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WO2022211261A1 - Electronic device - Google Patents

Electronic device Download PDF

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Publication number
WO2022211261A1
WO2022211261A1 PCT/KR2022/001906 KR2022001906W WO2022211261A1 WO 2022211261 A1 WO2022211261 A1 WO 2022211261A1 KR 2022001906 W KR2022001906 W KR 2022001906W WO 2022211261 A1 WO2022211261 A1 WO 2022211261A1
Authority
WO
WIPO (PCT)
Prior art keywords
circuit board
printed circuit
contact
mounting layer
electronic device
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Ceased
Application number
PCT/KR2022/001906
Other languages
French (fr)
Korean (ko)
Inventor
김재은
이진형
양정우
최용호
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Samsung Electronics Co Ltd
Original Assignee
Samsung Electronics Co Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Priority claimed from KR1020210040353A external-priority patent/KR102898714B1/en
Application filed by Samsung Electronics Co Ltd filed Critical Samsung Electronics Co Ltd
Publication of WO2022211261A1 publication Critical patent/WO2022211261A1/en
Anticipated expiration legal-status Critical
Ceased legal-status Critical Current

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Classifications

    • HELECTRICITY
    • H05ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05KPRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00Apparatus or processes for manufacturing printed circuits
    • H05K3/30Assembling printed circuits with electric components, e.g. with resistor
    • H05K3/32Assembling printed circuits with electric components, e.g. with resistor electrically connecting electric components or wires to printed circuits
    • H05K3/34Assembling printed circuits with electric components, e.g. with resistor electrically connecting electric components or wires to printed circuits by soldering
    • H05K3/341Surface mounted components
    • H05K3/3421Leaded components
    • H05K3/3426Leaded components characterised by the leads
    • HELECTRICITY
    • H05ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05KPRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K1/00Printed circuits
    • H05K1/02Details
    • H05K1/14Structural association of two or more printed circuits
    • HELECTRICITY
    • H05ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05KPRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K1/00Printed circuits
    • H05K1/02Details
    • H05K1/14Structural association of two or more printed circuits
    • H05K1/145Arrangements wherein electric components are disposed between and simultaneously connected to two planar printed circuit boards, e.g. Cordwood modules
    • HELECTRICITY
    • H05ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05KPRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K1/00Printed circuits
    • H05K1/18Printed circuits structurally associated with non-printed electric components
    • HELECTRICITY
    • H05ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05KPRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K1/00Printed circuits
    • H05K1/18Printed circuits structurally associated with non-printed electric components
    • H05K1/181Printed circuits structurally associated with non-printed electric components associated with surface mounted components
    • HELECTRICITY
    • H05ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05KPRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00Apparatus or processes for manufacturing printed circuits
    • H05K3/30Assembling printed circuits with electric components, e.g. with resistor
    • H05K3/32Assembling printed circuits with electric components, e.g. with resistor electrically connecting electric components or wires to printed circuits
    • H05K3/34Assembling printed circuits with electric components, e.g. with resistor electrically connecting electric components or wires to printed circuits by soldering
    • HELECTRICITY
    • H05ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05KPRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00Apparatus or processes for manufacturing printed circuits
    • H05K3/30Assembling printed circuits with electric components, e.g. with resistor
    • H05K3/32Assembling printed circuits with electric components, e.g. with resistor electrically connecting electric components or wires to printed circuits
    • H05K3/34Assembling printed circuits with electric components, e.g. with resistor electrically connecting electric components or wires to printed circuits by soldering
    • H05K3/341Surface mounted components
    • H05K3/3415Surface mounted components on both sides of the substrate or combined with lead-in-hole components

Definitions

  • the present disclosure relates to an electronic device, and more particularly, to a slimmed electronic device.
  • the electronic device may include a power supply for supplying power to the electronic device.
  • the power supply device is also referred to as a power board, and electronic components and the like may be mounted on a printed circuit board mainly including an insulating layer and a mounting layer.
  • the electronic component has an electrode wire.
  • the electronic component is disposed on an insulating layer and the electrode wire can penetrate the printed circuit board so as to be electrically connected to the mounting layer including the metal. Separation distances may be required to comply with safety standards between the power board and other devices or components (e.g., rear chassis) within an electronic device. have.
  • One aspect of the present disclosure provides a slimmed electronic device.
  • Another aspect of the present disclosure provides an electronic device with improved productivity.
  • An electronic device includes an insulating layer including a first surface and a second surface disposed on a side opposite to the first surface, and a mounting layer stacked on the first surface of the insulating layer.
  • a printed circuit board including a mounting layer provided with a plurality of circuit patterns spaced apart from each other and a jumper disposed on the mounting layer to electrically connect the plurality of circuit patterns and respectively connected to the plurality of circuit patterns wherein the jumper includes a body extending in one direction, an extension extending from the body toward the mounting layer, and one end of the extension provided at one end of the extension to be electrically connected to the plurality of circuit patterns.
  • a contact portion in contact with the layer and an insertion protrusion which protrudes from the outer periphery of the contact portion toward the printed circuit board so as to be inserted into the printed circuit board, and is inserted into the printed circuit board so as not to protrude with respect to the second surface of the insulating layer; may include
  • the contact portion extends along the longitudinal direction of the body, and the contact portion includes a first connection portion connected to the extension portion at one end along the extension direction of the contact portion, and the insertion protrusion at the other end along the extension direction of the contact portion of the contact portion. It may include a second connection part to be connected.
  • the extension portion extends perpendicularly to the longitudinal direction of the body toward the mounting layer from one end along the longitudinal direction of the body, and the insertion protrusion may protrude from the second connecting portion in a direction perpendicular to the longitudinal direction of the body.
  • the printed circuit board is a first printed circuit board
  • the electronic device has an electrode wire to be electrically connected to the first printed circuit board, an electronic part disposed on the mounting layer, and the electrode a second printed circuit board electrically connected to a wire and in contact with the first printed circuit board, and the first printed circuit board and the second printed circuit board to electrically connect the first printed circuit board and the second printed circuit board Connection members each coupled to the circuit board may be further included.
  • connection member may include a first connection part contacting the first printed circuit board, and a second connection part bent from the first connection part and contacting the second printed circuit board.
  • the second printed circuit board includes an insulating layer and a mounting layer stacked on the insulating layer to be electrically connected to the second connection part, and the first connection part is in contact with the mounting layer of the first printed circuit board, The second connection part may be in contact with a mounting layer of the second printed circuit board.
  • the connecting member may be provided in plurality, and the plurality of connecting members may be provided to have a potential difference from each other.
  • the printed circuit board includes a mounting hole
  • the electronic device includes an electrode wire to be electrically connected to the printed circuit board as an electronic component disposed on the mounting layer, and one end of the electrode wire to be inserted into the mounting hole. It may further include an electronic component including a terminal provided in the holders and a holder for pressing the electrode wire to fix the terminal to the mounting hole.
  • the printed circuit board further includes a coupling hole provided to be coupled to the holder, wherein the holder includes a cover part extending in one direction to cover the terminal, and both ends of the cover part so that the holder is coupled to the coupling hole.
  • a plurality of coupling protrusions protruding from the mounting layer and a fixing protrusion provided so that the plurality of coupling protrusions are fixed to the printed circuit board when the holder is coupled, from one end of each of the plurality of coupling protrusions to the cover part It may include a plurality of fixing protrusions protruding outward.
  • An electronic device has an insulating layer, a first printed circuit board including a mounting layer laminated on the insulating layer, and an electrode wire to be electrically connected to the first printed circuit board, An electronic part disposed on the mounting layer, a second printed circuit board electrically connected to the electrode wire and in contact with the first printed circuit board, and the first printed circuit board and the second printed circuit A connecting member coupled to the first printed circuit board and the second printed circuit board to electrically connect the substrate, and a first connecting portion contacting the first printed circuit board, and bending from the first connecting portion, the second connecting member 2 It may include a connection member including a second connection portion in contact with the printed circuit board.
  • the second printed circuit board includes an insulating layer and a mounting layer stacked on the insulating layer to be electrically connected to the second connection part, and the first connection part is in contact with the mounting layer of the first printed circuit board, The second connection part may be in contact with a mounting layer of the second printed circuit board.
  • the connecting member may be provided in plurality, and the plurality of connecting members may be provided to have a potential difference from each other.
  • the first printed circuit board further includes a plurality of circuit patterns provided to be spaced apart from each other, and the electronic device has jumpers respectively connected to the plurality of circuit patterns on the mounting layer to electrically connect the plurality of circuit patterns.
  • the jumper further includes a body extending in one direction, an extension extending from the body toward the mounting layer, and a contact portion provided at one end of the extension to be seated on the mounting layer and contacting the mounting layer. and an insertion protrusion protruding toward the printed circuit board from the outer periphery of the contact portion so as to be inserted into the printed circuit board.
  • the insulating layer of the first printed circuit board includes a first surface on which the mounting layer is laminated and a second surface disposed on a side opposite to the first surface, and the insertion protrusion is on the second surface of the insulating layer. It may be inserted into the printed circuit board so as not to protrude against the printed circuit board.
  • the contact portion extends along the longitudinal direction of the body, and the contact portion includes a first connection portion connected to the extension portion at one end along the length direction of the contact portion, and the insertion protrusion at the other end along the length direction of the contact portion of the contact portion. It may include a second connection part to be connected.
  • the extension portion extends perpendicularly to the longitudinal direction of the body toward the mounting layer from one end along the longitudinal direction of the body, and the insertion protrusion may protrude from the second connecting portion in a direction perpendicular to the longitudinal direction of the body.
  • the electronic component includes a terminal provided at one end of the electrode wire, the first printed circuit board further includes a mounting hole in which the terminal is seated, and the electrode wire is mounted to fix the terminal to the mounting hole. It may further include a holder for pressing.
  • the holder includes a cover portion extending to cover the terminal, a plurality of coupling protrusions protruding from both ends of the cover portion toward the mounting layer so that the holder is coupled to the first printed circuit board, and when the holder is coupled
  • the plurality of coupling protrusions are fixing protrusions provided to be fixed to the first printed circuit board, and may include a plurality of fixing protrusions protruding from one end of each of the plurality of coupling protrusions toward the outside of the cover part.
  • An electronic device includes a printed circuit board including an insulating layer, a mounting layer laminated on the insulating layer and having a mounting hole formed therein, and an electronic component disposed on the mounting layer, the printed circuit
  • An electronic component including an electrode wire to be electrically connected to the substrate, a terminal provided at one end of the electrode wire, and a holder for pressing the electrode wire to fix the terminal to the mounting hole and covering the terminal can
  • the printed circuit board further includes a coupling hole provided to be coupled to the holder, wherein the holder includes a cover part extending to cover the terminal, and mounting the holder from both ends of the cover part so that the holder is coupled to the coupling hole.
  • FIG. 1 is a diagram illustrating an electronic device according to an embodiment of the present invention.
  • FIG. 2 is an exploded perspective view of the electronic device shown in FIG. 1 .
  • FIG. 3 is a plan view illustrating a state in which electronic components are mounted in the electronic device shown in FIG. 1 .
  • FIG. 4 is a plan view illustrating a state in which electronic components are mounted in an electronic device according to another exemplary embodiment of the present invention.
  • FIG. 5 is a perspective view illustrating a jumper in the electronic device shown in FIG. 3 .
  • FIG. 6 is a plan view illustrating a state in which a jumper is mounted on a printed circuit board in the electronic device shown in FIG. 5;
  • FIG. 7 is a perspective view illustrating a jumper in an electronic device according to another embodiment of the present invention.
  • FIG. 8 is a plan view illustrating a state in which a jumper is mounted on a printed circuit board in the electronic device shown in FIG. 7 ;
  • FIG. 9 is a perspective view illustrating a state in which a jumper is mounted on a printed circuit board in an electronic device according to another embodiment of the present invention.
  • FIG. 10 is a perspective view illustrating a state in which an electronic component is mounted on a printed circuit board in an electronic device according to another embodiment of the present invention.
  • FIG. 11 is a plan view illustrating a state in which an electronic component is mounted on a printed circuit board in the electronic device shown in FIG. 10 ;
  • FIG. 12 is a perspective view illustrating a state in which an electronic component is mounted on a printed circuit board in an electronic device according to another embodiment of the present invention.
  • FIG. 13 is a perspective view illustrating a state in which an electronic component is mounted on a printed circuit board in an electronic device according to another embodiment of the present invention.
  • FIG. 14 is an exploded perspective view illustrating a state in which an electronic component is mounted on a printed circuit board in an electronic device according to another embodiment of the present invention.
  • FIG. 15 is a perspective view illustrating a state in which an electronic component is mounted on a printed circuit board in the electronic device shown in FIG. 14 .
  • 16 is a perspective view illustrating a state in which an electronic component is mounted on a printed circuit board in an electronic device according to another embodiment of the present invention.
  • FIG. 17 is a perspective view illustrating a state in which an electronic component is mounted on a printed circuit board in the electronic device shown in FIG. 16 .
  • first may be referred to as a second component
  • second component may also be referred to as a first component.
  • the term "and/or” includes a combination of a plurality of related listed items or any of a plurality of related listed items.
  • FIG. 1 is a diagram illustrating an electronic device 1 according to an embodiment of the present invention.
  • FIG. 2 is an exploded perspective view of the electronic device 1 shown in FIG. 1 .
  • the electronic device may include at least one of a display device, a mobile communication terminal, a tablet PC, and a wearable electronic device.
  • a display device a mobile communication terminal
  • a tablet PC a tablet PC
  • a wearable electronic device a wearable electronic device
  • the display device 1 may include a housing 10 forming an exterior.
  • the housing 10 may have an opening 13 .
  • the opening 13 may be formed on the front surface of the housing 10 .
  • the housing 10 may include an outer frame 11 .
  • the outer frame 11 may have a box shape in which the front and rear surfaces are open.
  • the open front side of the outer frame 11 may be defined as an opening 13 . That is, the opening 13 may be formed on the front surface of the outer frame 11 .
  • the open rear surface of the outer frame 11 may be defined as a rear opening 19 . That is, the rear opening 19 may be formed on the rear surface of the outer frame 11 .
  • the housing 10 may further include a rear chassis 12 .
  • the rear chassis 12 may be coupled to the outer frame 11 .
  • the rear chassis 12 may be coupled to the open rear surface of the outer frame 11 to form the exterior of the display device 1 together with the outer frame 11 . That is, the rear chassis 12 may be coupled to the rear opening 19 .
  • the display device 1 may further include a display module 30 .
  • the display module 30 may be disposed inside the housing 10 .
  • the display module 30 may include a display panel (not shown).
  • a screen may be provided on the display panel.
  • the display panel may display various images on the screen according to an image signal input from the outside.
  • the display panel is a light emitting display panel that generates an image when a plurality of pixels constituting the display panel generate light by itself, or a non-light emitting display that generates an image by reflecting/transmitting/blocking light by a plurality of pixels It may be any one of the panels.
  • the display panel may include a liquid crystal layer, a transparent electrode layer, a transparent substrate, and a color filter.
  • the display device 1 may include a power supply device 100 for supplying power to the display device 1 .
  • the power supply device 100 may be a power board 100 .
  • the power board 100 may be disposed between the rear chassis 12 and the board cover 90 . That is, the power board 100 may be protected from the outside of the display device 1 due to the rear chassis 12 and the board cover 90 .
  • the position of the power board 100 is not limited thereto.
  • the display device 1 will be referred to as an electronic device 1 and will be described.
  • FIG. 3 is a plan view illustrating a state in which electronic components 130 are mounted in the electronic device shown in FIG. 1 .
  • an electronic device may include a rear chassis 12 and a power supply device 100 .
  • the power supply device 100 may be referred to as a power board 100 .
  • the power board 100 may include a printed circuit board 110 and various electronic components 130 .
  • the printed circuit board 110 may include an insulating layer 111 and a mounting layer 112 .
  • the insulating layer 111 may be a prepreg.
  • the insulating layer 111 may be a composite material in which the reinforcing fibers are impregnated with a matrix resin.
  • the mounting layer 112 may include a metal material to be electrically connected to the electronic component 130 .
  • the mounting layer 112 may be formed of copper.
  • An electrode wire (not shown) of the electronic component 130 may be electrically connected to the mounting layer 112 .
  • a solder mask (not shown) for preventing corrosion and a silk screen (not shown) for writing characters may be provided on the mounting layer 112 .
  • the electronic component 130 may be electrically connected to the printed circuit board 110 on the mounting layer 112 .
  • Each of the electronic components 130 may include an electrode wire for being electrically connected to the printed circuit board 110 .
  • the electrode wire may be connected to the printed circuit board 110 on the mounting layer 112 . Since the electrode wire of the electronic component 130 disposed on the mounting layer 112 is soldered in the mounting layer 112 , the electrode wire may not penetrate the insulating layer 111 . Accordingly, a hole through which the electrode wire passes may not be provided in the insulating layer 111 . In addition, the electrode wire may not penetrate the mounting layer 112 .
  • the present invention is not limited thereto, and the rear chassis 12 and the printed circuit board 110 may be spaced apart from each other by a predetermined distance. Accordingly, the power board 100 and the rear chassis 12 may be provided to be spaced apart.
  • the electrode wire passes through the printed circuit board 110 and is not exposed to the side opposite to the surface on which the electronic component 130 is mounted, an unnecessary gap between the power board 100 and the rear chassis 12 can be reduced. . Accordingly, the thickness (eg, thickness in the X direction) of the electronic device may be reduced.
  • FIG. 4 is a plan view illustrating a state in which electronic components 130 are mounted in an electronic device according to another embodiment of the present invention.
  • the electronic device may further include an insulating paper 140 .
  • the insulating paper 140 may be disposed between the printed circuit board 110 and the rear chassis 12 .
  • the insulating paper 140 may be provided between the insulating layer 111 and the rear chassis 12 .
  • the insulating paper 140 is shown to be in contact with the rear chassis 12 and the printed circuit board 110, but is not limited thereto and the insulating paper 140 is the rear chassis 12 and the printed circuit board 110. distance can be separated.
  • FIG. 5 is a perspective view illustrating a jumper 130 in the electronic device shown in FIG. 3 .
  • 6 is a plan view illustrating a state in which the jumper 130 is mounted on the printed circuit board 110 in the electronic device shown in FIG. 5 .
  • the insulating layer 111 may include a first surface 111a, a second surface 111b, and a recess 111c.
  • the first surface 111a may be a surface on which the mounting layer 112 is stacked.
  • the second surface 111b may be a surface disposed on a side opposite to the first surface 111a.
  • the second surface 111b may be the outer surface of the printed circuit board 110 .
  • the second surface 111b may face the rear chassis 12 or the insulating paper 140 .
  • the second surface 111b may be in contact with the rear chassis 12 or the insulating paper 140 .
  • the recess 111c may be recessed from the first surface 111a.
  • the recess 111c may accommodate the insertion protrusion 134 of the jumper 130 .
  • the recess 111c may be formed to correspond to the insertion protrusion 134 .
  • the insertion protrusion 134 of the jumper 130 may be accommodated in the insulating layer 111 .
  • the electronic device may include an electronic component 130 .
  • the electronic component 130 may include a jumper 130 .
  • the jumper 130 may electrically connect the plurality of circuit patterns 112a provided on the printed circuit board 110 .
  • the jumper 130 may electrically connect the circuit patterns 112a provided to be spaced apart from each other on the mounting layer 112 .
  • the jumper 130 may electrically connect the circuit patterns 112a spaced apart from each other to increase the efficiency of disposing the circuit patterns 112a and increase the productivity of the printed circuit board 110 .
  • the jumper 130 may include a body 131 , an extension part 132 , a contact part 133 , and an insertion protrusion 134 .
  • the body 131 may extend in one direction (eg, the Y direction).
  • the extension part 132 may be bent and extended from the longitudinal end of the body 131 .
  • the extension 132 may be provided at both ends of the body 131 , respectively. That is, a plurality of extension parts 132 may be provided.
  • the extension 132 may extend from the body 131 toward the mounting layer 112 of the printed circuit board 110 .
  • One end of the extension part 132 may be connected to the body 131 , and the other end of the extension part 132 may be connected to the contact part 133 .
  • the contact part 133 may be in contact with the printed circuit board 110 .
  • the contact part 133 may be in contact with the mounting layer 112 to be electrically connected to the printed circuit board 110 .
  • the contact part 133 may include a contact surface 133a.
  • the contact surface 133a may be in contact with the mounting layer 112 .
  • the contact surface 133a may contact the circuit pattern 112a on the mounting layer 112 .
  • the contact part 133 may extend along the longitudinal direction of the body 131 .
  • the contact portion 133 may extend in the Y direction.
  • the contact part 133 may include a first connection part 135a and a second connection part 135b.
  • the first connection part 135a may be provided at one end along the length direction of the contact part 133 .
  • the first connection part 135a may be connected to the extension part 132 .
  • the second connection part 135b may be provided at the other end along the longitudinal direction of the contact part 133 .
  • the second connection part 135b may be connected to the insertion protrusion 134 .
  • the positions of the first connection part 135a and the second connection part 135b are not limited to the above example.
  • the first connection part 135a may be vertically connected to the extension part 132 .
  • the second connection part 135b may be vertically connected to the insertion protrusion 134 .
  • the area occupied by the jumper 130 may be reduced compared to when the connection part 135 is not vertically connected to the extension part 132 or the insertion protrusion 134 , and thus the space utilization of the power board 100 may be increased.
  • the width W1 of the extension part 132 may be shorter than the width W2 of the contact part 133 .
  • the extension part 132 may be formed only with a thickness necessary to be connected to the contact part 133 . Through this, the cost of the jumper 130 can be reduced.
  • the insertion protrusion 134 may protrude toward the printed circuit board 110 so that the jumper 130 can be inserted into the printed circuit board 110 .
  • the insertion protrusion 134 may protrude from the contact part 133 .
  • the insertion protrusion 134 may protrude toward the printed circuit board 110 from the outer periphery of the contact part 133 .
  • the insertion protrusion 134 may protrude toward the printed circuit board 110 from the other end in the longitudinal direction of the contact part 133 .
  • the insertion protrusion 134 may be inserted up to the inside of the insulating layer 111 .
  • the insertion protrusion 134 may be accommodated in the recess 111c. However, the present invention is not limited thereto, and only the mounting layer 112 may be inserted.
  • the insertion protrusion 134 may allow the jumper 130 to be fixed to the printed circuit board 110 .
  • the insertion protrusion 134 may prevent the jumper 130 from being separated from the printed circuit board 110 due to shaking before soldering is performed.
  • FIG. 7 is a perspective view illustrating a jumper 230 in an electronic device according to another embodiment of the present invention.
  • 8 is a plan view illustrating a state in which the jumper 230 is mounted on the printed circuit board 110 in the electronic device shown in FIG. 7 .
  • the insulating layer 111 may include a first surface 111a, a second surface 111b, and a recess 111c.
  • the first surface 111a may be a surface on which the mounting layer 112 is stacked.
  • the second surface 111b may be a surface disposed on a side opposite to the first surface 111a.
  • the second surface 111b may be the outer surface of the printed circuit board 110 .
  • the second surface 111b may face the rear chassis 12 or the insulating paper 140 .
  • the second surface 111b may be in contact with the rear chassis 12 or the insulating paper 140 .
  • the recess 111c may be recessed from the first surface 111a.
  • the recess 111c may accommodate the insertion protrusion 234 of the jumper 230 .
  • the recess 111c may be formed to correspond to the insertion protrusion 234 .
  • the insertion protrusion 234 of the jumper 230 may be accommodated in the insulating layer 111 .
  • the electronic device may include an electronic component 230 .
  • the electronic component 230 may include a jumper 230 .
  • the jumper 230 may be provided on the mounting layer 112 .
  • the jumper 230 may electrically connect the circuit patterns 112a provided to be spaced apart from each other on the mounting layer 112 .
  • the jumper 230 may include a body 231 , an extension part 232 , a contact part 233 , and an insertion protrusion 234 .
  • the body 231 may extend in one direction.
  • the extension 232 may be bent and extended from the longitudinal end of the body 231 .
  • the extension 232 may be provided at both ends of the body 231 , respectively. That is, a plurality of extension parts 232 may be provided.
  • the extension 232 may extend from the body 231 toward the printed circuit board 110 .
  • One end of the extension part 232 may be connected to the body 231 , and the other end of the extension part 232 may be connected to the contact part 233 .
  • the contact part 233 may be in contact with the printed circuit board 110 .
  • the contact part 233 may be in contact with the mounting layer 112 to be electrically connected to the printed circuit board 110 .
  • the contact portion 233 may include a contact surface 233a.
  • the contact surface 233a may be in contact with the mounting layer 112 .
  • the contact part 233 may be in contact with the circuit pattern 112a.
  • the contact surface 233a may contact the circuit pattern 112a on the mounting layer 112 .
  • the insertion protrusion 234 may protrude toward the printed circuit board 110 so that the jumper 230 can be inserted into the printed circuit board 110 .
  • the insertion protrusion 234 may protrude from the contact portion 233 .
  • the insertion protrusion 234 may protrude from the outer periphery of the contact part 233 toward the mounting layer 112 .
  • the insertion protrusion 234 may protrude toward the printed circuit board 110 from the other end of the contact part 233 .
  • the insertion protrusion 234 When the insertion protrusion 234 is inserted into the printed circuit board 110 , the insertion protrusion 234 may be inserted into the insulating layer 111 .
  • the insertion protrusion 234 may be accommodated in the recess 111c.
  • the present invention is not limited thereto, and only the mounting layer 112 may be inserted.
  • FIG. 9 is a perspective view illustrating a state in which a jumper 530 is mounted on a printed circuit board 110 in an electronic device according to another embodiment of the present invention.
  • the electronic device may include an electronic component 530 .
  • the electronic component 530 may include a jumper 530 .
  • the jumper 530 may be mounted on the printed circuit board 110 .
  • FIG. 10 is a perspective view illustrating a state in which an electronic component 330 is mounted on a printed circuit board 110 in an electronic device according to another embodiment of the present invention.
  • 11 is a plan view illustrating a state in which the electronic component 330 is mounted on the printed circuit board 110 in the electronic device shown in FIG. 10 .
  • the printed circuit board 110 may be the first printed circuit board 110 .
  • the electronic device may include a second printed circuit board 120 , a connection member 150 , and an electronic component 330 .
  • the electronic component 330 may be a capacitor. However, the electronic component 330 is not limited to the above example.
  • the electronic component 330 may include a body 331 and an electrode wire 332 .
  • the electrode wire 332 may be electrically connected to the second printed circuit board 120 such that the electronic component 330 is electrically connected to the second printed circuit board 120 .
  • the second printed circuit board 120 may be in contact with the first printed circuit board 110 .
  • the second printed circuit board 120 may extend perpendicularly to the first printed circuit board 110 to be in contact with the first printed circuit board 110 .
  • the second printed circuit board 120 may be electrically connected to the electrode wire 332 of the electronic component 330 .
  • the second printed circuit board 120 may include a mounting layer 122 and an insulating layer 121 .
  • the insulating layer 121 may be disposed in a direction facing the electronic component body 331 .
  • the mounting layer 122 may be disposed in a direction facing the connecting member 150 so as to be in contact with the connecting member 150 .
  • the arrangement of the mounting layer 122 and the insulating layer 121 is not limited to the above example.
  • connection member 150 may be respectively coupled to the first printed circuit board 110 and the second printed circuit board 120 so that the first printed circuit board 110 and the second printed circuit board 120 are electrically connected. have.
  • the connection member 150 may be coupled to the mounting layer 112 of the first printed circuit board 110 and the mounting layer 122 of the second printed circuit board 120 , respectively.
  • the connection member 150 may contact the mounting layer 112 of the first printed circuit board 110 and the mounting layer 122 of the second printed circuit board 120 .
  • the connection member 150 may be respectively soldered to the mounting layer 112 of the first printed circuit board 110 and the mounting layer 122 of the second printed circuit board 120 .
  • the connection member 150 may be electrically connected to a circuit pattern (not shown) provided on each of the mounting layers 112 and 122 .
  • the connecting member 150 may be made of metal to be electrically connected to the first printed circuit board 110 and the second printed circuit board 120 , respectively.
  • the connecting member 150 has an effect of physically connecting the first printed circuit board 110 and the second printed circuit board 120 while also electrically connecting the first printed circuit board 110 .
  • a plurality of connection members 150 may be provided.
  • the plurality of connection members 150 may include a first connection member 151 and a second connection member 152 .
  • the first connection member 151 and the second connection member 152 may be provided to have a potential difference with each other.
  • the first connecting member 151 and the second connecting member 152 may be disposed to be spaced apart from each other.
  • the arrangement of the first connecting member 151 and the second connecting member 152 is not limited thereto.
  • the connecting member 150 may include first connecting portions 151a and 152a in contact with the first printed circuit board 110 and second connecting portions 151b and 152b in contact with the second printed circuit board 120 . have.
  • the first connecting portions 151a and 152a may be electrically connected to the first printed circuit board 110
  • the second connecting portions 151b and 152b may be electrically connected to the second printed circuit board 120 .
  • the first printed circuit board 110 and the second printed circuit board 120 may be electrically connected to each other through the first connecting portions 151a and 152a and the second connecting portions 151b and 152b.
  • the first connection member 151 may include a first connection part 151a and a second connection part 151b.
  • the second connection member 152 may include a first connection part 152a and a second connection part 152b.
  • the size and shape of the connecting member 150 is not limited to the illustrated bar and may be formed in various sizes and shapes.
  • the insulating paper 140 may be disposed between the first printed circuit board 110 and the rear chassis 12 .
  • the present invention is not limited thereto and the insulating paper 140 may be omitted.
  • FIG. 12 is a perspective view illustrating an electronic component 330 mounted on a printed circuit board 110 in an electronic device according to another embodiment of the present invention.
  • the electronic device may include a connection member 150 and an electronic component 330 .
  • the second printed circuit board 120 may include a mounting layer 122 and an insulating layer 121 .
  • the mounting layer 122 may be disposed in a direction facing the electronic component body 331 .
  • the insulating layer 121 may be disposed on a surface that does not face the body 331 .
  • the mounting layer 122 may be in contact with the connecting member 150 and may be electrically connected to the connecting member 150 .
  • FIG. 13 is a perspective view illustrating a state in which an electronic component 430 is mounted on a printed circuit board 110 in an electronic device according to another embodiment of the present invention.
  • the electronic device may include an electronic component 430 .
  • the electronic component 430 may be an NTC sensor.
  • the electronic component 430 is not limited to the above example.
  • the electronic component 430 may include a body 431 and an electrode wire 432 .
  • the electrode wire 432 may be electrically connected to the second printed circuit board 120 such that the electronic component 430 is electrically connected to the second printed circuit board 120 .
  • the second printed circuit board 120 may include a coupling part 123 to be inserted into the first printed circuit board 110 .
  • the connecting members 151 and 152 are respectively coupled to the first printed circuit board 110 and the second printed circuit board 120 so that the first printed circuit board 110 and the second printed circuit board 120 are electrically connected to each other.
  • the connection members 151 and 152 may be soldered to the mounting layer 112 of the first printed circuit board 110 and the mounting layer 122 of the second printed circuit board 120 .
  • FIG. 14 is an exploded perspective view illustrating a state in which an electronic component 430 is mounted on a printed circuit board 110 in an electronic device according to another embodiment of the present invention.
  • 15 is a perspective view illustrating a state in which the electronic component 430 is mounted on the printed circuit board 110 in the electronic device shown in FIG. 14 .
  • the printed circuit board 110 may include a plurality of holes.
  • the plurality of holes may include a mounting hole 113 and a coupling hole 114 .
  • the mounting hole 113 may be provided so that the electronic component 430 is mounted on the printed circuit board 110 .
  • the coupling hole 114 may be coupled to a holder 160 to be described later.
  • the electronic device may include an electronic component 430 and a holder 160 .
  • the electronic component 430 may include a body 431 , an electrode wire 432 , and a terminal 433 .
  • the electrode wire 432 may protrude from the body 431 .
  • the electrode wire 432 may protrude from the outer peripheral surface of the body 431 .
  • the electrode wire 432 may include a first portion 432a and a second portion 432b.
  • the first portion 432a and the second portion 432b may be provided to have a step difference from each other.
  • the terminal 433 may be provided at one end of the electrode wire 432 .
  • the terminal 433 may be connected to the second portion 432b.
  • the terminal 433 may be seated in the mounting hole 113 .
  • shaking of manufacturing equipment may occur, and the electronic component 430 may not be separated due to the mounting hole 113 .
  • the holder 160 may fix the terminal 433 so that the terminal 433 is not separated from the mounting hole 113 during the manufacturing process of the power board 100 and the electronic device 1 .
  • the holder 160 may cover the terminal 433 from one side of the terminal 433 .
  • the terminal 433 may be disposed between the holder 160 and the printed circuit board 110 in the Z direction.
  • the holder 160 may press the electrode wire 432 so that the electronic component 430 is fixed to the printed circuit board 110 .
  • the holder 160 may press the second portion 432b of the electrode wire 432 .
  • the present invention is not limited thereto.
  • the holder 160 may include a cover part 161 , a coupling protrusion 162 , and a fixing protrusion 163 .
  • the cover part 161 may include a first part 161a and a second part 161b.
  • the first portion 161a may extend in one direction to cover the terminal 433 in the Z-axis direction.
  • the second portion 161b may be bent from the first portion 161a in the -Z axis direction to cover the terminal 433 .
  • the coupling protrusion 162 may protrude from an end of the cover part 161 .
  • a plurality of coupling protrusions 162 may be provided.
  • the plurality of coupling protrusions 162 may respectively protrude from both ends of the cover part 161 .
  • the coupling protrusion 162 may protrude from the second portion 161b toward the printed circuit board 110 .
  • the coupling protrusion 162 may be coupled to the coupling hole 114 of the printed circuit board 110 .
  • One end of the coupling protrusion 162 may be connected to the second portion 161b, and a fixing protrusion 163 may be provided at the other end of the coupling protrusion 162 .
  • the fixing protrusion 163 may be provided so that the holder 160 does not fall into the printed circuit board 110 .
  • the fixing protrusion 163 may protrude from the other end of the coupling protrusion 162 in the X direction or the -X direction.
  • the fixing protrusion 163 may protrude toward the outside of the holder 160 .
  • the fixing protrusion 163 may contact the printed circuit board 110 to prevent the holder 160 from being removed from the printed circuit board 110 .
  • the printed circuit board 110 may include a mounting layer 112 and an insulating layer 111 .
  • the insulating layer 111 and the mounting layer 112 may be sequentially stacked along the Z direction.
  • the coupling protrusion 162 and the fixing protrusion 163 may pass through the printed circuit board 110 sequentially through the mounting layer 112 and the insulating layer 111 .
  • the body 431 may contact the mounting layer 112
  • the fixing protrusion 163 may contact the insulating layer 111 .
  • the terminal 433 when the terminal 433 is fixed by the holder 160 and the mounting hole 113 , the terminal 433 may be soldered to the mounting layer 112 .
  • solder cream may be applied adjacent to the terminal 433 , and heat may be applied to the holder 160 and the terminal 433 to perform the soldering process.
  • the material of the holder 160 may be a material capable of transferring heat to the inside of the holder 160 and having a high melting point.
  • 16 is a perspective view illustrating a state in which an electronic component 430 is mounted on a printed circuit board 110 in an electronic device according to another embodiment of the present invention.
  • 17 is a perspective view illustrating a state in which the electronic component 430 is mounted on the printed circuit board 110 in the electronic device shown in FIG. 16 .
  • a terminal 433 and/or an electrode wire 432 may be disposed between the holder 160 and the printed circuit board 110 . Accordingly, the terminal 433 and/or the electrode wire 432 may not be separated from the mounting position due to shaking during the manufacturing process. In FIG. 16 , the terminal 433 is not exposed because it is covered by the holder 160 .
  • soldering between the terminal 433 and the printed circuit board 110 is completed.
  • a soldering part 434 may be provided outside the terminal 433 .
  • the holder 160 may be removed.
  • the present invention is not limited thereto and the holder 160 may not be removed.

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Abstract

An electronic device is disclosed. An electronic device according to an embodiment of the present disclosure may include: an insulating layer; a printed circuit board including a mounting layer laminated on the insulating layer and provided with multiple circuit patterns spaced apart from each other; and a jumper disposed on the mounting layer and connected to each of the multiple circuit patterns so as to electrically connect the multiple circuit patterns, wherein the jumper may include: a body extending in one direction; an extension part extending from the body toward the mounting layer; a contact part provided at one end of the extension part to be in contact with the mounting layer such that the jumper is electrically connected to the multiple circuit patterns; and an insertion protrusion protruding from the outer perimeter of the contact part toward the printed circuit board so as to be inserted into the printed circuit board.

Description

전자장치electronics

본 개시는 전자장치에 관한 것으로, 보다 구체적으로는 슬림화된 전자장치에 관한 것이다.The present disclosure relates to an electronic device, and more particularly, to a slimmed electronic device.

전자장치는 전자장치에 파워를 공급하는 전원공급장치를 포함할 수 있다. 전원공급장치는 파워보드라고 지칭되기도 하는데, 주로 절연층과 실장층을 포함하는 인쇄회로기판 위에 전자부품 등을 실장할 수 있다.The electronic device may include a power supply for supplying power to the electronic device. The power supply device is also referred to as a power board, and electronic components and the like may be mounted on a printed circuit board mainly including an insulating layer and a mounting layer.

전자부품은 전극 와이어를 갖는데, 일반적으로 전자부품은 절연층 위에 배치되어 금속을 포함하는 실장층과 전기적으로 연결되도록 전극 와이어가 인쇄회로기판을 관통할 수 있다. 전자장치 내에서 파워보드와 다른 장치 또는 부품(예를 들어, 리어섀시) 간에는 안전규격을 준수하기 위해 이격거리가 필요할 수 있는데, 관통된 전극 와이어로 인해 파워보드와 부품 간의 이격거리가 보다 커질 수 있다.The electronic component has an electrode wire. In general, the electronic component is disposed on an insulating layer and the electrode wire can penetrate the printed circuit board so as to be electrically connected to the mounting layer including the metal. Separation distances may be required to comply with safety standards between the power board and other devices or components (e.g., rear chassis) within an electronic device. have.

따라서, 전자장치를 슬림화 할 수 있도록 파워보드와 다른 부품 간의 이격거리를 감소시키고자 하는 요구가 있다.Accordingly, there is a need to reduce the separation distance between the power board and other components so that the electronic device can be slimmed down.

본 개시의 일 측면은 슬림화된 전자장치를 제공한다.One aspect of the present disclosure provides a slimmed electronic device.

본 개시의 다른 일 측면은 생산성이 향상된 전자장치를 제공한다.Another aspect of the present disclosure provides an electronic device with improved productivity.

본 개시의 일 실시예에 따른 전자장치는, 제1면과 상기 제1면과 반대되는 측에 배치되는 제2면을 포함하는 절연층과, 상기 절연층의 제1면 상에 적층되는 실장층으로, 서로 이격되는 복수의 회로패턴이 마련되는 실장층을 포함하는 인쇄회로기판 및 상기 복수의 회로패턴을 전기적으로 연결시키도록 상기 실장층 상에 배치되어 상기 복수의 회로패턴과 각각 접속되는 점퍼를 포함하고, 상기 점퍼는, 상기 점퍼는 일 방향으로 연장되는 몸체와, 상기 몸체로부터 상기 실장층을 향해 연장되는 연장부와, 상기 복수의 회로패턴과 전기적으로 연결되도록 상기 연장부의 일단에 마련되어 상기 실장층과 접촉하는 접촉부 및 상기 인쇄회로기판 내로 삽입되도록 상기 접촉부의 바깥둘레로부터 상기 인쇄회로기판을 향해 돌출되며, 상기 절연층의 제2면에 대해 돌출되지 않도록 상기 인쇄회로기판 내에 삽입되는 삽입돌기를 포함할 수 있다.An electronic device according to an embodiment of the present disclosure includes an insulating layer including a first surface and a second surface disposed on a side opposite to the first surface, and a mounting layer stacked on the first surface of the insulating layer. A printed circuit board including a mounting layer provided with a plurality of circuit patterns spaced apart from each other and a jumper disposed on the mounting layer to electrically connect the plurality of circuit patterns and respectively connected to the plurality of circuit patterns wherein the jumper includes a body extending in one direction, an extension extending from the body toward the mounting layer, and one end of the extension provided at one end of the extension to be electrically connected to the plurality of circuit patterns. a contact portion in contact with the layer and an insertion protrusion which protrudes from the outer periphery of the contact portion toward the printed circuit board so as to be inserted into the printed circuit board, and is inserted into the printed circuit board so as not to protrude with respect to the second surface of the insulating layer; may include

상기 접촉부는 상기 몸체의 길이방향을 따라 연장되고, 상기 접촉부는 상기 접촉부의 연장방향에 따른 일단에서 상기 연장부와 연결되는 제1연결부와, 상기 접촉부의 접촉부의 연장방향에 따른 타단에서 상기 삽입돌기와 연결되는 제2연결부를 포함할 수 있다.The contact portion extends along the longitudinal direction of the body, and the contact portion includes a first connection portion connected to the extension portion at one end along the extension direction of the contact portion, and the insertion protrusion at the other end along the extension direction of the contact portion of the contact portion. It may include a second connection part to be connected.

상기 연장부는 상기 몸체의 길이방향에 따른 일단에서 상기 실장층을 향해 상기 몸체의 길이방향과 수직하게 연장되고, 상기 삽입돌기는 상기 제2연결부로부터 상기 몸체의 길이방향과 수직한 방향으로 돌출될 수 있다.The extension portion extends perpendicularly to the longitudinal direction of the body toward the mounting layer from one end along the longitudinal direction of the body, and the insertion protrusion may protrude from the second connecting portion in a direction perpendicular to the longitudinal direction of the body. have.

상기 인쇄회로기판은 제1인쇄회로기판이고, 상기 전자장치는, 상기 제1인쇄회로기판에 전기적으로 연결되도록 전극 와이어를 갖고, 상기 실장층 상에 배치되는 전자부품(Electronic part)과, 상기 전극 와이어와 전기적으로 연결되고, 상기 제1인쇄회로기판과 접촉되는 제2인쇄회로기판 및 상기 제1인쇄회로기판과 제2인쇄회로기판을 전기적으로 연결시키도록 상기 제1인쇄회로기판 및 제2인쇄회로기판에 각각 결합되는 연결부재를 더 포함할 수 있다.The printed circuit board is a first printed circuit board, and the electronic device has an electrode wire to be electrically connected to the first printed circuit board, an electronic part disposed on the mounting layer, and the electrode a second printed circuit board electrically connected to a wire and in contact with the first printed circuit board, and the first printed circuit board and the second printed circuit board to electrically connect the first printed circuit board and the second printed circuit board Connection members each coupled to the circuit board may be further included.

상기 연결부재는, 상기 제1인쇄회로기판에 접촉되는 제1접속부와, 상기 제1접속부로부터 절곡되며 상기 제2인쇄회로기판에 접촉되는 제2접속부를 포함할 수 있다.The connection member may include a first connection part contacting the first printed circuit board, and a second connection part bent from the first connection part and contacting the second printed circuit board.

상기 제2인쇄회로기판은 절연층과, 상기 제2접속부와 전기적으로 연결되도록 상기 절연층에 적층되는 실장층을 포함하고, 상기 제1접속부는 상기 제1인쇄회로기판의 실장층과 접촉되고, 상기 제2접속부는 상기 제2인쇄회로기판의 실장층과 접촉될 수 있다.The second printed circuit board includes an insulating layer and a mounting layer stacked on the insulating layer to be electrically connected to the second connection part, and the first connection part is in contact with the mounting layer of the first printed circuit board, The second connection part may be in contact with a mounting layer of the second printed circuit board.

상기 연결부재는 복수로 마련되고, 상기 복수의 연결부재는 서로 전위차를 갖도록 마련될 수 있다.The connecting member may be provided in plurality, and the plurality of connecting members may be provided to have a potential difference from each other.

상기 인쇄회로기판은 실장 홀을 포함하고, 상기 전자장치는, 상기 실장층 상에 배치되는 전자부품으로 상기 인쇄회로기판에 전기적으로 연결되도록 전극 와이어와, 상기 실장 홀에 삽입되도록 상기 전극 와이어의 일단에 마련되는 단자를 포함하는 전자부품 및 상기 단자를 상기 실장 홀에 고정시키도록 상기 전극 와이어를 가압하는 홀더를 더 포함할 수 있다.The printed circuit board includes a mounting hole, and the electronic device includes an electrode wire to be electrically connected to the printed circuit board as an electronic component disposed on the mounting layer, and one end of the electrode wire to be inserted into the mounting hole. It may further include an electronic component including a terminal provided in the holders and a holder for pressing the electrode wire to fix the terminal to the mounting hole.

상기 인쇄회로기판은 상기 홀더와 결합되도록 마련되는 결합 홀을 더 포함하고, 상기 홀더는, 상기 단자를 커버하도록 일 방향으로 연장되는 커버부와, 상기 홀더가 상기 결합 홀과 결합되도록 상기 커버부의 양단으로부터 상기 실장층을 향해 돌출되는 복수의 결합돌기 및 상기 홀더가 결합되었을 때 상기 복수의 결합돌기가 상기 인쇄회로기판에 고정되도록 마련되는 고정돌기로, 상기 복수의 결합돌기 각각의 일단으로부터 상기 커버부의 외측을 향해 돌출되는 복수의 고정돌기를 포함할 수 있다.The printed circuit board further includes a coupling hole provided to be coupled to the holder, wherein the holder includes a cover part extending in one direction to cover the terminal, and both ends of the cover part so that the holder is coupled to the coupling hole. A plurality of coupling protrusions protruding from the mounting layer and a fixing protrusion provided so that the plurality of coupling protrusions are fixed to the printed circuit board when the holder is coupled, from one end of each of the plurality of coupling protrusions to the cover part It may include a plurality of fixing protrusions protruding outward.

본 개시의 일 실시예에 따른 전자장치는, 절연층과, 상기 절연층에 적층되는 실장층을 포함하는 제1인쇄회로기판과, 상기 제1인쇄회로기판에 전기적으로 연결되도록 전극 와이어를 갖고, 상기 실장층 상에 배치되는 전자부품(Electronic part)과, 상기 전극 와이어와 전기적으로 연결되고, 상기 제1인쇄회로기판과 접촉되는 제2인쇄회로기판 및 상기 제1인쇄회로기판과 제2인쇄회로기판을 전기적으로 연결시키도록 상기 제1인쇄회로기판 및 제2인쇄회로기판에 각각 결합되는 연결부재로서, 상기 제1인쇄회로기판에 접촉되는 제1접속부와, 상기 제1접속부로부터 절곡되며 상기 제2인쇄회로기판에 접촉되는 제2접속부를 포함하는 연결부재를 포함할 수 있다.An electronic device according to an embodiment of the present disclosure has an insulating layer, a first printed circuit board including a mounting layer laminated on the insulating layer, and an electrode wire to be electrically connected to the first printed circuit board, An electronic part disposed on the mounting layer, a second printed circuit board electrically connected to the electrode wire and in contact with the first printed circuit board, and the first printed circuit board and the second printed circuit A connecting member coupled to the first printed circuit board and the second printed circuit board to electrically connect the substrate, and a first connecting portion contacting the first printed circuit board, and bending from the first connecting portion, the second connecting member 2 It may include a connection member including a second connection portion in contact with the printed circuit board.

상기 제2인쇄회로기판은 절연층과, 상기 제2접속부와 전기적으로 연결되도록 상기 절연층에 적층되는 실장층을 포함하고, 상기 제1접속부는 상기 제1인쇄회로기판의 실장층과 접촉되고, 상기 제2접속부는 상기 제2인쇄회로기판의 실장층과 접촉될 수 있다.The second printed circuit board includes an insulating layer and a mounting layer stacked on the insulating layer to be electrically connected to the second connection part, and the first connection part is in contact with the mounting layer of the first printed circuit board, The second connection part may be in contact with a mounting layer of the second printed circuit board.

상기 연결부재는 복수로 마련되고, 상기 복수의 연결부재는 서로 전위차를 갖도록 마련될 수 있다.The connecting member may be provided in plurality, and the plurality of connecting members may be provided to have a potential difference from each other.

상기 제1인쇄회로기판은 서로 이격되어 마련되는 복수의 회로패턴을 더 포함하고, 상기 전자장치는 상기 복수의 회로패턴을 전기적으로 연결시키도록 상기 실장층 상에서 상기 복수의 회로패턴과 각각 접속되는 점퍼를 더 포함하고, 상기 점퍼는, 일 방향으로 연장되는 몸체와, 상기 몸체로부터 상기 실장층을 향해 연장되는 연장부와, 상기 실장층에 안착되도록 상기 연장부의 일단에 마련되어 상기 실장층과 접촉하는 접촉부 및 상기 인쇄회로기판 내로 삽입되도록 상기 접촉부의 바깥둘레로부터 상기 인쇄회로기판을 향해 돌출되는 삽입돌기를 포함할 수 있다.The first printed circuit board further includes a plurality of circuit patterns provided to be spaced apart from each other, and the electronic device has jumpers respectively connected to the plurality of circuit patterns on the mounting layer to electrically connect the plurality of circuit patterns. The jumper further includes a body extending in one direction, an extension extending from the body toward the mounting layer, and a contact portion provided at one end of the extension to be seated on the mounting layer and contacting the mounting layer. and an insertion protrusion protruding toward the printed circuit board from the outer periphery of the contact portion so as to be inserted into the printed circuit board.

상기 제1인쇄회로기판의 절연층은 상기 실장층이 적층되는 제1면과 상기 제1면과 반대되는 측에 배치되는 제2면을 포함하고, 상기 삽입돌기는 상기 절연층의 제2면에 대해 돌출되지 않도록 상기 인쇄회로기판 내에 삽입될 수 있다.The insulating layer of the first printed circuit board includes a first surface on which the mounting layer is laminated and a second surface disposed on a side opposite to the first surface, and the insertion protrusion is on the second surface of the insulating layer. It may be inserted into the printed circuit board so as not to protrude against the printed circuit board.

상기 접촉부는 상기 몸체의 길이방향을 따라 연장되고, 상기 접촉부는 상기 접촉부의 길이 방향에 따른 일단에서 상기 연장부와 연결되는 제1연결부와, 상기 접촉부의 접촉부의 길이 방향에 따른 타단에서 상기 삽입돌기와 연결되는 제2연결부를 포함할 수 있다.The contact portion extends along the longitudinal direction of the body, and the contact portion includes a first connection portion connected to the extension portion at one end along the length direction of the contact portion, and the insertion protrusion at the other end along the length direction of the contact portion of the contact portion. It may include a second connection part to be connected.

상기 연장부는 상기 몸체의 길이방향에 따른 일단에서 상기 실장층을 향해 상기 몸체의 길이방향과 수직하게 연장되고, 상기 삽입돌기는 상기 제2연결부로부터 상기 몸체의 길이방향과 수직한 방향으로 돌출될 수 있다.The extension portion extends perpendicularly to the longitudinal direction of the body toward the mounting layer from one end along the longitudinal direction of the body, and the insertion protrusion may protrude from the second connecting portion in a direction perpendicular to the longitudinal direction of the body. have.

상기 전자부품은 상기 전극 와이어의 일단에 마련되는 단자를 포함하고, 상기 제1인쇄회로기판은 상기 단자가 안착되는 실장 홀을 더 포함하고, 상기 단자를 상기 실장 홀에 고정시키도록 상기 전극 와이어를 가압하는 홀더를 더 포함할 수 있다.The electronic component includes a terminal provided at one end of the electrode wire, the first printed circuit board further includes a mounting hole in which the terminal is seated, and the electrode wire is mounted to fix the terminal to the mounting hole. It may further include a holder for pressing.

상기 홀더는, 상기 단자를 커버하도록 연장되는 커버부와, 상기 홀더가 상기 제1인쇄회로기판과 결합되도록 상기 커버부의 양단으로부터 상기 실장층을 향해 돌출되는 복수의 결합돌기 및 상기 홀더가 결합되었을 때 상기 복수의 결합돌기가 상기 제1인쇄회로기판에 고정되도록 마련되는 고정돌기로, 상기 복수의 결합돌기 각각의 일단으로부터 상기 커버부의 외측을 향해 돌출되는 복수의 고정돌기를 포함할 수 있다.The holder includes a cover portion extending to cover the terminal, a plurality of coupling protrusions protruding from both ends of the cover portion toward the mounting layer so that the holder is coupled to the first printed circuit board, and when the holder is coupled The plurality of coupling protrusions are fixing protrusions provided to be fixed to the first printed circuit board, and may include a plurality of fixing protrusions protruding from one end of each of the plurality of coupling protrusions toward the outside of the cover part.

본 개시의 일 실시예에 따른 전자장치는, 절연층과, 상기 절연층에 적층되는 실장층을 포함하고 실장 홀이 형성되는 인쇄회로기판 및 상기 실장층 상에 배치되는 전자부품으로, 상기 인쇄회로기판에 전기적으로 연결되도록 전극 와이어와, 상기 전극 와이어의 일단에 마련되는 단자를 포함하는 전자부품 및 상기 단자가 상기 실장 홀에 고정시키도록 상기 전극 와이어를 가압하며 상기 단자를 커버하는 홀더를 포함할 수 있다.An electronic device according to an embodiment of the present disclosure includes a printed circuit board including an insulating layer, a mounting layer laminated on the insulating layer and having a mounting hole formed therein, and an electronic component disposed on the mounting layer, the printed circuit An electronic component including an electrode wire to be electrically connected to the substrate, a terminal provided at one end of the electrode wire, and a holder for pressing the electrode wire to fix the terminal to the mounting hole and covering the terminal can

상기 인쇄회로기판은 상기 홀더와 결합되도록 마련되는 결합 홀을 더 포함하고, 상기 홀더는, 상기 단자를 커버하도록 연장되는 커버부와, 상기 홀더가 상기 결합 홀과 결합되도록 상기 커버부의 양단으로부터 상기 실장층을 향해 돌출되는 복수의 결합돌기 및 상기 홀더가 결합되었을 때 상기 복수의 결합돌기가 상기 인쇄회로기판에 고정되도록 마련되는 고정돌기로, 상기 복수의 결합돌기 각각의 일단으로부터 상기 커버부의 외측을 향해 돌출되는 복수의 고정돌기를 포함할 수 있다.The printed circuit board further includes a coupling hole provided to be coupled to the holder, wherein the holder includes a cover part extending to cover the terminal, and mounting the holder from both ends of the cover part so that the holder is coupled to the coupling hole. A plurality of coupling protrusions protruding toward the layer and a fixing protrusion provided so that the plurality of coupling protrusions are fixed to the printed circuit board when the holder is coupled, from one end of each of the plurality of coupling protrusions toward the outside of the cover part It may include a plurality of fixing protrusions that protrude.

본 개시에 따르면 파워보드와 리어섀시 간에 이격거리가 감소되어 슬림화된 전자장치를 제공할 수 있다.According to the present disclosure, it is possible to provide a slimmed electronic device by reducing the separation distance between the power board and the rear chassis.

본 개시에 따르면 파워보드에 부품들이 안정적으로 안착되므로 생산성이 향상된 전자장치를 제공할 수 있다.According to the present disclosure, since components are stably seated on the power board, it is possible to provide an electronic device with improved productivity.

도 1은 본 발명의 일 실시예에 따른 전자장치를 도시한 도면이다.1 is a diagram illustrating an electronic device according to an embodiment of the present invention.

도 2는 도 1에 도시된 전자장치의 분해 사시도이다.FIG. 2 is an exploded perspective view of the electronic device shown in FIG. 1 .

도 3은 도 1에 도시된 전자장치에서 전자부품들이 실장된 모습을 나타낸 평면도이다.3 is a plan view illustrating a state in which electronic components are mounted in the electronic device shown in FIG. 1 .

도 4는 본 발명의 다른 실시예에 따른 전자장치에서 전자부품들이 실장된 모습을 나타낸 평면도이다.4 is a plan view illustrating a state in which electronic components are mounted in an electronic device according to another exemplary embodiment of the present invention.

도 5는 도 3에 도시된 전자장치에서 점퍼를 도시한 사시도이다.FIG. 5 is a perspective view illustrating a jumper in the electronic device shown in FIG. 3 .

도 6은 도 5에 도시된 전자장치에서 점퍼가 인쇄회로기판에 실장된 모습을 나타낸 평면도이다6 is a plan view illustrating a state in which a jumper is mounted on a printed circuit board in the electronic device shown in FIG. 5;

도 7은 본 발명의 또 다른 실시예에 따른 전자장치에서 점퍼를 나타낸 사시도이다.7 is a perspective view illustrating a jumper in an electronic device according to another embodiment of the present invention.

도 8은 도 7에 도시된 전자장치에서 점퍼가 인쇄회로기판에 실장된 모습을 나타낸 평면도이다8 is a plan view illustrating a state in which a jumper is mounted on a printed circuit board in the electronic device shown in FIG. 7 ;

도 9는 본 발명의 또 다른 실시예에 따른 전자장치에서 점퍼가 인쇄회로기판에 실장된 모습을 도시한 사시도이다.9 is a perspective view illustrating a state in which a jumper is mounted on a printed circuit board in an electronic device according to another embodiment of the present invention.

도 10은 본 발명의 또 다른 실시예에 따른 전자장치에서 전자부품이 인쇄회로기판에 실장된 모습을 도시한 사시도이다.10 is a perspective view illustrating a state in which an electronic component is mounted on a printed circuit board in an electronic device according to another embodiment of the present invention.

도 11은 도 10에 도시된 전자장치에서 전자부품이 인쇄회로기판에 실장된 모습을 나타낸 평면도이다11 is a plan view illustrating a state in which an electronic component is mounted on a printed circuit board in the electronic device shown in FIG. 10 ;

도 12는 본 발명의 또 다른 실시예에 따른 전자장치에서 전자부품이 인쇄회로기판에 실장된 모습을 도시한 사시도이다.12 is a perspective view illustrating a state in which an electronic component is mounted on a printed circuit board in an electronic device according to another embodiment of the present invention.

도 13은 본 발명의 또 다른 실시예에 따른 전자장치에서 전자부품이 인쇄회로기판에 실장된 모습을 도시한 사시도이다.13 is a perspective view illustrating a state in which an electronic component is mounted on a printed circuit board in an electronic device according to another embodiment of the present invention.

도 14는 본 발명의 또 다른 실시예에 따른 전자장치에서 전자부품이 인쇄회로기판에 실장되는 모습을 도시한 분해 사시도이다.14 is an exploded perspective view illustrating a state in which an electronic component is mounted on a printed circuit board in an electronic device according to another embodiment of the present invention.

도 15는 도 14에 도시된 전자장치에서 전자부품이 인쇄회로기판에 실장된 모습을 도시한 사시도이다.15 is a perspective view illustrating a state in which an electronic component is mounted on a printed circuit board in the electronic device shown in FIG. 14 .

도 16은 본 발명의 또 다른 실시예에 따른 전자장치에서 전자부품이 인쇄회로기판에 실장된 모습을 도시한 사시도이다.16 is a perspective view illustrating a state in which an electronic component is mounted on a printed circuit board in an electronic device according to another embodiment of the present invention.

도 17은 도 16에 도시된 전자장치에서 전자부품이 인쇄회로기판에 실장된 모습을 도시한 사시도이다.17 is a perspective view illustrating a state in which an electronic component is mounted on a printed circuit board in the electronic device shown in FIG. 16 .

본 명세서에 기재된 실시예와 도면에 도시된 구성은 개시된 발명의 바람직한 일 예에 불과할 뿐이며, 본 출원의 출원시점에 있어서 본 명세서의 실시예와 도면을 대체할 수 있는 다양한 변형 예들이 있을 수 있다.The configuration shown in the embodiments and drawings described in this specification is only a preferred example of the disclosed invention, and there may be various modifications that can replace the embodiments and drawings of the present specification at the time of filing of the present application.

또한, 본 명세서의 각 도면에서 제시된 동일한 참조번호 또는 부호는 실질적으로 동일한 기능을 수행하는 부품 또는 구성요소를 나타낸다.In addition, the same reference numbers or reference numerals in each drawing in the present specification indicate parts or components that perform substantially the same functions.

또한, 본 명세서에서 사용한 용어는 실시예를 설명하기 위해 사용된 것으로, 개시된 발명을 제한 및/또는 한정하려는 의도가 아니다. 단수의 표현은 문맥상 명백하게 다르게 뜻하지 않는 한, 복수의 표현을 포함한다. 본 명세서에서, "포함하다" 또는 "가지다"등의 용어는 명세서상에 기재된 특징, 숫자, 단계, 동작, 구성요소, 부품 또는 이들을 조합한 것이 존재함을 지정하려는 것이지, 하나 또는 그 이상의 다른 특징들이나 숫자, 단계, 동작, 구성요소, 부품 또는 이들을 조합한 것들의 존재 또는 부가 가능성을 미리 배제하지 않는다.In addition, the terms used herein are used to describe the embodiments, and are not intended to limit and/or limit the disclosed invention. The singular expression includes the plural expression unless the context clearly dictates otherwise. In the present specification, terms such as "comprises" or "have" are intended to designate that the features, numbers, steps, operations, components, parts, or combinations thereof described in the specification exist, but one or more other features It does not preclude the possibility of the presence or addition of numbers, steps, operations, components, parts, or combinations thereof.

또한, 본 명세서에서 사용한 "제1", "제2" 등과 같이 서수를 포함하는 용어는 다양한 구성요소들을 설명하는데 사용될 수 있지만, 상기 구성요소들은 상기 용어들에 의해 한정되지는 않으며, 상기 용어들은 하나의 구성요소를 다른 구성요소로부터 구별하는 목적으로만 사용된다. 예를 들어, 본 발명의 권리 범위를 벗어나지 않으면서 제1 구성요소는 제2 구성요소로 명명될 수 있고, 유사하게 제2 구성요소도 제1 구성요소로 명명될 수 있다. "및/또는"이라는 용어는 복수의 관련된 기재된 항목들의 조합 또는 복수의 관련된 기재된 항목들 중의 어느 항목을 포함한다.In addition, terms including an ordinal number such as "first", "second", etc. used herein may be used to describe various elements, but the elements are not limited by the terms, and the terms are It is used only for the purpose of distinguishing one component from another. For example, without departing from the scope of the present invention, a first component may be referred to as a second component, and similarly, a second component may also be referred to as a first component. The term "and/or" includes a combination of a plurality of related listed items or any of a plurality of related listed items.

한편, 하기의 설명에서 사용된 용어 "전방", "후방", "좌측" 및 "우측"등은 도면을 기준으로 정의한 것이며, 이 용어에 의하여 각 구성요소의 형상 및 위치가 제한되는 것은 아니다.On the other hand, the terms "front", "rear", "left" and "right" used in the following description are defined based on the drawings, and the shape and position of each component is not limited by these terms.

이하에서는 본 발명에 따른 실시예를 첨부된 도면을 참조하여 상세히 설명한다.Hereinafter, an embodiment according to the present invention will be described in detail with reference to the accompanying drawings.

도 1은 본 발명의 일 실시예에 따른 전자장치(1)를 도시한 도면이다. 도 2는 도 1에 도시된 전자장치(1)의 분해 사시도이다.1 is a diagram illustrating an electronic device 1 according to an embodiment of the present invention. FIG. 2 is an exploded perspective view of the electronic device 1 shown in FIG. 1 .

본 발명의 다양한 실시예에 따르면 전자장치는 디스플레이 장치, 이동통신 단말기, 태블릿 PC, 웨어러블 전자장치 중 적어도 하나를 포함할 수 있다. 다만, 아래에서는 디스플레이 장치를 기준으로 설명한다.According to various embodiments of the present disclosure, the electronic device may include at least one of a display device, a mobile communication terminal, a tablet PC, and a wearable electronic device. However, below, the description will be made based on the display device.

도 1 및 도 2를 참조하면, 디스플레이 장치(1)는 외관을 형성하는 하우징(housing)(10)을 포함할 수 있다. 하우징(10)은 개구(13)를 가질 수 있다. 구체적으로, 개구(13)는 하우징(10)의 전면(前面)에 형성될 수 있다. 1 and 2 , the display device 1 may include a housing 10 forming an exterior. The housing 10 may have an opening 13 . Specifically, the opening 13 may be formed on the front surface of the housing 10 .

하우징(10)은 외부 프레임(11)을 포함할 수 있다. 외부 프레임(11)은 전면(前面) 및 후면(後面)이 개방된 박스(box)형상을 가질 수 있다. 외부 프레임(11)의 개방된 전면은 개구(13)로 정의될 수 있다. 즉, 개구(13)는 외부 프레임(11)의 전면(前面)에 형성될 수 있다. 외부 프레임(11)의 개방된 후면은 후면 개구(19)로 정의될 수 있다. 즉, 후면 개구(19)는 외부 프레임(11)의 후면(前面)에 형성될 수 있다. The housing 10 may include an outer frame 11 . The outer frame 11 may have a box shape in which the front and rear surfaces are open. The open front side of the outer frame 11 may be defined as an opening 13 . That is, the opening 13 may be formed on the front surface of the outer frame 11 . The open rear surface of the outer frame 11 may be defined as a rear opening 19 . That is, the rear opening 19 may be formed on the rear surface of the outer frame 11 .

하우징(10)은 리어 섀시(12)를 더 포함할 수 있다. 리어 섀시(12)는 외부 프레임(11)에 결합될 수 있다. 구체적으로, 리어 섀시(12)는 외부 프레임(11)과 함께 디스플레이 장치(1)의 외관을 형성하도록 외부 프레임(11)의 개방된 후면에 결합될 수 있다. 즉, 리어 섀시(12)는 후면 개구(19)에 결합될 수 있다.The housing 10 may further include a rear chassis 12 . The rear chassis 12 may be coupled to the outer frame 11 . Specifically, the rear chassis 12 may be coupled to the open rear surface of the outer frame 11 to form the exterior of the display device 1 together with the outer frame 11 . That is, the rear chassis 12 may be coupled to the rear opening 19 .

디스플레이 장치(1)는 디스플레이 모듈(display module)(30)을 더 포함할 수 있다. 디스플레이 모듈(30)은 하우징(10)의 내부에 배치될 수 있다. The display device 1 may further include a display module 30 . The display module 30 may be disposed inside the housing 10 .

디스플레이 모듈(30)은 디스플레이패널(미도시)을 포함할 수 있다. 디스플레이패널에는 화면이 마련될 수 있다. 디스플레이패널은 외부로부터 입력되는 영상 신호에 따라 화면에 각종 영상을 표시할 수 있다. 이 때, 디스플레이패널은 디스플레이패널을 구성하는 복수의 화소가 자체적으로 광을 발생시킴으로써, 영상을 생성하는 발광 디스플레이 패널, 또는 복수의 화소가 광을 반사/투과/차단함으로써 영상을 생성하는 비발광 디스플레이 패널 중 어느 하나일 수 있다. The display module 30 may include a display panel (not shown). A screen may be provided on the display panel. The display panel may display various images on the screen according to an image signal input from the outside. In this case, the display panel is a light emitting display panel that generates an image when a plurality of pixels constituting the display panel generate light by itself, or a non-light emitting display that generates an image by reflecting/transmitting/blocking light by a plurality of pixels It may be any one of the panels.

디스플레이패널은 도면에는 도시되어 있지 않으나, 액정층(liquid crystal layer), 투명 전극층, 투명 기판 및 컬러 필터(color filter)를 포함할 수 있다.Although not shown in the drawings, the display panel may include a liquid crystal layer, a transparent electrode layer, a transparent substrate, and a color filter.

디스플레이 장치(1)는 디스플레이 장치(1)에 전원을 공급하는 전원공급장치(100)를 포함할 수 있다. 전원공급장치(100)는 파워보드(100)가 될 수 있다. 파워보드(100)는 리어 섀시(12)와 보드커버(90)의 사이에 배치될 수 있다. 즉, 파워보드(100)는 리어 섀시(12) 및 보드커버(90)로 인해 디스플레이 장치(1)의 외부로부터 보호받을 수 있다. 다만, 파워보드(100)의 위치는 이에 제한되는 것은 아니다. 아래에서는 디스플레이 장치(1)를 전자장치(1)라고 지칭하여 설명한다.The display device 1 may include a power supply device 100 for supplying power to the display device 1 . The power supply device 100 may be a power board 100 . The power board 100 may be disposed between the rear chassis 12 and the board cover 90 . That is, the power board 100 may be protected from the outside of the display device 1 due to the rear chassis 12 and the board cover 90 . However, the position of the power board 100 is not limited thereto. Hereinafter, the display device 1 will be referred to as an electronic device 1 and will be described.

도 3은 도 1에 도시된 전자장치에서 전자부품들(130)이 실장된 모습을 나타낸 평면도이다.FIG. 3 is a plan view illustrating a state in which electronic components 130 are mounted in the electronic device shown in FIG. 1 .

도 3을 참조하면, 본 발명의 일 실시예에 따른 전자장치는 리어 섀시(12)와 전원공급장치(100)를 포함할 수 있다. 전원공급장치(100)는 파워보드(100)로 지칭할 수 있다. 파워보드(100)는 인쇄회로기판(110)과, 각종 전자부품(130)을 포함할 수 있다.Referring to FIG. 3 , an electronic device according to an embodiment of the present invention may include a rear chassis 12 and a power supply device 100 . The power supply device 100 may be referred to as a power board 100 . The power board 100 may include a printed circuit board 110 and various electronic components 130 .

인쇄회로기판(110)은 절연층(111)과 실장층(112)을 포함할 수 있다. 절연층(111)은 프리프레그(prepreg)가 될 수 있다. 예를 들어, 절연층(111)은 강화섬유에 매트릭스 수지를 침투시킨 복합재가 될 수 있다. 실장층(112)은 전자부품(130)과 전기적으로 연결되도록 금속재질을 포함할 수 있다. 예를 들어, 실장층(112)은 구리로 형성될 수 있다. 실장층(112)에는 전자부품(130)의 전극 와이어(미도시)가 전기적으로 연결될 수 있다. 실장층(112) 위에는 부식 방지를 위한 솔더 마스크(미도시)와, 글자를 표기하기 위한 실크 스크린(미도시)이 마련될 수 있다.The printed circuit board 110 may include an insulating layer 111 and a mounting layer 112 . The insulating layer 111 may be a prepreg. For example, the insulating layer 111 may be a composite material in which the reinforcing fibers are impregnated with a matrix resin. The mounting layer 112 may include a metal material to be electrically connected to the electronic component 130 . For example, the mounting layer 112 may be formed of copper. An electrode wire (not shown) of the electronic component 130 may be electrically connected to the mounting layer 112 . A solder mask (not shown) for preventing corrosion and a silk screen (not shown) for writing characters may be provided on the mounting layer 112 .

전자부품(130)은 실장층(112) 상에서 인쇄회로기판(110)과 전기적으로 연결될 수 있다. 각각의 전자부품(130)들은 인쇄회로기판(110)과 전기적으로 연결되기 위한 전극 와이어를 포함할 수 있다. 전극 와이어는 실장층(112) 상에서 인쇄회로기판(110)과 연결될 수 있다. 실장층(112) 상에 배치된 전자부품(130)의 전극 와이어가 실장층(112)에서 솔더링되므로, 전극 와이어가 절연층(111)을 관통하지 않을 수 있다. 따라서, 절연층(111)에는 전극 와이어가 관통하는 홀이 마련되지 않을 수 있다. 뿐만 아니라, 전극 와이어가 실장층(112)을 관통하지 않을 수도 있다.The electronic component 130 may be electrically connected to the printed circuit board 110 on the mounting layer 112 . Each of the electronic components 130 may include an electrode wire for being electrically connected to the printed circuit board 110 . The electrode wire may be connected to the printed circuit board 110 on the mounting layer 112 . Since the electrode wire of the electronic component 130 disposed on the mounting layer 112 is soldered in the mounting layer 112 , the electrode wire may not penetrate the insulating layer 111 . Accordingly, a hole through which the electrode wire passes may not be provided in the insulating layer 111 . In addition, the electrode wire may not penetrate the mounting layer 112 .

도면에서 리어 섀시(12)와 인쇄회로기판(110)이 접촉된 것으로 도시되었으나, 이에 제한되는 것은 아니고 리어 섀시(12)와 인쇄회로기판(110)은 일정거리 이격될 수 있다. 따라서, 파워보드(100)와 리어 섀시(12)가 이격되어 마련될 수 있다.Although it is illustrated in the drawing that the rear chassis 12 and the printed circuit board 110 are in contact, the present invention is not limited thereto, and the rear chassis 12 and the printed circuit board 110 may be spaced apart from each other by a predetermined distance. Accordingly, the power board 100 and the rear chassis 12 may be provided to be spaced apart.

상기한 바와 같이 전극 와이어가 인쇄회로기판(110)을 관통하여 전자부품(130)이 실장된 면의 반대면 측으로 노출되지 않으므로 파워보드(100)와 리어 섀시(12) 간의 불필요한 간격이 줄어들 수 있다. 이에 따라, 전자장치의 두께(예를 들어, X방향 두께)를 슬림화 시킬 수 있다.As described above, since the electrode wire passes through the printed circuit board 110 and is not exposed to the side opposite to the surface on which the electronic component 130 is mounted, an unnecessary gap between the power board 100 and the rear chassis 12 can be reduced. . Accordingly, the thickness (eg, thickness in the X direction) of the electronic device may be reduced.

도 4는 본 발명의 다른 실시예에 따른 전자장치에서 전자부품(130)들이 실장된 모습을 나타낸 평면도이다.4 is a plan view illustrating a state in which electronic components 130 are mounted in an electronic device according to another embodiment of the present invention.

도 4를 참조하면, 전자장치는 절연지(140)를 더 포함할 수 있다. 절연지(140)는 인쇄회로기판(110)과 리어 섀시(12)의 사이에 배치될 수 있다. 예를 들어, 절연지(140)는 절연층(111)과 리어 섀시(12)의 사이에 마련될 수 있다. 도면에서 절연지(140)가 리어 섀시(12) 및 인쇄회로기판(110)과 접촉된 것으로 도시되었으나, 이에 제한되는 것은 아니고 절연지(140)는 리어 섀시(12) 및 인쇄회로기판(110)은 일정거리 이격될 수 있다. Referring to FIG. 4 , the electronic device may further include an insulating paper 140 . The insulating paper 140 may be disposed between the printed circuit board 110 and the rear chassis 12 . For example, the insulating paper 140 may be provided between the insulating layer 111 and the rear chassis 12 . In the drawing, the insulating paper 140 is shown to be in contact with the rear chassis 12 and the printed circuit board 110, but is not limited thereto and the insulating paper 140 is the rear chassis 12 and the printed circuit board 110. distance can be separated.

도 5는 도 3에 도시된 전자장치에서 점퍼(130)를 도시한 사시도이다. 도 6은 도 5에 도시된 전자장치에서 점퍼(130)가 인쇄회로기판(110)에 실장된 모습을 나타낸 평면도이다FIG. 5 is a perspective view illustrating a jumper 130 in the electronic device shown in FIG. 3 . 6 is a plan view illustrating a state in which the jumper 130 is mounted on the printed circuit board 110 in the electronic device shown in FIG. 5 .

도 5 및 도 6을 참조하면, 절연층(111)은 제1면(111a), 제2면(111b) 및 리세스(111c)를 포함할 수 있다. 제1면(111a)은 실장층(112)이 적층되는 면이 될 수 있다. 제2면(111b)은 제1면(111a)과 반대되는 측에 배치되는 면이 될 수 있다. 예를 들어, 제2면(111b)은 인쇄회로기판(110)의 외면이 될 수 있다. 제2면(111b)은 리어 섀시(12) 또는 절연지(140)와 마주할 수 있다. 예를 들어, 제2면(111b)은 리어 섀시(12) 또는 절연지(140)와 접촉될 수 있다. 리세스(111c)는 제1면(111a)으로부터 함몰될 수 있다. 리세스(111c)는 점퍼(130)의 삽입돌기(134)를 수용할 수 있다. 리세스(111c)는 삽입돌기(134)와 대응되어 형성될 수 있다. 예를 들어, 점퍼(130)의 삽입돌기(134)는 절연층(111) 내에 수용될 수 있다.5 and 6 , the insulating layer 111 may include a first surface 111a, a second surface 111b, and a recess 111c. The first surface 111a may be a surface on which the mounting layer 112 is stacked. The second surface 111b may be a surface disposed on a side opposite to the first surface 111a. For example, the second surface 111b may be the outer surface of the printed circuit board 110 . The second surface 111b may face the rear chassis 12 or the insulating paper 140 . For example, the second surface 111b may be in contact with the rear chassis 12 or the insulating paper 140 . The recess 111c may be recessed from the first surface 111a. The recess 111c may accommodate the insertion protrusion 134 of the jumper 130 . The recess 111c may be formed to correspond to the insertion protrusion 134 . For example, the insertion protrusion 134 of the jumper 130 may be accommodated in the insulating layer 111 .

전자장치는 전자부품(130)을 포함할 수 있다. 전자부품(130)은 점퍼(130)를 포함할 수 있다. 점퍼(130)는 인쇄회로기판(110) 상에 마련되는 복수의 회로패턴(112a)을 전기적으로 연결시킬 수 있다. 예를 들어, 점퍼(130)는 실장층(112) 상에서 서로 이격되어 마련되는 회로패턴(112a)을 전기적으로 연결시킬 수 있다. 점퍼(130)는 서로 이격된 회로패턴(112a)을 전기적으로 연결시켜 회로패턴(112a) 배치의 효율을 증대시키고, 인쇄회로기판(110)의 생산성을 증대시킬 수 있다.The electronic device may include an electronic component 130 . The electronic component 130 may include a jumper 130 . The jumper 130 may electrically connect the plurality of circuit patterns 112a provided on the printed circuit board 110 . For example, the jumper 130 may electrically connect the circuit patterns 112a provided to be spaced apart from each other on the mounting layer 112 . The jumper 130 may electrically connect the circuit patterns 112a spaced apart from each other to increase the efficiency of disposing the circuit patterns 112a and increase the productivity of the printed circuit board 110 .

점퍼(130)는 몸체(131), 연장부(132), 접촉부(133), 삽입돌기(134)를 포함할 수 있다. 몸체(131)는 일 방향(예를 들어, Y방향)으로 연장될 수 있다. The jumper 130 may include a body 131 , an extension part 132 , a contact part 133 , and an insertion protrusion 134 . The body 131 may extend in one direction (eg, the Y direction).

연장부(132)는 몸체(131)의 길이 방향 단부로부터 절곡되어 연장될 수 있다. 예를 들어, 연장부(132)는 몸체(131)의 양 단에 각각 마련될 수 있다. 즉, 연장부(132)는 복수로 마련될 수 있다. 연장부(132)는 몸체(131)로부터 인쇄회로기판(110)의 실장층(112)을 향해 연장될 수 있다. 연장부(132)의 일단은 몸체(131)에 연결되고, 연장부(132)의 타단은 접촉부(133)에 연결될 수 있다.The extension part 132 may be bent and extended from the longitudinal end of the body 131 . For example, the extension 132 may be provided at both ends of the body 131 , respectively. That is, a plurality of extension parts 132 may be provided. The extension 132 may extend from the body 131 toward the mounting layer 112 of the printed circuit board 110 . One end of the extension part 132 may be connected to the body 131 , and the other end of the extension part 132 may be connected to the contact part 133 .

접촉부(133)는 인쇄회로기판(110)에 접촉될 수 있다. 예를 들어, 접촉부(133)는 인쇄회로기판(110)에 전기적으로 연결되도록 실장층(112)에 접촉될 수 있다. 접촉부(133)는 접촉면(133a)을 포함할 수 있다. 접촉면(133a)은 실장층(112)과 접촉될 수 있다. 예를 들어, 접촉면(133a)은 실장층(112) 상의 회로패턴(112a)과 접촉될 수 있다. The contact part 133 may be in contact with the printed circuit board 110 . For example, the contact part 133 may be in contact with the mounting layer 112 to be electrically connected to the printed circuit board 110 . The contact part 133 may include a contact surface 133a. The contact surface 133a may be in contact with the mounting layer 112 . For example, the contact surface 133a may contact the circuit pattern 112a on the mounting layer 112 .

접촉부(133)는 몸체(131)의 길이방향을 따라 연장될 수 있다. 예를 들어, 접촉부(133)는 Y방향으로 연장될 수 있다. 접촉부(133)는 제1연결부(135a)와 제2연결부(135b)를 포함할 수 있다. 제1연결부(135a)는 접촉부(133)의 길이 방향에 따른 일단에 마련될 수 있다. 제1연결부(135a)는 연장부(132)와 연결될 수 있다. 제2연결부(135b)는 접촉부(133)의 길이 방향에 따른 타단에 마련될 수 있다. 제2연결부(135b)는 삽입돌기(134)와 연결될 수 있다. 다만, 제1연결부(135a)와 제2연결부(135b)의 위치는 상기한 예에 제한되는 것은 아니다. The contact part 133 may extend along the longitudinal direction of the body 131 . For example, the contact portion 133 may extend in the Y direction. The contact part 133 may include a first connection part 135a and a second connection part 135b. The first connection part 135a may be provided at one end along the length direction of the contact part 133 . The first connection part 135a may be connected to the extension part 132 . The second connection part 135b may be provided at the other end along the longitudinal direction of the contact part 133 . The second connection part 135b may be connected to the insertion protrusion 134 . However, the positions of the first connection part 135a and the second connection part 135b are not limited to the above example.

제1연결부(135a)는 연장부(132)와 수직하게 연결될 수 있다. 제2연결부(135b)는 삽입돌기(134)와 수직하게 연결될 수 있다. 연결부(135)가 연장부(132) 또는 삽입돌기(134)와 수직하게 연결되지 않는 경우 보다 점퍼(130)가 차지하는 면적이 감소될 수 있고, 이에 따라 파워보드(100)의 공간 활용도가 증대될 수 있다.The first connection part 135a may be vertically connected to the extension part 132 . The second connection part 135b may be vertically connected to the insertion protrusion 134 . The area occupied by the jumper 130 may be reduced compared to when the connection part 135 is not vertically connected to the extension part 132 or the insertion protrusion 134 , and thus the space utilization of the power board 100 may be increased. can

연장부(132)의 폭(W1)은 접촉부(133)의 폭(W2) 보다 짧게 마련될 수 있다. 연장부(132)는 접촉부(133)와 연결되기 위해 필요한 두께만으로 형성될 수 있다. 이를 통해 점퍼(130)의 원가를 절감할 수 있다.The width W1 of the extension part 132 may be shorter than the width W2 of the contact part 133 . The extension part 132 may be formed only with a thickness necessary to be connected to the contact part 133 . Through this, the cost of the jumper 130 can be reduced.

삽입돌기(134)는 점퍼(130)가 인쇄회로기판(110)에 삽입될 수 있도록 인쇄회로기판(110)을 향해 돌출될 수 있다. 삽입돌기(134)는 접촉부(133)로부터 돌출될 수 있다. 삽입돌기(134)는 접촉부(133)의 바깥둘레로부터 인쇄회로기판(110)을 향해 돌출될 수 있다. 예를 들어, 삽입돌기(134)는 접촉부(133)의 길이 방향에 따른 타단으로부터 인쇄회로기판(110)을 향해 돌출될 수 있다. 삽입돌기(134)가 인쇄회로기판(110)에 삽입되었을 때 삽입돌기(134)는 절연층(111) 내부까지 삽입될 수 있다. 삽입돌기(134)는 리세스(111c) 내에 수용될 수 있다. 다만 이에 제한되는 것은 아니고 실장층(112)까지만 삽입될 수도 있다. 삽입돌기(134)는 점퍼(130)가 인쇄회로기판(110)에 고정되도록 할 수 있다. 삽입돌기(134)는 솔더링이 이루어지기 전 흔들림으로 인해 인쇄회로기판(110)에서 점퍼(130)가 이탈되는 것을 방지할 수 있다. The insertion protrusion 134 may protrude toward the printed circuit board 110 so that the jumper 130 can be inserted into the printed circuit board 110 . The insertion protrusion 134 may protrude from the contact part 133 . The insertion protrusion 134 may protrude toward the printed circuit board 110 from the outer periphery of the contact part 133 . For example, the insertion protrusion 134 may protrude toward the printed circuit board 110 from the other end in the longitudinal direction of the contact part 133 . When the insertion protrusion 134 is inserted into the printed circuit board 110 , the insertion protrusion 134 may be inserted up to the inside of the insulating layer 111 . The insertion protrusion 134 may be accommodated in the recess 111c. However, the present invention is not limited thereto, and only the mounting layer 112 may be inserted. The insertion protrusion 134 may allow the jumper 130 to be fixed to the printed circuit board 110 . The insertion protrusion 134 may prevent the jumper 130 from being separated from the printed circuit board 110 due to shaking before soldering is performed.

도 7은 본 발명의 또 다른 실시예에 따른 전자장치에서 점퍼(230)를 나타낸 사시도이다. 도 8은 도 7에 도시된 전자장치에서 점퍼(230)가 인쇄회로기판(110)에 실장된 모습을 나타낸 평면도이다7 is a perspective view illustrating a jumper 230 in an electronic device according to another embodiment of the present invention. 8 is a plan view illustrating a state in which the jumper 230 is mounted on the printed circuit board 110 in the electronic device shown in FIG. 7 .

도 7 및 도 8을 참조하면, 절연층(111)은 제1면(111a), 제2면(111b) 및 리세스(111c)를 포함할 수 있다. 제1면(111a)은 실장층(112)이 적층되는 면이 될 수 있다. 제2면(111b)은 제1면(111a)과 반대되는 측에 배치되는 면이 될 수 있다. 예를 들어, 제2면(111b)은 인쇄회로기판(110)의 외면이 될 수 있다. 제2면(111b)은 리어 섀시(12) 또는 절연지(140)와 마주할 수 있다. 예를 들어, 제2면(111b)은 리어 섀시(12) 또는 절연지(140)와 접촉될 수 있다. 리세스(111c)는 제1면(111a)으로부터 함몰될 수 있다. 리세스(111c)는 점퍼(230)의 삽입돌기(234)를 수용할 수 있다. 리세스(111c)는 삽입돌기(234)와 대응되어 형성될 수 있다. 예를 들어, 점퍼(230)의 삽입돌기(234)는 절연층(111) 내에 수용될 수 있다.7 and 8 , the insulating layer 111 may include a first surface 111a, a second surface 111b, and a recess 111c. The first surface 111a may be a surface on which the mounting layer 112 is stacked. The second surface 111b may be a surface disposed on a side opposite to the first surface 111a. For example, the second surface 111b may be the outer surface of the printed circuit board 110 . The second surface 111b may face the rear chassis 12 or the insulating paper 140 . For example, the second surface 111b may be in contact with the rear chassis 12 or the insulating paper 140 . The recess 111c may be recessed from the first surface 111a. The recess 111c may accommodate the insertion protrusion 234 of the jumper 230 . The recess 111c may be formed to correspond to the insertion protrusion 234 . For example, the insertion protrusion 234 of the jumper 230 may be accommodated in the insulating layer 111 .

전자장치는 전자부품(230)을 포함할 수 있다. 전자부품(230)은 점퍼(230)를 포함할 수 있다. 점퍼(230)는 실장층(112) 상에 마련될 수 있다. 점퍼(230)는 실장층(112) 상에서 서로 이격되어 마련되는 회로패턴(112a)을 전기적으로 연결시킬 수 있다.The electronic device may include an electronic component 230 . The electronic component 230 may include a jumper 230 . The jumper 230 may be provided on the mounting layer 112 . The jumper 230 may electrically connect the circuit patterns 112a provided to be spaced apart from each other on the mounting layer 112 .

점퍼(230)는 몸체(231), 연장부(232), 접촉부(233), 삽입돌기(234)를 포함할 수 있다. 몸체(231)는 일 방향으로 연장될 수 있다. The jumper 230 may include a body 231 , an extension part 232 , a contact part 233 , and an insertion protrusion 234 . The body 231 may extend in one direction.

연장부(232)는 몸체(231)의 길이 방향 단부로부터 절곡되어 연장될 수 있다. 연장부(232)는 몸체(231)의 양 단에 각각 마련될 수 있다. 즉, 연장부(232)는 복수로 마련될 수 있다. 연장부(232)는 몸체(231)로부터 인쇄회로기판(110)을 향해 연장될 수 있다. 연장부(232)의 일단은 몸체(231)에 연결되고, 연장부(232)의 타단은 접촉부(233)에 연결될 수 있다.The extension 232 may be bent and extended from the longitudinal end of the body 231 . The extension 232 may be provided at both ends of the body 231 , respectively. That is, a plurality of extension parts 232 may be provided. The extension 232 may extend from the body 231 toward the printed circuit board 110 . One end of the extension part 232 may be connected to the body 231 , and the other end of the extension part 232 may be connected to the contact part 233 .

접촉부(233)는 인쇄회로기판(110)에 접촉될 수 있다. 예를 들어, 접촉부(233)는 인쇄회로기판(110)에 전기적으로 연결되도록 실장층(112)과 접촉될 수 있다. 접촉부(233)는 접촉면(233a)을 포함할 수 있다. 접촉면(233a)은 실장층(112)과 접촉될 수 있다. 접촉부(233)는 회로패턴(112a)과 접촉될 수 있다. 예를 들어, 접촉면(233a)은 실장층(112) 상의 회로패턴(112a)과 접촉될 수 있다. The contact part 233 may be in contact with the printed circuit board 110 . For example, the contact part 233 may be in contact with the mounting layer 112 to be electrically connected to the printed circuit board 110 . The contact portion 233 may include a contact surface 233a. The contact surface 233a may be in contact with the mounting layer 112 . The contact part 233 may be in contact with the circuit pattern 112a. For example, the contact surface 233a may contact the circuit pattern 112a on the mounting layer 112 .

삽입돌기(234)는 점퍼(230)가 인쇄회로기판(110)에 삽입될 수 있도록 인쇄회로기판(110)을 향해 돌출될 수 있다. 삽입돌기(234)는 접촉부(233)로부터 돌출될 수 있다. 삽입돌기(234)는 접촉부(233)의 바깥둘레로부터 실장층(112)을 향해 돌출될 수 있다. 예를 들어, 삽입돌기(234)는 접촉부(233)의 타단으로부터 인쇄회로기판(110)을 향해 돌출될 수 있다. 삽입돌기(234)가 인쇄회로기판(110)에 삽입되었을 때 삽입돌기(234)는 절연층(111) 내부까지 삽입될 수 있다. 삽입돌기(234)는 리세스(111c) 내에 수용될 수 있다. 다만 이에 제한되는 것은 아니고 실장층(112)까지만 삽입될 수도 있다. The insertion protrusion 234 may protrude toward the printed circuit board 110 so that the jumper 230 can be inserted into the printed circuit board 110 . The insertion protrusion 234 may protrude from the contact portion 233 . The insertion protrusion 234 may protrude from the outer periphery of the contact part 233 toward the mounting layer 112 . For example, the insertion protrusion 234 may protrude toward the printed circuit board 110 from the other end of the contact part 233 . When the insertion protrusion 234 is inserted into the printed circuit board 110 , the insertion protrusion 234 may be inserted into the insulating layer 111 . The insertion protrusion 234 may be accommodated in the recess 111c. However, the present invention is not limited thereto, and only the mounting layer 112 may be inserted.

도 9는 본 발명의 또 다른 실시예에 따른 전자장치에서 점퍼(530)가 인쇄회로기판(110)에 실장된 모습을 도시한 사시도이다.9 is a perspective view illustrating a state in which a jumper 530 is mounted on a printed circuit board 110 in an electronic device according to another embodiment of the present invention.

도 9를 참조하면, 전자장치는 전자부품(530)을 포함할 수 있다. 전자부품(530)은 점퍼(530)를 포함할 수 있다. 점퍼(530)는 인쇄회로기판(110) 상에 실장될 수 있다. Referring to FIG. 9 , the electronic device may include an electronic component 530 . The electronic component 530 may include a jumper 530 . The jumper 530 may be mounted on the printed circuit board 110 .

도 10은 본 발명의 또 다른 실시예에 따른 전자장치에서 전자부품(330)이 인쇄회로기판(110)에 실장된 모습을 도시한 사시도이다. 도 11은 도 10에 도시된 전자장치에서 전자부품(330)이 인쇄회로기판(110)에 실장된 모습을 나타낸 평면도이다10 is a perspective view illustrating a state in which an electronic component 330 is mounted on a printed circuit board 110 in an electronic device according to another embodiment of the present invention. 11 is a plan view illustrating a state in which the electronic component 330 is mounted on the printed circuit board 110 in the electronic device shown in FIG. 10 .

도 10 및 도 11을 참조하면, 본 발명의 일 실시예에 따르면, 인쇄회로기판(110)은 제1인쇄회로기판(110)이 될 수 있다. 전자장치는 제2인쇄회로기판(120)과, 연결부재(150)와, 전자부품(330)을 포함할 수 있다. 10 and 11 , according to an embodiment of the present invention, the printed circuit board 110 may be the first printed circuit board 110 . The electronic device may include a second printed circuit board 120 , a connection member 150 , and an electronic component 330 .

전자부품(330)은 커패시터가 될 수 있다. 다만, 전자부품(330)은 상기한 예에 제한되지 않는다. 전자부품(330)은 몸체(331)와 전극 와이어(332)를 포함할 수 있다. 전극 와이어(332)는 전자부품(330)이 제2인쇄회로기판(120)에 전기적으로 연결되도록 제2인쇄회로기판(120)과 전기적으로 연결될 수 있다. The electronic component 330 may be a capacitor. However, the electronic component 330 is not limited to the above example. The electronic component 330 may include a body 331 and an electrode wire 332 . The electrode wire 332 may be electrically connected to the second printed circuit board 120 such that the electronic component 330 is electrically connected to the second printed circuit board 120 .

제2인쇄회로기판(120)은 제1인쇄회로기판(110)과 접촉될 수 있다. 예를 들어, 제2인쇄회로기판(120)은 제1인쇄회로기판(110)과 수직하게 연장되어 제1인쇄회로기판(110)과 접촉될 수 있다. 제2인쇄회로기판(120)은 전자부품(330)의 전극 와이어(332)와 전기적으로 연결될 수 있다.The second printed circuit board 120 may be in contact with the first printed circuit board 110 . For example, the second printed circuit board 120 may extend perpendicularly to the first printed circuit board 110 to be in contact with the first printed circuit board 110 . The second printed circuit board 120 may be electrically connected to the electrode wire 332 of the electronic component 330 .

제2인쇄회로기판(120)은 실장층(122)과 절연층(121)을 포함할 수 있다. 절연층(121)은 전자부품 몸체(331)와 마주하는 방향에 배치될 수 있다. 실장층(122)은 연결부재(150)와 접촉되도록 연결부재(150)와 마주보는 방향에 배치될 수 있다. 다만 실장층(122)과 절연층(121)의 배치는 상기한 예에 제한되지 않는다.The second printed circuit board 120 may include a mounting layer 122 and an insulating layer 121 . The insulating layer 121 may be disposed in a direction facing the electronic component body 331 . The mounting layer 122 may be disposed in a direction facing the connecting member 150 so as to be in contact with the connecting member 150 . However, the arrangement of the mounting layer 122 and the insulating layer 121 is not limited to the above example.

연결부재(150)는 제1인쇄회로기판(110)과 제2인쇄회로기판(120)이 전기적으로 연결되도록 제1인쇄회로기판(110) 및 제2인쇄회로기판(120)과 각각 결합될 수 있다. 예를 들어, 연결부재(150)는 제1인쇄회로기판(110)의 실장층(112) 및 제2인쇄회로기판(120)의 실장층(122)과 각각 결합될 수 있다. 연결부재(150)는 제1인쇄회로기판(110)의 실장층(112) 및 제2인쇄회로기판(120)의 실장층(122)에 접촉될 수 있다. 연결부재(150)는 제1인쇄회로기판(110)의 실장층(112) 및 제2인쇄회로기판(120)의 실장층(122)에 각각 솔더링 될 수 있다. 예를 들어, 연결부재(150)는 각 실장층(112, 122) 상에 마련되는 회로패턴(미도시)과 각각 전기적으로 연결될 수 있다.The connection member 150 may be respectively coupled to the first printed circuit board 110 and the second printed circuit board 120 so that the first printed circuit board 110 and the second printed circuit board 120 are electrically connected. have. For example, the connection member 150 may be coupled to the mounting layer 112 of the first printed circuit board 110 and the mounting layer 122 of the second printed circuit board 120 , respectively. The connection member 150 may contact the mounting layer 112 of the first printed circuit board 110 and the mounting layer 122 of the second printed circuit board 120 . The connection member 150 may be respectively soldered to the mounting layer 112 of the first printed circuit board 110 and the mounting layer 122 of the second printed circuit board 120 . For example, the connection member 150 may be electrically connected to a circuit pattern (not shown) provided on each of the mounting layers 112 and 122 .

또한, 연결부재(150)는 제1인쇄회로기판(110) 및 제2인쇄회로기판(120)과 각각 전기적으로 연결되도록 금속으로 마련될 수 있다. Also, the connecting member 150 may be made of metal to be electrically connected to the first printed circuit board 110 and the second printed circuit board 120 , respectively.

따라서, 연결부재(150)는 제1인쇄회로기판(110)과 제2인쇄회로기판(120)을 물리적으로 결합시키면서 동시에 전기적으로도 연결시킬 수 있는 효과가 있다.Accordingly, the connecting member 150 has an effect of physically connecting the first printed circuit board 110 and the second printed circuit board 120 while also electrically connecting the first printed circuit board 110 .

연결부재(150)는 복수로 마련될 수 있다. 복수의 연결부재(150)는 제1연결부재(151)와 제2연결부재(152)를 포함할 수 있다. 제1연결부재(151)와 제2연결부재(152)는 서로 전위차를 갖도록 마련될 수 있다. 제1연결부재(151)와 제2연결부재(152)는 서로 이격되어 배치될 수 있다. 다만 제1연결부재(151)와 제2연결부재(152)의 배치는 이에 제한되는 것은 아니다. A plurality of connection members 150 may be provided. The plurality of connection members 150 may include a first connection member 151 and a second connection member 152 . The first connection member 151 and the second connection member 152 may be provided to have a potential difference with each other. The first connecting member 151 and the second connecting member 152 may be disposed to be spaced apart from each other. However, the arrangement of the first connecting member 151 and the second connecting member 152 is not limited thereto.

연결부재(150)는 제1인쇄회로기판(110)과 접촉되는 제1접속부(151a, 152a)와, 제2인쇄회로기판(120)과 접촉되는 제2접속부(151b, 152b)를 포함할 수 있다. 제1접속부(151a, 152a)는 제1인쇄회로기판(110)과 전기적으로 연결될 수 있고, 제2접속부(151b, 152b)는 제2인쇄회로기판(120)과 전기적으로 연결될 수 있다. 제1접속부(151a, 152a)와 제2접속부(151b, 152b)를 통해 제1인쇄회로기판(110)과 제2인쇄회로기판(120)이 전기적으로 연결될 수 있다.The connecting member 150 may include first connecting portions 151a and 152a in contact with the first printed circuit board 110 and second connecting portions 151b and 152b in contact with the second printed circuit board 120 . have. The first connecting portions 151a and 152a may be electrically connected to the first printed circuit board 110 , and the second connecting portions 151b and 152b may be electrically connected to the second printed circuit board 120 . The first printed circuit board 110 and the second printed circuit board 120 may be electrically connected to each other through the first connecting portions 151a and 152a and the second connecting portions 151b and 152b.

제1연결부재(151)는 제1접속부(151a)와 제2접속부(151b)를 포함할 수 있다. 제2연결부재(152)는 제1접속부(152a)와 제2접속부(152b)를 포함할 수 있다.The first connection member 151 may include a first connection part 151a and a second connection part 151b. The second connection member 152 may include a first connection part 152a and a second connection part 152b.

연결부재(150)의 크기 및 형상은 도시된 바에 제한되지 않고 다양한 크기 및 형상으로 형성될 수 있다.The size and shape of the connecting member 150 is not limited to the illustrated bar and may be formed in various sizes and shapes.

절연지(140)는 제1인쇄회로기판(110)과 리어 섀시(12)의 사이에 배치될 수 있다. 다만, 이에 제한되는 것은 아니고 절연지(140)는 생략될 수도 있다.The insulating paper 140 may be disposed between the first printed circuit board 110 and the rear chassis 12 . However, the present invention is not limited thereto and the insulating paper 140 may be omitted.

도 12는 본 발명의 또 다른 실시예에 따른 전자장치에서 전자부품(330)이 인쇄회로기판(110)에 실장된 모습을 도시한 사시도이다.12 is a perspective view illustrating an electronic component 330 mounted on a printed circuit board 110 in an electronic device according to another embodiment of the present invention.

도 12를 참조하면, 전자장치는 연결부재(150)와, 전자부품(330)을 포함할 수 있다. Referring to FIG. 12 , the electronic device may include a connection member 150 and an electronic component 330 .

제2인쇄회로기판(120)은 실장층(122)과 절연층(121)을 포함할 수 있다. 도 11에 도시된 바와 달리, 실장층(122)은 전자부품 몸체(331)와 마주하는 방향에 배치될 수 있다. 절연층(121)은 몸체(331)와 마주하지 않는 면에 배치될 수 있다. 실장층(122)은 연결부재(150)와 접촉되고 연결부재(150)와 전기적으로 연결될 수 있다. The second printed circuit board 120 may include a mounting layer 122 and an insulating layer 121 . 11 , the mounting layer 122 may be disposed in a direction facing the electronic component body 331 . The insulating layer 121 may be disposed on a surface that does not face the body 331 . The mounting layer 122 may be in contact with the connecting member 150 and may be electrically connected to the connecting member 150 .

도 13은 본 발명의 또 다른 실시예에 따른 전자장치에서 전자부품(430)이 인쇄회로기판(110)에 실장된 모습을 도시한 사시도이다.13 is a perspective view illustrating a state in which an electronic component 430 is mounted on a printed circuit board 110 in an electronic device according to another embodiment of the present invention.

도 13을 참조하면, 전자장치는 전자부품(430)을 포함할 수 있다. 전자부품(430)은 NTC 센서가 될 수 있다. 다만, 전자부품(430)은 상기한 예에 제한되지 않는다. Referring to FIG. 13 , the electronic device may include an electronic component 430 . The electronic component 430 may be an NTC sensor. However, the electronic component 430 is not limited to the above example.

전자부품(430)은 몸체(431)와 전극 와이어(432)를 포함할 수 있다. 전극 와이어(432)는 전자부품(430)이 제2인쇄회로기판(120)에 전기적으로 연결되도록 제2인쇄회로기판(120)과 전기적으로 연결될 수 있다. The electronic component 430 may include a body 431 and an electrode wire 432 . The electrode wire 432 may be electrically connected to the second printed circuit board 120 such that the electronic component 430 is electrically connected to the second printed circuit board 120 .

제2인쇄회로기판(120)은 제1인쇄회로기판(110)에 삽입되도록 결합부(123)를 포함할 수 있다.The second printed circuit board 120 may include a coupling part 123 to be inserted into the first printed circuit board 110 .

연결부재(151, 152)는 제1인쇄회로기판(110)과 제2인쇄회로기판(120)이 전기적으로 연결되도록 제1인쇄회로기판(110) 및 제2인쇄회로기판(120)과 각각 결합될 수 있다. 연결부재(151, 152)는 제1인쇄회로기판(110)의 실장층(112) 및 제2인쇄회로기판(120)의 실장층(122) 솔더링 될 수 있다.The connecting members 151 and 152 are respectively coupled to the first printed circuit board 110 and the second printed circuit board 120 so that the first printed circuit board 110 and the second printed circuit board 120 are electrically connected to each other. can be The connection members 151 and 152 may be soldered to the mounting layer 112 of the first printed circuit board 110 and the mounting layer 122 of the second printed circuit board 120 .

도 14는 본 발명의 또 다른 실시예에 따른 전자장치에서 전자부품(430)이 인쇄회로기판(110)에 실장되는 모습을 도시한 분해 사시도이다. 도 15는 도 14에 도시된 전자장치에서 전자부품(430)이 인쇄회로기판(110)에 실장된 모습을 도시한 사시도이다.14 is an exploded perspective view illustrating a state in which an electronic component 430 is mounted on a printed circuit board 110 in an electronic device according to another embodiment of the present invention. 15 is a perspective view illustrating a state in which the electronic component 430 is mounted on the printed circuit board 110 in the electronic device shown in FIG. 14 .

도 14 및 도 15를 참조하면, 인쇄회로기판(110)은 복수의 홀을 포함할 수 있다. 복수의 홀은 실장 홀(113)과 결합 홀(114)을 포함할 수 있다. 실장 홀(113)은 전자부품(430)이 인쇄회로기판(110)에 안착되어 실장되도록 마련될 수 있다. 결합 홀(114)은 후술하는 홀더(160)와 결합될 수 있다.14 and 15 , the printed circuit board 110 may include a plurality of holes. The plurality of holes may include a mounting hole 113 and a coupling hole 114 . The mounting hole 113 may be provided so that the electronic component 430 is mounted on the printed circuit board 110 . The coupling hole 114 may be coupled to a holder 160 to be described later.

전자장치는 전자부품(430)과, 홀더(160)를 포함할 수 있다. 전자부품(430)은 몸체(431), 전극 와이어(432), 단자(433)를 포함할 수 있다. The electronic device may include an electronic component 430 and a holder 160 . The electronic component 430 may include a body 431 , an electrode wire 432 , and a terminal 433 .

전극 와이어(432)는 몸체(431)로부터 돌출될 수 있다. 예를 들어, 전극 와이어(432)는 몸체(431)의 외주면으로부터 돌출될 수 있다. 전극 와이어(432)는 제1부분(432a)과 제2부분(432b)을 포함할 수 있다. 제1부분(432a)과 제2부분(432b)은 서로 단차를 가지도록 마련될 수 있다. The electrode wire 432 may protrude from the body 431 . For example, the electrode wire 432 may protrude from the outer peripheral surface of the body 431 . The electrode wire 432 may include a first portion 432a and a second portion 432b. The first portion 432a and the second portion 432b may be provided to have a step difference from each other.

단자(433)는 전극 와이어(432)의 일단에 마련될 수 있다. 예를 들어, 단자(433)는 제2부분(432b)과 연결될 수 있다. 단자(433)는 실장 홀(113)에 안착될 수 있다. 파워보드(100) 및 전자장치(1)의 제조 공정시에 제조 장비의 흔들림이 발생할 수 있는데, 실장 홀(113)로 인해 전자부품(430)이 이탈되지 않도록 할 수 있다.The terminal 433 may be provided at one end of the electrode wire 432 . For example, the terminal 433 may be connected to the second portion 432b. The terminal 433 may be seated in the mounting hole 113 . During the manufacturing process of the power board 100 and the electronic device 1 , shaking of manufacturing equipment may occur, and the electronic component 430 may not be separated due to the mounting hole 113 .

홀더(160)는 파워보드(100) 및 전자장치(1)의 제조 공정시에 단자(433)가 실장 홀(113)에서 이탈되지 않도록 단자(433)를 고정시킬 수 있다. 홀더(160)는 단자(433)의 일측에서 단자(433)를 커버할 수 있다. 예를 들어, 단자(433)는 Z방향을 따라 홀더(160)와 인쇄회로기판(110)의 사이에 배치될 수 있다. 홀더(160)는 전극 와이어(432)를 가압하여 전자부품(430)이 인쇄회로기판(110)에 고정되도록 할 수 있다. 예를 들어, 홀더(160)는 전극 와이어(432)의 제2부분(432b)을 가압할 수 있다. 다만 이에 제한되는 것은 아니다.The holder 160 may fix the terminal 433 so that the terminal 433 is not separated from the mounting hole 113 during the manufacturing process of the power board 100 and the electronic device 1 . The holder 160 may cover the terminal 433 from one side of the terminal 433 . For example, the terminal 433 may be disposed between the holder 160 and the printed circuit board 110 in the Z direction. The holder 160 may press the electrode wire 432 so that the electronic component 430 is fixed to the printed circuit board 110 . For example, the holder 160 may press the second portion 432b of the electrode wire 432 . However, the present invention is not limited thereto.

홀더(160)는 커버부(161), 결합돌기(162), 고정돌기(163)를 포함할 수 있다. 커버부(161)는 제1부분(161a)과 제2부분(161b)을 포함할 수 있다. 제1부분(161a)은 단자(433)를 Z축 방향으로 커버하도록 일 방향으로 연장될 수 있다. 제2부분(161b)은 제1부분(161a)으로부터 -Z축 방향으로 절곡되어 단자(433)를 커버할 수 있다. The holder 160 may include a cover part 161 , a coupling protrusion 162 , and a fixing protrusion 163 . The cover part 161 may include a first part 161a and a second part 161b. The first portion 161a may extend in one direction to cover the terminal 433 in the Z-axis direction. The second portion 161b may be bent from the first portion 161a in the -Z axis direction to cover the terminal 433 .

결합돌기(162)는 커버부(161)의 단부로부터 돌출될 수 있다. 결합돌기(162)는 복수로 마련될 수 있다. 복수의 결합돌기(162)는 커버부(161)의 양단으로부터 각각 돌출될 수 있다. 결합돌기(162)는 제2부분(161b)으로부터 인쇄회로기판(110)을 향해 돌출될 수 있다. 결합돌기(162)는 인쇄회로기판(110)의 결합 홀(114)에 결합될 수 있다.The coupling protrusion 162 may protrude from an end of the cover part 161 . A plurality of coupling protrusions 162 may be provided. The plurality of coupling protrusions 162 may respectively protrude from both ends of the cover part 161 . The coupling protrusion 162 may protrude from the second portion 161b toward the printed circuit board 110 . The coupling protrusion 162 may be coupled to the coupling hole 114 of the printed circuit board 110 .

결합돌기(162)의 일단은 제2부분(161b)에 연결되고, 결합돌기(162)의 타단에는 고정돌기(163)가 마련될 수 있다. 홀더(160)가 인쇄회로기판(110)에 결합되었을 때, 홀더(160)가 인쇄회로기판(110)으로 빠지지 않도록 고정돌기(163)가 마련될 수 있다. 고정돌기(163)는 결합돌기(162)의 타단으로부터 X방향 또는 -X방향으로 돌출될 수 있다. 예를 들어, 고정돌기(163)는 홀더(160)의 외측을 향해 돌출될 수 있다. 고정돌기(163)는 인쇄회로기판(110)과 접촉하여 홀더(160)가 인쇄회로기판(110)으로부터 빠지지 않도록 할 수 있다. One end of the coupling protrusion 162 may be connected to the second portion 161b, and a fixing protrusion 163 may be provided at the other end of the coupling protrusion 162 . When the holder 160 is coupled to the printed circuit board 110 , the fixing protrusion 163 may be provided so that the holder 160 does not fall into the printed circuit board 110 . The fixing protrusion 163 may protrude from the other end of the coupling protrusion 162 in the X direction or the -X direction. For example, the fixing protrusion 163 may protrude toward the outside of the holder 160 . The fixing protrusion 163 may contact the printed circuit board 110 to prevent the holder 160 from being removed from the printed circuit board 110 .

인쇄회로기판(110)은 실장층(112)과 절연층(111)을 포함할 수 있다. 절연층(111)과 실장층(112)은 Z방향을 따라 순차적으로 적층될 수 있다. 예를 들어, 결합돌기(162)와 고정돌기(163)는 실장층(112)과 절연층(111)을 순차적으로 거쳐 인쇄회로기판(110)을 관통할 수 있다. 홀더(160)가 인쇄회로기판(110)에 결합되면, 몸체(431)는 실장층(112)에 접촉되고, 고정돌기(163)는 절연층(111)에 접촉될 수 있다.The printed circuit board 110 may include a mounting layer 112 and an insulating layer 111 . The insulating layer 111 and the mounting layer 112 may be sequentially stacked along the Z direction. For example, the coupling protrusion 162 and the fixing protrusion 163 may pass through the printed circuit board 110 sequentially through the mounting layer 112 and the insulating layer 111 . When the holder 160 is coupled to the printed circuit board 110 , the body 431 may contact the mounting layer 112 , and the fixing protrusion 163 may contact the insulating layer 111 .

도 15에 도시된 바와 같이, 단자(433)가 홀더(160) 및 실장 홀(113)에 의해 고정되었을 때, 단자(433)는 실장층(112)에 솔더링 될 수 있다. 예를 들어, 파워보드(100)의 제조공정시 단자(433)에 인접하게 솔더 크림을 도포하고, 홀더(160) 및 단자(433) 쪽으로 열을 가하여 솔더링 공정을 진행할 수 있다. 홀더(160)의 재질은 홀더(160) 내부로 열전달이 가능하고 녹는점이 높은 재질이면 가능할 수 있다.15 , when the terminal 433 is fixed by the holder 160 and the mounting hole 113 , the terminal 433 may be soldered to the mounting layer 112 . For example, in the manufacturing process of the power board 100 , solder cream may be applied adjacent to the terminal 433 , and heat may be applied to the holder 160 and the terminal 433 to perform the soldering process. The material of the holder 160 may be a material capable of transferring heat to the inside of the holder 160 and having a high melting point.

도 16은 본 발명의 또 다른 실시예에 따른 전자장치에서 전자부품(430)이 인쇄회로기판(110)에 실장된 모습을 도시한 사시도이다. 도 17은 도 16에 도시된 전자장치에서 전자부품(430)이 인쇄회로기판(110)에 실장된 모습을 도시한 사시도이다.16 is a perspective view illustrating a state in which an electronic component 430 is mounted on a printed circuit board 110 in an electronic device according to another embodiment of the present invention. 17 is a perspective view illustrating a state in which the electronic component 430 is mounted on the printed circuit board 110 in the electronic device shown in FIG. 16 .

도 16을 참조하면, 홀더(160)와 인쇄회로기판(110)의 사이에는 단자(433) 및/또는 전극 와이어(432)가 배치될 수 있다. 이에 따라, 단자(433) 및/또는 전극 와이어(432)는 제조공정 중 흔들림에 의해 실장 위치에서 이탈되지 않을 수 있다. 도 16에서 단자(433)는 홀더(160)에 의해 가려져 노출되지 않았다.Referring to FIG. 16 , a terminal 433 and/or an electrode wire 432 may be disposed between the holder 160 and the printed circuit board 110 . Accordingly, the terminal 433 and/or the electrode wire 432 may not be separated from the mounting position due to shaking during the manufacturing process. In FIG. 16 , the terminal 433 is not exposed because it is covered by the holder 160 .

도 17을 참조하면, 단자(433)와 인쇄회로기판(110) 간의 솔더링이 완료된 모습을 볼 수 있다. 단자(433)의 외측에는 솔더링부(434)가 마련될 수 있다. 단자(433)가 인쇄회로기판(110)에 솔더링이 완료된 후 홀더(160)는 제거될 수 있다. 다만, 이에 제한되는 것은 아니고 홀더(160)가 제거되지 않을 수도 있다.Referring to FIG. 17 , it can be seen that soldering between the terminal 433 and the printed circuit board 110 is completed. A soldering part 434 may be provided outside the terminal 433 . After soldering of the terminals 433 to the printed circuit board 110 is completed, the holder 160 may be removed. However, the present invention is not limited thereto and the holder 160 may not be removed.

이상에서는 특정의 실시예에 대하여 도시하고 설명하였다. 그러나, 상기한 실시예에만 한정되지 않으며, 발명이 속하는 기술분야에서 통상의 지식을 가진 자라면 이하의 청구범위에 기재된 발명의 기술적 사상의 요지를 벗어남이 없이 얼마든지 다양하게 변경 실시할 수 있을 것이다.In the above, specific embodiments have been shown and described. However, it is not limited to the above embodiments, and those of ordinary skill in the art to which the invention pertains can make various changes without departing from the spirit of the invention described in the claims below. .

Claims (15)

제1면과 상기 제1면과 반대되는 측에 배치되는 제2면을 포함하는 절연층과, 상기 절연층의 제1면 상에 적층되는 실장층으로, 서로 이격되는 복수의 회로패턴이 마련되는 실장층을 포함하는 인쇄회로기판; 및An insulating layer including a first surface and a second surface disposed on a side opposite to the first surface, and a mounting layer laminated on the first surface of the insulation layer, wherein a plurality of circuit patterns spaced apart from each other are provided a printed circuit board including a mounting layer; and 상기 복수의 회로패턴을 전기적으로 연결시키도록 상기 실장층 상에 배치되어 상기 복수의 회로패턴과 각각 접속되는 점퍼를 포함하고,and a jumper disposed on the mounting layer to electrically connect the plurality of circuit patterns and respectively connected to the plurality of circuit patterns, 상기 점퍼는,The jumper is 상기 점퍼는 일 방향으로 연장되는 몸체; The jumper includes a body extending in one direction; 상기 몸체로부터 상기 실장층을 향해 연장되는 연장부;an extension extending from the body toward the mounting layer; 상기 복수의 회로패턴과 전기적으로 연결되도록 상기 연장부의 일단에 마련되어 상기 실장층과 접촉하는 접촉부; 및a contact portion provided at one end of the extension portion to be electrically connected to the plurality of circuit patterns and in contact with the mounting layer; and 상기 접촉부의 바깥둘레로부터 상기 인쇄회로기판을 향해 돌출되며, 상기 절연층의 제2면에 대해 돌출되지 않도록 상기 인쇄회로기판 내에 삽입되는 삽입돌기;를 포함하는 전자장치.and an insertion protrusion protruding from the outer periphery of the contact portion toward the printed circuit board and inserted into the printed circuit board so as not to protrude from the second surface of the insulating layer. 제1항에 있어서,According to claim 1, 상기 접촉부는 상기 몸체의 길이방향을 따라 연장되고,The contact portion extends along the longitudinal direction of the body, 상기 접촉부는 상기 접촉부의 연장방향에 따른 일단에서 상기 연장부와 연결되는 제1연결부와, 상기 접촉부의 접촉부의 연장방향에 따른 타단에서 상기 삽입돌기와 연결되는 제2연결부를 포함하는 전자장치.The electronic device comprising: a first connection part connected to the extension part at one end of the contact part along an extending direction of the contact part; and a second connection part connected to the insertion protrusion at the other end along the extension direction of the contact part of the contact part. 제2항에 있어서,3. The method of claim 2, 상기 연장부는 상기 몸체의 길이방향에 따른 일단에서 상기 실장층을 향해 상기 몸체의 길이방향과 수직하게 연장되고, The extension portion extends perpendicularly to the longitudinal direction of the body from one end along the longitudinal direction of the body toward the mounting layer, 상기 삽입돌기는 상기 제2연결부로부터 상기 몸체의 길이방향과 수직한 방향으로 돌출되는 전자장치.The insertion protrusion protrudes from the second connection part in a direction perpendicular to the longitudinal direction of the body. 제1항에 있어서,According to claim 1, 상기 인쇄회로기판은 제1인쇄회로기판이고,The printed circuit board is a first printed circuit board, 상기 전자장치는,The electronic device is 상기 제1인쇄회로기판에 전기적으로 연결되도록 전극 와이어를 갖고, 상기 실장층 상에 배치되는 전자부품(Electronic part);an electronic part having an electrode wire to be electrically connected to the first printed circuit board and disposed on the mounting layer; 상기 전극 와이어와 전기적으로 연결되고, 상기 제1인쇄회로기판과 접촉되는 제2인쇄회로기판; 및a second printed circuit board electrically connected to the electrode wire and in contact with the first printed circuit board; and 상기 제1인쇄회로기판과 제2인쇄회로기판을 전기적으로 연결시키도록 상기 제1인쇄회로기판 및 제2인쇄회로기판에 각각 결합되는 연결부재;를 더 포함하는 전자장치.and connecting members respectively coupled to the first printed circuit board and the second printed circuit board to electrically connect the first printed circuit board and the second printed circuit board. 제4항에 있어서,5. The method of claim 4, 상기 연결부재는,The connecting member is 상기 제1인쇄회로기판에 접촉되는 제1접속부와, 상기 제1접속부로부터 절곡되며 상기 제2인쇄회로기판에 접촉되는 제2접속부를 포함하는 전자장치.An electronic device comprising: a first connection part contacting the first printed circuit board; and a second connection part bent from the first connection part and contacting the second printed circuit board. 제5항에 있어서,6. The method of claim 5, 상기 제2인쇄회로기판은 절연층과, 상기 제2접속부와 전기적으로 연결되도록 상기 절연층에 적층되는 실장층을 포함하고,The second printed circuit board includes an insulating layer and a mounting layer laminated on the insulating layer to be electrically connected to the second connection part, 상기 제1접속부는 상기 제1인쇄회로기판의 실장층과 접촉되고, 상기 제2접속부는 상기 제2인쇄회로기판의 실장층과 접촉되는 전자장치.The first connection part is in contact with the mounting layer of the first printed circuit board, and the second connection part is in contact with the mounting layer of the second printed circuit board. 제6항에 있어서,7. The method of claim 6, 상기 연결부재는 복수로 마련되고,The connecting member is provided in plurality, 상기 복수의 연결부재는 서로 전위차를 갖도록 마련되는 전자장치.The plurality of connection members are provided to have a potential difference with each other. 제1항에 있어서,According to claim 1, 상기 인쇄회로기판은 실장 홀을 포함하고,The printed circuit board includes a mounting hole, 상기 전자장치는, The electronic device is 상기 실장층 상에 배치되는 전자부품으로 상기 인쇄회로기판에 전기적으로 연결되도록 전극 와이어와, 상기 실장 홀에 삽입되도록 상기 전극 와이어의 일단에 마련되는 단자를 포함하는 전자부품; 및an electronic component disposed on the mounting layer, the electronic component including an electrode wire to be electrically connected to the printed circuit board, and a terminal provided at one end of the electrode wire to be inserted into the mounting hole; and 상기 단자를 상기 실장 홀에 고정시키도록 상기 전극 와이어를 가압하는 홀더;를 더 포함하는 전자장치.and a holder for pressing the electrode wire to fix the terminal to the mounting hole. 제8항에 있어서,9. The method of claim 8, 상기 인쇄회로기판은 상기 홀더와 결합되도록 마련되는 결합 홀을 더 포함하고,The printed circuit board further includes a coupling hole provided to be coupled to the holder, 상기 홀더는,The holder is 상기 단자를 커버하도록 일 방향으로 연장되는 커버부; a cover part extending in one direction to cover the terminal; 상기 홀더가 상기 결합 홀과 결합되도록 상기 커버부의 양단으로부터 상기 실장층을 향해 돌출되는 복수의 결합돌기; 및a plurality of coupling protrusions protruding toward the mounting layer from both ends of the cover so that the holder is coupled to the coupling hole; and 상기 홀더가 결합되었을 때 상기 복수의 결합돌기가 상기 인쇄회로기판에 고정되도록 마련되는 고정돌기로, 상기 복수의 결합돌기 각각의 일단으로부터 상기 커버부의 외측을 향해 돌출되는 복수의 고정돌기;를 포함하는 전자장치.A plurality of fixing projections provided to be fixed to the printed circuit board when the holder is coupled, a plurality of fixing projections protruding from one end of each of the plurality of coupling projections toward the outside of the cover; including; electronics. 제1항에 있어서,According to claim 1, 상기 인쇄회로기판은 제1인쇄회로기판이고,The printed circuit board is a first printed circuit board, 상기 전자장치는,The electronic device is 상기 제1인쇄회로기판에 전기적으로 연결되도록 전극 와이어를 갖고, 상기 실장층 상에 배치되는 전자부품(Electronic part);an electronic part having an electrode wire to be electrically connected to the first printed circuit board and disposed on the mounting layer; 상기 전극 와이어와 전기적으로 연결되고, 상기 제1인쇄회로기판과 접촉되는 제2인쇄회로기판; 및a second printed circuit board electrically connected to the electrode wire and in contact with the first printed circuit board; and 상기 제1인쇄회로기판과 제2인쇄회로기판을 전기적으로 연결시키도록 상기 제1인쇄회로기판 및 제2인쇄회로기판에 각각 결합되는 연결부재로서, 상기 제1인쇄회로기판에 접촉되는 제1접속부와, 상기 제1접속부로부터 절곡되며 상기 제2인쇄회로기판에 접촉되는 제2접속부를 포함하는 연결부재;를 더 포함하는 전자장치.A connection member respectively coupled to the first printed circuit board and the second printed circuit board to electrically connect the first printed circuit board and the second printed circuit board, and a first connecting part contacting the first printed circuit board and a connecting member bent from the first connecting portion and including a second connecting portion contacting the second printed circuit board. 제10항에 있어서,11. The method of claim 10, 상기 제2인쇄회로기판은 절연층과, 상기 제2접속부와 전기적으로 연결되도록 상기 절연층에 적층되는 실장층을 포함하고,The second printed circuit board includes an insulating layer and a mounting layer laminated on the insulating layer to be electrically connected to the second connection part, 상기 제1접속부는 상기 제1인쇄회로기판의 실장층과 접촉되고, 상기 제2접속부는 상기 제2인쇄회로기판의 실장층과 접촉되는 전자장치.The first connection part is in contact with the mounting layer of the first printed circuit board, and the second connection part is in contact with the mounting layer of the second printed circuit board. 제10항에 있어서,11. The method of claim 10, 상기 연결부재는 복수로 마련되고,The connecting member is provided in plurality, 상기 복수의 연결부재는 서로 전위차를 갖도록 마련되는 전자장치.The plurality of connection members are provided to have a potential difference with each other. 제10항에 있어서,11. The method of claim 10, 상기 제1인쇄회로기판은 서로 이격되어 마련되는 복수의 회로패턴을 더 포함하고,The first printed circuit board further includes a plurality of circuit patterns provided to be spaced apart from each other, 상기 전자장치는 상기 복수의 회로패턴을 전기적으로 연결시키도록 상기 실장층 상에서 상기 복수의 회로패턴과 각각 접속되는 점퍼를 더 포함하고, The electronic device further includes a jumper respectively connected to the plurality of circuit patterns on the mounting layer to electrically connect the plurality of circuit patterns; 상기 점퍼는, The jumper is 일 방향으로 연장되는 몸체; a body extending in one direction; 상기 몸체로부터 상기 실장층을 향해 연장되는 연장부; an extension extending from the body toward the mounting layer; 상기 실장층에 안착되도록 상기 연장부의 일단에 마련되어 상기 실장층과 접촉하는 접촉부; 및a contact part provided at one end of the extension part to be seated on the mounting layer and in contact with the mounting layer; and 상기 인쇄회로기판 내로 삽입되도록 상기 접촉부의 바깥둘레로부터 상기 인쇄회로기판을 향해 돌출되는 삽입돌기;를 포함하는 전자장치.and an insertion protrusion protruding toward the printed circuit board from an outer periphery of the contact portion so as to be inserted into the printed circuit board. 제13항에 있어서,14. The method of claim 13, 상기 제1인쇄회로기판의 절연층은 상기 실장층이 적층되는 제1면과 상기 제1면과 반대되는 측에 배치되는 제2면을 포함하고,The insulating layer of the first printed circuit board includes a first surface on which the mounting layer is laminated and a second surface disposed on a side opposite to the first surface, 상기 삽입돌기는 상기 절연층의 제2면에 대해 돌출되지 않도록 상기 인쇄회로기판 내에 삽입되는 전자장치.The insertion protrusion is inserted into the printed circuit board so as not to protrude from the second surface of the insulating layer. 제14항에 있어서,15. The method of claim 14, 상기 접촉부는 상기 몸체의 길이방향을 따라 연장되고,The contact portion extends along the longitudinal direction of the body, 상기 접촉부는 상기 접촉부의 길이 방향에 따른 일단에서 상기 연장부와 연결되는 제1연결부와, 상기 접촉부의 접촉부의 길이 방향에 따른 타단에서 상기 삽입돌기와 연결되는 제2연결부를 포함하는 전자장치.The electronic device comprising: a first connection part connected to the extension part at one end of the contact part along a longitudinal direction of the contact part; and a second connection part connected to the insertion protrusion at the other end along the length direction of the contact part of the contact part.
PCT/KR2022/001906 2021-03-29 2022-02-08 Electronic device Ceased WO2022211261A1 (en)

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