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WO2023064258A1 - Stabilisation de température d'encres fonctionnelles convertibles par rupture de chemins de conduction - Google Patents

Stabilisation de température d'encres fonctionnelles convertibles par rupture de chemins de conduction Download PDF

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Publication number
WO2023064258A1
WO2023064258A1 PCT/US2022/046255 US2022046255W WO2023064258A1 WO 2023064258 A1 WO2023064258 A1 WO 2023064258A1 US 2022046255 W US2022046255 W US 2022046255W WO 2023064258 A1 WO2023064258 A1 WO 2023064258A1
Authority
WO
WIPO (PCT)
Prior art keywords
ink
particles
aspect ratio
convertible
stabilizing
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Ceased
Application number
PCT/US2022/046255
Other languages
English (en)
Inventor
Craig A. ARMIENTO
Yuri PIRO
Dr. Oshadha RANASINGHA
Andrew M. LUCE
Edward D. Kingsley
Dr. Alkim AKYURTLU
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Raytheon Co
University of Massachusetts Boston
University of Massachusetts Amherst
Original Assignee
Raytheon Co
University of Massachusetts Boston
University of Massachusetts Amherst
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Priority claimed from US17/938,688 external-priority patent/US12492318B2/en
Application filed by Raytheon Co, University of Massachusetts Boston, University of Massachusetts Amherst filed Critical Raytheon Co
Priority to KR1020247014431A priority Critical patent/KR20240070664A/ko
Priority to JP2024521840A priority patent/JP2024539615A/ja
Priority to EP22801623.4A priority patent/EP4416225A1/fr
Publication of WO2023064258A1 publication Critical patent/WO2023064258A1/fr
Anticipated expiration legal-status Critical
Ceased legal-status Critical Current

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Classifications

    • C—CHEMISTRY; METALLURGY
    • C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
    • C09D—COATING COMPOSITIONS, e.g. PAINTS, VARNISHES OR LACQUERS; FILLING PASTES; CHEMICAL PAINT OR INK REMOVERS; INKS; CORRECTING FLUIDS; WOODSTAINS; PASTES OR SOLIDS FOR COLOURING OR PRINTING; USE OF MATERIALS THEREFOR
    • C09D11/00—Inks
    • C09D11/02—Printing inks
    • C09D11/10—Printing inks based on artificial resins
    • C09D11/106—Printing inks based on artificial resins containing macromolecular compounds obtained by reactions only involving carbon-to-carbon unsaturated bonds
    • C09D11/107—Printing inks based on artificial resins containing macromolecular compounds obtained by reactions only involving carbon-to-carbon unsaturated bonds from unsaturated acids or derivatives thereof
    • C—CHEMISTRY; METALLURGY
    • C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
    • C09D—COATING COMPOSITIONS, e.g. PAINTS, VARNISHES OR LACQUERS; FILLING PASTES; CHEMICAL PAINT OR INK REMOVERS; INKS; CORRECTING FLUIDS; WOODSTAINS; PASTES OR SOLIDS FOR COLOURING OR PRINTING; USE OF MATERIALS THEREFOR
    • C09D11/00—Inks
    • C09D11/02—Printing inks
    • C09D11/03—Printing inks characterised by features other than the chemical nature of the binder
    • C09D11/037—Printing inks characterised by features other than the chemical nature of the binder characterised by the pigment
    • C—CHEMISTRY; METALLURGY
    • C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
    • C09D—COATING COMPOSITIONS, e.g. PAINTS, VARNISHES OR LACQUERS; FILLING PASTES; CHEMICAL PAINT OR INK REMOVERS; INKS; CORRECTING FLUIDS; WOODSTAINS; PASTES OR SOLIDS FOR COLOURING OR PRINTING; USE OF MATERIALS THEREFOR
    • C09D11/00—Inks
    • C09D11/52—Electrically conductive inks

Definitions

  • the present disclosure relates to convertible inks, and more specifically, to temperature-stabilization of convertible inks.
  • Convertible inks can be used to fabricate electronic structures.
  • Examples of convertible inks include composite materials with an insulating or dielectric phase after curing but which can be selectively converted to a conductive or resistive phase by methods such as a thermal treatment or laser sintering.
  • an ink stabilizing composition includes a polymeric network including an acrylate polymer and a plurality of high aspect ratio particles each having an aspect ratio of about 2:1 to about 30:1 and an average particle diameter of about 0.5 to about 1.2 micrometers.
  • a stabilized ink includes a plurality of conductive particles, a plurality of insulating particles, a plurality of high aspect ratio stabilizing particles, and a polymer in voids between the plurality of conductive particles and the plurality of insulating particles.
  • the stabilized ink is in an insulating phase.
  • a method of stabilizing a convertible ink includes disposing a stabilizing material on a convertible ink.
  • the stabilizing material includes a polymeric network and a plurality of high aspect ratio particles each having an aspect ratio of about 2:1 to about 30:1 and an average particle diameter of about 0.5 to about 1.2 micrometers.
  • the convertible ink includes a plurality of conductive particles and a plurality of insulating particles.
  • FIG. 1A is a laser sintering method for converting dielectric portions of a convertible ink to conductive portions
  • FIG. IB is an expanded view of dielectric portions of the convertible ink
  • FIG. 1C is an expanded view of a conductive path of the convertible ink after laser sintering
  • FIG. 2 A shows dielectric portions of the convertible ink
  • FIG. 2B shows the convertible ink after applying a stabilizing material layer
  • FIG. 2C shows disruption of the conductive path after applying the stabilizing material layer and laser sintering
  • FIG. 3 is a graph showing the change in resistance of a convertible ink with and without a stabilizing layer
  • FIG. 4 A is a top view of a patterned stabilizing layer on a convertible ink layer.
  • FIG. 4B is a side view of FIG. 4A.
  • Convertible inks are composite materials with an insulating or dielectric phase after being cured but which are selectively converted to a conductive or resistive phase by methods such as a thermal treatment or laser sintering.
  • Convertible inks can include, for example, a composite blend of conductive particles and insulating particles.
  • a non-limiting example of a convertible ink includes conductive metal nanoparticles (e.g., silver) and insulating nanoparticles (e.g., barium strontium titanate), blended in a ratio such that the ink includes an insulating phase after curing but provides a conductive (and resistive) phase after higher temperature thermal treatment (e.g., a temperature greater than 125 degrees Celsius), such as by Selective Laser Sintering by an ultraviolet laser. Selective Laser Sintering can be performed using most lasers, but 400 to 450 nanometer (nm) wavelength lasers can provide optimal results.
  • conductive metal nanoparticles e.g., silver
  • insulating nanoparticles e.g., barium strontium titanate
  • higher temperature thermal treatment e.g., a temperature greater than 125 degrees Celsius
  • Selective Laser Sintering can be performed using most lasers, but 400 to 450 nanometer (nm) wavelength lasers can provide optimal results.
  • the surface plasmon resonance of silver (Ag) nanoparticles is around 400 to 450 nm, and therefore, when silver is used in the convertible ink, exciting the surface plasmon resonance of the Ag nanoparticles will result in efficiently melting the silver nanoparticles due to the local heating generated by surface plasmon resonance excitation.
  • other lasers e.g., 830 nm lasers among others, are also suitable for sintering silver nanoparticles to form a conductive pattern.
  • the laser wavelength used is tailored for the conductive nanoparticle. For example, when gold nanoparticles are used, a 532 nm laser may be used to excite the surface plasmon resonance of the gold. However, a laser of any wavelength may be used and tailored to the particular conductive nanoparticle.
  • FIG. 1A shows a laser sintering method for converting dielectric portions of a convertible ink to conductive portions.
  • the convertible ink is in an insulating phase.
  • a laser 110 converts insulting portions 102 of a convertible ink to conductive portions 106.
  • FIG. IB is an expanded view of the dielectric portions 102 of the convertible ink, which includes a blend of conductive particles 122 and insulating particles 120.
  • FIG. 1C is an expanded view of the conductive portion 106 showing how the conductive path of the convertible ink forms after laser sintering or thermal sintering, which causes the conductive particles 122 to fuse.
  • the convertible inks can be used as printable inks that are printed as films that can be easily patterned to create conductive traces by application of localized heat. After patterning the traces, however, it is desirable that insulating material remain in an insulating state. Yet, in some applications, subsequent thermal processes (e.g., soldering or other packaging processes) could unintentionally convert the desired patterns to a conductive state, thereby negating the patterning process.
  • stabilizing materials and methods of making and using thereof, that introduce high aspect ratio particles and a three-dimensional polymer network into the convertible inks that prevent the formation of conductive paths in the films, even after thermal exposure, such as soldering or microelectronic packaging processes.
  • the stabilizing materials can be used as a mask that is patterned to selectively define conductive traces within the dielectric portions of the convertible ink.
  • the term “convertible ink” and other like terms mean a composite of conductive and non- conductive particles that is converted from an insulator phase to a conductive/resistive phase by thermal sintering or laser sintering.
  • FIG. 2A shows dielectric portions of a convertible ink after curing and includes a blend of conductive particles 224 and insulating particles 222 with air gaps 202 therebetween.
  • FIG. 2B shows the convertible ink after applying a stabilizing material layer to the convertible ink.
  • the stabilizing layer includes a polymer 204 that fills the air gaps 202 in the convertible ink and high aspect ratio particles 260.
  • FIG. 2C shows the convertible ink after thermal exposure, such as laser sintering or thermal sintering, and disruption of the conductive path 230 by the high aspect ratio particles 260. Both the polymer 204 and the high aspect ratio particles 260 are needed to prevent formation of the conductive path 230.
  • the conductive particles 224 in the convertible ink include conductive metal particles.
  • conductive metal particles include silver particles, gold particles, copper particles, or a combination thereof.
  • the conductive particles 224 are in the convertible ink in an amount of about 55 to about 70 weight% (wt.%). In other embodiments, the conductive particles 224 are in the convertible ink in an amount of about 60 to about 65 wt.%. Yet, in some embodiments, the conductive particles 224 are in the convertible ink in an amount of about 62.5 wt.%.
  • the average diameter of the conductive particles 224 is about 20 to about 200 nanometers (nm). In other embodiments, the average diameter of the conductive particles 224 is about 80 to about 120 nm. Yet, in some embodiments, the average diameter of the conductive particles 224 is about 100 nm. The average diameters of the conductive particles 224 and insulating particles 222 should be very close in order to see a homogeneous distribution after the curing.
  • the insulating particles 222 in the convertible ink include insulating (dielectric) materials or alloys.
  • a non-limiting example of insulating particles 222 include barium strontium titanate particles.
  • the insulating particles 222 have a melting point of at least 700 degrees Celsius.
  • the average diameter of the insulating particles 222 is about 20 to about 200 nanometers (nm). In other embodiments, the average diameter of the insulating particles 222 is about 80 to about 120 nm. Yet, in some embodiments, the average diameter of the insulating particles 222 is about 100 nm. [0028] In one or more embodiments, the insulating particles 222 are in the convertible ink in an amount of about 30 to about 45 weight% (wt.%). In other embodiments, the insulating particles 222 are in the convertible ink in an amount of about 35 to about 40 wt.%. Yet, in some embodiments, the insulating particles 222 are in the convertible ink in an amount of about 37.5 wt.%.
  • the conductive particles 224 are silver particles, and the insulating particles 222 are barium strontium titanate particles.
  • the conductive particles 224 and insulating particles 222 are combined in a solvent(s) and optionally, one or more additives.
  • solvents include l-methoxy-2-propanol, ethylene glycol, or any combination thereof.
  • the solvent is a glycol solvent.
  • the mixture of conductive particles 224 and insulating particles 222 in the solvent(s) and optional additives is then cured by applying heat. After curing, the convertible ink remains in the insulating/ dielectric phase and includes only the conductive particles 222 and insulating particles 224.
  • Curing is performed by, for example, heating for a period of time.
  • the temperature and time for curing will depend on the composition of the convertible ink. According to one or more embodiments, curing is performed by heating at a temperature of about 75 to about 125 degrees Celsius. In other embodiments, curing is performed by heating at a temperature of about 80 to about 100 degrees Celsius.
  • the stabilizing material layer is applied and cured with ultraviolet light.
  • the stabilizing layer includes a polymer 204 that fills the air gaps 202 in the convertible ink, as well as between high aspect ratio particles 260 (see FIG. 2B).
  • FIG. 2C shows the convertible ink after thermal treatment, such as ultraviolet laser sintering, and disruption of the conductive path 230 by the high aspect ratio particles 260.
  • the relatively large high aspect ratio particles 260 decrease the ratio of conductive particles 224 to insulating particles 222 in the initially cured convertible ink.
  • the relatively large high aspect ratio particles 260 further disrupt the coalescence of the conductive particles 224 during the thermal sintering when the conductive path 230 is formed.
  • the high aspect ratio particles 260 are hexagonal boron nitride particles. In some embodiments, the high aspect ratio particles 260 have an aspect ratio of about 2:1 to about 30:1. In other embodiments, the high aspect ratio particles 260 have an aspect ratio of about 10: 1 to about 20: 1.
  • the high aspect ratio particles 260 have an average diameter of about 0.5 to about 1.2 micrometers. In other embodiments, the high aspect ratio particles 260 have an average diameter of about 0.8 to about 1.0 micrometers.
  • the high aspect ratio particles 260 are in the stabilizing layer in an amount of about 5 to about 20 wt.%. In other embodiments, the high aspect ratio particles 260 are in the stabilizing layer in an amount of about 12 to about 15 wt.%.
  • the polymer 204 that fills the air gaps 202 in the convertible ink is an acrylate polymer.
  • the polymer include trimethylolpropane ethoxylate triacrylate, urethane acrylate, epoxy acrylate, polyester acrylate, or any combination thereof.
  • the polymer 204 is a triacrylate polymer, which creates a strong three-dimensional polymeric network as a result of the three sites of unsaturation. The polymeric three-dimensional network created by the polymer 204 fills the air gaps 202 and minimizes the reflowing of the conductive particles 224.
  • the polymer 204 forming the three-dimensional network sustains high temperatures without decomposition. In some embodiments, the polymer 204 sustains a temperature of about 100 to about 250 degrees Celsius without decomposition. In other embodiments, the polymer 204 sustains a temperature of about 200 to about 225 without decomposition.
  • one or more photoinitiators are combined with a polymer 204 precursor (i.e., oligomers and/ or monomers), high aspect ratio particles 260, and optionally, one or more additives, such as one or more photoinitiators.
  • a polymer 204 precursor i.e., oligomers and/ or monomers
  • high aspect ratio particles 260 i.e., oligomers and/ or monomers
  • additives such as one or more photoinitiators.
  • the one or more optional additive is added in an amount of about 0.25 to about 5 wt.%. The combination is mixed until agglomerations are no longer visible.
  • the polymer precursor e.g., oligomer and/or monomer
  • the polymer precursor is in the stabilizing layer in an amount of about 70 to about 89 wt.%. In other embodiments, the polymer precursor (e.g., oligomer and/or monomer) is in the stabilizing layer in an amount of about 80 to about 85 wt.%.
  • Non-limiting examples of photoinitiators include 1 -hydroxy cyclohexyl phenyl ketone, phenylbis (2,4,6,7-trimethylbenzoyl) phospine oxide, 2-methyl-4’-(methylthio)-2- morpholinopropionphenone, benzophenone, 4-benzoyl-4 ’ -methyldiphenylsulphide, benzyldimethylketal, 2-benzyle-2-dimethylamino-l-(4-morpholinophenyl)-l-butanoate, or any combination thereof.
  • the stabilizing material layer is applied to the surface of the convertible ink in the dielectric phase. Once applied, the stabilizing layer disrupts formation of a conductive path under thermal treatment that would otherwise convert the ink to a conductive phase (see FIG. 3).
  • the stabilizing layer is formed on the cured convertible ink layer.
  • the stabilizing layer is patterned as a mask.
  • FIGs. 4A and 4B are top and side views, respectively, of a patterned stabilizing layer 402 on a convertible ink layer 404 in a cured dielectric phase. Once portions of the stabilizing layer 402 have been removed to expose select portions of the convertible ink below, the uncovered portions are selectively thermally treated, for example, by laser sintering, to form select conductive portions 406.
  • the stabilizing layer 402 protects the unexposed portions of the convertible ink layer 404.
  • Example 1 Stabilizing layer formulations
  • oligomer, boron nitride, and photoinitiators are placed in a glass jar covered in aluminum foil. The jar is then stirred for two hours, with ten second on-off cycles. The sample is checked every minute for agglomerations. If agglomerations are present, the mixture is hand mixed until broken. The final mixture should have no visible agglomerations.
  • FIG. 3 is a graph showing the change in resistance of the convertible ink with and without a stabilizing material layer.
  • a stabilizing layer UV96
  • the resistance did not significantly change.
  • the measured resistance changed significantly, indicating that the insulating material was entirely converted to a conductor.
  • connection can include an indirect “connection” and a direct “connection.”
  • references in the specification to “one embodiment,” “an embodiment,” “an example embodiment,” etc., indicate that the embodiment described can include a particular feature, structure, or characteristic, but every embodiment may or may not include the particular feature, structure, or characteristic. Moreover, such phrases are not necessarily referring to the same embodiment. Further, when a particular feature, structure, or characteristic is described in connection with an embodiment, it is submitted that it is within the knowledge of one skilled in the art to affect such feature, structure, or characteristic in connection with other embodiments whether or not explicitly described.
  • the terms “upper,” “lower,” “right,” “left,” “vertical,” “horizontal,” “top,” “bottom,” and derivatives thereof shall relate to the described structures and methods, as oriented in the drawing figures.
  • the terms “overlying,” “atop,” “on top,” “positioned on” or “positioned atop” mean that a first element, such as a first structure, is present on a second element, such as a second structure, wherein intervening elements such as an interface structure can be present between the first element and the second element.
  • the term “direct contact” means that a first element, such as a first structure, and a second element, such as a second structure, are connected without any intermediary conducting, insulating or semiconductor layers at the interface of the two elements.

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  • Chemical & Material Sciences (AREA)
  • Life Sciences & Earth Sciences (AREA)
  • Engineering & Computer Science (AREA)
  • Materials Engineering (AREA)
  • Wood Science & Technology (AREA)
  • Organic Chemistry (AREA)
  • Chemical Kinetics & Catalysis (AREA)
  • General Chemical & Material Sciences (AREA)
  • Inks, Pencil-Leads, Or Crayons (AREA)

Abstract

Une composition de stabilisation d'encre comprend un réseau polymère comprenant un polymère d'acrylate et une pluralité de particules à rapport de forme élevé ayant chacune un rapport de forme d'environ 2 : 1 à environ 30 : 1 et un diamètre moyen de particule d'environ 0,5 à environ 1,2 micromètres.
PCT/US2022/046255 2021-10-11 2022-10-11 Stabilisation de température d'encres fonctionnelles convertibles par rupture de chemins de conduction Ceased WO2023064258A1 (fr)

Priority Applications (3)

Application Number Priority Date Filing Date Title
KR1020247014431A KR20240070664A (ko) 2021-10-11 2022-10-11 전도성 경로의 붕괴를 통한 컨버터블 기능성 잉크의 온도 안정화
JP2024521840A JP2024539615A (ja) 2021-10-11 2022-10-11 導通経路の遮断による変換可能機能性インクの温度安定化
EP22801623.4A EP4416225A1 (fr) 2021-10-11 2022-10-11 Stabilisation de température d'encres fonctionnelles convertibles par rupture de chemins de conduction

Applications Claiming Priority (4)

Application Number Priority Date Filing Date Title
US202163254230P 2021-10-11 2021-10-11
US63/254,230 2021-10-11
US17/938,688 US12492318B2 (en) 2021-10-11 2022-10-07 Temperature-stabilization of convertible functional inks by disruption of conduction paths
US17/938,688 2022-10-07

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WO2023064258A1 true WO2023064258A1 (fr) 2023-04-20

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Citations (5)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2003128959A (ja) * 2001-10-26 2003-05-08 Morimura Chemicals Ltd 透明導電塗膜及び透明導電塗膜形成用塗料
WO2012135551A1 (fr) * 2011-03-29 2012-10-04 Sun Chemical Corporation Compositions pâteuses en film épais applicables par sérigraphie ayant un rapport d'aspect élevé et contenant des cires thixotropes
JP2013195733A (ja) * 2012-03-21 2013-09-30 Toray Ind Inc 感光性導電ペースト
EP3065151A1 (fr) * 2013-10-30 2016-09-07 Nitto Denko Corporation Module de communication
JP2019192475A (ja) * 2018-04-25 2019-10-31 東洋インキＳｃホールディングス株式会社 活性エネルギー線硬化型導電性ペーストおよび配線板

Patent Citations (5)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2003128959A (ja) * 2001-10-26 2003-05-08 Morimura Chemicals Ltd 透明導電塗膜及び透明導電塗膜形成用塗料
WO2012135551A1 (fr) * 2011-03-29 2012-10-04 Sun Chemical Corporation Compositions pâteuses en film épais applicables par sérigraphie ayant un rapport d'aspect élevé et contenant des cires thixotropes
JP2013195733A (ja) * 2012-03-21 2013-09-30 Toray Ind Inc 感光性導電ペースト
EP3065151A1 (fr) * 2013-10-30 2016-09-07 Nitto Denko Corporation Module de communication
JP2019192475A (ja) * 2018-04-25 2019-10-31 東洋インキＳｃホールディングス株式会社 活性エネルギー線硬化型導電性ペーストおよび配線板

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