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WO2023028088A3 - Copper treatment additive - Google Patents

Copper treatment additive Download PDF

Info

Publication number
WO2023028088A3
WO2023028088A3 PCT/US2022/041276 US2022041276W WO2023028088A3 WO 2023028088 A3 WO2023028088 A3 WO 2023028088A3 US 2022041276 W US2022041276 W US 2022041276W WO 2023028088 A3 WO2023028088 A3 WO 2023028088A3
Authority
WO
WIPO (PCT)
Prior art keywords
copper
treatment additive
copper treatment
solution
coating
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Ceased
Application number
PCT/US2022/041276
Other languages
French (fr)
Other versions
WO2023028088A2 (en
Inventor
Rod SNIADECKI
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Acs Enterprises LLC
Original Assignee
Acs Enterprises LLC
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Acs Enterprises LLC filed Critical Acs Enterprises LLC
Publication of WO2023028088A2 publication Critical patent/WO2023028088A2/en
Anticipated expiration legal-status Critical
Publication of WO2023028088A3 publication Critical patent/WO2023028088A3/en
Ceased legal-status Critical Current

Links

Classifications

    • CCHEMISTRY; METALLURGY
    • C23COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
    • C23CCOATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THE SURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL
    • C23C2/00Hot-dipping or immersion processes for applying the coating material in the molten state without affecting the shape; Apparatus therefor
    • C23C2/34Hot-dipping or immersion processes for applying the coating material in the molten state without affecting the shape; Apparatus therefor characterised by the shape of the material to be treated
    • C23C2/36Elongated material
    • C23C2/38Wires; Tubes
    • CCHEMISTRY; METALLURGY
    • C22METALLURGY; FERROUS OR NON-FERROUS ALLOYS; TREATMENT OF ALLOYS OR NON-FERROUS METALS
    • C22FCHANGING THE PHYSICAL STRUCTURE OF NON-FERROUS METALS AND NON-FERROUS ALLOYS
    • C22F1/00Changing the physical structure of non-ferrous metals or alloys by heat treatment or by hot or cold working
    • C22F1/08Changing the physical structure of non-ferrous metals or alloys by heat treatment or by hot or cold working of copper or alloys based thereon
    • CCHEMISTRY; METALLURGY
    • C23COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
    • C23CCOATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THE SURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL
    • C23C2/00Hot-dipping or immersion processes for applying the coating material in the molten state without affecting the shape; Apparatus therefor
    • C23C2/04Hot-dipping or immersion processes for applying the coating material in the molten state without affecting the shape; Apparatus therefor characterised by the coating material
    • BPERFORMING OPERATIONS; TRANSPORTING
    • B21MECHANICAL METAL-WORKING WITHOUT ESSENTIALLY REMOVING MATERIAL; PUNCHING METAL
    • B21CMANUFACTURE OF METAL SHEETS, WIRE, RODS, TUBES, PROFILES OR LIKE SEMI-MANUFACTURED PRODUCTS OTHERWISE THAN BY ROLLING; AUXILIARY OPERATIONS USED IN CONNECTION WITH METAL-WORKING WITHOUT ESSENTIALLY REMOVING MATERIAL
    • B21C1/00Manufacture of metal sheets, wire, rods, tubes or like semi-manufactured products by drawing
    • B21C1/02Drawing metal wire or like flexible metallic material by drawing machines or apparatus in which the drawing action is effected by drums
    • BPERFORMING OPERATIONS; TRANSPORTING
    • B21MECHANICAL METAL-WORKING WITHOUT ESSENTIALLY REMOVING MATERIAL; PUNCHING METAL
    • B21CMANUFACTURE OF METAL SHEETS, WIRE, RODS, TUBES, PROFILES OR LIKE SEMI-MANUFACTURED PRODUCTS OTHERWISE THAN BY ROLLING; AUXILIARY OPERATIONS USED IN CONNECTION WITH METAL-WORKING WITHOUT ESSENTIALLY REMOVING MATERIAL
    • B21C9/00Cooling, heating or lubricating drawing material

Landscapes

  • Chemical & Material Sciences (AREA)
  • Engineering & Computer Science (AREA)
  • Materials Engineering (AREA)
  • Mechanical Engineering (AREA)
  • Metallurgy (AREA)
  • Organic Chemistry (AREA)
  • Chemical Kinetics & Catalysis (AREA)
  • Physics & Mathematics (AREA)
  • Thermal Sciences (AREA)
  • Crystallography & Structural Chemistry (AREA)
  • Chemical Treatment Of Metals (AREA)
  • Cleaning And De-Greasing Of Metallic Materials By Chemical Methods (AREA)

Abstract

A copper treatment additive and methods are provided for applying copper to base metal effectively and efficiently while requiring a reduced frequency of replacing a treatment bath of copper sulfate solution. The copper treatment additive comprises an acidic, liquid mixture for use with a solution of copper sulfate and sulfuric acid to produce a strongly adherent, uniform metallic copper coating on steel. The copper treatment additive includes a first portion of Polyethylene Glycol 3350, a second portion of 4,4'-Methylene Dianiline; and a third portion of 31.45% Hydrochloric Acid. The copper coating has been observed to facilitate wire drawing processes and enhance characteristics associated with welding and decorative wire.
PCT/US2022/041276 2021-08-24 2022-08-23 Copper treatment additive Ceased WO2023028088A2 (en)

Applications Claiming Priority (4)

Application Number Priority Date Filing Date Title
US202163236515P 2021-08-24 2021-08-24
US63/236,515 2021-08-24
US17/892,056 US20230063860A1 (en) 2021-08-24 2022-08-20 Copper treatment additive
US17/892,056 2022-08-20

Publications (2)

Publication Number Publication Date
WO2023028088A2 WO2023028088A2 (en) 2023-03-02
WO2023028088A3 true WO2023028088A3 (en) 2024-04-04

Family

ID=85286501

Family Applications (1)

Application Number Title Priority Date Filing Date
PCT/US2022/041276 Ceased WO2023028088A2 (en) 2021-08-24 2022-08-23 Copper treatment additive

Country Status (2)

Country Link
US (1) US20230063860A1 (en)
WO (1) WO2023028088A2 (en)

Citations (10)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
GB346401A (en) * 1929-01-10 1931-04-10 Parker Rust Proof Co. Improvements in compositions for coating metals and methods of making and using the same
US3664852A (en) * 1969-12-30 1972-05-23 Hooker Chemical Corp Electroless copper plating solution and process
US3730853A (en) * 1971-06-18 1973-05-01 Schloetter M Electroplating bath for depositing tin-lead alloy plates
EP0216513A2 (en) * 1985-08-22 1987-04-01 Amoco Corporation Treatment of drilled copper-clad thermoplastic laminates
CZ56587A3 (en) * 1987-01-29 1996-03-13 Michael Phdr Straka Bath for currentless copper coating of iron-made articles
JP2001152387A (en) * 1999-09-16 2001-06-05 Ishihara Chem Co Ltd Void-free copper plating method
KR100779691B1 (en) * 2006-12-01 2007-11-26 배명직 Metal plating method of stone surface
US20100221574A1 (en) * 2009-02-27 2010-09-02 Rochester Thomas H Zinc alloy mechanically deposited coatings and methods of making the same
US20130313119A1 (en) * 2012-05-25 2013-11-28 Trevor Pearson Additives for Producing Copper Electrodeposits Having Low Oxygen Content
CN108315787A (en) * 2018-05-08 2018-07-24 大同新成新材料股份有限公司 A kind of technique of brush plating

Patent Citations (10)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
GB346401A (en) * 1929-01-10 1931-04-10 Parker Rust Proof Co. Improvements in compositions for coating metals and methods of making and using the same
US3664852A (en) * 1969-12-30 1972-05-23 Hooker Chemical Corp Electroless copper plating solution and process
US3730853A (en) * 1971-06-18 1973-05-01 Schloetter M Electroplating bath for depositing tin-lead alloy plates
EP0216513A2 (en) * 1985-08-22 1987-04-01 Amoco Corporation Treatment of drilled copper-clad thermoplastic laminates
CZ56587A3 (en) * 1987-01-29 1996-03-13 Michael Phdr Straka Bath for currentless copper coating of iron-made articles
JP2001152387A (en) * 1999-09-16 2001-06-05 Ishihara Chem Co Ltd Void-free copper plating method
KR100779691B1 (en) * 2006-12-01 2007-11-26 배명직 Metal plating method of stone surface
US20100221574A1 (en) * 2009-02-27 2010-09-02 Rochester Thomas H Zinc alloy mechanically deposited coatings and methods of making the same
US20130313119A1 (en) * 2012-05-25 2013-11-28 Trevor Pearson Additives for Producing Copper Electrodeposits Having Low Oxygen Content
CN108315787A (en) * 2018-05-08 2018-07-24 大同新成新材料股份有限公司 A kind of technique of brush plating

Also Published As

Publication number Publication date
US20230063860A1 (en) 2023-03-02
WO2023028088A2 (en) 2023-03-02

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