WO2023163430A1 - Planar transformer and manufacturing method therefor - Google Patents

Abstract

The objective of the present invention is to provide a planar transformer and a manufacturing method therefor, which enables size and weight reduction of the planar transformer by minimizing the size of a PCB therein by using castellated holes instead of through holes and by minimizing the space occupied by via holes formed on the PCB.

Description

Planar transformer and its manufacturing method

The present invention relates to a transformer and a method for manufacturing the same, and more particularly, to a planar transformer capable of miniaturization and light weight and rapidly dissipating heat generated from a circuit board and a method for manufacturing the same.

In general, a transformer is a device for transferring electrical energy from one circuit to another through electrical insulation through an inductive electrical conductor, and a device for transferring electrical energy to another electrical circuit by increasing or decreasing voltage in an electrical circuit. am.

Conventional transformers have a problem in that they are not suitable for use in light and simple electronic products because they necessarily use a wire-wound element using an iron core or a ferrite core.

In order to solve this problem, conventionally, a planar transformer using a printed circuit board (Printed Circuit Board, PCB) having a coil pattern is used.

A planar transformer is manufactured by assembling a plurality of PCBs on which coil patterns are formed with an upper core and a lower core provided on upper and lower portions.

A planar transformer having such a structure does not require a coil winding operation by forming a coil pattern on a PCB, and the size and volume of the device can be reduced due to the coil pattern printed on the flat surface.

1 is a diagram showing a PCB constituting windings of a planar transformer according to the prior art by way of example. In the center of the board, a central opening is formed through which a central leg formed in an upper core or a lower core passes, and next to the central opening A plurality of via holes are formed to connect windings of each layer to other layers, and a plurality of through holes are formed at both ends of the substrate to connect external electrodes.

As shown in FIG. 1, since the space occupied by the via hole and the through hole formed in the conventional PCB occupies about 40% of the total length, the area of the PCB increases, thereby increasing the size and weight of the planar transformer. There is a problem with being heavy.

In addition, the planar transformer generates proportional heat according to the action of the coil, and has a structure in which the generated heat cannot be properly dissipated as a plurality of PCBs are embedded in the magnetic core in a sealed state, resulting in power loss due to overheating. In addition to loss, there is a problem in that the lifetime is shortened due to a decrease in durability.

An object of the present invention to solve the conventional problems as described above is to minimize the space occupied by via holes formed in the PCB and minimize the size of the PCB by using a castellated hole instead of a through hole, It is to provide a planar transformer and a method for manufacturing the same, which can reduce the size and weight of the planar transformer.

Another object of the present invention is to provide a planar transformer and a method for manufacturing the same, which can quickly dissipate heat generated in the PCB by mounting cooling fins on the PCB as well as the magnetic core.

In order to achieve the above object, a planar transformer according to the present invention includes a primary winding PCB having a coil pattern constituting a primary winding; A secondary winding PCB on which a coil pattern constituting a secondary winding is formed; a shield PCB disposed between the primary PCB and the secondary PCB and having a coil pattern constituting a shield winding; An upper core and a lower core coupled to surround the primary winding PCB, the shielding PCB, and the secondary winding PCB, and one of the upper core and the lower core penetrates a central opening formed in each PCB. A magnetic core having a central leg formed thereon, characterized in that a castellated hole for connection with another PCB is formed on a side surface of each PCB.

In addition, in the planar transformer according to the present invention, at least one via hole formed in each PCB is disposed close to the central opening through which the central leg passes, and is proportional to the current capacities of the primary winding and the secondary winding. characterized by being

In addition, in the planar transformer according to the present invention, the shielding PCB includes an insulating layer made of an insulator; It is characterized in that it comprises a; shielding layer formed with a coil pattern constituting the shield winding.

In addition, in the planar transformer according to the present invention, doedoe disposed above the primary winding PCB, the upper shielding PCB on which the coil pattern constituting the shielding winding is formed; characterized in that it further comprises.

In addition, in the planar transformer according to the present invention, the upper shield PCB includes an insulating layer made of an insulator; It is characterized in that it comprises a; shielding layer formed with a coil pattern constituting the shield winding.

In addition, in the planar transformer according to the present invention, the upper shielding PCB may further include a pad layer for soldering cooling fins to which cooling fins are soldered.

In addition, in the planar transformer according to the present invention, it is disposed below the secondary winding PCB, and a lower shielding PCB having a coil pattern constituting the shielding winding is formed.

In addition, in the planar transformer according to the present invention, the lower shield PCB includes an insulating layer made of an insulator; It is characterized in that it comprises a; shielding layer formed with a coil pattern constituting the shield winding.

In addition, in the planar transformer according to the present invention, the lower shield PCB is characterized in that it further comprises a substrate layer for height adjustment for adjusting the height.

In addition, in order to achieve the above object, a planar transformer according to the present invention, a primary winding PCB having a coil pattern constituting a primary winding; A secondary winding PCB on which a coil pattern constituting a secondary winding is formed; a shield PCB disposed between the primary PCB and the secondary PCB and having a coil pattern constituting a shield winding; an upper shield PCB disposed above the primary winding PCB and having a coil pattern constituting a shield winding; a lower shielding PCB disposed below the secondary winding PCB and having a coil pattern forming a shield winding; An upper core and a lower core coupled to surround the upper shielding PCB, the primary winding PCB, the shielding PCB, the secondary winding PCB, and the lower shielding PCB, wherein any one of the upper core and the lower core has the A magnetic core formed with a central leg passing through a central opening formed in each PCB, wherein a castellated hole for connection with another PCB is formed on a side surface of each PCB. do.

Further, in the planar transformer according to the present invention, each of the PCBs is soldered by the castellated hole formed on the side surface.

In addition, in order to achieve the above object, a planar transformer according to the present invention, a primary winding PCB having a coil pattern constituting a primary winding; A secondary winding PCB on which a coil pattern constituting a secondary winding is formed; a shield PCB disposed between the primary PCB and the secondary PCB and having a coil pattern constituting a shield winding; An upper core and a lower core coupled to surround the primary winding PCB, the shielding PCB, and the secondary winding PCB, and one of the upper core and the lower core penetrates a central opening formed in each PCB. a magnetic core formed with a central leg; a first cooling fin attached to a lower portion of the magnetic core to dissipate heat generated from the magnetic core; a second cooling fin attached to an upper portion of the magnetic core to dissipate heat generated from the magnetic core; A third cooling fin attached to the upper portion of the primary winding PCB to dissipate heat generated from the plurality of PCBs; on the side of each PCB, a castellated hole for connection with another PCB ( Castellated Hole) is characterized in that it is formed.

In addition, in the planar transformer according to the present invention, the first cooling fin and the second cooling fin are attached to the magnetic core by a heat conductive double-sided tape, and the third cooling fin is attached to the primary cooling fin by a surface mounting technology method. Characterized in that it is attached to the top of the winding PCB.

In addition, in order to achieve the above object, a planar transformer according to the present invention, a primary winding PCB having a coil pattern constituting a primary winding; A secondary winding PCB on which a coil pattern constituting a secondary winding is formed; a shield PCB disposed between the primary PCB and the secondary PCB and having a coil pattern constituting a shield winding; an upper shield PCB disposed above the primary winding PCB and having a coil pattern constituting a shield winding; a lower shielding PCB disposed below the secondary winding PCB and having a coil pattern forming a shield winding; An upper core and a lower core coupled to surround the upper shielding PCB, the primary winding PCB, the shielding PCB, the secondary winding PCB, and the lower shielding PCB, wherein any one of the upper core and the lower core has the a magnetic core formed with a central leg passing through a central opening formed in each PCB; a first cooling fin attached to a lower portion of the magnetic core to dissipate heat generated from the magnetic core; a second cooling fin attached to an upper portion of the magnetic core to dissipate heat generated from the magnetic core; A third cooling fin attached to an upper portion of the upper shielding PCB to dissipate heat generated in each PCB; and, on the side surface of each PCB, a castellated hole for connection with another PCB. ) is characterized in that it is formed.

In addition, in the planar transformer according to the present invention, the first cooling fin and the second cooling fin are attached to the magnetic core by a heat conductive double-sided tape, and the third cooling fin is attached to the upper shield by a surface mounting technology method. It is characterized in that it is attached to the top of the PCB.

In addition, in order to achieve the above object, a method for manufacturing a planar transformer according to the present invention includes preparing a lower core for inducing a magnetic field; laminating a secondary winding PCB on which a coil pattern forming a secondary winding is formed inside the lower core; laminating a shielding PCB having a coil pattern forming a shield winding on top of the secondary winding PCB; laminating a primary winding PCB having a coil pattern forming a primary winding on top of the shielding PCB; connecting the secondary winding PCB, the shielding PCB, and the primary winding PCB laminated inside the lower core through a castellated hole formed on a side surface of each PCB; and coupling an upper core to the lower core so as to surround a multilayer PCB formed by stacking the secondary winding PCB, the shielding PCB, and the primary winding PCB.

In addition, in the planar transformer manufacturing method according to the present invention, attaching a first cooling fin to the lower portion of the lower core; attaching a second cooling fin to an upper portion of the upper core; It is characterized in that it further comprises; attaching a third cooling fin to the top of the primary winding PCB.

In addition, in order to achieve the above object, a method for manufacturing a planar transformer according to the present invention includes preparing a lower core for inducing a magnetic field; laminating a lower shielding PCB having a coil pattern forming a shield winding inside the lower core; laminating a secondary winding PCB having a coil pattern forming a secondary winding on top of the lower shielding PCB; laminating a shielding PCB having a coil pattern forming a shield winding on top of the secondary winding PCB; laminating a primary winding PCB having a coil pattern forming a primary winding on top of the shielding PCB; laminating an upper shielding PCB having a coil pattern constituting a shielding winding on top of the primary winding PCB; connecting the lower shielding PCB, the secondary winding PCB, the shielding PCB, the primary winding PCB, and the upper shielding PCB laminated inside the lower core through castellated holes formed on side surfaces of the respective PCBs; coupling an upper core to the lower core so as to surround a multilayer PCB formed by stacking the lower shielding PCB, the secondary winding PCB, the shielding PCB, the primary winding PCB, and the upper shielding PCB; to be characterized

In addition, in the planar transformer manufacturing method according to the present invention, attaching a first cooling fin to the lower portion of the lower core; attaching a second cooling fin to an upper portion of the upper core; It characterized in that it further comprises; attaching a third cooling fin to the top of the upper shield PCB.

Details of other embodiments are included in the "specific details for carrying out the invention" and the accompanying "drawings".

Advantages and/or features of the present invention, and methods of achieving them, will become apparent with reference to the various embodiments described below in detail in conjunction with the accompanying drawings.

However, the present invention is not limited only to the configuration of each embodiment disclosed below, but may also be implemented in various other forms, and each embodiment disclosed herein only makes the disclosure of the present invention complete, and the present invention It is provided to completely inform those skilled in the art of the scope of the present invention, and it should be noted that the present invention is only defined by the scope of each claim of the claims.

According to the present invention, by minimizing the space occupied by the via hole formed in the PCB and minimizing the size of the PCB by using a castellated hole instead of a through hole, it is possible to reduce the size and weight of the planar transformer.

In addition, by mounting cooling fins on the PCB as well as the magnetic core, heat generated in the PCB can be quickly dissipated.

1 is a diagram showing a PCB constituting windings of a planar transformer according to the prior art by way of example.

2 is a diagram exemplarily showing a PCB constituting windings of a planar transformer according to an embodiment of the present invention.

3 is a cross-sectional view schematically showing the structure of a planar transformer according to an embodiment of the present invention.

4 is a cross-sectional view schematically showing the structure of a planar transformer according to another embodiment of the present invention.

5 is a view showing an exemplary shielding PCB applied to the present invention.

6 is a cross-sectional view schematically showing the structure of a planar transformer according to another embodiment of the present invention.

7 is a cross-sectional view schematically showing the structure of a planar transformer according to another embodiment of the present invention.

8 is a process diagram for explaining a method for manufacturing a planar transformer according to an embodiment of the present invention.

9 is a process diagram for explaining a method for manufacturing a planar transformer according to another embodiment of the present invention.

Before explaining the present invention in detail, the terms or words used in this specification should not be construed unconditionally in a conventional or dictionary sense, and in order for the inventor of the present invention to explain his/her invention in the best way It should be noted that concepts of various terms may be appropriately defined and used, and furthermore, these terms or words should be interpreted as meanings and concepts corresponding to the technical spirit of the present invention.

That is, the terms used in this specification are only used to describe preferred embodiments of the present invention, and are not intended to specifically limit the contents of the present invention, and these terms represent various possibilities of the present invention. It should be noted that it is a defined term.

In addition, it should be noted that in this specification, singular expressions may include plural expressions unless the context clearly indicates otherwise, and similarly, even if they are expressed in plural numbers, they may include singular meanings. .

Throughout this specification, when a component is described as "including" another component, it does not exclude any other component, but further includes any other component, unless otherwise stated. It can mean you can do it.

Furthermore, when a component is described as “existing inside or connected to and installed” of another component, this component may be directly connected to or installed in contact with the other component, and a certain It may be installed at a distance, and when it is installed at a certain distance, a third component or means for fixing or connecting the corresponding component to another component may exist, and now It should be noted that the description of the components or means of 3 may be omitted.

On the other hand, when it is described that a certain element is "directly connected" to another element, or is "directly connected", it should be understood that no third element or means exists.

Similarly, other expressions describing the relationship between components, such as "between" and "directly between", or "adjacent to" and "directly adjacent to" have the same meaning. should be interpreted as

In addition, in this specification, the terms "one side", "the other side", "one side", "the other side", "first", "second", etc., if used, refer to one component It is used to be clearly distinguished from other components, and it should be noted that the meaning of the corresponding component is not limitedly used by such a term.

In addition, in this specification, terms related to positions such as "top", "bottom", "left", and "right", if used, should be understood as indicating a relative position in the drawing with respect to the corresponding component, Unless an absolute position is specified for these positions, these positional terms should not be understood as referring to an absolute position.

In addition, in this specification, in specifying the reference numerals for each component of each drawing, for the same component, even if the component is displayed in different drawings, it has the same reference numeral, that is, the same reference throughout the specification. Symbols indicate identical components.

In the drawings accompanying this specification, the size, position, coupling relationship, etc. of each component constituting the present invention is partially exaggerated, reduced, or omitted in order to sufficiently clearly convey the spirit of the present invention or for convenience of explanation. may be described, and therefore the proportions or scale may not be exact.

In addition, in the following description of the present invention, a detailed description of a configuration that is determined to unnecessarily obscure the subject matter of the present invention, for example, a known technology including the prior art, may be omitted.

Hereinafter, embodiments of the present invention will be described in detail with reference to related drawings.

2 is a diagram exemplarily showing a PCB constituting windings of a planar transformer according to an embodiment of the present invention.

As shown in Fig. 2, in the PCB 10 applied to the present invention, a central opening a is formed in the center of the board, and windings b having a predetermined pattern are formed.

In addition, the windings (b) formed on the PCB 10 are electrically connected to the windings formed on the PCB of different layers through via holes (c), and both ends of the board in the longitudinal direction are casted for connecting external electrodes. A castellated hole (d) is formed.

In order to minimize the area size of the PCB 10, it is preferable that the via hole (c) is disposed close to the central opening (a).

In addition, at least one via hole (c) is preferably arranged in proportion to the current capacities of the primary winding and the secondary winding.

As described above, the PCB 10 applied to the present invention is implemented so that the via hole c is disposed close to the central opening a and the external electrode is connected through the castellated hole d formed on the side. , it becomes possible to minimize the area size.

3 is a cross-sectional view schematically showing the structure of a planar transformer according to an embodiment of the present invention.

As shown in FIG. 3, the planar transformer 100 according to an embodiment of the present invention includes a magnetic core 110, a primary winding PCB 115, a shielding PCB 120, a secondary winding PCB 125, and the like. can be made including

The magnetic core 110 includes an upper core and a lower core, and the upper core and the lower core are combined to surround the primary winding PCB 115, the shielding PCB 120, and the secondary winding PCB 125 from the outside. .

A central leg passing through the central opening a formed in each of the PCBs 115 , 120 , and 125 is formed in one of the upper core and the lower core constituting the magnetic core 110 .

The magnetic core 110 constituting a magnetic circuit composed of an upper core and a lower core may be composed of a core without air gaps.

In addition, the magnetic core 110 constituting a magnetic circuit composed of an upper core and a lower core may be composed of a core having an air gap.

In addition, the magnetic core 110 constituting a magnetic circuit composed of an upper core and a lower core may be implemented in a flat flat plate shape.

The magnetic core 110 may be implemented as a magnetic material (eg, ferrite) having magnetic properties.

In the primary winding PCB 115, a coil pattern constituting the primary winding is formed, and a central opening a is formed in the center so that the central leg of the magnetic core 110 passes through.

The shielding PCB 120 is disposed between the primary winding PCB 115 and the secondary winding PCB 125, and a coil pattern constituting the shield winding is formed, and the central leg of the magnetic core 110 passes through the center. An opening (a) is formed.

The above-described shielding PCB 120 may include an insulating layer made of an insulator and a shielding layer having a coil pattern constituting the shield winding.

In the secondary winding PCB 125, a coil pattern constituting the secondary winding is formed, and a central opening a is formed in the middle so that the central leg of the magnetic core 110 passes through.

Here, the laminated primary winding PCB 115, shielding PCB 120, and secondary winding PCB 125 are mechanically/electrically connected by soldering wires or electrodes to the castellated holes d formed on the side surfaces. It is desirable that they are connected to each other.

Accordingly, solder connections 165 are formed in the castellated holes d formed on the side surfaces of the laminated primary winding PCB 115 , shielding PCB 120 , and secondary winding PCB 125 .

As described above, the planar transformer 100 formed so that the magnetic core 110 surrounds the multilayer PCB formed by stacking the primary winding PCB 115, the shielding PCB 120, and the secondary winding PCB 125 is connected. It can be directly mounted on the PCB 170 by soldering.

Accordingly, a solder connection 165 is formed between the planar transformer 100 and the connection PCB 170 .

Meanwhile, in the embodiment of the present invention, the frequency of the applied voltage applied to the primary winding formed on the primary winding PCB 115 constituting the planar transformer 100 and the secondary winding formed on the secondary winding PCB 125 is 50 kHz. Above, it can be set within the range of 2 MHz or less.

4 is a cross-sectional view schematically showing the structure of a planar transformer according to another embodiment of the present invention.

As shown in FIG. 4, the planar transformer 100 according to another embodiment of the present invention includes a magnetic core 110, an upper shielding PCB 130, a primary winding PCB 115, a shielding PCB 120, a secondary It may be made including a winding PCB 125, a lower shielding PCB 135, and the like.

Here, the magnetic core 110, the primary winding PCB 115, the shielding PCB 120, and the secondary winding PCB 125 are the magnets of the planar transformer 100 according to one embodiment of the present invention shown in FIG. Since the core 110, the primary winding PCB 115, the shielding PCB 120, and the secondary winding PCB 125 are substantially the same, the same reference numerals are given, and repeated descriptions will be omitted.

4, the upper shielding PCB 130 is disposed above the primary winding PCB 115, a coil pattern constituting the shield winding is formed, and a central opening ( a) is formed.

As described above, the upper shielding PCB 130 may include an insulating layer made of an insulator and a shielding layer having a coil pattern constituting the shield winding.

In addition, the upper shielding PCB 130 may include a pad layer for soldering cooling pins to which cooling pins described later are soldered.

The lower shielding PCB 135 is disposed below the secondary winding PCB 125, and a coil pattern constituting the shield winding is formed, and a central opening a is formed in the middle so that the central leg of the magnetic core 110 passes through. do.

The above-described lower shielding PCB 135 may include an insulating layer made of an insulator and a shielding layer having a coil pattern forming a shield winding.

In addition, the lower shielding PCB 135 is a multilayer PCB formed by stacking an upper shielding PCB 130, a primary winding PCB 115, a shielding PCB 120, a secondary winding PCB 125, and a lower shielding PCB 135. It may include a substrate layer for height adjustment for adjusting the height of.

Here, the stacked upper shielding PCB 130, primary winding PCB 115, shielding PCB 120, secondary winding PCB 125, and lower shielding PCB 135 have a castellated hole (d) formed on the side surface. It is preferable to connect wires or electrodes to each other mechanically/electrically by soldering.

Accordingly, solder connections 165 are formed in the castellated holes d formed on the side surfaces of the laminated primary winding PCB 115 , shielding PCB 120 , and secondary winding PCB 125 .

In this way, a multi-layer PCB formed by stacking the upper shielding PCB 130, the primary winding PCB 115, the shielding PCB 120, the secondary winding PCB 125, and the lower shielding PCB 135 is formed on the magnetic core 110. ) may be directly mounted on the connection PCB 170 in a soldering manner.

Accordingly, a solder connection 165 is formed between the planar transformer 100 and the connection PCB 170 .

As described above, coil patterns forming shield windings are formed on the shielding PCB 120, the upper shielding PCB 130, and the lower shielding PCB 135. The shielding PCB 120, the upper shielding PCB 130, and the lower shielding PCB 135 As shown in FIG. 5, the shield winding formed on the PCB 135 may be implemented in a pair of spiral shapes.

Here, the shield winding has a conductor width of 0.2 mm to 5 mm or less, the insulation interval between wires follows international standards (IPC-2221), and each output electrode of the shield layer is externally formed by a castellated hole (d) formed on the side. can be connected with

In this way, when the shield winding is implemented in a pair of spiral shapes, very strong high-frequency magnetic flux flows in a direction perpendicular to the shield winding by the magnetic core 110 passing through the central opening (a), so that the shield winding has a concentric circle shape. The eddy current of flows, but since there is no closed circuit in the spiral circuit, it becomes a structure in which eddy current cannot flow, and Faraday shielding becomes possible.

6 is a cross-sectional view schematically showing the structure of a planar transformer according to another embodiment of the present invention.

As shown in FIG. 6, the planar transformer 100 according to another embodiment of the present invention includes a magnetic core 110, a primary winding PCB 115, a shielding PCB 120, a secondary winding PCB 125, It may include a first cooling fin 140, a second cooling fin 145, a third cooling fin 150, and the like.

Here, the magnetic core 110, the primary winding PCB 115, the shielding PCB 120, and the secondary winding PCB 125 are the magnets of the planar transformer 100 according to one embodiment of the present invention shown in FIG. Since the core 110, the primary winding PCB 115, the shielding PCB 120, and the secondary winding PCB 125 are substantially the same, the same reference numerals are given, and repeated descriptions will be omitted.

In FIG. 6 , the first cooling fin 140 is attached to the lower portion of the magnetic core 110 to dissipate heat generated in the magnetic core 110 .

The first cooling fin 140 may be attached to the lower part of the magnetic core 110 by the heat conductive double-sided tape 160 .

The first cooling fin 140 is also connected to the connection PCB 170 so that heat generated from the connection PCB 170 can be dissipated together. It is desirable to be implemented to have a sufficient size to fit.

The second cooling fin 145 is attached to an upper portion of the magnetic core 110 to dissipate heat generated in the magnetic core 110 .

The second cooling fin 145 may be attached to the top of the magnetic core 110 by the heat conductive double-sided tape 160 .

As described above, the first cooling fins 140 and the second cooling fins 145 are attached to the lower and upper portions of the magnetic core 110 by the heat conductive double-sided tape 160, respectively, so that heat generated in the magnetic core 110 is generated. emits

The third cooling fin 150 is attached to the top of the primary winding PCB 115, and is formed on a multilayer PCB formed by stacking the primary winding PCB 115, the shielding PCB 120, and the secondary winding PCB 125. dissipate the heat generated.

The third cooling fin 150 may be installed in an exposed portion of the primary winding PCB 115, not a portion wrapped by the magnetic core 110.

The third cooling fin 150 may be directly soldered to the top of the primary winding PCB 115 by surface mounting technology.

Accordingly, a solder connection 165 is formed between the third cooling fin 150 and the primary winding PCB 115 .

As described above, since the third cooling fin 150 is attached by soldering to the top of the primary winding PCB 115, the primary winding PCB 115 is a pad layer for soldering to which the third cooling fin 150 is soldered. It can be made including.

7 is a cross-sectional view schematically showing the structure of a planar transformer according to another embodiment of the present invention.

As shown in FIG. 7, the planar transformer 100 according to another embodiment of the present invention includes a magnetic core 110, an upper shielding PCB 130, a primary winding PCB 115, a shielding PCB 120, 2 It may include a secondary winding PCB 125, a lower shielding PCB 135, a first cooling fin 140, a second cooling fin 145, a third cooling fin 150, and the like.

Here, the magnetic core 110, the upper shielding PCB 130, the primary winding PCB 115, the shielding PCB 120, the secondary winding PCB 125, and the lower shielding PCB 135 are the same as shown in FIG. Magnetic core 110 of the planar transformer 100 according to another embodiment of the invention, upper shielding PCB 130, primary winding PCB 115, shielding PCB 120, secondary winding PCB 125, lower shielding Substantially the same as the PCB 135, the first cooling fin 140 and the second cooling fin 145 are the first cooling fins of the planar transformer 100 according to another embodiment of the present invention shown in FIG. 140 and the second cooling fin 145 are substantially the same, so the same reference numerals are given, and repeated descriptions will be omitted.

7, the third cooling fin 150 is attached to the top of the upper shielding PCB 130, the upper shielding PCB 130, the primary winding PCB 115, the shielding PCB 120, the secondary winding PCB ( 125) and the lower shielding PCB 135 are stacked to release heat generated from the multi-layer PCB.

The third cooling fin 150 may be installed in an exposed portion of the upper shielding PCB 130, not a portion surrounded by the magnetic core 110.

The third cooling fin 150 may be directly soldered to the top of the upper shielding PCB 130 by surface mounting technology.

8 is a process diagram for explaining a method for manufacturing a planar transformer according to an embodiment of the present invention.

First, in step S10, a lower core for inducing magnetic field formation is prepared.

Subsequently, in step S20, a secondary winding PCB 125 having a coil pattern constituting a secondary winding is formed inside the lower core.

And, in step S30, the shielding PCB 120 formed with the coil pattern constituting the shield winding is laminated on the upper part of the secondary winding PCB 125.

The shielding PCB 120 stacked on the secondary winding PCB 125 in step S30 may include an insulating layer made of an insulator and a shielding layer formed with a coil pattern constituting the shielding winding.

Then, in step S40, a primary winding PCB 115 having a coil pattern forming a primary winding is laminated on the shield PCB 120.

Then, in step S50, the secondary winding PCB 125, the shielding PCB 120, and the primary winding PCB 115 laminated on the inside of the lower core are casted on the side surfaces of the respective PCBs 125, 120, and 115. To connect wires or electrodes to the hole (d) by soldering and connect them to each other.

Then, in step S60, the magnetic core 110 is formed by combining the upper core with the lower core so as to surround the multilayer PCB formed by stacking the secondary winding PCB 125, the shielding PCB 120, and the primary winding PCB 115. form

The planar transformer 100 formed so that the magnetic core 110 surrounds the multilayer PCB formed by stacking the secondary winding PCB 125, the shielding PCB 120, and the primary winding PCB 115 through the above-described step S60. , It can be directly mounted on the connection PCB 170 by soldering.

Thereafter, in step S70 , the first cooling fins 140 are attached to the lower part of the magnetic core 110 to dissipate heat generated from the magnetic core 110 .

In step S70 described above, the first cooling fin 140 may be attached to the lower part of the magnetic core 110 by the heat conductive double-sided tape 160 .

Then, in step S80, the second cooling fin 145 is attached to the top of the magnetic core 110.

In step S80 described above, the second cooling fin 145 may be attached to the lower part of the magnetic core 110 by the heat conductive double-sided tape 160 .

And, in step S90, the upper part of the primary winding PCB 115 to dissipate heat generated in the multilayer PCB formed by stacking the secondary winding PCB 125, the shielding PCB 120, and the primary winding PCB 115. Attach the third cooling fin 150 to.

In step S90 described above, the third cooling fin 150 may be directly soldered to the top of the primary winding PCB 115 by surface mounting technology.

9 is a process diagram for explaining a method for manufacturing a planar transformer according to another embodiment of the present invention.

First, in step S110, a lower core for inducing magnetic field formation is prepared.

Subsequently, in step S115, a lower shielding PCB 135 having a coil pattern forming a shield winding is formed inside the lower core.

The lower shielding PCB 135 stacked on the inside of the lower core in step S115 may include an insulating layer made of an insulator and a shielding layer having a coil pattern constituting the shield winding.

In addition, the lower shielding PCB 135 may include a height adjusting substrate layer for adjusting the height.

Then, in step S120, the secondary winding PCB 125 on which the coil pattern constituting the secondary winding is formed is laminated on the lower shielding PCB 135.

Then, in step S125, the shielding PCB 120 having the coil pattern constituting the shielding winding is formed on the upper part of the secondary winding PCB 125.

The shielding PCB 120 laminated on the secondary winding PCB 125 in step S125 may include an insulating layer made of an insulator and a shielding layer formed with a coil pattern constituting the shielding winding.

Then, in step S130, the primary winding PCB 115 on which the coil pattern constituting the primary winding is formed is laminated on the shield PCB 120.

And, in step S135, the upper shielding PCB 130 formed with the coil pattern constituting the shielding winding is laminated on the upper part of the primary winding PCB 115.

The upper shielding PCB 130 stacked on top of the primary winding PCB 115 in step S135 may include an insulating layer made of an insulator and a shielding layer having a coil pattern constituting the shielding winding.

In addition, the upper shielding PCB 130 may include a pad layer for soldering cooling pins to which cooling pins are soldered.

And, in step S140, the lower shielding PCB 135, the secondary winding PCB 125, the shielding PCB 120, the primary winding PCB 115, and the upper shielding PCB 130 laminated on the inside of the lower core are each PCB. (135, 125, 120, 115, 130) Connect wires or electrodes to each other by soldering to the castellated hole (d) formed on the side.

And, in step S145, the lower shielding PCB 135, the secondary winding PCB 125, the shielding PCB 120, the primary winding PCB 115, and the upper shielding PCB 130 are stacked to surround the multi-layered PCB. The magnetic core 110 is formed by combining the upper core with the lower core.

Through the above step S145, the multilayer PCB formed by stacking the lower shielding PCB 135, the secondary winding PCB 125, the shielding PCB 120, the primary winding PCB 115, and the upper shielding PCB 130 is magnetically The planar transformer 100 formed to surround the core 110 may be directly mounted on the connection PCB 170 by soldering.

Thereafter, in step S150, the first cooling fin 140 is attached to the lower part of the magnetic core 110 to dissipate heat generated from the magnetic core 110.

In step S150 described above, the first cooling fin 140 may be attached to the lower part of the magnetic core 110 by the heat conductive double-sided tape 160 .

Then, in step S155, the second cooling fin 145 is attached to the top of the magnetic core 110.

In step S155 described above, the second cooling fin 145 may be attached to the lower part of the magnetic core 110 by the heat conductive double-sided tape 160 .

And, in step S160, the upper part of the primary winding PCB 115 to dissipate heat generated in the multilayer PCB formed by stacking the secondary winding PCB 125, the shielding PCB 120, and the primary winding PCB 115. Attach the third cooling fin 150 to.

In step S160 described above, the third cooling fin 150 may be directly soldered to the top of the primary winding PCB 115 by surface mounting technology.

As described above, according to the present invention, the planar transformer can be miniaturized and lightened by minimizing the space occupied by the via hole formed in the PCB and minimizing the size of the PCB by using the castellated hole instead of the through hole.

In addition, by mounting cooling fins on the PCB as well as the magnetic core, heat generated in the PCB can be quickly dissipated.

In the above, various preferred embodiments of the present invention have been described with some examples, but the description of various embodiments described in the "Specific Contents for Carrying Out the Invention" section is only exemplary, and the present invention Those skilled in the art will understand from the above description that the present invention can be practiced with various modifications or equivalent implementations of the present invention can be performed.

In addition, since the present invention can be implemented in various other forms, the present invention is not limited by the above description, and the above description is intended to complete the disclosure of the present invention and is common in the technical field to which the present invention belongs. It is only provided to completely inform those skilled in the art of the scope of the present invention, and it should be noted that the present invention is only defined by each claim of the claims.

Claims (19)

A primary winding PCB having a coil pattern constituting a primary winding; A secondary winding PCB on which a coil pattern constituting a secondary winding is formed; a shield PCB disposed between the primary PCB and the secondary PCB and having a coil pattern constituting a shield winding; An upper core and a lower core coupled to surround the primary winding PCB, the shielding PCB, and the secondary winding PCB, and one of the upper core and the lower core penetrates a central opening formed in each PCB. A magnetic core formed with a central leg; On the side of each PCB, Characterized in that a castellated hole is formed for connection with another PCB, planar transformer. According to claim 1, The via holes formed in each of the PCBs, disposed proximal to the central opening through which the central leg passes; Characterized in that at least one is disposed in proportion to the current capacity of the primary winding and the secondary winding, planar transformer. According to claim 1, The shielding PCB, an insulating layer made of an insulator; Characterized in that it comprises a; shielding layer formed with a coil pattern constituting the shield winding. planar transformer. According to claim 1, Disposed on the primary winding PCB, the upper shielding PCB having a coil pattern constituting the shielding winding; characterized in that it further comprises, planar transformer. According to claim 4, The upper shield PCB, an insulating layer made of an insulator; Characterized in that it comprises a; shielding layer formed with a coil pattern constituting the shield winding. planar transformer. According to claim 5, The upper shield PCB, Characterized in that it further comprises; a cooling fin soldering pad layer to which the cooling fins are soldered. planar transformer. According to claim 1, Disposed below the secondary winding PCB, a lower shielding PCB on which a coil pattern forming a shield winding is formed; characterized in that it further comprises, planar transformer. According to claim 7, The lower shield PCB, an insulating layer made of an insulator; Characterized in that it comprises a; shielding layer formed with a coil pattern constituting the shield winding. planar transformer. According to claim 8, The lower shield PCB, Characterized in that it further comprises a; substrate layer for height adjustment for adjusting the height, planar transformer. A primary winding PCB having a coil pattern constituting a primary winding; A secondary winding PCB on which a coil pattern constituting a secondary winding is formed; a shield PCB disposed between the primary PCB and the secondary PCB and having a coil pattern constituting a shield winding; an upper shield PCB disposed above the primary winding PCB and having a coil pattern constituting a shield winding; a lower shielding PCB disposed below the secondary winding PCB and having a coil pattern forming a shield winding; An upper core and a lower core coupled to surround the upper shielding PCB, the primary winding PCB, the shielding PCB, the secondary winding PCB, and the lower shielding PCB, wherein any one of the upper core and the lower core has the A magnetic core formed with a central leg passing through a central opening formed in each PCB; On the side of each PCB, Characterized in that a castellated hole is formed for connection with another PCB, planar transformer. According to claim 10, Each of the above PCBs, Characterized in that it is connected by soldering by the castellated hole formed on the side surface, planar transformer. A primary winding PCB having a coil pattern constituting a primary winding; A secondary winding PCB on which a coil pattern constituting a secondary winding is formed; a shield PCB disposed between the primary PCB and the secondary PCB and having a coil pattern constituting a shield winding; An upper core and a lower core coupled to surround the primary winding PCB, the shielding PCB, and the secondary winding PCB, and one of the upper core and the lower core penetrates a central opening formed in each PCB. a magnetic core formed with a central leg; a first cooling fin attached to a lower portion of the magnetic core to dissipate heat generated from the magnetic core; a second cooling fin attached to an upper portion of the magnetic core to dissipate heat generated from the magnetic core; A third cooling fin attached to an upper portion of the primary winding PCB to dissipate heat generated from the plurality of PCBs; On the side of each PCB, Characterized in that a castellated hole is formed for connection with another PCB, planar transformer. According to claim 12, The first cooling fin and the second cooling fin, attached to the magnetic core by a thermally conductive double-sided tape; The third cooling fin, Characterized in that it is attached to the top of the primary winding PCB by a surface mount technology method, planar transformer. A primary winding PCB having a coil pattern constituting a primary winding; A secondary winding PCB on which a coil pattern constituting a secondary winding is formed; a shielding PCB disposed between the primary PCB and the secondary PCB and having a coil pattern constituting a shield winding; an upper shield PCB disposed above the primary winding PCB and having a coil pattern constituting a shield winding; a lower shielding PCB disposed below the secondary winding PCB and having a coil pattern forming a shield winding; An upper core and a lower core coupled to surround the upper shielding PCB, the primary winding PCB, the shielding PCB, the secondary winding PCB, and the lower shielding PCB, wherein any one of the upper core and the lower core has the a magnetic core formed with a central leg passing through a central opening formed in each PCB; a first cooling fin attached to a lower portion of the magnetic core to dissipate heat generated in the magnetic core; a second cooling fin attached to an upper portion of the magnetic core to dissipate heat generated from the magnetic core; A third cooling fin attached to an upper portion of the upper shielding PCB to dissipate heat generated in each of the PCBs; On the side of each PCB, Characterized in that a castellated hole is formed for connection with another PCB, planar transformer, According to claim 14, The first cooling fin and the second cooling fin, attached to the magnetic core by a thermally conductive double-sided tape; The third cooling fin, Characterized in that it is attached to the top of the upper shield PCB by a surface mount technology method, planar transformer. Preparing a lower core for inducing magnetic field formation; laminating a secondary winding PCB on which a coil pattern forming a secondary winding is formed inside the lower core; laminating a shielding PCB having a coil pattern forming a shield winding on top of the secondary winding PCB; laminating a primary winding PCB having a coil pattern forming a primary winding on top of the shielding PCB; connecting the secondary winding PCB, the shielding PCB, and the primary winding PCB laminated inside the lower core through a castellated hole formed on a side surface of each PCB; characterized in that it comprises; coupling the upper core to the lower core so as to surround the multi-layer PCB formed by stacking the secondary winding PCB, the shielding PCB, and the primary winding PCB, Method of manufacturing a planar transformer. According to claim 16, attaching a first cooling fin to a lower portion of the lower core; attaching a second cooling fin to an upper portion of the upper core; characterized in that it further comprises; attaching a third cooling fin to the top of the primary winding PCB; Method of manufacturing a planar transformer. Preparing a lower core for inducing magnetic field formation; laminating a lower shielding PCB having a coil pattern forming a shield winding inside the lower core; laminating a secondary winding PCB having a coil pattern forming a secondary winding on top of the lower shielding PCB; laminating a shielding PCB having a coil pattern forming a shield winding on top of the secondary winding PCB; laminating a primary winding PCB having a coil pattern forming a primary winding on top of the shielding PCB; laminating an upper shielding PCB having a coil pattern constituting a shielding winding on top of the primary winding PCB; connecting the lower shielding PCB, the secondary winding PCB, the shielding PCB, the primary winding PCB, and the upper shielding PCB laminated inside the lower core through castellated holes formed on side surfaces of the respective PCBs; coupling an upper core to the lower core so as to surround a multilayer PCB formed by stacking the lower shielding PCB, the secondary winding PCB, the shielding PCB, the primary winding PCB, and the upper shielding PCB; characterized by, Method of manufacturing a planar transformer. According to claim 18, attaching a first cooling fin to a lower portion of the lower core; attaching a second cooling fin to an upper portion of the upper core; Attaching a third cooling fin to the top of the upper shield PCB; characterized in that it further comprises, Method of manufacturing a planar transformer.

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