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WO2021220620A1 - Capteur de courant électrique - Google Patents

Capteur de courant électrique Download PDF

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Publication number
WO2021220620A1
WO2021220620A1 PCT/JP2021/008978 JP2021008978W WO2021220620A1 WO 2021220620 A1 WO2021220620 A1 WO 2021220620A1 JP 2021008978 W JP2021008978 W JP 2021008978W WO 2021220620 A1 WO2021220620 A1 WO 2021220620A1
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WIPO (PCT)
Prior art keywords
flow path
path portion
axis direction
bus bar
magnetic sensor
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Ceased
Application number
PCT/JP2021/008978
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English (en)
Japanese (ja)
Inventor
潤哉 菰田
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Murata Manufacturing Co Ltd
Original Assignee
Murata Manufacturing Co Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Murata Manufacturing Co Ltd filed Critical Murata Manufacturing Co Ltd
Publication of WO2021220620A1 publication Critical patent/WO2021220620A1/fr
Anticipated expiration legal-status Critical
Ceased legal-status Critical Current

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    • G—PHYSICS
    • G01—MEASURING; TESTING
    • G01R—MEASURING ELECTRIC VARIABLES; MEASURING MAGNETIC VARIABLES
    • G01R15/00—Details of measuring arrangements of the types provided for in groups G01R17/00 - G01R29/00, G01R33/00 - G01R33/26 or G01R35/00
    • G01R15/14—Adaptations providing voltage or current isolation, e.g. for high-voltage or high-current networks
    • G01R15/20—Adaptations providing voltage or current isolation, e.g. for high-voltage or high-current networks using galvano-magnetic devices, e.g. Hall-effect devices, i.e. measuring a magnetic field via the interaction between a current and a magnetic field, e.g. magneto resistive or Hall effect devices

Definitions

  • the present invention relates to a current sensor.
  • Patent Document 1 Japanese Patent Application Laid-Open No. 2013-245942
  • Patent Document 2 Japanese Patent Application Laid-Open No. 2015-152363
  • Patent Document 3 Japanese Patent Application Laid-Open No. 2017-49264
  • Patent Document 4 Japanese Patent Application Laid-Open No. 2018-116047
  • Patent Document 5 Japanese Patent Application Laid-Open No. 2018-116047
  • the current sensor described in Patent Document 1 includes a conductor, a signal terminal portion, a support portion, a magnetic-electric conversion element, and an insulating member.
  • the conductor has a gap.
  • the signal terminal portion has a lead terminal.
  • the support portion supports a signal processing IC having a gap for electrically insulating the conductor in a plan view and being configured to be electrically connectable to the signal terminal portion.
  • the magnetic conversion element is configured to be electrically connectable to the signal processing IC, and is arranged in the gap of the conductor so as to detect the current flowing through the conductor.
  • the insulating member supports the magnetic-electric conversion element.
  • the magnetoelectric conversion element is a Hall element or a magnetoresistive element.
  • the current sensor described in Patent Document 2 includes a plurality of magnetic-electric conversion elements, a conductor, a signal processing IC, and a lead frame.
  • Each of the plurality of magnetic-electric conversion elements detects the magnetic flux.
  • a current to be measured flows through the conductor.
  • the signal processing IC processes the output from the magnetic-electric conversion element.
  • the lead frame forms a signal terminal.
  • the conductor has a first conductor portion and a second conductor portion formed from the first conductor portion via a step.
  • Each magnetic conversion element is arranged on both sides of the second conductor portion on the insulating sheet supported by the lead frame with the second conductor portion interposed therebetween.
  • the signal processing IC is supported by a fixed portion formed from the lead frame via a step, and is arranged so as to straddle the first conductor portion.
  • the magnetoelectric conversion element is a Hall element, a magnetoresistive element, a Hall IC or a magnetoresistive IC.
  • the current sensor described in Patent Document 3 includes a lead frame and a die.
  • the lead frame has a first portion containing a current lead connected to form a current conductor for carrying the primary current and a second portion containing a signal lead.
  • the die is coupled to the second lead frame portion by interconnection.
  • the die includes a magnetic field sensing circuit that senses the magnetic field associated with the primary current and produces an output at one of the signal leads based on the sensed magnetic field.
  • the interconnect is a flip chip using solder bumps.
  • the magnetic field sensing circuit includes a magnetic field transducer having a sensing element selected from one of a Hall effect sensing element or a magnetoresistive sensing element.
  • the current sensor described in Patent Document 4 includes a primary conductor, a support portion, and a lead terminal.
  • the primary conductor has a U-shaped current path.
  • the support portion supports the magnetic-electric conversion element.
  • the lead terminal is connected to the support portion.
  • the U-shaped current path is formed so as not to overlap the support portion in a plan view and to be different in height from the support portion in a side view.
  • the magnetic-electric conversion element is a Hall element, a Hall IC, or a magnetoresistive IC.
  • the current sensor described in Patent Document 5 includes a sealing portion, a first conductor, a second conductor, a first magnetic sensor, and a second magnetic sensor.
  • the first conductor has a curved portion curved in a plan view in the sealing portion, and two ends are exposed from the sealing portion.
  • the second conductor has a curved portion curved in a plan view in the sealing portion, and two ends are exposed from the sealing portion.
  • the first magnetic sensor is provided inside the sealing portion and is arranged inside the first conductor in a plan view.
  • the second magnetic sensor is provided inside the sealing portion and is arranged inside the second conductor in a plan view.
  • One end of the first conductor and one end of the second conductor are electrically connected.
  • Each of the first magnetic sensor and the second magnetic sensor has a Hall element.
  • the magnetic-electric conversion elements are arranged on both sides of the second conductor portion with the second conductor portion sandwiched between them. Therefore, when the magnetic-electric conversion element is a magnetoresistive element, There is room for improving the magnetic field detection characteristics of the magnetoelectric conversion element.
  • the current sensor based on the present invention includes a bus bar, a magnetic sensor chip, and an insulating sheet.
  • the current to be measured flows through the bus bar.
  • the magnetic sensor chip includes at least one magnetic sensor having a magnetoresistive element.
  • the insulating sheet is provided on the bus bar and supports the magnetic sensor chip.
  • the bus bar includes a pair of support portions to which an insulating sheet is fixed, and a portion to be measured that is located between the support portions and through which the current to be measured flows.
  • the insulating sheet includes a beam portion located between a pair of supporting portions when viewed from the direction in which the bus bar and the insulating sheet are arranged side by side. The beam portion and the measured portion are separated from each other in the direction in which the bus bar and the insulating sheet are lined up.
  • At least one magnetic sensor is arranged at a position overlapping the measured portion when viewed from the direction in which the bus bar and the insulating sheet are lined up.
  • the magnetic field detection characteristics can be maintained satisfactorily and stably while improving the insulation resistance characteristics of the magnetic sensor.
  • FIG. 5 is a cross-sectional view of the current sensor of FIG. 1 as viewed from the direction of the arrow on line II-II.
  • FIG. 5 is a plan view of the current sensor of FIG. 2 as viewed from the direction of arrow III. It is a top view which shows the structure of the magnetic sensor included in the current sensor which concerns on Embodiment 1 of this invention. It is a perspective view which shows the structure of the current sensor which concerns on Embodiment 2 of this invention.
  • FIG. 5 is a cross-sectional view of the current sensor of FIG. 5 as viewed from the direction of the arrow on the VI-VI line.
  • FIG. 7 is a cross-sectional view of the current sensor of FIG. 7 as viewed from the direction of the arrow along line VIII-VIII. It is a perspective view which shows the structure of the current sensor which concerns on Embodiment 4 of this invention.
  • 9 is a cross-sectional view of the current sensor of FIG. 9 as viewed from the direction of the XX line arrow. It is a perspective view which shows the structure of the current sensor which concerns on Embodiment 5 of this invention.
  • FIG. 11 is a cross-sectional view of the current sensor of FIG. 11 as viewed from the direction of the arrow along the line XII-XII.
  • FIG. 3 is a cross-sectional view of the current sensor of FIG. 13 as viewed from the direction of the arrow on the XIV-XIV line.
  • FIG. 14 is a plan view of the current sensor of FIG. 14 as viewed from the direction of arrow XV.
  • FIG. 1 is a perspective view showing a configuration of a current sensor according to a first embodiment of the present invention.
  • FIG. 2 is a cross-sectional view of the current sensor of FIG. 1 as viewed from the direction of the arrow along line II-II.
  • FIG. 3 is a plan view of the current sensor of FIG. 2 as viewed from the direction of arrow III.
  • the sealing resin is seen through and shown.
  • the sealing resin is not shown.
  • the length direction of the current sensor is the X-axis direction
  • the width direction of the current sensor is the Y-axis direction
  • the thickness direction of the current sensor is the Z-axis direction.
  • the current sensor 100 includes a bus bar 110, a magnetic sensor chip 140, a plurality of signal terminals, and an insulating sheet 160.
  • the current sensor 100 includes a first signal terminal 151, a second signal terminal 152, a third signal terminal 153, and a fourth signal terminal 154, which are arranged at intervals in the X-axis direction. ing.
  • the number of signal terminals is not limited to four, and may be a plurality.
  • the bus bar 110 includes a U-shaped folded portion.
  • the shape of the folded portion may be V-shaped or semi-circular.
  • the bus bar 110 includes a first flow path portion 111, a second flow path portion 112, a third flow path portion 113, a fourth flow path portion 114, and a fifth flow path portion 115. ..
  • the first flow path portion 111 extends toward one side in the X-axis direction.
  • the second flow path portion 112 extends from one end of the first flow path portion 111 in the X-axis direction to one side in the Y-axis direction.
  • the third flow path portion 113 extends from one end of the second flow path portion 112 in the Y-axis direction and is curved in a semicircular shape when viewed from the Z-axis direction.
  • the fourth flow path portion 114 extends from the end portion of the third flow path portion 113 to the other side in the Y-axis direction.
  • the fifth flow path portion 115 extends from the other end of the fourth flow path portion 114 in the Y-axis direction toward one side in the X-axis direction.
  • the second flow path portion 112 and the fourth flow path portion 114 form a pair of facing portions in which the current I flows in opposite directions while being located with a gap between them.
  • One of the pair of facing portions is the second flow path portion 112, and the other of the pair of facing portions is the fourth flow path portion 114.
  • the pair of facing portions is included in the measured portion through which the current I to be measured flows.
  • the first flow path portion 111, the second flow path portion 112, the third flow path portion 113, the fourth flow path portion 114, and the fifth flow path portion 115 are embedded in the sealing resin 190.
  • the sealing resin 190 is an insulating resin such as an epoxy resin.
  • the bus bar 110 includes a first current terminal 116a, a second current terminal 116b, a third current terminal 116c, and a fourth current terminal 116d, which are arranged at intervals in the X-axis direction.
  • the first current terminal 116a is connected to a portion of the first flow path portion 111 on the other side in the X-axis direction.
  • the second current terminal 116b is connected to one side of the first flow path portion 111 in the X-axis direction.
  • the third current terminal 116c is connected to a portion of the fifth flow path portion 115 on the other side in the X-axis direction.
  • the fourth current terminal 116d is connected to one side of the fifth flow path portion 115 in the X-axis direction.
  • first current terminal 116a One end in the Y-axis direction of each of the first current terminal 116a, the second current terminal 116b, the third current terminal 116c, and the fourth current terminal 116d is embedded in the sealing resin 190.
  • the portions of the first current terminal 116a, the second current terminal 116b, the third current terminal 116c, and the fourth current terminal 116d other than one end in the Y-axis direction are not covered with the sealing resin 190. It is exposed.
  • the bus bar 110 includes a pair of supports to which the insulating sheet 160 is fixed.
  • the pair of support portions is composed of a first support portion 117a and a second support portion 117b.
  • the bus bar 110 includes a first stage portion 118a and a second stage portion 118b.
  • Each of the first step portion 118a and the second step portion 118b extends in the Z-axis direction and has a step.
  • the first support portion 117a and the second support portion 117b are the first flow path portion 111, the second flow path portion 112, the third flow path portion 113, the fourth flow path portion 114, and the fifth flow path portion 115 and Z. They are located at different positions in the axial direction.
  • first support portion 117a and the second support portion 117b are formed by the first step portion 118a and the second step portion 118b in the Z-axis direction with the first flow path portion 111 and the second flow path portion 112.
  • the third flow path portion 113, the fourth flow path portion 114, and the fifth flow path portion 115 are arranged closer to the insulating sheet 160.
  • the first support portion 117a is located on the other side of the first flow path portion 111 in the X-axis direction and one in the Y-axis direction via the first step portion 118a. It is connected to the side part.
  • the first support portion 117a is located on the other side in the X-axis direction with a gap from the second flow path portion 112, and is located on one side in the Z-axis direction from the second flow path portion 112. ..
  • the second support portion 117b is connected to one side of the fifth flow path portion 115 in the X-axis direction and one side in the Y-axis direction via the second stage portion 118b.
  • the second support portion 117b is located on one side in the X-axis direction with a gap from the fourth flow path portion 114, and is located on one side in the Z-axis direction from the fourth flow path portion 114. ..
  • the second flow path portion 112 and the fourth flow path portion 114 are located between the first support portion 117a and the second support portion 117b. That is, when viewed from the Z-axis direction in which the bus bar 110 and the insulating sheet 160 are aligned, the first support portion 117a and the second support portion 117b have the second flow path portion 112 and the fourth flow path portion 114 in between. It is arranged outside the second flow path portion 112 and the fourth flow path portion 114 so as to be sandwiched between them.
  • the one-sided surface of the first support portion 117a in the Z-axis direction and the one-sided surface of the second support portion 117b in the Z-axis direction are located on substantially the same plane.
  • bus bar 110 a portion connected from the first support portion 117a to the first flow path portion 111 through the first stage portion 118a, and from the second support portion 117b to the fifth flow path portion 115 through the second stage portion 118b.
  • Each of the connected portions is embedded in the sealing resin 190.
  • the bus bar 110 is made of a material having a low electrical resistivity such as copper.
  • the bus bar 110 is formed by press molding.
  • the bus bar 110 may be formed by a method such as etching, sintering, forging, or cutting.
  • the first signal terminal 151, the second signal terminal 152, the third signal terminal 153, and the fourth signal terminal 154 are located apart from the bus bar 110.
  • the first signal terminal 151, the second signal terminal 152, the third signal terminal 153, and the fourth signal terminal 154 are arranged side by side in this order with an interval toward one side in the X-axis direction.
  • Each of the first signal terminal 151, the second signal terminal 152, the third signal terminal 153, and the fourth signal terminal 154 extends toward one side in the Y-axis direction.
  • the other end of each of the first signal terminal 151, the second signal terminal 152, the third signal terminal 153, and the fourth signal terminal 154 in the Y-axis direction is embedded in the sealing resin 190.
  • each of the first signal terminal 151, the second signal terminal 152, the third signal terminal 153, and the fourth signal terminal 154 other than the other end in the Y-axis direction is not covered with the sealing resin 190. It is exposed.
  • the first to fourth signal terminals 151 to 154 are insulated from the bus bar 110 by the sealing resin 190.
  • the Z-axis direction of the portion embedded in the sealing resin 190 at each of the first signal terminal 151, the second signal terminal 152, the third signal terminal 153, and the fourth signal terminal 154 is located on substantially the same plane. However, these do not necessarily have to be located on substantially the same plane.
  • the 1st to 4th signal terminals 151 to 154 are made of a material having a low electrical resistivity such as copper.
  • the first to fourth signal terminals 151 to 154 are formed by press molding.
  • the first to fourth signal terminals 151 to 154 may be formed by a method such as etching, sintering, forging, or cutting.
  • the insulating sheet 160 is provided on the bus bar 110 and supports the magnetic sensor chip 140.
  • the insulating sheet 160 has a rectangular parallelepiped shape and extends in the X-axis direction. The other end of the insulating sheet 160 in the X-axis direction is located on the first support 117a, and the one end of the insulating sheet 160 in the X-axis direction is located on the second support 117b.
  • the beam portion 161 When viewed from the Z-axis direction, the beam portion 161 is located between the first support portion 117a and the second support portion 117b in the insulating sheet 160.
  • the beam portion 161 of the insulating sheet 160 is separated from each of the second flow path portion 112 and the fourth flow path portion 114, which are the measured portions, in the Z-axis direction.
  • the first step portion 118a and the second step portion 118b separate the second flow path portion 112 and the fourth flow path portion 114 from each other and the beam portion 161 in the Z-axis direction. doing.
  • the insulating sheet 160 is made of a resin having electrical insulation.
  • the insulating sheet 160 is bonded to each other with each of the first support portion 117a and the second support portion 117b by a bonding agent.
  • the insulating sheet 160 is embedded in the sealing resin 190.
  • the bus bar 110 and the first to fourth signal terminals 151 to 154 are formed by pressing one sheet metal, they are formed from one member. There is. However, the bus bar 110 and the first to fourth signal terminals 151 to 154 may be formed of different members.
  • the magnetic sensor chip 140 includes a substrate 141.
  • the substrate 141 is made of silicon.
  • the material constituting the substrate 141 is not limited to silicon, and may be another semiconductor or an insulator.
  • the magnetic sensor chip 140 has at least one magnetic sensor having a magnetoresistive element and detecting the strength of the magnetic field generated by the current I flowing through the bus bar 110, and at least one of them. Includes multiple connection terminals that are electrically connected to one magnetic sensor.
  • the magnetic sensor chip 140 includes a first magnetic sensor 120 and a second magnetic sensor 130 as at least one magnetic sensor. I have. Each of the first magnetic sensor 120 and the second magnetic sensor 130 is provided on the substrate 141. In the first embodiment of the present invention, the number of magnetic sensors is not limited to two, and may be a plurality.
  • the magnetic sensitivity axis 120a of the first magnetic sensor 120 is along the X-axis direction.
  • the magnetic sensitivity axis 130a of the second magnetic sensor 130 is along the X-axis direction.
  • each of the first magnetic sensor 120 and the second magnetic sensor 130 has a bridge circuit including a reluctance resistance R1 and a fixed resistance R2.
  • the resistance value of the magnetosensitivity resistor R1 changes when a magnetic field along the X-axis direction is applied.
  • the resistance value of the fixed resistor R2 hardly changes even when a magnetic field along the X-axis direction is applied.
  • FIG. 4 is a plan view showing a configuration of a magnetic sensor included in the current sensor according to the first embodiment of the present invention.
  • each of the first magnetic sensor 120 and the second magnetic sensor 130 has a TMR (Tunnel Magneto Resistance) element as a magnetoresistive element.
  • the magnetoresistive resistor R1 comprises a magnetically sensitive element row 10 in which a plurality of TMR elements are connected in series.
  • the fixed resistor R2 constitutes a reference element row 20 in which a plurality of TMR elements are connected in series.
  • a shielding structure (not shown) is provided to cover the reference element row 20. Since the magnetic field is shielded by the shielding structure, the magnetic field is substantially not applied to the TMR element of the reference element row 20.
  • Each of the first magnetic sensor 120 and the second magnetic sensor 130 may have a GMR (Giant Magneto Resistance) element or an AMR (Anisotropic Magneto Resistance) element as the magnetoresistive element instead of the TMR element. ..
  • the insulating sheet 160 supports the magnetic sensor chip 140.
  • one surface of the insulating sheet 160 in the Z-axis direction and the other surface of the substrate 141 in the Z-axis direction are joined to each other by a die attach film or an adhesive (not shown). Therefore, the magnetic sensor chip 140 is supported by the insulating sheet 160.
  • the other surface of the substrate 141 in the Z-axis direction and the second flow path portion 112 and the fourth flow path portion 114 is separated from each other on one side in the Z-axis direction.
  • the surface of the substrate 141 on the other side in the Z-axis direction constitutes the surface of the magnetic sensor chip 140 on the other side in the Z-axis direction.
  • the at least one magnetic sensor is arranged at a position overlapping the measured portion of the bus bar 110 when viewed from the Z-axis direction.
  • the first magnetic sensor 120 is arranged at a position overlapping the second flow path portion 112 when viewed from the Z-axis direction
  • the second magnetic sensor 130 is the fourth flow path portion 114. It is placed at a position that overlaps with.
  • the magnetic field 112e generated around the second flow path portion 112 is generated in the first magnetic sensor 120 by the magnetic sensitivity shaft 120a.
  • the magnetic field 114e generated around the fourth flow path portion 114 acts on the second magnetic sensor 130 in the direction along the magnetic sensitivity axis 130a.
  • the magnetic sensor chip 140 is electrically connected to the first magnetic sensor 120 and the second magnetic sensor 130 by wiring 146, the first connection terminal 142, the second connection terminal 143, and the third connection. It includes a terminal 144 and a fourth connection terminal 145.
  • the first connection terminal 142 is a power supply terminal Vcc connected to a power supply, and is connected to each of the magnetic reluctance resistance R1 of the first magnetic sensor 120 and the fixed resistance R2 of the second magnetic sensor 130.
  • the fourth connection terminal 145 is a ground terminal GND having a ground potential, and is connected to each of the fixed resistance R2 of the first magnetic sensor 120 and the magnetic sensing resistance R1 of the second magnetic sensor 130.
  • the second connection terminal 143 is the output terminal V + of the first magnetic sensor 120, and is connected to the midpoint between the magnetosensitivity resistance R1 and the fixed resistance R2 of the first magnetic sensor 120.
  • the third connection terminal 144 is an output terminal V- of the second magnetic sensor 130, and is connected to a midpoint between the fixed resistance R2 and the magnetic reluctance resistance R1 of the second magnetic sensor 130.
  • the first signal terminal 151 and the first connection terminal 142 are electrically connected by the bonding wire 180
  • the second signal terminal 152 and the second connection terminal 143 are electrically connected by the bonding wire 180
  • the third signal terminal 153 and the third connection terminal 144 are electrically connected by the bonding wire 180
  • the fourth signal terminal 154 and the fourth connection terminal 145 are electrically connected by the bonding wire 180. ..
  • the magnetic sensor chip 140 and the bonding wire 180 are embedded in the sealing resin 190. Therefore, the magnetic sensor chip 140 and the bus bar 110 are insulated from each other by the sealing resin 190 and the insulating sheet 160.
  • the current I to be measured flows through the second flow path portion 112 toward one side in the Y-axis direction and through the fourth flow path portion 114 toward the other side in the Y-axis direction. Therefore, as shown in FIG. 2, the magnetic field 112e generated by the current I to be measured flowing through the second flow path portion 112 acts on the first magnetic sensor 120 toward one side in the X-axis direction. .. On the other hand, the magnetic field 114e generated by the current I to be measured flowing through the fourth flow path portion 114 acts on the second magnetic sensor 130 toward the other side in the X-axis direction.
  • the phase of the detected value of the first magnetic sensor 120 and the phase of the detected value of the second magnetic sensor 130 are opposite in phase with respect to the strength of the magnetic field generated by the current I of the measurement target flowing through the bus bar 110. Therefore, if the strength of the magnetic field detected by the first magnetic sensor 120 is a positive value, the strength of the magnetic field detected by the second magnetic sensor 130 is a negative value.
  • the current I of the measurement target flowing through the bus bar 110 is calculated while canceling the influence of the external magnetic field. Can be done.
  • the beam portion 161 of the insulating sheet 160 that supports the magnetic sensor chip 140 is the second flow path portion 112 and the fourth flow path portion 114 that are the measured portions. Since they are separated from each other and there is no interface connecting the first magnetic sensor 120 and the second magnetic sensor 130 and the bus bar 110, it is possible to suppress the occurrence of creepage current between the bus bar 110 and the magnetic sensor chip 140. The insulation resistance of the current sensor 100 can be improved.
  • the steps of the first step portion 118a and the second step portion 118b cause the second flow path portion 112 and the fourth flow path portion 114 in the Z-axis direction. Since each of the beam portions 161 is separated from each other, it is possible to suppress the occurrence of creepage discharge between the bus bar 110 and the magnetic sensor chip 140 without increasing the number of parts of the current sensor 100, and the current sensor 100 The insulation resistance can be improved.
  • the first magnetic sensor 120 overlaps with the second flow path portion 112 when viewed from the Z-axis direction in which the bus bar 110 and the insulating sheet 160 are arranged side by side.
  • the second magnetic sensor 130 is arranged at a position and is arranged at a position overlapping with the fourth flow path portion 114.
  • the magnetic field 112e generated around the second flow path portion 112 acts on the first magnetic sensor 120 in the direction along the magnetic sensitivity axis 120a, and the second magnetic sensor 130 has the fourth flow path portion.
  • the magnetic field 114e generated around 114 acts in the direction along the magnetic sensitivity axis 130a.
  • each of the first magnetic sensor 120 and the second magnetic sensor 130 can detect the current I to be measured flowing through the bus bar 110 with high sensitivity.
  • the first signal terminal 151 and the first connection terminal 142 are electrically connected by the bonding wire 180, and the second signal terminal 152 and the second connection terminal are connected.
  • the 143 is electrically connected by the bonding wire 180
  • the third signal terminal 153 and the third connection terminal 144 are electrically connected by the bonding wire 180
  • the fourth signal terminal 154 and the fourth connection terminal 145 are bonded. Since it is electrically connected by the wire 180, it is possible to suppress the transmission of stress from the first to fourth signal terminals 151 to 154 to each of the first magnetic sensor 120 and the second magnetic sensor 130. Therefore, it is possible to prevent the magnetic field detection characteristics of the first magnetic sensor 120 and the second magnetic sensor 130 from becoming unstable due to the stress transmitted from the first to fourth signal terminals 151 to 154.
  • the magnetic field detection characteristics of the first magnetic sensor 120 and the second magnetic sensor 130 are improved while improving the insulation resistance characteristics of the current sensor 100 by the above configuration. It can be maintained well and stably.
  • the measured portions of the bus bar 110 are located with a gap between them, and the current I to be measured flows in opposite directions to each other.
  • the first magnetic sensor 120 is arranged at a position overlapping the second flow path portion 112, which is one of the pair of facing portions, when viewed from the direction in which the bus bar 110 and the insulating sheet 160 are lined up.
  • the magnetic sensor 130 is arranged at a position overlapping the fourth flow path portion 114, which is the other of the pair of facing portions.
  • the phase of the detected value of the first magnetic sensor 120 and the phase of the detected value of the second magnetic sensor 130 are opposite to each other.
  • the current I to be measured flowing through the bus bar 110 can be accurately measured while canceling the influence of the external magnetic field. Can be detected.
  • the bus bar 110 and the first to fourth signal terminals 151 to 154 are formed of one member. Thereby, each of the bus bar 110 and the first to fourth signal terminals 151 to 154 can be easily formed by a method such as pressing one sheet metal while stabilizing the characteristics.
  • the current sensor according to the second embodiment of the present invention is different from the current sensor 100 according to the first embodiment of the present invention because the position of the step portion is mainly different from the current sensor 100 according to the first embodiment of the present invention. The description of a similar configuration will not be repeated.
  • FIG. 5 is a perspective view showing the configuration of the current sensor according to the second embodiment of the present invention.
  • FIG. 6 is a cross-sectional view of the current sensor of FIG. 5 as viewed from the direction of the arrow on the VI-VI line.
  • the sealing resin is seen through and shown.
  • the sealing resin is not shown.
  • the current sensor 200 includes a bus bar 210.
  • the bus bar 210 includes a pair of supports to which the insulating sheet 160 is fixed.
  • the pair of support portions is composed of a first support portion 217a and a second support portion 217b.
  • the bus bar 210 includes a first stage portion 218a and a second stage portion 218b.
  • Each of the first step portion 218a and the second step portion 218b extends in the Z-axis direction and has a step.
  • the first stage portion 218a is arranged between the first flow path portion 111 and the second flow path portion 112
  • the second stage portion 218b is the fourth flow path portion 114 and the fifth flow path portion 114. It is arranged between the unit 115 and the unit 115. Therefore, the second flow path portion 112, the third flow path portion 113, and the fourth flow path portion 114 are formed by the first step portion 118a and the second step portion 118b in the Z-axis direction.
  • first support portion 217a and the second support portion 217b are arranged at different positions in the Z-axis direction from the second flow path portion 112, the third flow path portion 113, and the fourth flow path portion 114.
  • first support portion 217a and the second support portion 217b are formed by the first step portion 218a and the second step portion 218b in the Z-axis direction with the second flow path portion 112 and the third flow path portion 113.
  • it is arranged at a position closer to the insulating sheet 160 than the fourth flow path portion 114.
  • the first support portion 217a is connected to the other side of the first flow path portion 111 in the X-axis direction and one side in the Y-axis direction.
  • the first support portion 217a is located on the other side in the X-axis direction with a gap from the second flow path portion 112, and is located on one side in the Z-axis direction from the second flow path portion 112. ..
  • the second support portion 217b is connected to one side of the fifth flow path portion 115 in the X-axis direction and one side in the Y-axis direction.
  • the second support portion 217b is located on one side in the X-axis direction with a gap from the fourth flow path portion 114, and is located on one side in the Z-axis direction from the fourth flow path portion 114. ..
  • the second flow path portion 112 and the fourth flow path portion 114 are located between the first support portion 217a and the second support portion 217b. That is, when viewed from the Z-axis direction in which the bus bar 210 and the insulating sheet 160 are aligned, the first support portion 217a and the second support portion 217b have the second flow path portion 112 and the fourth flow path portion 114 in between. It is arranged outside the second flow path portion 112 and the fourth flow path portion 114 so as to be sandwiched between them.
  • the one-sided surface of the first support portion 217a in the Z-axis direction and the one-sided surface of the second support portion 217b in the Z-axis direction are located on substantially the same plane.
  • each of the portion connected from the first support portion 217a to the first flow path portion 111 and the portion connected from the second support portion 217b to the fifth flow path portion 115 is a sealing resin. It is buried in 190.
  • the magnetic field detection characteristics of the first magnetic sensor 120 and the second magnetic sensor 130 are satisfactorily stabilized while improving the insulation resistance characteristics of the current sensor 200. Can be maintained.
  • FIG. 7 is a perspective view showing the configuration of the current sensor according to the third embodiment of the present invention.
  • FIG. 8 is a cross-sectional view of the current sensor of FIG. 7 as viewed from the direction of the arrow along line VIII-VIII.
  • the sealing resin is seen through and shown.
  • the sealing resin is not shown.
  • the current sensor 300 includes a bus bar 310.
  • the bus bar 310 includes a pair of supports to which the insulating sheet 160 is fixed.
  • the pair of support portions is composed of a first support portion 317a and a second support portion 317b.
  • the bus bar 310 includes a first stage portion 318a and a second stage portion 318b.
  • Each of the first step portion 318a and the second step portion 318b extends in the Z-axis direction and has a step.
  • the first support portion 317a and the second support portion 317b are the first flow path portion 111, the second flow path portion 112, the third flow path portion 113, the fourth flow path portion 114, and the fifth flow path portion 115 and Z. They are located at different positions in the axial direction.
  • the first support portion 317a and the second support portion 317b are formed by the first step portion 318a and the second step portion 318b in the Z-axis direction with the first flow path portion 111 and the second flow path portion 112.
  • the third flow path portion 113, the fourth flow path portion 114, and the fifth flow path portion 115 are arranged closer to the insulating sheet 160.
  • the first support portion 317a is connected to the other portion of the second flow path portion 112 in the X-axis direction via the first step portion 318a.
  • the first support portion 317a is located on the other side in the X-axis direction with respect to the second flow path portion 112, and is located on one side in the Z-axis direction with respect to the second flow path portion 112.
  • the second support portion 317b is connected to one side of the fourth flow path portion 114 in the X-axis direction via the second stage portion 318b.
  • the second support portion 317b is located on one side in the X-axis direction with respect to the fourth flow path portion 114, and is located on one side in the Z-axis direction with respect to the fourth flow path portion 114.
  • the second flow path portion 112 and the fourth flow path portion 114 are located between the first support portion 317a and the second support portion 317b. That is, when viewed from the Z-axis direction in which the bus bar 310 and the insulating sheet 160 are aligned, the first support portion 317a and the second support portion 317b have the second flow path portion 112 and the fourth flow path portion 114 in between. It is arranged outside the second flow path portion 112 and the fourth flow path portion 114 so as to be sandwiched between them.
  • the one-sided surface of the first support portion 317a in the Z-axis direction and the one-sided surface of the second support portion 317b in the Z-axis direction are located on substantially the same plane.
  • bus bar 310 a portion connected from the first support portion 317a to the second flow path portion 112 through the first step portion 318a, and from the second support portion 317b to the fourth flow path portion 114 through the second step portion 318b.
  • Each of the connected portions is embedded in the sealing resin 190.
  • the magnetic field detection characteristics of the first magnetic sensor 120 and the second magnetic sensor 130 are satisfactorily stabilized while improving the insulation resistance characteristics of the current sensor 300. Can be maintained.
  • FIG. 9 is a perspective view showing the configuration of the current sensor according to the fourth embodiment of the present invention.
  • FIG. 10 is a cross-sectional view of the current sensor of FIG. 9 as viewed from the direction of the XX line arrow.
  • the sealing resin is seen through and shown.
  • the sealing resin is not shown.
  • the current sensor 400 includes a bus bar 410.
  • the bus bar 410 includes a pair of supports to which the insulating sheet 160 is fixed.
  • the pair of support portions is composed of a first support portion 417a and a second support portion 417b.
  • the bus bar 410 includes a step portion 418.
  • the step portion 418 extends in the Z-axis direction and has a step. That is, the bus bar 410 has only one step portion 418.
  • the first support portion 417a and the second support portion 417b are the first flow path portion 111, the second flow path portion 112, the third flow path portion 113, the fourth flow path portion 114, and the fifth flow path portion 115 and Z. They are located at different positions in the axial direction.
  • the first support portion 417a and the second support portion 417b are formed by the step portion 418, in the Z-axis direction, the first flow path portion 111, the second flow path portion 112, and the third flow path portion 113. It is arranged at a position closer to the insulating sheet 160 than the fourth flow path portion 114 and the fifth flow path portion 115.
  • the first support portion 417a is connected to a portion of the third flow path portion 113 on one side in the Y-axis direction via a step portion 418.
  • the first support portion 417a is located on the other side in the X-axis direction with a gap from the second flow path portion 112, and is located on one side in the Z-axis direction from the second flow path portion 112. ..
  • the second support portion 417b is connected to a portion of the third flow path portion 113 on one side in the Y-axis direction via a step portion 418.
  • the second support portion 417b is located on one side in the X-axis direction with a gap from the fourth flow path portion 114, and is located on one side in the Z-axis direction from the fourth flow path portion 114. ..
  • the second flow path portion 112 and the fourth flow path portion 114 are located between the first support portion 417a and the second support portion 417b. That is, when viewed from the Z-axis direction in which the bus bar 410 and the insulating sheet 160 are aligned, the first support portion 417a and the second support portion 417b have the second flow path portion 112 and the fourth flow path portion 114 in between. It is arranged outside the second flow path portion 112 and the fourth flow path portion 114 so as to be sandwiched between them.
  • the one-sided surface of the first support portion 417a in the Z-axis direction and the one-sided surface of the second support portion 417b in the Z-axis direction are located on substantially the same plane.
  • bus bar 410 a portion connected from the first support portion 417a to the third flow path portion 113 through the step portion 418, and a portion connected from the second support portion 417b to the third flow path portion 113 through the step portion 418.
  • Each of the portions is embedded in the sealing resin 190.
  • the magnetic field detection characteristics of the first magnetic sensor 120 and the second magnetic sensor 130 are satisfactorily stabilized while improving the insulation resistance characteristics of the current sensor 400. Can be maintained.
  • the bus bar 410 since the bus bar 410 has only one step portion 418, one surface of the first support portion 417a in the Z-axis direction and the second support portion 417b. It is possible to easily position one surface in the Z-axis direction on substantially the same plane.
  • the current sensor according to the fifth embodiment of the present invention is different from the current sensor 200 according to the second embodiment of the present invention mainly in that the bus bar is not provided with a step portion and an insulating tape is provided. Therefore, the description of the configuration similar to that of the current sensor 200 according to the second embodiment of the present invention will not be repeated.
  • FIG. 11 is a perspective view showing the configuration of the current sensor according to the fifth embodiment of the present invention.
  • FIG. 12 is a cross-sectional view of the current sensor of FIG. 11 as viewed from the direction of the arrow along the XII-XII line.
  • the sealing resin is seen through and shown.
  • the sealing resin is not shown.
  • the current sensor 500 includes a bus bar 510 and an insulating tape.
  • the bus bar 510 includes a pair of supports to which the insulating sheet 160 is fixed.
  • the pair of support portions is composed of a first support portion 217a and a second support portion 217b.
  • the four flow path portions 114 are located on substantially the same plane as the one side surface in the Z-axis direction.
  • a first insulating tape 570a is provided between the first support portion 217a and the insulating sheet 160.
  • the first support portion 217a and the insulating sheet 160 are joined to each other by the first insulating tape 570a.
  • a second insulating tape 570b is provided between the second support portion 217b and the insulating sheet 160.
  • the second support portion 217b and the insulating sheet 160 are joined to each other by the second insulating tape 570b.
  • each of the second flow path portion 112 and the fourth flow path portion 114 and the beam portion 161 in the Z-axis direction are separated from each other.
  • the surface of the first support portion 217a on one side in the Z-axis direction and the surface of the second support portion 217b on one side in the Z-axis direction can be easily positioned on substantially the same plane.
  • the magnetic field detection characteristics of the first magnetic sensor 120 and the second magnetic sensor 130 are satisfactorily stabilized while improving the insulation resistance characteristics of the current sensor 500. Can be maintained.
  • the current sensor according to the sixth embodiment of the present invention is related to the fifth embodiment of the present invention because the shape of the bus bar and the configuration of the magnetic sensor are mainly different from the current sensor 500 according to the fifth embodiment of the present invention. The description of the configuration similar to that of the current sensor 500 will not be repeated.
  • FIG. 13 is a perspective view showing the configuration of the current sensor according to the sixth embodiment of the present invention.
  • FIG. 14 is a cross-sectional view of the current sensor of FIG. 13 as viewed from the direction of the XIV-XIV line arrow.
  • FIG. 15 is a plan view of the current sensor of FIG. 14 as viewed from the direction of arrow XV.
  • the sealing resin is seen through and shown.
  • the sealing resin is not shown.
  • the current sensor 600 includes a bus bar 610.
  • the bus bar 610 includes a first flow path portion 111, a third flow path portion 613, and a fifth flow path portion 115.
  • the first flow path portion 111 extends toward one side in the X-axis direction.
  • the third flow path portion 613 extends from a portion of the first flow path portion 111 on one side in the X-axis direction on one side in the Y-axis direction toward one side in the X-axis direction.
  • the fifth flow path portion 115 extends from the portion of the third flow path portion 613 on one side in the X-axis direction on the other side in the Y-axis direction toward one side in the X-axis direction.
  • the first flow path portion 111, the third flow path portion 613, and the fifth flow path portion 115 are embedded in the sealing resin 190.
  • the first support portion 217a is located on the other side in the X-axis direction with a gap with respect to the third flow path portion 613.
  • the second support portion 217b is located on one side in the X-axis direction with a gap with respect to the third flow path portion 613.
  • the third flow path portion 613 is located between the first support portion 217a and the second support portion 217b. That is, when viewed from the Z-axis direction in which the bus bar 610 and the insulating sheet 160 are aligned, the first support portion 217a and the second support portion 217b sandwich the third flow path portion 613 and the third flow path. It is arranged outside the portion 613.
  • the one-sided surface of the first support portion 217a in the Z-axis direction, the one-sided surface of the second support portion 217b in the Z-axis direction, and the one-sided surface of the third flow path portion 613 in the Z-axis direction are It is located on almost the same plane.
  • the magnetic sensor chip 140 includes a first magnetic sensor 620 as at least one magnetic sensor.
  • the first magnetic sensor 620 is provided on the substrate 141.
  • the number of magnetic sensors is not limited to one, and may be a plurality.
  • the magnetic sensitivity axis 620a of the first magnetic sensor 620 is along the Y-axis direction.
  • the first magnetic sensor 620 has a Wheatstone bridge circuit including a magnetically sensitive resistor R1, a fixed resistor R2, a fixed resistor R3, and a magnetically sensitive resistor R4.
  • the resistance values of the reluctance resistance R1 and the reluctance resistance R4 change when a magnetic field along the X-axis direction is applied, and the magnetic field along the X-axis direction is applied to each of the fixed resistance R2 and the fixed resistance R3. However, the resistance value hardly changes.
  • the reluctance resistor R4 outputs a signal having a phase opposite to that of the reluctance resistor R1.
  • the fixed resistor R3 has the same configuration as the fixed resistor R2.
  • the first magnetic sensor 620 is arranged at a position overlapping the third flow path portion 613 when viewed from the Z-axis direction in which the bus bar 610 and the insulating sheet 160 are arranged side by side.
  • the first magnetic sensor 620 has a magnetic field 613e generated around the third flow path portion 613, and the magnetic sensitivity shaft 620a Acts in the direction along.
  • the first magnetic sensor 620 is located at a position overlapping the third flow path portion 613 when viewed from the Z-axis direction in which the bus bar 610 and the insulating sheet 160 are aligned. Have been placed. As a result, the magnetic field 613e generated around the third flow path portion 613 acts on the first magnetic sensor 620 in the direction along the magnetic sensitivity axis 620a. As a result, the first magnetic sensor 620 can detect the current I to be measured flowing through the bus bar 610 with high sensitivity.
  • the magnetic field detection characteristic of the first magnetic sensor 620 can be maintained satisfactorily and stably while improving the insulation resistance characteristic of the current sensor 600.
  • the current sensor according to each of the above embodiments may be an open-loop current sensor or a closed-loop current sensor.

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  • Physics & Mathematics (AREA)
  • General Physics & Mathematics (AREA)
  • Measuring Instrument Details And Bridges, And Automatic Balancing Devices (AREA)

Abstract

La présente invention concerne une feuille isolante (160) placée au-dessus d'une barre omnibus (110) et supportant une puce de capteur magnétique (140). La barre omnibus (110) comprend une paire de parties de support (117a, 117b) sur laquelle la feuille isolante (160) est fixée et une partie mesurée qui est positionnée entre les parties de support (117a, 117b) et à travers laquelle circule un courant électrique (I) à mesurer. La feuille isolante (160) comprend une partie poutre (161) positionnée entre la paire de parties de support (117a, 117b) telle qu'observée depuis la direction dans laquelle la barre omnibus (110) et la feuille isolante (160) sont alignées. La partie poutre (161) et la partie mesurée sont espacées l'une de l'autre dans la direction dans laquelle la barre omnibus (110) et la feuille isolante (160) sont alignées. Un ou plusieurs capteurs magnétiques sont disposés dans une position chevauchant la partie mesurée telle qu'observée depuis la direction dans laquelle la barre omnibus (110) et la feuille isolante (160) sont alignées.
PCT/JP2021/008978 2020-04-30 2021-03-08 Capteur de courant électrique Ceased WO2021220620A1 (fr)

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JP2020-080055 2020-04-30
JP2020080055 2020-04-30

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* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US20220229094A1 (en) * 2019-10-08 2022-07-21 Alps Alpine Co., Ltd. Magnetic sensor and current detecting apparatus including the same
JP2024546171A (ja) * 2021-12-21 2024-12-17 江▲蘇▼多▲維▼科技有限公司 電流センサ

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JP2008545964A (ja) * 2005-05-27 2008-12-18 アレグロ・マイクロシステムズ・インコーポレーテッド 電流センサ
JP2011080973A (ja) * 2009-10-09 2011-04-21 Kohshin Electric Corp コアレス電流センサ
JP2011185648A (ja) * 2010-03-05 2011-09-22 Keihin Corp 電流センサ
JP2014041049A (ja) * 2012-08-22 2014-03-06 Alps Green Devices Co Ltd 電流センサ
WO2014050068A1 (fr) * 2012-09-28 2014-04-03 アルプス・グリーンデバイス株式会社 Capteur de courant
JP2017049264A (ja) * 2011-07-22 2017-03-09 アレグロ・マイクロシステムズ・エルエルシー 磁界変換器を有する電流センサの強化絶縁
US20190386206A1 (en) * 2018-06-15 2019-12-19 Infineon Technologies Ag Current sensor package with continuous insulation

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Publication number Priority date Publication date Assignee Title
JP2008545964A (ja) * 2005-05-27 2008-12-18 アレグロ・マイクロシステムズ・インコーポレーテッド 電流センサ
JP2011080973A (ja) * 2009-10-09 2011-04-21 Kohshin Electric Corp コアレス電流センサ
JP2011185648A (ja) * 2010-03-05 2011-09-22 Keihin Corp 電流センサ
JP2017049264A (ja) * 2011-07-22 2017-03-09 アレグロ・マイクロシステムズ・エルエルシー 磁界変換器を有する電流センサの強化絶縁
JP2014041049A (ja) * 2012-08-22 2014-03-06 Alps Green Devices Co Ltd 電流センサ
WO2014050068A1 (fr) * 2012-09-28 2014-04-03 アルプス・グリーンデバイス株式会社 Capteur de courant
US20190386206A1 (en) * 2018-06-15 2019-12-19 Infineon Technologies Ag Current sensor package with continuous insulation

Cited By (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US20220229094A1 (en) * 2019-10-08 2022-07-21 Alps Alpine Co., Ltd. Magnetic sensor and current detecting apparatus including the same
US12044709B2 (en) * 2019-10-08 2024-07-23 Alps Alpine Co., Ltd. Magnetic sensor and current detecting apparatus including the same
JP2024546171A (ja) * 2021-12-21 2024-12-17 江▲蘇▼多▲維▼科技有限公司 電流センサ

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