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WO2023032896A1 - Puce à microcanaux - Google Patents

Puce à microcanaux Download PDF

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Publication number
WO2023032896A1
WO2023032896A1 PCT/JP2022/032367 JP2022032367W WO2023032896A1 WO 2023032896 A1 WO2023032896 A1 WO 2023032896A1 JP 2022032367 W JP2022032367 W JP 2022032367W WO 2023032896 A1 WO2023032896 A1 WO 2023032896A1
Authority
WO
WIPO (PCT)
Prior art keywords
resin substrate
mold
resin
less
microchannel chip
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Ceased
Application number
PCT/JP2022/032367
Other languages
English (en)
Japanese (ja)
Inventor
康介 薬丸
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Sumitomo Bakelite Co Ltd
Original Assignee
Sumitomo Bakelite Co Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Sumitomo Bakelite Co Ltd filed Critical Sumitomo Bakelite Co Ltd
Priority to EP22864479.5A priority Critical patent/EP4397618A4/fr
Priority to US18/685,935 priority patent/US20240390891A1/en
Priority to JP2023516501A priority patent/JP7416331B2/ja
Publication of WO2023032896A1 publication Critical patent/WO2023032896A1/fr
Anticipated expiration legal-status Critical
Ceased legal-status Critical Current

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Classifications

    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B01—PHYSICAL OR CHEMICAL PROCESSES OR APPARATUS IN GENERAL
    • B01L—CHEMICAL OR PHYSICAL LABORATORY APPARATUS FOR GENERAL USE
    • B01L3/00—Containers or dishes for laboratory use, e.g. laboratory glassware; Droppers
    • B01L3/50—Containers for the purpose of retaining a material to be analysed, e.g. test tubes
    • B01L3/502—Containers for the purpose of retaining a material to be analysed, e.g. test tubes with fluid transport, e.g. in multi-compartment structures
    • B01L3/5027—Containers for the purpose of retaining a material to be analysed, e.g. test tubes with fluid transport, e.g. in multi-compartment structures by integrated microfluidic structures, i.e. dimensions of channels and chambers are such that surface tension forces are important, e.g. lab-on-a-chip
    • B01L3/502707—Containers for the purpose of retaining a material to be analysed, e.g. test tubes with fluid transport, e.g. in multi-compartment structures by integrated microfluidic structures, i.e. dimensions of channels and chambers are such that surface tension forces are important, e.g. lab-on-a-chip characterised by the manufacture of the container or its components
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B29—WORKING OF PLASTICS; WORKING OF SUBSTANCES IN A PLASTIC STATE IN GENERAL
    • B29C—SHAPING OR JOINING OF PLASTICS; SHAPING OF MATERIAL IN A PLASTIC STATE, NOT OTHERWISE PROVIDED FOR; AFTER-TREATMENT OF THE SHAPED PRODUCTS, e.g. REPAIRING
    • B29C33/00—Moulds or cores; Details thereof or accessories therefor
    • B29C33/38—Moulds or cores; Details thereof or accessories therefor characterised by the material or the manufacturing process
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B29—WORKING OF PLASTICS; WORKING OF SUBSTANCES IN A PLASTIC STATE IN GENERAL
    • B29C—SHAPING OR JOINING OF PLASTICS; SHAPING OF MATERIAL IN A PLASTIC STATE, NOT OTHERWISE PROVIDED FOR; AFTER-TREATMENT OF THE SHAPED PRODUCTS, e.g. REPAIRING
    • B29C33/00—Moulds or cores; Details thereof or accessories therefor
    • B29C33/42—Moulds or cores; Details thereof or accessories therefor characterised by the shape of the moulding surface, e.g. ribs or grooves
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B29—WORKING OF PLASTICS; WORKING OF SUBSTANCES IN A PLASTIC STATE IN GENERAL
    • B29C—SHAPING OR JOINING OF PLASTICS; SHAPING OF MATERIAL IN A PLASTIC STATE, NOT OTHERWISE PROVIDED FOR; AFTER-TREATMENT OF THE SHAPED PRODUCTS, e.g. REPAIRING
    • B29C45/00—Injection moulding, i.e. forcing the required volume of moulding material through a nozzle into a closed mould; Apparatus therefor
    • B29C45/17—Component parts, details or accessories; Auxiliary operations
    • B29C45/26—Moulds
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B01—PHYSICAL OR CHEMICAL PROCESSES OR APPARATUS IN GENERAL
    • B01L—CHEMICAL OR PHYSICAL LABORATORY APPARATUS FOR GENERAL USE
    • B01L2200/00—Solutions for specific problems relating to chemical or physical laboratory apparatus
    • B01L2200/06—Fluid handling related problems
    • B01L2200/0684—Venting, avoiding backpressure, avoid gas bubbles
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B01—PHYSICAL OR CHEMICAL PROCESSES OR APPARATUS IN GENERAL
    • B01L—CHEMICAL OR PHYSICAL LABORATORY APPARATUS FOR GENERAL USE
    • B01L2300/00—Additional constructional details
    • B01L2300/04—Closures and closing means
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B01—PHYSICAL OR CHEMICAL PROCESSES OR APPARATUS IN GENERAL
    • B01L—CHEMICAL OR PHYSICAL LABORATORY APPARATUS FOR GENERAL USE
    • B01L2300/00—Additional constructional details
    • B01L2300/08—Geometry, shape and general structure
    • B01L2300/0809—Geometry, shape and general structure rectangular shaped
    • B01L2300/0816—Cards, e.g. flat sample carriers usually with flow in two horizontal directions
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B29—WORKING OF PLASTICS; WORKING OF SUBSTANCES IN A PLASTIC STATE IN GENERAL
    • B29C—SHAPING OR JOINING OF PLASTICS; SHAPING OF MATERIAL IN A PLASTIC STATE, NOT OTHERWISE PROVIDED FOR; AFTER-TREATMENT OF THE SHAPED PRODUCTS, e.g. REPAIRING
    • B29C45/00—Injection moulding, i.e. forcing the required volume of moulding material through a nozzle into a closed mould; Apparatus therefor
    • B29C45/0053—Injection moulding, i.e. forcing the required volume of moulding material through a nozzle into a closed mould; Apparatus therefor combined with a final operation, e.g. shaping
    • B29C45/0055—Shaping
    • B29C2045/0058—Shaping removing material
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B29—WORKING OF PLASTICS; WORKING OF SUBSTANCES IN A PLASTIC STATE IN GENERAL
    • B29L—INDEXING SCHEME ASSOCIATED WITH SUBCLASS B29C, RELATING TO PARTICULAR ARTICLES
    • B29L2031/00—Other particular articles
    • B29L2031/756—Microarticles, nanoarticles

Definitions

  • the present invention relates to a microchannel chip.
  • This application claims priority based on Japanese Patent Application No. 2021-141725 filed in Japan on August 31, 2021, the contents of which are incorporated herein.
  • microfluidic chips using microcontainers called micromixers or microreactors.
  • a microchannel chip is provided with a plurality of microchannels (microcavities connected to microchannels). By merging multiple types of fluids in the microcavity through the microchannels, the multiple types of fluids are mixed, or a chemical reaction is caused along with the mixing.
  • Patent Document 1 discloses a resin substrate having a channel groove on one surface and a resin substrate bonded to the resin substrate so as to cover the channel groove.
  • a dressing is disclosed.
  • a resin substrate having channel grooves can be formed, for example, by injection molding using a mold. By doing so, a microchannel chip can be manufactured at low cost.
  • a mold formed by direct engraving usually has rounded corners, and the corners of a resin substrate manufactured using such a mold may also be rounded. If the corners of the resin substrate (especially the corners of the edges of the channel grooves) are rounded, when the coating material is joined, minute spaces remain at the sites, which may cause air bubbles to occur in the channels. There was a possibility that it would be lost.
  • the present invention has been made in view of the above-mentioned problems, and makes it possible to manufacture a microchannel chip at low cost by forming a resin substrate having channel grooves using a die by direct engraving, while making it difficult for air bubbles to occur in the channels.
  • the challenge is to
  • the present invention employs the following configuration. [1].
  • the resin substrate is heated to (T1-20° C.) or more and T1 or less.
  • the microchannel chip according to [1] which is formed by
  • the resin substrate is provided with a molten resin heated to (Tg+130° C.) or more (Tg+160° C.) or less in a cavity space formed in the mold.
  • a microchannel chip at low cost by forming a resin substrate having channel grooves using a die by direct carving, while making it difficult for air bubbles to occur in the channels.
  • FIG. 1 is a schematic cross-sectional view of a microchannel chip according to this embodiment
  • FIG. 1 is a schematic cross-sectional view of a mold for manufacturing a microchannel chip according to this embodiment
  • FIG. FIG. 4 is a schematic cross-sectional view showing one aspect of the manufacturing process of the mold for manufacturing the microchannel chip according to the present embodiment.
  • FIG. 4 is a schematic cross-sectional view showing one aspect of the molding process of the microchannel chip according to the present embodiment.
  • FIG. 4 is a schematic cross-sectional view showing one aspect of the molding process of the microchannel chip according to the present embodiment.
  • FIG. 4 is a schematic cross-sectional view showing one aspect of the assembly process of the microchannel chip according to the present embodiment.
  • a microchannel chip 1 of the present embodiment includes a resin substrate 2 and a coating material 3 bonded to the resin substrate 2, as shown in FIG.
  • the resin substrate 2 can be made of a resin selected from the group consisting of polycarbonate, cycloolefin copolymer, cycloolefin polymer, polymethylpentene, polystyrene, polymethyl(meth)acrylate, and polyethylene terephthalate, for example.
  • the resin substrate 2 has a channel groove 21 on one surface (in this embodiment, the bonding surface 2a with the coating material 3).
  • the number of flow channel grooves 21 may be one or may be plural. When a plurality of channel grooves 21 are provided, those channel grooves 21 may be provided in series or in parallel. Also, the channel groove 21 may have a branch. For example, the channel groove 21 may have a width of 1 mm or less and a depth of 0.01 mm or more and 0.5 mm or less. In this way, experiments and the like can be performed on a minute scale.
  • the external shape and size of the resin substrate 2 can be appropriately set in consideration of handling properties, suitability for analysis (applicability to analysis methods and analysis equipment), and the like.
  • one side is preferably 10 mm or more and 200 mm or less, more preferably 10 mm or more and 150 mm or less.
  • the outer shape of the resin substrate 2 may be other polygonal, circular, elliptical, or the like.
  • the covering material 3 can be composed of, for example, a resin film or a resin plate. A resin having excellent heat resistance and transparency can be appropriately selected as the resin forming the coating material 3 .
  • the covering material 3 can be made of a resin selected from the group consisting of polycarbonate, cycloolefin copolymer, cycloolefin polymer, polymethylpentene, polystyrene, polymethyl(meth)acrylate, and polyethylene terephthalate, for example.
  • the resin forming the coating material 3 may be the same resin as the resin forming the resin substrate 2, or may be a different resin.
  • the thickness of the covering material 3 is not particularly limited, it can be, for example, 0.01 mm or more and 1 mm or less. When the thickness is 0.01 mm or more, wrinkles or the like are less likely to occur during bonding, and the channel groove 21 can be sufficiently sealed. In addition, since the thickness is 1 mm or less, it is possible to obtain good conformability to the unevenness of the resin substrate 2 .
  • the resin substrate 2 and the coating material 3 are arranged so that the bonding surface 2a of the resin substrate 2 (the surface on which the flow channel 21 is formed) and the bonding surface 3a, which is one surface of the coating material 3, are in contact with each other. Laminated.
  • the coating material 3 is bonded to the resin substrate 2 so as to cover the flow channel 21 .
  • a micro-channel composed of the channel groove 21 is formed between the resin substrate 2 and the coating material 3 .
  • Such a microchannel chip 1 can be suitably used as biochips such as nucleic acid chips, protein chips, antibody chips, aptamer chips, and glycoprotein chips, or microanalysis chips for various chemical analyses. can.
  • the corner 2c (see FIG. 1) formed at the boundary between the bonding surface 2a with the coating material 3 and the inner side surface 2b that defines the channel groove 21 in the resin substrate 2. ) is R5 ⁇ m or less. If the roundness of the corner 2c exceeds R5 ⁇ m, when the coating material 3 is joined to the resin substrate 2, a minute space remains in the corner 2c, which causes air bubbles to be generated in the flow path. there is a possibility.
  • the roundness of the corners 2 c to R5 ⁇ m or less as in the present embodiment, when the coating material 3 is joined to the resin substrate 2 , the resin substrate 2 and the coating including the edges of the flow channel grooves 21 can be separated. The material 3 can be tightly adhered. As a result, almost no minute space remains between the resin substrate 2 and the coating material 3, and in the finally obtained microchannel chip 1, it is possible to make it difficult for air bubbles to occur in the channel.
  • the roundness of the corner 2c at the boundary between the joint surface 2a with the coating material 3 and the inner side surface 2b defining the channel groove 21 is preferably R4.8 ⁇ m or less, more preferably R4.6 ⁇ m or less. , R4.4 ⁇ m or less. According to these, it is possible to make it more difficult for air bubbles to be generated in the flow path.
  • the microchannel chip 1 of this embodiment can be manufactured using a mold 5 for injection molding and a heat press.
  • the resin substrate 2 is produced using the mold 5 (molding process), and the resin substrate 2 and the coating material 3 separately produced are thermocompression bonded using a hot press (assembly process). be able to.
  • the microchannel chip 1 can also be manufactured by bonding the resin substrate 2 and the coating material 3 together with an adhesive, an adhesive, an adhesive film, or the like.
  • the mold 5 includes a first mold 5A having a concave portion 51 and a second mold 5B having a ridge portion 52, as shown in FIG.
  • the concave portion 51 corresponds to the outer shape of the resin substrate 2 .
  • the ridges 52 correspond to the shape of the inner surface of the channel groove 21 .
  • the mold 5 used for injection molding of the resin substrate 2 is formed by direct carving instead of electroforming.
  • Direct carving is a processing method for cutting a metal block to produce a mold, and can be performed using, for example, an NC (numerical control) milling machine.
  • the mold 5 here, in particular, the second mold 5B having the protruding portion 52
  • the corner 5f between the protruding portion 52 and the outer side surface 5e remains rounded.
  • the roundness of the corner 5f may be, for example, R10 ⁇ m or more, typically R20 ⁇ m or more.
  • the cornering process is performed to further cut so that the shape is close to a right angle.
  • the cornering process can be performed using the cornering tool 7 .
  • the roundness of the corner 5f between the second inner surface 5d and the outer surface 5e of the ridge portion 52 is set to, for example, R5 ⁇ m or less.
  • the roundness of the corner 5f is preferably R4.8 ⁇ m or less, more preferably R4.6 ⁇ m or less, and even more preferably R4.4 ⁇ m or less.
  • the resin substrate 2 having the flow channel 21 on one surface is formed (molding step).
  • the first mold 5A and the second mold 5B are clamped, and the molten resin is injected from the gate 53 into the cavity space C formed between them.
  • the temperature of the mold 5 used in the molding process is not particularly limited. (T1-20°C) or higher (T1°C) or lower, more preferably (T1-15°C) or higher (T1°C) or lower, and (T1-10°C) or higher (T1°C) or lower. is more preferred. According to this configuration, from the viewpoint of optimizing the molding conditions with respect to the mold temperature, it is possible to make it more difficult to generate air bubbles.
  • the deflection temperature under load can be measured according to JIS K 7191-1 A method.
  • the temperature of the mold 5 is less than the above lower limit, the temperature of the molten resin will drop sharply after injection, resulting in a decrease in fluidity and a loss of conformability to the mold 5 .
  • the temperature of the mold 5 exceeds the above upper limit, energy consumption increases and cooling takes time, which may lead to a decrease in productivity. Therefore, by setting the mold temperature within the above range, the resin substrate 2 having a desired shape can be obtained with high productivity.
  • the temperature of the molten resin injected into the mold 5 in the molding process is not particularly limited. It is preferably (Tg + 160°C) or less, more preferably (Tg + 130°C) or more and (Tg + 155°C) or less, and further preferably (Tg + 130°C) or more (Tg + 150°C) or less. According to this configuration, from the viewpoint of optimizing the molding conditions related to the resin temperature, it is possible to make it more difficult to generate air bubbles.
  • the temperature of the molten resin is less than the above lower limit, the fluidity may be insufficient and the followability to the mold 5 may be impaired.
  • the temperature of the molten resin exceeds the above upper limit, the effect of improving the fluidity is limited in spite of the increase in energy consumption. Therefore, by setting the resin temperature within the above range, the resin substrate 2 having a desired shape can be obtained with high productivity.
  • the injection pressure when injecting the molten resin into the mold 5 in the molding process is not particularly limited, but is preferably 90 MPa or more and 120 MPa or less, more preferably 95 MPa or more and 120 MPa or less, and 100 MPa or more and 120 MPa or less. is more preferable. According to this configuration, from the viewpoint of optimizing the molding conditions related to the injection pressure, it is possible to make it more difficult for air bubbles to occur.
  • the injection pressure of the molten resin is less than the above lower limit, the molten resin may not spread throughout the cavity space C, and the followability to the mold 5 may be impaired.
  • the injection pressure of the molten resin exceeds the above upper limit, the effect of improving followability to the mold 5 is limited in spite of the increase in energy consumption. Therefore, by setting the injection pressure of the molten resin within the above range, the resin substrate 2 having a desired shape can be obtained with high productivity.
  • the channel groove 21 having an outer shape corresponding to the concave portion 51 of the first mold 5A and an inner surface corresponding to the protruding portion 52 of the second mold 5B is opened on one side. is obtained.
  • the mold 5 that has been subjected to cornering processing in addition to normal direct carving processing the boundary between the joint surface 2a with the coating material 3 and the inner side surface 2b that defines the flow channel groove 21 It is possible to obtain the resin substrate 2 in which the roundness of the corners 2c (see FIG. 1) formed at the edges is suppressed to R5 ⁇ m or less.
  • the resin substrate 2 obtained in the molding process described above and the coating material 3 prepared separately are laminated and joined together (assembly process).
  • the coating material 3 is laminated on the resin substrate 2 so as to cover the flow channel groove 21 .
  • the laminated body is applied to a hot press, and the resin substrate 2 and the coating material 3 are bonded by thermocompression bonding.
  • the hot press machine includes a first block and a second block for sandwiching and press-bonding a laminate of a resin substrate 2 and a covering material 3 between the first block and the first block.
  • the first block and second block each have a built-in heater.
  • the roundness of the corner 2c at the boundary between the joint surface 2a and the inner side surface 2b of the channel groove 21 is suppressed to R5 ⁇ m or less. Therefore, when the resin substrate 2 and the coating material 3 are joined together, the resin substrate 2 and the coating material 3 including the edges of the channel grooves 21 are in close contact with each other. As a result, almost no minute space remains between the resin substrate 2 and the coating material 3 (particularly, the edge portion of the channel groove 21). Therefore, it is possible to make it difficult for air bubbles to be generated in the channels of the microchannel chip 1 .
  • microchannel chip has been described in detail by showing specific embodiments, the present invention is not limited thereto.
  • the embodiments disclosed in this specification are examples in all respects, and can be modified as appropriate without departing from the scope of the present disclosure.

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  • Chemical & Material Sciences (AREA)
  • Health & Medical Sciences (AREA)
  • Engineering & Computer Science (AREA)
  • Mechanical Engineering (AREA)
  • General Health & Medical Sciences (AREA)
  • Analytical Chemistry (AREA)
  • Dispersion Chemistry (AREA)
  • Hematology (AREA)
  • Clinical Laboratory Science (AREA)
  • Chemical Kinetics & Catalysis (AREA)
  • Manufacturing & Machinery (AREA)
  • Moulds For Moulding Plastics Or The Like (AREA)
  • Injection Moulding Of Plastics Or The Like (AREA)
  • Micromachines (AREA)

Abstract

Une puce à microcanaux (1) comprend : un substrat de résine (2) fabriqué à l'aide d'un moule formé par usinage par sculpture directe, et ayant une rainure de canal (21) sur une surface de celui-ci ; et un matériau de recouvrement (3) lié au substrat de résine (2) de manière à recouvrir la rainure de canal (21). Dans le substrat de résine (2), la rondeur d'une partie d'angle (2c) formée à une limite entre une surface liée (2a) au matériau de recouvrement (3) et une surface latérale interne (2b) définissant la rainure de canal (21) est inférieure ou égale à R 5 µm.
PCT/JP2022/032367 2021-08-31 2022-08-29 Puce à microcanaux Ceased WO2023032896A1 (fr)

Priority Applications (3)

Application Number Priority Date Filing Date Title
EP22864479.5A EP4397618A4 (fr) 2021-08-31 2022-08-29 Puce à microcanaux
US18/685,935 US20240390891A1 (en) 2021-08-31 2022-08-29 Microchannel chip
JP2023516501A JP7416331B2 (ja) 2021-08-31 2022-08-29 マイクロ流路チップ及びマイクロ流路チップの製造方法

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
JP2021-141725 2021-08-31
JP2021141725 2021-08-31

Publications (1)

Publication Number Publication Date
WO2023032896A1 true WO2023032896A1 (fr) 2023-03-09

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Application Number Title Priority Date Filing Date
PCT/JP2022/032367 Ceased WO2023032896A1 (fr) 2021-08-31 2022-08-29 Puce à microcanaux

Country Status (4)

Country Link
US (1) US20240390891A1 (fr)
EP (1) EP4397618A4 (fr)
JP (1) JP7416331B2 (fr)
WO (1) WO2023032896A1 (fr)

Citations (6)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPH07125206A (ja) * 1993-06-14 1995-05-16 Ricoh Co Ltd サーマルインクジェットヘッド
JPH0957847A (ja) * 1995-08-21 1997-03-04 Riken Vinyl Kogyo Kk エンボス加工フィルムの製造方法およびこれに使用するための装置
JP2009019127A (ja) * 2007-07-12 2009-01-29 Teijin Ltd 光ディスク基板および光ディスク
JP2013022534A (ja) * 2011-07-22 2013-02-04 Ulvac Seimaku Kk マイクロ流路基板およびその製造方法
JP2015199340A (ja) 2014-03-31 2015-11-12 住友ベークライト株式会社 樹脂製マイクロ流路デバイスの製造方法、およびマイクロ流路デバイス製造装置
JP2021141725A (ja) 2020-03-05 2021-09-16 ニシム電子工業株式会社 太陽光発電電力制御装置

Family Cites Families (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US11000975B2 (en) * 2016-10-13 2021-05-11 Purdue Research Foundation Methods of making hydrophobic contoured surfaces and hydrophobic contoured surfaces and devices made therefrom
JP2021099237A (ja) * 2019-12-20 2021-07-01 住友ベークライト株式会社 マイクロ流路チップ
JP2021109158A (ja) * 2020-01-14 2021-08-02 住友ベークライト株式会社 マイクロ流路チップ

Patent Citations (6)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPH07125206A (ja) * 1993-06-14 1995-05-16 Ricoh Co Ltd サーマルインクジェットヘッド
JPH0957847A (ja) * 1995-08-21 1997-03-04 Riken Vinyl Kogyo Kk エンボス加工フィルムの製造方法およびこれに使用するための装置
JP2009019127A (ja) * 2007-07-12 2009-01-29 Teijin Ltd 光ディスク基板および光ディスク
JP2013022534A (ja) * 2011-07-22 2013-02-04 Ulvac Seimaku Kk マイクロ流路基板およびその製造方法
JP2015199340A (ja) 2014-03-31 2015-11-12 住友ベークライト株式会社 樹脂製マイクロ流路デバイスの製造方法、およびマイクロ流路デバイス製造装置
JP2021141725A (ja) 2020-03-05 2021-09-16 ニシム電子工業株式会社 太陽光発電電力制御装置

Non-Patent Citations (1)

* Cited by examiner, † Cited by third party
Title
See also references of EP4397618A4

Also Published As

Publication number Publication date
US20240390891A1 (en) 2024-11-28
EP4397618A4 (fr) 2025-09-10
JPWO2023032896A1 (fr) 2023-03-09
JP7416331B2 (ja) 2024-01-17
EP4397618A1 (fr) 2024-07-10

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