WO2022258031A1 - Structural member and communication apparatus - Google Patents

Abstract

Provided in the present disclosure is a structural member, which is applied to a heating device. The structural member comprises: a heat dissipation structure; and a heat conduction structure, which can be switched between a heat dissipation state and a heat preservation state. In the heat dissipation state, the heat conduction structure is in contact with the heat dissipation structure and the heating device at the same time, while in the heat preservation state, the heat conduction structure is separated from at least one of the heat dissipation structure and the heating device. The heat conduction structure comprises a heat-conducting adhesive, wherein when the temperature is higher than or equal to a preset temperature, the heat-conducting adhesive expands, causing the heat conduction structure to be in the heat dissipation state, and when the temperature is lower than the preset temperature, the heat-conducting adhesive contracts, causing the heat conduction structure to be in the heat preservation state. Further provided in the present disclosure is a communication apparatus.

Description

Structural parts, communication devices

Cross References to Related Applications

This application claims priority to Patent Application No. CN202110656717.1 filed with the China Patent Office on June 11, 2021, the entire contents of which are hereby incorporated by reference.

technical field

The present disclosure relates to the technical field of heat dissipation, and in particular to a structural component and a communication device.

Background technique

Many communication devices (such as Internet of Things devices, user terminal devices) are used in complex environments, which may be used in high-temperature environments, low-temperature environments, or even alternating temperature environments with large temperature differences at different times.

Structural components (such as housings) used in communication equipment are either good for heat dissipation or good for heat preservation. However, the structural parts that are good for heat dissipation are likely to cause the temperature of the communication equipment to be too low at low temperatures, so heaters, etc. need to be installed; and the structural parts that are good for heat preservation are likely to cause the communication equipment to overheat at high temperatures.

Contents of the invention

In the first aspect, an embodiment of the present disclosure provides a structural member, which is used for a heat generating device. The structural member includes: a heat dissipation structure; a heat conduction structure, which can be switched between a heat dissipation state and a heat preservation state; The heat conduction structure is in contact with the heat dissipation structure and the heat generating device at the same time, and the heat conduction structure is separated from at least one of the heat dissipation structure and the heat generation device in the heat preservation state; the heat conduction structure includes heat conduction glue, and the temperature When the temperature is higher than or equal to the preset temperature, the heat-conducting adhesive expands so that the heat-conducting structure is in the heat dissipation state, and when the temperature is lower than the preset temperature, the heat-conducting adhesive shrinks so that the heat-conducting structure is in the heat-preserving state.

In a second aspect, an embodiment of the present disclosure provides a communication device, including: the structural member according to the above first aspect; and a communication device, where the communication device is the heating device.

In some embodiments, the communication device is an outdoor communication device.

Description of drawings

In the drawings of the embodiments of the present disclosure:

FIG. 1 is a schematic diagram of a partial cross-sectional structure of a structural member provided by an embodiment of the present disclosure when the heat conduction structure is in a heat dissipation state;

2 is a schematic diagram of a partial cross-sectional structure of a structural member provided by an embodiment of the present disclosure when the heat-conducting structure is in a heat preservation state;

Fig. 3 is a front structural schematic diagram of a housing and a heat dissipation structure in a structural member provided by an embodiment of the present disclosure;

FIG. 4 is a schematic diagram of a partial structure inside a housing and a heat dissipation structure in a structural member provided by an embodiment of the present disclosure;

Fig. 5 is a front structural schematic view of a support plate in a structural member provided by an embodiment of the present disclosure;

Fig. 6 is a front structural schematic diagram of a heat conduction structure in a structural member provided by an embodiment of the present disclosure;

FIG. 7 is a block diagram of a communication device provided by an embodiment of the present disclosure;

Wherein, the meanings of the reference signs in each accompanying drawing are as follows:

1. Shell; 11. Contact hole; 12. Blind hole; 2. Thermal conduction structure; 21. Support plate; 211. Accommodating hole; 212. Reinforcing rib; 213. Protrusion; 214. Support hole; 22. Heat conduction rear cover; 23. Thermal adhesive; 3. Heat dissipation structure; 31. Heat dissipation part; 32. Contact part; 4. Heating device.

Detailed ways

In order to enable those skilled in the art to better understand the technical solution of the present disclosure, the structural components and communication devices provided by the embodiments of the present disclosure will be described in detail below with reference to the accompanying drawings.

The present disclosure will be described more fully hereinafter with reference to the accompanying drawings, but the illustrated embodiments may be embodied in different forms, and the present disclosure should not be construed as limited to the embodiments set forth below. Rather, these embodiments are provided so that this disclosure will be thorough and complete, and will fully convey the scope of the disclosure to those skilled in the art.

The drawings of the embodiments of the present disclosure are used to provide a further understanding of the embodiments of the present disclosure, and constitute a part of the description, and are used together with the detailed embodiments to explain the present disclosure, and do not constitute a limitation to the present disclosure. The above and other features and advantages will become more apparent to those skilled in the art by describing detailed embodiments with reference to the accompanying drawings.

The present disclosure may be described with reference to plan views and/or cross-sectional views by way of idealized schematic views of the present disclosure. Accordingly, the example illustrations may be modified according to manufacturing techniques and/or tolerances.

The orientations and directions in the drawings of the present disclosure are exemplary, and do not represent the real orientations and directions of the device in a working state. Furthermore, the drawings are not necessarily to scale, and certain features may be exaggerated in order to better illustrate and explain the innovative aspects of the present disclosure.

In the case of no conflict, various embodiments of the present disclosure and various features in the embodiments can be combined with each other.

The terms used in the present disclosure are for describing specific embodiments only, and are not intended to limit the present disclosure. As used in this disclosure, the term "and/or" includes any and all combinations of one or more of the associated listed items. As used in this disclosure, the singular forms "a" and "the" are intended to include the plural forms as well, unless the context clearly dictates otherwise. As used in the present disclosure, the terms "comprising", "made up of" designate the presence of said features, integers, steps, operations, elements and/or components, but do not exclude the presence or addition of one or more other features, Integrals, steps, operations, elements, components and/or groups thereof.

Unless otherwise defined, all terms (including technical and scientific terms) used in this disclosure have the same meaning as commonly understood by one of ordinary skill in the art. It will also be understood that terms such as those defined in commonly used dictionaries should be interpreted as having meanings consistent with their meanings in the context of the relevant art and the present disclosure, and will not be interpreted as having idealized or excessive formal meanings, Unless the disclosure expressly so limited.

The present disclosure is not limited to the embodiments shown in the drawings, but includes modifications of configurations formed based on manufacturing processes. Accordingly, the regions illustrated in the figures have schematic properties, and the shapes of the regions shown in the figures illustrate the specific shapes of the regions of the elements, but are not intended to be limiting.

In the first aspect, referring to FIG. 1 to FIG. 6 , an embodiment of the present disclosure provides a structural member.

The structural member of the embodiment of the present disclosure is used for the heat generating device 4 . That is, the structural member of the embodiment of the present disclosure is adapted to be assembled with the heat-generating device 4, as a housing of the heat-generating device 4, a radiator, and the like. Wherein, the heating device 4 can be any device that emits heat during operation, such as electronic equipment such as communication equipment, or a chip.

Referring to Fig. 1 and Fig. 2, the structural parts of the disclosed embodiment include: a heat dissipation structure 3; a heat conduction structure 2, which can be switched between a heat dissipation state and a heat preservation state; In contact, the heat-conducting structure 2 is separated from at least one of the heat-dissipating structure 3 and the heating device 4 in the heat preservation state; the heat-conducting structure 2 includes a thermal glue (thermal glue) 23, and when the temperature is higher than or equal to a preset temperature, the heat-conducting glue 23 expands to conduct heat The structure 2 is in a state of heat dissipation, and when the temperature is lower than a preset temperature, the heat-conducting adhesive 23 shrinks so that the heat-conducting structure 2 is in a state of heat preservation.

The structural parts of the embodiments of the present disclosure include a heat dissipation structure 3 (such as a metal heat sink) and a heat conduction structure 2. When assembled with a heat generating device 4, the heat conduction structure 2 is connected between the heat dissipation structure 3 and the heat generating device 4, thereby In the heat dissipation state, the heat generated by the heat generating device 4 can be conducted to the heat dissipation structure 3 for dissipation.

The heat dissipation structure 3 includes thermal conductive glue 23 . The thermally conductive adhesive 23 has a high coefficient of thermal expansion, so when the temperature changes, the thermally conductive adhesive 23 can obviously shrink or expand, and drive the specific structural changes of the thermally conductive structure 2, so that the thermally conductive structure 2 can switch between the heat dissipation state and the heat preservation state.

The thermally conductive adhesive 23 is a material that is originally liquid or pasty and has good thermal conductivity. Generally, a thermally conductive adhesive can be coated (cured after coating) on a device that needs to be dissipated to conduct heat generated by the device.

For example, the thermally conductive glue 23 can be in the form of thermally conductive silicone, thermally conductive silicone oil, thermally conductive resin (such as thermally conductive silicone grease), etc., which will not be described in detail here.

Wherein, the heat dissipation structure 3 above should be made of a material with good thermal conductivity. For example, the heat dissipation structure 3 may be made of metal materials such as copper (Cu) and aluminum (Al).

When the temperature is high (higher than or equal to the preset temperature), referring to Fig. 1, the thermally conductive adhesive 23 expands so that the thermally conductive structure 2 is in a state of heat dissipation, that is, the thermally conductive structure 2 is in contact with both the heat generating device 4 and the heat dissipation structure 3, so that it can pass through " The heat-conducting channel of the heat-generating device 4-heat-conducting structure 2-heat-dissipating structure 3" conducts a large amount of heat emitted by the heating device 4 to the heat-dissipating structure 3 in the form of "heat conduction", which has a good heat dissipation effect.

And when the temperature is low (lower than the preset temperature), with reference to Fig. 2, the heat-conducting adhesive 23 shrinks so that the heat-conducting structure 2 is in a heat preservation state, that is, at least one of the heat-conducting structure 2 and the heat-generating device 4 and the heat-dissipating structure 3 (in Fig. In 2, it is separated from the heat dissipation structure 3) (for example, an air layer is generated between them). Therefore, the above "heat conduction channel" is equivalent to adding an "air layer", and the thermal conductivity of air is far lower than the heat conduction structure 2 of metal and other materials, so the heat in the air layer can only pass through "thermal radiation" However, the heat transfer capacity of heat radiation is far lower than that of heat conduction; therefore, in the heat preservation state, the heat dissipation capacity of the structural parts to the heat generating device 4 is greatly reduced, which can inhibit the relationship between the heat generating device 4 and the structural parts to a certain extent. The heat exchange between them is used to "insulate heat" on the heating element 4.

Although the heat dissipation state and the heat preservation state are switched at the "preset temperature", it should be understood that the thermally conductive adhesive 23 does not only expand and contract at the preset temperature, but within a certain temperature range, the thermally conductive adhesive 23 Although it also expands and contracts, the degree of expansion and contraction is not enough to change the contact condition between the heat conduction structure 2 and other structures, so the state of the heat conduction structure 2 is not changed.

In the structural parts of the embodiment of the present disclosure, through the thermal expansion and contraction of the thermally conductive adhesive 23, it can automatically enter the heat dissipation state when the temperature is high, so that the heat-generating device 4 can be effectively dissipated by heat conduction through the heat-conducting structure 2, and the heat-generating device 4 can be avoided. Overheating at high temperature; and when the temperature is low, the structural parts can automatically enter the heat preservation state, so that the heating device 4 can only dissipate heat slowly through thermal radiation. To a certain extent, the heating device 4 is "insulated" to avoid the heating device 4 in Supercooled at low temperatures.

Thus, the above structural parts can adaptively adjust the heat dissipation capacity of the heating device 4 according to the ambient temperature, greatly reduce the impact of the ambient temperature on the heating device 4, make the working environment of the heating device 4 more stable, and reduce the impact on the heating device 4 hardware. It is required to expand the scope of application of the heating device 4 (for example, the heating device 4 can be used in high temperature, low temperature, and greatly variable temperature environments).

At the same time, the structure of the embodiment of the present disclosure does not need to be equipped with structures such as heaters and insulation materials, nor does it need to be controlled and adjusted according to the ambient temperature (such as adding a heater at low temperature), so its structure is simple and easy to implement. ,Wide range of applications.

In some embodiments, the heat conduction structure 2 is separated from the heat dissipation structure 3 and is in contact with the heat generating device 4 in the heat preservation state.

As an implementation manner of the embodiment of the present disclosure, the heat dissipation structure 3 is always in contact with the heat generating device 4 , and the heat conduction structure 2 is only separated from the heat dissipation structure 3 in the heat preservation state.

In some embodiments, the heat conduction structure 2 includes a housing portion with a housing cavity, and the thermal conductive glue 23 is filled in the housing cavity; the housing portion has a contact surface suitable for contacting the heating device 4; the housing cavity has a contact port facing the heat dissipation structure 3 In the state of heat dissipation, the thermally conductive adhesive 23 expands and contacts the heat dissipation structure 3 at the contact port, and in the state of heat preservation, the thermally conductive adhesive 23 shrinks and separates from the heat dissipation structure 3 .

As an implementation of the embodiment of the present disclosure, the thermally conductive glue 23 is filled in the cavity of the containing part, and the containing part has a contact port; thus, the thermally conductive glue 23 can "fill up" or "fill up" the containing cavity when it expands with heat and contracts with cold. Relatively vacant", that is, the surface of the thermally conductive adhesive 23 can "undulate" at the contact port, so that the thermally conductive adhesive 23 itself (which is of course a part of the thermally conductive structure 2) contacts or separates from the heat dissipation structure 3, thereby switching the thermally conductive structure 2 state.

Specific examples of the structure of the above accommodating portion will be described in detail later.

In some embodiments, the structural member also includes a housing 1; the housing 1 is suitable for accommodating the heating device 4; the heat conducting structure 2 is arranged in the housing 1; at least one side wall of the housing 1 has a through contact hole 11; the heat dissipation structure 3 has a design The heat dissipation part 31 outside the housing 1 and the contact part 32 protruding from the contact hole 11 into the housing 1 .

Referring to FIGS. 1 to 4 , as an implementation of an embodiment of the present disclosure, the structural member includes a housing 1 to enclose the heat-conducting structure 2 and the heat-generating device 4 , so that the structural member and the heat-generating device 4 form a relatively complete of the overall structure.

Referring to Figures 1 to 3, when there is a housing 1, the heat dissipation part 31 that actually plays a role in heat dissipation in the above heat dissipation structure 3 can be arranged outside the housing 1, and the heat dissipation structure 3 also has a contact hole 11 extending through the housing 1. The contact portion 32 inserted into the housing 1 is used to make contact with the heat-conducting structure 2 (in the housing 1).

In some embodiments, the housing 1 is made of plastic material or ceramic material.

Since the embodiment of the present disclosure mainly dissipates heat through the heat dissipation structure 3 , the above casing 1 does not have a heat dissipation effect, so it can be made of plastic materials or ceramic materials with poor thermal conductivity.

There are various specific forms of the heat dissipation structure 3 .

For example, in some embodiments, referring to FIG. 3 , the heat dissipation structure 3 includes a metal heat sink (radiation portion 31 ) attached to the outer surface of the housing 1 , and the metal heat sink communicates with the metal feed point in the housing 1 through the contact hole 11 . (contact portion 32) connection.

In some embodiments, a plurality of metal cooling fins can also be connected together to form a certain pattern (such as an "H" shape with reference to FIG. 3 ).

In some embodiments, referring to Fig. 3, the position where the metal heat sink is provided with the housing 1 may also have a blind hole 12, so that the metal heat sink part enters the blind hole 12, strengthens the connection between the metal heat sink and the shell 1, and reduces the The thickness of part of the shell 1 improves the heat dissipation effect.

The above metal heat sink (radiating part 31) can be a metal coating formed on the shell 1 by cold fusion spraying process (Cold plasma spray), laser direct structuring process (LDS, Laser Direct Structuring) etc.; 32) It can be formed by cold spraying process, inlay process, etc. and connected with metal heat sink.

The specific forms of the heat dissipation structure 3 are not limited to those introduced above. For example, the heat dissipation structure 3 may also be a rigid metal sheet or the like that is connected to the housing 1 by clamping or the like.

In addition, the forms of the structural members are not limited to those introduced above. For example, in some embodiments, the structural member may not have a casing, but itself is a heat sink or the like for dissipating heat from the heat generating device 4 . In other embodiments, the housing may serve as a heat dissipation structure for the structural member.

In some embodiments, the heat conducting structure 2 is in contact with the inner surface of the sidewall of the housing 1 having the contact hole 11 . The heat generating device 4 is adapted to be located on the side of the heat conduction structure 2 away from the contact hole 11 , and is adapted to be in contact with the surface of the heat conduction structure 2 away from the contact hole 11 (the right side surface in FIGS. 1 and 2 ). The heat conduction structure 2 is in contact with the contact portion 32 in the heat dissipation state, and the heat conduction structure 2 is separated from the contact portion 32 in the heat preservation state.

Referring to Fig. 1 and Fig. 2, as a form of the embodiment of the present disclosure, one side of the heat conduction structure 2 is in contact with the side wall (the left side wall in Fig. (the right side among Fig. 1, Fig. 2) then keep contacting with heating device 4 (this side surface is above-mentioned contact surface).

In this state, the heat-conducting structure 2 is "sandwiched" between the heat-generating device 4 and one side wall of the housing 1; on the contrary, the heat-generating device 4 can also be "sandwiched" between the heat-conducting structure 2 and the other side of the housing 1 between walls. Moreover, the heat conducting structure 2 is kept in contact with the heat generating device 4, so whether the heat conducting structure 2 is in contact with the contact portion 32 (such as a metal feed point) in the side wall of the housing 1 can be determined through thermal expansion and contraction of the heat conducting adhesive 23 .

In some embodiments, the heat conduction structure 2 includes a housing part with a housing cavity, and the thermal conductive glue 23 is filled in the housing cavity; the surface on one side of the contact hole 11 is a contact surface suitable for contacting the heating device 4; The contact port of the part 32; the thermal conductive adhesive 23 expands and contacts the contact part 32 at the contact port under the heat dissipation state, and the thermal conductive adhesive 23 shrinks and separates from the contact part 32 under the heat preservation state.

Referring to Fig. 1 and Fig. 2, the heat conduction structure 2 may also be in the form of a housing part, that is, through the "fluctuation" of the surface of the heat conduction glue 23 in the chamber, it is determined whether the heat conduction glue 23 is in contact with the contact part 32 (heat dissipation) at the contact port. Structure 3) Contact.

In some embodiments, the accommodating portion includes: a bracket plate 21 in contact with the inner surface of the side wall of the housing 1 having the contact hole 11; the bracket plate 21 has a plurality of through accommodating holes 211, and the accommodating holes 211 face the side of the contact portion 32 The opening is the contact port; the heat conduction back cover 22 is located on the side of the support plate 21 away from the contact hole 11; the heat conduction back cover 22 and the support plate 21, and the interior of the accommodation hole 211 form an accommodation chamber; the heat conduction back cover 22 is away from the support plate The surface on one side of 21 is the contact surface.

Referring to Fig. 1, Fig. 2 and Fig. 6, the above accommodating part can be specifically composed of a bracket plate 21 and a heat-conducting back cover 22. The bracket plate 21 has a plurality of accommodating holes 211 (through holes), and the heat-conducting back cover 22 "covers" the accommodating holes 211 is away from the side of the side wall of the housing 1 .

Thus, the side of the heat-conducting back cover 22 facing away from the support plate 21 is the contact surface with the heat-generating device 4; , and the inner space of the receiving hole 211 in the bracket plate 21 is also a part of the receiving cavity; and the opening of the receiving hole 211 facing the contact portion 32 is the contact port of the receiving cavity.

It can be seen that in the above-mentioned structure, the side wall of the receiving hole 211 is in contact with the inner wall of the housing 1, so referring to FIG. The space is approximately vacuum or only thin air, which can further reduce the heat conduction capacity of this part of the space.

In addition, in the structural parts of the above form, referring to Fig. 1 and Fig. 2, most of the thermally conductive adhesive 23 is located in the space between the bracket plate 21 and the heat dissipation back cover 22, so the thermally conductive adhesive 23 in this part of the space can be kept For stability, the “undulation” of the surface of the thermally conductive adhesive 23 is mainly carried out in the receiving hole 211 .

The support plate 21 above is made of materials with poor thermal conductivity such as plastic materials and ceramic materials; and the heat-conducting back cover 22 is made of materials with good thermal conductivity such as metal.

It can be seen that, in the heat conduction structure 2 of the above form, the heat is mainly conducted to the contact part 32 (radiation structure 3) through the heat conduction back cover 22 and the heat conduction glue 23, so the heat conduction back cover 22 should have good thermal conductivity; The plate 21 does not conduct heat, so materials with poor heat conduction can be used.

The specific forms of the support plate 21 and the heat-conducting rear cover 22 are various, and are not limited to those introduced above.

In some embodiments, for example, referring to FIG. 5 and FIG. 6 , the side of the support plate 21 facing the contact portion 32 may be provided with protruding reinforcing ribs 212 and protruding protrusions 213 around the receiving hole 211 (also visible This side of support plate 21 is all recessed at other positions except reinforcing rib 212, protrusion 213), so above reinforcing rib 212 and protrusion 213 can contact with shell 1 side wall (that is, the rib 212 and protrusion 213 The height can be basically the same) to improve the structural strength.

For another example, referring to FIG. 5 and FIG. 6 , a plurality of bracket holes 214 may also be provided on the bracket plate 21 to reduce the weight of the bracket plate 21 and facilitate contact and positioning with other structures.

For another example, referring to FIG. 1 and FIG. 2 , the opening of the receiving hole 211 toward the side of the thermally conductive rear cover 22 can be relatively narrowed so as to facilitate the positioning of the thermally conductive adhesive 23 .

For another example, referring to FIG. 5 and FIG. 6 , the number of the heat dissipation portion 31 , the contact portion 32 , the contact hole 11 , and the receiving hole 211 can be multiple.

For another example, referring to Fig. 1 and Fig. 2, the heat-conducting back cover 22 covers the rear side of the support plate 21 "integrally", so that the heat-conducting glue 23 corresponding to different receiving holes 211 is integrated, and a multi-contact port is obtained. Alternatively, the heat-conducting rear cover 22 can also separate the heat-conducting glue 23 corresponding to different accommodation holes 211, thereby forming a plurality of mutually independent accommodation chambers, and each accommodation chamber has a contact port.

In addition, the specific preparation methods of the above structural members are also various.

In some embodiments, for example, the above shell 1 and bracket plate 21 can be formed by injection molding process, etc.; Formed by a stamping process or the like. The bracket plate 21 can be connected with the heat-conducting rear cover 22 through ultrasonic welding process, secondary injection molding process, etc., and then inject heat-conducting glue 23 into the housing cavity to form an integral heat-conducting structure 2; The welding process, the bonding process, etc. are connected with the housing 1 (for example, the support plate 21 is connected with the housing 1 through an ultrasonic welding process).

In a second aspect, referring to FIG. 7 , an embodiment of the present disclosure provides a communication device, including: the above structural member; and a communication device, where the communication device is a heat generating device.

The structural components of the embodiments of the present disclosure can be assembled with communication equipment to form a communication device.

At different temperatures, structural parts can conduct heat for communication equipment or play a certain role in heat preservation for communication equipment, thereby stabilizing the working environment of communication equipment, reducing the requirements for communication equipment hardware, and expanding the scope of application of communication equipment.

The above communication devices may be any devices with communication functions such as Internet of Things (IOT) devices and customer terminal (CPE) devices, such as 5G (fifth generation mobile communication technology) communication devices, which will not be described in detail here.

In some embodiments, the communication device is an outdoor communication device.

Compared with the situation of indoor use, outdoor communication devices used outdoors (such as installed on outdoor equipment poles) often face more extreme temperatures, so it is more suitable to adopt the structural components of the disclosed embodiments.

For example, the above outdoor communication device is particularly suitable for areas with high or low temperature such as tropical areas and frigid areas, or areas with large temperature differences at different times and alternating temperatures.

Wherein, the structural components in the embodiments of the present disclosure are not limited to be used in communication devices.

For example, the structural components of the embodiments of the present disclosure can also be used in other electronic devices without communication functions (ie, the heat generating device is an electronic device), or used as a heat sink for a chip (ie, the heat generating device is a chip), etc., and will not be described in detail here. .

This disclosure has disclosed example embodiments and, although specific terms have been employed, they are used and should be construed in a generic descriptive sense only and not for purposes of limitation. In some instances, it will be apparent to those skilled in the art that features, characteristics and/or elements described in connection with a particular embodiment may be used alone, or may be described in combination with other embodiments, unless explicitly stated otherwise. Combinations of features and/or elements. Accordingly, it will be understood by those of ordinary skill in the art that various changes in form and details may be made without departing from the scope of the present disclosure as set forth in the appended claims.

Claims (10)

A structural member used for a heat generating device, the structural member comprising: heat dissipation structure; A heat conduction structure, which can be switched between a heat dissipation state and a heat preservation state; in the heat dissipation state, the heat conduction structure is in contact with the heat dissipation structure and the heat generating device at the same time, and in the heat preservation state, the heat conduction structure is in contact with the heat dissipation structure . At least one of the heat-generating devices is separated; the heat-conducting structure includes a heat-conducting glue, and when the temperature is higher than or equal to a preset temperature, the heat-conducting glue expands so that the heat-conducting structure is in the heat dissipation state, and the temperature is lower than the preset temperature. At a preset temperature, the thermal conductive adhesive shrinks so that the thermal conductive structure is in the heat preservation state. The structural member according to claim 1, wherein, In the heat preservation state, the heat conduction structure is separated from the heat dissipation structure and is in contact with the heat generating device. The structural member according to claim 2, wherein the heat conducting structure comprises a housing portion having a housing chamber, and the heat conducting glue is filled in the housing chamber; The accommodating portion has a contact surface suitable for contacting the heating element; The accommodating cavity has a contact port facing the heat dissipation structure; in the heat dissipation state, the heat conduction adhesive expands and contacts the heat dissipation structure at the contact port; in the heat preservation state, the heat conduction adhesive contracts and contacts with the heat dissipation structure The heat dissipation structure is separated. The structural member of claim 1, further comprising a housing, wherein, The housing is suitable for accommodating the heating device; the heat conduction structure is arranged in the housing; At least one side wall of the housing has a contact hole therethrough; The heat dissipation structure has a heat dissipation portion disposed outside the housing, and a contact portion protruding from the contact hole into the housing. A structural member according to claim 4, wherein, The heat conduction structure is in contact with an inner surface of a side wall of the housing having the contact hole; The heat generating device is adapted to be disposed on a side of the heat conduction structure away from the contact hole, and is adapted to be in contact with a surface of the heat conduction structure on a side away from the contact hole; The heat conduction structure is in contact with the contact portion in the heat dissipation state, and the heat conduction structure is separated from the contact portion in the heat preservation state. The structural member according to claim 5, wherein the heat conducting structure comprises a housing portion having a housing chamber, and the heat conducting glue is filled in the housing chamber; The surface of the accommodating portion away from the contact hole is a contact surface suitable for contacting the heating device; The accommodating cavity has a contact port facing the contact part; in the heat dissipation state, the thermal conductive adhesive expands and contacts the contact part at the contact port; in the heat preservation state, the thermal conductive adhesive contracts and contacts with the contact part. The contacts are separated. The structural member of claim 6, wherein the receiving portion comprises: A support plate in contact with the inner surface of the side wall of the housing having the contact hole; the support plate has a plurality of through receiving holes, and the opening of the receiving hole on the side facing the contact portion is the contact port ; The heat-conducting back cover is arranged on the side of the support plate away from the contact hole; the accommodation cavity is formed between the heat-conducting back cover and the support plate, and inside the accommodation hole; The surface of the heat-conducting rear cover away from the support plate is the contact surface. A structural member according to any one of claims 4 to 7, wherein, The housing is made of plastic material or ceramic material. A communication device comprising: A structural member according to any one of claims 1 to 8; A communication device, where the communication device is the heating device. The communication device according to claim 9, wherein, The communication device is an outdoor communication device.

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