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WO2023021188A1 - Module détecteur, système de capture d'image optoélectronique et aéronef pour capture d'image - Google Patents

Module détecteur, système de capture d'image optoélectronique et aéronef pour capture d'image Download PDF

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Publication number
WO2023021188A1
WO2023021188A1 PCT/EP2022/073199 EP2022073199W WO2023021188A1 WO 2023021188 A1 WO2023021188 A1 WO 2023021188A1 EP 2022073199 W EP2022073199 W EP 2022073199W WO 2023021188 A1 WO2023021188 A1 WO 2023021188A1
Authority
WO
WIPO (PCT)
Prior art keywords
detector module
module
optoelectronic
detector
circuit board
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Ceased
Application number
PCT/EP2022/073199
Other languages
German (de)
English (en)
Inventor
Andreas Zintl
Steffen Rienecker
Christian Kerl
Mathias Stellmach
Hans-Ulrich Zühlke
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Jena Optronik GmbH
Original Assignee
Jena Optronik GmbH
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Jena Optronik GmbH filed Critical Jena Optronik GmbH
Priority to EP22768657.3A priority Critical patent/EP4388589A1/fr
Priority to US18/683,704 priority patent/US20240373110A1/en
Priority to KR1020247008834A priority patent/KR20240064649A/ko
Priority claimed from DE102022120998.9A external-priority patent/DE102022120998A1/de
Publication of WO2023021188A1 publication Critical patent/WO2023021188A1/fr
Anticipated expiration legal-status Critical
Ceased legal-status Critical Current

Links

Classifications

    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10F—INORGANIC SEMICONDUCTOR DEVICES SENSITIVE TO INFRARED RADIATION, LIGHT, ELECTROMAGNETIC RADIATION OF SHORTER WAVELENGTH OR CORPUSCULAR RADIATION
    • H10F39/00—Integrated devices, or assemblies of multiple devices, comprising at least one element covered by group H10F30/00, e.g. radiation detectors comprising photodiode arrays
    • H10F39/80—Constructional details of image sensors
    • H—ELECTRICITY
    • H04—ELECTRIC COMMUNICATION TECHNIQUE
    • H04N—PICTORIAL COMMUNICATION, e.g. TELEVISION
    • H04N23/00—Cameras or camera modules comprising electronic image sensors; Control thereof
    • H04N23/45—Cameras or camera modules comprising electronic image sensors; Control thereof for generating image signals from two or more image sensors being of different type or operating in different modes, e.g. with a CMOS sensor for moving images in combination with a charge-coupled device [CCD] for still images
    • H—ELECTRICITY
    • H04—ELECTRIC COMMUNICATION TECHNIQUE
    • H04N—PICTORIAL COMMUNICATION, e.g. TELEVISION
    • H04N23/00—Cameras or camera modules comprising electronic image sensors; Control thereof
    • H04N23/50—Constructional details
    • H04N23/54—Mounting of pick-up tubes, electronic image sensors, deviation or focusing coils
    • H—ELECTRICITY
    • H04—ELECTRIC COMMUNICATION TECHNIQUE
    • H04N—PICTORIAL COMMUNICATION, e.g. TELEVISION
    • H04N23/00—Cameras or camera modules comprising electronic image sensors; Control thereof
    • H04N23/57—Mechanical or electrical details of cameras or camera modules specially adapted for being embedded in other devices
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B64—AIRCRAFT; AVIATION; COSMONAUTICS
    • B64G—COSMONAUTICS; VEHICLES OR EQUIPMENT THEREFOR
    • B64G1/00—Cosmonautic vehicles
    • B64G1/22—Parts of, or equipment specially adapted for fitting in or to, cosmonautic vehicles
    • B64G1/66—Arrangements or adaptations of apparatus or instruments, not otherwise provided for

Definitions

  • Detector module optoelectronic imaging system and missile for imaging
  • the invention relates to a detector module for image acquisition, in particular for an optoelectronic image acquisition system for a missile, such as a spacecraft.
  • the invention relates to at least one optoelectronic imaging system having a detector module and a corresponding missile, such as a spacecraft.
  • Optoelectronic imaging systems are used, for example, in the field of space travel for earth observation.
  • Such image recording systems typically have optics, one or more detectors in an image plane and electronics.
  • the combination of several detectors is necessary for high-resolution earth observation.
  • the detectors are usually designed as a line with the appropriate resolution.
  • several detector rows also known as sensor rows, can be combined with one another in order to be able to record a larger area, for example with a larger swath width. In this case, it is necessary for the detectors to cover or overlap in the edge area.
  • line detectors or optoelectronic elements such as line elements
  • FPA Fluorescence-Activated Probes
  • spectral ranges are usually examined or used.
  • Each row of detectors for example made up of overlapping detectors or optoelectronic elements, can be optimized for a separate spectral range.
  • the known FPA solutions in a planar arrangement and with a monolithic FPA base plate and mounted on it, in separate housings or chip carriers installed sensors cannot be optimally adapted to the new generation of significantly larger sensors.
  • the new sensors can have more and/or smaller pixels and/or a significantly higher integration density due to significantly more functions on the chip, and/or higher clock rates and/or potentially a higher power loss as a result.
  • Electrical connections to peripheral components must be short and of high electrical quality. However, there is no space for the peripheral components in the direction of the image plane. Perforations in the FPA base plate for electronic components perpendicular to the image plane can degrade the thermal behavior due to inhomogeneity.
  • openings can also be difficult to manufacture and can degrade the mechanical-thermal properties of the monolithic baseplate.
  • the high data rate of the new sensors can require very high bandwidth communication. This can be realized by optical links. Arranging the optical link in the plane can also be difficult. Both the laying of the optical fibers and/or the placement of the optical link close to the data source (necessary because of the high clock rates) as well as the thermal management can lead to greater space requirements.
  • the sensors can currently be glued and/or non-detachably attached for precise fixation after adjustment and/or for good thermal connection. If one sensor fails, the entire monolithic FPA then has to be replaced.
  • the sensor and peripheral components can create thermal hotspots that cannot be selectively compensated for in a monolithic FPA.
  • the occurrence of temperature gradients means a deterioration in the operating point.
  • the possible optical resolution with the new sensor generation can only be used if thermal expansion effects can be avoided as far as possible, which in turn can be difficult in a monolithic, planar FPA.
  • adjustment tools can be used with the desired minimum distances between the sensors can only be used to a limited extent in a planar FPA due to the spatial narrowness.
  • a planar monolithic FPA also requires high-quality optics, which must ensure a flat field of view and imaging free of chromatic aberrations. Adapting the planar FPA to imaging specifics such as field curvature and/or chromatic aberration correction can be difficult.
  • the object of the invention is to improve the structure and/or function of a detector module as mentioned at the outset.
  • the invention is based on the object of structurally and/or functionally improving an optoelectronic image recording system as mentioned at the outset.
  • the invention is based on the object of structurally and/or functionally improving a missile, such as a spacecraft, for image recording.
  • the object of the invention is to avoid the described disadvantages of a planar and/or monolithic FPA, for example to enable effective packaging or a more compact and improved arrangement of optoelectronic detectors in the FPA.
  • a further object of the invention is to increase the integration density, in particular in the image field or on the image plane or focal plane, and to improve performance.
  • the object is achieved with a detector module having the features of claim 1.
  • the object is achieved with an optoelectronic imaging system having the features of claim 34.
  • the object is also achieved with a missile, such as a spacecraft, with the features of claim 41.
  • Advantageous designs and/or developments are the subject matter of the dependent claims, the description and/or the accompanying figures.
  • the independent claims of a claim category can also be developed analogously to the dependent claims of another claim category.
  • the detector module can be used and/or designed to record images.
  • the detector module can be for an optoelectronic image recording system and/or can be arranged there.
  • the detector module can be for a missile, for example a spacecraft, and/or can be arranged there.
  • the detector module can be or be designed for earth observation, in particular for high-resolution earth observation.
  • the detector module can comprise a module base body.
  • the detector module can comprise at least one optoelectronic element, for example a detector and/or a light-sensitive sensor chip, arranged and/or integrated on the module base body, for example directly.
  • the at least one optoelectronic element can have at least one line with a large number of pixels, such as a pixel line.
  • the detector module can have a plurality of optoelectronic elements, for example detectors and/or light-sensitive sensor chips, arranged and/or integrated directly on the module body.
  • the plurality of optoelectronic elements can essentially be arranged one behind the other in one direction, such as the longitudinal direction of the detector module and/or the module base body.
  • the longitudinal direction can be a longitudinal direction of the detector module and/or the module base body.
  • the longitudinal direction can essentially be the direction of the longitudinal axis and/or essentially the direction of the longest dimension or extent of the detector module and/or the module base body.
  • the plurality of optoelectronic elements can overlap in sections, for example in one direction, such as the longitudinal direction of the detector module and/or the module base body, and/or in their end regions, in particular viewed in the transverse direction.
  • the lines with a large number of pixels, such as pixel lines, of the several optoelectronic elements, for example arranged one behind the other can overlap in sections, in particular in one direction, such as the longitudinal direction of the detector module or module base body, and/or in their end regions, in particular in the transverse direction .
  • the transverse direction can be one Be lateral direction of the detector module and / or the module body.
  • the transverse direction can essentially be the direction of the transverse axis of the detector module or module base body and/or essentially the direction transverse, such as perpendicular, to the longitudinal direction. Furthermore, the transverse direction can essentially be the direction of a shorter and/or the shortest dimension or extent of the detector module and/or the module base body.
  • the transverse direction or transverse axis and the longitudinal direction or longitudinal axis can lie in one plane.
  • the plane can be defined and/or formed by a carrier surface, in particular of the module base body. The plane can be parallel to the support surface.
  • the plurality of optoelectronic elements can be arranged directly adjacent to one another or at a distance from one another, for example in one direction, such as the longitudinal direction of the detector module or module base body.
  • the plurality of optoelectronic elements, for example arranged one behind the other can be arranged at a distance, for example in one direction, such as the longitudinal direction of the detector module or module base body.
  • the detector module and/or the at least one optoelectronic element can be designed for at least one spectral channel and/or color channel.
  • the detector module and/or the at least one optoelectronic element can be designed and/or optimized for at least one spectral range.
  • the at least one optoelectronic element can be connected to the module base body.
  • the at least one optoelectronic element can be permanently connected to the module base body, such as glued and/or permanently connected.
  • the at least one optoelectronic element can be a light-sensitive chip.
  • the at least one optoelectronic element can be a CMOS chip and/or have at least one active pixel technology.
  • the at least one optoelectronic element can be and/or include a CCD chip, a photodiode or the like.
  • the at least one optoelectronic element can have at least one printed circuit board.
  • the at least one printed circuit board can be rigid or flexible, at least in sections.
  • the at least one circuit board can be a rigid or flexible circuit board.
  • the at least one optoelectronic element can include at least one integrated signal processing and/or readout circuit.
  • the at least one optoelectronic element can include at least one line-shaped light-sensitive chip.
  • the at least one light-sensitive chip can be a CMOS chip, a CCD chip, a photodiode or the like.
  • the at least one optoelectronic element can have at least one line, such as a pixel line, with a large number of pixels, in particular in its longitudinal direction.
  • the at least one optoelectronic element can have, for example, between 1000 and 30000 pixels, in particular between 5000 and 25000 pixels, preferably approximately 10000 or approximately 20000 pixels as a pixel line.
  • the at least one optoelectronic element can have a number of sub-rows, such as sub-pixel rows, arranged parallel to one another, in particular in its transverse/lateral direction, each with a multiplicity of pixels.
  • the at least one optoelectronic element can have, for example, a number corresponding to a power of 2, in particular up to 512 or 1024, sub-rows.
  • the pixel row can have a large number of sub-pixel rows.
  • the at least one optoelectronic element can be and/or comprise a sensor and/or detector and/or a light-sensitive electronic chip and/or a light-sensitive sensor chip.
  • the at least one optoelectronic element can be an optoelectronic detector and/or a light-sensitive sensor chip.
  • the at least one optoelectronic element can be integrated directly in the detector module and/or directly on or in the module base body.
  • the basic module body can be designed in several parts.
  • the basic module body can be designed in two parts, three parts, four parts or five parts. At least one part or each part of the module base body can have at least one optoelectronic element.
  • the basic module body can, for example in the longitudinal direction and/or in the transverse direction of the basic module body, be configured at least in sections essentially in an arc shape and/or wedge shape and/or angled and/or stepped. Step-like can also be understood as step-like.
  • the module base body can have a central section and at least one section that is angled or stepped in relation to the central section. At least one or each section of the module base body can have at least one optoelectronic element.
  • the module base body can be essentially wedge-shaped and/or arc-shaped and/or angled and/or stepped.
  • the at least one optoelectronic element can, for example in the longitudinal direction and/or in the transverse direction of the at least one optoelectronic element, be configured at least in sections essentially wedge-shaped and/or stepped and/or angled and/or arc-shaped, for example curved.
  • the detector module in particular the at least one or the optoelectronic elements of the detector module, can have and/or form an essentially planar, concave, convex or spherical, for example common, image field and/or, for example common, focal surface.
  • the basic module body can be essentially U-shaped or T-shaped.
  • the basic module body can have at least one carrier surface.
  • the at least one optoelectronic element and/or the plurality of optoelectronic elements can be arranged on the carrier surface.
  • the at least one optoelectronic element and/or the plurality of optoelectronic elements can be integrated directly in the module base body and/or in the carrier surface and/or fixedly arranged on it.
  • the basic module body can have at least one section which is configured essentially perpendicularly to the carrier surface and which is intended to accommodate at least one electronic circuit and/or electronics, such as signal processing and/or Readout circuit, and / or can be designed to accommodate at least one printed circuit board.
  • the at least one electronic circuit and/or electronics and/or circuit board can be connected to the at least one optoelectronic element, in particular electrically.
  • the at least one section can have at least one receiving area, for example a recess, breakout and/or pocket, in which the at least one electronic circuit and/or electronics and/or printed circuit board can be and/or can be arranged.
  • the at least one electronic circuit and/or electronics and/or printed circuit board can be and/or can be arranged transversely, for example perpendicularly, to the carrier surface.
  • the detector module can have at least one electronic circuit and/or electronics and/or printed circuit board, which can be connected to the at least one optoelectronic element, in particular electrically.
  • the at least one electronic circuit and/or electronics and/or printed circuit board can be and/or can be arranged at an angle, for example transversely and/or essentially perpendicularly, to the carrier surface and/or to the at least one optoelectronic element.
  • the at least one electronic circuit and/or electronics and/or printed circuit board can be electrically connected to the at least one optoelectronic element.
  • the at least one electronic circuit and/or electronics and/or printed circuit board can be electrically connected to the at least one optoelectronic element by means of bonding, for example wire ground or a bonded connection.
  • the at least one electronic circuit and/or electronics and/or printed circuit board can be electrically connected to the at least one optoelectronic element by means of soldering, such as solder jet bumping or laser soldering methods, or a soldered connection.
  • the at least one electronic circuit and/or electronics and/or printed circuit board can be electrically connected to the at least one optoelectronic element by means of welding, such as laser welding, or a welded connection.
  • the electrical connection can be made via an end face and/or side face of the at least one printed circuit board take place or be realized.
  • An end face of the at least one printed circuit board can have at least one electrically conductive contact point.
  • the at least one electrically conductive contact point on the end face of the at least one printed circuit board can be electrically connected to at least one electrically conductive contact point on the at least one optoelectronic element.
  • the at least one printed circuit board can have conductor tracks running transversely and/or substantially perpendicularly to one another.
  • At least one conductor track of the at least one printed circuit board can essentially run parallel to an end face of the at least one printed circuit board. At least one further conductor track of the at least one printed circuit board can run essentially parallel to a side face of the at least one printed circuit board running essentially perpendicularly to the end face. At least one further printed circuit board aligned substantially perpendicularly to the printed circuit board can be arranged on an end face of the at least one printed circuit board. The at least one further printed circuit board can be electrically connected to the at least one optoelectronic element, for example via an electrically conductive contact point.
  • the at least one printed circuit board can be electrically connected to the at least one further printed circuit board, for example by means of bonding, such as wire ground, and/or by means of soldering, such as solder jet bumping, and/or by means of welding, such as laser welding.
  • the at least one printed circuit board and/or the at least one further printed circuit board can form a segmented printed circuit board with the at least one printed circuit board of the at least one optoelectronic element.
  • the printed circuit boards can be produced, for example, as a PCB (printed circuit board), using LTCC (low temperature cofired ceramics), using HTCC (high temperature cofired ceramics) or based on glass.
  • the electrically conductive contact points can be so-called pads.
  • the conductor tracks can be flat layers/tracks, for example made of metal. A space-saving contacting of the vertical printed circuit board directly to the chip/optoelectronic element can therefore be implemented.
  • the detector module can have at least one cooling device and/or
  • the cooling device and/or heating device can be arranged and/or formed on the module base body.
  • the cooling device and/or heating device can be designed for cooling and/or heating the at least one optoelectronic element.
  • the module base body can be designed to form a graded temperature distribution.
  • the basic module body can have different wall thicknesses and/or material thicknesses, for example to form a graded temperature distribution.
  • the basic module body can be made, at least in sections, from materials that have different thermal conductivities and/or thermal conductivity coefficients, in particular to form different temperature distributions. Additionally or alternatively, at least one air gap can be provided, in particular to influence the heat conduction function and/or temperature distributions.
  • the basic module body can be designed for targeted cooling and/or heating.
  • the detector module and/or the module base body can have at least one cooling line and/or heating line, for example for targeted cooling and/or heating.
  • the at least one cooling device and/or heating device and/or the at least one cooling line and/or heating line can be designed to transport and/or supply and remove coolant or heating medium.
  • the coolant or heating medium can, in particular, flow.
  • Cooling or heating medium for example a fluid such as a liquid or gas.
  • the at least one cooling device and/or heating device and/or the at least one cooling line and/or heating line can be designed to supply the coolant or heating medium in liquid form and, in particular due to evaporation, to remove it in vapor form and/or gaseous form.
  • the at least one cooling device and/or heating device and/or the at least one cooling line and/or heating line can be designed to supply the coolant or heating medium in vaporous and/or gaseous form and, for example due to cooling, in liquid form dissipate form.
  • the at least one cooling device and/or heating device and/or the at least one cooling line and/or heating line can be designed
  • the at least one cooling device and/or heating device and/or the at least one cooling line and/or heating line can be designed to supply coolant or heating medium to an essentially internal and/or central point of the detector module and on one side, such as the outside, of the detector module.
  • the at least one cooling line and/or heating line can be designed to influence and/or change the flow properties of a coolant and/or heating medium, for example through adapted cross sections, such as line cross sections.
  • the at least one cooling line or heating line can have the same cross section throughout or can have different cross sections at least in sections.
  • the cross sections can be round, such as circular, or angular.
  • the cross sections can define and/or have a diameter.
  • the at least one cooling line or heating line can be designed to form different flow speeds.
  • the at least one cooling line and/or heating line can have a larger cross section on one side of the detector module than on a side of the detector module opposite this side.
  • the at least one cooling line and/or heating line can have a larger or smaller cross section on a feed side/feed point of the detector module than on a discharge side/discharge point of the detector module.
  • the cross section can be a line cross section.
  • the at least one cooling line and/or heating line can taper conically at least in sections in the direction of flow or counter to the direction of flow of the coolant and/or heating medium.
  • the cooling line and/or heating line can have a number of lines, for example a number of lines designed as stranded wires.
  • Several strands / cables can form strands or cable packages.
  • the several strands/lines for example a bundle of strands or lines, can have the same cross-sections or different cross-sections. Bundled strands can be provided, with several strands having the same cross-section being suitably bundled.
  • Each detector module can have an individual cooling and/or heating device or individual cooling and/or heating circuits.
  • An optoelectronic imaging system can be for a missile, such as a spacecraft.
  • the optoelectronic image recording system can be designed for earth observation, in particular for high-resolution earth observation.
  • the optoelectronic image recording system can have a modular image field arrangement or image plane arrangement and/or focal plane arrangement/focal surface arrangement.
  • the optoelectronic image recording system can have at least one detector module or a plurality of detector modules. The at least one detector module or the plurality of detector modules can be designed as described above and/or below.
  • the plurality of detector modules in particular the optoelectronic elements of the detector modules, can form and/or define a common image field/image plane and/or common focal surface/focal plane.
  • the plurality of detector modules can be arranged, for example directly and/or alongside, next to and/or parallel to one another and/or connected to one another.
  • the multiple detector modules can be arranged along a straight line or a curved line.
  • the line can essentially run transversely, for example perpendicularly, to the longitudinal direction of the detector module(s) and/or module base body.
  • the plurality of detector modules can essentially be lined up and/or arranged in an arc shape.
  • the common image field/image plane and/or focal area/focal plane can be, for example, in the image recording direction and/or flight direction and/or longitudinal direction of the missile, such as a spacecraft, and/or in the lateral direction or transverse, such as essentially perpendicular, to the image recording direction and/or Flight direction of the missile, such as spacecraft, essentially curved, for example convex or concave or spherically curved, be.
  • the optoelectronic imaging system can have optics focusing on at least one detector module, in particular on at least one optoelectronic element, and/or on the image field/image plane and/or on the focal surface/focal plane.
  • the at least one detector module or the several detector modules or the carrier surfaces of the module base bodies can/can be arranged within an imaging area of the optics in the image field/the image plane.
  • the optics can be designed to focus on a single detector module or on a plurality of detector modules and/or on a single optoelectronic element and/or on a plurality of optoelectronic elements, for example simultaneously or sequentially.
  • the optics can be designed as a lens, for example, or have a lens.
  • the optics can be designed as a telescope, for example, or have a telescope.
  • the optics can have one or more lenses and/or mirrors.
  • the optics can have a tube.
  • the one or more lenses and/or mirrors can be arranged in the tube.
  • the optics can have a motor, such as a stepper motor, for adjusting one or more lenses and/or mirrors.
  • a missile such as a spacecraft, can have at least one detector module or a plurality of detector modules.
  • the at least one detector module or the plurality of detector modules can be designed as described above and/or below.
  • a missile, such as a spacecraft can have at least one optoelectronic imaging system.
  • the at least one optoelectronic imaging system can be designed as described above and/or below.
  • the missile may be a spacecraft.
  • the missile can be for earth observation, in particular for high-resolution earth observation.
  • the missile can be a drone, an airplane, a satellite, in particular an artificial satellite, for example an earth satellite, a space probe, for example an orbiter, a rocket, a space shuttle, a spaceship, a spacecraft, a space capsule, a space station or the like.
  • the missile, in particular spacecraft can be designed to move in space or to be brought there.
  • the missile or spacecraft can be a spacecraft.
  • the missile or spacecraft may be configured to be placed in Earth orbit and/or to travel in Earth orbit and/or to hover.
  • the missile or spacecraft can be designed to be at an altitude of, for example, about 100 m, 10 km and/or to move and/or hover 1000 km or more.
  • the missile or spacecraft can be designed to be brought into an orbit of a planet and/or celestial body and/or to move and/or to hover in an orbit of the planet or celestial body.
  • the celestial body can be a planet, star, moon, asteroid, etc., for example.
  • the missile or spacecraft can have a drive, such as an engine, rocket drive and/or brake and/or steering nozzles, or the like.
  • the invention results in a modular FPA, among other things.
  • the planar monolithic FPA can be divided into a modular system. Highly precise positioning and/or thus simplified adjustment of the sensor can be made possible by a relatively easy-to-manufacture, for example planar (in the sense of planar in the area on which the sensor/detector is attached) FPA base body. Possibilities of compensating for image field errors can be made possible by a targeted arrangement of the individual detectors in the array. Compensation options for color errors can be enabled through a targeted arrangement of the individual color channels/spectral channels (e.g. z-tuning). The adjustment can be optimized by pre-assembling the FPA modules.
  • a heat flow gradient can be or will be generated in the FPA for selective cooling or temperature control by designing different material thicknesses.
  • a selective temperature control of hotspots can be realized by spatial arrangement of the temperature control devices. Selective temperature control can be achieved by choosing the right flow direction for the media/heat flow. The variants of selective temperature control can be used and/or implemented both for supplying heat and for cooling.
  • the electronics can be arranged along the surface of the FPA modules or in pockets of the FPA modules perpendicular to the focal plane. Short lines can be realized from the printed circuit board to the sensor module for optimal HF properties. It can be an optimal connection to that thermal management can be realized.
  • Optimum accessibility for service, testing and commissioning can be achieved on the individual module.
  • a geometrically adapted printed circuit board with cavities for optimal local heat conduction can be implemented.
  • Improved service and/or lower costs can be made possible by modularly exchangeable units (eg color channels) with permanently attached components/sensors.
  • the FPA module can be designed from multiple components to optimize thermal performance.
  • An embedding of materials or media (e.g. cooling channel) in the base body of the modular FPA for thermal optimization can be implemented.
  • the image plane or focal plane can be reduced and/or used more efficiently.
  • the integration density on the image plane or focal plane can be increased and/or the performance can be improved.
  • FIG. 1 shows a perspective view of a detector module according to a variant
  • FIG. 2 shows a perspective view of a combination of several detector modules according to FIG. 1 ;
  • FIG. 5 shows a perspective view of a detector module according to a further variant
  • FIG. 6 shows a carrier plate with an optoelectronic element of the detector module according to FIG. 5;
  • FIG. 7 shows a variant of a combination of several detector modules according to FIG. 5;
  • FIG. 8 shows a further variant of a combination of several detector modules
  • FIG. 9 shows a further variant of a combination of several detector modules according to FIG. 5;
  • FIG. 10 shows a further variant of a combination of several detector modules according to FIG. 5;
  • FIG. 11 shows a further variant of a combination of several detector modules
  • FIG. 13 shows the detector module according to FIG. 5 with adjustment tools
  • FIG. 15 shows the detector module according to FIG. 1 with a variant of a cooling and/or heating device
  • FIG. 17 shows the detector module according to FIG. 1 with a further variant of a cooling and/or heating device
  • FIG. 19 shows the detector module according to FIG. 1 with a further variant of a cooling and/or heating device
  • 20b schematically shows a variant of a detector module with a variant of an arrangement of optoelectronic elements
  • 20c schematically shows a further variant of a detector module with a further variant of an arrangement of optoelectronic elements
  • 20d schematically shows a further variant of a detector module with a further variant of an arrangement of optoelectronic elements
  • 20e schematically shows a curved optoelectronic element
  • FIG. 21 shows an arrangement of a printed circuit board perpendicular to the focal plane in a detector module according to FIG. 1;
  • 25 schematically shows a variant of an arrangement and connection of a printed circuit board to the optoelectronic element.
  • the basic module 100 can be the carrier for a color channel.
  • the sensors 102 are integrated directly in the detector module 100 and are not initially preassembled separately on chip carriers, such as support plates, and/or in separate housings.
  • the detector module 100 has a module base body 104 and at least one optoelectronic element 102 arranged on the module base body 104 .
  • several optoelectronic elements 102 are directly integrated in the module base body 104 .
  • the optoelectronic elements 102 each have a row 106 with a large number of pixels, such as pixel row 106 .
  • the optoelectronic elements 102 can be designed as detectors and/or light-sensitive sensor chips.
  • the optoelectronic elements 102 are essentially in one direction, such as the longitudinal direction 108 of the detector module 100 or module body 104, arranged one behind the other.
  • the optoelectronic elements 102 arranged one behind the other overlap (seen in the transverse direction) in sections in the longitudinal direction 108 of the detector module 100 or module base body 104 in their end regions 110, with the rows 106 having a large number of pixels, such as pixel rows 106, of the multiple optoelectronic elements arranged one behind the other 102 also overlap in sections in the longitudinal direction 108 of the detector module 100 or module base body 104 in their end regions 110, seen in the transverse direction.
  • the detector module 100 is designed for at least one spectral channel.
  • FIG. 2 shows a detector module arrangement 200 with a combination of several basic modules 100, such as detector modules 100, arranged alongside one another, in particular alongside one another, for the focal plane or which together form a total FPA or a common focal plane 202 or total image plane /define or form image field 202 .
  • Detector modules 100 can at least partially form the optoelectronic imaging system.
  • the detector module arrangement 200 can form an optoelectronic image recording system and/or be part of it.
  • FIG. 3 shows schematically a variant of a structured front side of an FPA module or detector module 300 or 400 for a curved, essentially concave (shown in Fig. 3 above, or convex (shown in Fig. 3 below)) Image plane/image field transverse to the direction of flight
  • the detector module 300 or 400 according to Figure 3 can be designed in several parts for this purpose
  • Figure 4 shows a schematic of wedge-shaped FPA modules or detector modules 500 for a curved image plane/image field in the direction of flight y.
  • the overall FPA offers the possibility of compensating for various aberrations. If the image field is not flat, the detectors 102 and/or its optoelectronic elements 102 can be or become inclined in the edge areas (cf. FIGS. 3, 8 and 11), so that a sharp image can always be ensured here. Convex and/or concave image field curvatures can be corrected. The compensation of spherical and/or aspherical field curvatures can, at least approximately, be possible. Furthermore, the modular FPA can also offer the possibility of individually adjusting the effects of the longitudinal chromatic aberration of the imaging optics for the different spectral ranges.
  • the front side of the individual module can be structured along the direction transverse to the direction of flight (x-axis).
  • the basic module body can be designed in several parts, with at least one part or each part of the basic module body having at least one optoelectronic element.
  • a wedge-shaped manufacture/configuration (see FIG. 4) can be realized along the flight direction (y-axis), in particular while maintaining the high manufacturing precision.
  • Fig. 5 shows a further variant of a detector module 600.
  • the detector module 600 essentially corresponds to the detector module 100, but in the detector module 600, in contrast to the detector module 100, the optoelectronic elements 602 are arranged on the module base body 604, in particular by means of support plates 606 .
  • the module base body 604 is the carrier for the detectors 602 or optoelectronic elements 602 of a color channel/spectral channel.
  • the carrier plates 606 are firmly connected to the module base body 604 .
  • the optoelectronic elements 602 are each fixedly arranged on a carrier plate 606 or can be integrated into it.
  • the optoelectronic elements 602 are aligned in the longitudinal direction 608 by means of the carrier plate 606, in particular in such a way that the end regions of the optoelectronic elements 602 overlap.
  • a printed circuit board 612 is arranged essentially perpendicular to the optoelectronic element 602 in a receiving area 610 .
  • the printed circuit board can have an electrical circuit and/or be an electronics module that is electrically connected to the optoelectronic element 602 .
  • the optoelectronic element 602 has a Si chip 614 comprising, for example, MCM from CMOS chip/detector and ROIC (read out integrated circuit). Furthermore, the optoelectronic element 602 has an optical filter 616, such as Spectral filter, electronic components 618, such as a clock or timer, for example a "high voltage clock” (HVCLK), a printed circuit board 620, for example PCT / LTCC, and / or electrically conductive contacts / contact points 622.
  • the carrier plate 606 has mechanical interfaces 624 for adjustment and/or fixation.
  • All optoelectronic elements 602 on a module base body 604 are adjusted and/or fixed to one another.
  • the thermal connection and/or optimized temperature control can be implemented at module level.
  • the detector module as a whole or optoelectronic elements 602 can be temperature-controlled individually be or become.
  • FIG. 7 shows a detector module arrangement 700 which has a plurality of detector modules 600 according to FIG.
  • the detector module arrangement 700 can form an optoelectronic image recording system and/or be part of it.
  • the combination of multiple detector modules 600 results in the overall FPA or common field of view.
  • the detector modules 600 are arranged and connected to one another alongside one another and along a straight line 702 (which runs in the y-direction), so that the optoelectronic elements 602 of the detector modules 600 have or form a substantially planar image field and/or focal surface.
  • the image field or the focal area lies here essentially in the plane spanned by the longitudinal direction/flight direction y and the lateral direction/transverse direction x.
  • Each detector module 600 of the detector module arrangement 700 is designed for a spectral range.
  • the detector module arrangement 700 in FIG. 7 has, for example, seven detector modules 600 and can thus be designed for seven different spectral ranges or spectral channels.
  • the detector module arrangement 800 can form an optoelectronic imaging system and/or be part of it.
  • the detector modules 802 essentially correspond to the detector modules 600 according to FIG. 5, but have an articulated front side of the FPA module for an essentially concavely curved image plane/image field transverse to the flight direction, ie in the x-direction.
  • the field of view can be flat along the longitudinal direction/direction of flight y.
  • the detector module arrangement 800 can thus have a concave image field curvature in the x direction and a flat image field in the y direction (direction of flight).
  • the oblique position of the outer optoelectronic elements 804 can be implemented by an adapted module base body 806 or wedge-shaped plates, such as intermediate plates.
  • the module base body 806 can be in one piece or in multiple pieces, for example in three pieces. Sections of the module base body 806 are essentially wedge-shaped and/or angled in the longitudinal direction 808 of the module base body 806 .
  • the module base body 806 can have a middle section 810 and two sections 812 angled towards the middle section 810 , each section having an optoelectronic element 804 .
  • a substantially convex curvature can also be implemented.
  • the detector module arrangement 900 can form an optoelectronic image recording system and/or be part of it.
  • the detector modules 600 are arranged alongside one another but along a curved line 902 (which essentially runs in the y-direction).
  • the detector module arrangement 900 has an essentially concave image plane/image field in the longitudinal direction/flight direction y or has a concave image field curvature in the y-direction.
  • the module base bodies 604 of the detector modules 600 can be correspondingly wedge-shaped, so that the concave curvature in the y-direction results when the module base bodies or detector modules are arranged on the longitudinal side.
  • the detector module arrangement 1000 shows a detector module arrangement 1000 with a plurality of detector modules 600 according to FIG. 5.
  • the detector module arrangement 1000 can form an optoelectronic image recording system and/or be part of it.
  • the detector module arrangement 1000 essentially corresponds to the detector module arrangement 900, but is not concave but essentially convex.
  • the detector modules 600 are side by side, but along a curved line 1002 (which is shown in Substantially runs in the y-direction) arranged.
  • the detector module arrangement 1000 has a convexly curved image plane/image field in the longitudinal direction/flight direction y or has a convex image field curvature in the y direction.
  • the module base bodies 604 of the detector modules 600 can be correspondingly wedge-shaped, so that the convex curvature in the y-direction results when the module base bodies or detector modules are arranged on the longitudinal side.
  • the detector module arrangement 1100 can form an optoelectronic image recording system and/or be part of it.
  • the detector module arrangement 1100 essentially corresponds to a combination of the detector module arrangement 800 and 1000, with the detector modules 1102 being designed and arranged in such a way that an essentially convexly curved image plane/image field in the longitudinal direction/flight direction y and in the x direction (transverse to the flight direction y/ Lateral direction) or a substantially convex field curvature in the y-direction and x-direction is realized.
  • FIG. 12 shows the use of adjustment tools 1200 or adjustment devices 1202.
  • the modular design of the FPA can offer the advantage of simpler assembly and/or adjustment.
  • FIG. 13 shows the detector module 600 according to FIG. 5 with adjustment tools 1200 and adjustment devices 1202.
  • the individual detector modules 600 are freely accessible in flight direction y or perpendicular to the color channels/spectral channels. This accessibility can be used to use adjustment tools 1200 and/or adjustment devices 1202, in particular for the optoelectronic elements 602 (multi-chip mounts/sensors) and/or for the carrier plate 606 (chip carrier). After the adjustment, the permanent fixing of the optoelectronic elements 602 or carrier plates 606 can take place or be implemented.
  • the adjustment tools 1200 and/or adjustment devices 1202 can then be removed.
  • the detector modules 600 can then be constructed very compactly to form an overall FPA in the y-axis.
  • the modular design of the FPA can take advantage of an improved
  • the modular FPA can allow much more freedom for selective temperature control.
  • a cooling device e.g. passive or actively pumped cooling lines / heating lines / heat pipe
  • the coolant can heat up.
  • the cooling effect can therefore not be constant in the case of homogeneous heat sources.
  • the base body or module base body of the modular FPA or the detector module can be designed geometrically in such a way that a graded temperature distribution can be achieved through different wall thicknesses and material thicknesses. As a result, a homogeneous temperature distribution can be realized in the area of the detectors and/or the optoelectronic elements. This can have a positive effect on the image quality.
  • FIG. 15 shows an example of a detector module 100 according to FIG. 1 with a cooling device and/or heating device 1300 for cooling and/or heating the optoelectronic elements 102.
  • the cooling device and/or heating device 1300 a cooling line and/or heating line for supplying a coolant or heating medium on one side of the detector module 100 (on the left in FIG. 15) and for discharging on a side of the detector module 100 opposite this side (on the right in FIG. 15).
  • the direction of flow of the coolant or heating medium is illustrated by the arrows.
  • the module base body 104 has different wall thicknesses and/or material thicknesses (larger/thicker on the left in FIG.
  • Hotspots in the FPA or in the detector module caused by components with a high heat load, can be tempered in a targeted manner. This can be achieved by using several individual cooling devices (e.g. heat pipes or heat pipes/heat lines/cooling lines), which are arranged geometrically, for example, in such a way that their position and/or the flow direction of the cooling medium locally generate the highest cooling effect where the components cause hotspots develop.
  • individual cooling devices e.g. heat pipes or heat pipes/heat lines/cooling lines
  • FIG. 17 shows an example of a detector module 100 according to FIG. 1 with a cooling device and/or heating device 1400 for cooling and/or heating the optoelectronic elements 102, wherein the cooling device and/or heating device 1400 has a plurality of cooling lines and/or heating lines 1402 .
  • the cooling device and/or heating device 1400 or the cooling lines and/or heating lines are designed in such a way that coolant or heating medium is supplied at a substantially inner and/or central location 1404 of the detector module 100 and at one side 1406, such as the outer side 1406, of the Detector module 100 is discharged.
  • individual cooling or heating of the individual optoelectronic elements 102 can be and/or be implemented.
  • heat can be and/or is transported from the inside to the outside.
  • Hotspots in the FPA or in the detector module can also be tempered in a targeted manner by constructively influencing the flow properties of the cooling medium. This can be done, for example, by an adapted cross section of the temperature control device and/or cooling lines, as a result of which the flow rate of the medium can be changed. As a result, a targeted temperature control of individual areas can be implemented.
  • FIG. 19 shows an example of a detector module 100 according to FIG.
  • Cooling device and / or heating device 1500 for cooling and / or heating the optoelectronic elements 102, wherein the cooling line and / or Heat line 1502 on one side of the detector module 100 (on the left in Fig. 19) has a larger cross section/line cross section than on a side of the detector module 100 opposite this side (on the right in Fig. 19).
  • the cooling line and/or heat line 1502 can be in the direction of flow or counter to the direction of flow of the coolant and/or heating medium, at least in sections taper conically. A different heat transport can be or will be realized in this way.
  • thermal hotspots can be specifically decoupled from thermally sensitive components (e.g. detector or optoelectronic elements).
  • thermally sensitive components e.g. detector or optoelectronic elements
  • the heat conduction in regions of the FPA modules or detector modules can be or will be changed in a targeted manner by geometric design (e.g. air gap) or appropriate material selection (e.g. thermally particularly good or poorly conductive materials).
  • FIG. 20a schematically shows an optimal image field, here a spherical and/or convex image field, with respect to an optical axis 1602.
  • FIG. 20b schematically shows a variant of a detector module 1604 with a variant of an arrangement of optoelectronic elements or detectors 1606, a stepped module base body 1608 being provided and the individual optoelectronic elements or detectors 1606 each being arranged on a step.
  • a modular FPA with stepped adjustment, with an essentially rough approximation, to the optimal field of view can be realized.
  • FIG. 20c schematically shows a further variant of a detector module 1610 with a further variant of an arrangement of optoelectronic elements or detectors 1606, wherein the module base body 1612 has sections that are angled relative to one another instead of steps, on each of which an optoelectronic element or detector 1606 is arranged.
  • a modular FPA with oblique optoelectronic elements or detectors 1606 with essentially wedge-shaped adaptation to the optimal image field and thus a better approximation can be realized.
  • Fig. 20d shows schematically a further variant of a detector module 1614 with a further variant of an arrangement of curved optoelectronic elements or detectors 1616, each have a curved surface 1618, like sensor surface.
  • Such a curved optoelectronic element or detector 1616 is shown schematically in FIG. 20e.
  • a modular FPA with curved optoelectronic elements or detectors 1616 and thus an essentially ideal adaptation to the optimal image field can be implemented.
  • Fig. 12 shows an arrangement of a circuit board 1 12 of the detector module 100 of FIG. 1 perpendicular to the focal plane.
  • the modular FPA or the detector module 100 can realize an arrangement of the printed circuit boards 112 in the third dimension (eg perpendicular to the actual focal plane). Due to the structural design with recesses and/or pockets 114, the printed circuit boards 112, in particular in these recesses and/or pockets 114, can be stably fixed, but can remain freely accessible for maintenance of the individual module. Since an edge of the printed circuit board 112 can run directly on the back of the detector 102/the multi-chip module 102, very short cable paths can be implemented, which can be better suited for high-frequency signals.
  • the printed circuit boards 1 12 themselves can be arranged along the FPA module surface/detector module surface or in pockets and/or recesses 1 14 and/or also be efficiently integrated into the thermal concept.
  • the circuit boards 112 may include electronic circuitry.
  • an electronic circuit and/or an electronic module can also be arranged accordingly.
  • the module base body 104 can have a carrier surface 116 on which the optoelectronic elements 102 are arranged.
  • the module base body 104 can have a plurality of sections which are configured essentially perpendicularly to the carrier surface 116 and which are configured to accommodate at least one electronic circuit, such as a signal processing and/or readout circuit, and/or to accommodate at least one printed circuit board 112.
  • the sections each have a receiving area 1 14, in particular a recess and/or pocket 1 14, in which the at least one electronic circuit and/or printed circuit board 1 12 is and/or can be arranged.
  • the at least one electronic circuit and/or printed circuit board 112 is electrically connected to a respective optoelectronic element 102.
  • the sensor or the optoelectronic element 102 can generally be permanently fixed on the FPA or the detector module 100, for example by gluing. With this connection, which cannot be detached non-destructively, it can be important to be able to exchange the sensors 102 and/or the detector modules 100 in small units in the event of service, for example as a color channel. This can be made possible by the modular FPA concept.
  • the printed circuit board 1700 is arranged substantially perpendicular to the optoelectronic element 1702 and is electrically connected to the optoelectronic element 1702 by means of bonding, such as wire ground, or a bonded connection.
  • the electrical connection is implemented via an end face and/or side face 1706 of printed circuit board 1700 .
  • the end face 1706 of the printed circuit board 1700 can have at least one electrically conductive contact point, which is electrically connected to at least one electrically conductive contact point of the optoelectronic element 1702.
  • Printed circuit board 1700 can have conductor tracks that run transversely and/or essentially perpendicularly to one another, with at least one conductor track running essentially parallel to end face 1706 of printed circuit board 1700 and at least one further conductor track running essentially parallel to a side surface 1708 running essentially perpendicular to end face 1706 runs.
  • FIG. 22 therefore illustrates a possible arrangement of an additional printed circuit board 1700 to a printed circuit board of the sensor chip/optoelectronic element 1702 or to a sensor chip/optoelectronic element 1702 to be contacted directly at an angle, in the present exemplary embodiment of 90° .
  • a wire bond or wire bond from the end face 1706 of the printed circuit board 1700 to the other printed circuit board or directly to the sensor chip/optoelectronic element 1702, for example a wire bond/wire bond from chip pad to edge pad, enables space optimized variant
  • the senor or the detector module can be built as compact as possible in the direction of flight, especially if several sensors or detector modules are combined in one system.
  • FIG. 23 schematically shows a further variant of an arrangement and connection of the printed circuit board 1700 to or with the optoelectronic element 1702.
  • a further printed circuit board 1710 aligned essentially perpendicularly to the printed circuit board 1700 is arranged on the end face 1706 of the printed circuit board 1700 , which is electrically connected to the optoelectronic element 1702 by means of wire bonding, in particular via an electrically conductive contact point.
  • wire bonding in particular via an electrically conductive contact point.
  • the printed circuit board 1700 is electrically connected to the further printed circuit board 1710, for example by means of soldering, such as solder jet bumping.
  • circuit board 1700 is connected to the optoelectronic element 1702 via a side surface 1712 facing the optoelectronic element 1702, here electrically connected, for example by means of soldering, such as solder jet bumping.
  • soldering such as solder jet bumping.
  • a 90° contact can thus be implemented, in particular by means of soldering technology.
  • FIG. 17 shows schematically a further variant of an arrangement and connection of the circuit board 1700 to or with the optoelectronic element 1702.
  • the circuit board 1700 via a side surface 1712 facing the optoelectronic element 1702 with the optoelectronic element 1702, here electrically connected, for example, by means of ground such as wire bonding.
  • a 90° contact can thus be implemented, in particular by means of a bond connection.
  • Detector module arrangement common focal plane / image plane / field of view
  • PCB electrically conductive contacts / contact points mechanical interfaces 00 detector module arrangement 02 straight line 00 detector module arrangement 02 detector modules 04 optoelectronic elements 06 module main body 08 longitudinal direction / longitudinal direction 10 central section 12 angled sections 00 detector module arrangement 02 curved line (concave)

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  • Signal Processing (AREA)
  • Human Computer Interaction (AREA)
  • Solid State Image Pick-Up Elements (AREA)

Abstract

L'invention concerne un module détecteur (100, 300, 400, 500, 600, 802, 1102, 1604, 1610, 1614) pour l'acquisition d'images, en particulier pour un système optoélectronique d'acquisition d'images (200, 700, 800, 900, 1000, 1100) pour un aéronef, tel qu'un vaisseau spatial, comprenant un corps de module principal (104, 604, 806, 1608, 1612, 1704) et au moins un élément optoélectronique (102, 602, 804, 1606, 1616, 1702) disposé sur et/ou intégré dans le corps de module principal (104, 604, 806, 1608, 1612, 1704), le au moins un élément optoélectronique (102, 602, 804, 1606, 1616, 1702) ayant au moins une ligne (106) avec une multiplicité de pixels, telle qu'une ligne de pixels (106), et un système de capture d'image optoélectronique (200, 700, 800, 900, 1000, 1100) et un aéronef, tel qu'un vaisseau spatial.
PCT/EP2022/073199 2021-08-20 2022-08-19 Module détecteur, système de capture d'image optoélectronique et aéronef pour capture d'image Ceased WO2023021188A1 (fr)

Priority Applications (3)

Application Number Priority Date Filing Date Title
EP22768657.3A EP4388589A1 (fr) 2021-08-20 2022-08-19 Module détecteur, système de capture d'image optoélectronique et aéronef pour capture d'image
US18/683,704 US20240373110A1 (en) 2021-08-20 2022-08-19 Detector module, optoelectronic image capture system and aircraft for image capture
KR1020247008834A KR20240064649A (ko) 2021-08-20 2022-08-19 검출기 모듈, 광전자 이미지 캡처 시스템 및 이미지 캡처를 위한 비행체

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DE102021121609 2021-08-20
DE102021121609.5 2021-08-20
DE102022120998.9A DE102022120998A1 (de) 2021-08-20 2022-08-19 Detektormodul, optoelektronisches Bildaufnahmesystem und Flugkörper zur Bildaufnahme

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Citations (6)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US20010020671A1 (en) * 2000-02-04 2001-09-13 Fank Ansorge Focal surface and detector for opto-electronic imaging systems, manufacturing method and opto-electronic imaging system
CN100373601C (zh) * 2005-04-15 2008-03-05 广达电脑股份有限公司 二次曲线型热管鳍片散热器
US20100308429A1 (en) * 2009-06-04 2010-12-09 Wisconsin Alumni Research Foundation Flexible lateral pin diodes and three-dimensional arrays and imaging devices made therefrom
US20130321621A1 (en) * 2012-05-31 2013-12-05 Martin M. Menzel Method for Mapping Hidden Objects Using Sensor Data
US20150301180A1 (en) * 2011-09-08 2015-10-22 Advanced Scientific Concepts Inc. Terrain mapping ladar system
US20190141261A1 (en) * 2009-06-03 2019-05-09 Flir Systems, Inc. Imager with array of multiple infrared imaging modules

Patent Citations (6)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US20010020671A1 (en) * 2000-02-04 2001-09-13 Fank Ansorge Focal surface and detector for opto-electronic imaging systems, manufacturing method and opto-electronic imaging system
CN100373601C (zh) * 2005-04-15 2008-03-05 广达电脑股份有限公司 二次曲线型热管鳍片散热器
US20190141261A1 (en) * 2009-06-03 2019-05-09 Flir Systems, Inc. Imager with array of multiple infrared imaging modules
US20100308429A1 (en) * 2009-06-04 2010-12-09 Wisconsin Alumni Research Foundation Flexible lateral pin diodes and three-dimensional arrays and imaging devices made therefrom
US20150301180A1 (en) * 2011-09-08 2015-10-22 Advanced Scientific Concepts Inc. Terrain mapping ladar system
US20130321621A1 (en) * 2012-05-31 2013-12-05 Martin M. Menzel Method for Mapping Hidden Objects Using Sensor Data

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