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WO2022091424A1 - Plaque à puits - Google Patents

Plaque à puits Download PDF

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Publication number
WO2022091424A1
WO2022091424A1 PCT/JP2020/041133 JP2020041133W WO2022091424A1 WO 2022091424 A1 WO2022091424 A1 WO 2022091424A1 JP 2020041133 W JP2020041133 W JP 2020041133W WO 2022091424 A1 WO2022091424 A1 WO 2022091424A1
Authority
WO
WIPO (PCT)
Prior art keywords
base material
well plate
electrode
conductive pattern
plate according
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Ceased
Application number
PCT/JP2020/041133
Other languages
English (en)
Japanese (ja)
Inventor
雅明 杉本
英明 横山
雄一 老田
清 藤巻
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Takahata Precision Co Ltd
Elephantech Inc
Original Assignee
Takahata Precision Co Ltd
Elephantech Inc
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Takahata Precision Co Ltd, Elephantech Inc filed Critical Takahata Precision Co Ltd
Priority to PCT/JP2020/041133 priority Critical patent/WO2022091424A1/fr
Priority to JP2021531140A priority patent/JP6963267B1/ja
Publication of WO2022091424A1 publication Critical patent/WO2022091424A1/fr
Anticipated expiration legal-status Critical
Ceased legal-status Critical Current

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Classifications

    • G—PHYSICS
    • G01—MEASURING; TESTING
    • G01N—INVESTIGATING OR ANALYSING MATERIALS BY DETERMINING THEIR CHEMICAL OR PHYSICAL PROPERTIES
    • G01N27/00—Investigating or analysing materials by the use of electric, electrochemical, or magnetic means
    • G01N27/26—Investigating or analysing materials by the use of electric, electrochemical, or magnetic means by investigating electrochemical variables; by using electrolysis or electrophoresis
    • G01N27/28—Electrolytic cell components
    • G—PHYSICS
    • G01—MEASURING; TESTING
    • G01N—INVESTIGATING OR ANALYSING MATERIALS BY DETERMINING THEIR CHEMICAL OR PHYSICAL PROPERTIES
    • G01N27/00—Investigating or analysing materials by the use of electric, electrochemical, or magnetic means
    • G01N27/26—Investigating or analysing materials by the use of electric, electrochemical, or magnetic means by investigating electrochemical variables; by using electrolysis or electrophoresis
    • G01N27/28—Electrolytic cell components
    • G01N27/30—Electrodes, e.g. test electrodes; Half-cells
    • G01N27/327—Biochemical electrodes, e.g. electrical or mechanical details for in vitro measurements

Definitions

  • the present invention relates to a well plate.
  • the substrate at least a portion of the main surface of the substrate, has at least one electrode and wiring conducting to this electrode, a well plate having at least one well for holding the solution in contact with the electrode, and a spacer.
  • a microwell electrochemical detection device the well plate has a plate portion having at least one through hole and a skirt-shaped portion extending from one opening of the through hole, and the through hole and the skirt-shaped portion.
  • Wells are formed with the inner wall, adjacent wells are arranged at a distance from each other, spacers are used to maintain the distance between the well plate and the substrate, and the open end of the skirt-like portion is the substrate, the electrode, and the substrate.
  • Patent Document 1 discloses that set the spacing so that the solution, which is in non-contact with the wiring and is held in the well, does not flow out from the open ends of the substrate, electrodes and wiring and the skirt-like part due to the surface tension of the solution.
  • a multi-well plate consisting of a well wall array having a plurality of wells and a transparent bottom plate attached to the well wall array with an adhesive so as to form the bottom surface of the wells, wherein the adhesive has a curing shrinkage rate.
  • a multi-well plate which is an ultraviolet curable adhesive of 4% or less, is also known (Patent Document 2).
  • the wells are arranged with high positional accuracy on the base material on which the conductive pattern and the electrodes are formed, and the material components are eluted from the constituent materials as compared with the case where the base material and the resin layer are bonded with an adhesive.
  • the material components are eluted from the constituent materials as compared with the case where the base material and the resin layer are bonded with an adhesive.
  • the well plate according to claim 1 is used to solve the above problems.
  • the conductive pattern arranged on the base material and An electrode continuously formed at one end of the conductive pattern and An external connection terminal for electrically connecting the conductive pattern and an external element provided outside the base material, which is electrically bonded to the conductive pattern.
  • a resin layer that forms a recess for holding the liquid in contact with the electrode and is integrated with the base material to cover the base material is provided. It is characterized by that.
  • the well plate according to claim 2 is used to solve the above-mentioned problems.
  • a deformable base material made of synthetic resin material and The conductive pattern arranged on the base material and An electrode continuously formed at one end of the conductive pattern and An external connection terminal for electrically connecting the conductive pattern and an external element provided outside the base material, which is electrically bonded to the conductive pattern.
  • a part of the base material on which the electrode is formed and depressed in the thickness direction and a resin layer that forms a recess for holding the liquid in contact with the electrode and is integrated with the base material to cover the base material are provided.
  • rice field It is characterized by that.
  • the invention according to claim 3 is the well plate according to claim 1 or 2. At least one of the electrodes is formed for each of the recesses. It is characterized by that.
  • the invention according to claim 4 is the well plate according to any one of claims 1 to 3.
  • the electrode is a metal electrode containing at least one of Au, Ag, Pt, Ag / AgCl, or at least one of ITO, IGO, Cr, Al, IZO, IGZO, ZnO, ZnO2 and TiO2.
  • the invention according to claim 5 is the well plate according to any one of claims 1 to 3.
  • the electrode is an enzyme-modified electrode in which an enzyme and / or an enzyme-containing substance is mixed as an electrode component. It is characterized by that.
  • the invention according to claim 6 is the well plate according to any one of claims 1 to 5.
  • a temperature sensor continuously formed at one end of the conductive pattern is arranged close to the electrode. It is characterized by that.
  • the invention according to claim 7 is the well plate according to any one of claims 1 to 6.
  • a heater continuously formed at one end of the conductive pattern is arranged so as to surround the electrode with the base material interposed therebetween. It is characterized by that.
  • the invention according to claim 8 is the well plate according to any one of claims 1 to 6. Only the electrode is exposed on the bottom surface of the recess. It is characterized by that.
  • the invention according to claim 9 is the well plate according to any one of claims 1 to 8. Further provided with a notification unit that notifies that the electrode and the external element are electrically connected by using at least one of light, sound, and display. It is characterized by that.
  • the invention according to claim 10 is the well plate according to any one of claims 1 to 9.
  • An information recording medium is further provided on the conductive pattern. It is characterized by that.
  • the invention according to claim 11 is the well plate according to any one of claims 1 to 10. Further provided with an insulating layer covering the conductive pattern, It is characterized by that.
  • the invention according to claim 12 is the well plate according to any one of claims 1 to 11.
  • the external connection terminal is formed integrally with the resin layer and is surrounded by a housing surrounding the external connection terminal so that the terminal surface which is the surface of the external connection terminal is exposed. It is characterized by that.
  • the invention according to claim 13 is the well plate according to any one of claims 1 to 11.
  • the external connection terminal is formed at one end of the base material by connecting to a lead wire extending from a part of the conductive pattern so as to project outward from the end of the resin layer. It is characterized by that.
  • the invention according to claim 14 is the well plate according to any one of claims 1 to 13.
  • the conductive pattern is a metal plating layer made of at least one metal selected from Cu, Ni, Ag, and Au formed on a base layer made of a catalyst that triggers metal plating growth. It is characterized by that.
  • the invention according to claim 15 is the well plate according to any one of claims 1 to 14.
  • the substrate has a light transmissive property. It is characterized by that.
  • the invention according to claim 16 is the well plate according to any one of claims 1 to 15.
  • the resin layer contains a material selected from the group consisting of PEEK, PC, PET, PMMA, PA, ABS, PE, PP, m-PPE, m-PPO, COC and COP. It is characterized by that.
  • the wells are arranged with high positional accuracy on the base material on which the conductive pattern and the electrodes are formed, and the structure is as compared with the case where the base material and the resin layer are adhered with an adhesive. It is possible to reduce the cost while suppressing the elution of material components from the material.
  • the wells are arranged with high positional accuracy on the deformable base material on which the conductive pattern and the electrodes are formed, and compared with the case where the base material and the resin layer are adhered with an adhesive. Therefore, it is possible to reduce the overall thickness while suppressing the elution of material components from the constituent materials.
  • the change in the voltage in the liquid contained in the recess can be stably measured.
  • the temperature data of the liquid contained in the recess can be acquired.
  • the liquid contained in the recess can be kept warm or heated.
  • the quality control information of the well plate can be retained.
  • the number of parts can be reduced.
  • the conductive pattern can be arranged along the three-dimensional shape of the deformed base material.
  • the inside of the recess can be brightened.
  • the chemical resistance can be improved.
  • FIG. 1A is a schematic plan view showing an example of a well plate
  • FIG. 1B is a schematic cross-sectional view
  • FIG. 2A is a schematic cross-sectional view showing an example of a well plate provided with a notification unit
  • FIG. 2B is a schematic cross-sectional view showing an example of a well plate provided with another notification unit
  • FIG. 3A is a schematic cross-sectional view showing an example of a well plate equipped with a heater
  • FIG. 3B is a partially enlarged view showing a heater arranged so as to surround an electrode with a substrate sandwiched therein
  • FIG. 3C is a temperature arranged in the well. It is a partial enlarged view which shows a sensor.
  • FIG. 3A is a schematic plan view showing an example of a well plate
  • FIG. 1B is a schematic cross-sectional view
  • FIG. 2A is a schematic cross-sectional view showing an example of a well plate provided with a notification unit
  • FIG. 2B is
  • FIG. 4A is a schematic plan view showing a well plate provided with an external connection terminal of a modified example
  • FIG. 4B is a schematic cross-sectional view. It is sectional drawing which shows the well plate which concerns on modification 1.
  • FIG. FIG. 6A is a schematic plan view showing a well plate according to Modification 2
  • FIG. 6B is a schematic cross-sectional view. It is a flowchart which shows an example of the outline procedure of the manufacturing method of the well plate which concerns on this embodiment. It is sectional drawing which shows the state which the conductive pattern and the base material in which an electrode are arranged, and the external connection terminal are set in the mold which fills the resin layer.
  • thermoformed base material in which a conductive pattern and electrodes are arranged and an external connection terminal are set in a mold filled with a resin layer and a part of a recess is formed in the base material. ..
  • FIG. 1A is a schematic plan view showing an example of a well plate 1
  • FIG. 1B is a schematic cross-sectional view
  • FIG. 2A is a schematic cross-sectional view showing an example of a well plate 1 provided with a notification unit 10.
  • 2B is a schematic cross-sectional view showing an example of a well plate 1 provided with another notification unit
  • FIG. 3A is a schematic cross-sectional view showing an example of a well plate 1 provided with a heater
  • FIG. 3B surrounds an electrode with a substrate sandwiched between them.
  • FIG. 3C is a partially enlarged view showing a heater 3b arranged in such a manner
  • FIG. 3C is a partially enlarged view showing a temperature sensor 3c arranged in the well 7.
  • the well plate 1 includes a base material 2, a conductive pattern 3 arranged on the base material 2, and an electrode 4 continuously formed at one end of the conductive pattern 3.
  • the external connection terminal 5 electrically bonded to the conductive pattern 3 and the bonding material 6 and the recess 7 (hereinafter referred to as the well 7) which is a well for holding the liquid in contact with the electrode 4 may be referred to.
  • a total of 6 wells 7 in 2 rows vertically and 3 columns horizontally are arranged in a grid pattern, but the number of wells is not limited to 6, but 12 or 24 wells. , 96 pieces, 384 pieces, etc. may be used.
  • the base material 2 on which the conductive pattern 3 used in the present embodiment is formed is preferably an insulating base material, and a base material made of a resin (hereinafter referred to as a resin base material), a glass base material, or the like can be used.
  • a resin base material is more preferable.
  • the resin base material also includes the following deformable film base material.
  • a glass base material for example, BK7 glass having a plate thickness of about 1 mm may be used, and a metal layer having a conductive pattern 3 may be formed on the glass base material by a sputtering method, a thin-film deposition method, or the like. can.
  • polyester such as polyethylene terephthalate (PET) and polyethylene naphthalate (PEN), nylon 6-10, polyamide (PA) such as nylon 46, polyetheretherketone (PEEK), and acrylonitrile butadiene styrene ( Examples thereof include thermoplastic resins such as ABS), polymethyl methacrylate (PMMA), and polyvinyl chloride.
  • PET polyethylene terephthalate
  • PEN polyethylene naphthalate
  • PA polyamide
  • PEEK polyetheretherketone
  • PEEK acrylonitrile butadiene styrene
  • thermoplastic resins such as ABS
  • PMMA polymethyl methacrylate
  • PET polyethylene terephthalate
  • PET polyethylene terephthalate
  • the base material 2 may be a deformable film base material, or may be a deformable film substrate by arranging the conductive pattern 3 on the film base material.
  • the "deformable film substrate” can be deformed after the conductive pattern 3 is placed, that is, from a substantially flat two-dimensional shape to a substantially three-dimensional shape by thermoforming, vacuum forming, pneumatic forming, or the like. Means a substrate that can be formed into.
  • the melting point Tm when the melting point Tm is present, it is preferably 150 ° C. or higher, and more preferably 200 ° C. or higher.
  • the range of the glass transition point Tg is preferably 20 ° C to 250 ° C, more preferably 50 ° C to 200 ° C, and most preferably 70 ° C to 150 ° C. If the glass transition point Tg is too low, the strain of the base material 2 may increase when the conductive pattern 3 is formed.
  • the thickness (mm) of the base material 2 is not particularly limited, but the resin base material is preferably 0.01 to 3 mm, more preferably 0.02 to 1 mm, and 0.03 to 0.03 to be in terms of balance between handleability and thinning. 0.1 mm is more preferable. Further, in the glass substrate, 0.01 to 3 mm is preferable, 0.3 to 0.8 mm is more preferable, and 0.4 to 0.7 mm is further preferable. In particular, for the film substrate, 0.005 to 0.25 mm is preferable, 0.01 to 0.2 mm is more preferable, and 0.05 to 0.188 mm is most preferable. If the thickness of the base material 2 is too thin, the strength may be insufficient and the strain of the base material 2 may be increased during the plating process of the conductive pattern 3.
  • a surface treatment to the surface of the base material 2 in order to uniformly apply the catalyst ink such as metal nanoparticles.
  • the surface treatment for example, corona treatment, plasma treatment, solvent treatment, and primer treatment can be used.
  • the base material 2 may be formed of a translucent material.
  • a polyethylene terephthalate (PET) film base material is preferable.
  • PET polyethylene terephthalate
  • a base layer (not shown) made of a catalyst such as metal nanoparticles that triggers the growth of metal plating is first formed in a predetermined pattern.
  • the base layer is formed by applying a catalyst ink such as metal nanoparticles on the base material 2 and then drying and firing.
  • the thickness ( ⁇ m) of the base layer is preferably 0.1 to 20 ⁇ m, more preferably 0.2 to 5 ⁇ m, and most preferably 0.5 to 2 ⁇ m. If the base layer is too thin, the strength of the base layer may decrease. Further, if the base layer is too thick, the metal nanoparticles are more expensive than ordinary metals, which may increase the manufacturing cost.
  • Gold, silver, copper, palladium, nickel and the like are used as the catalyst material, and gold, silver and copper are preferable from the viewpoint of conductivity, and copper, which is cheaper than gold and silver, is most preferable.
  • the particle size (nm) of the catalyst is preferably 1 to 500 nm, more preferably 10 to 100 nm. If the particle size is too small, the reactivity of the particles becomes high, which may adversely affect the storage stability and stability of the ink. If the particle size is too large, it becomes difficult to form a thin film uniformly, and there is a risk that ink particles are likely to precipitate.
  • the conductive pattern 3 is formed on the base layer by electrolytic plating or electroless plating.
  • the plating metal copper, nickel, tin, silver, gold and the like can be used, but copper is most preferable from the viewpoint of extensibility, conductivity and price.
  • the thickness ( ⁇ m) of the plating layer is preferably 0.03 to 100 ⁇ m, more preferably 1 to 35 ⁇ m, and most preferably 3 to 18 ⁇ m. If the plating layer is too thin, the mechanical strength may be insufficient and the conductivity may not be sufficiently obtained in practice. If the plating layer is too thick, the time required for plating becomes long, and the manufacturing cost may increase.
  • the conductive pattern 3 shows an example in which the electrode 4 and the external connection terminal 5 are electrically connected in FIG. 1, but a plurality of electronic components are attached to the conductive pattern 3 in addition to the electrode 4.
  • Electronic components include control circuits, distortion, resistance, capacitance, contact sensing such as TIR, optical sensing components, tactile components such as piezoelectric actuators, sound receiving or sounding such as microphones and speakers, memory chips, and programmable logic.
  • Device operating components such as chips and CPUs, digital signal processors (DSPs), ALS devices, PS devices, processing devices, MEMS and the like can be mentioned.
  • examples of the electronic component include a light emitting element 11 constituting the notification unit 10 described later, a speaker 12 (not shown), and an IC chip as an information recording medium.
  • FIG. 2 shows a well plate 1 provided with a notification unit 10.
  • the notification unit 10 includes a light emitting element 11 such as an LED and a lens 8a formed on a resin layer 8 that receives the light emitted by the light emitting element 11 and emits light to the outside, and the electrode 4 is an external device. It is designed to indicate that it is electrically connected to.
  • the light emitting element 11 is electrically bonded to the conductive pattern 3 formed on the base material 2 by a bonding material 6, and is supplied with power from the outside via an external connection terminal 5 electrically bonded to the conductive pattern 3. It emits light.
  • the notification unit 10 is provided with pores 8b on the outer surface of the resin layer 8 and transmits a part of the light emitted from the light emitting element 11 to display the notification content. good. Further, the notification unit 10 may perform notification by sound by electrically joining and arranging the speaker 12 (not shown) on the conductive pattern 3.
  • the conductive pattern 3 may be arranged on the other surface 2b on the opposite side of the one surface 2a of the base material 2 to form a double-sided substrate. Then, on the other surface 2b of the base material 2, a heater 3b continuously formed at one end of the conductive pattern 3 may be arranged so as to surround the electrode 4 with the base material 2 interposed therebetween. As a result, the liquid contained in the well 7 can be uniformly kept warm or heated as needed.
  • a temperature sensor 3c continuously formed at one end of the conductive pattern 3 may be arranged in the vicinity of the electrode 4. Thereby, the temperature data of the liquid contained in the well 7 can be acquired as needed. Further, in this case, the heater 3b may be further arranged by sandwiching the base material 2 on the other surface 2b of the base material 2.
  • the electrode 4 is arranged so as to be exposed on the bottom surface 7a of the well 7 formed of the resin layer 8 on the base material 2. At least one electrode 4 is formed in each well 7, for example, a working electrode 4A, a counter electrode 4B, and a reference electrode 4C are formed at the tip of the conductive pattern 3.
  • An external connection terminal 5 is electrically bonded to the other end of the conductive pattern 3, and the electrode 4 is connected to an external device for electrochemical measurement (not shown) via the conductive pattern 3 and the external connection terminal 5. Will be done.
  • the electrode 4 is used for electrochemical measurement, and it is preferable that the electrode 4 has excellent chemical stability.
  • Such an electrode may be a metal electrode containing at least one of Au, Ag, Pt, and Ag / AgCl, or among ITO, IGO, Cr, Al, IZO, IGZO, ZnO, ZnO2, and TiO2.
  • the electrode 4 may be an enzyme-modified electrode in which an enzyme and / or an enzyme-containing substance is mixed as an electrode component.
  • the enzyme may be any enzyme as long as it has the ability to catalyze the redox reaction of the substance to be measured and transmit the transfer of electrons based on the reaction to the electrode, and for example, PQQ, FADSNAD, NADP and the like are used as coenzymes. Dehydrogenase is preferably used.
  • a composition is prepared in which an enzyme and an electrode component other than the enzyme are uniformly kneaded together with a vehicle such as liquid paraffin, and this composition is shaped into an electrode. Or it can be formed by coating the surface of the electrode substrate with this composition.
  • an external connection terminal 5 for electrically connecting to an external device provided outside the well plate 1 is electrically joined on the conductive pattern 3.
  • the external connection terminal 5 is formed in a quadrangular prism shape using, for example, a copper alloy.
  • the surface of the external connection terminal 5 may be nickel-plated, and a metal such as gold or tin or an alloy containing these metals may be plated on the nickel plating.
  • the pitch of the external connection terminal 5 corresponds to the standard of the connector to be connected.
  • the external connection terminal 5 is composed of, for example, a terminal portion 5a serving as a connector terminal and an anchor portion 5b, and the anchor portion 5b is electrically bonded to the conductive pattern 3 with a bonding material 6.
  • solder can be mentioned as the joining material 6.
  • the solder is preferably a low-temperature solder having a melting temperature lower than the softening point of the base material 2, for example, an alloy (SnBi) of tin (Sn) and bismuth (Bi), tin (Sn), bismuth (Bi) and nickel.
  • Other alloys having a relatively low melting point as compared to the softening point of the base material 2 and other combinations of bismuth (Bi) and / or indium (In) can be used, for example, polyethylene as the base material 2. When terephthalate (PET) is used, it is desirable to have a melting point of 120 to 140 ° C., which is lower than the softening point of the base material 2.
  • the substrate 2 does not melt or otherwise deform, while the solder paste melts and chemically and physically with the conductive pattern 3. It will be in a state where it can be joined. Then, the solder solidifies, and the external connection terminal 5 is electrically bonded to the conductive pattern 3 via the solder.
  • solder is not limited to low-temperature soldering, and may be ordinary soldering, because it is non-contact and does not impose a load on the base material 2 as compared with trowel soldering.
  • the external connection terminal 5 is surrounded by a housing portion 82 integrally formed with a resin layer 8 described later so that the terminal portion 5a is exposed, and the external connection terminal 5 and the housing portion 82 are formed of the well plate 1 and the well plate 1. It constitutes a connector that electrically connects to an external device provided outside.
  • FIG. 4A is a schematic plan view showing a well plate 1 provided with an external connection terminal 5A of a modified example
  • FIG. 4B is a schematic cross-sectional view.
  • the external connection terminal 5A according to the modification is the base material 2 in which the connector contact is formed on the base material 2 that can be deformed as a part of the conductive pattern 3, and the external connection terminal 5A is formed.
  • One end 2c protrudes outward from the end portion of the resin layer 8.
  • a plate material 5Aa is arranged on the back surface 2b side of the base material 2 on which the external connection terminal 5A is formed, and forms a connector for electrically connecting to an external device provided outside the well plate 1.
  • the connector structure can be simplified and electrically connected to an external device provided outside.
  • the resin layer 8 is formed so as to cover one surface 2a on which the conductive pattern 3 of the base material 2 is arranged, and as shown in FIGS. 1 and 2, a recess 7 serving as a well is formed on the electrode 4 and the base material 2 is formed.
  • the resin layer 8 is a thermoplastic resin made of a resin material that can be secondarily molded with respect to the base material 2.
  • a resin material that can be secondarily molded with respect to the base material 2.
  • PEEK polyetheretherketone
  • PC polycarbonate
  • PET polyethylene terephthalate
  • PMMA polymethyl methacrylate
  • PA polyamide
  • ABS acrylonitrile butadiene styrene
  • PE polyethylene
  • thermoplastic resins selected from the group consisting of polypropylene (PP), modified polyphenylene ether (m-PPE), modified polyphenylene oxide (m-PPO), cyclic olefin copolymer (COC), and cycloolefin polymer (COP). ..
  • the resin layer 8 has mechanical strength and heat resistance, and PET and PC are preferable from the viewpoint of adhesiveness to the base material 2, and the resin layer 8 forms a well 7 for holding the liquid to be measured.
  • PEEK which has low reactivity with and has chemical resistance, is more preferable.
  • an interface layer AD on one surface 2a of the base material 2 so that the base material 2 and the main body portion 81 are liquid-tightly adhered to each other.
  • a binder ink containing a resin compatible with the materials of the base material 2 and the resin layer 8 is used.
  • the base material 2 is a PET resin film
  • the secondary molded resin layer 8 is a group consisting of PEEK, PC, PET, PMMA, PA, ABS, PE, PP, m-PPE, m-PPO, COC, and COP.
  • the thickness of the interface layer AD is preferably 0.5 to 50 ⁇ m.
  • corona treatment, plasma treatment, solvent treatment, and primer treatment may be performed.
  • FIG. 5 is a schematic cross-sectional view showing the well plate 1A according to the modified example 1.
  • the well plate 1A according to the first modification forms a recess 7A that becomes a well for holding a liquid in contact with a part of the base material 2 on which the electrode 4 is formed and depressed in the thickness direction and the base material 2.
  • a resin layer 8A that is integrated with the base material 2 and covers the base material 2 is provided.
  • the base material 2 having the electrode 4 formed at the tip of the conductive pattern 3 is made of a film made of a deformable synthetic resin material, more specifically, a film that can be formed into a three-dimensional shape by thermoforming. Therefore, when the resin layer 8A is secondarily molded, a part of the recess 7A which is depressed in the thickness direction and becomes a well is formed, and the resin layer 8A forms the remaining recess 7A. According to the well plate 1A according to the first modification, the well 7A is arranged on the deformable base material 2 on which the conductive pattern 3 and the electrode 4 are formed with high positional accuracy, and the whole is thinned while suppressing liquid leakage. can do.
  • FIG. 6A is a schematic plan view showing the well plate 1B according to the modified example 2
  • FIG. 6B is a schematic cross-sectional view.
  • the resin layer 8 covering the one side 2a on which the conductive pattern 3 of the base material 2 is arranged is exposed, and only the electrode 4 is exposed on the bottom surface 7Ba of the well.
  • the recess 7B is formed so as to do so.
  • the one side 2a on which the conductive pattern 3 of the base material 2 is arranged is covered with the insulating layer 9.
  • a solder resist is applied to one surface 2a to protect the conductive pattern 3.
  • the solder resist prevents the solder from adhering to other than the joint where the electrical connection is made and causing a circuit short-circuit when the external connection terminal 5 is mounted by soldering.
  • the insulation between the conductive patterns 3 is maintained, and the conductive patterns 3 are protected from the external environment such as dust, heat, and humidity.
  • FIG. 7 is a flowchart showing an example of a schematic procedure of the well plate 1 manufacturing method
  • FIG. 8 shows a substrate 2 on which a conductive pattern 3 and an electrode 4 are arranged and an external connection terminal 5.
  • FIG. 9 is a schematic cross-sectional view showing a state in which the resin layer 8 is set in a mold filled with the resin layer 8.
  • FIG. It is sectional drawing which shows the state which was set in the mold to be filled, and the part of the recess 7A was shaped into the base material 2.
  • the well plate 1 includes a base layer coating step S1 for applying a catalyst ink such as metal nanoparticles on the base material 2, and a wiring plating step S2 for forming a conductive pattern 3 on the base layer by a plating process.
  • the conductive pattern 3 In order to arrange the conductive pattern 3 on the substantially flat base material 2 formed into a predetermined shape and size, from catalyst particles such as metal nanoparticles that trigger the growth of metal plating on the base material 2.
  • the underlying layer is formed in a predetermined pattern.
  • the base material 2 is preferably subjected to surface treatment such as corona treatment, plasma treatment, solvent treatment, primer treatment, etc. in order to uniformly apply the catalyst ink composed of catalyst particles such as metal nanoparticles.
  • an inkjet printing method As a method of applying a catalyst ink composed of catalyst particles such as metal nanoparticles on the base material 2, an inkjet printing method, a silk screen printing method, a gravure printing method, an offset printing method, a flexo printing method, a roller coater method, and a brush coating method are used. Methods, spray method, knife jet coater method, pad printing method, gravure offset printing method, die coater method, bar coater method, spin coater method, comma coater method, impregnation coater method, dispenser method, metal mask method, etc. In this embodiment, an inkjet printing method is used.
  • the solvent is volatilized to leave only metal nanoparticles. Then, the solvent is removed (drying) and the metal nanoparticles are sintered (baking).
  • the firing temperature is preferably 100 ° C to 300 ° C, more preferably 150 ° C to 200 ° C. If the firing temperature is too low, the sintering of the metal nanoparticles will be insufficient, and components other than the metal nanoparticles will remain, so that adhesion may not be obtained. Further, if the firing temperature is too high, the base material 2 may be deteriorated or distorted.
  • the mass ratio is preferably 5% to 60%, more preferably 10% to 30%. If the content ratio is too low, the nanoparticles required to form the base layer of the metal nanoparticles may be insufficient and pinholes may occur, and if the content ratio is too high, the particles tend to aggregate in the ink. There is a risk that stability will be impaired.
  • plating process for wiring By performing electrolytic plating or electroless plating on the base layer formed on the base material 2 through the base layer coating step S1 in the wiring plating step S2, plating metal is deposited on the surface and the inside of the base layer.
  • the plating method is the same as that of known plating solutions and plating treatments, and specific examples thereof include electrolytic copper plating and electrolytic copper plating.
  • a working electrode 4A, a counter electrode 4B, and a reference electrode 4C are formed at the tip of each conductive pattern 3 arranged on the base material 2 in the wiring plating step S2.
  • surface treatment such as corona treatment, plasma treatment, solvent treatment, and primer treatment on the base material 2.
  • An electrode material ink containing at least one of PSS, carbon, polyacetylene, polythiophene (PT), polypyrrole, polyparaphenylene, polyaniline, and polysulfur nitride is applied.
  • Gravure offset printing method die coater method, bar coater method, spin coater method, comma coater method, impregnation coater method, dispenser method, metal mask method, and silk screen printing method is used in this embodiment. ..
  • the electrode material is a metal electrode material such as Au, Ag, Pt, Ag / AgCl
  • a plating method by electrolytic plating or electroless plating may be used.
  • the resin filling step S4 First, the resin of the base material 2 and the resin layer 8 is placed on one surface 2a in which the conductive pattern 3 of the base material 2 and the electrode 4 are arranged in the plating step S2 for wiring and the electrode forming step S3, if necessary.
  • a binder ink that forms the interface layer AD is applied according to the combination of materials.
  • the binder ink contains an adhesive resin and is applied by screen printing, inkjet printing, spray coating, brush painting or the like to improve the interfacial adhesive strength between the base material 2 and the resin layer 8 to be secondarily molded.
  • the fixed side mold KA and the movable side mold KB are closed in a state where the external connection terminal 5 is positioned and set in the secondary molding die, and the cavity CA is filled with the resin. ..
  • the terminal portion 5a of the external connection terminal 5 is fixed to the fixing hole KAa.
  • the main body 81 that forms a recess 7 as a well on the electrode 4 and covers one surface 2a of the base material 2 and a tubular shape that protrudes toward the one surface 2a of the base material 2 and has an external connection terminal inside the cylinder.
  • a resin layer 8 is formed in which the housing portion 82 surrounding the terminal portion 5a of the 5 is exposed so as to be integrated with the housing portion 82.
  • the base material 2 is a film made of a thermoplastic resin that can be shaped by thermoforming or the like
  • the base material 2 and the external connection terminal 5 are set in a mold for secondary molding as shown in FIG.
  • the fixed-side type KA and the movable-side type KB are closed, and the region where the electrode 4 of the base material 2 is arranged is shaped into a three-dimensional shape to form a part of the recessed recess 7A.
  • the cavity CA is filled with the resin, so that the base material 2 bent in the thickness direction and the resin filled in the cavity CA form the recess 7A.
  • the conductive pattern 3 is formed by secondary molding the resin layer 8 in a state where the conductive pattern 3 and the electrode 4 are arranged and placed together with the base material 2 and the external connection terminal 5 in a mold.
  • the electrode 4 and the external connection terminal 5 can be arranged with high positional accuracy on the base material 2 on which the is formed.
  • solder paste is applied to the conductive pattern 3, the anchor portion 5b of the external connection terminal 5, and the lead portion of the light emitting element 11.
  • the solder paste can be applied using a known device such as a stencil printing device, a screen printing device, and a dispenser device. In this embodiment, the solder paste is applied using a dispenser device.
  • the solder is melted and solidified, and the anchor portion 5b of the external connection terminal 5 and the light emitting element 11 are electrically bonded onto the conductive pattern 3 via the solder.
  • the base material 2 is a film made of a thermoplastic resin that can be deformed by thermal molding or the like, its softening point is low. No melting or other deformation is caused by the heat of the target joining step S5.
  • the soldering laser soldering or light firing soldering may be used.
  • the solder is not limited to low-temperature solder, and may be ordinary solder because it is non-contact and does not give a load to the base material 2.
  • the recess 7 as a well is formed on the base material 2 on which the conductive pattern 3 and the electrode 4 are formed with high positional accuracy, and the base material 2 and the resin are formed.
  • the layer 8 is bonded with an adhesive, it is possible to reduce the cost while suppressing the elution of material components from the constituent materials.

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Abstract

L'invention concerne une plaque à puits dans laquelle un puits est disposé avec une excellente précision de positionnement sur un matériau de base sur lequel un motif conducteur et une électrode sont formés, et qui peut réduire les coûts correspondants tout en supprimant l'élution d'un composant de matériau hors d'un matériau constitutif en comparaison avec le cas dans lequel le matériau de base et une couche de résine sont collés par un adhésif.　Cette plaque à puits comprend : un matériau de base composé d'un matériau en résine synthétique ; une borne de connexion externe pour connecter électriquement un motif conducteur disposé sur le matériau de base, une électrode formée dans la continuité d'une extrémité du motif conducteur, et un élément externe qui est électriquement relié au motif conducteur et qui est disposé à l'extérieur du matériau de base ; et une couche de résine, qui forme une section évidée destinée à contenir un liquide tout en étant en contact avec l'électrode, est intégrée au matériau de base, et recouvre le matériau de base.
PCT/JP2020/041133 2020-11-02 2020-11-02 Plaque à puits Ceased WO2022091424A1 (fr)

Priority Applications (2)

Application Number Priority Date Filing Date Title
PCT/JP2020/041133 WO2022091424A1 (fr) 2020-11-02 2020-11-02 Plaque à puits
JP2021531140A JP6963267B1 (ja) 2020-11-02 2020-11-02 ウェルプレート

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
PCT/JP2020/041133 WO2022091424A1 (fr) 2020-11-02 2020-11-02 Plaque à puits

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WO2022091424A1 true WO2022091424A1 (fr) 2022-05-05

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PCT/JP2020/041133 Ceased WO2022091424A1 (fr) 2020-11-02 2020-11-02 Plaque à puits

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WO (1) WO2022091424A1 (fr)

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Publication number Priority date Publication date Assignee Title
WO2023203757A1 (fr) * 2022-04-22 2023-10-26 エレファンテック株式会社 Structure de positionnement et de fixation et procédé de production de composants de montage en surface

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WO2005001018A1 (fr) * 2003-06-27 2005-01-06 Matsushita Electric Industrial Co., Ltd. Dispositif et systeme de mesure pharmacologique et contenant a cupules utilise a cet effet
JP2006015068A (ja) * 2004-07-05 2006-01-19 Nishitomo Co Ltd 生体情報測定センサおよび生体情報測定装置
WO2006132250A1 (fr) * 2005-06-06 2006-12-14 Nikkiso Co., Ltd. Biocapteur et cellule à biocapteur
JP2007010431A (ja) * 2005-06-29 2007-01-18 Matsushita Electric Ind Co Ltd 細胞電位測定用容器
JP2007171134A (ja) * 2005-12-26 2007-07-05 Kri Inc 生体関連物質検出装置
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JP2015187607A (ja) * 2014-03-11 2015-10-29 大日本印刷株式会社 微生物夾雑物の濃度検出方法、電極チップおよびオリゴペプチド
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