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WO2023014040A1 - Ensemble capteur d'image - Google Patents

Ensemble capteur d'image Download PDF

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Publication number
WO2023014040A1
WO2023014040A1 PCT/KR2022/011383 KR2022011383W WO2023014040A1 WO 2023014040 A1 WO2023014040 A1 WO 2023014040A1 KR 2022011383 W KR2022011383 W KR 2022011383W WO 2023014040 A1 WO2023014040 A1 WO 2023014040A1
Authority
WO
WIPO (PCT)
Prior art keywords
heat dissipation
image sensor
thermoelectric element
sensor assembly
block
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Ceased
Application number
PCT/KR2022/011383
Other languages
English (en)
Korean (ko)
Inventor
편영현
권정용
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Vieworks Co Ltd
Original Assignee
Vieworks Co Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Vieworks Co Ltd filed Critical Vieworks Co Ltd
Publication of WO2023014040A1 publication Critical patent/WO2023014040A1/fr
Anticipated expiration legal-status Critical
Ceased legal-status Critical Current

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Classifications

    • H—ELECTRICITY
    • H04—ELECTRIC COMMUNICATION TECHNIQUE
    • H04N—PICTORIAL COMMUNICATION, e.g. TELEVISION
    • H04N23/00—Cameras or camera modules comprising electronic image sensors; Control thereof
    • H04N23/50—Constructional details
    • H04N23/52—Elements optimising image sensor operation, e.g. for electromagnetic interference [EMI] protection or temperature control by heat transfer or cooling elements
    • H—ELECTRICITY
    • H04—ELECTRIC COMMUNICATION TECHNIQUE
    • H04N—PICTORIAL COMMUNICATION, e.g. TELEVISION
    • H04N23/00—Cameras or camera modules comprising electronic image sensors; Control thereof
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10F—INORGANIC SEMICONDUCTOR DEVICES SENSITIVE TO INFRARED RADIATION, LIGHT, ELECTROMAGNETIC RADIATION OF SHORTER WAVELENGTH OR CORPUSCULAR RADIATION
    • H10F39/00—Integrated devices, or assemblies of multiple devices, comprising at least one element covered by group H10F30/00, e.g. radiation detectors comprising photodiode arrays
    • H10F39/10—Integrated devices
    • H10F39/12—Image sensors
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10F—INORGANIC SEMICONDUCTOR DEVICES SENSITIVE TO INFRARED RADIATION, LIGHT, ELECTROMAGNETIC RADIATION OF SHORTER WAVELENGTH OR CORPUSCULAR RADIATION
    • H10F39/00—Integrated devices, or assemblies of multiple devices, comprising at least one element covered by group H10F30/00, e.g. radiation detectors comprising photodiode arrays
    • H10F39/80—Constructional details of image sensors
    • H10F39/804—Containers or encapsulations
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10N—ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10N10/00—Thermoelectric devices comprising a junction of dissimilar materials, i.e. devices exhibiting Seebeck or Peltier effects
    • H10N10/10—Thermoelectric devices comprising a junction of dissimilar materials, i.e. devices exhibiting Seebeck or Peltier effects operating with only the Peltier or Seebeck effects

Definitions

  • the present invention relates to an image sensor assembly, and more particularly, to an image sensor assembly including a sealing structure of a heat dissipation medium.
  • thermoelectric element and the image sensor are located inside a case sealed from the outside to prevent moisture, and a heat dissipation medium to increase the thermal conductivity between the thermoelectric element and the heating block and the cooling block.
  • a heat dissipation medium to increase the thermal conductivity between the thermoelectric element and the heating block and the cooling block.
  • the reason for applying the heat dissipation medium in this way is to increase thermal conductivity by reducing thermal resistance due to a difference in surface roughness between two adjacent objects.
  • a heat dissipation medium that is a thermally conductive compound for example, a heat dissipation grease contains silicone oil, Due to its characteristics, the silicone oil may contain a small amount of oil. Such thermal grease may liquefy or vaporize the oil in a high-temperature environment.
  • oil of the applied thermal grease may be liquefied or vaporized due to a rise in temperature of the thermoelectric element.
  • Such oil is prevented from escaping to the outside due to the sealed structure of the case, so it flows into the thermoelectric element in a liquid state, or floats inside the sealed case in a vapor state and condenses on the image sensor at a relatively low temperature. .
  • thermoelectric element When such oil is introduced into the thermoelectric element, the cooling efficiency of the thermoelectric element may decrease and the life of the thermoelectric element may be shortened.
  • the oil condensed on the image sensor in an oil vapor state may degrade the quality of an image generated by the image sensor.
  • the present invention has been made to solve the above problems, and an object of the present invention is to provide an image sensor assembly including a sealing structure of a heat dissipation medium.
  • An image sensor assembly includes a cover part and an image sensor part provided inside the cover part, and has a thermoelectric element for cooling the image sensor part and one side surface for heat dissipation of the thermoelectric element.
  • a heat dissipation block coupled to the thermoelectric element, a heat dissipation medium applied to an interface between the thermoelectric element and the heat dissipation block, and a sealing portion disposed between the thermoelectric element and the heat dissipation block and disposed to surround the heat dissipation medium on a horizontal surface do.
  • an opening may be formed on one side of the cover unit, and the heat dissipation block may be coupled to cover the opening of the cover unit.
  • a heat insulating member blocking heat transfer from the heat dissipation block to the cover may be provided at a contact portion between the cover part and the heat dissipation block.
  • the image sensor assembly further includes a cooling block provided on a rear surface of the image sensor unit, one side of the cooling block is disposed on the rear surface of the image sensor unit, and the cooling block facing the one side of the cooling block.
  • the thermoelectric element may be disposed on the other side of the cooling block.
  • thermoelectric element disposed on the other side of the cooling block is a cooling surface
  • a second surface of the thermoelectric element opposite to the first surface of the thermoelectric element is a heating surface
  • the first surface of the thermoelectric element is a heating surface.
  • a semiconductor region may be formed between the first surface and the second surface of the thermoelectric element.
  • the heat dissipation medium may be applied to an interface between the thermoelectric element and the heat dissipation block by the amount of the semiconductor area, and the sealing part may be disposed outside the semiconductor area between the thermoelectric element and the heat dissipation block.
  • thermoelectric element disposed between the first surface of the thermoelectric element and the second surface of the thermoelectric element and formed to surround the semiconductor region on a horizontal surface may further be included.
  • the heat dissipation block may further include at least one discharge port formed through the inside of the heat dissipation block and discharging steam generated from the effluent of the heat dissipation medium.
  • the sealing unit includes an edge sealing body disposed while surrounding the heat dissipation medium on a horizontal surface.
  • the sealing unit may further include an eluate absorbing unit that is disposed inside the edge sealing body so as to surround the heat dissipation medium on a horizontal surface and absorbs the eluate from the heat dissipation medium.
  • the outlet may communicate with the effluent absorbing unit.
  • the rim sealing body includes a groove formed by being recessed on the other side of the rim sealing body opposite to one side of the rim sealing body, and the dissolution absorbing unit can be inserted into the groove. there is.
  • the rim sealing body may further include at least one discharge hole extending from the groove and penetrating the inside of the rim sealing body, and the discharge hole may be in communication with the discharge port.
  • oil vapor generated by the oil absorbed in the leachate absorbing unit may be discharged to the outside through the discharge hole and the outlet.
  • a space portion in which at least a portion of the heat dissipation medium can be filled is formed at a lower portion of the outlet, and the edge sealing body may be positioned outside the space portion.
  • the heat dissipation block may include a mounting portion formed on the other side of the heat dissipation block opposite to one side of the heat dissipation block and seated on an edge portion formed outside the opening of the cover unit.
  • the edge sealing body may be formed to extend between the heat dissipation block and the cover part.
  • thermoelectric element by providing a sealing unit capable of preventing leakage of the heat dissipation medium applied between the heat dissipation block and the thermoelectric element into the image sensor assembly, oil generated from the heat dissipation medium due to high temperature is transferred to the thermoelectric element or the image sensor unit. penetration can be prevented.
  • the sealing part includes an edge sealing body and a dissolving material absorbing part, and the sealing part is formed to surround the dissolving material absorbing part from the outside, the oil of the heat dissipation medium is prevented from escaping the space between the heat dissipation block and the thermoelectric element.
  • Oil generated from the heat dissipation medium may be prevented from flowing into the thermoelectric element or the image sensor unit.
  • FIG. 1 is a view showing the overall shape of an image sensor assembly according to an embodiment of the present invention.
  • FIG. 2 is an exploded perspective view of an image sensor assembly according to an embodiment of the present invention.
  • FIG. 3 is a cross-sectional view of an image sensor assembly according to an embodiment of the present invention (A-A' direction cross-section in FIG. 1).
  • thermoelectric element 4 is a diagram illustrating another embodiment of a thermoelectric element included in an image sensor assembly according to an embodiment of the present invention.
  • FIG. 5 is a view showing a configuration of a sealing unit provided in an image sensor assembly according to an embodiment of the present invention (an enlarged view of part B in FIG. 3 ).
  • FIG. 6 is a view showing another embodiment of a configuration of a sealing unit provided in an image sensor assembly according to an embodiment of the present invention.
  • FIG. 7 is a view showing another embodiment of a configuration of a sealing unit provided in an image sensor assembly according to an embodiment of the present invention.
  • FIG. 8 is a cross-sectional view of an image sensor assembly according to another embodiment of the present invention.
  • Figure 1 is a view showing the overall shape of the image sensor assembly 100 according to an embodiment of the present invention
  • Figure 2 is an exploded perspective view of the image sensor assembly 100 according to an embodiment of the present invention
  • Figure 3 is A cross-sectional view of the image sensor assembly 100 according to an embodiment of the present invention (A-A' direction cross-section in FIG. 1).
  • illustration of the heat dissipation medium 60 and the support part 80 is omitted.
  • the image sensor assembly 100 includes a cover part 10, an image sensor part 20, a cooling block 30, a thermoelectric element 40, and heat dissipation. It includes a block 50, a heat dissipation medium 60, a sealing part 70 and a support part 80.
  • the cover unit 10 may be formed of a light-transmitting material through which light may pass, but is not limited thereto.
  • An opening may be formed on one side (top) of the cover part 10, and as shown in FIGS. 1 to 3, the heat dissipation block 50 is positioned in the opening of the cover part 10 to The inside can be sealed.
  • the inside of the cover part 10 in a state where the heat dissipation block 50 is located in the opening of the cover part 10, the inside of the cover part 10 may be in a vacuum state.
  • the image sensor unit 20 may be disposed inside the cover unit 10 .
  • the front surface image sensor unit 20 The lower surface of
  • the image sensor unit 20 may sense an image by converting light transmitted through the cover unit 10 through the front surface of the image sensor unit 20 into an electrical signal.
  • the cooling block 30 may be provided on the rear surface of the image sensor unit 20 .
  • one side of the cooling block 30 (lower surface of the cooling block 30) may be disposed on the rear surface of the image sensor unit 20.
  • the cooling block 30 may be formed of a metal material having excellent thermal conductivity, but is not limited thereto.
  • the thermoelectric element 40 may be a component for cooling the image sensor unit 20 .
  • the first surface (lower surface of the thermoelectric element 40) of the thermoelectric element 40 is the other side surface (cooling block 30) of the cooling block 30 opposite to one side surface of the cooling block 30. ) may be disposed on the upper surface of).
  • the first surface (lower surface of the thermoelectric element 40) of the thermoelectric element 40 is a cooling surface 42 and faces the first surface of the thermoelectric element 40.
  • the second surface (upper surface of the thermoelectric element 40) of the thermoelectric element 40 may be a heating surface 44, a thermoelectric module such as a Peltier element.
  • the first surface (cooling surface 42) and the second surface (heating surface 44) of the thermoelectric element 40 may be formed of a ceramic material.
  • thermoelectric element 40 may be indirectly in contact with the heat dissipation block 50 via the heat dissipation medium 60 described above.
  • thermoelectric element 40 may also indirectly contact the cooling block 30 through a heat dissipation medium.
  • thermoelectric element 40 may exemplarily include a P-type semiconductor and an N-type semiconductor.
  • a horizontal area of the semiconductor region 46 may be smaller than horizontal areas of the first and second surfaces of the thermoelectric element 40 .
  • the heat dissipation block 50 may have a configuration in which one side surface is coupled to the thermoelectric element 40 for heat dissipation of the thermoelectric element 40 .
  • one side surface (lower surface of the heat dissipation block 50 ) of the heat dissipation block 50 may be disposed on the second surface of the thermoelectric element 40 .
  • the heat dissipation block 50 may be formed of a metal material having excellent thermal conductivity, but is not limited thereto.
  • the heat dissipation block 50 is formed on the other side of the heat dissipation block 50 (upper surface of the heat dissipation block 50) opposite to one side of the heat dissipation block 50. and a seating portion 52 seated on the rim portion 12 formed outside the opening of the cover portion 10 .
  • the heat dissipation medium 60 may be applied to the interface between the thermoelectric element 40 and the heat dissipation block 50 .
  • the interface between the thermoelectric element 40 and the heat dissipation block 50 may mean a portion between the second surface of the thermoelectric element 40 and one side surface of the heat dissipation block 50 .
  • the heat dissipation medium 60 may be applied to the interface between the thermoelectric element 40 and the heat dissipation block 50 as much as the semiconductor region 46 of the thermoelectric element 40 .
  • the heat dissipation medium 60 may be a thermally conductive compound such as thermal grease or a heat dissipation pad containing silicon oil containing a small amount of oil, but is not limited thereto.
  • the sealing unit 70 may be provided between the thermoelectric element 40 and the heat dissipation block 50 .
  • the sealing unit 70 may be provided between the second surface of the thermoelectric element 40 and one side surface of the heat dissipation block 50 and may be disposed to surround the heat dissipation medium 60 on a horizontal surface.
  • the sealing unit 70 may be disposed on an outer region of the semiconductor region 46 when viewed from above between the second surface of the thermoelectric element 40 and one side surface of the heat dissipation block 50 .
  • the sealing portion 70 is arranged as described above to prevent the heat dissipation block 50 through the heat dissipation medium 60. While securing the heat transfer area, it is possible to prevent the heat dissipation medium 60 from escaping in the lateral direction.
  • the sealing unit 70 is arranged to surround the heat dissipation medium 60 on a horizontal surface, and the dissipate absorption unit 72 absorbs liquid oil generated by the oil of the heat dissipation medium 60.
  • the dissipate absorption unit 72 absorbs liquid oil generated by the oil of the heat dissipation medium 60.
  • a rim sealing body 74 disposed to surround the extract absorbing unit 72 on a horizontal plane.
  • the extract absorbing part 72 and the edge sealing body 74 may each be formed in a hollow shape.
  • the extract absorbing part 72 may be a porous foam material
  • the edge sealing body 74 may be a rubber or silicon material, but is not limited thereto.
  • the edge sealing body 74 is part of the recess 54 formed on one side of the heat dissipation block 50 (one side of the edge sealing body 74 (the upper part of the edge sealing body 74) side) and part of the side surface of the edge sealing body 74) may be inserted.
  • the image sensor assembly 100 of the present invention is provided between a first surface (cooling surface 42) of the thermoelectric element 40 and a second surface (heating surface 44) of the thermoelectric element 40. It may further include a support 80 disposed on the semiconductor region 46 and formed to surround the semiconductor region 46 on a horizontal surface.
  • the support part 80 may be formed of a resin material, and the first surface (cooling surface 42) of the thermoelectric element 40 and the second surface (heating surface 44) of the thermoelectric element 40 ) can be placed between
  • the support part 80 supports the first and second surfaces of the thermoelectric element 40, the first surface of the thermoelectric element 40 is compressed by a compressive force due to the coupling structure of components including the heat dissipation block 50. And it is possible to prevent the second surface from being damaged.
  • heat generated in the image sensor unit 20 may be transferred to the cooling block 30, and the heat transferred to the cooling block 30 may pass through the thermoelectric element 40 and the heat dissipation block 50. may be released to the outside.
  • thermoelectric element 40 is a view showing another embodiment of the thermoelectric element 40 provided in the image sensor assembly.
  • thermoelectric element 40 may be formed in a multilayer structure of two or more layers, unlike the thermoelectric element 40 shown in FIGS. 2 and 3 .
  • thermoelectric element 40 includes an intermediate surface 45, and a cooling surface 42 is disposed below the intermediate surface 45.
  • the heating surface 44 may be disposed on the upper portion of the intermediate surface 45 .
  • the intermediate surface 45 may be formed of a ceramic material.
  • the semiconductor region 46 may also have a multi-layered structure.
  • a first semiconductor region 46a is formed between the heating surface 44 and the intermediate surface 45 of the thermoelectric element 40 .
  • a second semiconductor region 46b may be disposed between the intermediate surface 45 of the thermoelectric element 40 and the cooling surface 42 .
  • the horizontal area of the first semiconductor region 46a and the second semiconductor region 46b may be smaller than the horizontal area of the cooling surface 42 and the heating surface 44 of the thermoelectric element 40 .
  • the support portion 80 may also be formed in a multi-layered structure.
  • the support portion 80 is disposed between the heating surface 44 and the intermediate surface 45 of the thermoelectric element 40. and a first support portion 80a formed to surround the first semiconductor region 46a on a horizontal surface and a second semiconductor region 46b disposed between the intermediate surface 45 of the thermoelectric element 40 and the cooling surface 42 It includes a second support portion (80b) formed to surround on a horizontal surface.
  • the first support portion 80a and the second support portion 80b may be formed of a resin material.
  • FIG. 5 is a view showing the configuration of a sealing unit provided in the image sensor assembly (an enlarged view of part B in FIG. 3 ).
  • the rim sealing body 74 is formed by being recessed on the other side of the rim sealing body 74 (the lower surface of the rim sealing body 74) opposite to one side of the rim sealing body 74 A groove 742 is included.
  • the extract absorbing portion 72 may be inserted into the groove portion 742 formed in the edge sealing body 74 .
  • the heat dissipation block 50 is formed through the inside of the heat dissipation block 50 in the opening direction of the cover part 10, and at least one contacting with the sealing part 70. It includes an outlet 56. As an example, as shown in FIG. 2 , four outlets 56 may be provided in the front, rear, left, and right directions, but are not limited thereto, and may be provided with one to three or five or more outlets.
  • At least one edge sealing body 74 extends from the groove portion 742 and is formed through the inside of the edge sealing body 74 in the opening direction of the cover unit 10. It further includes a discharge hole 744 of. As an example, as shown in FIG. 2 , four discharge holes 744 may be disposed in the front, rear, left, and right directions, but are not limited thereto, and may include one to three or five or more discharge holes.
  • the discharge hole 744 may communicate with the discharge port 56 in a state in which each component of the image sensor assembly 100 is assembled.
  • the oil vapor generated by the oil absorbed by the effluent absorbing unit 72 through the above configuration may be discharged to the outside of the image sensor assembly 100 through the discharge hole 744 and the discharge port 56 .
  • FIG. 6 is a view showing another embodiment of the configuration of the sealing unit 70 provided in the image sensor assembly 100 .
  • the sealing unit 70 includes an extract absorbing unit 72 and an edge sealing body 74 disposed to surround the dissolving material absorbing unit 72 on a horizontal surface.
  • the edge sealing body 74 in the embodiment shown in FIG. 6 may not have a groove 742 and a discharge hole 744 unlike the embodiment shown in FIGS. 3 and 5 .
  • the edge sealing body 74 in the embodiment shown in FIG. 6 is arranged to surround only the outer surface of the extract absorbent 72 on a horizontal plane without covering the upper surface of the extract absorbent 72.
  • the heat dissipation block 50 may be formed to directly contact the upper surface of the dissipation absorber 72, and the discharge port 56 formed inside the dissipation block 50 also connects to the dissipate absorber 72. It may be formed to directly contact.
  • oil vapor generated by the oil absorbed in the effluent absorbing unit 72 may be discharged to the outside through the outlet 56 .
  • a sealing portion capable of preventing leakage of the heat dissipation medium 60 applied between the heat dissipation block 50 and the thermoelectric element 40 into the image sensor assembly 100
  • the 70 it is possible to prevent oil generated from the heat dissipating medium 60 due to high temperature from flowing into the thermoelectric element 40 or the image sensor unit 20.
  • the sealing unit 70 includes an edge sealing body 74 and a dissolving material absorbing unit 72, and the edge sealing unit 74 is formed to surround the dissolving unit 72 from the outside, Oil of the heat dissipation medium 60 may be prevented from escaping the space between the heat dissipation block 50 and the thermoelectric element 40 .
  • oil in a liquid state generated by the oil of the heat dissipation medium 60 is absorbed by the extract absorbing portion 72, and oil vapor generated from the oil absorbed by the extract absorbing portion 72 is a heat dissipation block ( Since it is discharged to the outside through the outlet 56 formed in 50), it is possible to prevent oil generated from the heat dissipating medium 60 from flowing into the thermoelectric element 40 or the image sensor unit 20.
  • FIG. 7 is a view showing another embodiment of a configuration of a sealing unit provided in an image sensor assembly according to an embodiment of the present invention.
  • FIG. 7 is similar to the embodiment shown in FIG. 6, but is different in that the dissolution absorbent 72 is not provided.
  • the heat dissipation medium 60 is positioned up to the bottom of the outlet 56 formed in the heat dissipation block 50, and an edge sealing body 74 constituting the sealing portion 70 is provided outside the heat dissipation medium 60.
  • a space portion 76 that can be filled with a surplus of the heat dissipation medium 60 may be formed below the discharge port 56 . Oil vapor generated from the heat dissipation medium 60 may be discharged to the outside of the image sensor assembly 100 through the outlet 56 communicating with the space 76 .
  • FIG. 8 is a cross-sectional view of an image sensor assembly 100A according to another embodiment of the present invention.
  • the image sensor assembly 100A includes a cover part 110, an image sensor part 120, a cooling block 130, a thermoelectric element 140, a heat dissipation block 150, a heat dissipation medium 160, and a sealing part 170.
  • the image sensor assembly 100A shown in FIG. 8 further includes an outer cover part 102 surrounding the outside of the cover part 110 .
  • the edge sealing body 174 of the sealing unit 170 forming the outer edge of the heat dissipation body 160 is provided to come into contact with the upper end of the cover unit 110. .
  • One side (top) of the cover part 110 forms an opening, and the cover part 110 is coupled to the heat dissipation block 150 so that a space is formed by the cover part 110 and the heat dissipation block 150 .
  • the cover unit 110 may be divided into a first cover unit 112 and a second cover unit 114, and the first cover unit 112 may include a light transmission unit 112a.
  • a substrate 124 of an image sensor unit 120 to be described later may be positioned between the first cover unit 112 and the second cover unit 114 .
  • sealing members 115a and 115b in contact with the substrate 124 are provided to seal the first cover portion 112.
  • the second cover part 114 may be provided on a contact surface contacting the substrate 124 .
  • a coupling hole 118 is formed at the upper end of the second cover portion 114, and the second cover portion 114 is formed by a coupling screw 190 passing through the heat dissipation block 150 and coupled to the coupling hole 118. may be fixed to the heat dissipation block 150 . Meanwhile, a heat insulating member 180 may be provided at a portion where the second cover unit 114 contacts the heat dissipation block 150 so that heat from the heat dissipation block 150 is not transferred to the second cover unit 114. .
  • the coupling screw 190 may be made of a material with low heat transfer rate.
  • the second cover portion 114 may be coupled to the lower surface of the heat dissipation block 150 with an insulating member 180 interposed therebetween using an adhesive. Heat transferred from the thermoelectric element 140 to the heat dissipation block 150 is transferred back through the cover portion 110 to cool by providing the heat insulation member 180 at the connection portion between the heat dissipation block 150 and the cover portion 110. performance degradation can be prevented.
  • the image sensor unit 120 , the cooling block 130 , and the thermoelectric element 140 are disposed in a space formed by the cover unit 110 and the heat dissipation block 150 .
  • the image sensor unit 120 may be mounted on the board 124 through the mounting socket 122 . Meanwhile, the cable 126 connected to the substrate 124 for electrical connection of the image sensor unit 120 may be led out of the image sensor assembly 100A.
  • An upper surface of the image sensor unit 120 is in contact with the cooling block 130 , and an upper surface of the cooling block 130 is in contact with the thermoelectric element 140 .
  • An intermediate member 132 may be provided between the image sensor unit 120 and the cooling block 130 .
  • a heat dissipation medium 160 is provided between the thermoelectric element 140 and the heat dissipation block 150, and an outlet 156 for discharging oil vapor generated from the heat dissipation medium 160 to the outside is provided in the heat dissipation block 150.
  • FIG. 8 the configuration of the sealing part 170 and the outlet 156 is shown in a form similar to the embodiment shown in FIG.
  • the configuration of 156 is also possible to apply the configuration of the sealing portion 70 and the discharge port 56 shown in FIG. 2, FIG. 3, FIG. 5, or FIG. 6, of course.
  • the edge sealing body 174 constituting the sealing unit 170 may be inserted into the recess 154 formed on the lower surface of the heat dissipation block 150 .
  • One side of the rim sealing body 174 (the inner surface of the rim sealing body 174 when viewed on a horizontal plane) is disposed in a form surrounding the heat dissipation medium 160, and the other side of the rim sealing body 174 is the second cover part. It is arranged to be in contact with the upper end of (114).
  • a protrusion 116 may be formed on the upper side of the second cover part 114, and the edge sealing body 174 may be seated and fixed to the protrusion 116.
  • edge sealing body 174 additionally performs a sealing function at the junction between the heat dissipation block 150 and the cover part 110, external moisture enters the cover part 110. transmission can be prevented.
  • the number of parts can be reduced by configuring the edge sealing body 174 to perform both a function of sealing the heat dissipating medium 160 side and a function of sealing the heat dissipation block 150 and the cover unit 110 together.

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  • Engineering & Computer Science (AREA)
  • Multimedia (AREA)
  • Signal Processing (AREA)
  • Physics & Mathematics (AREA)
  • Electromagnetism (AREA)
  • Transforming Light Signals Into Electric Signals (AREA)
  • Cooling Or The Like Of Semiconductors Or Solid State Devices (AREA)
  • Solid State Image Pick-Up Elements (AREA)

Abstract

L'invention concerne un ensemble capteur d'image comprenant une structure d'étanchéité d'un milieu de dissipation de chaleur. L'ensemble capteur d'image selon un mode de réalisation de la présente invention, qui est un ensemble capteur d'image comprenant une unité de couvercle et une unité de capteur d'image disposée à l'intérieur de l'unité de couvercle, comprend : un élément thermoélectrique pour refroidir l'unité de capteur d'image ; un bloc de dissipation de chaleur ayant un côté couplé à l'élément thermoélectrique pour dissiper la chaleur de l'élément thermoélectrique ; un milieu de dissipation de chaleur appliqué à une interface entre l'élément thermoélectrique et le bloc de dissipation de chaleur ; et une partie d'étanchéité disposée entre l'élément thermoélectrique et le bloc de dissipation de chaleur et placée de façon à entourer le milieu de dissipation de chaleur sur un plan horizontal.
PCT/KR2022/011383 2021-08-03 2022-08-02 Ensemble capteur d'image Ceased WO2023014040A1 (fr)

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
KR10-2021-0102164 2021-08-03
KR20210102164 2021-08-03

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WO2023014040A1 true WO2023014040A1 (fr) 2023-02-09

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KR102868904B1 (ko) * 2023-04-05 2025-10-14 주식회사 뷰웍스 카메라 냉각 구조 및 이를 구비한 카메라

Citations (6)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2006174226A (ja) * 2004-12-17 2006-06-29 Konica Minolta Photo Imaging Inc 撮像ユニット及び撮像装置
JP2008227939A (ja) * 2007-03-13 2008-09-25 Olympus Imaging Corp 撮像素子モジュール及びそれを用いた電子機器
KR100950386B1 (ko) * 2009-05-22 2010-03-29 이주상 열전소자를 이용한 이미지센서 냉각장치가 구비된 카메라
KR20140013271A (ko) * 2012-07-23 2014-02-05 주식회사 뷰웍스 방열형 라인스캔카메라
KR20170004053A (ko) * 2015-07-01 2017-01-11 엘지이노텍 주식회사 카메라 모듈
KR20200053317A (ko) * 2018-11-08 2020-05-18 엘지이노텍 주식회사 열전모듈

Family Cites Families (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
KR101597947B1 (ko) 2015-10-29 2016-03-07 주식회사 아맥스 열전소자를 구비한 냉각모듈

Patent Citations (6)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2006174226A (ja) * 2004-12-17 2006-06-29 Konica Minolta Photo Imaging Inc 撮像ユニット及び撮像装置
JP2008227939A (ja) * 2007-03-13 2008-09-25 Olympus Imaging Corp 撮像素子モジュール及びそれを用いた電子機器
KR100950386B1 (ko) * 2009-05-22 2010-03-29 이주상 열전소자를 이용한 이미지센서 냉각장치가 구비된 카메라
KR20140013271A (ko) * 2012-07-23 2014-02-05 주식회사 뷰웍스 방열형 라인스캔카메라
KR20170004053A (ko) * 2015-07-01 2017-01-11 엘지이노텍 주식회사 카메라 모듈
KR20200053317A (ko) * 2018-11-08 2020-05-18 엘지이노텍 주식회사 열전모듈

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