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WO2021260931A1 - Douille de connexion électrique - Google Patents

Douille de connexion électrique Download PDF

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Publication number
WO2021260931A1
WO2021260931A1 PCT/JP2020/025303 JP2020025303W WO2021260931A1 WO 2021260931 A1 WO2021260931 A1 WO 2021260931A1 JP 2020025303 W JP2020025303 W JP 2020025303W WO 2021260931 A1 WO2021260931 A1 WO 2021260931A1
Authority
WO
WIPO (PCT)
Prior art keywords
terminal
lead
socket
lead portion
package
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Ceased
Application number
PCT/JP2020/025303
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English (en)
Japanese (ja)
Inventor
ルイ ツー ロー
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Enplas Corp
Original Assignee
Enplas Corp
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Enplas Corp filed Critical Enplas Corp
Priority to PCT/JP2020/025303 priority Critical patent/WO2021260931A1/fr
Publication of WO2021260931A1 publication Critical patent/WO2021260931A1/fr
Anticipated expiration legal-status Critical
Ceased legal-status Critical Current

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Classifications

    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L23/00—Details of semiconductor or other solid state devices
    • H01L23/48—Arrangements for conducting electric current to or from the solid state body in operation, e.g. leads, terminal arrangements ; Selection of materials therefor
    • H01L23/50—Arrangements for conducting electric current to or from the solid state body in operation, e.g. leads, terminal arrangements ; Selection of materials therefor for integrated circuit devices, e.g. power bus, number of leads
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01R—ELECTRICALLY-CONDUCTIVE CONNECTIONS; STRUCTURAL ASSOCIATIONS OF A PLURALITY OF MUTUALLY-INSULATED ELECTRICAL CONNECTING ELEMENTS; COUPLING DEVICES; CURRENT COLLECTORS
    • H01R33/00—Coupling devices specially adapted for supporting apparatus and having one part acting as a holder providing support and electrical connection via a counterpart which is structurally associated with the apparatus, e.g. lamp holders; Separate parts thereof
    • H01R33/74—Devices having four or more poles, e.g. holders for compact fluorescent lamps
    • H01R33/76—Holders with sockets, clips, or analogous contacts adapted for axially-sliding engagement with parallely-arranged pins, blades, or analogous contacts on counterpart, e.g. electronic tube socket

Definitions

  • the present invention relates to an electrical connection socket used for electrical connection of electrical components in a performance test or the like of an electric component such as an IC package that encloses an integrated circuit (IC: Integrated Circuit).
  • IC integrated circuit
  • sockets with multiple probe pins are used.
  • the socket is arranged on an inspection board, which is a board on the inspection device side, and is configured to accommodate an IC package to be inspected.
  • the terminal of the housed IC package and the terminal of the inspection board are electrically connected via a probe pin as a contact pin, and a test such as a continuity test is performed to inspect the performance of the IC package. do.
  • IC packages have different lead shapes for each package, and in particular, surface mount type (surface mount type) flat packages such as J lead type, gull wing type, and butt lead type are known.
  • surface mount type surface mount type
  • J lead type gull wing type
  • butt lead type a flat package
  • IC packages having leads having different shapes are known.
  • Patent Documents 1 and 2 a plurality of leads derived from one IC package are composed of gull-wing type leads and J-lead type leads having different shapes.
  • gull-wing type lead terminals and J-lead type lead terminals are alternately arranged around the outer periphery of the package body.
  • the present invention has been made in view of the above problems, and provides an electrical connection socket that is compactly formed even for electrical components having leads having different shapes and can be reliably connected to the electrical components. With the goal.
  • One aspect of the electrical connection socket according to the present invention is An electric component having a first lead portion protruding in a direction away from the outer peripheral portion of the main body of the electric component and a second lead portion protruding from the outer peripheral portion and having a tip portion arranged on the outer peripheral portion side.
  • the socket body to accommodate and A first terminal provided on the socket body and connected to the first lead portion, A second lead portion provided on the socket body, when the electrical component is housed in the socket body, approaches the second lead portion from the side of the second lead portion and comes into contact with the second lead portion. With terminals Have.
  • the socket for electrical connection according to the present invention, even an electric component having leads having different shapes can be compactly formed and can be reliably connected to the electrical component.
  • FIG. 3 is a cross-sectional view taken along the line AA of FIG.
  • FIG. 3 is a cross-sectional view taken along the line BB of FIG.
  • FIG. 3 is a cross-sectional view taken along the line CC of FIG.
  • It is a figure which shows the 1st terminal and the 2nd terminal in a normal state.
  • It is a perspective view which shows the open state which can accommodate an IC package of the electric connection socket which concerns on embodiment of this invention.
  • FIG. 1 is a perspective view showing a normal state of an electrical connection socket according to an embodiment of the present invention.
  • FIG. 2 is a perspective view showing an example of an IC package connected to the electrical connection socket according to the embodiment of the present invention.
  • FIG. 3 is a plan view of the electrical connection socket. 4 is a sectional view taken along line AA of FIG. 3,
  • FIG. 5 is a sectional view taken along line BB of FIG. 3, and
  • FIG. 6 is a sectional view taken along line CC of FIG.
  • the electrical connection socket 1 is a surface mount type socket, and as an example, an electrical component such as an IC package P (see FIG. 2) is electrically attached to an electrical component such as a circuit board. It is applied to the application of connecting and performing performance test of electric parts.
  • the electrical connection socket 1 also functions as an inspection socket. In this embodiment, a case where the electric connection socket 1 is applied to a performance test of an electric component such as an IC package P will be described as an example.
  • the electrical connection socket 1 is mounted on another electrical component (for example, a circuit board or the like, which is used for measuring electrical characteristics in a performance test), and is an IC package P or the like which is a target of a performance test. Electrical parts are installed.
  • another electrical component for example, a circuit board or the like, which is used for measuring electrical characteristics in a performance test
  • IC package P or the like which is a target of a performance test. Electrical parts are installed.
  • circuit board side will be referred to as the lower side (corresponding to the lower side in FIG. 1) and the IC package side will be referred to as the upper side (corresponding to the upper side in FIG. 1) when viewed from the electrical connection socket 1.
  • the most efficient method for maintaining the data transfer rate is to directly solder the electric component to be measured to the electric component used for measurement such as a circuit board.
  • the electrical connection socket 1 as in the present embodiment. The terminals of are electrically connected to each other.
  • the electrical connection socket 1 shown in FIG. 1 has an accommodating portion 12, a first terminal portion 20, and a second terminal portion 30.
  • the IC package P is housed in the housing part 12, and the first terminal part 20 is electrically connected to the first lead part 2 of the housed IC package P, and the second terminal part 30 Is electrically connected to the second lead portion 3.
  • the electrical connection socket 1 connects the first lead portion 2 and the second lead portion 3 of the IC package P to the terminals of the circuit board on which the electrical connection socket 1 is mounted, thereby connecting the IC package. Measure the performance of P.
  • the IC package P is, for example, a surface mount type IC package.
  • the IC package P has a plurality of lead portions having different shapes.
  • the package main body 4 is formed in a rectangular plate shape, and the first lead portion 2 and the second lead portion 3 are projected from the outer peripheral surface of the package main body 4.
  • the first lead portion 2 is provided so as to project outward from the outer peripheral surface of the package main body 4 at a predetermined interval.
  • the first lead portion 2 is provided on the package main body 4 so that the tip portion side extends in a direction perpendicular to the outer peripheral surface.
  • the first lead portion 2 comes into contact with the first terminal portion 20 of the electrical connection socket 1 by approaching (moving) from above.
  • the first lead portion 2 is, for example, a gull wing type lead (hereinafter referred to as “gull wing”).
  • the second lead portion 3 is provided on the outer peripheral surface so as to alternately project with the first lead at a predetermined interval in the circumferential direction.
  • the tip portion of the second lead portion 3 is arranged at a position different from that of the first lead portion 2.
  • the second lead portion 3 has a portion that comes into contact with the second terminal portion 30 in a direction different from the contact direction between the first lead portion 2 and the first terminal portion 20.
  • the second lead portion 3 contacts the second terminal portion 30 in a direction intersecting the contact direction between the first lead portion 2 and the first terminal portion 20, for example, in a direction orthogonal to each other.
  • the tip portion of the second lead portion 3 is provided so as to project downward and be arranged so as to be parallel to the outer peripheral surface, or to be located on the lower surface side of the IC package main body.
  • the second lead portion 3 is a J-shaped lead (hereinafter referred to as “J lead”) and has a shape extending from the outer peripheral surface and returning to the package main body 4 side.
  • the gull wing which is the first lead portion 2
  • the gull wing can be connected to the first terminal portion 20 on the side of the package main body 4.
  • the J-lead as the second lead portion 3 is formed so as to be in contact with the second terminal portion 30 in the vicinity of the side surface and the lower surface of the package main body 4.
  • the IC package P is housed in the electrical connection socket 1 of FIG. 1 and is electrically connected to the circuit board 114 on which the electrical connection socket 1 is mounted.
  • the circuit board is, for example, a PCB (Printed Circuit Board) board.
  • a circuit pattern for a signal path for generating a signal for performing a performance test of the IC package P and receiving and processing a signal from the IC package P, and a ground for supplying a ground voltage. A pattern or the like is formed.
  • a pad electrode connected to a circuit pattern for a signal path is formed in a state of being exposed from the surface of the circuit board.
  • the electrical connection socket 1 is attached to the circuit board, for example, by soldering bolts and nuts or the terminal portion of the socket.
  • the electrical connection socket 1 has a socket main body 10 having an accommodating portion 12 and a cover portion 40 movably attached to the socket main body 10 in the contact / separation direction.
  • the electrical connection socket 1 accommodates the IC package P mounted on the socket body 10
  • the first lead portion 2 and the second lead portion 3 of the IC package P are connected to the first terminal portion 20 and the second terminal portion 30. Will be done.
  • the electrical connection socket 1 transmits signals between the IC package P and the circuit board.
  • the socket body 10 is provided with a first terminal portion 20 and a second terminal portion 30 so as to surround the mounting portion 121.
  • the socket body 10 is formed in a cubic shape having a recess that opens upward in the central portion, for example.
  • the socket body 10 has a frame portion 110 that constitutes a mounting portion 121 on the upper surface surrounding the recess, and a core portion 120 that can move in the opening direction, that is, in the vertical direction in the recess of the frame portion 110.
  • the contact portions of the first terminal portion 20 are arranged on the outer peripheral portion side with a predetermined interval in the circumferential direction, and the contact portions of the second terminal portion 30 are arranged on the inner peripheral portion side with a predetermined interval in the circumferential direction. Are arranged.
  • a guide mechanism 130 for guiding the movement of the cover portion 40 is provided at the upper surface corner portion of the frame portion 110.
  • the guide mechanism 130 has a hole 132 provided at the corner of the upper surface, a pillar 134 sliding in the hole 132, and an urging member 136.
  • the pillar portion 134 is provided so as to project downward from the lower surface of the cover portion 40.
  • the tip portion of the pillar portion 134 is provided so as to engage with the upper end portion of the hole portion 132 so as not to come off upward.
  • the pillar portion 134 is provided so as to project from the cover portion 40 toward the frame portion 110.
  • the urging member 136 is a coil spring exteriorized on the pillar portion 134 so as to urge the cover portion 40 away from the socket body 10, that is, upward.
  • the cover portion 40 moves from the position shown in FIGS. 1 to 6 toward the socket body 10 side in a direction approaching against the urging force of the urging member 136, that is, downward.
  • the frame portion 110 is provided in the shape of a bottomed rectangular cylinder.
  • the frame portion 110 is formed in a rectangular frame shape surrounding the recess, and closes the frame-shaped wall portion 140 in which the first terminal portion 20 and the second terminal portion 30 are arranged and the opening on the bottom surface side of the frame-shaped wall portion 140. It has a lower portion of the frame-shaped wall portion 140 and a central bottom portion 150 constituting the bottom portion of the frame portion 110.
  • the frame-shaped wall portion 140 is arranged so that the contact portions of the first terminal portion 20 and the second terminal portion 30 are alternately arranged in the circumferential direction around the recess.
  • the frame-shaped wall portion 140 is provided with a communication hole through which the first terminal portion 20 and the second terminal portion 30 are inserted.
  • the communication hole is formed so as to communicate from the upper surface to the lower surface of the frame portion 110, specifically, the frame-shaped wall portion 140.
  • the first terminal portion 20 and the second terminal portion 30 are uniformly arranged in the corresponding through holes.
  • the second terminal portion 30 is arranged on the inner peripheral side of the frame-shaped wall portion 140, and the first terminal portion 20 is arranged on the outer peripheral side of the frame-shaped wall portion 140.
  • a core portion 120 is inserted through the central bottom portion 150, and a lever portion 50 that presses the core portion 120 from above is rotatably attached.
  • the lever portion 50 is provided so as to extend laterally from the center of the central bottom portion 150.
  • the lever portion 50 is arranged diagonally in the central bottom portion 150 having a rectangular shape in a plan view, and is rotated by the shaft portion 152 at the tip of the support portion protruding upward from the central bottom portion 150 at one end on the center side. It is fixed so that it can move freely.
  • the end portion on the outer side in the radial direction is the free end portion 54 and swings.
  • the core portion 120 moves the second terminal portion 30 to a position where it can be connected to the second lead portion 3 and a position where it is not connected by moving the inside of the frame portion 110 in the vertical direction.
  • the upper surface of the core portion 120 faces the lower surface of the IC package P.
  • the core portion 120 moves in the vertical direction due to the swing of the free end portion of the lever portion 50.
  • the core portion 120 is provided so as to be movable in the contacting / separating direction with respect to the central bottom portion 150 of the frame portion 110, and is provided from the central bottom portion 150 by the urging member 125. It is urged in the direction of separation.
  • the core portion 120 includes a pressing piece portion 126 that is pressed downward by a lever portion 50 (specifically, a lever movable action portion 44) rotatably provided in the recess in the frame portion 110, and a second terminal portion. It has a pressing protrusion 128 that displaces 30.
  • the pressing piece portion 126 is arranged so as to be able to be pressed downward by the swinging lever portion 50. When the pressing piece portion 126 is pressed by the lever portion 50, the core portion 120 moves downward.
  • the pressing convex portion 128 abuts the second terminal portion 30 on the second lead portion 3 or separates the second terminal portion 3 from the second lead portion 3.
  • the pressing convex portion 128 is provided so as to project laterally (horizontally outward) around the outer circumference of the core portion 120 on the outer circumference of the core portion 120.
  • the pressing convex portion 128 separates the pressed portion 342 of the second terminal portion 30 from the core portion 120 by moving the core portion 120 downward (mounting direction) and approaching the central bottom portion 150 which is the concave bottom portion. Press in the direction orthogonal to the vertical direction.
  • the contact portion 35 (contact piece 354) of the second terminal portion 30 is separated from the position where it comes into contact with the second lead portion 3.
  • the second terminal portion 30 can accept the connection with the second lead portion 3 of the IC package P mounted on the mounting portion 121 by moving the core portion 120 downward (as described above). Located in a connectable position).
  • the core portion 120 is pressed by the lever portion 50 that swings in conjunction with the approach of the cover portion 40 to the socket body 10, and moves the second terminal portion 30 to a position away from the connection position with the second lead portion 3. Let me.
  • the core portion 120 is provided with a through hole in the central portion, and the ground terminal portion 170 is inserted.
  • the ground terminal portion 170 is arranged so as to abut on the lower surface of the IC package P in the electrical connection socket 1 so that the IC package P is in contact with a ground electrode (for example, a pad electrode) formed on the circuit board 114. Has been done. This stabilizes the ground voltage of the IC package P. Further, the heat of the IC package can be dissipated to the circuit board 114 side by the ground terminal portion 170 coming into contact with the lower surface of the IC package P.
  • a ground electrode for example, a pad electrode
  • the ground terminal portion 170 is inserted into a through hole formed through the central portion of the core portion 120 and the central portion of each of the frame portions 110 (central bottom portion 150) in the vertical direction.
  • the ground terminal portion 170 has a shaft shape and is configured to be expandable and contractible in the extending direction.
  • a shaft-shaped terminal upper portion 172 and a terminal upper portion 172 that are fixed in an exposed state on the upper surface of the core portion 120 through which the core portion 120 is inserted are slidably inserted, and the lower end is a circuit board 114. It has a tubular terminal lower portion 174 and an urging member 176 which are connected through the above.
  • the upper part of the terminal 172 and the lower part of the terminal 174 are each conductive and made of metal. Further, the terminal upper portion 172 has a head portion 172a which is in contact with the IC package P on the upper surface and has a larger outer diameter than the lower portion. A flange is provided at the lower end of the head portion 172a so that the head portion 172a does not come off from the core portion 120. The flange engages a portion that overhangs inward at the upper edge of the through hole of the core portion 120. As a result, the terminal upper portion 172 having the head portion 172a is configured to be vertically movable in the core portion 120 but not to be pulled out upward from the core portion 120.
  • the urging member 176 is urging in the direction of separating the terminal upper portion 172.
  • the urging member 176 is, for example, a coil spring.
  • the first terminal portion 20 is provided corresponding to the first lead portion 2 of the IC package P in a state of being housed in the electrical connection socket 1.
  • FIG. 7A and 7B are side views showing the first terminal portion and the second terminal portion of the electrical connection socket 1
  • FIG. 7A is a side view of the first terminal portion 20
  • FIG. 7B is a second terminal portion 30. It is a side view of.
  • the first terminal portion 20 includes a base end portion 21 protruding downward from the circuit board 114, a fixing portion 23 fixed to the socket body 10, a holding portion 25 functioning as a contact portion, an elastic deformation portion 27, and a tip end thereof. It has a part 29 and.
  • the first terminal portion 20 electrically connects the first lead portion 2 connected by the sandwiching portion 25 and the circuit board connected to the base end portion 21.
  • the base end portion 21 is inserted into the through hole of the circuit board 114, fixed to the socket body 10 (outer peripheral side of the frame-shaped wall portion 140) by the fixing portion 23, and to the upper holding portion 25.
  • the elastically deformed portion 27 and the tip portion 29 to be connected are elastically deformable.
  • the holding portion 25 has a first holding portion 252 provided at the tip of the arm portion 28 extending from the fixing portion 23 and a second holding portion 254 provided on the elastically deforming portion 27.
  • the first holding portion 252 is provided at the tip of the arm portion 28 and can be displaced by the elastic deformation of the arm portion 28.
  • the second holding portion 254 is arranged so as to press the first holding portion 252 mainly by the elastic deformation of the elastic deformation portion 27.
  • the elastically deformed portion 27 has a curved portion, and a second holding portion 254 is provided in an intermediate portion extending upward from the fixed portion 23 to the tip portion 29.
  • the elastically deformed portion 27 is formed so that the second holding portion 254 presses the first holding portion 252 due to the elastic deformation.
  • the elastically deformed portion 27 elastically deforms due to the displacement of the tip portion 29, and displaces the second sandwiching portion 254 in a direction away from the first sandwiching portion 252.
  • the elastic deformation portion 27 is deformed so that when the tip portion 29 moves downward (moves to the fixed portion 23 side), the second holding portion 254 moves upward and outward of the first holding portion 252. Then, the second holding portion 254 is separated from the first holding portion 252.
  • the second terminal portion 30 has a base end portion 31 protruding downward from the circuit board 114 below the inner peripheral portion of the frame-shaped wall portion 140, a fixing portion 33 fixed to the socket body 10, and an elastic arm portion 34. And a contact portion 35 (contact pieces 352, 354).
  • the second terminal portion 30 is fixed to the socket body 10 (outer peripheral side of the frame-shaped wall portion 140) by the fixing portion 33 by inserting the base end portion 31 into the through hole of the circuit board 114.
  • the portion above the fixed portion 33 is elastically deformable, and the elastic arm portion 34 rises from the fixed portion 33 and contacts the upper end side (tip portion in the present embodiment) of the elastic arm portion 34.
  • a portion 35 is provided.
  • the elastic arm portion 34 is elastically deformed, and the contact portion 35 at the tip portion moves in a direction orthogonal to the mounting direction, that is, in a direction orthogonal to the outer peripheral surface of the IC package P and in a direction away from the outer peripheral surface.
  • the elastic arm portion 34 is provided with a pressed portion 342 pressed by the core portion 120.
  • the pressed portion 342 is provided so as to project toward the core portion 120, and is arranged on a movement locus when the pressing convex portion 128 of the core portion 120 moves up and down.
  • the pressed portion 342 is arranged on a movement locus when the pressed convex portion 342 moves downward from the upper end position farthest from the central bottom portion 150.
  • the pressed portion 342 is pressed by the pressing convex portion 128 that moves up and down, and is in a direction orthogonal to the outer peripheral surface of the IC package P mounted on the mounting portion 121, that is, lateral to the IC package P. Move outward in the horizontal direction.
  • the contact portion 35 at the tip of the elastic arm portion 34 moves outward in the horizontal direction, that is, is laterally separated from the contact position with the second lead portion 3.
  • the core portion 120 When the core portion 120 is located at the upper end portion (when the pressing convex portion 342 is located at the upper end position), that is, when the pressed portion 342 is in the normal state of the electrical connection socket 1 shown in FIGS. 1 to 6. It is located at the position closest to the central axis of the frame portion 110 in the horizontal direction.
  • the pressed portion 342 is arranged below the pressing convex portion 128 of the core portion 120 in the vertical direction, and is not pressed outward in the horizontal direction by the pressing convex portion 128.
  • At least the contact piece 354 of the contact portions 35 is provided so as to be accessible to the side of the second lead portion 3, that is, from the radial outside to the second lead portion 3 side. ..
  • the plurality of pressed portions 342 press and contact with each other so as to sandwich the second lead portion 3 of the IC package P in the horizontal direction.
  • the pressed portion 342 is formed so as to be separated horizontally from the outer diameter side of the plurality of second lead portions 3 provided in the IC package P by the deformation of the elastic arm portion 34 to which the pressed portion 342 is connected. ..
  • the contact portion 35 has a plurality of contact pieces 352 and 354, and is formed so as to be able to contact the second lead portion 3 at a plurality of locations.
  • the contact portion 35 is formed so as to come into contact with the lower surface side portion 3a (see FIGS. 2 and 17) and the side surface side portion 3b (see FIGS. 2 and 17) of the second lead portion 3.
  • the contact pieces 35 are arranged so as to be orthogonal to each other to form an L-shaped contact portion 35, but the contact pieces 352 and 354 may be formed so as to extend in the intersecting directions.
  • the cover portion 40 is arranged on the socket main body 10 so as to be movable in the contacting / separating direction with respect to the socket main body 10.
  • the IC package P can be accommodated or accommodated in the electrical connection socket 1.
  • the IC package P is electrically connected and held to the first terminal portion 20 and the second terminal portion 30 of the electrical connection socket 1.
  • the cover portion 40 has a cover portion main body 42 arranged so as to overlap on the socket main body 10, a lever movable action portion 44, and a terminal deforming portion 48.
  • the cover portion main body 42 is formed in a rectangular frame shape having an opening 43 in the central portion.
  • a corner guide protrusion 16 protruding from the upper surface of the socket body 10 is arranged inside the opening 43.
  • the cover portion 40 can be stably moved in the direction perpendicular to the socket body 10 (mounting direction) by sliding the corner guide protrusion 16 at the corner of the opening 43.
  • the IC package P is mounted on the mounting portion 121 of the socket main body 10 through the opening 43, and can be accommodated in the accommodating portion 12.
  • the lever movable action unit 44 moves the lever unit 50.
  • the lever movable action portion 44 is provided so as to project from the surface of the cover portion 40 on the socket body 10 side, and in the present embodiment, from the lower surface.
  • the lever movable action portion 44 presses the free end portion side of the lever portion 50 (in the present embodiment, the free end portion 54). As a result, the lever portion 50 rotates about the shaft portion 152 and presses the core portion 120 downward against the urging force of the urging member 125.
  • the terminal deforming portion 48 comes into contact with the tip portion 29 of the first terminal portion 20 to deform the first terminal portion 20 and hold the holding portion 25. Open it.
  • the terminal deformation portion 48 is provided on the cover portion main body 42.
  • the terminal deformation portion 48 is provided by opening on the lower surface of the socket body 10, and has a guide hole in which the tip portion 29 to be inserted slides on the inner sliding surface to elastically deform the first terminal portion 20.
  • the elastically deformed portion 27 (see FIG. 7) of the first terminal portion 20 is deformed, and the second holding portion 254 of the holding portion 25 is the first holding portion. Separated from 252, the holding portion 25 is in an open state.
  • FIG. 8 is a perspective view showing an open state in which an IC package can be accommodated in the electrical connection socket according to the embodiment of the present invention.
  • 9 to 11 are cross-sectional views corresponding to the AA, BB, and CC line cross sections in the open state of the electrical connection socket according to the embodiment of the present invention.
  • the circuit board 114 see FIGS. 1, 4 to 6) as an electric component to which the electric connection socket 1 is mounted is omitted for convenience of explanation.
  • the cover portion 40 is moved to the socket body 10 side, that is, is brought close to the socket body 10. At this time, as shown in FIGS. 8 to 11, the cover portion 40 opposes the urging force of the urging member 136 of the guide mechanism 130 and is located on the socket body 10 side, that is, along the corner guide protrusion 16. Move down.
  • the pressing convex portion 128 presses the pressed portion 342 of the second terminal portion 30 radially outward as shown in FIG.
  • the second terminal portion 30 moves laterally at the contact position with the second lead portion 3, or in the present embodiment, outward in the horizontal direction. That is, the second terminal portion 30 is a position separated laterally from the second lead portion 3, and is a position where the second lead portion 3 can be approached and connected from the side of the second lead portion 3. Located in.
  • the terminal deforming portion 48 comes into contact with the tip portion 29 of the first terminal portion 20 to deform the elastic deforming portion 27 of the first terminal portion 20, so that the sandwiching portion 25 of the first terminal portion 20 has a second position.
  • the holding portion 254 is separated from the first holding portion 252.
  • the first terminal portion 20 is in a state in which the first lead portion 2 can be pinched in the pinching portion 25, that is, the pinching portion 25 is in an open state. Therefore, in the first terminal portion 20, when the IC package P is mounted on the mounting portion 121 from above, the second holding portion 254 is not located on the movement locus of the IC package P, and the first lead portion 2 Is in a state where it can come into contact with the first holding portion 252.
  • first terminal portion 20 and the second terminal portion 30 can be connected to the first lead portion 2 and the second lead portion 3 of the IC package P, that is, the electrical connection socket 1 is connected to the IC package P. Make it storable (open).
  • FIG. 12 is a perspective view showing an electrical connection socket on which an IC package is mounted
  • FIG. 13 is a cross-sectional view corresponding to the AA line cross section of the electrical connection socket on which the IC package is mounted
  • FIG. 14 is a cross-sectional view corresponding to the BB line cross section of the electrical connection socket on which the IC package is mounted
  • FIG. 15 corresponds to the CC line cross section of the electrical connection socket on which the IC package is mounted. It is a cross-sectional view.
  • FIG. 16 is a partially enlarged view of the first terminal portion of the electrical connection socket on which the IC package is mounted
  • FIG. 17 is a partially enlarged view of the second terminal portion of the electrical connection socket on which the IC package is mounted. It is a figure.
  • the IC package P is mounted on the mounting section 121 as shown in FIGS. 12 to 14.
  • the IC package P surrounds the concave portion, and the outer peripheral edge portion of the package body 4 is mounted on the upper surface of the frame portion 110 constituting the mounting portion 121.
  • the tip portion of the first lead portion 2 is arranged on the first holding portion 252 after the second holding portion 254 is separated in the first terminal portion 20.
  • connection between electrical connection socket 1 and IC package P is applied to the performance test of the IC package P.
  • the electrical connection socket 1 is mounted on the circuit board 114 (see FIGS. 1, 4 to 6).
  • 18 to 22 are diagrams showing a state in which the performance can be inspected by accommodating the IC package P in the electrical connection socket 1 and connecting the IC package P.
  • FIG. 18 is a perspective view showing an electrical connection socket containing an IC package
  • FIG. 19 is a cross-sectional view corresponding to the AA line cross section of the electrical connection socket containing the IC package
  • FIG. 20 is a cross-sectional view corresponding to the BB line cross section of the electrical connection socket accommodating the IC package
  • 21 and 22 are partially enlarged views showing the connection states of the first terminal portion and the second terminal portion in the electrical connection socket accommodating the IC package.
  • the IC package P Since the IC package P is placed in the open state of the electrical connection socket 1, the IC package P is placed in the mounting portion 121 with the electrical connection socket 1 open as shown in FIGS. 12 to 17 from the normal state. Is placed. In this open state, the cover portion 40 moves toward the socket body 10 side against the urging force and approaches the socket body 10.
  • the first lead portion 2 and the second lead portion 3 are connected to the first terminal portion 20 and the second terminal portion 30 by releasing the pressing force of the cover portion 40.
  • the cover portion 40 is separated from the socket body 10. Since the cover portion 40 is placed close to the socket main body 10 by being pressed against the socket main body 10 against the urging force of the urging member 136 (adjacent arrangement in the present embodiment), the cover portion 40 is a cover portion. The pressing force on the 40 may be released.
  • the first terminal portion 20 and the second terminal portion 30, which have been elastically deformed due to the movement of the cover portion 40 to the socket body 10 side, are in their original state. That is, it tries to restore the shape to the normal state.
  • the cover portion 40 moves upward, that is, when the cover portion 40 is separated from the socket body 10, the terminal deforming portion 48 also moves upward.
  • the terminal deformed portion 48 slides in the direction in which the tip portion 29 is separated from the top surface side of the cover portion 40.
  • the second holding portion 254 has a shape in which the first holding portion 252 is pressed or a shape in which inclusions can be sandwiched between the first holding portion 252 and the first holding portion 252.
  • the restriction on the elastic deformation of the first terminal portion 20 is lifted, and the second pinching portion 254 moves so as to come into contact with the first pinching portion 252 and approaches the first pinching portion 252.
  • the tip portion 2a which is the contact portion of the first lead portion 2
  • the second holding portion 254 abuts on the tip portion 2a and causes the tip portion 2a to come into contact with the tip portion 2a. Press against the first holding portion 252 side.
  • the holding portion 25 having the first holding portion 252 and the second holding portion 254 is connected to the first lead portion 2 in a state of sandwiching the tip portion 2a of the first lead portion 2.
  • the first holding portion 252 is provided on the tip end side of the elastically deformable arm portion 28.
  • the second terminal portion 30 is electrically connected to the second lead portion 3. do.
  • the urging member 125, 127 (FIGS. 13, 14, 19, and 19) is provided in the direction in which the core portion 120 is separated from the central bottom portion 150 with respect to the central bottom portion 150 of the frame portion 110, that is, upward. Move against (see FIG. 20).
  • the pressing of the second terminal portion 30 against the pressed portion 342 by the pressing convex portion 128 of the core portion 120 is released, and the contact portion 35, which is the tip portion of the second terminal portion 30, is displaced toward the central axis direction. do.
  • the contact piece 354 of the contact portion 35 moves in the direction of restoring the normal shape (arrow direction), that is, at a position laterally separated from the side surface side portion 3b of the second lead portion 3. Then, it moves to the side surface side portion 3b side and presses the side surface side portion 3b.
  • the lower surface side portion 3a of the second lead portion 3 may be positioned so as to be in contact with the contact piece 352 above.
  • the contact piece 354 for the side surface side portion sideways toward the side surface side portion 3b of the second lead portion 3, here, the side surface side portion. 3b approaches and abuts from the outside in the horizontal direction.
  • the second terminal portion 30 can be stably brought into contact with the second lead portion 3 at a plurality of contacts.
  • the second terminal portion 30 is arranged so as to surround the IC package P, and is connected to the corresponding second read portion 3. As a result, the IC package P is held in a state of being pressed by the second terminal portion 30 on the lower surface side and the side surface side over the entire circumference, so that the IC package P is held in a state of being sandwiched between the plurality of second terminal portions 30.
  • the second terminal portion 30 and the second lead portion 3 can be stably and electrically connected.
  • the ground terminal portion 170 uses the urging member 176 to cover the lower surface of the IC package P.
  • the lower surface of the IC package P can be pressed and connected.
  • the ground can be suitably taken when inspecting the IC package P.
  • the heat of the IC package P can be dissipated to the circuit board 114 side.
  • the electrical connection socket 1 does not have to have the ground terminal portion 170.
  • another ground wiring may be provided to connect the IC package P to the ground.
  • the cover portion 40 is as shown in FIGS. 8 to 11. Is pressed toward the socket body 10 side so that the IC package P can be placed in the mounting portion 121 in an open state. Then, as shown in FIGS. 12 to 17, the IC package P is placed on the mounting portion 121. In the state where the IC package P is mounted on the mounting portion 121, the tip portion 2a of the first lead portion 2 is mounted on the first holding portion 252 of the first terminal portion 20, and the inner peripheral portion of the frame portion 110 is mounted. The outer peripheral edge portion of the IC package P is arranged on the frame-shaped upper surface (mounting portion 121) of the IC package P.
  • the first terminal portion 20 sandwiches the first lead portion 2 with the sandwiching portion 25, and then the second terminal portion 30 moves to the second lead portion 3. Connect to.
  • the second terminal portion 30 approaches the second lead portion 3 from the side of the second lead portion 3, that is, from the lateral direction (horizontal direction in the present embodiment) orthogonal to the mounting direction. , Touch, press and hold.
  • each of the lead portions having different shapes can be electrically connected, and the performance of the IC package P can be connected to the circuit board 114 on which the electrical connection socket 1 is mounted. Can be measured.
  • the socket main body 10 has a mounting portion 121 on which the IC package P is mounted, a core portion (pressing portion) 120, and a cover portion (moving body) 40.
  • the core portion (pressing portion) 120 presses the second terminal portion 30 so that the second terminal portion 30 is placed in contact with the second lead portion 3 of the IC package P mounted on the mounting portion 121. 2 Separated from the side of the lead portion 3.
  • the cover portion 40 is provided so as to be movable in the contact / separation direction with respect to the socket body 10.
  • the cover portion 40 causes the core portion 120 to press the second terminal portion 30 by moving in one direction in the contact / separation direction, and the cover portion 40 releases the pressed state of the core portion 120 by moving in the other direction in the contact / separation direction.
  • the second terminal portion 30 and the second lead portion 3 are brought into contact with each other.
  • the first terminal portion 20 is arranged in a sandwiched state in which the first lead portion 2 of the IC package P of the mounting portion 121 can be sandwiched by the sandwiching portion 25, and the cover portion 40 is moved to one side in the contact / separation direction. A part of the first terminal portion 20 is pressed and deformed to open the sandwiching portion 25, the first lead portion 2 is put into a non-pinching state, and the pressing state to the first terminal portion 20 by moving to the other in the contact / separation direction. Is released, and the holding portion 25 is put into the holding state.
  • the electric connection socket 1 of the present embodiment even electric parts having leads having different shapes can be compactly formed and can be reliably connected to the electric parts.
  • the electric connection socket 1 for an IC package having lead portions having different shapes a gull-wing type lead and an electric connection socket for connecting to an IC package having a J-lead type lead are used.
  • the electrical connection socket may be an electrical connection socket of any IC package as long as it is an electrical connection socket in which one of leads having different shapes is in contact from the side.
  • the second terminal portion 30 is brought into contact with the second lead portion by being brought into contact with the second lead portion by being brought into contact with the second terminal portion from the side of the IC package. It may be configured to bring the second lead into contact with the second lead.
  • the socket for electrical connection according to the present invention, even an electrical component having leads having different shapes can be compactly formed, has an effect of being able to be reliably connected to the electrical component, and inspects the electrical characteristics of the electrical component. It is also useful as an inspection socket used for.

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  • Physics & Mathematics (AREA)
  • Condensed Matter Physics & Semiconductors (AREA)
  • General Physics & Mathematics (AREA)
  • Engineering & Computer Science (AREA)
  • Computer Hardware Design (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Power Engineering (AREA)
  • Connecting Device With Holders (AREA)
  • Testing Of Individual Semiconductor Devices (AREA)

Abstract

La présente invention concerne une douille de connexion électrique conçue pour être compacte qui peut être connectée de manière fiable pour l'inspection d'un boîtier de circuit intégré, même si le boîtier de circuit intégré a un fil de forme différente. Cette douille comprend : un corps de douille qui loge un composant électrique, qui comprend un premier fil faisant saillie dans la direction s'éloignant de la périphérie externe d'un corps de composant électrique, et un second fil faisant saillie à partir de la périphérie externe, la partie de pointe étant positionnée vers la périphérie externe ; une première borne qui est disposée sur le corps de douille et qui est reliée au premier fil ; et une seconde borne qui est disposée sur le corps de douille et qui, lorsque le composant électrique est logé dans le corps de douille, s'approche du second fil à partir du côté du second fil et entre en contact avec le second fil.
PCT/JP2020/025303 2020-06-26 2020-06-26 Douille de connexion électrique Ceased WO2021260931A1 (fr)

Priority Applications (1)

Application Number Priority Date Filing Date Title
PCT/JP2020/025303 WO2021260931A1 (fr) 2020-06-26 2020-06-26 Douille de connexion électrique

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
PCT/JP2020/025303 WO2021260931A1 (fr) 2020-06-26 2020-06-26 Douille de connexion électrique

Publications (1)

Publication Number Publication Date
WO2021260931A1 true WO2021260931A1 (fr) 2021-12-30

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Country Link
WO (1) WO2021260931A1 (fr)

Citations (6)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS52122661U (fr) * 1976-03-12 1977-09-17
JPH0582221A (ja) * 1991-09-18 1993-04-02 Texas Instr Japan Ltd ソケツト
JPH06349556A (ja) * 1993-06-11 1994-12-22 Yamaichi Electron Co Ltd Ｉｃソケット
JPH07254469A (ja) * 1994-03-16 1995-10-03 Texas Instr Japan Ltd ソケット
JP2003045533A (ja) * 2001-05-22 2003-02-14 Enplas Corp コンタクトピン及び電気部品用ソケット
WO2014167693A1 (fr) * 2013-04-11 2014-10-16 ルネサスエレクトロニクス株式会社 Procédé de fabrication de dispositif à semi-conducteurs

Patent Citations (6)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS52122661U (fr) * 1976-03-12 1977-09-17
JPH0582221A (ja) * 1991-09-18 1993-04-02 Texas Instr Japan Ltd ソケツト
JPH06349556A (ja) * 1993-06-11 1994-12-22 Yamaichi Electron Co Ltd Ｉｃソケット
JPH07254469A (ja) * 1994-03-16 1995-10-03 Texas Instr Japan Ltd ソケット
JP2003045533A (ja) * 2001-05-22 2003-02-14 Enplas Corp コンタクトピン及び電気部品用ソケット
WO2014167693A1 (fr) * 2013-04-11 2014-10-16 ルネサスエレクトロニクス株式会社 Procédé de fabrication de dispositif à semi-conducteurs

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