WO2022082868A1 - Electronic device - Google Patents
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- WO2022082868A1 WO2022082868A1 PCT/CN2020/126624 CN2020126624W WO2022082868A1 WO 2022082868 A1 WO2022082868 A1 WO 2022082868A1 CN 2020126624 W CN2020126624 W CN 2020126624W WO 2022082868 A1 WO2022082868 A1 WO 2022082868A1
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- WIPO (PCT)
- Prior art keywords
- hole
- sound
- cavity
- electronic device
- acoustic resistance
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Classifications
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- H—ELECTRICITY
- H04—ELECTRIC COMMUNICATION TECHNIQUE
- H04R—LOUDSPEAKERS, MICROPHONES, GRAMOPHONE PICK-UPS OR LIKE ACOUSTIC ELECTROMECHANICAL TRANSDUCERS; DEAF-AID SETS; PUBLIC ADDRESS SYSTEMS
- H04R1/00—Details of transducers, loudspeakers or microphones
- H04R1/20—Arrangements for obtaining desired frequency or directional characteristics
- H04R1/22—Arrangements for obtaining desired frequency or directional characteristics for obtaining desired frequency characteristic only
- H04R1/28—Transducer mountings or enclosures modified by provision of mechanical or acoustic impedances, e.g. resonator, damping means
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- H—ELECTRICITY
- H04—ELECTRIC COMMUNICATION TECHNIQUE
- H04R—LOUDSPEAKERS, MICROPHONES, GRAMOPHONE PICK-UPS OR LIKE ACOUSTIC ELECTROMECHANICAL TRANSDUCERS; DEAF-AID SETS; PUBLIC ADDRESS SYSTEMS
- H04R9/00—Transducers of moving-coil, moving-strip, or moving-wire type
- H04R9/06—Loudspeakers
Definitions
- the present application relates to the technical field of electronic devices, and in particular, to an electronic device having a speaker module.
- the speaker module in the existing electronic equipment has poor low frequency performance, which seriously affects the performance of the speaker module and the electronic equipment.
- the purpose of the present application is to provide an electronic device to solve the technical problem of poor low-frequency performance of existing electronic devices with small volume and large amplitude speaker modules.
- An electronic device comprising: a casing with an accommodation space and a speaker module accommodated in the accommodation space, the speaker module includes a casing with a cavity and a sound-emitting unit accommodated in the cavity, the The sound-generating unit divides the cavity into a front cavity and a rear cavity, the casing is provided with a sound hole and a through hole, the sound hole and the through hole are arranged at intervals; the sound hole communicates with the front cavity , the receiving space and the rear cavity are communicated through the through hole.
- the speaker module further includes an acoustic resistance member for adjusting the air flow velocity through the through hole, the acoustic resistance member is attached to the housing and covers the One side of the through hole or the acoustic resistance member is accommodated in the through hole.
- the acoustic resistance member covers a side of the through hole close to the rear cavity or the acoustic resistance member covers a side of the through hole away from the rear cavity .
- the acoustic resistance member includes at least one layer of acoustic resistance material, and each of the acoustic resistance material layers is stacked in sequence.
- the acoustic resistance member is attached to the housing.
- the acoustic impedance of the acoustic resistance member ranges from 50 Pa ⁇ s/m to 200 Pa ⁇ s/m.
- the sound-generating unit has a diaphragm
- the housing includes an upper cover that is opposite to the diaphragm and is spaced apart, and a lower cover that is spaced apart and opposite to the upper cover.
- a cover and a side wall that is bent and extended from the edge of the upper cover toward the lower cover and fixed with the lower cover, the upper cover, the side wall and the lower cover are surrounded to form the cavity,
- the front cavity is formed by an interval between the upper cover and the diaphragm.
- the sound hole is formed through the side wall and surrounded by the side wall and the upper cover.
- the upper cover extends toward the lower cover to form a blocking wall, the blocking wall, the side wall and the upper cover enclose a sound-absorbing cavity for accommodating sound-absorbing materials,
- the sound-absorbing cavity is spaced apart from the through hole and the sound-emitting unit, and the sound-absorbing cavity is communicated with the rear cavity.
- the baffle wall is spaced apart from the lower cover, and an end of the baffle wall away from the upper cover is covered with a ventilating spacer, and the ventilating spacer is connected to the lower cover.
- the sound-absorbing cavity and the rear cavity are communicated with the air-permeable spacer, the sound-absorbing cavity is located on the side of the through hole away from the sound-emitting unit, and the upper cover is provided with a connection with the sound-absorbing cavity.
- a connected powder filling hole, a leakage hole communicated with the sound-absorbing cavity is formed through the lower cover, and the diameter of the powder filling hole is larger than that of the leakage hole.
- the above-mentioned electronic equipment by opening a through hole on the shell of the speaker module, communicates the rear cavity of the speaker module with the accommodation space of the shell of the electronic device, thereby improving the low-frequency amplitude of the speaker module and improving the rated power.
- the low-frequency performance of the electronic device is improved; and the above-mentioned electronic device only has through-holes on the casing, which improves the performance and reduces the increase in the manufacturing cost.
- Embodiment 1 is a schematic structural diagram of an electronic device in Embodiment 1 and Embodiment 2 of the application;
- FIG. 2 is a schematic structural diagram of a speaker module in the electronic device according to Embodiment 1 of the application;
- FIG. 3 is a schematic structural diagram from another perspective of the speaker module in the electronic device according to Embodiment 1 of the present application;
- Fig. 4 is A-A sectional view in Fig. 3;
- Fig. 5 is the exploded structure schematic diagram of the loudspeaker module shown in Fig. 3;
- FIG. 6 is a schematic structural diagram of a speaker module in the electronic device according to Embodiment 2 of the application;
- Fig. 7 is B-B in Fig. 6 sectional view
- FIG. 8 is a schematic diagram of an exploded structure of the speaker module shown in FIG. 6 .
- the electronic device 1 can be a mobile phone, a notebook computer, a tablet computer, a player, an earphone, a smart watch, or smart glasses.
- the electronic device 1 includes: a housing 20 having an accommodation space 21 and a speaker module 10 accommodated in the accommodation space 21 .
- the speaker module 10 is fixed on the casing 20 .
- the speaker module 10 includes a casing 100 having a cavity and a sound generating unit 200 accommodated in the cavity.
- the sound-generating unit 200 divides the cavity into a front cavity 101 and a rear cavity 102 .
- the housing 100 is provided with a sound hole 103 and a through hole 104 , the sound hole 103 and the through hole 104 are spaced apart, the sound hole 103 communicates with the front cavity 101 , and the accommodation space 21 and the rear cavity 102 communicate through the through hole 104 .
- the above-mentioned electronic device 1 by opening a through hole 104 on the housing 100 of the speaker module 10, connects the rear cavity 102 of the speaker module 10 with the accommodation space 21 of the housing 20 of the electronic device 1, thereby improving the speaker module.
- the low frequency amplitude of 10 can improve the low frequency performance of the electronic device 1 under the rated power; and the electronic device 1 only has the through hole 104 on the casing 100 , which improves the performance and reduces the increase in the manufacturing cost.
- the sound-generating unit 200 has a diaphragm
- the housing 100 includes an upper cover 110 that is opposite to the diaphragm and is spaced apart, a lower cover 120 that is spaced apart and opposite to the upper cover 110 , and a cover 120 that faces downward from the edge of the upper cover 110 .
- the side wall 130 is bent and extended in the direction and fixed with the lower cover 120 .
- the upper cover 110 , the side wall 130 and the lower cover 120 are surrounded to form a cavity, and the upper cover 110 and the diaphragm are spaced apart to form a front cavity 101 .
- the lower cover 120 is detachably connected to the side wall 130 to facilitate the design, replacement or maintenance of the internal structure of the casing 100 and the components accommodated in the casing 100 .
- the sound hole 103 is located on the side wall 130 , so that the speaker module 10 emits sound from the side. The sound is transmitted outside the electronic device 1 .
- the upper cover 110 includes a detachable plate 111 corresponding to the sound hole 103 .
- the sound hole 103 is formed by surrounding the side wall 130 and the upper cover 110. Since the detachable plate 111 and the side wall 130 are detachably connected, it can be understood that in other embodiments, the detachable plate 111 can be removed to further increase the sound The hole 103 area and/or the volume of the front cavity 101 .
- the speaker module 10 further includes an acoustic resistance member, which is used to adjust the air flow velocity through the through hole 104 , and the acoustic resistance member can adjust the through hole 104 and the accommodating space 21 by adjusting the air flow velocity of the through hole 104 .
- the acoustic resistance element can directly affect the resonance strength of the rear cavity 102 . In terms of frequency response performance, the greater the acoustic impedance of the acoustic resistance element, the smoother the resonance valley in the frequency response, but the improvement in low frequency performance is small.
- the range of the acoustic impedance of the acoustic resistance element is 50 Pa ⁇ s/m ⁇ 200 Pa ⁇ s/m, and the acoustic impedance is the acoustic impedance per unit area. It represents the ratio of the sound pressure of the sound wave on the wave front in the medium to the vibration velocity of the particle on the surface.
- the acoustic impedance ratio of the acoustic resistance element is within the above range, which not only ensures that the resonance valley on the frequency response is relatively flat, and obtains a relatively ideal frequency response performance, but also ensures that the speaker module 10 has better low-frequency performance.
- the acoustic resistance element also has a great influence on the shell vibration of the casing 20 . Since the acoustic resistance element can reduce the resonance strength of the rear cavity 102 and the through hole 104 , it can reduce the shell vibration of the casing 20 caused by the vibration of the speaker module 10 , thereby directly reducing the strength of the casing vibration of the casing 20 . Ultimately, the selection of the acoustic impedance rate of the acoustic resistance component should be jointly determined by combining the frequency response and the shell vibration.
- the through hole 104 makes the air inside the casing 100 communicate with the air inside the casing 20, during the vibration of the speaker module 10, the air inside the casing 100 and the casing 20 has air convection, which increases the convective heat dissipation efficiency.
- the temperature rise of the voice coil of the speaker module 10 is slowed down during operation, and the power bearing capability of the speaker module 10 is improved.
- the acoustic resistance member is attached to the casing 100 and covers one side of the through hole 104 or is accommodated in the through hole 104 .
- the acoustic resistance element covers the side of the through hole 104 close to the rear cavity 102 or the acoustic resistance element covers the side of the through hole 104 away from the rear cavity 102 .
- the shape of the through hole 104 includes, but is not limited to, a circle, a square, a triangle or an ellipse.
- the length of the through hole 104 is not limited. In this embodiment, the through hole 104 is vertical and runs through the side wall 130 , and its length is the same as the thickness of the side wall 130 .
- the through hole 104 may also be disposed obliquely relative to the side wall 130 and run through the side wall 130 , and the length of the through hole 104 is greater than the thickness of the side wall 130 .
- the ventilation area of the through hole 104 and the volume of the acoustic resistance member are not limited, and can be designed according to the performance requirements of the speaker module 10 and the electronic device 1 .
- the acoustic resistance member includes at least one layer of acoustic resistance material, and the layers of acoustic resistance material are stacked in sequence. Wherein, each layer of acoustic resistance material arranged in layers may be arranged along the axis of the through hole 104 . Further, the acoustic resistance member may be made of acoustic resistance materials such as mesh or sound-absorbing cotton, and is disposed on the casing 100 by means of lamination. In this embodiment, the acoustic resistance member may be attached to the side walls 130 near both sides of the through hole 104 , and the acoustic resistance member may also be attached to the hole wall forming the through hole 104 .
- the upper cover 110 extends toward the lower cover 120 to form a blocking wall 140 .
- the blocking wall 140 , the side wall 130 and the upper cover 110 enclose a sound-absorbing cavity 150 for accommodating sound-absorbing materials, the sound-absorbing cavity 150 , the through hole 104 and the sound-emitting unit. 200 are arranged at intervals, and the sound-absorbing cavity 150 communicates with the rear cavity 102 .
- one end of the blocking wall 140 is fixed on the side of the side wall 130 where the through hole 104 is provided, and a gap is formed between the other end of the blocking wall 140 and the side wall 130 to connect the sound absorbing cavity 150 with the rear cavity 102 .
- the baffle wall 140 By arranging the baffle wall 140 to form a bass tube in the rear cavity 102 that communicates with the through hole 104, the coupling between the rear cavity of the speaker module and the internal space of the electronic device 1 can be increased, which is equivalent to expanding the rear cavity of the speaker module. It can improve the low frequency sensitivity of the speaker module, thereby improving the overall sound quality, thereby improving the acoustic performance of the product.
- a sound absorbing member 160 connected to the housing 100 is accommodated in the cavity, and the sound absorbing member 160 is located on the side of the through hole 104 away from the blocking wall 140 .
- the sound-absorbing member 160 and the housing 100 are integrally constructed, the sound-absorbing member 160 and the sound-emitting unit 200 are located at opposite ends of the cavity, respectively, and a blocking wall 140 is provided between the sound-absorbing member 160 and the sound-emitting unit 200 to communicate with each other.
- the hole 104 is provided on the side wall 130 between the blocking wall 140 and the sound absorbing member 160 .
- the electronic device 1 can be a mobile phone, a notebook computer, a tablet computer, a player, an earphone, a smart watch, or smart glasses.
- the electronic device 1 includes: a housing 20 having an accommodation space 21 and a speaker module 10 accommodated in the accommodation space 21 .
- the speaker module 10 is fixed on the casing 20 .
- the speaker module 10 includes a casing 100 having a cavity and a sound generating unit 200 accommodated in the cavity.
- the sound-generating unit 200 divides the cavity into a front cavity 101 and a rear cavity 102 .
- the housing 100 is provided with a sound hole 103 and a through hole 104 , the sound hole 103 and the through hole 104 are spaced apart, the sound hole 103 communicates with the front cavity 101 , and the accommodation space 21 and the rear cavity 102 communicate through the through hole 104 .
- the above-mentioned electronic device 1 by opening a through hole 104 on the housing 100 of the speaker module 10, connects the rear cavity 102 of the speaker module 10 with the accommodation space 21 of the housing 20 of the electronic device 1, thereby improving the speaker module.
- the low frequency amplitude of 10 can improve the low frequency performance of the electronic device 1 under the rated power; and the electronic device 1 only has the through hole 104 on the casing 100 , which improves the performance and reduces the increase in the manufacturing cost.
- the sound-generating unit 200 has a diaphragm
- the housing 100 includes an upper cover 110 that is opposite to the diaphragm and is spaced apart, a lower cover 120 that is spaced apart and opposite to the upper cover 110 , and a cover 120 that faces downward from the edge of the upper cover 110 .
- the side wall 130 is bent and extended in the direction and fixed with the lower cover 120 .
- the upper cover 110 , the side wall 130 and the lower cover 120 are surrounded to form a cavity, and the upper cover 110 and the diaphragm are spaced apart to form a front cavity 101 .
- the lower cover 120 is detachably connected to the side wall 130 to facilitate the design, replacement or maintenance of the internal structure of the casing 100 and the components accommodated in the casing 100 .
- the sound hole 103 is located on the side wall 130 , so that the speaker module 10 emits sound from the side. The sound is transmitted outside the electronic device 1 .
- the upper cover 110 includes a detachable plate 111 corresponding to the sound hole 103 .
- the sound hole 103 is formed by surrounding the side wall 130 and the upper cover 110. Since the detachable plate 111 and the side wall 130 are detachably connected, it can be understood that in other embodiments, the detachable plate 111 can be removed to further increase the sound The hole 103 area and/or the volume of the front cavity 101 .
- the speaker module 10 further includes an acoustic resistance member, which is used to adjust the air flow velocity through the through hole 104 , and the acoustic resistance member can adjust the through hole 104 and the accommodating space 21 by adjusting the air flow velocity of the through hole 104 .
- the acoustic resistance element can directly affect the resonance strength of the rear cavity 102 . In terms of frequency response performance, the greater the acoustic impedance of the acoustic resistance element, the smoother the resonance valley in the frequency response, but the improvement in low frequency performance is small.
- the range of the acoustic impedance of the acoustic resistance element is 50 Pa ⁇ s/m ⁇ 200 Pa ⁇ s/m, and the acoustic impedance is the acoustic impedance per unit area. It represents the ratio of the sound pressure of the sound wave on the wave front in the medium to the vibration velocity of the particle on the surface.
- the acoustic impedance ratio of the acoustic resistance element is within the above range, which not only ensures that the resonance valley on the frequency response is relatively flat, and obtains a relatively ideal frequency response performance, but also ensures that the speaker module 10 has better low-frequency performance.
- the acoustic resistance element also has a great influence on the shell vibration of the casing 20 . Since the acoustic resistance element can reduce the resonance strength of the rear cavity 102 and the through hole 104 , it can reduce the shell vibration of the casing 20 caused by the vibration of the speaker module 10 , thereby directly reducing the strength of the casing vibration of the casing 20 . Ultimately, the selection of the acoustic impedance rate of the acoustic resistance component should be jointly determined by combining the frequency response and the shell vibration.
- the through hole 104 makes the air inside the casing 100 communicate with the air inside the casing 20, during the vibration of the speaker module 10, the air inside the casing 100 and the casing 20 has air convection, which increases the convective heat dissipation efficiency.
- the temperature rise of the voice coil of the speaker module 10 is slowed down during operation, and the power bearing capability of the speaker module 10 is improved.
- the acoustic resistance member is attached to the casing 100 and covers one side of the through hole 104 or is accommodated in the through hole 104 .
- the acoustic resistance element covers the side of the through hole 104 close to the rear cavity 102 or the acoustic resistance element covers the side of the through hole 104 away from the rear cavity 102 .
- the shape of the through hole 104 includes, but is not limited to, a circle, a square, a triangle or an ellipse.
- the length of the through hole 104 is not limited. In this embodiment, the through hole 104 is vertical and runs through the side wall 130 , and its length is the same as the thickness of the side wall 130 .
- the through hole 104 may also be disposed obliquely relative to the side wall 130 and run through the side wall 130 , and the length of the through hole 104 is greater than the thickness of the side wall 130 .
- the ventilation area of the through hole 104 and the volume of the acoustic resistance member are not limited, and can be designed according to the performance requirements of the speaker module 10 and the electronic device 1 .
- the acoustic resistance member includes at least one layer of acoustic resistance material, and the layers of acoustic resistance material are stacked in sequence. Wherein, each layer of acoustic resistance material arranged in layers may be arranged along the axis of the through hole 104 . Further, the acoustic resistance member may be made of acoustic resistance materials such as mesh or sound-absorbing cotton, and is disposed on the casing 100 by means of lamination. In this embodiment, the acoustic resistance member may be attached to the side walls 130 near both sides of the through hole 104 , and the acoustic resistance member may also be attached to the hole wall forming the through hole 104 .
- the upper cover 110 extends toward the lower cover 120 to form a blocking wall 140 .
- the blocking wall 140 , the side wall 130 and the upper cover 110 enclose a sound-absorbing cavity 150 for accommodating sound-absorbing materials, the sound-absorbing cavity 150 , the through hole 104 and the sound-emitting unit. 200 are arranged at intervals, and the sound-absorbing cavity 150 communicates with the rear cavity 102 .
- the baffle wall 140 and the lower cover 120 are spaced apart, and one end of the baffle wall 140 away from the upper cover 110 is covered with a ventilating spacer. 150 is located on the side of the through hole 104 away from the sound-emitting unit 200.
- the upper cover 110 is provided with a powder filling hole 151 that communicates with the sound-absorbing cavity 150.
- the lower cover 120 is provided with a leakage hole 152 that communicates with the sound-absorbing cavity 150.
- the powder filling hole 151 The pore size is larger than the pore size of the leakage hole 152 .
- the leakage hole 152 ensures the circulation of gas, so as to ensure that the gas in the sound absorbing cavity 150 can be discharged through the leakage hole 152 when the sound absorbing material is filled.
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Abstract
Description
本申请涉及电子设备技术领域，具体涉及一种具有扬声器模组的电子设备。The present application relates to the technical field of electronic devices, and in particular, to an electronic device having a speaker module.
现有电子设备中的扬声器模组在小体积、大振幅的设计策略下，扬声器模组的低频性能较差，严重影响扬声器模组和电子设备的性能。Under the design strategy of small volume and large amplitude, the speaker module in the existing electronic equipment has poor low frequency performance, which seriously affects the performance of the speaker module and the electronic equipment.
因此，有必要提供一种电子设备。Therefore, it is necessary to provide an electronic device.
本申请的目的在于提供一种电子设备，以解决现有具有小体积、大振幅扬声器模组的电子设备的低频性能较差的技术问题。The purpose of the present application is to provide an electronic device to solve the technical problem of poor low-frequency performance of existing electronic devices with small volume and large amplitude speaker modules.
为解决上述技术问题，本申请的技术方案如下：In order to solve the above-mentioned technical problems, the technical scheme of the present application is as follows:
一种电子设备，包括：具有收容空间的外壳以及收容于所述收容空间的扬声器模组，所述扬声器模组包括具有腔体的壳体以及收容于所述腔体内的发声单体，所述发声单体将所述腔体分隔成前腔和后腔，所述壳体上设有声孔和通孔，所述声孔与所述通孔间隔设置；所述声孔与所述前腔连通，所述收容空间和所述后腔通过所述通孔连通。An electronic device, comprising: a casing with an accommodation space and a speaker module accommodated in the accommodation space, the speaker module includes a casing with a cavity and a sound-emitting unit accommodated in the cavity, the The sound-generating unit divides the cavity into a front cavity and a rear cavity, the casing is provided with a sound hole and a through hole, the sound hole and the through hole are arranged at intervals; the sound hole communicates with the front cavity , the receiving space and the rear cavity are communicated through the through hole.
在所述电子设备的一些实施例中，所述扬声器模组还包括用于调节经过所述通孔的空气流通速度的声阻件，所述声阻件贴设于所述壳体并覆盖所述通孔一侧或所述声阻件收容于所述通孔内。In some embodiments of the electronic device, the speaker module further includes an acoustic resistance member for adjusting the air flow velocity through the through hole, the acoustic resistance member is attached to the housing and covers the One side of the through hole or the acoustic resistance member is accommodated in the through hole.
在所述电子设备的一些实施例中，所述声阻件覆盖在所述通孔靠近所述后腔的一侧或所述声阻件覆盖在所述通孔远离所述后腔的一侧。In some embodiments of the electronic device, the acoustic resistance member covers a side of the through hole close to the rear cavity or the acoustic resistance member covers a side of the through hole away from the rear cavity .
在所述电子设备的一些实施例中，所述声阻件包括至少一层声阻材料层，各所述声阻材料层依次层叠设置。In some embodiments of the electronic device, the acoustic resistance member includes at least one layer of acoustic resistance material, and each of the acoustic resistance material layers is stacked in sequence.
在所述电子设备的一些实施例中，所述声阻件贴合于所述壳体。In some embodiments of the electronic device, the acoustic resistance member is attached to the housing.
在所述电子设备的一些实施例中，所述声阻件的声阻抗率的范围为50Pa•s/m~200Pa•s/m。In some embodiments of the electronic device, the acoustic impedance of the acoustic resistance member ranges from 50 Pa·s/m to 200 Pa·s/m.
在所述电子设备的一些实施例中，所述发声单体具有振膜，所述壳体包括与所述振膜正对且间隔设置的上盖、与所述上盖间隔且相对设置的下盖以及自所述上盖边缘朝所述下盖方向弯折延伸并与所述下盖固定的侧壁，所述上盖、所述侧壁和所述下盖围设形成所述腔体，所述上盖与所述振膜之间间隔形成所述前腔。In some embodiments of the electronic device, the sound-generating unit has a diaphragm, and the housing includes an upper cover that is opposite to the diaphragm and is spaced apart, and a lower cover that is spaced apart and opposite to the upper cover. a cover and a side wall that is bent and extended from the edge of the upper cover toward the lower cover and fixed with the lower cover, the upper cover, the side wall and the lower cover are surrounded to form the cavity, The front cavity is formed by an interval between the upper cover and the diaphragm.
在所述电子设备的一些实施例中，所述声孔贯穿开设于所述侧壁并通过所述侧壁与所述上盖围设形成。In some embodiments of the electronic device, the sound hole is formed through the side wall and surrounded by the side wall and the upper cover.
在所述电子设备的一些实施例中，所述上盖朝所述下盖方向延伸形成有挡壁，所述挡壁与所述侧壁及所述上盖围成收容吸音材料的吸音腔，所述吸音腔与所述通孔及所述发声单体均间隔设置，所述吸音腔与所述后腔连通。In some embodiments of the electronic device, the upper cover extends toward the lower cover to form a blocking wall, the blocking wall, the side wall and the upper cover enclose a sound-absorbing cavity for accommodating sound-absorbing materials, The sound-absorbing cavity is spaced apart from the through hole and the sound-emitting unit, and the sound-absorbing cavity is communicated with the rear cavity.
在所述电子设备的一些实施例中，所述挡壁与所述下盖间隔设置，所述挡壁远离所述上盖一端盖设有透气隔离件，所述透气隔离件与所述下盖间隔设置，所述吸音腔与所述后腔经所述透气隔离件连通，所述吸音腔位于所述通孔远离所述发声单体一侧，所述上盖贯穿开设有与所述吸音腔连通的灌粉孔，所述下盖贯穿开设有与所述吸音腔连通的泄露孔，所述灌粉孔的孔径大于与所述泄露孔的孔径。In some embodiments of the electronic device, the baffle wall is spaced apart from the lower cover, and an end of the baffle wall away from the upper cover is covered with a ventilating spacer, and the ventilating spacer is connected to the lower cover. The sound-absorbing cavity and the rear cavity are communicated with the air-permeable spacer, the sound-absorbing cavity is located on the side of the through hole away from the sound-emitting unit, and the upper cover is provided with a connection with the sound-absorbing cavity. A connected powder filling hole, a leakage hole communicated with the sound-absorbing cavity is formed through the lower cover, and the diameter of the powder filling hole is larger than that of the leakage hole.
本申请的有益效果在于：The beneficial effects of this application are:
上述电子设备，通过在扬声器模组的壳体上开设通孔，将扬声器模组的后腔与电子设备的外壳具有的收容空间连通，从而提升了扬声器模组的低频振幅，在额定功率下提升了电子设备的低频性能；并且上述电子设备仅在壳体上开设通孔，在提升性能的同时，制造成本增幅较小。The above-mentioned electronic equipment, by opening a through hole on the shell of the speaker module, communicates the rear cavity of the speaker module with the accommodation space of the shell of the electronic device, thereby improving the low-frequency amplitude of the speaker module and improving the rated power. The low-frequency performance of the electronic device is improved; and the above-mentioned electronic device only has through-holes on the casing, which improves the performance and reduces the increase in the manufacturing cost.
图1为本申请的实施例1和实施例2中电子设备的结构示意图；1 is a schematic structural diagram of an electronic device in Embodiment 1 and Embodiment 2 of the application;
图2为本申请的实施例1的电子设备中扬声器模组的结构示意图；2 is a schematic structural diagram of a speaker module in the electronic device according to Embodiment 1 of the application;
图3为本申请的实施例1的电子设备中扬声器模组的另一视角的结构示意图；3 is a schematic structural diagram from another perspective of the speaker module in the electronic device according to Embodiment 1 of the present application;
图4为图3中A-A向剖视图；Fig. 4 is A-A sectional view in Fig. 3;
图5为图3所示扬声器模组的爆炸结构示意图；Fig. 5 is the exploded structure schematic diagram of the loudspeaker module shown in Fig. 3;
图6为本申请的实施例2的电子设备中扬声器模组的结构示意图；6 is a schematic structural diagram of a speaker module in the electronic device according to Embodiment 2 of the application;
图7为图6中B-B向剖视图；Fig. 7 is B-B in Fig. 6 sectional view;
图8为图6所示扬声器模组的爆炸结构示意图。FIG. 8 is a schematic diagram of an exploded structure of the speaker module shown in FIG. 6 .
下面结合附图和实施方式对本申请作进一步说明。The present application will be further described below with reference to the accompanying drawings and embodiments.
实施例1Example 1
请一并结合图1至图5，现对本申请提供的电子设备1进行说明。该电子设备1可为手机、笔记本电脑、平板电脑、播放器、耳机、智能手表或智能眼镜等。具体地，电子设备1包括：具有收容空间21的外壳20以及收容于收容空间21的扬声器模组10。扬声器模组10固设于外壳20。进一步地，扬声器模组10包括具有腔体的壳体100以及收容于腔体内的发声单体200。发声单体200将腔体分隔成前腔101和后腔102。壳体100上设有声孔103和通孔104，声孔103与通孔104间隔设置，声孔103与前腔101连通，收容空间21和后腔102通过通孔104连通。上述电子设备1，通过在扬声器模组10的壳体100上开设通孔104，将扬声器模组10的后腔102与电子设备1的外壳20具有的收容空间21连通，从而提升了扬声器模组10的低频振幅，在额定功率下提升电子设备1的低频性能；并且上述电子设备1仅在壳体100上开设通孔104，在提升性能的同时，制造成本增幅较小。Please refer to FIG. 1 to FIG. 5 together to describe the electronic device 1 provided by the present application. The electronic device 1 can be a mobile phone, a notebook computer, a tablet computer, a player, an earphone, a smart watch, or smart glasses. Specifically, the electronic device 1 includes: a housing 20 having an accommodation space 21 and a speaker module 10 accommodated in the accommodation space 21 . The speaker module 10 is fixed on the casing 20 . Further, the speaker module 10 includes a casing 100 having a cavity and a sound generating unit 200 accommodated in the cavity. The sound-generating unit 200 divides the cavity into a front cavity 101 and a rear cavity 102 . The housing 100 is provided with a sound hole 103 and a through hole 104 , the sound hole 103 and the through hole 104 are spaced apart, the sound hole 103 communicates with the front cavity 101 , and the accommodation space 21 and the rear cavity 102 communicate through the through hole 104 . The above-mentioned electronic device 1, by opening a through hole 104 on the housing 100 of the speaker module 10, connects the rear cavity 102 of the speaker module 10 with the accommodation space 21 of the housing 20 of the electronic device 1, thereby improving the speaker module. The low frequency amplitude of 10 can improve the low frequency performance of the electronic device 1 under the rated power; and the electronic device 1 only has the through hole 104 on the casing 100 , which improves the performance and reduces the increase in the manufacturing cost.
进一步地，发声单体200具有振膜，壳体100包括与振膜正对且间隔设置的上盖110、与上盖110间隔且相对设置的下盖120以及自上盖110边缘朝下盖120方向弯折延伸并与下盖120固定的侧壁130，上盖110、侧壁130和下盖120围设形成腔体，上盖110与振膜之间间隔形成前腔101。本实施例中，下盖120均与侧壁130可拆连接，以方便对壳体100内部结构以及收容于壳体100内的部件进行设计、替换或维修。Further, the sound-generating unit 200 has a diaphragm, and the housing 100 includes an upper cover 110 that is opposite to the diaphragm and is spaced apart, a lower cover 120 that is spaced apart and opposite to the upper cover 110 , and a cover 120 that faces downward from the edge of the upper cover 110 . The side wall 130 is bent and extended in the direction and fixed with the lower cover 120 . The upper cover 110 , the side wall 130 and the lower cover 120 are surrounded to form a cavity, and the upper cover 110 and the diaphragm are spaced apart to form a front cavity 101 . In this embodiment, the lower cover 120 is detachably connected to the side wall 130 to facilitate the design, replacement or maintenance of the internal structure of the casing 100 and the components accommodated in the casing 100 .
本实施例中，声孔103位于侧壁130上，使得扬声器模组10为侧发声，声孔103与设在外壳20上的出声孔22正对连通，用于将发声单体200形成的声音传播至电子设备1之外。本实施例中，上盖110包括与声孔103相对应的可拆板111。声孔103通过侧壁130与上盖110围设形成，由于可拆板111与侧壁130为可拆连接，可以理解为在其他实施例中，可将可拆板111拆除，以进一步增加声孔103面积和/或前腔101的体积。In this embodiment, the sound hole 103 is located on the side wall 130 , so that the speaker module 10 emits sound from the side. The sound is transmitted outside the electronic device 1 . In this embodiment, the upper cover 110 includes a detachable plate 111 corresponding to the sound hole 103 . The sound hole 103 is formed by surrounding the side wall 130 and the upper cover 110. Since the detachable plate 111 and the side wall 130 are detachably connected, it can be understood that in other embodiments, the detachable plate 111 can be removed to further increase the sound The hole 103 area and/or the volume of the front cavity 101 .
进一步地，扬声器模组10还包括声阻件，声阻件用于调节经过通孔104的空气流通速度，声阻件通过调节通孔104的空气流通速度，可调节通孔104与收容空间21之间的谐振强度。声阻件可直接影响后腔102共振强度，从频响性能来讲，声阻件的声阻抗率越大，频响上谐振谷越平缓，但低频性能提升较小。因此，本实施例中，声阻件的声阻抗率的范围为50Pa•s/m~200Pa•s/m，声阻抗率即单位面积上的声阻抗。它表示声波在介质中波阵面上的声压与该面上质点的振动速度之比。声阻件的声阻抗率位于上述范围内，既保证了频响上谐振谷较平缓，得到较为理想的频响性能，又保证了扬声器模组10具有较好的低频性能。同时，声阻件对外壳20的壳振影响也较大。由于声阻件能够减缓后腔102与通孔104共振强度，因此，能够减缓扬声器模组10振动带来的外壳20壳振，直接降低了外壳20壳振的强度。最终，声阻件的声阻抗率选择应综合频响和壳振两方面共同决定。Further, the speaker module 10 further includes an acoustic resistance member, which is used to adjust the air flow velocity through the through hole 104 , and the acoustic resistance member can adjust the through hole 104 and the accommodating space 21 by adjusting the air flow velocity of the through hole 104 . resonance strength between. The acoustic resistance element can directly affect the resonance strength of the rear cavity 102 . In terms of frequency response performance, the greater the acoustic impedance of the acoustic resistance element, the smoother the resonance valley in the frequency response, but the improvement in low frequency performance is small. Therefore, in this embodiment, the range of the acoustic impedance of the acoustic resistance element is 50 Pa·s/m~200 Pa·s/m, and the acoustic impedance is the acoustic impedance per unit area. It represents the ratio of the sound pressure of the sound wave on the wave front in the medium to the vibration velocity of the particle on the surface. The acoustic impedance ratio of the acoustic resistance element is within the above range, which not only ensures that the resonance valley on the frequency response is relatively flat, and obtains a relatively ideal frequency response performance, but also ensures that the speaker module 10 has better low-frequency performance. At the same time, the acoustic resistance element also has a great influence on the shell vibration of the casing 20 . Since the acoustic resistance element can reduce the resonance strength of the rear cavity 102 and the through hole 104 , it can reduce the shell vibration of the casing 20 caused by the vibration of the speaker module 10 , thereby directly reducing the strength of the casing vibration of the casing 20 . Ultimately, the selection of the acoustic impedance rate of the acoustic resistance component should be jointly determined by combining the frequency response and the shell vibration.
另外，由于通孔104使壳体100内部空气与外壳20内部空气有了连通，在扬声器模组10振动过程中，壳体100和外壳20内部的空气有了空气对流，增加了对流散热效率，使扬声器模组10的音圈温度在工作时温升减缓，提升了扬声器模组10的功率承受能力。In addition, since the through hole 104 makes the air inside the casing 100 communicate with the air inside the casing 20, during the vibration of the speaker module 10, the air inside the casing 100 and the casing 20 has air convection, which increases the convective heat dissipation efficiency. The temperature rise of the voice coil of the speaker module 10 is slowed down during operation, and the power bearing capability of the speaker module 10 is improved.
进一步地，声阻件贴设于壳体100并覆盖通孔104一侧或收容于通孔104内。具体地，声阻件覆盖在通孔104靠近后腔102一侧或声阻件覆盖在通孔104远离后腔102一侧。同时，通孔104的形状包括但不限于圆形、方形、三角形或椭圆形。通孔104的长度不限，本实施例中，通孔104垂直并贯穿开设于侧壁130，其长度与侧壁130的厚度相同。可以理解为在其他实施例中，通孔104还可以相对侧壁130倾斜设置并贯穿开设于侧壁130，其长度大于侧壁130的厚度。通孔104的通气面积以及声阻件的体积不限，可根据对扬声器模组10以及电子设备1的性能要求进行设计。Further, the acoustic resistance member is attached to the casing 100 and covers one side of the through hole 104 or is accommodated in the through hole 104 . Specifically, the acoustic resistance element covers the side of the through hole 104 close to the rear cavity 102 or the acoustic resistance element covers the side of the through hole 104 away from the rear cavity 102 . Meanwhile, the shape of the through hole 104 includes, but is not limited to, a circle, a square, a triangle or an ellipse. The length of the through hole 104 is not limited. In this embodiment, the through hole 104 is vertical and runs through the side wall 130 , and its length is the same as the thickness of the side wall 130 . It can be understood that in other embodiments, the through hole 104 may also be disposed obliquely relative to the side wall 130 and run through the side wall 130 , and the length of the through hole 104 is greater than the thickness of the side wall 130 . The ventilation area of the through hole 104 and the volume of the acoustic resistance member are not limited, and can be designed according to the performance requirements of the speaker module 10 and the electronic device 1 .
进一步地，声阻件包括至少一层声阻材料层，各声阻材料层依次层叠设置。其中，层叠设置的各声阻材料层可沿通孔104的轴线设置。进一步地，声阻件可由网状物或吸音棉等声阻材料制成并通过贴合的方式设置在壳体100上。本实施例中，声阻件可贴合在通孔104的两侧附近的侧壁130上，声阻件也可以贴合在形成通孔104的孔壁上。Further, the acoustic resistance member includes at least one layer of acoustic resistance material, and the layers of acoustic resistance material are stacked in sequence. Wherein, each layer of acoustic resistance material arranged in layers may be arranged along the axis of the through hole 104 . Further, the acoustic resistance member may be made of acoustic resistance materials such as mesh or sound-absorbing cotton, and is disposed on the casing 100 by means of lamination. In this embodiment, the acoustic resistance member may be attached to the side walls 130 near both sides of the through hole 104 , and the acoustic resistance member may also be attached to the hole wall forming the through hole 104 .
进一步地，上盖110朝下盖120方向延伸形成有挡壁140，挡壁140与侧壁130及上盖110围成收容吸音材料的吸音腔150，吸音腔150与通孔104及发声单体200均间隔设置，吸音腔150与后腔102连通。本实施例中，挡壁140的一端固定在侧壁130设有通孔104的一侧，挡壁140的另一端与侧壁130之间形成有间隙，以将吸音腔150与后腔102连通。通过设置挡壁140在后腔102内形成与通孔104连通的低音管，可增加扬声器模组的后腔与电子设备1内部空间的耦合性，相当于扩大了扬声器模组的后腔，如此可提高扬声器模组的低频灵敏度，进而提升整体音质，从而提高产品的声学性能。Further, the upper cover 110 extends toward the lower cover 120 to form a blocking wall 140 . The blocking wall 140 , the side wall 130 and the upper cover 110 enclose a sound-absorbing cavity 150 for accommodating sound-absorbing materials, the sound-absorbing cavity 150 , the through hole 104 and the sound-emitting unit. 200 are arranged at intervals, and the sound-absorbing cavity 150 communicates with the rear cavity 102 . In this embodiment, one end of the blocking wall 140 is fixed on the side of the side wall 130 where the through hole 104 is provided, and a gap is formed between the other end of the blocking wall 140 and the side wall 130 to connect the sound absorbing cavity 150 with the rear cavity 102 . By arranging the baffle wall 140 to form a bass tube in the rear cavity 102 that communicates with the through hole 104, the coupling between the rear cavity of the speaker module and the internal space of the electronic device 1 can be increased, which is equivalent to expanding the rear cavity of the speaker module. It can improve the low frequency sensitivity of the speaker module, thereby improving the overall sound quality, thereby improving the acoustic performance of the product.
进一步地，腔体内收容有与壳体100连接的吸音件160，吸音件160位于通孔104远离挡壁140一侧。本实施例中，吸音件160与壳体100为一体结构，吸音件160与发声单体200分别位于腔体相对的两端，在吸音件160与发声单体200之间设置挡壁140，通孔104设置在挡壁140与吸音件160之间的侧壁130上。通过设置吸音件160可以有效提升声音的低频灵敏度，保证声孔103的出声质量。Further, a sound absorbing member 160 connected to the housing 100 is accommodated in the cavity, and the sound absorbing member 160 is located on the side of the through hole 104 away from the blocking wall 140 . In this embodiment, the sound-absorbing member 160 and the housing 100 are integrally constructed, the sound-absorbing member 160 and the sound-emitting unit 200 are located at opposite ends of the cavity, respectively, and a blocking wall 140 is provided between the sound-absorbing member 160 and the sound-emitting unit 200 to communicate with each other. The hole 104 is provided on the side wall 130 between the blocking wall 140 and the sound absorbing member 160 . By arranging the sound absorbing member 160, the low frequency sensitivity of the sound can be effectively improved, and the sound quality of the sound hole 103 can be ensured.
实施例2Example 2
请一并结合图1和图6至图8，现对本申请提供的电子设备1进行说明。该电子设备1可为手机、笔记本电脑、平板电脑、播放器、耳机、智能手表或智能眼镜等。具体地，电子设备1包括：具有收容空间21的外壳20以及收容于收容空间21的扬声器模组10。扬声器模组10固设于外壳20。进一步地，扬声器模组10包括具有腔体的壳体100以及收容于腔体内的发声单体200。发声单体200将腔体分隔成前腔101和后腔102。壳体100上设有声孔103和通孔104，声孔103与通孔104间隔设置，声孔103与前腔101连通，收容空间21和后腔102通过通孔104连通。上述电子设备1，通过在扬声器模组10的壳体100上开设通孔104，将扬声器模组10的后腔102与电子设备1的外壳20具有的收容空间21连通，从而提升了扬声器模组10的低频振幅，在额定功率下提升电子设备1的低频性能；并且上述电子设备1仅在壳体100上开设通孔104，在提升性能的同时，制造成本增幅较小。Please refer to FIG. 1 and FIG. 6 to FIG. 8 together to describe the electronic device 1 provided by the present application. The electronic device 1 can be a mobile phone, a notebook computer, a tablet computer, a player, an earphone, a smart watch, or smart glasses. Specifically, the electronic device 1 includes: a housing 20 having an accommodation space 21 and a speaker module 10 accommodated in the accommodation space 21 . The speaker module 10 is fixed on the casing 20 . Further, the speaker module 10 includes a casing 100 having a cavity and a sound generating unit 200 accommodated in the cavity. The sound-generating unit 200 divides the cavity into a front cavity 101 and a rear cavity 102 . The housing 100 is provided with a sound hole 103 and a through hole 104 , the sound hole 103 and the through hole 104 are spaced apart, the sound hole 103 communicates with the front cavity 101 , and the accommodation space 21 and the rear cavity 102 communicate through the through hole 104 . The above-mentioned electronic device 1, by opening a through hole 104 on the housing 100 of the speaker module 10, connects the rear cavity 102 of the speaker module 10 with the accommodation space 21 of the housing 20 of the electronic device 1, thereby improving the speaker module. The low frequency amplitude of 10 can improve the low frequency performance of the electronic device 1 under the rated power; and the electronic device 1 only has the through hole 104 on the casing 100 , which improves the performance and reduces the increase in the manufacturing cost.
进一步地，发声单体200具有振膜，壳体100包括与振膜正对且间隔设置的上盖110、与上盖110间隔且相对设置的下盖120以及自上盖110边缘朝下盖120方向弯折延伸并与下盖120固定的侧壁130，上盖110、侧壁130和下盖120围设形成腔体，上盖110与振膜之间间隔形成前腔101。本实施例中，下盖120均与侧壁130可拆连接，以方便对壳体100内部结构以及收容于壳体100内的部件进行设计、替换或维修。Further, the sound-generating unit 200 has a diaphragm, and the housing 100 includes an upper cover 110 that is opposite to the diaphragm and is spaced apart, a lower cover 120 that is spaced apart and opposite to the upper cover 110 , and a cover 120 that faces downward from the edge of the upper cover 110 . The side wall 130 is bent and extended in the direction and fixed with the lower cover 120 . The upper cover 110 , the side wall 130 and the lower cover 120 are surrounded to form a cavity, and the upper cover 110 and the diaphragm are spaced apart to form a front cavity 101 . In this embodiment, the lower cover 120 is detachably connected to the side wall 130 to facilitate the design, replacement or maintenance of the internal structure of the casing 100 and the components accommodated in the casing 100 .
本实施例中，声孔103位于侧壁130上，使得扬声器模组10为侧发声，声孔103与设在外壳20上的出声孔22正对连通，用于将发声单体200形成的声音传播至电子设备1之外。本实施例中，上盖110包括与声孔103相对应的可拆板111。声孔103通过侧壁130与上盖110围设形成，由于可拆板111与侧壁130为可拆连接，可以理解为在其他实施例中，可将可拆板111拆除，以进一步增加声孔103面积和/或前腔101的体积。In this embodiment, the sound hole 103 is located on the side wall 130 , so that the speaker module 10 emits sound from the side. The sound is transmitted outside the electronic device 1 . In this embodiment, the upper cover 110 includes a detachable plate 111 corresponding to the sound hole 103 . The sound hole 103 is formed by surrounding the side wall 130 and the upper cover 110. Since the detachable plate 111 and the side wall 130 are detachably connected, it can be understood that in other embodiments, the detachable plate 111 can be removed to further increase the sound The hole 103 area and/or the volume of the front cavity 101 .
进一步地，扬声器模组10还包括声阻件，声阻件用于调节经过通孔104的空气流通速度，声阻件通过调节通孔104的空气流通速度，可调节通孔104与收容空间21之间的谐振强度。声阻件可直接影响后腔102共振强度，从频响性能来讲，声阻件的声阻抗率越大，频响上谐振谷越平缓，但低频性能提升较小。因此，本实施例中，声阻件的声阻抗率的范围为50Pa•s/m~200Pa•s/m，声阻抗率即单位面积上的声阻抗。它表示声波在介质中波阵面上的声压与该面上质点的振动速度之比。声阻件的声阻抗率位于上述范围内，既保证了频响上谐振谷较平缓，得到较为理想的频响性能，又保证了扬声器模组10具有较好的低频性能。同时，声阻件对外壳20的壳振影响也较大。由于声阻件能够减缓后腔102与通孔104共振强度，因此，能够减缓扬声器模组10振动带来的外壳20壳振，直接降低了外壳20壳振的强度。最终，声阻件的声阻抗率选择应综合频响和壳振两方面共同决定。Further, the speaker module 10 further includes an acoustic resistance member, which is used to adjust the air flow velocity through the through hole 104 , and the acoustic resistance member can adjust the through hole 104 and the accommodating space 21 by adjusting the air flow velocity of the through hole 104 . resonance strength between. The acoustic resistance element can directly affect the resonance strength of the rear cavity 102 . In terms of frequency response performance, the greater the acoustic impedance of the acoustic resistance element, the smoother the resonance valley in the frequency response, but the improvement in low frequency performance is small. Therefore, in this embodiment, the range of the acoustic impedance of the acoustic resistance element is 50 Pa·s/m~200 Pa·s/m, and the acoustic impedance is the acoustic impedance per unit area. It represents the ratio of the sound pressure of the sound wave on the wave front in the medium to the vibration velocity of the particle on the surface. The acoustic impedance ratio of the acoustic resistance element is within the above range, which not only ensures that the resonance valley on the frequency response is relatively flat, and obtains a relatively ideal frequency response performance, but also ensures that the speaker module 10 has better low-frequency performance. At the same time, the acoustic resistance element also has a great influence on the shell vibration of the casing 20 . Since the acoustic resistance element can reduce the resonance strength of the rear cavity 102 and the through hole 104 , it can reduce the shell vibration of the casing 20 caused by the vibration of the speaker module 10 , thereby directly reducing the strength of the casing vibration of the casing 20 . Ultimately, the selection of the acoustic impedance rate of the acoustic resistance component should be jointly determined by combining the frequency response and the shell vibration.
另外，由于通孔104使壳体100内部空气与外壳20内部空气有了连通，在扬声器模组10振动过程中，壳体100和外壳20内部的空气有了空气对流，增加了对流散热效率，使扬声器模组10的音圈温度在工作时温升减缓，提升了扬声器模组10的功率承受能力。In addition, since the through hole 104 makes the air inside the casing 100 communicate with the air inside the casing 20, during the vibration of the speaker module 10, the air inside the casing 100 and the casing 20 has air convection, which increases the convective heat dissipation efficiency. The temperature rise of the voice coil of the speaker module 10 is slowed down during operation, and the power bearing capability of the speaker module 10 is improved.
进一步地，声阻件贴设于壳体100并覆盖通孔104一侧或收容于通孔104内。具体地，声阻件覆盖在通孔104靠近后腔102一侧或声阻件覆盖在通孔104远离后腔102一侧。同时，通孔104的形状包括但不限于圆形、方形、三角形或椭圆形。通孔104的长度不限，本实施例中，通孔104垂直并贯穿开设于侧壁130，其长度与侧壁130的厚度相同。可以理解为在其他实施例中，通孔104还可以相对侧壁130倾斜设置并贯穿开设于侧壁130，其长度大于侧壁130的厚度。通孔104的通气面积以及声阻件的体积不限，可根据对扬声器模组10以及电子设备1的性能要求进行设计。Further, the acoustic resistance member is attached to the casing 100 and covers one side of the through hole 104 or is accommodated in the through hole 104 . Specifically, the acoustic resistance element covers the side of the through hole 104 close to the rear cavity 102 or the acoustic resistance element covers the side of the through hole 104 away from the rear cavity 102 . Meanwhile, the shape of the through hole 104 includes, but is not limited to, a circle, a square, a triangle or an ellipse. The length of the through hole 104 is not limited. In this embodiment, the through hole 104 is vertical and runs through the side wall 130 , and its length is the same as the thickness of the side wall 130 . It can be understood that in other embodiments, the through hole 104 may also be disposed obliquely relative to the side wall 130 and run through the side wall 130 , and the length of the through hole 104 is greater than the thickness of the side wall 130 . The ventilation area of the through hole 104 and the volume of the acoustic resistance member are not limited, and can be designed according to the performance requirements of the speaker module 10 and the electronic device 1 .
进一步地，声阻件包括至少一层声阻材料层，各声阻材料层依次层叠设置。其中，层叠设置的各声阻材料层可沿通孔104的轴线设置。进一步地，声阻件可由网状物或吸音棉等声阻材料制成并通过贴合的方式设置在壳体100上。本实施例中，声阻件可贴合在通孔104的两侧附近的侧壁130上，声阻件也可以贴合在形成通孔104的孔壁上。Further, the acoustic resistance member includes at least one layer of acoustic resistance material, and the layers of acoustic resistance material are stacked in sequence. Wherein, each layer of acoustic resistance material arranged in layers may be arranged along the axis of the through hole 104 . Further, the acoustic resistance member may be made of acoustic resistance materials such as mesh or sound-absorbing cotton, and is disposed on the casing 100 by means of lamination. In this embodiment, the acoustic resistance member may be attached to the side walls 130 near both sides of the through hole 104 , and the acoustic resistance member may also be attached to the hole wall forming the through hole 104 .
进一步地，上盖110朝下盖120方向延伸形成有挡壁140，挡壁140与侧壁130及上盖110围成收容吸音材料的吸音腔150，吸音腔150与通孔104及发声单体200均间隔设置，吸音腔150与后腔102连通。挡壁140与下盖120间隔设置，挡壁140远离上盖110一端盖设有透气隔离件，透气隔离件与下盖120间隔设置，吸音腔150与后腔102经透气隔离件连通，吸音腔150位于通孔104远离发声单体200一侧，上盖110贯穿开设有与吸音腔150连通的灌粉孔151，下盖120贯穿开设有与吸音腔150连通的泄露孔152，灌粉孔151的孔径大于与泄露孔152的孔径。泄露孔152保证气体的流通，从而保证填充吸音材料时，吸音腔150中的气体能够由泄露孔152排出。Further, the upper cover 110 extends toward the lower cover 120 to form a blocking wall 140 . The blocking wall 140 , the side wall 130 and the upper cover 110 enclose a sound-absorbing cavity 150 for accommodating sound-absorbing materials, the sound-absorbing cavity 150 , the through hole 104 and the sound-emitting unit. 200 are arranged at intervals, and the sound-absorbing cavity 150 communicates with the rear cavity 102 . The baffle wall 140 and the lower cover 120 are spaced apart, and one end of the baffle wall 140 away from the upper cover 110 is covered with a ventilating spacer. 150 is located on the side of the through hole 104 away from the sound-emitting unit 200. The upper cover 110 is provided with a powder filling hole 151 that communicates with the sound-absorbing cavity 150. The lower cover 120 is provided with a leakage hole 152 that communicates with the sound-absorbing cavity 150. The powder filling hole 151 The pore size is larger than the pore size of the leakage hole 152 . The leakage hole 152 ensures the circulation of gas, so as to ensure that the gas in the sound absorbing cavity 150 can be discharged through the leakage hole 152 when the sound absorbing material is filled.
以上所述的仅是本申请的实施方式，在此应当指出，对于本领域的普通技术人员来说，在不脱离本申请创造构思的前提下，还可以做出改进，但这些均属于本申请的保护范围。The above are only the embodiments of the present application. It should be pointed out that for those of ordinary skill in the art, improvements can be made without departing from the creative concept of the present application, but these belong to the present application. scope of protection.
Claims (10)
Applications Claiming Priority (2)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN202022395601.0U CN213661902U (en) | 2020-10-23 | 2020-10-23 | Electronic device |
| CN202022395601.0 | 2020-10-23 |
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| WO2022082868A1 true WO2022082868A1 (en) | 2022-04-28 |
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| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| PCT/CN2020/126624 Ceased WO2022082868A1 (en) | 2020-10-23 | 2020-11-05 | Electronic device |
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| CN (1) | CN213661902U (en) |
| WO (1) | WO2022082868A1 (en) |
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| Publication number | Priority date | Publication date | Assignee | Title |
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| CN114302290A (en) * | 2021-12-27 | 2022-04-08 | 毕亚峰 | Equivalent expansion structure of speaker rear cavity, speaker and electronic equipment |
Citations (3)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| WO2014023008A1 (en) * | 2012-08-09 | 2014-02-13 | 易力声科技(深圳)有限公司 | Earphone |
| CN107371106A (en) * | 2017-07-04 | 2017-11-21 | 瑞声科技(新加坡)有限公司 | Loudspeaker enclosure |
| CN207869368U (en) * | 2018-01-27 | 2018-09-14 | 瑞声科技(新加坡)有限公司 | Loudspeaker enclosure |
-
2020
- 2020-10-23 CN CN202022395601.0U patent/CN213661902U/en active Active
- 2020-11-05 WO PCT/CN2020/126624 patent/WO2022082868A1/en not_active Ceased
Patent Citations (3)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| WO2014023008A1 (en) * | 2012-08-09 | 2014-02-13 | 易力声科技(深圳)有限公司 | Earphone |
| CN107371106A (en) * | 2017-07-04 | 2017-11-21 | 瑞声科技(新加坡)有限公司 | Loudspeaker enclosure |
| CN207869368U (en) * | 2018-01-27 | 2018-09-14 | 瑞声科技(新加坡)有限公司 | Loudspeaker enclosure |
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