[go: up one dir, main page]

WO2021215382A1 - Film de résine organique - Google Patents

Film de résine organique Download PDF

Info

Publication number
WO2021215382A1
WO2021215382A1 PCT/JP2021/015809 JP2021015809W WO2021215382A1 WO 2021215382 A1 WO2021215382 A1 WO 2021215382A1 JP 2021015809 W JP2021015809 W JP 2021015809W WO 2021215382 A1 WO2021215382 A1 WO 2021215382A1
Authority
WO
WIPO (PCT)
Prior art keywords
solvent
organic resin
resin film
sample
film according
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Ceased
Application number
PCT/JP2021/015809
Other languages
English (en)
Japanese (ja)
Inventor
梶田　智
長澤　忠
智恵 主税
智士 芦浦
晃次 藤川
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Kyocera Corp
Original Assignee
Kyocera Corp
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Kyocera Corp filed Critical Kyocera Corp
Priority to JP2022517028A priority Critical patent/JPWO2021215382A1/ja
Publication of WO2021215382A1 publication Critical patent/WO2021215382A1/fr
Anticipated expiration legal-status Critical
Ceased legal-status Critical Current

Links

Classifications

    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08F—MACROMOLECULAR COMPOUNDS OBTAINED BY REACTIONS ONLY INVOLVING CARBON-TO-CARBON UNSATURATED BONDS
    • C08F32/00—Homopolymers and copolymers of cyclic compounds having no unsaturated aliphatic radicals in a side chain, and having one or more carbon-to-carbon double bonds in a carbocyclic ring system
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08J—WORKING-UP; GENERAL PROCESSES OF COMPOUNDING; AFTER-TREATMENT NOT COVERED BY SUBCLASSES C08B, C08C, C08F, C08G or C08H
    • C08J5/00—Manufacture of articles or shaped materials containing macromolecular substances
    • C08J5/18—Manufacture of films or sheets
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K1/00—Printed circuits
    • H05K1/02—Details
    • H05K1/03—Use of materials for the substrate
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/46—Manufacturing multilayer circuits

Definitions

  • This disclosure relates to an organic resin film.
  • Patent Document 1 When a resin film formed of a conventional cyclic olefin copolymer as described in Patent Document 1 is used, for example, as an insulating layer of a wiring board, it tends to change to a state in which it is difficult to laminate and crimp in the manufacturing process of the wiring board. There is a problem.
  • the organic resin film according to the present disclosure contains a resin containing a cyclic olefin copolymer as a main component, a first solvent, and a second solvent having a boiling point lower than that of the first solvent.
  • the first solvent is at least one solvent selected from the group consisting of toluene, xylene, naphtha, octane, decalin, glycol ethers, decane and tridecane.
  • the second solvent is at least one solvent selected from the group consisting of cyclohexane, benzene, hexane, chloroform and dichloroethane.
  • the organic resin film according to the present disclosure contains a resin containing a cyclic olefin copolymer as a main component, a first solvent, and a second solvent having a boiling point lower than that of the first solvent. Therefore, the organic resin film according to the present disclosure has an effect of being easily laminated and pressure-bonded in the manufacturing process of the wiring board.
  • the cyclic olefin copolymer contained in the organic resin film according to the embodiment of the present disclosure is a polyolefin-based copolymer having a cyclic structure.
  • the cyclic olefin copolymer is obtained by polymerizing the cyclic olefin with another monomer copolymerizable with the cyclic olefin.
  • the ratio of the cyclic olefin to other monomers is not particularly limited. For example, other monomers are used in a ratio of 1 part by mass or more and 100 parts by mass or less with respect to 100 parts by mass of the cyclic olefin.
  • the cyclic olefin copolymer preferably contains a crosslinkable functional group in the molecule.
  • a crosslinkable functional group it is preferable that the crosslinking reaction proceeds with a peroxide having a benzene ring.
  • Peroxides having a benzene ring include di-t-butyl peroxide (perbutyl D), di- (t-butylperoxy) diisopyrbenzene (perbutyl P, t-butylcumyl peroxide (perbutyl C)) and dik. Examples thereof include mil peroxide (park mill D).
  • Examples of the cyclic olefin include a norbornene-based monomer, a cyclic diene-based monomer, and a vinyl alicyclic hydrocarbon-based monomer.
  • examples of the cyclic olefin include norbornene, vinylnorbornene, phenylnorbornene, dicyclopentadiene, tetracyclododecene, cyclopropene, cyclobutene, cyclopentene, cyclohexene, cyclohexadiene, cyclooctadiene and the like. These cyclic olefins may be used alone or in combination of two or more.
  • Examples of other monomers copolymerizable with the cyclic olefin include chain olefins, acrylate acrylates, acrylates, methacrylic acids, aromatic vinyl compounds, unsaturated nitriles, and aliphatic conjugated dienes.
  • such monomers include ethylene, propylene, butene, acrylic acid, methacrylic acid, fumaric acid, maleic anhydride, maleic acid, maleic anhydride, methyl acrylate, ethyl acrylate, and propyl acrylate.
  • Isopropyl acrylate, methyl methacrylate, ethyl methacrylate, propyl methacrylate, isopropyl methacrylate, styrene, vinyltoluene, acrylonitrile, methacrylonitrile, 1,3-butadiene, 2-methyl-1,3-butadiene, 2,3 -Dimethyl-1,3-butadiene and the like can be mentioned.
  • These other monomers may be used alone or in combination of two or more.
  • the "resin containing a cyclic olefin copolymer as a main component” means a resin containing 50% by mass or more of the above-mentioned cyclic olefin copolymer, excluding the additives described later. That is, the "resin containing the cyclic olefin copolymer as a main component” may be a resin composed only of the cyclic olefin copolymer (100% by mass of the cyclic olefin copolymer), and the cyclic olefin copolymer and the resin other than the cyclic olefin copolymer may be used. It may be a resin containing.
  • resins other than the cyclic olefin copolymer include acrylic resin, epoxy resin, phenol resin, melamine resin, urea resin, polyamide, and polyimide. These resins may be used alone or in combination of two or more, for example, in consideration of compatibility with the cyclic olefin copolymer.
  • the first solvent contained in the organic resin film is at least one solvent selected from the group consisting of toluene, xylene, octane, decahydronaphthalene, glycol ether (ethylene glycol dimethyl ether), decane, and tridecane.
  • the first solvent is a solvent having a relatively high boiling point. Among these first solvents, toluene or xylene is preferably used.
  • the second solvent contained in the organic resin film according to the first embodiment is a solvent having a boiling point lower than that of the first solvent.
  • the second solvent is at least one solvent selected from the group consisting of cyclohexane, benzene, hexane, chloroform, and dichloroethane. Among these second solvents, cyclohexane is preferably used.
  • the organic resin film contains the first solvent and the second solvent, the suppleness of the organic resin film is increased, and the organic resin films are easily adhered to each other.
  • the contents of the first solvent and the second solvent for example, the content of the second solvent may be larger than the content of the first solvent.
  • the content of the second solvent is preferably 3.4 times or more and 7.2 times or less, particularly 4.1 times or more and 7.2 times or less the content of the first solvent.
  • the solvent of the obtained organic resin film tends to volatilize in the process of evacuation during laminating and pressure bonding. The organic resin film thus obtained is less likely to cause delamination and blistering.
  • cyclohexane easily dissolves the cyclic olefin copolymer.
  • Cyclohexane has a hydrophilic lipophilic balance (HLB) of about 15. Cyclohexane tends to generate static electricity. Therefore, a solvent having a lower HLB value than cyclohexane is mixed. The generation of static electricity can be suppressed by mixing a solvent having a HLB value lower than that of cyclohexane.
  • examples of such a solvent include the above-mentioned first solvent (toluene).
  • the HLB value of toluene is 11.3.
  • the content of the first solvent and the second solvent contained in the organic resin film is such that the total amount of the first solvent and the second solvent is 0.2% by mass or more and 1.1% by mass or less. good. When these are expressed in units of ppm as a mass ratio, they are 2000 ppm or more and 11000 ppm or less. When the total amount of the first solvent and the second solvent contained in the organic resin film is 0.2% by mass or more and 1.1% by mass or less, an organic resin film that is difficult to peel off is obtained in the laminated pressure bonding test and the solder heat resistance test. be able to. The contents of the first solvent and the second solvent contained in the organic resin film are measured by performing gas chromatography analysis on a sample piece cut out from the produced organic resin film.
  • the content of the second solvent is the content of the first solvent in the organic resin film according to the first embodiment from the viewpoint that peeling can be suppressed in the laminated pressure bonding test and the solder heat resistance test on the laminate obtained after the pressure heat treatment. Better than more.
  • the organic resin film according to one embodiment may contain additives such as an antioxidant, an ultraviolet absorber, a colorant, a stress relaxant, an inorganic filler, and a flame retardant.
  • the content of the additive is not limited as long as it does not interfere with the effect of the organic resin film of the present disclosure.
  • the organic resin film according to one embodiment may contain, for example, an additive in a proportion of 1% by mass or more and 50% by mass or less.
  • examples of the inorganic filler include silica, talc, mica, clay, calcium carbonate, titanium oxide, barium titanate, carbon black, glass beads, and glass hollow spheres.
  • examples of silica include crushed silica and molten silica. Only one kind of inorganic filler may be used, or two or more kinds may be used in combination.
  • the average particle size of the inorganic filler is not particularly limited, and may be, for example, 0.01 ⁇ m or more and 10 ⁇ m or less, and 0.5 ⁇ m or more and 3 ⁇ m or less.
  • the content of the inorganic filler may be 5 parts by mass or more and 40 parts by mass or less with respect to 100 parts by mass of the cyclic olefin copolymer.
  • flame-retardant agents include melamine phosphate, melam polyphosphate, melem polyphosphate, melamine pyrophosphate, ammonium polyphosphate, red phosphorus, aromatic phosphate ester, phosphonic acid ester, phosphinic acid ester, phosphine oxide, phosphazene, and melamine.
  • flame retardants include cyanolate, ethylene bispentabromobenzene, and ethylene bistetrabromophthalimide. These flame retardants may be used alone or in combination of two or more.
  • a bromine-based flame retardant (ethylenebispentabromobenzene, ethylenebistetrabromophthalimide, etc.) is used because the dielectric loss tangent of the laminated cured sheet obtained by curing the laminated uncured sheet can be lowered. May be good.
  • the average particle size of the flame retardant is not particularly limited, and may be, for example, 0.01 ⁇ m or more and 10 ⁇ m or less, and 0.5 ⁇ m or more and 3 ⁇ m or less.
  • the content of the flame retardant may be 15 parts by mass or more and 45 parts by mass or less with respect to 100 parts by mass of the cyclic olefin copolymer.
  • the method for producing the organic resin film of the present disclosure is not particularly limited.
  • a resin containing a cyclic olefin copolymer as a main component is dissolved or dispersed in a mixed solvent containing a first solvent and a second solvent, and if necessary, an additive is added to obtain a resin varnish.
  • an additive a necessary additive may be selected and used from the above-mentioned plurality of types.
  • a film-shaped molded product is produced from the obtained resin varnish.
  • the resin varnish is formed into a film by a bar coater method, a doctor blade method, a die coater method, an extrusion method, an injection molding method, etc., and then dried at about 120 to 150 ° C. for about 1 to 10 minutes.
  • a film-shaped molded product is obtained.
  • This film-shaped molded product is subjected to pressure heat treatment to obtain an organic resin film in which the first solvent and the second solvent remain.
  • the conditions for the pressure heat treatment are, for example, a temperature of about 160 to 230 ° C. and a pressure of about 1 to 10 MPa.
  • the organic resin film thus obtained has a thickness of, for example, about 0.01 to 1 mm.
  • the metal-clad laminate of the present disclosure includes a metal foil on at least one surface of the organic resin film of the present disclosure.
  • the metal-clad laminate of the present disclosure is obtained, for example, by superimposing the above-mentioned organic resin film and a metal foil and heating (curing) pressure molding.
  • the metal foil is not particularly limited, and examples thereof include a copper foil such as an electrolytic copper foil and a rolled copper foil, an aluminum foil, and a composite foil obtained by superimposing these metal foils. Among these metal foils, for example, copper foil is used.
  • the thickness of the metal foil is not particularly limited, and is, for example, about 5 to 105 ⁇ m.
  • the metal-clad laminate of the present disclosure can also be obtained by laminating a desired number of the above-mentioned organic resin films and metal foils and heat-pressing molding.
  • the metal-clad laminate of the present disclosure is used for, for example, a printed wiring board.
  • the wiring board of the present disclosure includes a plurality of insulating layers and a conductor layer arranged between the insulating layers, and the insulating layer is formed of the organic resin film of the present disclosure.
  • Heat-resistant cyclic olefin copolymer (heat-resistant COC (including radically polymerizable functional group), manufactured by Mitsui Chemicals Co., Ltd.) 100 parts by mass, 30 parts by mass of SAYTEX8010 as a flame retardant, peroxide having a benzene ring in the molecule
  • As a substance 1.8 parts by mass of dit-butyl peroxide (Perbutyl D, manufactured by Nichiyu Co., Ltd.) and 20 parts by mass of silica were added. 40% by mass of the obtained mixture and 60% by mass of the solvent were mixed to obtain a resin varnish.
  • Toluene (boiling point 110 ° C.) was used as the first solvent.
  • Cyclohexane (boiling point 81 ° C.) was used as the second solvent.
  • Sample No. Reference numeral 1 denotes a sample prepared from an organic resin film obtained using only a second solvent (cyclohexane).
  • Sample No. Reference numeral 2 denotes a sample prepared from an organic resin film obtained by using only the first solvent (toluene).
  • Sample No. 3 to 8 are samples prepared from an organic resin film obtained by using a mixed solvent.
  • Example No. 1 The residual amount of cyclohexane (second solvent) in the organic resin film of No. 1 is shown in Table 1.
  • Example Nos. 2 to 8 The drying temperature and the drying time were variously changed to obtain organic resin films having a thickness of 15 ⁇ m in which the residual amount of the solvent was different (Sample Nos. 2 to 8).
  • Sample No. Table 1 shows the residual amounts of toluene (first solvent) and cyclohexane (second solvent) in the organic resin films 2 to 8.
  • Sample No. The drying conditions of 2 to 8 are as follows. The conditions are, in order, the maximum temperature and the holding time. Sample No. 2 is 140 ° C. and 4 minutes, sample No. 3 is 140 ° C. and 1 minute, sample No. 4 is 140 ° C. and 0.5 minutes, sample No. 5 is 130 ° C. and 2 minutes, sample No. 6 is 130 ° C. and 1 minute, sample No. 7 is 120 ° C. and 10 minutes, sample No. 8 is 110 ° C. and 10 minutes.
  • the contents of the first solvent and the second solvent contained in the produced organic resin film were measured by gas chromatography analysis.
  • the sample used for the gas chromatography analysis a sample piece cut out from the prepared organic resin film was used.
  • the laminated crimping test was carried out according to the following procedure. First, the obtained organic resin film was cut into a size of 500 mm ⁇ 500 mm. Next, 20 sheets of the cut organic resin film were laminated using a vacuum laminating hot press machine (manufactured by Meiki Seisakusho Co., Ltd.). The pressure at the time of stacking was 1 MPa, the temperature was 110 ° C. (maximum temperature), and the holding time at the maximum temperature was 1 minute. If there was even one peeled portion after laminating, it was evaluated as NG, and if there was no peeled portion, it was evaluated as OK. The results are shown in Table 1.
  • solder heat resistance test A solder heat resistance test A
  • the obtained organic resin film was cut into a size of 300 mm ⁇ 300 mm.
  • four obtained organic resin films were laminated to prepare a laminate.
  • copper foils were placed on both sides of the laminate and subjected to pressure heat treatment using a laminate press to prepare a copper-clad laminate.
  • the conditions for the pressure heat treatment were the maximum temperature: 180 ° C., the holding time at the maximum temperature: 2 hours, and the pressure: 3 MPa.
  • solder heat resistance test A solder heat resistance test A and solder heat resistance test B in Table 1
  • solder heat resistance test B solder heat resistance test B
  • the conditions of the solder heat resistance test A are that the maximum temperature is 288 ° C. and the holding time is 10 seconds.
  • the conditions of the solder heat resistance test B were the same as the maximum temperature and the holding time was 60 seconds.
  • Solder heat resistance tests A and B were carried out by a method in which the sample was floated in a solder bath. After the test, if there was even one peeled part, it was evaluated as NG, and if there was no peeled part, it was evaluated as OK. The results are shown in Table 1.
  • the amount of solvent contained in the organic resin film is expressed in ppm.
  • the samples prepared using the mixed solvent all contained the first solvent and the second solvent. Its content was 2735 ppm or more and 57600 ppm or less.
  • the sample No. prepared using the mixed solvent In 3 to 8, the content of the second solvent was higher than the content of the first solvent.
  • sample No. In Nos. 1 and 2 peeled portions were observed in the laminated crimping test. Further, in the solder heat resistance test (solder heat resistance test A and solder heat resistance test B), a peeled portion was observed in the sample after the test. Sample No. Sample Nos. 3 to 8 are No. Compared with 1 and 2, the adhesion between the organic resin films was excellent.
  • sample No. 9 shows the residual amounts of xylene (first solvent) and cyclohexane (second solvent) in the organic resin films 9 to 12.
  • Sample No. The drying conditions of 9 to 12 are as follows. The conditions are, in order, the maximum temperature and the holding time. Sample No. 9 is 140 ° C. and 1 minute, sample No. 10 is 140 ° C. and 0.5 minutes, sample No. No. 11 was sample No. 11 at 130 ° C. and 1 minute. 12 is 120 ° C. and 10 minutes.
  • solder heat resistance test A and solder heat resistance test B were performed in the same procedure as in 3 to 8. The results are shown in Table 2.
  • the amount of solvent contained in the organic resin film is expressed in ppm.
  • the samples prepared using the mixed solvent all contained the first solvent and the second solvent. Its content was 450 ppm or more and 39830 ppm or less.
  • the sample No. prepared using the mixed solvent In 9 to 12, the content of the second solvent was higher than the content of the first solvent.
  • sample Nos. 9 to 12 As shown in Table 2, in the samples (Sample Nos. 9 to 12) prepared using the organic resin film according to the present disclosure, no peeled portion was observed in the laminated pressure bonding test. Sample No. In Nos. 9 to 12, no peeled portion was observed under the conditions of the solder heat resistance test A and the conditions of the solder heat resistance test B, and no slight blister was observed on the copper foil on the surface. Furthermore, the sample No. 9 to 12 are the above-mentioned sample Nos. Compared with 1 and 2, the adhesion between the organic resin films was excellent.

Landscapes

  • Engineering & Computer Science (AREA)
  • Chemical & Material Sciences (AREA)
  • Manufacturing & Machinery (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Health & Medical Sciences (AREA)
  • Chemical Kinetics & Catalysis (AREA)
  • Medicinal Chemistry (AREA)
  • Polymers & Plastics (AREA)
  • Organic Chemistry (AREA)
  • Materials Engineering (AREA)
  • Manufacture Of Macromolecular Shaped Articles (AREA)
  • Laminated Bodies (AREA)

Abstract

La présente invention concerne un film de résine organique qui contient une résine qui est principalement composée d'un copolymère d'oléfine cyclique, d'un premier solvant et d'un second solvant qui a un point d'ébullition inférieur à celui du premier solvant. Le premier solvant est composé d'au moins un solvant qui est choisi dans le groupe constitué par le toluène, le xylène, le naphta, l'octane, la décaline, les éthers de glycols, le décane et le tridécane. Le second solvant est composé d'au moins un solvant qui est choisi dans le groupe constitué par le cyclohexane, le benzène, l'hexane, le chloroforme et le dichloroéthane.
PCT/JP2021/015809 2020-04-23 2021-04-19 Film de résine organique Ceased WO2021215382A1 (fr)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP2022517028A JPWO2021215382A1 (fr) 2020-04-23 2021-04-19

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
JP2020076815 2020-04-23
JP2020-076815 2020-04-23

Publications (1)

Publication Number Publication Date
WO2021215382A1 true WO2021215382A1 (fr) 2021-10-28

Family

ID=78269246

Family Applications (1)

Application Number Title Priority Date Filing Date
PCT/JP2021/015809 Ceased WO2021215382A1 (fr) 2020-04-23 2021-04-19 Film de résine organique

Country Status (2)

Country Link
JP (1) JPWO2021215382A1 (fr)
WO (1) WO2021215382A1 (fr)

Citations (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2015140364A (ja) * 2014-01-27 2015-08-03 京セラ株式会社 誘電体樹脂および誘電体フィルム、ならびにフィルムコンデンサ
WO2015133473A1 (fr) * 2014-03-03 2015-09-11 京セラ株式会社 Condensateur au film, condensateur connecté, onduleur et véhicule électrique
JP2019147930A (ja) * 2018-02-28 2019-09-05 三井化学株式会社 環状オレフィン系重合体組成物およびその架橋体
JP2020004852A (ja) * 2018-06-28 2020-01-09 京セラ株式会社 積層未硬化シート

Patent Citations (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2015140364A (ja) * 2014-01-27 2015-08-03 京セラ株式会社 誘電体樹脂および誘電体フィルム、ならびにフィルムコンデンサ
WO2015133473A1 (fr) * 2014-03-03 2015-09-11 京セラ株式会社 Condensateur au film, condensateur connecté, onduleur et véhicule électrique
JP2019147930A (ja) * 2018-02-28 2019-09-05 三井化学株式会社 環状オレフィン系重合体組成物およびその架橋体
JP2020004852A (ja) * 2018-06-28 2020-01-09 京セラ株式会社 積層未硬化シート

Also Published As

Publication number Publication date
JPWO2021215382A1 (fr) 2021-10-28

Similar Documents

Publication Publication Date Title
TW521548B (en) Curable composition, molded article, multi-layer wiring substrate, particle and its manufacturing process, varnish and its manufacturing process, laminate, and flame retardant slurry
KR101677461B1 (ko) 에폭시 수지 조성물
TWI617619B (zh) 樹脂組成物、預浸物、覆金屬積層板及配線基板
CN111819227B (zh) 预浸渍体和电路基板用层叠板
JP6811240B2 (ja) 有機絶縁体、金属張積層板および配線基板
JPWO2016147984A1 (ja) 樹脂組成物、プリプレグ、金属張積層板および配線基板
KR20210148114A (ko) 수지 조성물 및 그 용도
WO2018179682A1 (fr) Feuille de cuivre sur laquelle est collé un agent adhésif, plaque stratifiée revêtue de cuivre et substrat de câblage
JP2017082200A (ja) 樹脂組成物、プリプレグ、金属張積層板、および配線基板
KR102429883B1 (ko) 층간 절연 필름 및 그 제조 방법
WO2019004223A1 (fr) Isolant organique, stratifié plaqué de métal et tableau de connexions
JP2020100759A (ja) 樹脂組成物、プリプレグ、金属張積層板および配線基板
CN118048008A (zh) 堆积膜可固化组合物
JP7550176B2 (ja) 樹脂組成物、プリプレグ、金属張積層板および配線基板
WO2021215382A1 (fr) Film de résine organique
US11426970B2 (en) Laminated uncured sheet
JP7181231B2 (ja) 有機絶縁体、金属張積層板および配線基板
US11661495B2 (en) Organic board, metal-clad laminate, and wiring board
US20250171628A1 (en) Resin composition, prepreg, film with resin, metal foil with resin, metal-clad laminate, and wiring board
CN120344612A (zh) 树脂组合物、预浸料、带树脂的膜、带树脂的金属箔、覆金属箔层压板、以及布线板
JP2016104868A (ja) 接着フィルム、該接着フィルムを用いた多層プリント配線板、及び該多層プリント配線板の製造方法
JP2004059896A (ja) プリプレグ及びこのプリプレグを用いたプリント配線板の製造方法
JPH10147687A (ja) 絶縁材料用樹脂組成物およびこれを用いた多層プリント配線板の製造方法

Legal Events

Date Code Title Description
121 Ep: the epo has been informed by wipo that ep was designated in this application

Ref document number: 21791753

Country of ref document: EP

Kind code of ref document: A1

ENP Entry into the national phase

Ref document number: 2022517028

Country of ref document: JP

Kind code of ref document: A

NENP Non-entry into the national phase

Ref country code: DE

122 Ep: pct application non-entry in european phase

Ref document number: 21791753

Country of ref document: EP

Kind code of ref document: A1