WO2022255328A1 - 表示装置、特にハプティック表示装置およびその設計方法 - Google Patents
表示装置、特にハプティック表示装置およびその設計方法 Download PDFInfo
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- WO2022255328A1 WO2022255328A1 PCT/JP2022/022033 JP2022022033W WO2022255328A1 WO 2022255328 A1 WO2022255328 A1 WO 2022255328A1 JP 2022022033 W JP2022022033 W JP 2022022033W WO 2022255328 A1 WO2022255328 A1 WO 2022255328A1
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- component
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- C—CHEMISTRY; METALLURGY
- C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
- C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
- C09J7/00—Adhesives in the form of films or foils
- C09J7/30—Adhesives in the form of films or foils characterised by the adhesive composition
- C09J7/38—Pressure-sensitive adhesives [PSA]
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- C—CHEMISTRY; METALLURGY
- C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
- C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
- C09J183/00—Adhesives based on macromolecular compounds obtained by reactions forming in the main chain of the macromolecule a linkage containing silicon, with or without sulfur, nitrogen, oxygen, or carbon only; Adhesives based on derivatives of such polymers
- C09J183/10—Block or graft copolymers containing polysiloxane sequences
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- C—CHEMISTRY; METALLURGY
- C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
- C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
- C09J183/00—Adhesives based on macromolecular compounds obtained by reactions forming in the main chain of the macromolecule a linkage containing silicon, with or without sulfur, nitrogen, oxygen, or carbon only; Adhesives based on derivatives of such polymers
- C09J183/04—Polysiloxanes
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- C—CHEMISTRY; METALLURGY
- C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
- C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
- C09J7/00—Adhesives in the form of films or foils
- C09J7/10—Adhesives in the form of films or foils without carriers
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- G—PHYSICS
- G06—COMPUTING OR CALCULATING; COUNTING
- G06F—ELECTRIC DIGITAL DATA PROCESSING
- G06F3/00—Input arrangements for transferring data to be processed into a form capable of being handled by the computer; Output arrangements for transferring data from processing unit to output unit, e.g. interface arrangements
- G06F3/01—Input arrangements or combined input and output arrangements for interaction between user and computer
- G06F3/03—Arrangements for converting the position or the displacement of a member into a coded form
- G06F3/041—Digitisers, e.g. for touch screens or touch pads, characterised by the transducing means
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- G—PHYSICS
- G06—COMPUTING OR CALCULATING; COUNTING
- G06F—ELECTRIC DIGITAL DATA PROCESSING
- G06F3/00—Input arrangements for transferring data to be processed into a form capable of being handled by the computer; Output arrangements for transferring data from processing unit to output unit, e.g. interface arrangements
- G06F3/01—Input arrangements or combined input and output arrangements for interaction between user and computer
- G06F3/03—Arrangements for converting the position or the displacement of a member into a coded form
- G06F3/041—Digitisers, e.g. for touch screens or touch pads, characterised by the transducing means
- G06F3/0414—Digitisers, e.g. for touch screens or touch pads, characterised by the transducing means using force sensing means to determine a position
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- C—CHEMISTRY; METALLURGY
- C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
- C08G—MACROMOLECULAR COMPOUNDS OBTAINED OTHERWISE THAN BY REACTIONS ONLY INVOLVING UNSATURATED CARBON-TO-CARBON BONDS
- C08G77/00—Macromolecular compounds obtained by reactions forming a linkage containing silicon with or without sulfur, nitrogen, oxygen or carbon in the main chain of the macromolecule
- C08G77/04—Polysiloxanes
- C08G77/12—Polysiloxanes containing silicon bound to hydrogen
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- C—CHEMISTRY; METALLURGY
- C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
- C08G—MACROMOLECULAR COMPOUNDS OBTAINED OTHERWISE THAN BY REACTIONS ONLY INVOLVING UNSATURATED CARBON-TO-CARBON BONDS
- C08G77/00—Macromolecular compounds obtained by reactions forming a linkage containing silicon with or without sulfur, nitrogen, oxygen or carbon in the main chain of the macromolecule
- C08G77/04—Polysiloxanes
- C08G77/20—Polysiloxanes containing silicon bound to unsaturated aliphatic groups
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- C—CHEMISTRY; METALLURGY
- C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
- C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
- C09J2203/00—Applications of adhesives in processes or use of adhesives in the form of films or foils
- C09J2203/318—Applications of adhesives in processes or use of adhesives in the form of films or foils for the production of liquid crystal displays
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- C—CHEMISTRY; METALLURGY
- C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
- C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
- C09J2203/00—Applications of adhesives in processes or use of adhesives in the form of films or foils
- C09J2203/326—Applications of adhesives in processes or use of adhesives in the form of films or foils for bonding electronic components such as wafers, chips or semiconductors
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- C—CHEMISTRY; METALLURGY
- C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
- C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
- C09J2301/00—Additional features of adhesives in the form of films or foils
- C09J2301/30—Additional features of adhesives in the form of films or foils characterized by the chemical, physicochemical or physical properties of the adhesive or the carrier
- C09J2301/302—Additional features of adhesives in the form of films or foils characterized by the chemical, physicochemical or physical properties of the adhesive or the carrier the adhesive being pressure-sensitive, i.e. tacky at temperatures inferior to 30°C
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- C—CHEMISTRY; METALLURGY
- C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
- C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
- C09J2301/00—Additional features of adhesives in the form of films or foils
- C09J2301/30—Additional features of adhesives in the form of films or foils characterized by the chemical, physicochemical or physical properties of the adhesive or the carrier
- C09J2301/312—Additional features of adhesives in the form of films or foils characterized by the chemical, physicochemical or physical properties of the adhesive or the carrier parameters being the characterizing feature
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- C—CHEMISTRY; METALLURGY
- C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
- C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
- C09J2301/00—Additional features of adhesives in the form of films or foils
- C09J2301/40—Additional features of adhesives in the form of films or foils characterized by the presence of essential components
- C09J2301/408—Additional features of adhesives in the form of films or foils characterized by the presence of essential components additives as essential feature of the adhesive layer
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- C—CHEMISTRY; METALLURGY
- C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
- C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
- C09J2483/00—Presence of polysiloxane
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- G—PHYSICS
- G06—COMPUTING OR CALCULATING; COUNTING
- G06F—ELECTRIC DIGITAL DATA PROCESSING
- G06F2203/00—Indexing scheme relating to G06F3/00 - G06F3/048
- G06F2203/041—Indexing scheme relating to G06F3/041 - G06F3/045
- G06F2203/04105—Pressure sensors for measuring the pressure or force exerted on the touch surface without providing the touch position
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- G—PHYSICS
- G06—COMPUTING OR CALCULATING; COUNTING
- G06F—ELECTRIC DIGITAL DATA PROCESSING
- G06F3/00—Input arrangements for transferring data to be processed into a form capable of being handled by the computer; Output arrangements for transferring data from processing unit to output unit, e.g. interface arrangements
- G06F3/01—Input arrangements or combined input and output arrangements for interaction between user and computer
- G06F3/016—Input arrangements with force or tactile feedback as computer generated output to the user
Definitions
- the present invention relates to a display device having a pressure-sensitive adhesive layer having specific viscoelastic properties and adhesive strength between members, particularly a haptic display device having a haptic function for tactile detection to tactile feedback/notification, and It relates to a method of designing a display device using a pressure sensitive adhesive layer with such properties.
- silicone-based pressure-sensitive adhesive compositions Compared to acrylic or rubber pressure-sensitive adhesive compositions, silicone-based pressure-sensitive adhesive compositions have electrical insulation, heat resistance, cold resistance, adhesiveness to various adherends, and, if necessary, transparency.
- addition reaction curing type pressure-sensitive adhesive compositions are widely used because of their excellent properties.
- OCA silicone-based optically clear adhesives
- Silicone-based OCA has practically sufficient adhesive strength, is flexible and highly deformable, and has excellent heat resistance, cold resistance, and light resistance. Due to small changes in physical properties such as force, storage modulus (e.g.
- Patent Documents 1 and 2 silicone-based pressure-sensitive adhesive compositions with different adhesive strengths of flexible structures, adhesive layers obtained by curing, and storage elastic moduli at low temperature to room temperature, according to applications such as display devices.
- haptic functions that give users a sense of touch are being developed.
- display devices such as touch panel operations and smart devices
- the market applications of haptic devices, especially haptic display devices, having haptic functions are rapidly expanding.
- Such a haptic display device has been proposed to have a configuration in which a silicone material or a non-silicone material such as acrylic is used as an electroactive polymer member (for example, Patent Documents 8 and 9).
- a silicone material or a non-silicone material such as acrylic is used as an electroactive polymer member
- it is a highly functional material that meets the requirements for bonding and sealing of the members that make up the display device such as electrodes and displays, and that can improve the operability and reliability of display devices with haptic functions. It was not enough to meet the demand.
- the acrylic pressure-sensitive adhesive layer is particularly insufficient in heat and cold resistance and light resistance. It may cause a failure or decrease in reliability.
- a display device having a good haptic function and practically sufficient adhesion and durability is efficiently designed, and a suitable pressure-sensitive adhesive layer (especially an adhesive layer obtained by curing silicone OCA) ) is difficult to provide.
- Non-Patent Literature 1 Non-Patent Literature 2 and Non-Patent Literature 3 describe a frequency range that the human body can perceive sharply.
- the frequency band of 200 to 300 Hz has the highest sensitivity based on vibration perception of sensory receptors distributed on the skin (Non-Patent Document 1).
- Non-Patent Document 3 Tanaka reported that the human sense of touch is most sensitive to vibrations around 250 Hz, and this is thought to be supported by the fact that the skin of our fingertips easily transmits vibrations around 100 to 300 Hz.
- Non-Patent Document 4 Yanaka et al. also introduced that tactile technology using ultrasonic waves can express the boundaries of buttons and the like displayed on the screen and minute unevenness.
- the present invention has been made to solve the above problems, and is capable of improving the operability and reliability of a display device having a haptic function, and providing practically sufficient adhesion between members of the display device.
- the object of the present invention is to provide a display device having a pressure-sensitive adhesive layer between members, and a method of designing the display device, which can sufficiently improve the reliability and durability of the display device.
- an object of the present invention is to provide a display device having a pressure-sensitive adhesive layer between members, wherein the pressure-sensitive adhesive has a maximum loss tangent tan ⁇ (f) at a frequency f (Hz) of 100 to 300 Hz at 25 ° C.
- the pressure-sensitive adhesive layer is a cured product of a specific silicone-based OCA that is excellent in transparency, heat resistance, etc., and is particularly suitable when the display device is a haptic display device. resolved.
- the object of the present invention is to arrange a pressure-sensitive adhesive layer with features i) and ii) above between the members constituting the display device for the purpose of realizing or improving the haptic function of the device,
- the problem can be preferably solved by the design method of the display device.
- the pressure-sensitive adhesive layer has both a predetermined viscoelastic property (feature i) above and an adhesive force that provides practically sufficient adhesion between members (feature ii) above). Therefore, in the display device having the structure, the operability and reliability of the display device having the haptic function can be improved, and the pressure-sensitive adhesive layer is provided between members, and the display is excellent in reliability and durability.
- An apparatus and method for designing the same can be provided. That is, by selectively applying a pressure-sensitive adhesive layer having the above characteristics, especially in a haptic display device, by realizing good touch operability and haptic function, user's feeling of use and satisfaction with the product can be improved. Further, the reliability and durability of the display device itself are improved.
- silicone-based pressure-sensitive adhesive layers are excellent in heat resistance, cold resistance, and light resistance, and are less likely to cause problems such as coloring and discoloration of the pressure-sensitive adhesive layer.
- a display device having an adhesive layer that is excellent in transparency and adhesion between members over a period of time can be designed and manufactured in an industrially efficient and highly reliable manner.
- the display device according to the present invention preferably has a haptic function.
- the "haptic function” is a function that gives the user a sense of touch through tactile feedback effects or notifications such as force, vibration and motion.
- a "haptic device” or a display device having a haptic function may be simply called a "haptic display device”.
- Such display devices are typified by mobile devices, touch screen devices, personal computers or smartphones, and are preferably display devices with a touch panel such as smartphones, tablet touch screen devices, and in-vehicle consoles.
- a haptic display device having a function of recognizing contact with a display surface and a haptic function of providing tactile feedback or notification of contact is a particularly preferable form of the display device from the technical effects of the present invention.
- Such display devices may have a flat display surface, or may have a repetitive deforming motion (including bending, folding, opening and closing, rolling up, rolling up like a scroll, scrolling) or a curved surface. It may be a flexible display including a digital display designed on the premise of continuous stress, or a curved display, and is not particularly limited.
- the display device has a pressure-sensitive adhesive layer between members having the characteristics described below, and the type of member and the number and arrangement of pressure-sensitive adhesive layers in the display device are particularly limited. not a thing
- a haptic display device suitable for the present invention may have a structure in which a display panel, a haptic integrated touch screen, and a protective cover made of a transparent member such as glass are laminated.
- a structure in which an electrode layer is provided on at least one side or both sides of a shape or sheet-like member is generally used.
- the pressure-sensitive adhesive layer according to the present invention is preferably arranged as an adhesive layer or an intermediate layer between these members, and due to its properties, one side can be used as an adhesive layer (adhesive film) constituting the haptic integrated touch screen.
- it may have a structure having electrode layers on both sides, and may be arranged as an adhesive layer or an intermediate layer between the haptic-integrated touch screen and the protective cover, which are made of other transparent insulating films or the like.
- the pressure-sensitive adhesive layer used in the display device according to the present invention has a frequency dispersion curve (including a master curve obtained according to the time-temperature conversion rule described later) obtained by dynamic viscoelasticity measurement at 25 ° C.
- the maximum value of the loss tangent tan ⁇ (f) of the pressure-sensitive adhesive layer is 0.9 or more when the frequency f (Hz) is in the range of 100 to 300 Hz;
- the maximum value of tan ⁇ (f) is 0.95 or more, 1.0 or more, 1.1 or more, or 1.2 or more, and the maximum value is in the range of 0.9 to 2.1, 0.95 to 2.0.
- the pressure-sensitive adhesive layer used in the display device according to the present invention has a tan ⁇ (f) of less than 0.90 at some frequencies (f), as long as it has the above maximum value within the above frequency range. It may be any value, but from the viewpoint of the performance of the haptic display device, it is more preferable that the value of tan ⁇ (f) is not less than 0.70 at a frequency f (Hz) of 100 to 300 Hz. In this specification, unless otherwise specified, the loss tangent tan ⁇ (f) of the pressure-sensitive adhesive layer at a certain frequency f (Hz) is the value at 25°C.
- the maximum value of the loss tangent tan ⁇ (f) of the pressure-sensitive adhesive layer is 0.9 or more
- part or all of the range of 100 to 300 Hz means that the value of the loss tangent tan ⁇ (f) of the pressure-sensitive adhesive layer is 0.9 or more in the frequency range of , and the maximum value within the same frequency range may be 0.9 or more, and the same frequency It may have a value of 0.9 or more continuously in all or part of the frequency range within the range, and at least one point in different frequencies within the range of 100 to 300 Hz Loss tangent tan ⁇ at frequency (f) (f) may be 0.9 or more.
- the frequency (f) of the pressure-sensitive adhesive layer according to the present invention is 100, 200 based on the actual measurement by the frequency dispersion measurement method or the master curve showing the dependency of tan ⁇ (f) on the frequency (f) described later. , 300 Hz, the loss tangent tan .delta.(f) may be 0.9 or more, but is not limited to this.
- the pressure-sensitive adhesive according to the above definition has a loss tangent tan ⁇ (f) of less than 0.9 throughout the same frequency range, i.e., the maximum value of the same loss tangent tan ⁇ (f) is less than 0.9, Haptic responses, signals, or feedback generated or transmitted through the pressure-sensitive adhesive layer may not be sensitively detected or perceived by the user, and the haptic function as the user's tactile sensation cannot be sufficiently improved.
- the value of the loss tangent tan ⁇ (f) of the pressure-sensitive adhesive layer at a certain frequency (f) Hz can be obtained by measuring tan ⁇ (f) in a certain frequency range at a constant temperature (25° C. in this case) based on the frequency dispersion measurement method.
- a frequency dispersion curve is obtained by actual measurement, or based on data measured while changing the temperature in a narrower frequency range, the dependence of tan ⁇ (f) on frequency (f) is calculated according to a known method, the time-temperature conversion rule.
- the behavior of the loss tangent tan ⁇ (f) at 25° C. in the range of frequency f (Hz) of the pressure-sensitive adhesive layer used in the display device from 100 to 300 Hz improves the haptic function as a user's tactile sensation.
- suitability and effectiveness can be readily determined in advance, particularly for user experience and perception, and can be utilized in material selection and design in haptic displays.
- the loss tangent (tan ⁇ ) value of the material is represented by the ratio of the storage (shear) elastic modulus (G′) and the loss (shear) elastic modulus (G′′) of the material, G′′/G′.
- the loss tangent tan ⁇ (f) at a certain frequency f(1/t) of the pressure-sensitive adhesive layer in the present invention is the storage elastic modulus G′(f) and the loss elastic
- the modulus G''(f) can be derived from a master curve (curve) created based on the dynamic viscoelasticity measurement result of the pressure-sensitive adhesive and the time-temperature conversion rule from the following known calculation process. good.
- dynamic viscoelasticity measurement applies a sinusoidal strain of frequency ⁇ to a test piece and measures the corresponding stress.
- the applied strain energy is dissipated as heat, so that it changes to velocity, resulting in a 90° phase difference.
- stress and strain are in a proportional relationship, so no phase difference occurs.
- the elastic modulus defined as the ratio of stress and strain is a complex number as a function of the frequency ⁇ , the real part being the elastic component and the storage elastic modulus, and the imaginary part being the viscous component and the loss elastic modulus.
- polymer materials which are viscoelastic bodies, behave hard at high frequencies even at the same temperature, and hard at low temperatures at the same frequency. It is known as the law of time-temperature conversion that when a measured value at a certain temperature is converted to a frequency according to that temperature, it matches the measured result at another temperature. By measuring the frequency dispersion in a certain range at a certain isothermal temperature and changing the temperature in several steps, it is possible to obtain data in a wide frequency range, which is difficult to measure with a single device.
- a master curve is a curve obtained by synthesizing a narrow range of measurement results into a wide range of results using the time-temperature conversion rule.
- the master curve in the present invention consists of storage modulus G′, loss modulus G '', obtained by measuring the frequency dependence of the loss tangent (tan ⁇ ) and applying the time-temperature conversion rule, finally, the storage modulus G' (f) with respect to the frequency (f) at 25 ° C., It is obtained as a master curve showing the dependence of the loss elastic modulus G′′(f) and loss tangent tan ⁇ (f).
- the value of tan ⁇ (f) at a frequency f (Hz) of 100 to 300 Hz is the value of the present invention.
- the condition of feature i) especially the preferable condition, is satisfied, notification or feedback regarding the user's tactile sensation can be generated or transmitted through the pressure-sensitive adhesive layer in a form with excellent detection sensitivity. Haptic functions can be improved.
- the method for measuring the dynamic viscoelasticity and creating the master curve of the loss tangent tan ⁇ (f) is as described above. This does not preclude the application of pressure-sensitive adhesive layers having other dynamic viscoelastic properties to the display device of the present invention. This includes, for example, the selection and application of pressure sensitive adhesive layers that additionally have suitable parameters as creep compliance values based on dynamic viscoelasticity measurements of the pressure sensitive adhesive layers.
- the pressure-sensitive adhesive layer used in the display device according to the present invention is characterized by having practically sufficient adhesive strength in addition to the aforementioned characteristic i).
- the aforementioned characteristic i For example, among non-adhesive gel materials and dielectric polymer materials, there are materials whose loss tangent tan ⁇ (f) satisfies the above feature i). Insufficient adhesiveness between the members constituting the device may make it impossible to achieve the goal of the present invention of improving the reliability and durability of the display device main body.
- the interface cannot adhere sufficiently, the haptic response to the user's touch, the user's tactile sensation to the signal or feedback, the usability, and the responsiveness will deteriorate due to delamination between the members, etc., and the haptic function will not be sufficiently improved. Sometimes.
- the pressure-sensitive adhesive layer according to the present invention has a thickness of 50 ⁇ m
- a polymethyl methacrylate sheet having a thickness of 2 mm is subjected to a tensile speed of 300 mm/min using a 180° peeling test method according to JIS Z 0237.
- the pressure-sensitive adhesive layer has an adhesive strength of 500 gf/inch or more measured by can be designed, and a pressure sensitive adhesive layer in the range of 1200-3500 gf/inch is preferred.
- the above thickness (50 ⁇ m) is the thickness of the cured layer itself, which serves as a standard for objectively defining the adhesive strength of the pressure-sensitive adhesive layer according to the present invention, and is the pressure-sensitive adhesive in the display device of the present invention.
- the agent layer is not limited to a thickness of 50 ⁇ m, and may be a cured layer or a pressure-sensitive adhesive layer of any thickness. If the adhesive strength of the pressure-sensitive adhesive layer according to the present invention is within the above range, there will be no gap or peeling between the members constituting the display device, particularly the member having a haptic function and the member serving as a user interface such as a protective cover. It can be adhered without causing any defects, and the reliability and durability of the entire display device can be improved.
- the pressure-sensitive adhesive layer according to the present invention has the above adhesive strength and viscoelastic properties as in feature i), in addition to improving the haptic function, deformation and stress between members constituting the display device can be improved. And because it has a restoring force and flexibility against bending, it achieves a high degree of conformability to members, as well as adhesion and bonding strength.
- the pressure-sensitive adhesive layer particularly the silicone-based pressure-sensitive adhesive layer, used in the display device according to the present invention may be substantially transparent, translucent or opaque. Its transparency can be designed according to the application. When it is visually transparent, more objectively, the transmittance of light at a wavelength of 450 nm of the pressure-sensitive adhesive layer for display devices composed of a cured layer with a thickness of 100 ⁇ m is assuming that the transmittance of air is 100%. , 80% or more, preferably 90% or more, and may be designed to be 95% or more. A filler component or additive may also be used as long as the transparency and light transmittance are not impaired.
- a semi-transparent to opaque pressure-sensitive adhesive layer may be used, depending on the required properties other than light transmittance.
- filler components or additives that impair coloring or light transmittance may be used.
- the substantially transparent pressure-sensitive adhesive layer is a member having a haptic function or a member that transmits a haptic response, signal or feedback to the user
- the substantially transparent pressure-sensitive adhesive layer It is particularly preferred to have
- the haptic function for the user is improved along with the visibility due to the structure in which the members of the haptic display device are firmly adhered by the highly transparent pressure-sensitive adhesive layer. This is because the usability, responsiveness, reliability, etc. of the display device as a whole can be improved.
- the cured layer of the present invention can be designed so that its color tone does not change significantly even when exposed to high temperature or high energy rays such as ultraviolet rays for a long time, and in particular, the problem of yellowing does not occur. be.
- the pressure-sensitive adhesive layer disposed between the members as an adhesive or intermediate layer has features i) and ii) above, and optionally feature iii) other properties.
- the type of the adhesive is not particularly limited, but at least one selected from the group consisting of silicone-based pressure-sensitive adhesives, acrylic-based pressure-sensitive adhesives, and urethane-based pressure-sensitive adhesives can be used, for example.
- Acrylic pressure-sensitive adhesives may be selected in terms of economy, adhesion to other substrates, and durability, but especially in terms of long-term heat resistance, cold resistance, light resistance, and transparency.
- Silicone-based pressure sensitive adhesives can be advantageously selected, with the use of silicone-based OCAs being highly preferred.
- the display device of the present invention preferably has a pressure-sensitive adhesive layer having the above properties between members.
- the use of a silicone-based pressure sensitive adhesive layer formed from a cured formable organopolysiloxane composition is preferred.
- the composition rapidly cures through a curing reaction including a hydrosilylation reaction to form a pressure-sensitive adhesive layer with strong adhesion to the substrate.
- the constituent components, the technical features of the organopolysiloxane resin or mixture thereof, the mass ratio of the organopolysiloxane resin to the linear organopolysiloxane, and the properties of the pressure-sensitive adhesive layer are described below.
- the pressure-sensitive adhesive layer-forming organopolysiloxane composition suitable for use in the present invention is one that cures through a hydrosilylation reaction to form a pressure-sensitive adhesive layer having a certain adhesive strength.
- the sum of the contents of hydroxyl groups and hydrolyzable groups with respect to all silicon atoms in the molecule is 9 mol% or less
- organopolysiloxane resins with different molecular weight ranges are used singly or in the form of a mixture, and are the main component
- the range of blending of the organopolysiloxane resin with the linear organopolysiloxane having alkenyl groups is within a specific range.
- a pressure-sensitive adhesive layer obtained by curing a composition having such characteristics has a shear storage elastic modulus G′ at 25° C. of 1.0 MPa or less and has a certain adhesive strength.
- the pressure-sensitive adhesive layer-forming organopolysiloxane composition suitable in the present invention is (A) a chain organopolysiloxane having an average of more than 1 alkenyl group in the molecule; (B) an organopolysiloxane resin in which the sum of the content of hydroxyl groups and hydrolyzable groups relative to all silicon atoms in the molecule is 9 mol% or less; (C) an organohydrogenpolysiloxane having at least two Si—H bonds in the molecule; (D) an effective amount of a hydrosilylation reaction catalyst, and optionally (A') a linear organopolysiloxane that does not contain carbon-carbon double bond-containing reactive groups in the molecule.
- composition contains a hydrosilylation reaction catalyst, from the viewpoint of handling workability, it may further contain (E) a curing retardant, and other additions within the scope not contrary to the purpose of the present invention It may contain an agent.
- a hydrosilylation reaction catalyst from the viewpoint of handling workability, it may further contain (E) a curing retardant, and other additions within the scope not contrary to the purpose of the present invention It may contain an agent.
- Component (A) alkenyl group-containing organopolysiloxane, is a chain-shaped polysiloxane molecule and is the main ingredient (base polymer) of this composition.
- the preferred number of alkenyl groups is 1.5 or more per molecule.
- the alkenyl group of the component (A) organopolysiloxane includes alkenyl groups having 2 to 10 carbon atoms, with vinyl groups and hexenyl groups being particularly preferred.
- the bonding position of the alkenyl group of the component (A) includes, for example, the terminal of the molecular chain and/or the side chain of the molecular chain.
- the (A) component may contain only a single component, or may be a mixture of two or more different components.
- Examples of organic groups bonded to silicon atoms other than alkenyl groups in the organopolysiloxane of component (A) include alkyl groups such as methyl groups; aryl groups such as phenyl groups; aralkyl groups; and halogenated alkyl groups. and particularly preferably a methyl group or a phenyl group.
- component (A) has a chain polysiloxane molecular structure.
- the component (A) is preferably linear or partially branched linear (branched), and may partially contain a cyclic or three-dimensional network.
- it is a linear or branched diorganopolysiloxane whose main chain consists of repeating diorganosiloxane units and whose molecular chain ends are blocked with triorganosiloxy groups.
- the siloxane units that give the branched organopolysiloxane are the T units or Q units described later.
- the properties of component (A) at room temperature may be oily or gum-like, and the viscosity of component (A) at 25°C is preferably 50 mPa ⁇ s or more, particularly 100 mPa ⁇ s or more.
- the organopolysiloxane composition according to the present invention is a solvent type, at least part of the component (A) (A1) has a viscosity of 100,000 mPa ⁇ s or more at 25° C. or conforms to JIS K6249.
- Plasticity measured according to the method specified in 25 ° C., 4.2 g of spherical sample when a load of 1 kgf is applied for 3 minutes, the thickness is read to 1/100 mm, and this value is multiplied by 100 ) is in the range of 50-200, more preferably in the range of 80-180.
- volatile or low-molecular-weight siloxane oligomers octamethyltetrasiloxane (D4), decamethylpentasiloxane (D5), etc.
- D4 octamethyltetrasiloxane
- D5 decamethylpentasiloxane
- the degree can be designed as desired, it may be less than 1% by weight of the entire component (A) and less than 0.1% by weight for each siloxane oligomer, and may be reduced to near the detection limit if necessary.
- the content of the portion (hereinafter referred to as “vinyl content”) is preferably in the range of 0.005 to 0.400% by mass, more preferably in the range of 0.005 to 0.300% by mass. Especially preferred.
- the weight ratio of the linear organopolysiloxane to the organopolysiloxane resin according to the present invention is within a predetermined range, and by using the predetermined organopolysiloxane resin or a mixture thereof, an appropriate storage modulus can be obtained.
- an appropriate storage modulus can be obtained.
- component (A) of the present invention even a component (A) having a viscosity lower than that of the component (A1) can be used.
- Organopolysiloxanes containing alkenyl groups with less than s are available.
- examples of component (A2) other than viscosity are the same as for component (A1).
- cyclic siloxanes and organosilicon compounds having other alkenyl groups In the present invention, optionally, a small amount of cyclic siloxanes having an alkenyl group such as 1,3,5,7-tetramethyl-1,3,5,7-tetravinylcyclotetrasiloxane is used together with component (A). You may These cyclic siloxanes may function as reactive diluents or curing reactivity controllers and can be used as desired.
- an organosilicon compound having an average of more than 1 alkenyl group in the molecule wherein component (A), component (B) and the alkenyl group are You may use the component which does not correspond to cyclic siloxanes which have.
- These organosilicon compounds are typically alkenyl-containing silanes, alkenyl-containing silane-siloxane reaction mixtures used as independent tackifiers in curable siloxane compositions, and polyorganosiloxanes such as polydialkylsiloxanes. It is a component different from the component and the organopolysiloxane resin component.
- organosilicon compounds having an alkenyl group which further have an epoxy group in the molecule, are excellent in handling workability, and do not impair viscoelastic properties such as shear storage elastic modulus G' at room temperature. In addition to being rapidly cured by a curing reaction, it can impart good adhesiveness to various substrates, and in particular, can form a pressure-sensitive adhesive layer with excellent tensile adhesive strength. be.
- (B) Organopolysiloxane resin or a mixture thereof is one of the preferred configurations of the present invention, and is a tackifying component that imparts adhesive strength to the substrate, and at the same time It is a component that achieves the storage elastic modulus, stress and practical adhesive strength range of the silicone-based pressure-sensitive adhesive layer obtained by curing. More specifically, the component (B) is an organopolysiloxane resin with a reduced content of hydroxyl groups or hydrolyzable groups, or a mixture thereof. Since such a component (B) is unlikely to cause hydrolysis/polymerization reaction between components (B), in the present invention, it gives a suitable loss tangent value tan ⁇ (f) in a certain frequency (f) region.
- component (B) is an organopolysiloxane resin having a total content of hydroxyl groups and hydrolyzable groups of 9 mol% or less with respect to all silicon atoms in the molecule, and may be used alone or in the form of a mixture with a different molecular weight distribution. may be
- component (B) is an organopolysiloxane resin or a mixture thereof containing the following components (b1) and (b2) in a weight ratio of 0:100 to 100:0.
- the component (B) may consist of only the (b1) component or (b2) component, or may be a mixture of the (b1) component and the (b2) component.
- (b1) The sum of the content of hydroxyl groups and hydrolyzable groups relative to all silicon atoms in the molecule is 9 mol% or less, and is measured by gel permeation chromatography (GPC) using toluene as a solvent in terms of standard polystyrene.
- an organopolysiloxane resin having a weight average molecular weight (Mw) of 4500 or more; (b2) The sum of the content of hydroxyl groups and hydrolyzable groups with respect to all silicon atoms in the molecule is 9 mol% or less, and the weight average molecular weight (Mw ) is less than 4500
- the sum of the contents of hydroxyl groups and hydrolyzable groups in the molecule is in the range of 9 mol% or less with respect to all silicon atoms in the organopolysiloxane resin molecule, and the molecule It is preferably 7 mol % or less with respect to the total silicon atoms therein.
- the content of hydroxyl groups and hydrolyzable groups in component (B) can also be expressed by converting all of these functional groups into hydroxyl groups.
- the mass % is calculated as follows: is that the sum of the contents of hydroxyl groups and hydrolyzable groups in terms of hydroxyl groups in the organopolysiloxane resin molecule is 2.0% by mass or less, preferably 1.6% by mass or less. can.
- a hydroxyl group or a hydrolyzable group is a group directly bonded to silicon such as a T unit or a Q unit among the siloxane units in the resin structure described later, and is derived from the raw material silane or as a result of hydrolysis of the silane. Therefore, the content of hydroxyl groups or hydrolyzable groups can be reduced by hydrolyzing the synthesized organopolysiloxane resin with a silylating agent such as trimethylsilane.
- component (B) if the amount of the hydroxyl group or hydrolyzable group exceeds the above upper limit, the condensation reaction between the organopolysiloxane resin molecules proceeds, and an organopolysiloxane resin structure with a large molecular weight is formed in the cured product. easier to form.
- Such an organopolysiloxane resin having a large molecular weight tends to impair the curability of the composition as a whole, resulting in insufficient low-temperature curability of the composition and insufficient pressure-sensitive adhesive layer for practical use. It may lose its storage modulus.
- Both components (B) are organopolysiloxane resins and organopolysiloxanes having a three-dimensional structure.
- it consists of R 2 SiO 2/2 units (D units) and RSiO 3/2 units (T units) (wherein R independently represents a monovalent organic group) and contains a hydroxyl group or a hydrolyzable group.
- Resins with the amount within the above range resins consisting solely of T units and containing hydroxyl groups or hydrolyzable groups within the above range, and R 3 SiO 1/2 units (M units) and SiO 4/2 units (Q unit) and the content of hydroxyl groups or hydrolyzable groups within the above range.
- M units R 3 SiO 1/2 units
- SiO 4/2 units Q units
- the sum of the content of hydroxyl groups and hydrolyzable groups with respect to all silicon atoms in the molecule is 0 to 7 mol %. (preferably 0.0 to 1.6% by mass when all these functional groups are converted to hydroxyl groups) (also called MQ resin).
- the monovalent organic group of R is preferably a monovalent hydrocarbon group having 1 to 10 carbon atoms, such as an alkyl group having 1 to 10 carbon atoms, an alkenyl group having 2 to 10 carbon atoms, and an aryl group having 6 to 10 carbon atoms. , a cycloalkyl group having 6 to 10 carbon atoms, a benzyl group, a phenylethyl group, and a phenylpropyl group.
- 90 mol % or more of R is preferably an alkyl group having 1 to 6 carbon atoms or a phenyl group, and particularly preferably 95 to 100 mol % of R is a methyl group or a phenyl group.
- component (B) is a resin composed of R 3 SiO 1/2 units (M units) and SiO 4/2 units (Q units), the molar ratio of M units to Q units is 0.5-2. 0 is preferred. If this molar ratio is less than 0.5, the adhesive strength to the substrate may be lowered, and if it is greater than 2.0, the cohesive strength of the substance constituting the adhesive layer will be lowered.
- D units and T units can be included in the component (B) as long as the properties of the present invention are not impaired.
- these organopolysiloxane resins may have low-molecular-weight siloxane oligomers reduced or removed from the standpoint of preventing contact failure.
- component (B) is an organopolysiloxane resin mixture of components (b1) and (b2) that differ from each other in weight average molecular weight (Mw).
- Mw weight average molecular weight
- the weight average molecular weight (Mw) is measured in terms of standard polystyrene by gel permeation chromatography (GPC) using toluene as a mobile phase solvent. It is the average molecular weight considering the ratio.
- Component (b1) is an organopolysiloxane resin having a large molecular weight, and its weight average molecular weight (Mw) is 4,500 or more, preferably 5,000 or more, and particularly preferably 5,500 or more.
- the component (b1) is a resin composed of the above R 3 SiO 1/2 units (M units) and SiO 4/2 units (Q units) having a weight average molecular weight (Mw) in the range of 5,000 to 10,000. is particularly preferred.
- Component (b2) is an organopolysiloxane resin with a small molecular weight, and its weight average molecular weight (Mw) is less than 4,500, preferably 4,400 or less, and particularly preferably 4,200 or less.
- component (b1) consists of the aforementioned R 3 SiO 1/2 units (M units) and SiO 4/2 units (Q units) having a weight average molecular weight (Mw) in the range of 500 to 4200. Resins are particularly preferred.
- Component (B) may be an organopolysiloxane resin or organopolysiloxane resin mixture containing components (b1) and (b2) above in a weight ratio of 0:100 to 100:0, and as described above, Only component (b1) or component (b2) may be used, or a mixture thereof may be used.
- the mixing ratio is not particularly limited, but may vary from 5:95 to 95: It may be in the range of 5, it may be in the range of 10:90 to 90:10, it may be in the range of 15:85 to 85:15.
- the (B) component may be an organopolysiloxane resin consisting only of the (b1) component, and similarly, the (B) component may be an organopolysiloxane resin consisting only of the (b2) component.
- component (B) is a single organopolysiloxane resin
- embodiments of the invention in which component (B) is a mixture of components (b1) and (b2) are both preferred embodiment.
- a single organopolysiloxane resin may be used in order to achieve desired properties such as curability, adhesive strength, and storage modulus. Desirable and more favorable properties may be achieved by using substantially combinations of the above organopolysiloxane resins having different molecular weights.
- the pressure-sensitive adhesive layer-forming organopolysiloxane composition according to the present invention is an organopolysiloxane resin (B ) is preferably in the range of 0.8 to 4.0.
- the characteristic organopolysiloxane resin or mixture thereof is selected as the component (B), and the resin component is blended with the linear siloxane polymer component in the above range, This is because viscoelastic properties such as an appropriate loss tangent value, which is the object of the present invention, can be suitably realized.
- Component (C) is an organohydrogenpolysiloxane having two or more Si—H bonds in the molecule, and is a cross-linking agent for the organopolysiloxane composition according to the present invention.
- the molecular structure of component (C) is not limited, and examples thereof include linear, partially branched linear, branched, cyclic, and organopolysiloxane resins, preferably linear. , partially branched linear or organopolysiloxane resins.
- the bonding position of the silicon-bonded hydrogen atom is not particularly limited, and is exemplified by molecular chain terminals, side chains, and both.
- the content of silicon-bonded hydrogen atoms is preferably in the range of 0.1 to 2.0% by mass, more preferably in the range of 0.5 to 1.7% by mass.
- organic groups bonded to silicon atoms include alkyl groups having 1 to 8 carbon atoms such as methyl groups; aryl groups such as phenyl groups; aralkyl groups; and halogenated alkyl groups. % or more are preferably C 1-8 alkyl groups or phenyl groups.
- the other organic group is preferably a methyl group or a phenyl group from the standpoint of ease of production and compatibility with the preferred components (A) and (B) described above.
- component (C) examples include tris(dimethylhydrogensiloxy)methylsilane, tetra(dimethylhydrogensiloxy)silane, both-terminal trimethylsiloxy-blocked methylhydrogenpolysiloxane, and both-terminal trimethylsiloxy-blocked dimethylsiloxane.
- Methylhydrogensiloxane Copolymer Dimethylhydrogensiloxy Group-Blocked Dimethylsiloxane/Methylhydrogensiloxane Copolymer at Both Ends, Cyclic Methylhydrogenoligosiloxane, Cyclic Methylhydrogensiloxane/Dimethylsiloxane Copolymer, Both Terminals of Molecular Chain trimethylsiloxy group-blocked methylhydrogensiloxane/diphenylsiloxane copolymer, trimethylsiloxy group-blocked methylhydrogensiloxane/diphenylsiloxane/dimethylsiloxane copolymer at both molecular chain ends, hydrolytic condensate of trimethoxysilane, (CH 3 ) 2 HSiO 1/2 units and SiO 4/2 units ; _ Copolymers, copolymers consisting of (CH 3 ) 2 HSiO 1/2 units and CH 3 SiO
- a composition that provides a preferred pressure-sensitive adhesive layer according to the present invention is hydrosilylation-curable, and the amount of component (C) used is particularly limited as long as the composition can be sufficiently cured by hydrosilylation reaction.
- the amount of atom-bonded hydrogen atom (SiH) groups, that is, the molar ratio is preferably within the range of 0.1 to 100, within the range of 0.5 to 60, within the range of 1.0 to 50, or 1 It may be in the range of 0 to 40.
- the said molar ratio may be hereafter called "SiH/Vi ratio.”
- the SiH/Vi ratio can be designed to be 10 or more, or 20 or more, and preferably exceeds 11, more preferably 22 or more. preferable.
- silicon-bonded hydrogen atoms ( The amount of SiH) groups can be designed within the range of 11-60, within the range of 21-60, and within the range of 22-50. If the amount of SiH groups is less than the lower limit, the technical effect of improving the adhesion to the substrate may not be achieved.
- the amount of SiH groups exceeds the above upper limit, the amount of the curing agent that remains unreacted increases, causing adverse effects on the cured physical properties such as brittleness of the cured product and problems such as gas generation. There is however, even if the SiH/Vi ratio of the composition is outside the above range, it may be possible to form a practically sufficient pressure-sensitive adhesive layer.
- the amount of silicon-bonded hydrogen (SiH) groups in component (C) is preferably 1.0 or more with respect to the total amount (amount of material) of alkenyl groups in the composition.
- the substance amount of silicon-bonded hydrogen (SiH) groups in component (C) relative to the total amount (substance amount) of alkenyl groups may be within the range of 1.5 to 60, and within the range of 21 to 60 may be
- the organopolysiloxane composition of the present invention contains a hydrosilylation reaction catalyst.
- hydrosilylation reaction catalysts include platinum-based catalysts, rhodium-based catalysts, and palladium-based catalysts. Platinum-based catalysts are preferred because they can significantly accelerate the curing of the present composition.
- platinum-based catalyst a platinum-alkenylsiloxane complex is preferable. Siloxane is preferred.
- non-platinum metal catalysts such as iron, ruthenium, and iron/cobalt may be used.
- the content of the hydrosilylation reaction catalyst is not particularly limited.
- the amount may be in the range of 0.1 to 150 ppm, the amount in the range of 0.1 to 100 ppm, or the amount in the range of 0.1 to 50 ppm.
- the platinum-based metal is a Group VIII metal element consisting of platinum, rhodium, palladium, ruthenium, and iridium.
- the solid content is a component (mainly a main agent, an adhesion-imparting component, a cross-linking agent, a catalyst and other non-volatile components) that forms a cured layer when the organopolysiloxane composition according to the present invention undergoes a curing reaction. It does not contain volatile components such as solvents that volatilize during heat curing.
- the content of the platinum-based metal in the organopolysiloxane composition according to the present invention is 50 ppm or less (45 ppm or less, 35 ppm or less, 30 ppm or less, 25 ppm or less, or 20 ppm or less) in mass units, after curing, or by heating or ultraviolet light. When exposed to high-energy radiation such as, discoloration and coloring of the transparent pressure-sensitive adhesive layer can be suppressed in some cases.
- the content of the platinum-based metal is 0.1 ppm or more, and if it is less than the lower limit, it may cause poor curing.
- Component (E) is a curing retardant that suppresses the cross-linking reaction between the alkenyl groups in the composition and the SiH groups in component (C), thereby extending the pot life at room temperature and improving storage stability. It is formulated for Therefore, it is practically an essential component for the organopolysiloxane composition of the present invention.
- the (E) component is exemplified by acetylenic compounds, enyne compounds, organic nitrogen compounds, organic phosphorus compounds, and oxime compounds.
- the preferred pressure-sensitive adhesive layer-forming organopolysiloxane composition according to the present invention exhibits an increase in viscosity of no more than 1.5 times after 8 hours at room temperature after preparation of the composition, It is preferably curable at 80-200°C. Suppression of thickening is important from the viewpoint of handling workability, pot life, and properties after curing. This is because the curability can be ensured by curing at a high temperature (80 to 200° C.) above a certain level.
- such a composition can be realized by selecting a suitable combination and blending amount of each of the above components, the hydrosilylation catalyst, and the component (E).
- a preferred organopolysiloxane composition according to the present invention may contain an organic solvent as a solvent in addition to the above preferred components (A) and (B).
- organic solvents include aromatic hydrocarbon solvents such as toluene, xylene and benzene; aliphatic hydrocarbon solvents such as heptane, hexane, octane and isoparaffin; ester solvents such as ethyl acetate and isobutyl acetate; Ether, ether solvents such as 1,4-dioxane, trichlorethylene, perchlorethylene, chlorinated aliphatic hydrocarbon solvents such as methylene chloride, solvent volatile oils, etc.
- the amount of the organic solvent to be blended is preferably such that the mixture of components (A) to (C) can be uniformly coated on the surface of the sheet-like substrate. It is in the range of 5 to 3000 parts by weight per 100 parts by weight of the total components.
- a suitable organopolysiloxane composition according to the present invention can optionally contain components other than the above components within a range that does not impair the technical effects of the present invention.
- adhesion promoters for example, adhesion promoters; non-reactive organopolysiloxanes such as polydimethylsiloxane or polydimethyldiphenylsiloxane; antioxidants; light stabilizers; flame retardants;
- pigments, dyes, inorganic fine particles may optionally be blended.
- organopolysiloxane compositions include non-reactive polydimethylsiloxanes or polydimethyldiphenylsiloxanes that do not contain reactive groups containing carbon-carbon double bonds such as alkenyl groups, acrylic groups, methacrylic groups, and the like.
- organopolysiloxane can be blended, which may improve the loss coefficient (tan ⁇ ), storage elastic modulus (G′), and loss elastic modulus (G′′) of the pressure-sensitive adhesive layer, which will be described later. be.
- hydroxyl-terminated polydimethylsiloxane, trimethylsiloxy-terminated polydimethylsiloxane or polydimethyldiphenylsiloxane can increase the loss factor of the pressure-sensitive adhesive layer, and such compositions can be used in the present invention. is included in the range of
- the component (A') is a chain organopolysiloxane that does not participate in the curing reaction by hydrosilylation
- the mass ratio of the component (B) in the composition is the adhesive strength and storage elastic modulus of the composition.
- the weight ratio of component (B) to components (A) and (A') may be in the range of 0.8 to 4.0.
- the mass ratio of the component (A) and the component (A') is not particularly limited, but is within the range of 100:0 to 40:60 depending on the desired storage modulus and the mass ratio of the component (B). It may be designed within the range of 100:0 to 65:35, within the range of 90:10 to 65:35, within the range of 85:15 to 70:30, and the like.
- the preparation method of the organopolysiloxane composition according to the present invention is not particularly limited, and is carried out by homogeneously mixing each component.
- a solvent may be added as necessary, and the mixture may be prepared by mixing at a temperature of 0 to 200° C. using a known stirrer or kneader.
- the organopolysiloxane composition of the present invention is coated on a substrate to form a coating film, and heated under temperature conditions of 80 to 200°C, preferably 90 to 190°C. Make it a cured product.
- Coating methods include gravure coating, offset coating, offset gravure, roll coating, reverse roll coating, air knife coating, curtain coating, and comma coating.
- the coating amount can be designed to have a desired thickness according to the application such as a display device.
- the thickness of the pressure-sensitive adhesive layer after curing is 1 to 1,000 ⁇ m, and 5 to 900 ⁇ m. 10 to 800 ⁇ m, but is not limited to these.
- the silicone-based pressure-sensitive adhesive layer according to the present invention is subjected to primer treatment, corona treatment, Surface treatment such as etching treatment and plasma treatment may be performed.
- the curable organopolysiloxane composition according to the present invention is coated on a release liner, it is cured by heating under the temperature conditions described above, and the release liner is peeled off to form a film-like substrate, tape-like substrate, or After bonding with a sheet-like substrate (hereinafter referred to as "film-like substrate") or coating on a film-like substrate, it is cured by heating under the above temperature conditions, and the surface of the substrate is exposed.
- a pressure adhesive layer can be formed.
- the cured layer obtained by curing the above organopolysiloxane composition is a pressure-sensitive adhesive layer, particularly a pressure-sensitive adhesive film
- the cured layer is a film base having a release layer having release coating ability.
- the release layer is preferably a release layer having a release coating ability such as a silicone release agent, a fluorine release agent, an alkyd release agent, or a fluorosilicone release agent, or a release layer having fine physical irregularities on the substrate surface. It may be formed or the substrate itself, which is difficult to adhere to the pressure-sensitive adhesive layer of the present invention, may be used, and it is preferable to use a release layer formed by curing a fluorosilicone release agent.
- the release layer may be a differential release layer, which is a first release layer and a second release layer having different types of release agents constituting the release layer and different release strengths, and a fluorosilicone-based release agent.
- a curable reactive silicone composition containing one or more fluorine-containing groups selected from fluoroalkyl groups and perfluoropolyether groups.
- the pressure-sensitive adhesive layer between the members has the above characteristics, and the characteristics can be easily grasped by a dynamic viscoelasticity test of the pressure-sensitive adhesive. It can be manufactured by pre-selecting a pressure sensitive adhesive that meets the properties and applying or placing it between the members. It should be noted that the same method can be used to design a display device, especially a haptic display device.
- the composition that provides the pressure-sensitive adhesive layer is the above pressure-sensitive adhesive layer-forming organopolysiloxane composition and is cured to form a silicone-based pressure-sensitive adhesive layer
- the curing is performed in advance.
- the product has the above characteristics i) and ii), is preferably transparent, and gives a cured product having a glass transition point (Tg) and a specific storage modulus G' at 25°C/-20°C.
- Tg glass transition point
- G' specific storage modulus
- each composition was applied to a release liner coated with a fluorosilicone release coating to a thickness of about 100 ⁇ m after curing and cured at 150° C. for 5 minutes.
- each composition was applied to a release liner coated with a fluorosilicone release coating to a thickness of about 280 ⁇ m after curing, and cured at 150° C. for 15 minutes.
- Five or more pressure-sensitive adhesive films of 100 ⁇ m thickness and two pressure-sensitive adhesive films of 280 ⁇ m thickness were superimposed to obtain a film sample having a thickness of 500 ⁇ m or more sandwiched between release liners on both sides.
- the film was punched out to a diameter of 8 mm and attached to a parallel plate probe of a dynamic viscoelasticity device (DMA; manufactured by Anoton Paar, MCR302) for measurement. Measurements were made at temperatures up to 125° C. and at several temperatures down to ⁇ 45° C. under isothermal conditions, in shear mode at 0.1% strain, from 0.1 to 10 Hz, with decreasing temperature stepwise storage modulus. The frequency dependence of G′, loss elastic modulus G′′, and loss tangent (tan ⁇ ) was measured to obtain a master curve according to the time-temperature conversion rule.
- DMA dynamic viscoelasticity device
- Table 1 shows the materials of the curing reactive organopolysiloxane composition. The viscosity or plasticity of each component was measured at room temperature by the following method.
- Viscosity Viscosity (mPa s) is a value measured using a rotational viscometer conforming to JIS K7117-1, and kinematic viscosity (mm 2 /s) was measured using a Ubbelohde viscometer conforming to JIS Z8803. value.
- the plasticity is a value measured according to the method specified in JIS K 6249 (when a load of 1 kgf is applied to a spherical sample of 4.2 g for 3 minutes at 25 ° C., the thickness is read to 1/100 mm, and this (value multiplied by 100).
- compositions according to Examples 1 to 7 and Comparative Examples 1 to 4 were prepared, cured according to the items of (dynamic viscoelasticity) and (measurement of adhesive strength), and the adhesive strength was measured at 25°C and frequency was 100. , 200 and 300 Hz are shown in Table 2.
- Example 1 33.3 parts by mass of component a-1, 8.33 parts by mass of component a', 80.5 parts by mass of component b-3, 44.5 parts by mass of toluene, 0.692 parts by mass of component c-1 , 0.409 parts by weight of component e-1 were thoroughly mixed at room temperature, and 0.484 parts by weight of component d-1 was added to the mixture to prepare a curable organopolysiloxane composition.
- the molar ratio of SiH groups in component c-1 to alkenyl groups in component a-1 was 31.5, and the content of platinum metal relative to the solid content was 30 ppm by mass.
- Example 2 38.5 parts by weight of component a-1, 84.9 parts by weight of component b-3, 43.3 parts by weight of toluene, 0.762 parts by weight of component c-1, 0.577 parts by weight of component e- 1 was thoroughly mixed at room temperature, and 0.423 parts by mass of component d-2 was added to this mixture to obtain a curable reactive organopolysiloxane composition.
- the molar ratio of SiH groups in component c-1 to alkenyl groups in component a-1 was 30.1, and the content of platinum metal relative to the solid content was 22 ppm in mass units.
- Example 3 29.9 parts by mass of component a-1, 7.46 parts by mass of component a', 86.5 parts by mass of component b-3, 42.9 parts by mass of toluene, 0.586 parts by mass of component c-1 , and 0.409 parts by weight of component e-1 were thoroughly mixed at room temperature, and 0.355 parts by weight of component d-1 was added to the mixture to prepare a curable organopolysiloxane composition.
- the molar ratio of SiH groups in component c-1 to alkenyl groups in component a-1 was 29.8, and the content of platinum metal relative to the solid content was 22 ppm by mass.
- Example 4 18.6 parts by mass of component a-1, 18.6 parts by mass of component a', 86.7 parts by mass of component b-3, 42.8 parts by mass of toluene, 0.423 parts by mass of component c-1 , and 0.409 parts by weight of component e-1 were thoroughly mixed at room temperature, and 0.355 parts by weight of component d-1 was added to the mixture to prepare a curable organopolysiloxane composition.
- the molar ratio of SiH groups in component c-1 to alkenyl groups in component a-1 was 34.5, and the content of platinum metal relative to the solid content was 22 ppm by mass.
- Example 5 34.6 parts by weight of component a-1, 90.2 parts by weight of component b-3, 41.9 parts by weight of toluene, 0.655 parts by weight of component c-1, 0.577 parts by weight of component e- 1 was thoroughly mixed at room temperature, and 0.355 parts by mass of component d-1 was added to this mixture to obtain a curable reactive organopolysiloxane composition.
- the molar ratio of SiH groups in component c-1 to alkenyl groups in component a-1 (SiH/Vi ratio) was 28.7, and the content of platinum metal relative to the solid content was 22 ppm in mass units.
- Example 6 23.2 parts by mass of component a-1, 9.93 parts by mass of component a', 92.3 parts by mass of component b-3, 41.3 parts by mass of toluene, 0.489 parts by mass of component c-1 , and 0.409 parts by weight of component e-1 were thoroughly mixed at room temperature, and 0.355 parts by weight of component d-1 was added to the mixture to prepare a curable organopolysiloxane composition.
- the molar ratio of SiH groups in component c-1 to alkenyl groups in component a-1 was 32.1, and the content of platinum metal relative to the solid content was 22 ppm in mass units.
- Example 7 30.7 parts by weight of component a-1, 15.1 parts by weight of component b-1, 82.2 parts by weight of component b-3, 38.7 parts by weight of toluene, 0.598 parts by weight of component c- 1.
- 0.577 parts by weight of component e-1 were thoroughly mixed at room temperature, and 0.355 parts by weight of component d-1 was added to the mixture to prepare a curable organopolysiloxane composition.
- the molar ratio of SiH groups in component c-1 to alkenyl groups in component a-1 was 29.6, and the content of platinum metal relative to the solid content was 22 ppm in mass units.
- Comparative example 1 49.0 parts by weight of component a-1, 72.9 parts by weight of component b-2, 44.7 parts by weight of toluene, 1.00 parts by weight of component c-1, 0.600 parts by weight of component e- 1 was thoroughly mixed at room temperature, and 0.577 parts by weight of component d-2 was added to this mixture to obtain a curable reactive organopolysiloxane composition.
- the molar ratio of SiH groups in component c-1 to alkenyl groups in component a-1 (SiH/Vi ratio) was 31.0, and the content of platinum metal relative to the solid content was 30 ppm by mass.
- Comparative example 2 45.5 parts by weight of component a-1, 78.0 parts by weight of component b-2, 43.2 parts by weight of toluene, 0.923 parts by weight of component c-1, 0.545 parts by weight of component e- 1 was thoroughly mixed at room temperature, and 0.545 parts by mass of component d-2 was added to this mixture to obtain a curable reactive organopolysiloxane composition.
- the molar ratio of SiH groups in component c-1 to alkenyl groups in component a-1 (SiH/Vi ratio) was 31.0, and the content of platinum metal relative to the solid content was 28.3 ppm in mass units.
- Comparative Example 4 32.3 parts by weight of component a-3, 101 parts by weight of component b-1, 4.01 parts by weight of component b-3, 29.4 parts by weight of toluene, 0.761 parts by weight of component c-2, 0.491 parts by weight of component e-1 was thoroughly mixed at room temperature, and 0.355 parts by weight of component d-1 was added to the mixture to obtain a curable reactive organopolysiloxane composition.
- the molar ratio of SiH groups in component c-2 to alkenyl groups in component a-3 was 12.8, and the content of platinum metal relative to the solid content was 22 ppm by mass.
- the pressure-sensitive adhesive layer-forming organopolysiloxane compositions according to Examples 1 to 7 had excellent transparency in the pressure-sensitive adhesive layer obtained by curing thereof.
- a master curve is created using the time-temperature conversion rule from, and the loss tangent (tan ⁇ ) value at 25 ° C. obtained therefrom has a maximum value exceeding 0.9 between frequencies of 100 and 300 Hz, and Adhesive strength to PMMA shows a high adhesive strength of 500 gf/inch or more.
- the display device of the present invention has a pressure-sensitive adhesive layer having specific viscoelastic properties and adhesion between members, a display panel, a haptic integrated touch screen, and a protective cover made of a transparent member such as glass are laminated. It is suitable as a haptic integrated touch screen having a structure formed by
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Abstract
Description
本発明に係る表示装置は、ハプティック機能を有することが好ましい。ここで、「ハプティック機能」は、力、振動及びモーション(運動)のような触覚によるフィードバック効果または通知により、使用者に触覚を与える機能であり、本明細書において、ハプティック機能を備えた装置を「ハプティックデバイス」、ハプティック機能を備えた表示装置のことを単に「ハプティック表示装置」と呼ぶことがある。
本発明にかかる表示装置に用いられる感圧接着剤層は、25℃において、その動的粘弾性測定によって得られる周波数分散曲線(後述する時間-温度換算則に従って得られるマスターカーブを含む)において、周波数f(Hz)が100~300Hzの範囲内での当該感圧接着剤層の損失正接tanδ(f)の最大値が0.9以上であることを特徴とし、さらに、同周波数の範囲内においてtanδ(f)の最大値が0.95以上、1.0以上、1.1以上または1.2以上であり、最大値が0.9~2.1の範囲内、0.95~2.05の範囲内、1.0~2.0の範囲内であってよい。なお、本発明にかかる表示装置に用いられる感圧接着剤層は、上記周波数の範囲内において前記の最大値を有する限り、一部の周波数(f)においてtanδ(f)が0.90未満の値であってもよいが、ハプティック表示装置の性能の見地から、100~300Hzの周波数f(Hz)においてtanδ(f)の値が0.70以下とならないことがより好ましい。なお、本明細書において、特段の記載がない限り、ある周波数f(Hz)における感圧接着剤層の損失正接tanδ(f)は、25℃における値である。
ある周波数(f)Hzにおける感圧接着剤層の損失正接tanδ(f)の値は、温度を一定(本件では25℃)にして周波数分散測定法に基づいてある周波数領域におけるtanδ(f)を実測して周波数分散曲線を得たり、より狭い周波数範囲で温度を変えながら測定したデータに基づいて、公知の手法である時間-温度換算則に従ってtanδ(f)の周波数(f)に関する依存性を示すマスターカーブを作成することにより特定乃至導出することができる。本発明により、25℃において、表示装置に用いる感圧接着剤層の周波数f(Hz)が100~300Hzの範囲内における損失正接tanδ(f)に関する挙動から、ユーザーの触感としてのハプティック機能の改善、特にユーザーの使用感および知覚について適合性および有効性を事前に容易に判断することができ、ハプティック表示装置における材料選択および設計に利用することができる。
一般的に動的粘弾性測定は、試験片に周波数ωの歪を正弦波で与え、対応する応力を測定する。粘性体の場合、与えられた歪エネルギーは熱として散逸するため速度に変わり、90°の位相差が生じる。弾性体の場合は応力と歪が比例関係にあるので、位相差が生じない。粘弾性体では、応力と歪の比として定義される弾性率は周波数ωの関数で複素数となり、実数部が弾性成分、貯蔵弾性率となり、虚数部分が粘性成分、損失弾性率となる。
本発明にかかる表示装置に用いられる感圧接着剤層は前記の特徴i)に加えて、実用上、十分な粘着力を有することを特徴とする。例えば、非接着性のゲル材料や誘電性高分子材料の中には、損失正接tanδ(f)が前記の特徴i)を充足する材料も存在するが、粘着力が不十分である場合、表示装置を構成する部材間の接着性が不十分となって、表示装置本体の信頼性および耐久性の改善という本発明の目標を達成できなくなる場合があり、かつ、特にハプティック機能を有する部材とユーザーインターフェースが十分に密着できない場合、部材間の層間剥離などにより、結果的にユーザータッチに対するハプティックな応答、信号乃至フィードバックに対するユーザーの触感、使用感や応答性が低下し、ハプティック機能を十分に改善できない場合がある。
本発明にかかる表示装置に用いられる感圧接着剤層、特にシリコーン系の感圧接着剤層は、実質的に透明、半透明または不透明のいずれであってもよく、当該感圧接着剤層の用途に応じてその透明性を設計することができる。目視で透明である場合、より客観的には、厚み100μmの硬化層からなる表示装置用の感圧接着層の波長450nmの光の透過率が、空気の光透過率を100%とした場合に、80%以上であり、好適には90%以上であり、95%以上に設計してもよい。また、透明性や光透過率を損なわない範囲で、フィラー成分または添加剤を使用してもよい。ただし、当該表示装置内おいて、光透過性が求められない電気・電子部品の接着等においては、半透明~不透明な感圧接着層であってもよく、光透過性以外の要求特性に応じて、着色性あるいは光透過性を損なうようなフィラー成分または添加剤を利用しても良い。
本発明に係る表示装置において、その部材間に接着層乃至中間層として配置される感圧接着剤層は、上記の特徴i)および特徴ii)を備え、任意で特徴iii)その他の特性を備えてもよく、その種類について特に制限されないが、例えばシリコーン系感圧接着剤、アクリル系感圧接着剤、及びウレタン系感圧接着剤からなる群から選択された少なくとも1種を使用することができる。経済性、他の基材への接着性、耐久性の点ではアクリル系感圧接着剤を選択してもよいが、特に長期に及ぶ、耐熱性、耐寒性、耐光性および透明性の点ではシリコーン系感圧接着剤を有利に選択することができ、シリコーン系OCAの使用が極めて好ましい。
本発明における表示装置は、上記の特性を備える感圧接着剤層を部材間に有することが好ましいものであるが、特に、このような感圧接着剤層として、以下に述べる感圧接着剤層形成性オルガノポリシロキサン組成物を硬化させてなるシリコーン系感圧接着剤層の使用が好ましい。
(A)分子内に平均して1を超える数のアルケニル基を有する鎖状オルガノポリシロキサン、
(B)分子内の全ケイ素原子に対する水酸基および加水分解性基の含有量の和が9モル%以下であるオルガノポリシロキサンレジン、
(C)分子内に少なくとも2個のSi-H結合を有するオルガノハイドロジェンポリシロキサン、
(D)有効量のヒドロシリル化反応触媒、および
任意で、(A´)分子内に炭素-炭素二重結合含有反応性基を含まない鎖状オルガノポリシロキサン
を含有してなる。また、当該組成物は、ヒドロシリル化反応触媒を含むので、取扱作業性の見地から、さらに、(E)硬化遅延剤を含有してもよく、本発明の目的に反しない範囲で、その他の添加剤を含むものであってよい。以下、各成分について説明する。
本発明において、任意選択により、(A)成分と共に、1,3,5,7-テトラメチル―1,3,5,7-テトラビニルシクロテトラシロキサン等のアルケニル基を有する環状シロキサン類を少量使用してもよい。これらの環状シロキサン類は、反応性希釈剤または硬化反応性の制御剤としての機能を果たす場合があり、必要に応じて使用することができる。
(b1)分子内の全ケイ素原子に対する水酸基および加水分解性基の含有量の和が9モル%以下であり、トルエンを溶媒としたゲルパーミエーションクロマトグラフィー(GPC)により標準ポリスチレン換算で測定される重量平均分子量(Mw)が4500以上であるオルガノポリシロキサンレジン、
(b2)分子内の全ケイ素原子に対する水酸基および加水分解性基の含有量の和が9モル%以下であり、ゲルパーミエーションクロマトグラフィー(GPC)により標準ポリスチレン換算で測定される重量平均分子量(Mw)が4500未満であるオルガノポリシロキサンレジン
本発明に係る感圧接着層形成性オルガノポリシロキサン組成物は、鎖状の反応性シロキサン成分である(A)成分および後述する(A´)成分の和に対する、オルガノポリシロキサンレジンである(B)成分の質量比が0.8~4.0の範囲内にあることが好ましい。(B)成分として、上記の特徴的なオルガノポリシロキサンレジンまたはその混合物を選択し、かつ、鎖状のシロキサンポリマー成分に対して上記のレジン成分が前記範囲となるように配合されていると、本発明の目的とする適切な損失正接値等の粘弾特性が好適に実現されるためである。
本発明にかかる好適な感圧接着剤層を与える組成物は、ヒドロシリル化反応硬化性であり、(C)成分の使用量は、組成物がヒドロシリル化反応により十分に硬化することができれば特に制限されるものではないが、組成物中の(A)成分中のアルケニル基の量(物質量)および(B)成分中のアルケニル基の量(物質量)の和に対する(C)成分中のケイ素原子結合水素原子(SiH)基の物質量、すなわちモル比が0.1~100の範囲内であることが好ましく、0.5~60の範囲内、1.0~50の範囲内、または1.0~40の範囲内であっても良い。なお、当該モル比を以下、「SiH/Vi比」と呼ぶことがある。
本発明にかかるオルガノポリシロキサン組成物は、ヒドロシリル化反応触媒を含む。ヒドロシリル化反応触媒としては、白金系触媒、ロジウム系触媒、パラジウム系触媒が例示され、本組成物の硬化を著しく促進できることから白金系触媒が好ましい。この白金系触媒としては、白金-アルケニルシロキサン錯体が好ましく、特に、この白金-アルケニルシロキサン錯体の安定性が良好であることから、1,3-ジビニル-1,1,3,3-テトラメチルジシロキサンであることが好ましい。なお、ヒドロシリル化反応を促進する触媒としては、鉄、ルテニウム、鉄/コバルトなどの非白金系金属触媒を用いてもよい。
本発明にかかる好適なオルガノポリシロキサン組成物には、アルケニル基、アクリル基、メタクリル基等の炭素-炭素二重結合含有反応性基を含まないポリジメチルシロキサンまたはポリジメチルジフェニルシロキサンなどの非反応性のオルガノポリシロキサンを配合することができ、これにより、後述する感圧接着層の損失係数(tanδ)、貯蔵弾性率(G')損失弾性率(G'')を改善することができる場合がある。例えば、水酸基末端を有するポリジメチルシロキサン、トリメチルシロキシ末端を有するポリジメチルシロキサンまたはポリジメチルジフェニルシロキサンの使用により、感圧接着層の損失係数を増加させることができ、そのような組成物は、本発明の範囲に包含される。
好適には、本発明に係るシリコーン系の感圧接着剤層は、被着体との密着性を向上させるために、感圧接着剤層または基材の表面に対してプライマー処理、コロナ処理、エッチング処理、プラズマ処理等の表面処理を行ってもよい。
本発明に係る表示装置は、その部材間における感圧接着剤層が前記の特徴を有するものであり、当該特徴は感圧接着剤の動的粘弾性試験により容易に把握されることから、当該特性を満たす感圧接着剤を事前に選択し、部材間に塗布または配置することで製造することができる。なお、同方法により表示装置、特にハプティック表示装置を設計することができる。
表1に示す各成分を用いて、各実施例・比較例に示す硬化反応性のオルガノポリシロキサン組成物を調製した。なお、表1における%は全て質量%である。
Waters社製Allianceゲルパーミエーションクロマトグラフィー(GPC)を用い、トルエンを溶媒として、標準ポリスチレン換算で、オルガノポリシロキサンレジン等のオルガノポリシロキサン成分の重量平均分子量(Mw)、数平均分子量(Mn)を求めた。
ガラスフリープローブを備えたブルカー製ACP-30029Si NMRスペクトロメーターを用い、テトラメチルシランの化学シフトを0ppmとしたときに、-93から-103.5ppmに現れるSi(OH)O2/3単位の全シリコンに対する存在比率からモル含量を得、さらに、オルガノポリシロキサンレジン中の水酸基(OH)の質量%にも換算した。なお、以下の実施例におけるオルガノポリシロキサンレジン中に水酸基以外の加水分解性官能基は含まれていなかった。
各組成物を、PETフィルム(株式会社東レ製、製品名ルミラー(登録商標)S10、厚さ50μm)に硬化後の厚みが50μmとなるように塗工し、150℃、3分間で硬化させた。1日放置後、同試料を幅20mmに切断し、粘着層面をPMMA板(パルテック製、アクリライトL001,50×120×2mm)にローラーを用いて貼り合せて試験片とした。PMMA板を用いた試験片は、オリエンテック社製RTC-1210引っ張り試験機を用いてJIS Z 0237に準じて180°引き剥がし試験方法を用いて引張速度300mm/minにて粘着力(20mm幅での測定を表示単位gf/inchに換算)を測定した。結果を表2に示す。
各組成物を硬化後の厚みが約100μmになるようにフロロシリコーン剥離コーティングを塗工した剥離ライナーに塗工し、150℃で5分間硬化させた。あるいは各組成物を硬化後の厚みが約280μmになるようにフロロシリコーン剥離コーティングを塗工した剥離ライナーに塗工し、150℃、15分間で硬化させた。この感圧接着剤フィルムを、100μmの場合は5枚以上、280μmの場合は2枚重ね合わせ、厚さ500μm以上である、両面を剥離ライナーに挟まれたフィルムサンプルを得た。当該フィルムを直径8mmにくりぬき、動的粘弾性装置(DMA; Anoton Paar社製、MCR302)のパラレルプレートプローブに貼り付けて測定した。測定は、温度を125℃まで上げ、-45℃までいくつかの温度で、等温条件下、0.1%歪のせん断モードで0.1~10Hzで、段階的に温度を下げながら貯蔵弾性率G'、損失弾性率G''、損失正接(tanδ)の周波数依存性を測定し、時間-温度換算則によりマスターカーブを得た。続いて-70℃~200℃の範囲で、周波数1Hz、昇温速度3℃/分にてこれらの温度依存性を測定した。マスターカーブより得た、25℃においての、周波数100、200、300Hzにおける損失正接(tanδ)の値を表2に示す。
粘度(mPa・s)は、JIS K7117-1に準拠した回転粘度計を使用して測定した値であり、動粘度(mm2/s)は、JIS Z8803に準拠したウベローデ型粘度計によって測定した値である。
可塑度は、JIS K 6249に規定される方法に準じて測定された値(25℃、4.2gの球状試料に1kgfの荷重を3分間かけたときの厚さを1/100mmまで読み、この数値を100倍したもの)で示した。
各実施例・比較例に示す硬化反応性のオルガノポリシロキサン組成物を硬化後の厚みが100μmとなるように塗工し、150℃、3分間で硬化させ、光透過率を測定した。実施例および比較例にかかる硬化物はすべて良好な透明性を備えることが目視で確認でき、その光透過率は空気を100%とした場合、いずれも95%以上であった。
以下、実施例1~7、比較例1~4にかかる組成物を準備し、上記の(動的粘弾性)および(粘着力測定)の項目に従って硬化させ、その粘着力,25℃、周波数100、200、300Hzにおける損失正接(tanδ)を表2に示した。
33.3質量部の成分a-1、8.33質量部の成分a´、80.5質量部の成分b-3、44.5質量部のトルエン、0.692質量部の成分c-1、0.409質量部の成分e-1を室温でよく混合し、この混合物に0.484質量部の成分d-1を加えて硬化反応性のオルガノポリシロキサン組成物とした。成分a-1中のアルケニル基に対する成分c-1中のSiH基のモル比(SiH/Vi比)は31.5、白金金属の固形分に対する含量は質量単位で30ppmであった。
38.5質量部の成分a-1、84.9質量部の成分b-3、43.3質量部のトルエン、0.762質量部の成分c-1、0.577質量部の成分e-1を室温でよく混合し、この混合物に0.423質量部の成分d-2を加えて硬化反応性のオルガノポリシロキサン組成物とした。成分a-1中のアルケニル基に対する成分c-1中のSiH基のモル比(SiH/Vi比)は30.1、白金金属の固形分に対する含量は質量単位で22ppmであった。
29.9質量部の成分a-1、7.46質量部の成分a´、86.5質量部の成分b-3、42.9質量部のトルエン、0.586質量部の成分c-1、0.409質量部の成分e-1を室温でよく混合し、この混合物に0.355質量部の成分d-1を加えて硬化反応性のオルガノポリシロキサン組成物とした。成分a-1中のアルケニル基に対する成分c-1中のSiH基のモル比(SiH/Vi比)は29.8、白金金属の固形分に対する含量は質量単位で22ppmであった。
18.6質量部の成分a-1、18.6質量部の成分a´、86.7質量部の成分b-3、42.8質量部のトルエン、0.423質量部の成分c-1、0.409質量部の成分e-1を室温でよく混合し、この混合物に0.355質量部の成分d-1を加えて硬化反応性のオルガノポリシロキサン組成物とした。成分a-1中のアルケニル基に対する成分c-1中のSiH基のモル比(SiH/Vi比)は34.5、白金金属の固形分に対する含量は質量単位で22ppmであった。
34.6質量部の成分a-1、90.2質量部の成分b-3、41.9質量部のトルエン、0.655質量部の成分c-1、0.577質量部の成分e-1を室温でよく混合し、この混合物に0.355質量部の成分d-1を加えて硬化反応性のオルガノポリシロキサン組成物とした。成分a-1中のアルケニル基に対する成分c-1中のSiH基のモル比(SiH/Vi比)は28.7、白金金属の固形分に対する含量は質量単位で22ppmであった。
23.2質量部の成分a-1、9.93質量部の成分a´、92.3質量部の成分b-3、41.3質量部のトルエン、0.489質量部の成分c-1、0.409質量部の成分e-1を室温でよく混合し、この混合物に0.355質量部の成分d-1を加えて硬化反応性のオルガノポリシロキサン組成物とした。成分a-1中のアルケニル基に対する成分c-1中のSiH基のモル比(SiH/Vi比)は32.1、白金金属の固形分に対する含量は質量単位で22ppmであった。
30.7質量部の成分a-1、15.1質量部の成分b-1、82.2質量部の成分b-3、38.7質量部のトルエン、0.598質量部の成分c-1、0.577質量部の成分e-1を室温でよく混合し、この混合物に0.355質量部の成分d-1を加えて硬化反応性のオルガノポリシロキサン組成物とした。成分a-1中のアルケニル基に対する成分c-1中のSiH基のモル比(SiH/Vi比)は29.6、白金金属の固形分に対する含量は質量単位で22ppmであった。
49.0質量部の成分a-1、72.9質量部の成分b-2、44.7質量部のトルエン、1.00質量部の成分c-1、0.600質量部の成分e-1を室温でよく混合し、この混合物に0.577質量部の成分d-2を加えて硬化反応性のオルガノポリシロキサン組成物とした。成分a-1中のアルケニル基に対する成分c-1中のSiH基のモル比(SiH/Vi比)は31.0、白金金属の固形分に対する含量は質量単位で30ppmであった。
45.5質量部の成分a-1、78.0質量部の成分b-2、43.2質量部のトルエン、0.923質量部の成分c-1、0.545質量部の成分e-1を室温でよく混合し、この混合物に0.545質量部の成分d-2を加えて硬化反応性のオルガノポリシロキサン組成物とした。成分a-1中のアルケニル基に対する成分c-1中のSiH基のモル比(SiH/Vi比)は31.0、白金金属の固形分に対する含量は質量単位で28.3ppmであった。
36.2質量部の成分a-2、99.6質量部の成分b-1、30.8質量部のトルエン、0.332質量部の成分c-2、0.332質量部の成分e-2を室温でよく混合し、この混合物に0.602質量部の成分d-1を加えて硬化反応性のオルガノポリシロキサン組成物とした。成分a-2中のアルケニル基に対する成分c-2中のSiH基のモル比(SiH/Vi比)は23.0、白金金属の固形分に対する含量は質量単位で40ppmであった。
32.3質量部の成分a-3、101質量部の成分b-1、4.01質量部の成分b-3、29.4質量部のトルエン、0.761質量部の成分c-2、0.491質量部の成分e-1を室温でよく混合し、この混合物に0.355質量部の成分d-1を加えて硬化反応性のオルガノポリシロキサン組成物とした。成分a-3中のアルケニル基に対する成分c-2中のSiH基のモル比(SiH/Vi比)は12.8、白金金属の固形分に対する含量は質量単位で22ppmであった。
Claims (11)
- 以下の特徴i)および特徴ii)を有する感圧接着剤層を、部材間に有する表示装置。
特徴i):25℃、100~300Hzの周波数f(Hz)における損失正接tanδ(f)の最大値が0.9以上である。
特徴ii):当該感圧接着剤層の厚みが50μmのとき、厚み2mmのポリメチルメタクリレートシートに対する、JIS Z 0237に従う180°引き剥がし試験方法を用いて引張速度300mm/minにより測定される粘着力が500gf/inch以上である。 - 前記の特徴i)について、25℃、100~300Hzの周波数f(Hz)における少なくとも一つの連続した周波数領域において、損失正接tanδ(f)が0.9以上である、請求項1に記載の表示装置。
- 前記の特徴i)について、25℃、100~300Hzの周波数f(Hz)における損失正接tanδ(f)の最大値が0.9以上であり、かつ、前記周波数の範囲内における損失正接tanδ(f)が0.70以下にはならない、請求項1に記載の表示装置。
- 前記の特徴i)について、25℃、100~300Hzの周波数f(Hz)における損失正接tanδ(f)の最大値が1.0以上であり、かつ、
前記の特徴ii)について、粘着力が600~4000gf/inchの範囲内である、請求項1に記載の表示装置。 - 感圧接着剤層が、
(A)分子内に平均して1を超える数のアルケニル基を有する鎖状オルガノポリシロキサン、
(B)分子内の全ケイ素原子に対する水酸基および加水分解性基の含有量の和が9モル%以下であるオルガノポリシロキサンレジン、
(C)分子内に少なくとも2個のSi-H結合を有するオルガノハイドロジェンポリシロキサン、
(D)有効量のヒドロシリル化反応触媒
を含有する感圧接着剤層形成性オルガノポリシロキサン組成物の硬化物により形成されている、請求項1に記載の表示装置。 - (A)成分の少なくとも一部が、25℃において100,000mPa・s以上の粘度を有するか、JIS K6249に規定される方法に準じて測定された可塑度が50~200の範囲にある生ゴム状のアルケニル基含有オルガノポリシロキサンであり、そのアルケニル基中のビニル(CH2=CH)部分の含有量が0.005~0.400質量%の範囲内にある鎖状オルガノポリシロキサンであり、
(B)成分が、R3SiO1/2単位(式中、Rは一価有機基であり、Rの90モル%以上が炭素数1~6のアルキル基またはフェニル基である;M単位)及びSiO4/2単位(Q単位)から実質的になるオルガノポリシロキサンレジンまたはその混合物であり、
(C)成分の量が、上記の(A)成分中および(B)成分中のアルケニル基の物質量の和に対する(c)成分中のSiH基の物質量の比(モル比)が0.1~100の範囲内となる量であり、
(D)成分の量が、組成物中の固形分中の白金系金属の含有量が0.1~200ppmの範囲内となる量である、請求項5に記載の表示装置。 - 感圧接着剤層が、さらに、以下の特徴iii)を有する、請求項1に記載の表示装置。
特徴iii):厚み100μmの感圧接着層の波長450nmの光の透過率が、空気の光透過率を100%とした場合に、80%以上である。 - タッチパネル付き表示装置である、請求項1~請求項7のいずれか1項に記載の表示装置。
- ハプティック機能付き表示装置である、請求項1~請求項7のいずれか1項に記載の表示装置。
- 表示面への接触を認識する機能、接触に対する触覚的フィードバックまたは通知を行うハプティック機能を備えたハプティック表示装置である、請求項1~請求項7のいずれか1項に記載の表示装置。
- 以下の特徴i)および特徴ii)を有する感圧接着剤層を、装置のハプティック機能を実現乃至改善する目的で表示装置を構成する部材間に配置する、表示装置の設計方法。
特徴i):25℃、100~300Hzの周波数f(Hz)における損失正接tanδ(f)の最大値が0.9以上である。
特徴ii):当該感圧接着剤層の厚みが50μmのとき、厚み2mmのポリメチルメタクリレートシートに対する、JIS Z 0237に従う180°引き剥がし試験方法を用いて引張速度300mm/minにより測定される粘着力が500gf/inch以上である。
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| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| WO2024130669A1 (en) * | 2022-12-23 | 2024-06-27 | Dow Silicones Corporation | Electronic article having interlayer adhesive layer with damping/shock-absorption function |
| FR3156009A1 (fr) * | 2023-11-29 | 2025-05-30 | Hap2U | Adhésif pour dispositif haptique |
| WO2025114113A1 (fr) * | 2023-11-29 | 2025-06-05 | Vibra Nova | Adhésif pour dispositif haptique |
Also Published As
| Publication number | Publication date |
|---|---|
| KR20240015655A (ko) | 2024-02-05 |
| JPWO2022255328A1 (ja) | 2022-12-08 |
| TW202248394A (zh) | 2022-12-16 |
| US20240327680A1 (en) | 2024-10-03 |
| EP4349932A1 (en) | 2024-04-10 |
| EP4349932A4 (en) | 2025-05-07 |
| CN117255842A (zh) | 2023-12-19 |
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