WO2022179395A1 - Atomization assembly, atomizer, and electronic atomization device - Google Patents

Abstract

An atomization assembly (15), an atomizer (10) and an electronic atomization device. The atomization assembly (15) comprises an atomization core (151) and an infrared reflector (152), wherein the atomization core (151) comprises an e-liquid guiding core (154) and an infrared radiation layer (155), the infrared radiation layer (155) is disposed on an atomization surface (1541) of the e-liquid guiding core (154), and the infrared reflector (152) is disposed on the side of the infrared radiation layer (155) away from the e-liquid guiding core (154), and is separated from the infrared radiation layer (155); and the infrared radiation layer (155) can heat and atomize a substrate to be atomized by means of infrared radiation, and an infrared reflecting surface (15221) of the infrared reflector (152) is configured to reflect infrared rays radiated from the infrared radiation layer (155) to the atomizion surface (1541) of the e-liquid guiding core (154). The atomization assembly (15), the atomizer (10) and the electronic atomization device can solve the problems of generating a local high-temperature and a burnt smell on the surface of the atomization surface (1541) and the small amount of atomization when the atomization core (151) is used for heating and atomizing.

Description

Nebulizer components, nebulizers and electronic nebulizers

CROSS-REFERENCE TO RELATED APPLICATIONS

This application claims priority based on Chinese patent application 202120412950.0 filed on February 24, 2021, the entire contents of which are incorporated herein by reference.

technical field

The present application relates to the technical field of electronic atomization devices, and in particular, to an atomization assembly, an atomizer, and an electronic atomization device.

Background technique

Electronic atomizers are electronic products that generate aerosols. The toxic components in the aerosol generated by the combustion of the atomized substrate will enter the body of the user along with the suction, which will cause adverse effects on the health of the user and the people around him. Therefore, the electronic atomization device has been widely promoted.

The key component in the electronic atomization device is the atomizing core, which can heat and atomize the substrate to be atomized and escape the aerosol for the user to use. In the existing atomizing core, a metal thin film circuit is made on the surface of the oil-conducting porous ceramic core, and the substrate to be atomized is heated and atomized by the metal thin film circuit. However, when the metal film circuit is heated and atomized, the surface temperature is not uniform, and the heating circuit is prone to local high temperature and produces a burnt smell. Moreover, the metal film circuit will hinder the passage of the substrate to be atomized, so the area of the metal film circuit on the atomization surface is relatively small. Small, so that the atomization volume of the atomizing core is less.

SUMMARY OF THE INVENTION

The atomization assembly, atomizer and electronic atomization device provided in this application can solve the problem of local high temperature and burnt smell on the surface of the atomization surface when the atomization core is heated and atomized. The problem of less atomization.

In order to solve the above technical problems, the present application provides an atomization assembly, which includes an atomization core and an infrared reflector. The atomizing core includes a liquid-conducting core and an infrared radiation layer, the infrared radiation layer is arranged on the atomization surface of the liquid-conducting core, and the infrared reflector is arranged on the side of the infrared radiation layer away from the liquid-conducting core, and is arranged at intervals from the infrared radiation layer, The infrared radiation layer can heat and atomize the substrate to be atomized by infrared radiation, and the infrared reflection surface of the infrared reflector is configured to reflect the infrared rays radiated by the infrared radiation layer to the atomization surface of the liquid-conducting core.

The infrared reflector is configured such that the infrared reflector is a concave surface.

The infrared reflector includes a heat shield and an infrared reflector, the infrared reflector is disposed on the side of the heat shield close to the infrared radiation layer, and the infrared reflector forms an infrared reflector on the surface of the heat shield away from the heat shield.

Wherein, the side of the heat insulation plate close to the infrared radiation layer has a first groove, and the infrared reflection layer is arranged on the inner wall surface of the first groove, or the infrared reflection layer is arranged on the inner wall surface of the first groove, and the heat insulation plate is close to the inner wall surface of the first groove. One surface of the infrared radiation layer is on the other surface except the inner wall surface of the first groove, so that the surface of the infrared reflection layer away from the heat insulation board is a concave surface.

The atomizing core further includes an electrode, which is arranged on the liquid-conducting core and is electrically connected to the infrared radiation layer. The atomizing assembly further includes a conductive member. The infrared reflection member has a through hole. One end of the conductive member is connected to the electrode, and the other end passes through it. Through the through hole, the conductive member has a limiting portion, and the limiting portion abuts the side of the infrared reflection member close to the electrode.

Wherein, part or all of the electrodes are arranged on the surface of the infrared radiation layer facing away from the liquid-conducting core.

Wherein, the gap distance between the atomizing surface and the infrared reflecting surface is 1.5mm-3mm.

Wherein, the infrared reflector has one or more first air inlet holes, and the first air inlet holes are used to communicate with the air inlet of the installation base.

Wherein, the thickness of the infrared radiation layer is 0.15mm-0.6mm. The liquid-conducting core is a porous material, and the infrared radiation layer is a conductive infrared porous material.

Wherein, the conductive infrared porous material is one or more of titanium carbide-based ceramic materials, cordierite-based ceramic materials, spinel-based ceramic materials, and perovskite-based ceramic materials.

Wherein, the atomizing core further includes a conductive heating layer, which is arranged on the atomization surface; the conductive heating layer and the infrared radiation layer are arranged side by side, and the infrared radiation layer is a conductive porous material.

The atomizing core further includes a conductive heating layer, which is arranged on the atomization surface; the conductive heating layer and the infrared radiation layer are stacked and arranged, and the non-overlapping part of the infrared radiation layer and the conductive heating layer is a conductive porous material.

In order to solve the above-mentioned technical problems, the present application also provides an atomizer. The atomizer includes a casing, a mounting base and the above-mentioned atomization assembly, the casing has a liquid storage cavity and an installation cavity, and the installation base is arranged in the installation cavity, The atomizing assembly is arranged on the installation base.

In order to solve the above technical problems, the present application also provides an electronic atomization device, the electronic atomization device includes a battery assembly and the above-mentioned atomizer, and the battery assembly and the atomizer are electrically connected.

The beneficial effects of this application are:

In the atomization assembly, atomizer and electronic atomization device provided by the present application, an infrared radiation layer is arranged on the atomization surface of the atomization core of the atomization assembly to replace the original metal thin film circuit, and the substrate to be atomized is irradiated with infrared radiation. Atomization is heated, and an infrared reflection surface is arranged at the opposite position of the infrared radiation layer, and the infrared reflection surface can reflect the infrared rays radiated by the infrared radiation layer to the atomization surface of the liquid-conducting core. The projection of infrared radiation is very strong, which can increase the atomization depth in the thickness direction of the liquid film of the substrate to be atomized, which is beneficial to increase the amount of atomization; at the same time, the reflection of infrared radiation makes the heating area of the infrared radiation on the atomizing surface wider, It is beneficial to improve the field uniformity of the temperature of the atomizing surface, and solve the problem of uneven temperature of the atomizing surface. The reflection of infrared radiation further makes the area heated by infrared radiation wider, so it can increase the atomization of the substrate to be atomized. volume, improve the user's atomization taste.

Description of drawings

In order to illustrate the technical solutions in the embodiments of the present application more clearly, the following briefly introduces the drawings that are used in the description of the embodiments. Obviously, the drawings in the following description are only some embodiments of the present application. For those of ordinary skill in the art, other drawings can also be obtained from these drawings without any creative effort.

Fig. 1 is a kind of structural representation of the atomizer provided by this application;

Fig. 2 is the exploded structure schematic diagram of the atomizer of Fig. 1;

Fig. 3 is the sectional structure schematic diagram of the atomizer of Fig. 1;

4 is a schematic structural diagram of an angle of the atomizing assembly provided by the application;

FIG. 5 is a schematic structural diagram of another angle of the atomizing assembly provided by the application.

Detailed ways

The technical solutions in the embodiments of the present application will be clearly and completely described below with reference to the accompanying drawings in the embodiments of the present application. Obviously, the described embodiments are only a part of the embodiments of the present application, rather than all the embodiments. Based on the embodiments in the present application, all other embodiments obtained by those of ordinary skill in the art without creative efforts shall fall within the protection scope of the present application.

In the following description, for purposes of illustration and not limitation, specific details such as specific system structures, interfaces, techniques, etc. are set forth in order to provide a thorough understanding of the present application.

The term "and/or" in this article is only an association relationship to describe the associated objects, indicating that there can be three kinds of relationships, for example, A and/or B, it can mean that A exists alone, A and B exist at the same time, and A and B exist independently B these three cases. In addition, the character "/" in this document generally indicates that the related objects are an "or" relationship. Also, "multiple" herein means two or more than two.

The terms "first", "second" and "third" in this application are only used for descriptive purposes, and should not be construed as indicating or implying relative importance or implying the number of indicated technical features. Thus, features defined as "first", "second", "third" may expressly or implicitly include at least one of said features. In the description of the present application, "a plurality of" means at least two, such as two, three, etc., unless otherwise expressly and specifically defined. All directional indications (such as up, down, left, right, front, rear...) in the embodiments of the present application are only used to explain the relative positional relationship between components under a certain posture (as shown in the accompanying drawings). , motion situation, etc., if the specific posture changes, the directional indication also changes accordingly. The terms "comprising" and "having" and any variations thereof in the embodiments of the present application are intended to cover non-exclusive inclusion. For example, a process, method, system, product or device comprising a series of steps or units is not limited to the listed steps or units, but optionally also includes unlisted steps or units, or optionally also includes Other steps or components inherent to these processes, methods, products or devices.

Reference herein to an "embodiment" means that a particular feature, structure, or characteristic described in connection with the embodiment can be included in at least one embodiment of the present application. The appearances of the phrases in various places in the specification are not necessarily all referring to the same embodiment, nor are they separate or alternative embodiments that are mutually exclusive with other embodiments. It is explicitly and implicitly understood by those skilled in the art that the embodiments described herein may be combined with other embodiments.

The present application will be described in detail below with reference to the accompanying drawings and embodiments.

The present application provides an electronic atomization device, which can be used for atomization of liquid substrates. The electronic atomizer device includes an atomizer 10 and a battery assembly, and the atomizer 10 and the battery assembly are electrically connected.

The nebulizer 10 can be used in different fields, such as medical atomization, electronic atomization, and the like. The atomizer 10 is used for storing the substrate to be atomized and atomizing the substrate to be atomized to generate aerosol. Atomizing the substrate and generating an aerosol for the user to inhale, the following embodiments are all taken as an example; in other embodiments, the atomizer 10 can also be applied to a hair spray device to atomize for hair styling hair spray; or used in medical equipment for the treatment of upper and lower respiratory diseases to atomize medical drugs. There is a battery in the battery assembly, and the battery is used to power the atomizer 10, so that the atomizer 10 can atomize the substrate to be atomized to form an aerosol. The atomizer 10 and the battery assembly may be integrally provided, or may be detachably connected, which can be designed according to specific needs. The atomizer 10 and the battery assembly provided in this embodiment are detachably connected.

The present application also provides an atomizer 10 , please refer to FIG. 1 , FIG. 2 and FIG. 3 . FIG. 1 provides a schematic structural diagram of the atomizer 10 in this embodiment, FIG. 2 provides a schematic exploded structure diagram of the atomizer 10 of FIG. 1 , and FIG. 3 provides a cross-sectional structural schematic diagram of the atomizer 10 of FIG. 1 .

The atomizer 10 includes a housing 11 , a mounting top seat 13 , an atomizing assembly 15 , a mounting base 17 and a bottom cover 18 .

The housing 11 is formed with a liquid storage cavity 111 , an atomization channel 112 and an installation cavity 113 . One end of the housing 11 forms a suction nozzle, and the suction nozzle communicates with the atomization channel 112 . Specifically, the housing 11 forms an installation cavity 113 on the side of the liquid storage cavity 111 away from the suction nozzle.

The liquid storage chamber 111 is used to store the liquid substrate to be atomized. The housing 11 can be made of metal such as aluminum, stainless steel, or plastic, as long as it can store the substrate to be atomized without reacting with it to make it deteriorate. That is, the shape and size of the liquid storage chamber 111 are not limited, and can be designed as required.

The atomization channel 112 and the liquid storage cavity 111 are arranged on one side of the installation cavity 113, and the atomization channel 112 communicates with the installation cavity 113; the liquid storage cavity 111 can be arranged around the atomization channel 112, or, the liquid storage cavity 111 and the The channels 112 can also be arranged side by side, that is, the atomization channel 112 is arranged on one side of the liquid storage chamber 111 .

Both the mounting top seat 13 and the mounting base 17 are accommodated in the mounting cavity 133 , and the mounting top seat 13 is assembled on the side of the mounting base 17 close to the liquid storage chamber 111 . The installation top seat 13 has a liquid guide channel 131, the liquid guide channel 131 is communicated with the liquid storage cavity 111, and the substrate to be atomized in the liquid storage cavity 111 can guide the liquid through the liquid guide channel 131; at the same time, the installation top seat 13 and the shell The body 11 cooperates to form an air outlet channel, and the air outlet channel communicates with the atomization channel 112 , so that the airflow can flow to the atomization channel 112 through the air outlet channel. The installation top seat 13 can realize the separation and guiding of liquid and gas through the liquid guiding channel 131 and the gas outlet channel.

A second groove 171 is provided on the surface of the mounting base 17 close to the liquid guide channel 131 , the atomizing assembly 15 is overlapped on the mounting base 17 , and the part of the atomizing assembly 15 is accommodated in the second groove 171 and covers the second groove 171 . The groove 171 is close to one end of the liquid guiding channel 131 . The atomizing assembly 15 cooperates with the mounting base 17 to form an atomizing cavity 114 . The substrate to be atomized in the liquid storage chamber 111 flows to the atomizing assembly 15 through the liquid guiding channel 131, and the substrate to be atomized is heated and atomized in the atomizing chamber 114 to form an aerosol; the atomizing chamber 114 is communicated with the air outlet channel, so that the atomization The aerosol in the atomizing chamber 114 flows to the atomizing channel 112 through the air outlet channel.

The mounting base 17 is provided with a second air intake hole 172 , the second air intake hole 172 is disposed on the side of the second groove 171 away from the mounting top seat 13 , and the second air intake hole 172 communicates the external atmosphere with the atomizing chamber 114 . That is, the second air inlet hole 172 , the atomization chamber 114 , the air outlet channel, and the atomization channel 112 form the air flow channel in the atomizer 10 . The second air inlet hole 172 , the atomization cavity 114 , the air outlet channel, and the atomization channel 112 form an air flow channel in the atomizer 10 . When the user uses the electronic atomization device, when the suction nozzle is inhaling, the outside air enters the atomization chamber 114 through the second air inlet 172 on the mounting base 17, and carries the aerosol atomized in the atomization chamber 114 through the air outlet. The channel enters the atomization channel 112, and the aerosol finally reaches the mouthpiece to be sucked by the user.

The bottom cover 18 covers the end of the mounting base 17 facing away from the liquid storage chamber 111 , and the housing 11 and the bottom cover 18 are detachably connected. The bottom cover 18 has an opening 181 so that the outside air can enter the second air intake hole 172 through the opening 181 .

Further, a first sealing member 12 and a second sealing member 14 are also provided in the installation cavity 113 , and the first sealing member 12 is provided at one end of the installation top seat 13 close to the liquid storage cavity 111 to realize the installation of the top seat 13 and the housing. 11 ; the second seal 14 is arranged at one end of the atomizing assembly 15 close to the liquid storage chamber 111 to realize the sealing between the atomizing assembly 15 and the mounting top seat 13 . The material of the first sealing member 12 and the second sealing member 14 can be any sealing material that has certain flexibility and can withstand a certain temperature. In one embodiment, the material of the first sealing member 12 and the second sealing member 14 is silica gel; the shape and size of the first sealing member 12 and the second sealing member 14 are not limited, and can be designed as required.

The present application also provides an atomizing assembly 15 , please refer to FIGS. 4 and 5 . FIGS. 4 and 5 provide schematic structural diagrams of the atomizing assembly 15 in this embodiment. The atomizing assembly 15 includes an atomizing core 151 , an infrared reflecting member 152 and a conductive member 153 .

The atomizing core 151 includes a liquid-conducting core 154 , an infrared radiation layer 155 and an electrode 156 . The liquid-conducting core 154 has an atomizing surface 1541, and the substrate to be atomized flowing to the atomizing surface 1541 will be heated and atomized to form an aerosol. One end of the liquid guiding core 154 facing away from the atomization surface 1541 has a third groove 1542 , and the substrate to be atomized flows from the liquid guiding channel 131 to the third groove 1542 . The liquid-conducting core 154 is a porous material, and the liquid-conducting core 154 uses capillary force to drain the substrate to be atomized to the atomizing surface 1541 .

The infrared radiation layer 155 is disposed on the atomizing surface 1541 of the liquid-conducting core 154, and the infrared radiation layer 155 can heat and atomize the substrate to be atomized by infrared radiation. The projection of infrared radiation is very strong, which can increase the atomization depth in the thickness direction of the liquid film of the substrate to be atomized, which is beneficial to increase the amount of atomization; and the enhancement of the projection property can make the substrate to be atomized that has not been atomized to be preheated in advance , and the pre-set substrate to be atomized increases, which is beneficial to the continuous improvement of high-flow atomization. The infrared radiation layer 155 is arranged on the atomization surface 1541 of the liquid-conducting core 154, which is beneficial to reduce the propagation loss of the infrared radiation, so that the efficiency of the infrared radiation is higher.

The infrared reflector 152 of the atomizing assembly 15 is disposed on the side of the infrared radiation layer 155 away from the liquid-conducting core 154 , and the infrared reflector 152 is spaced from the infrared radiation layer 155 . Specifically, the infrared reflecting member 152 includes a heat shield 1521 and an infrared reflecting layer 1522. The infrared reflecting layer 1522 is disposed on the side of the heat shield 1521 close to the infrared radiation layer 155, and the infrared reflecting layer 1522 forms infrared reflection on the surface of the infrared reflecting layer 1522 close to the infrared radiation layer 155. face 15221. The heat insulation plate 1521 can insulate the installation base to prevent the heat of the installation base from being too high.

The infrared reflection surface 15221 of the infrared reflection layer 1522 can reflect the infrared rays radiated by the infrared radiation layer 155 to the atomization surface 1541 of the liquid guiding core 154, that is, the infrared radiation is emitted from the infrared radiation layer 155 on the atomization surface 1541 to the infrared reflection. On layer 1522, the infrared reflecting layer 1522 reflects infrared radiation back to the fogging surface 1541. The reflection of infrared radiation makes the heating area of the infrared radiation of the atomizing surface 1541 wider, which is conducive to improving the field uniformity of the temperature of the atomizing surface 1541, and solves the problem of uneven temperature of the atomizing surface. The infrared radiation heating area is wider, so the atomization amount of the substrate to be atomized can be increased, and the user's atomization taste can be improved. In this embodiment, the electrode 156 is disposed on the liquid-conducting core 154 and is electrically connected to the infrared radiation layer 155 . Specifically, the electrode 156 is a conductive metal film, and part or all of the electrode 156 is disposed on the surface of the infrared radiation layer 155 facing away from the liquid conducting core 154 ; for example, a part of the electrode 156 is disposed on the infrared radiation layer 155 facing away from the liquid conducting core 154 The other part is arranged on the atomizing surface 1541 of the liquid-conducting core 154;

The liquid-conducting core 154 is a conductive porous material, such as a conductive infrared porous ceramic, such as one of a titanium carbide-based ceramic material, a cordierite-based ceramic material, a spinel-based ceramic material, and a perovskite-based ceramic material. one or more. Porous ceramics have the advantages of high temperature resistance, long service life and high porosity, and are porous materials with excellent performance. The infrared radiation layer 155 is a conductive material. After the electrode 156 is energized, the electrical energy can be effectively converted into infrared radiation energy to heat the atomized substrate; and the infrared radiation layer 155 is a porous material that can penetrate and accommodate the atomized substrate.

In the atomizing assembly 15 of this embodiment, an infrared radiation layer 155 is provided on the atomizing surface 1541 of the atomizing core 151 to replace the original metal thin film circuit, and the substrate to be atomized is heated and atomized by infrared radiation. Compared with the metal thin film circuit, the infrared radiation layer 155 is a conductive porous material, and the matrix to be atomized and the aerosol can be exported through the infrared radiation layer 155 . Therefore, the infrared radiation layer 155 can cover a large area on the atomizing surface 1541, so that the surface temperature of the atomizing surface 1541 is more uniform, and the problem of burning smell caused by local high temperature will not be caused. In addition, the infrared radiation layer 155 can cover most of the atomizing surface 1541 , so that the contact area between the infrared radiation layer 155 and the substrate to be atomized is greatly increased, thereby increasing the atomization amount of the atomizing core 151 .

In one embodiment, the infrared radiation layer 155 is layered, rectangular in shape, and 0.15mm-0.6mm in thickness. The thickness of the infrared radiation layer 155 should not be too thick or too thin. If the thickness of the infrared radiation layer 155 is too thick, it will hinder the export of the matrix to be atomized and the aerosol; if the thickness of the infrared radiation layer 155 is too thin, the heating effect of the infrared radiation will be weaker. Difference.

In one embodiment, the atomizing core 151 further includes a conductive heating layer, and the conductive heating layer is disposed on the atomizing surface 1541 . The conductive heating layer and the infrared radiation layer 155 are arranged side by side or stacked on the atomizing surface 1541 .

When the conductive heating layer and the infrared radiation layer 155 are arranged side by side, the conductive heating layer and the infrared radiation layer can be connected, and the electrode 156 is connected with the conductive heating layer and/or the infrared radiation layer 155, so that the conductive heating layer and the infrared radiation layer 155 can be connected together. The substrate to be atomized on the atomizing surface is heated; the conductive heating layer and the infrared radiation layer can also be installed without connection, and the electrode 156 can be electrically connected to the conductive heating layer and the infrared radiation layer 155; when arranged side by side, the infrared radiation layer 155 is conductive Porous material so that the substrate to be atomized can pass through the infrared radiation layer 155 .

When the conductive heating layer and the infrared radiation layer 155 are stacked and arranged, the infrared radiation layer 155 can be arranged between the conductive heating layer and the liquid-conducting core 154, or can be arranged on the side of the conductive heating layer away from the liquid-conducting core 154; The overlapping part of the radiation layer 155 and the conductive heating layer may or may not be a porous material, and the part other than the overlapping of the infrared radiation layer 155 and the conductive heating layer is a porous material, so that the substrate to be atomized can pass the infrared radiation. Layer 155. The electrode 156 is electrically connected to the conductive heating layer and/or the infrared radiation layer 155, so that the conductive heating layer and the infrared radiation layer 155 can jointly heat the substrate to be atomized on the atomizing surface.

The conductive heating layer can be a metal thin film circuit, which can heat the substrate to be atomized near the atomizing surface 1541 after being energized. Using the conductive heating layer and the infrared radiation layer 155 to jointly heat the atomized substrate can make the heating speed of the atomized substrate faster; in addition, the conductive heating layer cannot penetrate the atomized substrate and the aerosol, so the heating of the conductive heating layer The area is small, and local high temperature is likely to be generated, and when the infrared radiation layer 155 is disposed on the atomizing surface in a large area, it can make up for this defect, so that the heating temperature distribution on the atomizing surface 1541 is more uniform.

In one embodiment, the gap distance between the atomizing surface 1541 and the infrared reflecting surface 15221 is 1.5mm-3mm. When the gap distance between the atomizing surface 1541 and the infrared reflecting surface 15221 falls within this range, the reflection effect of infrared radiation is the best, and the field uniformity of the temperature of the atomizing surface 1541 is the best.

In one embodiment, the infrared reflecting surface 15221 of the infrared reflecting member 152 is a concave surface. In this embodiment, the side of the heat shield 1521 close to the infrared radiation layer 155 has a first groove, and the infrared reflection layer 1522 is deposited on the side of the heat shield 1521 close to the infrared radiation layer 155. Specifically, the infrared reflection layer 1522 is deposited on the first groove. The inner wall of a groove and other surfaces of the heat shield 1521 close to the infrared radiation layer 155 are concave, so that the surface of the infrared reflector 1522 disposed on the inner wall of the first groove away from the heat shield 1521 is concave. The infrared reflecting surface 15221 is configured as a concave surface, and the infrared radiation energy reflected by the infrared reflecting surface 15221 is more concentrated and reflected on the atomizing surface 1541, so that the radiation temperature on the atomizing surface 1541 is more uniform.

In one embodiment, the infrared reflector 152 is disposed coaxially with the infrared radiation layer 155 , and the length of the infrared reflector 1522 is greater than the length of the infrared radiation layer 155 , and/or the width of the infrared reflector 1522 is greater than that of the infrared radiation layer 155 width. The length and width of the infrared reflection layer 1522 is larger than that of the infrared radiation layer 155 , so that the infrared reflection layer 1522 can reflect more infrared radiation emitted by the infrared radiation layer 155 , which is beneficial to improve the field uniformity of the temperature of the atomizing surface 1541 .

The infrared reflecting member 152 has a through hole 1523 , one end of the conductive member 153 in the atomizing assembly 15 is connected to the electrode 156 , and the other end passes through the through hole 1523 . Specifically, the through hole 1523 penetrates the heat shield 1521 and the infrared reflection layer 1522 of the infrared reflection member 152 , so that the conductive member 153 can pass through the infrared reflection member 152 . In this embodiment, the number of electrodes 156 , through holes 1523 and conductive members 153 are all two. The through holes 1523 are respectively disposed opposite to the two electrodes 156 .

In this embodiment, the shape of the conductive member 153 is a column. Of course, the shape of the conductive member 153 can also be other shapes. Further, the conductive member 153 includes a limiting portion, and the limiting portion is in contact with the side of the infrared reflecting member 152 close to the electrode 156 to limit the displacement of the infrared reflecting member 152 in the axial direction, thereby limiting the infrared reflecting member 152 and the The distance between the atomized surfaces 1541. The limiting portion may be a step or a protrusion, for example, the limiting portion in this embodiment is a step. Specifically, the conductive member 153 includes a first conductive portion 1531 and a second conductive portion 1532. One end of the first conductive portion 1531 is connected to the electrode 156, and the other end is connected to the second conductive portion 1532. One end of the second conductive portion 1532 is connected to the first conductive portion 1532. The conductive portion 1531 is connected, and the other end passes through the through hole 1523 . The first conductive portion 1531 and the second conductive portion 1532 are both cylindrical, and the inner diameter of the cross-section of the first conductive portion 1531 is larger than the inner diameter of the cross-section of the second conductive portion 1532, so that the first conductive portion 1531 and the second conductive portion 1532 Steps are formed at the connection. The inner diameter of the cross section of the first conductive portion 1531 is larger than the diameter of the through hole 1523 , so that the limiting portion can limit the distance between the infrared reflector 152 and the atomizing surface 1541 .

When the atomizing assembly 15 of this embodiment is manufactured, the conductive infrared ceramic (infrared radiation) is cast or screen-printed or PVD deposited (Physical Vapor Deposition) on the atomizing surface 1541 of the oil-conducting porous ceramic (liquid-conducting core 154 ). layer 155), and sintering the oil-conducting porous ceramics and the conductive infrared ceramics together; then make a metal electrode 156 film layer (electrode 156) on the infrared radiation layer 155, and conduct with the conductive member 153, and the upper limit of the conductive member 153 is separated by a distance On the surface of the hot plate 1521 and the heat shield 1521 close to the atomization surface 1541, an infrared reflection layer 1522 is PVD deposited. Among them, the oil-conducting porous ceramics and the conductive infrared ceramics are sintered together, which can improve the bonding force between the liquid-conducting core 154 and the conductive infrared ceramics, and reduce the influence of the contact interface of the two ceramics on the oil-conducting.

Referring to FIGS. 3 to 5 , in this embodiment, the liquid guiding core 154 is overlapped on the mounting base 17 , the end of the liquid guiding core 154 facing away from the liquid storage chamber 111 has an atomizing surface 1541 , and the liquid guiding core has an atomizing surface 1541 One end is accommodated in the second groove 171 . One end of the infrared reflector 152 close to the liquid guide core 154 abuts against the limiting portion 1531 , and one end away from the liquid guide core 154 abuts against the mounting base 17 , thereby limiting the axial displacement of the infrared reflector 152 . A third sealing member 16 is provided between the infrared reflecting member 152 and the mounting base 17 so as to seal the infrared reflecting member 152 .

The infrared reflector 152 has one or more first air inlet holes 1524 . The first air intake hole 1524 is spaced apart from the through hole 1523 . The first air inlet hole 1524 penetrates through the heat shield 1521 and the infrared reflection layer 1522 of the infrared reflector 152 . The first air intake hole 1524 communicates with the second air intake hole 172 and the atomization cavity 114 , so that the outside air can enter the atomization cavity 114 through the second air intake hole 172 .

One end of the mounting base 17 close to the atomizing chamber 114 is provided with an electrode fixing member 19, and the electrode fixing member 19 is made of conductive material. One end of the conductive member 153 close to the mounting base 17 is inserted into the electrode fixing member 19 , the bottom cover 18 of the atomizer 10 has an opening 181 , and the opening 181 can expose the electrode fixing member 19 to the external space of the atomizer 10 , So that the electrode holder 19 can be electrically connected with the battery assembly.

The above are only the embodiments of the present application, and are not intended to limit the scope of the patent of the present application. Any equivalent structure or equivalent process transformation made by using the contents of the description and drawings of the present application, or directly or indirectly applied in other related technical fields, All are similarly included in the scope of patent protection of the present application.

Claims (15)

An atomization assembly, which includes an atomization core and an infrared reflector, the atomization core includes a liquid-conducting core and an infrared radiation layer, and the infrared radiation layer is arranged on the atomization surface of the liquid-conducting core, so the The infrared reflector is arranged on the side of the infrared radiation layer away from the liquid-conducting core, and is spaced from the infrared radiation layer; the infrared radiation layer can heat and atomize the substrate to be atomized by infrared radiation, and the infrared radiation layer can be heated and atomized by infrared radiation. The infrared reflecting surface of the infrared reflecting member is configured to reflect the infrared rays radiated by the infrared radiation layer to the atomizing surface of the liquid-conducting core. The atomizing assembly of claim 1, wherein the infrared reflecting member is configured such that the infrared reflecting surface is a concave surface. The atomizing assembly according to claim 1, wherein the infrared reflecting member comprises a heat shield and an infrared reflecting layer, the infrared reflecting layer is provided on a side of the heat shield close to the infrared radiation layer, and the infrared reflecting layer is The infrared reflection surface is formed by the surface of the infrared reflection layer far away from the heat insulation board. The atomizer assembly according to claim 3, wherein a first groove is formed on a side of the heat shield plate close to the infrared radiation layer, and the infrared reflection layer is disposed on the inner wall surface of the first groove, or , the infrared reflection layer is arranged on the inner wall surface of the first groove, and the surface of the heat shield close to the infrared radiation layer is on the other surface except the inner wall surface of the first groove, so that the The surface of the infrared reflection layer away from the heat insulation board is the concave surface. The atomizing assembly according to claim 1, wherein the atomizing core further comprises an electrode, the electrode is arranged on the liquid-conducting core and is electrically connected with the infrared radiation layer, and the atomizing assembly further comprises A conductive member, the infrared reflection member has a through hole, one end of the conductive member is connected to the electrode, and the other end passes through the through hole, the conductive member has a limit portion, and the limit portion is connected to the The infrared reflector is in contact with one side close to the electrode. The atomizing assembly according to claim 1, wherein part or all of the electrodes are provided on a surface of the infrared radiation layer facing away from the liquid-conducting core. The atomizing assembly according to claim 1, wherein a gap distance between the atomizing surface and the infrared reflecting surface is 1.5mm-3mm. The atomizing assembly according to claim 1, wherein the infrared reflector has one or more first air inlet holes, and the first air inlet holes are used to communicate with the air inlet of the mounting base. The atomizing assembly according to claim 1, wherein the thickness of the infrared radiation layer is 0.15mm-0.6mm. The atomizing assembly according to claim 1, wherein the liquid conducting core is a porous material, and the infrared radiation layer is a conductive infrared porous material. The atomizing assembly according to claim 10, wherein the conductive infrared porous material is one of a titanium carbide-based ceramic material, a cordierite-based ceramic material, a spinel-based ceramic material, and a perovskite-based ceramic material or variety. The atomizing assembly according to claim 1, wherein the atomizing core further comprises a conductive heating layer disposed on the atomizing surface; the conductive heating layer and the infrared radiation layer are arranged side by side, and the infrared radiation The layer is a conductive porous material. The atomizing assembly according to claim 1, wherein the atomizing core further comprises a conductive heating layer disposed on the atomizing surface; the conductive heating layer and the infrared radiation layer are stacked and arranged, and the infrared radiation The non-overlapping portion of the layer and the conductive heat generating layer is a conductive porous material. An atomizer, comprising a housing, a mounting base and the atomizing assembly according to claim 1, wherein the housing has a liquid storage cavity and an installation cavity, the installation base is arranged in the installation cavity, and the The atomizing assembly is arranged on the mounting base. An electronic atomizer device, comprising a battery assembly and the atomizer according to claim 14, wherein the battery assembly and the atomizer are electrically connected.

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