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WO2022139436A1 - Dispositif électronique comprenant une caméra - Google Patents

Dispositif électronique comprenant une caméra Download PDF

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Publication number
WO2022139436A1
WO2022139436A1 PCT/KR2021/019564 KR2021019564W WO2022139436A1 WO 2022139436 A1 WO2022139436 A1 WO 2022139436A1 KR 2021019564 W KR2021019564 W KR 2021019564W WO 2022139436 A1 WO2022139436 A1 WO 2022139436A1
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WO
WIPO (PCT)
Prior art keywords
camera
electronic device
support
length
region
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Ceased
Application number
PCT/KR2021/019564
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English (en)
Korean (ko)
Inventor
김문경
김일영
이정석
김한응
허재영
김승용
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Samsung Electronics Co Ltd
Original Assignee
Samsung Electronics Co Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Samsung Electronics Co Ltd filed Critical Samsung Electronics Co Ltd
Publication of WO2022139436A1 publication Critical patent/WO2022139436A1/fr
Anticipated expiration legal-status Critical
Ceased legal-status Critical Current

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Classifications

    • H—ELECTRICITY
    • H04—ELECTRIC COMMUNICATION TECHNIQUE
    • H04N—PICTORIAL COMMUNICATION, e.g. TELEVISION
    • H04N23/00—Cameras or camera modules comprising electronic image sensors; Control thereof
    • H04N23/57—Mechanical or electrical details of cameras or camera modules specially adapted for being embedded in other devices
    • G—PHYSICS
    • G03—PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
    • G03B—APPARATUS OR ARRANGEMENTS FOR TAKING PHOTOGRAPHS OR FOR PROJECTING OR VIEWING THEM; APPARATUS OR ARRANGEMENTS EMPLOYING ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ACCESSORIES THEREFOR
    • G03B30/00—Camera modules comprising integrated lens units and imaging units, specially adapted for being embedded in other devices, e.g. mobile phones or vehicles
    • H—ELECTRICITY
    • H04—ELECTRIC COMMUNICATION TECHNIQUE
    • H04N—PICTORIAL COMMUNICATION, e.g. TELEVISION
    • H04N23/00—Cameras or camera modules comprising electronic image sensors; Control thereof
    • H04N23/50—Constructional details
    • H04N23/51—Housings
    • H—ELECTRICITY
    • H04—ELECTRIC COMMUNICATION TECHNIQUE
    • H04N—PICTORIAL COMMUNICATION, e.g. TELEVISION
    • H04N23/00—Cameras or camera modules comprising electronic image sensors; Control thereof
    • H04N23/50—Constructional details
    • H04N23/55—Optical parts specially adapted for electronic image sensors; Mounting thereof

Definitions

  • Various embodiments of the present invention relate to an electronic device including a camera.
  • Various types of cameras may be mounted on the electronic device.
  • a plurality of cameras may be included in the electronic device to enable shooting under various shooting conditions (eg, focal length and angle of view).
  • the electronic device may include a standard, wide-angle, or telephoto camera according to an angle of view.
  • the camera included in the electronic device may be fixed using a camera housing that can fix the camera to the electronic device. Since the camera housing is disposed adjacent to a lens barrel of the camera, light reflected from the camera housing may be introduced into the lens of the camera due to a design element of the camera housing, and a flare phenomenon may occur.
  • an electronic device including a camera housing may include a structure capable of preventing an image flare phenomenon due to reflection of light by the camera housing.
  • An electronic device includes: a camera including a camera barrel in which a lens assembly is accommodated; a camera housing including an opening corresponding to the camera barrel and disposed to substantially surround the camera; and a transparent region formed to be transparent in a portion corresponding to the opening, and a camera window disposed in the camera housing, wherein the camera housing includes a support; and a frame portion forming a first step with the support portion. and a decoration part forming a second step difference with the support part and having a thickness and length decreasing as the support part approaches the opening.
  • the electronic device may prevent light reflected by the camera housing from being incident on the camera lens while exposing the structure for designing the camera housing.
  • the electronic device may prevent image flare phenomenon by preventing light reflected by the camera housing from being incident on the camera lens.
  • FIG. 1 is a block diagram of an electronic device in a network environment according to various embodiments of the present disclosure
  • FIG. 2A is a perspective view illustrating a front surface of an electronic device according to various embodiments of the present disclosure
  • FIG. 2B is a perspective view illustrating a rear surface of the electronic device shown in FIG. 2A .
  • 3A is an exploded perspective view of a camera structure according to various embodiments disclosed herein.
  • FIG. 3B is a plan view of the camera window shown in FIG. 3A .
  • 3C is a plan view of the camera housing shown in FIG. 3A .
  • FIG. 3D is a plan view of the camera structure shown in FIG. 3A .
  • FIG. 4 is a cross-sectional view taken along line A-B of the camera structure shown in FIG. 3D.
  • FIG. 5 is a cross-sectional view taken along line A-B of the camera structure shown in FIG. 3D according to various embodiments of the present invention.
  • FIG. 6 is a cross-sectional view taken along line A-B of the camera structure shown in FIG. 3D according to various embodiments of the present invention.
  • FIG. 7 is a cross-sectional view taken along line A-B of the camera structure shown in FIG. 3D according to various embodiments of the present invention.
  • FIG. 8 is a cross-sectional view taken along line A-B of the camera structure shown in FIG. 3D according to various embodiments of the present invention.
  • FIG. 9 is a cross-sectional view taken along line A-B of the camera structure shown in FIG. 3D according to various embodiments of the present invention.
  • FIG. 1 is a block diagram of an electronic device 101 in a network environment 100 according to various embodiments.
  • an electronic device 101 communicates with an electronic device 102 through a first network 198 (eg, a short-range wireless communication network) or a second network 199 . It may communicate with at least one of the electronic device 104 and the server 108 through (eg, a long-distance wireless communication network). According to an embodiment, the electronic device 101 may communicate with the electronic device 104 through the server 108 .
  • a first network 198 eg, a short-range wireless communication network
  • a second network 199 e.g., a second network 199
  • the electronic device 101 may communicate with the electronic device 104 through the server 108 .
  • the electronic device 101 includes a processor 120 , a memory 130 , an input module 150 , a sound output module 155 , a display module 160 , an audio module 170 , and a sensor module ( 176), interface 177, connection terminal 178, haptic module 179, camera module 180, power management module 188, battery 189, communication module 190, subscriber identification module 196 , or an antenna module 197 may be included.
  • at least one of these components eg, the connection terminal 178
  • may be omitted or one or more other components may be added to the electronic device 101 .
  • some of these components are integrated into one component (eg, display module 160 ). can be
  • the processor 120 for example, executes software (eg, a program 140) to execute at least one other component (eg, a hardware or software component) of the electronic device 101 connected to the processor 120 . It can control and perform various data processing or operations. According to one embodiment, as at least part of data processing or operation, the processor 120 converts commands or data received from other components (eg, the sensor module 176 or the communication module 190 ) to the volatile memory 132 . may be stored in the volatile memory 132 , and may process commands or data stored in the volatile memory 132 , and store the result data in the non-volatile memory 134 .
  • software eg, a program 140
  • the processor 120 converts commands or data received from other components (eg, the sensor module 176 or the communication module 190 ) to the volatile memory 132 .
  • the volatile memory 132 may be stored in the volatile memory 132 , and may process commands or data stored in the volatile memory 132 , and store the result data in the non-volatile memory 134 .
  • the processor 120 is the main processor 121 (eg, a central processing unit or an application processor) or a secondary processor 123 (eg, a graphic processing unit, a neural network processing unit) a neural processing unit (NPU), an image signal processor, a sensor hub processor, or a communication processor).
  • the main processor 121 e.g, a central processing unit or an application processor
  • a secondary processor 123 eg, a graphic processing unit, a neural network processing unit
  • NPU neural processing unit
  • an image signal processor e.g., a sensor hub processor, or a communication processor.
  • the main processor 121 e.g, a central processing unit or an application processor
  • a secondary processor 123 eg, a graphic processing unit, a neural network processing unit
  • NPU neural processing unit
  • an image signal processor e.g., a sensor hub processor, or a communication processor.
  • the main processor 121 e.g, a central processing unit or an application processor
  • a secondary processor 123
  • the auxiliary processor 123 is, for example, on behalf of the main processor 121 while the main processor 121 is in an inactive (eg, sleep) state, or the main processor 121 is active (eg, executing an application). ), together with the main processor 121, at least one of the components of the electronic device 101 (eg, the display module 160, the sensor module 176, or the communication module 190) It is possible to control at least some of the related functions or states.
  • the co-processor 123 eg, an image signal processor or a communication processor
  • may be implemented as part of another functionally related component eg, the camera module 180 or the communication module 190. have.
  • the auxiliary processor 123 may include a hardware structure specialized for processing an artificial intelligence model.
  • Artificial intelligence models can be created through machine learning. Such learning may be performed, for example, in the electronic device 101 itself on which the artificial intelligence model is performed, or may be performed through a separate server (eg, the server 108).
  • the learning algorithm may include, for example, supervised learning, unsupervised learning, semi-supervised learning, or reinforcement learning, but in the above example not limited
  • the artificial intelligence model may include a plurality of artificial neural network layers.
  • Artificial neural networks include deep neural networks (DNNs), convolutional neural networks (CNNs), recurrent neural networks (RNNs), restricted boltzmann machines (RBMs), deep belief networks (DBNs), bidirectional recurrent deep neural networks (BRDNNs), It may be one of deep Q-networks or a combination of two or more of the above, but is not limited to the above example.
  • the artificial intelligence model may include, in addition to, or alternatively, a software structure in addition to the hardware structure.
  • the memory 130 may store various data used by at least one component of the electronic device 101 (eg, the processor 120 or the sensor module 176 ).
  • the data may include, for example, input data or output data for software (eg, the program 140 ) and instructions related thereto.
  • the memory 130 may include a volatile memory 132 or a non-volatile memory 134 .
  • the program 140 may be stored as software in the memory 130 , and may include, for example, an operating system 142 , middleware 144 , or an application 146 .
  • the input module 150 may receive a command or data to be used in a component (eg, the processor 120 ) of the electronic device 101 from the outside (eg, a user) of the electronic device 101 .
  • the input module 150 may include, for example, a microphone, a mouse, a keyboard, a key (eg, a button), or a digital pen (eg, a stylus pen).
  • the sound output module 155 may output a sound signal to the outside of the electronic device 101 .
  • the sound output module 155 may include, for example, a speaker or a receiver.
  • the speaker can be used for general purposes such as multimedia playback or recording playback.
  • the receiver may be used to receive an incoming call. According to one embodiment, the receiver may be implemented separately from or as part of the speaker.
  • the display module 160 may visually provide information to the outside (eg, a user) of the electronic device 101 .
  • the display module 160 may include, for example, a control circuit for controlling a display, a hologram device, or a projector and a corresponding device.
  • the display module 160 may include a touch sensor configured to sense a touch or a pressure sensor configured to measure the intensity of a force generated by the touch.
  • the audio module 170 may convert a sound into an electric signal or, conversely, convert an electric signal into a sound. According to an embodiment, the audio module 170 acquires a sound through the input module 150 , or an external electronic device (eg, a sound output module 155 ) connected directly or wirelessly with the electronic device 101 . A sound may be output through the electronic device 102 (eg, a speaker or headphones).
  • an external electronic device eg, a sound output module 155
  • a sound may be output through the electronic device 102 (eg, a speaker or headphones).
  • the sensor module 176 detects an operating state (eg, power or temperature) of the electronic device 101 or an external environmental state (eg, user state), and generates an electrical signal or data value corresponding to the sensed state. can do.
  • the sensor module 176 may include, for example, a gesture sensor, a gyro sensor, a barometric pressure sensor, a magnetic sensor, an acceleration sensor, a grip sensor, a proximity sensor, a color sensor, an IR (infrared) sensor, a biometric sensor, It may include a temperature sensor, a humidity sensor, or an illuminance sensor.
  • the interface 177 may support one or more designated protocols that may be used by the electronic device 101 to directly or wirelessly connect with an external electronic device (eg, the electronic device 102 ).
  • the interface 177 may include, for example, a high definition multimedia interface (HDMI), a universal serial bus (USB) interface, an SD card interface, or an audio interface.
  • HDMI high definition multimedia interface
  • USB universal serial bus
  • SD card interface Secure Digital Card
  • the connection terminal 178 may include a connector through which the electronic device 101 can be physically connected to an external electronic device (eg, the electronic device 102 ).
  • the connection terminal 178 may include, for example, an HDMI connector, a USB connector, an SD card connector, or an audio connector (eg, a headphone connector).
  • the haptic module 179 may convert an electrical signal into a mechanical stimulus (eg, vibration or movement) or an electrical stimulus that the user can perceive through tactile or kinesthetic sense.
  • the haptic module 179 may include, for example, a motor, a piezoelectric element, or an electrical stimulation device.
  • the camera module 180 may capture still images and moving images. According to an embodiment, the camera module 180 may include one or more lenses, image sensors, image signal processors, or flashes.
  • the power management module 188 may manage power supplied to the electronic device 101 .
  • the power management module 188 may be implemented as, for example, at least a part of a power management integrated circuit (PMIC).
  • PMIC power management integrated circuit
  • the battery 189 may supply power to at least one component of the electronic device 101 .
  • battery 189 may include, for example, a non-rechargeable primary cell, a rechargeable secondary cell, or a fuel cell.
  • the communication module 190 is a direct (eg, wired) communication channel or a wireless communication channel between the electronic device 101 and an external electronic device (eg, the electronic device 102, the electronic device 104, or the server 108). It can support establishment and communication performance through the established communication channel.
  • the communication module 190 may include one or more communication processors that operate independently of the processor 120 (eg, an application processor) and support direct (eg, wired) communication or wireless communication.
  • the communication module 190 is a wireless communication module 192 (eg, a cellular communication module, a short-range wireless communication module, or a global navigation satellite system (GNSS) communication module) or a wired communication module 194 (eg, : It may include a LAN (local area network) communication module, or a power line communication module).
  • GNSS global navigation satellite system
  • a corresponding communication module among these communication modules is a first network 198 (eg, a short-range communication network such as Bluetooth, wireless fidelity (WiFi) direct, or infrared data association (IrDA)) or a second network 199 (eg, legacy It may communicate with the external electronic device 104 through a cellular network, a 5G network, a next-generation communication network, the Internet, or a computer network (eg, a telecommunication network such as a LAN or a WAN).
  • a first network 198 eg, a short-range communication network such as Bluetooth, wireless fidelity (WiFi) direct, or infrared data association (IrDA)
  • a second network 199 eg, legacy It may communicate with the external electronic device 104 through a cellular network, a 5G network, a next-generation communication network, the Internet, or a computer network (eg, a telecommunication network such as a LAN or a WAN).
  • a telecommunication network
  • the wireless communication module 192 uses the subscriber information (eg, International Mobile Subscriber Identifier (IMSI)) stored in the subscriber identification module 196 within a communication network such as the first network 198 or the second network 199 .
  • the electronic device 101 may be identified or authenticated.
  • the wireless communication module 192 may support a 5G network after a 4G network and a next-generation communication technology, for example, a new radio access technology (NR).
  • NR access technology includes high-speed transmission of high-capacity data (eMBB (enhanced mobile broadband)), minimization of terminal power and access to multiple terminals (mMTC (massive machine type communications)), or high reliability and low latency (URLLC (ultra-reliable and low-latency) -latency communications)).
  • eMBB enhanced mobile broadband
  • mMTC massive machine type communications
  • URLLC ultra-reliable and low-latency
  • the wireless communication module 192 may support a high frequency band (eg, mmWave band) to achieve a high data rate, for example.
  • a high frequency band eg, mmWave band
  • the wireless communication module 192 includes various technologies for securing performance in a high-frequency band, for example, beamforming, massive multiple-input and multiple-output (MIMO), all-dimensional multiplexing. It may support technologies such as full dimensional MIMO (FD-MIMO), an array antenna, analog beam-forming, or a large scale antenna.
  • the wireless communication module 192 may support various requirements specified in the electronic device 101 , an external electronic device (eg, the electronic device 104 ), or a network system (eg, the second network 199 ).
  • the wireless communication module 192 may include a peak data rate (eg, 20 Gbps or more) for realizing eMBB, loss coverage (eg, 164 dB or less) for realizing mMTC, or U-plane latency for realizing URLLC ( Example: downlink (DL) and uplink (UL) each 0.5 ms or less, or round trip 1 ms or less).
  • a peak data rate eg, 20 Gbps or more
  • loss coverage eg, 164 dB or less
  • U-plane latency for realizing URLLC
  • the antenna module 197 may transmit or receive a signal or power to the outside (eg, an external electronic device).
  • the antenna module 197 may include an antenna including a conductor formed on a substrate (eg, a PCB) or a radiator formed of a conductive pattern.
  • the antenna module 197 may include a plurality of antennas (eg, an array antenna). In this case, at least one antenna suitable for a communication method used in a communication network such as the first network 198 or the second network 199 is connected from the plurality of antennas by, for example, the communication module 190 . can be selected. A signal or power may be transmitted or received between the communication module 190 and an external electronic device through the selected at least one antenna.
  • other components eg, a radio frequency integrated circuit (RFIC)
  • RFIC radio frequency integrated circuit
  • the antenna module 197 may form a mmWave antenna module.
  • the mmWave antenna module comprises a printed circuit board, an RFIC disposed on or adjacent to a first side (eg, bottom side) of the printed circuit board and capable of supporting a designated high frequency band (eg, mmWave band); and a plurality of antennas (eg, an array antenna) disposed on or adjacent to a second side (eg, top or side) of the printed circuit board and capable of transmitting or receiving signals of the designated high frequency band. can do.
  • peripheral devices eg, a bus, general purpose input and output (GPIO), serial peripheral interface (SPI), or mobile industry processor interface (MIPI)
  • GPIO general purpose input and output
  • SPI serial peripheral interface
  • MIPI mobile industry processor interface
  • the command or data may be transmitted or received between the electronic device 101 and the external electronic device 104 through the server 108 connected to the second network 199 .
  • Each of the external electronic devices 102 or 104 may be the same as or different from the electronic device 101 .
  • all or a part of operations executed in the electronic device 101 may be executed in one or more external electronic devices 102 , 104 , or 108 .
  • the electronic device 101 may perform the function or service itself instead of executing the function or service itself.
  • one or more external electronic devices may be requested to perform at least a part of the function or the service.
  • One or more external electronic devices that have received the request may execute at least a part of the requested function or service, or an additional function or service related to the request, and transmit a result of the execution to the electronic device 101 .
  • the electronic device 101 may process the result as it is or additionally and provide it as at least a part of a response to the request.
  • cloud computing distributed computing, mobile edge computing (MEC), or client-server computing technology may be used.
  • the electronic device 101 may provide an ultra-low latency service using, for example, distributed computing or mobile edge computing.
  • the external electronic device 104 may include an Internet of things (IoT) device.
  • Server 108 may be an intelligent server using machine learning and/or neural networks.
  • the external electronic device 104 or the server 108 may be included in the second network 199 .
  • the electronic device 101 may be applied to an intelligent service (eg, smart home, smart city, smart car, or health care) based on 5G communication technology and IoT-related technology.
  • FIG. 2A is a perspective view illustrating a front surface of an electronic device according to various embodiments of the present disclosure
  • FIG. 2B is a perspective view illustrating a rear surface of the electronic device shown in FIG. 2A .
  • an electronic device 101 has a first surface (or front surface) 210A, a second surface (or rear surface) 210B, and a first surface 210A. and a housing 210 including a side surface 210C surrounding the space between the second surfaces 210B.
  • the housing 210 may refer to a structure forming part of the first surface 210A of FIG. 2A , the second surface 210B of FIG. 2B , and the side surfaces 210C have.
  • the first surface 210A may be formed by a front plate 202 at least a portion of which is substantially transparent.
  • the front plate 202 may include glass or a transparent polymer.
  • the front plate 202 may be coupled to the housing 210 to form an interior space with the housing 210 .
  • the term 'internal space' may mean a space accommodating at least a portion of the display 201 as an internal space of the housing 210 .
  • the second surface 210B may be formed by the substantially opaque back plate 211 .
  • the back plate 211 may be formed by, for example, coated or tinted glass, ceramic, polymer, metal (eg, aluminum, stainless steel (STS), or magnesium), or a combination of at least two of the materials. have.
  • the side surface 210C is coupled to the front plate 202 and the rear plate 211 and may be formed by a side bezel structure (or “side member”) 218 comprising a metal and/or a polymer.
  • the back plate 211 and the side bezel structure 218 are integrally formed and may include the same material (eg, a metal material such as aluminum).
  • the front plate 202 includes two first regions 210D (eg, curved regions) that extend seamlessly by bending from the first surface 210A toward the rear plate 211 , It may be included at both ends of the long edge of the front plate (202).
  • the rear plate 211 includes two second regions 210E (eg, curved regions) extending seamlessly from the second surface 210B toward the front plate 202 at both ends of the long edge. may include
  • the front plate 202 (or the back plate 211 ) may include only one of the first regions 210D (or the second regions 210E). In another embodiment, some of the first regions 210D or the second regions 210E may not be included.
  • the side bezel structure 218 may include a side (eg, a connector hole 208 ) that does not include the first area 210D or the second area 210E. It has a first thickness (or width) on the side where the side surface is formed, and has the first thickness (or width) on the side (eg, the side on which the key input device 237 is disposed) including the first area 210D or the second area 210E. It may have a second thickness that is thinner than the thickness.
  • the electronic device 101 includes a display 201 , audio modules 203 , 207 , 234 , a sensor module 204 , camera modules 205 and 230 , a key input device 217 , and light emission. element 206 , and at least one or more of connector holes 208 and 209 .
  • the electronic device 101 may omit at least one of the components (eg, the key input device 217 or the light emitting device 206 ) or additionally include other components.
  • the display 201 may be exposed through a substantial portion of the front plate 202 , for example. In various embodiments, at least a portion of the display 201 may be exposed through the front plate 202 forming the first area 210D of the first surface 210A and the side surface 210C. In various embodiments, the edge of the display 201 may be formed to be substantially the same as an adjacent outer shape of the front plate 202 . In another embodiment (not shown), in order to expand the area to which the display 201 is exposed, the distance between the outer edge of the display 201 and the outer edge of the front plate 202 may be substantially the same.
  • a recess or opening is formed in a portion of a screen display area (eg, an active area) or an area outside the screen display area (eg, an inactive area) of the display 201, It may include at least one of an audio module 234 , a sensor module 204 , camera modules 205 and 230 , and a light emitting element 206 aligned with a recess or opening.
  • at least one of the audio module 234 , the sensor module 204 , the camera modules 205 and 230 , and the light emitting element 206 on the rear surface of the screen display area of the display 201 may include more than one.
  • the display 201 is coupled to or adjacent to a touch sensing circuit, a pressure sensor capable of measuring the intensity (pressure) of a touch, and/or a digitizer that detects a magnetic field type stylus pen. can be placed.
  • a touch sensing circuit capable of measuring the intensity (pressure) of a touch
  • a digitizer capable of measuring the intensity (pressure) of a touch
  • a digitizer that detects a magnetic field type stylus pen.
  • at least a portion of the sensor module 204 and/or at least a portion of the key input device 237 may be disposed in the first areas 210D and/or the second areas 210E. .
  • the first camera module 205 and/or the sensor module 204 among the camera modules 205 and 230 is in the internal space of the electronic device 101 through the transparent area of the display 201 . It may be arranged so as to be in contact with the external environment.
  • the area facing the first camera module 205 of the display 201 may be formed as a transmissive area having a transmittance designated as a part of an area displaying content.
  • the transmissive region may be formed to have a transmittance in a range of about 5% to about 20%.
  • the transmission region may include a region overlapping an effective region (eg, an angle of view region) of the first camera module 205 through which light for generating an image by being imaged by an image sensor passes.
  • the transmissive area of the display 201 may include an area having lower pixel density and/or wiring density than the surrounding area.
  • the transmissive area may replace a recess or opening.
  • the audio modules 203 , 207 , and 214 may include a microphone hole 203 and speaker holes 207 and 214 .
  • a microphone for acquiring an external sound may be disposed therein, and a plurality of microphones may be disposed to detect the direction of the sound in various embodiments.
  • the speaker holes 207 and 214 may include an external speaker hole 207 and a receiver hole 214 for a call.
  • the speaker holes 207 and 214 and the microphone hole 203 may be implemented as a single hole, or a speaker may be included without the speaker holes 207 and 214 (eg, a piezo speaker).
  • the sensor module 204 may generate an electrical signal or data value corresponding to an internal operating state of the electronic device 101 or an external environmental state.
  • the sensor module 204 may include, for example, a first sensor module 204 (eg, a proximity sensor) and/or a second sensor module (not shown) disposed on the first side 210A of the housing 210 ( eg a fingerprint sensor), and/or another sensor module (not shown) disposed on the second side 210B of the housing 210 (eg, an HRM sensor or a fingerprint sensor).
  • the fingerprint sensor may be disposed on the second surface 210B as well as the first surface 210A (eg, the display 201) of the housing 210 .
  • the electronic device 101 may include a sensor module not shown, for example, a gesture sensor, a gyro sensor, a barometric pressure sensor, a magnetic sensor, an acceleration sensor, a grip sensor, a color sensor, an IR (infrared) sensor, a biometric sensor, a temperature sensor, It may further include at least one of a humidity sensor and an illuminance sensor 204 .
  • a sensor module not shown, for example, a gesture sensor, a gyro sensor, a barometric pressure sensor, a magnetic sensor, an acceleration sensor, a grip sensor, a color sensor, an IR (infrared) sensor, a biometric sensor, a temperature sensor, It may further include at least one of a humidity sensor and an illuminance sensor 204 .
  • the camera modules 205 and 230 include the first camera device 205 disposed on the first surface 210A of the electronic device 101 and the second camera device 230 disposed on the second surface 210B of the electronic device 101 .
  • the camera module 205 , 230 may include one or more lenses, an image sensor and/or an image signal processor. In various embodiments, two or more lenses (infrared cameras, wide-angle and telephoto lenses) and image sensors may be disposed on one side of the electronic device 101 .
  • the key input device 217 may be disposed on the side surface 210C of the housing 210 .
  • the electronic device 101 may not include some or all of the mentioned key input devices 217 and the not included key input devices 217 may be displayed on the display 201 as soft keys, etc. It can be implemented in the form
  • the light emitting device 206 may be disposed, for example, on the first surface 210A of the housing 210 .
  • the light emitting element 206 may provide, for example, state information of the electronic device 101 in the form of light.
  • the light emitting device 206 may provide, for example, a light source that is interlocked with the operation of the camera module 205 .
  • Light emitting element 206 may include, for example, LEDs, IR LEDs, and xenon lamps.
  • the connector holes 208 and 209 include a first connector hole 208 capable of receiving a connector (eg, a USB connector) for transmitting and receiving power and/or data to and from an external electronic device, and/or an external electronic device. and a second connector hole (eg, earphone jack) 209 capable of accommodating a connector for transmitting and receiving audio signals.
  • a connector eg, a USB connector
  • a second connector hole eg, earphone jack
  • 3A is an exploded perspective view of a camera structure 300 according to various embodiments disclosed herein.
  • FIG. 3B is a plan view of the camera window 350 shown in FIG. 3A .
  • 3C is a plan view of the camera housing 340 shown in FIG. 3A .
  • 3D is a plan view of the camera structure 300 shown in FIG. 3A .
  • the camera structure 300 may include a camera module 301 , a light emitting unit 391 , a camera housing 340 and/or a camera window 350 . ) may be included. At least one of the configurations of the camera structure 300 described above may be omitted, and the shape of the camera structure 300 is not limited to that illustrated in the drawings. According to an embodiment, the camera structure 300 may include two or four or more cameras. In the following description, it is assumed that the camera structure 300 includes three cameras (a first camera 310 , a second camera 320 , and a third camera 330 ).
  • the camera module 301 may include a first camera 310 , a second camera 320 , and/or a third camera 330 .
  • the first camera 310 , the second camera 320 , and/or the third camera 330 may include an image sensor that converts light reflected from an object into an electrical signal.
  • the image sensor may be, for example, a sensor such as a charge coupled device (CCD) or a complementary metal oxide semiconductor (CMOS).
  • the first camera 310 , the second camera 320 , and the third camera 330 included in the camera module 301 may be cameras that perform different types or functions.
  • the first camera 310 , the second camera 320 , and/or the third camera 330 may include different types of lens assemblies.
  • the first camera 310 may include a first lens assembly 311
  • the second camera 320 may include a second lens assembly 321
  • the third camera 330 may include a third lens assembly 331 .
  • the lens assembly may mean that at least one lens is optically disposed.
  • the first lens assembly 311 , the second lens assembly 321 , and the third lens assembly 331 have optical properties (eg, angle of view, focal length, auto-focus, f-number, or optical zoom) from each other. It may be an assembly comprising other lenses.
  • the first lens assembly 311 of the first camera 310 may be a lens assembly capable of capturing an image at a first angle of view
  • the second lens assembly 321 of the second camera 320 may include a second lens assembly 321 of the second camera 320 .
  • It may be a lens assembly capable of capturing an image in two angles of view
  • the third lens assembly 331 of the third camera 330 may be a lens assembly capable of capturing an image in a third angle of view.
  • the first angle of view may be an angle of view typically classified as a wide angle in the camera field
  • the second angle of view may be an angle of view classified as a standard angle
  • the third angle of view may be a zoom angle. It may be a classified angle of view.
  • At least one of the first camera 310 , the second camera 320 , and the third camera 330 may include an OIS unit (not shown) for driving an optical image stabiliazer (OIS).
  • the OIS unit may be a device for correcting shake of the electronic device (eg, the electronic device 101 of FIG. 2A ) in a photographing situation.
  • the OIS unit may correct the shake of the electronic device by moving a device (eg, a camera barrel or a camera body) in which the lens assembly is accommodated.
  • the OIS unit can be driven by various kinds of forces.
  • the OIS unit may be driven by an electromagnetic or magnetic force between a coil and a magnet, and may be driven by a driving force of an electric motor.
  • the first camera 310 may include a printed circuit board on which an image sensor is disposed, a first camera body 313 for including other devices of the first camera 310 , or a first lens assembly 311 .
  • ) may include a first camera barrel 312 in which is disposed. At least a portion of the first camera barrel 312 may be inserted into the first opening 341 of the camera housing 340 .
  • the second camera 320 may include a printed circuit board on which an image sensor is disposed, a second camera body 323 for accommodating other devices of the second camera 320 , or a second lens assembly 321 .
  • ) may include a second camera barrel 322 on which is disposed. At least a portion of the second camera barrel 322 may be inserted into the second opening 342 of the camera housing 340 .
  • the third camera 330 may include a printed circuit board on which an image sensor is disposed, a third camera body 333 for accommodating other devices of the third camera 330 , or a third lens assembly 331 .
  • a third camera barrel 332 on which is disposed.
  • the first camera barrel 312 and the second camera barrel 322 are different from each other.
  • the third camera barrel 332 may have different sizes.
  • the space between the first camera barrel 312 and the first decoration 361 and the space between the second camera barrel 322 and the second decoration 362 and the third camera barrel 332 ) and the space between the third decoration part 363 may have different sizes.
  • the first shielding part 371 is formed to at least partially fill the space between the first camera barrel 312 and the first decoration part 361
  • the third shielding part 373 is the third camera barrel 332 .
  • the size of the second camera barrel 322 may substantially coincide with the inner circumferential diameter of the second decoration portion 362 .
  • a shielding part may not be disposed between the second camera barrel 322 and the second decoration part 362 . Details of the first shielding part 371 and the third shielding part 373 will be described later.
  • the first camera body 313 of the first camera 310 , the second camera body 323 of the second camera 320 , or the third camera body 333 of the third camera 330 . ) may be included in the camera module 301 by being integrally formed with or coupled to at least a portion of each other.
  • the light emitting unit 391 may generate light.
  • the light emitting unit 391 may include a device capable of generating light (eg, a light emitting device).
  • the light emitting unit 391 may include a device such as a light emitting diode (LED), an injection laser diode (ILD), or a xenon lamp.
  • the light emitting unit 391 operates in a photographing situation and adds light to a dark photographing environment, thereby enabling photographing at an appropriate shutter speed and sensitivity (eg, international standard organization; ISO value).
  • the light emitting unit 391 operates alone so that a user can use it as a flash.
  • the sensor unit 392 may include a sensor for measuring the user's biometric information.
  • the sensor unit 392 may include a sensor (eg, a photoplethysmography (PPG) sensor) for measuring information related to a user's heartbeat.
  • the sensor unit 392 may include a light emitting device 392-1 or a light receiving device 392-2.
  • the sensor unit 392 may receive the light generated by the light emitting device 392-1 and reflected on the skin to the light receiving device 392-2 to measure heartbeat-related information.
  • the microphone unit 393 may have a microphone disposed therein for acquiring an external sound, and in various embodiments, the microphone unit 393 includes a plurality of microphones to detect the direction of the sound. can be placed.
  • the camera housing 340 is arranged to substantially include the first camera 310 , the second camera 320 and/or the third camera 330 included in the camera structure 300 .
  • the camera housing 340 includes the first camera body 313 of the first camera 310 , the second camera body 323 of the second camera 320 , and the third camera 330 . It may be supported by the third camera body 333 .
  • the camera housing 340 may include a first opening 341 , a second opening 342 , and/or a third opening 343 .
  • the first opening 341 may correspond to the first camera barrel 312
  • the second opening 342 may correspond to the second camera barrel 322
  • the size of the first opening 341 may be the same as or larger than the size of the first camera barrel 312
  • the size of the second opening 342 may be the same as or larger than the size of the second camera barrel 322
  • the size of the third opening 343 may be the same as or larger than the size of the third camera barrel 332 .
  • first camera barrel 312 may be inserted into the first opening 341
  • second camera barrel 322 may be inserted into the second opening 342 .
  • External light may be incident on the first lens assembly 311 disposed in the first camera barrel 312 through the first opening 341 , and external light may be transmitted through the second opening 342 to the second camera It may be incident on the second lens assembly 321 disposed in the barrel 322 , and external light through the third opening 343 is transmitted to the third lens assembly 331 disposed in the third camera barrel 332 .
  • a camera window 350 may be disposed in a portion of the camera structure 300 .
  • the camera window 350 may be disposed in a portion where the camera structure 300 is exposed to the outside of the electronic device. At least a portion of the camera window 350 may be formed of a material having high light transmittance.
  • the camera window 350 may be formed of substantially transparent glass or synthetic resin.
  • the camera window 350 may block foreign substances from being introduced into the camera structure 300 . Since the camera window 350 may be exposed to an external environment, it may be formed of a material having good durability (eg, hardness, strength, or corrosion resistance).
  • the camera window 350 may include a material capable of improving optical properties of the first camera 310 , the second camera 320 , and/or the third camera 330 .
  • This material may be disposed on the surface of the camera window 350 in a manner such as coating or printing.
  • the camera window 350 may be divided into a plurality of regions.
  • the camera window 350 includes a first transparent area 351 corresponding to the first opening 341 of the camera housing 340 and a second opening 342 corresponding to the second opening 342 of the camera housing 340 .
  • the region 355 and/or the opaque region 356 excluding the first transparent region 351 to the fifth transparent region 355 may be included.
  • the camera window 350 is formed of a material having high transmittance, such as glass, and the first transparent region 351 , the second transparent region 352 , the third transparent region 353 , and the fourth transparent region A material having low transmittance may be disposed on the opaque region 356 excluding 354 and/or the fifth transparent region 355 in a manner such as coating or printing.
  • a black material having high light absorption may be disposed in the opaque region 356 .
  • the camera window 350 may be formed of a composite material.
  • the opaque region 356 is formed of a material having low transmittance, and includes a first transparent region 351 , a second transparent region 352 , a third transparent region 353 , a fourth transparent region 354 , and /
  • the fifth transparent region 355 may be formed of a material having high transmittance.
  • the sizes of the first transparent region 351 , the second transparent region 352 , and/or the third transparent region 353 may be substantially the same.
  • the first transparent region 351 when the first transparent region 351 , the second transparent region 352 , and/or the third transparent region 353 are substantially circular, the first transparent region 351 is ), the diameter A of the second transparent region 352 , or the diameter A of the third transparent region 353 may all be the same.
  • the diameter A of the first transparent region 351 is equal to the diameter of the outer perimeter of the first decoration 361 (the diameter B of the outer perimeter of the first decoration 361 in FIG.
  • the diameter A of the second transparent region 352 is equal to the diameter of the outer perimeter of the second decorative portion 362 (the diameter B of the outer perimeter of the second decorative portion 362 in FIG. 3C ), and the third transparent
  • the diameter A of the region 353 may be equal to the diameter of the outer perimeter of the third decoration 363 (the diameter B of the outer perimeter of the third decoration 363 in FIG. 3C ). Due to the unity of the size, a plurality of cameras viewed through the camera window 350 may have unity.
  • the camera structure 300 may include a first decoration part 361 , a second decoration part 362 , and/or a third decoration part 363 .
  • the first decoration part 361 is disposed inside the first opening 341
  • the second decoration part 362 is disposed inside the second opening 342
  • the third decoration part 363 is disposed in the third It may be disposed inside the opening 343 .
  • a slope may be formed on the side surface of the second decoration part 362 .
  • the first decoration part 361 , the second decoration part 362 , and/or the third decoration part 363 may be formed in a ring shape.
  • the size of the first decoration part 361 , the second decoration part 362 , and/or the third decoration part 363 may be substantially the same as each other.
  • the diameter B of the outer perimeter of the first decoration 361, the diameter B of the outer perimeter of the second decoration 362, and the diameter B of the outer perimeter of the third decoration 363 are mutually exclusive same
  • the diameter (C) of the inner perimeter of the first decorative part 361, the diameter (C) of the inner perimeter of the second decorative part 362, and the diameter (C) of the inner perimeter of the third decorative part 363 may be the same have.
  • the width (width) (W) of the first decorative part 361, the width (width) (W) of the second decorative part 362, and the width (width) (W) of the third decorative part 363 may also be the same.
  • the width (width) W may mean a distance between the outer circumferential surface and the inner circumferential surface of the decoration part.
  • the first decorative part 361 , the second decorative part 362 , and the third decorative part 363 are processed in the same way by a workpiece of the same size, so that their external shapes may be substantially identical to each other. have.
  • the diameter of the first opening 341 may be the diameter C of the inner circumference.
  • the diameter of the second opening 342 may be the diameter C of the inner circumference.
  • the diameter of the third opening 343 may be the diameter C of the inner circumference.
  • the camera housing 340 may further include a light emitting unit hole 395 , a sensor unit hole 396 , and a microphone unit hole 397 .
  • the light emitting hole 395 corresponds to the light emitting unit 391 of FIG. 3D , and may be opened so that light from the light emitting unit 391 can be emitted to the outside of the electronic device 101 .
  • the sensor unit hole 396 corresponds to the sensor unit 392 of FIG. 3D , and may be opened to perform a sensing operation of the sensor unit 392 .
  • the microphone unit hole 397 corresponds to the microphone unit 393 of FIG. 3D , and may be opened to transmit sound to the microphone unit 393 .
  • the first decoration part 361 , the second decoration part 362 , and the third decoration part 363 may be formed by processing the camera housing 340 .
  • a part of the camera housing 340 may be processed by a computerized numerical control (CNC) method to form a first decorative part 361 , a second decorative part 362 , and a third decorative part 363 .
  • CNC computerized numerical control
  • the first decoration part 361 , the second decoration part 362 , and the third decoration part 363 may be separately processed and disposed on the camera housing 340 .
  • the first shielding part 371 may be disposed around the inner circumference of the first decoration part 361 so that at least a portion between the first camera barrel 312 and the first decoration part 361 is filled. have.
  • the third shielding part 373 may be disposed around the inner circumference of the third decoration part 363 such that at least a portion between the third camera barrel 332 and the third decoration part 363 is filled.
  • the surface of the first shielding part 371 and the surface of the third shielding part 373 may be anodized.
  • the surface of the first shielding part 371 and the surface of the third shielding part 373 may be anodized with a material having low light transmittance.
  • the first shielding part 371 and the third shielding part 373 may be omitted.
  • the first shielding part 371 and the third shielding part 373 are omitted or their size in consideration of the OIS driving. can be adjusted.
  • the first camera barrel 312 of the first camera 310 the second camera barrel 322 of the second camera 320 , and the third camera barrel 332 of the third camera 330 .
  • At least one of the shielding plate may be fitted.
  • FIG. 4 is a cross-sectional view of the camera structure 300 shown in FIG. 3D taken along line A-B.
  • At least a portion of the second camera barrel 322 of the second camera 320 may be inserted into the second opening 342 of the camera housing 340 to be disposed.
  • the camera window 350 may be coupled to the camera housing 340 using an adhesive member 410 .
  • the adhesive member 410 may be, for example, a tape having adhesive properties.
  • the camera window 350 may include a second transparent area 352 and/or an opaque area 356 .
  • the camera window 350 may be spaced apart from the second camera barrel 322 of the second camera 320 by a predetermined interval (eg, the second interval length G2).
  • the camera window 350 is spaced apart from the second camera barrel 322 of the second camera 320 by a predetermined interval (eg, the second interval length G2), the second camera ( It may be considered that the second camera barrel 322 is moved by the OIS driving of the 320 .
  • the camera window 350 may be spaced apart from the second camera barrel 322 of the second camera 320 by a predetermined interval (eg, the second interval length G2).
  • the second transparent region 352 may correspond to the second opening 342 of the camera housing 340 .
  • the size of the second transparent region 352 may be greater than or equal to that of the second opening 342 .
  • the opaque region 356 may be disposed in a manner such as coating or printing a material having a low transmittance.
  • a black material having high light absorption for example, the blocking member 3561 may be disposed on the opaque region 356 .
  • the blocking member 3561 may be, for example, printed or tape.
  • the blocking member 3561 may be attached to one surface of the camera window 350 .
  • the blocking member 3561 may be disposed between the camera housing 340 and the camera window 350 .
  • the blocking member 3561 may correspond to a planar area of the support 402 .
  • the camera housing 340 may include a frame 401 , a support 402 and/or a second decoration 362 .
  • the frame unit 401 may be fixed so that the camera window 350 is not separated when it is seated in the camera housing 340 .
  • the frame unit 401 may fix the side of the camera window 350 .
  • the frame unit 401 may be coupled to at least a portion of a side surface of the camera window 350 .
  • the frame portion 401 may have a designated height H from the reference plane.
  • the frame unit 401 may be coupled to the support unit 402 to form the camera housing 340 .
  • the frame part 401 may be integrally formed with the support part 402 .
  • the frame part 401 may be coupled to the support part 402 by forming a first step S1 .
  • the frame part 401 may form the support part 402 and the first step S1 and may be integrally formed.
  • the first step S1 may have a specified length.
  • the first step S1 is substantially equal to the thickness of the camera window 350 or the camera window 350 so that the camera window 350 can be seamlessly fixed to the frame portion 401 .
  • ) can be close to the thickness of
  • the first step S1 is substantially the thickness of the camera window 350 and the thickness of the adhesive member 410 so that the camera window 350 can be seamlessly fixed to the frame unit 401 . , or may be substantially equal to the sum of the thicknesses of the blocking member 3561 .
  • the support 402 may be coupled to the adhesive member 410 to support the camera window 350 .
  • the support 402 when viewed from the cut surface of the camera structure 300 based on the line A-B, the support 402 has a shelf and/or pedestal shape, and the surface coupled to the adhesive member 410 is flat. can
  • the support 402 may support at least a portion of the surface of the camera window 350 .
  • the support 402 may have a predetermined height (eg, a first height L1 ) from the reference plane.
  • the reference surface may be a surface facing in a direction opposite to a surface on which the camera window 350 of the camera housing 340 is disposed.
  • the first height L1 of the support part 402 may be smaller than the height H of the frame part 401 .
  • the height H of the frame part 401 may be the sum of the first height L1 of the support part 402 and the length of the first step S1 .
  • the support 402 may have a ring shape having an outer diameter and an inner diameter different from each other.
  • the support part 402 may have an inside diameter close to the second decoration part 362 and an outside diameter close to the frame part 401 . It may have a first distance T1 according to the difference between the outer diameter and the inner diameter of the support part 402 .
  • the support part 402 may have a ring shape having a plane of a first distance T1 with a first height L1.
  • the support 402 may correspond to the opaque region 356 .
  • the plane of the first distance T1 may be visible, and the opaque region 356 may block the support part 402 from being visible to the outside.
  • the first distance T1 may be a distance from the frame part 401 to the outer circumference of the second decoration part 362 .
  • the support part 402 may be combined with the frame part 401 and/or the second decoration part 362 to form the camera housing 340 .
  • the support part 402 may be coupled to the second decoration part 362 by forming a second step S2 with the second decoration part 362 .
  • the second step S2 may have a specified length.
  • the support part 402 forms the second decorative part 362 and the second step S2, and may be integrally formed.
  • the frame part 401 , the support part 402 , or the second decoration part 362 may be integrally formed.
  • a second step S2 of the support 402 may be formed.
  • the length of the second step S2 may vary depending on the cutting tool entry angle during C-CUT machining.
  • Table 1 shows the length of the second step S2 according to the cutting tool entry angle during CUT machining.
  • the camera housing 340 forms a second step S2 between the support part 402 and the second decoration part 362 , so that incident light is reflected by the second decoration part 362 to the second Inflow into the lens assembly 321 may be reduced.
  • the camera housing 340 may include a second decoration part 362 between the second opening 342 and the support part 402 .
  • the second decoration 362 may be formed to surround the second opening 342 of the camera housing 340 .
  • the second decoration part 362 may be formed to have a gradually decreasing thickness. The second decoration part 362 may be formed to have a smaller thickness as it moves away from the support part 402 .
  • the thickness of the region coupled to the support 402 is the second height L2, and the thickness of the region adjacent to the second opening 342 is the third height L3.
  • the second height L2 may be longer than the third height L3 .
  • the second decoration 362 may include an inclined region 362A.
  • the second decoration portion 362 may include an inclined region 362A of a specified angle ⁇ .
  • the second decoration portion 362 may form an inclined region 362A of a specified angle ⁇ from the third height L3 to the second height L2 .
  • the surface (the inclined region 362A) of the second decoration portion 362 may be formed of a material having high reflectivity by anodizing. By disposing a material having a high reflectance on the surface 362A of the second decorative part 362 having a gradually decreasing thickness, the second decorative part 362 may provide a three-dimensional effect to the user. In various embodiments, a hair line may be formed on the surface 362A of the second decoration portion 362 .
  • the second decoration part 362 may have a ring shape having an outer diameter and an inner diameter different from each other.
  • the second decoration 362 may have an inside diameter close to the second opening 342 and an outside diameter close to the support 402 .
  • it may have a second distance T2 according to a difference between an outer diameter and an inner diameter of the second decoration part 362 .
  • the second transparent area 352 of the camera window 350 may be disposed in a portion corresponding to the second camera 320 .
  • a diameter of the second transparent region 352 may be substantially the same as an outer diameter of the second decoration part 362 .
  • the second camera barrel 322 of the second camera 320 may be disposed to be spaced apart from the second decorative part 362 by a predetermined interval. For example, it may be considered that the second camera barrel 322 is moved by the OIS driving of the second camera 320 .
  • the separation distance between the second camera barrel 322 and the second decoration part 362 may be at least greater than a movable range of the second camera barrel 322 by OIS driving.
  • the second decoration portion 362 may be spaced apart from the camera window 350 by a predetermined interval (eg, the first interval length G1 ) based on the second height L2 .
  • the length of the second step S2 may be greater than 0 and smaller than the first height L1 of the support part 402 .
  • the length range of the second step S2 may be expressed by Equation (1).
  • the first interval length G1 may be equal to the sum of the lengths of the second interval length G2 and the second step S2 , and may be greater than the second interval length G2 .
  • the range of the first interval length G1 may be expressed by Equation (2).
  • FIG. 5 is a cross-sectional view taken along line A-B of the camera structure 300 shown in FIG. 3D according to various embodiments of the present invention.
  • the arrangement of the blocking member 3561 and the camera window 350 may be different from that of FIG. 4 , and the remaining components may be the same as those of FIG. 4 .
  • the blocking member 3561 of FIG. 5 may be disposed under the camera window 350 .
  • the blocking member 3561 of FIG. 5 may be disposed inside the camera housing 340 .
  • the blocking member 356 may correspond to a planar area of the support 402 .
  • the blocking member 3561 may be positioned between the camera window 350 and the support 402 .
  • the blocking member 3561 when viewed from above the camera window 350 , the blocking member 3561 may overlap the camera window 350 .
  • the blocking member 3561 when viewed from above the camera window 350 , the blocking member 3561 may be disposed so as not to overlap the second decoration part 362 .
  • FIG. 6 is a cross-sectional view taken along line A-B of the camera structure 300 shown in FIG. 3D according to various embodiments of the present invention.
  • FIG. 6 may further include an anti-reflection area 610 in the second step S2 in FIG. 4 .
  • the anti-reflection area 610 may prevent reflection by eroding or surface-treating the second step S2 area.
  • the incident light is reflected by the second step S2 and then reflected to the second decorative part 362 , and the light reflected from the second decorative part 362 is reflected by the camera window 350 to the second lens assembly 321 . can be imported.
  • the anti-reflection area 610 may prevent or reduce incident light from being reflected by the second step S2 to the second decoration part 362 .
  • the surface of the anti-reflection region 610 may be roughened to lower the reflectance of the surface of the second step S2 .
  • FIG. 7 is a cross-sectional view taken along line A-B of the camera structure 300 shown in FIG. 3D according to various embodiments of the present invention.
  • FIG. 7 may further include an anti-reflection area 610 in the second step S2 in FIG. 5 .
  • the anti-reflection area 610 may prevent reflection by eroding or surface-treating the second step S2 area.
  • the incident light is reflected by the second step S2 and then reflected to the second decorative part 362 , and the light reflected from the second decorative part 362 is reflected by the camera window 350 to the second lens assembly 321 . can be imported.
  • the anti-reflection area 610 may prevent or reduce incident light from being reflected by the second step S2 to the second decoration part 362 .
  • the surface of the anti-reflection region 610 may be roughened to lower the reflectance of the surface of the second step S2 .
  • FIG. 8 is a cross-sectional view taken along line A-B of the camera structure 300 shown in FIG. 3D according to various embodiments of the present invention.
  • FIG. 8 may further include an anti-reflection member 810 at the second step S2 in FIG. 4 .
  • the anti-reflection member 810 is attached to the second step S2 region, and may be anti-radiation tape and/or anti-radiation paint.
  • the anti-radiation tape and/or the anti-radiation paint may be an anti-reflective coating member and/or a light absorbing member.
  • the incident light is reflected by the second step S2 and then reflected to the second decorative part 362 , and the light reflected from the second decorative part 362 is reflected by the camera window 350 to the second lens assembly 321 . can be imported.
  • the anti-reflection member 810 may prevent incident light from being reflected by the second step S2 and reflected to the second decorative part 362 .
  • the anti-reflection member 810 may absorb incident light directed toward the second step S2 .
  • the anti-reflection member 810 may lower the reflectance of the surface of the second step S2 .
  • FIG. 9 is a cross-sectional view taken along line A-B of the camera structure 300 shown in FIG. 3D according to various embodiments of the present invention.
  • FIG. 9 may further include an anti-reflection member 810 at the second step S2 in FIG. 5 .
  • the anti-reflection member 810 is attached to the second step S2 region, and may be anti-radiation tape and/or anti-radiation paint.
  • the anti-radiation tape and/or the anti-radiation paint may be an anti-reflective coating member and/or a light absorbing member.
  • the incident light is reflected by the second step S2 and then reflected to the second decorative part 362 , and the light reflected from the second decorative part 362 is reflected by the camera window 350 to the second lens assembly 321 . can be imported.
  • the anti-reflection member 810 may prevent or reduce incident light from being reflected by the second step S2 to the second decorative part 362 .
  • the anti-reflection member 810 may absorb incident light directed toward the second step S2 .
  • the anti-reflection member 810 may lower the reflectance of the surface of the second step S2 .
  • the electronic device may have various types of devices.
  • the electronic device may include, for example, a portable communication device (eg, a smart phone), a computer device, a portable multimedia device, a portable medical device, a camera, a wearable device, or a home appliance device.
  • a portable communication device eg, a smart phone
  • a computer device e.g., a smart phone
  • a portable multimedia device e.g., a portable medical device
  • a camera e.g., a portable medical device
  • a camera e.g., a portable medical device
  • a camera e.g., a portable medical device
  • a wearable device e.g., a smart bracelet
  • a home appliance device e.g., a home appliance
  • first, second, or first or second may be used simply to distinguish the element from other elements in question, and may refer to elements in other aspects (e.g., importance or order) is not limited. It is said that one (eg, first) component is “coupled” or “connected” to another (eg, second) component, with or without the terms “functionally” or “communicatively”. When referenced, it means that one component can be connected to the other component directly (eg by wire), wirelessly, or through a third component.
  • module used in various embodiments of this document may include a unit implemented in hardware, software, or firmware, and is interchangeable with terms such as, for example, logic, logic block, component, or circuit.
  • a module may be an integrally formed part or a minimum unit or a part of the part that performs one or more functions.
  • the module may be implemented in the form of an application-specific integrated circuit (ASIC).
  • ASIC application-specific integrated circuit
  • one or more instructions stored in a storage medium may be implemented as software (eg, the program 140) including
  • a processor eg, processor 120
  • a device eg, electronic device 101
  • the one or more instructions may include code generated by a compiler or code executable by an interpreter.
  • the device-readable storage medium may be provided in the form of a non-transitory storage medium.
  • 'non-transitory' only means that the storage medium is a tangible device and does not include a signal (eg, electromagnetic wave), and this term is used in cases where data is semi-permanently stored in the storage medium and It does not distinguish between temporary storage cases.
  • a signal eg, electromagnetic wave
  • the method according to various embodiments disclosed in this document may be provided as included in a computer program product.
  • Computer program products may be traded between sellers and buyers as commodities.
  • the computer program product is distributed in the form of a machine-readable storage medium (eg compact disc read only memory (CD-ROM)), or via an application store (eg Play Store TM ) or on two user devices ( It can be distributed online (eg download or upload), directly between smartphones (eg smartphones).
  • a part of the computer program product may be temporarily stored or temporarily generated in a machine-readable storage medium such as a memory of a server of a manufacturer, a server of an application store, or a relay server.
  • each component (eg, module or program) of the above-described components may include a singular or a plurality of entities, and some of the plurality of entities may be separately disposed in other components. have.
  • one or more components or operations among the above-described corresponding components may be omitted, or one or more other components or operations may be added.
  • a plurality of components eg, a module or a program
  • the integrated component may perform one or more functions of each component of the plurality of components identically or similarly to those performed by the corresponding component among the plurality of components prior to the integration. .
  • operations performed by a module, program, or other component are executed sequentially, in parallel, repeatedly, or heuristically, or one or more of the operations are executed in a different order, or omitted. or one or more other operations may be added.

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Abstract

Un dispositif électronique selon divers modes de réalisation de la présente invention comprend : une caméra comprenant un barillet de caméra dans lequel est logé un ensemble lentille ; un boîtier de caméra comprenant une partie d'ouverture correspondant au barillet de caméra, et disposé de façon à entourer sensiblement la caméra ; et une fenêtre de caméra comprenant une zone transparente qui est formée de façon à être transparente sur une partie correspondant à la partie d'ouverture, et disposée sur le boîtier de caméra. Le boîtier de caméra peut comprendre : une partie de support ; une partie de cadre formant une première marche avec la partie de support ; et une partie décorative formant une seconde marche avec la partie de support et formée de telle sorte que l'épaisseur devient progressivement plus petite de la partie de support à la partie d'ouverture
PCT/KR2021/019564 2020-12-24 2021-12-22 Dispositif électronique comprenant une caméra Ceased WO2022139436A1 (fr)

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KR1020200183605A KR102878398B1 (ko) 2020-12-24 2020-12-24 카메라를 포함하는 전자 장치
KR10-2020-0183605 2020-12-24

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WO2022139436A1 true WO2022139436A1 (fr) 2022-06-30

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Families Citing this family (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
WO2024158142A1 (fr) * 2023-01-26 2024-08-02 삼성전자 주식회사 Dispositif électronique comprenant un module d'appareil photographique
WO2025100704A1 (fr) * 2023-11-06 2025-05-15 삼성전자 주식회사 Dispositif électronique comprenant une caméra

Citations (5)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2000284422A (ja) * 1999-03-30 2000-10-13 Fuji Photo Film Co Ltd レンズ付きフイルムユニット
KR20140111503A (ko) * 2013-03-11 2014-09-19 삼성전자주식회사 카메라 모듈을 포함하는 전자장치
US20140368711A1 (en) * 2013-06-14 2014-12-18 Paul O'Brien Reduced height camera module for small form factor applications
KR20180026288A (ko) * 2016-09-02 2018-03-12 삼성전자주식회사 카메라 모듈, 카메라 모듈이 적용된 전자 장치 및 이의 운용 방법
KR20190028284A (ko) * 2017-09-08 2019-03-18 애플 인크. 휴대용 전자 디바이스

Patent Citations (5)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2000284422A (ja) * 1999-03-30 2000-10-13 Fuji Photo Film Co Ltd レンズ付きフイルムユニット
KR20140111503A (ko) * 2013-03-11 2014-09-19 삼성전자주식회사 카메라 모듈을 포함하는 전자장치
US20140368711A1 (en) * 2013-06-14 2014-12-18 Paul O'Brien Reduced height camera module for small form factor applications
KR20180026288A (ko) * 2016-09-02 2018-03-12 삼성전자주식회사 카메라 모듈, 카메라 모듈이 적용된 전자 장치 및 이의 운용 방법
KR20190028284A (ko) * 2017-09-08 2019-03-18 애플 인크. 휴대용 전자 디바이스

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KR20220092138A (ko) 2022-07-01

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