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WO2023035289A1 - Puce microfluidique dotée d'une surface de couche diélectrique plate, son procédé de préparation, et moule de fabrication - Google Patents

Puce microfluidique dotée d'une surface de couche diélectrique plate, son procédé de préparation, et moule de fabrication Download PDF

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WO2023035289A1
WO2023035289A1 PCT/CN2021/118384 CN2021118384W WO2023035289A1 WO 2023035289 A1 WO2023035289 A1 WO 2023035289A1 CN 2021118384 W CN2021118384 W CN 2021118384W WO 2023035289 A1 WO2023035289 A1 WO 2023035289A1
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dielectric layer
layer
mold
microfluidic chip
chip
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Chinese (zh)
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胡秋滨
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Shanghai Renxing Biotechnology Co Ltd
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Shanghai Renxing Biotechnology Co Ltd
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    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B01—PHYSICAL OR CHEMICAL PROCESSES OR APPARATUS IN GENERAL
    • B01L—CHEMICAL OR PHYSICAL LABORATORY APPARATUS FOR GENERAL USE
    • B01L3/00—Containers or dishes for laboratory use, e.g. laboratory glassware; Droppers
    • B01L3/50—Containers for the purpose of retaining a material to be analysed, e.g. test tubes
    • B01L3/502—Containers for the purpose of retaining a material to be analysed, e.g. test tubes with fluid transport, e.g. in multi-compartment structures
    • B01L3/5027—Containers for the purpose of retaining a material to be analysed, e.g. test tubes with fluid transport, e.g. in multi-compartment structures by integrated microfluidic structures, i.e. dimensions of channels and chambers are such that surface tension forces are important, e.g. lab-on-a-chip
    • B01L3/502707—Containers for the purpose of retaining a material to be analysed, e.g. test tubes with fluid transport, e.g. in multi-compartment structures by integrated microfluidic structures, i.e. dimensions of channels and chambers are such that surface tension forces are important, e.g. lab-on-a-chip characterised by the manufacture of the container or its components
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B01—PHYSICAL OR CHEMICAL PROCESSES OR APPARATUS IN GENERAL
    • B01L—CHEMICAL OR PHYSICAL LABORATORY APPARATUS FOR GENERAL USE
    • B01L3/00—Containers or dishes for laboratory use, e.g. laboratory glassware; Droppers
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B01—PHYSICAL OR CHEMICAL PROCESSES OR APPARATUS IN GENERAL
    • B01L—CHEMICAL OR PHYSICAL LABORATORY APPARATUS FOR GENERAL USE
    • B01L3/00—Containers or dishes for laboratory use, e.g. laboratory glassware; Droppers
    • B01L3/50—Containers for the purpose of retaining a material to be analysed, e.g. test tubes
    • B01L3/502—Containers for the purpose of retaining a material to be analysed, e.g. test tubes with fluid transport, e.g. in multi-compartment structures
    • B01L3/5027—Containers for the purpose of retaining a material to be analysed, e.g. test tubes with fluid transport, e.g. in multi-compartment structures by integrated microfluidic structures, i.e. dimensions of channels and chambers are such that surface tension forces are important, e.g. lab-on-a-chip
    • B01L3/50273—Containers for the purpose of retaining a material to be analysed, e.g. test tubes with fluid transport, e.g. in multi-compartment structures by integrated microfluidic structures, i.e. dimensions of channels and chambers are such that surface tension forces are important, e.g. lab-on-a-chip characterised by the means or forces applied to move the fluids
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B01—PHYSICAL OR CHEMICAL PROCESSES OR APPARATUS IN GENERAL
    • B01L—CHEMICAL OR PHYSICAL LABORATORY APPARATUS FOR GENERAL USE
    • B01L3/00—Containers or dishes for laboratory use, e.g. laboratory glassware; Droppers
    • B01L3/50—Containers for the purpose of retaining a material to be analysed, e.g. test tubes
    • B01L3/502—Containers for the purpose of retaining a material to be analysed, e.g. test tubes with fluid transport, e.g. in multi-compartment structures
    • B01L3/5027—Containers for the purpose of retaining a material to be analysed, e.g. test tubes with fluid transport, e.g. in multi-compartment structures by integrated microfluidic structures, i.e. dimensions of channels and chambers are such that surface tension forces are important, e.g. lab-on-a-chip
    • B01L3/502746—Containers for the purpose of retaining a material to be analysed, e.g. test tubes with fluid transport, e.g. in multi-compartment structures by integrated microfluidic structures, i.e. dimensions of channels and chambers are such that surface tension forces are important, e.g. lab-on-a-chip characterised by the means for controlling flow resistance, e.g. flow controllers, baffles
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B29—WORKING OF PLASTICS; WORKING OF SUBSTANCES IN A PLASTIC STATE IN GENERAL
    • B29C—SHAPING OR JOINING OF PLASTICS; SHAPING OF MATERIAL IN A PLASTIC STATE, NOT OTHERWISE PROVIDED FOR; AFTER-TREATMENT OF THE SHAPED PRODUCTS, e.g. REPAIRING
    • B29C45/00—Injection moulding, i.e. forcing the required volume of moulding material through a nozzle into a closed mould; Apparatus therefor
    • B29C45/14—Injection moulding, i.e. forcing the required volume of moulding material through a nozzle into a closed mould; Apparatus therefor incorporating preformed parts or layers, e.g. injection moulding around inserts or for coating articles
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B29—WORKING OF PLASTICS; WORKING OF SUBSTANCES IN A PLASTIC STATE IN GENERAL
    • B29C—SHAPING OR JOINING OF PLASTICS; SHAPING OF MATERIAL IN A PLASTIC STATE, NOT OTHERWISE PROVIDED FOR; AFTER-TREATMENT OF THE SHAPED PRODUCTS, e.g. REPAIRING
    • B29C45/00—Injection moulding, i.e. forcing the required volume of moulding material through a nozzle into a closed mould; Apparatus therefor
    • B29C45/16—Making multilayered or multicoloured articles
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B29—WORKING OF PLASTICS; WORKING OF SUBSTANCES IN A PLASTIC STATE IN GENERAL
    • B29C—SHAPING OR JOINING OF PLASTICS; SHAPING OF MATERIAL IN A PLASTIC STATE, NOT OTHERWISE PROVIDED FOR; AFTER-TREATMENT OF THE SHAPED PRODUCTS, e.g. REPAIRING
    • B29C45/00—Injection moulding, i.e. forcing the required volume of moulding material through a nozzle into a closed mould; Apparatus therefor
    • B29C45/17—Component parts, details or accessories; Auxiliary operations
    • B29C45/26—Moulds
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B01—PHYSICAL OR CHEMICAL PROCESSES OR APPARATUS IN GENERAL
    • B01L—CHEMICAL OR PHYSICAL LABORATORY APPARATUS FOR GENERAL USE
    • B01L2200/00—Solutions for specific problems relating to chemical or physical laboratory apparatus
    • B01L2200/12—Specific details about manufacturing devices
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B01—PHYSICAL OR CHEMICAL PROCESSES OR APPARATUS IN GENERAL
    • B01L—CHEMICAL OR PHYSICAL LABORATORY APPARATUS FOR GENERAL USE
    • B01L2300/00—Additional constructional details
    • B01L2300/06—Auxiliary integrated devices, integrated components
    • B01L2300/0627—Sensor or part of a sensor is integrated
    • B01L2300/0645—Electrodes
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B01—PHYSICAL OR CHEMICAL PROCESSES OR APPARATUS IN GENERAL
    • B01L—CHEMICAL OR PHYSICAL LABORATORY APPARATUS FOR GENERAL USE
    • B01L2300/00—Additional constructional details
    • B01L2300/08—Geometry, shape and general structure
    • B01L2300/0887—Laminated structure
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B01—PHYSICAL OR CHEMICAL PROCESSES OR APPARATUS IN GENERAL
    • B01L—CHEMICAL OR PHYSICAL LABORATORY APPARATUS FOR GENERAL USE
    • B01L2300/00—Additional constructional details
    • B01L2300/14—Means for pressure control
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B01—PHYSICAL OR CHEMICAL PROCESSES OR APPARATUS IN GENERAL
    • B01L—CHEMICAL OR PHYSICAL LABORATORY APPARATUS FOR GENERAL USE
    • B01L2300/00—Additional constructional details
    • B01L2300/16—Surface properties and coatings
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B01—PHYSICAL OR CHEMICAL PROCESSES OR APPARATUS IN GENERAL
    • B01L—CHEMICAL OR PHYSICAL LABORATORY APPARATUS FOR GENERAL USE
    • B01L2300/00—Additional constructional details
    • B01L2300/16—Surface properties and coatings
    • B01L2300/161—Control and use of surface tension forces, e.g. hydrophobic, hydrophilic
    • B01L2300/165—Specific details about hydrophobic, oleophobic surfaces
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B01—PHYSICAL OR CHEMICAL PROCESSES OR APPARATUS IN GENERAL
    • B01L—CHEMICAL OR PHYSICAL LABORATORY APPARATUS FOR GENERAL USE
    • B01L2400/00—Moving or stopping fluids
    • B01L2400/04—Moving fluids with specific forces or mechanical means
    • B01L2400/0403—Moving fluids with specific forces or mechanical means specific forces
    • B01L2400/0415—Moving fluids with specific forces or mechanical means specific forces electrical forces, e.g. electrokinetic
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B01—PHYSICAL OR CHEMICAL PROCESSES OR APPARATUS IN GENERAL
    • B01L—CHEMICAL OR PHYSICAL LABORATORY APPARATUS FOR GENERAL USE
    • B01L2400/00—Moving or stopping fluids
    • B01L2400/04—Moving fluids with specific forces or mechanical means
    • B01L2400/0403—Moving fluids with specific forces or mechanical means specific forces
    • B01L2400/0415—Moving fluids with specific forces or mechanical means specific forces electrical forces, e.g. electrokinetic
    • B01L2400/0424—Dielectrophoretic forces
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B29—WORKING OF PLASTICS; WORKING OF SUBSTANCES IN A PLASTIC STATE IN GENERAL
    • B29C—SHAPING OR JOINING OF PLASTICS; SHAPING OF MATERIAL IN A PLASTIC STATE, NOT OTHERWISE PROVIDED FOR; AFTER-TREATMENT OF THE SHAPED PRODUCTS, e.g. REPAIRING
    • B29C45/00—Injection moulding, i.e. forcing the required volume of moulding material through a nozzle into a closed mould; Apparatus therefor
    • B29C45/14—Injection moulding, i.e. forcing the required volume of moulding material through a nozzle into a closed mould; Apparatus therefor incorporating preformed parts or layers, e.g. injection moulding around inserts or for coating articles
    • B29C2045/14852—Injection moulding, i.e. forcing the required volume of moulding material through a nozzle into a closed mould; Apparatus therefor incorporating preformed parts or layers, e.g. injection moulding around inserts or for coating articles incorporating articles with a data carrier, e.g. chips

Definitions

  • the invention relates to the technical field of microfluidic chip manufacturing, in particular to a microfluidic chip with a flat dielectric layer surface.
  • Microfluidics is a technology that precisely controls and manipulates microscale fluids, especially submicron structures, and has been developed in the directions of DNA chips, lab-on-a-chip, micro-sampling technology, and micro-thermodynamics technology.
  • Traditional microfluidic chips use MEMS micromachining technology to integrate devices such as microvalves, micropumps, microelectrodes, and microsensors on the chip.
  • microchannels are etched on the surface of the chip, and the separation is completed through the flow of fluid in the channel. , transportation, testing and other analysis processes.
  • Microfluidic chips can be further divided into continuous microfluidic chips and digital microfluidic chips.
  • the control object of the continuous microfluidic chip is a continuous fluid, while the control object of the digital microfluidic chip is a micro droplet.
  • Digital microfluidic chip is an emerging technology that has developed rapidly in the past 10 years. It is based on controlling the movement of single or multiple discrete droplets on the chip plane. A voltage is applied to the electrodes on the chip, thereby changing the solid-liquid surface tension between the dielectric layer of the chip and the droplets on it, and realizing the flexible movement of the droplets on the plane.
  • the dielectric layer of existing digital microfluidic chip products is difficult to avoid the uneven surface of the dielectric layer caused by the protrusion of the lower electrode. The uneven surface of the dielectric layer will cause certain obstacles to the flexible movement of droplets, which will affect the performance and quality of digital microfluidic chip products.
  • the existing digital microfluidic chip processing methods are difficult to effectively planarize the chip surface.
  • the existing technology belongs to the “positive sequence processing” process.
  • “Positive sequence processing” is characterized by processing various structural layers of digital microfluidic technology chips stacked from the substrate, such as "wire layer”, “insulation layer”, “electrode layer”, and “dielectric layer”. Since the “dielectric layer” is always the last layer of the “positive sequence processing” process stack, its flatness will be affected by the accumulation of the various structural layers below.
  • the digital microfluidic chip prepared by the MEMS processing technology can be polished and smoothed by thinning and polishing the dielectric layer, the thinning and polishing process has certain limitations. When part of the dielectric layer is trapped in the gap between the electrode layers and the surface is lower than the surface of the electrode layer, the thinning and polishing process cannot be thinned to be completely flat. Moreover, polishing the prepared chip will not only increase the processing cost, but also reduce the yield rate, and will aggravate the problem of batch-to-batch variation to a certain extent. Although the digital microfluidic chip produced by PCB processing technology can alleviate the unevenness by filling the gap between the electrodes of the electrode layer, it cannot completely solve the problem of unevenness caused by "positive sequence processing".
  • a new type of flexible digital microfluidic chip adopts a new method of "reverse processing”.
  • This "reverse processing” method prepares the dielectric layer first, and then stacks the electrode layer, insulating layer, wire layer and other circuit structures in sequence. Since the first layer of “reverse processing” is a dielectric layer, structural unevenness caused by cumulative stacking is avoided.
  • the surface of the "reversed processing" digital microfluidic chip is flat but soft. Its soft nature makes the surface of this digital microfluidic chip easy to dent when it is packaged on a hard substrate. In the end, the packaged digital microfluidic chip will still have a certain degree of unevenness and cause the droplet to move poorly, affecting the performance and quality of the final product.
  • the present invention provides a new microfluidic chip and its preparation method.
  • the microfluidic chip with a flat dielectric layer is prepared by a high pressure molding injection molding process to ensure a smooth and flat surface of the dielectric layer.
  • a microfluidic chip with a flat dielectric layer comprising a dielectric layer and a circuit layer, droplets move on the other side of the dielectric layer opposite to the circuit layer, and the side of the dielectric layer on which the circuit layer is not formed for a flat surface.
  • X min /Y max ⁇ 100.
  • X min is the minimum value of the distance between electrodes on the chip surface.
  • Y max is the highest height value of electrode protrusion on the chip surface.
  • a circuit layer is printed or coated on the dielectric layer, that is, the dielectric layer is prepared first, and then the circuit layer is sequentially arranged on the dielectric layer.
  • a dielectric layer is provided on the circuit layer, that is, the circuit layer of the digital microfluidic technology chip is stacked from the substrate by using a positive sequence processing technology, and a dielectric layer is provided on the last circuit layer structure.
  • a dielectric layer with a smooth surface can be obtained by flattening the side of the chip dielectric layer on which the circuit layer is not formed using a manufacturing mold with a dielectric layer molding surface.
  • the dielectric layer is used as a base material for preparing a circuit layer, and a circuit layer including an electrode layer is formed on the dielectric layer by printing, printing or etching, and the circuit layer is used to generate a driver located at the The electric field of the micro-droplet on the side opposite to the circuit layer on the dielectric layer.
  • the technical scheme adopted in the present invention directly forms the required circuit layer on the dielectric layer, so the circuit layer and the dielectric layer can be fully contacted, so that the circuit layer, the dielectric layer, and the micro-liquid on the side opposite to the circuit layer on the dielectric layer The three form an equivalent plate capacitor.
  • the dielectric layer can effectively avoid the charge exchange between the circuit layer and the micro-droplet, which will cause electrolysis of the micro-droplet.
  • the dielectric layer attached to the circuit layer will also be uneven and there will be gaps between the electrodes, which will affect the flow of micro-droplets. move.
  • the technical scheme adopted in the present invention forms a dielectric layer first, and then forms a circuit layer on the dielectric layer, so that unevenness and gaps will not occur on the side of the dielectric layer opposite to the circuit layer, and the side of the dielectric layer is utilized
  • the flat surface carries the micro-droplets, so that the micro-droplets are not blocked when driven and move smoothly.
  • the circuit layer includes an electrode layer and a wire layer, and the electrode layer and the wire layer are in the same layer in the form of co-layering.
  • the electrode layer consists of multiple single electrodes designed on demand. When the micro-droplets are located on some single electrodes (hereinafter referred to as "upper electrodes"), the periphery of the micro-droplets will contact other single electrodes in several different directions (hereinafter referred to as “lower electrodes"). When the lower electrodes surrounding the droplet are not powered, the droplet will maintain its current position on the upper electrode.
  • the wire layer is composed of multiple wires designed according to the needs, connecting the single electrodes and the electrodes with the external voltage, so that the voltage can be applied to each single electrode.
  • the co-layer design enables full contact between the electrode layer and the wire layer, ensuring that each single electrode can have the voltage to drive micro-droplets, and the electrode layer and the wire layer can be formed at the same time, which reduces the difficulty of the process and reduces the production cost.
  • an electrode layer, an insulating layer and a wire layer are sequentially formed on the dielectric layer, and the electrode layer, the insulating layer and the wire layer together constitute a circuit layer and form a multilayer structure in a stacked form.
  • the common layer of electrode layer and wire layer is prone to short circuit, which affects the use of the chip, and it is difficult to realize the process. Therefore, the electrode layer and circuit layer are stacked and formed, and an insulating layer is added between the two layers. Two layers of isolation.
  • the electrode layer is formed on the dielectric layer, and the electrode layer is separated from the wire layer by the insulating layer, so that the micro-droplets on the side opposite to the circuit layer on the dielectric layer will not be affected by the wire layer when driven by the electrode layer, and can accurately Move in the direction of the applied voltage.
  • the thickness of the electrode layer is 0.1-100um
  • the thickness of the wire layer is 0.1-100um.
  • the thickness of the electrode layer is 0.1-100um, so that it can generate enough voltage to drive micro-droplets
  • the thickness of the wire layer is 0.1-100um, so that it can withstand enough external voltage and transmit it to the electrode layer.
  • the film is a film with a double-layer structure, wherein one layer is a functional film used as a dielectric layer, and the other layer is a release film.
  • the circuit layer is formed on the side opposite to the release film on the functional film used as the dielectric layer, and the release film can protect the functional film from being damaged during the process of forming the circuit layer.
  • a sufficiently thin dielectric layer can effectively reduce the initial voltage of dielectric wetting, increase the voltage difference between the two sides of the micro-droplet, make the micro-droplet more sensitive to the voltage drive, and improve the practical application significance of the chip, but At the same time, the thinner the dielectric layer, the weaker the strength, and it is easy to cause damage during the production process.
  • the double-layer structure film increases the overall thickness of the film, so that the circuit layer can be formed on the dielectric layer without causing damage to it, and overcomes the problem caused by the dielectric layer. Process defects caused by layers that are too thin.
  • the film is a film with a single-layer structure.
  • the film uses a material with a high dielectric constant, the voltage required to drive the micro-droplet to move can be effectively reduced, which is beneficial to the driving of the micro-droplet.
  • an over-thin dielectric layer is easily damaged during the formation of the circuit layer. Therefore, the selection of a single-layer high-dielectric film with an appropriate thickness can make the chip more sensitive while reducing the difficulty of the process and reducing the production cost.
  • the side of the dielectric layer on which the circuit layer is not formed is coated with a hydrophobic layer.
  • a hydrophobic layer On the side of the thin film of the dielectric layer that is not formed with the circuit layer, apply a hydrophobic layer, make the micro-droplets contact the hydrophobic layer, increase the contact angle of the micro-droplets on the chip surface, and when applying a voltage to the chip, The greater difference in contact angles on both sides of the micro-droplet is conducive to the generation of unbalanced forces inside the micro-droplet, thereby promoting the driving of the micro-droplet.
  • the contact surface between the micro-droplet and the chip surface becomes smaller, making the chip surface smoother and reducing the frictional resistance that needs to be overcome to drive the micro-droplet.
  • the technical solution adopted in the present invention provides a new type of process mold.
  • the process mold includes: a first mold and a second mold, and the first mold is connected with a first nozzle.
  • the second mold is provided with a flat dielectric layer molding surface.
  • the middle part forms a casting cavity
  • the side of the chip dielectric layer that is not formed with the circuit layer faces the dielectric layer molding surface of the second mold, and the injection molding liquid enters the casting from the first nozzle
  • the cavity is used to extrude the microfluidic chip, and the injection molding liquid is cooled and combined with the chip to form.
  • the side of the chip dielectric layer where the circuit layer is not formed is matched with the molding surface of the dielectric layer to form a flat surface of the chip dielectric layer.
  • the injection molding liquid should be a low-melting injection molding material, and its melting point should not be higher than 200°C. It is further preferred that the injection molding liquid is a resin material.
  • the molding process is as follows: the microfluidic chip is placed between the first and second molds, and the dielectric layer of the chip does not form the circuit
  • a detachable release film is provided on one side of the layer, the circuit layer of the chip faces the first mold, and the release film faces the second mold.
  • the first and second molds are separated, and the release film is separated from the dielectric layer of the chip to obtain the microfluidic chip with a flat dielectric layer of the present invention.
  • a microfluidic chip with a flat dielectric layer during the preparation process, the dielectric layer of the printed circuit layer is placed between the first and second molds, and the circuit layer faces the first mold , the dielectric layer faces the second mold. Lay the first and second molds together, and inject the injection molding liquid from the first nozzle. Using the high-pressure liquid resin injected from the first nozzle, the dielectric layer and the molding surface of the dielectric layer are bonded and evenly stressed, and finally a dielectric layer with a flat surface is obtained. In this process, through reasonable setting of the casting cavity of the first mold and the second mold, an injection-molded base or shell can be obtained.
  • the technical solution adopted in the present invention adopts a high-pressure injection molding process. While packaging, the molding surface of the dielectric layer and the dielectric layer of the chip The surfaces are matched and extruded so that the chip dielectric layer has a completely flat surface after the package is completed.
  • a chip preparation and packaging method provided by the present invention is applicable to any flexible digital microfluidic chip, which can complete the packaging process while ensuring the surface flatness of the dielectric layer, effectively improving the performance and quality of the product, and greatly Reduce the manufacturing cost of the chip.
  • FIG. 1 is a schematic structural diagram of a microfluidic chip in the prior art.
  • Fig. 2 is a schematic structural diagram of a microfluidic chip according to a specific embodiment of the present invention.
  • Fig. 3 is a schematic structural diagram of a microfluidic chip according to another specific embodiment of the present invention.
  • Fig. 4 is a process flow chart 1 of a specific embodiment of the present invention.
  • a microfluidic chip with a flat dielectric layer surface comprising a dielectric layer 1 and a circuit layer 2 printed on the dielectric layer 1, the droplet 8 moves on the other side of the dielectric layer 1 relative to the circuit layer 2,
  • the side of the dielectric layer 1 on which the circuit layer is not formed is a flat surface.
  • the forming method of the flat surface is to flatten the side of the chip dielectric layer on which the circuit layer is not formed by using a mold with a dielectric layer forming surface to obtain a dielectric layer with a flat surface.
  • the dielectric layer 1 is used as the base material for preparing the circuit layer 2, and the circuit layer 2 including the electrode layer is formed on the dielectric layer 1 by etching, and the circuit layer 2 is used to drive the Droplet 8 on the side opposite to the circuit layer on 1.
  • a hydrophobic layer 5 on the side of the dielectric layer where the circuit layer is not formed.
  • a microfluidic chip with a flat dielectric layer comprising a circuit layer 2 and a dielectric layer 1 disposed on the circuit layer 2, the side of the dielectric layer 1 where the circuit layer is not formed is flat noodle.
  • the forming method of the flat surface is to flatten the side of the chip dielectric layer where the circuit layer is not formed with a production mold with a dielectric layer molding surface to obtain a dielectric layer with a smooth surface.
  • Embodiment 3 is a diagrammatic representation of Embodiment 3
  • a microfluidic chip comprising a dielectric layer 1 and a circuit layer 2 arranged on the dielectric layer 1, the side of the dielectric layer 1 on which the circuit layer is not formed is a flat surface.
  • the outer side of the dielectric layer 1 is coated with a hydrophobic layer 5 .
  • the circuit layer 2 includes an electrode layer, an insulating layer, and a wire layer sequentially formed on the dielectric layer 1 , and the electrode layer, the insulating layer, and the wire layer together constitute the circuit layer 2 and are formed in a stacked multilayer structure.
  • the side of the chip dielectric layer 1 where the circuit layer is not formed is bonded to the molding surface 44 of the dielectric layer, and the liquid resin flows from the second side on the same side as the circuit layer 2.
  • a nozzle 43 enters the casting cavity and fills the casting cavity, and squeezes the microfluidic chip to make it close to the molding surface 44 of the dielectric layer.
  • a resin base is formed on one side of the circuit layer to complete the packaging, and the dielectric layer has a flat surface.
  • a mold for making a microfluidic chip with a flat dielectric layer comprising: a first mold 41 and a second mold 42 , the first mold 41 is connected with a first nozzle 43 .
  • the second mold 42 is provided with a dielectric layer forming surface 44 .
  • the middle part forms a casting cavity, and the side of the dielectric layer 1 where the circuit layer is not formed faces the dielectric layer forming surface 44 of the second mold 42, and the injection molding solution 6 comes from
  • the first nozzle 43 enters the casting cavity to squeeze the microfluidic chip, and the dielectric layer molding surface 44 is matched with the side of the dielectric layer 1 where the circuit layer is not formed.
  • a mold for making a microfluidic chip with a flat dielectric layer comprising: a first mold 41 and a second mold 42, the first mold 41 is connected with a first nozzle 43, and the first mold 41 is provided with a base
  • the space cavity 411 , the second mold 42 is provided with a dielectric layer molding surface 44 .
  • the middle part forms a casting cavity in which the microfluidic chip is placed, and the side of the dielectric layer 1 where the circuit layer is not formed faces the dielectric layer of the second mold 42
  • the injection molding liquid 6 enters the casting cavity from the first nozzle 43 to extrude the microfluidic chip.
  • the dielectric layer molding surface 44 is matched with the side of the dielectric layer 1 where the circuit layer is not formed to form a flat surface. After cooling, the first mold 41 and the second mold 42 are separated, and the outer side of the circuit layer 2 forms the injection base 7 .
  • the microfluidic chip with a flat dielectric layer of the present invention can be obtained.
  • a release film 3 is provided on the side of the dielectric layer 1 where the circuit layer is not formed before injection molding.
  • the technical scheme adopted in the present invention squeezes the microfluidic chip located in the process mold through the injection molding liquid, so that the dielectric layer of the microfluidic chip is not formed on the side of the circuit layer.
  • a flat surface is formed under the cooperation of the forming surface of the layer.

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  • Micromachines (AREA)

Abstract

L'invention concerne une puce microfluidique dotée d'une surface de couche diélectrique plate (1), comprenant une couche diélectrique (1) et une couche de circuit (2). Le côté de la couche diélectrique (1) sur lequel la couche de circuit (2) n'est pas formée est une surface plate. Une surface de moulage de couche diélectrique (44) est utilisée pour aplatir la surface de la couche diélectrique (1) de manière à garantir que la surface de la couche diélectrique (1) est plate, ce qui permet d'augmenter efficacement la qualité du produit de puces microfluidiques numériques.
PCT/CN2021/118384 2021-09-13 2021-09-15 Puce microfluidique dotée d'une surface de couche diélectrique plate, son procédé de préparation, et moule de fabrication Ceased WO2023035289A1 (fr)

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PCT/CN2021/118384 Ceased WO2023035289A1 (fr) 2021-09-13 2021-09-15 Puce microfluidique dotée d'une surface de couche diélectrique plate, son procédé de préparation, et moule de fabrication
PCT/CN2022/118431 Ceased WO2023036333A1 (fr) 2021-09-13 2022-09-13 Puce microfluidique dotée d'une surface de couche diélectrique plate, et procédé de préparation et moule de fabrication

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