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WO2022075640A1 - Dispositif électronique comprenant une structure de connecteur de blindage - Google Patents

Dispositif électronique comprenant une structure de connecteur de blindage Download PDF

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Publication number
WO2022075640A1
WO2022075640A1 PCT/KR2021/013026 KR2021013026W WO2022075640A1 WO 2022075640 A1 WO2022075640 A1 WO 2022075640A1 KR 2021013026 W KR2021013026 W KR 2021013026W WO 2022075640 A1 WO2022075640 A1 WO 2022075640A1
Authority
WO
WIPO (PCT)
Prior art keywords
substrate
receptacle
disposed
connector
sidewall
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Ceased
Application number
PCT/KR2021/013026
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English (en)
Korean (ko)
Inventor
임주영
노현욱
송용재
이인하
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Samsung Electronics Co Ltd
Original Assignee
Samsung Electronics Co Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Samsung Electronics Co Ltd filed Critical Samsung Electronics Co Ltd
Publication of WO2022075640A1 publication Critical patent/WO2022075640A1/fr
Priority to US18/295,467 priority Critical patent/US20230246395A1/en
Anticipated expiration legal-status Critical
Ceased legal-status Critical Current

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    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01R—ELECTRICALLY-CONDUCTIVE CONNECTIONS; STRUCTURAL ASSOCIATIONS OF A PLURALITY OF MUTUALLY-INSULATED ELECTRICAL CONNECTING ELEMENTS; COUPLING DEVICES; CURRENT COLLECTORS
    • H01R13/00—Details of coupling devices of the kinds covered by groups H01R12/70 or H01R24/00 - H01R33/00
    • H01R13/648—Protective earth or shield arrangements on coupling devices, e.g. anti-static shielding  
    • H01R13/658—High frequency shielding arrangements, e.g. against EMI [Electro-Magnetic Interference] or EMP [Electro-Magnetic Pulse]
    • H01R13/6581—Shield structure
    • H01R13/6582—Shield structure with resilient means for engaging mating connector
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01R—ELECTRICALLY-CONDUCTIVE CONNECTIONS; STRUCTURAL ASSOCIATIONS OF A PLURALITY OF MUTUALLY-INSULATED ELECTRICAL CONNECTING ELEMENTS; COUPLING DEVICES; CURRENT COLLECTORS
    • H01R12/00—Structural associations of a plurality of mutually-insulated electrical connecting elements, specially adapted for printed circuits, e.g. printed circuit boards [PCB], flat or ribbon cables, or like generally planar structures, e.g. terminal strips, terminal blocks; Coupling devices specially adapted for printed circuits, flat or ribbon cables, or like generally planar structures; Terminals specially adapted for contact with, or insertion into, printed circuits, flat or ribbon cables, or like generally planar structures
    • H01R12/70—Coupling devices
    • H01R12/71—Coupling devices for rigid printing circuits or like structures
    • H01R12/712—Coupling devices for rigid printing circuits or like structures co-operating with the surface of the printed circuit or with a coupling device exclusively provided on the surface of the printed circuit
    • H01R12/714—Coupling devices for rigid printing circuits or like structures co-operating with the surface of the printed circuit or with a coupling device exclusively provided on the surface of the printed circuit with contacts abutting directly the printed circuit; Button contacts therefore provided on the printed circuit
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01R—ELECTRICALLY-CONDUCTIVE CONNECTIONS; STRUCTURAL ASSOCIATIONS OF A PLURALITY OF MUTUALLY-INSULATED ELECTRICAL CONNECTING ELEMENTS; COUPLING DEVICES; CURRENT COLLECTORS
    • H01R12/00—Structural associations of a plurality of mutually-insulated electrical connecting elements, specially adapted for printed circuits, e.g. printed circuit boards [PCB], flat or ribbon cables, or like generally planar structures, e.g. terminal strips, terminal blocks; Coupling devices specially adapted for printed circuits, flat or ribbon cables, or like generally planar structures; Terminals specially adapted for contact with, or insertion into, printed circuits, flat or ribbon cables, or like generally planar structures
    • H01R12/70—Coupling devices
    • H01R12/71—Coupling devices for rigid printing circuits or like structures
    • H01R12/712—Coupling devices for rigid printing circuits or like structures co-operating with the surface of the printed circuit or with a coupling device exclusively provided on the surface of the printed circuit
    • H01R12/716—Coupling device provided on the PCB
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01R—ELECTRICALLY-CONDUCTIVE CONNECTIONS; STRUCTURAL ASSOCIATIONS OF A PLURALITY OF MUTUALLY-INSULATED ELECTRICAL CONNECTING ELEMENTS; COUPLING DEVICES; CURRENT COLLECTORS
    • H01R12/00—Structural associations of a plurality of mutually-insulated electrical connecting elements, specially adapted for printed circuits, e.g. printed circuit boards [PCB], flat or ribbon cables, or like generally planar structures, e.g. terminal strips, terminal blocks; Coupling devices specially adapted for printed circuits, flat or ribbon cables, or like generally planar structures; Terminals specially adapted for contact with, or insertion into, printed circuits, flat or ribbon cables, or like generally planar structures
    • H01R12/70—Coupling devices
    • H01R12/77—Coupling devices for flexible printed circuits, flat or ribbon cables or like structures
    • H01R12/79—Coupling devices for flexible printed circuits, flat or ribbon cables or like structures connecting to rigid printed circuits or like structures
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01R—ELECTRICALLY-CONDUCTIVE CONNECTIONS; STRUCTURAL ASSOCIATIONS OF A PLURALITY OF MUTUALLY-INSULATED ELECTRICAL CONNECTING ELEMENTS; COUPLING DEVICES; CURRENT COLLECTORS
    • H01R13/00—Details of coupling devices of the kinds covered by groups H01R12/70 or H01R24/00 - H01R33/00
    • H01R13/648—Protective earth or shield arrangements on coupling devices, e.g. anti-static shielding  
    • H01R13/658—High frequency shielding arrangements, e.g. against EMI [Electro-Magnetic Interference] or EMP [Electro-Magnetic Pulse]
    • H01R13/6581—Shield structure
    • H01R13/6585—Shielding material individually surrounding or interposed between mutually spaced contacts
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K9/00—Screening of apparatus or components against electric or magnetic fields
    • H05K9/0007—Casings
    • H05K9/0018—Casings with provisions to reduce aperture leakages in walls, e.g. terminals, connectors, cables
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01R—ELECTRICALLY-CONDUCTIVE CONNECTIONS; STRUCTURAL ASSOCIATIONS OF A PLURALITY OF MUTUALLY-INSULATED ELECTRICAL CONNECTING ELEMENTS; COUPLING DEVICES; CURRENT COLLECTORS
    • H01R12/00—Structural associations of a plurality of mutually-insulated electrical connecting elements, specially adapted for printed circuits, e.g. printed circuit boards [PCB], flat or ribbon cables, or like generally planar structures, e.g. terminal strips, terminal blocks; Coupling devices specially adapted for printed circuits, flat or ribbon cables, or like generally planar structures; Terminals specially adapted for contact with, or insertion into, printed circuits, flat or ribbon cables, or like generally planar structures
    • H01R12/70—Coupling devices
    • H01R12/71—Coupling devices for rigid printing circuits or like structures
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01R—ELECTRICALLY-CONDUCTIVE CONNECTIONS; STRUCTURAL ASSOCIATIONS OF A PLURALITY OF MUTUALLY-INSULATED ELECTRICAL CONNECTING ELEMENTS; COUPLING DEVICES; CURRENT COLLECTORS
    • H01R12/00—Structural associations of a plurality of mutually-insulated electrical connecting elements, specially adapted for printed circuits, e.g. printed circuit boards [PCB], flat or ribbon cables, or like generally planar structures, e.g. terminal strips, terminal blocks; Coupling devices specially adapted for printed circuits, flat or ribbon cables, or like generally planar structures; Terminals specially adapted for contact with, or insertion into, printed circuits, flat or ribbon cables, or like generally planar structures
    • H01R12/70—Coupling devices
    • H01R12/71—Coupling devices for rigid printing circuits or like structures
    • H01R12/712—Coupling devices for rigid printing circuits or like structures co-operating with the surface of the printed circuit or with a coupling device exclusively provided on the surface of the printed circuit
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01R—ELECTRICALLY-CONDUCTIVE CONNECTIONS; STRUCTURAL ASSOCIATIONS OF A PLURALITY OF MUTUALLY-INSULATED ELECTRICAL CONNECTING ELEMENTS; COUPLING DEVICES; CURRENT COLLECTORS
    • H01R13/00—Details of coupling devices of the kinds covered by groups H01R12/70 or H01R24/00 - H01R33/00
    • H01R13/648—Protective earth or shield arrangements on coupling devices, e.g. anti-static shielding  
    • H01R13/658—High frequency shielding arrangements, e.g. against EMI [Electro-Magnetic Interference] or EMP [Electro-Magnetic Pulse]
    • H01R13/6581—Shield structure
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01R—ELECTRICALLY-CONDUCTIVE CONNECTIONS; STRUCTURAL ASSOCIATIONS OF A PLURALITY OF MUTUALLY-INSULATED ELECTRICAL CONNECTING ELEMENTS; COUPLING DEVICES; CURRENT COLLECTORS
    • H01R13/00—Details of coupling devices of the kinds covered by groups H01R12/70 or H01R24/00 - H01R33/00
    • H01R13/648—Protective earth or shield arrangements on coupling devices, e.g. anti-static shielding  
    • H01R13/658—High frequency shielding arrangements, e.g. against EMI [Electro-Magnetic Interference] or EMP [Electro-Magnetic Pulse]
    • H01R13/6591—Specific features or arrangements of connection of shield to conductive members
    • H01R13/6594—Specific features or arrangements of connection of shield to conductive members the shield being mounted on a PCB and connected to conductive members
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01R—ELECTRICALLY-CONDUCTIVE CONNECTIONS; STRUCTURAL ASSOCIATIONS OF A PLURALITY OF MUTUALLY-INSULATED ELECTRICAL CONNECTING ELEMENTS; COUPLING DEVICES; CURRENT COLLECTORS
    • H01R13/00—Details of coupling devices of the kinds covered by groups H01R12/70 or H01R24/00 - H01R33/00
    • H01R13/648—Protective earth or shield arrangements on coupling devices, e.g. anti-static shielding  
    • H01R13/658—High frequency shielding arrangements, e.g. against EMI [Electro-Magnetic Interference] or EMP [Electro-Magnetic Pulse]
    • H01R13/6591—Specific features or arrangements of connection of shield to conductive members
    • H01R13/6597—Specific features or arrangements of connection of shield to conductive members the conductive member being a contact of the connector
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01R—ELECTRICALLY-CONDUCTIVE CONNECTIONS; STRUCTURAL ASSOCIATIONS OF A PLURALITY OF MUTUALLY-INSULATED ELECTRICAL CONNECTING ELEMENTS; COUPLING DEVICES; CURRENT COLLECTORS
    • H01R2201/00—Connectors or connections adapted for particular applications
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01R—ELECTRICALLY-CONDUCTIVE CONNECTIONS; STRUCTURAL ASSOCIATIONS OF A PLURALITY OF MUTUALLY-INSULATED ELECTRICAL CONNECTING ELEMENTS; COUPLING DEVICES; CURRENT COLLECTORS
    • H01R2201/00—Connectors or connections adapted for particular applications
    • H01R2201/16—Connectors or connections adapted for particular applications for telephony
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01R—ELECTRICALLY-CONDUCTIVE CONNECTIONS; STRUCTURAL ASSOCIATIONS OF A PLURALITY OF MUTUALLY-INSULATED ELECTRICAL CONNECTING ELEMENTS; COUPLING DEVICES; CURRENT COLLECTORS
    • H01R24/00—Two-part coupling devices, or either of their cooperating parts, characterised by their overall structure
    • H01R24/38—Two-part coupling devices, or either of their cooperating parts, characterised by their overall structure having concentrically or coaxially arranged contacts
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K9/00—Screening of apparatus or components against electric or magnetic fields
    • H05K9/0007—Casings
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K9/00—Screening of apparatus or components against electric or magnetic fields
    • H05K9/0007—Casings
    • H05K9/002—Casings with localised screening
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K9/00—Screening of apparatus or components against electric or magnetic fields
    • H05K9/0007—Casings
    • H05K9/002—Casings with localised screening
    • H05K9/0022—Casings with localised screening of components mounted on printed circuit boards [PCB]
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K9/00—Screening of apparatus or components against electric or magnetic fields
    • H05K9/0007—Casings
    • H05K9/002—Casings with localised screening
    • H05K9/0022—Casings with localised screening of components mounted on printed circuit boards [PCB]
    • H05K9/0024—Shield cases mounted on a PCB, e.g. cans or caps or conformal shields
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K9/00—Screening of apparatus or components against electric or magnetic fields
    • H05K9/0007—Casings
    • H05K9/002—Casings with localised screening
    • H05K9/0022—Casings with localised screening of components mounted on printed circuit boards [PCB]
    • H05K9/0024—Shield cases mounted on a PCB, e.g. cans or caps or conformal shields
    • H05K9/0026—Shield cases mounted on a PCB, e.g. cans or caps or conformal shields integrally formed from metal sheet

Definitions

  • Various embodiments of the present disclosure relate to electronic devices including shielded connector structures.
  • a plurality of electronic components disposed in the internal space of the electronic device must be efficiently disposed to each other to help slim the electronic device.
  • the quality of the electronic device may be deteriorated.
  • the electronic device may include at least one electronic component disposed in an internal space. At least one electronic component may be electrically connected to each other in order to perform a corresponding function of the electronic device.
  • Such electronic components may include at least two boards (eg, printed circuit boards) disposed in an internal space of the electronic device.
  • Each of the substrates may be disposed in a stacking manner to secure an efficient mounting space, and may be electrically connected to each other through an interposer (eg, a stacked board) disposed therebetween.
  • each substrate may include a plurality of conductive terminals (eg, conductive pads), and may be formed by physically contacting a plurality of corresponding conductive terminals (eg, corresponding conductive pads) disposed on a corresponding surface of the interposer. , the two substrates may be electrically connected.
  • the interposer is bonded to the two substrates through a bonding process such as soldering, it is difficult to maintain the electronic device.
  • the interposer since the interposer is bonded to be electrically connected to the entire area of the two substrates, there may be a limitation in shielding individual electrical elements.
  • the interposer since the interposer has a relatively limited number of connection terminals, the size of the interposer must be expanded to increase the number of connection terminals, which may go against the slimming of the electronic device.
  • Various embodiments of the present disclosure may provide an electronic device including a shielded connector structure.
  • an electronic device including a shielded connector structure that can be easily separated during maintenance.
  • an electronic device including a shielding connector structure that can help slim the electronic device while increasing the number of connection terminals.
  • an electronic device includes a housing, a first substrate disposed in an internal space of the housing and including at least one electric element, and in the first substrate, the at least one electric element at least partially at least one receptacle disposed to surround the at least one receptacle base comprising a recess, through the recess, through the recess, and through the recess and a first sidewall formed adjacent to the at least one electrical element; a second sidewall formed to be spaced outwardly from the first sidewall and an island region protruding from the recess in a longitudinal direction, wherein the recess is a first rib formed between the island region and the first sidewall at least one receptacle base including a recess and a second recess formed between the island region and the second sidewall; a first plurality of conductive terminals, a second plurality of conductive terminals disposed at a predetermined interval from at least a portion of the island region to at least a portion of the first recess, and in
  • Exemplary embodiments of the present disclosure electrically connect two substrates and provide a shielding connector structure including a receptacle and a connector disposed between the two substrates, thereby helping to effectively shield electrical components disposed on the substrate. .
  • it is advantageous for maintenance and can help to slim the electronic device while increasing the number of connection terminals.
  • FIG. 1 is a perspective view of a front side of an electronic device (eg, a mobile electronic device) according to various embodiments of the present disclosure
  • FIG. 2 is a perspective view of a rear surface of the electronic device of FIG. 1 according to various embodiments of the present disclosure
  • FIG. 3 is an exploded perspective view of the electronic device of FIG. 1 according to various embodiments of the present disclosure
  • FIG. 4 is an exploded perspective view of an electronic device having a shielded connector structure disposed therein according to various embodiments of the present disclosure
  • FIG. 5A is a perspective view of a first substrate including a receptacle according to various embodiments of the present disclosure
  • FIG. 5B is a perspective view of a second substrate including a connector coupled to the receptacle of FIG. 5A according to various embodiments of the present disclosure
  • FIG. 6A is a perspective view illustrating a state in which a first substrate and a second substrate are combined according to various embodiments of the present disclosure
  • 6B is a partial cross-sectional view illustrating a coupling relationship between a receptacle and a connector as viewed from a line 6b-6b according to various embodiments of the present disclosure
  • FIG. 7A is a perspective view of a first substrate including receptacles according to various embodiments of the present disclosure
  • FIG. 7B is a perspective view of a second substrate including connectors coupled to the receptacles of FIG. 7A according to various embodiments of the present disclosure
  • FIGS. 8A to 8E are diagrams illustrating a shielding structure through coupling of a receptacle and a connector according to various embodiments of the present disclosure
  • FIG. 1 is a perspective view of a front side of an electronic device 100 (eg, a mobile electronic device) according to various embodiments of the present disclosure.
  • 2 is a perspective view of a rear surface of the electronic device 100 of FIG. 1 according to various embodiments of the present disclosure.
  • an electronic device 100 includes a first surface (or front surface) 110A, a second surface (or rear surface) 110B, and a first surface 110A. and a housing 110 including a side surface 110C surrounding the space between the second surfaces 110B.
  • the housing may refer to a structure forming a part of the first surface 110A, the second surface 110B, and the side surface 110C of FIG. 1 .
  • the first surface 110A may be formed by the front plate 102 (eg, a glass plate including various coating layers, or a polymer plate) at least a portion of which is substantially transparent.
  • the second surface 110B may be formed by the substantially opaque back plate 111 .
  • the back plate 111 is formed by, for example, coated or colored glass, ceramic, polymer, metal (eg, aluminum, stainless steel (STS), or magnesium), or a combination of at least two of the above materials.
  • the side surface 110C is coupled to the front plate 102 and the rear plate 111 and may be formed by a side bezel structure 118 (or “side member”) including a metal and/or a polymer.
  • the back plate 111 and the side bezel structure 118 are integrally formed and may include the same material (eg, a metal material such as aluminum).
  • the front plate 102 has a first region 110D that extends seamlessly by bending from the first surface 110A toward the rear plate, including a long edge of the front plate. edge) can be included at both ends.
  • the rear plate 111 may include a second region 110E that extends seamlessly from the second surface 110B toward the front plate at both ends of the long edge. there is.
  • the front plate 102 or the back plate 111 may include only one of the first region 110D or the second region 110E.
  • the front plate 102 may not include the first region and the second region, but may include only a flat plane disposed parallel to the second surface 110B.
  • the side bezel structure 118 when viewed from the side of the electronic device, has a first thickness ( or width), and may have a second thickness thinner than the first thickness on the side surface including the first region 110D or the second region 110E.
  • the electronic device 100 includes a display 101 , an input device 103 , a sound output device 107 , 114 , a sensor module 104 , 119 , a camera module 105 , 112 , and a key. It may include at least one of an input device 117 , an indicator (not shown), and a connector 108 . In some embodiments, the electronic device 100 may omit at least one of the components (eg, the key input device 117 or an indicator) or additionally include other components.
  • the display 101 may be exposed through a substantial portion of the front plate 102 , for example. In some embodiments, at least a portion of the display 101 may be exposed through the front plate 102 forming the first area 110D of the first surface 110A and the side surface 110C.
  • the display 101 may be coupled to or disposed adjacent to a touch sensing circuit, a pressure sensor capable of measuring the intensity (pressure) of a touch, and/or a digitizer that detects a magnetic field type stylus pen.
  • at least a portion of the sensor module 104 , 119 , and/or at least a portion of a key input device 117 is located in the first area 110D and/or the second area 110E. can be placed.
  • the input device 103 may include a microphone 103 .
  • the input device 103 may include a plurality of microphones 103 arranged to sense the direction of the sound.
  • the sound output devices 107 and 114 may include speakers 107 and 114 .
  • the speakers 107 and 114 may include an external speaker 107 and a receiver 114 for a call.
  • the microphone 103 , the speakers 107 , 114 , and the connector 108 may be disposed at least partially in the internal space of the electronic device 100 , and pass through at least one hole formed in the housing 110 . may be exposed to the external environment.
  • the hole formed in the housing 110 may be commonly used for the microphone 103 and the speakers 107 and 114 .
  • the sound output devices 107 and 114 may include a speaker (eg, a piezo speaker) that operates while excluding a hole formed in the housing 110 .
  • the sensor modules 104 and 119 may generate electrical signals or data values corresponding to an internal operating state of the electronic device 100 or an external environmental state.
  • the sensor modules 104 and 119 include, for example, a first sensor module 104 (eg, a proximity sensor) and/or a second sensor module (not shown) disposed on the first surface 110A of the housing 110 . ) (eg, a fingerprint sensor), and/or a third sensor module 119 (eg, an HRM sensor) disposed on the second surface 110B of the housing 110 .
  • the fingerprint sensor may be disposed on the first surface 110A (eg, a home key button) of the housing 110 , a portion of the second surface 110B, and/or under the display 101 .
  • the electronic device 100 includes a sensor module not shown, for example, a gesture sensor, a gyro sensor, a barometric pressure sensor, a magnetic sensor, an acceleration sensor, a grip sensor, a color sensor, an IR (infrared) sensor, a biometric sensor, a temperature sensor, It may further include at least one of a humidity sensor, a proximity sensor, and an illuminance sensor.
  • a sensor module not shown, for example, a gesture sensor, a gyro sensor, a barometric pressure sensor, a magnetic sensor, an acceleration sensor, a grip sensor, a color sensor, an IR (infrared) sensor, a biometric sensor, a temperature sensor, It may further include at least one of a humidity sensor, a proximity sensor, and an illuminance sensor.
  • the camera modules 105 and 112 include a first camera module 105 disposed on the first surface 110A of the electronic device 100, and a second camera module 112 disposed on the second surface 110B of the electronic device 100, and/or flash 113 .
  • the camera modules 105 and 112 may include one or more lenses, an image sensor, and/or an image signal processor.
  • the flash 113 may include, for example, a light emitting diode or a xenon lamp.
  • two or more lenses (a wide-angle lens, an ultra-wide-angle lens, or a telephoto lens) and image sensors may be disposed on one surface of the electronic device 100 .
  • the key input device 117 may be disposed on the side surface 110C of the housing 110 .
  • the electronic device 100 may not include some or all of the above-mentioned key input devices 117 and the not included key input devices 117 are displayed on the display 101 as soft keys or the like. It may be implemented in other forms.
  • the key input device 117 may be implemented using a pressure sensor included in the display 101 .
  • the indicator may be disposed, for example, on the first surface 110A of the housing 110 .
  • the indicator may provide, for example, state information of the electronic device 100 in the form of a light (eg, a light emitting device).
  • the light emitting device may provide, for example, a light source that is interlocked with the operation of the camera module 105 .
  • Indicators may include, for example, LEDs, IR LEDs and/or xenon lamps.
  • the connector hole 108 includes a first connector hole 108 capable of receiving a connector (eg, a universal serial bus (USB) connector) for transmitting and receiving power and/or data with an external electronic device, and/or It may include a second connector hole (or earphone jack) (not shown) capable of accommodating a connector for transmitting and receiving an audio signal to and from an external electronic device.
  • a connector eg, a universal serial bus (USB) connector
  • USB universal serial bus
  • Some of the camera modules 105 and 112 , some of the camera modules 105 , some of the sensor modules 104 and 119 , or an indicator may be disposed to be exposed through the display 101 .
  • the camera module 105 , the sensor module 104 , or the indicator may come into contact with the external environment from the internal space of the electronic device 100 through the perforated opening or transmission area up to the front plate 102 of the display 101 .
  • the area where the display 101 and the camera module 105 face each other may be formed as a transparent area having a predetermined transmittance as a part of an area displaying content.
  • the transmissive region may be formed to have a transmittance in a range of about 5% to about 20%.
  • a transmission area may include an area overlapping an effective area (eg, an angle of view area) of the camera module 105 through which light for generating an image by being imaged by an image sensor passes.
  • the transmissive area of the display 101 may include an area having a lower pixel density than the surrounding area.
  • the transmissive area may replace the opening.
  • the camera module 105 may include an under display camera (UDC).
  • UDC under display camera
  • some sensor modules 104 may be arranged to perform their functions without being visually exposed through the front plate 102 in the internal space of the electronic device. For example, in this case, the area of the display 101 facing the sensor module may not need a perforated opening.
  • the electronic device 100 has a bar-type or plate-type appearance, but the present disclosure is not limited thereto.
  • the illustrated electronic device 100 may be a part of a foldable electronic device, a slideable electronic device, a stretchable electronic device, and/or a rollable electronic device.
  • foldable electronic device “slidable electronic device”, “stretchable electronic device” and/or “rollable electronic device” This means that bending deformation of the display (eg, the display 330 of FIG. 3 ) is possible, at least a part of it is folded, or rolled or rolled, or the area is at least partially expanded and/or the housing It may refer to an electronic device that can be accommodated inside (eg, the housing 110 of FIGS.
  • a foldable electronic device, a slideable electronic device, a stretchable electronic device, and/or a rollable electronic device expands a screen display area by unfolding a display or exposing a larger area of the display to the outside according to a user's needs. can be used
  • a receptacle that electrically connects two substrates (eg, the first substrate 420 and the second substrate 440 of FIG. 6B ) and provides a shielding structure according to exemplary embodiments of the present disclosure
  • the connection structure between (eg, the receptacle 430 of FIG. 6B ) and the connector (eg, the connector 450 of FIG. 6B ) is the above-described bar-type electronic device, flat-panel electronic device, foldable electronic device, slideable electronic device, and stripe electronic device. It may be applied to at least one electronic device among a retractable electronic device and a rollable electronic device.
  • FIG. 3 is an exploded perspective view of the electronic device 100 of FIG. 1 according to various embodiments of the present disclosure.
  • the electronic device 300 of FIG. 3 may be at least partially similar to the electronic device 100 of FIGS. 1 and 2 , or may include another embodiment of the electronic device.
  • the electronic device 300 (eg, the electronic device 100 of FIG. 1 or FIG. 2 ) includes a side member 310 (eg, a side bezel structure), a first support member 311 (for example: a bracket or support structure), a front plate 320 (such as a front cover), a display 330 (such as the display 101 of FIG. 1 ), a substrate 340 (such as a printed circuit board (PCB); Flexible PCB (FPCB), or rigid-flex PCB (RFPCB)), battery 350 , second support member 360 (eg, rear case), antenna 370 , and rear plate 380 (eg, rear surface) cover) may be included.
  • a side member 310 eg, a side bezel structure
  • a first support member 311 For example: a bracket or support structure
  • a front plate 320 such as a front cover
  • a display 330 such as the display 101 of FIG. 1
  • a substrate 340 such as a printed circuit board (PCB); Flexible PCB (FPC
  • the electronic device 300 may omit at least one of the components (eg, the first support member 311 or the second support member 360 ) or additionally include other components. . At least one of the components of the electronic device 300 may be the same as or similar to at least one of the components of the electronic device 100 of FIG. 1 or FIG. 2 , and overlapping descriptions will be omitted below.
  • the first support member 311 may be disposed inside the electronic device 300 and connected to the side member 310 , or may be integrally formed with the side member 310 .
  • the first support member 311 may be formed of, for example, a metal material and/or a non-metal (eg, polymer) material.
  • the first support member 311 may have a display 330 coupled to one surface and a substrate 340 coupled to the other surface.
  • the substrate 340 may be equipped with a processor, memory, and/or an interface.
  • the processor may include, for example, one or more of a central processing unit, an application processor, a graphics processing unit, an image signal processor, a sensor hub processor, or a communication processor.
  • Memory may include, for example, volatile memory or non-volatile memory.
  • the interface may include, for example, a high definition multimedia interface (HDMI), a universal serial bus (USB) interface, an SD card interface, and/or an audio interface.
  • HDMI high definition multimedia interface
  • USB universal serial bus
  • the interface may, for example, electrically or physically connect the electronic device 300 to an external electronic device, and may include a USB connector, an SD card/MMC connector, or an audio connector.
  • the battery 350 is a device for supplying power to at least one component of the electronic device 300 and may include, for example, a non-rechargeable primary battery, a rechargeable secondary battery, or a fuel cell. . At least a portion of the battery 350 may be disposed, for example, on the same plane as the substrate 340 . The battery 350 may be integrally disposed inside the electronic device 300 . In another embodiment, the battery 350 may be detachably disposed from the electronic device 300 .
  • the antenna 370 may be disposed between the rear plate 380 and the battery 350 .
  • the antenna 370 may include, for example, a near field communication (NFC) antenna, a wireless charging antenna, and/or a magnetic secure transmission (MST) antenna.
  • the antenna 370 may, for example, perform short-range communication with an external device or wirelessly transmit/receive power required for charging.
  • an antenna structure may be formed by a part of the side bezel structure 310 and/or the first support member 311 or a combination thereof.
  • FIG. 4 is an exploded perspective view of an electronic device having a shielded connector structure disposed therein according to various embodiments of the present disclosure
  • the electronic device 400 of FIG. 4 may be at least partially similar to the electronic device 100 of FIGS. 1 and 2 or the electronic device 300 of FIG. 3 , or may include other embodiments of the electronic device.
  • the electronic device 400 (eg, the electronic device 300 of FIG. 3 ) has a front cover 481 (eg, the front plate 320 of FIG. 3 ) in the opposite direction to the front cover 481 ).
  • a rear cover 480 (eg, the rear plate 380 of FIG. 3 ) facing toward ( 310 ) may include a housing (eg, the housing 110 of FIG. 1 ).
  • the electronic device 400 may include a first support member 411 (eg, the first support member 311 of FIG. 3 ) disposed in an internal space.
  • the first support member 411 may be disposed to extend from the side member 410 into the inner space.
  • the first support member 411 may be separately provided in the internal space of the electronic device 400 .
  • the first support member 411 may extend from the side member 410 and at least a portion of the region may be formed of a conductive material.
  • the electronic device 400 may include a pair of substrates 420 and 440 (eg, substrates) disposed between the first support member 411 and the rear cover 480 in the internal space. there is.
  • the pair of substrates 420 and 440 when the pair of substrates 420 and 440 are viewed from above (eg, in the Z-axis direction of FIG. 3 ), the pair of substrates 420 and 440 may be arranged such that at least some regions thereof overlap.
  • the pair of substrates 420 and 440 includes a first substrate 420 (eg, a main substrate or a first substrate) disposed between the first support member 411 and the rear cover 480 , and , a second substrate 440 (eg, a sub substrate or a second substrate) disposed between the first substrate 420 and the rear cover 480 .
  • the first substrate 420 is a main substrate, and when the front cover 481 is viewed from above, the first substrate 420 may be larger than the second substrate 440 , which is a sub substrate.
  • the first substrate 420 may be formed to have substantially the same size as the second substrate 440 when the front cover 481 is viewed from above.
  • the first substrate 420 may be formed to be smaller than the second substrate 440 when the front cover 481 is viewed from above.
  • the first substrate 420 may include a receptacle 430 disposed on a surface facing the second substrate 440 .
  • the second substrate 440 is disposed on the surface facing the first substrate 420 , and when the first substrate 420 and the second substrate 440 are coupled, the electrical connection to the receptacle 430 is performed.
  • the first substrate 420 and the second substrate 440 may be electrically connected through a coupling structure of the connector 450 coupled to the receptacle 430 .
  • the electronic device 400 may include a shielding structure (eg, a shielding connector structure) through coupling of the receptacle 430 and the connector 450 electrically connecting the two boards 420 and 440 .
  • a shielding structure eg, a shielding connector structure
  • at least one electrical device 425 eg, an active device, a passive device, and/or integrated circuit chips
  • the first space 4201 may be formed in a closed loop shape or a partially open loop shape through the receptacle 430 .
  • the electronic device 400 may include a second support member (not shown) (eg, a fixing bracket) disposed between the second substrate 440 and the rear cover 480 .
  • the second support member (not shown) may be disposed at a position at least partially overlapping the second substrate 440 .
  • the second support member 470 may include a metal plate.
  • the first substrate 420 , the shielding structure (eg, a shielding connector structure), and the second substrate 440 are to be fixed to the electronic device 400 through a second support member (not shown).
  • the first substrate 420 , a shielding structure (eg, a shielding connector structure), and the second substrate 440 are disposed in the internal space of the electronic device 400 without a second support member (not shown). it might be
  • 5A is a perspective view of a first substrate including a receptacle according to various embodiments of the present disclosure
  • 5B is a perspective view of a second substrate including a connector coupled to the receptacle of FIG. 5A according to various embodiments of the present disclosure
  • the first substrate 420 may include a receptacle 430 disposed to form a first space 4201 in a manner surrounding at least one electric element 425 .
  • the receptacle 430 may be electrically connected to at least one electrical element 425 disposed on the first substrate 420 .
  • the receptacle 430 may include a plurality of conductive terminals, and some conductive terminals of the plurality of conductive terminals may be electrically connected to the ground of the first substrate 420 .
  • the second substrate 440 may include a connector 450 having a corresponding shape to be connected to the receptacle 430 .
  • the second substrate 440 may include a second space 4501 formed to face the first space 4201 through the connector 450 .
  • the connector 450 may include a plurality of connector terminals, and some of the plurality of connector terminals may be electrically connected to the ground of the second substrate 440 .
  • the ground of the first substrate 420 and/or the ground of the second substrate 440 may include a ground conductor, a ground plane, or a ground layer.
  • the first space 4201 and the second space 4501 are sealed through the receptacle 430 and the connector 450 .
  • the at least one electrical element 425 disposed therein may also be shielded.
  • the at least one electrical element 425 may be disposed in the second space 4501 of the second substrate 440 .
  • the at least one electrical element 425 may be disposed in both the first space 4201 and the second space 4501 .
  • 6A is a perspective view illustrating a state in which a first substrate and a second substrate are combined according to various embodiments of the present disclosure
  • 6B is a partial cross-sectional view illustrating a coupling relationship between a receptacle and a connector as viewed from a line 6b-6b according to various embodiments of the present disclosure
  • the first substrate 420 and the second substrate 440 may be electrically connected through the connection of the receptacle 430 and the connector 450 .
  • at least one electric element disposed on the first substrate 420 eg, the electric element 425 of FIG. 5A . can be electrically shielded from the surroundings.
  • the receptacle 430 disposed on the first substrate 420 may include a receptacle base 431 and conductive terminals 4351 , 4352 , 4353 , 4354 disposed on the receptacle base 431 .
  • the receptacle base 431 may be formed of a mold made of a polymer material.
  • the receptacle base 431 is a kind of molding product, and may support the conductive terminals 4351 , 4352 , 4353 , and 4354 while including an insulating material.
  • the receptacle base 431 may suppress deformation of the conductive terminals 4351 , 4352 , 4353 , and 4354 , and may provide a binding structure with the connector 450 .
  • the conductive terminals 4351 , 4352 , 4353 , and 4354 may be assembled or mounted to the receptacle base 431 by a press-fit method, or mounted to the receptacle base 431 at the same time as the receptacle base 431 is molded through an insert injection process. there is.
  • the receptacle base 431 includes a structure for supporting the first plurality of conductive terminals 4351 and the second plurality of conductive terminals 4352 , respectively, and the third plurality of conductive terminals.
  • a structure for supporting the 4353 and the fourth plurality of conductive terminals 4354 may be included, respectively.
  • the receptacle base 431 may include recesses 4301 and 4302 .
  • the receptacle base 431 has a first sidewall 432 formed adjacent to at least one electrical component (eg, electrical component 425 in FIG. 5A ) through the recesses 4301 and 4302 .
  • the second sidewall 433 formed to be spaced outwardly from the first sidewall 432, and the recesses 4301 and 4302 protruding along the longitudinal direction of the receptacle base 431 It may include an island region 434 to be formed.
  • the recesses 4301 and 4302 include a first recess 4301 formed between the island region 434 and the first sidewall 432 , and the island region 434 and the second sidewall 433 . ) and a second recess 4302 formed between them.
  • the plurality of conductive terminals 4351 , 4352 , 4353 , and 4354 are first disposed at a predetermined interval from at least a portion of the first sidewall 432 to at least a portion of the first recess 4301 .
  • the plurality of conductive terminals 4351 , 4352 , 4353 , and 4354 are connected to the conductive pads 4211 , 4212 , 4213 , and 4214 disposed at corresponding positions on the first substrate through a bonding process such as soldering. may be electrically connected.
  • the third plurality of conductive terminals 4353 disposed at the furthest distance from at least one electrical device may be connected to the ground ( G) and may be electrically connected.
  • the plurality of conductive terminals 4351 , 4352 , 4353 , and 4354 are formed by bending a conductive plate, and have one end of the conductive pads 4211 , 4212 , 4213 , and 4214 of the first substrate 420 . ), and the other end (eg, the first coupling part) may be bent in a substantially U-shape of the alphabet. Between both ends of the second plurality of conductive terminals 4352 and the fourth plurality of conductive terminals 4354 may be disposed to at least partially surround the island region 434 or to be surrounded by the island region 434 . there is.
  • the connector 450 disposed on the second substrate 440 may include a connector base 451 and connector terminals 4551 , 4552 , 4553 , and 4554 coupled to the connector base 451 .
  • the connector base 451 is formed to face the island seating portion 454 on which the island region 434 of the receptacle base 431 is seated, and the first recess 4301 of the receptacle base 431 .
  • a third sidewall 452 , and a fourth sidewall 453 formed to face the second recess 4302 of the receptacle base 431 .
  • the connector terminals 4551 , 4552 , 4553 , and 4554 are disposed on at least a portion of the third sidewall 452 , and are elastically coupled to the first plurality of conductive terminals 4351 .
  • the third plurality of connector terminals 4553 disposed on at least a portion of the fourth sidewall 453 and elastically coupled to the third plurality of conductive terminals 4353 , and at least a portion of the fourth sidewall 453 .
  • It may include a plurality of fourth connector terminals 4554 that are disposed on the , and are elastically coupled to the plurality of fourth conductive terminals 4354 .
  • the plurality of connector terminals 4551 , 4552 , 4553 , and 4554 are bonded to conductive pads 4411 , 4412 , 4413 , 4414 disposed at corresponding positions of the second substrate 440 , such as by soldering. It can be electrically connected through the process.
  • the plurality of connector terminals 4551 , 4552 , 4553 , and 4554 are formed by bending a conductive plate, and have one end of the conductive pads 4411 , 4412 , 4413 , and 4414 of the second substrate 440 . ), and the other end (eg, the second binding part) may be bent in a substantially U-shape of the alphabet.
  • the second binding portion of the plurality of connector terminals 4551 , 4552 , 4553 , 4554 may be coupled in a state of being wrapped around the first binding part.
  • the first binding part may press the second binding part while receiving at least a portion of the second binding part, whereby the plurality of connector terminals 4551 , 4552 , 4553 , 4554 and the plurality of conductive terminals 4351 , 4352, 4353, 4354) may be in contact with two different points or two different regions.
  • the shapes of the first binding part and the second binding part are not limited to the illustrated examples and may be formed in various shapes.
  • a portion of the second binding portion in contact with the first binding portion may be formed to be thicker than a portion not in contact with the second binding portion.
  • the second binding portion may be formed in the shape of a match head rather than the letter U-shape, and the first binding portion may be formed in the shape of a hooking jaw corresponding to the shape of the match head, between the receptacle 430 and the connector 450 .
  • Mechanical bonding strength can be further improved.
  • the second binding part may contact one surface of the first binding part and also contact an end of the first binding part.
  • the second coupling part may further include an elastic piece protruding from one surface.
  • the elastic piece is substantially a part of the second binding part or a part of one surface of the second binding part, and may be in direct contact with the first binding part.
  • the end of the first binding portion may be rolled into a shape close to a circle or a polygon to be in stable contact with the end of the second binding portion.
  • the shape of the end of the elastic piece and the first binding part may stably maintain an electrical connection state of the first binding part and the second binding part.
  • the second binding part may contact one surface of the first binding part and may contact an end of the first binding part, and at least a portion of the second binding part (eg, the first binding part) and the contact portion, hereinafter, the head) may be formed thicker than other portions.
  • the head of the second binding part has a structure thicker than the other parts, by forming a hooking protrusion in the first binding part, the mechanical binding force between the receptacle 430 and the connector 450 can be further improved. there is.
  • the number of receptacles 430 is relatively large compared to the minimized volume of the receptacle base 431 because two conductive terminals are disposed in one recess 4301 and 4302 in the receptacle base 431 .
  • the conductive terminals of the may be used as a signal line and/or a ground line.
  • the receptacle 430 may further include a fifth conductive terminal (not shown) in at least a portion of the island region 434 of the receptacle base 431 .
  • the fifth conductive terminal (not shown) may be electrically connected to the ground conductor of the first substrate 420 or the ground conductor of the second substrate 440 .
  • the shielding structure (eg, a receptacle and a connector) according to various embodiments is not limited to the illustrated embodiment, and may be formed in various shapes. For example, the number, arrangement, location, or role of conductive terminals 4351 , 4352 , 4353 , 4354 and connector terminals 4551 , 4552 , 4553 , 4554 forming receptacle 430 and connector 450 . (eg receptacles or connectors) may change.
  • the arrangement of the conductive terminals 4351 , 4352 , 4353 , 4354 of the receptacle 430 and/or the connector terminals 4551 , 4552 , 4553 , 4554 of the connector 450 may be divided into four or more It may be formed of terminals. For example, it may be formed in a symmetrical arrangement of 4 columns * n rows, or may be formed in an asymmetrical arrangement of 5 columns * n rows.
  • 7A is a perspective view of a first substrate including receptacles according to various embodiments of the present disclosure
  • 7B is a perspective view of a second substrate including connectors coupled to the receptacles of FIG. 7A according to various embodiments of the present disclosure
  • the first substrate 420 is a first receptacle 430 disposed to form a first space 4201 in a manner surrounding at least one first electrical element 425, and a second receptacle 430 - 1 disposed near the first receptacle 430 and disposed such that a second space 4202 is formed in a manner surrounding at least one second electrical element 426 .
  • the second substrate 440 has a first connector 450 having a corresponding shape for connection to the first receptacle 430 , and a corresponding shape for connecting to the second receptacle 430 - 1 . It may include a second connector 450-1 having.
  • the first connector 450 may include the first space 4201 and the third space 4501 at least partially facing.
  • the second connector 450-1 may include the second space 4202 and the fourth space 4502 at least partially facing each other.
  • the first space 4201 and the third space 4501 are the first receptacle 430 and the first connector 450 .
  • the second space 4202 and the fourth space 4502 maintain a closed state through the second receptacle 430-1 and the second connector 450-1, so that at least one The second electrical element 426 may also be shielded.
  • a connector shielding structure is provided through an electrical coupling structure of receptacles 430 and 430-1 and connectors 450 and 450-1 having shielding spaces spaced apart from each other on one single substrate. Separate shielding of electrical elements 425 , 426 may be possible.
  • FIGS. 8A to 8E are diagrams illustrating a shielding structure through coupling of a receptacle and a connector according to various embodiments of the present disclosure
  • the first substrate 420 and the second substrate 440 are illustrated in different sizes for differentiation, but the two substrates 420 and 440 are substantially the same, or the second substrate 440 is It may be formed to be larger than the first substrate 420 .
  • the receptacles and the connectors are also illustrated in different sizes for differentiation, they may have substantially the same size (eg, width).
  • an electronic device may include a first substrate 420 and a second substrate 440 disposed to overlap the first substrate 420 .
  • the first substrate 420 and the second substrate 440 may be electrically connected through the coupling of the two receptacles 511 and 512 and the corresponding two connectors 521 and 522 .
  • the first substrate 420 may include a first receptacle 511 and a second receptacle 512 disposed to form a first space 5101 for enclosing the electric element 425 .
  • the second substrate 440 may include a first connector 521 connected to the first receptacle 511 and a second connector 522 connected to the second receptacle 512 .
  • the first space 5101 may include a portion 5102 partially opened from the outside through the arrangement of the first receptacle 511 and the second receptacle 512 .
  • the open portion 5102 may be utilized as a passage for the electrical connection member 460 (eg, a conductive cable, a coaxial cable, or a flexible printed circuit board (FPCB) type radio frequency cable (FRC)).
  • the electrical connection member 460 may include a cable extending to a specified length, one end 461 may be disposed outside the first space 5101 , and the other end 462 may be disposed in the first space 5101 .
  • the receptacles and connectors connected thereto may provide a passage path through which the electrical connection member passes in the first space.
  • an electronic device may include a first substrate 420 and a second substrate 440 disposed to overlap the first substrate 420 .
  • the first substrate 420 and the second substrate 440 may be electrically connected to each other through coupling of two receptacles 531 and 532 and one connector 541 corresponding thereto.
  • the first substrate 420 includes a first receptacle 531 and a second receptacle 532 disposed to form a space 5301 surrounding the electric element 425 in a closed loop form. can do.
  • the second substrate 440 may include a connector 541 commonly connected to the first receptacle 531 and the second receptacle 532 .
  • a coupling structure of three or more receptacles and at least one connector may be provided in order to provide the first space 5301 having a closed loop shape. For example, the number of receptacles and connectors may be different from each other.
  • the first substrate 420 may include a first receptacle 551 having a closed loop shape and a second receptacle 552 disposed to cross at least a part of the inner space of the first receptacle 551 .
  • the second substrate 440 may include a first connector 561 connected to the first receptacle 551 and a second connector 562 connected to the second receptacle 552 .
  • the electrical elements 425 and 426 respectively disposed in the first space 5501 and the second space 5502 of the first receptacle 551 divided by the second receptacle 552 are individually shielding may be possible.
  • the first substrate 420 is disposed in a first receptacle 571 having a first space 5701 having a closed loop shape and in a first space 5701 of the first receptacle 571 ,
  • a second receptacle 572 having a loop-shaped second space 5702 may be included.
  • the second substrate 440 may include a first connector 581 connected to the first receptacle 571 and a second connector 582 connected to the second receptacle 572 .
  • the electrical elements 425 and 426 respectively disposed in the first space 5701 formed by the first receptacle 571 and the second space 5702 formed by the second receptacle 572 are Individual shielding may be possible.
  • the first substrate 420 may include a receptacle 591 having a first space 5901 having a closed loop shape.
  • the second substrate 440 includes a first connector 595 connected to a partial region of the receptacle 591 and a second connector 596 connected to another partial region of the receptacle 591 . can do.
  • the first substrate 420 is at least partially spaced apart through the first connector 595 and the second connector 596 within a range in which the shielding performance for the electric element 425 does not deteriorate.
  • a space 5951 may be provided.
  • This separation space 5951 may be used as a passage path of the above-described electrical connection member (eg, the electrical connection member 460 of Fig. 8A).
  • the first substrate 420 may be connected to the first substrate 420 through two or more receptacles.
  • the first space 5901 may be formed and two or more receptacles disposed on the first board 420 may be connected to each other through one connector disposed on the second board 440 .
  • the electronic device (eg, the electronic device 400 of FIG. 4 ) includes a housing (eg, the housing 110 of FIG. 1 ), disposed in an internal space of the housing, and at least one electrical element A first substrate (eg, the first substrate 420 of FIG. 4 ) including (eg, the electric element 425 of FIG. 4 ), and the first substrate at least partially surrounding the at least one electric element at least one receptacle (eg, receptacle 430 in FIG. 6B ) disposed to A first sidewall (eg, the first sidewall 432 of FIG.
  • the recess includes the island region and the first A first recess formed between the sidewall (eg, the first recess 4301 of FIG. 6B ) and a second recess formed between the island region and the second sidewall (eg, the second recess of FIG.
  • the a second plurality of connector terminals elastically coupled to the second plurality of conductive terminals (eg, the second plurality of connector terminals 4552 of FIG. 6B ); disposed on at least a portion of the fourth sidewall; a third plurality of connector terminals elastically coupled to the third plurality of conductive terminals (eg, the third plurality of connector terminals 4553 in FIG. 6B ) and at least a portion of the fourth sidewall; at least one connector including a fourth plurality of connector terminals (eg, a fourth plurality of connector terminals 4554 of FIG.
  • At least one of the plurality of first, second, third, and fourth conductive terminals may be electrically connected to the ground of the first substrate (eg, the ground (G) of FIG. 6B ).
  • the at least one receptacle base may be disposed to surround the at least one electrical element in the first substrate in a closed loop shape.
  • the plurality of third conductive terminals may be electrically connected to the ground of the first substrate.
  • the at least one receptacle base may be disposed in a closed loop shape along an edge of the first substrate when the first substrate is viewed from above.
  • the at least one receptacle base may have a size smaller than that of the first substrate when the first substrate is viewed from above.
  • the at least one electric element includes two or more electric elements spaced apart from each other at a predetermined interval on the first substrate, and the at least one receptacle base is configured to individually connect the two or more electric elements to the at least one receptacle base. It may be placed in an enclosing number of corresponding numbers.
  • the at least one connector may be disposed on a second substrate, and when the at least one connector is coupled to the at least one receptacle, the first substrate and the second substrate may be electrically connected. there is.
  • any one of the plurality of connector terminals coupled to any one of the plurality of conductive terminals electrically connected to the ground of the first board among the plurality of connector terminals is electrically connected to the ground of the second board. can be connected to
  • the second substrate further includes at least one other electric element, and the at least one connector base at least partially surrounds the another at least one electric element in the second substrate. It can be arranged to
  • the at least one connector base may be disposed to surround the other at least one electrical element in the second substrate in a closed loop shape.
  • the at least one receptacle may form at least one space surrounding the at least one electrical element.
  • the at least one space may be formed through two or more receptacles.
  • the two or more receptacles are a first receptacle forming a first space in the form of a closed loop, and a second receptacle disposed to cross the first space, and dividing the first space into two spaces Receptacles may be included.
  • the two or more receptacles may include a first receptacle forming a first space in the form of a closed loop and a second receptacle disposed in the first space and including a second space in the form of a closed loop.
  • the at least one receptacle may include two or more receptacles, and the at least one connector may be disposed in a number corresponding to the two or more receptacles.
  • the at least one receptacle may include two or more receptacles, and the at least one connector may be disposed in a greater or smaller number than the two or more receptacles.
  • the at least one connector may be disposed to overlap the two or more receptacles when the first substrate is viewed from above.
  • the at least one receptacle is arranged to include a passage path at least partially formed through the two or more receptacles, the passage path being capable of receiving an electrical connection member.
  • the electrical connection member may include at least one of a flexible substrate (eg, a flexible printed circuit board (FPCB), a coaxial cable, and an FPCB type RF cable (FRC)).
  • a flexible substrate eg, a flexible printed circuit board (FPCB), a coaxial cable, and an FPCB type RF cable (FRC)
  • the at least one connector is disposed to include a passage path at least partially formed through the two or more connectors, and the passage path may receive an electrical connection member.

Landscapes

  • Engineering & Computer Science (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Details Of Connecting Devices For Male And Female Coupling (AREA)
  • Shielding Devices Or Components To Electric Or Magnetic Fields (AREA)

Abstract

Selon divers modes de réalisation, un dispositif électronique comprend : un boîtier; un premier substrat disposé dans un espace interne du boîtier et comprenant au moins un élément électrique; au moins un réceptacle comprenant une pluralité de bornes conductrices agencées pour entourer au moins partiellement le ou les éléments électriques contenus dans le premier substrat; et au moins un connecteur couplé de manière amovible au ou aux réceptacles et comprenant une pluralité de bornes de connecteur, au moins l'une de la pluralité de bornes conductrices pouvant être électriquement connectée à la masse du premier substrat.
PCT/KR2021/013026 2020-10-07 2021-09-24 Dispositif électronique comprenant une structure de connecteur de blindage Ceased WO2022075640A1 (fr)

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KR10-2020-0129351 2020-10-07
KR1020200129351A KR102805715B1 (ko) 2020-10-07 2020-10-07 차폐 커넥터 구조를 포함하는 전자 장치

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WO2025110571A1 (fr) * 2023-11-20 2025-05-30 삼성전자 주식회사 Douille de connecteur et dispositif électronique la comprenant

Citations (5)

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