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WO2023068568A1 - Dispositif électronique comprenant un boîtier et son procédé de fabrication - Google Patents

Dispositif électronique comprenant un boîtier et son procédé de fabrication Download PDF

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Publication number
WO2023068568A1
WO2023068568A1 PCT/KR2022/014098 KR2022014098W WO2023068568A1 WO 2023068568 A1 WO2023068568 A1 WO 2023068568A1 KR 2022014098 W KR2022014098 W KR 2022014098W WO 2023068568 A1 WO2023068568 A1 WO 2023068568A1
Authority
WO
WIPO (PCT)
Prior art keywords
electronic device
mold
housing
tool
pattern area
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Ceased
Application number
PCT/KR2022/014098
Other languages
English (en)
Korean (ko)
Inventor
김창수
황한규
공영환
나상식
정현정
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Samsung Electronics Co Ltd
Original Assignee
Samsung Electronics Co Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Samsung Electronics Co Ltd filed Critical Samsung Electronics Co Ltd
Publication of WO2023068568A1 publication Critical patent/WO2023068568A1/fr
Anticipated expiration legal-status Critical
Ceased legal-status Critical Current

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Classifications

    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K5/00—Casings, cabinets or drawers for electric apparatus
    • H05K5/0017—Casings, cabinets or drawers for electric apparatus with operator interface units
    • H05K5/0018—Casings, cabinets or drawers for electric apparatus with operator interface units having an electronic display
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B22—CASTING; POWDER METALLURGY
    • B22D—CASTING OF METALS; CASTING OF OTHER SUBSTANCES BY THE SAME PROCESSES OR DEVICES
    • B22D17/00—Pressure die casting or injection die casting, i.e. casting in which the metal is forced into a mould under high pressure
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B22—CASTING; POWDER METALLURGY
    • B22D—CASTING OF METALS; CASTING OF OTHER SUBSTANCES BY THE SAME PROCESSES OR DEVICES
    • B22D17/00—Pressure die casting or injection die casting, i.e. casting in which the metal is forced into a mould under high pressure
    • B22D17/002—Pressure die casting or injection die casting, i.e. casting in which the metal is forced into a mould under high pressure using movable moulds
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B29—WORKING OF PLASTICS; WORKING OF SUBSTANCES IN A PLASTIC STATE IN GENERAL
    • B29C—SHAPING OR JOINING OF PLASTICS; SHAPING OF MATERIAL IN A PLASTIC STATE, NOT OTHERWISE PROVIDED FOR; AFTER-TREATMENT OF THE SHAPED PRODUCTS, e.g. REPAIRING
    • B29C33/00—Moulds or cores; Details thereof or accessories therefor
    • B29C33/42—Moulds or cores; Details thereof or accessories therefor characterised by the shape of the moulding surface, e.g. ribs or grooves
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B29—WORKING OF PLASTICS; WORKING OF SUBSTANCES IN A PLASTIC STATE IN GENERAL
    • B29C—SHAPING OR JOINING OF PLASTICS; SHAPING OF MATERIAL IN A PLASTIC STATE, NOT OTHERWISE PROVIDED FOR; AFTER-TREATMENT OF THE SHAPED PRODUCTS, e.g. REPAIRING
    • B29C33/00—Moulds or cores; Details thereof or accessories therefor
    • B29C33/42—Moulds or cores; Details thereof or accessories therefor characterised by the shape of the moulding surface, e.g. ribs or grooves
    • B29C33/424—Moulding surfaces provided with means for marking or patterning
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B29—WORKING OF PLASTICS; WORKING OF SUBSTANCES IN A PLASTIC STATE IN GENERAL
    • B29C—SHAPING OR JOINING OF PLASTICS; SHAPING OF MATERIAL IN A PLASTIC STATE, NOT OTHERWISE PROVIDED FOR; AFTER-TREATMENT OF THE SHAPED PRODUCTS, e.g. REPAIRING
    • B29C45/00—Injection moulding, i.e. forcing the required volume of moulding material through a nozzle into a closed mould; Apparatus therefor
    • B29C45/17—Component parts, details or accessories; Auxiliary operations
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B29—WORKING OF PLASTICS; WORKING OF SUBSTANCES IN A PLASTIC STATE IN GENERAL
    • B29C—SHAPING OR JOINING OF PLASTICS; SHAPING OF MATERIAL IN A PLASTIC STATE, NOT OTHERWISE PROVIDED FOR; AFTER-TREATMENT OF THE SHAPED PRODUCTS, e.g. REPAIRING
    • B29C45/00—Injection moulding, i.e. forcing the required volume of moulding material through a nozzle into a closed mould; Apparatus therefor
    • B29C45/17—Component parts, details or accessories; Auxiliary operations
    • B29C45/1769—Handling of moulded articles or runners, e.g. sorting, stacking, grinding of runners
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B29—WORKING OF PLASTICS; WORKING OF SUBSTANCES IN A PLASTIC STATE IN GENERAL
    • B29C—SHAPING OR JOINING OF PLASTICS; SHAPING OF MATERIAL IN A PLASTIC STATE, NOT OTHERWISE PROVIDED FOR; AFTER-TREATMENT OF THE SHAPED PRODUCTS, e.g. REPAIRING
    • B29C45/00—Injection moulding, i.e. forcing the required volume of moulding material through a nozzle into a closed mould; Apparatus therefor
    • B29C45/17—Component parts, details or accessories; Auxiliary operations
    • B29C45/26—Moulds
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K5/00—Casings, cabinets or drawers for electric apparatus
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K5/00—Casings, cabinets or drawers for electric apparatus
    • H05K5/04—Metal casings

Definitions

  • Various embodiments disclosed in this document relate to an electronic device including a housing including a non-painted surface, and a manufacturing method thereof.
  • the electronic device may include a housing that forms at least a part of an external appearance of the electronic device to provide a sense of aesthetics to the user or to protect the electronic device.
  • the housing may include a pattern area to improve scratch resistance of the unpainted surface.
  • the housing including the pattern area may be injection molded using a mold in which the pattern area is processed.
  • the mold is a method of etching (eg, a method of chemically or electrically corroding) at least a part of the mold, or a CNC machining method (eg, a method of cutting using a tool, or a method of processing a plurality of concave-convex shape patterns). can be used to form a pattern area.
  • a plurality of concavo-convex pattern processing methods may include a process of machining a mold by rotating a ball-shaped tool several times to scrape a surface.
  • a rough surface for example, an atypical anchor structure
  • a rough surface is formed on the pattern area of the mold processed by chemical or physical erosion.
  • a rough surface eg, including a burr, tool mark, or concavo-convex structure
  • Contaminants adsorbed on the rough surface may contaminate the surface of the housing.
  • An electronic device includes a housing including an unpainted surface forming an exterior of the electronic device, and the unpainted surface includes a pattern area formed of a plurality of convex portions including a smooth surface. Including, the pattern area may have a surface roughness value less than or equal to a predetermined threshold value.
  • At least one protrusion presses at least a portion of at least one surface of a mold using a tool including at least one protrusion having a convex shape in a first direction.
  • a process of injecting the housing including the second pattern area inverted to the area may be included.
  • Various embodiments disclosed in this document provide a housing of an electronic device capable of preventing contamination or scratches (eg, scratches) from occurring on the housing by forming a pattern including an unpainted surface and a manufacturing method thereof.
  • Various embodiments disclosed in this document may provide a housing of an electronic device and a manufacturing method thereof capable of preventing surface contamination due to low surface roughness while forming a pattern on the surface.
  • FIG. 1 is a perspective view illustrating a housing of an electronic device according to an exemplary embodiment.
  • FIG. 2 is a flowchart illustrating a method of manufacturing a housing of an electronic device according to an exemplary embodiment.
  • FIG. 3 is a plan view illustrating a tool according to an exemplary embodiment.
  • FIG. 4 is a cross-sectional view illustrating a process of processing a mold with a tool according to an embodiment.
  • FIG. 5 is a perspective view illustrating a process of processing a mold with a tool according to an embodiment.
  • FIG. 6 is a graph showing the surface of a machined mold according to an embodiment.
  • FIG. 7 is a perspective view illustrating a machined mold according to various embodiments.
  • FIG. 8 is a perspective view illustrating a process of processing a mold according to another embodiment.
  • FIG. 9 is a perspective view illustrating a process of processing a mold according to another embodiment.
  • FIG. 10 is a perspective view illustrating a pattern area of a machined mold according to various embodiments.
  • FIG. 11 is a perspective view illustrating a process of polishing an edge portion of a processed mold according to an embodiment.
  • FIG. 12 is a flowchart illustrating a method of manufacturing a housing of an electronic device according to another embodiment.
  • FIG. 13 is a front perspective view of a mobile electronic device according to an embodiment.
  • FIG. 14 is a perspective view of the back of the electronic device of FIG. 13;
  • FIG. 15 is an exploded perspective view of the electronic device of FIG. 13;
  • An electronic device may include, for example, a smartphone, a tablet personal computer (PC), a mobile phone, a video phone, an e-book reader, Desktop personal computer, laptop personal computer, netbook computer, workstation, server, personal digital assistant (PDA), portable multimedia player (PMP), MP3 player, mobile medical It may include at least one of a device, a camera, or a wearable device.
  • a smartphone a tablet personal computer (PC)
  • a mobile phone a video phone
  • an e-book reader Desktop personal computer
  • laptop personal computer netbook computer
  • workstation server
  • server personal digital assistant
  • PMP portable multimedia player
  • MP3 player MP3 player
  • the wearable device may be an accessory (eg, watch, ring, bracelet, anklet, necklace, glasses, contact lens, or head-mounted-device (HMD)), fabric or clothing integrated (for example, it may include at least one of an electronic clothing), a body attachment type (eg, a skin pad or tattoo), or a living body implantable type (eg, an implantable circuit).
  • an accessory eg, watch, ring, bracelet, anklet, necklace, glasses, contact lens, or head-mounted-device (HMD)
  • fabric or clothing integrated for example, it may include at least one of an electronic clothing), a body attachment type (eg, a skin pad or tattoo), or a living body implantable type (eg, an implantable circuit).
  • HMD head-mounted-device
  • the electronic device may be a home appliance.
  • Home appliances include, for example, televisions, digital video disk (DVD) players, audio systems, refrigerators, air conditioners, vacuum cleaners, ovens, microwave ovens, washing machines, air purifiers, set-top boxes, home automation control panels ( It may include at least one of a home automation control panel, a security control panel, a TV box, a game console, an electronic dictionary, an electronic key, a camcorder, or an electronic picture frame.
  • the electronic device may include various types of medical devices (e.g., various portable medical measuring devices (blood glucose meter, heart rate monitor, blood pressure monitor, body temperature monitor, etc.), magnetic resonance angiography (MRA), magnetic resonance imaging (MRI), CT (computer tomography), camera, or ultrasonicator, etc.), navigation device, GNSS (global navigation satellite system), EDR (event data recorder), FDR (flight data recorder), automotive infotainment ) devices, marine electronics (e.g.
  • various portable medical measuring devices blood glucose meter, heart rate monitor, blood pressure monitor, body temperature monitor, etc.
  • MRA magnetic resonance angiography
  • MRI magnetic resonance imaging
  • CT computer tomography
  • camera or ultrasonicator, etc.
  • navigation device e.g., GNSS (global navigation satellite system), EDR (event data recorder), FDR (flight data recorder), automotive infotainment ) devices, marine electronics (e.g.
  • marine navigation systems gyrocompasses, etc.
  • avionics security devices
  • automotive head units industrial or home robots
  • ATMs automatic teller's machines
  • POS point of sales
  • internet of things devices e.g. light bulbs, sensors, electric or gas meters, sprinklers, smoke alarms, thermostats, street lights, toasters
  • Exercise equipment hot water tank, heater, boiler, etc.
  • the electronic device may be a piece of furniture or a building/structure, an electronic board, an electronic signature receiving device, a projector, or various measuring devices (eg, Water, electricity, gas, radio wave measuring devices, etc.) may include at least one.
  • the electronic device may be one or a combination of more than one of the various devices described above.
  • An electronic device according to some embodiments may be a flexible electronic device.
  • the electronic device according to the embodiment of this document is not limited to the above-described devices, and may include new electronic devices according to technological development.
  • a housing according to various embodiments of the present disclosure may be at least a part of the housing of the electronic device described above.
  • FIG. 1 is a perspective view illustrating a housing 100 of an electronic device according to an exemplary embodiment.
  • an electronic device may include at least one housing 100 forming at least a part of an exterior of the electronic device.
  • At least one housing 100 may be injection molded using a mold. However, it is not limited to this.
  • at least one housing 100 may be molded by processing a housing member.
  • the housing 100 may include an unpainted surface.
  • the unpainted surface is not subjected to post-processing (eg, painting, deposition, or plating) on the housing base material (eg, a member that is the material of the housing 100) (eg, post-processing is not required)
  • the housing base material may refer to a surface exposed on the surface of the housing 100 .
  • the housing 100 including an unpainted surface may include at least one pattern area 110 to improve scratch resistance.
  • the unpainted surface of the housing 100 may include the pattern area 110 .
  • the pattern area 110 may include a pattern.
  • the pattern area 110 may be formed of a plurality of convex portions 120 .
  • the region 121 between the plurality of convex portions 120 of the pattern region 110 may include a curved surface.
  • the pattern area 110 may include a concave portion between one convex portion and another convex portion.
  • the pattern area 110 may be seamlessly formed from a convex portion to a concave portion.
  • the pattern area 110 may include a sine wave pattern. However, it is not limited to this.
  • a curvature value of the pattern of the pattern area 110 may be 0.2 or more.
  • the curvature of a curved surface may mean a rate of change representing a degree of curvature of the curved surface.
  • the curvature of the curved surface may be defined as a reciprocal of a radius (eg, RA or RB) of a circle including the curved surface.
  • the curvature (1/RA) value of the plurality of convex portions 120 may be 0.2 or more.
  • the curvature (1/RB) value of the curved surface formed in the region 121 between the plurality of convex portions 120 may be 0.2 or more. However, it is not limited to this.
  • the housing 100 may include a smooth surface at least in part.
  • the plurality of convex portions 120 forming the pattern area 110 may include a smooth surface.
  • the curved surface formed in the region 121 between the plurality of convex portions 120 may include a smooth surface. Since the pattern area 110 includes the smooth surface, the smooth surface may prevent contaminants from adsorbing to the pattern area 110 .
  • a surface roughness value of the pattern area 110 may be equal to or less than a predetermined threshold value.
  • the surface roughness of the pattern region 110 may be 5.0 ⁇ m or less. However, it is not limited to this.
  • the pattern area 110 may include a polygonal shape.
  • at least one of the plurality of convex portions 120 may have a polygonal shape.
  • at least one of the plurality of convex portions 120 may have a rectangular shape.
  • at least one of the plurality of convex portions 120 may have a triangular or pentagonal shape.
  • the polygonal shape of the pattern area 110 may include a curved polygonal shape rather than a planar shape.
  • the housing 100 may include a hard material.
  • the housing 100 may include at least one material of metal or glass.
  • the housing 100 may include at least one of resin and polymer materials.
  • the housing 100 may include a transparent material. However, it is not limited to this.
  • the housing 100 may include an opaque material.
  • FIG. 2 is a flowchart illustrating a method 200 of manufacturing a housing of an electronic device according to an exemplary embodiment.
  • the housing may be referred to by the housing 100 of FIG. 1 .
  • the same reference numerals are used for the same or substantially the same components as those described above, and redundant descriptions are omitted.
  • a method 200 of manufacturing a housing of an electronic device may include a process 203 of processing a mold with a tool and a process 207 of injection molding the housing with the processed mold.
  • the method 200 for manufacturing a housing of an electronic device is not limited thereto.
  • the method 200 for manufacturing a housing of an electronic device may omit at least one of the above processes or may further include at least one other process.
  • the method 200 of manufacturing a housing of an electronic device may further include at least one process of manufacturing a tool (201) or polishing an edge portion (205).
  • the process of manufacturing a tool 201 may include a process of manufacturing a tool for processing a mold used for injection molding of a housing.
  • the tool manufactured in step 201 may include a structure for processing the surface of the mold without rotating the tool. A detailed description of the tool will be described later with reference to FIG. 3 .
  • the tool in step 203 of machining a mold with a tool, may be used to machine the mold.
  • a tool may be used to form the first pattern area in the mold.
  • the tool may make at least one linear locomotion in one direction while pressing at least a portion of the mold.
  • the tool may linearly move without rotation. Details of the process of processing the mold will be described later with reference to FIGS. 4 to 9 .
  • the processed edge portion of the mold may be polished.
  • Polishing in the present disclosure may mean smoothing by rubbing the edge or surface of an object. Details of the process of polishing the edge portion will be described later with reference to FIGS. 10 and 11 .
  • the process 207 of injection molding the housing with the machined mold is a process of injection molding the housing including the second pattern area reversed to the first pattern area with the mold including the first pattern area.
  • a housing injection-molded by the mold may include a second pattern region including a plurality of convex portions inverted to the plurality of concave portions.
  • FIG. 3 is a plan view illustrating a tool 300 according to an exemplary embodiment.
  • 4 is a cross-sectional view illustrating a process of processing a mold with a tool according to an embodiment.
  • the tool 300 may include at least one machining part.
  • the tool 300 may include at least one protrusion 310 .
  • At least one protrusion 310 may include a convex shape protruding in one direction (eg, -y axis direction).
  • at least one protrusion 310 may include a curved surface.
  • the outer surface of at least one protrusion 310 may include a hemisphere shape.
  • at least one protrusion 310 may include an arch shape.
  • the processing unit of the tool 300 may include a smooth surface.
  • at least a portion of the at least one protrusion 310 may include a smooth surface. Since at least one protrusion 310 includes a smooth surface, adsorption of contaminants to an irregular structure (eg, an anchor structure) generated in the mold when the mold is processed with a tool can be prevented.
  • an irregular structure eg, an anchor structure
  • a tool 300 may be used to process a mold 400 used in a process of manufacturing a housing.
  • at least one protrusion 310 of the tool 300 may press (eg, in the -y-axis direction) at least a portion of the mold 400 .
  • a pattern region may be formed in the mold 400 .
  • a plurality of concave portions 410 may be formed in the mold 400 .
  • the plurality of concave portions 410 may include a first concave portion 411 and a second concave portion 412 .
  • the width W of at least one protrusion 310 of the tool 300 may be substantially equal to the width of at least one pattern of the pattern area.
  • the width W of the at least one protrusion 310 is the width of at least one concave portion (eg, the first concave portion 411 or the second concave portion 412) among the plurality of concave portions 410. It may be substantially equal to the width. However, it is not limited to this.
  • the width of at least one protrusion 310 of the tool 300 may be substantially the same as the width of at least one concave portion among the plurality of concave portions 410 . Accordingly, in the process of processing the mold 400 using the tool, vibration (or shaking) of the tool can be minimized.
  • the thickness D of at least one protrusion 310 of the tool 300 may be substantially equal to the depth of at least one pattern in the pattern area.
  • the thickness D of the at least one protrusion 310 is the thickness of at least one concave portion among the plurality of concave portions 410 (eg, the first concave portion 411 or the second concave portion 412). It may be substantially equal to the depth. However, it is not limited to this.
  • FIG. 5 is a perspective view illustrating a process of processing a mold with a tool according to an embodiment.
  • 6 is a graph showing the surface of a machined mold according to an embodiment.
  • Tool 300 and mold 400 may be referred to by tool 300 and mold 400 of FIGS. 2 to 5 , respectively.
  • the same reference numerals are used for the same or substantially the same components as those described above, and redundant information is omitted.
  • the tool 300 may process the mold so that at least a portion of the mold 400 includes a pattern area.
  • the tool 300 may linearly move in one direction while pressing at least a portion of the mold 400 .
  • a pattern region may be formed on at least a portion of the mold 400 .
  • the tool 300 may linearly move in at least two or more directions that intersect. The arrangement of patterns in the pattern area may be directed in the same direction as the moving path of the tool 300 .
  • At least one protrusion 310 of the tool 300 may linearly move at least once in the first direction A while pressing at least a portion of at least one surface of the mold 400 .
  • the at least one protrusion 310 of the tool 300 extends from one end to the other end of the mold 400 (in the first direction A), or from the other end of the mold 400 to one end (in the first direction). in the opposite direction of (A)) at least once.
  • a plurality of linear patterns may be formed on at least a part of the mold 400 .
  • the tool 300 may move without rotation when processing the mold 400 .
  • at least one protrusion 310 of the tool 300 may linearly move without rotation. Since the at least one protrusion 310 linearly moves without rotation, the at least one protrusion 310 can prevent scratches (eg, burrs or tool marks) on the mold due to the rotation of the tool. .
  • the pattern of the pattern region may include a concave shape by pressing at least a portion of at least one surface of the mold 400 with at least one protrusion 310 .
  • the pattern area may include a first concave portion 411 and a second concave portion 412 disposed parallel to the first concave portion 411 .
  • the region 413 between the first concave portion 411 and the second concave portion 412 may include a curved surface.
  • a convex portion may be formed between the first concave portion 411 and the second concave portion 412 .
  • the graphs 501 and 502 of (a) of FIG. 6 are graphs showing the surface of a mold processed using a conventional technique (eg, a method of etching at least a portion of the mold or a CNC machining method).
  • Graphs 503 and 504 in (b) of FIG. 6 may be graphs showing surfaces of a mold (400 in FIG. 5) processed using a tool (eg, 300 in FIG. 5) according to an embodiment.
  • the graph 503 in (b) of FIG. 6 may be a graph showing the surface of the cross section of the mold 400 cut along line A-A' in FIG. 5 .
  • the graph 504 in (b) of FIG. 6 may be a graph showing the surface of the cross section of the mold 400 cut along line BB' in FIG. 5 .
  • the x-axis of the graphs shown in (a) and (b) of FIG. 6 may be a position of a pattern formed by processing the mold 400 with the tool 300 .
  • the y-axis of the graph may be the height of the pattern from the reference plane (0).
  • the surface of the mold in the graph (a) is the surface of the mold in the graph (b).
  • it may contain more.
  • the surface roughness of the molds of the graphs 501 and 502 of (a) may be rougher than the roughness of the surfaces of the molds of the graphs 503 and 504 of (b). Therefore, the surface of the mold in the graph (a) is more likely to adsorb contaminants than the surface in the graph (b).
  • the pattern area of the mold may include a curved surface in which the area 413 between the plurality of concave portions is curved.
  • the pattern area of the mold may include a sine wave shape. However, it is not limited to this.
  • a surface roughness value of the pattern region of the mold may be equal to or less than a predetermined threshold value.
  • the surface roughness value of the pattern area of the mold may be 0.5 ⁇ m or less. However, it is not limited to this.
  • a curvature value of the plurality of concave portions of the pattern area of the mold may be 0.2 or more.
  • the curvature value of the curved surface of the region 413 between the plurality of concave portions may be 0.2 or more. However, it is not limited to this.
  • FIG. 7 is a perspective view illustrating a machined mold according to various embodiments.
  • Molds 600a to 600c may be referred to by mold 400 of FIGS. 2 to 5 .
  • redundant description will be omitted.
  • the mold may include a pattern area including a pattern.
  • the pattern area of the mold may include a plurality of linear patterns directed in one direction. However, it is not limited to this.
  • the pattern area of the mold may include at least one non-linear pattern.
  • the pattern area of the mold may include a plurality of linear patterns directed in one direction.
  • Straight patterns may include concave shapes.
  • the pattern area 610a of the mold 600a may include a plurality of linear patterns directed in the first direction (A).
  • the pattern area 610b of the mold 600b may include a plurality of linear patterns directed in a second direction B, which is different from the first direction A. may be
  • the pattern area of the mold may include a plurality of curved patterns.
  • the curved pattern may include a concave shape.
  • the pattern area 610c of the mold 600c may include a plurality of curved patterns directed in the third direction (C).
  • the pattern area of the mold may include a spiral pattern.
  • FIG. 8 is a perspective view illustrating a process of processing a mold according to an embodiment.
  • At least one protrusion eg, the protrusion 310 of FIG. 3
  • a tool eg, the tool 300 of FIG. 3
  • a process of linearly moving at least one time in the first direction A while pressing at least a portion of at least one surface of the mold 700 may be included.
  • a pattern area including a linear pattern directed in the first direction A may be formed in the mold 700 .
  • the pattern area of the mold 700 processed in the process of FIG. 8(b) may form a plurality of concave portions 710 having a polygonal shape.
  • the pattern area may form a plurality of concave portions 710 having a rectangular shape.
  • FIG. 9 is a perspective view illustrating a process of processing a mold according to an embodiment.
  • At least one protrusion eg, the protrusion 310 of FIG. 3
  • a tool eg, the tool 300 of FIG. 3
  • a process of linearly moving at least one or more times in the first direction A while pressing at least a portion of at least one surface of the mold 800 may be included.
  • a pattern region including a linear pattern directed in the first direction A may be formed in the mold 800 .
  • At least one protrusion of a tool presses at least a portion of the pattern area of the mold 800 processed in the process of (a) of FIG. 9 It may further include a process of linearly moving at least once in the second direction (B) while doing so.
  • the pattern area of the mold 800 processed in the step (b) of FIG. 9 may include a polygonal shape formed by crossing the first direction (A) and the second direction (B).
  • the plurality of concave portions may have a polygonal shape.
  • At least one protrusion of a tool presses at least a portion of the pattern region of the mold 800 processed in the process of (b) of FIG. 9 It may further include a process of linearly moving at least once in a third direction (C) different from the first direction (A) and the second direction (B) while doing so.
  • the pattern area of the mold 800 processed in the process of (c) of FIG. 9 intersects the first direction (A), the second direction (B), and the third direction (C). It may include a polygonal shape formed by being.
  • the plurality of concave portions 810 may have a polygonal shape.
  • FIG. 10 is a perspective view illustrating a pattern area of a machined mold according to various embodiments.
  • the mold 900a of FIG. 10 (a) may be referred to as the mold 400 of FIGS. 4 to 6 .
  • the mold 900b of FIG. 10(b) may be referred to as the mold 700 of FIG. 8 or the mold 800 of FIG. 9 . Redundant descriptions of components that are the same as or substantially the same as those described above are omitted.
  • an edge portion may be formed at a portion where the patterns of the pattern area intersect.
  • the edge portion may be formed at a portion where the concave portion of the pattern area intersects.
  • the edge portion may include a protruding shape.
  • the edge portion may include a protruding horn shape. However, it is not limited to this.
  • the mold 900a may include a pattern area 910a.
  • the pattern area 910b may include a plurality of concave portions.
  • the pattern area 910a may include a first concave portion 911a and a second concave portion 912a.
  • the pattern area 910a may include a plurality of edge portions.
  • the edge portion may be a corner (or edge) formed between a plurality of concave portions as the tool linearly moves in the first direction A at least once in the process of FIG. 8 (a).
  • the pattern area 910a may include an edge portion 920a formed between the first concave portion 911a and the second concave portion 912a.
  • the mold 900b may include a pattern area 910b.
  • the pattern area 910b may include a plurality of concave portions.
  • the pattern area 910b includes a first concave portion 911b, a second concave portion 912b adjacent to the first concave portion 911b, and a second concave portion adjacent to the first concave portion 911b.
  • a third concave portion 913b facing 912b, and a fourth concave portion 914b adjacent to the second concave portion 912b and the third concave portion 913b and facing the first concave portion 911b can include
  • the pattern area 910b may include a plurality of edge portions.
  • the pattern area 910b may include an edge portion 920b formed between the first concave portion 911b to the fourth concave portion 914b.
  • the edges (or edges) formed between the plurality of concave portions as the tool linearly moves in the second direction (B) intersecting the first direction (A). ) can be.
  • the edge portion 920b may include a plurality of edges as the tool linearly moves in the third direction C while intersecting the first direction A and the second direction B in the process of FIG. 9 (c). It may be a corner (or edge) formed between the concave portions.
  • FIG. 11 is a perspective view illustrating a process of polishing an edge portion 1020 of a machined mold according to an embodiment.
  • the edge portion 1020 formed between the plurality of concave portions 1010 may be polished.
  • the edge portion 1020 may be polished so that a region between the plurality of concave portions 1010 includes a curved surface.
  • the edge portion may be polished such that a region between the plurality of concave portions 1010 includes a convex portion.
  • the edge portion 1020 formed between the first concave portion 1011 to the fourth concave portion 1014 is to be polished.
  • the plurality of edge portions 1020 form a curved surface in which a region between the plurality of concave portions (eg, the first concave portion 1011 to the fourth concave portion 1014) is curved. can be polished to
  • the plurality of edge portions 1020 may be polished using a brush 1200.
  • the plurality of edge portions 1020 may be polished using a polishing process.
  • the process of polishing the edge portion 1020 may include a brush 1200 or a polishing process.
  • the brush 1200 or the polishing process the roughness of the pattern area 1000 may be reduced or appearance defects of the pattern area 1000 may be prevented.
  • FIG. 12 is a flowchart illustrating a method 1100 of manufacturing a housing of an electronic device according to another embodiment.
  • a method 1100 of manufacturing a housing of an electronic device may include a process 1103 of processing a housing member with a tool. However, it is not limited to this.
  • the method 1100 of manufacturing a housing of an electronic device may further include at least one other process.
  • the method 1100 of manufacturing a housing of an electronic device may further include at least one process of manufacturing a tool ( 1101 ) or polishing an edge portion ( 1105 ).
  • the tool may be referenced by tool 300 in FIG. 3 .
  • Process 1101 for manufacturing a tool may be referenced by process 201 for manufacturing a tool in FIG. 2 .
  • redundant description will be omitted.
  • the tool in the process of machining the housing member with a tool, may be used to machine the housing member such that at least a portion of the housing member includes the pattern region.
  • a tool may be used to machine the housing member such that the pattern area includes a plurality of convex portions.
  • the process of polishing the edge portion may include a process of polishing the edge portion formed in the pattern region of the housing member machined with a tool.
  • the edge portion may be polished using at least one process of a brush or a polishing process. However, it is not limited to this.
  • the housing member may include a hard material.
  • the housing member may include at least one material of metal or glass.
  • the housing member may include at least one of resin and polymer materials.
  • the housing member may include a transparent material.
  • the housing member may include an opaque material.
  • an electronic device 1300 includes a first side (or front side) 1310A, a second side (or back side) 1310B, and a first side 1310A and It may include a housing 1310 including a side surface 1310C surrounding a space between the second surface 1310B.
  • the housing may refer to a structure that forms part of the first face 1310A, the second face 1310B, and the side face 1310C of FIG. 13 .
  • the first surface 1310A may be formed by a front plate 1302 (eg, a glass plate including various coating layers, or a polymer plate) that is at least partially transparent.
  • the second side 1310B may be formed by a substantially opaque back plate 1311 .
  • the back plate 1311 is formed, for example, of coated or tinted glass, ceramic, polymer, metal (eg, aluminum, stainless steel (STS), or magnesium), or a combination of at least two of the foregoing materials. It can be.
  • the side surface 1310C may be formed by a side bezel structure (or "side member") 1318 coupled to the front plate 1302 and the rear plate 1311 and including metal and/or polymer.
  • the back plate 1311 and the side bezel structure 1318 may be integrally formed and include the same material (eg, a metal material such as aluminum).
  • the front plate 1302 includes two first regions 1310D curved from the first surface 1310A toward the rear plate 1311 and extending seamlessly, the front plate 1310D. 1302 on both ends of the long edge.
  • the rear plate 1311 includes two second regions 1310E that are curved and seamlessly extended from the second surface 1310B toward the front plate 1302 at a long edge. Can be included at both ends.
  • the front plate 1302 (or the rear plate 1311) may include only one of the first regions 1310D (or the second regions 1310E). In another embodiment, some of the first regions 1310D or the second regions 1310E may not be included.
  • the side bezel structure 1318 when viewed from the side of the electronic device 1300, has the first and second regions 1310D and 1310E. 1 thickness (or width), and may have a second thickness thinner than the first thickness at a side surface including the first regions 1310D or the second regions 1310E.
  • the electronic device 1300 includes a display 1301, audio modules 1303, 1307, and 1314, sensor modules 1304, 1316, and 1319, camera modules 1305, 1312, and 1313, and key input. At least one of the device 1317, the light emitting element 1306, and the connector holes 1308 and 1309 may be included. In some embodiments, the electronic device 1300 may omit at least one of the components (eg, the key input device 1317 or the light emitting device 1306) or may additionally include other components.
  • the display 1301 may be exposed through a substantial portion of the front plate 1302, for example. In some embodiments, at least a portion of the display 1301 may be exposed through the front plate 1302 forming the first area 1310D of the first surface 1310A and the side surface 1310C. In some embodiments, a corner of the display 1301 may be substantially identical to an adjacent outer shape of the front plate 1302 . In another embodiment (not shown), in order to expand an exposed area of the display 1301, the distance between the outer edge of the display 1301 and the outer edge of the front plate 1302 may be substantially the same.
  • a recess or an opening is formed in a part of the screen display area of the display 1301, and the audio module 1314, the sensor aligned with the recess or the opening At least one of the module 1304 , the camera module 1305 , and the light emitting element 1306 may be included.
  • an audio module 1314, a sensor module 1304, a camera module 1305, a fingerprint sensor 1316, and a light emitting element 1306 may include at least one of them.
  • the display 1301 is coupled to or adjacent to a touch sensing circuit, a pressure sensor capable of measuring the intensity (pressure) of a touch, and/or a digitizer that detects a magnetic stylus pen. can be placed.
  • a touch sensing circuit capable of measuring the intensity (pressure) of a touch
  • a digitizer capable of measuring the intensity (pressure) of a touch
  • a digitizer that detects a magnetic stylus pen.
  • at least a portion of the sensor modules 1304 and 1319 and/or at least a portion of the key input device 1317 may be located in the first regions 1310D and/or the second region 1310E. can be placed in the field.
  • the audio modules 1303 , 1307 , and 1314 may include a microphone hole 1303 and speaker holes 1307 and 1314 .
  • a microphone for acquiring external sound may be disposed inside the microphone hole 1303, and in some embodiments, a plurality of microphones may be disposed to detect the direction of sound.
  • the speaker holes 1307 and 1314 may include an external speaker hole 1307 and a receiver hole 1314 for communication.
  • the speaker holes 1307 and 1314 and the microphone hole 1303 may be implemented as one hole, or a speaker may be included without the speaker holes 1307 and 1314 (eg, a piezo speaker).
  • the sensor modules 1304 , 1316 , and 1319 may generate electrical signals or data values corresponding to an internal operating state of the electronic device 1300 or an external environmental state.
  • the sensor modules 1304, 1316, and 1319 may include, for example, a first sensor module 1304 (eg, a proximity sensor) and/or a second sensor module disposed on the first surface 1310A of the housing 1310 ( (not shown) (eg, a fingerprint sensor), and/or a third sensor module 1319 (eg, an HRM sensor) and/or a fourth sensor module 1316 disposed on the second side 1310B of the housing 1310. ) (eg, a fingerprint sensor).
  • a first sensor module 1304 eg, a proximity sensor
  • a second sensor module disposed on the first surface 1310A of the housing 1310 (not shown)
  • a third sensor module 1319 eg, an HRM sensor
  • a fourth sensor module 1316 disposed on the second side 1310B of the housing 1310.
  • the fingerprint sensor may be disposed on the first surface 1310A (eg, the display 1301 as well as the second surface 1310B) of the housing 1310.
  • the electronic device 1300 may include a sensor module, eg, not shown.
  • a sensor module eg, not shown.
  • a gesture sensor e.g., a gyro sensor, an air pressure sensor, a magnetic sensor, an acceleration sensor, a grip sensor, a color sensor, an IR (infrared) sensor, a bio sensor, a temperature sensor, a humidity sensor, or an illuminance sensor 1304 may be further selected.
  • a gesture sensor e.g, a gyro sensor, an air pressure sensor, a magnetic sensor, an acceleration sensor, a grip sensor, a color sensor, an IR (infrared) sensor, a bio sensor, a temperature sensor, a humidity sensor, or an illuminance sensor 1304 may be further selected.
  • IR infrared
  • the camera modules 1305, 1312, and 1313 include a first camera device 1305 disposed on a first surface 1310A of the electronic device 1300 and a second camera device 1312 disposed on a second surface 1310B. ), and/or flash 1313.
  • the camera devices 1305 and 1312 may include one or a plurality of lenses, an image sensor, and/or an image signal processor.
  • the flash 1313 may include, for example, a light emitting diode or a xenon lamp.
  • two or more lenses (infrared camera, wide-angle and telephoto lenses) and image sensors may be disposed on one side of the electronic device 1300 .
  • the key input device 1317 may be disposed on the side surface 1310C of the housing 1310.
  • the electronic device 1300 may not include some or all of the above-mentioned key input devices 1317, and the key input devices 1317 that are not included may include other key input devices such as soft keys on the display 1301. can be implemented in the form
  • the key input device may include a sensor module 1316 disposed on the second side 1310B of the housing 1310.
  • the light emitting device 1306 may be disposed on the first surface 1310A of the housing 1310, for example.
  • the light emitting element 1306 may provide, for example, state information of the electronic device 1300 in the form of light.
  • the light emitting device 1306 may provide, for example, a light source interlocked with the operation of the camera module 1305 .
  • the light emitting element 1306 may include, for example, an LED, an IR LED, and a xenon lamp.
  • the connector holes 1308 and 1309 include a first connector hole 1308 capable of receiving a connector (eg, a USB connector) for transmitting and receiving power and/or data to and from an external electronic device, and/or an external electronic device. and a second connector hole (eg, an earphone jack) 1309 capable of accommodating a connector for transmitting and receiving an audio signal.
  • a connector eg, a USB connector
  • a second connector hole eg, an earphone jack
  • the electronic device 1400 includes a side bezel structure 1410, a first support member 1411 (eg, a bracket), a front plate 1420, a display 1430, and a printed circuit board 1440. , a battery 1450, a second support member 1460 (eg, a rear case), an antenna 1470, and a rear plate 1480.
  • the electronic device 1400 may omit at least one of the components (eg, the first support member 1411 or the second support member 1460) or may additionally include other components.
  • At least one of the components of the electronic device 1400 may be the same as or similar to at least one of the components of the electronic device 1300 of FIG. 13 or 14, and duplicate descriptions are omitted below.
  • the first support member 1411 may be disposed inside the electronic device 1400 and connected to the side bezel structure 1410 or integrally formed with the side bezel structure 1410 .
  • the first support member 1411 may be formed of, for example, a metal material and/or a non-metal (eg, polymer) material.
  • the display 1430 may be coupled to one surface of the first support member 1411 and the printed circuit board 1440 may be coupled to the other surface.
  • a processor, memory, and/or interface may be mounted on the printed circuit board 1440 .
  • the processor may include, for example, one or more of a central processing unit, an application processor, a graphics processing unit, an image signal processor, a sensor hub processor, or a communication processor.
  • Memory may include, for example, volatile memory or non-volatile memory.
  • the interface may include, for example, a high definition multimedia interface (HDMI), a universal serial bus (USB) interface, an SD card interface, and/or an audio interface.
  • HDMI high definition multimedia interface
  • USB universal serial bus
  • the interface may electrically or physically connect the electronic device 1400 to an external electronic device, and may include a USB connector, an SD card/MMC connector, or an audio connector.
  • the battery 1450 is a device for supplying power to at least one component of the electronic device 1400, and may include, for example, a non-rechargeable primary battery, a rechargeable secondary battery, or a fuel cell. . At least a portion of the battery 1450 may be disposed on a substantially coplanar surface with the printed circuit board 1440 , for example. The battery 1450 may be integrally disposed inside the electronic device 1400 or may be disposed detachably from the electronic device 1400 .
  • the antenna 1470 may be disposed between the back plate 1480 and the battery 1450 .
  • the antenna 1470 may include, for example, a near field communication (NFC) antenna, a wireless charging antenna, and/or a magnetic secure transmission (MST) antenna.
  • the antenna 1470 may, for example, perform short-range communication with an external device or wirelessly transmit/receive power required for charging.
  • an antenna structure may be formed by a part of the side bezel structure 1410 and/or the first support member 1411 or a combination thereof.
  • At least one housing of the aforementioned electronic device is the housing of the present disclosure (eg, , the housing 100 of FIG. 1).
  • an electronic device includes a housing including a non-painted surface forming an exterior of the electronic device, and the non-painted surface has a smooth surface. and a pattern area formed of a plurality of convex portions including a surface roughness value of the pattern area may be equal to or less than a predetermined threshold value.
  • the pattern area may include a curved surface in which an area between the plurality of convex portions is curved.
  • the curvature value of the curved surface may be 0.2 or more.
  • At least one of the plurality of convex portions may have a polygonal shape.
  • the pattern area may have a surface roughness value of 5.0 ⁇ m or less.
  • the housing may include at least one material of metal, glass, resin, or polymer.
  • the first protrusion processing the mold with the tool so that at least one surface of the mold forms a first pattern region formed of a plurality of concave portions including a smooth surface by linear locomotion at least once in a direction; and the processed mold
  • the method may include a step of injecting a housing including at least a portion of a second pattern region inverted from the first pattern region.
  • the manufacturing method of the housing of the electronic device may further include a step of polishing an edge portion formed between the plurality of concave portions of the first pattern area.
  • the edge part in the process of polishing the edge part, may be polished using at least one process of a brush or a polishing process.
  • the process of machining the mold with the tool is linear at least once in a second direction different from the first direction while the at least one protrusion of the tool presses at least a portion of at least one surface of the mold.
  • a moving process may be further included.
  • the at least one protrusion of the tool presses at least a portion of at least one surface of the mold in a third direction different from the first direction and the second direction. It may further include a process of linear movement at least once.
  • the at least one protrusion of the tool may linearly move without rotation to process the mold.
  • the first pattern area may include a curved surface in which an area between the plurality of concave portions is curved.
  • the curvature value of the curved surface may be 0.2 or more.
  • a curvature value of the plurality of concave portions may be 0.2 or more.
  • At least one of the plurality of concave portions may have a polygonal shape.
  • the housing may include an unpainted surface forming an exterior of the electronic device, and the unpainted surface may include the second pattern area formed of a plurality of convex portions including a smooth surface.
  • a surface roughness value of at least one of the first pattern area and the second pattern area may be 5.0 ⁇ m or less.
  • the housing may include at least one material of metal, glass, resin, or polymer.

Landscapes

  • Engineering & Computer Science (AREA)
  • Mechanical Engineering (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Manufacturing & Machinery (AREA)
  • Moulds For Moulding Plastics Or The Like (AREA)

Abstract

Un dispositif électronique selon un mode de réalisation peut comprendre un boîtier comprenant une surface non revêtue formant l'extérieur du dispositif électronique, la surface non revêtue pouvant comprendre une région de motif formée d'une pluralité de parties convexes comprenant une surface lisse, et la région de motif pouvant avoir une valeur de rugosité de surface égale ou inférieure à une certaine valeur de seuil. Divers autres modes de réalisation identifiés à partir de la description sont possibles.
PCT/KR2022/014098 2021-10-18 2022-09-21 Dispositif électronique comprenant un boîtier et son procédé de fabrication Ceased WO2023068568A1 (fr)

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Citations (5)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPH0865604A (ja) * 1994-08-26 1996-03-08 Hitachi Ltd 電子機器の筐体構造
JP2007173585A (ja) * 2005-12-22 2007-07-05 Kyocera Corp 電子機器用ケース
JP2019055517A (ja) * 2017-09-21 2019-04-11 キヤノン株式会社 樹脂成形品、その製造方法、およびその製造に用いる製造装置
KR20200112228A (ko) * 2019-03-21 2020-10-05 삼성전자주식회사 후면 플레이트를 포함하는 전자 장치 및 이의 제조하는 방법
JP2021079580A (ja) * 2019-11-15 2021-05-27 キヤノン株式会社 樹脂成形品、樹脂成形品の製造方法、樹脂成形品を備えた機器、樹脂成形用の金型、および金型の製造方法

Patent Citations (5)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPH0865604A (ja) * 1994-08-26 1996-03-08 Hitachi Ltd 電子機器の筐体構造
JP2007173585A (ja) * 2005-12-22 2007-07-05 Kyocera Corp 電子機器用ケース
JP2019055517A (ja) * 2017-09-21 2019-04-11 キヤノン株式会社 樹脂成形品、その製造方法、およびその製造に用いる製造装置
KR20200112228A (ko) * 2019-03-21 2020-10-05 삼성전자주식회사 후면 플레이트를 포함하는 전자 장치 및 이의 제조하는 방법
JP2021079580A (ja) * 2019-11-15 2021-05-27 キヤノン株式会社 樹脂成形品、樹脂成形品の製造方法、樹脂成形品を備えた機器、樹脂成形用の金型、および金型の製造方法

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