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WO2023009165A1 - Couches de boîtier de dispositif électronique - Google Patents

Couches de boîtier de dispositif électronique Download PDF

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Publication number
WO2023009165A1
WO2023009165A1 PCT/US2021/071061 US2021071061W WO2023009165A1 WO 2023009165 A1 WO2023009165 A1 WO 2023009165A1 US 2021071061 W US2021071061 W US 2021071061W WO 2023009165 A1 WO2023009165 A1 WO 2023009165A1
Authority
WO
WIPO (PCT)
Prior art keywords
layer
housing
electronic device
rigid
elastic material
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Ceased
Application number
PCT/US2021/071061
Other languages
English (en)
Inventor
Wen-Chih Chen
Yi-Te Liu
Wen-Hsiang Chen
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Hewlett Packard Development Co LP
Original Assignee
Hewlett Packard Development Co LP
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Hewlett Packard Development Co LP filed Critical Hewlett Packard Development Co LP
Priority to PCT/US2021/071061 priority Critical patent/WO2023009165A1/fr
Publication of WO2023009165A1 publication Critical patent/WO2023009165A1/fr
Anticipated expiration legal-status Critical
Ceased legal-status Critical Current

Links

Classifications

    • H—ELECTRICITY
    • H04—ELECTRIC COMMUNICATION TECHNIQUE
    • H04M—TELEPHONIC COMMUNICATION
    • H04M1/00—Substation equipment, e.g. for use by subscribers
    • H04M1/02—Constructional features of telephone sets
    • H04M1/0202—Portable telephone sets, e.g. cordless phones, mobile phones or bar type handsets
    • G—PHYSICS
    • G06—COMPUTING OR CALCULATING; COUNTING
    • G06F—ELECTRIC DIGITAL DATA PROCESSING
    • G06F1/00—Details not covered by groups G06F3/00 - G06F13/00 and G06F21/00
    • G06F1/16—Constructional details or arrangements
    • G06F1/1613—Constructional details or arrangements for portable computers
    • H—ELECTRICITY
    • H04—ELECTRIC COMMUNICATION TECHNIQUE
    • H04M—TELEPHONIC COMMUNICATION
    • H04M1/00—Substation equipment, e.g. for use by subscribers
    • H04M1/02—Constructional features of telephone sets
    • H04M1/18—Telephone sets specially adapted for use in ships, mines, or other places exposed to adverse environment
    • H04M1/185—Improving the shock resistance of the housing, e.g. by increasing the rigidity

Definitions

  • An electronic device includes a housing, which can form the outermost enclosure of the electronic device.
  • the housing defines an inner chamber in which various electronic components and other components are included.
  • some electronic components can be mounted on a circuit board or multiple circuit boards.
  • the electronic device can further include a display panel that is contained in the housing.
  • FIG. 1 is a top schematic sectional view of an electronic device housing, according to some examples.
  • FIGs. 2-4 are cross-sectional views of sections of an electronic device housing, according to some examples.
  • FIGs. 5A-5B are top schematic sectional views of a corner portion of an electronic device including a cantilevered housing layer, according to some examples.
  • FIG. 6 is a perspective view of a corner portion of an electronic device including an outer elastic housing layer, according to some examples.
  • FIG. 7 is an inner perspective view of a corner portion an electronic device, according to some examples.
  • FIG. 8 is a flow diagram of a process of making an electronic device housing, according to some examples.
  • identical reference numbers designate similar, but not necessarily identical, elements.
  • the figures are not necessarily to scale, and the size of some parts may be exaggerated to more clearly illustrate the example shown.
  • the drawings provide examples and/or implementations consistent with the description; however, the description is not limited to the examples and/or implementations provided in the drawings.
  • the housing of an electronic device can be formed of a material that is subject to cracking, breaking, warping, or any other type of deformation when a sufficient force is applied on a portion of the housing.
  • the electronic device can be dropped onto the ground, which can impart a large enough force on the housing to cause damage of the housing.
  • force can be imparted on the electronic device housing in other ways.
  • Examples of materials that can be used to form an electronic device housing include plastic, glass, metal (e.g., aluminum), or any other relatively rigid material.
  • an outer layer formed of an elastic material can be provided around the layer of rigid material.
  • the outer layer can be formed of thermoplastic polyurethane (TPU).
  • TPU thermoplastic polyurethane
  • the outer layer formed of the elastic material can be purchased or otherwise obtained separately from the electronic device, e.g., as an accessory. The outer layer can then be fitted around the electronic device housing.
  • the outer layer formed of the elastic material can be built as part of a manufacturing process of the electronic device housing.
  • the layer formed of the elastic material may not provide sufficient protection for the layer of rigid material of the electronic device housing.
  • the force generated on a portion of the electronic device housing may cause damage to the electronic device housing.
  • the electronic device housing may have multiple corners. If the electronic device housing were to be dropped such that a corner impacts the ground, a sufficiently large force can be imparted on the corner of the electronic device housing to cause damage.
  • enhanced protection is provided for an electronic device housing by forming multiple layers of the electronic device housing that includes both an outer layer and an inner layer formed of an elastic material.
  • An intermediate layer formed of a rigid material can be provided between the outer layer and the inner layer in the electronic device housing. The presence of the outer layer and the inner layer provides enhanced protection for the intermediate layer against damage due to a large force applied to the electronic device housing, such as when the electronic device housing is dropped onto the ground or when another blunt force is applied onto a portion of the electronic device housing.
  • FIG. 1 is a top schematic sectional view of an electronic device housing 100, in accordance with some implementations of the present disclosure.
  • the electronic device housing 100 can be the housing for an electronic device.
  • the electronic device may be a computing device such as a laptop or notebook computer, a tablet, or other mobile electronic device.
  • the electronic device may be a desktop or all-in-one (AIO) computing device.
  • the electronic device housing 100 defines an inner space 102 in which various electronic components 104 (and other components) of an electronic device can be contained.
  • Examples of electronic components can include any or some combination of the following: a processor, a memory device, a persistent storage device, an input/output device (I/O) device, a display panel, a user input device, and so forth.
  • the electronic components 104 are shown in dotted profiles because they do not actually form part of the electronic device housing 100, but are rather part of an electronic device that can include the electronic device housing 100.
  • the electronic device housing 100 includes multiple housing layers.
  • the multiple housing layers include a rigid housing layer 106 (made up of rigid housing layer segments 106-1, 106-2, 106-3, and 106-4), an outer elastic housing layer 108, and an inner elastic housing layer 110 (made up of inner elastic housing layer segments 110-1, 110-2, 110-3, and 110-4).
  • the rigid housing layer 106 extends around the outer perimeter of the electronic device housing 100.
  • the outer elastic housing layer 108 extends around the outside of the rigid housing layer 106.
  • the inner elastic housing layer 110 is made up of four segments (110-1, 110-2, 110-3, and 110-4) at the four corner regions of the generally rectangular (when viewed from the top) electronic device housing 100.
  • the electronic device housing 100 in some examples is not perfectly rectangular in shape, but is generally rectangular with rounded corners in some examples. In other examples, the corners can be sharp corners, or the corners of the electronic device housing 100 can be beveled. In other examples, the electronic device housing 100 can have a shape that is different from being generally rectangular in cross-section.
  • the multiple housing layers of the electronic device housing 100 include three housing layers: the outer elastic housing layer 108, the rigid housing layer 106, and the inner elastic housing layer 110, where the rigid housing layer 106 is sandwiched between the outer elastic housing layer 108 and the inner elastic housing layer 110.
  • the inner elastic housing layer segments 110-1, 110-2, 110-3, and 110-4 are provided at first regions (e.g., at the corner portions) of the rigid housing layer 106.
  • the inner elastic housing layer is omitted from regions of the rigid housing layer 106 away from the corner portions.
  • the rigid housing layer 106 does not continuously extend around the outer perimeter of the electronic device housing 100. Rather, the rigid housing layer 106 can be broken up into multiple segments 106-1, 106-2, 106- 3, and 106-4. The four rigid housing layer segments 106-1 to 106-4 are separated by gaps 112-1, 112-2, 112-3, and 112-4 in the rigid housing layer 106.
  • Bridges 114-1, 114-2, 114-3, and 114-4 fill the respective gaps 112-1, 112-2, 112-3, and 112-4. More specifically, the bridge 114-1 fills the gap 112-1 and connects the outer elastic housing layer 108 to the respective inner elastic housing layer segment 110-1, the bridge 114-2 fills the gap 112-2 and connects the outer elastic housing layer 108 to the respective inner elastic housing layer segment 110- 2, the bridge 114-3 fills the gap 112-3 and connects the outer elastic housing layer 108 to the respective inner elastic housing layer segment 110-3, and the bridge 114- 4 fills the gap 112-4 and connects the outer elastic housing layer 108 to the respective inner elastic housing layer segment 110-4.
  • the bridges 114-1, 114-2, 114-3, and 114-4 are formed of the elastic material used to form the outer elastic housing layer 108 and the inner elastic housing layer 110.
  • the bridges 114-1, 114-2, 114-3, and 114-4 can be integrally formed with the outer elastic housing layer 108 and the respective inner elastic housing layer segments 110-2, 110-3, and 110-4.
  • the bridges 114-1, 114-2, 114-3, and 114-4 are separate from the outer elastic housing layer 108 and/or the inner elastic housing layer 110 and can be adhered or otherwise attached to the outer elastic housing layer 108 and/or the inner elastic housing layer 110.
  • the elastic material used to form the outer elastic housing layer 108, the bridges 114-1, 114-2, 114-3, and 114-4, and the inner elastic housing layer 110 are the same. In other examples, different elastic materials can be used to form outer elastic housing layer 108, the bridges 114-1, 114-2, 114-3, and 114-4, and/or the inner elastic housing layer 110.
  • bridges 114-1, 114-2, 114-3, and 114-4 allow for the electronic device housing 100 to absorb a larger amount of impact force without damage (e.g., due to cracking, breaking, warping, or another deformation). Any force imparted on a corner portion of the electronic device housing 100 is directed through the outer elastic housing layer 108, through a corresponding bridge (114-1, 114-2, 114-3, or 114-4), and to the respective inner elastic housing layer segment (110-1, 110-2, 110-3, or 110-4), for dispersing the force over a larger surface area to reduce the possibility of damage due to the force.
  • Examples of elastic materials can include any or some combination of the following: TPU or another type of polymer, silicone rubber, or another type of relatively elastic material.
  • Examples of rigid materials can include any or some combination of the following: plastic, glass, metal (e.g., aluminum), or any other relatively rigid material.
  • the elasticity of a material can be represented by an elastic modulus, also referred to as the Young's modulus.
  • the Young's modulus for plastic which is an example of a rigid material that can be used to form the rigid housing layer 106, is approximately 2 gigapascals (GPa).
  • the Young's modulus for glass is approximately 70 GPa
  • aluminum is approximately 70 GPa. Glass and aluminum are other examples of rigid materials that can be used to form the rigid housing layer 106.
  • the Young's modulus for TPU is approximately 0.02 GPa
  • the Young's modulus for silicone rubber is approximately 0.001 GPa.
  • an elastic material can have a Young's modulus of less than 0.5 GPa, or less than 0.2 GPa, or less than 0.1 GPa, or less than 0.05 GPa, or less than 0.03 GPa, as examples.
  • a rigid material can have a Young's modulus that exceeds 0.5 GPa, or 1 GPa, or 1.5 GPa, as examples.
  • FIG. 2 shows the bridge 114-1 interconnecting the outer elastic housing layer 108 and the inner elastic housing layer segment 110-1.
  • the bridge 114-1 is formed of the same elastic material as the outer elastic housing layer 108 and the inner elastic housing layer segment 110-1, for example. In some examples, the bridge 114-1 is integrally formed with the outer elastic housing layer
  • FIG. 3-3 of FIG. 1 is shown in FIG. 3, which is away from the location of the bridge 114-1.
  • FIG. 3 shows the rigid housing layer segment 106-1 being sandwiched between the outer elastic housing layer 108 and the inner elastic housing layer segment 110-1.
  • the rigid housing layer 106 is an intermediate layer of the electronic device housing 100 between the outer layer (108) and the inner layer (110) of the electronic device housing 100.
  • FIG. 4-4 is shown in FIG. 4, which is away from the corner region.
  • FIG. 4 shows a portion of the electronic device housing 100 where the inner elastic housing layer 110 is not present.
  • FIG. 4 shows the outer elastic housing layer 108 and the rigid housing layer segment 106-1.
  • FIGs. 5A-5B illustrate a corner portion of an electronic device 500 that has an electronic device housing 502 for housing electronic device components 503 and other components of the electronic device 500.
  • the electronic device housing 502 includes rigid housing layer segments 504-1 and 104-2, which are separated by a gap 506 (similar to the gap 112-1, 112-2, 112-3, or 112-4 of FIG. 1).
  • the rigid housing layer segments 504-1 and 504-2 are among multiple rigid housing layer segments that make up a rigid housing layer 504, similar to the rigid housing layer 106 of FIG. 1.
  • FIGs. 5A-5B the outer elastic housing layer and the inner elastic housing layer (similar to 108 and 106 in FIG. 1 ) are not shown.
  • a space 508 is defined inside the rigid housing layer 504 to accommodate an inner elastic housing layer segment (similar to 110-1 , 110-2, 110-3, or 110-4 in FIG.
  • the outer elastic housing layer if shown would be provided outside the rigid housing layer 504.
  • each rigid housing layer segment 504-1 or 504-2 includes a respective cantilever.
  • the rigid housing layer segment 504-1 has a thicker portion 504-11 and a thinner portion that makes up a cantilever 504-12 of the rigid housing layer segment 504-1.
  • the rigid housing layer segment 504-2 (as well as the other rigid housing layer segments of the rigid housing layer 504) is similarly configured.
  • the cantilever 504-12 is adjacent the space 508, and the cantilever 504- 12 can be deflected inwardly into the space 508 in response to an outer force 510 (FIG. 5B) applied against the rigid housing layer segment 504-1.
  • the cantilever of the rigid housing layer segment 504-2 is similarly deflected inwardly into the space 508 in response to the outer force 510.
  • the rigid housing layer 504 thus includes cantilevers having ends separated by a gap (e.g., 506).
  • FIG. 6 is a different perspective view of the corner portion of the electronic device 500, which shows an outer elastic housing layer 602 that surrounds the rigid housing layer segments 504-1 and 504-2 of the rigid housing layer 504.
  • the outer elastic housing layer 602 is shown as transparent so that the rigid housing layer segments 504-1 and 504-2 are visible.
  • the inner elastic housing layer segment is omitted.
  • FIG. 7 is an inner perspective view of the corner portion of the electronic device 500, which shows an inner elastic housing layer segment 702 covering portions of a first side of the rigid housing layer segments 504-1 and 504-2. A second opposite side of the rigid housing layer segments 504-1 and 504-2 is covered by the outer elastic housing layer 602.
  • FIG. 8 is a flow diagram of a process 800 of making an electronic device housing, according to some examples.
  • the process 800 includes forming (at 802) an inner layer and an outer layer of the electronic device housing, the inner layer and the outer layer being formed of an elastic material.
  • the process 800 includes forming (at 804) an intermediate layer sandwiched by the inner layer and the outer layer, the intermediate layer being part of the electronic device housing and formed of a rigid material.
  • the inner layer and the outer layer and a bridge interconnecting the inner layer and the outer layer are formed together using a first injection molding process.
  • the intermediate layer is formed using a second injection molding process.
  • the injection molding processes used to form the inner layer, the outer layer, and the intermediate layer may be based on mature injection molding processes, so that the cost of manufacturing an electronic device housing according to some examples can be less costly.

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  • Engineering & Computer Science (AREA)
  • Theoretical Computer Science (AREA)
  • Signal Processing (AREA)
  • Computer Hardware Design (AREA)
  • Human Computer Interaction (AREA)
  • Physics & Mathematics (AREA)
  • General Engineering & Computer Science (AREA)
  • General Physics & Mathematics (AREA)
  • Casings For Electric Apparatus (AREA)

Abstract

Dans certains exemples, un boîtier pour un dispositif électronique comprend une pluralité de couches comprenant une couche externe et une couche interne, la couche externe et la couche interne étant constituées d'un matériau élastique. La pluralité de couches comprend en outre une couche intermédiaire entre la couche interne et la couche externe, la couche intermédiaire étant formée d'un matériau rigide.
PCT/US2021/071061 2021-07-30 2021-07-30 Couches de boîtier de dispositif électronique Ceased WO2023009165A1 (fr)

Priority Applications (1)

Application Number Priority Date Filing Date Title
PCT/US2021/071061 WO2023009165A1 (fr) 2021-07-30 2021-07-30 Couches de boîtier de dispositif électronique

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
PCT/US2021/071061 WO2023009165A1 (fr) 2021-07-30 2021-07-30 Couches de boîtier de dispositif électronique

Publications (1)

Publication Number Publication Date
WO2023009165A1 true WO2023009165A1 (fr) 2023-02-02

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ID=85087183

Family Applications (1)

Application Number Title Priority Date Filing Date
PCT/US2021/071061 Ceased WO2023009165A1 (fr) 2021-07-30 2021-07-30 Couches de boîtier de dispositif électronique

Country Status (1)

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WO (1) WO2023009165A1 (fr)

Citations (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US20140243054A1 (en) * 2012-11-30 2014-08-28 Superior Communications, Inc. Mobile device case with cushion devices
WO2016005942A1 (fr) * 2014-07-09 2016-01-14 Sabic Global Technologies B.V. Composites à paroi mince de boîtiers électroniques et d'autres dispositifs
US20170187853A1 (en) * 2014-05-30 2017-06-29 Samsonite IP Holdings S.àr.l Protective Cover for an Electronic Device Including Impact Geometry
US20170248991A1 (en) * 2014-09-19 2017-08-31 Gen Nine, Inc. Wearable computing system

Patent Citations (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US20140243054A1 (en) * 2012-11-30 2014-08-28 Superior Communications, Inc. Mobile device case with cushion devices
US20170187853A1 (en) * 2014-05-30 2017-06-29 Samsonite IP Holdings S.àr.l Protective Cover for an Electronic Device Including Impact Geometry
WO2016005942A1 (fr) * 2014-07-09 2016-01-14 Sabic Global Technologies B.V. Composites à paroi mince de boîtiers électroniques et d'autres dispositifs
US20170248991A1 (en) * 2014-09-19 2017-08-31 Gen Nine, Inc. Wearable computing system

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