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WO2021200618A1 - Film de matériau de base, et feuille d'usinage de pièce à travailler - Google Patents

Film de matériau de base, et feuille d'usinage de pièce à travailler Download PDF

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Publication number
WO2021200618A1
WO2021200618A1 PCT/JP2021/012779 JP2021012779W WO2021200618A1 WO 2021200618 A1 WO2021200618 A1 WO 2021200618A1 JP 2021012779 W JP2021012779 W JP 2021012779W WO 2021200618 A1 WO2021200618 A1 WO 2021200618A1
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WO
WIPO (PCT)
Prior art keywords
base film
polyester resin
less
film according
elastomer
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Ceased
Application number
PCT/JP2021/012779
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English (en)
Japanese (ja)
Inventor
遼 佐々木
田矢　直紀
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Lintec Corp
Original Assignee
Lintec Corp
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Lintec Corp filed Critical Lintec Corp
Priority to JP2022512100A priority Critical patent/JPWO2021200618A1/ja
Publication of WO2021200618A1 publication Critical patent/WO2021200618A1/fr
Anticipated expiration legal-status Critical
Ceased legal-status Critical Current

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Classifications

    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B32—LAYERED PRODUCTS
    • B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
    • B32B27/00—Layered products comprising a layer of synthetic resin
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B32—LAYERED PRODUCTS
    • B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
    • B32B27/00—Layered products comprising a layer of synthetic resin
    • B32B27/36—Layered products comprising a layer of synthetic resin comprising polyesters
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08L—COMPOSITIONS OF MACROMOLECULAR COMPOUNDS
    • C08L21/00—Compositions of unspecified rubbers
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08L—COMPOSITIONS OF MACROMOLECULAR COMPOUNDS
    • C08L67/00—Compositions of polyesters obtained by reactions forming a carboxylic ester link in the main chain; Compositions of derivatives of such polymers
    • C08L67/02—Polyesters derived from dicarboxylic acids and dihydroxy compounds
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/02—Manufacture or treatment of semiconductor devices or of parts thereof
    • H01L21/04—Manufacture or treatment of semiconductor devices or of parts thereof the devices having potential barriers, e.g. a PN junction, depletion layer or carrier concentration layer
    • H01L21/18—Manufacture or treatment of semiconductor devices or of parts thereof the devices having potential barriers, e.g. a PN junction, depletion layer or carrier concentration layer the devices having semiconductor bodies comprising elements of Group IV of the Periodic Table or AIIIBV compounds with or without impurities, e.g. doping materials
    • H01L21/30—Treatment of semiconductor bodies using processes or apparatus not provided for in groups H01L21/20 - H01L21/26

Definitions

  • the present invention relates to a base film that can be suitably used as a base film for a work processing sheet used for processing a work such as a semiconductor wafer, and the work processing sheet.
  • Semiconductor wafers such as silicon and gallium arsenide and various packages are manufactured in a large diameter state, cut (diced) into chips, peeled (picked up), and then moved to the next step, the mounting process.
  • a work such as a semiconductor wafer is back grinded, diced, washed, and dried while being attached to an adhesive sheet having a base material and an adhesive layer (hereinafter, may be referred to as a “work processing sheet”). , Expanding, picking up, mounting, etc. are performed.
  • the semiconductor chips in order to facilitate the pickup of the semiconductor chips, the semiconductor chips may be individually pushed up from the surface of the workpiece processing sheet opposite to the surface on which the semiconductor chips are laminated.
  • the work processing sheet in order to suppress collisions between semiconductor chips during pickup and to facilitate pickup, usually, the work processing sheet is stretched (expanded) to separate the semiconductor chips from each other. Therefore, the work processing sheet is required to have excellent flexibility that enables good expansion.
  • Patent Documents 1 and 2 disclose inventions relating to a workpiece processing sheet developed for the purpose of realizing good expansion.
  • Cited Document 1 discloses a dicing film having a base material layer and an adhesive layer, wherein the base material layer contains a predetermined random polypropylene and a predetermined olefin elastomer under predetermined conditions. Has been done.
  • Cited Document 2 the pressure-sensitive adhesive tape in which the pressure-sensitive adhesive layer, the layer to be coated with the pressure-sensitive adhesive, the thermoplastic elastomer layer, and the resin layer are laminated in this order, and the thermoplastic elastomer layer is specified.
  • An adhesive tape made of a resin composition is disclosed.
  • the present inventors are considering using a base film composed of a predetermined polyester resin as a main material as a base film for a work processing sheet.
  • the present inventors have confirmed that such a work processing sheet has various excellent effects including an effect of suppressing the generation of cutting pieces during dicing.
  • the present inventors have found that the usefulness of the base film can be further enhanced by improving the expandability of the base film.
  • the present invention has been made in view of such an actual situation, and provides a base film having excellent flexibility that enables good expansion, and a work processing sheet that enables good expansion. The purpose.
  • the present invention provides a base film made of a material containing a polyester resin having an alicyclic structure and an elastomer other than the polyester resin (invention). 1).
  • the base film according to the above invention (Invention 1) is made of a material containing a polyester resin having an alicyclic structure and an elastomer other than the polyester resin, so that the base film has excellent flexibility.
  • a work processing sheet using a film can perform good expansion.
  • the content of the elastomer in the material is preferably 4% by mass or more and 45% by mass or less (Invention 2).
  • the elastomer is preferably a thermoplastic elastomer (Invention 3).
  • thermoplastic elastomer is preferably at least one of a styrene-based elastomer, an acrylic-based elastomer, a urethane-based elastomer, and an olefin-based elastomer (Invention 4).
  • the polyester resin preferably contains a dicarboxylic acid having the alicyclic structure as a monomer unit constituting the polyester resin (Invention 5).
  • the polyester resin preferably contains a diol having the alicyclic structure as a monomer unit constituting the polyester resin (Invention 6).
  • the alicyclic structure preferably has 6 or more and 14 or less carbon atoms constituting the ring (Invention 7).
  • the polyester resin contains dimer acid obtained by dimerizing an unsaturated fatty acid as a monomer unit constituting the polyester resin, and the unsaturated fatty acid has 10 or more carbon atoms. , 30 or less is preferable (Invention 8).
  • the tensile elastic modulus measured when the base film is subjected to a tensile test in an environment of 23 ° C. and a tensile speed of 200 mm / min is 50 MPa or more and 800 MPa or less. It is preferable that there is (Invention 9).
  • the elongation at break measured when a tensile test is performed on the base film in an environment of 23 ° C. and a tensile speed of 200 mm / min is 150% or more and 800%.
  • the following is preferable (Invention 10).
  • the thickness of the base film is preferably 20 ⁇ m or more and 600 ⁇ m or less (Invention 11).
  • the present invention provides a work processing sheet comprising the base film of the above inventions (Inventions 1 to 12) and an adhesive layer laminated on one side of the base film. (Invention 13).
  • the base film according to the present invention has excellent flexibility that enables good expansion. Further, the work processing sheet according to the present invention can be expanded well.
  • the base film according to the present embodiment is made of a material containing a polyester resin having an alicyclic structure and an elastomer other than the polyester resin.
  • the base film according to the present embodiment has very excellent flexibility because it is made of the above materials.
  • the base film according to the present embodiment has excellent extensibility by further combining an elastomer with the polyester resin which can exhibit flexibility by itself. Therefore, when the base film according to the present embodiment is used as the base film of the semiconductor processing sheet, the semiconductor processing sheet can be expanded satisfactorily. Along with this, in the subsequent pickup process, it becomes easier to push up the chip from the back surface, and good pickup becomes possible.
  • a work processing sheet used for processing a work such as a semiconductor wafer. It is preferably used as a base material, and in particular, it is preferably used as a base material for a dicing sheet used for dicing a work.
  • the base film according to the present embodiment is made of a material containing a polyester resin having an alicyclic structure, a rotating round blade is used in the work processing sheet constructed by using the base film.
  • a rotating round blade is used in the work processing sheet constructed by using the base film.
  • Such a cutting chip suppressing effect is exhibited without irradiating the base film according to the present embodiment with radiation such as electron beam or ⁇ ray. Therefore, according to the base film according to the present embodiment, it is possible to manufacture a work processing sheet at a low manufacturing cost as compared with a conventional base film manufactured by a method including a radiation irradiation step. can.
  • the base film according to the present embodiment using the polyester resin as a material also has good transparency, the work can be visually inspected and inspected through the work processing sheet provided with the base film. It will be easy.
  • the base film according to the present embodiment is made of a material containing a polyester resin having an alicyclic structure and an elastomer other than the polyester resin.
  • Polyester resin The specific composition of the polyester resin is not particularly limited as long as it has an alicyclic structure.
  • the alicyclic structure of the polyester resin preferably has 6 or more carbon atoms constituting the ring.
  • the carbon number is preferably 14 or less, and particularly preferably 10 or less.
  • the number of carbon atoms is preferably 6.
  • the alicyclic structure may be a monocyclic type composed of one ring, a bicyclic type composed of two rings, or a structure composed of three or more rings.
  • the polyester resin preferably contains a dicarboxylic acid having an alicyclic structure as a monomer unit constituting the polyester resin.
  • the polyester resin preferably contains a diol having an alicyclic structure as a monomer unit constituting the polyester resin.
  • the polyester resin is a dicarboxylic acid and diol from the viewpoint of facilitating better flexibility. It is preferable to include both.
  • the structure of the dicarboxylic acid described above is not particularly limited as long as it has an alicyclic structure and two carboxy groups.
  • the dicarboxylic acid may have a structure in which two carboxy groups are bonded to the alicyclic structure, and an alkyl group or the like is further inserted between the alicyclic structure and the carboxy group. It may be.
  • Preferred examples of such a dicarboxylic acid are 1,2-cyclohexanedicarboxylic acid, 1,3-cyclohexanedicarboxylic acid, 1,4-cyclohexanedicarboxylic acid, 1,4-decahydronaphthalenedicarboxylic acid, and 1,5-deca.
  • Examples thereof include hydronaphthalenedicarboxylic acid, 2,6-decahydronaphthalenedicarboxylic acid and 2,7-decahydronaphthalenedicarboxylic acid, and among these, 1,4-cyclohexanedicarboxylic acid is preferably used.
  • These dicarboxylic acids may be derivatives such as alkyl esters.
  • Such an alkyl ester derivative may be, for example, an alkyl ester having 1 or more and 10 or less carbon atoms. More specific examples include dimethyl ester, diethyl ester and the like, and dimethyl ester is particularly preferable.
  • the ratio of the dicarboxylic acid monomer to all the monomer units constituting the polyester resin is 20 mol% or more. It is preferably 25 mol% or more, particularly preferably 30 mol% or more, and further preferably 35 mol% or more. The ratio is preferably 60 mol% or less, more preferably 55 mol% or less, particularly preferably 50 mol% or less, and further preferably 45 mol% or less. Within these ranges, the base film according to the present embodiment tends to have more excellent flexibility.
  • the dicarboxylic acid having an alicyclic structure is relative to the entire dicarboxylic acid having a ring structure constituting the polyester resin.
  • the ratio of the acid is preferably 60% or more, more preferably 70% or more, particularly preferably 80% or more, and further preferably 90% or more.
  • the upper limit of the ratio is not particularly limited, and may be 100% or less, for example.
  • the dicarboxylic acid having a ring structure includes a dicarboxylic acid having an alicyclic structure, a dicarboxylic acid having an aromatic ring structure, and the like.
  • the structure of the diol described above is not particularly limited as long as it has an alicyclic structure and two hydroxy groups.
  • the diol may have a structure in which two hydroxy groups are bonded to the alicyclic structure, and a structure in which an alkyl group or the like is further inserted between the alicyclic structure and the hydroxy group.
  • Preferred examples of such diols are 1,2-cyclohexanedimethanol (particularly 1,2-cyclohexanedimethanol), 1,3-cyclohexanedimethanol (particularly 1,3-cyclohexanedimethanol), and 1,4-cyclohexanedimethanol.
  • 1,4-cyclohexanedimethanol 2,2-bis- (4-hydroxycyclohexyl) -propane and the like can be mentioned, and among these, 1,4-cyclohexanedimethanol is preferably used.
  • the ratio of the diol monomer to all the monomer units constituting the polyester resin is 35 mol% or more. It is preferably 40 mol% or more, more preferably 45 mol% or more. The ratio is preferably 65 mol% or less, particularly preferably 60 mol% or less, and further preferably 55 mol% or less. Within these ranges, the base film according to the present embodiment tends to have more excellent flexibility.
  • the polyester resin in the present embodiment contains dimer acid obtained by dimerizing unsaturated fatty acids as a monomer unit constituting the polyester resin from the viewpoint that the base film tends to have more excellent flexibility.
  • the number of carbon atoms of the unsaturated fatty acid is preferably 10 or more, and particularly preferably 15 or more.
  • the number of carbon atoms is preferably 30 or less, and particularly preferably 25 or less.
  • dimer acids include unsaturated fatty acids having 22 carbon atoms such as dicarboxylic acid having 36 carbon atoms and erucic acid obtained by dimerizing unsaturated fatty acids having 18 carbon atoms such as oleic acid and linoleic acid.
  • Examples thereof include a dicarboxylic acid having 44 carbon atoms obtained by dimerization.
  • a small amount of trimer acid obtained by quantifying the above-mentioned unsaturated fatty acid may also be generated.
  • the polyester resin in the present embodiment may contain such a trimer acid together with the above dimer acid.
  • the ratio of the dimeric acid to all the dicarboxylic acid units constituting the polyester resin may be 2 mol% or more. It is preferable, in particular, it is preferably 5 mol% or more, and further preferably 10 mol% or more. The ratio is preferably 25 mol% or less, particularly preferably 23 mol% or less, and further preferably 20 mol% or less. Within these ranges, the polyester resin tends to have the desired flexibility, and as a result, the base film according to the present embodiment tends to have more excellent flexibility.
  • the polyester resin in the present embodiment may contain a monomer other than the above-mentioned dicarboxylic acid, diol and dimer acid as the monomer unit constituting the polyester resin.
  • monomers are aliphatic dicarboxylic acids such as succinic acid, glutaric acid, adipic acid, pimelli acid, suberic acid, azelaic acid, sebacic acid; phthalic acid, terephthalic acid, isophthalic acid, 2,6-naphthalene.
  • aromatic dicarboxylic acids such as dicarboxylic acid, 1,4-naphthalenedicarboxylic acid and 4,4'-diphenyldicarboxylic acid.
  • a diol component other than the diol having an alicyclic structure may be contained.
  • ethylene glycol, propylene glycol, butanediol, hexanediol, octanediol, decanediol; ethylene oxide adducts such as bisphenol A and bisphenol S; trimethylol propane and the like may be contained.
  • the monomer having an alicyclic structure (the above-mentioned dicarboxylic acid having an alicyclic structure or the diol having an alicyclic structure) is used. It is preferably contained in a larger amount than the monomer having an aromatic ring structure.
  • the molar ratio of the monomer unit having an aromatic ring structure to the monomer unit having an alicyclic structure is preferably less than 1, preferably 0.5 or less. More preferably, it is more preferably 0.2 or less, more preferably 0.1 or less, more preferably 0.05 or less, still more preferably 0.03 or less, and 0. It is more preferably 0.01 or less, particularly preferably 0.005 or less, further preferably 0.001 or less, and most preferably 0.
  • the heat of fusion measured at a heating rate of 20 ° C./min by differential scanning calorimetry is preferably 2 J / g or more, and more preferably 5 J / g or more. In particular, it is preferably 10 J / g or more, and more preferably 15 J / g or more.
  • the heat of fusion is preferably 150 J / g or less, more preferably 100 J / g or less, particularly preferably 70 J / g or less, and further preferably 50 J / g or less.
  • the base film according to the present embodiment tends to have more excellent flexibility.
  • the details of the above-mentioned method for measuring the amount of heat of fusion are as described in the column of Examples described later.
  • the method for producing the polyester resin in the present embodiment is not particularly limited, and the polyester resin can be obtained by polymerizing the above-mentioned monomer components using a known catalyst.
  • the content of the polyester resin in the material constituting the base film according to the present embodiment is preferably 55% by mass or more, particularly preferably 60% by mass or more, and further preferably 65% by mass or more. Is preferable.
  • the content is preferably 96% by mass or less, particularly preferably 94% by mass or less, and further preferably 92% by mass or less.
  • the elastomer in the present embodiment is not particularly limited, and may be a thermosetting elastomer or a thermoplastic elastomer, but the base film according to the present embodiment is more excellent in flexibility.
  • a thermoplastic elastomer is preferable from the viewpoint of easily having a property.
  • thermoplastic elastomer is not particularly limited, and for example, a styrene-based elastomer, an acrylic-based elastomer, a urethane-based elastomer, an olefin-based elastomer, a polyester-based elastomer, a silicone-based elastomer, or the like can be used. These may be used alone or in combination of two or more.
  • a styrene-based elastomer from the viewpoint of easily having more excellent flexibility, it is preferable to use at least one of a styrene-based elastomer, an acrylic-based elastomer, a urethane-based elastomer, and an olefin-based elastomer, and in particular, a styrene-based elastomer. It is preferable to use at least one of an acrylic elastomer and a urethane elastomer, and further preferably a styrene elastomer. Further, from the viewpoint that the physical properties of the base film can be easily adjusted to a desired range, it is preferable to use a urethane-based elastomer.
  • the "styrene-based elastomer” is a copolymer containing a structural unit derived from styrene or a derivative thereof (styrene-based compound), has rubber-like elasticity in a temperature range including room temperature, and has heat. It means a material having plasticity.
  • styrene-based elastomer examples include a styrene-conjugated diene copolymer and a styrene-olefin copolymer.
  • Specific examples of the styrene / conjugated diene copolymer include a styrene / butadiene copolymer, a styrene / butadiene / styrene copolymer (SBS), a styrene / butadiene / butylene / styrene copolymer, and a styrene / isoprene copolymer.
  • Unhydrogenated styrene / conjugated diene copolymer such as styrene / isoprene / styrene copolymer (SIS), styrene / ethylene / isoprene / styrene copolymer; styrene / ethylene / propylene / styrene copolymer (SEPS), styrene •
  • SEPS styrene •
  • hydrogenated styrene / conjugated diene copolymers such as ethylene / butylene / styrene copolymer (SEBS). These may be used alone or in combination of two or more.
  • styrene-based elastomers a styrene-conjugated diene copolymer is preferable, and a hydrogenated styrene-conjugated diene copolymer is preferable, and further, styrene-ethylene / It is preferable to use a butylene / styrene copolymer.
  • the styrene content in the copolymer is preferably 3% by mass or more, particularly preferably 5% by mass or more, and further 10% by mass. It is preferably%.
  • the styrene content is preferably 60% by mass or less, particularly preferably 50% by mass or less, and further preferably 40% by mass or less.
  • the "acrylic elastomer” is a copolymer containing a structural unit derived from acrylic acid or a derivative thereof (acrylic compound), has rubber-like elasticity in a temperature range including normal temperature, and has rubber-like elasticity. It means a material having thermoplasticity.
  • acrylic elastomers include (meth) acrylic acid-based diblock copolymers and (meth) acrylic acid-based triblock copolymers.
  • the copolymer is formed from polymethyl methacrylate (PMMA) on one or both ends of a relatively soft segment (soft segment) composed of butyl polyacrylate (PBA) or -2-ethylhexyl polyacrylate (2EHA). It has a structure in which relatively hard and pseudo-crosslinkable segments (hard segments) are connected.
  • PMMA polymethyl methacrylate
  • PBA butyl polyacrylate
  • 2EHA -2-ethylhexyl polyacrylate
  • a (meth) acrylic acid-based triblock copolymer is preferable from the viewpoint of film strength.
  • Examples of the above (meth) acrylate-based triblock copolymer are polymethylmethacrylate (PMMA) -butylpolyacrylate (PBA) -methylmethylmethacrylate (PMMA), polymethylmethacrylate (PMMA) -poly. Examples thereof include -2-ethylhexyl acrylate-polymethyl methacrylate (PMMA).
  • the ratio of methyl methacrylate monomer to all the monomers constituting the copolymer (MMA ratio). Is preferably 10% by weight or more, particularly preferably 20% by weight or more, and further preferably 30% by weight or more.
  • the MMA ratio is preferably 80% by weight or less, particularly preferably 70% by weight or less, and further preferably 60% by weight or less.
  • the "urethane-based elastomer” is a copolymer containing a structural unit derived from a urethane compound or a derivative thereof (urethane-based compound), has rubber-like elasticity in a temperature range including room temperature, and has rubber-like elasticity. It means a material having thermoplasticity.
  • the urethane-based elastomer is generally obtained by reacting a long-chain polyol, a chain extender and a polyisocyanate, and has a soft segment having a constituent unit derived from the long-chain polyol, a chain extender and a poly. It consists of a hard segment having a polyurethane structure obtained from the reaction with isocyanate.
  • Urethane-based elastomers are classified into polyester-based polyurethane elastomers, polyether-based polyurethane elastomers, polycarbonate-based polyurethane elastomers, etc. according to the type of long-chain polyol used as the soft segment component thereof.
  • long-chain polyol examples include polyester polyols such as lactone-based polyester polyols and adipate-based polyester polyols; polyether polyols such as polypropylene (ethylene) polyols and polytetramethylene ether glycols; and polycarbonate polyols.
  • polyester polyols such as lactone-based polyester polyols and adipate-based polyester polyols
  • polyether polyols such as polypropylene (ethylene) polyols and polytetramethylene ether glycols
  • polycarbonate polyols examples include polycarbonate polyols.
  • polyisocyanate examples include 2,4-toluene diisocyanate, 2,6-toluene diisocyanate, 4,4'-diphenylmethane diisocyanate, hexamethylene diisocyanate and the like.
  • chain extender examples include low molecular weight polyhydric alcohols such as 1,4-butanediol and 1,6-hexanediol, and aromatic diamines.
  • the "olefin-based elastomer” is a copolymer containing a structural unit derived from an olefin or a derivative thereof (olefin-based compound), has rubber-like elasticity in a temperature range including room temperature, and has heat. It means a material having plasticity.
  • olefin-based elastomers examples include ethylene / ⁇ -olefin copolymers, propylene / ⁇ -olefin copolymers, butene / ⁇ -olefin copolymers, ethylene / propylene / ⁇ -olefin copolymers, and ethylene / butene / ⁇ -.
  • olefin-based elastomers include ethylene / ⁇ -olefin copolymers, propylene / ⁇ -olefin copolymers, butene / ⁇ -olefin copolymers, ethylene / propylene / butene / ⁇ -olefin copolymers.
  • the content of the elastomer in the material constituting the base film according to the present embodiment is preferably 4% by mass or more, particularly preferably 6% by mass or more, and further preferably 8% by mass or more. Is preferable.
  • the content of the elastomer in the material is 4% by mass or more, the base film formed by using the material tends to have better flexibility.
  • the content is preferably 45% by mass or less, particularly preferably 40% by mass or less, and further preferably 35% by mass or less.
  • the content of the elastomer in the material is 45% by mass or less, it becomes easy to form a base film using the material, and it becomes easy to achieve a more excellent cutting piece suppressing effect.
  • the material for producing the base film according to the present embodiment may contain other components other than the polyester resin and the elastomer described above.
  • the material may contain components used in the base film of a general work processing sheet.
  • Such components include various additives such as flame retardants, plasticizers, lubricants, antioxidants, colorants, infrared absorbers, ultraviolet absorbers, and ion scavengers.
  • the content of these additives is not particularly limited, but is preferably in the range in which the base film exhibits a desired function.
  • a layer made of the above-mentioned polyester resin and elastomer-containing material (hereinafter, may be referred to as “resin layer A”) is used. As long as it is provided, it may be a single layer or a plurality of layers. From the viewpoint of reducing the production cost, the base film in the present embodiment is preferably a single layer (resin layer A only). On the other hand, in the case of forming a plurality of layers, a plurality of resin layers A may be laminated, or the resin layer A and other layers may be laminated.
  • the surface of the base film on which the pressure-sensitive adhesive layer is laminated may be subjected to surface treatment such as primer treatment, corona treatment, plasma treatment, etc. in order to improve the adhesion to the pressure-sensitive adhesive layer.
  • the tensile elastic modulus of the base film in the present embodiment measured in an environment of 23 ° C. and a tensile speed of 200 mm / min is preferably 800 MPa or less. In particular, it is preferably 600 MPa or less, and more preferably 500 MPa or less. When the tensile elastic modulus is 800 MPa or less, the base film according to the present embodiment tends to have better flexibility.
  • the tensile elastic modulus is preferably 50 MPa or more, more preferably 100 MPa or more, particularly preferably 150 MPa or more, further preferably 200 MPa or more, and further preferably 250 MPa or more. It is more preferable, and it is most preferable that it is 300 MPa or more.
  • the base film according to the present embodiment tends to have appropriate strength, and the work processing sheet provided with the base film has good handleability. At the same time, it becomes easy to perform the desired work processing satisfactorily.
  • the tensile elastic modulus of the base film of the present embodiment measured in an environment of 23 ° C. and at a tensile speed of 406 mm / min is preferably 800 MPa or less, and particularly 600 MPa or less. Is preferable, and more preferably 500 MPa or less. When the tensile elastic modulus is 800 MPa or less, the base film according to the present embodiment tends to have better flexibility.
  • the tensile elastic modulus is preferably 50 MPa or more, more preferably 100 MPa or more, particularly preferably 150 MPa or more, further preferably 200 MPa or more, and further preferably 250 MPa or more. It is more preferable, and it is most preferable that it is 300 MPa or more.
  • the base film according to the present embodiment tends to have appropriate strength, and the work processing sheet provided with the base film has good handleability. At the same time, it becomes easy to perform the desired work processing satisfactorily.
  • the tensile speed of 406 mm / min represents a value obtained by converting the strain rate of the work processing sheet under normal expanding conditions into a tensile speed.
  • the breaking point stress of the base film in the present embodiment measured when a tensile test is performed in an environment of 23 ° C. and a tensile speed of 200 mm / min is preferably 60 MPa or less, and particularly 50 MPa or less. Is preferable, and more preferably 40 MPa or less. When the breaking point stress is 60 MPa or less, the base film according to the present embodiment has better workability.
  • the breaking point stress is preferably 5 MPa or more, more preferably 10 MPa or more, particularly preferably 15 MPa or more, further preferably 20 MPa or more, and preferably 25 MPa or more. Most preferred.
  • the base film according to the present embodiment tends to have appropriate strength, and the work processing sheet provided with the base film has good handleability. At the same time, it becomes easy to perform the desired work processing satisfactorily. Further, when the breaking point stress is 15 MPa or more, the base film according to the present embodiment has good expandability.
  • the breaking point stress of the base film in the present embodiment measured when a tensile test is performed in an environment of 23 ° C. and a tensile speed of 406 mm / min is preferably 60 MPa or less, and particularly 50 MPa or less. Is preferable, and more preferably 40 MPa or less.
  • the breaking point stress is 60 MPa or less, the base film according to the present embodiment has better workability.
  • the breaking point stress is preferably 5 MPa or more, particularly preferably 10 MPa or more, further preferably 15 MPa or more, preferably 20 MPa or more, and preferably 25 MPa or more. ..
  • the base film according to the present embodiment tends to have appropriate strength, and the work processing sheet provided with the base film has good handleability. At the same time, it becomes easy to perform the desired work processing satisfactorily. Further, when the breaking point stress is 5 MPa or more, the base film according to the present embodiment has good expandability.
  • the elongation at break measured when the substrate film in the present embodiment is subjected to a tensile test in an environment of 23 ° C. and a tensile speed of 200 mm / min is preferably 150% or more, preferably 200% or more. More preferably, it is particularly preferably 250% or more, further preferably 300% or more, and most preferably 350% or more.
  • breaking elongation is 200% or more
  • the base film in the present embodiment tends to have the desired extensibility, and the work processing sheet provided with the base film has excellent expandability and pick-up property. Will be easy to realize.
  • the elongation at break is preferably 800% or less, more preferably 700% or less, particularly preferably 600% or less, and further preferably 500% or less.
  • breaking elongation is 800% or less, the processability of the base film becomes more excellent, and it becomes easy to manufacture a desired work processing sheet.
  • the elongation at break measured by the substrate film in the present embodiment in an environment of 23 ° C. and at a tensile speed of 406 mm / min is preferably 150% or more, particularly 200% or more. It is preferably 250% or more, preferably 300% or more, and preferably 350% or more.
  • the breaking elongation is 150% or more, the base film in the present embodiment tends to have the desired extensibility, and the work processing sheet provided with the base film has excellent expandability and pick-up property. Will be easy to realize.
  • the elongation at break is preferably 800% or less, particularly preferably 700% or less, further preferably 600% or less, and preferably 500% or less. When the breaking elongation is 800% or less, the processability of the base film becomes more excellent, and it becomes easy to manufacture a desired work processing sheet.
  • the thickness of the base film according to the present embodiment is preferably 20 ⁇ m or more, particularly preferably 40 ⁇ m or more, and further preferably 60 ⁇ m or more.
  • the thickness of the base film is preferably 600 ⁇ m or less, particularly preferably 300 ⁇ m or less, and further preferably 200 ⁇ m or less.
  • the work processing sheet provided with the base film tends to have appropriate strength, and it is easy to satisfactorily support the work fixed on the work processing sheet. It becomes a thing. As a result, it is possible to effectively suppress the occurrence of chipping during dicing.
  • the thickness of the base film is 600 ⁇ m or less, the above-mentioned elongation at break can be easily achieved. Further, when the thickness of the base film is 600 ⁇ m or less, the base film has better processability.
  • the method for producing a base film according to the present embodiment is not particularly limited as long as the above-mentioned material containing the polyester resin and elastomer is used, and for example, the T-die method, the round die method, or the like is melted.
  • Extrusion method; calendar method; solution method such as dry method and wet method can be used. Among these, it is preferable to adopt the melt extrusion method or the calendar method from the viewpoint of efficiently producing the base material.
  • the material of the base film (the material containing the polyester resin and the elastomer described above) is kneaded, and pellets are produced directly from the obtained kneaded product or once. Then, a film may be formed using a known extruder.
  • a base film composed of a plurality of layers is produced by a melt extrusion method
  • the components constituting each layer are kneaded, and pellets are produced directly from the obtained kneaded product or once pellets are produced, and then a known extruder is used. Then, a plurality of layers may be extruded at the same time to form a film.
  • the work processing sheet according to the present embodiment includes the above-mentioned base film and an adhesive layer laminated on one side of the base film.
  • Adhesive layer As the adhesive constituting the pressure-sensitive adhesive layer, it shall exhibit sufficient adhesive strength to the adherend (particularly, adhesive strength against the work that is sufficient for processing the work). Is not particularly limited as long as possible.
  • the pressure-sensitive adhesive constituting the pressure-sensitive adhesive layer include acrylic pressure-sensitive adhesive, rubber-based pressure-sensitive adhesive, silicone-based pressure-sensitive adhesive, urethane-based pressure-sensitive adhesive, polyester-based pressure-sensitive adhesive, polyvinyl ether-based pressure-sensitive adhesive, and the like. Among these, it is preferable to use an acrylic pressure-sensitive adhesive from the viewpoint of easily exerting a desired adhesive strength.
  • the pressure-sensitive adhesive constituting the pressure-sensitive adhesive layer in the present embodiment may be a pressure-sensitive adhesive having no active energy ray-curable property, a pressure-sensitive adhesive having active energy ray-curable property (hereinafter, "active energy ray-curable pressure-sensitive adhesive”). It may be referred to as “agent”). Since the pressure-sensitive adhesive layer is composed of an active energy ray-curable pressure-sensitive adhesive, the pressure-sensitive adhesive layer is cured by irradiation with active energy rays, and the adhesive force of the work processing sheet to the adherend can be easily reduced. Can be done. In particular, irradiation with active energy rays makes it possible to easily separate the processed work from the pressure-sensitive adhesive sheet.
  • the active energy ray-curable pressure-sensitive adhesive constituting the pressure-sensitive adhesive layer may be mainly composed of a polymer having active energy ray-curable property, or an active energy ray-curable polymer (active energy ray-curable).
  • the main component may be a mixture of a monomer having at least one active energy ray-curable group and / or an oligomer.
  • the polymer having active energy ray curability is a (meth) acrylic acid ester polymer in which a functional group having active energy ray curability (active energy ray curable group) is introduced into the side chain (hereinafter, "active energy ray curable”). It may be referred to as “polymer”).
  • This active energy ray-curable polymer is obtained by reacting an acrylic copolymer having a functional group-containing monomer unit with an unsaturated group-containing compound having a functional group bonded to the functional group. Is preferable.
  • (meth) acrylic acid means both acrylic acid and methacrylic acid. The same applies to other similar terms.
  • the concept of "polymer” shall also be included in “polymer”.
  • the weight average molecular weight of the active energy ray-curable polymer is preferably 10,000 or more, particularly preferably 150,000 or more, and further preferably 200,000 or more.
  • the weight average molecular weight is preferably 2.5 million or less, particularly preferably 2 million or less, and further preferably 1.5 million or less.
  • the weight average molecular weight (Mw) in the present specification is a standard polystyrene-equivalent value measured by a gel permeation chromatography method (GPC method).
  • the active energy ray-curable pressure-sensitive adhesive contains a mixture of an active energy ray-curable polymer component and a monomer and / or an oligomer having at least one active energy ray-curable group as a main component
  • the activity is concerned.
  • the energy ray non-curable polymer component for example, the acrylic copolymer before the reaction of the unsaturated group-containing compound can be used.
  • the active energy ray-curable monomer and / or oligomer for example, an ester of a polyhydric alcohol and (meth) acrylic acid can be used.
  • the weight average molecular weight of the acrylic polymer as the active energy ray non-curable polymer component is preferably 10,000 or more, particularly preferably 150,000 or more, and further preferably 200,000 or more. ..
  • the weight average molecular weight is preferably 2.5 million or less, particularly preferably 2 million or more, and further preferably 1.5 million or less.
  • the active energy rays When ultraviolet rays are used as the active energy rays for curing the active energy ray-curable pressure-sensitive adhesive, it is preferable to add a photopolymerization initiator to the pressure-sensitive adhesive. Further, an active energy ray non-curable polymer component or an oligomer component, a cross-linking agent or the like may be added to the pressure-sensitive adhesive.
  • the thickness of the pressure-sensitive adhesive layer in the present embodiment is preferably 1 ⁇ m or more, particularly preferably 2 ⁇ m or more, and further preferably 3 ⁇ m or more.
  • the thickness of the pressure-sensitive adhesive layer is preferably 50 ⁇ m or less, particularly preferably 40 ⁇ m or less, and further preferably 30 ⁇ m or less.
  • the thickness of the pressure-sensitive adhesive layer is 1 ⁇ m or more, the work processing sheet according to the present embodiment can easily exhibit the desired adhesiveness. Further, when the thickness of the pressure-sensitive adhesive layer is 50 ⁇ m or less, it becomes easy to separate the adherend from the cured pressure-sensitive adhesive layer.
  • the configuration of the release sheet is arbitrary, and an example is one in which a plastic film is peeled off with a release agent or the like.
  • the plastic film include polyester films such as polyethylene terephthalate, polybutylene terephthalate, and polyethylene naphthalate; and polyolefin films such as polypropylene and polyethylene.
  • the release agent a silicone type, a fluorine type, a long chain alkyl type or the like can be used, and among these, a silicone type which can obtain stable performance at a low cost is preferable.
  • the thickness of the release sheet is not particularly limited, and may be, for example, 20 ⁇ m or more and 250 ⁇ m or less.
  • the adhesive layer may be laminated on the surface of the pressure-sensitive adhesive layer opposite to the base film.
  • the work processing sheet according to the present embodiment can be used as a dicing / die bonding sheet.
  • a work is attached to the surface of the adhesive layer opposite to the pressure-sensitive adhesive layer, and the adhesive layer is diced together with the work to obtain a chip in which individualized adhesive layers are laminated. be able to.
  • the individualized adhesive layer allows the chip to be easily fixed to the object on which the chip is mounted.
  • thermosetting adhesive component As the material constituting the adhesive layer described above, a material containing a thermoplastic resin and a low molecular weight thermosetting adhesive component, a material containing a B stage (semi-curable) thermosetting adhesive component, and the like are used. It is preferable to use it.
  • a protective film forming layer may be laminated on the adhesive surface of the adhesive layer.
  • the work processing sheet according to the present embodiment can be used as a protective film forming and dicing sheet.
  • a work is attached to the surface of the protective film forming layer opposite to the adhesive layer, and the protective film forming layer is diced together with the work, whereby the individualized protective film forming layer is laminated.
  • a protective film forming layer is usually laminated on a surface opposite to the surface on which the circuit is formed.
  • the individualized protective film forming layer is cured at a predetermined timing to form a protective film having sufficient durability on the chip.
  • the protective film forming layer is preferably made of an uncured curable adhesive.
  • the manufacturing method of the work processing sheet according to the present embodiment is not particularly limited. For example, it is preferable to obtain a work processing sheet by forming a pressure-sensitive adhesive layer on the release sheet and then laminating one side of the base film on the surface of the pressure-sensitive adhesive layer opposite to the release sheet.
  • the above-mentioned adhesive layer can be formed by a known method.
  • a tacky composition for forming a pressure-sensitive adhesive layer and, if desired, a coating solution further containing a solvent or dispersion medium are prepared.
  • the coating liquid is applied to the peelable surface of the release sheet (hereinafter, may be referred to as "peeling surface").
  • peeling surface the peelable surface of the release sheet
  • the pressure-sensitive adhesive layer can be formed by drying the obtained coating film.
  • the above-mentioned coating liquid can be applied by a known method, for example, a bar coating method, a knife coating method, a roll coating method, a blade coating method, a die coating method, a gravure coating method, or the like.
  • the properties of the coating liquid are not particularly limited as long as it can be coated, and the coating liquid may contain a component for forming the pressure-sensitive adhesive layer as a solute or a dispersoid. ..
  • the release sheet may be peeled off as a process material, or the adhesive layer may be protected until it is attached to the adherend.
  • the adhesive composition for forming the adhesive layer contains the above-mentioned cross-linking agent
  • it is applied by changing the above-mentioned drying conditions (temperature, time, etc.) or by separately providing a heat treatment. It is preferable to proceed the cross-linking reaction between the polymer component in the film and the cross-linking agent to form a cross-linked structure in the pressure-sensitive adhesive layer at a desired abundance density. Further, in order to allow the above-mentioned cross-linking reaction to proceed sufficiently, after the pressure-sensitive adhesive layer and the base material are bonded together, curing may be carried out, for example, allowing the adhesive layer to stand in an environment at 23 ° C. and a relative humidity of 50% for several days. ..
  • the work processing sheet according to the present embodiment can be used for processing a work such as a semiconductor wafer.
  • a work such as a semiconductor wafer.
  • the work can be processed on the work processing sheet.
  • the work processing sheet according to the present embodiment can be used as a work processing sheet such as a back grind sheet, a dicing sheet, an expanding sheet, and a pickup sheet.
  • the work include semiconductor members such as semiconductor wafers and semiconductor packages, and glass members such as glass plates.
  • the work processing sheet according to the present embodiment can be expanded well because the base film has good flexibility. Therefore, the work processing sheet according to the present embodiment is particularly suitable for use as a dicing sheet, an expanding sheet, or a pickup sheet.
  • the work processing sheet according to the present embodiment includes the adhesive layer described above, the work processing sheet can be used as a dicing / die bonding sheet. Further, when the work processing sheet according to the present embodiment includes the above-mentioned protective film forming layer, the work processing sheet can be used as a protective film forming and dicing sheet.
  • the pressure-sensitive adhesive layer in the work processing sheet according to the present embodiment is composed of the above-mentioned active energy ray-curable pressure-sensitive adhesive
  • the following active energy rays are irradiated at the time of use. Is also preferable. That is, when the processing of the work is completed on the work processing sheet and the processed work is separated from the work processing sheet, the pressure-sensitive adhesive layer may be irradiated with active energy rays before the separation. preferable. As a result, the adhesive layer is cured, the adhesive force of the work processing sheet to the processed work is satisfactorily reduced, and the processed work can be easily separated.
  • Example 1 (1) Preparation of base film In a reactor equipped with a stirrer, a distillate tube and a decompression device, 12.90 kg of dimethyl 1,4-cyclohexanedicarboxylic acid (trans compound ratio 98%), 1,4-cyclohexanedi 11.47 kg of methanol, 0.3 kg of ethylene glycol, and 0.11 kg of an ethylene glycol solution containing 10% Mn acetate tetrahydrate were charged, heated to 200 ° C. under a nitrogen flow, and then elevated to 230 ° C. over 1 hour. It was warm.
  • a reactor equipped with a stirrer, a distillate tube and a decompression device 12.90 kg of dimethyl 1,4-cyclohexanedicarboxylic acid (trans compound ratio 98%), 1,4-cyclohexanedi 11.47 kg of methanol, 0.3 kg of ethylene glycol, and 0.11 kg of an ethylene glycol solution containing 10% Mn acetate tetra
  • SEBS styrene / ethylene / butylene / styrene copolymer
  • the pellets thus obtained were put into the hopper of a single-screw extruder equipped with a T-die. Then, under the conditions of a cylinder temperature of 220 ° C. and a die temperature of 220 ° C., the pellets are extruded from a T-die in a melt-kneaded state and cooled by a cooling roll to obtain a sheet-like base film having a thickness of 80 ⁇ m. Obtained.
  • the polyester resin contains about 50 mol% of 1,4-cyclohexanedimethanol, about 40.5 mol% of dimethyl 1,4-cyclohexanedicarboxylic acid, and a dimer derived from erucic acid as the monomers constituting the resin. It contained 9.5 mol% of acid. The ratio of the dimeric acid to the total dicarboxylic acid units constituting the polyester resin was 19.1 mol%. Further, the amount of heat of fusion of the polyester resin was measured by the method described later and found to be 20 J / g.
  • Adhesive Composition 95 parts by mass of n-butyl acrylate and 5 parts by mass of acrylic acid were polymerized by a solution polymerization method to obtain a (meth) acrylic acid ester polymer.
  • the weight average molecular weight (Mw) of this acrylic polymer was measured by the method described later and found to be 500,000.
  • Adhesive Layer A release sheet manufactured by Lintec Corporation, in which one side of a 38 ⁇ m-thick polyethylene terephthalate film is peeled off with a silicone-based release agent from the adhesive composition obtained in the above step (2). It was applied to the peeled surface of the product name "SP-PET38131"), and the obtained coating film was dried at 100 ° C. for 1 minute. As a result, a laminated body in which a pressure-sensitive adhesive layer having a thickness of 10 ⁇ m was formed on the peeled surface of the peeling sheet was obtained.
  • the heat of fusion of the polyester resin described above was measured using a differential scanning calorimeter (DSC, manufactured by TA Instruments, product name "DSC Q2000") according to JIS K 7121: 2012.
  • DSC differential scanning calorimeter
  • the above-mentioned weight average molecular weight (Mw) is a standard polystyrene-equivalent weight average molecular weight measured under the following conditions (GPC measurement) using gel permeation chromatography (GPC).
  • GPC measurement gel permeation chromatography
  • Example 2 In the step of preparing the base film, the base film was prepared in the same manner as in Example 1 except that the ratio of the mass number of parts of the dried polyester resin pellets to SEBS was changed to 80:20, and the base film was prepared. A work processing sheet was obtained in the same manner as in Example 1 using a material film.
  • Example 3 In the step of preparing the base film, the base film was prepared in the same manner as in Example 1 except that the ratio of the mass number of parts of the dried polyester resin pellets to SEBS was changed to 90:10, and the base film was prepared. A work processing sheet was obtained in the same manner as in Example 1 using a material film.
  • PMMA polymethacrylic acid
  • PBA polymethacrylate
  • PMMA polymethacrylic acid triblock copolymer as an acrylic elastomer
  • MFR flow rate
  • Example 5 Dried polyester resin pellets were obtained in the same manner as in step (1) of Example 1. 80 parts by mass of the pellet and 20 parts by mass of a thermoplastic polyurethane elastomer (manufactured by BASF Japan, product name "Elastollan ET164D") as a urethane-based elastomer were kneaded with a twin-screw kneader. The pellets thus obtained were put into the hopper of a single-screw extruder equipped with a T-die. Then, under the conditions of a cylinder temperature of 220 ° C.
  • a thermoplastic polyurethane elastomer manufactured by BASF Japan, product name "Elastollan ET164D"
  • the pellets are extruded from a T-die in a melt-kneaded state and cooled by a cooling roll to obtain a sheet-like base film having a thickness of 80 ⁇ m. Obtained.
  • a work processing sheet was obtained in the same manner as in Example 1 except that the base film was used.
  • the base film was prepared without using SEBS (the dried polyester resin pellet alone was put into the hopper of the single-screw extruder equipped with the T-die to prepare the base film.
  • a base film was prepared in the same manner as in Example 1, and a work processing sheet was obtained in the same manner as in Example 1 using the base film.
  • Test Example 1 Measurement of tensile properties of base film
  • the base film prepared in Examples and Comparative Examples was cut into 15 mm ⁇ 150 mm test pieces.
  • the side of 150 mm is parallel to the MD direction of the base film (flow direction at the time of manufacturing the base film), and the side of 15 mm is the TD direction of the base film (direction perpendicular to the MD direction). It was cut so that it would be parallel.
  • the tensile elastic modulus, the elongation at break and the stress at the breaking point were measured for the test piece in accordance with JIS K7127: 1999.
  • test piece is set to a distance between chucks of 100 mm with a tensile tester (manufactured by Shimadzu Corporation, product name "Autograph AG-Xplus 100N”), and then 200 mm / min in an environment of 23 ° C.
  • a tensile tester manufactured by Shimadzu Corporation, product name "Autograph AG-Xplus 100N”
  • MPa tensile elastic modulus
  • % elongation at break
  • MPa stress at the breaking point
  • a tensile test was performed in the same manner as above except that the tensile speed was changed to 406 mm / min, and the tensile elastic modulus (MPa), the elongation at break (%), and the stress at the breaking point (MPa) were measured. They are shown in Table 1 as a result relating to a tensile speed of 406 mm / min.
  • the work processing sheet to which the tip and ring frame obtained by dicing are attached is installed in the expanding device (manufactured by JCM, product name "ME-300B"), and the ring frame is set at a speed of 2 mm / sec. , The withdrawal was performed until the withdrawal amount became 40 mm.
  • the base film of the present invention can be suitably used as a base film constituting a work processing sheet used for processing a work such as a semiconductor wafer.

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  • Chemical & Material Sciences (AREA)
  • Engineering & Computer Science (AREA)
  • Chemical Kinetics & Catalysis (AREA)
  • Medicinal Chemistry (AREA)
  • Polymers & Plastics (AREA)
  • Organic Chemistry (AREA)
  • Health & Medical Sciences (AREA)
  • Condensed Matter Physics & Semiconductors (AREA)
  • Physics & Mathematics (AREA)
  • General Physics & Mathematics (AREA)
  • Manufacturing & Machinery (AREA)
  • Computer Hardware Design (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Power Engineering (AREA)
  • Dicing (AREA)
  • Adhesive Tapes (AREA)

Abstract

Un film de matériau de base est caractérisé en ce qu'il comprend un matériau comprenant une résine de polyester qui a une structure alicyclique et un élastomère autre que la résine de polyester. Le film de matériau de base a une excellente flexibilité permettant d'avoir une bonne extensibilité, et permet de fournir une feuille d'usinage de pièce à travailler qui a une bonne extensibilité.
PCT/JP2021/012779 2020-03-30 2021-03-26 Film de matériau de base, et feuille d'usinage de pièce à travailler Ceased WO2021200618A1 (fr)

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Citations (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2002012749A (ja) * 2000-06-29 2002-01-15 Kanebo Ltd ポリエステル樹脂組成物及びその用途
JP2011219563A (ja) * 2010-04-06 2011-11-04 Mitsubishi Chemicals Corp 脂環式ポリエステル系樹脂組成物及びその成形体
JP2016069600A (ja) * 2014-10-01 2016-05-09 大和製罐株式会社 ポリエステル樹脂組成物

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US5859119A (en) * 1997-09-15 1999-01-12 General Electric Company Reinforced aliphatic polyester molding composition having improved ductility/flow properties
US6136441A (en) * 1998-03-24 2000-10-24 General Electric Company Multilayer plastic articles
US20030030172A1 (en) * 2001-06-15 2003-02-13 Gabrie Hoogland Formed decorative film
US7169880B2 (en) * 2003-12-04 2007-01-30 Eastman Chemical Company Shaped articles from cycloaliphatic polyester compositions
JP2013194186A (ja) * 2012-03-21 2013-09-30 Nippon Shokubai Co Ltd 透明樹脂組成物、透明フィルムおよび画像表示装置
CN106832823B (zh) * 2017-03-20 2018-11-30 江苏裕兴薄膜科技股份有限公司 一种耐高温pet聚酯膜及其制备方法

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Publication number Priority date Publication date Assignee Title
JP2002012749A (ja) * 2000-06-29 2002-01-15 Kanebo Ltd ポリエステル樹脂組成物及びその用途
JP2011219563A (ja) * 2010-04-06 2011-11-04 Mitsubishi Chemicals Corp 脂環式ポリエステル系樹脂組成物及びその成形体
JP2016069600A (ja) * 2014-10-01 2016-05-09 大和製罐株式会社 ポリエステル樹脂組成物

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