WO2023159785A1 - Conductive apparatus for coating and coating machine - Google Patents

Abstract

The present invention relates to a conductive apparatus for a coating and a coating machine. The conductive apparatus for a coating comprises a rack and two conductive mechanisms. The rack is provided with a plating tank which contains a plating solution; the two conductive mechanisms are both fixed on the rack and arranged opposite to each other at an interval along the depth direction of the plating tank, and the conductive mechanisms comprise conductive rollers, titanium baskets and rectifiers; positive electrodes of the rectifiers are electrically connected to the titanium baskets, negative electrodes of the rectifiers are electrically connected to the conductive rollers, the titanium baskets are at least partially immersed in the plating solution, one side of each conductive roller in the radial direction thereof is immersed in the plating solution, the other side thereof is exposed out from the plating solution, and the cross sections of the conductive rollers in the axial direction thereof are "工" shaped; when the coated product passes through the conductive mechanisms, one surface of the coated product is in contact with one of the two conductive rollers, and the other surface of the coated product is in contact with the other conductive roller. The conductive apparatus for a coating provided by the present invention may prevent the middle part of the conductive rollers from coming into contact with the plating solution during the electroplating process of the coated product, thereby remarkably improving the coating quality of the coated product.

Description

Coating conductive device and coating machine technical field

The invention relates to the technical field of electroplating thin films, in particular to a conductive device and a coating machine for coating.

Background technique

Electroplating is an important process in the production of composite current collector copper film. The rectifier is connected with the conductive roller and the titanium basket. The current flows from the positive pole of the rectifier through the titanium basket, and flows through the plating solution, the conductive mechanism and the negative pole of the rectifier, so that the entire electroplating system forms a complete circuit, so as to form a thin film on the coated product.

At present, the conductive roller is usually a tubular structure with the same diameter. During the coating process, while the conductive roller is in contact with the coated product, it will also directly or indirectly contact the plating solution (copper solution), forming a back-plated copper or copper on the conductive roller. The phenomenon of deposition, in the long-term copper plating process, after the copper plating on the conductive roller accumulates to a certain extent, an irregular copper crystal layer will be formed on the surface, and this layer of copper crystal layer is extremely distributed on the conductive roller. Unevenness, resulting in the formation of copper slag or copper thorns in the local position of the conductive roller. When the coated product contacts the conductive roller, the copper slag or copper thorns formed on the conductive roller will scratch the copper film deposited on the surface of the coated product, seriously affecting the electroplating quality of the copper film on the surface of the coated product. Moreover, when the copper crystal layer on the conductive roller accumulates too thick, it will also affect the chromaticity and uniformity of the copper film on the surface of the coated product.

Contents of the invention

Based on this, it is necessary to address the problem that during the coating process of the existing conductive device, the conductive roller will directly or indirectly contact the plating solution, and copper replating or copper deposition will occur on the surface, which will seriously affect the coating quality of the copper film on the surface of the coated product. To solve the problem, a conductive device for coating and a coating machine are provided.

A conductive device for coating, used for electroplating thin films on the surface of coated products, comprising:

A frame, the frame is provided with a plating tank for containing the plating solution;

Two conductive mechanisms, both of which are fixed on the frame, are arranged opposite to each other along the depth direction of the plating tank. The conductive mechanisms include conductive rollers, titanium baskets and rectifiers, and the rectifiers The positive pole is electrically connected to the titanium basket, the negative pole of the rectifier is electrically connected to the conductive roller, the titanium basket is at least partially immersed in the plating solution, and one side of the conductive roller along its radial direction is immersed in the In the plating solution, the other side is exposed outside the plating solution, and the cross-section of the conductive roller in its axial direction is I-shaped;

When the film-coated product passes through the conductive mechanism, one side of the film-coated product is in contact with one of the two conductive rollers, and the other side is in contact with the other conductive roller.

The above conductive device for coating has a plating tank on the frame, which can be used to accommodate the plating solution, and the two conductive mechanisms are fixed on the frame to realize the fixed connection between the two conductive mechanisms and the frame. The positive electrode of the rectifier is electrically connected to the titanium basket, the negative electrode of the rectifier is electrically connected to the conductive roller, the titanium basket is at least partially immersed in the plating solution, one side of the conductive roller along its radial direction is immersed in the plating solution, and the other side of the conductive roller Barely exposed to the plating solution, the rectifier, titanium basket, conductive roller and plating solution form a complete current loop. When the coated product passes through the conductive mechanism, one side of the coated product contacts one of the two conductive rollers, and The other side of the coated product is in contact with the other of the two conductive rollers to electroplate thin films on both surfaces of the coated product to achieve double-sided coating of the coated product and improve the electroplating efficiency on the surface of the coated product. And the cross-section of the conductive roller in its axial direction is I-shaped. During the electroplating process of the coated product, the middle part of the conductive roller is neither in contact with the plating solution nor with the middle part of the coated product, so as to prevent the middle part of the conductive roller from directly or indirectly contacting Contact with the plating solution reduces the phenomenon of copper replating or copper deposition on the conductive roller, reduces the risk of the conductive roller scratching the deposited film on the surface of the coated product, and significantly improves the coating quality of the coated product.

In one embodiment, the diameters of both ends of the conductive roller are 5cm-20cm, and the middle position of the conductive roller is recessed by 1cm-3cm compared to the end positions.

In one embodiment, the conductive roller is a hollow tubular structure.

In one embodiment, the conductive roller is made of one of 304 stainless steel and 316 stainless steel.

In one of the embodiments, the conductive mechanism further includes an auxiliary anode, and the positive pole of the rectifier is electrically connected to the auxiliary anode.

In one embodiment, the auxiliary anode is made of titanium metal, and its surface is uniformly coated with an iridium metal layer.

A coating machine, comprising an unwinding mechanism, a winding mechanism, and a conductive device for coating according to any one of the above technical solutions, the unwinding mechanism and the winding mechanism are fixed on the frame, and The intervals are arranged on the conveying path of the coated products.

In the above-mentioned coating machine, the cross-section of the conductive roller in its axial direction is I-shaped. During the electroplating process of the coated product, the middle part of the conductive roller is neither in contact with the plating solution nor with the middle part of the coated product, preventing the conductive roller from being directly or Indirect contact with the plating solution, copper replating or copper deposition occurs on the conductive roller, which prevents the conductive roller from scratching the deposited film on the surface of the coated product, and significantly improves the coating quality of the coated product.

In one embodiment, a plurality of tensioning elements are further included, and the plurality of tensioning elements are all fixed on the frame and evenly distributed between the unwinding mechanism and the winding mechanism.

In one of the embodiments, it also includes two spray elements, both of which are fixed on the frame, and the spray elements have spray ports, and one of the two spray ports One faces one of the two conductive rollers, and the other faces the other of the two conductive rollers.

In one of the embodiments, a heating element is further included, and the heating element is fixed on the frame.

Description of drawings

Fig. 1 is the top view of the conductive device for coating provided by the present invention;

Fig. 2 is the front view of the coating machine provided by the present invention.

Reference signs:

100. Conductive device for coating;

110. Rack;

120, conductive mechanism; 121, conductive roller; 122, titanium basket; 123, rectifier; 124, auxiliary anode;

200. Coated products;

300. Coating machine;

310, unwinding mechanism; 320, winding mechanism; 330, tensioning element.

Detailed ways

In order to make the above objects, features and advantages of the present invention more comprehensible, specific implementations of the present invention will be described in detail below in conjunction with the accompanying drawings. In the following description, numerous specific details are set forth in order to provide a thorough understanding of the present invention. However, the present invention can be implemented in many other ways different from those described here, and those skilled in the art can make similar improvements without departing from the connotation of the present invention, so the present invention is not limited by the specific embodiments disclosed below.

In describing the present invention, it should be understood that the terms "center", "longitudinal", "transverse", "length", "width", "thickness", "upper", "lower", "front", " Back", "Left", "Right", "Vertical", "Horizontal", "Top", "Bottom", "Inner", "Outer", "Clockwise", "Counterclockwise", "Axial" , "radial", "circumferential" and other indicated orientations or positional relationships are based on the orientations or positional relationships shown in the drawings, which are only for the convenience of describing the present invention and simplifying the description, rather than indicating or implying the referred device or Elements must have certain orientations, be constructed and operate in certain orientations, and therefore should not be construed as limitations on the invention.

In addition, the terms "first" and "second" are used for descriptive purposes only, and cannot be understood as indicating or implying relative importance or implicitly specifying the quantity of indicated technical features. Thus, the features defined as "first" and "second" may explicitly or implicitly include at least one of these features. In the description of the present invention, "plurality" means at least two, such as two, three, etc., unless otherwise specifically defined.

In the present invention, unless otherwise clearly specified and limited, terms such as "installation", "connection", "connection" and "fixation" should be understood in a broad sense, for example, it can be a fixed connection or a detachable connection , or integrated; it may be mechanically connected or electrically connected; it may be directly connected or indirectly connected through an intermediary, and it may be the internal communication of two components or the interaction relationship between two components, unless otherwise specified limit. Those of ordinary skill in the art can understand the specific meanings of the above terms in the present invention according to specific situations.

In the present invention, unless otherwise clearly specified and limited, the first feature may be in direct contact with the first feature or the first and second feature may be in direct contact with the second feature through an intermediary. touch. Moreover, "above", "above" and "above" the first feature on the second feature may mean that the first feature is directly above or obliquely above the second feature, or simply means that the first feature is higher in level than the second feature. "Below", "beneath" and "beneath" the first feature may mean that the first feature is directly below or obliquely below the second feature, or simply means that the first feature is less horizontally than the second feature.

It should be noted that when an element is referred to as being “fixed on” or “disposed on” another element, it may be directly on the other element or there may be an intervening element. When an element is referred to as being "connected to" another element, it can be directly connected to the other element or intervening elements may also be present. As used herein, the terms "vertical", "horizontal", "upper", "lower", "left", "right" and similar expressions are for the purpose of illustration only and do not represent the only embodiment.

The technical solutions provided by the embodiments of the present invention are described below with reference to the accompanying drawings.

As shown in FIG. 1 , the present invention provides a conductive device 100 for coating. The conductive device 100 for coating includes a frame 110 and two conductive mechanisms 120. The conductive device 100 for coating is used for electroplating a film on the surface of a coated product 200 .

The frame 110 is provided with a plating tank (not shown in the figure), which can accommodate a plating solution, which can be used for forming a thin film on the coated product 200 and for conducting current. Wherein, the frame 110 can be integrally formed with a plating tank through casting, molding, etc., to simplify the molding process of the frame 110 and save the manufacturing cost of the frame 110; The tool is created separately. The plating solution can be copper liquid, iron liquid, etc., which can form a thin film on the surface of the coating product 200. In this embodiment, only copper liquid is used as a representative.

The two conductive mechanisms 120 are fixed on the frame 110 by screwing, welding, etc., so as to realize the fixed connection between the two conductive mechanisms 120 and the frame 110 . Moreover, the two conductive mechanisms 120 are arranged opposite to each other along the depth direction of the plating tank, that is, there is a gap between the two conductive mechanisms 120 . In this embodiment, the two conductive mechanisms 120 are arranged vertically at intervals. The conductive mechanism 120 includes a conductive roller 121, a titanium basket 122 and a rectifier 123, the conductive roller 121 and the titanium basket 122 are fixed on the frame 110, the positive pole of the rectifier 123 is electrically connected to the titanium basket 122, and the negative pole of the rectifier 123 is electrically connected to the conductive roller 121. connected, the titanium basket 122 is at least partly immersed in the plating solution, and in the radial direction of the conductive roller 121, one side of the conductive roller 121 is immersed in the plating solution, and the other side of the conductive roller 121 is exposed outside the plating solution. The plating solution has conductivity, and the rectifier 123 , the titanium basket 122 , the conductive roller 121 and the plating solution form a complete current loop to provide the current for the coated product 200 . And the cross-section of the conductive roller 121 in its axial direction is I-shaped, and the coated product 200 is in the electroplating process, and the middle part of the conductive roller 121 is neither in contact with the plating solution nor in contact with the middle part of the coated product 200, preventing the conductive roller 121 from The middle part is directly or indirectly in contact with the plating solution, which weakens the phenomenon of copper replating or copper deposition on the conductive roller 121, reduces the risk of the conductive roller 121 scratching the deposited film on the surface of the coated product 200, and significantly improves the coating quality of the coated product 200.

When the coated product 200 was passing through the conductive mechanism 120, one side of the coated product 200 was in contact with one of the two conductive rollers 121, and the other side of the coated product 200 was in contact with the other of the two conductive rollers 121, Thin films are plated on both surfaces of the coated product 200 to improve the electroplating efficiency on the surface of the coated product 200 .

In order to make the cross section of the conductive roller 121 in its axial direction be I-shaped, a preferred embodiment, as shown in Fig. The central position is recessed by 1cm-3cm. In other words, the conductive roller 121 has a cylindrical structure with large ends and a small middle. Coated product 200 is in the electroplating process, and the middle part of conductive roller 121 is neither in contact with plating solution, nor contacts with the middle part of coated product 200, prevents the middle part of conductive roller 121 from being directly or indirectly contacted with plating solution, and weakens the appearance on conductive roller 121. The phenomenon of copper replating or copper deposition reduces the risk of the conductive roller 121 scratching the deposited film on the surface of the coated product 200 , and significantly improves the coating quality of the coated product 200 .

When setting specifically, the diameter at both ends of the conductive roller 121 can be one of 5cm, 10cm, 15cm, and 20cm. Of course, the diameter at the two ends of the conductive roller 121 is not limited to the above-mentioned range value, and can also be in the range of 5cm-20cm other values within. In addition, for different installation processes or molding processes of the conductive roller 121, the diameters at both ends of the conductive roller 121 are not limited to the above diameter setting range, and the two ends of the conductive roller 121 can be specifically set according to the installation process or molding process of the conductive roller 121. diameter.

In order to save the manufacturing cost of the conductive roller 121, a preferred embodiment, as shown in Figure 1, the conductive roller 121 is a hollow tubular structure, the material required for the conductive roller 121 in the molding process is reduced, and the cost of the conductive roller 121 can be saved. manufacturing cost. Moreover, the requirements for the load-bearing strength of the frame 110 are relatively low, so that the lightweight design of the conductive device 100 for coating can be realized.

In order to facilitate the manufacture and molding of the conductive roller 121 , in a preferred embodiment, as shown in FIG. 1 , the material of the conductive roller 121 is one of 304 stainless steel and 316 stainless steel. Because both 304 stainless steel and 316 stainless steel have excellent formability, it is convenient for the manufacture and molding of the conductive roller 121, and stainless steel also has excellent corrosion resistance, toughness, etc., which can significantly improve the service life of the conductive roller 121 and prevent the conductive roller 121. Defects such as deformation may occur during long-term use.

Of course, in other embodiments, the conductive roller 121 can also be made of other materials with excellent formability and conductivity, such as: 316L stainless steel. The present invention does not limit the specific material of the conductive roller 121. Specific selection of process requirements or budget costs.

In order to further improve the coating quality of the coated product 200 , in a preferred embodiment, as shown in FIG. 1 , the conductive mechanism 120 further includes an auxiliary anode 124 , and the positive pole of the rectifier 123 is electrically connected to the auxiliary anode 124 . Because the cross-section of the conductive roller 121 along its axial direction is I-shaped, the conductive capacity of the middle position of the conductive roller 121 is relatively weak, and the rectifier 123, the auxiliary anode 124, the conductive roller 121 and the plating solution form a complete current loop, and the rectifier 123, the titanium basket 122, the conductive roller 121 and the current loop formed by the plating solution jointly enhance the conductivity of the conductive roller 121, make up for the small shortcoming of the current density in the middle of the conductive roller 121, and greatly improve the uniformity of the film formed on the surface of the coated product 200 property, to improve the coating quality of the coating product 200.

Wherein, the auxiliary anode 124 is made of titanium metal. Since titanium metal is insoluble in strong acid, it is not easy to deform and corrode when it contacts with the plating solution, which helps to prolong the service life of the auxiliary electrode. However, the conductivity of titanium metal is weak, so its surface is uniformly coated with an iridium metal layer, which can enhance the conductivity of the auxiliary anode 124, make up for the small shortcoming of the current density in the middle of the conductive roller 121, and greatly improve the coating product 200. The uniformity of the thin film formed on the surface can improve the coating quality of the coating product 200 .

In addition, as shown in Figures 1 and 2, the present invention also provides a coating machine 300, the coating machine 300 includes an unwinding mechanism 310, a winding mechanism 320 and a conductive device 100 for coating according to any one of the above technical solutions, The unwinding mechanism 310 is fixed on the frame 110 by screwing, welding, etc., and the winding mechanism 320 is also fixed on the frame 110 by screwing, welding, etc., to realize the installation of the unwinding mechanism 310 and the winding mechanism 320 fixed. The unwinding mechanism 310 and the winding mechanism 320 are arranged at intervals on the conveying path of the coated product 200. The unwinding mechanism 310 is used to automatically transport the coated product 200 before electroplating, and the winding mechanism 320 is used to automatically collect the coated product 200 after electroplating.

Above-mentioned coater 300, conductive roller 121 is I-shaped in the cross-section of its axial direction, and coating product 200 is in electroplating process, and the middle part of conductive roller 121 neither contacts with plating solution, also does not contact with the middle part of coated product 200, Prevent the conductive roller 121 from being in direct or indirect contact with the plating solution, resulting in copper replating or copper deposition on the conductive roller 121, preventing the conductive roller 121 from scratching the film deposited on the surface of the coated product 200, and significantly improving the coating quality of the coated product 200.

In order to improve the coating quality on the surface of the coating product 200, a preferred embodiment, as shown in Figure 1 and Figure 2, the coating machine 300 also includes a plurality of tension elements 330, and the plurality of tension elements 330 are all screwed, riveted, etc. The method is fixed on the frame 110 , and a plurality of tensioning elements 330 are evenly distributed between the unwinding mechanism 310 and the winding mechanism 320 , in other words, the plurality of tensioning elements 330 are evenly distributed on the conveying path of the coated product 200 . When the coated product 200 passes through the tensioning element 330, the tensioning element 330 can tension the coated product 200 to ensure the surface flatness of the coated product 200, further improve the uniformity of the film formed on the surface of the coated product 200, and improve the coating product. 200 surface coating quality.

Wherein, the tensioning element 330 is a tensioning wheel or a tensioning spring to ensure that when the coated product 200 passes through the tensioning element 330, the tensioning element 330 can tension the coated product 200 to ensure the surface smoothness of the coated product 200. Certainly, the tensioning element 330 is not limited to the tensioning wheel or the tensioning spring provided above, and may also be other elements capable of tensioning the coated product 200 , and the specific type of the tensioning element 330 is not limited in the present invention.

In order to weaken the phenomenon of copper replating or copper deposition on the conductive roller 121, a preferred embodiment, as shown in Figure 1 and Figure 2, the coating machine 300 also includes two spray elements (not shown), the two Each spray element is fixed on the frame 110 by means of screwing, riveting and the like. The shower element has a spray port, one of the two spray ports faces one of the two conductive rollers 121 , and the other of the two spray ports faces the other of the two conductive rollers 121 . The cleaning medium ejected by the shower element cleans the conductive roller 121 to clean the plating solution remaining on the conductive roller 121, preventing the plating solution remaining on the conductive roller 121 from being exposed to the air for a long time. Copper replating or copper deposition occurs on 121.

Wherein, the shower element is a shower head to clean the plating solution remaining on the conductive roller 121 . Certainly, the shower element is not limited to the above-mentioned shower head, and can also be other elements capable of cleaning the plating solution remaining on the conductive roller 121 , and the present invention does not limit the specific type of the shower element.

In order to improve the electroplating efficiency of the coating machine 300 on the coating product 200, a preferred embodiment, as shown in Figure 1 and Figure 2, the coating machine 300 also includes a heating element (not shown), the heating element is connected by screwing, Fixed on the frame 110 by welding or other means, the heating element can accelerate the forming rate of the film on the surface of the coated product 200 and improve the electroplating efficiency of the coating machine 300 on the coated product 200 .

Wherein, the heating element is an oven, and the heating element can accelerate the forming rate of the film on the surface of the coated product 200 . Certainly, the heating element is not limited to the oven provided above, and can also be other elements capable of accelerating the forming rate of the film on the surface of the coated product 200, and the specific type of the heating element is not limited in the present invention.

The present invention will be further elaborated below in combination with specific embodiments.

并且将电镀后的镀膜产品200展开，通过CCD相机(工业相机)对展开后的镀膜产品200表面形成的薄膜情况进行摄像，通过观测孔洞数量以及孔洞直径大小以表示镀膜产品200表面的镀膜质量。 It should be noted that, in the examples, the square resistance uniformity and the surface hole morphology of the film are used to represent the coating quality of the coating product surface. Use a four-probe tester to measure the resistance of the film formed on the surface of the coating product 200,

And the coated product 200 after electroplating is unfolded, and the thin film situation formed on the surface of the coated product 200 after the expansion is taken by a CCD camera (industrial camera), and the coating quality on the surface of the coated product 200 is represented by observing the number of holes and the diameter of the holes.

Example 1

The electroplated film is selected on the surface of the polypropylene film, the thickness of the polypropylene film is 6 μm, the conductive roller 121 is the existing conductive roller 121 , and the auxiliary anode 124 is not provided.

Plating solution composition: 130g/L copper sulfate, 140g/L sulfuric acid, 60mg/L hydrochloric acid, 8ml/L brightener.

Antioxidant solution: DP-A agent 5ml/L, DP-B agent 10ml/L, process temperature 20-30℃, pH 1.8-3.5.

Oven setting temperature: 80°C.

The conveying line speed of polypropylene film: 2m/min.

The total current of one side of the polypropylene film (replaced by A side below) is 1152A; the total current of the other side of the polypropylene film (replaced by B side below) is 1164A.

Tension of polypropylene film during conveying: 80N.

The results are shown in Table 1 and Table 2:

Table 1 1200m polypropylene film surface A and B square resistance at different positions

Coating position (m) 50 150 250 350 450 550 650 750 850 950 1050 1150 Side A square resistance twenty two 20 twenty one twenty three twenty three twenty two twenty three twenty four twenty two twenty one 19 19 Side B square resistance 19 twenty one twenty two twenty two twenty four twenty three twenty three twenty two 20 twenty one 19 19

Table 2 The hole detection data of the film on the surface of the polypropylene film

As can be seen from Table 1 and Table 2, in the absence of an auxiliary anode 124, when using the existing conductive roller 121 to electroplate a polypropylene film, use a four-probe tester to measure the surface formation of the polypropylene film within a range of 1200m. The electrical resistance of the film was 11.6% for the uniformity of square resistance on the side A of the polypropylene film, and 11.6% for the uniformity of square resistance on the side B of the polypropylene film. A CCD camera was used to take pictures of the film formation on the surface of the polypropylene film within a range of 1200 square meters after unfolding. The total number of holes was 1752, and the diameter of the holes in each interval was relatively large.

Example 2

Select to carry out electroplating thin film on the surface of polypropylene film, the thickness of polypropylene film is 6 μ m, conduction roller 121 is the conduction roller 121 that the present invention uses (the cross section of conduction roller 121 along its axial direction is I-shaped), no auxiliary Anode 124.

Plating solution composition: 130g/L copper sulfate, 140g/L sulfuric acid, 60mg/L hydrochloric acid, 8ml/L brightener.

Antioxidant solution: DP-A agent 5ml/L, DP-B agent 10ml/L, process temperature 20-30℃, pH 1.8-3.5.

Oven setting temperature: 80°C.

The conveying line speed of polypropylene film: 2m/min.

The total current of the side A of the polypropylene film: 1152A; the total current of the side B of the polypropylene film: 1164A.

Tension of polypropylene film during conveying: 80N.

The results are shown in Table 3 and Table 4:

Table 3 1200m polypropylene film surface A and B square resistance at different positions

Coating position (m) 50 150 250 350 450 550 650 750 850 950 1050 1150 Side A square resistance 18 19 twenty two twenty three twenty three twenty three twenty three twenty three 20 19 20 18 Side B square resistance 19 20 twenty two twenty three twenty four twenty three twenty four twenty two twenty one twenty one 18 19

Table 4 Pore detection data of polypropylene film surface film

As can be seen from Table 3 and Table 4, in the absence of an auxiliary anode 124, when the conductive roller 121 used in the present invention is used to electroplate the polypropylene film, the polypropylene film within the range of 1200m is measured using a four-probe tester As for the resistance of the thin film formed on the surface, the square resistance uniformity of the polypropylene film A side was 12.2%, and the square resistance uniformity of the polypropylene film B side was 14.3%. A CCD camera was used to take pictures of the film formation on the surface of the polypropylene film within 1200 square meters after unfolding. The total number of holes was 492, and the diameter of the holes in each interval was relatively small.

Example 3

Select to carry out electroplating thin film on the surface of polypropylene film, the thickness of polypropylene film is 6 μ m, conduction roller 121 is the conduction roller 121 that the present invention uses (conduction roller 121 is I-shaped along the cross section of its axial direction), and is provided with Auxiliary anode 124.

Plating solution composition: 130g/L copper sulfate, 140g/L sulfuric acid, 60mg/L hydrochloric acid, 8ml/L brightener.

Antioxidant solution: DP-A agent 5ml/L, DP-B agent 10ml/L, process temperature 20-30℃, pH 1.8-3.5.

Oven setting temperature: 80°C.

The conveying line speed of polypropylene film: 2m/min.

The total current of the side A of the polypropylene film: 1152A; the total current of the side B of the polypropylene film: 1164A.

The total current of the auxiliary anode 124A surface: 52A; the total current of the auxiliary anode 124B surface: 64A.

Tension of polypropylene film during conveying: 80N.

The results are shown in Table 5 and Table 6:

Table 5 1200m polypropylene film different position A surface and B surface resistance

Coating position (m) 50 150 250 350 450 550 650 750 850 950 1050 1150 Side A square resistance twenty two twenty one twenty one 20 twenty two twenty two twenty two twenty two twenty two twenty one 20 19 Side B square resistance 20 twenty one twenty two twenty two twenty two twenty two twenty one twenty two 20 twenty one 19 19

Table 6 The hole detection data of the film on the surface of the polypropylene film

It can be seen from Table 5 and Table 6 that, in the case where the auxiliary anode 124 is provided, when the conductive roller 121 used in the present invention is used to electroplate the polypropylene film, a four-probe tester is used to measure the polypropylene film in the range of 1200m As for the resistance of the thin film formed on the surface, the uniformity of the square resistance of the polypropylene film A side was 7.3%, and the square resistance uniformity of the polypropylene film B side was 7.3%. A CCD camera was used to take pictures of the film formation on the surface of the polypropylene film within a range of 1200 square meters after unfolding. The total number of holes was 456, and the diameter of the holes in each interval was significantly reduced.

In summary, when using the conductive roller 121 of the present invention (the cross-section of the conductive roller 121 along its axial direction is I-shaped), the number of holes formed on the surface of the polypropylene film is significantly reduced, and the diameter of the holes in each interval Both are small, indicating that in the electroplating process of the coated product 200, the phenomenon of copper replating or copper deposition on the conductive roller 121 has been weakened, and the risk of the conductive film scratching the deposited film on the surface of the coated product 200 is reduced. The quality is significantly improved. In addition, when the auxiliary anode 124 is provided, the uniformity of the film formed on the surface of the coated product 200 is greatly improved due to the increase of the current density in the middle of the conductive roller 121 , and the coating quality of the coated product 200 is further improved.

The technical features of the above-mentioned embodiments can be combined arbitrarily. To make the description concise, all possible combinations of the technical features in the above-mentioned embodiments are not described. However, as long as there is no contradiction in the combination of these technical features, should be considered as within the scope of this specification.

The above-mentioned embodiments only express several implementation modes of the present invention, and the descriptions thereof are relatively specific and detailed, but should not be construed as limiting the patent scope of the invention. It should be noted that, for those skilled in the art, several modifications and improvements can be made without departing from the concept of the present invention, and these all belong to the protection scope of the present invention. Therefore, the protection scope of the patent for the present invention should be based on the appended claims.

Claims (10)

A conductive device for coating, which is used for electroplating thin films on the surface of coated products, is characterized in that it includes: A frame, the frame is provided with a plating tank for containing the plating solution; Two conductive mechanisms, both of which are fixed on the frame, are arranged opposite to each other along the depth direction of the plating tank. The conductive mechanisms include conductive rollers, titanium baskets and rectifiers, and the rectifiers The positive pole is electrically connected to the titanium basket, the negative pole of the rectifier is electrically connected to the conductive roller, the titanium basket is at least partially immersed in the plating solution, and one side of the conductive roller along its radial direction is immersed in the In the plating solution, the other side is exposed outside the plating solution, and the cross-section of the conductive roller in its axial direction is I-shaped; When the film-coated product passes through the conductive mechanism, one side of the film-coated product is in contact with one of the two conductive rollers, and the other side is in contact with the other conductive roller. The conductive device for coating according to claim 1, wherein the diameters of both ends of the conductive roller are 5cm-20cm, and the middle position of the conductive roller is recessed by 1cm-3cm compared to the end positions. The conductive device for coating according to claim 1, wherein the conductive roller is a hollow tubular structure. The conductive device for coating according to claim 1, wherein the material of the conductive roller is one of 304 stainless steel and 316 stainless steel. The conductive device for coating according to claim 1, wherein the conductive mechanism further includes an auxiliary anode, and the positive pole of the rectifier is electrically connected to the auxiliary anode. The conductive device for coating according to claim 5, wherein the auxiliary anode is made of titanium metal, and its surface is uniformly coated with an iridium metal layer. A coating machine, characterized in that it comprises an unwinding mechanism, a winding mechanism and the conductive device for coating according to any one of claims 1-6, the unwinding mechanism and the winding mechanism are fixed on the on the frame, and are arranged at intervals on the conveying path of the coated products. The coating machine according to claim 7, further comprising a plurality of tensioning elements, a plurality of tensioning elements are fixed on the frame and evenly distributed between the unwinding mechanism and the Between the winding mechanism. The coating machine according to claim 7, characterized in that, it also includes two spray elements, both of which are fixed on the frame, and the spray elements have spray ports, and the two spray elements are fixed on the frame. One of the spray openings faces one of the two conductive rollers, and the other one faces the other of the two conductive rollers. The coating machine according to claim 7, further comprising a heating element fixed on the frame.

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