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WO2022223744A1 - Dispositif d'éjection de liant et procédé de commande dudit dispositif - Google Patents

Dispositif d'éjection de liant et procédé de commande dudit dispositif Download PDF

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Publication number
WO2022223744A1
WO2022223744A1 PCT/EP2022/060637 EP2022060637W WO2022223744A1 WO 2022223744 A1 WO2022223744 A1 WO 2022223744A1 EP 2022060637 W EP2022060637 W EP 2022060637W WO 2022223744 A1 WO2022223744 A1 WO 2022223744A1
Authority
WO
WIPO (PCT)
Prior art keywords
temperature
additive manufacturing
manufacturing device
powder composition
layer
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Ceased
Application number
PCT/EP2022/060637
Other languages
English (en)
Inventor
Magnus Boström
Daniel WEDLUND
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Sandvik Machining Solutions AB
Original Assignee
Sandvik Machining Solutions AB
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Sandvik Machining Solutions AB filed Critical Sandvik Machining Solutions AB
Publication of WO2022223744A1 publication Critical patent/WO2022223744A1/fr
Anticipated expiration legal-status Critical
Ceased legal-status Critical Current

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Classifications

    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B29—WORKING OF PLASTICS; WORKING OF SUBSTANCES IN A PLASTIC STATE IN GENERAL
    • B29C—SHAPING OR JOINING OF PLASTICS; SHAPING OF MATERIAL IN A PLASTIC STATE, NOT OTHERWISE PROVIDED FOR; AFTER-TREATMENT OF THE SHAPED PRODUCTS, e.g. REPAIRING
    • B29C64/00—Additive manufacturing, i.e. manufacturing of three-dimensional [3D] objects by additive deposition, additive agglomeration or additive layering, e.g. by 3D printing, stereolithography or selective laser sintering
    • B29C64/30—Auxiliary operations or equipment
    • B29C64/386—Data acquisition or data processing for additive manufacturing
    • B29C64/393—Data acquisition or data processing for additive manufacturing for controlling or regulating additive manufacturing processes
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B22—CASTING; POWDER METALLURGY
    • B22F—WORKING METALLIC POWDER; MANUFACTURE OF ARTICLES FROM METALLIC POWDER; MAKING METALLIC POWDER; APPARATUS OR DEVICES SPECIALLY ADAPTED FOR METALLIC POWDER
    • B22F10/00—Additive manufacturing of workpieces or articles from metallic powder
    • B22F10/10—Formation of a green body
    • B22F10/14—Formation of a green body by jetting of binder onto a bed of metal powder
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B22—CASTING; POWDER METALLURGY
    • B22F—WORKING METALLIC POWDER; MANUFACTURE OF ARTICLES FROM METALLIC POWDER; MAKING METALLIC POWDER; APPARATUS OR DEVICES SPECIALLY ADAPTED FOR METALLIC POWDER
    • B22F10/00—Additive manufacturing of workpieces or articles from metallic powder
    • B22F10/30—Process control
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B22—CASTING; POWDER METALLURGY
    • B22F—WORKING METALLIC POWDER; MANUFACTURE OF ARTICLES FROM METALLIC POWDER; MAKING METALLIC POWDER; APPARATUS OR DEVICES SPECIALLY ADAPTED FOR METALLIC POWDER
    • B22F10/00—Additive manufacturing of workpieces or articles from metallic powder
    • B22F10/30—Process control
    • B22F10/36—Process control of energy beam parameters
    • B22F10/368—Temperature or temperature gradient, e.g. temperature of the melt pool
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B22—CASTING; POWDER METALLURGY
    • B22F—WORKING METALLIC POWDER; MANUFACTURE OF ARTICLES FROM METALLIC POWDER; MAKING METALLIC POWDER; APPARATUS OR DEVICES SPECIALLY ADAPTED FOR METALLIC POWDER
    • B22F10/00—Additive manufacturing of workpieces or articles from metallic powder
    • B22F10/80—Data acquisition or data processing
    • B22F10/85—Data acquisition or data processing for controlling or regulating additive manufacturing processes
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B22—CASTING; POWDER METALLURGY
    • B22F—WORKING METALLIC POWDER; MANUFACTURE OF ARTICLES FROM METALLIC POWDER; MAKING METALLIC POWDER; APPARATUS OR DEVICES SPECIALLY ADAPTED FOR METALLIC POWDER
    • B22F12/00—Apparatus or devices specially adapted for additive manufacturing; Auxiliary means for additive manufacturing; Combinations of additive manufacturing apparatus or devices with other processing apparatus or devices
    • B22F12/90—Means for process control, e.g. cameras or sensors
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B29—WORKING OF PLASTICS; WORKING OF SUBSTANCES IN A PLASTIC STATE IN GENERAL
    • B29C—SHAPING OR JOINING OF PLASTICS; SHAPING OF MATERIAL IN A PLASTIC STATE, NOT OTHERWISE PROVIDED FOR; AFTER-TREATMENT OF THE SHAPED PRODUCTS, e.g. REPAIRING
    • B29C64/00—Additive manufacturing, i.e. manufacturing of three-dimensional [3D] objects by additive deposition, additive agglomeration or additive layering, e.g. by 3D printing, stereolithography or selective laser sintering
    • B29C64/10—Processes of additive manufacturing
    • B29C64/165—Processes of additive manufacturing using a combination of solid and fluid materials, e.g. a powder selectively bound by a liquid binder, catalyst, inhibitor or energy absorber
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B29—WORKING OF PLASTICS; WORKING OF SUBSTANCES IN A PLASTIC STATE IN GENERAL
    • B29C—SHAPING OR JOINING OF PLASTICS; SHAPING OF MATERIAL IN A PLASTIC STATE, NOT OTHERWISE PROVIDED FOR; AFTER-TREATMENT OF THE SHAPED PRODUCTS, e.g. REPAIRING
    • B29C64/00—Additive manufacturing, i.e. manufacturing of three-dimensional [3D] objects by additive deposition, additive agglomeration or additive layering, e.g. by 3D printing, stereolithography or selective laser sintering
    • B29C64/20—Apparatus for additive manufacturing; Details thereof or accessories therefor
    • G—PHYSICS
    • G05—CONTROLLING; REGULATING
    • G05B—CONTROL OR REGULATING SYSTEMS IN GENERAL; FUNCTIONAL ELEMENTS OF SUCH SYSTEMS; MONITORING OR TESTING ARRANGEMENTS FOR SUCH SYSTEMS OR ELEMENTS
    • G05B19/00—Programme-control systems
    • G05B19/02—Programme-control systems electric
    • G05B19/18—Numerical control [NC], i.e. automatically operating machines, in particular machine tools, e.g. in a manufacturing environment, so as to execute positioning, movement or co-ordinated operations by means of programme data in numerical form
    • G05B19/4097—Numerical control [NC], i.e. automatically operating machines, in particular machine tools, e.g. in a manufacturing environment, so as to execute positioning, movement or co-ordinated operations by means of programme data in numerical form characterised by using design data to control NC machines, e.g. CAD/CAM
    • G05B19/4099—Surface or curve machining, making 3D objects, e.g. desktop manufacturing
    • G—PHYSICS
    • G05—CONTROLLING; REGULATING
    • G05D—SYSTEMS FOR CONTROLLING OR REGULATING NON-ELECTRIC VARIABLES
    • G05D23/00—Control of temperature
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B22—CASTING; POWDER METALLURGY
    • B22F—WORKING METALLIC POWDER; MANUFACTURE OF ARTICLES FROM METALLIC POWDER; MAKING METALLIC POWDER; APPARATUS OR DEVICES SPECIALLY ADAPTED FOR METALLIC POWDER
    • B22F2999/00—Aspects linked to processes or compositions used in powder metallurgy
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B33—ADDITIVE MANUFACTURING TECHNOLOGY
    • B33Y—ADDITIVE MANUFACTURING, i.e. MANUFACTURING OF THREE-DIMENSIONAL [3-D] OBJECTS BY ADDITIVE DEPOSITION, ADDITIVE AGGLOMERATION OR ADDITIVE LAYERING, e.g. BY 3-D PRINTING, STEREOLITHOGRAPHY OR SELECTIVE LASER SINTERING
    • B33Y10/00—Processes of additive manufacturing
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B33—ADDITIVE MANUFACTURING TECHNOLOGY
    • B33Y—ADDITIVE MANUFACTURING, i.e. MANUFACTURING OF THREE-DIMENSIONAL [3-D] OBJECTS BY ADDITIVE DEPOSITION, ADDITIVE AGGLOMERATION OR ADDITIVE LAYERING, e.g. BY 3-D PRINTING, STEREOLITHOGRAPHY OR SELECTIVE LASER SINTERING
    • B33Y30/00—Apparatus for additive manufacturing; Details thereof or accessories therefor
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B33—ADDITIVE MANUFACTURING TECHNOLOGY
    • B33Y—ADDITIVE MANUFACTURING, i.e. MANUFACTURING OF THREE-DIMENSIONAL [3-D] OBJECTS BY ADDITIVE DEPOSITION, ADDITIVE AGGLOMERATION OR ADDITIVE LAYERING, e.g. BY 3-D PRINTING, STEREOLITHOGRAPHY OR SELECTIVE LASER SINTERING
    • B33Y50/00—Data acquisition or data processing for additive manufacturing
    • B33Y50/02—Data acquisition or data processing for additive manufacturing for controlling or regulating additive manufacturing processes
    • G—PHYSICS
    • G05—CONTROLLING; REGULATING
    • G05B—CONTROL OR REGULATING SYSTEMS IN GENERAL; FUNCTIONAL ELEMENTS OF SUCH SYSTEMS; MONITORING OR TESTING ARRANGEMENTS FOR SUCH SYSTEMS OR ELEMENTS
    • G05B2219/00—Program-control systems
    • G05B2219/30—Nc systems
    • G05B2219/49—Nc machine tool, till multiple
    • G05B2219/49023—3-D printing, layer of powder, add drops of binder in layer, new powder

Definitions

  • the present disclosure relates generally to methods and systems for controlling the temperature of an additive manufacturing device, particularly when the additive manufacturing device employs binder jetting.
  • Additive manufacturing also known as 3D printing, generally involves manufacturing, or printing, one layer at a time using specialized systems.
  • a layer of powder material may be deposited on the working surface of a build chamber and bonded with another layer of the same or of a different material.
  • Additive manufacturing may be used to manufacture articles from computer-aided design models using techniques such as binder jetting.
  • a step of dispensing binder to the powder bed follows. This dispensing step forms a green body in the powder bed.
  • the dispensing is performed by a print head which supplies the binder to the powder bed in droplets.
  • the dispensed binder soaks into the powder bed and the solvent in the binder starts to evaporate, often using a radiation source such as a heat lamp or the like to enhance the evaporation.
  • Each powder layer comprises at least one closed shape with dispensed binder. These closed shapes are stacked on each other and form the green body in the powder bed of the build chamber during the subsequent steps of layer formations.
  • the term “printed area” is used interchangeable for the closed shapes of dispensed binder in the powder bed.
  • the heating of the powder bed is controlled with the bed temperature as input data.
  • the measurement of the temperature is a measurement of a printed area, i.e. combination of powder and binder, an unprinted area, i.e. an area with only loose powder, or a combination thereof.
  • the properties of the loose powder and the powder with binder added to it differ, it would be beneficial if a better temperature control could be achieved.
  • An object of embodiments of the invention is to provide a method for controlling an additive manufacturing device, in which a better and more accurate temperature control of the build box, particularly of the powder bed, may be achieved, such that the combination of binder and powder composition does not become too dry or too wet. It is further an object to provide an additive manufacturing device for the same purpose.
  • a method for controlling an additive manufacturing device comprises depositing a layer of loose powder composition and adding binder to a part of the layer of loose powder composition.
  • the method further comprises heating the powder composition and obtaining temperature information of the layer of powder composition.
  • the method further comprises analyzing the temperature information in order to obtain at least one of a first lower temperature and a second higher temperature, and controlling a temperature in the additive manufacturing device based on the at least one temperature.
  • an additive manufacturing device comprises a build box comprising a powder bed, a powder supply for supplying the powder bed with powder, and means for dispensing binder to the powder bed.
  • the additive manufacturing device further comprises means for obtaining temperature information of the powder bed and means for controlling the temperature in the powder bed.
  • the additive manufacturing device further comprises processing means comprising processing circuitry, and a memory, the memory containing instructions executable by said processing circuitry.
  • the additive manufacturing device is operative for depositing a layer of loose powder composition, adding binder to a part of the layer of loose powder composition and heating the powder composition.
  • the additive manufacturing device is further operative for obtaining temperature information of the layer of powder composition and analyzing the temperature information in order to obtain at least one of a first lower temperature and a second higher temperature.
  • the additive manufacturing device is further operative for controlling a temperature in the additive manufacturing device based on the at least one temperature.
  • Fig. 1 shows a flow chart of a method for controlling an additive manufacturing device according to an embodiment.
  • FIG. 2 shows a block schematic of parts of an additive manufacturing device according to an embodiment.
  • the present disclosure relates to a method for controlling an additive manufacturing device, also referred to as a 3d printer, particularly for controlling the temperature of the additive manufacturing device.
  • the method comprises the general steps of depositing powder, adding binder to part of the powder, and heating the powder.
  • the method further comprises obtaining temperature information of the layer of powder composition, and analyzing the temperature information in order to obtain at least one of a first lower temperature and a second higher temperature, and then controlling a subsequent temperature application in the printer based on either the first temperature or the second temperature.
  • the present disclosure provides a method for controlling the temperature based on more detailed temperature information, which differentiates between printed and unprinted areas, and which may be agnostic to the location of the printed and unprinted areas.
  • An unprinted area is an area comprising only loose powder with no binder added
  • a printed area is an area comprising both powder and binder.
  • Another insight which is relevant for the present disclosure is that there will only be two different larger clusters of temperature information in a powder bed of an additive manufacturing device, one representing printed areas and one representing the unprinted area. Based on this, it is possible to achieve a method which is agnostic to where the printed and unprinted areas are located, but still different between them from a temperature perspective.
  • the additive manufacturing device is a binder jet printer.
  • the additive manufacturing device comprises a build box with a powder bed, and a powder supply for supplying the powder bed with powder.
  • the binder jet further comprises means for dispensing binder to the powder bed, such as a print head.
  • the additive manufacturing device further comprises means for obtaining temperature information of the powder bed, such as a temperature detector.
  • the temperature detector may be a thermal imaging device.
  • the additive manufacturing device further comprises means for controlling the temperature in the powder bed, such as a heat source.
  • the printer may further comprise a levelling device configured to level the powder in the build box.
  • the binder jet may further comprise processing means comprising processing circuitry, and a memory, the memory containing instructions executable by said processing circuitry.
  • FIG. 1 a method for controlling the temperature of an additive manufacturing device according to an embodiment will now be described.
  • the method comprises depositing 202 a layer of powder composition, on a powder bed of an additive manufacturing device.
  • the additive manufacturing device may for example be one which employs binder jetting technology, but is suitable for any additive manufacturing device where an agent is combined with loose powder and going through a temperature change, either by itself, or by an external heat source.
  • the method further comprises adding 204 binder to a part of the layer of powder composition.
  • the binder is preferably added such that at least one closed shaped is formed by the area to which binder is added.
  • the method further comprises heating 206 the powder composition.
  • the heating may be performed by any suitable method, for example by moving an irradiation device over the layer of powder composition, or by heating the entire space in which the powder composition is contained.
  • the method further comprises obtaining 208 temperature information of the layer of powder composition.
  • the temperature information should preferably be detailed enough to contain information for all parts of the powder composition, including both the printed and unprinted areas.
  • the area which is to considered to be one point in the temperature information is between 0.1 mm 2 - 4cm 2 , and preferably around 4 mm 2 .
  • the method further comprises analyzing 210 the temperature information in order to obtain at least one of a first and a second temperature.
  • analyzing 210 the temperature information in order to obtain at least one of a first and a second temperature.
  • the purpose of the analyzing step is to obtain at least one of these two temperatures, in order to use that as input for subsequent temperature control of the method.
  • the method further comprises controlling 212 a temperature of the powder composition, based on the at least one temperature, i.e. the first or second temperature, representing either the printed or unprinted area.
  • the step of controlling 212 the temperature preferably comprises controlling the subsequent heating step 206 for the next layer of powder composition, it does not necessarily comprise controlling the temperature immediately after the analyzing step.
  • the controlling step 212 may be seen as performing steps 202, 204 and 206, wherein step 206 is controlled based on the at least one of the first and second temperature.
  • the temperature which is most relevant for deciding which temperature to use in subsequent operations is generally the part representing the printed area, since the purpose of the temperature control is to control the processes occurring in printed areas.
  • One example of such a process is the evaporation of solvent in the a deposited binder If the solvent in the binder evaporates too quickly due to too much heating, the structural integrity of the green body might be compromised, e.g. lose strength and/or delaminate. On the other hand, if the temperature is too low, binder might bleed through a subsequently deposited layer and cause powder to stick to the roller, which leads to defects in the build bed surface.
  • the relationship between the temperature of printed and unprinted area will usually be constant, and thus, if the relationship is known beforehand, the method may just as well be performed by controlling the temperature based on the unprinted area, adapted based on the relationship between the two temperatures. For example, if the unprinted areas are generally two degrees warmer than the printed areas, the method could be controlled based on the unprinted area, with an offset of two degrees.
  • the method is generally performed for a plurality of layers of powder composition, wherein the steps are performed for each layer of powder composition.
  • the controlling 212 may comprise adjusting a temperature of the additive manufacturing device directly after the analyzing 210, for example if the temperature information indicates that there is still binder left which has not been evaporated.
  • the method may further comprise analyzing again, and then possibly controlling 212 the temperature again, and depending on the results, the method may comprise continuing to loop the controlling 212 and the analyzing 210 steps, until a desired temperature has been obtained.
  • the step of analyzing 210 the temperature information comprises clustering the temperature information into two clusters, based on the temperature information.
  • the reason for doing this is that there is usually only two relevant different temperatures to consider, one representing the printed area and one representing the unprinted area.
  • clustering the temperature information into two clusters comprises clustering the temperature information into a plurality of clusters and discarding all but the two largest clusters. There may be small differences between different parts of the printed area, as well as between different parts of the unprinted area, that may result into more than two clusters, depending on the method used for clustering.
  • the first temperature is an average value of a first temperature cluster
  • the second temperature is an average value of a second temperature cluster.
  • a reason for using the average temperature rather than a highest or lowest temperature, is that the average temperature is more stable and represent a larger amount of data, and may thus be more accurate and less susceptible to noise.
  • controlling 212 the temperature comprises controlling the temperature based on the lower temperature, i.e. the first temperature, which represents the printed area.
  • obtaining 208 temperature information comprises obtaining a thermal image of the powder composition.
  • a thermal image may be obtained e.g. by using a pixel based temperature detector, such as an IR camera.
  • one pixel may be regarded as one data point for temperature. The size of each pixel will depend on the properties of the sensor, as well as the distance from which the thermal image is captured.
  • analyzing 210 the temperature information further comprises analyzing spatial information of the temperature information.
  • spatial information of the temperature information By using spatial information about the location of different temperature, a better analysis may be obtained, where outliers, noise, and similar sources of errors can be more easily detected. It should be noted that using spatial temperature information is different form using spatial information regarding the powder composition itself, even though it represents a similar set of underlying data. In the present method, there is generally no need to match the spatial powder information with the spatial temperature information.
  • the method may comprise not obtaining any spatial information about the powder itself or any other information about the physical layout in the build box. Further, in some embodiments, the method may comprise not obtaining any spatial temperature information. In some embodiments, the method comprises discarding any obtained spatial temperature information. In some embodiments, the method comprises obtaining spatial temperature information, but not using it for any subsequent steps. For example, the temperature information may be obtained by a thermal image comprising both temperature values and spatial temperature information, but only the temperature information comprising temperature values is used.
  • the method comprises only using the temperature information and no other information for performing the analyzing 210 and the subsequent controlling 212 of the temperature.
  • the method comprises only using temperature information which represents a temperature value.
  • the temperature information may be obtained from a thermal image comprising spatial information, and possibly other information, as well as information representing temperature values, but only the information representing temperature values is used for subsequent steps.
  • the temperature information used in the method is temperature information which can be expressed as a value, and does not require a vector for expressing it.
  • analyzing the thermal image comprises analyzing temperature data points in an area of interest. It may not be necessary or optimal to use the entire thermal image, and instead an area of interest is chosen. In some embodiments, such an area of interest comprises both printed and unprinted areas.
  • the heating 206 may be achieved by other means than a heat source, such as a chemical reaction between components in the powder and/or binder.
  • the heating may be controlled by controlling the amount of chemicals added for causing such a reaction.
  • the means for controlling the temperature of the additive manufacturing device may be means for controlling the amount of chemicals added.
  • the method further comprises performing steps 208, 210 and 212 prior to step 206. It should be noted that the method still comprises performing steps 208, 210 and 212 after step 206 as well. Performing steps 208, 210 and 212 both before and after step 206 may be relevant for obtaining information about how the temperature of an unprinted area is affected by the addition of binder, and based on this information, a more detailed analysis may be possible.
  • the method further comprises performing steps 202, 204, 208, 210 and 212, prior to performing step 202.
  • the method may comprise depositing a layer, or a plurality of layers, without adding binder, but still perform the temperature analysis and subsequent temperature control based on the temperature analysis. This is generally performed in order to have a stable temperature between subsequent powder layers before starting the actual print process.
  • the clustering may comprise clustering the temperature information into more than two clusters, and the controlling may be based on at least one of the clusters. This may be relevant e.g. if there are different areas with different concentrations of binders, which could result in more than two distinct temperature clusters.
  • Fig. 2 shows parts an additive manufacturing device 600, operable for performing an additive manufacturing process.
  • the additive manufacturing device 600 comprises processing circuitry 603 and a memory 604.
  • the processing circuitry 603 may comprise one or more programmable processor, application- specific integrated circuits, field programmable gate arrays or combinations of these (not shown) adapted to execute instructions.
  • the memory contains instructions executable by said processing circuitry, whereby the device/system 600 is operative for depositing a layer of loose powder composition, adding binder to a part of the layer of loose powder composition and heating the powder composition.
  • the additive manufacturing device is further operative for obtaining temperature information of the layer of powder composition and analyzing the temperature information in order to obtain at least one of a first lower temperature and a second higher temperature.
  • the additive manufacturing device is further operative for controlling a temperature in the additive manufacturing device based on the at least one temperature.
  • the additive manufacturing device may further comprise the components described earlier herein.
  • the additive manufacturing device 600 for which the method is performed may be a group of devices, wherein functionality for performing the method are spread out over different physical, or virtual, devices of the system.
  • the additive manufacturing device 600 may comprise a cloud-solution, i.e. parts of the additive manufacturing device 600 may be deployed as cloud computing resources that may be distributed in the system.
  • the additive manufacturing device 600 is operative for performing any of the method steps described herein.
  • the additive manufacturing device 600 may further comprise a communication unit 602, which may be considered to comprise conventional means for communicating with other parts of an additive manufacturing system.
  • the instructions executable by the processing circuitry 603 may be arranged as a computer program stored e.g. in a memory 604.
  • the processing circuitry 603 and the memory 604 may be arranged in a sub arrangement 601.
  • the sub-arrangement 601 may be a micro-processor and adequate software and storage therefore, a Programmable Logic Device, PLD, or other electronic component(s)/processing circuit(s) configured to perform the methods mentioned above.
  • the computer program may comprise computer readable code means, which when run in an additive manufacturing device 600 causes the additive manufacturing device 600 to perform the steps described in any of the described embodiments of the additive manufacturing device 600 or the method for controlling an additive manufacturing device 600.
  • the computer program may be carried by a computer program product connectable to the processing circuitry 603.
  • the computer program product may be the memory 604.
  • the memory 604 may be realized as for example a RAM (Random-access memory), ROM (Read- Only Memory) or an EEPROM (Electrical Erasable Programmable ROM).
  • the computer program may be carried by a separate computer-readable medium, such as a CD, DVD or flash memory, from which the program could be downloaded into the memory 604.
  • the computer program may be stored on a server or any other entity connected to the additive manufacturing device 600, to which the additive manufacturing device 600 has access via the communication unit 602. The computer program may then be downloaded from the server into the memory 604.

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  • Engineering & Computer Science (AREA)
  • Chemical & Material Sciences (AREA)
  • Materials Engineering (AREA)
  • Manufacturing & Machinery (AREA)
  • Physics & Mathematics (AREA)
  • Automation & Control Theory (AREA)
  • Mechanical Engineering (AREA)
  • Optics & Photonics (AREA)
  • General Physics & Mathematics (AREA)
  • Analytical Chemistry (AREA)
  • Human Computer Interaction (AREA)

Abstract

L'invention concerne un procédé de commande d'un dispositif de fabrication additive. Le procédé comprend le dépôt (202) d'une couche de composition de poudre en vrac et l'ajout (204) d'un liant à une partie de la couche de composition de poudre en vrac. Le procédé comprend en outre le chauffage (206) de la composition de poudre et l'obtention (208) d'informations de température de la couche de composition de poudre. Le procédé comprend en outre l'analyse (210) des informations de température afin d'obtenir une première température plus basse et/ou une seconde température plus élevée et la commande (212) d'une température dans le dispositif de fabrication additive sur la base de ladite température.
PCT/EP2022/060637 2021-04-22 2022-04-21 Dispositif d'éjection de liant et procédé de commande dudit dispositif Ceased WO2022223744A1 (fr)

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
SE2100060-9 2021-04-22
SE2100060A SE545644C2 (en) 2021-04-22 2021-04-22 Additive manufacturing device and method for controlling an additive manufacturing device

Publications (1)

Publication Number Publication Date
WO2022223744A1 true WO2022223744A1 (fr) 2022-10-27

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Citations (4)

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WO2017054842A1 (fr) * 2015-09-28 2017-04-06 Hewlett-Packard Development Company L.P. Détermination de la température dans des systèmes de fabrication d'additifs
WO2019143347A1 (fr) * 2018-01-19 2019-07-25 Hewlett-Packard Development Company, L.P. Commande de niveaux de puissance d'éléments chauffants
US20190308372A1 (en) * 2018-04-09 2019-10-10 Hewlett-Packard Development Company, L.P. Controlling heat sources based on representative temperatures

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WO2017071741A1 (fr) * 2015-10-27 2017-05-04 Hewlett Packard Development Company L.P. Détermination de la température d'une zone d'impression dans un système de fabrication additive
BR112018072035A2 (pt) * 2016-05-12 2019-02-12 Hewlett-Packard Development Company, L.P. dissipadores de calor de impressão 3d
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