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WO2023038052A1 - Feuille de rayonnement de chaleur - Google Patents

Feuille de rayonnement de chaleur Download PDF

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Publication number
WO2023038052A1
WO2023038052A1 PCT/JP2022/033525 JP2022033525W WO2023038052A1 WO 2023038052 A1 WO2023038052 A1 WO 2023038052A1 JP 2022033525 W JP2022033525 W JP 2022033525W WO 2023038052 A1 WO2023038052 A1 WO 2023038052A1
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WO
WIPO (PCT)
Prior art keywords
thermally conductive
conductive filler
average particle
fluororubber
particle size
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Ceased
Application number
PCT/JP2022/033525
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English (en)
Japanese (ja)
Inventor
武 水谷
梨夏 高城
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Maxell Ltd
Maxell Kureha Co Ltd
Original Assignee
Maxell Ltd
Maxell Kureha Co Ltd
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Priority to JP2023546963A priority Critical patent/JPWO2023038052A1/ja
Publication of WO2023038052A1 publication Critical patent/WO2023038052A1/fr
Anticipated expiration legal-status Critical
Ceased legal-status Critical Current

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    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08J—WORKING-UP; GENERAL PROCESSES OF COMPOUNDING; AFTER-TREATMENT NOT COVERED BY SUBCLASSES C08B, C08C, C08F, C08G or C08H
    • C08J5/00—Manufacture of articles or shaped materials containing macromolecular substances
    • C08J5/18—Manufacture of films or sheets
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08K—Use of inorganic or non-macromolecular organic substances as compounding ingredients
    • C08K3/00—Use of inorganic substances as compounding ingredients
    • C08K3/18—Oxygen-containing compounds, e.g. metal carbonyls
    • C08K3/20—Oxides; Hydroxides
    • C08K3/22—Oxides; Hydroxides of metals
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08K—Use of inorganic or non-macromolecular organic substances as compounding ingredients
    • C08K3/00—Use of inorganic substances as compounding ingredients
    • C08K3/28—Nitrogen-containing compounds
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08L—COMPOSITIONS OF MACROMOLECULAR COMPOUNDS
    • C08L27/00—Compositions of homopolymers or copolymers of compounds having one or more unsaturated aliphatic radicals, each having only one carbon-to-carbon double bond, and at least one being terminated by a halogen; Compositions of derivatives of such polymers
    • C08L27/02—Compositions of homopolymers or copolymers of compounds having one or more unsaturated aliphatic radicals, each having only one carbon-to-carbon double bond, and at least one being terminated by a halogen; Compositions of derivatives of such polymers not modified by chemical after-treatment
    • C08L27/12—Compositions of homopolymers or copolymers of compounds having one or more unsaturated aliphatic radicals, each having only one carbon-to-carbon double bond, and at least one being terminated by a halogen; Compositions of derivatives of such polymers not modified by chemical after-treatment containing fluorine atoms
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L23/00—Details of semiconductor or other solid state devices
    • H01L23/34—Arrangements for cooling, heating, ventilating or temperature compensation ; Temperature sensing arrangements
    • H01L23/36—Selection of materials, or shaping, to facilitate cooling or heating, e.g. heatsinks
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L23/00—Details of semiconductor or other solid state devices
    • H01L23/34—Arrangements for cooling, heating, ventilating or temperature compensation ; Temperature sensing arrangements
    • H01L23/36—Selection of materials, or shaping, to facilitate cooling or heating, e.g. heatsinks
    • H01L23/373—Cooling facilitated by selection of materials for the device or materials for thermal expansion adaptation, e.g. carbon

Definitions

  • the present invention relates to a heat dissipating material sheet used in electronic equipment and the like.
  • heat dissipation material sheets are used in electronic devices.
  • the heat dissipating material sheet is inserted between a heat source such as an electronic component and a heat dissipating member such as a heat sink, and plays a role of efficiently transferring heat generated by the heat source to the heat dissipating member.
  • Composite materials in which a thermally conductive filler is dispersed in a matrix component are generally known as heat dissipating material sheets (see, for example, Patent Document 1).
  • heat dissipating material sheets using silicone rubber as a matrix component are distributed.
  • Patent Document 2 in the volume-based particle size distribution curve of the insulating filler, both large and small particle sizes are used, and the number of particles with a small particle size is larger than that of particles with a large particle size.
  • a heat conductive sheet is described.
  • Patent Document 3 describes a thermally conductive resin molded article containing thermally conductive fillers having different average particle sizes and using fluororubber as the resin.
  • the present invention has been made in view of such circumstances, and an object of the present invention is to provide a heat dissipating material sheet that has heat resistance, flexibility, insulation, and excellent thermal conductivity.
  • the heat dissipating material sheet of the present invention is a heat dissipating material sheet made of a fluororubber composition, wherein the fluororubber composition contains a fluororubber, a softening agent, and a thermally conductive filler, and the content of the thermally conductive filler is 50% by volume or more of the entire fluororubber composition, the thermally conductive filler includes a plurality of thermally conductive fillers having different average particle sizes, and among the plurality of thermally conductive fillers, the average particle size is When a large thermally conductive filler is used as the first thermally conductive filler (F1) and a thermally conductive filler with a small average particle size is used as the second thermally conductive filler (F2), the average of the first thermally conductive filler (F1) The particle diameter is 120 ⁇ m to 500 ⁇ m, the average particle diameter of the second thermally conductive filler (F2) is 10 ⁇ m to 100 ⁇ m, and the first thermal
  • the content of the thermally conductive filler is 65% by volume or less with respect to the entire fluororubber composition.
  • the average particle size of the first thermally conductive filler (F1) is 300 ⁇ m to 500 ⁇ m.
  • the average particle size of the second thermally conductive filler (F2) is 20 ⁇ m to 70 ⁇ m.
  • the heat conductive filler is at least one selected from boron nitride, aluminum nitride, aluminum oxide, and magnesium oxide.
  • the softening agent is characterized by being contained in an amount of 20 to 60 parts by mass with respect to 100 parts by mass of the fluororubber.
  • the sheet thickness of the heat dissipating material sheet is 1 mm or more.
  • the heat dissipating material sheet of the present invention contains fluororubber, a softening agent, and thermally conductive fillers (F1, F2), and the content of the thermally conductive filler is 50% by volume or more with respect to the entire fluororubber composition.
  • F1 has an average particle size of 120 ⁇ m to 500 ⁇ m
  • F2 has an average particle size of 10 ⁇ m to 100 ⁇ m
  • the mass ratio (F1:F2) of F1 and F2 in the fluororubber composition is (2:1) to (5 : 1)
  • the entire thermally conductive filler is well filled in the sheet, making it easy to form a thermally conductive path, and as a result, the thermal conductivity can be further improved.
  • the heat dissipating material sheet has heat resistance, flexibility, insulation, and excellent thermal conductivity.
  • the softening agent is contained in 20 to 60 parts by mass with respect to 100 parts by mass of fluororubber, so even if it contains a large amount of heat-conducting filler, it becomes easy to mold and becomes a heat dissipation material sheet with excellent flexibility. In addition, since the adhesiveness to the heat source can be improved, it also contributes to an increase in the heat radiation effect.
  • FIG. 1 is a perspective view showing an example of the heat dissipation material sheet of the present invention.
  • the heat dissipating material sheet 1 is placed between a heat source such as an IC and a heat dissipating member such as a heat sink in an electronic device, for example, and is used with one surface in contact with the heat source and the other surface in contact with the heat dissipating member.
  • the shape of the heat dissipating material sheet 1 is rectangular in plan view, but it can be made into any shape according to the arrangement space, application, and the like.
  • the heat dissipation material sheet 1 is used in a wide range of fields such as electrical parts and automobile parts.
  • the heat dissipation material sheet 1 is made of a fluororubber composition, and the composition contains a fluororubber as a base, a softening agent, and a heat-conducting filler.
  • the heat dissipating material sheet 1 contains a large amount of thermally conductive filler, and the thermally conductive filler is widely dispersed in the sheet, so that thermally conductive paths are easily formed, and excellent thermal conductivity is exhibited. is.
  • the fluororubber composition will be described in detail below.
  • Fluorororubber is a rubber with high heat and chemical resistance.
  • examples of the fluororubber used in the present invention include vinylidene fluoride rubber (FKM), tetrafluoroethylene-propylene rubber (FEPM), tetrafluoroethylene-perfluoromethyl vinyl ether rubber (FFKM), and the like. may be used alone or in combination of two or more.
  • fluororubber more specifically, vinylidene fluoride/hexafluoropropylene copolymer rubber, tetrafluoroethylene/propylene copolymer rubber, tetrafluoroethylene/hexafluoropropylene copolymer rubber, hexafluoropropylene/ethylene copolymer rubber, Binary copolymer rubber such as polymer rubber, tetrafluoroethylene/perfluoro(alkyl vinyl ether) copolymer rubber, vinylidene fluoride/tetrafluoroethylene/hexafluoropropylene copolymer rubber, vinylidene fluoride/tetrafluoropropylene copolymer rubber Ternary copolymer rubber such as fluoroethylene/perfluoromethyl vinyl ether copolymer rubber and tetrafluoroethylene/propylene/vinylidene fluoride copolymer rubber can be used.
  • Binary copolymer rubber such as polymer
  • the fluororubber can be produced by conventional methods such as solution polymerization, suspension polymerization, and emulsion polymerization. A commercially available fluororubber may also be used.
  • the fluorororubber is, for example, solid at room temperature (25° C.).
  • Mooney viscosity (ML 1+10 , 121° C.) of the fluororubber is not particularly limited, it is, for example, 20-60, preferably 20-50.
  • the Mooney viscosity is measured according to JIS K6300.
  • the content of the fluororubber is preferably 20% by mass to 50% by mass, more preferably 20% by mass to 40% by mass, and still more preferably 20% by mass to 35% by mass, relative to the total amount of the fluororubber composition. %.
  • the content of the fluororubber is 20% by mass to 50% by mass, it becomes easy to ensure moldability while imparting good heat resistance, chemical resistance, etc. to the heat dissipation material sheet.
  • Softening agents used in the present invention include petroleum softening agents such as naphthenic oils and paraffin oils, vegetable oil softening agents such as palm oil and castor oil, plasticizers, and liquid rubbers. These may be used alone or in combination of two or more.
  • plasticizers include fluorosilicone oils, phthalates, aliphatic carboxylic acid esters, polyester polymer plasticizers, higher fatty acids such as palmitic acid and stearic acid, higher aliphatic amides, higher fatty acid esters, and higher fatty acids. and the like.
  • Liquid rubber refers to rubber that exhibits a liquid state at room temperature (25°C), and known liquid rubbers such as diene liquid rubber, olefin liquid rubber, and liquid fluororubber can be used. Among these liquid rubbers, it is preferable to use the liquid fluororubber. Note that the liquid fluororubber does not correspond to the fluororubber used as the base described above.
  • the liquid fluororubber commercially available products such as Daiel (registered trademark) G101 (manufactured by Daikin Industries, Ltd.) and Viton (registered trademark) LM (manufactured by Chemours Co., Ltd.) can be used.
  • the above liquid fluororubber is a non-crosslinked rubber component.
  • the viscosity of the liquid fluororubber is not particularly limited, it preferably has a viscosity of 500 cP to 30000 cP at 105° C. from the viewpoint of kneadability and moldability.
  • liquid fluororubber As the softener, it is preferable to use liquid fluororubber as the softener.
  • the liquid fluororubber has the same level of heat resistance and chemical resistance as the fluororubber used as the base, and can suppress bleeding. can be improved.
  • the softening agent is preferably contained in an amount of 10 to 70 parts by mass with respect to 100 parts by mass of the fluororubber. If the content of the softening agent is less than 10 parts by mass, it is difficult to obtain the effect of lowering the rubber hardness, and if the content of the softening agent exceeds 70 parts by mass, the mechanical strength of the sheet may be impaired.
  • the softener is more preferably contained in an amount of 20 to 60 parts by mass, and may be contained in an amount of 40 to 60 parts by mass, based on 100 parts by mass of the fluororubber.
  • thermally conductive filler examples include metal oxides such as aluminum oxide, magnesium oxide and titanium oxide; metal hydroxides such as aluminum hydroxide and magnesium hydroxide; and nitrogen compounds such as boron nitride and aluminum nitride. , quartz powder, silicon nitride, and silicon compounds such as silicon carbide.
  • thermally conductive fillers may be used alone or in combination of two or more. Among them, it is preferable to use at least one selected from boron nitride, aluminum nitride, aluminum oxide, and magnesium oxide, and it is particularly preferable to use boron nitride, which has excellent thermal conductivity.
  • the shape of the heat-conducting filler particles is not particularly limited, and any of scaly, granular, spherical, columnar, and the like can be used.
  • the thermally conductive filler particles are not limited to primary particles, and granules obtained by agglomerating primary particles, agglomerates thereof, and the like can be used.
  • the shape of the thermally conductive filler particles is scaly, it is difficult to form a thermal conduction path in the thickness direction of the sheet.
  • scale-like boron nitride particles have anisotropy in thermal conductivity, so it is preferable to use granules or aggregates obtained by granulating scale-like primary particles.
  • the boron nitride particles are less likely to be oriented in one direction when the sheet is formed, so that the thermal conductivity can be improved.
  • a plurality of thermally conductive filler particles having different average particle sizes are used as the thermally conductive filler.
  • the plurality of thermally conductive filler particles may have the same or different filler components.
  • a thermally conductive filler having a large average particle size is used as the first thermally conductive filler (F1)
  • a thermally conductive filler having a small average particle size is used as the second thermally conductive filler.
  • a filler (F2) mutual relationships and the like are defined. It is explained below.
  • the average particle size of F1 is, for example, 120 ⁇ m to 500 ⁇ m, preferably 200 ⁇ m to 500 ⁇ m, more preferably 300 ⁇ m to 500 ⁇ m.
  • the average particle size of F2 is, for example, 10 ⁇ m to 100 ⁇ m, preferably 20 ⁇ m to 70 ⁇ m. In addition, it may be 50 ⁇ m to 100 ⁇ m.
  • the ratio of the average particle sizes of F1 and F2 (F1:F2) is, for example, (2:1) to (5:1), preferably (2:1) to (4:1), and more It is preferably (3:1) to (4:1).
  • the average particle size of F1 is less than 120 ⁇ m, the amount of powder increases, resulting in a sheet that is likely to crack and molding (for example, press vulcanization molding) may become difficult.
  • the average particle size of F1 is larger than 500 ⁇ m, the number of particles having a large particle size increases, making it difficult to form a heat conduction path, which may result in poor thermal conductivity.
  • the average particle size of F2 is less than 10 ⁇ m, the bulk becomes large, which may make processing difficult due to fragility and cracking. Moreover, it becomes difficult to form a heat conduction path, and there is a possibility that the heat conductivity is deteriorated.
  • the average particle size of F2 is larger than 100 ⁇ m, the average particle size of F2 is too close to that of F1, so that the thermally conductive filler is difficult to be densely packed. may be inferior.
  • the average particle size of F1 and F2 is the particle size (D50) at the point where the volume-based cumulative value is 50% when the particle size distribution is a cumulative distribution, and is a laser diffraction/scattering particle size. It can be measured by a wet method using a distribution measuring device (eg LA-920 manufactured by Horiba Ltd.).
  • a distribution measuring device eg LA-920 manufactured by Horiba Ltd.
  • a magnifying glass capable of appropriately observing the cross section of the sheet can be used for actual measurement.
  • the mass ratio (F1:F2) of F1 and F2 in the fluororubber composition is (2:1) to (5:1), preferably (2:1) to (4:1), More preferably (3:1) to (4:1).
  • the mass of F2 is 1, if the mass of F1 is less than 2 (when the amount of F1 is too small), the number of particles with a small average particle size increases, making it difficult to form a heat conduction path, resulting in poor thermal conductivity. may decrease.
  • the mass of F1 is greater than 5 (when the amount of F1 is too large), the number of particles with a small average particle size decreases, so the number of particles that enter the gap between particles with a large average particle size decreases, resulting in a heat conduction path becomes difficult to form, and there is a risk that the thermal conductivity will decrease.
  • the plurality of thermally conductive fillers are not limited to two types (F1, F2), and may further include thermally conductive fillers with different average particle sizes. In this case, it is preferable that at least two types of particles having a size relationship among the plurality of thermally conductive fillers satisfy the above relationship.
  • the content of the thermally conductive filler (the total amount thereof when using a plurality of thermally conductive fillers having different average particle sizes) is 50% by volume or more relative to the entire fluororubber composition, preferably It is more than 50% by volume, more preferably 52% by volume or more, and particularly preferably 55% by volume or more. This makes it easier to form a heat conduction path in the sheet, thereby exhibiting excellent heat conductivity.
  • % or less may be 70 volume % or less, or may be 65 volume % or less.
  • the heat dissipating material sheet of the present invention has insulating properties, and preferably has a dielectric breakdown voltage of 4.50 kV or higher or a dielectric breakdown strength of 3.50 kV/mm or higher as defined in JIS C 2110-1. .
  • the fluororubber composition preferably does not contain a conductive filler.
  • conductive fillers include solid carbon materials such as graphite powder, conductive carbon black, carbon nanotubes, and fullerene; metal powders such as copper powder, silver powder, and iron powder; and conductive materials such as conductive tin oxide and conductive titanium oxide. metal oxides and the like.
  • the above-mentioned fluororubber is preferably crosslinked.
  • a cross-linking method for example, chemical cross-linking such as press vulcanization can be performed.
  • Vulcanizing agents used for press vulcanization include dicumyl peroxide, 2,5-dimethyl-2,5-bis(t-butylperoxy)hexane, 1,3-bis-(t-butylperoxy-isopropyl) Organic peroxides such as benzene, t-butylcumyl peroxide, di-t-butylperoxide can be used.
  • the content of the vulcanizing agent is preferably 0.5 to 3 parts by mass with respect to 100 parts by mass of the fluororubber.
  • the cross-linking method is not limited to press vulcanization, and a normal cross-linking method can be employed, for example, a radiation cross-linking method may be performed. Electron beams, ⁇ -rays, X-rays, and the like are used in radiation crosslinking.
  • fluororubber softening agent, heat conductive filler, and vulcanizing agent
  • other additives can be added to the fluororubber composition as long as they do not impair the effects of the present invention.
  • anti-aging agents e.g., anti-aging agents, vulcanization accelerators, reinforcing agents, coloring agents and the like can be blended.
  • the heat dissipation material sheet of the present invention has excellent thermal conductivity, and the thermal conductivity is preferably 3.0 W/mK or higher, more preferably 4.5 W/mK or higher, and more preferably 5.0 W/mK or higher. .
  • the thermal conductivity is 20 W/mK or less, and may be 15 W/mK or less.
  • the thermal conductivity of the heat dissipating material sheet is the value measured by the hot wire method. For example, it can be obtained by measuring a test piece with a thickness of 1 mm with a thermal conductivity meter.
  • the hardness of the heat dissipating material sheet of the present invention is not particularly limited, it preferably has a hardness of 20 to 60, more preferably 20 to 50, according to the type D durometer specified in JIS K6253. As a result, good flexibility can be imparted, and complicated shapes such as narrow spaces and curved surfaces can be fitted, making it applicable to a wide range of applications.
  • the heat dissipation material sheet can be produced by (1) preparing a raw material composition, and (2) molding and crosslinking the prepared raw material composition.
  • the raw material composition of (1) is prepared, for example, by kneading various raw materials such as fluororubber, softening agent, and heat-conductive filler with two rolls.
  • the heat dissipating material sheet of the present invention contains a large amount of thermally conductive filler, the kneading operation tends to be relatively difficult. Therefore, in the present invention, it is preferable to manufacture by drying, molding and vulcanizing after preparing a solution containing various raw materials.
  • a heat conductive filler and a softening agent are placed in a container, a solvent is added and mixed and dispersed, and then a compound containing fluororubber that has been kneaded in advance by a kneading roll is placed in the container and dissolved. .
  • the thermal conductive filler to the base fluororesin is added. It is thought that dispersibility can be improved.
  • a predetermined amount of the obtained solution is poured into the mold to volatilize the solvent. After that, the dried product is vulcanized by pressing to obtain a heat dissipating material sheet.
  • the obtained heat dissipation material sheet may be annealed as necessary.
  • extrusion molding As a molding method, extrusion molding, injection molding, transfer molding, and the like can be performed, but press molding is preferable, and the heat radiation material sheet is preferably a press-molded body.
  • the sheet thickness of the heat radiation material sheet is not particularly limited, and is, for example, 0.5 mm or more, preferably 1 mm or more.
  • the sheet thickness is preferably thin from the viewpoint of installation in a narrow space and flexibility of shape, and the sheet thickness is, for example, 5 mm or less, and may be 3 mm or less.
  • Examples 1-6, Comparative Examples 1-5 The composition of the fluororubber composition of each test example is as shown in Tables 1 and 2.
  • a liquid fluororubber was used as a softening agent.
  • the heat conductive filler three types of boron nitride A to C with different average particle sizes and three types of aluminum oxide (alumina) A to C with different average particle sizes are used, and one or two of these are used. were combined, and the one with a larger average particle size was designated as F1, and the one with a smaller average particle size was designated as F2.
  • the boron nitride particles granules obtained by granulating scale-like primary particles or aggregates thereof were used.
  • "Volume % of thermally conductive filler (F1+F2)" in Tables 1 and 2 indicates the volume % of the entire thermally conductive filler with respect to the entire fluororubber composition.
  • each heat conductive filler has a average particle size of 300 ⁇ m to 500 ⁇ m Boron nitride B: 55 ⁇ m to 65 ⁇ m Boron nitride C: 25 ⁇ m Alumina A: 600 ⁇ m Alumina B: 355 ⁇ m Alumina C: 53 ⁇ m
  • test sheet was produced by the following procedure. 1. A compound was obtained by previously kneading the fluororubber, the vulcanizing agent, and the like with a kneading roll. 2. Boron nitride or alumina, liquid fluororubber, etc. were weighed in a container, methyl ethyl ketone (MEK) was added, mixed and dispersed, and then the above compound was placed in a container and dissolved. 3. A predetermined amount of the resulting solution was poured into a mold, subjected to a vacuum defoaming treatment, and then dried until the solvent was volatilized. 4. After the dried sheet was vulcanized by pressing, it was annealed to obtain a test sheet.
  • MEK methyl ethyl ketone
  • thermal conductivity tensile strength, elongation at break, and hardness (type D) were measured as physical property evaluations in the normal state.
  • the thermal conductivity was measured at 23° C. according to the hot wire method specified in JIS R2616 after cutting out a sample of dimensions (50 mm ⁇ 100 mm ⁇ 1 mm) from each test sheet.
  • Tensile strength and elongation at break were measured according to the test method specified in JIS K6251.
  • the hardness was measured according to the test method specified in JIS K6253 (type D durometer).
  • Example 2 when the test sheet of Example 2 was measured according to the test method specified in JIS C 2110-1, the dielectric breakdown voltage was 4.99 kV and the dielectric breakdown strength was 3.84 kV/mm. there were.
  • boron nitride and liquid fluororubber are dispersed in advance in the solvent, and it is possible that the use of a large amount of liquid fluororubber has improved the dispersibility of the thermally conductive filler in the sheet. be done.
  • Comparative Example 2 Even when two types of boron nitride particles having an average particle size are combined, when those having a relatively small average particle size are combined (Comparative Example 2), cracking occurs during vulcanization press, could not be molded. That is, the result was that the bulk increased and the workability decreased. For Comparative Example 2, various physical properties could not be evaluated.
  • boron nitride was used as the thermally conductive filler than when alumina was used.
  • the specific gravity of alumina is higher than that of boron nitride (for example, boron nitride is 2.15 g/cm 3 and alumina is 3.98 g/cm 3 ). It is considered that the uneven distribution of alumina led to the decrease in thermal conductivity. Further, when alumina is used, boron nitride is more preferable in terms of post-workability because it is difficult to cut the sheet.
  • Examples 1 to 3 and 5 maintain their thermal conductivity without deterioration even when placed in a high temperature environment for a long period of time.
  • the thermal conductivity was well maintained, and high-temperature deterioration was prevented.
  • the heat dissipating material sheet of the present invention has heat resistance, flexibility, insulation, and excellent thermal conductivity, so it is used in electronic devices and the like, and can quickly transmit heat generated by a heat source. .

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Abstract

L'invention concerne une feuille de rayonnement de chaleur ayant une résistance à la chaleur, une flexibilité et des propriétés isolantes et ayant en outre une excellente conductivité thermique. La feuille de rayonnement de chaleur 1 comprend une composition de caoutchouc fluoré, la composition de caoutchouc fluoré comprenant un caoutchouc fluoré, un plastifiant, et une charge thermoconductrice, la teneur en charge thermoconductrice étant supérieure ou égale à 50 % en volume par rapport à la totalité de la composition de caoutchouc fluoré et la charge thermoconductrice étant au moins un composé choisi parmi le nitrure de bore, le nitrure d'aluminium, l'oxyde d'aluminium et la magnésie.
PCT/JP2022/033525 2021-09-07 2022-09-07 Feuille de rayonnement de chaleur Ceased WO2023038052A1 (fr)

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Citations (6)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US5781412A (en) * 1996-11-22 1998-07-14 Parker-Hannifin Corporation Conductive cooling of a heat-generating electronic component using a cured-in-place, thermally-conductive interlayer having a filler of controlled particle size
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