WO2023098206A1 - Housing and electronic device - Google Patents

Abstract

The present application provides a housing and an electronic device. The housing comprises a first supporting plate, a second supporting plate and a vapor chamber. The first supporting plate, the vapor chamber and the second supporting plate are arranged in a stacked manner, and the vapor chamber is located between and connected to the first supporting plate and the second supporting plate. A heat dissipation channel is arranged in the vapor chamber, the heat dissipation channel comprises a main heat dissipation channel and an auxiliary heat dissipation channel, the main heat dissipation channel is communicated with the auxiliary heat dissipation channel, and heat exchange may occur between the main heat dissipation channel and the auxiliary heat dissipation channel. The housing provided by the present application solves the technical problem in the prior art of poor heat dissipation performance of a housing.

Description

Cases and Electronics

This application claims priority to a Chinese patent application with application number 202111436285.X and application title "Housing and Electronic Devices" filed with the China Patent Office on November 30, 2021, the entire contents of which are hereby incorporated by reference into this application .

technical field

The present application relates to the technical field of electronic products, in particular to a casing and electronic equipment.

Background technique

With the development of science and technology, electronic devices (such as mobile phones, tablet computers, etc.) are gradually becoming thinner and lighter. The back cover made of plastic is conducive to the thinning of electronic equipment, and the thermal conductivity of plastic is poor, resulting in poor heat dissipation performance of electronic equipment and affecting the performance of the whole machine.

Contents of the invention

The present application provides a casing to solve the technical problem of poor heat dissipation performance of the casing in the prior art.

In a first aspect, the present application provides a casing. The casing includes: a first support plate, a second support plate and a heat soaking plate. The first support plate, the heat soaking plate and the second support plate are stacked, and the heat soaking plate is located between the first support plate and the second support plate, and connected with the first support plate and the second support plate. A heat dissipation channel is provided in the vapor chamber, and the heat dissipation channel includes a main heat dissipation channel and an auxiliary heat dissipation channel, the main heat dissipation channel and the auxiliary heat dissipation channel are connected, and heat exchange can occur between the main heat dissipation channel and the auxiliary heat dissipation channel.

In this embodiment, by disposing a vapor chamber between the first support plate and the second support plate, the heat dissipation effect of the housing can be improved. In addition, the vapor chamber also plays a role of equalizing heat. Through the heat exchange between the main heat dissipation channel and the auxiliary heat dissipation channel, the heat transmitted from the first support plate to the vapor chamber can be evenly distributed to the entire heat chamber, thereby The heat dissipation efficiency of the housing can be improved, thereby improving the performance and service life of the electronic equipment. In addition, the vapor chamber has high strength, and by disposing the vapor chamber between the first support plate and the second support plate, the strength of the housing can be improved and the flatness of the housing can be reduced.

In one embodiment, the vapor chamber includes a low temperature region and a high temperature region connected to the low temperature region. The vapor chamber is filled with coolant, which can be vaporized in the high-temperature area and condensed in the low-temperature area, so that the heat in the high-temperature area can be transferred to the low-temperature area. In this embodiment, the temperature of the high-temperature region is higher than that of the low-temperature region, and by conducting the heat from the high-temperature region to the low-temperature region, the heat distribution of the vapor chamber can be evenly distributed, thereby improving the heat dissipation efficiency of the housing.

In one embodiment, a capillary structure is provided in the heat dissipation channel, and the cooling liquid is filled in the capillary structure, and the cooling liquid can undergo gas-liquid circulation in the main heat dissipation channel and the auxiliary heat dissipation channel, so that the heat in the high temperature area is conducted to the the low temperature region.

In this embodiment, the coolant located in the high temperature area is vaporized by heat, absorbs heat and expands rapidly. The vaporized coolant quickly fills the entire heat dissipation channel, and when the vaporized coolant touches a low-temperature area, it condenses and releases the heat accumulated during vaporization. The condensed coolant passes through the capillary structure and returns to the hot zone in the vapor chamber. After continuous circulation, during the process of vaporization and condensation, the coolant continuously transfers the heat from the high-temperature area of the vapor chamber to the low-temperature area, so as to achieve a uniform heat effect, so that the heat of the vapor chamber is evenly distributed throughout the vapor chamber. Thereby improving the heat dissipation effect.

In one embodiment, the heat dissipation channel also includes a flow guide channel, one end of the flow guide channel is connected to the main heat dissipation channel, and the other end is connected to the auxiliary heat dissipation channel, and the main heat dissipation channel, the auxiliary heat dissipation channel and the flow guide channel are connected; the width of the flow guide channel Less than the width of the main heat dissipation channel and the auxiliary heat dissipation channel.

In this embodiment, by setting the width of the flow guide channel to be smaller than the width of the main heat dissipation channel and the auxiliary heat dissipation channel, when the vaporized coolant passes through the flow guide channel, the flow speed will be accelerated, thereby speeding up the main heat dissipation channel and the auxiliary heat dissipation channel. The heat transfer between the channels accelerates the heat equalization effect of the vapor chamber, thereby improving the heat dissipation efficiency of the shell.

In one embodiment, the material of the vapor chamber is copper, carbon fiber, graphene or graphite sheet. The vapor chamber made of copper or carbon fiber has excellent thermal conductivity, high strength and good ductility. When the vapor chamber is applied to the shell, the heat dissipation performance, strength and toughness of the shell can be improved. The vapor chamber made of graphene or graphite sheet has excellent heat conduction performance, thereby improving the heat dissipation performance of the housing.

In one embodiment, the thickness of the casing is 0.5mm-0.65mm.

In one embodiment, the casing further includes a protection plate, the protection plate is provided with a receiving groove, and the vapor chamber is located in the receiving groove and is fixedly connected with the protection plate. In this embodiment, by providing a protection plate and installing the vapor chamber in the receiving groove of the protection plate, the protection plate can protect the heat vapor chamber. Moreover, the protection plate can also prevent the vapor chamber from being exposed from the edge area, which does not affect the appearance design of the housing 100 and improves the aesthetics of the housing.

In one embodiment, the surface of the first supporting plate facing the vapor chamber is provided with an installation groove, and the chamber is located in the installation groove; or, the surface of the second support plate facing the chamber is provided with an installation groove, and the chamber is located in the installed in the slot. In this embodiment, the installation groove is directly provided on the first support plate or the second support plate, and the vapor chamber is installed in the installation groove, without additional protection plate, so that the structure of the housing can be simplified and the weight of the housing can be further reduced. quality.

In one embodiment, the surface of the first support plate facing the vapor chamber is provided with an installation groove, the surface of the second support plate facing the heat chamber is provided with an installation groove, and the installation groove of the first support plate and the installation of the second support plate The slots snap together to secure the vapor chamber. In this embodiment, installation grooves are directly provided on the first support plate and the second support plate, and the vapor chamber is installed in the installation grooves without additional protection plates, which can simplify the structure of the housing and further reduce the weight of the housing. quality.

In one embodiment, the housing is a one-piece molded part. In this embodiment, the integrally formed shell can be prepared by secondary injection molding or multiple injection molding, so that the structural stability of the shell can be increased.

In one embodiment, the casing includes a decorative layer, and the decorative layer is stacked on the surface of the first support plate facing away from the heat chamber. In this embodiment, by providing the decorative layer, the aesthetics of the casing can be improved, and the user's feeling of use can also be improved. At the same time, the decoration layer can also protect the first support plate.

In one embodiment, the decoration layer is formed on the surface of the first support plate by spraying or non-conductive coating process. In this embodiment, the decorative layer formed by the non-conductive coating technology (NCVM) has a metal coating mirror effect, rich colors, and can improve the aesthetics of the casing. At the same time, the decorative layer formed by the NCVM technology has a high resistivity, which can avoid affecting the communication performance of the electronic equipment. Forming the decorative layer through a spraying process can simplify the process.

In one embodiment, the housing includes an ink layer, and the ink layer is stacked on the surface of the second support plate facing away from the vapor chamber. In this embodiment, the ink layer is formed on the surface of the second support plate through a spraying process. By arranging the ink layer, the aesthetics of the casing can be improved, and at the same time, the ink layer can protect the second support plate.

In a second aspect, the present application provides an electronic device, which includes a body and the casing described above, and the casing is installed on the body. The electronic equipment provided by this embodiment is small in thickness and light in weight. Moreover, the casing has high strength and good toughness, which is beneficial to improving the drop resistance and durability of the electronic equipment. At the same time, the flatness of the shell is small, thereby improving the smoothness of the appearance of the electronic device and improving the user experience.

In one embodiment, the vapor chamber includes a low-temperature area and a high-temperature area, a first heating element and a second heating element are installed in the body, the heat of the first heating element is greater than that of the second heating element, and the high-temperature area is connected with the first heating element. relatively.

In this embodiment, the heat generated by the first heating element can be transmitted to the high temperature area of the vapor chamber, and the heat generated by the second heating element can be transmitted to the low temperature area. Moreover, the temperature in the high-temperature area is higher than that in the low-temperature area, and the heat in the high-temperature area can be conducted to the low-temperature area, so that the heat distribution of the vapor chamber can be made uniform, and the heat dissipation efficiency of the housing can be improved. The application provides a housing, including: The first support plate, the second support plate and the heat soaking plate, the first support plate, the heat soaking plate and the second support plate are stacked, and the heat soaking plate is located between the first support plate and the second support plate, and is connected to the second support plate A supporting board is connected with the second supporting board.

In summary, in the present application, by disposing a vapor chamber between the first support plate and the second support plate, the heat dissipation effect of the casing can be improved. In addition, the vapor chamber also plays a role of equalizing heat. Through the heat exchange between the main heat dissipation channel and the auxiliary heat dissipation channel, the heat transmitted from the first support plate to the vapor chamber can be evenly distributed to the entire heat chamber, thereby The heat dissipation efficiency of the housing can be improved, thereby improving the performance and service life of the electronic equipment. In addition, the vapor chamber has high strength, and by disposing the vapor chamber between the first support plate and the second support plate, the strength of the housing can be improved and the flatness of the housing can be reduced.

Description of drawings

In order to more clearly illustrate the technical solutions in the embodiment of the present application or the background art, the following will describe the drawings that need to be used in the embodiment of the present application or the background art.

FIG. 1 is a schematic structural diagram of an electronic device provided by the present application;

FIG. 2 is a schematic structural diagram of a housing in the electronic device shown in FIG. 1;

Fig. 3 is a schematic diagram of an exploded structure of the housing shown in Fig. 2;

Fig. 4 is an enlarged structural schematic diagram of the vapor chamber in the housing shown in Fig. 2;

Fig. 5 is a sectional view of the vapor chamber shown in Fig. 4;

Fig. 6 is a schematic structural view of a vapor chamber in a housing provided in another embodiment of the present application;

Fig. 7 is a partial structural schematic diagram of the housing shown in Fig. 2;

Fig. 8 is a schematic diagram of an exploded structure of a casing provided by the second embodiment of the present application.

Detailed ways

Embodiments of the present application are described below with reference to the drawings in the embodiments of the present application.

Please refer to FIG. 1 . FIG. 1 is a schematic structural diagram of an electronic device 200 provided in this application.

Electronic devices 200 include but are not limited to cellphones, notebook computers, tablet personal computers, laptop computers, personal digital assistants, or wearable devices ( wearable device) etc. Hereinafter, the electronic device 200 is described as a mobile phone.

The electronic device 200 includes a body 110 and a casing 100 , and the casing 100 is installed on the body 110 . The casing 100 is a battery cover of the electronic device 200 . The structure of the housing 100 will be described in detail below.

For ease of description, in this application, the width direction of the casing 100 is defined as the X direction, the length direction is defined as the Y direction, and the thickness direction is defined as the Z direction. Wherein, the X direction, the Y direction and the Z direction are perpendicular to each other.

Please refer to FIG. 2 and FIG. 3 , FIG. 2 is a schematic structural diagram of the casing 100 in the electronic device shown in FIG. 1 , and FIG. 3 is a schematic diagram of an exploded structure of the casing 100 shown in FIG. 2 .

In one embodiment of the present application, the casing 100 includes a first support plate 10 , a second support plate 20 , a heat vapor chamber 30 and a protection plate 40 . The vapor chamber 30 is nested in the protection plate 40, the first support plate 10, the protection plate 40 and the second support plate 20 are stacked, and the protection plate 40 and the heat vapor chamber 30 are located on the first support plate 10 and the second support plate 20, and connected with the first support plate 10 and the second support plate 20.

The first support plate 10 is a rectangular thin plate. The first supporting board 10 includes a first upper surface 11 and a first lower surface 12 , and the first upper surface 11 is opposite to the first lower surface 12 . In this embodiment, the first support plate 10 is made of polyethylene terephthalate (PET). In other embodiments, the first support plate 10 can also be made of polymethyl methacrylate (acrylic, PMMA), polycarbonate (PC) or other plastics. The first support plate 10 made of plastic is light in weight, which is conducive to the thinning of the electronic device 200 . Alternatively, the first support plate 10 can also be made of glass or ceramic material.

The casing 100 further includes a decoration layer (not shown in the figure), and the decoration layer is located on the first upper surface 11 . In this embodiment, the decorative layer is a paint layer. Wherein, the decoration layer is formed on the first upper surface 11 by non-conductive vacuum metalization (NCVM). The decoration layer formed by the NCVM technology has a metal coating mirror effect and rich colors, which can improve the aesthetics of the casing 100 . At the same time, the decorative layer formed by the NCVM technology has a high resistivity, which can avoid affecting the communication performance of the electronic device 200 . In other embodiments, the decoration layer is formed on the first upper surface 11 through a spraying process to simplify the formation process of the decoration layer. In this embodiment, by providing a decorative layer, the aesthetics of the casing 100 can be improved, and the user's feeling of use can also be improved. At the same time, the decoration layer can also protect the first support plate 10 .

Please continue to refer to FIG. 3 , the second support plate 20 is a rectangular thin plate. The size and shape of the second support plate 20 are the same as those of the first support plate 10 . The second support plate 20 includes a second upper surface 21 and a second lower surface 22 , and the second upper surface 21 is opposite to the second lower surface 22 . In this embodiment, the second support plate 20 is made of polyethylene terephthalate (PET). In other embodiments, the second support plate 20 can also be made of polymethyl methacrylate (acrylic, PMMA), polycarbonate (PC) or other plastics. The second support plate 20 made of plastic is light in weight, which is conducive to the thinning of the electronic device 200 . In one embodiment, the second support plate 20 can also be made of glass or ceramic material.

The casing 100 further includes an ink layer (not shown in the figure), and the ink layer is located on the second lower surface 22 . In this embodiment, the ink layer is formed on the second lower surface 22 through a spraying process. By providing the ink layer, the aesthetics of the housing 100 can be improved, and at the same time, the ink layer can protect the second support plate 20 .

In one embodiment, opposite sides of the vapor chamber 30 are connected to the first lower surface 12 and the second upper surface 21 . In another embodiment, the heat vapor chamber 30 is embedded in the first lower surface 12 and/or the second upper surface 21 , wherein the embedded means that the heat chamber 30 is partially embedded. The specific implementation is introduced in the following content.

Please refer to FIG. 4 . FIG. 4 is an enlarged structural diagram of the vapor chamber 30 in the housing 100 shown in FIG. 2 .

In this embodiment, the vapor chamber 30 is made of copper. In other embodiments, the material of the vapor chamber 30 may also be carbon fiber. The vapor chamber 30 made of copper or carbon fiber has excellent thermal conductivity, high strength and good ductility. When the vapor chamber 30 is applied to the housing 100 , the heat dissipation performance, strength and toughness of the housing 100 can be improved. In other embodiments, the material of the vapor chamber 30 may also be graphene or graphite sheet.

The vapor chamber 30 includes a main body section 31 , a flow guide section a and an auxiliary heat dissipation section b. In this embodiment, the main body section 31 is rectangular. In other embodiments, the main body segment 31 may also be circular, rhombus or other shapes. The guide section a includes a first guide section 32 and a second guide section 33 . In this embodiment, the first flow guide section 32 and the second flow guide section 33 are both rectangular, and the widths of the first flow guide section 32 and the second flow guide section 33 are both smaller than the width of the main body section 31. The "width" mentioned here refers to the dimension along the X direction. That is to say, the size of the first flow guide section 32 and the second flow guide section 33 along the X direction is smaller than the size of the main body section 31 along the X direction. The first guide section 32 and the second guide section 33 are respectively located at two opposite ends of the body section 31 along the Y direction, and are connected to the body section 31 .

The auxiliary heat dissipation section b includes a first auxiliary heat dissipation section 34 and a second auxiliary heat dissipation section 35 . The widths of the first auxiliary heat dissipation section 34 and the second auxiliary heat dissipation section 35 are both larger than the width of the air guiding section a. That is to say, the dimensions of the first auxiliary heat dissipation section 34 and the second auxiliary heat dissipation section 35 along the X direction are larger than the dimensions of the air guide section a along the X direction. The first auxiliary cooling section 34 is connected to an end of the first air guiding section 32 away from the main section 31 , and the second auxiliary cooling section 35 is connected to an end of the second air guiding section 33 away from the main section 31 .

In this embodiment, the width of the first auxiliary heat dissipation section 34 and the second auxiliary heat dissipation section 35 is the same as that of the main body section 31 . The first auxiliary heat dissipation section 34, the first air guide section 32, the main body section 31, the second air guide section 33, and the second auxiliary heat dissipation section 35 are arranged in sequence and have a flat structure. The length of the vapor chamber 30 is the length of the first auxiliary heat dissipation section. 34. The sum of the lengths of the first flow guide section 32 , the main body section 31 , the second flow guide section 33 and the second auxiliary heat dissipation section 35 . In other embodiments, the width of the first auxiliary heat dissipation section 34 and the second auxiliary heat dissipation section 35 may also be different from the width of the main body section 31 .

Please continue to refer to FIG. 4 , the vapor chamber 30 is a hollow plate-like structure. The vapor chamber 30 includes a top wall 36 , a bottom wall 37 and side walls 38 . The top wall 36 and the bottom wall 37 are arranged oppositely, and are stacked and spaced along the Z direction. A side wall 38 connects the top wall 36 and the bottom wall 37 . The top wall 36 , the bottom wall 37 and the side wall 38 jointly enclose and form a sealed heat dissipation channel c.

The heat dissipation channel c includes a main heat dissipation channel 301 , a first flow guide channel 302 , a second flow guide channel 303 , a first auxiliary heat dissipation channel 304 and a second auxiliary heat dissipation channel 305 . The main heat dissipation channel 301 corresponds to the main body section 31 of the vapor chamber 30 , that is, the main heat dissipation channel 301 is disposed inside the main body section 31 . The first flow guide channel 302 corresponds to the first flow guide section 32 , that is, the first flow guide channel 302 is disposed inside the first flow guide section 32 . The second guide channel 303 corresponds to the second guide section 33 , that is, the second guide channel 303 is disposed in the second guide section 33 . The first auxiliary heat dissipation channel 304 corresponds to the first auxiliary heat dissipation section 34 , that is, the first auxiliary heat dissipation channel 304 is disposed in the first auxiliary heat dissipation section 34 . The second auxiliary heat dissipation channel 305 corresponds to the second auxiliary heat dissipation section 35 , that is, the second auxiliary heat dissipation channel 305 is disposed in the second auxiliary heat dissipation section 35 . Wherein, the width of the first auxiliary heat dissipation channel 304 and the second auxiliary heat dissipation channel 305 is the same as that of the main heat dissipation channel 301, and the width of the first guide channel 302 is wider than that of the main heat dissipation channel 301, the first auxiliary heat dissipation channel 304 and the second auxiliary heat dissipation channel 301. The widths of the cooling channels 305 are all small.

Please also refer to FIG. 5 , which is a cross-sectional view of the vapor chamber 30 shown in FIG. 4 .

In this embodiment, capillary structures d are provided on the inner surfaces of the top wall 36 and the bottom wall 37 , and the capillary structures d are located in the entire heat dissipation channel c. That is, the main cooling channel 301 , the first flow guide channel 302 , the second flow guiding channel 303 , the first auxiliary cooling channel 304 and the second auxiliary cooling channel 305 are all provided with a capillary structure d. The capillary structure d is filled with cooling liquid. In this embodiment, the capillary structure d is a porous medium based on copper, for example, copper mesh, sintered copper powder, copper foam, and the like. In other embodiments, the capillary structure d may also be other porous microstructures.

When the heat generated by the heat source of the electronic device 200 is conducted to the vapor chamber 30 , the temperature of a local region of the vapor chamber 30 increases, forming a high temperature region and a low temperature region on the vapor chamber 30 . The cooling liquid in the capillary structure d located in the high temperature area is heated and vaporized in the vacuum environment, absorbs heat and expands rapidly in volume at the same time, and the vaporized cooling liquid quickly fills the entire cooling channel c. After the coolant in the capillary structure d in the high-temperature region is vaporized, the coolant in the capillary structure d in the low-temperature region is transported to the capillary structure d in the high-temperature region and vaporized. Condensation occurs when vaporized coolant comes into contact with a low temperature area, releasing heat accumulated during vaporization during the condensation process. Thus, the heat in the high temperature area of the vapor chamber 30 is conducted to the low temperature area.

Moreover, the condensed coolant is absorbed by the capillary structure d in the low-temperature region, and returns to the capillary structure d in the high-temperature region through the capillary structure d, and the coolant that enters the high-temperature region from the low-temperature region continues to vaporize and returns to Low temperature area, condensation in low temperature area. After continuous circulation, during the process of vaporization and condensation, the coolant continuously conducts the heat from the high temperature area of the soaking plate 30 to the low temperature area, thereby achieving a heat equalizing effect, so that the heat of the soaking plate 30 is evenly distributed throughout the soaking area. The board 30 further enhances the heat dissipation effect. It should be noted that the capillary structure d can transfer the cooling liquid from the low-temperature region to the high-temperature region through the capillary action of its microstructure.

Specifically, at normal temperature, the coolant is liquid and located in the capillary structure d. When the temperature of the main body section 31 is higher than the temperature of the auxiliary heat dissipation section b, that is, the main heat dissipation channel 301 is in a high-temperature area and the auxiliary heat dissipation channel is in a low-temperature area, the coolant in the capillary structure d in the main body section 31 is heated and vaporized, And enter the first auxiliary cooling channel 304 through the first flow guide channel 302 . After the coolant in the capillary structure d in the main body section 31 is vaporized, the coolant in the capillary structure d in the auxiliary heat dissipation section b is transferred to the capillary structure d in the main body section 31 and vaporized. The cooling liquid enters the first auxiliary cooling channel 304 through the first flow guide channel 302 . The vaporized coolant enters the first auxiliary cooling channel 304 and condenses to release heat, thereby transferring the heat of the main body section 31 to the first auxiliary cooling section 34 . At the same time, the cooling liquid in the capillary structure d in the main body section 31 is heated and vaporized, and can also enter the second auxiliary cooling channel 305 through the second guide channel 303, and condense in the second auxiliary cooling section 35, thereby transferring heat to the The second auxiliary cooling section 35 .

The cooling liquid condensed in the first auxiliary heat dissipation channel 304 is absorbed by the capillary structure d in the first auxiliary heat dissipation section 34 and transported to the capillary structure d in the main body section 31 . The cooling liquid condensed in the second auxiliary heat dissipation channel 305 is absorbed by the capillary structure d in the second auxiliary heat dissipation section 35 and transported to the capillary structure d in the main body section 31 . The coolant entering the capillary structure d in the main body section 31 continues to vaporize, and is transported to the first auxiliary cooling channel 304 and the second auxiliary cooling channel 305 . During the cycle of vaporization and condensation of the cooling liquid, the heat located in the main body section 31 is continuously transferred to the first auxiliary heat dissipation section 34 and the second auxiliary heat dissipation section 35 until the temperature of the entire heat vapor chamber 30 is consistent, thereby making the heat chamber The heat distribution of the 30 is uniform, thereby achieving the effect of improving the heat dissipation effect.

Wherein, when the temperature of the first flow guide section 32 is lower than the temperature of the main body section 31 , the vaporized coolant will also condense in the first flow guide channel 302 and be transported to the main cooling channel 301 through the capillary structure d. When the temperature of the second flow guiding section 33 is lower than that of the main body section 31 , the vaporized coolant will also condense in the second flow guiding channel 303 and be transported to the main cooling channel 301 through the capillary structure d. That is, the heat located in the main body section 31 can also be transferred to the first flow guide section 32 and the second flow guide section 33 , so that the uniformity of heat distribution can be further increased and the heat dissipation effect can be improved.

In this embodiment, since the widths of the first flow guide channel 302 and the second flow guide channel 303 are smaller than the width of the main heat dissipation channel 301, the coolant vaporized in the main heat dissipation channel 301 passes through the first flow guide channel 302 and the second flow guide channel 302. When the flow channel 303 is flowed, the flow will be accelerated, so that the heating speed can be increased, and the heat dissipation efficiency can be further improved.

When the temperatures of the first auxiliary heat dissipation section 34 and the second auxiliary heat dissipation section 35 are both higher than the temperature of the main body section 31, that is, the auxiliary heat dissipation channel is in a high temperature area and the main heat dissipation channel 301 is in a low temperature area, it is located in the first auxiliary heat dissipation section. The coolant in the capillary structure d in 34 is heated and vaporized, and enters the main cooling channel 301 through the first flow guide channel 302 . After the coolant in the capillary structure d in the first auxiliary heat dissipation section 34 is vaporized, the coolant in the capillary structure d in the main body section 31 is transported to the capillary structure d in the first auxiliary heat dissipation section 34, and Vaporization, the vaporized cooling liquid continues to enter the main cooling channel 301 through the first guide channel 302 . At the same time, the coolant in the capillary structure d in the second auxiliary cooling section 35 is vaporized by heat, and enters the main cooling channel 301 through the second guide channel 303 . After the coolant in the capillary structure d in the second auxiliary heat dissipation section 35 is vaporized, the coolant in the capillary structure d in the main body section 31 is transferred to the capillary structure d in the second auxiliary heat dissipation section 35, and Vaporization, the vaporized cooling liquid continues to enter the main cooling channel 301 through the second guide channel 303 . The vaporized coolant enters the main heat dissipation channel 301 and condenses to release heat, thereby transferring heat from the first auxiliary heat dissipation section 34 and the second auxiliary heat dissipation section 35 to the main body section 31 .

The coolant condensed in the main heat dissipation channel 301 is absorbed by the capillary structure d in the main body section 31, and transported to the capillary structure d in the first auxiliary heat dissipation section 34 and the second auxiliary heat dissipation section 35, and enters the first auxiliary heat dissipation section 35. The coolant in the capillary structure d in the heat dissipation section 34 and the second auxiliary heat dissipation section 35 continues to vaporize and is transported to the main heat dissipation channel 301 . During the cycle of vaporization and condensation of the cooling liquid, the heat located in the first auxiliary heat dissipation section 34 and the second auxiliary heat dissipation section 35 is continuously transferred to the main body section 31 until the temperature of the entire heat chamber 30 is uniform, thereby making the heat chamber The heat distribution of the 30 is uniform, thereby achieving the effect of improving the heat dissipation effect.

Wherein, when the temperature of the first flow guide section 32 is lower than the temperature of the first auxiliary heat dissipation section 34, the vaporized cooling liquid will also condense in the first flow guide channel 302 and be transported to the first auxiliary heat sink through the capillary structure d. heat dissipation channel 304 . When the temperature of the second flow guide section 33 is lower than the temperature of the second auxiliary heat dissipation section 35, the vaporized coolant will also condense in the second flow guide channel 303 and be transported to the second auxiliary heat dissipation channel through the capillary structure d within 305. That is, the heat located in the first auxiliary heat dissipation section 34 and the second auxiliary heat dissipation section 35 can also be transferred to the first air guide section 32 and the second air guide section 33, thereby further increasing the uniformity of heat distribution and improving the heat dissipation effect .

In this embodiment, since the widths of the first guide channel 302 and the second guide channel 303 are both smaller than the width of the main heat dissipation channel 301, the coolant vaporized in the first auxiliary heat dissipation channel 304 will be accelerated when passing through the first guide channel 302. Flow, when the vaporized coolant in the second auxiliary heat dissipation channel 305 passes through the second flow guide channel 303, the flow will be accelerated, so that the heat uniformity speed can be increased, and the heat dissipation efficiency can be further improved.

In one embodiment, the main heat dissipation channel 301 includes a low-temperature area and a high-temperature area, and the coolant can circulate in gas-liquid between the low-temperature area and the high-temperature area in the main heat dissipation channel 301, so that the heat in the high-temperature area is transferred to the low-temperature area, thereby The heat distribution of the main body section 31 is made uniform. Alternatively, the auxiliary heat dissipation channel includes a low-temperature area and a high-temperature area, and the coolant can circulate in gas-liquid between the low-temperature area and the high-temperature area in the auxiliary heat dissipation channel, so that the heat in the high-temperature area is transferred to the low-temperature area, so that the auxiliary heat dissipation section b The heat is evenly distributed.

Please refer to FIG. 6 . FIG. 6 is a schematic structural diagram of a vapor chamber 30 in a housing provided in another embodiment of the present application.

In this embodiment, the first guide section 32 and the second guide section 33 may also be curved. The first flow guiding section 32 includes a first side 321 and a second side 322 , and the first side 321 and the second side 322 are opposite to each other. Both the first side 321 and the second side 322 are arc-shaped. Wherein, the middle regions of the first side 321 and the second side 322 protrude toward the first guide channel 302 . That is to say, the width of the first guide section 32 gradually decreases from both ends to the middle. The second guide section 33 includes a third side 331 and a fourth side 332 , and the third side 331 and the fourth side 332 are oppositely disposed. Both the third side 331 and the fourth side 332 are arc-shaped. Wherein, middle regions of the third side 331 and the fourth side 332 protrude toward the second guide channel 303 . That is to say, the width of the second guide section 33 gradually decreases from both ends to the middle.

In this embodiment, the first auxiliary heat dissipation section 34 and the second auxiliary heat dissipation section 35 of the vapor chamber 30 have the same shape and size, and the first air guide section 32 and the second air guide section 33 have the same shape and size. That is, the vapor chamber has a symmetrical structure in both the X direction and the Y direction. In other embodiments, the length and width of the first guide section 32 and the second guide section 33 may be different, and the shapes may also be different. The shape and size of the first auxiliary heat dissipation section 34 and the second auxiliary heat dissipation section 35 may also be different.

In one embodiment, the vapor chamber 30 may also be a rectangular plate-shaped structure, or a circular plate-shaped structure. The vapor chamber 30 may also be in the shape of a "ten". Certainly, the vapor chamber 30 may also be a single-layer structure. When the vapor chamber 30 has a single-layer structure, the heat transferred to the vapor chamber 30 directly exchanges heat with the external space to dissipate the heat to the outside.

Please refer to FIG. 3 , the casing 100 further includes a protection plate 40 . The protection plate 40 has a thin plate shape. In this embodiment, the protective plate 40 is made of polymethyl methacrylate (PMMA). In other embodiments, it is made of polymethyl methacrylate (acrylic, PMMA), polycarbonate (PC) or other plastics.

The protective plate 40 includes a first surface 41 and a second surface 42 , and the first surface 41 and the second surface 42 are oppositely disposed. The protective plate 40 includes a main body 43 . The main body 43 of the protective plate 40 defines a receiving groove 44 , the receiving groove 44 runs through the first surface 41 and the second surface 42 , and the main body 43 surrounds the periphery of the receiving groove 44 . Wherein, the shape of the receiving groove 44 matches the shape of the vapor chamber 30 . That is to say, the vapor chamber 30 can be just installed and fixed in the receiving groove 44 .

Please also refer to FIG. 7 . FIG. 7 is a partial structural diagram of the housing 100 shown in FIG. 2 .

The vapor chamber 30 is installed in the receiving groove 44 of the protection plate 40 and is fixedly connected to the side wall of the receiving groove 44 . Specifically, when installing the soaking plate 30 on the protective plate 40, the soaking plate 30 can be placed in the receiving groove 44 of the protective plate 40 first, and the soaking plate 30 can be installed in the receiving groove 44 through a pressing process. . Then glue is applied between the side wall of the vapor chamber 30 and the side wall of the receiving groove 44 , so that the vapor chamber 30 is fixedly connected with the protection plate 40 .

Wherein, in the pressing process, the pressing mold can be heated to soften or deform the protective plate 40, so that the shape of the receiving groove 44 of the protective plate 40 can be more adapted to the shape of the vapor chamber 30, so as to increase the uniformity. The stability of the connection between the thermal plate 30 and the protection plate 40.

In this embodiment, by providing the protection plate 40 and installing the heat vapor chamber 30 in the receiving groove 44 of the protection plate 40 , the protection plate 40 can protect the heat vapor chamber 30 . Moreover, when the vapor chamber 30 is installed between the first support plate 10 and the second support plate 20, the protective plate 40 can also prevent the heat vapor chamber 30 from being exposed from the edge area, without affecting the shape design of the housing 100 and lifting the shell The aesthetics of the body 100.

Please refer to FIG. 3 , the housing 100 also includes a first adhesive member and a second adhesive member (not shown in the figure), the first adhesive member is located between the first support plate 10 and the protective plate 40, and bonds the first The lower surface 12 and the first surface 41 . The second bonding member is located between the second support plate 20 and the protection plate 40 , and bonds the second upper surface 21 and the second surface 42 . In this embodiment, both the first bonding member and the second bonding member are OCA optical adhesives. In other embodiments, the first adhesive member and the second adhesive member may also be glue, double-sided tape or any other adhesive, as long as the bonding function can be realized.

In other embodiments, the housing 100 can also be formed as an integral part, so as to increase the structural stability of the housing 100 . Specifically, the casing 100 can be prepared through multiple injection molding processes.

In this embodiment, by disposing the vapor chamber 30 between the first support plate 10 and the second support plate 20 , the heat dissipation effect of the casing 100 can be improved. When the casing 100 is installed on the body 110, the heat generated by the internal electronic components such as batteries and circuit boards of the electronic device 200 is transferred to the vapor chamber 30 through the second support plate 20, and then transferred to the first vapor chamber 30 by the vapor chamber 30. The supporting plate 10 is then transported to the outside by the first supporting plate 10, so as to play the role of heat dissipation. Moreover, the vapor chamber 30 also acts as a heat equalizer, and the heat transferred from the first support plate 10 to the vapor chamber 30 is evenly distributed to the entire chamber 30, thereby improving the heat dissipation efficiency of the housing 100, thereby improving the electronic performance. The performance and service life of the device 200.

Wherein, the thickness of the casing 100 is 0.5mm˜0.65mm. That is to say, the dimension of the housing 100 in the Z direction is 0.5mm˜0.65mm. In this embodiment, the thickness of the casing 100 is 0.55 mm. The casing 100 has a puncture strength of 180N when the thickness is 0.55 mm.

In this embodiment, the vapor chamber 30 has high strength, and the strength of the casing 100 can be improved by disposing the vapor chamber 30 between the first support plate 10 and the second support plate 20 . That is to say, while realizing the ultra-thin casing 100, its strength requirement can also be guaranteed. At the same time, the vapor chamber 30 has high rigidity and is not easily deformed, thereby reducing the flatness of the housing 100 . Moreover, the vapor chamber 30 also has ductility, so that the toughness of the casing 100 can be improved.

In this embodiment, there is a safety distance e between the vapor chamber 30 and the edge of the second supporting plate 20 . That is to say, the size of the vapor chamber 30 in the X direction is smaller than the size of the second support plate 20 in the X direction, and the size of the vapor chamber 30 in the Y direction is smaller than the size of the second support plate 20 in the Y direction. The outer peripheral edge of 30 is spaced apart from the outer peripheral edge of the second support plate 20 . When the antenna of the electronic device 200 is a frame antenna, by setting a safety distance e between the vapor chamber 30 and the edge of the second support plate 20, it is possible to avoid the impact of the vapor chamber 30 made of metal on the frame antenna of the electronic device 200. Communication performance is affected.

Please refer to FIG. 8 . FIG. 8 is a schematic diagram of an exploded structure of the casing 100 provided by the second embodiment of the present application.

The difference from the previous embodiment is that the first support plate 10 is provided with an installation groove 13 , and the installation groove 13 is recessed on the first lower surface 12 . The shape of the mounting groove 13 matches the shape of the vapor chamber 30 . The vapor chamber 30 is installed in the installation groove 13 .

The casing 100 also includes a third adhesive member (not shown), the third adhesive member is located between the first support plate 10 and the second support plate 20, and bonds the first lower surface 12 and the second upper surface 21 , so as to realize the fixed connection between the first supporting board 10 and the second supporting board 20 .

In this embodiment, the installation groove 13 is directly provided on the first support plate 10, and the vapor chamber 30 is installed in the installation groove 13, without additionally providing a protection plate 40, thereby simplifying the structure of the housing 100 and further reducing the weight of the housing. 100 quality.

In one embodiment, the housing 100 is a one-piece molding. In this embodiment, the materials of the first supporting board 10 and the second supporting board 20 are both polycarbonate. The housing 100 is prepared through a two-time injection molding process. Specifically, the first support plate 10 with the mounting groove 13 is first formed by injection molding, and then the vapor chamber 30 is installed in the mounting groove 13, and then the second support plate 10 is formed on the first lower surface 12 of the first support plate 10 by injection molding. Support plate 20. The shell 100 prepared by the secondary injection molding process has a stable structure.

It should be noted that when the material of the first support plate 10 and the second support plate 20 is a material with a higher melting temperature, such as polyethylene terephthalate (PET) and polymethyl methacrylate (acrylic, PMMA), the method of bonding is usually used to realize the fixed connection, so as to simplify the process and save costs. When the material of the first support plate 10 and the second support plate 20 is a material with a lower melting temperature, such as polycarbonate (PC), polycarbonate and acrylonitrile-butadiene-styrene copolymer and mixture (PC/ ABS), the injection molding process is usually used to realize the connection, so as to increase the structural stability of the housing 100.

In the third embodiment of the present application, the difference from the second embodiment is that the second support plate 20 is provided with a mounting groove, and the mounting groove is recessed in the second upper surface 21 . The shape of the mounting groove 13 matches the shape of the vapor chamber 30 . The vapor chamber 30 is installed in the installation groove.

In the fourth embodiment of the present application, the difference from the second embodiment is that the first support plate 10 is provided with a first installation groove, and the first installation groove is recessed in the first lower surface 12 . The second support plate 20 is provided with a second installation groove, and the second installation groove is recessed on the second upper surface 21 . The first installation slot and the second installation slot have the same shape. The first support plate 10 and the second support plate 20 are connected, and the first installation groove communicates with the second installation groove to jointly form the installation groove. The shape and size of the mounting groove are the same as those of the vapor chamber 30 .

During the installation process, the vapor chamber 30 is first installed in the first installation groove, and then the second support plate 20 is fastened to the first lower surface 12 of the first support plate 10, and the vapor chamber 30 is exposed to the first installation groove. A portion of the groove is located in the second mounting groove. At the same time, the first lower surface 12 and the second upper surface 21 are bonded together by a third adhesive member, so that the first support plate 10 is fixedly connected to the second support plate 20 , thereby realizing the fixed connection of the housing 100 . Alternatively, the housing 100 in this embodiment can also be connected through secondary injection molding.

Please refer back to FIG. 1 , the electronic device 200 provided in this application includes a main body 110 and the aforementioned casing 100 . The casing 100 is a battery cover of the electronic device 200 . The casing 100 provided by the present application is small in thickness and light in weight, which is conducive to thinning and thinning of the electronic device 200 . Moreover, the casing 100 has high strength and good toughness, which is beneficial to improving the drop resistance and durability of the electronic device 200 . At the same time, the flatness of the casing 100 is small, thereby improving the flatness of the appearance of the electronic device 200 and enhancing the user experience.

Please also refer to FIG. 4 , the body 110 is equipped with a first heating element and a second heating element (not shown). In this embodiment, the first heating element is a battery, and the second heating element is electronic components such as a motherboard, a CPU, and a small board. When the casing 100 is installed on the body 110 , the casing 100 faces the first heating element and the second heating element. In this embodiment, the main section 31 of the vapor chamber 30 is opposite to the first heating element, and the auxiliary heat dissipation section b is opposite to the second heating element. The heat generated by the first heating element is transmitted to the main body section 31 of the heat chamber 30 through the second support plate 20 . The heat generated by the second heating element is transmitted to the auxiliary heat dissipation section b of the vapor chamber 30 through the second support plate 20 .

When the heat generated by the first heating element is greater than the heat generated by the second heating element, the temperature of the main body section 31 is higher than the temperature of the auxiliary heat dissipation section b. Part of the heat located in the main body section 31 is directly transmitted to the first support plate 10 and then dissipated to the outside. Part of the heat is absorbed and vaporized by the cooling liquid in the capillary structure d in the main body section 31 , and the vaporized cooling liquid is transferred to the first auxiliary cooling channel 304 through the first flow guide channel 302 , and is discharged in the first auxiliary cooling channel 304 Condensation occurs and heat is released at the same time, so that the heat of the main body section 31 is transmitted to the first auxiliary heat dissipation section 34, and then transferred to the first support plate 10 by the first auxiliary heat dissipation section 34, and then dissipated to the outside by the first support plate 10, To reduce the temperature of the vapor chamber 30 . At the same time, the coolant vaporized in the main heat dissipation channel 301 can also be transported to the second auxiliary heat dissipation channel 305 through the second guide channel 303, and condense in the second auxiliary heat dissipation channel 305, and release heat at the same time, so that the main body section 31 The heat is transferred to the second auxiliary heat dissipation section 35 , then transferred to the first support plate 10 by the second auxiliary heat dissipation section 35 , and then dissipated to the outside by the first support plate 10 to further reduce the temperature of the vapor chamber 30 .

When the heat generated by the second heating element is greater than the heat generated by the first heating element, the temperature of the auxiliary heat dissipation section b is higher than that of the main body section 31 . Part of the heat located in the auxiliary heat dissipation section b is directly transmitted to the first support plate 10 and then dissipated to the outside. Part of the heat is absorbed and vaporized by the coolant in the capillary structure d in the first auxiliary heat dissipation section 34 , and the vaporized coolant is transferred to the main heat dissipation channel 301 through the first flow guiding channel 302 , and is discharged in the main heat dissipation channel 301 Condensation occurs and heat is released at the same time, so that the heat of the first auxiliary heat dissipation section 34 is transferred to the main body section 31 . Part of the heat is absorbed and vaporized by the coolant in the capillary structure d in the second auxiliary heat dissipation section 35 , and the vaporized coolant is transferred to the main heat dissipation channel 301 through the second flow guiding channel 303 , and is discharged in the main heat dissipation channel 301 Condensation occurs and heat is released at the same time, so that the heat of the second auxiliary cooling section 35 is transferred to the main section 31 . The heat transmitted to the main body section 31 is then transmitted to the first support plate 10 , and then dissipated to the outside by the first support plate 10 , thereby reducing the temperature of the vapor chamber 30 .

In other embodiments, the first heating element may also be an electronic component such as a motherboard, a CPU, or a small board, and the second heating element may be a battery. The installation positions of the battery, the main board, the CPU and the small board can also be adjusted according to the actual situation. In a word, the heat transmitted to the vapor chamber 30 can be evenly distributed throughout the vapor chamber 30 , so that the heat dissipation speed of the vapor chamber 30 can be improved, and the heat dissipation performance of the electronic device 200 and user experience can be improved. It should be noted that the "uniform" mentioned here can be completely uniform, and a small amount of deviation can also be allowed.

The above are only some examples and implementations of the present application, and the protection scope of the present application is not limited thereto. Anyone skilled in the art can easily think of changes or substitutions within the technical scope disclosed in the present application, and should cover all Within the protection scope of this application. Therefore, the protection scope of the present application should be based on the protection scope of the claims.

Claims (28)

A housing, characterized by comprising: a first support plate, a second support plate, and a heat soaking plate, the first support plate, the heat soaking plate, and the second support plate are stacked, and the The vapor chamber is located between the first support plate and the second support plate, and is connected with the first support plate and the second support plate; A heat dissipation channel is provided in the vapor chamber, and the heat dissipation channel includes a main heat dissipation channel and an auxiliary heat dissipation channel, the main heat dissipation channel communicates with the auxiliary heat dissipation channel, and the main heat dissipation channel and the auxiliary heat dissipation channel heat exchange can take place. The housing according to claim 1, wherein the vapor chamber includes a low-temperature region and a high-temperature region connected to the low-temperature region, the vapor chamber is filled with cooling liquid, and the cooling liquid can The high temperature area is vaporized and condensed in the low temperature area, so that the heat of the high temperature area is transferred to the low temperature area. The casing according to claim 2, wherein a capillary structure is provided in the heat dissipation channel, and the cooling liquid is filled in the capillary structure, and the cooling liquid can flow between the main heat dissipation channel and the The gas-liquid circulation occurs in the auxiliary heat dissipation channel, so that the heat in the high temperature area is transferred to the low temperature area. The casing according to claim 3, wherein the heat dissipation channel further includes a guide channel, one end of the guide channel is connected to the main heat dissipation channel, and the other end is connected to the auxiliary heat dissipation channel, and the The main heat dissipation channel and the auxiliary heat dissipation channel communicate with the flow guide channel; the width of the flow guide channel is smaller than the width of the main heat dissipation channel and the auxiliary heat dissipation channel. The housing according to claim 1, wherein the vapor chamber is made of copper, carbon fiber, graphene or graphite sheet. The shell according to claim 1, characterized in that, the thickness of the shell is 0.5mm-0.65mm. The housing according to any one of claims 1 to 6, wherein the housing further comprises a protection plate, the protection plate is provided with a receiving groove, the soaking plate is located in the receiving groove, and It is fixedly connected with the protection board. The casing according to any one of claims 1 to 6, wherein an installation groove is provided on the surface of the first support plate facing the vapor chamber, and the chamber is located in the installation groove; Or, an installation groove is provided on the surface of the second support plate facing the heat chamber, and the heat chamber is located in the installation groove. The casing according to any one of claims 1 to 6, wherein the first support plate is provided with an installation groove on the surface facing the heat chamber, and the second support plate faces the heat chamber A mounting groove is provided on the surface of the first supporting plate, and the mounting groove of the first supporting plate is fastened with the mounting groove of the second supporting plate to fix the vapor chamber. The housing according to claim 1, characterized in that the housing is a one-piece molding. The casing according to claim 1, wherein the casing comprises a decorative layer, and the decorative layer is laminated on a surface of the first support plate facing away from the heat chamber. The casing according to claim 11, wherein the decoration layer is formed on the surface of the first support plate by spraying or non-conductive coating process. The casing according to claim 1, wherein the casing includes an ink layer, and the ink layer is laminated on a surface of the second support plate facing away from the heat vapor chamber. An electronic device, characterized by comprising a body and the housing according to any one of claims 1 to 13, the housing being installed on the body. The electronic device according to claim 14, wherein the vapor chamber includes a low-temperature area and a high-temperature area, a first heating element and a second heating element are installed in the body, and the heat of the first heating element is greater than The heat of the second heating element, the high temperature area is opposite to the first heating element. A case, which is used as a battery cover of an electronic device, is characterized in that it comprises: a first support plate, a second support plate and a heat soaking plate, the first support plate, the heat soaking plate and the heat soaking plate The second support plates are stacked, and the vapor chamber is located between the first support plate and the second support plate, and connected to the first support plate and the second support plate; A heat dissipation channel is provided in the vapor chamber, and the heat dissipation channel includes a main heat dissipation channel and an auxiliary heat dissipation channel, the main heat dissipation channel communicates with the auxiliary heat dissipation channel, and the main heat dissipation channel and the auxiliary heat dissipation channel heat exchange can take place. The casing according to claim 16, wherein the vapor chamber includes a low-temperature region and a high-temperature region connected to the low-temperature region, the vapor chamber is filled with cooling liquid, and the cooling liquid can The high temperature area is vaporized and condensed in the low temperature area, so that the heat of the high temperature area is transferred to the low temperature area. The casing according to claim 17, wherein a capillary structure is provided in the heat dissipation channel, and the cooling liquid is filled in the capillary structure, and the cooling liquid can flow between the main heat dissipation channel and the The gas-liquid circulation occurs in the auxiliary heat dissipation channel, so that the heat in the high temperature area is transferred to the low temperature area. The housing according to claim 18, wherein the heat dissipation channel further includes a guide channel, one end of the guide channel is connected to the main heat dissipation channel, and the other end is connected to the auxiliary heat dissipation channel, and the The main heat dissipation channel and the auxiliary heat dissipation channel communicate with the flow guide channel; the width of the flow guide channel is smaller than the width of the main heat dissipation channel and the auxiliary heat dissipation channel. The housing according to claim 16, wherein the vapor chamber is made of copper, carbon fiber, graphene or graphite sheet. The shell according to claim 16, characterized in that, the thickness of the shell is 0.5mm-0.65mm. The housing according to any one of claims 16 to 21, wherein the housing further comprises a protection plate, the protection plate is provided with a receiving groove, the soaking plate is located in the receiving groove, and It is fixedly connected with the protection board. The casing according to any one of claims 16 to 21, wherein an installation groove is provided on the surface of the first support plate facing the vapor chamber, and the chamber is located in the installation groove; Or, an installation groove is provided on the surface of the second support plate facing the heat chamber, and the heat chamber is located in the installation groove. The casing according to any one of claims 16 to 21, characterized in that, the surface of the first support plate facing the heat soaking plate is provided with an installation groove, and the second support plate faces the heat soaking plate A mounting groove is provided on the surface of the first supporting plate, and the mounting groove of the first supporting plate is fastened with the mounting groove of the second supporting plate to fix the vapor chamber. The housing according to claim 16, characterized in that the housing is a one-piece molding. The casing according to claim 16, wherein the casing includes a decorative layer, and the decorative layer is laminated on a surface of the first support plate facing away from the heat chamber. The housing according to claim 26, wherein the decoration layer is formed on the surface of the first support plate by spraying or non-conductive coating process. The casing according to claim 16, wherein the casing includes an ink layer, and the ink layer is laminated on a surface of the second support plate facing away from the vapor chamber.

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