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WO2023037699A1 - Pressure sensor - Google Patents

Pressure sensor Download PDF

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Publication number
WO2023037699A1
WO2023037699A1 PCT/JP2022/025166 JP2022025166W WO2023037699A1 WO 2023037699 A1 WO2023037699 A1 WO 2023037699A1 JP 2022025166 W JP2022025166 W JP 2022025166W WO 2023037699 A1 WO2023037699 A1 WO 2023037699A1
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WO
WIPO (PCT)
Prior art keywords
diaphragm
covering member
pressure sensor
layer
base material
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Ceased
Application number
PCT/JP2022/025166
Other languages
French (fr)
Japanese (ja)
Inventor
満美 内田
良平 濱▲崎▼
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Murata Manufacturing Co Ltd
Original Assignee
Murata Manufacturing Co Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Murata Manufacturing Co Ltd filed Critical Murata Manufacturing Co Ltd
Publication of WO2023037699A1 publication Critical patent/WO2023037699A1/en
Anticipated expiration legal-status Critical
Ceased legal-status Critical Current

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    • GPHYSICS
    • G01MEASURING; TESTING
    • G01LMEASURING FORCE, STRESS, TORQUE, WORK, MECHANICAL POWER, MECHANICAL EFFICIENCY, OR FLUID PRESSURE
    • G01L9/00Measuring steady of quasi-steady pressure of fluid or fluent solid material by electric or magnetic pressure-sensitive elements; Transmitting or indicating the displacement of mechanical pressure-sensitive elements, used to measure the steady or quasi-steady pressure of a fluid or fluent solid material, by electric or magnetic means

Definitions

  • the present invention relates to a pressure sensor formed using MEMS (Micro Electro Mechanical Systems) technology.
  • MEMS Micro Electro Mechanical Systems
  • Patent Document 1 the one described in Patent Document 1 is known as this type of pressure sensor.
  • the pressure sensor described in Patent Document 1 includes a sensor portion having a diaphragm, and a rigid cover disposed over the sensor portion and forming a cavity between the sensor portion and the diaphragm.
  • the sensor portion has electronic circuitry for calculating the pressure applied to the diaphragm based on a signal corresponding to the amount of strain in the diaphragm.
  • an object of the present invention is to solve the above problems and to provide a pressure sensor with high resistance to static electricity.
  • the pressure sensor according to the present invention comprises: a diaphragm and a base material having a support portion surrounding the diaphragm when viewed from the thickness direction of the diaphragm; a covering member that covers one surface of the diaphragm so as to form a measurement space between itself and the diaphragm, and that is joined to a supporting portion of the base material; with the diaphragm flexes due to pressure applied to one side of the diaphragm; A communication hole is formed in the covering member to communicate the measurement space with the outside, the covering member is grounded; is configured as
  • a pressure sensor with high resistance to static electricity can be realized.
  • FIG. 1 is a plan view of a pressure sensor according to a first embodiment of the invention
  • FIG. FIG. 2 is a cross-sectional view taken along line II-II of the pressure sensor in FIG. 1
  • FIG. 2 is a cross-sectional view taken along line III-III of the pressure sensor of FIG. 1
  • FIG. 3 is an enlarged view of a region Z1 in FIG. 2
  • FIG. 3 is a cross-sectional view showing an example of a mounted state of the pressure sensor of FIG. 2
  • FIG. 2 is a cross-sectional view of a pressure sensor according to a second embodiment of the invention, corresponding to line II-II in FIG. 1
  • FIG. 3 is an enlarged view corresponding to a region Z1 of a modification of the pressure sensor of FIG.
  • FIG. 3 is an enlarged view corresponding to a region Z1 of a modification of the pressure sensor of FIG. 2;
  • FIG. 3 is an enlarged view corresponding to a region Z1 of a modification of the pressure sensor of FIG. 2;
  • FIG. 7 is a cross-sectional view showing an example of a method of forming a covering member in the pressure sensor of FIG. 6;
  • FIG. 11 is a cross-sectional view showing a step following FIG. 10;
  • FIG. 12 is a cross-sectional view showing a step following FIG. 11;
  • FIG. 13 is a cross-sectional view showing a step following FIG. 12;
  • FIG. 14 is a cross-sectional view showing a step following FIG. 13;
  • FIG. 15 is a cross-sectional view showing a step following FIG. 14;
  • FIG. 2 is a plan view showing a modification of the pressure sensor of FIG. 1;
  • a pressure sensor comprises a diaphragm and a base material having a support portion surrounding the diaphragm when viewed from the thickness direction of the diaphragm; a covering member that covers one surface of the diaphragm so as to form a measurement space between itself and the diaphragm, and that is joined to a supporting portion of the base material; with the diaphragm flexes due to pressure applied to one side of the diaphragm; A communication hole is formed in the covering member to communicate the measurement space with the outside, The covering member is grounded.
  • the covering member is grounded.
  • the base material has an electronic circuit for calculating the pressure applied to one side of the diaphragm, it is possible to suppress current caused by static electricity or the like from flowing into the electronic circuit. Therefore, a pressure sensor with high resistance to static electricity can be realized.
  • the base material may have a first layer and a second layer having the diaphragm and the support.
  • the second layer may be laminated to the first layer so as to form a reference space between the first layer and the opposite side of the diaphragm.
  • the first layer may have a ground portion that is grounded.
  • the covering member may be electrically connected to the ground portion of the first layer.
  • the covering member is electrically connected to the ground portion of the first layer, a grounded covering member can be realized. Therefore, a pressure sensor with high resistance to static electricity can be realized.
  • the covering member may have a facing surface that forms the measurement space and faces the diaphragm.
  • the covering member may have a convex portion projecting toward the diaphragm in an overlapping region of the facing surface that overlaps with the diaphragm when viewed in the thickness direction of the diaphragm.
  • the covering member has a convex portion in the overlapping region of the facing surfaces. Therefore, when the diaphragm is drawn toward the facing surface of the covering member, the diaphragm contacts the convex portion before the facing surface of the covering member and is no longer drawn. That is, the contact area between the diaphragm and the covering member is smaller than in a configuration in which the covering member does not have a convex portion. This prevents the diaphragm from sticking to the covering member. Therefore, it is possible to reduce the possibility of detection failure of the pressure sensor.
  • the convex portion may be formed around the opening of the communication hole formed in the facing surface of the covering member.
  • the above-mentioned water droplets tend to accumulate in the measurement space near the opening of the communication hole, which is the infiltration path of water.
  • the projection is formed around the opening of the communication hole on the facing surface of the covering member. This can prevent the diaphragm from sticking to the covering member. Therefore, it is possible to reduce the possibility of detection failure of the pressure sensor.
  • the covering member may have a plurality of protrusions.
  • the plurality of protrusions may be formed in a grid pattern over the entire overlapping region of the covering member.
  • a plurality of protrusions are formed in the entire overlapping region of the covering member. As a result, it is possible to suppress adhesion of the diaphragm to the covering member in the entire overlapping region of the covering member. Therefore, it is possible to reduce the possibility of detection failure of the pressure sensor.
  • the convex portion may have a tapered shape in which the width of the convex portion decreases toward the diaphragm when viewed from a direction perpendicular to the thickness direction of the diaphragm.
  • the width of the tip of the protrusion is narrow, the contact area between the protrusion and the diaphragm is small. Therefore, sticking of the diaphragm to the protrusion is suppressed compared to a configuration that does not have a tapered shape in which the width of the protrusion decreases toward the diaphragm. Therefore, it is possible to reduce the possibility of detection failure of the pressure sensor.
  • the tip of the convex portion may be a curved surface.
  • the covering member may have a facing surface that forms the measurement space and faces the diaphragm.
  • the opening of the communicating hole formed in the facing surface may not overlap the diaphragm when viewed from the thickness direction of the diaphragm.
  • the opening of the communicating hole formed in the facing surface of the covering member does not overlap with the diaphragm when viewed from the thickness direction of the diaphragm. Therefore, it is possible to reduce the possibility that foreign matter that has passed through the communication hole together with the fluid will reach one side of the diaphragm. Therefore, detection failure of the pressure sensor due to adhesion of foreign matter to the diaphragm can be suppressed.
  • the covering member may have a facing surface that forms the measurement space and faces the diaphragm, and an upper surface that is opposite to the facing surface.
  • the shortest distance between the opening of the communicating hole formed in the top surface and the center of the top surface is shorter than the shortest distance between the opening of the communicating hole formed in the top surface and the edge of the top surface.
  • the pressure sensor is mounted on the base substrate, it is sealed with resin except for a part of the upper surface of the covering member.
  • the shortest distance between the opening of the communicating hole formed in the upper surface of the covering member and the center of the upper surface is the shortest distance between the opening of the communicating hole formed in the upper surface and the edge of the upper surface. shorter than distance. That is, on the upper surface of the covering member, the opening of the communication hole is separated from the edge of the upper surface.
  • the covering member may be thicker than the base material in the thickness direction of the diaphragm.
  • the pressure sensor when the pressure sensor is mounted on a housing, stress may deform it so that the covering member side becomes convex along the thickness direction of the diaphragm.
  • the magnitude of this deformation increases as the upper surface of the covering member is approached in the thickness direction of the diaphragm.
  • the covering member is thicker than the base material in the thickness direction of the diaphragm. Therefore, the distance between the upper surface of the covering member and the diaphragm can be increased compared to a configuration in which the covering member is thinner than the base material.
  • the stress acting on the diaphragm can be relaxed when the pressure sensor is deformed into a convex shape, so that the deflection of the diaphragm can be reduced. Therefore, it is possible to suppress characteristic fluctuations of the pressure sensor caused by stress.
  • the covering member may be thinner than the base material in the thickness direction of the diaphragm.
  • the pressure sensor stress is generated by the shrinkage of the resin as it hardens.
  • the stress is smaller in the portion between the central portion of the pressure sensor and the top surface of the covering member than in the portion between the central portion of the pressure sensor and the bottom surface of the base member in the thickness direction of the diaphragm.
  • the covering member is thinner than the base material in the thickness direction of the diaphragm. Therefore, the diaphragm is arranged in the portion between the central portion of the pressure sensor and the upper surface of the covering member in the thickness direction.
  • FIG. 1 is a plan view of a pressure sensor according to a first embodiment of the present invention
  • FIG. 2 is a cross-sectional view of the pressure sensor of FIG. 1 taken along line II-II.
  • FIG. 3 is a cross-sectional view of the pressure sensor of FIG. 1 taken along line III-III.
  • FIG. 4 is an enlarged view of area Z1 in FIG. 2 to 4 are cross-sectional views along the thickness direction of the diaphragm 51, which will be described later.
  • the pressure sensor 1 according to the first embodiment detects the pressure applied to one side of the diaphragm based on the electrostatic capacitance generated between the diaphragm and an electrode remote from the diaphragm. That is, the pressure sensor 1 according to the first embodiment is a capacitive pressure sensor.
  • the pressure sensor 1 includes a base material 2 and a covering member 7 joined to the base material 2 .
  • the base material 2 has a multilayer structure.
  • the base material 2 has a lower layer 3, a middle layer 4, an upper layer 5, and insulating layers 61,62.
  • the middle layer 4 is an example of the "first layer” of the present disclosure.
  • the upper layer 5 is an example of the "second layer” of the present disclosure.
  • the lower layer 3 and the upper layer 5 are made of silicon (Si), for example.
  • the intermediate layer 4 is made of, for example, polysilicon (Poly-Si).
  • the insulating layers 61 and 62 are made of silicon oxide (SiO2), for example.
  • the lower layer 3 has a bottom surface 3a which is one surface.
  • the bottom surface 3 a of the lower layer 3 constitutes the bottom surface of the substrate 2 .
  • An insulating layer 61 is laminated on the surface of the lower layer 3 opposite to the bottom surface 3a.
  • the intermediate layer 4 is laminated on the surface of the insulating layer 61 opposite to the surface in contact with the lower layer 3 .
  • the middle layer 4 has a ground portion 41 and a fixed electrode portion 43 (see FIG. 3) that generates capacitance between the diaphragm 51 and the ground portion 41 .
  • the fixed electrode portion 43 is electrically connected to the lower layer 3 through holes 611 formed in the insulating layer 61 .
  • a ground electrode 42 is superimposed on the ground portion 41 .
  • the ground electrode 42 is made of, for example, aluminum (Al), titanium (Ti), or the like.
  • the ground electrode 42 is grounded, for example, by being connected via a wire 14 to a ground electrode (not shown) of the base substrate B on which the pressure sensor 1 is mounted.
  • the ground portion 41 of the intermediate layer 4 connected to the ground electrode 42 is also grounded.
  • an insulating layer 62 is laminated on the surface of the intermediate layer 4 opposite to the surface in contact with the insulating layer 61 .
  • a hole is formed in the insulating layer 62 in a portion overlapping the fixed electrode portion 43 of the intermediate layer 4 .
  • the hole corresponds to the reference space 10 described later.
  • the upper layer 5 is laminated on the surface of the insulating layer 62 opposite to the surface in contact with the intermediate layer 4 .
  • the upper layer 5 has an upper surface 5 a opposite to the surface that contacts the insulating layer 62 .
  • the ground portion 41 and the ground electrode 42 communicate with the outside of the base material 2 .
  • a ground electrode 42 is spaced from the top layer 5 .
  • each layer constituting the base material 2 is airtightly joined. This bonding is, for example, normal temperature bonding, adhesive fixation, or the like.
  • the reference space 10 is formed by airtightly closing a hole formed in the insulating layer 62 with layers stacked above and below the insulating layer 62 . In this embodiment, the reference space 10 is in a vacuum state of 10 Pa or less, for example.
  • the upper layer 5 has a diaphragm 51 that overlaps the reference space 10 and a support portion 52 that surrounds the diaphragm 51 when viewed from above in the stacking direction of the layers of the base material 2 .
  • a region of the upper surface 5 a of the upper layer 5 that corresponds to the diaphragm 51 constitutes an upper surface 51 a of the diaphragm 51 .
  • the upper surface 51a is an example of "one side" of the diaphragm in the present invention.
  • Diaphragm 51 has an upper surface 51a and an opposite lower surface 51b.
  • the lower surface 51b is an example of the "other surface" of the diaphragm in the present invention.
  • the diaphragm 51 is a portion of the upper layer 5 that bends in response to pressure applied to the upper surface 51a.
  • the diaphragm 51 is the portion of the upper layer 5 that is not bonded to the insulating layer 62 .
  • a broken line shown in FIG. 3 is a line obtained by extending a boundary line between the diaphragm 51 and the support portion 52 in the upper layer 5 in the stacking direction of each layer of the base material 2 .
  • the diaphragm 51 and the support portion 52 are integrally formed.
  • the upper layer 5 has two diaphragms 51.
  • each diaphragm 51 is rectangular in plan view, but may be circular, elliptical, polygonal, or the like, for example.
  • the number of diaphragms 51 may be one or three or more.
  • the thickness direction of the diaphragm 51 coincides with the stacking direction of each layer of the base material 2 .
  • the upper surface 5 a of the upper layer 5 is provided with a covering member 7 that covers the upper surface 51 a of the diaphragm 51 so as to form the measurement space 11 between itself and the diaphragm 51 .
  • the covering member 7 is joined to a region of the upper surface 5 a of the upper layer 5 corresponding to the support portion 52 via the insulating layer 63 .
  • "joining" includes both contacting and joining two or more objects and joining two or more objects through another object.
  • the insulating layer 63 is made of, for example, silicon oxide (SiO2).
  • the covering member 7 is made of silicon (Si), for example.
  • the bonding between the upper layer 5, the insulating layer 63, and the covering member 7 is, for example, normal temperature bonding, adhesive fixation, or the like.
  • the covering member 7 forms the measurement space 11 and has a facing surface 7a facing the upper surface 51a of the diaphragm 51. As shown in FIG. Furthermore, the covering member 7 has an upper surface 7b opposite to the facing surface 7a. The upper surface 7 b of the covering member 7 constitutes the upper surface of the pressure sensor 1 .
  • the distance between the upper surface 5a of the upper layer 5 and the facing surface 7a of the covering member 7, that is, the height of the measurement space 11 is 2 ⁇ m.
  • the upper surface 7b of the covering member 7 has, for example, a rotationally symmetrical shape in plan view.
  • rotational symmetry means that when the upper surface 7b of the covering member 7 is rotated around the virtual center point C, the relative position and shape with respect to the virtual center point C match before and after the rotation. means.
  • the upper surface 7b of the covering member 7 is rectangular in plan view.
  • the virtual center point C is an example of the "center of the upper surface" in the present invention.
  • the covering member 7 is formed with a communication hole 8 that penetrates between the facing surface 7a and the upper surface 7b and communicates the measurement space 11 with the outside of the covering member 7.
  • An opening 81 of the communication hole 8 is formed in the facing surface 7a of the covering member 7.
  • An opening 82 of the communication hole 8 is formed in the upper surface 7b of the covering member 7.
  • the cross section of the communication hole 8 is, for example, circular with a diameter of 20 ⁇ m or more. Although one communication hole 8 is formed in this embodiment, two or more communication holes 8 may be formed.
  • the communication hole 8 extends in the thickness direction of the diaphragm 51 . That is, as shown in FIG. 1, the opening 81 formed in the facing surface 7a of the covering member 7 and the opening 82 formed in the upper surface 7b of the covering member 7 match each other in plan view.
  • the communication hole 8 is not limited to the shape described above, and may extend in other directions or may be bent. In other words, the openings 81 and 82 do not have to match in plan view.
  • the facing surface 7a of the covering member 7 has an overlapping region 7c that overlaps the diaphragm 51 in plan view.
  • a region of the facing surface 7a of the covering member 7 excluding the overlapping region 7c constitutes a non-overlapping region 7d.
  • the openings 81 are formed in the non-overlapping regions 7d. That is, the opening 81 formed in the facing surface 7a of the covering member 7 does not overlap the diaphragm 51 in plan view.
  • the upper surface 7b of the covering member 7 has an edge 7e.
  • the shortest distance between the opening 82 formed in the upper surface 7b of the covering member 7 and the virtual center point C is shorter than the shortest distance between the opening 82 and the edge 7e.
  • the shortest distance L1 (not shown) between the edge of the opening 82 and the virtual center point C is the edge of the opening 82 and the edge 7e.
  • the shortest distance L2 (see FIG. 1) between Note that when the virtual center point C overlaps the opening 82 in plan view, the shortest distance L1 is zero.
  • the center point of the opening 82 and the virtual center point C match in plan view. That is, the shortest distance L1 is zero. Therefore, the shortest distance L1 is not shown.
  • a ground electrode 71 electrically connected to the covering member 7 is arranged on the upper surface 7 b of the covering member 7 .
  • the ground electrode 71 is arranged on the edge 7e of the upper surface 7b of the covering member 7.
  • the ground electrode 71 is made of, for example, aluminum (Al), titanium (Ti), or the like.
  • the ground electrode 71 is connected via a wire 9 to the ground electrode 42 arranged on the base material 2 . Since the ground electrode 42 of the base material 2 is grounded, the ground electrode 71 is also grounded. Thereby, the covering member 7 is grounded. That is, the covering member 7 is connected to the ground potential.
  • At least one convex portion 72 projecting toward the diaphragm 51 in the thickness direction of the diaphragm 51 is formed in the overlap region 7c of the facing surface 7a of the covering member 7 .
  • a plurality of protrusions 72 are formed in a grid pattern over the entire overlapping region 7c.
  • the plurality of protrusions 72 are aligned parallel to each of the short and long sides of the rectangular edge 7e when viewed from the thickness direction of the diaphragm 51 . That is, the plurality of protrusions 72 are aligned in two orthogonal directions.
  • the convex portion 72 is also formed on the facing surface 7a of the covering member 7 around the opening 81 of the communication hole 8 (see FIG. 2).
  • the projection 72 has a tapered shape in which the width decreases toward the diaphragm 51 (downward in FIG. 4) when viewed from the direction orthogonal to the thickness direction of the diaphragm 51.
  • a tip portion 73 of the convex portion 72 is a curved surface.
  • the height of each protrusion 72 with respect to the facing surface 7a of the covering member 7 is 1 ⁇ m.
  • the thickness D1 of the covering member 7 is thicker than the thickness D2 of the base material 2.
  • the thickness D1 of the covering member 7 refers to the thickness from the upper surface 7b of the covering member 7 to the surface of the covering member 7 in contact with the insulating layer 63 .
  • the thickness D2 of the base material 2 refers to the thickness from the upper surface 5a of the upper layer 5 to the bottom surface 3a of the lower layer 3 .
  • the ratio of the thickness D1 of the covering member 7 to the thickness D2 of the base material 2 is preferably 1.4 to 1.6 times.
  • the thickness D1 of the covering member 7 is 600 ⁇ m
  • the thickness D2 of the substrate 2 is 400 ⁇ m. That is, the ratio of the thickness D1 of the covering member 7 to the thickness D2 of the base material 2 is 1.5 times.
  • FIG. 5 is a cross-sectional view showing an example of the mounting state of the pressure sensor of FIG.
  • the pressure sensor 1 is mounted on the base substrate B via the bottom surface 3a of the lower layer 3.
  • the pressure sensor 1 is electrically connected to an electronic circuit (not shown) provided on the base substrate B via external electrodes (not shown) arranged on the bottom surface 3a of the lower layer 3, for example.
  • the pressure sensor 1 is sealed with a resin M except for a portion of the upper surface 7b of the covering member 7.
  • the ground electrode 71 and the wire 9 are sealed while the opening 82 of the communication hole 8 is not sealed. Since the opening 82 of the communication hole 8 is not blocked by the resin M, the fluid can enter and exit the measurement space 11 through the communication hole 8 .
  • the diaphragm 51 bends according to the pressure applied to the upper surface 51a of the diaphragm 51 by the fluid (for example, gas) entering and exiting the measurement space 11 .
  • the fluid for example, gas
  • the distance between the diaphragm 51 and the fixed electrode portion 43 (see FIG. 3) of the middle layer 4 changes, increasing or decreasing the capacitance generated therebetween.
  • An electrical signal corresponding to the capacitance is output from the diaphragm 51 and the fixed electrode portion 43 of the intermediate layer 4 and transmitted to the electronic circuit, whereby the pressure applied to the upper surface 51a of the diaphragm 51 is calculated.
  • the pressure sensor 1 functions as an absolute pressure sensor that detects pressure with reference to vacuum.
  • the pressure sensor 1 When the pressure in the reference space 10 is the atmospheric pressure, the pressure sensor 1 functions as a gauge pressure sensor that indicates the pressure when the atmospheric pressure is 0. Moreover, when the pressure in the reference space 10 is an arbitrary pressure, the pressure sensor 1 functions as a differential pressure sensor that indicates the differential pressure with respect to the arbitrary pressure.
  • the covering member 7 is grounded.
  • the base material 2 has an electronic circuit for calculating the pressure applied to the upper surface 51a of the diaphragm 51, it is possible to suppress the current caused by static electricity or the like from flowing into the electronic circuit. Therefore, the pressure sensor 1 with high resistance to static electricity can be realized.
  • the covering member 7 is electrically connected to the ground portion 41 of the middle layer 4, so that the covering member 7 can be grounded. Therefore, the pressure sensor 1 with high resistance to static electricity can be realized.
  • a reference space 10 is formed between the middle layer 4 and the upper layer 5 .
  • the middle layer 4 faces the diaphragm 51 of the upper layer 5 with the reference space 10 interposed therebetween, and has a fixed electrode portion 43 that generates a capacitance with the diaphragm 51 .
  • the ground portion 41 and the fixed electrode portion 43 can be formed at the same time by arranging the ground portion 41 in the middle layer 4. FIG. Therefore, in the manufacturing process of the pressure sensor 1, an additional process for providing the ground portion 41 is unnecessary. Therefore, the grounded covering member 7 can be realized more easily than the configuration in which the ground portion 41 is arranged in a layer having no conductor among the layers constituting the base material 2 .
  • the covering member 7 has the convex portion 72 in the overlapping region 7c of the facing surface 7a. Therefore, when the diaphragm 51 is drawn toward the facing surface 7a of the covering member 7, the diaphragm 51 contacts the convex portion 72 before the facing surface 7a of the covering member 7, and is no longer drawn. In other words, the contact area between the diaphragm 51 and the covering member 7 becomes smaller compared to the configuration in which the covering member 7 does not have the convex portion 72 . This prevents the diaphragm 51 from sticking to the covering member 7 . Therefore, the possibility of detection failure of the pressure sensor 1 can be reduced.
  • the water droplets described above tend to accumulate in the measurement space 11 near the opening 81 of the communication hole 8, which is the water entry path.
  • the convex portion 72 is formed on the peripheral portion 7f of the opening 81 of the communication hole 8. As shown in FIG. As a result, sticking of the diaphragm 51 to the covering member 7 can be suppressed. Therefore, the possibility of detection failure of the pressure sensor 1 can be reduced.
  • a plurality of protrusions 72 are formed in the entire overlapping region 7c of the covering member 7.
  • adhesion of the diaphragm 51 to the covering member 7 can be suppressed in the entire overlapping region 7 c of the covering member 7 . Therefore, the possibility of detection failure of the pressure sensor 1 can be reduced.
  • the tip portion 73 of the projection 72 has a narrow width, the contact area between the projection 72 and the diaphragm 51 is small. Therefore, as compared with a configuration in which the protrusion 72 does not have a tapered shape in which the width of the protrusion 72 decreases toward the diaphragm 51 , sticking of the diaphragm 51 to the protrusion 72 is suppressed. Therefore, the possibility of detection failure of the pressure sensor 1 can be reduced.
  • the tip portion 73 of the convex portion 72 has a curved surface, concentration of stress on the tip portion 73 of the convex portion 72 can be suppressed. Therefore, it is possible to realize the convex portion 72 that is less likely to be damaged by contact with the diaphragm 51 .
  • the opening 81 of the communication hole 8 formed in the facing surface 7a of the covering member 7 does not overlap the diaphragm 51 when viewed from the thickness direction of the diaphragm 51 . Therefore, it is possible to reduce the possibility that foreign matter that has passed through the communication hole 8 together with the fluid will reach the upper surface 51 a of the diaphragm 51 . Therefore, detection failure of the pressure sensor 1 due to adhesion of foreign matter to the diaphragm 51 can be suppressed.
  • the shortest distance between the opening 82 of the communicating hole 8 formed in the upper surface 7b of the covering member 7 and the center C of the upper surface 7b is It is shorter than the shortest distance between the edge 7e of the upper surface 7b. That is, on the upper surface 7b of the covering member 7, the opening 82 of the communication hole 8 is separated from the edge 7e of the upper surface 7b.
  • the resin M blocks the communication hole 8 or the diaphragm 51. It is possible to reduce the possibility of sticking. Therefore, detection failure of the pressure sensor 1 can be suppressed.
  • stress may deform the diaphragm 51 so that the covering member 7 side becomes convex along the thickness direction.
  • the magnitude of this deformation increases as the upper surface 7 b of the covering member 7 is approached in the thickness direction of the diaphragm 51 .
  • the covering member 7 is thicker than the base material 2 in the thickness direction of the diaphragm 51 . Therefore, the distance between the upper surface 7 b of the covering member 7 and the diaphragm 51 can be increased compared to the configuration in which the covering member 7 is thinner than the base material 2 . As a result, the stress acting on the diaphragm 51 can be relaxed when the pressure sensor 1 is deformed into a convex shape, so that the deflection of the diaphragm 51 can be reduced. Therefore, the characteristic fluctuation of the pressure sensor 1 caused by stress can be suppressed.
  • FIG. 6 is a cross-sectional view of the pressure sensor according to the second embodiment of the invention, corresponding to line II-II in FIG.
  • the pressure sensor 1A according to the second embodiment differs from the pressure sensor 1 according to the first embodiment in that the thickness D1 of the covering member 7 is thinner than the thickness D2 of the base material 2.
  • the ratio of the thickness D1 of the covering member 7 to the thickness D2 of the base material 2 is preferably 0.1 to 0.3 times.
  • the thickness D1 of the covering member 7 is 80 ⁇ m
  • the thickness D2 of the substrate 2 is 400 ⁇ m. That is, the ratio of the thickness D1 of the covering member 7 to the thickness D2 of the base material 2 is 0.2 times.
  • the pressure sensor 1A stress is generated by shrinkage of the resin M as it cures.
  • the stress in the thickness direction of the diaphragm 51 is greater in the portion between the central portion of the pressure sensor 1A and the bottom surface 3a of the lower layer 3 than in the portion between the central portion of the pressure sensor 1A and the bottom surface 3a of the lower layer 3 .
  • the covering member 7 is thinner than the base material 2 in the thickness direction of the diaphragm 51 . Therefore, the diaphragm 51 is arranged in the portion between the central portion of the pressure sensor 1A and the upper surface 7b of the covering member 7 in the thickness direction.
  • the stress applied to the diaphragm 51 due to the contraction of the resin M can be reduced, so that the deflection of the diaphragm 51 can be reduced. Therefore, the characteristic fluctuation of the pressure sensor 1A caused by the stress can be suppressed.
  • FIGS. 7 to 9 are enlarged views corresponding to the region Z1 of the modified example of the pressure sensor of FIG.
  • each projection 72 may have a shape other than the shape shown in FIG. 4 when viewed from the direction perpendicular to the thickness direction of the diaphragm 51.
  • the width of the convex portion 72 decreases toward the tip portion 73 of the convex portion 72 when viewed from the direction orthogonal to the thickness direction of the diaphragm 51. It is a trapezoid. That is, the tip portion 73 of the convex portion 72 is not a curved surface but a flat surface parallel or substantially parallel to the facing surface 7 a of the covering member 7 .
  • the convex portion 72 shown in FIG. 8 has a rectangular shape with a constant width when viewed from the direction orthogonal to the thickness direction of the diaphragm 51 . That is, the width of the protrusion 72 does not decrease toward the tip 73 of the protrusion 72 .
  • a plurality of convex portions 72 shown in FIG. 9 are formed in a continuous wave shape when viewed from a direction perpendicular to the thickness direction of the diaphragm 51 .
  • the sticking of the diaphragm 51 to the covering member 7 can also be suppressed by the protrusions 72 shown in FIGS. Therefore, the possibility of detection failure of the pressure sensor 1 can be reduced.
  • FIGS. 10 to 14 are cross-sectional views showing an example of a method of forming the covering member in the pressure sensor of FIG. 6.
  • FIG. 10 to 14 are cross-sectional views showing an example of a method of forming the covering member in the pressure sensor of FIG. 6.
  • an SOI (silicon on insulator) substrate 12 is used.
  • the SOI substrate 12 has a Si support layer 121, a SiO2 layer 122 and a surface Si layer 123.
  • the SiO2 layer 122 is laminated on one side of the Si support layer 121 .
  • a surface Si layer 123 is laminated on the surface of the SiO2 layer 122 opposite to the surface in contact with the Si support layer 121 .
  • a portion of the surface Si layer 123 constitutes the covering member 7 . 10 to 14, for convenience of explanation, the SOI substrate 12 is shown in the direction opposite to the stacking direction described above, that is, the surface Si layer 123 stacked last is shown at the bottom in each figure.
  • the additional SiO2 layer 13 is formed on the surface of the surface Si layer 123 opposite to the surface in contact with the SiO2 layer 122 .
  • a portion of the additional SiO2 layer 13 constitutes the insulating layer 63 .
  • the insulating layer 63 is formed by removing the portion of the additional SiO2 layer 13 that does not constitute the insulating layer 63 .
  • the removal is performed, for example, by etching.
  • the portion of the surface Si layer 123 that does not constitute the covering member 7 is removed.
  • the removal is performed, for example, by etching.
  • the covering member 7 having the projections 72 is formed.
  • the SOI substrate 12 and the additional SiO2 layer 13 are placed on the side opposite to the surface that contacts the surface Si layer 123 (that is, the covering member 7) of the additional SiO2 layer 13. is joined to the upper surface 5a of the upper layer 5 of the base material 2 via the surface of .
  • the bonding is, for example, normal temperature bonding, adhesive fixation, or the like.
  • the Si support layer 121 and the SiO2 layer 122 are removed.
  • the surface Si layer 123 (that is, the covering member 7) is etched, for example, to form the communication holes 8. As shown in FIG. 14, the Si support layer 121 and the SiO2 layer 122 are removed. Finally, the surface Si layer 123 (that is, the covering member 7) is etched, for example, to form the communication holes 8. As shown in FIG. 14, the Si support layer 121 and the SiO2 layer 122 are removed. Finally, the surface Si layer 123 (that is, the covering member 7) is etched, for example, to form the communication holes 8. As shown in FIG.
  • a ground electrode 71 is patterned on the upper surface 7b of the covering member 7. Then, as shown in FIG. 15, a ground electrode 71 is patterned on the upper surface 7b of the covering member 7. Then, as shown in FIG. 15, a ground electrode 71 is patterned on the upper surface 7b of the covering member 7. Then, as shown in FIG.
  • the covering member 7 in the pressure sensor 1A can be formed by further increasing the thickness of the surface Si layer 123 in this forming method.
  • the pressure sensors 1 and 1A are capacitive pressure sensors, but the present invention is not limited to this.
  • the pressure sensors 1, 1A may be piezoresistive pressure sensors.
  • the diaphragm 51 is provided with a plurality of piezoresistive elements forming an electronic circuit. An electric signal corresponding to the deflection of the diaphragm 51 is output from the electronic circuit, and the pressure applied to the upper surface 51a of the diaphragm 51 is calculated based on the electric signal.
  • the ground electrode 71 of the covering member 7 and the ground electrode 42 of the base material 2 are connected by the wire 9, but the present invention is not limited to this.
  • the ground electrode 71 of the covering member 7 and the ground electrode 42 of the base material 2 may be connected by a conductive part other than the wire 9 .
  • the ground electrode 71 of the covering member 7 and the ground electrode 42 of the base material 2 may be indirectly connected as long as they are electrically connected.
  • the covering member 7 and the ground portion 41 of the base material 2 are electrically connected, at least one of the ground electrode 71 and the ground electrode 42 may not be provided.
  • the grounding portion 41 of the middle layer 4 may not be provided.
  • the covering member 7 may be grounded by being electrically connected to a grounded member that is provided separately from the pressure sensors 1 and 1A without going through the base material 2 .
  • the number, arrangement, and shape of the protrusions 72 are not limited to the above as long as they can suppress the movement of the diaphragm 51 drawn toward the facing surface 7a of the covering member 7.
  • a plurality of linear ribs may extend parallel to each other.
  • the plurality of protrusions 72 are aligned in two orthogonal directions, but the present invention is not limited to this.
  • the term “lattice” means that a plurality of protrusions 72 are aligned in two directions on the facing surface 7a of the covering member 7 and the two directions intersect.
  • the two directions in which the plurality of protrusions 72 are aligned need not be orthogonal.
  • covering member 7 is assumed to be grounded in the above description, it does not have to be grounded.
  • the pressure sensor according to the present invention is highly resistant to static electricity and is useful for various pressure sensors.
  • Reference Signs List 1 1A Pressure sensor 2 Base material 4 Middle layer 41 Ground part 5 Upper layer 51 Diaphragm 51a Upper surface 51b Lower surface 52 Supporting part 7 Covering member 7a Opposing surface 7b Upper surface 7c Overlapping area 7e Edge 7f Surrounding part 72 Protruding part 73 Tip part 8 Communication hole 81 aperture 82 aperture 10 reference space 11 measurement space C virtual center point

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Abstract

Provided is a pressure sensor having high electrostatic resistance. This pressure sensor comprises a substrate and a covering member. The substrate has a diaphragm, and a support part that surrounds the diaphragm as seen from the thickness direction of the diaphragm. The covering member covers one surface of the diaphragm such that a measurement space is formed between the covering member and the diaphragm, the covering member being joined to the support part of the substrate. The diaphragm flexes due to pressure applied to the one surface of the diaphragm. A communication orifice that allows the measurement space and the exterior to communicate with one another is formed in the covering member. The covering member is grounded.

Description

圧力センサpressure sensor

 本発明は、MEMS(Micro Electro Mechanical Systems)技術を用いて形成される圧力センサに関する。 The present invention relates to a pressure sensor formed using MEMS (Micro Electro Mechanical Systems) technology.

 従来、この種の圧力センサとして、例えば、特許文献1に記載のものが知られている。特許文献1に記載の圧力センサは、ダイアフラムを有するセンサ部と、当該センサ部上に配置され、ダイアフラムとの間にキャビティを形成する剛性カバーとを備える。センサ部は、ダイアフラムの歪みの大きさに対応する信号に基づいて、ダイアフラムに加えられた圧力を算出するための電子回路を有する。 Conventionally, for example, the one described in Patent Document 1 is known as this type of pressure sensor. The pressure sensor described in Patent Document 1 includes a sensor portion having a diaphragm, and a rigid cover disposed over the sensor portion and forming a cavity between the sensor portion and the diaphragm. The sensor portion has electronic circuitry for calculating the pressure applied to the diaphragm based on a signal corresponding to the amount of strain in the diaphragm.

特開2010-203857号公報JP 2010-203857 A

 しかしながら、特許文献1に記載の圧力センサでは、剛性カバーに静電気等に起因する電流が流れた場合、当該電流がセンサ部に設けられた電子回路に流れ込むことによって、圧力センサの検出不良が引き起こされるおそれがある。 However, in the pressure sensor described in Patent Literature 1, when a current caused by static electricity or the like flows through the rigid cover, the current flows into the electronic circuit provided in the sensor section, causing detection failure of the pressure sensor. There is a risk.

 したがって、本発明の目的は、前記課題を解決することにあって、静電気耐性の高い圧力センサを提供することにある。 Accordingly, an object of the present invention is to solve the above problems and to provide a pressure sensor with high resistance to static electricity.

 前記目的を達成するために、本発明に係る圧力センサは、
 ダイアフラム、及び、前記ダイアフラムの厚み方向から見て前記ダイアフラムを囲む支持部を有する基材と、
 前記ダイアフラムとの間に測定空間を形成するように前記ダイアフラムの一方面を覆い、前記基材の支持部に接合された被覆部材と、
 を備え、
 前記ダイアフラムは、前記ダイアフラムの一方面に加えられる圧力によって撓み、
 前記被覆部材に、前記測定空間と外部とを連通する連通穴が形成され、
 前記被覆部材は、接地される、
 ように構成されている。
In order to achieve the above object, the pressure sensor according to the present invention comprises:
a diaphragm and a base material having a support portion surrounding the diaphragm when viewed from the thickness direction of the diaphragm;
a covering member that covers one surface of the diaphragm so as to form a measurement space between itself and the diaphragm, and that is joined to a supporting portion of the base material;
with
the diaphragm flexes due to pressure applied to one side of the diaphragm;
A communication hole is formed in the covering member to communicate the measurement space with the outside,
the covering member is grounded;
is configured as

 本発明によれば、静電気耐性の高い圧力センサを実現できる。 According to the present invention, a pressure sensor with high resistance to static electricity can be realized.

本発明の第1実施形態に係る圧力センサの平面図。1 is a plan view of a pressure sensor according to a first embodiment of the invention; FIG. 図1の圧力センサのII-II線断面図。FIG. 2 is a cross-sectional view taken along line II-II of the pressure sensor in FIG. 1; 図1の圧力センサのIII-III線断面図。FIG. 2 is a cross-sectional view taken along line III-III of the pressure sensor of FIG. 1; 図2の領域Z1の拡大図。FIG. 3 is an enlarged view of a region Z1 in FIG. 2; 図2の圧力センサの実装状態の一例を示す断面図。FIG. 3 is a cross-sectional view showing an example of a mounted state of the pressure sensor of FIG. 2; 本発明の第2実施形態に係る圧力センサの、図1におけるII-II線に対応する断面図。FIG. 2 is a cross-sectional view of a pressure sensor according to a second embodiment of the invention, corresponding to line II-II in FIG. 1; 図2の圧力センサの変形例の領域Z1に対応する拡大図。FIG. 3 is an enlarged view corresponding to a region Z1 of a modification of the pressure sensor of FIG. 2; 図2の圧力センサの変形例の領域Z1に対応する拡大図。FIG. 3 is an enlarged view corresponding to a region Z1 of a modification of the pressure sensor of FIG. 2; 図2の圧力センサの変形例の領域Z1に対応する拡大図。FIG. 3 is an enlarged view corresponding to a region Z1 of a modification of the pressure sensor of FIG. 2; 図6の圧力センサにおける被覆部材の形成方法の一例を示す断面図。FIG. 7 is a cross-sectional view showing an example of a method of forming a covering member in the pressure sensor of FIG. 6; 図10に続く工程を示す断面図。FIG. 11 is a cross-sectional view showing a step following FIG. 10; 図11に続く工程を示す断面図。FIG. 12 is a cross-sectional view showing a step following FIG. 11; 図12に続く工程を示す断面図。FIG. 13 is a cross-sectional view showing a step following FIG. 12; 図13に続く工程を示す断面図。FIG. 14 is a cross-sectional view showing a step following FIG. 13; 図14に続く工程を示す断面図。FIG. 15 is a cross-sectional view showing a step following FIG. 14; 図1の圧力センサの変形例を示す平面図。FIG. 2 is a plan view showing a modification of the pressure sensor of FIG. 1;

 本発明の一態様に係る圧力センサは、
 ダイアフラム、及び、前記ダイアフラムの厚み方向から見て前記ダイアフラムを囲む支持部を有する基材と、
 前記ダイアフラムとの間に測定空間を形成するように前記ダイアフラムの一方面を覆い、前記基材の支持部に接合された被覆部材と、
 を備え、
 前記ダイアフラムは、前記ダイアフラムの一方面に加えられる圧力によって撓み、
 前記被覆部材に、前記測定空間と外部とを連通する連通穴が形成され、
 前記被覆部材は、接地される。
A pressure sensor according to an aspect of the present invention comprises
a diaphragm and a base material having a support portion surrounding the diaphragm when viewed from the thickness direction of the diaphragm;
a covering member that covers one surface of the diaphragm so as to form a measurement space between itself and the diaphragm, and that is joined to a supporting portion of the base material;
with
the diaphragm flexes due to pressure applied to one side of the diaphragm;
A communication hole is formed in the covering member to communicate the measurement space with the outside,
The covering member is grounded.

 この構成によれば、被覆部材は、接地される。このことにより、基材がダイアフラムの一方面に加えられた圧力を算出するための電子回路を有する場合に、静電気等に起因する電流が当該電子回路に流れ込むことを抑制することができる。したがって、静電気耐性の高い圧力センサを実現することができる。 According to this configuration, the covering member is grounded. As a result, when the base material has an electronic circuit for calculating the pressure applied to one side of the diaphragm, it is possible to suppress current caused by static electricity or the like from flowing into the electronic circuit. Therefore, a pressure sensor with high resistance to static electricity can be realized.

 前記基材は、第1層と、前記ダイアフラム及び前記支持部を有する第2層とを有してもよい。前記第2層は、前記ダイアフラムの一方面の反対側の他方面と前記第1層との間に基準空間を形成するように前記第1層に積層されてもよい。前記第1層は、接地された接地部を有してもよい。前記被覆部材は、前記第1層の接地部に電気的に接続されてもよい。 The base material may have a first layer and a second layer having the diaphragm and the support. The second layer may be laminated to the first layer so as to form a reference space between the first layer and the opposite side of the diaphragm. The first layer may have a ground portion that is grounded. The covering member may be electrically connected to the ground portion of the first layer.

 この構成によれば、被覆部材が第1層の接地部に電気的に接続されるので、接地された被覆部材を実現することができる。したがって、静電気耐性の高い圧力センサを実現することができる。 According to this configuration, since the covering member is electrically connected to the ground portion of the first layer, a grounded covering member can be realized. Therefore, a pressure sensor with high resistance to static electricity can be realized.

 前記被覆部材は、前記測定空間を形成し且つ前記ダイアフラムを向く対向面を有してもよい。前記被覆部材は、前記対向面のうち、前記ダイアフラムの厚み方向から見て、前記ダイアフラムと重複する重複領域に、前記ダイアフラムに向かって突出した凸部を有してもよい。 The covering member may have a facing surface that forms the measurement space and faces the diaphragm. The covering member may have a convex portion projecting toward the diaphragm in an overlapping region of the facing surface that overlaps with the diaphragm when viewed in the thickness direction of the diaphragm.

 測定空間に水分が浸入したとき、当該水分によって構成される水滴は、被覆部材の対向面とダイアフラムとの両方に、同時に接触し得る。当該水滴が被覆部材の対向面とダイアフラムとの両方に接触した状態で気化によって小さくなると、ダイアフラムは、当該水滴の表面張力によって、被覆部材の対向面に向かって引き寄せられる。当該水滴が更に小さくなると、ダイアフラムは、被覆部材の対向面に接触する。この場合、当該水滴がなくなった後に、ダイアフラムが被覆部材の対向面に固着するおそれがある。ダイアフラムの固着は、圧力センサの検出不良を引き起こす。 When water enters the measurement space, water droplets formed by the water can contact both the facing surface of the covering member and the diaphragm at the same time. When the water droplet is in contact with both the facing surface of the covering member and the diaphragm and becomes smaller due to evaporation, the diaphragm is drawn toward the facing surface of the covering member by the surface tension of the water droplet. When the water droplet becomes smaller, the diaphragm contacts the opposing surface of the covering member. In this case, the diaphragm may adhere to the facing surface of the covering member after the water droplets have disappeared. A sticking diaphragm causes the pressure sensor to fail to detect.

 一方、この構成によれば、被覆部材は、対向面の重複領域に凸部を有する。そのため、ダイアフラムは、被覆部材の対向面に向かって引き寄せられたときに、被覆部材の対向面よりも先に凸部に接触することにより、それ以上引き寄せられなくなる。つまり、被覆部材が凸部を有しない構成と比較して、ダイアフラムと被覆部材との接触面積が小さくなる。このことにより、被覆部材に対するダイアフラムの固着が抑制される。したがって、圧力センサの検出不良が起こる可能性を低くすることができる。 On the other hand, according to this configuration, the covering member has a convex portion in the overlapping region of the facing surfaces. Therefore, when the diaphragm is drawn toward the facing surface of the covering member, the diaphragm contacts the convex portion before the facing surface of the covering member and is no longer drawn. That is, the contact area between the diaphragm and the covering member is smaller than in a configuration in which the covering member does not have a convex portion. This prevents the diaphragm from sticking to the covering member. Therefore, it is possible to reduce the possibility of detection failure of the pressure sensor.

 前記凸部は、前記被覆部材の対向面に形成された前記連通穴の開口の周囲部に形成されてもよい。 The convex portion may be formed around the opening of the communication hole formed in the facing surface of the covering member.

 前記の水滴は、測定空間において、水分の浸入経路である連通穴の開口の近傍に溜まりやすい。この構成によれば、被覆部材の対向面において、連通穴の開口の周囲部に凸部が形成される。このことにより、被覆部材に対するダイアフラムの固着を抑制することができる。したがって、圧力センサの検出不良が起こる可能性を低くすることができる。 The above-mentioned water droplets tend to accumulate in the measurement space near the opening of the communication hole, which is the infiltration path of water. According to this configuration, the projection is formed around the opening of the communication hole on the facing surface of the covering member. This can prevent the diaphragm from sticking to the covering member. Therefore, it is possible to reduce the possibility of detection failure of the pressure sensor.

 前記被覆部材は、複数の前記凸部を有してもよい。複数の前記凸部は、前記被覆部材の重複領域の全体に格子状に形成されてもよい。 The covering member may have a plurality of protrusions. The plurality of protrusions may be formed in a grid pattern over the entire overlapping region of the covering member.

 この構成によれば、被覆部材の重複領域の全体に、複数の凸部が形成されている。このことにより、被覆部材の重複領域の全体において、被覆部材に対するダイアフラムの固着を抑制することができる。したがって、圧力センサの検出不良が起こる可能性を低くすることができる。 According to this configuration, a plurality of protrusions are formed in the entire overlapping region of the covering member. As a result, it is possible to suppress adhesion of the diaphragm to the covering member in the entire overlapping region of the covering member. Therefore, it is possible to reduce the possibility of detection failure of the pressure sensor.

 前記凸部は、前記ダイアフラムの厚み方向に直交する方向から見て、前記凸部の幅が前記ダイアフラムに向かって減少するテーパ形状を有してもよい。 The convex portion may have a tapered shape in which the width of the convex portion decreases toward the diaphragm when viewed from a direction perpendicular to the thickness direction of the diaphragm.

 この構成によれば、凸部の先端部の幅が細いので、凸部とダイアフラムとの接触面積が小さい。そのため、凸部の幅がダイアフラムに向かって減少するテーパ形状を有しない構成と比較して、凸部に対するダイアフラムの固着が抑制される。したがって、圧力センサの検出不良が起こる可能性を低くすることができる。 According to this configuration, since the width of the tip of the protrusion is narrow, the contact area between the protrusion and the diaphragm is small. Therefore, sticking of the diaphragm to the protrusion is suppressed compared to a configuration that does not have a tapered shape in which the width of the protrusion decreases toward the diaphragm. Therefore, it is possible to reduce the possibility of detection failure of the pressure sensor.

 前記凸部の先端部は、曲面であってもよい。 The tip of the convex portion may be a curved surface.

 ダイアフラムの厚み方向に直交する方向から見て、凸部がダイアフラムに向かって細くなって先端部が尖った形状である場合、凸部とダイアフラムとが接触したときに、凸部の先端部に応力が集中するおそれがある。凸部の先端部に応力が集中すると、凸部が破損する可能性が高まる。この構成によれば、凸部の先端部が曲面であるので、凸部の先端部に対する応力の集中を抑制することができる。したがって、ダイアフラムとの接触によって破損しにくい凸部を実現することができる。 When viewed from the direction perpendicular to the thickness direction of the diaphragm, if the protrusion tapers toward the diaphragm and has a sharp tip, stress is applied to the tip of the protrusion when the protrusion and the diaphragm come into contact with each other. may concentrate. Concentration of stress on the tip of the protrusion increases the possibility of breakage of the protrusion. According to this configuration, since the tip of the protrusion is a curved surface, it is possible to suppress concentration of stress on the tip of the protrusion. Therefore, it is possible to realize a protrusion that is less likely to be damaged by contact with the diaphragm.

 前記被覆部材は、前記測定空間を形成し且つ前記ダイアフラムを向く対向面を有してもよい。前記対向面に形成された前記連通穴の開口は、前記ダイアフラムの厚み方向から見て、前記ダイアフラムと重複しなくてもよい。 The covering member may have a facing surface that forms the measurement space and faces the diaphragm. The opening of the communicating hole formed in the facing surface may not overlap the diaphragm when viewed from the thickness direction of the diaphragm.

 この構成によれば、被覆部材の対向面に形成された連通穴の開口は、ダイアフラムの厚み方向から見て、ダイアフラムと重複しない。そのため、流体と共に連通穴を通過した異物がダイアフラムの一方面に到達する可能性を低くすることができる。したがって、ダイアフラムに異物が付着することによる圧力センサの検出不良を抑制することができる。 According to this configuration, the opening of the communicating hole formed in the facing surface of the covering member does not overlap with the diaphragm when viewed from the thickness direction of the diaphragm. Therefore, it is possible to reduce the possibility that foreign matter that has passed through the communication hole together with the fluid will reach one side of the diaphragm. Therefore, detection failure of the pressure sensor due to adhesion of foreign matter to the diaphragm can be suppressed.

 前記被覆部材は、前記測定空間を形成し且つ前記ダイアフラムを向く対向面と、前記対向面と反対側の上面とを有してもよい。前記上面に形成された前記連通穴の開口と前記上面の中心との間の最短距離は、前記上面に形成された前記連通穴の開口と前記上面の縁部との間の最短距離よりも短くてもよい。 The covering member may have a facing surface that forms the measurement space and faces the diaphragm, and an upper surface that is opposite to the facing surface. The shortest distance between the opening of the communicating hole formed in the top surface and the center of the top surface is shorter than the shortest distance between the opening of the communicating hole formed in the top surface and the edge of the top surface. may

 圧力センサは、例えば、ベース基板に実装された後、被覆部材の上面の一部を除いて樹脂によって封止される。この構成によれば、被覆部材の上面に形成された連通穴の開口と当該上面の中心との最短距離は、当該上面に形成された連通穴の開口と当該上面の縁部との間の最短距離よりも短い。つまり、被覆部材の上面において、連通穴の開口は、当該上面の縁部から離れている。このことにより、未硬化の樹脂が被覆部材の上面の縁部から上面の中心に向かって流れ込んだときに、樹脂が連通穴を塞いだり、ダイアフラムに付着したりする可能性を低くすることができる。よって、圧力センサの検出不良を抑制することができる。 For example, after the pressure sensor is mounted on the base substrate, it is sealed with resin except for a part of the upper surface of the covering member. According to this configuration, the shortest distance between the opening of the communicating hole formed in the upper surface of the covering member and the center of the upper surface is the shortest distance between the opening of the communicating hole formed in the upper surface and the edge of the upper surface. shorter than distance. That is, on the upper surface of the covering member, the opening of the communication hole is separated from the edge of the upper surface. As a result, when the uncured resin flows from the edge of the upper surface of the covering member toward the center of the upper surface, it is possible to reduce the possibility that the resin will block the communication holes or adhere to the diaphragm. . Therefore, detection failure of the pressure sensor can be suppressed.

 前記被覆部材は、前記ダイアフラムの厚み方向において前記基材よりも厚くてもよい。 The covering member may be thicker than the base material in the thickness direction of the diaphragm.

 圧力センサは、例えば、筐体への搭載時に、応力によって、ダイアフラムの厚み方向に沿って被覆部材側が凸となるように変形することがある。この変形の大きさは、ダイアフラムの厚み方向において、被覆部材の上面に近づくほど大きい。この構成によれば、被覆部材は、ダイアフラムの厚み方向において基材よりも厚い。そのため、被覆部材が基材よりも薄い構成と比較して、被覆部材の上面とダイアフラムとの間の距離を長くすることができる。このことにより、圧力センサが凸状に変形したときに、ダイアフラムに作用する応力を緩和することができるため、ダイアフラムの撓みを小さくすることができる。したがって、応力に起因する圧力センサの特性変動を抑制することができる。 For example, when the pressure sensor is mounted on a housing, stress may deform it so that the covering member side becomes convex along the thickness direction of the diaphragm. The magnitude of this deformation increases as the upper surface of the covering member is approached in the thickness direction of the diaphragm. According to this configuration, the covering member is thicker than the base material in the thickness direction of the diaphragm. Therefore, the distance between the upper surface of the covering member and the diaphragm can be increased compared to a configuration in which the covering member is thinner than the base material. As a result, the stress acting on the diaphragm can be relaxed when the pressure sensor is deformed into a convex shape, so that the deflection of the diaphragm can be reduced. Therefore, it is possible to suppress characteristic fluctuations of the pressure sensor caused by stress.

 前記被覆部材は、前記ダイアフラムの厚み方向において前記基材よりも薄くてもよい。 The covering member may be thinner than the base material in the thickness direction of the diaphragm.

 圧力センサでは、樹脂が硬化とともに収縮することによって応力が発生する。当該応力は、ダイアフラムの厚み方向において、圧力センサの中央部と基材の底面との間の部分よりも、当該中央部と被覆部材の上面との間の部分で小さい。この構成によれば、被覆部材は、ダイアフラムの厚み方向において基材よりも薄い。そのため、ダイアフラムは、前記の厚み方向において、圧力センサの中央部と被覆部材の上面との間の部分に配置される。このことにより、樹脂の収縮によってダイアフラムにかかる応力を低減することができるため、ダイアフラムの撓みを小さくすることができる。したがって、当該応力に起因する圧力センサの特性変動を抑制することができる。 In the pressure sensor, stress is generated by the shrinkage of the resin as it hardens. The stress is smaller in the portion between the central portion of the pressure sensor and the top surface of the covering member than in the portion between the central portion of the pressure sensor and the bottom surface of the base member in the thickness direction of the diaphragm. According to this configuration, the covering member is thinner than the base material in the thickness direction of the diaphragm. Therefore, the diaphragm is arranged in the portion between the central portion of the pressure sensor and the upper surface of the covering member in the thickness direction. As a result, the stress applied to the diaphragm due to shrinkage of the resin can be reduced, so that the deflection of the diaphragm can be reduced. Therefore, the characteristic fluctuation of the pressure sensor caused by the stress can be suppressed.

 以下、本発明の実施形態について、図面を参照しながら説明する。なお、これらの実施形態は、本発明を限定するものではない。また、図面において実質的に同一の部材については、同一の符号を付すことにより説明を省略する。 Hereinafter, embodiments of the present invention will be described with reference to the drawings. It should be noted that these embodiments do not limit the present invention. Also, in the drawings, substantially the same members are denoted by the same reference numerals, and descriptions thereof are omitted.

 以下では、説明の便宜上、「上層」、「下層」、「上面」、「下面」等の方向を示す用語を用いるが、これらの用語は、本発明に係る圧力センサの使用状態等を限定するものではない。 Hereinafter, for convenience of explanation, terms indicating directions such as “upper layer”, “lower layer”, “upper surface”, and “lower surface” are used, but these terms limit the usage conditions of the pressure sensor according to the present invention. not a thing

<第1実施形態>
 図1~図4を参照しながら、本発明の第1実施形態に係る圧力センサについて説明する。図1は、本発明の第1実施形態に係る圧力センサの平面図である。図2は、図1の圧力センサのII-II線断面図である。図3は、図1の圧力センサのIII-III線断面図である。図4は、図2の領域Z1の拡大図である。つまり、図2~図4は、後述するダイアフラム51の厚み方向に沿った断面図である。
<First Embodiment>
A pressure sensor according to a first embodiment of the present invention will be described with reference to FIGS. 1 to 4. FIG. 1 is a plan view of a pressure sensor according to a first embodiment of the present invention; FIG. FIG. 2 is a cross-sectional view of the pressure sensor of FIG. 1 taken along line II-II. FIG. 3 is a cross-sectional view of the pressure sensor of FIG. 1 taken along line III-III. FIG. 4 is an enlarged view of area Z1 in FIG. 2 to 4 are cross-sectional views along the thickness direction of the diaphragm 51, which will be described later.

 第1実施形態に係る圧力センサ1は、ダイアフラムと当該ダイアフラムから離れた電極との間で生じる静電容量を基に、ダイアフラムの一方面に加えられた圧力を検出する。つまり、第1実施形態に係る圧力センサ1は、静電容量式圧力センサである。 The pressure sensor 1 according to the first embodiment detects the pressure applied to one side of the diaphragm based on the electrostatic capacitance generated between the diaphragm and an electrode remote from the diaphragm. That is, the pressure sensor 1 according to the first embodiment is a capacitive pressure sensor.

 図2に示すように、圧力センサ1は、基材2と、基材2に接合された被覆部材7とを備えている。 As shown in FIG. 2 , the pressure sensor 1 includes a base material 2 and a covering member 7 joined to the base material 2 .

 基材2は、多層構造を有する。本実施形態では、基材2は、下層3と、中層4と、上層5と、絶縁層61,62とを有する。中層4は、本開示の「第1層」の一例である。上層5は、本開示の「第2層」の一例である。下層3及び上層5は、例えば、シリコン(Si)で構成される。中層4は、例えば、ポリシリコン(Poly-Si)で構成される。絶縁層61,62は、例えば、酸化シリコン(SiO2)で構成される。 The base material 2 has a multilayer structure. In this embodiment, the base material 2 has a lower layer 3, a middle layer 4, an upper layer 5, and insulating layers 61,62. The middle layer 4 is an example of the "first layer" of the present disclosure. The upper layer 5 is an example of the "second layer" of the present disclosure. The lower layer 3 and the upper layer 5 are made of silicon (Si), for example. The intermediate layer 4 is made of, for example, polysilicon (Poly-Si). The insulating layers 61 and 62 are made of silicon oxide (SiO2), for example.

 下層3は、一方面である底面3aを有する。下層3の底面3aは、基材2の底面を構成する。下層3の底面3aと反対側の面には、絶縁層61が積層されている。絶縁層61の下層3に接触する面と反対側の面には、中層4が積層されている。中層4は、接地部41と、ダイアフラム51との間で静電容量を生じる固定電極部43(図3参照)とを有する。本実施形態では、図3に示すように、固定電極部43は、絶縁層61に形成された穴611を介して、下層3に電気的に接続されている。 The lower layer 3 has a bottom surface 3a which is one surface. The bottom surface 3 a of the lower layer 3 constitutes the bottom surface of the substrate 2 . An insulating layer 61 is laminated on the surface of the lower layer 3 opposite to the bottom surface 3a. The intermediate layer 4 is laminated on the surface of the insulating layer 61 opposite to the surface in contact with the lower layer 3 . The middle layer 4 has a ground portion 41 and a fixed electrode portion 43 (see FIG. 3) that generates capacitance between the diaphragm 51 and the ground portion 41 . In this embodiment, as shown in FIG. 3 , the fixed electrode portion 43 is electrically connected to the lower layer 3 through holes 611 formed in the insulating layer 61 .

 図2に示すように、接地部41には、接地電極42が重ねて配置されている。接地電極42は、例えば、アルミニウム(Al)、チタン(Ti)等で構成される。図5に示すように、接地電極42は、例えば、ワイヤ14を介して、圧力センサ1が実装されるベース基板Bの接地電極(図示せず)に接続されることにより、接地される。このことにより、接地電極42に接続された中層4の接地部41も接地される。 As shown in FIG. 2 , a ground electrode 42 is superimposed on the ground portion 41 . The ground electrode 42 is made of, for example, aluminum (Al), titanium (Ti), or the like. As shown in FIG. 5, the ground electrode 42 is grounded, for example, by being connected via a wire 14 to a ground electrode (not shown) of the base substrate B on which the pressure sensor 1 is mounted. As a result, the ground portion 41 of the intermediate layer 4 connected to the ground electrode 42 is also grounded.

 図3に示すように、中層4の絶縁層61に接触する面と反対側の面には、絶縁層62が積層されている。絶縁層62には、中層4の固定電極部43に重複する部分に穴が形成されている。当該穴は、後述する基準空間10に相当する。絶縁層62の中層4に接触する面と反対側の面には、上層5が積層されている。上層5は、絶縁層62に接触する面と反対側の上面5aを有する。図2に示すように、接地部41及び接地電極42は、基材2の外部に連通している。接地電極42は、上層5から離れている。 As shown in FIG. 3, an insulating layer 62 is laminated on the surface of the intermediate layer 4 opposite to the surface in contact with the insulating layer 61 . A hole is formed in the insulating layer 62 in a portion overlapping the fixed electrode portion 43 of the intermediate layer 4 . The hole corresponds to the reference space 10 described later. The upper layer 5 is laminated on the surface of the insulating layer 62 opposite to the surface in contact with the intermediate layer 4 . The upper layer 5 has an upper surface 5 a opposite to the surface that contacts the insulating layer 62 . As shown in FIG. 2 , the ground portion 41 and the ground electrode 42 communicate with the outside of the base material 2 . A ground electrode 42 is spaced from the top layer 5 .

 基材2を構成する各層は、気密に接合されている。この接合は、例えば、常温接合、接着固定等である。図3に示すように、絶縁層62に形成された穴が絶縁層62の上下に積層された層によって気密に閉鎖されることにより、基準空間10が形成される。本実施形態では、基準空間10は、例えば、10Pa以下の真空状態である。 Each layer constituting the base material 2 is airtightly joined. This bonding is, for example, normal temperature bonding, adhesive fixation, or the like. As shown in FIG. 3, the reference space 10 is formed by airtightly closing a hole formed in the insulating layer 62 with layers stacked above and below the insulating layer 62 . In this embodiment, the reference space 10 is in a vacuum state of 10 Pa or less, for example.

 上層5は、基材2の各層の積層方向から見た平面視で、基準空間10と重複するダイアフラム51と、ダイアフラム51を囲む支持部52とを有する。上層5の上面5aのうち、ダイアフラム51に対応する領域は、ダイアフラム51の上面51aを構成する。上面51aは、本発明におけるダイアフラムの「一方面」の一例である。ダイアフラム51は、上面51aと反対側の下面51bを有する。下面51bは、本発明におけるダイアフラムの「他方面」の一例である。 The upper layer 5 has a diaphragm 51 that overlaps the reference space 10 and a support portion 52 that surrounds the diaphragm 51 when viewed from above in the stacking direction of the layers of the base material 2 . A region of the upper surface 5 a of the upper layer 5 that corresponds to the diaphragm 51 constitutes an upper surface 51 a of the diaphragm 51 . The upper surface 51a is an example of "one side" of the diaphragm in the present invention. Diaphragm 51 has an upper surface 51a and an opposite lower surface 51b. The lower surface 51b is an example of the "other surface" of the diaphragm in the present invention.

 ダイアフラム51は、上層5のうち、上面51aに加えられた圧力に対応して撓む部分である。言い換えると、ダイアフラム51は、上層5のうち、絶縁層62に接合されていない部分である。図3に示す破線は、上層5におけるダイアフラム51と支持部52との境界線を基材2の各層の積層方向に延長した線である。本実施形態では、ダイアフラム51と支持部52とは、一体に形成される。 The diaphragm 51 is a portion of the upper layer 5 that bends in response to pressure applied to the upper surface 51a. In other words, the diaphragm 51 is the portion of the upper layer 5 that is not bonded to the insulating layer 62 . A broken line shown in FIG. 3 is a line obtained by extending a boundary line between the diaphragm 51 and the support portion 52 in the upper layer 5 in the stacking direction of each layer of the base material 2 . In this embodiment, the diaphragm 51 and the support portion 52 are integrally formed.

 図1に示す例では、上層5は、2つのダイアフラム51を有する。本実施形態では、各ダイアフラム51は、平面視で矩形であるが、例えば、円形、楕円形、多角形等であってもよい。また、ダイアフラム51の数は、1つ又は3つ以上であってもよい。ここで、ダイアフラム51の厚み方向は、基材2の各層の積層方向と一致する。 In the example shown in FIG. 1, the upper layer 5 has two diaphragms 51. In this embodiment, each diaphragm 51 is rectangular in plan view, but may be circular, elliptical, polygonal, or the like, for example. Also, the number of diaphragms 51 may be one or three or more. Here, the thickness direction of the diaphragm 51 coincides with the stacking direction of each layer of the base material 2 .

 図3に示すように、上層5の上面5aには、ダイアフラム51との間に測定空間11を形成するようにダイアフラム51の上面51aを覆う被覆部材7が設けられている。被覆部材7は、絶縁層63を介して、上層5の上面5aのうち支持部52に対応する領域に接合されている。本明細書において、「接合」とは、2つ以上の物体が接触して接合すること、及び、2つ以上の物体が他の物体を介して接合すること、の両方を含む。 As shown in FIG. 3 , the upper surface 5 a of the upper layer 5 is provided with a covering member 7 that covers the upper surface 51 a of the diaphragm 51 so as to form the measurement space 11 between itself and the diaphragm 51 . The covering member 7 is joined to a region of the upper surface 5 a of the upper layer 5 corresponding to the support portion 52 via the insulating layer 63 . As used herein, "joining" includes both contacting and joining two or more objects and joining two or more objects through another object.

 絶縁層63は、例えば、酸化シリコン(SiO2)で構成される。被覆部材7は、例えば、シリコン(Si)で構成される。上層5と絶縁層63と被覆部材7との接合は、例えば、常温接合、接着固定等である。 The insulating layer 63 is made of, for example, silicon oxide (SiO2). The covering member 7 is made of silicon (Si), for example. The bonding between the upper layer 5, the insulating layer 63, and the covering member 7 is, for example, normal temperature bonding, adhesive fixation, or the like.

 図2に示すように、被覆部材7は、測定空間11を構成し且つダイアフラム51の上面51aを向く対向面7aを有する。さらに、被覆部材7は、対向面7aと反対側の上面7bを有する。被覆部材7の上面7bは、圧力センサ1の上面を構成する。 As shown in FIG. 2, the covering member 7 forms the measurement space 11 and has a facing surface 7a facing the upper surface 51a of the diaphragm 51. As shown in FIG. Furthermore, the covering member 7 has an upper surface 7b opposite to the facing surface 7a. The upper surface 7 b of the covering member 7 constitutes the upper surface of the pressure sensor 1 .

 本実施形態では、上層5の上面5aと被覆部材7の対向面7aとの間の距離、すなわち、測定空間11の高さは、2μmである。 In this embodiment, the distance between the upper surface 5a of the upper layer 5 and the facing surface 7a of the covering member 7, that is, the height of the measurement space 11 is 2 μm.

 図1に示すように、被覆部材7の上面7bは、平面視において、例えば、回転対称な形状を有する。本明細書において、「回転対称」とは、被覆部材7の上面7bを仮想中心点Cの周りに回転させたときに、仮想中心点Cに対する相対位置及び形状が回転の前後で一致することを意味する。本実施形態では、被覆部材7の上面7bは、平面視において長方形である。仮想中心点Cは、本発明における「上面の中心」の一例である。 As shown in FIG. 1, the upper surface 7b of the covering member 7 has, for example, a rotationally symmetrical shape in plan view. In this specification, "rotational symmetry" means that when the upper surface 7b of the covering member 7 is rotated around the virtual center point C, the relative position and shape with respect to the virtual center point C match before and after the rotation. means. In this embodiment, the upper surface 7b of the covering member 7 is rectangular in plan view. The virtual center point C is an example of the "center of the upper surface" in the present invention.

 図2に示すように、被覆部材7には、対向面7aと上面7bとの間を貫通し、測定空間11と被覆部材7の外部とを連通する連通穴8が形成されている。被覆部材7の対向面7aには、連通穴8の開口81が形成されている。被覆部材7の上面7bには、連通穴8の開口82が形成されている。連通穴8の断面は、例えば、直径20μm以上の円形である。本実施形態では、1つの連通穴8が形成されているが、2つ以上の連通穴8が形成されてもよい。 As shown in FIG. 2, the covering member 7 is formed with a communication hole 8 that penetrates between the facing surface 7a and the upper surface 7b and communicates the measurement space 11 with the outside of the covering member 7. As shown in FIG. An opening 81 of the communication hole 8 is formed in the facing surface 7a of the covering member 7. As shown in FIG. An opening 82 of the communication hole 8 is formed in the upper surface 7b of the covering member 7. As shown in FIG. The cross section of the communication hole 8 is, for example, circular with a diameter of 20 μm or more. Although one communication hole 8 is formed in this embodiment, two or more communication holes 8 may be formed.

 連通穴8は、ダイアフラム51の厚み方向に延びている。つまり、図1に示すように、被覆部材7の対向面7aに形成された開口81と、被覆部材7の上面7bに形成された開口82とは、平面視において一致している。なお、連通穴8は、上記の形状に限らず、他の方向に延びていたり、屈曲したりしてもよい。つまり、平面視において、開口81と開口82とが一致しなくてもよい。 The communication hole 8 extends in the thickness direction of the diaphragm 51 . That is, as shown in FIG. 1, the opening 81 formed in the facing surface 7a of the covering member 7 and the opening 82 formed in the upper surface 7b of the covering member 7 match each other in plan view. In addition, the communication hole 8 is not limited to the shape described above, and may extend in other directions or may be bent. In other words, the openings 81 and 82 do not have to match in plan view.

 図1及び図3に示すように、被覆部材7の対向面7aは、平面視において、ダイアフラム51に重複する重複領域7cを有する。被覆部材7の対向面7aのうち、重複領域7cを除く領域は、非重複領域7dを構成する。図1及び図2に示すように、被覆部材7の対向面7aにおいて、開口81は、非重複領域7dに形成されている。すなわち、被覆部材7の対向面7aに形成された開口81は、平面視において、ダイアフラム51に重複しない。 As shown in FIGS. 1 and 3, the facing surface 7a of the covering member 7 has an overlapping region 7c that overlaps the diaphragm 51 in plan view. A region of the facing surface 7a of the covering member 7 excluding the overlapping region 7c constitutes a non-overlapping region 7d. As shown in FIGS. 1 and 2, in the facing surface 7a of the covering member 7, the openings 81 are formed in the non-overlapping regions 7d. That is, the opening 81 formed in the facing surface 7a of the covering member 7 does not overlap the diaphragm 51 in plan view.

 図1に示すように、被覆部材7の上面7bは、縁部7eを有する。被覆部材7の上面7bに形成された開口82と仮想中心点Cとの間の最短距離は、開口82と縁部7eとの間の最短距離よりも短い。例えば、平面視において、仮想中心点Cが開口82の外側にある場合、開口82の縁と仮想中心点Cとの間の最短距離L1(図示せず)は、開口82の縁と縁部7eとの間の最短距離L2(図1参照)よりも短い。なお、平面視において、仮想中心点Cが開口82と重複している場合、最短距離L1はゼロである。本実施形態では、平面視において、開口82の中心点と仮想中心点Cとは、一致している。つまり、最短距離L1はゼロである。そのため、最短距離L1は図示されていない。 As shown in FIG. 1, the upper surface 7b of the covering member 7 has an edge 7e. The shortest distance between the opening 82 formed in the upper surface 7b of the covering member 7 and the virtual center point C is shorter than the shortest distance between the opening 82 and the edge 7e. For example, when the virtual center point C is outside the opening 82 in plan view, the shortest distance L1 (not shown) between the edge of the opening 82 and the virtual center point C is the edge of the opening 82 and the edge 7e. is shorter than the shortest distance L2 (see FIG. 1) between Note that when the virtual center point C overlaps the opening 82 in plan view, the shortest distance L1 is zero. In the present embodiment, the center point of the opening 82 and the virtual center point C match in plan view. That is, the shortest distance L1 is zero. Therefore, the shortest distance L1 is not shown.

 図1及び図2に示すように、被覆部材7の上面7bには、被覆部材7と電気的に接続された接地電極71が配置されている。本実施形態では、接地電極71は、被覆部材7の上面7bの縁部7eに配置されている。接地電極71は、例えば、アルミニウム(Al)、チタン(Ti)等で構成される。 As shown in FIGS. 1 and 2 , a ground electrode 71 electrically connected to the covering member 7 is arranged on the upper surface 7 b of the covering member 7 . In this embodiment, the ground electrode 71 is arranged on the edge 7e of the upper surface 7b of the covering member 7. As shown in FIG. The ground electrode 71 is made of, for example, aluminum (Al), titanium (Ti), or the like.

 接地電極71は、ワイヤ9を介して、基材2に配置された接地電極42に接続されている。基材2の接地電極42が接地しているので、接地電極71も接地する。このことにより、被覆部材7が接地される。すなわち、被覆部材7は、接地電位に接続されている。 The ground electrode 71 is connected via a wire 9 to the ground electrode 42 arranged on the base material 2 . Since the ground electrode 42 of the base material 2 is grounded, the ground electrode 71 is also grounded. Thereby, the covering member 7 is grounded. That is, the covering member 7 is connected to the ground potential.

 図3に示すように、被覆部材7の対向面7aのうち、重複領域7cには、ダイアフラム51の厚み方向において、ダイアフラム51に向かって突出した凸部72が、少なくとも1つ形成されている。図1に示す例では、複数の凸部72が、重複領域7cの全体に格子状に形成されている。本実施形態では、複数の凸部72は、ダイアフラム51の厚み方向から見て、長方形の縁部7eの短辺及び長辺のそれぞれに対して平行に整列している。すなわち、複数の凸部72は、直交する2方向に整列している。本実施形態では、凸部72は、被覆部材7の対向面7aにおいて、連通穴8の開口81の周囲部7f(図2参照)にも形成されている。 As shown in FIG. 3 , at least one convex portion 72 projecting toward the diaphragm 51 in the thickness direction of the diaphragm 51 is formed in the overlap region 7c of the facing surface 7a of the covering member 7 . In the example shown in FIG. 1, a plurality of protrusions 72 are formed in a grid pattern over the entire overlapping region 7c. In this embodiment, the plurality of protrusions 72 are aligned parallel to each of the short and long sides of the rectangular edge 7e when viewed from the thickness direction of the diaphragm 51 . That is, the plurality of protrusions 72 are aligned in two orthogonal directions. In the present embodiment, the convex portion 72 is also formed on the facing surface 7a of the covering member 7 around the opening 81 of the communication hole 8 (see FIG. 2).

 図4に示すように、凸部72は、ダイアフラム51の厚み方向に直交する方向から見て幅がダイアフラム51に向かって(図4における下側に向かって)減少するテーパ形状を有する。凸部72の先端部73は、曲面である。本実施形態では、被覆部材7の対向面7aに対する各凸部72の高さは、1μmである。 As shown in FIG. 4, the projection 72 has a tapered shape in which the width decreases toward the diaphragm 51 (downward in FIG. 4) when viewed from the direction orthogonal to the thickness direction of the diaphragm 51. A tip portion 73 of the convex portion 72 is a curved surface. In this embodiment, the height of each protrusion 72 with respect to the facing surface 7a of the covering member 7 is 1 μm.

 図2に示すように、被覆部材7の厚みD1は、基材2の厚みD2よりも厚い。図2に示す例において、被覆部材7の厚みD1とは、被覆部材7の上面7bから、被覆部材7の絶縁層63と接触する面までの厚みを指す。基材2の厚みD2とは、上層5の上面5aから下層3の底面3aまでの厚みを指す。基材2の厚みD2に対する被覆部材7の厚みD1の比は、好ましくは1.4倍~1.6倍である。本実施形態では、被覆部材7の厚みD1は600μmであり、基材2の厚みD2は400μmである。すなわち、基材2の厚みD2に対する被覆部材7の厚みD1の比は、1.5倍である。 As shown in FIG. 2, the thickness D1 of the covering member 7 is thicker than the thickness D2 of the base material 2. In the example shown in FIG. 2, the thickness D1 of the covering member 7 refers to the thickness from the upper surface 7b of the covering member 7 to the surface of the covering member 7 in contact with the insulating layer 63 . The thickness D2 of the base material 2 refers to the thickness from the upper surface 5a of the upper layer 5 to the bottom surface 3a of the lower layer 3 . The ratio of the thickness D1 of the covering member 7 to the thickness D2 of the base material 2 is preferably 1.4 to 1.6 times. In this embodiment, the thickness D1 of the covering member 7 is 600 μm, and the thickness D2 of the substrate 2 is 400 μm. That is, the ratio of the thickness D1 of the covering member 7 to the thickness D2 of the base material 2 is 1.5 times.

 図5は、図2の圧力センサの実装状態の一例を示す断面図である。図5に示す例では、圧力センサ1は、下層3の底面3aを介してベース基板Bに実装される。圧力センサ1は、例えば、下層3の底面3aに配置された外部電極(図示せず)を介して、ベース基板Bに設けられた電子回路(図示せず)に電気的に接続される。圧力センサ1は、被覆部材7の上面7bの一部を除いて、樹脂Mによって封止される。具体的には、連通穴8の開口82が封止されない一方で、接地電極71及びワイヤ9は、封止される。連通穴8の開口82が樹脂Mによって塞がれていないので、流体は、連通穴8を介して、測定空間11に出入りすることができる。 FIG. 5 is a cross-sectional view showing an example of the mounting state of the pressure sensor of FIG. In the example shown in FIG. 5, the pressure sensor 1 is mounted on the base substrate B via the bottom surface 3a of the lower layer 3. As shown in FIG. The pressure sensor 1 is electrically connected to an electronic circuit (not shown) provided on the base substrate B via external electrodes (not shown) arranged on the bottom surface 3a of the lower layer 3, for example. The pressure sensor 1 is sealed with a resin M except for a portion of the upper surface 7b of the covering member 7. As shown in FIG. Specifically, the ground electrode 71 and the wire 9 are sealed while the opening 82 of the communication hole 8 is not sealed. Since the opening 82 of the communication hole 8 is not blocked by the resin M, the fluid can enter and exit the measurement space 11 through the communication hole 8 .

 ダイアフラム51は、測定空間11に出入りする流体(例えば、気体等)によってダイアフラム51の上面51aに加えられた圧力に応じて撓む。ダイアフラム51が撓むと、ダイアフラム51と中層4の固定電極部43(図3参照)との間の距離が変化し、それらの間で発生する静電容量が増減する。当該静電容量に応じた電気信号がダイアフラム51及び中層4の固定電極部43から出力され、前記の電子回路に伝達されることにより、ダイアフラム51の上面51aに加えられた圧力が算出される。このようにして、圧力センサ1は、真空を基準として圧力を検出する絶対圧センサとして機能する。 The diaphragm 51 bends according to the pressure applied to the upper surface 51a of the diaphragm 51 by the fluid (for example, gas) entering and exiting the measurement space 11 . When the diaphragm 51 bends, the distance between the diaphragm 51 and the fixed electrode portion 43 (see FIG. 3) of the middle layer 4 changes, increasing or decreasing the capacitance generated therebetween. An electrical signal corresponding to the capacitance is output from the diaphragm 51 and the fixed electrode portion 43 of the intermediate layer 4 and transmitted to the electronic circuit, whereby the pressure applied to the upper surface 51a of the diaphragm 51 is calculated. In this way, the pressure sensor 1 functions as an absolute pressure sensor that detects pressure with reference to vacuum.

 なお、基準空間10の圧力が大気圧である場合、圧力センサ1は、大気圧を0とした圧力を示すゲージ圧センサとして機能する。また、基準空間10の圧力が任意の圧力である場合、圧力センサ1は、当該任意の圧力に対する差圧を示す差圧センサとして機能する。 When the pressure in the reference space 10 is the atmospheric pressure, the pressure sensor 1 functions as a gauge pressure sensor that indicates the pressure when the atmospheric pressure is 0. Moreover, when the pressure in the reference space 10 is an arbitrary pressure, the pressure sensor 1 functions as a differential pressure sensor that indicates the differential pressure with respect to the arbitrary pressure.

 第1実施形態に係る圧力センサ1によれば、被覆部材7は、接地される。このことにより、基材2がダイアフラム51の上面51aに加えられた圧力を算出するための電子回路を有する場合に、静電気等に起因する電流が当該電子回路に流れ込むことを抑制することができる。したがって、静電気耐性の高い圧力センサ1を実現することができる。 According to the pressure sensor 1 according to the first embodiment, the covering member 7 is grounded. As a result, when the base material 2 has an electronic circuit for calculating the pressure applied to the upper surface 51a of the diaphragm 51, it is possible to suppress the current caused by static electricity or the like from flowing into the electronic circuit. Therefore, the pressure sensor 1 with high resistance to static electricity can be realized.

 また、第1実施形態に係る圧力センサ1によれば、被覆部材7が中層4の接地部41に電気的に接続されるので、接地された被覆部材7を実現することができる。したがって、静電気耐性の高い圧力センサ1を実現することができる。 Further, according to the pressure sensor 1 according to the first embodiment, the covering member 7 is electrically connected to the ground portion 41 of the middle layer 4, so that the covering member 7 can be grounded. Therefore, the pressure sensor 1 with high resistance to static electricity can be realized.

 静電容量式圧力センサの場合、中層4と上層5との間に、基準空間10が形成される。中層4は、基準空間10を介して上層5のダイアフラム51と対向し、且つ、ダイアフラム51との間で静電容量を生じる固定電極部43を有する。被覆部材7と電気的に接続される接地部41を圧力センサ1に設ける場合、接地部41を中層4に配置すると、接地部41と固定電極部43とを同時に形成できる。そのため、圧力センサ1の製造工程において、接地部41を設けるための追加工程が不要である。したがって、基材2を構成する層のうち導体を有しない層に接地部41を配置する構成と比較して、接地された被覆部材7をより容易に実現できる。 In the case of a capacitive pressure sensor, a reference space 10 is formed between the middle layer 4 and the upper layer 5 . The middle layer 4 faces the diaphragm 51 of the upper layer 5 with the reference space 10 interposed therebetween, and has a fixed electrode portion 43 that generates a capacitance with the diaphragm 51 . When the pressure sensor 1 is provided with the ground portion 41 electrically connected to the covering member 7, the ground portion 41 and the fixed electrode portion 43 can be formed at the same time by arranging the ground portion 41 in the middle layer 4. FIG. Therefore, in the manufacturing process of the pressure sensor 1, an additional process for providing the ground portion 41 is unnecessary. Therefore, the grounded covering member 7 can be realized more easily than the configuration in which the ground portion 41 is arranged in a layer having no conductor among the layers constituting the base material 2 .

 測定空間11に水分が浸入したとき、当該水分によって構成される水滴は、被覆部材7の対向面7aとダイアフラム51との両方に、同時に接触し得る。当該水滴が被覆部材7の対向面7aとダイアフラム51との両方に接触した状態で気化によって小さくなると、ダイアフラム51は、当該水滴の表面張力によって、被覆部材7の対向面7aに向かって引き寄せられる。当該水滴が更に小さくなると、ダイアフラム51は、被覆部材7の対向面7aに接触する。この場合、当該水滴がなくなった後に、ダイアフラム51が被覆部材7の対向面7aに固着するおそれがある。ダイアフラム51の固着は、圧力センサ1の検出不良を引き起こす。 When water enters the measurement space 11, water droplets formed by the water can contact both the facing surface 7a of the covering member 7 and the diaphragm 51 at the same time. When the water droplets contact both the facing surface 7a of the covering member 7 and the diaphragm 51 and become smaller due to evaporation, the diaphragm 51 is drawn toward the facing surface 7a of the covering member 7 by the surface tension of the water droplets. When the water droplet becomes even smaller, the diaphragm 51 comes into contact with the facing surface 7a of the covering member 7. As shown in FIG. In this case, the diaphragm 51 may adhere to the facing surface 7a of the covering member 7 after the water droplets have disappeared. Sticking of the diaphragm 51 causes detection failure of the pressure sensor 1 .

 一方、第1実施形態に係る圧力センサ1によれば、被覆部材7は、対向面7aの重複領域7cに凸部72を有する。そのため、ダイアフラム51は、被覆部材7の対向面7aに向かって引き寄せられたときに、被覆部材7の対向面7aよりも先に凸部72に接触することにより、それ以上引き寄せられなくなる。つまり、被覆部材7が凸部72を有しない構成と比較して、ダイアフラム51と被覆部材7との接触面積が小さくなる。このことにより、被覆部材7に対するダイアフラム51の固着が抑制される。したがって、圧力センサ1の検出不良が起こる可能性を低くすることができる。 On the other hand, according to the pressure sensor 1 according to the first embodiment, the covering member 7 has the convex portion 72 in the overlapping region 7c of the facing surface 7a. Therefore, when the diaphragm 51 is drawn toward the facing surface 7a of the covering member 7, the diaphragm 51 contacts the convex portion 72 before the facing surface 7a of the covering member 7, and is no longer drawn. In other words, the contact area between the diaphragm 51 and the covering member 7 becomes smaller compared to the configuration in which the covering member 7 does not have the convex portion 72 . This prevents the diaphragm 51 from sticking to the covering member 7 . Therefore, the possibility of detection failure of the pressure sensor 1 can be reduced.

 前記の水滴は、測定空間11において、水分の浸入経路である連通穴8の開口81の近傍に溜まりやすい。第1実施形態に係る圧力センサ1によれば、被覆部材7の対向面7aにおいて、連通穴8の開口81の周囲部7fに凸部72が形成される。このことにより、被覆部材7に対するダイアフラム51の固着を抑制することができる。したがって、圧力センサ1の検出不良が起こる可能性を低くすることができる。 The water droplets described above tend to accumulate in the measurement space 11 near the opening 81 of the communication hole 8, which is the water entry path. According to the pressure sensor 1 according to the first embodiment, on the facing surface 7a of the covering member 7, the convex portion 72 is formed on the peripheral portion 7f of the opening 81 of the communication hole 8. As shown in FIG. As a result, sticking of the diaphragm 51 to the covering member 7 can be suppressed. Therefore, the possibility of detection failure of the pressure sensor 1 can be reduced.

 第1実施形態に係る圧力センサ1によれば、被覆部材7の重複領域7cの全体に、複数の凸部72が形成されている。このことにより、被覆部材7の重複領域7cの全体において、被覆部材7に対するダイアフラム51の固着を抑制することができる。したがって、圧力センサ1の検出不良が起こる可能性を低くすることができる。 According to the pressure sensor 1 according to the first embodiment, a plurality of protrusions 72 are formed in the entire overlapping region 7c of the covering member 7. As a result, adhesion of the diaphragm 51 to the covering member 7 can be suppressed in the entire overlapping region 7 c of the covering member 7 . Therefore, the possibility of detection failure of the pressure sensor 1 can be reduced.

 第1実施形態に係る圧力センサ1によれば、凸部72の先端部73の幅が細いので、凸部72とダイアフラム51との接触面積が小さい。そのため、凸部72の幅がダイアフラム51に向かって減少するテーパ形状を有しない構成と比較して、凸部72に対するダイアフラム51の固着が抑制される。したがって、圧力センサ1の検出不良が起こる可能性を低くすることができる。 According to the pressure sensor 1 according to the first embodiment, since the tip portion 73 of the projection 72 has a narrow width, the contact area between the projection 72 and the diaphragm 51 is small. Therefore, as compared with a configuration in which the protrusion 72 does not have a tapered shape in which the width of the protrusion 72 decreases toward the diaphragm 51 , sticking of the diaphragm 51 to the protrusion 72 is suppressed. Therefore, the possibility of detection failure of the pressure sensor 1 can be reduced.

 ダイアフラム51の厚み方向に直交する方向から見て、凸部72がダイアフラム51に向かって細くなって先端部73が尖った形状である場合、凸部72とダイアフラム51とが接触したときに、凸部72の先端部73に応力が集中するおそれがある。凸部72の先端部73に応力が集中すると、凸部72が破損する可能性が高まる。 When viewed from the direction orthogonal to the thickness direction of the diaphragm 51 , when the convex portion 72 tapers toward the diaphragm 51 and the distal end portion 73 has a sharp shape, when the convex portion 72 and the diaphragm 51 contact each other, the convex portion 72 and the diaphragm 51 contact each other. Stress may concentrate on the tip portion 73 of the portion 72 . When the stress concentrates on the tip portion 73 of the protrusion 72, the possibility of the protrusion 72 being damaged increases.

 第1実施形態に係る圧力センサ1によれば、凸部72の先端部73が曲面であるので、凸部72の先端部73に対する応力の集中を抑制することができる。したがって、ダイアフラム51との接触によって破損しにくい凸部72を実現することができる。 According to the pressure sensor 1 according to the first embodiment, since the tip portion 73 of the convex portion 72 has a curved surface, concentration of stress on the tip portion 73 of the convex portion 72 can be suppressed. Therefore, it is possible to realize the convex portion 72 that is less likely to be damaged by contact with the diaphragm 51 .

 また、第1実施形態に係る圧力センサ1によれば、被覆部材7の対向面7aに形成された連通穴8の開口81は、ダイアフラム51の厚み方向から見て、ダイアフラム51と重複しない。そのため、流体と共に連通穴8を通過した異物がダイアフラム51の上面51aに到達する可能性を低くすることができる。したがって、ダイアフラム51に異物が付着することによる圧力センサ1の検出不良を抑制できる。 Further, according to the pressure sensor 1 according to the first embodiment, the opening 81 of the communication hole 8 formed in the facing surface 7a of the covering member 7 does not overlap the diaphragm 51 when viewed from the thickness direction of the diaphragm 51 . Therefore, it is possible to reduce the possibility that foreign matter that has passed through the communication hole 8 together with the fluid will reach the upper surface 51 a of the diaphragm 51 . Therefore, detection failure of the pressure sensor 1 due to adhesion of foreign matter to the diaphragm 51 can be suppressed.

 また、第1実施形態に係る圧力センサ1によれば、被覆部材7の上面7bに形成された連通穴8の開口82と上面7bの中心Cとの最短距離は、連通穴8の開口82と上面7bの縁部7eとの間の最短距離よりも短い。つまり、被覆部材7の上面7bにおいて、連通穴8の開口82は、上面7bの縁部7eから離れている。このことにより、未硬化の樹脂Mが被覆部材7の上面7bの縁部7eから上面7bの仮想中心点Cに向かってに流れ込んだときに、樹脂Mが連通穴8を塞いだり、ダイアフラム51に付着したりする可能性を低くすることができる。よって、圧力センサ1の検出不良を抑制できる。 Further, according to the pressure sensor 1 according to the first embodiment, the shortest distance between the opening 82 of the communicating hole 8 formed in the upper surface 7b of the covering member 7 and the center C of the upper surface 7b is It is shorter than the shortest distance between the edge 7e of the upper surface 7b. That is, on the upper surface 7b of the covering member 7, the opening 82 of the communication hole 8 is separated from the edge 7e of the upper surface 7b. As a result, when the uncured resin M flows from the edge 7e of the upper surface 7b of the covering member 7 toward the imaginary center point C of the upper surface 7b, the resin M blocks the communication hole 8 or the diaphragm 51. It is possible to reduce the possibility of sticking. Therefore, detection failure of the pressure sensor 1 can be suppressed.

 圧力センサ1は、例えば、筐体への搭載時に、応力によって、ダイアフラム51の厚み方向に沿って被覆部材7側が凸となるように変形することがある。この変形の大きさは、ダイアフラム51の厚み方向において、被覆部材7の上面7bに近づくほど大きい。 For example, when the pressure sensor 1 is mounted on a housing, stress may deform the diaphragm 51 so that the covering member 7 side becomes convex along the thickness direction. The magnitude of this deformation increases as the upper surface 7 b of the covering member 7 is approached in the thickness direction of the diaphragm 51 .

 第1実施形態に係る圧力センサ1によれば、被覆部材7は、ダイアフラム51の厚み方向において基材2よりも厚い。そのため、被覆部材7が基材2よりも薄い構成と比較して、被覆部材7の上面7bとダイアフラム51との間の距離を長くすることができる。このことにより、圧力センサ1が凸状に変形したときに、ダイアフラム51に作用する応力を緩和することができるため、ダイアフラム51の撓みを小さくすることができる。したがって、応力に起因する圧力センサ1の特性変動を抑制することができる。 According to the pressure sensor 1 according to the first embodiment, the covering member 7 is thicker than the base material 2 in the thickness direction of the diaphragm 51 . Therefore, the distance between the upper surface 7 b of the covering member 7 and the diaphragm 51 can be increased compared to the configuration in which the covering member 7 is thinner than the base material 2 . As a result, the stress acting on the diaphragm 51 can be relaxed when the pressure sensor 1 is deformed into a convex shape, so that the deflection of the diaphragm 51 can be reduced. Therefore, the characteristic fluctuation of the pressure sensor 1 caused by stress can be suppressed.

<第2実施形態>
 図6を参照しながら、本発明の第2実施形態に係る圧力センサ1Aについて説明する。図6は、本発明の第2実施形態に係る圧力センサの、図1におけるII-II線に対応する断面図である。
<Second embodiment>
A pressure sensor 1A according to a second embodiment of the present invention will be described with reference to FIG. FIG. 6 is a cross-sectional view of the pressure sensor according to the second embodiment of the invention, corresponding to line II-II in FIG.

 第2実施形態に係る圧力センサ1Aが第1実施形態に係る圧力センサ1と異なる点は、被覆部材7の厚みD1が基材2の厚みD2よりも薄い点である。基材2の厚みD2に対する被覆部材7の厚みD1の比は、好ましくは0.1倍~0.3倍である。本実施形態では、被覆部材7の厚みD1は80μmであり、基材2の厚みD2は400μmである。すなわち、基材2の厚みD2に対する被覆部材7の厚みD1の比は、0.2倍である。 The pressure sensor 1A according to the second embodiment differs from the pressure sensor 1 according to the first embodiment in that the thickness D1 of the covering member 7 is thinner than the thickness D2 of the base material 2. The ratio of the thickness D1 of the covering member 7 to the thickness D2 of the base material 2 is preferably 0.1 to 0.3 times. In this embodiment, the thickness D1 of the covering member 7 is 80 μm, and the thickness D2 of the substrate 2 is 400 μm. That is, the ratio of the thickness D1 of the covering member 7 to the thickness D2 of the base material 2 is 0.2 times.

 圧力センサ1Aでは、樹脂Mが硬化とともに収縮することによって応力が発生する。当該応力は、ダイアフラム51の厚み方向において、圧力センサ1Aの中央部と下層3の底面3aとの間の部分よりも、当該中央部と被覆部材7の上面7bとの間の部分で大きい。第2実施形態に係る圧力センサ1Aによれば、被覆部材7は、ダイアフラム51の厚み方向において基材2よりも薄い。そのため、ダイアフラム51は、前記の厚み方向において、圧力センサ1Aの中央部と被覆部材7の上面7bとの間の部分に配置される。このことにより、樹脂Mの収縮によってダイアフラム51にかかる応力を低減することができるため、ダイアフラム51の撓みを小さくすることができる。したがって、当該応力に起因する圧力センサ1Aの特性変動を抑制することができる。 In the pressure sensor 1A, stress is generated by shrinkage of the resin M as it cures. The stress in the thickness direction of the diaphragm 51 is greater in the portion between the central portion of the pressure sensor 1A and the bottom surface 3a of the lower layer 3 than in the portion between the central portion of the pressure sensor 1A and the bottom surface 3a of the lower layer 3 . According to the pressure sensor 1</b>A according to the second embodiment, the covering member 7 is thinner than the base material 2 in the thickness direction of the diaphragm 51 . Therefore, the diaphragm 51 is arranged in the portion between the central portion of the pressure sensor 1A and the upper surface 7b of the covering member 7 in the thickness direction. As a result, the stress applied to the diaphragm 51 due to the contraction of the resin M can be reduced, so that the deflection of the diaphragm 51 can be reduced. Therefore, the characteristic fluctuation of the pressure sensor 1A caused by the stress can be suppressed.

<変形例>
 図7~図9を参照しながら、圧力センサ1の変形例について説明する。図7~図9は、図2の圧力センサの変形例の領域Z1に対応する拡大図である。
<Modification>
Modifications of the pressure sensor 1 will be described with reference to FIGS. 7 to 9. FIG. 7 to 9 are enlarged views corresponding to the region Z1 of the modified example of the pressure sensor of FIG.

 圧力センサ1において、各凸部72は、ダイアフラム51の厚み方向に直交する方向から見て、図4に示す形状以外の形状であってもよい。例えば、図7に示す圧力センサ1の変形例では、凸部72は、ダイアフラム51の厚み方向に直交する方向から見て、凸部72の幅が凸部72の先端部73に向かって減少する台形である。すなわち、凸部72の先端部73は、曲面ではなく、被覆部材7の対向面7aに平行又は略平行な平面である。 In the pressure sensor 1, each projection 72 may have a shape other than the shape shown in FIG. 4 when viewed from the direction perpendicular to the thickness direction of the diaphragm 51. For example, in the modified example of the pressure sensor 1 shown in FIG. 7, the width of the convex portion 72 decreases toward the tip portion 73 of the convex portion 72 when viewed from the direction orthogonal to the thickness direction of the diaphragm 51. It is a trapezoid. That is, the tip portion 73 of the convex portion 72 is not a curved surface but a flat surface parallel or substantially parallel to the facing surface 7 a of the covering member 7 .

 図8に示す凸部72は、ダイアフラム51の厚み方向に直交する方向から見て、凸部72の幅が一定の矩形である。すなわち、凸部72の幅は、凸部72の先端部73に向かって減少していない。 The convex portion 72 shown in FIG. 8 has a rectangular shape with a constant width when viewed from the direction orthogonal to the thickness direction of the diaphragm 51 . That is, the width of the protrusion 72 does not decrease toward the tip 73 of the protrusion 72 .

 図9に示す複数の凸部72は、ダイアフラム51の厚み方向に直交する方向から見て、連続した波形状に形成されている。 A plurality of convex portions 72 shown in FIG. 9 are formed in a continuous wave shape when viewed from a direction perpendicular to the thickness direction of the diaphragm 51 .

 図7~図9に示す上記の凸部72によっても、被覆部材7に対するダイアフラム51の固着を抑制することができる。したがって、圧力センサ1の検出不良が起こる可能性を低くすることができる。 The sticking of the diaphragm 51 to the covering member 7 can also be suppressed by the protrusions 72 shown in FIGS. Therefore, the possibility of detection failure of the pressure sensor 1 can be reduced.

<被覆部材7の形成方法>
 次に、図10~図14を参照しながら、本発明に係る圧力センサ1Aにおける被覆部材7の形成方法の一例について説明する。図10~図14は、図6の圧力センサにおける被覆部材の形成方法の一例を示す断面図である。
<Method for Forming Covering Member 7>
Next, an example of a method of forming the covering member 7 in the pressure sensor 1A according to the present invention will be described with reference to FIGS. 10 to 14. FIG. 10 to 14 are cross-sectional views showing an example of a method of forming the covering member in the pressure sensor of FIG. 6. FIG.

 本形成方法では、SOI(silicon on insulator)基板12が使用される。図10に示すように、SOI基板12は、Si支持層121と、SiO2層122と、表面Si層123とを有する。SiO2層122は、Si支持層121の一方面に積層されている。SiO2層122のSi支持層121に接触する面と反対側の面には、表面Si層123が積層されている。表面Si層123の一部は、被覆部材7を構成する。図10~図14では、説明の便宜上、SOI基板12を上記の積層方向と反対の向きで、すなわち、最後に積層される表面Si層123が各図において最も下に示されている。 In this forming method, an SOI (silicon on insulator) substrate 12 is used. As shown in FIG. 10, the SOI substrate 12 has a Si support layer 121, a SiO2 layer 122 and a surface Si layer 123. As shown in FIG. The SiO2 layer 122 is laminated on one side of the Si support layer 121 . A surface Si layer 123 is laminated on the surface of the SiO2 layer 122 opposite to the surface in contact with the Si support layer 121 . A portion of the surface Si layer 123 constitutes the covering member 7 . 10 to 14, for convenience of explanation, the SOI substrate 12 is shown in the direction opposite to the stacking direction described above, that is, the surface Si layer 123 stacked last is shown at the bottom in each figure.

 まず、図10に示すように、表面Si層123のSiO2層122に接触する面と反対側の面に、付加SiO2層13が形成される。付加SiO2層13の一部は、絶縁層63を構成する。 First, as shown in FIG. 10, the additional SiO2 layer 13 is formed on the surface of the surface Si layer 123 opposite to the surface in contact with the SiO2 layer 122 . A portion of the additional SiO2 layer 13 constitutes the insulating layer 63 .

 次に、図11に示すように、付加SiO2層13のうち絶縁層63を構成しない部分が除去されることにより、絶縁層63が形成される。当該除去は、例えば、エッチングにより行われる。 Next, as shown in FIG. 11, the insulating layer 63 is formed by removing the portion of the additional SiO2 layer 13 that does not constitute the insulating layer 63 . The removal is performed, for example, by etching.

 次に、図12に示すように、表面Si層123のうち被覆部材7を構成しない部分が除去される。当該除去は、例えば、エッチングにより行われる。このことにより、凸部72を有する被覆部材7が形成される。 Next, as shown in FIG. 12, the portion of the surface Si layer 123 that does not constitute the covering member 7 is removed. The removal is performed, for example, by etching. As a result, the covering member 7 having the projections 72 is formed.

 次に、図13に示すように、SOI基板12及び付加SiO2層13(すなわち、絶縁層63)は、付加SiO2層13の表面Si層123(すなわち、被覆部材7)に接触する面と反対側の面を介して、基材2の上層5の上面5aに接合される。当該接合は、例えば、常温接合、接着固定等である。 Next, as shown in FIG. 13, the SOI substrate 12 and the additional SiO2 layer 13 (that is, the insulating layer 63) are placed on the side opposite to the surface that contacts the surface Si layer 123 (that is, the covering member 7) of the additional SiO2 layer 13. is joined to the upper surface 5a of the upper layer 5 of the base material 2 via the surface of . The bonding is, for example, normal temperature bonding, adhesive fixation, or the like.

 次に、図14に示すように、Si支持層121及びSiO2層122が除去される。最後に、表面Si層123(すなわち、被覆部材7)に対して、例えば、エッチングを行うことにより、連通穴8が形成される。 Next, as shown in FIG. 14, the Si support layer 121 and the SiO2 layer 122 are removed. Finally, the surface Si layer 123 (that is, the covering member 7) is etched, for example, to form the communication holes 8. As shown in FIG.

 最後に、図15に示すように、被覆部材7の上面7bに接地電極71がパターニングされる。 Finally, as shown in FIG. 15, a ground electrode 71 is patterned on the upper surface 7b of the covering member 7. Then, as shown in FIG.

 上記では、圧力センサ1Aにおける被覆部材7の形成方法について説明したが、当該形成方法において表面Si層123を更に厚くすることにより、圧力センサ1における被覆部材7を形成できる。 Although the method of forming the covering member 7 in the pressure sensor 1A has been described above, the covering member 7 in the pressure sensor 1 can be formed by further increasing the thickness of the surface Si layer 123 in this forming method.

 なお、本発明は、前述の実施形態に限定されるものではなく、その他種々の態様で実施できる。例えば、前記では、圧力センサ1,1Aが静電容量式圧力センサであるものとしたが、これに限定されない。例えば、圧力センサ1,1Aは、ピエゾ抵抗式圧力センサであってもよい。この場合、ダイアフラム51に、電子回路を形成する複数のピエゾ抵抗素子が配置される。当該電子回路からダイアフラム51の撓みに応じた電気信号が出力され、当該電気信号を基にして、ダイアフラム51の上面51aに加えられた圧力が算出される。 It should be noted that the present invention is not limited to the above-described embodiments, and can be implemented in various other aspects. For example, in the description above, the pressure sensors 1 and 1A are capacitive pressure sensors, but the present invention is not limited to this. For example, the pressure sensors 1, 1A may be piezoresistive pressure sensors. In this case, the diaphragm 51 is provided with a plurality of piezoresistive elements forming an electronic circuit. An electric signal corresponding to the deflection of the diaphragm 51 is output from the electronic circuit, and the pressure applied to the upper surface 51a of the diaphragm 51 is calculated based on the electric signal.

 また、前記では、被覆部材7の接地電極71と基材2の接地電極42とがワイヤ9によって接続されているものとしたが、これに限定されない。例えば、被覆部材7の接地電極71と基材2の接地電極42とは、ワイヤ9以外の導電性部品によって接続されていてもよい。被覆部材7の接地電極71と基材2の接地電極42とは、電気的に接続されていれば、間接的に接続されてもよい。被覆部材7と基材2の接地部41とが電気的に接続される限り、接地電極71及び接地電極42のうち少なくとも一方は、設けられなくてもよい。被覆部材7が接地される限り、中層4の接地部41は、設けられなくてもよい。例えば、被覆部材7は、基材2を介することなく、圧力センサ1,1Aとは別に設けられて接地された部材と電気的に接続されることによって、接地されてもよい。 Also, in the above description, the ground electrode 71 of the covering member 7 and the ground electrode 42 of the base material 2 are connected by the wire 9, but the present invention is not limited to this. For example, the ground electrode 71 of the covering member 7 and the ground electrode 42 of the base material 2 may be connected by a conductive part other than the wire 9 . The ground electrode 71 of the covering member 7 and the ground electrode 42 of the base material 2 may be indirectly connected as long as they are electrically connected. As long as the covering member 7 and the ground portion 41 of the base material 2 are electrically connected, at least one of the ground electrode 71 and the ground electrode 42 may not be provided. As long as the covering member 7 is grounded, the grounding portion 41 of the middle layer 4 may not be provided. For example, the covering member 7 may be grounded by being electrically connected to a grounded member that is provided separately from the pressure sensors 1 and 1A without going through the base material 2 .

 凸部72の数、配置、及び形状は、被覆部材7の対向面7aに向かって引き寄せられるダイアフラム51の動きを抑制することができれば、上記に限定されない。例えば、平面視において、複数の線状のリブが、互いに平行に延びてもよい。 The number, arrangement, and shape of the protrusions 72 are not limited to the above as long as they can suppress the movement of the diaphragm 51 drawn toward the facing surface 7a of the covering member 7. For example, in plan view, a plurality of linear ribs may extend parallel to each other.

 また、前記では、複数の凸部72が直交する2方向に整列しているものとしたが、これに限定されない。本明細書において、「格子状」とは、複数の凸部72が被覆部材7の対向面7aにおいて2方向に整列し、当該2方向が交差することを意味する。例えば、図16に示す例にように、複数の凸部72が整列する2方向は、直交していなくてもよい。 Also, in the above description, the plurality of protrusions 72 are aligned in two orthogonal directions, but the present invention is not limited to this. In this specification, the term “lattice” means that a plurality of protrusions 72 are aligned in two directions on the facing surface 7a of the covering member 7 and the two directions intersect. For example, as in the example shown in FIG. 16, the two directions in which the plurality of protrusions 72 are aligned need not be orthogonal.

 また、前記では、被覆部材7は、接地されるものとしたが、接地されなくてもよい。 Also, although the covering member 7 is assumed to be grounded in the above description, it does not have to be grounded.

 なお、前述の様々な実施形態から任意の実施形態を適宜組み合わせることにより、それぞれの有する効果を奏するようにすることができる。 By appropriately combining any of the various embodiments described above, the respective effects can be achieved.

 本発明は、添付図面を参照しながら、好ましい実施形態に関連して充分に記載されているが、この技術に熟練した人々にとって、種々の変形や修正は明白である。このような変形や修正は、添付した請求の範囲による本発明の範囲から外れない限りにおいて、その中に含まれると理解されるべきである。 Although the present invention has been fully described in connection with preferred embodiments and with reference to the accompanying drawings, various variations and modifications will be apparent to those skilled in the art. Such variations and modifications are to be included therein insofar as they do not depart from the scope of the invention as set forth in the appended claims.

 本発明に係る圧力センサは、静電気耐性が高いので、種々の圧力センサに有用である。 The pressure sensor according to the present invention is highly resistant to static electricity and is useful for various pressure sensors.

 1,1A 圧力センサ
 2  基材
 4  中層
 41 接地部
 5  上層
 51 ダイアフラム
 51a 上面
 51b 下面
 52 支持部
 7  被覆部材
 7a 対向面
 7b 上面
 7c 重複領域
 7e 縁部
 7f 周囲部
 72 凸部
 73 先端部
 8  連通穴
 81 開口
 82 開口
 10 基準空間
 11 測定空間
 C  仮想中心点
Reference Signs List 1, 1A Pressure sensor 2 Base material 4 Middle layer 41 Ground part 5 Upper layer 51 Diaphragm 51a Upper surface 51b Lower surface 52 Supporting part 7 Covering member 7a Opposing surface 7b Upper surface 7c Overlapping area 7e Edge 7f Surrounding part 72 Protruding part 73 Tip part 8 Communication hole 81 aperture 82 aperture 10 reference space 11 measurement space C virtual center point

Claims (11)

 ダイアフラム、及び、前記ダイアフラムの厚み方向から見て前記ダイアフラムを囲む支持部を有する基材と、
 前記ダイアフラムとの間に測定空間を形成するように前記ダイアフラムの一方面を覆い、前記基材の支持部に接合された被覆部材と、
 を備え、
 前記ダイアフラムは、前記ダイアフラムの一方面に加えられる圧力によって撓み、
 前記被覆部材に、前記測定空間と外部とを連通する連通穴が形成され、
 前記被覆部材は、接地される、
 圧力センサ。
a diaphragm and a base material having a support portion surrounding the diaphragm when viewed from the thickness direction of the diaphragm;
a covering member that covers one surface of the diaphragm so as to form a measurement space between itself and the diaphragm, and that is joined to a supporting portion of the base material;
with
the diaphragm flexes due to pressure applied to one side of the diaphragm;
A communication hole is formed in the covering member to communicate the measurement space with the outside,
the covering member is grounded;
pressure sensor.
 前記基材は、第1層と、前記ダイアフラム及び前記支持部を有する第2層とを有し、
 前記第2層は、前記ダイアフラムの一方面の反対側の他方面と前記第1層との間に基準空間を形成するように前記第1層に積層され、
 前記第1層は、接地された接地部を有し、
 前記被覆部材は、前記第1層の接地部に電気的に接続される、
 請求項1に記載の圧力センサ。
The base material has a first layer and a second layer having the diaphragm and the support,
the second layer is laminated to the first layer so as to form a reference space between the first layer and the other side opposite to one side of the diaphragm;
The first layer has a ground portion that is grounded,
The covering member is electrically connected to the ground portion of the first layer,
A pressure sensor according to claim 1 .
 前記被覆部材は、前記測定空間を形成し且つ前記ダイアフラムを向く対向面を有し、
 前記被覆部材は、前記対向面のうち、前記ダイアフラムの厚み方向から見て、前記ダイアフラムと重複する重複領域に、前記ダイアフラムに向かって突出した凸部を有する、
 請求項1又は請求項2に記載の圧力センサ。
The covering member forms the measurement space and has a facing surface facing the diaphragm,
The covering member has a convex portion projecting toward the diaphragm in an overlap region overlapping the diaphragm when viewed from the thickness direction of the diaphragm on the facing surface.
The pressure sensor according to claim 1 or 2.
 前記凸部は、前記被覆部材の対向面に形成された前記連通穴の開口の周囲部に形成される、請求項3に記載の圧力センサ。 The pressure sensor according to claim 3, wherein the convex portion is formed around the opening of the communication hole formed in the facing surface of the covering member.  前記被覆部材は、複数の前記凸部を有し、
 複数の前記凸部は、前記被覆部材の重複領域の全体に格子状に形成される、
 請求項3又は請求項4に記載の圧力センサ。
The covering member has a plurality of the convex portions,
The plurality of protrusions are formed in a grid pattern over the entire overlapping region of the covering member,
The pressure sensor according to claim 3 or 4.
 前記凸部は、前記ダイアフラムの厚み方向に直交する方向から見て、前記凸部の幅が前記ダイアフラムに向かって減少するテーパ形状を有する、請求項3~5のいずれか1つに記載の圧力センサ。 The pressure according to any one of claims 3 to 5, wherein the protrusion has a tapered shape in which the width of the protrusion decreases toward the diaphragm when viewed from a direction perpendicular to the thickness direction of the diaphragm. sensor.  前記凸部の先端部は、曲面である、請求項3~6のいずれか1つに記載の圧力センサ。 The pressure sensor according to any one of claims 3 to 6, wherein the tip of the convex portion has a curved surface.  前記被覆部材は、前記測定空間を形成し且つ前記ダイアフラムを向く対向面を有し、
 前記対向面に形成された前記連通穴の開口は、前記ダイアフラムの厚み方向から見て、前記ダイアフラムと重複しない、
 請求項1~7のいずれか1つに記載の圧力センサ。
The covering member forms the measurement space and has a facing surface facing the diaphragm,
The opening of the communication hole formed in the facing surface does not overlap with the diaphragm when viewed from the thickness direction of the diaphragm.
The pressure sensor according to any one of claims 1-7.
 前記被覆部材は、前記測定空間を形成し且つ前記ダイアフラムを向く対向面と、前記対向面と反対側の上面とを有し、
 前記上面に形成された前記連通穴の開口と前記上面の中心との間の最短距離は、前記上面に形成された前記連通穴の開口と前記上面の縁部との間の最短距離よりも短い、
 請求項1~8のいずれか1つに記載の圧力センサ。
The covering member has a facing surface that forms the measurement space and faces the diaphragm, and an upper surface that is opposite to the facing surface,
The shortest distance between the opening of the communication hole formed in the top surface and the center of the top surface is shorter than the shortest distance between the opening of the communication hole formed in the top surface and the edge of the top surface. ,
The pressure sensor according to any one of claims 1-8.
 前記被覆部材は、前記ダイアフラムの厚み方向において前記基材よりも厚い、請求項1~9のいずれか1つに記載の圧力センサ。 The pressure sensor according to any one of claims 1 to 9, wherein the covering member is thicker than the base material in the thickness direction of the diaphragm.  前記被覆部材は、前記ダイアフラムの厚み方向において前記基材よりも薄い、請求項1~9のいずれか1つに記載の圧力センサ。 The pressure sensor according to any one of claims 1 to 9, wherein the covering member is thinner than the base material in the thickness direction of the diaphragm.
PCT/JP2022/025166 2021-09-10 2022-06-23 Pressure sensor Ceased WO2023037699A1 (en)

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