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WO2022149807A1 - Dispositif électronique comprenant une carte de circuit imprimé souple - Google Patents

Dispositif électronique comprenant une carte de circuit imprimé souple Download PDF

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Publication number
WO2022149807A1
WO2022149807A1 PCT/KR2021/095137 KR2021095137W WO2022149807A1 WO 2022149807 A1 WO2022149807 A1 WO 2022149807A1 KR 2021095137 W KR2021095137 W KR 2021095137W WO 2022149807 A1 WO2022149807 A1 WO 2022149807A1
Authority
WO
WIPO (PCT)
Prior art keywords
fpcb
electronic device
circuit board
printed circuit
flexible printed
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Ceased
Application number
PCT/KR2021/095137
Other languages
English (en)
Korean (ko)
Inventor
이양희
김승준
박준영
이재혁
유지용
박성철
허재영
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Samsung Electronics Co Ltd
Original Assignee
Samsung Electronics Co Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Samsung Electronics Co Ltd filed Critical Samsung Electronics Co Ltd
Publication of WO2022149807A1 publication Critical patent/WO2022149807A1/fr
Anticipated expiration legal-status Critical
Ceased legal-status Critical Current

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Classifications

    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K1/00—Printed circuits
    • H05K1/02—Details
    • H05K1/0213—Electrical arrangements not otherwise provided for
    • H05K1/0216—Reduction of cross-talk, noise or electromagnetic interference
    • H05K1/0218—Reduction of cross-talk, noise or electromagnetic interference by printed shielding conductors, ground planes or power plane
    • H—ELECTRICITY
    • H04—ELECTRIC COMMUNICATION TECHNIQUE
    • H04M—TELEPHONIC COMMUNICATION
    • H04M1/00—Substation equipment, e.g. for use by subscribers
    • H04M1/02—Constructional features of telephone sets
    • H—ELECTRICITY
    • H04—ELECTRIC COMMUNICATION TECHNIQUE
    • H04M—TELEPHONIC COMMUNICATION
    • H04M1/00—Substation equipment, e.g. for use by subscribers
    • H04M1/02—Constructional features of telephone sets
    • H04M1/0202—Portable telephone sets, e.g. cordless phones, mobile phones or bar type handsets
    • H04M1/026—Details of the structure or mounting of specific components
    • H04M1/0277—Details of the structure or mounting of specific components for a printed circuit board assembly
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K1/00—Printed circuits
    • H05K1/02—Details
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K1/00—Printed circuits
    • H05K1/02—Details
    • H05K1/0213—Electrical arrangements not otherwise provided for
    • H05K1/0237—High frequency adaptations
    • H05K1/025—Impedance arrangements, e.g. impedance matching, reduction of parasitic impedance
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K1/00—Printed circuits
    • H05K1/02—Details
    • H05K1/14—Structural association of two or more printed circuits
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K1/00—Printed circuits
    • H05K1/02—Details
    • H05K1/14—Structural association of two or more printed circuits
    • H05K1/147—Structural association of two or more printed circuits at least one of the printed circuits being bent or folded, e.g. by using a flexible printed circuit
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/22—Secondary treatment of printed circuits
    • H05K3/28—Applying non-metallic protective coatings
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/22—Secondary treatment of printed circuits
    • H05K3/28—Applying non-metallic protective coatings
    • H05K3/281—Applying non-metallic protective coatings by means of a preformed insulating foil

Definitions

  • the following disclosure relates to an electronic device including a flexible printed circuit board.
  • EMI electromagnetic interference
  • electromagnetic interference is reduced by bonding an electromagnetic interference shielding film to the surface of the flexible printed circuit board.
  • an FPCB such as an interface FPCB connecting a main printed circuit board (PCB) and a sub-PCB is designed to have a thin thickness for a slim design of an electronic device.
  • the FPCB is designed to have a thin thickness, the physical distance between the shielding film layer formed on the outer surface of the FPCB to shield electromagnetic interference (EMI) and the central layer where the wiring is formed in the FPCB is located close to each other, The impedance of the FPCB is formed low.
  • EMI electromagnetic interference
  • a method of increasing direct current resistance can be used in order to reduce the thickness of the FPCB and make the FPCB have the same impedance as the set impedance.
  • a method of reducing the width of the wiring may be used.
  • conductive lines e.g., universal serial bus line, USB line
  • they tend to be more sensitive to DC resistance than impedance matching, so increase the width of some conductive lines This can improve transmission performance.
  • an FPCB and an electronic device including the same may be provided.
  • the thickness of the FPCB and the electronic device may be reduced.
  • the FPCB may have a set impedance.
  • an FPCB capable of reducing the degree of deterioration of shielding performance while reducing the thickness of the FPCB and satisfying the set impedance condition.
  • the flexible printed circuit board (eg, 270 of FIG. 2 or 700 of FIG. 7 ) connected between the plurality of electronic components includes a plurality of conductive lines that transmit power or signals between the plurality of electronic components.
  • a central layer having a (eg, 510 in FIG. 5); an insulating layer (eg, 520 or 540 in FIG. 5 ) laminated on the central layer; and a shielding film layer (eg, 530, 550 in FIG. 5 or 713 in FIG. 7) laminated on the insulating layer and reducing noise caused by current flowing through the plurality of conductive lines from leaking to the outside,
  • the shielding film layer may include a cutout (eg, 713-5 in FIG. 7 ) formed in a region overlapping with at least one conductive line among the plurality of conductive lines based on the thickness direction of the flexible printed circuit board.
  • an electronic device may include a plurality of electronic components; and a central layer (eg, 510 in FIG. 5 ) for connecting between the plurality of electronic components, (i) having a plurality of conductive lines for transmitting power or signals between the plurality of electronic components, (ii) the An insulating layer (eg, 520 or 540 in FIG. 5) laminated on the central layer, (iii) is laminated on the insulating layer, and reduces noise caused by current flowing through the plurality of conductive lines from leaking to the outside a flexible printed circuit board (eg, 270 in FIG. 2 or 700 in FIG. 7) having a shielding film layer (eg, 530, 550 in FIG. 5 or 713 in FIG. 7) for
  • the flexible printed circuit board may include a cutout (eg, 713-5 of FIG. 7 ) formed in a region overlapping with at least one conductive line among the plurality of conductive lines based on a thickness direction of the flexible printed circuit board.
  • a sample central layer including a sample universal serial bus (USB) line and a sample conductive line
  • a sample insulating layer laminated on the sample central layer
  • the sample insulating layer A sample circuit board laminated on the sample circuit board (eg, in FIG. 7(A)) having a sample shielding film layer for reducing leakage of noise caused by current flowing through the sample USB line and the sample conductive line to the outside
  • a flexible printed circuit board eg, in FIG. 7B, designed based on and a central layer having the same thickness as that of the sample central layer (eg, 510 in FIG.
  • the shielding film layer includes: Based on the thickness direction of the circuit board, a cutout (eg, 713-5 in FIG. 7 ) formed in a region overlapping the USB line is included, and the width of the USB line (eg, W2 in FIG. 7 ) is, It may be wider than the width of the sample USB line (eg, W1 of FIG. 7 ).
  • the EMI shielding film layer corresponding to some of the conductive lines of the plurality of conductive lines of the FPCB, it is possible to increase the impedance of the FPCB while maintaining the thickness of the FPCB.
  • the EMI shielding film layer corresponding to some of the conductive lines of the plurality of conductive lines of the FPCB by partially cutting the EMI shielding film layer corresponding to some of the conductive lines of the plurality of conductive lines of the FPCB, while maintaining the impedance matching of the FPCB, increasing the width of the some conductive lines, As a result, the transmission performance of the FPCB can be improved.
  • the EMI shielding film layer corresponding to some of the conductive lines of the plurality of conductive lines of the FPCB is partially cut, and a cover film capable of additionally shielding electromagnetic interference (EMI) is disposed in the cut out portion
  • the noise leaking from the FPCB is reduced by the performance of other electronic components of the electronic device. It can reduce the problem of lowering the
  • the problem of increasing the thickness of the electronic device can reduce
  • FIG. 1 is a block diagram of an electronic device in a network environment, according to various embodiments of the present disclosure.
  • FIG. 2 is an exploded perspective view of an electronic device according to various embodiments of the present disclosure
  • FIG. 3 is a diagram illustrating a connection relationship of an FPCB according to various embodiments of the present disclosure
  • 4A, 4B, and 4C are diagrams illustrating a connection relationship between FPCBs according to various embodiments of the present disclosure.
  • 5A and 5B are views illustrating a laminated structure of a flexible cable of an FPCB according to various embodiments of the present disclosure
  • FIG. 6 is a diagram illustrating various performance improvement methods of an FPCB according to various embodiments of the present disclosure.
  • FIG. 7A is a plan view illustrating a part of an FPCB according to a comparative example.
  • FIG. 7B is a plan view illustrating a part of an FPCB according to various embodiments.
  • FIG 8 is a graph comparing the impedance value of a part of the conductive line (eg, USB line) of the FPCB according to the comparative example and the impedance value of the part of the conductive line (eg, the USB line) of the FPCB according to various embodiments. .
  • FIG. 9 is a plan view of an FPCB and a graph illustrating an impedance value of the FPCB, according to various embodiments of the present disclosure.
  • 10A to 10E are plan views of an FPCB, according to various embodiments.
  • FIG. 11 is a plan view and a partially enlarged view of an FPCB according to various embodiments of the present disclosure.
  • FIGS. 12A to 12G are plan views of an FPCB according to various embodiments of the present disclosure.
  • FIG. 13 is a diagram illustrating a cross-sectional view of an electronic device according to various embodiments of the present disclosure
  • FIG. 14 is a diagram illustrating a cross-sectional view of an electronic device according to various embodiments of the present disclosure
  • 15 is a plan view of an FPCB according to various embodiments.
  • FIG. 16 is a cross-sectional view of an FPCB according to various embodiments taken along the cutting direction along the cutting line I-I shown in FIG. 15 .
  • 17A and 17B are diagrams illustrating a state in which a component of an electronic device and an FPCB are combined with each other, according to various embodiments of the present disclosure
  • FIG. 18 is a graph comparing the impedance value of the FPCB according to the comparative example and the impedance value of the FPCB according to various embodiments.
  • FIG. 19 is a diagram comparing the performance of the FPCB according to the comparative example and the performance of the FPCB according to various embodiments.
  • FIG. 20 is a diagram comparing the impedance value of the FPCB according to the comparative example and the impedance value of the FPCB according to various embodiments.
  • FIG. 1 is a block diagram of an electronic device 101 in a network environment 100 according to various embodiments of the present disclosure.
  • an electronic device 101 communicates with an electronic device 102 through a first network 198 (eg, a short-range wireless communication network) or a second network 199 . It may communicate with at least one of the electronic device 104 and the server 108 through (eg, a long-distance wireless communication network). According to an embodiment, the electronic device 101 may communicate with the electronic device 104 through the server 108 .
  • a first network 198 eg, a short-range wireless communication network
  • a second network 199 e.g., a second network 199
  • the electronic device 101 may communicate with the electronic device 104 through the server 108 .
  • the electronic device 101 includes a processor 120 , a memory 130 , an input module 150 , a sound output module 155 , a display module 160 , an audio module 170 , and a sensor module ( 176), interface 177, connection terminal 178, haptic module 179, camera module 180, power management module 188, battery 189, communication module 190, subscriber identification module 196 , or an antenna module 197 .
  • at least one of these components eg, the connection terminal 178
  • some of these components are integrated into one component (eg, display module 160 ). can be
  • the processor 120 for example, executes software (eg, a program 140) to execute at least one other component (eg, a hardware or software component) of the electronic device 101 connected to the processor 120. It can control and perform various data processing or operations. According to an embodiment, as at least part of data processing or operation, the processor 120 stores a command or data received from another component (eg, the sensor module 176 or the communication module 190 ) into the volatile memory 132 . may be stored in , process commands or data stored in the volatile memory 132 , and store the result data in the non-volatile memory 134 .
  • software eg, a program 140
  • the processor 120 stores a command or data received from another component (eg, the sensor module 176 or the communication module 190 ) into the volatile memory 132 .
  • the processor 120 stores a command or data received from another component (eg, the sensor module 176 or the communication module 190 ) into the volatile memory 132 .
  • the processor 120 is a main processor 121 (eg, a central processing unit or an application processor) or a secondary processor 123 (eg, a graphic processing unit, a neural network processing unit) a neural processing unit (NPU), an image signal processor, a sensor hub processor, or a communication processor).
  • a main processor 121 eg, a central processing unit or an application processor
  • a secondary processor 123 eg, a graphic processing unit, a neural network processing unit
  • NPU neural processing unit
  • an image signal processor e.g., a sensor hub processor, or a communication processor.
  • the secondary processor 123 may, for example, act on behalf of the main processor 121 while the main processor 121 is in an inactive (eg, sleep) state, or when the main processor 121 is active (eg, executing an application). ), together with the main processor 121, at least one of the components of the electronic device 101 (eg, the display module 160, the sensor module 176, or the communication module 190) It is possible to control at least some of the related functions or states.
  • the auxiliary processor 123 eg, image signal processor or communication processor
  • the auxiliary processor 123 may include a hardware structure specialized for processing an artificial intelligence model.
  • Artificial intelligence models can be created through machine learning. Such learning may be performed, for example, in the electronic device 101 itself on which the artificial intelligence model is performed, or may be performed through a separate server (eg, the server 108).
  • the learning algorithm may include, for example, supervised learning, unsupervised learning, semi-supervised learning, or reinforcement learning, but in the above example not limited
  • the artificial intelligence model may include a plurality of artificial neural network layers.
  • Artificial neural networks include deep neural networks (DNNs), convolutional neural networks (CNNs), recurrent neural networks (RNNs), restricted boltzmann machines (RBMs), deep belief networks (DBNs), bidirectional recurrent deep neural networks (BRDNNs), It may be one of deep Q-networks or a combination of two or more of the above, but is not limited to the above example.
  • the artificial intelligence model may include, in addition to, or alternatively, a software structure in addition to the hardware structure.
  • the memory 130 may store various data used by at least one component (eg, the processor 120 or the sensor module 176 ) of the electronic device 101 .
  • the data may include, for example, input data or output data for software (eg, the program 140 ) and instructions related thereto.
  • the memory 130 may include a volatile memory 132 or a non-volatile memory 134 .
  • the program 140 may be stored as software in the memory 130 , and may include, for example, an operating system 142 , middleware 144 , or an application 146 .
  • the input module 150 may receive a command or data to be used by a component (eg, the processor 120 ) of the electronic device 101 from the outside (eg, a user) of the electronic device 101 .
  • the input module 150 may include, for example, a microphone, a mouse, a keyboard, a key (eg, a button), or a digital pen (eg, a stylus pen).
  • the sound output module 155 may output a sound signal to the outside of the electronic device 101 .
  • the sound output module 155 may include, for example, a speaker or a receiver.
  • the speaker can be used for general purposes such as multimedia playback or recording playback.
  • the receiver can be used to receive incoming calls. According to an embodiment, the receiver may be implemented separately from or as a part of the speaker.
  • the display module 160 may visually provide information to the outside (eg, a user) of the electronic device 101 .
  • the display module 160 may include, for example, a control circuit for controlling a display, a hologram device, or a projector and a corresponding device.
  • the display module 160 may include a touch sensor configured to sense a touch or a pressure sensor configured to measure the intensity of a force generated by the touch.
  • the audio module 170 may convert a sound into an electric signal or, conversely, convert an electric signal into a sound. According to an embodiment, the audio module 170 acquires a sound through the input module 150 , or an external electronic device (eg, a sound output module 155 ) connected directly or wirelessly with the electronic device 101 .
  • the electronic device 102) eg, a speaker or headphones
  • the electronic device 102 may output a sound.
  • the sensor module 176 detects an operating state (eg, power or temperature) of the electronic device 101 or an external environmental state (eg, a user state), and generates an electrical signal or data value corresponding to the sensed state. can do.
  • the sensor module 176 may include, for example, a gesture sensor, a gyro sensor, a barometric pressure sensor, a magnetic sensor, an acceleration sensor, a grip sensor, a proximity sensor, a color sensor, an IR (infrared) sensor, a biometric sensor, It may include a temperature sensor, a humidity sensor, or an illuminance sensor.
  • the interface 177 may support one or more specified protocols that may be used by the electronic device 101 to directly or wirelessly connect with an external electronic device (eg, the electronic device 102 ).
  • the interface 177 may include, for example, a high definition multimedia interface (HDMI), a universal serial bus (USB) interface, an SD card interface, or an audio interface.
  • the connection terminal 178 may include a connector through which the electronic device 101 can be physically connected to an external electronic device (eg, the electronic device 102 ).
  • the connection terminal 178 may include, for example, an HDMI connector, a USB connector, an SD card connector, or an audio connector (eg, a headphone connector).
  • the haptic module 179 may convert an electrical signal into a mechanical stimulus (eg, vibration or movement) or an electrical stimulus that the user can perceive through tactile or kinesthetic sense.
  • the haptic module 179 may include, for example, a motor, a piezoelectric element, or an electrical stimulation device.
  • the camera module 180 may capture still images and moving images. According to an embodiment, the camera module 180 may include one or more lenses, image sensors, image signal processors, or flashes.
  • the power management module 188 may manage power supplied to the electronic device 101 .
  • the power management module 188 may be implemented as, for example, at least a part of a power management integrated circuit (PMIC).
  • PMIC power management integrated circuit
  • the battery 189 may supply power to at least one component of the electronic device 101 .
  • the battery 189 may include, for example, a non-rechargeable primary cell, a rechargeable secondary cell, or a fuel cell.
  • the communication module 190 is a direct (eg, wired) communication channel or a wireless communication channel between the electronic device 101 and an external electronic device (eg, the electronic device 102, the electronic device 104, or the server 108). It can support establishment and communication performance through the established communication channel.
  • the communication module 190 may include one or more communication processors that operate independently of the processor 120 (eg, an application processor) and support direct (eg, wired) communication or wireless communication.
  • the communication module 190 is a wireless communication module 192 (eg, a cellular communication module, a short-range wireless communication module, or a global navigation satellite system (GNSS) communication module) or a wired communication module 194 (eg, : It may include a local area network (LAN) communication module, or a power line communication module).
  • a wireless communication module 192 eg, a cellular communication module, a short-range wireless communication module, or a global navigation satellite system (GNSS) communication module
  • GNSS global navigation satellite system
  • wired communication module 194 eg, : It may include a local area network (LAN) communication module, or a power line communication module.
  • a corresponding communication module among these communication modules is a first network 198 (eg, a short-range communication network such as Bluetooth, wireless fidelity (WiFi) direct, or infrared data association (IrDA)) or a second network 199 (eg, legacy It may communicate with the external electronic device 104 through a cellular network, a 5G network, a next-generation communication network, the Internet, or a computer network (eg, a telecommunication network such as a LAN or a WAN).
  • a first network 198 eg, a short-range communication network such as Bluetooth, wireless fidelity (WiFi) direct, or infrared data association (IrDA)
  • a second network 199 eg, legacy It may communicate with the external electronic device 104 through a cellular network, a 5G network, a next-generation communication network, the Internet, or a computer network (eg, a telecommunication network such as a LAN or a WAN).
  • a telecommunication network
  • the wireless communication module 192 uses subscriber information (eg, International Mobile Subscriber Identifier (IMSI)) stored in the subscriber identification module 196 within a communication network such as the first network 198 or the second network 199 .
  • subscriber information eg, International Mobile Subscriber Identifier (IMSI)
  • IMSI International Mobile Subscriber Identifier
  • the electronic device 101 may be identified or authenticated.
  • the wireless communication module 192 may support a 5G network after a 4G network and a next-generation communication technology, for example, a new radio access technology (NR).
  • NR access technology includes high-speed transmission of high-capacity data (eMBB (enhanced mobile broadband)), minimization of terminal power and access to multiple terminals (mMTC (massive machine type communications)), or high reliability and low latency (URLLC (ultra-reliable and low-latency) -latency communications)).
  • eMBB enhanced mobile broadband
  • mMTC massive machine type communications
  • URLLC ultra-reliable and low-latency
  • the wireless communication module 192 may support a high frequency band (eg, mmWave band) to achieve a high data rate, for example.
  • a high frequency band eg, mmWave band
  • the wireless communication module 192 uses various techniques for securing performance in a high-frequency band, for example, beamforming, massive multiple-input and multiple-output (MIMO), all-dimensional multiplexing. It may support technologies such as full dimensional MIMO (FD-MIMO), an array antenna, analog beam-forming, or a large scale antenna.
  • the wireless communication module 192 may support various requirements defined in the electronic device 101 , an external electronic device (eg, the electronic device 104 ), or a network system (eg, the second network 199 ).
  • the wireless communication module 192 includes a peak data rate (eg, 20 Gbps or more) for realizing eMBB, loss coverage (eg, 164 dB or less) for realizing mMTC, or U-plane latency for realizing URLLC ( Example: Downlink (DL) and uplink (UL) each 0.5 ms or less, or round trip 1 ms or less) can be supported.
  • a peak data rate eg, 20 Gbps or more
  • loss coverage eg, 164 dB or less
  • U-plane latency for realizing URLLC
  • the antenna module 197 may transmit or receive a signal or power to the outside (eg, an external electronic device).
  • the antenna module 197 may include an antenna including a conductor formed on a substrate (eg, a PCB) or a radiator formed of a conductive pattern.
  • the antenna module 197 may include a plurality of antennas (eg, an array antenna). In this case, at least one antenna suitable for a communication method used in a communication network such as the first network 198 or the second network 199 is connected from the plurality of antennas by, for example, the communication module 190 . can be selected. A signal or power may be transmitted or received between the communication module 190 and an external electronic device through the selected at least one antenna.
  • other components eg, a radio frequency integrated circuit (RFIC)
  • RFIC radio frequency integrated circuit
  • the antenna module 197 may form a mmWave antenna module.
  • the mmWave antenna module comprises a printed circuit board, an RFIC disposed on or adjacent to a first side (eg, bottom side) of the printed circuit board and capable of supporting a designated high frequency band (eg, mmWave band); and a plurality of antennas (eg, an array antenna) disposed on or adjacent to a second side (eg, top or side) of the printed circuit board and capable of transmitting or receiving signals of the designated high frequency band. can do.
  • peripheral devices eg, a bus, general purpose input and output (GPIO), serial peripheral interface (SPI), or mobile industry processor interface (MIPI)
  • GPIO general purpose input and output
  • SPI serial peripheral interface
  • MIPI mobile industry processor interface
  • the command or data may be transmitted or received between the electronic device 101 and the external electronic device 104 through the server 108 connected to the second network 199 .
  • Each of the external electronic devices 102 or 104 may be the same as or different from the electronic device 101 .
  • all or part of the operations executed by the electronic device 101 may be executed by one or more external electronic devices 102 , 104 , or 108 .
  • the electronic device 101 may perform the function or service itself instead of executing the function or service itself.
  • one or more external electronic devices may be requested to perform at least a part of the function or the service.
  • One or more external electronic devices that have received the request may execute at least a part of the requested function or service, or an additional function or service related to the request, and transmit a result of the execution to the electronic device 101 .
  • the electronic device 101 may process the result as it is or additionally and provide it as at least a part of a response to the request.
  • cloud computing, distributed computing, mobile edge computing (MEC), or client-server computing technology may be used.
  • the electronic device 101 may provide an ultra-low latency service using, for example, distributed computing or mobile edge computing.
  • the external electronic device 104 may include an Internet of things (IoT) device.
  • the server 108 may be an intelligent server using machine learning and/or neural networks.
  • the external electronic device 104 or the server 108 may be included in the second network 199 .
  • the electronic device 101 may be applied to an intelligent service (eg, smart home, smart city, smart car, or health care) based on 5G communication technology and IoT-related technology.
  • the electronic device may be a device of various types.
  • the electronic device may include, for example, a portable communication device (eg, a smart phone), a computer device, a portable multimedia device, a portable medical device, a camera, a wearable device, or a home appliance device.
  • a portable communication device eg, a smart phone
  • a computer device e.g., a laptop, a desktop, a tablet, or a portable multimedia device
  • portable medical device e.g., a portable medical device
  • camera e.g., a camera
  • a wearable device e.g., a smart watch
  • a home appliance device e.g., a smart bracelet
  • first, second, or first or second may simply be used to distinguish an element from other elements in question, and may refer elements to other aspects (e.g., importance or order) is not limited. It is said that one (eg, first) component is “coupled” or “connected” to another (eg, second) component, with or without the terms “functionally” or “communicatively”. When referenced, it means that one component can be connected to the other component directly (eg by wire), wirelessly, or through a third component.
  • module used in various embodiments of the present document may include a unit implemented in hardware, software, or firmware, for example, and interchangeably with terms such as logic, logic block, component, or circuit.
  • a module may be an integrally formed part or a minimum unit or a part of the part that performs one or more functions.
  • the module may be implemented in the form of an application-specific integrated circuit (ASIC).
  • ASIC application-specific integrated circuit
  • one or more instructions stored in a storage medium may be implemented as software (eg, the program 140) including
  • the processor eg, the processor 120
  • the device eg, the electronic device 101
  • the one or more instructions may include code generated by a compiler or code executable by an interpreter.
  • the device-readable storage medium may be provided in the form of a non-transitory storage medium.
  • non-transitory only means that the storage medium is a tangible device and does not contain a signal (eg, electromagnetic wave), and this term is different from the case where data is semi-permanently stored in the storage medium. It does not distinguish between temporary storage cases.
  • a signal eg, electromagnetic wave
  • the method according to various embodiments disclosed in this document may be provided by being included in a computer program product.
  • Computer program products may be traded between sellers and buyers as commodities.
  • the computer program product is distributed in the form of a machine-readable storage medium (eg compact disc read only memory (CD-ROM)), or through an application store (eg Play StoreTM) or on two user devices ( It can be distributed (eg downloaded or uploaded) directly, online between smartphones (eg: smartphones).
  • a portion of the computer program product may be temporarily stored or temporarily generated in a machine-readable storage medium such as a memory of a server of a manufacturer, a server of an application store, or a memory of a relay server.
  • each component (eg, module or program) of the above-described components may include a singular or a plurality of entities, and some of the plurality of entities may be separately disposed in other components.
  • one or more components or operations among the above-described corresponding components may be omitted, or one or more other components or operations may be added.
  • a plurality of components eg, a module or a program
  • the integrated component may perform one or more functions of each component of the plurality of components identically or similarly to those performed by the corresponding component among the plurality of components prior to the integration. .
  • operations performed by a module, program, or other component are executed sequentially, in parallel, repeatedly, or heuristically, or one or more of the operations are executed in a different order, omitted, or , or one or more other operations may be added.
  • FIG. 2 is an exploded perspective view of an electronic device according to various embodiments of the present disclosure
  • an electronic device 200 (eg, the electronic device 101 of FIG. 1 ) according to an embodiment includes housings 210 , 220 , 230 , support structures 240 , 250 , 290 , and printing.
  • the circuit board 260 may include a printed circuit board (PCB), a flexible printed circuit board (FPCB) 270 , a display 280 , and an antenna 295 .
  • PCB printed circuit board
  • FPCB flexible printed circuit board
  • the housings 210 , 220 , and 230 may form the exterior of the electronic device 200 .
  • the housings 210 , 220 , and 230 include a front housing 210 (eg, a front cover glass) that surrounds the front outer surface of the electronic device 200 and a rear housing 220 that surrounds the rear outer surface of the electronic device 200 ( For example, it may include a rear cover glass) and a side housing 230 (eg, a bezel frame) that surrounds a lateral edge of the electronic device 200 .
  • the housings 210 , 220 , and 230 are illustrated as being divided into three parts covering the front, rear, and side, respectively, but this is only an example.
  • the side housing 230 may be integrally formed with the front housing 210 or the rear housing 230 .
  • the entire exterior of the electronic device 200 may be formed by coupling the front housing 210 and the rear housing 220 to each other without a separate side housing 230 .
  • the housings 210 , 220 , and 230 may be formed in different directions and numbers, for example, as two housings divided into upper and lower portions.
  • the support structures 240 , 250 , and 290 are disposed inside the housings 210 , 220 and 230 , and a plurality of electronic components 260 , 270 , 280 , 290 and 295 accommodated in the electronic device 200 . at least one electronic component may be supported.
  • the support structures 240 , 250 , and 290 may support one or more of both surfaces of the FPCB 270 .
  • the support structures 240 , 250 , and 290 may include a first frame 240 (eg, a front frame), a second frame 250 (eg, a rear frame), and a battery 290 . .
  • the battery 290 may be disposed to face adjacent electronic components (eg, the first FPCB 271 and/or the second FPCB 272 ).
  • the battery 290 may be referred to as a "support structure” or may also be referred to as an "electronic component".
  • the support structures 240 , 250 , and 290 are illustrated as including two frames 240 and 250 , but any one of these frames may be omitted, and an additional frame may be further provided. .
  • the front frame 240 may support the display 280 from the rear of the front housing 210 toward the front housing 210 .
  • the rigidity of the front frame 240 may be higher than that of the housings 210 , 220 , and 230 .
  • the front frame 240 may have a structure connected to the side housing 230 .
  • the front frame 240 and the side housing 230 may be integrally formed, but are not necessarily limited thereto, and the front frame 240 and the side housing 230 are each as separate members. It will be understood by those skilled in the art that it may be provided.
  • the front frame 240 may be formed of, for example, a metal material and/or a non-metal (eg, polymer) material.
  • the front frame 240, the display 280 may be coupled to the front surface and the PCB 260 may be coupled to the rear surface.
  • the FPCB 270 may include a protruding portion, and in this case, an adjacent FPCB of both sides of the front frame 240 .
  • a groove 241 for accommodating a portion protruding from the FPCB 270 may be formed on a surface facing the 270 (eg, the second FPCB 272 ).
  • the rear frame 250 may be disposed behind the front frame 240 .
  • electronic components may be fixed to the rear frame 250 .
  • the rear frame 250 may be formed by injection molding.
  • the rear frame 250 may be referred to as “rear injection molding”.
  • the rigidity of the rear frame 250 may be higher than that of the housings 210 , 220 , and 230 .
  • the rear frame 250 may form a space in which at least one or more electronic components 260 , 270 , and 290 can be disposed between the front frame 240 and the rear frame 250 together with the front frame 240 .
  • a portion of the front frame 240 and a portion of the rear frame 250 may be in direct contact to form a space between the front frame 240 and the rear frame 250 .
  • the rigidity of the front frame 240 and the rear frame 250 is higher than that of the PCB 260 and the FPCB 270, respectively, and the PCB 260 and the FPCB 270 are the front frame ( 240 ) and the rear frame 250 .
  • the rear frame 250 may include a through part 251 , a depression part 252 , and a protrusion part 253 .
  • the through part 251 , the recessed part 252 , and the protrusion 253 may be structures for appropriately supporting or accommodating various electronic components or various structures accommodated in the electronic device 200 .
  • one or more electronic components 261 - 2 eg, a camera module
  • the printed circuit board 260 may pass through the through part 251 to be exposed to the rear housing 220 .
  • the recessed part 252 may provide a space in which an electronic component (eg, an antenna) mounted on an inner wall of the rear housing 220 can be accommodated.
  • the protrusion 253 may have a shape to be tight fit into a groove formed in the rear housing 220 , thereby allowing the rear frame 250 and the rear housing 220 to be coupled to each other.
  • the protrusion 253 and/or the depression 252 may be formed on the front surface as well as the rear surface of the rear frame 250 as shown.
  • the protrusions 253 and/or the depressions 252 are formed by other components adjacent to the front and/or rear surfaces of the rear frame 250 (eg, the PCB 260 , the FPCB 270 , the battery 290 and/or the Alternatively, the rear housing 220 may support other components in order to reduce movement relative to the rear frame 250 .
  • the protrusion 253 may be formed to function as a reinforcing rib for reinforcing the rigidity of the rear frame 250 itself, not for interference with other components.
  • the PCB 260 includes one or more electronic components (eg, the processor 120 of FIG. 1 , the memory 130 , the input module 150 , the sound output module 155 , the display module 160 , and the audio module 170 ). , sensor module 176, interface 177, connection terminal 178, haptic module 179, camera module 180, power management module 188, battery 189, communication module 190, subscriber identification Module 196 and/or antenna module 197 may be mounted or connected.
  • the PCB 260 may include a first PCB 261 and a second PCB 262 .
  • first PCB 261 and the second PCB 262 are spaced apart from each other, and the FPCB 270 (eg, the interface FPCB) interconnecting the two PCBs 261 and 262 is connected. It may include board connectors 261-1 and 262-1 and one or more electronic components 261-2 and 262-2 (eg, a camera module).
  • the first PCB 261 and the second PCB 262 may be located in opposite directions with respect to the battery 290 .
  • the first PCB 261 eg, the main PCB
  • the sound receiving unit of the electronic device 200 the part that the user's ear approaches during a call
  • the second PCB 262 eg, a sub-PCB
  • the battery 290 which is relatively heavy and occupies a large volume compared to other components, can be disposed in the center of the electronic device 200 , thereby improving the weight balance of the electronic device 200 and providing a higher capacity. Sufficient space may be provided to use the battery 290 of the .
  • the battery 290 may supply power to one or more electronic components (eg, the PCB 260 , the FPCB 270 , the display 280 , and/or the antenna 295 ).
  • the battery 290 may be integrally disposed inside the electronic device 200 , or may be disposed detachably from the electronic device 200 .
  • at least a portion of the battery 290 may be disposed substantially on the same plane as the printed circuit board 260 .
  • the battery 290 may be disposed on substantially the same plane as the first PCB 261 and the second PCB 262 .
  • the FPCB 270 (eg, the first FPCB 271) may include a protruding portion, and in this case, the adjacent FPCB ( 270 ) (eg, the first FPCB 271 ) may be provided with a groove 291 accommodating a portion protruding from the FPCB 270 .
  • the FPCB 270 includes a plurality of electronic components (eg, the processor 120 of FIG. 1 , the memory 130 , the input module 150 , the sound output module 155 , the display module 160 , and the audio module 170 ). , sensor module 176, interface 177, connection terminal 178, haptic module 179, camera module 180, power management module 188, battery 189, communication module 190, subscriber identification may pass power and/or signals between the module 196 and/or the antenna module 197 .
  • the FPCB 270 may interconnect a plurality of PCBs 261 and 262 as shown in FIG. 2 .
  • the FPCB 270 may include a first FPCB 271 and a second FPCB 272 .
  • the first FPCB 271 may interconnect a plurality of electronic components (eg, the main PCB 261 and the sub PCB 262 ).
  • the first FPCB 271 includes (i) a flexible cable 271-1 having a plurality of conductive lines for transferring power or signals between a plurality of electronic components, and (ii) a plurality of electronic components.
  • the first connector 271-2 connected to any one component (eg, the board connector 261-1 of the first PCB 261), and (iii) the other component (eg, the second PCB ( and a second connector 271-3 connected to the board connector 262-1 of the 262).
  • the first FPCB 271 may be disposed between the battery 290 and the frames 240 and 250 (eg, the rear frame 250 ).
  • the second FPCB 272 may interconnect a plurality of electronic components, similarly to the first FPCB 271 .
  • the second FPCB 272 may, for example, be disposed on the opposite side of the first FPCB 271 with respect to the battery 290 .
  • the second FPCB 272 may be disposed between the battery 290 and the front frame 240 .
  • the display 280 outputs visual information (eg, text, image and/or image) by the display module (eg, the display module 160 of FIG. 1 ), and displays the output visual information to the front housing ( 210) may be provided to the user through the transparent part.
  • visual information eg, text, image and/or image
  • the antenna 295 is a part of an antenna module (eg, 197 of FIG. 1 ), and may transmit or receive a signal or power between a communication module (eg, 190 of FIG. 1 ) and an external electronic device.
  • the antenna 295 may include, for example, an ultra-wide band (UWB) antenna, a magnetic secure transmission (MST) antenna, a near field communication (NFC) antenna, and/or a wireless charging antenna.
  • the antenna 295 may, for example, perform long-distance communication with an external device, perform short-range communication, or wirelessly transmit/receive power required for charging.
  • the antenna 295 may be disposed between the display 280 and the rear housing 220 .
  • the antenna 295 may be disposed between the battery 290 and the rear housing 220 .
  • signals transmitted or received by the antenna 295 are internal components (eg, board connectors 261-1 and 262-1) and electronic components 261-1 and 262-2 including a conductive material.
  • the antenna 295 may be installed on a surface facing the rear housing 220 of the rear frame 250 .
  • FIGS. 4A to 4C are diagrams illustrating a connection relationship between FPCBs according to various embodiments.
  • an electronic device 300 (eg, the electronic device 101 of FIG. 1 or the electronic device 200 of FIG. 2 ) according to various embodiments of the present disclosure includes one or more electronic components. (eg, 120, 130, 150, 155, 160, 170, 176, 177, 178, 179, 180, 188, 189, 190, 196 and/or 197 of FIG. 1 ) and one or more PCBs (eg, FIG. 2 ); 260) and one or more FPCBs (eg, 270 in FIG. 2).
  • one or more electronic components eg, 120, 130, 150, 155, 160, 170, 176, 177, 178, 179, 180, 188, 189, 190, 196 and/or 197 of FIG. 1
  • PCBs eg, FIG. 2
  • FPCBs eg, 270 in FIG. 2
  • one or more electronic components may (i) be dividedly located inside and outside of one or more PCBs, or (ii) be dividedly installed on several PCBs. make it clear
  • an electronic component eg, a memory 130 , a communication module 190 , a subscriber identification module 196 , a power management module 188 , or a connection terminal of some of the one or more electronic components (178)
  • a PCB eg, a main PCB or a sub PCB
  • some electronic components eg, the battery 189 are connected to any one PCB (eg, the main PCB) by an FPCB, and can transmit and receive power or signals. have.
  • some electronic components eg, 176, 170, 177, 197 in FIG. 1
  • some electronic components are (i) on any one PCB (eg, main PCB) Components installed (eg, the sensor module 1761, the audio module 171, the interface 1771, or the antenna module 1971 of FIG. 3) and (ii) installed on another PCB (eg, the sub PCB) components (eg, sensor module 1763, audio module 172, interface 1772, or antenna module 1972 of FIG. 3), and (iii) the two components described above connect the two PCBs electrically and/or Alternatively, power or signals can be sent and received by the FPCB that is physically connected.
  • PCB eg, main PCB
  • Components installed
  • another PCB eg, the sub PCB components
  • the two components described above connect the two PCBs electrically and/or
  • power or signals can be sent and received by the FPCB that is physically connected.
  • some electronic components eg, 150, 155, 160, 176, 179, 180 in FIG. 1
  • any one of the PCBs eg: Components (eg, the input module 151 of FIG. 3 , the sound output module 1551 , the sound output module 1553 , the display module 161 , the sensor module 1761 , and the haptic module of FIG. 3 ) installed on the main PCB or sub-PCB (1791) or the camera module 181)
  • independent components eg, the input module 152, the sound output module 1552, and the sound output module 1554 of FIG.
  • a display module 162 disposed at a position spaced apart from the PCB ), a display module 162, a sensor module 1761, a haptic module 1792 or a camera module 182), and (iii) an FPCB that electrically and/or physically connects the two components described above. have.
  • the FPCB may connect electronic components in various other forms.
  • the FPCB may directly connect a plurality of electronic components not installed on the PCB to each other.
  • 5A and 5B are views illustrating a laminated structure of a flexible cable of an FPCB according to various embodiments of the present disclosure
  • a flexible cable 500 or 500 ′ (eg, 271- of FIG. 2 ) of an FPCB (eg, the FPCB shown in FIGS. 4A, 4B, or 4C) according to various embodiments. 1) may include a central layer 510 or 510 ′, an insulating layer 520 and/or 540 , and a shielding film layer 530 and/or 550 .
  • FIGS. 5A and 5B show a case in which the central layer 510 or 510' is made of a two-layer flexible metal laminate (eg, copper-polyimide-copper), and a 1-layer ( Single-layer) type flexible metal laminates (eg, polyimide-copper) are shown respectively.
  • a flexible metal laminate in the form of a two-layer, and/or applying a half etching technique a high circuit density is achieved, and the thickness of the FPCB is reduced by reducing the size and/or weight of the FPCB. can be reduced
  • the flexible cable 500 of the FPCB, the central layer 510, the first insulating layer 520, the first shielding film layer 530, the first It may include a second insulating layer 540 and a second shielding film layer 550 .
  • the shielding layer of the flexible cable 500 of the FPCB may be formed by laminating the first shielding film layer 530 and the second shielding film layer 550 to the outermost side.
  • the central layer 510 may include a plurality of electronic components (eg, 120, 130, 150, 155, 160, 170, 176, 177, 178, 179, 180, 188, 189, 190, 196, It may be understood to refer to a portion in which a plurality of conductive lines (eg, conductive lines 711-1 in FIG. 7B) for transmitting power or signals between 197 and/or 260 in FIG. 2 are formed.
  • the central layer 510 is located on both sides of (i) an internal insulating layer 511 formed of an insulating material (eg, polyimide or synthetic resin) and (ii) an internal insulating layer 511 and a conductive material (eg, a conductive material).
  • a first metal layer 512 and a second metal layer 513 made of copper, silver or gold) and (iii) the two metal layers 512 and 513 located on the outer surface of each ) may include a first plating layer 514 and a second plating layer 515.
  • the plating layers 514 and 515 may be formed through a plated through hole (PTH) plating process.
  • PTH plated through hole
  • the plurality of conductive lines may be formed in the metal layers 512 and 513 and the plating layers 514 and 515.
  • a pair of adjacent metal layers 512 or 513 and the plating layer 514 or 515 are collectively referred to as a “wiring layer”. “.
  • first wiring layers 512 and 514 positioned on one side of the inner insulating layer 511 of the central layer 510 and the internal insulating layer 511 are the reference.
  • a plurality of different types of conductive lines may be provided in the "second wiring layers 513 and 515" located opposite to the first wiring layers 512 and 514, respectively.
  • the first insulating layer 520 may be stacked on the central layer 510 .
  • the first insulating layer 520 may include, for example, a cover lay 522 made of an insulating material and/or an adhesive 521 .
  • the cover lay 522 may be attached to the outer surface of the central layer 510 by an adhesive 521 .
  • the first shielding film layer 530 is laminated on the first insulating layer 520 and may reduce leakage of noise caused by currents flowing through the plurality of conductive lines of the central layer 510 to the outside.
  • the first shielding film layer 530 may be referred to as an “electromagnetic interference film (EMI film)”.
  • the second insulating layer 540 may be stacked on the opposite side of the first insulating layer 520 with respect to the central layer 510 .
  • the second insulating layer 540 may include an adhesive 541 and/or a cover lay 542 . Unless otherwise stated, it should be noted that the description of the first insulating layer 520 may also be applied to the second insulating layer 540 .
  • the second shielding film layer 550 may be laminated on the second insulating layer 540 positioned on the opposite side of the first shielding film layer 530 with respect to the central layer 510 . Unless otherwise stated, it should be noted that the description of the first shielding film layer 530 may also be applied to the second shielding film layer 550 .
  • the insulating layer 520 or 540 positioned between the central layer 510 and the shielding film layer 530 or 550 has a very thin thickness (eg, 27.5 ⁇ m).
  • the central layer 510 of the FPCB may include a conductive line (eg, a USB line, a USB 2.0 line, or a USB 3.2 line) that requires impedance matching for compatibility with other devices.
  • direct current resistance DC resistance
  • the width of the corresponding conductive line may be reduced.
  • the basic performance of some conductive lines may tend to be more sensitive to the size of the DC resistance than whether the impedance is matched.
  • some conductive lines eg, USB line, USB 2.0 line, or USB 3.2 line
  • the DC resistance must be increased for impedance matching, and accordingly, the transmission performance of some conductive lines may be deteriorated, so there is a need to compensate for this.
  • one or more of the shielding film layers 530 and/or 550 among the plurality of shielding film layers 530 and 550 is based on the thickness direction (up and down direction in FIG. 5 ) of the flexible cable 500 of the FPCB,
  • a cutout formed in a region overlapping at least one conductive line (for example, a conductive line requiring impedance matching) among the plurality of conductive lines formed in the central layer 510 may include. Exemplary description of the cutout will be described later with reference to FIGS. 6 to 8 .
  • the flexible cable 500 ′ of the FPCB may include a central layer 510 ′, an insulating layer 520 and a shielding film layer 530 .
  • the shielding layer of the flexible cable 500 ′ of the FPCB may be formed by laminating the shielding film layer 530 on the outermost side.
  • the description of the flexible cable 500 of the FPCB according to one embodiment may be applied to the flexible cable 500 ′ of the FPCB according to another embodiment.
  • the central layer 510 ′ is, for example, (i) an inner insulating layer 511 formed of an insulating material (eg, polyimide), and (ii) located on one surface of the inner insulating layer 511 and a conductive material (eg, polyimide). : copper) and (iii) a plating layer 514 positioned on the outer surface of the metal layer 512 and plated with a conductive material (eg, copper).
  • a plurality of electronic components eg, 120, 130, 150, 155, 160, 170, 176, 177, 178, 179, 180, 188
  • a plurality of conductive lines (eg, conductive line 711-1 of FIG. 7 ) for transmitting power or signals may be formed between 189 , 190 , 196 , 197 and/or 260 of FIG. 2 .
  • the FPCB is exemplarily described as having the structure of the flexible cable 500 of the FPCB made of a flexible metal laminate in the form of a two-layer, as shown in FIG. It should be noted that it is also possible to have a flexible cable 500' of an FPCB made of laminate.
  • FIG. 6 is a view showing various performance improvement methods of an FPCB according to various embodiments
  • FIG. 7a is a plan view showing a part of the FPCB according to a comparative example
  • FIG. 7b is a plan view showing a part of the FPCB according to various embodiments 8
  • the impedance value of a part of the conductive line (eg, USB line) of the FPCB according to the comparative example and the impedance value of the part of the conductive line (eg, USB line) of the FPCB according to various embodiments is compared. It is a graph.
  • FPCB 700 (eg, 270 of FIG. 2, FPCB of FIG. 3 or FPCB of FIG. 4) is a flexible cable 710 (eg, of FIG. 2) 271-1 (500 or 500' of FIG. 5) and a connector 720 (eg, the first connector 271-2 or the second connector 271-3 of FIG. 2).
  • the flexible cable 710 includes a central layer 711 (eg, 510 in FIG. 5A or 510 ′ in FIG. 5B ), an insulating layer (eg, 520 and/or 540 in FIG. 5A ) and a shielding film layer 713 (eg, 510 in FIG. 5A ). : 530 and/or 550 of FIG. 5A).
  • the central layer 711 may include a plurality of conductive lines 711-1.
  • some of the conductive lines 711-1 eg, USB line, USB 2.0 line, or USB 3.2 line
  • a set reference value eg, 90 ohm
  • the FPCB 700 ′ is (i) the flexible cable 710 ′ of the FPCB 700 ′ has a thin set thickness according to a pre-designed condition, (ii) impedance matching
  • the part of the conductive line 711-1' is sufficiently thin with a width W1 (eg 45 ⁇ m) is shown as an example of a shape designed to have.
  • W1 width
  • the FPCB 700 ′ is referred to as a “sample circuit board 700 ′,” and some conductive lines 711-1 ′ requiring the above-described impedance matching (eg, USB line) will be referred to as “sample USB line 711-1',” and the remaining conductive lines 711-1' other than the sample USB line 711-1' will be referred to as “sample conductive line 711-1'.” do it with
  • the sample circuit board 700' comprises (i) a sample central layer 711' comprising a sample USB line 711-1' and a sample conductive line 711-1', and (ii) a sample A sample insulating layer (not shown) laminated on the central layer 711', and (iii) a sample insulating layer (not shown) laminated on the sample USB line 711-1' and the sample conductive line 711- 1 ′) may include a sample shielding film layer 713 ′ for reducing leakage of noise due to current flowing to the outside
  • the sample shielding film layer 713 ′ has a general shape covering all of the plurality of conductive lines 711-1 ′ (a sample USB line and a sample conductive line) as shown, and the sample USB The line 711-1' may have a thin first width W1 (eg, 45 ⁇ m) for impedance matching of a set reference value (eg, 90 ohm).
  • the sample shielding film layer 713 ′ may not have a cutout (eg, 713 - 5 ).
  • the FPCB 700 according to various embodiments illustrated in FIG. 7B may include a cutout 713 - 5 unlike the sample circuit board 700 ′ according to the comparative example illustrated in FIG. 7A .
  • the FPCB 700 according to various embodiments includes (i) a USB line 711 having a second width W2 (eg 110 ⁇ m) different from the first width W1 (eg 45 ⁇ m) of the sample USB line.
  • a central layer 711 having the same thickness as the sample central layer 711', and (ii) an insulation laminated on the central layer 711 and having the same thickness as the sample insulating layer layer (not shown), and (iii) a shielding film layer 713 laminated on the insulating layer and having the same thickness as the sample shielding film layer 713 ′.
  • the shielding film layer 713 based on the thickness direction of the flexible cable 710 of the FPCB 700, is a cutout ( 713-5) may be included.
  • some conductive lines 711 - overlapping the cutout 713 - 5 based on the thickness direction of the flexible cable 710 . 1) eg, a USB line
  • the ground may become larger, so that some of the conductive lines 711 It becomes possible to increase the impedance of -1) (eg USB line).
  • the cutout 713 - 5 in the shielding film layer 713 without increasing the gap from the central layer 711 to the shielding film layer 713 . it can be understood that the impedance is increased, and (ii) the width W2 is increased as much as the impedance is increased. Therefore, with respect to some conductive lines 711-1 (eg, USB lines), (i) to have a thin thickness, (ii) to decrease the DC resistance by an increased line width to improve transmission performance, ( iii) It is possible to enable impedance matching as shown in the graph of FIG. 8 .
  • the graph of FIG. 8 shows the impedance of the conductive line of the FPCB measured with a time domain reflectometer (TDR).
  • TDR time domain reflectometer
  • the value of the average impedance of the FPCB has a value of 90% to 110% of the average impedance of the sample circuit board, based on the specification of the sample circuit board, some conductive lines 711 - 1) You can determine the width (W2) of (eg USB line).
  • FIGS. 10A to 10E are plan views of the FPCB according to various embodiments of the present disclosure.
  • FPCB 900 (eg, 270 of FIG. 2, FPCB of FIG. 3, FPCB of FIG. 4A or 700 of FIG. 7B) is a flexible cable ( 910) (271-1 in FIG. 2, 500 in FIG. 5A or 500' in FIG. 5B, 710 in FIG. 7B), a first connector 920 (eg, 271-2 in FIG. 2 or 720 in FIG. 7B) and a second connector 920 in FIG. 2 connectors 930 (eg, 271-3 of FIG. 2 or 720 of FIG. 7B ) may be included.
  • a first connector 920 eg, 271-2 in FIG. 2 or 720 in FIG. 7B
  • second connector 920 in FIG. 2 connectors 930 eg, 271-3 of FIG. 2 or 720 of FIG. 7B
  • the shielding film layer of the flexible cable 910 may include a first region 911 , a second region 912 , a bridge 913 , and a cutout 915 ). may include.
  • the cutout 915 may be formed in a portion overlapping with a conductive line requiring impedance matching (eg, 711-1, USB line of FIG. 7B ) when viewed in the thickness direction of the FPCB. As shown in FIG. 9 , the cutout 915 may be formed in plurality.
  • a conductive line requiring impedance matching eg, 711-1, USB line of FIG. 7B
  • the first area 911 may be located on one side with respect to the cutout 915 .
  • the first region 911 may be located on one side of the conductive line overlapping the cutout 915 .
  • the second region 912 may be located on the other side with respect to the cutout 915 .
  • the second region 912 may be positioned opposite to the first region 911 with respect to the conductive line overlapping the cutout 915 .
  • the bridge 913 may interconnect the first region 911 and the second region 912 separated from each other by the cutout 915 . According to the bridge 913, when the shielding film layer is laminated to form the outer surface of the FPCB, it is possible to reduce the misalignment of the relative attachment positions of the first region 911 and the second region 912, so that Ease of use can be improved.
  • the bridge 913 may be understood to refer to an uncut portion positioned between the plurality of cutouts 915 .
  • FIG. 9 is a graph showing the impedance for each position of the conductive line overlapping the cutout 915 along the longitudinal direction of the FPCB 900 according to various embodiments of the present disclosure.
  • the impedance drop impedance drop
  • the length of the bridge 913 ie, the width of region A
  • the length of the portion in which the impedance drop phenomenon occurs ie, the width of region B
  • the degree of impedance drop increase.
  • the impedance of the conductive line of the FPCB to which the bridge (eg, 913 ) is not applied is shown.
  • the magnitude of the impedance increases from one connector of the FPCB to the opposite connector due to the DC resistance of the conductive line.
  • the FPCB to which the bridge 913 is applied as shown in FIG. 9 shows an impedance drop phenomenon, by adjusting the number and position of the bridges 913, uniformity of the impedance of the conductive line over some or all sections It can be seen that the performance can be improved.
  • 10A to 10E illustrate setting patterns of a bridge (eg, 913 of FIG. 9 ) according to various embodiments of the present disclosure.
  • the bridge may be formed in a portion overlapping the center of the conductive line in the shielding film layer.
  • the bridge may be formed in a portion overlapping each end of the conductive line (eg, a portion connected to a connector) of the shielding film layer.
  • the shielding film layer may be formed in a portion overlapping any one of both ends of the conductive line (eg, a portion connected to a connector).
  • the FPCB may include a plurality of bridges, and the plurality of bridges may be formed to be spaced apart along a portion overlapping the conductive line in the shielding film layer.
  • the plurality of bridges may be spaced apart along the longitudinal direction of the cutout.
  • the distance between the plurality of bridges ie, the length of the cutout
  • the lengths of the plurality of bridges may be equal to each other.
  • the distance between a pair of adjacent bridges may be shorter than the length of the individual bridges.
  • the impedance can be relatively uniformly matched to a desired value, and at the same time, the shielding performance of shielding noise generated by the current flowing through the conductive line can be improved.
  • the distance between a pair of adjacent bridges may be longer than the length of the individual bridges.
  • the impedance of the conductive line can be adjusted by using various shapes of bridges (eg, 913 in FIG. 9 ) and cutouts (eg, 915 in FIG. 9 ). It will be described with reference to 11 and FIGS. 12A to 12G.
  • FIGS. 12A to 12G are plan views of the FPCB, according to various embodiments.
  • the FPCB 1100 (eg, 900 of FIG. 9) is a flexible cable 1110 (eg, 910 of FIG. 9) and a connector (eg: 920 of FIG. 9) may be included.
  • the flexible cable 1110 includes a central layer 1111 (eg, 510 in FIG. 5A or 510′ in FIG. 5B), an insulating layer (eg, 520 and/or 540 in FIG. 5A), and a shielding film layer 1113 (eg, 510 in FIG. 5B). : 530 and/or 550 of FIG. 5A).
  • the central layer 1111 includes a plurality of conductive lines 1111-1 (eg, 711-1 in FIG. 7B ), and some conductive lines 1111-1 ( For example: USB line, USB 2.0 line, or USB 3.2 line), impedance matching of the set reference value (eg 90ohm) may be required.
  • conductive lines 1111-1 eg, 711-1 in FIG. 7B
  • impedance matching of the set reference value eg 90ohm
  • the shielding film layer 1113 may include a first region 1113-1 (eg, 911 in FIG. 9 ), a second region 1113-2 (eg 912 in FIG. 9 ), and a bridge 1113-3 (eg, 911 in FIG. 9 ). : 913 of FIG. 9) and a cutout 1113-5 (eg, 915 of FIG. 9) may be included.
  • the bridge 1113 - 3 may be formed in a direction perpendicular to the longitudinal direction of the cutout 1113 - 5 .
  • the cutout 1113 - 5 may have a rectangular shape.
  • the cutout 1113 - 5 has a rectangular shape in which the length in the first direction (eg, the longitudinal direction of the FPCB) is longer than the length in the second direction (eg, the width direction of the FPCB) orthogonal to the first direction. can have
  • the length of the cutout 1113-5 may be referred to as "L1", and the distance between a pair of adjacent cutouts 1113-5 may be referred to as "L2".
  • the designer may determine the pattern of the bridge 1113 - 3 and/or the bridge 1113 - 5 formed on the shielding film layer 1113 by adjusting L1 and L2 for impedance matching.
  • L1 may be longer than L2.
  • L1 may be at least twice as large as L2.
  • the length (L1) of the cutout 1113-5 can be designed not to exceed 1/20 times (eg 6.25 cm) of the set wavelength (eg, 1.25 m) corresponding to the set frequency. According to such a design, it was confirmed that it is effective in compensating for the problem of deterioration of the shielding performance caused by the formation of the cutout 1113 - 5 . Meanwhile, it should be noted that this is only an example, and the value of L1 may be designed differently.
  • the distance L2 between the pair of adjacent cutouts 1113 - 5 may be determined according to the performance of the conductive line 1111-1 , impedance matching, shielding performance, and/or the level of the manufacturing process. .
  • FIG. 11 exemplarily illustrates a case in which the FPCB has a rectangular bridge 1113-3 and a cutout 1113-5.
  • the FPCB according to various embodiments shown in FIG. 12 it should be noted that, depending on the design situation, bridges and cutouts of various patterns may be provided.
  • the bridge may be formed in a shape that crosses the longitudinal direction of the FPCB in a diagonal direction.
  • the plurality of bridges includes (i) a first bridge formed in a direction crossing the longitudinal direction of the FPCB in the first direction, and (ii) both in the first direction and in the longitudinal direction of the FPCB. It may include a second bridge formed in a second intersecting direction.
  • the first bridge and the second bridge may be formed to alternate with each other.
  • the plurality of cutouts has a shape (eg, a triangle) protruding from the first region (eg, 1113-1 in FIG. 11 ) toward the second region (eg, 1113-2 in FIG. 11 ). shape) and a second cutout formed in a shape opposite to the first cutout.
  • the first cutout and the second cutout may be alternately formed.
  • the plurality of bridges have a shape (eg, a triangle) protruding from the first region (eg, 1113-1 in FIG. 11 ) toward the second region (eg, 1113-2 in FIG. 11 ). It may have a first bridge having a shape) and a second bridge formed in a shape opposite to that of the first bridge.
  • the first bridge and the second bridge may be formed to alternate with each other.
  • a plurality of first bridges may be formed in a direction intersecting the longitudinal direction of the FPCB, and a second bridge may be formed in a shape intersecting the plurality of first bridges.
  • a plurality of first bridges are formed in a direction crossing the longitudinal direction of the FPCB, and only some of the first bridges of the plurality of first bridges may be formed in a shape in which the second bridges intersect. have.
  • a plurality of first bridges and a plurality of second bridges may be formed in a first direction and a second direction that intersect in the longitudinal direction of the FPCB and are different from each other. Some of the plurality of first bridges and the plurality of second bridges may be formed to cross each other.
  • FIG. 13 is a diagram illustrating a cross-sectional view of an electronic device according to various embodiments of the present disclosure
  • an electronic device 1300 (eg, 101 in FIG. 1 , 200 in FIG. 2 , or 300 in FIG. 3 ) according to various embodiments of the present disclosure includes a front housing 1310 (eg, 210 in FIG. 2 ), Display 1380 (eg, 280 in FIG. 2 ), front frame 1340 (eg 240 in FIG. 2 ), battery 1390 (eg 290 in FIG. 2 ), FPCB 1370 (eg in FIG. 2 ) 270), an antenna 1395 (eg, 295 of FIG. 2 ), and a rear housing 1320 (eg, 220 of FIG. 2 ).
  • a front housing 1310 eg, 210 in FIG. 2
  • Display 1380 eg, 280 in FIG. 2
  • front frame 1340 eg 240 in FIG. 2
  • battery 1390 eg 290 in FIG. 2
  • FPCB 1370 eg in FIG. 2
  • an antenna 1395 eg, 295 of FIG. 2
  • the flexible cable 500 (eg, 500 in FIG. 5A or 500 ′ in FIG. 5B ) of the FPCB 1370 according to various embodiments is a central layer 510 , a first insulating layer 520 , and a first shielding film layer. 530 , a second insulating layer 540 , and a second shielding film layer 550 may be included.
  • the central layer 510 may include an internal insulating layer 511 , a first metal layer 512 , a second metal layer 513 , a first plating layer 514 , and a second plating layer 515 .
  • first metal layer 512 and the first plating layer 514 are referred to as “first wiring layers 512 and 514”
  • the second metal layer 513 and the second plating layer 515 are referred to as “second wiring layers ( 513, 515)”.
  • the FPCB 1370 may be positioned between the antenna 1395 and the battery 1390 .
  • cutouts eg, 713-5 in FIG. 7B , 915 in FIG. 9 , and 11 1113-5
  • a cutout may not be formed in the first shielding film layer 530 positioned on the surface facing the antenna 1395 among both surfaces of the FPCB 1370 .
  • a first surface on which the cutout is not formed may face the antenna 1395
  • a second surface on which the cutout is formed may be disposed toward the display 1380 .
  • noise caused by the current flowing in the conductive line (eg, 711-1 in FIG. 7B , 1111-1 or USB line in FIG. 11 ) formed in the central layer 510 is propagated toward the antenna 1395 .
  • the conductive line eg, 711-1 in FIG. 7B , 1111-1 or USB line in FIG. 11
  • signals eg, radio frequency signals, RF signals
  • the central layer 510 is positioned close to the first wiring layers 512 and 514 and the second shielding film layer 550 positioned close to the first shielding film layer 530 with respect to the internal insulator. and second wiring layers 513 and 515 .
  • the second wiring layers 513 and 515 may be located farther from the antenna 1395 than the first wiring layers 512 and 514 .
  • the second wiring layers 513 and 515 located relatively far from the antenna 1395 have a high need for impedance matching and a first conductive line (eg, USB) that has a high noise effect on the RF signal. line and/or RFIC line), and (ii) in the first wiring layers 512 and 514 located relatively close to the antenna 1395, the need for impedance matching is not relatively high compared to the first conductive line.
  • 2 conductive lines eg, a line connecting the sensor modules 1761 , 1762 , 1763 of FIG. 3 , a line connecting the audio modules 171 , 172 of FIG.
  • the impedance matching condition and/or the thickness condition of the FPCB can be achieved while reducing the problem of interference with the signal of the antenna 1395 .
  • the impedance matching condition may be satisfied without forming a cutout in the first shielding film layer 530 .
  • the shielding film layer ( 530 in FIG. 5A ) in which the cutout is formed faces the opposite direction of the antenna 1395 .
  • the shielding film layer ( 530 in FIG. 5A ) in which the cutout is formed faces the opposite direction of the antenna 1395 .
  • the need for impedance matching is high in the first wiring layers 512 and 514 located relatively far from the battery 1390, and the RF A conductive line (eg, a USB line) having a high noise effect on a signal may be disposed, and a cutout may be formed in the first shielding film layer 530 .
  • the battery 1390 may serve as a shield, the second shielding film layer 550 adjacent to the battery 1390 may be removed.
  • the antenna 1395 may be omitted.
  • the first wiring layers 512 and 514 may be disposed to face the case 1320 without the antenna 1395 (eg, the rear housing 220 of FIG. 2 ).
  • FIG. 14 is a diagram illustrating a cross-sectional view of an electronic device according to various embodiments of the present disclosure
  • an electronic device 1400 (eg, 101 in FIG. 1 , 200 in FIG. 2 , or 300 in FIG. 3 ) according to various embodiments of the present disclosure includes a front housing 1410 (eg, 210 in FIG. 2 ); Display 1480 (eg, 280 in FIG. 2 ), front frame 1440 (eg 240 in FIG. 2 ), FPCB 1470 (eg 270 in FIG. 2 ), battery 1490 (eg in FIG. 2 ) 290), an antenna 1495 (eg, 295 of FIG. 2 ), and a rear housing 1420 (eg, 220 of FIG. 2 ).
  • a front housing 1410 eg, 210 in FIG. 2
  • Display 1480 eg, 280 in FIG. 2
  • front frame 1440 eg 240 in FIG. 2
  • FPCB 1470 eg 270 in FIG. 2
  • battery 1490 eg in FIG. 2
  • an antenna 1495 eg, 295 of FIG. 2
  • the flexible cable 500 of the FPCB 1470 includes a central layer 510 , a first insulating layer 520 , a first shielding film layer 530 , a second insulating layer 540 and a second A shielding film layer 550 may be included.
  • the FPCB 1470 may be positioned between the front frame 1440 and the battery 1490 .
  • cutouts eg, 713-5 of FIG. 7B , 915 of FIG. 9 , and FIG. 11
  • the first shielding film layer 530 located on the side facing the battery 1490 among both surfaces of the FPCB 1470 .
  • 1113-5 may be formed.
  • a cutout may not be formed in the second shielding film layer 550 located on the surface facing the front frame 1440 among both surfaces of the FPCB 1470 .
  • noise caused by a current flowing through a conductive line eg, 711-1 in FIG. 7B , 1111-1 in FIG.
  • the FPCB 1470 includes a 1-layer flexible cable (500 ′ in FIG. 5 )
  • the shielding film layer ( 530 in FIG. 5A ) with a cutout is disposed to face the battery 1490 . By doing so, it is revealed that the problem of noise propagation to the outside can be reduced.
  • 15 is a plan view of an FPCB according to various embodiments.
  • FPCB (1500) (eg, 270 of Figure 2, FPCB of Figure 3, FPCB of Figures 4a to 4c or 700 of Figure 7b, 900 of Figure 9, Figure 11 1100 , 1370 of FIG. 13 , and 1470 of FIG. 14 may include a flexible cable 1510 , a first connector 1520 , and a second connector 1530 .
  • the shielding film (eg, 530 and 550 of FIG. 5A , 713 of FIG. 7B , and 1113 of FIG. 11 ) of the flexible cable 1510 includes a first region 1511 (eg, 1113-1 of FIG. 11 ), a second region It may include a 1512 (eg, 1113-2 of FIG. 11 ), a bridge (eg, 1113-3 of FIG. 11 ), a cutout (eg, 1113-5 of FIG. 11 ), and a cover film 1517 .
  • the cover film 1517 is a film having a shielding effect against electromagnetic interference (EMI), and may be formed of, for example, the same material as the shielding film layer.
  • the cover film 1517 is disposed in a region overlapping the cutout (eg, 1113-5 in FIG. 11 ) based on the thickness direction of the FPCB 1500 , and at least one conductive line (eg, 1111 in FIG. 11 ) It can reduce the leakage of noise caused by the current flowing in -1) to the outside.
  • EMI electromagnetic interference
  • FIG. 16 is a cross-sectional view of an FPCB according to various embodiments taken along the cutting direction along the cutting line I-I shown in FIG. 15 .
  • a flexible cable 1600 (eg, 500 in FIG. 5A, 500 ′ in FIG. 5B, or 1510 in FIG. 15) of an FPCB (eg, 1500 in FIG. 15) according to various embodiments is a central layer ( 1610) (eg, 510 in FIG. 5A ), a first insulating layer 1620 (eg 520 in FIG. 5A ), a first shielding film layer 1630 (eg 530 in FIG. 5A ), and a second insulating layer 1640 . ) (eg 540 in FIG. 5A ), a second shielding film layer 1650 (eg 550 in FIG. 5A ), a conductive adhesive 1660 and a cover film 1670 (eg 1517 in FIG. 15 ). have.
  • the cover film 1670 may cover the cutout (eg, 1113 - 5 of FIG. 11 ) formed in the first shielding film layer 1630 .
  • the cover film 1670 may be located at a greater distance than the distance from the central layer 1610 to the first shielding film layer 1630 .
  • the inner surface of the cover film 1670 (eg, the surface facing the central layer 1610 ) is perpendicular to the length and thickness directions of the flexible cable 1600 , in the width direction (left and right direction with reference to FIG. 16 ). As a result, it may overlap the first shielding film layer 1630 .
  • the cover film 1670 may cover the conductive adhesive 1660 together with the first shielding film layer 1630 so that the conductive adhesive 1660 is not exposed to the outside.
  • the cover film 1670 may be laminated on the outermost side of the flexible cable 1600 together with the shielding film layers 1630 and 1650 to form a shielding layer.
  • the central layer 1610 is located on one of both surfaces of (i) an inner insulating layer 1611 formed of an insulating material (eg, polyimide or synthetic resin) and (ii) an internal insulating layer 1611 and a conductive material (eg: A first wiring layer 1612 made of copper, silver, or gold), and (iii) a second wiring layer 1613 located on the other of both surfaces of the inner insulating layer 1611 and made of a conductive material (eg, copper, silver or gold).
  • an inner insulating layer 1611 formed of an insulating material (eg, polyimide or synthetic resin) and (ii) an internal insulating layer 1611 and a conductive material (eg: A first wiring layer 1612 made of copper, silver, or gold), and (iii) a second wiring layer 1613 located on the other of both surfaces of the inner insulating layer 1611 and made of a conductive material (eg, copper, silver or gold).
  • an inner insulating layer 1611 formed of an
  • any one or more wiring layers (eg, the first wiring layer 1612) of the first wiring layer 1612 and the second wiring layer 1613 may include: (i) one or more conductive lines 1612-1 that transmit power or signals (eg, : USB line) and (ii) a ground line 1612 - 2 functioning as a ground component by being physically and electrically connected to the cover film 1670 through the conductive adhesive 1660 .
  • the ground line (eg, 1612-2) is a line distinct from the one or more conductive lines 1612-1, and for example, an electronic device (eg, 101 in FIG. 1, 200 in FIG. 2, 300 in FIG. 3, or It may be electrically connected to a ground terminal of any one or more electronic components among a plurality of electronic components included in 1400 of FIG. 14 .
  • an electronic device eg, 101 in FIG. 1, 200 in FIG. 2, 300 in FIG. 3, or It may be electrically connected to a ground terminal of any one or more electronic components among a plurality of electronic components included in 1400 of FIG. 14 .
  • the ground line 1612-2 formed in the central layer 1610 the problem of leakage of noise caused by the current flowing in the conductive line 1612-1 to the side in a direction parallel to the surface of the flexible cable 1600 is prevented. can reduce
  • the effect of the ground line 1612 - 2 located on the side on the impedance of the conductive line 1612-1 may be insignificant.
  • the impedance of the conductive line 1612-1 is, from the conductive line 1612-1, to a ground overlapping the conductive line 1612-1 based on the thickness direction of the flexible cable 1600 (eg, a cover film 1670). ) is dominant, and in consideration of this, the conductive adhesive 1660 and the cover film 1670 may be installed.
  • the conductive adhesive 1660 may allow the cover film 1670 to function as a ground component by physically and electrically connecting the ground line 1612 - 2 and the cover film 1670 .
  • the conductive adhesive 1660 is located in (i) the cutout, and overlaps both the ground line 1612-2 and at least one conductive line 1612-1 based on the thickness direction of the flexible cable 1600 of the FPCB.
  • the "first part" to be used and (ii) the center layer 1610 and the first insulating layer 1620 are located in the cut-out portion, and based on the thickness direction of the flexible cable 1600 of the FPCB, the ground line 1612 - 2) and may include a “second portion” that does not overlap the at least one or more conductive lines 1612-1.
  • the first part is a part positioned in the cutout of the first shielding film layer 1360
  • the second part is a part positioned in the cutout across the central layer 1610 and the first insulating layer 1620 .
  • an area overlapping the ground line 1612 - 2 is cut, thereby providing a space in which the conductive adhesive 1660 is located.
  • the area overlapping the ground line 1612-2 is cut, thereby providing a space for the conductive adhesive 1660 to be located. have.
  • one of the shielding film layers 1630 and 1650 is cut off, and the cover film 1670 is installed in the cut out portion by way of example.
  • both of the shielding film layers 1630 and 1650 are cut, and a person skilled in the art will fully understand that a cover film (eg, 1670) may be installed in the cut out portion.
  • the cover film 1670 is illustrated as being grounded through the conductive adhesive 1660 to the ground line 1612 - 2 formed in the central layer 1610 , but otherwise, the conductive adhesive 1660 . ) may be omitted, and the cover film 1670 serves as a ground component in the electronic device (eg, a ground contact on the first connector 1520 or a ground contact on the second connector 1530 of FIG. 15 ). ), so that it can function as a ground. According to such a structure, the width of the cover film 1670 can be reduced.
  • the conductive line it is possible to increase the width of (1612-1), and consequently to improve the transmission performance of the FPCB, while reducing the extent to which the shielding performance deteriorates.
  • the periphery of the FPCB The shape of the parts can be modified.
  • 17A and 17B are diagrams illustrating a state in which a component of an electronic device and an FPCB are combined with each other, according to various embodiments of the present disclosure
  • an electronic device 1700 (eg, 101 in FIG. 1 , 200 in FIG. 2 , 300 in FIG. 3 or 1400 in FIG. 14 ) according to various embodiments of the present disclosure includes a flexible cable 1600 and, It may include a support structure 1710 (eg, 240 , 250 , 290 of FIG. 2 ) disposed adjacent to the flexible cable 1600 .
  • a support structure 1710 eg, 240 , 250 , 290 of FIG. 2
  • the support structure 1710 may include a groove 1711 for receiving a protruding portion of the flexible cable 1600 (eg, the cover film 1670 of FIG. 16 ).
  • the flexible cable 1600 is positioned between the front frame (eg, 240 in FIG. 2 ) and the battery (eg, 290 in FIG. 2 ), and a cover film (eg, 1670 in FIG. 16 ) of the flexible cable 1600 . ) can be installed on the side facing the front frame.
  • a groove 241 of FIG. 2 ) capable of accommodating a portion of the cover film is formed in the front frame, thereby reducing an increase in the thickness of the entire electronic device.
  • the flexible cable 1600 is positioned between the battery (eg, 290 in FIG. 2 ) and the rear frame (eg, 250 in FIG. 2 ), and a cover film (eg, 1670 in FIG. 16 ) of the flexible cable 1600 . ) can be installed on the side facing the battery.
  • a groove ( 291 of FIG. 2 ) capable of accommodating a part of the cover film is formed in the battery, an increase in the thickness of the entire electronic device may be reduced.
  • the support structure 1710 eg, the rear frame 250 of FIG. 2 or the rear housing ( 220)
  • a groove for accommodating a portion of the cover film may be formed.
  • an electronic device 1700 ′ (eg, 101 in FIG. 1 , 200 in FIG. 2 , 300 in FIG. 3 , or 1400 in FIG. 14 ) according to various embodiments of the present disclosure may include a flexible cable 1600 ′. ), a support structure 1710 (eg, 240 , 250 , 290 of FIG. 2 ) disposed adjacent to the flexible cable 1600 , and an adhesive layer 1712 and a cover body 1713 .
  • a support structure 1710 eg, 240 , 250 , 290 of FIG. 2
  • the flexible cable 1600 ′ may be understood as a form in which the cover film 1670 of the flexible cable 1600 of FIG. 16 is removed.
  • the support structure 1710 may include a recessed groove 1711 .
  • the cover film 1713 may be formed in a shape corresponding to the cutout of the flexible cable 1600 .
  • the cover film 1713 may be installed on the bottom surface of the groove 1711 via the adhesive layer 1712 .
  • the cover body 1713 may be formed of a conductive metal.
  • the cover body 1713 may be formed of the same material and/or thickness as that of the shielding film layer.
  • the cover body 1713 in the process of assembling the support structure 1710 and the FPCB, the cover body 1713 may be inserted into the cutout of the FPCB.
  • the cover body 1713 in an assembled state of the electronic device, the cover body 1713 may be located at a greater distance than the distance from the central layer of the flexible cable 1600 to the shielding film layer of the flexible cable 1600 . have.
  • FIG. 18 is a graph comparing the impedance value of the FPCB according to the comparative example and the impedance value of the FPCB according to various embodiments.
  • the FPCB according to various embodiments is a form in which a cutout and a single bridge are applied to the center of the cutout.
  • the average of the impedance values of the FPCBs according to various embodiments is an FPCB according to a comparative example. It appears similar to the average of the impedance values, indicating that impedance matching is possible.
  • the comparative example and the example are at a similar level to each other in the deviation of the impedance.
  • the FPCB according to the comparative example can be replaced with the FPCB according to the embodiment, and through this, the conductive line can have a wider width, so that the transmission performance can be improved while satisfying other conditions.
  • FIG. 19 is a diagram comparing the performance of the FPCB according to the comparative example and the performance of the FPCB according to various embodiments
  • FIG. 20 is an impedance value of the FPCB according to the comparative example and the impedance value of the FPCB according to various embodiments is a diagram comparing
  • the FPCB according to the comparative example is an FPCB to which a cutout is not applied (eg, the FPCB of FIG. 7a), and (ii) the FPCB according to Example 1 is an FPCB to which a cutout is applied and a bridge is not applied (Example : FPCB 700 of FIG.
  • FPCBs according to Examples 2 to 4 are FPCBs to which cutouts and a plurality of bridges are applied (eg, FPCB 1100 of FIG. 11).
  • FPCB 1100 of FIG. 11 the length L1 of the cutout (eg, 1113-5 in FIG. 11 ) and an adjacent pair based on the longitudinal direction of the FPCB It is revealed that the FPCB is manufactured by adjusting the distance L2 between the cutouts (eg, 1113-5 in FIG. 11 ).
  • the width of the USB 2.0 line is 45 ⁇ m in the comparative example and 110 ⁇ m in all other embodiments, and as can be seen in FIG. 20 , both the comparative example and the embodiments are designed so that there is no problem in impedance matching.
  • the USB signal quality of an electronic device is a measurement device specified by the USB implementers forum (USB-IF), a USB test packet generator, and a compliance test specification defined by the USB-IF. According to (compliance test specification, CTS), it is determined by implementing and testing the test environment.
  • the transmitter (TX) and receiver (RX) of the electronic device should be designed to meet the minimum specifications of CTS (eg, voltage level, rising time, falling time).
  • the electronic device when the electronic device generates a test packet and accumulates a plurality of signals so that an eye-shaped diagram is drawn, the traces of the accumulated signals are, It should not violate the eye-mask drawn based on the minimum specifications.
  • the voltage level is varied, and when the test packet is sent to the electronic device, The voltage level when the electronic device recognizes this as an abnormal packet becomes the scramble performance, which must be higher than 100mV. On the other hand, in the electronic device, the voltage level at the time of recognizing this as a normal packet becomes the sensitivity performance, which should be lower than 200 mV.
  • Example 1 in the case of Example 1 to which the bridge is not applied, the magnitude of the impedance increases from one connector of the FPCB to the opposite connector due to the DC resistance of the conductive line.
  • Examples 2 to 4 to which the bridge is applied it can be seen that the uniformity of the impedance over the entire section is relatively higher than in Example 1.
  • the EMI shielding film layer corresponding to some of the conductive lines of the plurality of conductive lines of the FPCB, it is possible to increase the impedance of the FPCB while maintaining the thickness of the FPCB.
  • the EMI shielding film layer corresponding to some of the conductive lines of the plurality of conductive lines of the FPCB by partially cutting the EMI shielding film layer corresponding to some of the conductive lines of the plurality of conductive lines of the FPCB, while maintaining the impedance matching of the FPCB, increasing the width of the some conductive lines, As a result, the transmission performance of the FPCB can be improved.
  • the EMI shielding film layer corresponding to some of the conductive lines of the plurality of conductive lines of the FPCB is partially cut, and a cover film capable of additionally shielding electromagnetic interference (EMI) is disposed in the cut out portion
  • the noise leaking from the FPCB may reduce the performance of other electronic components of the electronic device. It can reduce the problem of lowering the
  • the problem of increasing the thickness of the electronic device can reduce

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Abstract

Selon un mode de réalisation de l'invention, un dispositif électronique comprend une pluralité de composants électroniques et une carte de circuit imprimé souple, qui connecte la pluralité de composants électroniques les uns aux autres et comprend (i) une couche centrale ayant une pluralité de lignes conductrices pour transférer de l'énergie ou des signaux entre la pluralité de composants électroniques, (ii) une couche isolante empilée sur la couche centrale, et (iii) une couche de film de protection, qui est empilée sur la couche isolante et réduit la fuite, vers l'extérieur, de bruit provoqué par le courant circulant dans la pluralité de lignes conductrices, la couche de film de protection pouvant comprendre une fente formée dans une région chevauchant au moins une ligne conductrice parmi la pluralité de lignes conductrices sur la base de la direction de l'épaisseur de la carte de circuit imprimé souple.
PCT/KR2021/095137 2021-01-08 2021-12-27 Dispositif électronique comprenant une carte de circuit imprimé souple Ceased WO2022149807A1 (fr)

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CN117062304A (zh) * 2023-10-10 2023-11-14 荣耀终端有限公司 电子设备及电子设备的制备方法
WO2025082150A1 (fr) * 2023-10-16 2025-04-24 荣耀终端股份有限公司 Carte de circuit imprimé flexible et dispositif électronique

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CN117062304A (zh) * 2023-10-10 2023-11-14 荣耀终端有限公司 电子设备及电子设备的制备方法
CN117062304B (zh) * 2023-10-10 2024-04-05 荣耀终端有限公司 电子设备及电子设备的制备方法
WO2025082150A1 (fr) * 2023-10-16 2025-04-24 荣耀终端股份有限公司 Carte de circuit imprimé flexible et dispositif électronique

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