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WO2021206030A1 - Procédé de fabrication, programme, système de fabrication, collecteur de courant et batterie - Google Patents

Procédé de fabrication, programme, système de fabrication, collecteur de courant et batterie Download PDF

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Publication number
WO2021206030A1
WO2021206030A1 PCT/JP2021/014414 JP2021014414W WO2021206030A1 WO 2021206030 A1 WO2021206030 A1 WO 2021206030A1 JP 2021014414 W JP2021014414 W JP 2021014414W WO 2021206030 A1 WO2021206030 A1 WO 2021206030A1
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WIPO (PCT)
Prior art keywords
resin layer
metal
current collector
end portion
active material
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Ceased
Application number
PCT/JP2021/014414
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English (en)
Japanese (ja)
Inventor
貴也 齊藤
良基 高柳
西山　浩司
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
SoftBank Corp
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SoftBank Corp
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Filing date
Publication date
Application filed by SoftBank Corp filed Critical SoftBank Corp
Publication of WO2021206030A1 publication Critical patent/WO2021206030A1/fr
Anticipated expiration legal-status Critical
Ceased legal-status Critical Current

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    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01M—PROCESSES OR MEANS, e.g. BATTERIES, FOR THE DIRECT CONVERSION OF CHEMICAL ENERGY INTO ELECTRICAL ENERGY
    • H01M4/00—Electrodes
    • H01M4/02—Electrodes composed of, or comprising, active material
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01M—PROCESSES OR MEANS, e.g. BATTERIES, FOR THE DIRECT CONVERSION OF CHEMICAL ENERGY INTO ELECTRICAL ENERGY
    • H01M4/00—Electrodes
    • H01M4/02—Electrodes composed of, or comprising, active material
    • H01M4/64—Carriers or collectors
    • H01M4/66—Selection of materials
    • Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y02—TECHNOLOGIES OR APPLICATIONS FOR MITIGATION OR ADAPTATION AGAINST CLIMATE CHANGE
    • Y02E—REDUCTION OF GREENHOUSE GAS [GHG] EMISSIONS, RELATED TO ENERGY GENERATION, TRANSMISSION OR DISTRIBUTION
    • Y02E60/00—Enabling technologies; Technologies with a potential or indirect contribution to GHG emissions mitigation
    • Y02E60/10—Energy storage using batteries

Definitions

  • the present invention relates to a manufacturing method, a program, a manufacturing system, a current collector, and a battery.
  • Patent Document 1 Japanese Unexamined Patent Publication No. 2018-181823
  • a method for manufacturing a current collector may include a preparatory step for preparing the resin layer.
  • a metal is molecularly bonded to at least a part of the side surface, the upper surface, and the lower surface of the resin layer, and the metal layer on the upper surface and the metal layer on the lower surface are electrically connected by at least a part of the metal on the side surface. It may be provided with a generation step of generating a current collector.
  • the metal may be molecularly bonded to at least one side surface, an upper surface, and a lower surface of the four side surfaces of the rectangular resin layer to generate the current collector.
  • the metal may be molecularly bonded to the entire rectangular resin layer.
  • the metal may be molecularly bonded to the three side surfaces of the rectangular resin layer and the upper surface and the lower surface.
  • the metal may be molecularly bonded to the two side surfaces of the rectangular resin layer and the upper surface and the lower surface.
  • a metal may be molecularly bonded to one side surface of the rectangular resin layer and the upper surface and the lower surface.
  • a plurality of current collectors in which the metal is molecularly bonded to at least one side surface may be generated by cutting the resin layer in which the metal is molecularly bonded to the whole.
  • the resin layer having at least one hole penetrating from the upper surface to the lower surface may be prepared, and in the generation step, at least a part of the side surface of the resin layer, the upper surface and the lower surface, and the hole.
  • the metal may be molecularly bonded to the inner surface to generate the current collector.
  • the resin layer may be prepared by acquiring the resin layer on which at least one hole is formed.
  • the resin layer in which at least one hole is not formed may be obtained and at least one hole may be formed in the resin layer.
  • at least one hole may be formed in the resin layer by chemical etching.
  • at least one hole may be formed in the resin layer by an ultrasonic laser.
  • at least one hole may be formed in the resin layer by excavation using a drill for excavation.
  • at least one hole may be formed in the resin layer by a gas laser.
  • the active material is placed in a region other than the first end of the upper surface of the metal layer of the square resin layer in which the metal is molecularly bonded to the entire surface, and the active material is cut.
  • a plurality of the current collectors each of which includes both a part of the end portion of 1 and a portion where the active material is arranged, may be generated.
  • the active material is arranged in a region other than the first end portion of the upper surface of the metal layer of the square-shaped resin layer in which the metal is molecularly bonded to the entire surface, and the active material is arranged in a region other than the first end portion of the metal layer.
  • a plurality of convex portions are formed on the first end portion, and by cutting the resin layer, one of the plurality of convex portions is formed.
  • One and a plurality of the current collectors, each of which includes both the portion in which the active material is arranged, may be generated.
  • the active material is arranged in a region other than the first end portion and the second end portion on the upper surface of the metal layer of the resin layer, and the active material is cut at the portion where the active material is arranged.
  • each of the first partial resin layer including the first end portion and the second partial resin layer including the second end portion By cutting each of the first partial resin layer including the first end portion and the second partial resin layer including the second end portion, a part of the first end portion and the above
  • the active material is arranged in a region other than the first end portion and the second end portion on the upper surface of the metal layer of the resin layer, and the first end portion of the resin layer is arranged.
  • a plurality of convex portions are formed on the above-mentioned first end portion, and by cutting a part of the above-mentioned second end portion of the above-mentioned resin layer, the above By forming a plurality of convex portions on the second end portion and cutting the resin layer, one of the plurality of convex portions on the first end portion or the second end portion can be formed.
  • a plurality of the current collectors may be generated, each of which includes both one of the plurality of convex portions and the portion where the active material is arranged.
  • a plurality of convex portions are formed at the first end portion by cutting a part of the first end portion of the quadrangular resin layer, and then the metal is formed over the entire resin layer.
  • the resin layer By molecularly bonding the resin layer, arranging the active material in the upper surface region of the portion other than the first end portion of the resin layer, and cutting the resin layer, one of the plurality of convex portions can be formed.
  • a plurality of the current collectors, each of which includes both the portion in which the active material is arranged, may be generated.
  • a plurality of convex portions are formed at the first end portion by cutting a part of the first end portion of the quadrangular resin layer, and the first end portion of the resin layer is formed.
  • the metal is molecularly bonded to the entire resin layer to form the resin layer.
  • the active material in the upper surface region of the portion other than the first end portion and the second end portion and cutting the resin layer, the plurality of convex portions of the first end portion can be formed.
  • a plurality of the current collectors may be generated, each of which includes both one of them or one of the plurality of convex portions of the second end portion and the portion in which the active material is arranged. ..
  • a manufacturing method may include a preparatory step of preparing a resin layer having at least one hole penetrating from the upper surface to the lower surface.
  • the manufacturing method is to form a current collector in which a metal is molecularly bonded to the upper and lower surfaces of the resin layer and the inner surface of the hole, and the metal layer on the upper surface and the metal layer on the lower surface are electrically connected by the metal on the inner surface. It may be provided with a generation step to generate.
  • the current collector may be a negative electrode current collector having the resin layer and a copper layer molecularly bonded to the resin layer.
  • the current collector may be a positive electrode current collector having the resin layer and an aluminum layer molecularly bonded to the resin layer.
  • a program for causing a computer to execute the above-mentioned manufacturing method of the above-mentioned current collector is provided.
  • a manufacturing system may include a preparatory unit for preparing the resin layer.
  • the manufacturing system may include a generation unit in which a metal is molecularly bonded to at least a part of the side surface, the upper surface, and the lower surface of the resin layer to generate a current collector containing the resin layer in the middle.
  • a manufacturing system may include a preparatory unit that prepares a resin layer having at least one hole penetrating from the top surface to the bottom surface.
  • the manufacturing system is a current collector in which a metal is molecularly bonded to the upper and lower surfaces of the resin layer and the inner surface of the hole, and the metal layer on the upper surface and the metal layer on the lower surface are electrically connected by the metal on the inner surface. It may be provided with a generation unit to be generated.
  • a current collector may include a resin layer and a metal layer molecularly bonded to at least a part of the side surface, the upper surface, and the lower surface of the resin layer, and the metal layer on the upper surface and the metal layer on the lower surface may be provided by at least a part of the metal on the side surface.
  • the metal layer may be electrically connected.
  • a current collector may include a resin layer having at least one hole penetrating from the upper surface to the lower surface, and a metal molecularly bonded to the upper surface and the lower surface of the resin layer and the inner surface of the hole.
  • the metal layer on the upper surface and the metal layer on the lower surface may be electrically connected.
  • a battery having the above current collector is provided.
  • An example of the battery configuration 10 is shown schematically. Another example of the battery configuration 10 is shown schematically.
  • An example of the configuration of the negative electrode current collector 200 is shown schematically.
  • An example of the configuration of the positive electrode current collector 300 is shown schematically.
  • An example of the functional configuration of the manufacturing system 400 is schematically shown. It is explanatory drawing for demonstrating the plating of a resin layer 210. It is explanatory drawing for demonstrating the plating of a resin layer 210. It is explanatory drawing for demonstrating the plating of a resin layer 210. It is a cross-sectional view of AA.
  • An example of the processing flow by the current collector generation unit 410 is schematically shown. It is explanatory drawing for demonstrating the manufacturing process of the negative electrode current collector 200.
  • FIG. 1 schematically shows an example of the battery configuration 10.
  • the battery configuration 10 has a plurality of negative electrodes 20 and 30s that are alternately laminated with the separator 40 interposed therebetween.
  • the negative electrode 20 has a negative electrode current collector 200.
  • the positive electrode 30 has a positive electrode current collector 300.
  • the battery component 10 may be any kind of battery component.
  • the battery component 10 is, for example, a component of a lithium ion battery.
  • a tab is welded to each of the laminated body 280 on which the negative electrode current collector 200 is laminated and the laminated body 380 on which the positive electrode current collector 300 is laminated, and the entire battery configuration 10 is put into a housing or the like.
  • the lithium ion battery is formed by filling the electric field liquid.
  • the battery component 10 may be a component of a lithium-air battery.
  • the battery component 10 may be a component of another type of battery.
  • FIG. 1 illustrates a case where the negative electrode current collector 200 and the positive electrode current collector 300 are arranged in the same direction, but the present invention is not limited to this.
  • the negative electrode current collector 200 and the positive electrode current collector 300 may be arranged in different directions.
  • the negative electrode current collector 200 and the positive electrode current collector 300 may be arranged in opposite directions.
  • FIG. 2 schematically shows another example of the battery configuration 10.
  • the battery component 10 has a laminated laminated battery 50.
  • the laminated battery 50 has a negative electrode current collector 200 and a positive electrode current collector 300.
  • tabs are welded to each of the laminated body 280 and the laminated body 380, and the entire battery component 10 is put into a housing or the like. , Lithium-ion batteries are formed.
  • FIG. 2 illustrates a case where the negative electrode current collector 200 and the positive electrode current collector 300 are arranged in the same direction, but the present invention is not limited to this.
  • the negative electrode current collector 200 and the positive electrode current collector 300 may be arranged in different directions.
  • the negative electrode current collector 200 and the positive electrode current collector 300 may be arranged in opposite directions.
  • FIG. 3 schematically shows an example of the configuration of the negative electrode current collector 200.
  • the negative electrode current collector 200 according to the present embodiment has a resin layer 210 and a metal layer 230.
  • the metal layer 230 is generated by molecularly bonding a metal to at least a part of the side surface, the upper surface, and the lower surface of the resin layer 210.
  • the upper surface side and the lower surface side of the metal layer 230 are electrically connected by at least a part of the metal on the side surface.
  • the resin of the resin layer 210 As the resin of the resin layer 210 according to the present embodiment, a resin having a lower conductivity than the metal of the metal layer 230 but a lower density than the metal of the metal layer 230 is adopted.
  • the resin of the resin layer 210 include, but are not limited to, PET (polyethylene terephthalate), PP (polypropylene), PE (polyethylene), PPE (polyphenylene ether) and the like.
  • the material of the resin layer 210 is not particularly limited.
  • the metal of the metal layer 230 may be copper and the resin of the resin layer 210 may be PET.
  • the metal of the metal layer 230 may be another metal.
  • the resin of the resin layer 210 may be another resin.
  • the current may be low, but there are cases where you want to reduce the weight.
  • HAPS High Altitude Platform Station
  • the output current of the battery may be low because the change in flight speed is small.
  • the weight of the entire HAPS is required to be light. As described above, there are other applications in which the current may be low but the weight is required to be reduced.
  • a copper foil is often used as a negative electrode current collector, and such a requirement can be met by reducing the thickness of the copper foil.
  • the thickness of the copper foil there is a technical limit to reducing the thickness of the copper foil, and if the thickness of the copper foil is too thin, the strength cannot be maintained and the possibility of breakage increases.
  • the negative electrode current collector 200 according to the present embodiment has a resin layer 210 in the middle, the electrical resistance is higher than that of the negative electrode current collector made of only metal, but the density can be lowered. In addition, the strength of the negative electrode current collector 200 can be maintained.
  • a metal copper of the metal layer 230 when the resin of the resin layer 210 is assumed PET, density of copper is about 8.96 g / cm 3, the density of the PET is about 1.38 g / cm 3 Therefore, the weight can be significantly reduced as compared with the case where the negative electrode current collector is composed of only copper.
  • the density is about 3.25 g / cm 3
  • the weight ratio is about 35% of that when it is composed of only copper.
  • the weight can be reduced by about 65%.
  • the thickness of the resin layer 210 is 7 ⁇ m
  • the density is about 2.30 g / cm 3
  • the weight ratio is about 25% as compared with the case where the resin layer 210 is composed only of copper, and the weight can be reduced by about 75%.
  • the negative electrode current collector is composed only of metal, even if the negative electrode current collector is multi-layered, it is welded by ultrasonic welding, resistance welding, laser welding, etc. because the metals are metal to each other (conductive materials). As a result, a conductive path can be secured.
  • the metal is bonded to the resin by adhesive bonding, and the metal cannot be bonded to the edge portion. Therefore, when the number of layers is increased, the conductive path cannot be secured. Therefore, resistance welding cannot be performed as it is. Further, since the metal layer and the resin layer have different characteristics in terms of boiling point, thermal expansion, strength, etc., for example, when laser welding is attempted, problems such as rupture and residual pores may occur. .. Further, when ultrasonic welding is attempted, cracks and breaks may occur.
  • FIG. 4 schematically shows an example of the configuration of the positive electrode current collector 300.
  • the positive electrode current collector 300 according to the present embodiment has a resin layer 310 and a metal layer 330.
  • the metal layer 330 is generated by molecularly bonding a metal to at least a part of the side surface, the upper surface, and the lower surface of the resin layer 310.
  • the upper surface side and the lower surface side of the metal layer 330 are electrically connected by at least a part of the metal on the side surface.
  • the resin of the resin layer 310 As the resin of the resin layer 310 according to the present embodiment, a resin having a lower conductivity than the metal of the metal layer 330 but a lower density than the metal of the metal layer 330 is adopted.
  • the resin of the resin layer 310 include, but are not limited to, PET (polyethylene terephthalate), PP (polypropylene), PE (polyethylene), PPE (polyphenylene ether) and the like.
  • PET polyethylene terephthalate
  • PP polypropylene
  • PE polyethylene
  • PPE polyphenylene ether
  • the metal of the metal layer 330 may be aluminum and the resin of the resin layer 310 may be PET.
  • the metal of the metal layer 330 may be another metal.
  • the resin of the resin layer 310 may be another resin.
  • FIG. 5 schematically shows an example of the functional configuration of the manufacturing system 400.
  • the manufacturing system 400 includes a current collector generation unit 410 and a battery generation unit 420.
  • the manufacturing system 400 may be configured by one device. Further, the manufacturing system 400 may be composed of a plurality of devices. For example, the current collector generation unit 410 and the battery generation unit 420 may be different devices. The manufacturing system 400 does not have to include the battery generation unit 420.
  • the current collector generation unit 410 generates a current collector that includes a resin layer in the middle and is electrically connected to a metal layer on the upper surface and a metal layer on the lower surface.
  • the current collector generation unit 410 includes a preparation unit 412 and a generation unit 414.
  • the preparation unit 412 prepares the resin layer.
  • a metal is molecularly bonded to at least a part, an upper surface, and a lower surface of the side surface of the resin layer prepared by the preparation unit 412, and the metal layer on the upper surface of the resin layer is formed by at least a part of the metal on the side surface of the resin layer.
  • the metal layer on the lower surface of the resin layer are electrically connected to generate a current collector.
  • the generation unit 414 generates a current collector by applying a molecular bonding agent to at least a part of the side surface, the upper surface, and the lower surface of the resin layer and applying metal plating, for example.
  • the preparation unit 412 prepares, for example, a quadrangular resin layer.
  • a metal is molecularly bonded to at least one side surface, an upper surface, and a lower surface of the four side surfaces of the rectangular resin layer, and the resin layer is formed by the metal on at least one side surface of the resin layer.
  • a current collector may be generated in which the metal layer on the upper surface of the resin layer and the metal layer on the lower surface of the resin layer are electrically connected.
  • the metal may be molecularly bonded to the entire rectangular resin layer.
  • a metal may be molecularly bonded to the three side surfaces of the rectangular resin layer and the upper surface and the lower surface.
  • the generation unit 414 may have a metal molecularly bonded to the two side surfaces of the rectangular resin layer and the upper surface and the lower surface.
  • the generation unit 414 may have a metal molecularly bonded to one side surface of the rectangular resin layer and the upper surface and the lower surface.
  • the generation unit 414 may generate a plurality of current collectors in which the metal is molecularly bonded to at least one side surface by cutting the resin layer in which the metal is molecularly bonded to the whole.
  • the generation unit 414 may generate a current collector having the active material by applying the active material to the generated current collector.
  • the generation unit 414 may generate a plurality of current collectors, each of which has an active material, by applying the active material to the metal layer on the upper surface of the resin layer in which the metal is molecularly bonded to the entire surface and then cutting the metal layer.
  • the preparation unit 412 when generating the negative electrode 20 having the negative electrode current collector 200, the preparation unit 412 prepares the resin layer 210. Then, in the generation unit 414, a metal is molecularly bonded to at least a part of the side surface, the upper surface, and the lower surface of the resin layer 210 prepared by the preparation unit 412, and the negative electrode material is applied to the metal layer on the upper surface to apply the negative electrode material to the resin layer.
  • a negative electrode 20 having 210, a metal layer 230, and a negative electrode material may be produced.
  • the preparation unit 412 when generating the positive electrode 30 having the positive electrode current collector 300, the preparation unit 412 prepares the resin layer 310. Then, the generation unit 414 molecularly bonds metal to at least a part of the side surface, the upper surface, and the lower surface of the resin layer 310 prepared by the preparation unit 412, and applies the positive electrode material to the metal layer on the upper surface to apply the resin layer.
  • a positive electrode 30 having a 310, a metal layer 330, and a positive electrode material may be produced.
  • the battery generation unit 420 generates a battery by using the current collector generated by the current collector generation unit 410.
  • the battery generation unit 420 prepares the battery component 10 by stacking the negative electrode 20 and the positive electrode 30 generated by the current collector generation unit 410 and the separator 40, for example.
  • both the negative electrode current collector 200 and the positive electrode current collector 300 include a resin layer in the middle will be described as an example, but the present invention is not limited to this.
  • the negative electrode current collector 200 and the positive electrode current collector 300 only the negative electrode current collector 200 may include a resin layer in the middle, and the positive electrode current collector 300 may be composed of only metal.
  • the negative electrode current collector 200 and the positive electrode current collector 300 only the positive electrode current collector 300 may include a resin layer in the middle, and the negative electrode current collector 200 may be composed of only metal.
  • the battery generation unit 420 may connect the tabs by bringing the negative electrode current collectors 200 of the laminated body 280 of the battery component 10 into contact with each other.
  • the battery generator 420 compresses, for example, at least a portion of the end region of the laminate 280.
  • the battery generation unit 420 may heat-compress the laminated body 280 at least a part of the end region.
  • the battery generating unit 420 may perform resistance welding at least a part of the end region of the laminated body 280.
  • a precision resistance welding machine of the NAG system or the like can be adopted.
  • the battery generation unit 420 may connect the tabs by bringing the positive electrode current collectors 300 of the laminated body 380 of the battery component 10 into contact with each other.
  • the battery generator 420 compresses, for example, at least a portion of the end region of the laminate 380.
  • the battery generation unit 420 may heat and compress at least a part of the end region of the laminated body 380.
  • the battery generating unit 420 may perform resistance welding at least a part of the end region of the laminated body 380.
  • a device for performing resistance welding for example, a precision resistance welding machine of the NAG system or the like can be adopted.
  • the battery generation unit 420 generates a battery using the battery configuration 10 in which tabs are connected to each of the laminated body 280 and the laminated body 380.
  • the battery generation unit 420 generates a battery by, for example, putting the battery component 10 in a housing and performing work according to the type of battery such as injection of an electrolytic solution.
  • FIG. 6 is an explanatory diagram for explaining the metal plating of the resin layer 210.
  • the generation unit 414 may generate the metal layer 230 by molecularly bonding the metal to the entire resin layer 210 prepared by the preparation unit 412.
  • the metal layer 230 includes a metal molecularly bonded to the upper surface 211 of the resin layer 210, a metal molecularly bonded to the lower surface 212 of the resin layer 210, and an edge portion of the resin layer 210, that is, four side surfaces 213 of the resin layer 210. Includes a metal that is molecularly bonded to. By molecularly bonding the metal to the entire resin layer 210 in this way, the negative electrode current collector 200 having high conductivity can be generated.
  • the resin layer 210 has been described with reference to FIG. 6, the same applies to the resin layer 310.
  • FIG. 7 is an explanatory diagram for explaining the metal plating of the resin layer 210.
  • the generation unit 414 is formed by molecularly bonding a metal to one of the four side surfaces 213 of the resin layer 210 prepared by the preparation unit 412, the upper surface 211, and the lower surface 212.
  • the metal layer 230 may be formed.
  • the metal layer 230 includes a metal molecularly bonded to the upper surface 211 of the resin layer 210, a metal molecularly bonded to the lower surface 212 of the resin layer 210, and a metal molecularly bonded to one side surface 213 of the resin layer 210. ..
  • FIG. 8 is an explanatory diagram for explaining the metal plating of the resin layer 210.
  • FIG. 9 is a cross-sectional view taken along the line AA.
  • the preparation unit 412 may prepare a resin layer 210 having at least one hole 240 penetrating from the upper surface to the lower surface. In the example shown in FIG. 8, the resin layer 210 has four holes 240.
  • the generation unit 414 applies a molecular bonding agent to the upper surface 211, the lower surface 212, and the inner surface 242 of the hole 240 of the resin layer 210 having the holes 240, and metal-plats the resin layer 210 and the resin layer.
  • a negative electrode current collector 200 including a metal layer 231 on the upper surface side of 210, a metal layer 232 on the lower surface side of the resin layer 210, and a metal arranged on the inner surface of the hole 240 is generated.
  • the metal layer 231 and the metal layer 232 are electrically connected by a metal arranged on the inner surface of the hole 240. According to the molecular bonding, metal plating on the inner surface 242 of the hole 240 can be realized.
  • the number and size of the holes 240 can be determined according to the type of the resin layer 210, the size of the resin layer 210, the type of metal, and the like.
  • the appropriate number and size of holes 240 can be determined by conducting experiments under various conditions such as each type of resin layer 210, each size of resin layer 210, and each type of metal.
  • the size of the hole 240 can be 0.01 mm to 5 mm in diameter. Further, the distance between the holes 240 may be 0.05 to 5 mm between the centers.
  • the preparation unit 412 may prepare the resin layer 210 having the holes 240 by acquiring the resin layer 210 in which the holes 240 are formed. Further, the preparation unit 412 may acquire the resin layer 210 in which the holes 240 are not formed and form the holes 240 in the resin layer 210. For example, the preparation unit 412 forms one or a plurality of holes 240 in the resin layer 210 by chemical etching. By using chemical etching, for example, holes 240 having a diameter of 30 ⁇ m to 200 ⁇ m can be formed at a pitch of 100 ⁇ m.
  • the preparation unit 412 may form one or a plurality of holes 240 in the resin layer 210 by ultrasonic laser. Further, the preparation unit 412 may form one or a plurality of holes 240 in the resin layer 210 by excavation using a drill for excavation. Further, the preparation unit 412 may form one or a plurality of holes 240 in the resin layer 210 by a gas laser.
  • the weight is increased as compared with the negative electrode current collector 200 illustrated in FIG. A light negative electrode current collector 200 can be generated. Even if the current collector generation unit 410 generates the negative electrode current collector 200 by molecularly bonding a metal to at least one of the side surfaces 213 of the resin layer 210, the upper surface 211, the lower surface 212, and the inner surface 242 of the hole 240. good. As a result, the conductivity of the negative electrode current collector 200 can be increased while reducing the weight of the negative electrode current collector 200.
  • the resin layer 210 has been described with reference to FIGS. 8 and 9, the same applies to the resin layer 310.
  • FIG. 10 schematically shows an example of the processing flow by the current collector generation unit 410.
  • the flow of processing in the case of generating a plurality of current collectors having an active material will be described.
  • step 102 the step may be abbreviated as S
  • the preparation unit 412 prepares a quadrangular resin layer.
  • the generation unit 414 molecularly bonds the metal to the resin layer prepared in S102.
  • the generation unit 414 may molecularly bond the metal to the entire resin layer.
  • the generation unit 414 may have a metal molecularly bonded to at least a part of the side surface, the upper surface, and the lower surface of the resin layer.
  • the generation unit 414 arranges the active material on the metal layer on the upper surface of the resin layer.
  • the generation unit 414 arranges the active material in a region other than the first end portion on the upper surface of the metal layer, for example.
  • a plurality of generation units 414 include both a part of the first end portion and a portion in which the active material is arranged by cutting the resin layer on which the active material is arranged in S106. Generates a current collector.
  • the generation unit 414 generates a quadrangular resin layer 210 (sometimes referred to as a multilayer body 250) in which a metal is molecularly bonded to the entire surface.
  • FIG. 11 is a top view of the multilayer body 250.
  • the multilayer body 250 may have a band shape.
  • the generation unit 414 arranges the active material 260 in the region 255 other than the end portion 251 of the upper surface of the multilayer body 250 and the end portion 253 facing the end portion 251 and cuts the multilayer body 250 to cut the end portion 251.
  • a plurality of negative electrode current collectors 200 are generated. As illustrated in FIG. 12, the generation unit 414 arranges the active material 260 in the region 255, and cuts the partial resin layer 256 and the end portion 253 including the end portion 251 at the portion where the active material 260 is arranged.
  • a plurality of negative electrode current collectors 200 each of which includes both a part of the end portion 251 or a part of the end portion 253 and a portion in which the active material is arranged. May be generated.
  • the formation of the multilayer body 250, the arrangement of the active material 260, and the like may be realized by any method, and for example, a roll-to-roll method or the like can be adopted.
  • each negative electrode current collector 200 having metal molecularly bonded to two side surfaces and ten negative electrode current collectors 200 having metal molecularly bonded to one side surface are manufactured. Will be done.
  • a plurality of negative electrode current collectors 200 can be efficiently generated.
  • the manufacturing process of the negative electrode current collector 200 has been described with reference to FIGS. 11 to 13, the same applies to the manufacturing process of the positive electrode current collector 300.
  • FIG. 14 schematically shows an example of the processing flow by the current collector generation unit 410.
  • the flow of processing in the case of generating a plurality of current collectors having an active material will be described.
  • the preparation unit 412 prepares a square resin layer.
  • the generation unit 414 molecularly bonds the metal to the resin layer prepared in S202.
  • the generation unit 414 may molecularly bond the metal to the entire resin layer.
  • the generation unit 414 may have a metal molecularly bonded to at least a part of the side surface, the upper surface, and the lower surface of the resin layer.
  • the generation unit 414 arranges the active material on the metal layer on the upper surface of the resin layer.
  • the generation unit 414 arranges the active material in a region other than the first end portion on the upper surface of the metal layer, for example.
  • the generation unit 414 cuts a part of the first end portion of the resin layer to cut the first end portion into a saw shape, and a plurality of portions are formed on the first end portion. Form a convex part.
  • the generation unit 414 cuts the resin layer into strips to generate a plurality of current collectors, each of which includes both one convex portion and a portion on which the active material is arranged.
  • the generation unit 414 arranges the active material 260 in the region 255 other than the end portion 251 of the upper surface of the multilayer body 250 and the end portion 253 facing the end portion 251 to form a part of the end portion 251 of the multilayer body 250.
  • a plurality of convex portions 252 are formed on the portion of the end portion 251, and by cutting a part of the portion of the end portion 253 of the multilayer body 250, the plurality of convex portions 254 are formed on the portion of the end portion 253.
  • a plurality of negative electrode current collectors 200 each including both one convex portion 252 or one convex portion 254 and a portion on which the active material 260 is arranged are generated. do.
  • the negative electrode current collector 200 with ensured conductivity can be generated by the metal layer at the tip of the convex portion.
  • FIG. 17 schematically shows an example of the processing flow by the current collector generation unit 410.
  • the flow of processing in the case of generating a plurality of current collectors having an active material will be described.
  • the preparation unit 412 prepares a square resin layer.
  • the generation unit 414 cuts a part of the first end portion of the resin layer to cut the first end portion into a saw shape, and a plurality of portions are formed on the first end portion. Form a convex part.
  • the generation unit 414 molecularly bonds the metal to the entire resin layer in which a plurality of convex portions are formed at the first end portion in S304.
  • the generation unit 414 arranges the active material in the region of the upper surface of the portion other than the first end portion of the resin layer.
  • the generation unit 414 cuts the resin layer into strips to generate a plurality of current collectors, each of which includes both one convex portion and a portion on which the active material is arranged.
  • the generation unit 414 cuts a part of the end portion 221 of the rectangular resin layer 210 to form a plurality of convex portions 222 on the end portion 221 and cuts a part of the end portion 223 of the resin layer 210.
  • the metal is molecularly bonded to the entire resin layer 210 and activated in the upper surface region 225 of the portion other than the end portion 221 and the end portion 223 of the resin layer 210.
  • a plurality of negative electrode current collectors 200 each of which includes both one convex portion 222 or one convex portion 224 and a portion on which the active material is arranged, by arranging the material and cutting the resin layer 210. To generate.
  • the generation unit 414 may cut the resin layer 210 into strips.
  • FIG. 20 schematically shows an example of a hardware configuration of a computer 1200 that functions as a manufacturing system 400.
  • a program installed on the computer 1200 causes the computer 1200 to function as one or more "parts" of the device according to the present embodiment, or causes the computer 1200 to perform an operation associated with the device according to the present embodiment or the one or the like.
  • a plurality of "parts" can be executed and / or a computer 1200 can be made to execute a process according to the present embodiment or a stage of the process.
  • Such a program may be run by the CPU 1212 to cause the computer 1200 to perform certain operations associated with some or all of the blocks in the flowcharts and block diagrams described herein.
  • the computer 1200 includes a CPU 1212, a RAM 1214, and a graphic controller 1216, which are connected to each other by a host controller 1210.
  • the computer 1200 also includes input / output units such as a communication interface 1222, a storage device 1224, a DVD drive, and an IC card drive, which are connected to the host controller 1210 via the input / output controller 1220.
  • the DVD drive may be a DVD-ROM drive, a DVD-RAM drive, or the like.
  • the storage device 1224 may be a hard disk drive, a solid state drive, or the like.
  • the computer 1200 also includes a legacy I / O unit such as a ROM 1230 and a keyboard, which are connected to the I / O controller 1220 via an I / O chip 1240.
  • the CPU 1212 operates according to the programs stored in the ROM 1230 and the RAM 1214, thereby controlling each unit.
  • the graphic controller 1216 acquires the image data generated by the CPU 1212 in a frame buffer or the like provided in the RAM 1214 or itself so that the image data is displayed on the display device 1218.
  • the communication interface 1222 communicates with other electronic devices via the network.
  • the storage device 1224 stores programs and data used by the CPU 1212 in the computer 1200.
  • the DVD drive reads a program or data from a DVD-ROM or the like and provides it to the storage device 1224.
  • the IC card drive reads the program and data from the IC card and / or writes the program and data to the IC card.
  • the ROM 1230 stores a boot program or the like executed by the computer 1200 at the time of activation and / or a program depending on the hardware of the computer 1200.
  • the input / output chip 1240 may also connect various input / output units to the input / output controller 1220 via a USB port, a parallel port, a serial port, a keyboard port, a mouse port, and the like.
  • the program is provided by a computer-readable storage medium such as a DVD-ROM or IC card.
  • the program is read from a computer-readable storage medium, installed in a storage device 1224, RAM 1214, or ROM 1230, which is also an example of a computer-readable storage medium, and executed by the CPU 1212.
  • the information processing described in these programs is read by the computer 1200 and provides a link between the program and the various types of hardware resources described above.
  • the device or method may be configured to implement the operation or processing of information in accordance with the use of the computer 1200.
  • the CPU 1212 executes a communication program loaded in the RAM 1214, and performs communication processing on the communication interface 1222 based on the processing described in the communication program. You may order.
  • the communication interface 1222 reads and reads the transmission data stored in the transmission buffer area provided in the recording medium such as the RAM 1214, the storage device 1224, the DVD-ROM, or the IC card. The data is transmitted to the network, or the received data received from the network is written to the reception buffer area or the like provided on the recording medium.
  • the CPU 1212 makes the RAM 1214 read all or necessary parts of the file or the database stored in the external recording medium such as the storage device 1224, the DVD drive (DVD-ROM), the IC card, etc. Various types of processing may be performed on the data. The CPU 1212 may then write back the processed data to an external recording medium.
  • the external recording medium such as the storage device 1224, the DVD drive (DVD-ROM), the IC card, etc.
  • the CPU 1212 describes various types of operations, information processing, conditional judgment, conditional branching, unconditional branching, and information retrieval described in various parts of the present disclosure with respect to the data read from the RAM 1214. Various types of processing may be performed, including / replacement, etc., and the results are written back to the RAM 1214. Further, the CPU 1212 may search for information in a file, a database, or the like in the recording medium. For example, when a plurality of entries each having an attribute value of the first attribute associated with the attribute value of the second attribute are stored in the recording medium, the CPU 1212 is the first of the plurality of entries. The attribute value of the attribute of is searched for the entry that matches the specified condition, the attribute value of the second attribute stored in the entry is read, and the first attribute that satisfies the predetermined condition is selected. You may get the attribute value of the associated second attribute.
  • the program or software module described above may be stored on a computer 1200 or in a computer-readable storage medium near the computer 1200.
  • a recording medium such as a hard disk or RAM provided in a dedicated communication network or a server system connected to the Internet can be used as a computer-readable storage medium, whereby the program can be transferred to the computer 1200 via the network. offer.
  • the blocks in the flowchart and the block diagram in the present embodiment may represent the stage of the process in which the operation is executed or the "part" of the device having a role of executing the operation.
  • Specific stages and “parts” are supplied with dedicated circuits, programmable circuits supplied with computer-readable instructions stored on computer-readable storage media, and / or computer-readable instructions stored on computer-readable storage media. It may be implemented by the processor.
  • Dedicated circuits may include digital and / or analog hardware circuits, and may include integrated circuits (ICs) and / or discrete circuits.
  • Programmable circuits include logical products, logical sums, exclusive logical sums, negative logical products, negative logical sums, and other logical operations, such as field programmable gate arrays (FPGAs), programmable logic arrays (PLAs), and the like. , Flip-flops, registers, and reconfigurable hardware circuits, including memory elements.
  • the computer-readable storage medium may include any tangible device capable of storing instructions executed by the appropriate device, so that the computer-readable storage medium having the instructions stored therein is in a flow chart or block diagram. It will be equipped with a product that contains instructions that can be executed to create means for performing the specified operation.
  • Examples of the computer-readable storage medium may include an electronic storage medium, a magnetic storage medium, an optical storage medium, an electromagnetic storage medium, a semiconductor storage medium, and the like. More specific examples of computer-readable storage media include floppy (registered trademark) disks, diskettes, hard disks, random access memory (RAM), read-only memory (ROM), and erasable programmable read-only memory (EPROM or flash memory).
  • EEPROM Electrically Erasable Programmable Read Only Memory
  • SRAM Static Random Access Memory
  • CD-ROM Compact Disc Read Only Memory
  • DVD Digital Versatile Disc
  • Blu-ray® Disc Memory Stick
  • Integrated circuit cards and the like may be included.
  • Computer-readable instructions include assembler instructions, instruction set architecture (ISA) instructions, machine instructions, machine-dependent instructions, microcode, firmware instructions, state setting data, or Smalltalk®, JAVA®, C ++, etc.
  • ISA instruction set architecture
  • Object-oriented programming languages and either source code or object code written in any combination of one or more programming languages, including traditional procedural programming languages such as the "C" programming language or similar programming languages. May include.
  • Computer-readable instructions are used to generate means for a general-purpose computer, a special-purpose computer, or the processor of another programmable data processing device, or a programmable circuit, to perform an operation specified in a flowchart or block diagram.
  • WAN wide area network
  • LAN local area network
  • Internet etc.
  • processors include computer processors, processing units, microprocessors, digital signal processors, controllers, microcontrollers and the like.

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  • Chemical & Material Sciences (AREA)
  • Chemical Kinetics & Catalysis (AREA)
  • Electrochemistry (AREA)
  • General Chemical & Material Sciences (AREA)
  • Engineering & Computer Science (AREA)
  • Materials Engineering (AREA)
  • Cell Electrode Carriers And Collectors (AREA)

Abstract

L'invention concerne un procédé de fabrication d'un collecteur de courant, le procédé comprenant : une étape de préparation permettant de préparer une couche de résine ; et une étape de production lors de laquelle un métal est lié par liaison moléculaire à au moins une partie de la surface latérale, à la surface supérieure et à la surface inférieure de la couche de résine pour produire un collecteur de courant, les couches métalliques sur la surface supérieure et la surface inférieure étant électriquement connectées entre elles par le biais du métal sur au moins la partie de la surface latérale. L'invention concerne également un système de fabrication comprenant : une unité de préparation permettant de préparer une couche de résine ; et une unité de production dans laquelle un métal est lié par liaison moléculaire à au moins une partie de la surface latérale, à la surface supérieure et à la surface inférieure de la couche de résine pour produire un collecteur de courant, les couches métalliques sur la surface supérieure et la surface inférieure étant électriquement connectées entre elles par le biais du métal sur au moins la partie de la surface latérale.
PCT/JP2021/014414 2020-04-07 2021-04-02 Procédé de fabrication, programme, système de fabrication, collecteur de courant et batterie Ceased WO2021206030A1 (fr)

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WO2012046651A1 (fr) * 2010-10-04 2012-04-12 株式会社いおう化学研究所 Procédé de formation de couche métallique et produit doté d'une couche métallique
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JP7725426B2 (ja) 2022-06-16 2025-08-19 ソフトバンク株式会社 電極、電極構造体、電池、飛行体、及び、電極の生産方法、電極構造体の生産方法

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