WO2022116931A1 - Surface-encapsulated capacitor and method for manufacturing a surface-encapsulated capacitor - Google Patents

Abstract

Provided are a surface-encapsulated capacitor (100) and a method for manufacturing a surface-encapsulated capacitor (100). The surface-encapsulated capacitor (100) comprises an anode element (1) and a cathode element (2), which are isolated from each other; an anode leading-out wire (5); a substrate (8), wherein an anode connection groove (10) and a cathode connection groove (11) are provided in the substrate (8), and conductors are arranged in the anode connection groove (10) and the cathode connection groove (11); an anode bottom terminal (6), which is connected to a groove opening at one side of the anode connection groove (10), wherein one end of the conductor arranged in the anode connection groove (10) is connected to the anode leading-out wire (5), and the other end of the conductor arranged in the anode connection groove (10) is connected to an upper surface of the anode bottom terminal (6); and a cathode bottom terminal (7), which is connected to a groove opening at one side of the cathode connection groove (11), wherein one end of the conductor arranged in the cathode connection groove (11) is connected to the cathode element (2), and the other end of the conductor arranged in the cathode connection groove (11) is connected to an upper surface of the cathode bottom terminal (7). By means of the present application, the ESR value of a surface-encapsulated capacitor (100) is reduced, and the reliability of the surface-encapsulated capacitor (100) is improved.

Description

Surface-packaged capacitor and method of making surface-packaged capacitor

CROSS-REFERENCE TO RELATED APPLICATIONS

This application claims the priority of the Chinese Patent Application No. 202011391423.2 and titled "A Surface Mounting Capacitor and Method for Making Surface Mounting Capacitors" filed with the China Patent Office on December 03, 2020 and filed on December 03, 2020 The priority of the Chinese Patent Application No. 202022892161.X and titled "A Surface Mount Capacitor" filed with the Chinese Patent Office on 10 June 2020, the entire contents of which are incorporated herein by reference.

technical field

The present application relates to the technical field of capacitors, and in particular, to a surface package capacitor and a manufacturing method of the surface package capacitor.

Background technique

In the current surface package capacitors, the terminal leads mainly rely on the cathode lead terminal and the anode lead terminal to lead the internal lead out to the bottom surface terminal. This method has a small connection area and a single lead-out path, which makes the connection of the surface package capacitor unstable and the use risk is high. In addition, this method makes the ESR (Equivalent Series Resistance, equivalent series resistance) value of the surface package capacitor larger.

SUMMARY OF THE INVENTION

Embodiments of the present application provide a surface mount capacitor and a method for fabricating a surface mount capacitor, so as to improve the problem of "the current surface mount capacitor is unstable in connection, has high risk of use and the ESR value of the surface mount capacitor is also large".

The present invention is realized in this way:

An embodiment of the present application provides a surface package capacitor, which may include: an anode element and a cathode element isolated from each other; an anode lead wire connected to the anode element; The outside is filled with encapsulation material; the base plate is arranged at the bottom of the anode element and the cathode element, and an anode connection slot and a cathode connection slot are opened on the base plate; the anode connection slot and the cathode connection slot are provided with conductive The anode bottom surface terminal is arranged at the bottom of the substrate and is connected with the notch on one side of the anode connection slot; one end of the conductor arranged in the anode connection slot is connected to the anode lead wire, arranged at The other end of the conductor of the anode connection slot is connected to the upper surface of the anode bottom surface terminal; the cathode bottom surface terminal is arranged at the bottom of the substrate and is connected to the side notch of the cathode connection slot; One end of the conductor of the cathode connection slot is connected to the cathode element, and the other end of the conductor arranged in the cathode connection slot is connected to the upper surface of the bottom terminal of the cathode; the anode lead-out end is connected to the anode lead-out The wire and the anode bottom surface terminal are connected; the cathode lead-out terminal is connected with the cathode element and the cathode bottom surface terminal.

In the embodiment of the present application, the anode connection slot and the cathode connection slot are provided on the substrate, so that the anode element can be connected to the bottom terminal of the anode through the conductor in the anode connection slot, and the cathode element can be connected through the conductor in the cathode connection slot. Conduction with the cathode bottom terminal, so that two parallel equivalent resistances are formed between the anode element and the anode bottom terminal, and two parallel equivalent resistances are formed between the cathode element and the cathode bottom terminal, thereby reducing the ESR of the surface mount capacitor. value, improving the reliability of surface mount capacitors.

With reference to the technical solutions provided in the above embodiments, in some possible implementations, the anode lead-out wire may be connected to the first surface of the anode element.

In the embodiment of the present application, by connecting the anode lead wire to the surface of the anode element, the anode lead wire does not occupy the effective volume of the anode element, thereby effectively improving the capacity ratio of the surface package capacitor and improving the capacity of the anode element. utilization.

With reference to the technical solutions provided in the above embodiments, in some possible implementations, the anode lead-out wire may be formed by welding or sintering with the first surface of the anode element.

In the embodiment of the present application, the anode lead wire is connected to the surface of the anode element by welding or sintering, which can ensure a stable connection between the anode lead wire and the anode element, thereby improving the stability of the surface package capacitor.

With reference to the technical solutions provided in the foregoing embodiments, in some possible implementations, the anode lead-out line may be disposed below the centerline of the first surface of the anode element.

In the embodiment of the present application, by arranging the anode lead-out line below the center line of the first surface of the anode element, the anode lead-out line is made closer to the anode bottom surface terminal. In this way, the manufacturing difficulty of the surface package capacitor is reduced, and the The length of the conductive path, which in turn reduces the ESR value of the surface mount capacitor, improves the overall performance of the surface mount capacitor.

With reference to the technical solutions provided in the above embodiments, in some possible implementations, the anode lead-out wire may adopt a threaded structure.

In the embodiment of the present application, the anode lead-out wire adopts a threaded structure, so that the encapsulation material can be filled into the texture of the anode lead-out wire of the threaded structure, which increases the bonding area between the anode lead-out wire and the packaging material, thereby strengthening the anode lead-out. The bonding force between the wire and the packaging material prevents the generation of gaps and the entry of external moisture, improving the reliability of the product.

In combination with the technical solutions provided in the above embodiments, in some possible implementations, the anode lead-out line may adopt a sawtooth structure.

In the embodiment of the present application, the anode lead-out wire adopts a sawtooth structure, so that the packaging material can be filled into the gap of the anode lead-out wire of the sawtooth structure, which increases the bonding area between the anode lead-out wire and the packaging material, thereby strengthening the anode lead-out. The bonding force between the wire and the packaging material prevents the generation of gaps and the entry of external moisture, improving the reliability of the product.

In combination with the technical solutions provided in the foregoing embodiments, in some possible implementations, the diameter of the anode lead-out line on the side close to the anode lead-out end may be larger than the diameter of the anode lead-out line on the side close to the anode element .

In the embodiment of the present application, the diameter of the anode lead-out wire near the anode lead-out end is larger than the diameter of the anode lead-out wire on the side close to the anode element. As a result, the area of the anode lead-out wire and the anode lead-out end is larger and the connection between the two is improved. The reliability of the surface mount capacitor reduces the ESR value of the surface mount capacitor. Second, due to the different diameters at both ends of the anode lead wire, the bonding area between the anode lead wire and the packaging material is also increased, which in turn strengthens the anode lead wire and the packaging material. The bonding force between them prevents the generation of gaps and the entry of external moisture, and improves the reliability of the product.

Optionally, the diameter of the anode lead-out wire on the side close to the anode lead-out end may be smaller than the diameter of the anode lead-out wire on the side close to the anode element.

In combination with the technical solutions provided in the above embodiments, in some possible implementations, the cathode element may be disposed on the outer layer of the anode element, and a dielectric layer may be disposed between the cathode element and the anode element, so The cathode element may include a cathode layer, a carbon layer and a silver layer arranged in sequence; an insulator may be arranged between the conductor in the anode connection groove and the cathode element.

In the embodiment of the present application, by disposing an insulator between the conductor in the anode connection slot and the cathode element, the short circuit between the conductor inside the anode connection slot and the cathode element can be effectively protected.

In combination with the technical solutions provided in the above embodiments, in some possible implementations, the cathode layer of the cathode element may include one of manganese dioxide, polypyrrole, polythiophene, polyaniline, polyamphetamine and their respective derivatives or more.

With reference to the technical solutions provided in the foregoing embodiments, in some possible implementations, the electrical conductor may be conductive silver paste.

In combination with the technical solutions provided in the foregoing embodiments, in some possible implementations, the number of anode connection slots opened on the substrate may be at least two; the number of cathode connection slots opened on the substrate may be at least two .

Optionally, the number of the anode connection grooves and the number of the cathode connection grooves provided on the substrate may be equal or unequal.

In the embodiment of the present application, by opening at least two anode connection grooves on the substrate and at least two cathode connection grooves on the substrate, a multi-channel parallel equivalent resistance is formed between the anode element and the anode bottom terminal, and the cathode element A multi-channel parallel equivalent resistance is formed between the cathode bottom terminal, which further reduces the ESR value of the surface package capacitor and improves the reliability of the surface package capacitor.

In combination with the technical solutions provided in the foregoing embodiments, in some possible implementations, the added area of the anode connection slot and the cathode connection slot may be the sum of the area of the anode bottom terminal and the cathode bottom terminal. 10% to 80%.

In the embodiment of the present application, the added area of the anode connection groove and the cathode connection groove is 10% to 80% of the total area of the anode bottom terminal and the cathode bottom terminal. The reasonable setting ensures the reliability of the surface package capacitor. sex.

In combination with the technical solutions provided in the above embodiments, in some possible implementations, the anode connection groove may be opened on the side of the substrate close to the anode lead-out end, and the anode connection groove is close to a side of the anode lead-out end. side opening, so that the anode lead-out end is connected to the conductor in the anode connection groove; the cathode connection groove can be opened on the side of the substrate close to the cathode lead-out end, and the cathode connection groove is close to the One side of the cathode lead-out end is opened, so that the cathode lead-out end is connected to the conductor in the cathode connection groove.

In the embodiment of the present application, the anode connection slot is opened on the side of the substrate close to the anode lead-out end, and the anode connection slot is opened on the side close to the anode lead-out end; the cathode connection slot is opened on the side of the substrate close to the cathode lead-out end, and the cathode connection slot is opened The side close to the cathode lead-out end is opened. In this way, the manufacturing difficulty of the surface-packaged capacitor is reduced, and the overall performance of the surface-packaged capacitor is improved.

In combination with the technical solutions provided in the above embodiments, in some possible implementations, the notch on the other side of the anode connection slot may extend to connect with the anode lead wire; the notch on the other side of the cathode connection slot may extend to connect with the cathode element.

In the embodiment of the present application, the notch on the other side of the anode connection slot directly extends to connect with the anode lead wire, and the notch on the other side of the cathode connection slot extends to connect with the cathode element. In this way, the anode connection slot is ensured The inner conductor can effectively connect the anode lead wire and the anode bottom surface terminal, and is not easy to be deformed, and also ensures that the conductor in the cathode connection groove can effectively connect the cathode element and the cathode bottom surface terminal, and is not easily deformed.

In combination with the technical solutions provided in the above-mentioned embodiments, in some possible implementations, the anode element may be a tantalum block; the cathode element may be disposed on the outer layer of the tantalum block, and the cathode element and the tantalum block may be formed between the cathode element and the tantalum block. A dielectric layer may be disposed therebetween, and the cathode element may include a cathode layer, a carbon layer and a silver layer disposed in sequence.

In combination with the technical solutions provided in the above-mentioned embodiments, in some possible implementations, the anode element may be an aluminum block; the cathode element may be disposed on the outer layer of the aluminum block, and the cathode element and the aluminum block may be formed between the cathode element and the aluminum block. A dielectric layer may be disposed therebetween, and the cathode element may include a cathode layer, a carbon layer and a silver layer disposed in sequence.

Another embodiment of the present application provides a method for fabricating a surface mount capacitor, the method may include: providing a substrate; opening an anode connection slot and a cathode connection slot on the substrate by laser engraving; filling the conductor into the substrate In the anode connection tank and the cathode connection tank; the prepared anode block is bonded to the substrate, so that the conductor in the anode connection tank is connected to the anode lead wire and the anode bottom surface terminal, and the anode The electrical conductor in the cathode connection groove is connected to the cathode element and the cathode bottom surface terminal; the packaging test is carried out on the anode block.

Description of drawings

In order to explain the technical solutions of the embodiments of the present application more clearly, the following briefly introduces the accompanying drawings that need to be used in the embodiments of the present application. It should be understood that the following drawings only show some embodiments of the present application, therefore It should not be regarded as a limitation of the scope. For those of ordinary skill in the art, other related drawings can also be obtained from these drawings without any creative effort.

FIG. 1 is a schematic structural diagram of a surface package capacitor in the related art.

FIG. 2 is a schematic structural diagram of a first surface package capacitor provided by an embodiment of the present application.

FIG. 3 is a schematic structural diagram of a second surface package capacitor provided by an embodiment of the present application.

FIG. 4 is a schematic structural diagram of a third surface mount capacitor provided by an embodiment of the present application.

FIG. 5 is a schematic structural diagram of a fourth surface package capacitor provided by an embodiment of the present application.

FIG. 6 is a schematic structural diagram of a fifth surface mount capacitor provided by an embodiment of the present application.

FIG. 7 is a schematic structural diagram of a sixth surface package capacitor provided by an embodiment of the present application.

FIG. 8 is a schematic diagram of the connection between the anode lead-out wire and the anode element according to the embodiment of the present application.

FIG. 9 is a schematic structural diagram of a first anode lead-out wire provided in an embodiment of the present application.

FIG. 10 is a schematic structural diagram of a second type of anode lead-out wire provided in an embodiment of the present application.

FIG. 11 is a schematic structural diagram of a third anode lead wire provided in an embodiment of the present application.

FIG. 12 is a schematic structural diagram of a fourth anode lead-out wire provided by an embodiment of the present application.

FIG. 13 is a circuit diagram for supplying power to the FPGA CPU provided by an embodiment of the present application.

FIG. 14 is a flow chart of steps of a method for fabricating a surface package capacitor according to an embodiment of the present application.

FIG. 15 is a schematic flowchart of a manufacturing process of a surface package capacitor according to an embodiment of the present application.

Icon: 100-surface mounted capacitor; 1-anode element; 2-cathode element; 20-dielectric layer; 21-cathode layer; 22-carbon layer; 23-silver layer; 24-cathode silver paste; 3-anode terminal ; 4- cathode terminal; 5- anode lead wire; 6- anode bottom terminal; 7- cathode bottom terminal; 8- substrate; 9- packaging material; 10- anode connection slot; 11- cathode connection slot; 12- insulator.

Detailed ways

The technical solutions in the embodiments of the present application will be described below with reference to the accompanying drawings in the embodiments of the present application.

In the current surface package capacitors, the terminal leads mainly rely on the cathode lead terminal and the anode lead terminal to lead the internal lead out to the bottom surface terminal. As shown in FIG. 1 , the related art discloses a surface package capacitor consisting of an anode block, a cathode silver paste, an anode lead-out terminal, a cathode lead-out terminal, an anode connecting wire, an anode bottom terminal, a cathode bottom terminal, and a substrate. In the surface package capacitor, the anode is led out to the anode bottom terminal through the anode connecting wire and the anode lead terminal; the cathode is led out to the cathode bottom terminal through the cathode lead terminal. It can be seen from the figure that the connection area of this method is very small, which makes the connection of the surface mount capacitor unstable, and the use risk is high, and this method also makes the ESR value of the surface mount capacitor larger.

In view of the above problems, the inventors of the present application, through research and exploration, propose the following embodiments to solve the above problems.

Referring to FIG. 2, an embodiment of the present application provides a surface package capacitor 100, which may include: an anode element 1 isolated from each other, a cathode element 2 (the cathode element 2 is disposed on the outer layer of the anode element 1), an anode lead-out end 3, and a cathode lead-out Terminal 4, anode lead wire 5, anode bottom terminal 6, cathode bottom terminal 7 and substrate 8.

Wherein, a dielectric layer 20 may be disposed between the anode element 1 and the cathode element 2, and the cathode element 2 may include a cathode layer 21, a carbon layer 22 and a silver layer 23 arranged in sequence, that is, a dielectric layer 20 is sequentially disposed outside the anode element 1 , a cathode layer 21 , a carbon layer 22 and a silver layer 23 . The silver layer 23 is connected to the cathode silver paste 24 . The cathode layer 21 of the cathode element 2 includes one or more of manganese dioxide, polypyrrole, polythiophene, polyaniline, polyamphetamine and their respective derivatives. That is, the cathode layer 21 may include only one component, for example, the cathode layer 21 includes only manganese dioxide and only polythiophene; the cathode layer 21 may also include two components, such as the cathode layer 21 includes polyaniline and polyaniline derivatives; The cathode layer 21 may also include three components such as manganese dioxide, polyaniline and polyamphetamine. Correspondingly, the cathode layer 21 may further include four, five or six components. This application does not limit this.

The above-mentioned density of the cathode layer 21 is in the range of 5.0 g·cm ⁻³ to 14.0 g·cm ⁻³ . It should be noted that when the density of the cathode layer 21 is controlled between 5.0 g·cm ⁻³ and 14.0 g·cm ⁻³ , the effect of reducing the ESR value is particularly remarkable.

The anode lead wire 5 can be connected to the anode element 1 . The outside of the anode lead-out wire 5 , the anode element 1 and the cathode element 2 may be filled with a packaging material 9 . The above-mentioned encapsulation material 9 may be, but not limited to, plastic encapsulation resin and phenolic resin. Specifically, the molding resin may also be epoxy molding resin.

The substrate 8 may be provided at the bottom of the anode element 1 and the cathode element 2 . In the embodiment of the present application, the substrate 8 may be provided with an anode connection slot 10 and a cathode connection slot 11 ; conductors may be provided in the anode connection slot 10 and the cathode connection slot 11 . Wherein, the conductor can be, but not limited to, conductive silver paste, conductive ink, and the like. The electrical conductor may also be a viscous conductive paste, such as Au (elemental gold), Pd (elemental palladium), Ni (elemental nickel), and the like.

The anode bottom surface terminal 6 can be arranged at the bottom of the above-mentioned substrate 8, and can be connected with the notch on one side of the anode connection slot 10; one end of the conductor arranged in the anode connection slot 10 can be connected with the anode lead wire 5, and arranged at the anode connection slot 10. The other end of the conductor of the tank 10 may be connected to the upper surface of the anode bottom surface terminal 6 . As shown in FIG. 2 , the conductors in the anode connection groove 10 may be deposited between the anode lead-out wire 5 and the upper surface of the anode bottom terminal 6 . That is, in the actual manufacturing process, when the anode element 1 is fixed on the substrate 8 provided with the anode connection groove 10, the conductor is injected into the anode connection groove 10, so that the conductor in the anode connection groove 10 is accumulated to the same extent as the anode connection groove 10. The anode lead wire 5 is connected.

The cathode bottom terminal 7 can be arranged at the bottom of the above-mentioned substrate 8, and can be connected with the notch on one side of the cathode connection slot 11; The silver paste 24 is connected to the cathode element 2 ), and the other end of the conductor disposed in the cathode connection groove 11 can be connected to the upper surface of the cathode bottom terminal 7 . As shown in FIG. 2 , the conductors in the cathode connection groove 11 are deposited between the cathode silver paste 24 and the upper surface of the cathode bottom terminal 7 . That is, in the actual manufacturing process, when the cathode element 2 is fixed on the substrate 8 provided with the cathode connection groove 11, the conductor is injected into the cathode connection groove 11, so that the conductor in the cathode connection groove 11 is accumulated to the The cathode silver paste 24 is connected.

The anode lead terminal 3 can be connected to the anode lead wire 5 and the anode bottom surface terminal 6 . That is, the external connection is formed through the anode terminal 3 .

The cathode lead terminal 4 can be connected to the cathode element 2 and the cathode bottom surface terminal 7 . That is, the external connection is formed through the cathode terminal 4 . Specifically, the cathode lead terminal 4 can be connected to the cathode element 2 through the cathode silver paste 24 .

In the embodiment of the present application, the anode lead end 3 and the cathode lead end 4 are plating layers. Specifically, the plating layers may be formed by electroplating or electroless plating. When the plating layer is formed by electroless plating, the plating layer is composed of an inner plating layer formed by electroless plating of Ni/P (elemental nickel/elemental phosphorus) and an outer plating layer formed by electroless plating of Au (elemental gold) or Sn (elemental tin).

In order to reduce the manufacturing cost of the surface mount capacitor 100 , the plating layer may also be formed by dipping or paste plating.

To sum up, in the embodiment of the present application, the anode connection slot 10 and the cathode connection slot 11 are provided on the substrate 8, so that the anode element 1 can be connected to the anode bottom terminal 6 through the conductor in the anode connection slot 10, and the cathode element 2 can be conducted through the conductor in the cathode connection slot 11 and the cathode bottom terminal 7, so that two parallel equivalent resistances are formed between the anode element 1 and the anode bottom terminal 6 (one is the conductor inside the anode connection slot 10. The internal circuit formed by connecting the anode element 1 and the anode bottom terminal 6, the other is an external circuit formed by the anode lead-out terminal 3), and two parallel equivalent resistances are formed between the cathode element 2 and the cathode bottom terminal 7 (one is the cathode The conductor inside the connection groove 11 connects the cathode element 2 with the cathode bottom terminal 7 to form an internal circuit, and the other is an external circuit formed through the cathode lead-out terminal 4), thereby reducing the ESR value of the surface mount capacitor 100 and improving the surface Reliability of packaged capacitor 100 .

Please refer to FIG. 3 , in order to ensure that the conductor in the anode connection groove 10 can effectively communicate with the anode lead-out line 5 and the anode bottom terminal 6, and is not easily deformed, and in order to ensure that the conductor in the cathode connection groove 11 can effectively communicate with the cathode element 2 and the cathode bottom surface terminal 7, which are not easily deformed. The slot on the other side of the cathode connection slot 11 extends to connect with the cathode element 2 (the slot at the other side of the cathode connection slot 11 extends to the cathode silver paste 24 and then connects with the cathode element 2 ).

It should be noted that the notch on the other side of the anode connection groove 10 can be extended to connect with the anode lead wire 5, which can be understood as a connected groove between the anode lead wire 5 and the anode bottom surface terminal 6, and the groove passes through it. Via substrate 8 can be connected to the upper surface of anode bottom terminal 6 . In this way, after the conductors are arranged in the grooves, the conductors can be connected to the anode lead wires 5 and the upper surfaces of the anode bottom surface terminals 6 respectively. Similarly, the notch on the other side of the cathode connection slot 11 extends to connect with the cathode element 2, and can be connected to form a communicating slot between the cathode silver paste 24 and the cathode bottom surface terminal 7, and the slot can pass through the substrate 8 to connect with the cathode element 2. The upper surface of the cathode bottom surface terminal 7 is connected.

Optionally, the number of anode connection grooves 10 opened on the substrate 8 may also be at least two, and correspondingly, the number of cathode connection grooves 11 opened on the substrate 8 may also be at least two. For example, referring to FIG. 4 , an embodiment of the present application provides another structure of a surface mount capacitor 100 . The number of anode connection grooves 10 opened on the substrate 8 is two, and the number of cathode connection grooves 11 opened on the substrate 8 is also two. The conductors in the two anode connecting grooves 10 are accumulated between the anode lead-out wires 5 and the upper surface of the anode bottom terminal 6 . That is, in the actual manufacturing process, when the anode element 1 is fixed on the substrate 8 provided with the two anode connection grooves 10 , a conductor is injected into the two anode connection grooves 10 , so that the electrical conductors in the anode connection grooves 10 are electrically conductive. The body is stacked to connect with the anode lead-out line 5; wherein, the conductors placed above the two anode connection grooves 10 are stacked together. The conductors in the two cathode connection grooves 11 are deposited between the cathode silver paste 24 and the upper surface of the cathode bottom terminal 7 . That is, in the actual manufacturing process, when the cathode element 2 is fixed on the substrate 8 provided with the two cathode connection grooves 11, a conductor is injected into the two cathode connection grooves 11, so that the electrical conductors in the cathode connection grooves 11 are electrically conductive. The body is stacked to connect with the cathode silver paste 24; wherein, the conductors placed above the two cathode connection grooves 11 are stacked together.

In this way, a three-way parallel equivalent resistance is formed between the anode element 1 and the anode bottom surface terminal 6 (two of which are formed by connecting the anode element 1 and the anode bottom surface terminal 6 by the conductors inside the two anode connection grooves 10 ). Two internal circuits, the third circuit is an external circuit formed by the anode terminal 3). In this way, a three-way parallel equivalent resistance is formed between the cathode element and the cathode bottom terminal 7 (two of which are two circuits formed by connecting the cathode element 2 and the cathode bottom terminal 7 by the conductors inside the two cathode connection grooves 11 ). an internal circuit, and the third path is an external circuit formed through the cathode lead-out terminal 4).

Of course, in other embodiments, three anode connection grooves 10 and four cathode connection grooves 11 may be provided on the substrate 8 , or one anode connection groove 10 and two cathode connection grooves 11 may be provided on the substrate 8 . The numbers of the anode connection grooves 10 and the cathode connection grooves 11 may be equal or unequal, which is not limited in this application.

Optionally, when the number of the anode connection grooves 10 is at least two, the notches on the other side of the at least two anode connection grooves 10 can be extended to connect with the anode lead wires 5 . Correspondingly, when the number of the cathode connection grooves 11 is at least two, the notches on the other side of the cathode connection grooves 11 can be extended to connect with the cathode element 2 . As shown in FIG. 5 , the conductors in the two anode connection slots 10 are separated, and the conductors in the two cathode connection slots 11 are also separated.

To sum up, in the embodiment of the present application, at least two anode connection grooves 10 are formed on the substrate 8 and at least two cathode connection grooves 11 are formed on the substrate 8 , so that the anode element 1 and the anode bottom surface terminal 6 are formed with multiple The equivalent resistance in parallel is formed between the cathode element and the cathode bottom terminal 7 , which further reduces the ESR value of the surface mount capacitor 100 and improves the reliability of the surface mount capacitor 100 .

Optionally, in order to ensure the reliability and rationality of the surface mount capacitor 100, the added area of the anode connection groove 10 and the cathode connection groove 11 is 10% to 80% of the added area of the anode bottom terminal 6 and the cathode bottom terminal 7. . For example, the added area of the anode connection groove 10 and the cathode connection groove 11 is 20%, 70%, etc. of the total area of the anode bottom terminal 6 and the cathode bottom terminal 7 . The technical personnel can design the slot size of the anode connection tank 10 and the cathode connection tank 11 to meet the above conditions according to the requirements, which is not limited in this application.

As shown in FIG. 6 , as a way of setting the connection groove, in the embodiment of the present application, the anode connection groove 10 can be opened on the side of the substrate 8 close to the anode lead-out end 3 , and the anode connection groove 10 is close to the anode lead-out end 3 One side of the base plate is opened, so that the anode terminal 3 is connected to the conductor in the anode connection groove 10; the cathode connection groove 11 can be opened on the side of the substrate 8 close to the cathode terminal 4, and the cathode connection groove 11 is close to the cathode terminal One side is opened so that the cathode lead-out terminal 4 is connected to the conductor in the cathode connection groove 11 . In this way, the manufacturing difficulty of the surface mount capacitor 100 can be reduced, and the overall performance of the surface mount capacitor 100 can be improved. Correspondingly, when the number of anode connection grooves 10 is two and the number of cathode connection grooves 11 is two, reference may be made to FIG. 7 . In the actual production process, when the anode element 1 is fixed on the substrate 8 provided with two anode connection grooves 10 (one of the anode connection grooves 10 is opened on the side of the substrate 8 close to the anode terminal 3, and the anode connection groove 10 is close to the side opening of the anode lead-out end 3), and the conductors are injected into the two anode connection grooves 10, so that the conductors in the anode connection grooves 10 are piled up to be connected with the anode lead-out line 5; The electrical conductors above the slot 10 are stacked together. In the actual production process, when the cathode element 2 is fixed on the substrate 8 provided with two cathode connection grooves 11 (one of the cathode connection grooves 11 is opened on the side of the substrate 8 close to the cathode lead-out end 4, and the cathode connection groove 11 is close to the side of the cathode lead-out end 4), and the conductors are injected into the two cathode connection grooves 11, so that the conductors in the cathode connection grooves 11 are stacked to connect with the cathode silver paste 24; The conductors above the slot 11 are stacked together.

The inventors of the present application found in their research that a plug-in design is currently used between the anode lead-out line 5 and the anode element 1 , which causes the anode lead-out line 5 to occupy the effective volume of the anode element 1 , thereby reducing the surface packaging capacitor 100 . capacity ratio. Therefore, please refer to FIG. 8 , in the embodiment of the present application, the anode lead-out line 5 is connected to the first surface of the anode element 1 . The first surface can be understood as a certain side surface of the anode element 1 . By connecting the anode lead wire 5 to the first surface of the anode element 1 , the anode lead wire 5 does not occupy the effective volume of the anode element 1 , thereby effectively improving the capacity ratio of the surface package capacitor 100 and improving the capacity of the anode element 1 utilization.

As an implementation manner of connection, the anode lead-out wire 5 and the first surface of the anode element 1 are formed by welding. As another connection implementation manner, the anode lead-out wire 5 and the first surface of the anode element 1 are formed by sintering. Using the above two methods to connect the anode lead wire 5 and the surface of the anode element 1 can ensure a stable connection between the anode lead wire 5 and the anode element 1 , thereby improving the stability of the surface package capacitor 100 .

Since the anode lead wire 5 is connected to the first surface of the anode element 1 , the position of the anode lead wire 5 can be freely adjusted during the manufacturing process of the surface package capacitor 100 , that is, the position of welding or sintering can be freely set . For example, in the embodiment of the present application, the anode lead-out line 5 is arranged below the center line of the first surface of the anode element 1 . In this way, the manufacturing difficulty of the surface mount capacitor 100 is reduced, the length of the conductive path is reduced, the ESR value of the surface mount capacitor 100 is further reduced, and the overall performance of the surface mount capacitor 100 is improved.

In order to further improve the internal stability and reliability of the surface mount capacitor 100 , in the embodiment of the present application, the anode lead-out line 5 adopts a heterosexual structure instead of a smooth linear structure.

As an embodiment of the first heterosexual structure, please refer to FIG. 9 , the anode lead-out wire 5 may adopt a threaded structure. It should be explained that the thread refers to a helical, continuous convex portion with a specific cross-section made on the surface of a cylindrical or conical parent body. Threads are divided into external threads and internal threads according to their position in the parent body, and are divided into triangular threads, rectangular threads, trapezoidal threads, serrated threads and other special-shaped threads according to their cross-sectional shape (tooth type). In the embodiment of the present application, the parent body is the anode lead-out wire 5, and the present application does not limit the specific thread structure used. In the embodiment of the present application, by adopting the anode lead-out wire 5 of the threaded structure, the encapsulation material 9 can be filled into the texture of the anode lead-out wire 5 of the threaded structure, and the bonding between the anode lead-out wire 5 and the encapsulation material 9 is increased. Therefore, the bonding force between the anode lead-out wire 5 and the packaging material 9 is strengthened, the generation of gaps and the entry of external moisture are prevented, and the reliability of the product is improved.

As a second embodiment of the heterosexual structure, please refer to FIG. 10 , the anode lead-out line 5 adopts a sawtooth structure. It should be explained that the sawtooth structure is a structural feature with a sawtooth profile. Its surface forms a staggered and continuous overall structure, and an equal spacing is formed between every two serrations. By adopting the anode lead-out wires 5 of the sawtooth structure, the encapsulation material 9 can be filled into the gaps of the anode lead-out wires 5 of the sawtooth structure, thereby increasing the bonding area between the anode lead-out wires 5 and the encapsulation material 9, thereby enhancing the anode lead-out The bonding force between the wire 5 and the packaging material 9 prevents the generation of gaps and the entry of external moisture, and improves the reliability of the product.

As a third embodiment of the heterosexual structure, please refer to FIG. 11 , the diameter of the anode lead wire 5 near the anode lead end 3 is larger than the diameter of the anode lead wire 5 near the anode element 1 . That is, the diameters of both ends of the anode lead wire 5 are different, and a side surface is formed at the connection between the two ends of the different diameters. In this way, the area of the anode lead wire 5 and the anode lead end 3 is made larger, and the improvement is improved. The reliability of the connection between the two reduces the ESR value of the surface mount capacitor. Second, due to the different diameters at both ends of the anode lead-out line 5, the anode lead-out line 5 is enlarged by a side formed by the connection between the two ends with different diameters. The bonding area with the packaging material 9 further strengthens the bonding force between the anode lead-out line 5 and the packaging material 9, prevents the generation of gaps and the entry of external moisture, and improves the reliability of the product.

As a fourth embodiment of the heterosexual structure, please refer to FIG. 12 , the diameter of the anode lead wire 5 near the anode lead end 3 is smaller than the diameter of the anode lead wire 5 near the anode element 1 . It can be understood that the anode lead wire 5 in FIG. 12 is connected in an opposite manner to the anode lead wire 5 shown in FIG. 11 , that is, the larger diameter end of the anode lead wire 5 in FIG. 12 is connected to the anode element 1, and the diameter is smaller. The small end is connected to the anode terminal 3 . In this way, the connection between the anode element 1 and the anode lead wire 5 is made more stable, and the bonding area between the anode lead wire 5 and the packaging material 9 is also increased, thereby strengthening the anode lead wire 5 and the packaging material 9. The bonding force between them prevents the generation of gaps and the entry of external moisture, and improves the reliability of the product.

The present application does not limit the specific use of the anode lead-out line 5 of the heterosexual structure described above.

Please continue to refer to FIG. 2 . Optionally, in order to effectively ensure the short circuit between the conductor inside the anode connection tank 10 and the cathode element 2 , an insulator is also provided between the conductor of the anode connection tank 10 and the cathode element 2 . 12. Wherein, the insulator may be ceramic, rubber, etc., which is not limited in this application.

The specific application of the above surface mount capacitor 100 will be described below.

As an application, the above-mentioned anode element 1 is a tantalum block. That is, the above-described surface mount capacitor 100 may be a tantalum capacitor. The following description is given with a comparative example.

Comparative Example 1:

The goal is to make a 16V 2.2uF conductive polymer tantalum capacitor, which is to press and sinter tantalum powder with a charge of 30000CV/g to form a porous anode with a size of 1.2mm long * 0.55mm wide * 0.55mm high. The same polyimide material was sprayed on tantalum wire and cured at 150°C for 30 minutes, the anode was oxidized to 50V in phosphoric acid electrolyte.

Using 4wt% 3,4-ethyldioxythiophene monomer, 16wt% oxidant, 16wt% butanol and 2-propanol balancer as raw materials, an impregnation solution was prepared, the anode was repeatedly immersed in it, and cured at 85°C for 60 minute. The anodes were washed in deionized water at 25 degrees and dried after each curing cycle, and the anodes were treated as described above.

Carbon and silver are coated on the outside of the anode block, and laser cleaning is used to remove the coating material and conductive polymer from the wire.

The substrate has no holes. The anode block is directly bonded to the substrate, encapsulated with epoxy resin, and drawn out through slivers and terminals to form a product with a size of 0.9mm*1.7mm*0.8mm, and finally the aging sorting test is carried out.

The tantalum capacitor provided in Example 1 of this application: the substrate is engraved with two connection grooves (a cathode connection groove and an anode connection groove respectively) by laser, and the conductors are filled into the two connection grooves, and then the anode block is bonded to the On the substrate, other processes are the same as in Comparative Example 1.

Effect verification example 1: please refer to FIG. 13, FIG. 13 is a circuit diagram for supplying power to an FPGA (Field Programmable Gate Array, Field Programmable Gate Array) CPU (central processing unit, central processing unit) according to an embodiment of the present application . The specific parameters of the circuit are as follows: Vin=12V, Vout=1V, the peak current is 40A, the slope is 30A/us, the switching frequency of the switching power supply is 500kHz (2 phases), and the inductance is 0.15uH, using 150 comparative examples 1 and 150 respectively. The capacitor of Example 1 of the present application is installed in the line (the capacitor is installed at the position marked CAP in the figure), and the peak-to-peak value of the voltage at the power supply terminal of the CPU is measured, and the data is listed in Table 1.

Data comparison:

For the target product 16V 2.2uF conductive polymer tantalum capacitor, test the ESR of the comparison product (as shown in Table 1 below):

Table 1

It can be seen from the data comparison in Table 1 above that the tantalum capacitor provided in Example 1 of the present application can significantly reduce the ESR value of the equivalent series resistance and the peak-to-peak value of the voltage.

As another application, the above-mentioned anode element 1 is an aluminum block. That is, the above-described surface mount capacitor 100 may be an aluminum capacitor. The following description is made with reference to Comparative Example 2.

Comparative example 2:

An oxide is formed on an aluminum foil rated at 11V, resulting in an aluminum foil with a specific volume of 190uF/cm2. The aluminium foil was cut into 3.5mm wide strips and welded to the processed strips. Apply a strip of masking to create a 4.7mmx3.5mm area for the formation.

The aluminum foil was immersed in a pure aqueous solution of 5%wt ammonium adipate, and the Al2O3 dielectric layer at the edge of the aluminum foil was repaired by applying a DC voltage of 11 V.

The aluminum foil was sequentially immersed in an oxidant aqueous solution prepared with 25wt% ammonium persulfate and 1wt% sodium toluenesulfonate under vacuum conditions, and then immersed in 1.5mol/L 3,4-ethyldioxythiophene in propanol in solution. The anode was kept at 40.5 degrees for 30 minutes to complete the polymerization. From the immersion in the oxidant aqueous solution to the polymerization reaction, it was repeated three times. The by-products of the polymerization reaction on the aluminum foil are then cleaned and coated with carbon and silver.

The 8-layer units are stacked together to form an anode block, the positive end of the anode block is welded by resistance welding, and the negative electrode is bonded together with conductive silver glue and cured by heating.

The substrate has no holes. The anode block is directly bonded to the substrate, encapsulated with epoxy resin, and drawn out through slivers and terminals to form a product with a size of 7.3mm*4.3mm*1.9mm, and finally the aging sorting test is carried out.

Example 2 of the present application:

The substrate is laser engraved with 1 hole/terminal, and the conductive paste is filled into the hole, and then the anode block is bonded to the substrate. The other processes are the same as in Comparative Example 2.

Effect verification example 2: Please continue to refer to Figure 13. The circuit design and parameter effect verification example 1 are the same, but in this verification, only 3 capacitors of Comparative Example 2 and 3 capacitors of Example 2 of the present application are installed in the circuit ( The capacitor is installed at the position marked CAP in the figure), and the peak-to-peak value of the voltage at the power supply terminal of the CPU is measured, and the data is listed in Table 2.

Data comparison:

For the target product 6.3V 220uF conductive polymer aluminum capacitor, test the ESR of the comparative product (as shown in Table 2 below):

Table 2

From the data comparison in Table 2 above, it can be seen that the aluminum capacitor provided in Example 2 of the present application can significantly reduce the ESR value of the equivalent series resistance and reduce the peak-to-peak value of the voltage.

Comparative Example 3

The goal is to make a 16V 2.2uF conductive polymer tantalum capacitor, which is to press and sinter tantalum powder with a charge of 30000CV/g to form a porous anode with a size of 1.2mm long * 0.55mm wide * 0.55mm high. The same polyimide material was sprayed on tantalum wire and cured at 150°C for 30 minutes, the anode was oxidized to 50V in phosphoric acid electrolyte.

Using 4wt% 3,4-ethyldioxythiophene monomer, 16wt% oxidant, 16wt% butanol and 2-propanol balancer as raw materials, an impregnation solution was prepared, the anode was repeatedly immersed in it, and cured at 85°C for 60 minute. The anodes were washed in deionized water at 25 degrees and dried after each curing cycle, and the anodes were treated as described above.

Carbon and silver are coated on the outside of the anode block, and laser cleaning is used to remove the coating material and conductive polymer from the wire.

The substrate is laser engraved with 2 connection grooves (respectively, the cathode connection groove and the anode connection groove), and the conductors are filled into the two connection grooves, and then the anode block is bonded to the substrate.

For the target product 16V 2.2uF conductive polymer tantalum capacitor, test the moisture resistance of the comparative product, the method is tested according to JEDEC J-STD-020B.

The tantalum capacitors provided in Example 3 of this application, Example 4 of this application, and Example 5 of this application: the anode lead-out lines are shown in Figure 9, Figure 10, and Figure 11, respectively, and other processes are the same as Comparative Example 3.

Data comparison:

table 3

  Anode pinout style Moisture-resistant grade Comparative Example 3 Figure 8 MSL3 Example 3 of the present application Figure 9 MSL2a Example 4 of the present application Figure 10 MSL2a Example 5 of the present application Figure 11 MSL2a

From the comparison of the data in Table 3 above, it can be seen that the tantalum capacitors provided in the embodiments of the present application can significantly improve the moisture resistance of the products.

Referring to FIG. 14 , based on the same inventive concept, an embodiment of the present application may further provide a method for fabricating a surface-packaged capacitor, the method comprising: step S101 to step S105 .

Step S101: Provide a substrate.

Step S102 : forming an anode connecting groove and a cathode connecting groove on the substrate by laser engraving.

Step S103 : filling the conductors into the anode connection groove and the cathode connection groove.

Step S104: Adhering the prepared anode block to the substrate, so that the conductors in the anode connection grooves are connected to the anode lead wires and the anode bottom terminals, and the conductors in the cathode connection grooves are connected to Cathode element and cathode bottom terminal.

It should be noted that the process of preparing the anode block includes: connecting the surface of the anode element with the anode lead wire; sequentially generating a dielectric layer and a conductive polymer layer (cathode layer) on the surface of the anode element; then continuing to coat the surface with a carbon layer and silver layer; finally the anode leads are cleaned and insulators are applied.

For ease of understanding, the preparation process is described below with reference to FIG. 15 : 1. Fabrication of the anode element. 2. Bonding of anode element and anode lead wire. 3. Generate a dielectric layer. 4. Generate the cathode layer. 5. The surface is coated with carbon layer. 6. The surface is coated with silver layer. 7. Set the insulator. 8. The anode element is bonded to the substrate on which the anode connection groove and the cathode connection groove are formed. 9. Carry out encapsulation (injection of conductors, cathode silver paste, encapsulation materials, etc.). 10. Terminal leads.

Specifically, for the description of the structure in the method steps, reference may be made to the above description of the structure of the surface mount capacitor. In order to avoid redundancy, the description is not repeated here.

Step S105: Perform a packaging test on the anode block.

Wherein, the encapsulation can be encapsulated by, but not limited to, plastic encapsulation resin or phenolic resin. Subsequent use of lobes and terminals for extraction, that is, extraction through anode terminals and cathode terminals.

Through the above steps, a complete surface-packaged capacitor can be formed, and an aging sorting test method can be used for subsequent screening, which is not limited in this application.

In the description of this application, it should be noted that the orientation or positional relationship indicated by the terms "inside", "outside", etc. is based on the orientation or positional relationship shown in the accompanying drawings, or is usually placed when the product of the application is used. The orientation or positional relationship is only for the convenience of describing the present application and simplifying the description, rather than indicating or implying that the referred device or element must have a specific orientation, be constructed and operated in a specific orientation, and therefore should not be construed as a limitation on the present application. Furthermore, the terms "first", "second", etc. are only used to differentiate the description and should not be construed to indicate or imply relative importance.

It should also be noted that, unless otherwise expressly specified and limited, the terms "arrangement" and "connection" should be understood in a broad sense, for example, it may be a fixed connection, a detachable connection, or an integral connection; it may be a direct connection The connection can also be indirectly connected through an intermediate medium, and it can be the internal communication of two elements. For those of ordinary skill in the art, the specific meanings of the above terms in the present application can be understood in specific situations.

The above descriptions are merely examples of the present application, and are not intended to limit the protection scope of the present application. For those skilled in the art, the present application may have various modifications and changes. Any modification, equivalent replacement, improvement, etc. made within the spirit and principle of this application shall be included within the protection scope of this application.

Industrial Applicability

The application provides a surface-packaged capacitor and a manufacturing method of the surface-packaged capacitor. The surface-packaged capacitor includes: an anode element and a cathode element isolated from each other; an anode lead wire; a substrate, on which an anode connection slot and a cathode connection slot are formed; A conductor is arranged in the connection slot and the cathode connection slot; the anode bottom surface terminal is connected with the notch on one side of the anode connection slot; one end of the conductor arranged in the anode connection slot is connected with the anode lead wire, and the conductive conductor arranged in the anode connection slot The other end of the body is connected with the upper surface of the anode bottom terminal; the cathode bottom terminal is connected with the notch on one side of the cathode connecting slot; one end of the conductor arranged in the cathode connecting slot is connected with the cathode element, and the conductive The other end of the body is connected to the upper surface of the cathode bottom terminal. Through the above structure arrangement, the ESR value of the surface package capacitor is reduced, and the reliability of the surface package capacitor is improved.

Furthermore, it will be appreciated that the surface mount capacitors and methods of fabricating surface mount capacitors of the present application are reproducible and can be used in a variety of industrial applications. For example, the surface mount capacitor and the method for fabricating the surface mount capacitor of the present application can be used in the application field of the surface mount capacitor.

Claims (19)

A surface package capacitor, characterized in that, comprising: Anode and cathode elements isolated from each other; an anode lead wire, connected with the anode element; the outer parts of the anode lead wire, the anode element and the cathode element are filled with encapsulation material; a base plate, arranged at the bottom of the anode element and the cathode element, an anode connection slot and a cathode connection slot are opened on the base plate; a conductor is arranged in the anode connection slot and the cathode connection slot; The anode bottom surface terminal is arranged at the bottom of the substrate and is connected to the notch on one side of the anode connection slot; one end of the conductor arranged in the anode connection slot is connected to the anode lead wire, and is arranged at the The other end of the conductor of the anode connection groove is connected to the upper surface of the bottom terminal of the anode; The cathode bottom surface terminal is arranged at the bottom of the substrate and is connected to the notch on one side of the cathode connection slot; one end of the conductor arranged in the cathode connection slot is connected to the cathode element, and is arranged at the cathode The other end of the conductor of the connection slot is connected to the upper surface of the bottom terminal of the cathode; an anode lead-out terminal, connected with the anode lead-out wire and the anode bottom surface terminal; The cathode lead-out terminal is connected to the cathode element and the cathode bottom surface terminal. The surface mount capacitor of claim 1, wherein the anode lead wire is connected to the first surface of the anode element. The surface-mount capacitor according to claim 1 or 2, wherein the anode lead wire and the first surface of the anode element are formed by welding or sintering. The surface mount capacitor according to any one of claims 1 to 3, wherein the anode lead-out line is disposed below the centerline of the first surface of the anode element. The surface mount capacitor according to any one of claims 1 to 4, wherein the anode lead-out wire adopts a screw structure. The surface mount capacitor according to any one of claims 1 to 4, wherein the anode lead-out line adopts a sawtooth structure. The surface mount capacitor according to any one of claims 1 to 6, wherein the diameter of the side of the anode lead-out line close to the anode lead-out end is larger than the diameter of the anode lead-out line close to the anode element diameter of the side. The surface-mount capacitor according to any one of claims 1 to 6, wherein the diameter of the side of the anode lead-out line close to the anode lead-out end is smaller than the diameter of the anode lead-out line close to the anode element diameter of the side. The surface mount capacitor according to any one of claims 1 to 8, wherein the cathode element is disposed on the outer layer of the anode element, and a dielectric layer is disposed between the cathode element and the anode element , the cathode element comprises a cathode layer, a carbon layer and a silver layer arranged in sequence; an insulator is arranged between the conductor in the anode connection groove and the cathode element. The surface-mount capacitor according to claim 9, wherein the cathode layer of the cathode element comprises one or more of manganese dioxide, polypyrrole, polythiophene, polyaniline, polyamphetamine and their derivatives . The surface mount capacitor according to any one of claims 1 to 10, wherein the conductor is a conductive silver paste. The surface mount capacitor according to any one of claims 1 to 11, wherein the number of anode connection grooves opened on the substrate is at least two; the number of cathode connection grooves opened on the substrate is at least two two. The surface mount capacitor according to any one of claims 1 to 12, wherein the number of the anode connection grooves and the number of the cathode connection grooves provided on the substrate are equal or different. The surface mount capacitor according to any one of claims 1 to 13, wherein the area of the anode connection groove and the cathode connection groove is the sum of the anode bottom terminal and the cathode bottom terminal. 10% to 80% of the area. The surface mount capacitor according to any one of claims 1 to 14, wherein the anode connection groove is opened on a side of the substrate close to the anode lead-out end, and the anode connection groove is close to the anode One side of the lead-out end is opened, so that the anode lead-out end is connected with the conductor in the anode connection groove; The cathode connection slot is opened on the side of the substrate close to the cathode lead-out end, and the cathode connection slot is opened on the side close to the cathode lead-out end, so that the cathode lead-out end is connected to the cathode connection slot. Conductor connection. The surface mount capacitor according to any one of claims 1 to 15, wherein the notch on the other side of the anode connection groove extends to be connected with the anode lead wire; the other side of the cathode connection groove extends to connect with the anode lead wire; A side slot extends to connect with the cathode element. The surface mount capacitor according to any one of claims 1 to 16, wherein the anode element is a tantalum block; the cathode element is disposed on the outer layer of the tantalum block, and the cathode element is connected to the tantalum block. A dielectric layer is disposed between the blocks, and the cathode element includes a cathode layer, a carbon layer, and a silver layer arranged in sequence. The surface mount capacitor according to any one of claims 1 to 16, wherein the anode element is an aluminum block; the cathode element is arranged on the outer layer of the aluminum block, and the cathode element is connected to the aluminum block. A dielectric layer is disposed between the blocks, and the cathode element includes a cathode layer, a carbon layer, and a silver layer arranged in sequence. A method for manufacturing a surface-packaged capacitor, comprising: providing a substrate; An anode connecting groove and a cathode connecting groove are opened on the substrate by laser engraving; Filling conductors into the anode connection groove and the cathode connection groove; Adhering the prepared anode block to the substrate, so that the conductors in the anode connection grooves are connected to the anode lead-out wires and the anode bottom surface terminals, and the conductors in the cathode connection grooves are connected to the cathode elements and cathode bottom terminal; Encapsulation tests were performed on the anode blocks.

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