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WO2022031225A1 - Système et procédé de mesure d'alignement de couplage de bord - Google Patents

Système et procédé de mesure d'alignement de couplage de bord Download PDF

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Publication number
WO2022031225A1
WO2022031225A1 PCT/SG2021/050441 SG2021050441W WO2022031225A1 WO 2022031225 A1 WO2022031225 A1 WO 2022031225A1 SG 2021050441 W SG2021050441 W SG 2021050441W WO 2022031225 A1 WO2022031225 A1 WO 2022031225A1
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Prior art keywords
shaped fiber
respect
light
entrance
edge coupling
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Ceased
Application number
PCT/SG2021/050441
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English (en)
Inventor
Tiong Leh YAP (Johnny)
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Compoundtek Pte Ltd
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Compoundtek Pte Ltd
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Publication date
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Priority to CN202190000696.1U priority Critical patent/CN220105336U/zh
Publication of WO2022031225A1 publication Critical patent/WO2022031225A1/fr
Anticipated expiration legal-status Critical
Ceased legal-status Critical Current

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    • G—PHYSICS
    • G02—OPTICS
    • G02B—OPTICAL ELEMENTS, SYSTEMS OR APPARATUS
    • G02B6/00—Light guides; Structural details of arrangements comprising light guides and other optical elements, e.g. couplings
    • G02B6/24—Coupling light guides
    • G02B6/26—Optical coupling means
    • G02B6/262—Optical details of coupling light into, or out of, or between fibre ends, e.g. special fibre end shapes or associated optical elements

Definitions

  • the disclosures made herein relate generally to the silicon photonics and more particularly to a system and method for measuring alignment of an edge coupling device of a die in a semiconductor wafer during manufacture of a silicon photonics integrated chip (PIC) device.
  • PIC silicon photonics integrated chip
  • Monolithically integrated photonic circuits are mainly used as optical data links in applications including high performance computing (HPC), inter-device interconnects and optical memory extension (OME). They are also very much useful as input/output means in mobile devices to enable data exchange between the mobile devices and a host device and/or cloud servers at a rapid rate which is not possible with wireless technology or electrical cables.
  • HPC high performance computing
  • OME optical memory extension
  • edge coupler alignment measurement of an edge coupler at wafer-level is nontrivial due to narrow trench widths ( ⁇ 100pm typically) available to access the edge coupler. Accurate and reliable measurements result helps to determine a known-good-die for further packaging into final product where the packaging cost are known to be expensive.
  • United States Patent No.: US 7,113,671 B2 discloses an optical coupling device for coupling light to a core of an optical waveguide device, wherein a surface of the coupling device is shaped as a lens to diffract and converge light received from a light source.
  • a conical or funnel-shaped waveguide further converges the light to a convergence point by means of single/multiple internal reflections. This device occupies a huge space, and therefore cannot be cost-effective nor efficient for optical coupling in narrow trenches.
  • Figure 5 shows a conventional way of alignment measurement, wherein a sharp lensed fiber (1) is inserted into the trench (3) inclined with respect to a waveguide of the edge coupler (2), such that a tip of the fiber (1) is close to an entrance of the waveguide.
  • This solution requires relatively large trench width (>200pm) to slant the sharp lens fiber at a reasonable angle (-20°).
  • the coupling loss is still very high (typically >8dB per facet) due to mismatch in mode field diameter (MFD).
  • the present invention relates to a system for measuring alignment of an edge coupling device of a die in a semiconductor wafer.
  • the system comprises one or more light sources, a shaped fiber selectively connectable to the light sources, a positioning device for positioning the shaped fiber with respect to the edge coupling device and a control unit for controlling the light sources and the positioning device.
  • the control unit is also capable of determining a displacement and/or a rotational angle of the shaped fiber with respect to an entrance of a waveguide in the edge coupling device.
  • a viewing device is used for identifying a position of the shaped fiber with respect to the edge coupling device.
  • the shaped fiber is configured to change a direction of light propagating through the shaped fiber, more preferably at an angle of 90° with respect to an axis of the shaped fiber.
  • a light sensor is used for measuring intensity of light received at the entrance of the waveguide, the control unit automatically controls the positioning device based on the measured light intensity.
  • the present invention also relates to a method for measuring alignment of an edge coupling device of a die in a semiconductor wafer.
  • the method comprises the steps of: positioning a shaped fiber at a first position and a first angle with respect to an entrance of a waveguide in the edge coupling device, aligning the shaped fiber with respect to the entrance of the edge coupling device (120) and measuring alignment of the edge coupling device.
  • a position of the shaped fiber with respect to the entrance of the waveguide is continuously monitored through a viewing device. After aligning, the shaped fiber is at a second position and/or second angle with respect to the entrance of the waveguide.
  • the aligning step includes connecting the shaped fiber to a light source for passing light rays through the shaped fiber, coarsely aligning the shaped fiber with respect to the entrance of the waveguide, replacing the light source with a laser source for passing a laser light through the shaped fiber and finely aligning the shaped fiber with respect to the entrance of the waveguide.
  • the shaped fiber is configured to change a direction of light propagating through the shaped fiber, preferably at an angle of 90° with respect to an axis of the shaped fiber.
  • the shaped fiber is positioned at the first position and the first angle by detecting a position mark indicating a position of a trench of the edge coupling device and then inserting the shaped fiber into the trench, such that said shaped fiber is positioned at the first position and the first angle.
  • the position marker is formed on the die during manufacture.
  • the coarsely aligning step includes adjusting an angle and/or a distance of the shaped fiber with respect to the entrance of the waveguide, such that a difference between a cross sectional area/width of the entrance and a cross sectional area/width of a light beam exiting the shaped fiber is within a predetermined range.
  • the finely aligning step includes adjusting a position of the shaped fiber with respect to the entrance, such that an intensity of a light beam received at the entrance reaches a maximum level.
  • the alignment of the edge coupling device is measured by determining a displacement and/or an angle of rotation undergone by the shaped fiber during the aligning step.
  • the shaped fiber can change the light direction, the shaped fiber can be easily inserted into narrow trenches, while maximizing the optical coupling efficiency. Therefore, a need for wider trench for optimal coupling is avoided, and thus minimizing a size of the edge coupling device, which in turn increase a number of dies in a single semiconductor wafer. Furthermore, the present invention maximizes the optical coupling, and thus provides accurate measurement of alignment of the edge coupling device at wafer level, which in turn helps in determining a known-good-die for further packaging into a final product and avoiding moving damaged or faulty dies into the final product.
  • Figure 1 shows a schematic representation of the system for measuring alignment of an edge coupling device of a die in a semiconductor wafer, in accordance with an exemplary embodiment of the present invention
  • Figure 2 shows a schematic representation of a shaped fiber inserted into a trench of an edge coupling device during coarse alignment, in accordance with an exemplary embodiment of the present invention
  • Figure 3 shows a schematic representation of a shaped fiber inserted into a trench of an edge coupling device during fine alignment, in accordance with an exemplary embodiment of the present invention
  • Figure 4 shows a flow diagram of the method for fabricating the device, in accordance with the first embodiment of the present invention
  • Figure 5 shows a schematic representation of a sharp lens fiber inserted into a trench of an edge coupling device during alignment, in accordance with a conventional embodiment of the present invention
  • Figure 6 shows a schematic representation of a shaped fiber inserted into a slanted trench of an edge coupling device, in accordance with an exemplary embodiment of the present invention.
  • the present invention relates to a system and method for measuring alignment of an edge coupling device of a die in a semiconductor wafer during manufacture of a silicon photonic integrated chip (PIC) device.
  • the present invention includes a shaped fiber configured at to change a direction of light inputted into the shaped fiber at an angle of 90° with respect to an axis of the shaped fiber. Since the shaped fiber can change the light direction at an angle of 90°, the shaped fiber can be inserted vertically into a trench in the edge coupling device, while maximizing the optical coupling with a horizontal waveguide of the edge coupling device.
  • the present invention maximizes the optical coupling, and thus provides accurate measurement of alignment of the edge coupling device at wafer level, which in turn helps in determining a known- good-die for further packaging into a final product and avoiding moving damaged or faulty dies into the final product.
  • Figure 1 shows a schematic representation of a system for measuring alignment of an edge coupling device of a die in a semiconductor wafer, in accordance with an exemplary embodiment of the present invention.
  • the system (10) comprises one or more light sources (11), a shaped fiber (12), a positioning device (13), a control unit (14) and a viewing device (15).
  • the system (10) include a support means (not shown) for supporting a semiconductor wafer including multiple dies, wherein each die may include an edge coupling device (20) or an array of edge coupling devices to be tested for alignment thereof.
  • the system (10) also includes a power module (not shown) connected to a power source such as AC mains, battery and/or generator, for supplying power to the component of the system (10).
  • the edge coupling device (20) includes one or more trenches (21) and one or more waveguides (22), wherein an entrance (23) of each waveguide (22) is formed on a wall of the corresponding trench (21).
  • the waveguides (22) are parallel to a top surface of the edge coupling device (20).
  • one or more waveguides (22) may be inclined with respect to the top surface of the edge coupling device (20) according to specific requirements of the silicon PIC device.
  • the entrance (23) of each waveguide may be parallel or inclined to the wall of the corresponding trench (21).
  • the shaped fiber (12) is configured to change a direction of light propagating through the shaped fiber (12).
  • the shaped fiber (12) is configured to change a direction of light inputted into the shaped fiber (12) at an angle of 90° with respect to an axis of the shaped fiber (12).
  • the shaped fiber (12) may also be configured to change the light direction at an acute angle or at an obtuse angle according to specific requirement of construction of a slanted trench (21), as shown in Figure 6, wherein a light beam exiting the shaped fiber (12) is parallel to an axis of the waveguide (22).
  • the shaped fiber (12) includes a lens such as ball lens, capable of converging light rays, wherein the lens is formed with a flat surface, which is polished to reflect any light ray incident on the flat surface.
  • the flat surface is coated with a reflective coating such as silver coating, for reflecting the light rays.
  • An angle of inclination of the flat surface with respect to the axis of the shaped fiber determines the angle of change in direction of the propagating light.
  • the flat surface is angled with respect to the axis of the shaped fiber (12), such that when light rays propagating therethrough are incident on the flat surface, the light rays are reflected at 90° with respect to the axis of the shaped fiber (12) and are converged by the lens as they exit the shaped fiber (12).
  • the light sources (11) include a laser source and a visible light source selectively connectable to the shaped fiber (12) by means of any conventional coupling device e.g. optical switch.
  • the visible light source is connected to the shaped fiber (12) while coarsely aligning the shaped fiber (12) with respect to the entrance (23) of the waveguide
  • the laser source is connected to the shaped fiber (12) while finely aligning the shaped fiber (12) with respect to the entrance (23).
  • the viewing device (15) is used for identifying a position of the shaped fiber (12) with respect to the edge coupling device (20). Furthermore, the viewing device (15) is used for detecting a position marker indicating a position of the trench (21) of the edge coupling device (20) in the die.
  • the die is formed with the position marker during manufacture by means of etching or any other conventional means of marking. Before initiating coarse alignment, the position marker is detected using the viewing device (15) and then the shaped fiber is inserted into the trench (21), such that the shaped fiber (12) is positioned at a first position and a first angle with respect to the position marker.
  • the viewing device (15) is an optical viewing device such as microscope, camera-display combination or any other device capable of magnifying the trench (21) to be visible to a manual operator operating the positioning device (13).
  • the shaped fiber (12) is inclined with respect to the waveguide (22) and inserted into the trench (21), as shown in Figure 2.
  • an angle and/or distance of the shaped fiber (12) with respect to the entrance (23) is adjusted using the positioning device (13), such that a difference between a width of a light beam exiting the shaped fiber (12) and a width of the entrance (23) is within a predetermined range.
  • the difference is within a range of -5 to 5 microns.
  • the shaped fiber (12) is moved and/or rotated with respect to the edge coupling device (20), such that the light beam exiting the shaped fiber (12) and the waveguide (22) are made coaxial to one another.
  • the positioning device (13) is one or more robotic arms or any other mechanical mechanism capable of moving and/or rotating the shaped fiber (12) with respect to the edge coupling device (20), according to one or more commands received from the manual operator through the control unit (14).
  • the control unit (14) includes an input device such as keyboard, joystick, touchscreen, etc., for inputting the commands by the operator. For example, the operator views through the viewing device (15) and inputs the commands accordingly for positioning the shaped fiber (12).
  • the system (10) may operate in an automated mode, wherein the control unit (14) includes one or more microcontrollers configured to automatically control the positioning device (13) based on inputs from one or more sensors (not shown).
  • the control unit (14) may receiving inputs from an imaging sensor capturing still or video images of the entrance (23) and the light beam incident on the entrance (23) to calculate the width difference and control the positioning device (13) accordingly.
  • the control unit (14) is capable of controlling the light sources (11).
  • the light sources (11) include a single laser source controlled by the control unit (14) for the coarse alignment as well as for the fine alignment.
  • the positioning device (13) is controlled manually or automatically for finely aligning the shaped fiber (12) with respect to the entrance (23).
  • the laser source is optically coupled to the shaped fiber (12).
  • the system (10) includes a light sensor (24, shown in Figure 3) such as photodiode, coupled to the waveguide (22) for measuring intensity of light received at the entrance (23) of the waveguide (22), wherein the measured light intensity is displayed using a display device such as an LCD screen.
  • the positioning device (13) is controlled for finely aligning the shaped fiber (12) until the measured light intensity reaches a maximum level.
  • the control unit (14) receives the measured light intensity for automatically controlling the positioning device (13) for fine alignment of the shape fiber (12) until the measured light intensity reaches the maximum level.
  • the control unit (14) marks a position and angle of the shaped fiber (12) with respect to the position marker as a second position and a second angle.
  • the control unit (14) determines a displacement and/or a rotational angle of the shaped fiber (12) with respect to the entrance (23) of the waveguide (22) from the difference between the first position and first angle and the second position and second angle.
  • the control unit (14) determines the displacement and/or angle of rotation between the first position and first angle and the second position and second angle as a measurement of the alignment of the edge coupling device (20). This alignment measurement is stored and utilized for easy and quick identification of an alignment of the edge coupling devices in each die with respect to the position marker, during further processing of the die, for example testing of the edge coupling devices.
  • the present invention includes the shaped fiber (12) capable of changing direction of inputted light, it is possible to insert the shaped fiber into narrow trenches ( ⁇ 100pm) for alignment measurement of the edge coupling device at wafer-level in a simple and cost effective manner without compromising on the coupling efficiency and without a need for high-end sophisticated arrangements. Therefore, a need for wider trench for optimal coupling is avoided, and thus minimizing a size of the edge coupling device, which in turn increases a number of dies in a single semiconductor wafer and minimizes the cost of manufacture.
  • FIG. 4 shows a flow diagram of the method for measuring alignment of an edge coupling device of a die in a semiconductor wafer, in accordance with an exemplary embodiment of the present invention.
  • the method (100) comprises the steps of: (a) positioning at least one shaped fiber at a first position with respect to an entrance of a waveguide in the edge coupling device (110), aligning the shaped fiber with respect to the entrance (120) and measuring alignment of the edge coupling device (130). Preferably, a position of the shaped fiber with respect the entrance is continuously monitored through a viewing device during the aligning step.
  • the aligning step includes a coarse aligning step and a fine aligning step.
  • the coarse aligning step the shaped fiber is connected to a visible light source for passing light rays through the shaped fiber and then coarsely aligning the shaped fiber with respect to the entrance of the waveguide.
  • the fine aligning step the visible light source is replaced with a laser source for passing laser light through the shaped fiber and the shaped fiber is finely aligned with respect to the entrance of the waveguide.
  • the shaped fiber Before initiating the coarse aligning step, the shaped fiber is positioned with respect to the entrance of the waveguide by detecting a position marker formed on a surface of the die including the edge coupling device using a viewing device and then inserting the shaped fiber into a trench, such that the shaped fiber is at a first position and a first angle with respect to the position marker.
  • the first position and the first angle are determined by a control unit used for controlling a positioning device that is capable of moving and/or rotating the shaped fiber with respect to the edge coupling device.
  • the shaped fiber is configured to change a direction of light propagating through the shaped fiber.
  • the shaped fiber is configured at to change a direction of light inputted into the shaped fiber at an angle of 90° with respect to an axis of the shaped fiber.
  • the shaped fiber may also be configured to change the light direction at an acute angle or at an obtuse angle according to specific requirement of construction of the trench, as shown in Figure 6.
  • the shaped fiber includes a lens such as ball lens, capable of converging light rays, wherein the lens is formed with a flat surface, which is polished to reflect any light ray incident on the flat surface.
  • the flat surface is coated with a reflective coating such as silver coating, for reflecting the light rays.
  • An angle of inclination of the flat surface with respect to the axis of the shaped fiber determines the angle of change in direction of the propagating light.
  • the flat surface is angled with respect to the axis of the shaped fiber, such that when light rays propagating therethrough are incident on the flat surface, the light rays are reflected at 90° with respect to the axis of the shaped fiber and are converged by the lens as they exit the shaped fiber.
  • the coarse aligning step is initiated, wherein the positioning device is operated for adjusting an angle and/or a distance of the shaped fiber with respect to the entrance of the edge coupling device.
  • the angle and/or the distance of the shaped fiber is adjusted until a difference between a width of the entrance of the waveguide and a width of a light beam exiting the shaped fiber is within a predetermined range, preferably -5 to +5 pm.
  • the shaped fiber is coarsely aligned to make the light beam coaxial to the waveguide.
  • the positioning device is controlled manually or automatically for finely aligning the shaped fiber with respect to the entrance.
  • the laser source is optically coupled to the shaped fiber to pass a laser light beam to the waveguide and intensity of light received at the entrance of the waveguide is measured.
  • light sensor such as photodiode
  • the positioning device is controlled for finely aligning the shaped fiber until the measured light intensity reaches a maximum level.
  • the control unit receives the measured light intensity for automatically controlling the positioning device for fine alignment of the shape fiber until the measured light intensity reaches the maximum level.
  • a position and angle of the shaped fiber with respect to the position marker are identified by the control unit as a second position and a second angle. Furthermore, a displacement and/or a rotational angle of the shaped fiber with respect to the entrance of the waveguide is determined by the control unit by calculating a difference between the first position and first angle and the second position and second angle, respectively.
  • the displacement and/or angle of rotation undergone by the shaped fiber from the first position and the first angle to the second position and the second angle is determined as a measurement of the alignment of the edge coupling device with respect to the position marker.
  • This alignment measurement is stored and utilized for easy and quick identification of an alignment of the edge coupling devices in each die with respect to the position marker, during further processing of the die, for example testing of the edge coupling devices.
  • the present invention includes the shaped fiber capable of changing direction of inputted light, it is possible to insert the shaped fiber into narrow trenches ( ⁇ 100pm) for alignment measurement of the edge coupling device at wafer-level in a simple and cost effective manner without compromising on the coupling efficiency and without a need for high-end sophisticated arrangements. Therefore, a need for wider trench for optimal coupling is avoided, and thus minimizing a size of the edge coupling device, which in turn increases a number of dies in a single semiconductor wafer and minimizes the cost of manufacture.
  • the present invention maximizes the optical coupling as the light beam is made to enter the waveguide in parallel, and thus provides accurate measurement of alignment of the edge coupling device at wafer level, which in turn helps in determining a known-good-die for further packaging into a final product and avoiding moving damaged or faulty dies into the final product.
  • the present invention is applied for measuring alignment of the edge coupling device that is formed as a passive device receiving light signals
  • the present invention may also be applied for measuring alignment of an active device such as edge emitting diode, wherein a direction of light propagation is opposite to the light direction as described in the above embodiments.

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  • Physics & Mathematics (AREA)
  • General Physics & Mathematics (AREA)
  • Optics & Photonics (AREA)
  • Optical Couplings Of Light Guides (AREA)

Abstract

La présente invention concerne un système (10) pour mesurer l'alignement d'un dispositif de couplage de bord (20) d'une puce dans un semi-conducteur étagé. Le système (10) comprend une ou plusieurs source(s) lumineuse(s) (11), une ou plusieurs fibre(s) profilée(s) (12), un dispositif de positionnement (13), une unité de commande (14) et un dispositif de visualisation (15). La fibre profilée (12) peut être connectée sélectivement aux sources lumineuses (11), et le dispositif de positionnement (13) est capable de positionner la fibre profilée (12) par rapport au dispositif de couplage de bord (20). L'unité de commande (14) commande les sources de lumineuses (11) et le dispositif de positionnement (13) et détermine un déplacement et un angle de rotation de la fibre profilée (12) par rapport à une entrée (23) d'un guide d'ondes (22) dans le dispositif de couplage de bord (20). L'invention concerne également un procédé de mesure d'alignement du dispositif de couplage de bord.
PCT/SG2021/050441 2020-08-07 2021-07-29 Système et procédé de mesure d'alignement de couplage de bord Ceased WO2022031225A1 (fr)

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CN202190000696.1U CN220105336U (zh) 2020-08-07 2021-07-29 用于测量半导体晶圆中裸片的边缘耦合设备对准的系统

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SG10202007589X 2020-08-07
SG10202007589X 2020-08-07

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CN120629900A (zh) * 2025-08-06 2025-09-12 苏州联讯仪器股份有限公司 一种硅光晶圆测试方法及一种硅光晶圆测试装置

Citations (5)

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US7378861B1 (en) * 2003-04-07 2008-05-27 Luxtera, Inc. Optical alignment loops for the wafer-level testing of optical and optoelectronic chips
WO2015126905A2 (fr) * 2014-02-18 2015-08-27 3M Innovative Properties Company Ferrule optique et connecteur
US20190179078A1 (en) * 2017-11-03 2019-06-13 Pacific Biosciences Of California, Inc. Systems, devices, and methods for improved optical waveguide transmission and alignment
US20200033533A1 (en) * 2018-07-24 2020-01-30 Elenion Technologies, Llc On-wafer testing of photonic chips
US20200124638A1 (en) * 2018-10-18 2020-04-23 International Business Machines Corporation Structure and methodology for determining test pad integrity

Patent Citations (5)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US7378861B1 (en) * 2003-04-07 2008-05-27 Luxtera, Inc. Optical alignment loops for the wafer-level testing of optical and optoelectronic chips
WO2015126905A2 (fr) * 2014-02-18 2015-08-27 3M Innovative Properties Company Ferrule optique et connecteur
US20190179078A1 (en) * 2017-11-03 2019-06-13 Pacific Biosciences Of California, Inc. Systems, devices, and methods for improved optical waveguide transmission and alignment
US20200033533A1 (en) * 2018-07-24 2020-01-30 Elenion Technologies, Llc On-wafer testing of photonic chips
US20200124638A1 (en) * 2018-10-18 2020-04-23 International Business Machines Corporation Structure and methodology for determining test pad integrity

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