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WO2022091999A1 - Dispositif électronique transparent, verre feuilleté et procédé de production d'un dispositif électronique transparent - Google Patents

Dispositif électronique transparent, verre feuilleté et procédé de production d'un dispositif électronique transparent Download PDF

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Publication number
WO2022091999A1
WO2022091999A1 PCT/JP2021/039226 JP2021039226W WO2022091999A1 WO 2022091999 A1 WO2022091999 A1 WO 2022091999A1 JP 2021039226 W JP2021039226 W JP 2021039226W WO 2022091999 A1 WO2022091999 A1 WO 2022091999A1
Authority
WO
WIPO (PCT)
Prior art keywords
insulating base
transparent
base material
transparent insulating
wiring
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Ceased
Application number
PCT/JP2021/039226
Other languages
English (en)
Japanese (ja)
Inventor
将英 古賀
幸宏 垰
玲美 川上
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
AGC Inc
Original Assignee
Asahi Glass Co Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Asahi Glass Co Ltd filed Critical Asahi Glass Co Ltd
Priority to CN202180071935.7A priority Critical patent/CN116507597A/zh
Priority to JP2022559108A priority patent/JP7719338B2/ja
Publication of WO2022091999A1 publication Critical patent/WO2022091999A1/fr
Priority to US18/302,864 priority patent/US20230261164A1/en
Anticipated expiration legal-status Critical
Ceased legal-status Critical Current

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    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B32—LAYERED PRODUCTS
    • B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
    • B32B1/00—Layered products having a non-planar shape
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B32—LAYERED PRODUCTS
    • B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
    • B32B17/00—Layered products essentially comprising sheet glass, or glass, slag, or like fibres
    • B32B17/06—Layered products essentially comprising sheet glass, or glass, slag, or like fibres comprising glass as the main or only constituent of a layer, next to another layer of a specific material
    • B32B17/10—Layered products essentially comprising sheet glass, or glass, slag, or like fibres comprising glass as the main or only constituent of a layer, next to another layer of a specific material of synthetic resin
    • B32B17/10005—Layered products essentially comprising sheet glass, or glass, slag, or like fibres comprising glass as the main or only constituent of a layer, next to another layer of a specific material of synthetic resin laminated safety glass or glazing
    • B32B17/10009—Layered products essentially comprising sheet glass, or glass, slag, or like fibres comprising glass as the main or only constituent of a layer, next to another layer of a specific material of synthetic resin laminated safety glass or glazing characterized by the number, the constitution or treatment of glass sheets
    • B32B17/10036—Layered products essentially comprising sheet glass, or glass, slag, or like fibres comprising glass as the main or only constituent of a layer, next to another layer of a specific material of synthetic resin laminated safety glass or glazing characterized by the number, the constitution or treatment of glass sheets comprising two outer glass sheets
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B32—LAYERED PRODUCTS
    • B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
    • B32B17/00—Layered products essentially comprising sheet glass, or glass, slag, or like fibres
    • B32B17/06—Layered products essentially comprising sheet glass, or glass, slag, or like fibres comprising glass as the main or only constituent of a layer, next to another layer of a specific material
    • B32B17/10—Layered products essentially comprising sheet glass, or glass, slag, or like fibres comprising glass as the main or only constituent of a layer, next to another layer of a specific material of synthetic resin
    • B32B17/10005—Layered products essentially comprising sheet glass, or glass, slag, or like fibres comprising glass as the main or only constituent of a layer, next to another layer of a specific material of synthetic resin laminated safety glass or glazing
    • B32B17/10165—Functional features of the laminated safety glass or glazing
    • B32B17/10293—Edge features, e.g. inserts or holes
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B32—LAYERED PRODUCTS
    • B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
    • B32B17/00—Layered products essentially comprising sheet glass, or glass, slag, or like fibres
    • B32B17/06—Layered products essentially comprising sheet glass, or glass, slag, or like fibres comprising glass as the main or only constituent of a layer, next to another layer of a specific material
    • B32B17/10—Layered products essentially comprising sheet glass, or glass, slag, or like fibres comprising glass as the main or only constituent of a layer, next to another layer of a specific material of synthetic resin
    • B32B17/10005—Layered products essentially comprising sheet glass, or glass, slag, or like fibres comprising glass as the main or only constituent of a layer, next to another layer of a specific material of synthetic resin laminated safety glass or glazing
    • B32B17/10165—Functional features of the laminated safety glass or glazing
    • B32B17/10339—Specific parts of the laminated safety glass or glazing being colored or tinted
    • B32B17/10348—Specific parts of the laminated safety glass or glazing being colored or tinted comprising an obscuration band
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B32—LAYERED PRODUCTS
    • B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
    • B32B17/00—Layered products essentially comprising sheet glass, or glass, slag, or like fibres
    • B32B17/06—Layered products essentially comprising sheet glass, or glass, slag, or like fibres comprising glass as the main or only constituent of a layer, next to another layer of a specific material
    • B32B17/10—Layered products essentially comprising sheet glass, or glass, slag, or like fibres comprising glass as the main or only constituent of a layer, next to another layer of a specific material of synthetic resin
    • B32B17/10005—Layered products essentially comprising sheet glass, or glass, slag, or like fibres comprising glass as the main or only constituent of a layer, next to another layer of a specific material of synthetic resin laminated safety glass or glazing
    • B32B17/10165—Functional features of the laminated safety glass or glazing
    • B32B17/10541—Functional features of the laminated safety glass or glazing comprising a light source or a light guide
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B60—VEHICLES IN GENERAL
    • B60J—WINDOWS, WINDSCREENS, NON-FIXED ROOFS, DOORS, OR SIMILAR DEVICES FOR VEHICLES; REMOVABLE EXTERNAL PROTECTIVE COVERINGS SPECIALLY ADAPTED FOR VEHICLES
    • B60J1/00—Windows; Windscreens; Accessories therefor
    • G—PHYSICS
    • G09—EDUCATION; CRYPTOGRAPHY; DISPLAY; ADVERTISING; SEALS
    • G09F—DISPLAYING; ADVERTISING; SIGNS; LABELS OR NAME-PLATES; SEALS
    • G09F9/00—Indicating arrangements for variable information in which the information is built-up on a support by selection or combination of individual elements
    • G—PHYSICS
    • G09—EDUCATION; CRYPTOGRAPHY; DISPLAY; ADVERTISING; SEALS
    • G09F—DISPLAYING; ADVERTISING; SIGNS; LABELS OR NAME-PLATES; SEALS
    • G09F9/00—Indicating arrangements for variable information in which the information is built-up on a support by selection or combination of individual elements
    • G09F9/30—Indicating arrangements for variable information in which the information is built-up on a support by selection or combination of individual elements in which the desired character or characters are formed by combining individual elements
    • G—PHYSICS
    • G09—EDUCATION; CRYPTOGRAPHY; DISPLAY; ADVERTISING; SEALS
    • G09F—DISPLAYING; ADVERTISING; SIGNS; LABELS OR NAME-PLATES; SEALS
    • G09F9/00—Indicating arrangements for variable information in which the information is built-up on a support by selection or combination of individual elements
    • G09F9/30—Indicating arrangements for variable information in which the information is built-up on a support by selection or combination of individual elements in which the desired character or characters are formed by combining individual elements
    • G09F9/33—Indicating arrangements for variable information in which the information is built-up on a support by selection or combination of individual elements in which the desired character or characters are formed by combining individual elements being semiconductor devices, e.g. diodes
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L25/00—Assemblies consisting of a plurality of semiconductor or other solid state devices
    • H01L25/03—Assemblies consisting of a plurality of semiconductor or other solid state devices all the devices being of a type provided for in a single subclass of subclasses H10B, H10D, H10F, H10H, H10K or H10N, e.g. assemblies of rectifier diodes
    • H01L25/04—Assemblies consisting of a plurality of semiconductor or other solid state devices all the devices being of a type provided for in a single subclass of subclasses H10B, H10D, H10F, H10H, H10K or H10N, e.g. assemblies of rectifier diodes the devices not having separate containers
    • H01L25/075—Assemblies consisting of a plurality of semiconductor or other solid state devices all the devices being of a type provided for in a single subclass of subclasses H10B, H10D, H10F, H10H, H10K or H10N, e.g. assemblies of rectifier diodes the devices not having separate containers the devices being of a type provided for in group H10H20/00
    • H01L25/0753—Assemblies consisting of a plurality of semiconductor or other solid state devices all the devices being of a type provided for in a single subclass of subclasses H10B, H10D, H10F, H10H, H10K or H10N, e.g. assemblies of rectifier diodes the devices not having separate containers the devices being of a type provided for in group H10H20/00 the devices being arranged next to each other
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B32—LAYERED PRODUCTS
    • B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
    • B32B2250/00—Layers arrangement
    • B32B2250/02—2 layers
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B32—LAYERED PRODUCTS
    • B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
    • B32B2307/00—Properties of the layers or laminate
    • B32B2307/70—Other properties
    • B32B2307/732—Dimensional properties
    • B32B2307/737—Dimensions, e.g. volume or area
    • B32B2307/7375—Linear, e.g. length, distance or width
    • B32B2307/7376—Thickness
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B32—LAYERED PRODUCTS
    • B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
    • B32B2457/00—Electrical equipment
    • B32B2457/20—Displays, e.g. liquid crystal displays, plasma displays
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B32—LAYERED PRODUCTS
    • B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
    • B32B2605/00—Vehicles
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10H—INORGANIC LIGHT-EMITTING SEMICONDUCTOR DEVICES HAVING POTENTIAL BARRIERS
    • H10H20/00—Individual inorganic light-emitting semiconductor devices having potential barriers, e.g. light-emitting diodes [LED]
    • H10H20/01—Manufacture or treatment
    • H10H20/036—Manufacture or treatment of packages
    • H10H20/0364—Manufacture or treatment of packages of interconnections
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10H—INORGANIC LIGHT-EMITTING SEMICONDUCTOR DEVICES HAVING POTENTIAL BARRIERS
    • H10H20/00—Individual inorganic light-emitting semiconductor devices having potential barriers, e.g. light-emitting diodes [LED]
    • H10H20/80—Constructional details
    • H10H20/85—Packages
    • H10H20/857—Interconnections, e.g. lead-frames, bond wires or solder balls

Definitions

  • the present invention relates to a transparent electronic device, a laminated glass, and a method for manufacturing a transparent electronic device.
  • a transparent display device using a fine light emitting diode (LED) element formed on a transparent insulating base material as a pixel. Since such a transparent display device can visually recognize the back side through the transparent display device, it is provided on a transparent member such as a window or a partition of a vehicle or a building.
  • a transparent sensing device in which a microsensor is provided on a transparent insulating base material is known.
  • an electronic device such as a transparent display device or a transparent sensing device in which an electronic element is formed on a transparent insulating base material and the back side can be visually recognized is referred to as a "transparent electronic device”.
  • the inventors have found the following problems with respect to such a transparent electronic device. Since the feeding body (for example, a flexible wiring board) for supplying power to the transparent electronic device is opaque, it is connected to the edge of the transparent electronic device. Therefore, depending on the arrangement position of the electronic element in the transparent member such as a window, the routing distance of the fine wiring connecting the electronic element and the feeding element increases (that is, the transparent electronic device has a large area), and the yield of the transparent electronic device increases. There was a problem of decline.
  • the feeding body for example, a flexible wiring board
  • the present invention provides a transparent electronic device having the following configuration [1].
  • a transparent insulating base material An electronic device formed on the main surface of the transparent insulating base material and having an area of 250,000 ⁇ m 2 or less, An opaque power supply body that supplies power to the electronic element is provided.
  • the electronic element is a light emitting diode element or a sensor.
  • the transparent insulating base material is A first transparent insulating base material in which the electronic element and a first wiring connected to the electronic element are formed on one main surface.
  • a second transparent insulating substrate on which a second wiring is formed is included on one main surface. In the second transparent insulating base material, the electronic element is not formed, and the electronic element is not formed.
  • One end of the first wiring and one end of the second wiring are electrically connected, and at the edge of the second transparent insulating base material, the opaque power supply is supplied to the other end of the second wiring.
  • the body is connected, Transparent electronic device.
  • the first transparent insulating base material and the second transparent insulating base material overlap in a plan view, and in the overlapping portion between the first transparent insulating base material and the second transparent insulating base material.
  • the one main surface of the first transparent insulating base material and the one main surface of the second transparent insulating base material face each other and overlap in a plan view, [2] or.
  • the transparent electronic device according to any one of [1] to [8] is sandwiched between the first and second interlayer films. Laminated glass.
  • At least one of the first and second wirings is formed to be wide and an opaque opaque wiring region is formed on the peripheral edge of the transparent electronic device, and the opaque wiring region is formed with the shielding layer.
  • the laminated glass according to [10] which is installed in an overlapping manner in a plan view.
  • the laminated glass is for a vehicle, and the thickness of the glass plate located on the outside of the vehicle is 1.5 mm to 3.0 mm among the pair of glass plates [9] to [16]. Laminated glass according to any one of the above.
  • the peripheral edge of the first transparent insulating base material is defined in the annex "Test area for optical properties and light resistance of safety glass” of JIS standard R3212: 2015 (safety glass test method for automobiles).
  • the laminated glass according to any one of [9] to [17], which does not overlap with "test area A" in a plan view.
  • the peripheral edge of the second transparent insulating base material is defined in the annex "Test area for optical properties and light resistance of safety glass” of JIS standard R3212: 2015 (safety glass test method for automobiles).
  • the laminated glass according to any one of [9] to [18], which does not overlap with "test area A" in a plan view.
  • the present invention provides a method for manufacturing a transparent electronic device having the following configuration [20].
  • An electronic element having an area of 250,000 ⁇ m 2 or less and a first wiring connected to the electronic element are formed on one main surface of the first transparent insulating base material.
  • a second wiring is formed on one main surface of the second transparent insulating base material without forming the electronic element.
  • One end of the first wiring and one end of the second wiring are electrically connected to the electronic element at the other end of the second wiring at the edge of the second transparent insulating base material. Connect the opaque power supply to supply power, Manufacturing method for transparent electronic devices.
  • FIG. 3 is a cross-sectional view taken along the line II-II in FIG. It is a schematic partial plan view which shows an example of a display area 101.
  • FIG. 3 is a cross-sectional view taken along the line IV-IV in FIG.
  • It is sectional drawing which shows an example of the manufacturing method of the transparent display device which concerns on 1st Embodiment. It is sectional drawing which shows an example of the manufacturing method of the transparent display device which concerns on 1st Embodiment. It is sectional drawing which shows an example of the manufacturing method of the transparent display device which concerns on 1st Embodiment. It is sectional drawing which shows an example of the manufacturing method of the transparent display device which concerns on 1st Embodiment.
  • FIG. 17 is a cross-sectional view taken along the line XVIII-XVIII in FIG. It is a schematic cross-sectional view which shows another example of the laminated glass which concerns on 2nd Embodiment.
  • the "transparent display device” refers to a display device in which visual information such as a person or a background located on the back side of the display device can be visually recognized under a desired usage environment. Note that visibility is determined at least when the display device is in a non-display state, that is, in a state where it is not energized.
  • the "transparent sensing device” refers to a sensing member that can visually recognize visual information such as a person and a background located on the back side of the sensing device under a desired usage environment.
  • the “sensing device” refers to a device capable of acquiring various information by using a sensor.
  • transparent means that the transmittance of visible light is 40% or more, preferably 60% or more, and more preferably 70% or more. Further, it may indicate that the transmittance is 5% or more and the haze value is 10 or less. When the transmittance is 5% or more, when the outside is seen from the room during the daytime, the outside can be seen with the same or higher brightness as the room, and sufficient visibility can be ensured.
  • the transmittance when the transmittance is 40% or more, the back side of the transparent display device can be visually recognized without any problem even if the brightness of the front side and the back side of the transparent display device is about the same. Further, when the haze value is 10 or less, sufficient background contrast can be secured.
  • transparent means whether or not a color is applied, that is, it may be colorless and transparent, or it may be colored and transparent.
  • the transmittance refers to a value (%) measured by a method conforming to ISO9050.
  • the haze value refers to a value measured by a method conforming to ISO 14782.
  • FIG. 1 is a schematic plan view showing an example of the transparent display device according to the first embodiment.
  • FIG. 2 is a cross-sectional view taken along the line II-II in FIG.
  • the transparent display device is an aspect of a transparent electronic device.
  • the right-handed xyz orthogonal coordinates shown in FIG. 1 and other figures are for convenience to explain the positional relationship of the components. Normally, the z-axis positive direction is vertically upward, and the xy plane is a horizontal plane, which is common between drawings.
  • the transparent display device 100 includes transparent insulating base materials 10a and 10b, and a flexible wiring board 60.
  • the transparent display device 100 includes a display area 101.
  • the display area 101 is an area composed of a plurality of pixels PIX and in which an image is displayed.
  • the image includes characters.
  • each pixel PIX includes at least one light emitting diode element (hereinafter, LED element). That is, the transparent display device according to the present embodiment is a display device that uses a fine LED element for each pixel, and is called an LED display or the like. No LED element is formed in the non-display area other than the display area 101.
  • An organic EL (Organic Electro-Luminescence) display and an inorganic EL (Inorganic Electro-Luminescence) display are also included in the LED display provided with the LED element.
  • the transparent insulating base material 10a (first transparent insulating base material) includes a display area 101, and a wiring 40 and an LED element connected to the wiring 40 are formed on one main surface of the transparent insulating base material 10a.
  • the LED element is an example of a fine electronic element having an area of 250,000 ⁇ m 2 or less.
  • the transparent insulating base material (second transparent insulating base material) 10b does not include the display area 101, and the wiring 40 is formed on one main surface of the transparent insulating base material 10b, and the LED element is not formed. .. Further, the LED element is not formed on the other main surface of the transparent insulating base material 10b.
  • the transparent insulating base material 10a includes the entire display area 101, and the transparent insulating base material 10b does not include the display area 101. Further, only the wiring 40 is formed on the transparent insulating base material 10b. However, in the transparent insulating base material 10b, in addition to the wiring 40, only an electronic element other than the LED element and the sensor described later may be formed.
  • the wiring 40 shown linearly in FIG. 1 extends in the x-axis direction and the y-axis direction.
  • the wiring 40 extended in the x-axis direction has a wide width at the end on the positive side of the x-axis of the transparent insulating base materials 10a and 10b, and is extended in the negative direction of the y-axis and connected to the flexible wiring board 60. There is. That is, in the wiring 40, at least a part of the portion extending in the negative direction of the y-axis is thicker than the portion extending in the x-axis direction.
  • the wiring 40 extending in the y-axis direction has a wide width at the end on the negative side of the y-axis of the transparent insulating base material 10b, and is connected to the flexible wiring board 60. That is, in the portion of the wiring 40 extending in the y-axis direction, the width at one end in the negative direction of the y-axis is thicker than that at one end in the positive direction of the y-axis.
  • an opaque region in which the wiring 40 is formed in a wide width is schematically shown as an opaque wiring region 40a.
  • the thick wiring 40 is provided as a dense wiring group. Therefore, it can be said that at least a part of the portion of the wiring 40 extended to the opaque wiring region 40a is thicker than the portion extended to the display area 101.
  • the wiring 40 may have substantially the same line width in the x-axis direction (display region portion) and the y direction (opaque wiring region 40a), and a mesh-shaped wiring group may be formed in the opaque wiring region 40a. ..
  • a driver IC Integrated Circuit
  • each wiring 40 drawn in the form of one line in FIG. 1 is composed of a plurality of fine wirings as described later.
  • the width of the fine wiring 40 is, for example, 1 ⁇ m to 100 ⁇ m, preferably 3 ⁇ m to 20 ⁇ m. Since the width of the wiring 40 is 100 ⁇ m or less, the wiring 40 is hardly visible even when observing the transparent display device from a short distance of, for example, several tens of centimeters to 2 m, and the visibility on the back side is excellent.
  • the width of the wiring 40 in the opaque wiring region 40a is, for example, 100 ⁇ m to 10000 ⁇ m, preferably 100 ⁇ m to 5000 ⁇ m.
  • the distance between the wirings is, for example, 3 ⁇ m to 5000 ⁇ m, preferably 50 ⁇ m to 1500 ⁇ m.
  • the wiring 40 in the opaque wiring region 40a can be visually recognized. Therefore, the opaque wiring region 40a formed in a substantially L-shape in xy plane along the peripheral edge of the transparent display device 100 is covered by, for example, some means.
  • the flexible wiring board 60 is a strip-shaped opaque power feeding body for supplying power to the display area 101. Since it is opaque, the flexible wiring board 60 is connected to the end of the wiring 40 formed on the edge of the transparent insulating base material 10b. In the example shown in FIGS. 1 and 2, the flexible wiring board 60 is connected to the end of the wiring 40 of the opaque wiring region 40a formed at the end of the transparent insulating base material 10b on the negative side in the y-axis direction. The flexible wiring board 60 is also obscured by, for example, some means, like the opaque wiring area 40a.
  • the ends of the transparent insulating base materials 10a and 10b overlap.
  • one end of the wiring (first wiring) 40 formed on the transparent insulating base material 10a and the wiring (second wiring) formed on the transparent insulating base material 10b One end of 40 is electrically connected.
  • the other end of the wiring 40 formed on the transparent insulating base material 10b is connected to the flexible wiring board 60.
  • power can be supplied from the flexible wiring board 60 to drive the electronic element in the display area 101.
  • the display area 101 does not overlap with the second wiring 40 formed on the transparent insulating base material 10b. Therefore, since the transparent display device 100 can suppress a decrease in the transmittance in the display area 101, the visibility on the back side is excellent.
  • At least one of the transparent insulating base materials 10a and 10b may have one or a plurality of cutout portions.
  • the cutout portion improves the adhesion between the transparent display device 100 and the interlayer film described later, and makes it easy for the transparent display device 100 to be firmly held in the laminated glass.
  • the end of the wiring 40 on the positive side in the y-axis is opposed to each other and is connected via the conductive bonding layer 40b.
  • a conductive adhesive such as an anisotropic conductive film (ACF) or solder can be used.
  • ACF anisotropic conductive film
  • solder solder
  • the pad size can be reduced by using a conductive adhesive, solder, or the like.
  • burrs that occur when the transparent insulating base material is provided with through holes do not occur, and good contact can be obtained. As a result, the decrease in yield can be suppressed.
  • the transparent insulating base materials 10a and 10b all have a rectangular planar shape.
  • the transparent insulating base materials 10a and 10b By connecting the ends of the transparent insulating base materials 10a and 10b having the same width so as to overlap each other, the transparent insulating base materials 10a and 10b as a whole have a rectangular planar shape.
  • the ratio of the edges of the transparent insulating base materials 10a and 10b overlapping each other is, for example, 20% or less, preferably 10% or less, more preferably 5% or less of the area of the transparent insulating base material 10a. be.
  • two alignment marks AM for alignment are provided on each of the transparent insulating base materials 10a and 10b.
  • the shape and number of the alignment marks AM are not limited in any way, but in the example shown in FIG. 1, a square mark is provided on one of the transparent insulating substrates 10a and 10b, and a cross mark is provided on the other. ing.
  • the number of alignment marks AM may be one or three or more.
  • the transparent display device since the entire display area 101 and the wiring 40 are formed on one transparent insulating base material, there is a problem that the transparent display device becomes large and the yield decreases. For example, even if a defect does not occur in the display area 101, if a defect occurs in the non-display area, it is determined to be defective as a whole. Further, even if a defect does not occur in the non-display area, if a defect occurs in the display area 101, it is determined as a defect as a whole.
  • the transparent display device according to the present embodiment is divided into a transparent insulating base material 10a including the display area 101 and a transparent insulating base material 10b not including the display area 101. Therefore, the defect in the transparent insulating base material 10a including the display area 101 and the defect in the transparent insulating base material 10b not including the display area 101 can be separated, and the yield as a whole is improved.
  • the transparent display devices 100 having different sizes, for example, it is possible to change only the design of the transparent insulating base material 10b without changing the design of the transparent insulating base material 10a including the display area 101. .. That is, by sharing the transparent insulating base material 10a, the design can be simplified and the productivity in manufacturing can be improved.
  • the opaque wiring region 40a is formed by being divided into transparent insulating base materials 10a and 10b.
  • it may be divided into a rectangular transparent insulating base material 10a including the entire display area 101 and a transparent insulating base material 10b having an L-shaped xy plan view including the entire opaque wiring area 40a.
  • Other modifications will be described later.
  • FIG. 3 is a schematic partial plan view showing an example of the display area 101.
  • FIG. 4 is a cross-sectional view taken along the IV-IV cutting line in FIG.
  • the display region 101 is formed on the transparent insulating base material 10a.
  • a light emitting unit 20 an IC (Integrated Circuit) chip 30, a wiring 40, and a protective layer 50 are formed on the transparent insulating base material 10a.
  • the display area 101 is composed of a plurality of pixels PIX arranged in the row direction (x-axis direction) and the column direction (y-axis direction).
  • FIG. 3 shows a part of the display area 101, and shows a total of 4 pixels, 2 pixels each in the row direction and the column direction.
  • one pixel PIX is shown surrounded by an alternate long and short dash line.
  • the transparent insulating base material 10a and the protective layer 50 shown in FIG. 4 are omitted.
  • FIG. 3 is a plan view, the light emitting unit 20 and the IC chip 30 are displayed in dots for easy understanding.
  • each pixel PIX includes a light emitting unit 20 and an IC chip 30.
  • the light emitting unit 20 and the IC chip 30 are arranged in a matrix with a pixel pitch Px in the row direction (x-axis direction) and a pixel pitch Py in the column direction (y-axis direction). If the pixels are arranged in a predetermined direction at a predetermined pixel pitch, the arrangement format of the pixels PIX, that is, the light emitting unit 20 is not limited to the matrix shape.
  • the light emitting unit 20 in each pixel PIX includes at least one LED element.
  • each light emitting unit 20 includes a red LED element 21, a green LED element 22, and a blue LED element 23.
  • the LED elements 21 to 23 correspond to sub-pixels (sub-pixels) constituting one pixel.
  • each light emitting unit 20 has LED elements 21 to 23 that emit red, green, and blue, which are the three primary colors of light, the transparent display device according to the present embodiment can display a full-color image.
  • each light emitting unit 20 may include two or more LED elements of similar colors. This makes it possible to expand the dynamics range of the image.
  • the LED elements 21 to 23 have a minute size and are so-called micro LED elements. Specifically, the width (length in the x-axis direction) and the length (length in the y-axis direction) of the LED element 21 on the transparent insulating base material 10a are, for example, 100 ⁇ m or less, preferably 50 ⁇ m or less, more preferably. Is 20 ⁇ m or less. The same applies to the LED elements 22 and 23.
  • the lower limit of the width and length of the LED element is, for example, 3 ⁇ m or more due to various manufacturing conditions and the like.
  • the dimensions, that is, the width and the length of the LED elements 21 to 23 in FIG. 3 are the same, they may be different from each other.
  • the area occupied by each of the LED elements 21 to 23 on the transparent insulating base material 10a is, for example, 10000 ⁇ m 2 or less, preferably 3000 ⁇ m 2 or less, and more preferably 500 ⁇ m 2 or less.
  • the lower limit of the area occupied by one LED element is, for example, 10 ⁇ m 2 or more due to various manufacturing conditions and the like.
  • the area occupied by the constituent members such as the LED element and the wiring refers to the area in the xy plan view in FIG.
  • the shape of the LED elements 21 to 23 shown in FIG. 3 is rectangular (including a square), but is not particularly limited.
  • the transmittance of the LED elements 21 to 23 is as low as, for example, about 10% or less.
  • the LED elements 21 to 23 having a minute size having an area of 10000 ⁇ m 2 or less are used. Therefore, even when observing the transparent display device from a short distance of, for example, several tens of centimeters to 2 m, the LED elements 21 to 23 are almost invisible.
  • the area where the transmittance is low is narrow in the display area 101, and the visibility on the back side is excellent.
  • the degree of freedom in arranging the wiring 40 and the like is high.
  • the “region having a low transmittance in the display region 101” is, for example, a region having a transmittance of 20% or less. The same applies hereinafter.
  • the transparent display device according to the present embodiment can be used by being attached to a curved transparent plate such as a window glass for an automobile or being enclosed between two curved transparent plates.
  • a flexible material is used as the transparent insulating base material 10a, the transparent display device according to the present embodiment can be curved.
  • the LED elements 21 to 23 are not particularly limited, but are, for example, inorganic materials.
  • the red LED element 21 is, for example, AlGaAs, GaAsP, GaP, or the like.
  • the green LED element 22 is, for example, InGaN, GaN, AlGaN, GaP, AlGaInP, ZnSe, or the like.
  • the blue LED element 23 is, for example, InGaN, GaN, AlGaN, ZnSe, or the like.
  • the luminous efficiency that is, the energy conversion efficiency of the LED elements 21 to 23 is, for example, 1% or more, preferably 5% or more, and more preferably 15% or more.
  • the luminous efficiency of the LED elements 21 to 23 is 1% or more, sufficient brightness can be obtained even with the small size LED elements 21 to 23 as described above, and the LED elements 21 to 23 can be used as a display device during the daytime. Further, when the luminous efficiency of the LED element is 15% or more, heat generation is suppressed, and encapsulation inside the laminated glass using the resin adhesive layer becomes easy.
  • the pixel pitches Px and Py are, for example, 100 ⁇ m to 3000 ⁇ m, preferably 180 ⁇ m to 1000 ⁇ m, and more preferably 250 ⁇ m to 400 ⁇ m, respectively.
  • the pixel pitches Px and Py are, for example, 100 ⁇ m to 3000 ⁇ m, preferably 180 ⁇ m to 1000 ⁇ m, and more preferably 250 ⁇ m to 400 ⁇ m, respectively.
  • the pixel pitches Px and Py are, for example, 100 ⁇ m to 3000 ⁇ m, preferably 180 ⁇ m to 1000 ⁇ m, and more preferably 250 ⁇ m to 400 ⁇ m, respectively.
  • the pixel pitches Px and Py are, for example, 100 ⁇ m to 3000 ⁇ m, preferably 180 ⁇ m to 1000 ⁇ m, and more preferably 250 ⁇ m to 400 ⁇ m, respectively.
  • the pixel pitches Px and Py are, for example, 100 ⁇ m to 3000 ⁇ m, preferably 180 ⁇ m to 1000 ⁇ m, and more
  • the area of one pixel PIX is Px ⁇ Py, and this area is, for example, 1 ⁇ 10 4 ⁇ m 2 to 9 ⁇ 10 6 ⁇ m 2 , preferably 3 ⁇ 10 4 to 1 ⁇ 10 6 ⁇ m 2 , more preferably. It is 6 ⁇ 10 4 to 2 ⁇ 10 5 ⁇ m 2 .
  • the area of one pixel may be appropriately selected depending on the size of the display area 101, the application, the viewing distance, and the like.
  • the ratio of the area occupied by the LED elements 21 to 23 to the area of one pixel is, for example, 30% or less, preferably 10% or less, more preferably 5% or less, and further preferably 1% or less.
  • the three LED elements 21 to 23 are arranged in a row in the positive direction of the x-axis in this order, but the present invention is not limited to this.
  • the arrangement order of the three LED elements 21 to 23 may be changed.
  • the three LED elements 21 to 23 may be arranged in the y-axis direction.
  • the three LED elements 21 to 23 may be arranged at the vertices of the triangle.
  • each light emitting unit 20 includes a plurality of LED elements 21 to 23
  • the distance between the LED elements 21 to 23 in the light emitting unit 20 is, for example, 100 ⁇ m or less, preferably 10 ⁇ m or less. be.
  • the LED elements 21 to 23 may be arranged so as to be in contact with each other. This makes it easier to standardize the first power supply branch line 41a and improve the aperture ratio.
  • each light emitting unit 20 includes three LED elements that emit light having different wavelengths, in some light emitting units 20, the LED elements are arranged side by side in the x-axis direction or the y-axis direction, and in the other light emitting unit 20, the LED elements are arranged side by side. , LED elements of each color may be arranged at the apex of the triangle.
  • the IC chip 30 is arranged for each pixel PIX and drives the light emitting unit 20. Specifically, the IC chip 30 is connected to each of the LED elements 21 to 23 via a drive line 45, and the LED elements 21 to 23 can be individually driven.
  • the IC chip 30 is, for example, a hybrid IC including an analog region and a logic region.
  • the analog region includes, for example, a current control circuit, a transformer circuit, and the like.
  • the IC chip 30 may be arranged for each of a plurality of pixels, and a plurality of pixels to which each IC chip 30 is connected may be driven. For example, if one IC chip 30 is arranged for every four pixels, the number of IC chips 30 can be reduced to 1/4 of the example of FIG. 3, and the area occupied by the IC chip 30 can be reduced. Moreover, the IC chip 30 is not indispensable.
  • each IC chip 30 is, for example, 100,000 ⁇ m 2 or less, preferably 10,000 ⁇ m 2 or less, and more preferably 5000 ⁇ m 2 or less.
  • the transmittance of the IC chip 30 is as low as about 20% or less, but by using the IC chip 30 of the above size, the region of the display region 101 where the transmittance is low is narrowed, and the visibility on the back surface side is improved.
  • the wiring 40 includes a power supply line 41, a ground line 42, a row data line 43, a column data line 44, and a plurality of drive lines 45.
  • the power supply line 41, the ground line 42, and the column data line 44 extend in the y-axis direction.
  • the row data line 43 extends in the x-axis direction.
  • the power supply line 41 and the column data line 44 are provided on the x-axis negative direction side of the light emitting unit 20 and the IC chip 30, and the ground line 42 is x more than the light emitting unit 20 and the IC chip 30. It is provided on the positive side of the axis.
  • the power supply line 41 is provided on the side in the negative direction of the x-axis with respect to the column data line 44.
  • the row data line 43 is provided on the y-axis negative direction side with respect to the light emitting unit 20 and the IC chip 30.
  • the power supply line 41 includes a first power supply branch line 41a and a second power supply branch line 41b.
  • the ground line 42 includes a ground branch line 42a.
  • the row data line 43 includes a row data branch line 43a.
  • the column data line 44 includes a column data branch line 44a. Each of these branch lines is included in the wiring 40.
  • each power supply line 41 extending in the y-axis direction is connected to a light emitting unit 20 and an IC chip 30 of each pixel PIX arranged side by side in the y-axis direction. More specifically, in each pixel PIX, the LED elements 21 to 23 are arranged side by side in the x-axis positive direction in this order on the x-axis positive direction side of the power supply line 41. Therefore, the first power supply branch line 41a branched from the power supply line 41 in the positive direction of the x-axis is connected to the end portion of the LED elements 21 to 23 in the positive direction of the y-axis.
  • the IC chip 30 is arranged on the y-axis negative direction side of the LED elements 21 to 23. Therefore, between the LED element 21 and the column data line 44, the second power supply branch line 41b branched in the y-axis negative direction from the first power supply branch line 41a is extended in a straight line, and the y-axis of the IC chip 30 is extended. It is connected to the negative side of the x-axis of the end on the positive side.
  • each ground wire 42 extending in the y-axis direction is connected to the IC chip 30 of each pixel PIX arranged side by side in the y-axis direction.
  • the ground branch line 42a branched from the ground line 42 in the negative direction on the x-axis is linearly extended and connected to the end on the positive side of the x-axis of the IC chip 30.
  • the ground line 42 is connected to the LED elements 21 to 23 via the ground branch line 42a, the IC chip 30, and the drive line 45.
  • each row data line 43 extending in the x-axis direction is connected to the IC chip 30 of each pixel PIX juxtaposed in the x-axis direction (row direction).
  • the row data branch line 43a branched from the row data line 43 in the positive direction of the y-axis is linearly extended and connected to the end of the IC chip 30 in the negative direction of the y-axis.
  • the row data line 43 is connected to the LED elements 21 to 23 via the row data branch line 43a, the IC chip 30, and the drive line 45.
  • each column data line 44 extending in the y-axis direction is connected to an IC chip 30 of each pixel PIX arranged side by side in the y-axis direction (column direction).
  • the column data branch line 44a branched from the column data line 44 in the positive direction on the x-axis is linearly extended and connected to the end on the negative side of the x-axis of the IC chip 30.
  • the column data line 44 is connected to the LED elements 21 to 23 via the column data branch line 44a, the IC chip 30, and the drive line 45.
  • the drive line 45 connects the LED elements 21 to 23 and the IC chip 30 in each pixel PIX. Specifically, in each pixel PIX, three drive lines 45 are extended in the y-axis direction, and each of them is the y-axis negative side end of the LED elements 21 to 23 and the y-axis positive side of the IC chip 30. Connect with the end.
  • the arrangement of the power supply line 41, the ground line 42, the row data line 43, the column data line 44, their branch lines, and the drive line 45 shown in FIG. 3 is merely an example and can be changed as appropriate.
  • at least one of the power line 41 and the ground line 42 may extend in the x-axis direction instead of the y-axis direction.
  • the power line 41 and the column data line 44 may be interchanged.
  • the entire configuration shown in FIG. 3 may be upside down, left-right inverted, or the like. Further, the row data line 43, the column data line 44, their branch lines, and the drive line 45 are not essential.
  • the wiring 40 is a metal such as copper (Cu), aluminum (Al), silver (Ag), and gold (Au). Of these, a metal containing copper or aluminum as a main component is preferable from the viewpoint of low resistivity and cost. Further, the wiring 40 may be coated with a material such as titanium (Ti), molybdenum (Mo), copper oxide, or carbon for the purpose of reducing the reflectance. Further, irregularities may be formed on the surface of the coated material.
  • the width of the wiring 40 in the display area 101 shown in FIG. 3 is, for example, 1 ⁇ m to 100 ⁇ m, preferably 3 ⁇ m to 20 ⁇ m.
  • the width of the wiring 40 is 100 ⁇ m or less, the wiring 40 is hardly visible even when observing the transparent display device from a short distance of, for example, several tens of centimeters to 2 m, and the visibility on the back side is excellent.
  • the width of the wiring 40 is 1 ⁇ m or more, it is possible to suppress an excessive increase in the resistance of the wiring 40, and suppress a voltage drop and a decrease in signal strength. In addition, it is possible to suppress a decrease in heat conduction due to the wiring 40.
  • the wiring 40 when the wiring 40 extends mainly in the x-axis direction and the y-axis direction, a cross extending in the x-axis direction and the y-axis direction by the light emitted from the outside of the transparent display device. Diffraction images may occur, reducing the visibility of the back side of the transparent display device. By reducing the width of each wiring, this diffraction can be suppressed and the visibility on the back side can be further improved. From the viewpoint of suppressing diffraction, the width of the wiring 40 is 50 ⁇ m or less, preferably 10 ⁇ m or less, and more preferably 5 ⁇ m or less.
  • the electrical resistivity of the wiring 40 is, for example, 1.0 ⁇ 10 -6 ⁇ m or less, preferably 2.0 ⁇ 10 -8 ⁇ m or less.
  • the thermal conductivity of the wiring 40 is, for example, 150 W / (m ⁇ K) to 5500 W / (m ⁇ K), preferably 350 W / (m ⁇ K) to 450 W / (m ⁇ K).
  • the distance between adjacent wirings 40 in the display area 101 shown in FIG. 3 is, for example, 3 ⁇ m to 100 ⁇ m, preferably 5 ⁇ m to 30 ⁇ m. If there is an area where the wiring 40 is dense, the visibility on the back side may be hindered. When the distance between the adjacent wirings 40 is 3 ⁇ m or more, such obstruction of visual recognition can be suppressed. On the other hand, when the distance between adjacent wirings 40 is 100 ⁇ m or less, sufficient display capability can be ensured. When the distance between the wirings 40 is not constant due to the bending of the wirings 40 or the like, the above-mentioned distance between the adjacent wirings 40 indicates the minimum value.
  • the ratio of the area occupied by the wiring 40 to the area of one pixel is, for example, 30% or less, preferably 10% or less, more preferably 5% or less, still more preferably 3% or less.
  • the transmittance of the wiring 40 is as low as 20% or less, or 10% or less, for example.
  • the total area occupied by the light emitting unit 20, the IC chip 30, and the wiring 40 with respect to the area of one pixel is, for example, 30% or less, preferably 20% or less, and more preferably 10% or less.
  • the transparent insulating base material 10a is a transparent material having an insulating property.
  • the transparent insulating base material 10a has a two-layer structure of the main substrate 11 and the adhesive layer 12.
  • the main substrate 11 is, for example, a transparent resin, as will be described in detail later.
  • the adhesive layer 12 is a transparent resin adhesive such as epoxy-based, acrylic-based, silicone-based, olefin-based, polyimide-based, and novolak-based.
  • the main substrate 11 may be a thin glass plate having a thickness of, for example, 200 ⁇ m or less, preferably 100 ⁇ m or less. Further, the adhesive layer 12 is not essential.
  • polyester resins such as polyethylene terephthalate (PET) and polyethylene naphthalate (PEN)
  • olefin resins such as cycloolefin polymer (COP) and cycloolefin copolymer (COC)
  • cellulose and acetyl Cellulose cellulose-based resin such as triacetyl cellulose (TAC), imide-based resin such as polyimide (PI), amide-based resin such as polyamide (PA), amide-based resin such as polyamideimide (PAI), polycarbonate (PC), etc.
  • Carbonate-based resin sulfone-based resin such as polyether sulfone (PES), paraxylene-based resin such as polyparaxylene, polyethylene (PE), polyvinyl chloride (PVC), polystyrene (PS), polyvinyl acetate (PVAc). ), Vinyl resin such as polyvinyl alcohol (PVA) and polyvinyl butyral (PVB), acrylic resin such as polymethyl methacrylate (PMMA), ethylene / vinyl acetate copolymer resin (EVA), thermoplastic polyurethane (TPU), etc. Examples thereof include urethane-based resins and epoxy-based resins.
  • PES polyether sulfone
  • paraxylene-based resin such as polyparaxylene
  • PE polyethylene
  • PVC polyvinyl chloride
  • PS polystyrene
  • PVAc polyvinyl acetate
  • Vinyl resin such as polyvinyl alcohol (PVA) and polyvinyl butyral (PVB
  • polyethylene naphthalate and polyimide are preferable from the viewpoint of improving heat resistance.
  • cycloolefin polymer, cycloolefin copolymer, polyvinyl butyral and the like are preferable in that the double refractive index is low and distortion and bleeding of the image seen through the transparent insulating base material can be reduced.
  • the above materials may be used alone or a mixture of two or more kinds of materials may be used.
  • the main substrate 11 may be formed by laminating flat plates made of different materials.
  • the total thickness of the transparent insulating base material 10a is, for example, 3 ⁇ m to 1000 ⁇ m, preferably 5 ⁇ m to 200 ⁇ m.
  • the internal transmittance of visible light of the transparent insulating base material 10a is, for example, 50% or more, preferably 70% or more, and more preferably 90% or more.
  • the transparent insulating base material 10a may have flexibility, whereby, for example, a transparent display device can be mounted on a curved transparent plate or sandwiched between two curved transparent plates for use. Further, the transparent insulating base material 10a may be a material that shrinks when heated to 100 ° C. or higher.
  • the LED elements 21 to 23 and the IC chip 30 are provided on the transparent insulating base material 10a, that is, the adhesive layer 12, and are connected to the wiring 40 arranged on the transparent insulating base material 10a. ..
  • the wiring 40 is composed of a first metal layer M1 formed on the main substrate 11 and a second metal layer M2 formed on the adhesive layer 12.
  • the total thickness of the wiring 40 that is, the thickness of the first metal layer M1 and the thickness of the second metal layer M2 is, for example, 0.1 ⁇ m to 10 ⁇ m, preferably 0.5 ⁇ m to 5 ⁇ m.
  • the thickness of the first metal layer M1 is, for example, about 0.5 ⁇ m
  • the thickness of the second metal layer M2 is, for example, about 3 ⁇ m.
  • the ground wire 42 extending in the y-axis direction since the ground wire 42 extending in the y-axis direction has a large amount of current, it has a two-layer structure including the first metal layer M1 and the second metal layer M2. There is. That is, at the portion where the ground wire 42 is provided, the adhesive layer 12 is removed, and the second metal layer M2 is formed on the first metal layer M1.
  • the power supply line 41, the row data line 43, and the column data line 44 shown in FIG. 3 also have a two-layer structure including the first metal layer M1 and the second metal layer M2. Have.
  • the power supply line 41, the ground line 42, and the column data line 44 extending in the y-axis direction intersect with the row data line 43 extending in the x-axis direction.
  • the row data line 43 is composed of only the first metal layer M1
  • the power supply line 41, the ground line 42, and the column data line 44 are composed of only the second metal layer M2.
  • an adhesive layer 12 is provided between the first metal layer M1 and the second metal layer M2, and the first metal layer M1 and the second metal layer M2 are insulated from each other.
  • the first power supply branch line 41a is composed of only the first metal layer M1
  • the column data line 44 is the second metal. It is composed of only the layer M2.
  • the ground branch line 42a, the drive line 45, and the first power supply branch line 41a are composed of only the second metal layer M2 and cover the end portions of the LED elements 21 to 23 and the IC chip 30. Is formed in.
  • the second power supply branch line 41b, the row data branch line 43a, and the column data branch line 44a are also similarly composed of only the second metal layer M2.
  • the first power supply branch line 41a is composed of only the first metal layer M1 at the intersection with the column data line 44, and is composed of only the second metal layer M2 at other portions. Further, a metal pad made of copper, silver, gold or the like is arranged on the wiring 40 formed on the transparent insulating base material 10a, and at least one of the LED elements 21 to 23 and the IC chip 30 is arranged on the metal pad. May be good.
  • the protective layer 50 is a transparent resin formed on substantially the entire surface of the transparent insulating base material 10a so as to cover and protect the light emitting portion 20, the IC chip 30, and the wiring 40.
  • substantially the entire surface here means the entire surface of the transparent insulating base material 10a excluding the portion electrically connected to, for example, the transparent insulating base material 10b and the flexible wiring board 60.
  • the thickness of the protective layer 50 is, for example, 3 ⁇ m to 1000 ⁇ m, preferably 5 to 200 ⁇ m. The thickness of the protective layer 50 does not have to be uniform as long as it is within the above range.
  • the elastic modulus of the protective layer 50 is, for example, 10 GPa or less.
  • the internal transmittance of visible light of the protective layer 50 is, for example, 50% or more, preferably 70% or more, and more preferably 90% or more.
  • the protective layer 50 is not essential.
  • the transparent resin constituting the protective layer 50 vinyl-based resins such as polyethylene (PE), polyvinyl chloride (PVC), polystyrene (PS), polyvinyl acetate (PVAc), polyvinyl alcohol (PVA), and polyvinyl butyral (PVB) , Olefin resin such as cycloolefin polymer (COP), cycloolefin copolymer (COC), urethane resin such as thermoplastic polyurethane (TPU), polyester resin such as polyethylene terephthalate (PET), polyethylene naphthalate (PEN), Examples thereof include acrylic resins such as polymethyl methacrylate (PMMA) and thermoplastic resins such as ethylene / vinyl acetate copolymer resin (EVA).
  • a transparent resin adhesive constituting the adhesive layer 12 can also be used as the transparent resin constituting the protective layer 50.
  • the protective layer 50 may be made of one kind of transparent resin or may be made of a plurality of kinds of transparent resins.
  • the cross-sectional configuration of the non-display region formed on the transparent insulating base material 10b in the transparent display device according to the present embodiment will be described.
  • the display region 101 is not formed on the transparent insulating base material 10b, and the wiring 40 is formed.
  • the wiring 40 made of only the first metal layer M1 is formed on the transparent insulating base material 10b made of only the main substrate 11 described above.
  • the protective layer 50 covering the wiring 40 may be formed on the transparent insulating base material 10b.
  • the same material as the main substrate 11 constituting the transparent insulating base material 10a can be used as the material of the main substrate 11 constituting the transparent insulating base material 10a.
  • the material of the main substrate 11 constituting the transparent insulating base material 10b may be different from the material of the main substrate 11 constituting the transparent insulating base material 10a.
  • 5 to 12 are cross-sectional views showing an example of a method for manufacturing a transparent display device according to the first embodiment.
  • 5 to 12 are cross-sectional views corresponding to FIG. 4, showing how the display region 101 is formed on the transparent insulating base material 10a.
  • a first metal layer M1 is formed on substantially the entire surface of the main substrate 11, and then the first metal layer M1 is patterned by photolithography to form a lower layer wiring.
  • the lower layer wiring is formed by the first metal layer M1 at the position where the power supply line 41, the ground line 42, the row data line 43, the column data line 44, and the like shown in FIG. 3 are formed. No lower layer wiring is formed at the intersection of the power line 41, the ground line 42, and the column data line 44 with the row data line 43.
  • the LED is placed on the tacky adhesive layer 12 (that is, on the transparent insulating base material 10a).
  • the elements 21 to 23 and the IC chip 30 are mounted.
  • the LED elements 21 to 23 are patterned after growing crystals on the wafer by using, for example, a liquid phase growth method, an HVPE (Hydride Vapor Phase Epitaxy) method, a MOCVD (Metal Organic Chemical Vapor Deposition) method, or the like. And get it.
  • the LED elements 21 to 23 patterned on the wafer are transferred onto the transparent insulating substrate 10a by using, for example, a micro transfer printing technique.
  • the IC chip 30 similarly to the LED elements 21 to 23, for example, the IC chip 30 patterned on the Si wafer is transferred onto the transparent insulating base material 10a by using the micro transfer printing technique.
  • a photoresist FR1 is formed on substantially the entire surface of the transparent insulating base material 10a including the main substrate 11 and the adhesive layer 12, and then the photoresist FR1 on the first metal layer M1 is formed. Remove by patterning.
  • the photoresist FR1 at the intersection of the power line 41, the ground line 42, and the column data line 44 in the row data line 43 shown in FIG. 3 is not removed.
  • the adhesive layer 12 at the portion where the photoresist FR1 has been removed is removed by dry etching to expose the first metal layer M1, that is, the lower layer wiring.
  • the adhesive layer 12 at the portion where the photoresist FR1 has been removed is removed by dry etching to expose the first metal layer M1, that is, the lower layer wiring.
  • all the photoresist FR1 on the transparent insulating base material 10a is removed.
  • a seed layer for plating (not shown) is formed on substantially the entire surface of the transparent insulating base material 10a.
  • the photoresist FR2 at the portion where the upper layer wiring is formed is removed by patterning to expose the seed layer. ..
  • a second metal layer M2 is formed by plating on the portion where the photoresist FR2 has been removed, that is, the seed layer. As a result, the upper layer wiring is formed by the second metal layer M2.
  • the photoresist FR2 is removed. Further, the seed layer exposed by the removal of the photoresist FR2 is removed by etching. As a result, the display region 101 is formed on the transparent insulating base material 10a.
  • the wiring 40 is formed on the transparent insulating base material 10b as described above.
  • the wiring 40 composed of only the first metal layer M1 described above is patterned on the transparent insulating base material 10b composed of only the main substrate 11.
  • one end of the wiring 40 formed on the transparent insulating base material 10a and one end of the wiring 40 formed on the transparent insulating base material 10b are joined via the conductive bonding layer 40b. Connect electrically. Further, at the edge of the transparent insulating base material 10b, the other end of the wiring 40 is connected to the flexible wiring board 60. After that, the protective layer 50 may be formed on the transparent insulating base materials 10a and 10b. As described above, the transparent display device 100 according to the present embodiment can be manufactured.
  • FIGS. 13 to 16 are schematic cross-sectional views showing transparent display devices according to Modifications 1 to 4, respectively, of the first embodiment.
  • 13 to 16 are views corresponding to FIG. 2.
  • the transparent display device 100 according to the first modification shown in FIG. 13 has an upside-down configuration. That is, the transparent insulating base material 10a may be formed on the transparent insulating base material 10b. In the transparent display device 100 according to the first modification, the display area 101 does not overlap with the second wiring 40 formed on the transparent insulating base material 10b. Therefore, the transparent display device 100 according to the modification 1 can suppress a decrease in the transmittance in the display area 101, and is excellent in visibility on the back surface side. The same applies to the transparent display device 100 according to the modifications 2 to 4 described later. In the transparent display device 100 according to the modified example 2 shown in FIG. 14, in the transparent display device 100 according to the modified example 1 shown in FIG.
  • the transparent insulating base material 10b extends over the entire lower side of the transparent insulating base material 10a.
  • Has a configured configuration That is, the entire transparent insulating base material 10a (100% of the area of the transparent insulating base material 10a) overlaps with the transparent insulating base material 10b. Therefore, when the transparent display device 100 is enclosed in the laminated glass as described later, the shape of the transparent insulating base material 10a (that is, the display region 101) can be stabilized as compared with the configurations shown in FIGS. 2 and 13.
  • the transparent display device 100 according to the modification 3 shown in FIG. 15 has a configuration in which only the transparent insulating base material 10a is turned upside down in the transparent display device 100 according to the modification 2 shown in FIG. That is, the wiring 40 is formed on the upper surface of the transparent insulating base material 10a. Therefore, the wiring 40 formed on the upper surface of the transparent insulating base material 10a and the wiring 40 formed on the upper surface of the transparent insulating base material 10b are connected via the via 40c penetrating the transparent insulating base material 10a.
  • the transparent insulating base material 10a including the display area 101 and the transparent insulating base material 10b connected to the flexible wiring board 60 are composed of a transparent insulating base material (the first). 3 transparent insulating base material) It has a structure connected via 10c. In this way, the transparent insulating base material may be divided into three or more.
  • the transparent insulating base material 10a and the transparent insulating base material 10b do not overlap, and the wiring 40 is formed on the upper surface of each of the transparent insulating base materials 10a and 10b.
  • the wiring 40 of the opaque wiring region 40a is formed on the transparent insulating base material 10b, and the LED element is not formed. Therefore, for the transparent insulating base material 10b, the wiring 40 can be easily formed by using print patterning instead of patterning by photolithography. Both the wiring 40 of the opaque wiring region 40a and the fine wiring 40 are formed on the lower surface of the transparent insulating base material 10c.
  • FIG. 17 is a schematic plan view showing an example of the laminated glass according to the second embodiment.
  • FIG. 18 is a cross-sectional view taken along the line XVIII-XVIII in FIG.
  • the laminated glass 200 shown in FIGS. 17 and 18 is used for the windshield of the window glass of an automobile, but is not particularly limited.
  • the laminated glass according to the embodiment can be used for a moving body including a train, a ship, an aircraft, etc., that is, a window glass of a vehicle in general.
  • the window glass includes, for example, a rear glass, a side glass, a roof glass, and the like, in addition to the windshield.
  • the laminated glass 200 has a structure in which a pair of glass plates 220a and 220b arranged opposite to each other via an interlayer film 210 are bonded together.
  • the transparent display device 100 according to the first embodiment shown in FIG. 2 is sandwiched between the pair of glass plates 220a and 220b by the interlayer films 210a and 210b.
  • the glass plate 220a is arranged on the inside of the vehicle (visual recognition side), and the glass plate 220b is arranged on the outside of the vehicle (background side). Further, the intermediate film (first intermediate film) 210a and the intermediate film (second intermediate film) 210b are integrated to form the intermediate film 210. As shown in FIGS. 17 and 18, the transparent display device 100 is provided at the end of the laminated glass 200, and the flexible wiring plate 60 extends from the glass plates 220a and 220b. A plurality of transparent display devices 100 may be arranged inside the laminated glass 200.
  • FIG. 17 shows the laminated glass 200 in a plane, but the laminated glass 200 may have a curved shape.
  • the curved shape may be a single bending shape curved in one direction, or a compound bending shape curved in two orthogonal directions.
  • the radius of curvature is preferably 1000 mm to 100,000 mm.
  • the radii of curvature of the glass plates 220a and 220b may be the same or different.
  • the planar shape of the laminated glass 200 is rectangular, but the shape is not limited to a rectangular shape, and may be any shape including a trapezoidal shape, a parallel quadrilateral shape, a triangular shape, and the like.
  • the transparent display device 100 shown in FIG. 2 is installed so that the peripheral edges of the transparent insulating base materials 10a and 10b do not overlap with the predetermined test areas on the glass plates 220a and 220b, respectively.
  • the predetermined test area is the "test area A" specified in the annex "Test area for optical properties and light resistance of safety glass” of JIS standard R3212: 2015 (safety glass test method for automobiles). be. If the peripheral edges of the transparent insulating base materials 10a and 10b overlap with the "test region A", for example, there is a risk that the driver's field of vision may be adversely affected by reflection or scattering, or the test such as fluoroscopic distortion may not be cleared. Is.
  • FIG. 17 schematically shows the “test area A”.
  • the transparent insulating base material 10a shown in FIG. 17 does not overlap with the test area A, that is, the transparent insulating base material 10a overlaps with the test area A.
  • the transparent insulating base material 10a overlaps with the entire test area A is included. The same applies to the transparent insulating base material 10b.
  • the laminated glass 200 is provided with a band-shaped shielding layer 201 on the entire peripheral edge thereof. Since the shielding layer 201 shields sunlight, deterioration of the adhesive for assembling the laminated glass 200 to the automobile (for example, a resin such as urethane) due to ultraviolet rays can be suppressed.
  • FIG. 17 is a plan view, the shielding layer 201 and the opaque wiring region 40a are displayed in dots for ease of understanding.
  • the shielding layer 201 is formed on the inner surface of the glass plate 220a and the inner surface of the glass plate 220b.
  • the shielding layer 201 may be formed only on either the inner surface of the glass plate 220a or the inner surface of the glass plate 220b.
  • the shielding layer 201 is formed so as to overlap the flexible wiring board 60 and the opaque wiring region 40a. Therefore, the flexible wiring board 60 and the opaque wiring area 40a are difficult to see from the inside and the outside of the vehicle, and the design of the laminated glass 200 is improved.
  • a part of the peripheral edge of the transparent insulating base material 10a and 10b of the transparent display device 100 overlaps with the shielding layer 201, making it difficult to see.
  • the entire peripheral edges of the transparent insulating base materials 10a and 10b may overlap with the shielding layer 201.
  • the portion where the flexible wiring plate 60 and the opaque wiring region 40a are provided is preferably within 20 mm from the end of the glass plate 220a or the glass plate 220b because it is easily concealed by the body frame or interior material of the vehicle. Is more preferable.
  • the laminated glass 200 is a door glass that is slidably attached to the vehicle, the portion where the opaque wiring region 40a is provided is concealed by the door sash if it is within 15 mm from the end of the glass plate 220a or the glass plate 220b. It is preferable because it is easy to do, and it is more preferably within 10 mm.
  • the shielding layer 201 is not particularly limited, but can be formed, for example, by applying a ceramic color paste containing a meltable glass frit containing a pigment and firing it. For example, an organic ink containing a pigment may be applied and dried to form the shielding layer 201. Further, the shielding layer 201 may be formed of a colored film. The color of the pigment and the color of the colored film may be any color as long as they can block visible light to the extent that they can be concealed, at least in the portion where concealment is required, but a dark color is preferable, and black is more preferable. The shielding layer 201 is preferably opaque.
  • the glass plates 220a and 220b and the interlayer film 210 will be described in detail.
  • the glass plates 220a and 220b may be inorganic glass or organic glass.
  • the inorganic glass for example, soda lime glass, aluminosilicate glass, borosilicate glass, non-alkali glass, quartz glass and the like are used without particular limitation.
  • the glass plate 220b located on the outer side of the vehicle is preferably inorganic glass from the viewpoint of scratch resistance, and preferably soda lime glass from the viewpoint of moldability.
  • glass plates 220a and 220b glass that absorbs ultraviolet rays or infrared rays may be used, and more preferably, transparent glass plates may be used, but colored glass plates may be used so as not to impair the transparency.
  • transparent glass plates may be used, but colored glass plates may be used so as not to impair the transparency.
  • colored glass plates may be used so as not to impair the transparency.
  • the glass plates 220a and 220b are soda lime glass, clear glass, green glass containing an iron component in a predetermined amount or more, and UV-cut green glass can be preferably used.
  • the inorganic glass may be either unreinforced glass or tempered glass.
  • Untempered glass is made by molding molten glass into a plate shape and slowly cooling it. Tempered glass is formed by forming a compressive stress layer on the surface of untempered glass.
  • the tempered glass may be either physically tempered glass such as wind-cooled tempered glass or chemically tempered glass.
  • Physically tempered glass is a compressive stress layer on the glass surface due to the temperature difference between the glass surface and the inside of the glass by operations other than slow cooling, such as quenching a glass plate uniformly heated in bending molding from a temperature near the softening point. Can be used to strengthen the glass surface.
  • Chemically tempered glass can be strengthened by generating compressive stress on the glass surface by, for example, an ion exchange method after bending molding.
  • examples of the material of organic glass include polycarbonate, for example, acrylic resin such as polymethylmethacrylate, and transparent resin such as polyvinyl chloride and polystyrene.
  • the shape of the glass plates 220a and 220b is not particularly limited to a rectangular shape, and may be a shape processed into various shapes and curvatures. Gravity molding, press molding, roller molding and the like are used for bending molding of the glass plates 220a and 220b.
  • the molding method of the glass plates 220a and 220b is not particularly limited, but for example, in the case of inorganic glass, a glass plate molded by a float method or the like is preferable.
  • the thickness of the glass plate 220b located on the outside of the vehicle is preferably 1.5 mm to 3.0 mm or less at the thinnest portion. If the thickness of the glass plate 220b is 1.5 mm or more, the strength such as stepping stone resistance is sufficient, and if it is 3.0 mm or less, the mass of the laminated glass does not become too large, and the fuel efficiency of the vehicle is improved. preferable.
  • the thinnest portion of the glass plate 220b is more preferably 1.5 to 2.8 mm, and further preferably 1.5 mm to 2.6 mm.
  • the thickness of the glass plate 220a located inside the vehicle is preferably 0.3 mm to 2.3 mm. If the thickness of the glass plate 220a is 0.3 mm or more, the handleability is good, and if it is 2.3 mm or less, the mass does not become too large.
  • Each of the glass plates 220a and 220b is not a constant plate thickness, and the plate thickness may change from place to place as needed.
  • each of the glass plates 220a and 220b may have a wedge shape in which the plate thickness increases from the lower side to the upper side of the windshield with the windshield attached to the vehicle.
  • the total wedge angle of the glass plates 220a and 220b changes, for example, in a range larger than 0 mrad and 1.0 mrad or less.
  • the laminated glass 200 may be provided with a film having functions of water repellency, ultraviolet ray cut, and infrared ray cut, or a film having low reflection characteristics and low radiation characteristics on the outside of the glass plates 220a and 220b. Further, the laminated glass 200 may be provided with a film such as ultraviolet ray cut, infrared ray cut, low radiation characteristic, visible light absorption, coloring, etc. on the inside of the glass plates 220a and 220b (the side in contact with the interlayer film 210).
  • the glass plates 220a and 220b are inorganic glass, they are bent and molded, for example, after being molded by the float method or the like and before being bonded by the interlayer film 210. Bending molding is performed by softening the glass by heating. The heating temperature of the glass during bending is about 550 ° C to 700 ° C.
  • thermoplastic resin is often used as the interlayer film 210.
  • the resin composition containing the modified block copolymer hydride described in Japanese Patent No. 6065221 can also be preferably used.
  • plasticized polyvinyl acetal-based resins have an excellent balance of various performances such as transparency, weather resistance, strength, adhesive strength, penetration resistance, impact energy absorption, moisture resistance, heat insulation, and sound insulation. Is preferably used. These thermoplastic resins may be used alone or in combination of two or more. "Plasticization" in the above-mentioned plasticized polyvinyl acetal-based resin means that it is plasticized by adding a plasticizer. The same applies to other plasticized resins.
  • the transparent display device it may be deteriorated by a specific plasticizer, and in that case, it is preferable to use a resin that does not substantially contain the plasticizer as the interlayer film 210.
  • the resin containing no plasticizer include an ethylene-vinyl acetate copolymer resin.
  • polyvinyl acetal resin examples include polyvinyl formal resin obtained by reacting polyvinyl alcohol (PVA) with formaldehyde, polyvinyl acetal resin obtained by reacting PVA with acetaldehyde, and PVA and n-butyl aldehyde.
  • PVA polyvinyl alcohol
  • PVB polyvinyl butyral resin
  • PVB polyvinyl butyral resin
  • the material of the interlayer film 210 is not limited to the thermoplastic resin. Further, the interlayer film 210 may contain functional particles such as an infrared absorber, an ultraviolet absorber, and a light emitting agent. Further, the interlayer film 210 may have a colored portion called a shade band.
  • the interlayer films 210a and 210b contained in the interlayer film 210 are preferably the same material, but may be different materials.
  • the interlayer film 210 may have three or more layers.
  • the shear modulus of the interlayer films 210a and 210b may be the same or different.
  • at least one of the intermediate film 210a and the intermediate film 210b may have three or more layers.
  • the film thickness of the interlayer film 210 is preferably 0.5 mm or more at the thinnest part. When the film thickness of the interlayer film 210 is 0.5 mm or more, the penetration resistance required for laminated glass is sufficient.
  • the minimum value of the film thickness of the interlayer film 210 is more preferably 0.7 mm or more, further preferably 1.0 mm or more.
  • the film thickness of the interlayer film 210 is preferably 3.5 mm or less at the thickest portion. When the maximum value of the film thickness of the interlayer film 210 is 3.5 mm or less, the mass of the laminated glass does not become too large.
  • the maximum value of the interlayer film 210 is more preferably 3.4 mm or less, further preferably 2.8 mm or less, and particularly preferably 2.6 mm or less.
  • the interlayer films 210a and 210b and the transparent display device 100 are sandwiched between the glass plates 220a and 220b to form a laminated body.
  • this laminate is placed in a rubber bag and bonded at a temperature of 70 ° C. to 110 ° C. in a vacuum having a gauge pressure of ⁇ 65 kPa to ⁇ 100 kPa.
  • the heating conditions, temperature conditions, and laminating method are appropriately selected so that the transparent display device 100 does not deteriorate during manufacturing.
  • a laminated glass 200 having more excellent durability can be obtained.
  • this crimping treatment may not be performed.
  • the total thickness of the laminated glass 200 is preferably 2.8 mm to 10 mm. If the total thickness of the laminated glass 200 is 2.8 mm or more, sufficient rigidity can be ensured. Further, when the total thickness of the laminated glass 200 is 10 mm or less, sufficient transmittance can be obtained and haze can be reduced.
  • FIG. 19 is a schematic cross-sectional view showing another example of the laminated glass according to the second embodiment.
  • the laminated glass 200 of FIG. 19 includes the transparent display device 100 according to the second modification of FIG. 14 instead of the transparent display device 100 according to the first embodiment shown in FIG.
  • the laminated glass 200 has a protective layer 50 formed so as to cover the transparent display device 100. That is, the protective layer 50 is formed so as to cover the transparent insulating base material 10a and surround the peripheral edge of the transparent insulating base material 10a. Therefore, the peripheral edge of the transparent insulating base material 10a is difficult to see, which is preferable.
  • the protective layer 50 may be an interlayer film (third intermediate film). Further, the protective layer 50 may have different types of transparent resins in a portion including between the transparent insulating base material 10a and the transparent insulating base material 10b and a portion other than the transparent insulating base material 10b.
  • the window glass for a vehicle may be a double glazing in which a laminated glass 200 and at least one glass plate are arranged at intervals via a spacer.
  • a hollow layer is provided between the laminated glass 200 and the glass plate.
  • the hollow layer may be filled with dry air or may be filled with a rare gas such as krypton or argon.
  • the hollow layer may be a vacuum.
  • a gap holding member made of a metal material such as stainless steel or a resin material is provided in the hollow layer region between the laminated glass 200 and the glass plate. A plurality of may be arranged between them.
  • the spacer may be made of a metal such as aluminum or a resin such as polyamide or polypropylene.
  • the laminated glass 200 may be arranged on the outside of the vehicle or may be arranged on the inside of the vehicle.
  • the total visible light transmittance of the members located inside or outside the vehicle with respect to the transparent display device 100 may be set to, for example, 50% or less.
  • the transparent insulating base material 10a, the peripheral edge of the transparent insulating base material 10b, the wiring 40, the light emitting portion 20, and the like are difficult to see from the inside or the outside of the vehicle.
  • privacy glass may be used for the glass plate 220a located inside the vehicle.
  • a colored interlayer film may be used as the interlayer film 210a located inside the vehicle.
  • the laminated glass 200 may be provided with a colored film (including a smoke film) or a dimming element separately. The same applies to the glass plate 220b located on the outside of the vehicle and the interlayer film 210b located on the outside of the vehicle.
  • Privacy glass is a glass having a lower transparency than green glass and clear glass, and is also referred to as dark gray color glass. Privacy glass can be realized by adjusting the content of total iron converted into Fe 2 O 3 .
  • the visible light transmittance of the privacy glass can be adjusted to, for example, about 40% to 50% when the plate thickness is 1.8 mm and about 30% to 45% when the plate thickness is 2.0 mm.
  • the privacy glass is described in detail in, for example, International Publication No. 2015/088026, and the content thereof can be incorporated into the present specification as a reference.
  • the colored interlayer film is an interlayer film having a lower transparency than the clear interlayer film.
  • the visible light transmittance of the clear interlayer film is, for example, about 90% to 95% when the film thickness is 0.76 mm.
  • the colored interlayer film is obtained by coloring the above-mentioned material mentioned as the interlayer film 210.
  • a colorant is contained in a composition mainly containing a thermoplastic resin to obtain a colored interlayer film.
  • the colored interlayer film may contain a plasticizer for adjusting the glass transition point.
  • the laminated glass 200 may also lower the total visible light transmittance of the members located outside the vehicle than the transparent display device 100.
  • the transparent insulating base material 10a, the peripheral edge of the transparent insulating base material 10b, the wiring 40, the light emitting portion 20, and the like are less likely to be visually recognized from the outside of the vehicle and also from the inside of the vehicle.
  • the total visible light transmittance of the members located inside the vehicle with respect to the transparent display device 100 may also be lowered.
  • the transparent insulating base material 10a, the peripheral edge of the transparent insulating base material 10b, the wiring 40, the light emitting portion 20, and the like are more difficult to see from the inside of the vehicle and also from the outside of the vehicle.
  • FIG. 20 is a schematic partial plan view showing an example of the transparent display device according to the third embodiment.
  • the transparent display device according to the present embodiment includes a sensor 70 in the display area 101 in addition to the configuration of the transparent display device according to the first embodiment shown in FIG. That is, it has a function as a transparent sensing device.
  • the senor 70 is provided between predetermined pixels PIX and is connected to the power supply line 41 and the ground line 42. Further, the detection data by the sensor 70 is output via the data output line 46 extending from the sensor 70 in the y-axis direction. On the other hand, a control signal is input to the sensor 70 via the control signal line 47 extending in the y-axis direction to the sensor 70, and the sensor 70 is controlled.
  • the sensor 70 may be singular or plural.
  • a plurality of sensors 70 may be arranged at predetermined intervals, for example, in the x-axis direction or the y-axis direction.
  • the transparent display device according to the present embodiment is mounted on the windshield of the window glass of an automobile. That is, the transparent display device according to the present embodiment can also be applied to the laminated glass according to the second embodiment.
  • the sensor 70 is, for example, an illuminance sensor (for example, a light receiving element) for detecting illuminance inside and outside the vehicle.
  • the brightness of the display area 101 by the LED elements 21 to 23 is controlled according to the illuminance detected by the sensor 70.
  • the greater the illuminance outside the vehicle with respect to the illuminance inside the vehicle the greater the brightness of the display area 101 by the LED elements 21 to 23. With such a configuration, the visibility of the transparent display device is further improved.
  • the senor 70 may be an infrared sensor (for example, a light receiving element) or an image sensor (for example, a CMOS (Complementary Metal-Oxide-Semiconductor) image sensor) for detecting the line of sight of an observer (for example, a driver).
  • the transparent display device is driven only when the sensor 70 senses the line of sight.
  • the transparent display device is used for the laminated glass shown in FIG. 17, it is preferable because the transparent display device does not block the observer's field of view unless the observer directs his / her line of sight to the transparent display device.
  • the senor 70 which is an image sensor, may have a function of detecting the movement of the observer and, for example, turning on / off the transparent display device or switching the display screen based on the movement.
  • Other configurations are the same as those of the transparent display device according to the first embodiment.
  • FIG. 21 is a schematic partial plan view showing an example of the transparent sensing device according to the fourth embodiment.
  • the transparent sensing device according to the present embodiment replaces the light emitting unit 20 and the IC chip 30 in each pixel PIX in the configuration of the transparent display device according to the first embodiment shown in FIG. It is configured to include a sensor 70. That is, the transparent sensing device shown in FIG. 21 does not have a light emitting unit 20 and does not have a display function.
  • the transparent sensing device is an aspect of a transparent electronic device.
  • the sensing area in the transparent sensing device may correspond to the display area 101 in the transparent display device 100.
  • the sensor 70 is not particularly limited, but the transparent sensing device shown in FIG. 21 is a CMOS image sensor. That is, the transparent sensing device shown in FIG. 21 includes an image pickup region 301 composed of a plurality of pixel PIX arranged in a row direction (x-axis direction) and a column direction (y-axis direction), and has an image pickup function.
  • FIG. 21 shows a part of the imaging region 301, and shows a total of 4 pixels, 2 pixels each in the row direction and the column direction.
  • one pixel PIX is shown surrounded by an alternate long and short dash line.
  • the transparent insulating base material 10a and the protective layer 50 are omitted as in FIG.
  • FIG. 21 is a plan view, the sensor 70 is displayed in dots for easy understanding.
  • one sensor 70 is provided for each pixel PIX, is arranged between the power supply line 41 and the ground line 42 extending in the y-axis direction, and is connected to both of them. Further, the detection data by the sensor 70 is output via the data output line 46 extending from the sensor 70 in the y-axis direction. On the other hand, a control signal is input to the sensor 70 via the control signal line 47 extending in the y-axis direction to the sensor 70, and the sensor 70 is controlled.
  • the control signal is, for example, a synchronization signal, a reset signal, or the like.
  • the power line 41 may be connected to a battery (not shown).
  • FIG. 22 is a schematic cross-sectional view of the sensor 70.
  • the sensor 70 shown in FIG. 22 is a back-illuminated CMOS image sensor.
  • the sensor 70 as an image sensor is not particularly limited, and may be a surface-illuminated CMOS image sensor or a CCD (Charge-Coupled Device) image sensor.
  • CCD Charge-Coupled Device
  • each sensor 70 includes a wiring layer, a semiconductor substrate, color filters CF1 to CF3, and microlenses ML1 to ML3.
  • an internal wiring IW is formed inside the wiring layer.
  • photodiodes PD1 to PD3 are formed inside the semiconductor substrate.
  • a semiconductor substrate for example, a silicon substrate is formed on the wiring layer.
  • the internal wiring IW formed inside the wiring layer connects the wiring 40 (power supply line 41, ground line 42, data output line 46, and control signal line 47) with the photodiodes PD1 to PD3.
  • the photodiodes PD1 to PD3 are irradiated with light, a current is output from the photodiodes PD1 to PD3.
  • the currents output from the photodiodes PD1 to PD3 are amplified by an amplifier circuit (not shown), and are output via the internal wiring IW and the data output line 46.
  • the color filters CF1 to CF3 are formed on the photodiodes PD1 to PD3 formed inside the semiconductor substrate, respectively.
  • the color filters CF1 to CF3 are, for example, a red filter, a green filter, and a blue filter, respectively.
  • the microlenses ML1 to ML3 are placed on the color filters CF1 to CF3, respectively.
  • the light focused by the microlenses ML1 to ML3, which are convex lenses, is incident on the photodiodes PD1 to PD3 via the color filters CF1 to CF3, respectively.
  • the sensor 70 is a microsensor having a minute size with an occupied area of 250,000 ⁇ m 2 or less on the transparent insulating base material 10a.
  • the microsensor is a sensor having a minute size having an area of 250,000 ⁇ m 2 or less in a plan view.
  • the occupied area of the sensor 70 is, for example, preferably 25,000 ⁇ m 2 or less, more preferably 2500 ⁇ m 2 or less.
  • the lower limit of the occupied area of the sensor 70 is, for example, 10 ⁇ m 2 or more due to various manufacturing conditions and the like.
  • the shape of the sensor 70 shown in FIG. 21 is rectangular, but is not particularly limited.
  • the transparent sensing device according to the present embodiment can also be applied to the laminated glass according to the second embodiment.
  • the transparent sensing device according to the present embodiment is mounted on the windshield of the window glass of a vehicle (for example, an automobile)
  • the sensor 70 can acquire at least one of the images inside and outside the vehicle, for example. That is, the transparent sensing device according to this embodiment has a function as a drive recorder.
  • the sensor 70 in the transparent sensing device according to the fourth embodiment may be a single sensor. Further, the sensor 70 in the transparent sensing device according to the fourth embodiment is not limited to the image sensor, but may be an illuminance sensor, an infrared sensor, or the like exemplified in the third embodiment. Further, the sensor 70 may be a radar sensor, a Lidar sensor, or the like. For example, the inside and outside of a vehicle can be monitored by a window glass for a vehicle equipped with a transparent sensing device using these sensors 70.
  • the senor 70 according to the fourth embodiment is not particularly limited as long as it is a microsensor having a minute size of 250,000 ⁇ m 2 or less in the occupied area on the transparent insulating base material 10a.
  • the sensor 70 may be a temperature sensor, an ultraviolet sensor, a radio wave sensor, a pressure sensor, a sound sensor, a speed / acceleration sensor, or the like.
  • Other configurations are the same as those of the transparent display device according to the first embodiment.
  • the transparent display device may have a touch panel function.

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Abstract

L'invention concerne un dispositif électronique transparent équipé d'un substrat isolant transparent, d'un élément électronique présentant une surface égale ou inférieure à 250 000 µm2 formée sur une surface principale du substrat isolant transparent, et d'un distributeur de courant opaque qui distribue le courant à l'élément électronique. L'élément électronique est un élément constitué d'une diode électroluminescente ou un capteur. Le substrat isolant transparent comprend un premier substrat isolant transparent (10a) comportant un élément électronique et un premier câblage (40) connecté à l'élément électronique formé sur une surface principale et un second substrat isolant transparent (10b) comportant un second câblage (40) formé sur une surface principale. Aucun élément électronique n'est formé sur le second substrat isolant transparent. Une extrémité du premier câblage (40) et une extrémité du second câblage (40) sont électriquement connectées, et le distributeur de courant opaque (60) est connecté à l'autre extrémité du second câblage au niveau du bord du second substrat isolant transparent (10b).
PCT/JP2021/039226 2020-10-28 2021-10-25 Dispositif électronique transparent, verre feuilleté et procédé de production d'un dispositif électronique transparent Ceased WO2022091999A1 (fr)

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JP2022559108A JP7719338B2 (ja) 2020-10-28 2021-10-25 透明電子デバイス、合わせガラス、及び透明電子デバイスの製造方法
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