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WO2022040382A1 - Amortisseur de bruit à liquides en motif multicouches - Google Patents

Amortisseur de bruit à liquides en motif multicouches Download PDF

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Publication number
WO2022040382A1
WO2022040382A1 PCT/US2021/046619 US2021046619W WO2022040382A1 WO 2022040382 A1 WO2022040382 A1 WO 2022040382A1 US 2021046619 W US2021046619 W US 2021046619W WO 2022040382 A1 WO2022040382 A1 WO 2022040382A1
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WIPO (PCT)
Prior art keywords
article
composition
damping
layer
formulation
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Ceased
Application number
PCT/US2021/046619
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English (en)
Inventor
Nicholas Xuanlai FANG
John David CAMPBELL
Shahrzad Ghaffari MOSANENZADEH
Joshua C. SPEROS
Sean Raymond GEORGE
Karl R. NICHOLAS
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
BASF SE
Massachusetts Institute of Technology
Original Assignee
BASF SE
Massachusetts Institute of Technology
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Publication of WO2022040382A1 publication Critical patent/WO2022040382A1/fr
Anticipated expiration legal-status Critical
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    • G—PHYSICS
    • G10—MUSICAL INSTRUMENTS; ACOUSTICS
    • G10K—SOUND-PRODUCING DEVICES; METHODS OR DEVICES FOR PROTECTING AGAINST, OR FOR DAMPING, NOISE OR OTHER ACOUSTIC WAVES IN GENERAL; ACOUSTICS NOT OTHERWISE PROVIDED FOR
    • G10K11/00—Methods or devices for transmitting, conducting or directing sound in general; Methods or devices for protecting against, or for damping, noise or other acoustic waves in general
    • G10K11/16—Methods or devices for protecting against, or for damping, noise or other acoustic waves in general
    • G10K11/162—Selection of materials
    • G—PHYSICS
    • G10—MUSICAL INSTRUMENTS; ACOUSTICS
    • G10K—SOUND-PRODUCING DEVICES; METHODS OR DEVICES FOR PROTECTING AGAINST, OR FOR DAMPING, NOISE OR OTHER ACOUSTIC WAVES IN GENERAL; ACOUSTICS NOT OTHERWISE PROVIDED FOR
    • G10K11/00—Methods or devices for transmitting, conducting or directing sound in general; Methods or devices for protecting against, or for damping, noise or other acoustic waves in general
    • G10K11/16—Methods or devices for protecting against, or for damping, noise or other acoustic waves in general
    • G10K11/162—Selection of materials
    • G10K11/168—Plural layers of different materials, e.g. sandwiches

Definitions

  • the present technology is generally related to liquid- applied sound damping (“LASD”) coatings, and methods of their application and preparation, and their use in downstream applications.
  • LASD liquid- applied sound damping
  • the present technology is directed to an article of manufacture that includes a damping formulation deposited in a discontinuous pattern on a substrate.
  • the damping formulation is configured to dampen vibrational and/or acoustic sound from and/or through the substrate.
  • the article exhibits greater vibrational and/or acoustic sound damping than the same amount of the damping formulation deposited in a substantially continuous uniform layer on the substrate as measured by a composite loss factor (“CLF”).
  • CLF composite loss factor
  • the article exhibits an average of at least about 20% more vibrational and/or acoustic sound damping than the same amount of the damping formulation deposited in a substantially continuous uniform layer on the substrate.
  • the discontinuous pattern is determined by computer simulated modeling.
  • the present technology is directed to a method of damping sound that includes applying/depositing on the substrate the damping formulation in a discontinuous pattern as disclosed herein.
  • FIG. 1A illustrates a computer simulated stress distribution and plate deformation
  • FIG. IB illustrates a computer simulated elastic strain energy distribution, according to the examples.
  • FIG. 2 is a graph illustrating the dependence of system loss factor on thickness of the damping layer, according to the examples.
  • FIG. 3 is a schematic of panel test setup, according to the examples.
  • FIG. 4A is an illustration of test panels 2-5 and FIG. 4B is a photo of test panels 2-5, according to the examples.
  • FIG. 5 is a photo of test panels 1-5 with the six single axis accelerometer locations indicated for each panel, according to the examples.
  • FIG. 6 is a bar graph illustrating the average damping loss factor for panels 1-5 at varying frequencies, according to the examples.
  • FIG. 7A is a line graph illustrating the average composite loss factor (“CLF”) for panels 1-5 at varying frequencies and
  • FIG. 7B is a line graph illustrating the normalized CLF based on control 2 (S2) having a substantially continuous uniform sound damping, according to the examples.
  • CLF composite loss factor
  • FIG. 8 is an example block diagram of a computing system implementing a sound damping pattern predication application, in accordance with some embodiments of the present disclosure.
  • discontinuous refers to having interruptions or gaps of the damping formulation such that it is not substantially continuous.
  • substantially continuous refers to having little (e.g., less than 1%, 0.5%, 0.1%) or no interruption of the damping formulation.
  • CAFE Corporate Average Fuel Economy
  • LASD liquid-applied sound damping
  • the filler is largely present to add mass (a traditional damping technique) and to reduce the cost of the formulation.
  • the damping formulation is configured to dampen vibrational and/or acoustic sound from and/or through the substrate.
  • the article exhibits greater vibrational and/or acoustic sound damping than the same amount of the damping formulation deposited in a substantially continuous uniform layer on the substrate as measured by a composite loss factor (“CLF”).
  • CLF composite loss factor
  • the damping formulation may be any formulation disclosed in WO 2019/099372, WO 2017/062878, US Pub. Appl. Nos. 2019/0016918, 2018/0030263, 2016/0035339, 2009/0045008, and US Patent No. 7,186,442, each of which is incorporated herein by reference.
  • the damping formulation may be a liquid- applied sound damping (“EASD”) formulation.
  • the damping formulation may be an aqueous-based formulation.
  • the damping formulation is a vibration damping formulation, an acoustic damping formulation, or both a vibration and an acoustic damping formulation.
  • the article with the damping formulation deposited in a discontinuous pattern on a substrate exhibits an average of at least about 20% more vibrational and/or acoustic sound damping based on CLF than the same amount of the damping formulation deposited in a substantially continuous uniform layer on the substrate. In some embodiments, the article exhibits an average of at least about 30%, at least about 40%, at least about 50%, or at least about 60% more vibrational and/or acoustic sound damping based on CLF than the same amount of the damping formulation deposited in a substantially continuous uniform layer on the substrate.
  • the CLF is measured at about 100 to about 800 Hz (including about 100 Hz, about 125 Hz, about 160 Hz, about 200 Hz, about 250 Hz, about 315 Hz, about 400 Hz, about 500 Hz, about 630 Hz, and/or 800 Hz determined for 1/3 octave band frequencies (“OBF”).
  • OHF 1/3 octave band frequencies
  • the discontinuous sound damping pattern is determined by computer simulated modeling (z.e., pattern prediction application).
  • the discontinuous pattern may be determined based on locations of maximum oscillatory strain at a desired oscillatory stress frequency, as determined by computational analysis including but not limited to finite element simulation.
  • FIG. 8 an example block diagram of a computing system 100 is shown, in accordance with some embodiments of the present disclosure.
  • the computing system 100 includes a host device 105.
  • the host device 105 includes a memory device 110.
  • the memory device 110 associated with the host device 105 is a separate device that is communicatively coupled to the host device 105 instead.
  • the host device 105 may be configured to receive input from one or more input devices 115 and provide output to one or more output devices 120.
  • the host device 105 may be configured to communicate with the input devices 115 and the output devices 120 via appropriate interfaces or channels 125A and 125B, respectively.
  • the computing system 100 may be implemented in a variety of computing devices such as computers (e.g., desktop, laptop, etc.), tablets, personal digital assistants, mobile devices, wearable computing devices such as smart watches, other handheld or portable devices, or any other computing unit suitable for performing operations described herein using the host device 105. Further, some or all of the features described in the present disclosure may be implemented on a client device, a server device, or a cloud/distributed computing environment, or a combination thereof. Additionally, unless otherwise indicated, functions described herein as being performed by a computing device (e.g., the computing system 100) may be implemented by multiple computing devices in a distributed environment, and vice versa.
  • the input devices 115 may include any of a variety of input technologies such as a keyboard, stylus, touch screen, mouse, track ball, keypad, microphone, voice recognition, motion recognition, remote controllers, input ports, one or more buttons, dials, joysticks, camera, and any other input peripheral that is associated with the host device 105 and that allows an external source, such as a user, to enter information (e.g., data) into the host device and send instructions to the host device 105.
  • information e.g., data
  • the output devices 120 may include a variety of output technologies such as external memories, printers, speakers, displays, microphones, light emitting diodes, headphones, plotters, speech generating devices, video devices, global positioning systems, and any other output peripherals that are configured to receive information (e.g., data) from the host device 105.
  • the “data” that is either input into the host device 105 and/or output from the host device may include any of a variety of textual data, graphical data, video data, image data, sound data, position data, sensor data, combinations thereof, or other types of analog and/or digital data that is suitable for processing using the computing system 100.
  • the host device 105 may include one or more Central Processing Unit (“CPU”) cores or processors 13OA-13ON that may be configured to execute instructions for running one or more applications associated with the host device 105.
  • the instructions and data needed to run the one or more applications may be stored within the memory device 110.
  • the host device 105 may also be configured to store the results of running the one or more applications within the memory device 110.
  • One such application on the host device 105 may include a pattern prediction application 135.
  • the pattern predication application 135 may be executed by one or more of the CPU cores 13OA-13ON.
  • the instructions to execute the pattern predication application 135 may be stored within the memory device 110.
  • the pattern predication application 135 is described in greater detail below.
  • the host device 105 may be configured to request the memory device 110 to perform a variety of operations. For example, the host device 105 may request the memory device 110 to read data, write data, update or delete data, and/or perform management or other operations.
  • the memory device 110 may include or be associated with a memory controller 140.
  • the memory controller 140 is shown as being part of the memory device 110, in some embodiments, the memory controller 140 may instead be part of another element of the computing system 100 and operatively associated with the memory device 110.
  • the memory controller 140 may be configured as a logical block or circuitry that receives instructions from the host device 105 and performs operations in accordance with those instructions.
  • the host device 105 may send a request to the memory controller 140.
  • the memory controller 140 may read the instructions associated with the pattern prediction application 135 that are stored within the memory device 110, and send those instructions back to the host device 105. Continuing with the example embodiment of the memory device 110 being a separate device from the host device 105, those instructions may be temporarily stored within a memory on the host device 105. One or more of the CPU cores 13OA-13ON may then execute those instructions by performing one or more operations called for by those instructions of the pattern prediction application 135.
  • the memory device 110 may include one or more memory circuits 145 that store data and instructions.
  • the memory circuits 145 may be any of a variety of memory types, including a variety of volatile memories, non-volatile memories, or a combination thereof.
  • one or more of the memory circuits 145 or portions thereof may include NAND flash memory cores.
  • one or more of the memory circuits 145 or portions thereof may include NOR flash memory cores, Static Random Access Memory (SRAM) cores, Dynamic Random Access Memory (DRAM) cores, Magnetoresistive Random Access Memory (MRAM) cores, Phase Change Memory (PCM) cores, Resistive Random Access Memory (ReRAM) cores, 3D XPoint memory cores, ferroelectric random-access memory (FeRAM) cores, and other types of memory cores that are suitable for use within the memory device 110.
  • SCM storage class memory
  • the memory circuits 145 may include any of a variety of Random Access Memory (RAM), Read-Only Memory (ROM), Programmable ROM (PROM), Erasable PROM (EPROM), Electrically EPROM (EEPROM), hard disk drives, flash drives, memory tapes, cloud memory, or any combination of primary and/or secondary memory that is suitable for performing the operations described herein.
  • RAM Random Access Memory
  • ROM Read-Only Memory
  • PROM Programmable ROM
  • EPROM Erasable PROM
  • EEPROM Electrically EPROM
  • hard disk drives flash drives
  • flash drives memory tapes
  • cloud memory or any combination of primary and/or secondary memory that is suitable for performing the operations described herein.
  • the computing system 100 may include other components such as various batteries and power sources, networking interfaces, routers, switches, external memory systems, controllers, etc.
  • the computing system 100 may include any of a variety of hardware, software, and/or firmware components that are needed or considered desirable in performing the functions described herein.
  • the host device 105, the input devices 115, the output devices 120, and the memory device 110, including the memory controller 140 and the memory circuits 145 may include hardware, software, and/or firmware components that are considered necessary or desirable in performing the functions described herein.
  • the memory device 110 may integrate some or all of the components of the host device 105, including, for example, the CPU cores 13OA-13ON, and the CPU cores may be configured to execute the pattern predication application 135, as described herein.
  • the computing system may include a software capable of finite element modeling (e.g., COMSOL® Software).
  • the discontinuous pattern may include parallel stripes, 3-sided shapes (e.g., triangles), 4-sided shapes (e.g., square, rectangle, or parallelogram), parallel and perpendicular stripes, pound/hash sign, triangles, circles, ovals, 5 or greater sided shapes (e.g., pentagons, hexagons, octagons, etc.), star, arrow, heart, plus sign, or a combination of two or more thereof.
  • the discontinuous pattern includes parallel stripes, squares, pound/hash signs, or a combination of two or more thereof.
  • the substrate has a surface area and the substantially continuous uniform layer may cover 80% to 100% (or 90-100%) of the surface area and the discontinuous pattern may be deposited on less than 90% of the surface area.
  • the discontinuous pattern may cover less than 90%, less than 85%, less than 80%, less than 75%, less than 70%, less than 65%, less than 60%, less than 55%, less than 50%, less than 45%, less than 40%, less than 35%, less than 30%, or less than 25% of the surface area of the substrate.
  • the discontinuous pattern may be a uniform discontinuous pattern.
  • the damping formulation deposited in the discontinuous pattern on the substrate may include one or more layers.
  • the damping formulation may include a first layer and a second layer.
  • the first layer may include a first composition and the second layer may include a second composition.
  • the first layer is below the second layer (z.e., the first layer is a lower layer and the second layer is an upper layer).
  • the first layer may be deposited on the substrate.
  • the second layer may be deposited on the first layer such that the second layer is in direct contact with the first layer.
  • the first composition may include a first polymeric material and the second composition may include a second polymeric material.
  • the first polymeric material and the second polymeric material are the same. In other embodiments, the first polymeric material and the second polymeric material are different.
  • the second composition has a Young's Modulus stiffness factor less than 10-times greater than the first composition (e.g., the second composition may have a Young's Modulus (E') less than 1.0 x 10 9 MPa compared to the first composition). In some embodiments, the second composition has a Young's Modulus stiffness factor less than 10-times greater than the first composition (e.g., the second composition may have a Young's Modulus (E') less than 1.0 x 10 9 Pa compared to the first composition). In some embodiments, the second composition has a stiffness factor less than 8-times greater, less than 5-times greater, less than 3- times greater, or less than 2-times greater than the first composition.
  • the first composition has a stiffness of about 5 MPa to about 1000 MPa and the second composition has a stiffness of about 1000 MPa to about 10,000 MPa. In some embodiments, the first composition has a stiffness of about 5 MPa to about 800 MPa, about 5 MPa to about 500 MPa, or about 5 MPa to about 300 MPa. In some embodiments, the second composition has a stiffness of about 1100 MPa to about 8000 MPa, about 1200 MPa to about 7000 MPa, or about 1400 MPa to about 6000 MPa. In some embodiments, the first composition has a stiffness of about 10 MPa to about 100 MPa and the second composition has a stiffness of about 1500 MPa to about 5000 MPa.
  • the first composition has a lower glass transition temperature than the second composition.
  • the first composition may have a glass transition temperature (T g ) from about -20 °C to about 10 °C.
  • the first composition may have a glass transition temperature (T g ) from about -10 °C to about 10 °C or about -5 °C to about 5 °C.
  • the second composition may have a glass transition temperature (T g ) from about 10 °C to about 40 °C.
  • the second composition may have a glass transition temperature (T g ) from about 15 °C to about 30 °C or 15 °C to about 25 °C.
  • the first composition has a lower density than the second composition. In some embodiments, the first composition may have a density at least about 1.5 times lower than the second composition. In some embodiments, the first composition may have a density at least about 2 times, about 2.5 times, or about 3 times lower than the second composition. In some embodiments, the first composition may have a density from about 500 kg/m 3 to about 1500 kg/m 3 . In some embodiments, the first composition may have a density from about 600 kg/m 3 to about 1400 kg/m 3 . In some embodiments, the first composition may have a density from about 700 kg/m 3 to about 1300 kg/m 3 .
  • the first composition may have a density from about 800 kg/m 3 to about 1200 kg/m 3 .
  • the second composition may have a density from about 1500 kg/m 3 to about 2500 kg/m 3 .
  • the second composition may have a density from about 1600 kg/m 3 to about 2400 kg/m 3 .
  • the second composition may have a density from about 1700 kg/m 3 to about 2300 kg/m 3 .
  • the second composition may have a density from about 1800 kg/m 3 to about 2200 kg/m 3 .
  • the first composition has greater porosity than the second composition.
  • the first composition has a low density and high elastic modulus constrained by a dense second composition.
  • the damping formulation includes a porous lower layer constrained with a solid upper layer both made of LASD material.
  • the lower layer and the upper layer may both be made of pre-existing formulations (e.g. high/low density or high/low modulus).
  • the first polymeric material may be any polymeric material as long as the respective first composition has at least one of the physical properties described herein.
  • the first composition has at least the Young's Modulus, T g , and/or density described herein.
  • the first polymeric material and the second polymeric material may be the same or different and may be any polymeric material as long as the respective first composition and second composition have at least one of the physical properties described herein.
  • the first composition and second composition have at least the Young's Modulus, T g , and/or density described herein.
  • the polymeric material may be an acrylic based polymeric material.
  • the damping formulation may also include a filler.
  • the filler may be in the first composition, the second composition, or both the first and second compositions.
  • the first composition and the second composition may include the same filler.
  • a filler include, but are not limited to, calcium carbonate, barium sulfate, glass filler, magnesium carbonate, plastic microsphere, mica, or a combination of two or more thereof.
  • the filler may include calcium carbonate.
  • the filler may include microsphere including expanded microspheres.
  • the first composition and the second composition may include 0 to about 85 wt% filler (e.g., 0 to about 75 wt%, 0 to about 50 wt%, 0 to about 25 wt%, 0 to 15 wt%, 5 to about 75 wt%, 10 to about 65 wt%, 20 to about 60 wt%, or 30 to 50 wt%).
  • the first composition may include about 1.5-times or greater filler than the second composition.
  • the damping formulation may also include other additives such as a defoaming agent, a rheological modifier, an emulsifying agent, a biocide, or a mixture of any two or more thereof.
  • the damping formulation can also include pigments for aesthetic purposes.
  • the pigments can be, but are not limited to, black or white pigments.
  • the damping formulation may have a thickness of about 0.5 mm to about 20 mm, about 0.5 mm to about 10 mm, about 1.0 mm to about 9.0 mm, about 2.0 mm to about 8.0 mm, about 2.0 mm to about 6.0 mm, or about 1 mm to about 5 mm.
  • the first layer may have a thickness of about 0.5 mm to about 10 mm, about 1.0 mm to about 9.0 mm, about 2.0 mm to about 8.0 mm, about 2.0 mm to about 6.0 mm, or about 1 mm to about 5 mm.
  • the second layer may have a thickness of about 0.5 mm to about 10 mm, about 1.0 mm to about 9.0 mm, about 2.0 mm to about 8.0 mm, about 2.0 mm to about 6.0 mm, or about 1 mm to about 5 mm.
  • the first layer and the second layer may have about the same thickness.
  • the first layer may be thicker than the second layer or the second layer may be thicker than the first layer.
  • the substrate of the present disclosure may be an automotive (e.g., vehicle), airplane, home appliances (e.g., dishwasher or washing machine), building material, computer, vacuum cleaner, HVAC system, and/or flooring.
  • the substrate may be a vehicle.
  • Other advantages that may be imparted to the article by the damping formulation include, but are not limited to, optimization of barrier properties over the sound damping formulation, good flexibility, and ease of application. Further advantages include but are not limited to mass reduction/optimization.
  • a method of damping sound that includes applying on the substrate the damping formulation as disclosed herein in any of the patterns disclosed herein.
  • the damping formulation may include a first layer and a second layer.
  • the method may include applying to the substrate the first layer of the damping formulation and applying the second layer of the damping formulation to the first layer.
  • the damping formulation may be in liquid form during the application.
  • the damping formulation has a viscosity of about 5000 to about 300,000 cps (centipoise) (including viscosities of about 10,000 to about 200,000 cps, about 10,000 to about 150,000 cps, or about 10,000 to about 100,000 cps). Methods to measure viscosity will be well known to a person skilled in the art.
  • Embodiment 1 is an article of manufacture comprising a damping formulation deposited in a discontinuous pattern on a substrate, wherein the damping formulation is configured to dampen vibrational and/or acoustic sound from and/or through the substrate; wherein: the article exhibits greater vibrational and/or acoustic sound damping than the same amount of the damping formulation deposited in a substantially continuous uniform layer on the substrate as measured by a composite loss factor.
  • Embodiment 2 is the article of embodiment 1, wherein the article exhibits an average of at least about 20% more vibrational and/or acoustic sound damping than the same amount of the damping formulation deposited in a substantially continuous uniform layer on the substrate.
  • Embodiment 3 is the article of embodiment 1 or embodiment 2, wherein the article exhibits an average of at least about 30% more vibrational and/or acoustic sound damping than the same amount of the damping formulation deposited in a substantially continuous uniform layer on the substrate.
  • Embodiment 4 is the article of any one of embodiments 1-3, wherein the article exhibits an average of at least about 40% more vibrational and/or acoustic sound damping than the same amount of the damping formulation deposited in a substantially continuous uniform layer on the substrate.
  • Embodiment 5 is the article of any one of embodiments 1-4, wherein the damping formulation is a vibration damping formulation.
  • Embodiment 6 is the article of any one of embodiments 1-5, wherein the discontinuous pattern is determined by computer simulated modeling.
  • Embodiment 7 is the article of any one of embodiments 1-6, wherein the discontinuous pattern comprises parallel stripes, 4-sided shapes, parallel and perpendicular stripes, pound/hash sign, triangles, circles, ovals, 5 or greater sided shapes, star, arrow, heart, plus sign, or a combination of two or more thereof.
  • Embodiment 8 is the article of any one of embodiments 1-7, wherein the discontinuous pattern comprises parallel stripes, squares, pound/hash signs, or a combination of two or more thereof.
  • Embodiment 9 is the article of any one of embodiments 1-8, wherein the discontinuous pattern is a uniform discontinuous pattern.
  • Embodiment 10 is the article of any one of embodiments 1-9, wherein the substrate has a surface area and the substantially continuous uniform layer covers 80% to 100% of the surface area and the discontinuous pattern is deposited on less than 90% of the surface area.
  • Embodiment 11 is the article of embodiment 10, wherein the damping formulation deposited in the discontinuous pattern is deposited on less than 85% of the surface area of the substrate.
  • Embodiment 12 is the article of embodiment 10 or embodiment 11, wherein the damping formulation deposited in the discontinuous pattern is deposited on less than 80% of the surface area of the substrate.
  • Embodiment 13 is the article of any one of embodiments 10-12, wherein the damping formulation deposited in the discontinuous pattern is deposited on less than 75% of the surface area of the substrate.
  • Embodiment 14 is the article of any one of embodiments 10-13, wherein the damping formulation deposited in the discontinuous pattern is deposited on less than 60% of the surface area of the substrate.
  • Embodiment 15 is the article of any one of embodiments 10-14, wherein the damping formulation deposited in the discontinuous pattern is deposited on less than 50% of the surface area of the substrate.
  • Embodiment 16 is the article of any one of embodiments 10-15, wherein the damping formulation deposited in the discontinuous pattern is deposited on less than 40% of the surface area of the substrate.
  • Embodiment 17 is the article of any one of embodiments 1-16, wherein the damping formulation comprise a first layer and a second layer.
  • Embodiment 18 is the article of embodiment 17, wherein the first layer comprises a first composition and the second layer comprises a second composition.
  • Embodiment 19 is the article of embodiment 18, wherein the second composition has a stiffness factor less than 10-times greater than the first composition.
  • Embodiment 20 is the article of embodiment 18 or embodiment 19, wherein the second composition has a stiffness factor less than 8-times greater than the first composition.
  • Embodiment 21 is the article of any one of embodiments 18-20, wherein the second composition has a stiffness factor less than 5-times greater than the first composition.
  • Embodiment 22 is the article of any one of embodiments 18-21, wherein the first composition has a stiffness of about 5 MPa to about 1000 MPa and the second composition has a stiffness of about 1000 MPa to about 10,000 MPa.
  • Embodiment 23 is the article of any one of embodiments 18-22, wherein the first composition has a stiffness of about 10 MPa to about 100 MPa and the second composition has a stiffness of about 1500 MPa to about 5000 MPa.
  • Embodiment 24 is the article of any one of embodiments 18-23, wherein the first composition has a lower glass transition temperature than the second composition.
  • Embodiment 25 is the article of any one of embodiments 18-24, wherein the first composition has a lower density than the second composition.
  • Embodiment 26 is the article of any one of embodiments 18-25, wherein the first composition has greater porosity than the second composition.
  • Embodiment 27 is the article of any one of embodiments 18-26, wherein the first composition comprises a first polymeric material and the second composition comprises a second polymeric material.
  • Embodiment 28 is the article of embodiment 27, wherein the first polymeric material and the second polymeric material are the same.
  • Embodiment 29 is the article of embodiment 27, wherein the first polymeric material and the second polymeric material are different.
  • Embodiment 30 is the article of any one of embodiments 1-29, wherein the damping formulation comprises a filler, a defoaming agent, a rheological modifier, an emulsifying agent, a biocide, or a mixture of any two or more thereof.
  • Embodiment 31 is the article of embodiment 30, wherein the damping formulation comprises the filler.
  • Embodiment 32 is the article of embodiment 30 or embodiment 31, wherein the filler comprises calcium carbonate.
  • Embodiment 33 is the article of any one of embodiments 30-32, wherein the first composition and the second composition comprise the filler.
  • Embodiment 34 is the article of any one of embodiments 30-33, wherein the first composition and the second composition comprise the same filler.
  • Embodiment 35 is the article of any one of embodiments 17-34, wherein the second layer is direct contact with the first layer.
  • Embodiment 36 the article of any one of embodiments 1-35, wherein the damping formulation has a thickness of about 0.5 mm to about 10 mm.
  • Embodiment 37 is the article of any one of embodiments 1-36, wherein the damping formulation has a thickness of about 2.0 mm to about 8.0 mm.
  • Embodiment 38 is the article of any one of embodiments 17-37, wherein the first layer has a thickness of about 0.5 mm to about 10 mm and the second layer has a thickness of about 0.5 mm to about 10 mm.
  • Embodiment 39 is the article of any one of embodiments 17-38, wherein the first layer has a thickness of about 1 mm to about 5 mm and the second layer has a thickness of about 1 mm to about 5 mm.
  • Embodiment 40 is the article of embodiment 38 or embodiment 39, wherein the first layer and the second layer have about the same thickness.
  • Embodiment 41 is the article of embodiment 38 or embodiment 39, wherein the first layer is thicker than the second layer.
  • Embodiment 42 is the article of embodiment 38 or embodiment 39, wherein the second layer is thicker than the first layer.
  • Embodiment 43 is the article of any one of embodiments 1-42, wherein the damping formulation is a liquid- applied sound damping formulation.
  • Embodiment 44 is the article of any one of embodiments 1-43, wherein the damping formulation is an aqueous-based formulation.
  • Embodiment 45 is the article of any one of embodiments 1-44, wherein the substrate is a vehicle.
  • Embodiment 46 is a method of damping sound, the method comprising applying on the substrate the damping formulation in any one of embodiments 1-36 in the pattern in any one of embodiments 1-36.
  • Embodiment 47 is the method of embodiments 46, wherein the damping formulation comprises the first layer and the second layer in any one of embodiments 17-45, the method further comprising applying to the substrate the first layer of the damping formulation and applying the second layer of the damping formulation to the first layer.
  • Embodiment 48 is the method of embodiment 46 or embodiment 47, wherein the damping formulation is in liquid form during the applying.
  • Example 1 Computer simulations were used to evaluate the performance of a patterned LASD on a rectangular steel plate (365 mm x 250 mm x 0.8 mm), which was clamped and under forced vibration using the equation of motion for a viscously damped system expressed as: wherein M u is the mass matrix, C u the damping matrix and K u the stiffness matrix of the patterned LASD; ii(x, t) denotes the acceleration, it(x, t) the velocity, n(x, t) the displacement and f u (t) the external time dependent loads of the system.
  • Equation (1) requires very small time steps, hence the vibration analysis was carried out in the frequency domain to minimize the computational costs.
  • FIG. 1A illustrates a fully clamped panel under forced vibration computer simulated in three dimensions, which are in agreement with theoretical predictions. Plate geometry determines the frequency of natural modes and is applicable to any geometry.
  • Example 2 Following computer simulation, five total steel panel samples (600 mm x 500 mm x 1.6 mm) were produced and tested to determine and compare vibration loss factors. Each panel was rigidly mounted to a fixture with a measured torque of 10 Nm, which was connected to a shaker and carries vibration from the shaker to the panel sample (FIG. 3). Due to mounting of the fixture, a 50 mm gap was required at each edge. Panel 1 had no sound damping material (control 1) (Sample 1 (“SI”)) and panels 2-5 had substantially the same total amount of sound damping material (z.e., LASD).
  • Panel 2 (Sample 2 (“S2”)) had a pattern of two parallels stripes of LASD
  • panel 3 (Sample 3 (“S3”)) had a pattern of single small rectangle of LASD
  • panel 4 control 2) (Sample 4 (“S4”)) had a substantially continuous uniform LASD
  • panel 5 (Sample 5 (“S5”)) had a pattern of pound/hash sign (z.e., cross-hatch) of LASD (FIGS. 4A and 4B).
  • the test fixture was excited using a 220 N electro-magnetic shaker using random signal from 10-1000 Hz.
  • the response of the shaker based excitation was measured using single axis accelerometers at six predetermined and asymmetric locations (the same locations for each panel) (FIG. 5).
  • FFF frequency response function
  • the loss factor values were then averaged at each of the six locations to obtain the averaged damping loss factor for each panel for the range of 100-800 Hz 1/3 OBF as provided in Table 1 and FIG. 6.
  • the data demonstrates the average composite loss factor (“CLF”) for S5 was the greatest followed closely by S3 as graphically provided in FIG. 7A (normalized CLF average). Normalizing the CLF data based on panel 4 (substantially continuous uniform LASD) (S4) demonstrates S5 had the greatest average CLF (FIG. 7B).

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Abstract

La présente invention concerne un article manufacturé et des procédés de fabrication de l'article qui comprend une formulation d'amortissement déposée selon un motif discontinu sur un substrat, la formulation d'amortissement étant configurée pour amortir un son vibratoire et/ou acoustique provenant du substrat et/ou le traversant. L'article présente un amortissement vibratoire et/ou acoustique plus important que la même quantité de la formulation d'amortissement déposée dans une couche uniforme sensiblement continue sur le substrat telle que mesurée par un facteur de perte du composite.
PCT/US2021/046619 2020-08-19 2021-08-19 Amortisseur de bruit à liquides en motif multicouches Ceased WO2022040382A1 (fr)

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Citations (9)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
WO1996023988A1 (fr) * 1995-01-30 1996-08-08 Speedglue Ab Article dote d'un moyen permettant d'amortir le bruit produit par un cadre, procede pour fabriquer cet article et systeme pour appliquer le moyen amortisseur sur l'article
US7186442B2 (en) 2003-06-11 2007-03-06 Sika Technology Ag Constrained layer damper
US20090045008A1 (en) 2005-04-26 2009-02-19 Shiloh Industries, Inc. Acrylate-based sound damping material and method of preparing same
US20160035339A1 (en) 2013-02-11 2016-02-04 Henkel Ag & Co. Kgaa Liquid Rubber Damping Composition
US9580901B2 (en) * 2011-09-30 2017-02-28 Saint-Gobain Performance Plastics Chaineux Optimized pattern of a damping layer for wall, floor, and ceiling constructions
WO2017062878A1 (fr) 2015-10-09 2017-04-13 Basf Se Compositions de barrière acoustique appliquées par pulvérisation sur des matériaux d'absorption
US20180030263A1 (en) 2015-02-11 2018-02-01 Polyone Corporation Sound damping thermoplastic elastomer articles
US20190016918A1 (en) 2016-01-15 2019-01-17 Ppg Industries Ohio, Inc. Hydroxy functional alkyl polyurea containing compositions
WO2019099372A1 (fr) 2017-11-14 2019-05-23 Basf Se Compositions à séchage rapide, à haut extrait sec et résistantes à l'affaissement, revêtements, emballage à deux éléments constitutifs et procédé de revêtement

Patent Citations (9)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
WO1996023988A1 (fr) * 1995-01-30 1996-08-08 Speedglue Ab Article dote d'un moyen permettant d'amortir le bruit produit par un cadre, procede pour fabriquer cet article et systeme pour appliquer le moyen amortisseur sur l'article
US7186442B2 (en) 2003-06-11 2007-03-06 Sika Technology Ag Constrained layer damper
US20090045008A1 (en) 2005-04-26 2009-02-19 Shiloh Industries, Inc. Acrylate-based sound damping material and method of preparing same
US9580901B2 (en) * 2011-09-30 2017-02-28 Saint-Gobain Performance Plastics Chaineux Optimized pattern of a damping layer for wall, floor, and ceiling constructions
US20160035339A1 (en) 2013-02-11 2016-02-04 Henkel Ag & Co. Kgaa Liquid Rubber Damping Composition
US20180030263A1 (en) 2015-02-11 2018-02-01 Polyone Corporation Sound damping thermoplastic elastomer articles
WO2017062878A1 (fr) 2015-10-09 2017-04-13 Basf Se Compositions de barrière acoustique appliquées par pulvérisation sur des matériaux d'absorption
US20190016918A1 (en) 2016-01-15 2019-01-17 Ppg Industries Ohio, Inc. Hydroxy functional alkyl polyurea containing compositions
WO2019099372A1 (fr) 2017-11-14 2019-05-23 Basf Se Compositions à séchage rapide, à haut extrait sec et résistantes à l'affaissement, revêtements, emballage à deux éléments constitutifs et procédé de revêtement

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