WO2021121259A1 - Signal transceiving device and electronic device - Google Patents

Abstract

Provided in the present invention are a signal transceiving device and an electronic device. The signal transceiving device comprises: a housing, a power supply input interface contact, a first signal interface contact and a magnetic component being provided on the housing; a millimeter wave array antenna and a wireless network antenna provided inside the housing; a radio frequency circuit module provided inside the housing, the millimeter wave array antenna, the wireless network antenna and the first signal interface contact being respectively connected to the radio frequency circuit module; and a power supply management chip provided inside the housing, the power supply input interface contact being connected to the power supply management chip.

Description

Signal transceiving equipment and electronic equipment

Cross-references to related applications

This application claims the priority of Chinese Patent Application No. 201911326597.8 filed in China on December 20, 2019, the entire content of which is incorporated herein by reference.

Technical field

The present invention relates to the field of communication technology, in particular to a signal transceiving device and an electronic device.

Background technique

Compared with previous generation technologies, the fifth-generation mobile communication technology (5th-Generation, 5G) can provide higher communication speed, lower latency and more simultaneous connections. Because it has a very wide communication bandwidth, millimeter wave communication technology with a frequency band above 20 GHz is one of the key technologies in 5G technology. Generally, the millimeter wave frequency band is designated as the 5G frequency band. Therefore, in the future, there will be more and more electronic products equipped with millimeter wave antenna modules, especially mobile communication terminals such as mobile phones.

Customer Premise Equipment (CPE) can convert mobile network signals into wireless network signals and then connect to mobile terminals such as the user's mobile phone. The space link loss of 5G millimeter wave communication is large, and the power consumption and heat of mobile terminals are also high. Therefore, the CPE that can convert 5G millimeter wave network signals into wireless network signals and provide multiple users to use has very high practicality. .

However, the current millimeter wave communication technology and 5G millimeter wave CPE for mobile terminals have the following shortcomings:

In order to ensure a certain millimeter wave communication quality, mobile terminals need to install more than two millimeter wave communication modules in different positions. However, due to the limitation of the internal space of mobile terminals such as mobile phones and the impact of the material of the mobile terminal housing on the millimeter wave antenna, the space and location for installing millimeter wave communication modules inside the mobile terminal is very limited, which has a greater impact on the communication quality ；

The power consumption and heat generation of the millimeter wave communication system is very high, which not only causes the battery power consumption of mobile terminals such as mobile phones to be large, but also makes the heat dissipation effect inside the terminal poor;

The mobility of the mobile terminal and the influence of the surrounding human body and objects will cause the communication quality of the millimeter wave communication to be low. At the same time, the mobile terminal needs to constantly re-scan the beam to search for the direction of the base station, which increases the power consumption and heat generation of the system. ；

The current 5G millimeter wave CPE is large in size and needs to be fixedly placed and used. Because the communication range of the wireless network is relatively small, when the user leaves the wireless network communication range of the CPE, they cannot connect to the CPE for 5G millimeter wave high-speed communication, which will greatly affect the user's communication experience.

Summary of the invention

The embodiments of the present invention provide a signal transceiving device and an electronic device to solve the problem that users cannot connect to the signal transceiving device for 5G millimeter wave high-speed communication after leaving the wireless network communication range.

In order to solve the above technical problems, the present invention is implemented as follows:

In the first aspect, an embodiment of the present invention provides a signal transceiving device, including:

A housing, the housing is provided with a power input interface contact, a first signal interface contact and a magnetic component;

A millimeter wave array antenna and a wireless network antenna arranged in the housing;

The radio frequency circuit module arranged in the housing, wherein the millimeter wave array antenna, the wireless network antenna, and the first signal interface contact are respectively connected to the radio frequency circuit module;

The power management chip arranged in the housing, wherein the power input interface contacts are connected to the power management chip.

In a second aspect, an embodiment of the present invention also provides an electronic device, including a housing, and further including: the above-mentioned signal transceiving device;

Wherein, the signal transceiving device is arranged on the housing.

In this way, in the embodiment of the present invention, by arranging the power input interface contact, the first signal interface contact and the magnetic component on the housing, the millimeter wave array antenna, the wireless network antenna, the radio frequency circuit module and the power management chip are arranged inside the housing. , Wherein the millimeter wave array antenna, the wireless network antenna, and the first signal interface contact are respectively connected to the radio frequency circuit module, and the power input interface contact is connected to the power management chip. The 5G millimeter wave communication module that can be used as an electronic device provides 5G millimeter wave high-speed communication functions for the machine, and can also be used as a signal transceiver to provide 5G millimeter wave high-speed communication functions for multiple electronic devices.

Description of the drawings

In order to explain the technical solutions of the embodiments of the present invention more clearly, the following will briefly introduce the drawings that need to be used in the description of the embodiments of the present invention. Obviously, the drawings in the following description are only some embodiments of the present invention. For those of ordinary skill in the art, other drawings can be obtained based on these drawings without creative labor.

Figure 1 shows one of the structural schematic diagrams of a signal transceiving device according to an embodiment of the present invention;

FIG. 2 shows the second structural diagram of a signal transceiving device according to an embodiment of the present invention;

FIG. 3 shows the third structural diagram of the signal transceiving device according to the embodiment of the present invention;

FIG. 4 shows one of the schematic diagrams of the connection between the signal transceiving device and the external power supply according to the embodiment of the present invention;

FIG. 5 shows the second schematic diagram of the connection between the signal transceiving device and the external power supply according to the embodiment of the present invention;

FIG. 6 shows one of the structural schematic diagrams of the electronic device according to the embodiment of the present invention;

FIG. 7 shows the second structural diagram of an electronic device according to an embodiment of the present invention;

FIG. 8 shows one of the schematic diagrams of disassembling an electronic device according to an embodiment of the present invention;

FIG. 9 shows the second schematic diagram of disassembling an electronic device according to an embodiment of the present invention;

Description of reference signs:

1- housing, 11- power input interface contact, 12- first signal interface contact, 13- magnetic component, 14- millimeter wave array antenna, 15- wireless network antenna, 16- radio frequency circuit module, 17- heat dissipation hole , 18-power access port, 2-shell, 21-battery back cover, 22-groove, 3-data cable, 4-charging dock.

Detailed ways

Hereinafter, exemplary embodiments of the present invention will be described in more detail with reference to the accompanying drawings. Although the drawings show exemplary embodiments of the present invention, it should be understood that the present invention can be implemented in various forms and should not be limited by the embodiments set forth herein. On the contrary, these embodiments are provided to enable a more thorough understanding of the present invention and to fully convey the scope of the present invention to those skilled in the art.

As shown in Figures 1 to 5, embodiments of the present invention provide a signal transceiving device, including:

A housing 1, the housing 1 is provided with a power input interface contact 11, a first signal interface contact 12, and a magnetic component 13;

The millimeter wave array antenna 14 and the wireless network antenna 15 are provided in the housing 1. The millimeter wave array antenna 14 may be arranged on the surface of the housing, that is, the appearance is visible; the wireless network antenna 15 may also be arranged on the surface of the housing. The millimeter wave array antenna 14 may be arranged inside the housing and be blocked by an external obstruction, that is, the appearance is invisible, but the external obstruction can penetrate the millimeter wave signal, and does not affect the reception and transmission of the millimeter wave signal. The same is true for the wireless network antenna 15.

The radio frequency circuit module 16 arranged in the housing 1, wherein the millimeter wave array antenna 14, the wireless network antenna 15, and the first signal interface contact 12 are respectively connected to the radio frequency circuit module 16; The radio frequency circuit module 16 can be arranged inside the casing 1 and wrapped by the casing 1.

The power management chip provided in the housing 1, wherein the power input interface contact 11 is connected to the power management chip. The power management chip can also be arranged in the housing 1.

Specifically, the signal transceiving device may be a CPE or other devices with the same functions as the CPE. The CPE is a mobile signal access device that receives mobile signals and forwards them through wireless network signals. It is also a kind of high-speed 4G or 5G The device that converts the signal into a wireless network signal has a larger number of electronic devices that can support the Internet at the same time.

Specifically, the signal transceiving device may provide beam scanning and communication functions corresponding to the orientation direction according to the orientation of the millimeter wave array antenna 14. In addition, the signal transceiving device performs wireless network communication with the electronic device through the wireless network antenna 15, wherein the number of the wireless network antenna 15 may be multiple, which may be a wireless network between the signal transceiving device and the electronic device. The multiple-input multiple-output (MIMO) communication function improves the communication speed of the wireless network. In addition, the radio frequency circuit module 16 may include an integrated circuit of a radio frequency chip or the like.

Specifically, the magnetic component 13 can be a magnetic strip or other shapes, and can be used to be adsorbed on the surface of an iron article to play a role of positioning and fixing. The millimeter wave array antenna 14 may include multiple millimeter wave antenna units, and the multiple millimeter wave antenna units form the millimeter wave array antenna 14. Wherein, the positions and numbers of the power input interface contacts 11, the first signal interface contacts 12, and the magnetic components 13 provided on the housing 1 are not limited; and the shape and size of the housing 1 are also not limited. .

In the above-mentioned embodiment of the present invention, by arranging the power input interface contact 11, the first signal interface contact 12 and the magnetic component 13 on the housing 1, the millimeter wave array antenna 14, the wireless network antenna 15, and the The radio frequency circuit module 16 and the power management chip, wherein the millimeter wave array antenna 14, the wireless network antenna 15, and the first signal interface contact 12 are respectively connected to the radio frequency circuit module 16, and the power supply The input interface contact 11 is connected with the power management chip, not only can be used as a 5G millimeter wave communication module of an electronic device to provide 5G millimeter wave high-speed communication function for the machine, but also can be used as a signal forwarding device to provide 5G millimeter wave for multiple electronic devices High-speed communication function.

Further, as shown in FIGS. 1 and 2, the number of millimeter wave array antennas 14 is at least two, and at least two millimeter wave array antennas 14 have different orientations.

Specifically, the number of millimeter wave array antennas 14 may be two or more than two, and at least two millimeter wave array antennas 14 have different orientations. The signal transceiving device may provide beam scanning and communication in multiple directions. The function can enhance the communication coverage effect of millimeter wave communication and improve the quality of millimeter wave communication.

Further, as shown in FIGS. 1 to 5, a heat dissipation hole 17 may be provided on the housing 1.

Specifically, the number of the heat dissipation holes 17 may be one or more. When the number of the heat dissipation holes 17 is more than one, the heat dissipation holes 17 may be distributed on different side surfaces of the housing 1 to improve The heat dissipation capacity of the signal transceiving equipment.

Further, as shown in FIG. 2, the signal transceiving device may further include:

A power access port 18 is provided on the housing 1, and the power access port 18 is connected to the power management chip.

Specifically, as shown in FIGS. 4 and 5, the power input interface 18 may be a universal serial bus (Universal Serial Bus, USB) interface, and the signal transceiving device may be connected to an external power source through a data line 3, or the The signal transceiving device can be connected to an external power source through the charging base 4 to provide continuous power to the signal transceiving device to ensure that the signal transceiving device provides a 5G millimeter wave high-speed communication function for the electronic device, making millimeter wave communication more stable.

Further, the signal transceiving device may further include:

The battery is arranged inside the casing 1, and the battery is connected to the power management chip.

Specifically, when the signal transceiving device includes a battery, it can be connected to an external power source through the power access port 18 to charge the battery. When the battery is fully charged, the battery can supply power to the signal transceiving device. At this time, there is no need to connect to an external power source through the data line 3, which is more convenient for the movement of the signal transceiving device.

Further, the signal transceiving device may also be provided with other devices such as a camera, a speaker, etc., to realize multiple functions.

In the embodiment of the present invention, by arranging the power input interface contact 11, the first signal interface contact 12 and the magnetic component 13 on the housing 1, the millimeter wave array antenna 14, the wireless network antenna 15, and the radio frequency are arranged inside the housing 1. The circuit module 16 and the power management chip, wherein the millimeter wave array antenna 14, the wireless network antenna 15, and the first signal interface contact 12 are respectively connected to the radio frequency circuit module 16, and the power input The interface contact 11 is connected with the power management chip, not only can be used as a 5G millimeter wave communication module of an electronic device to provide 5G millimeter wave high-speed communication function for the machine, but also can be used as a signal forwarding device to provide 5G millimeter wave high-speed for multiple electronic devices Communication function; and, distributing the heat dissipation holes 17 on different side surfaces of the housing 1 can improve the heat dissipation capacity of the signal transceiver; and, the millimeter wave array antenna 14 can provide beam scanning and communication functions in multiple directions to enhance The communication coverage effect of millimeter wave communication improves the quality of millimeter wave communication.

As shown in FIGS. 6 to 9, an embodiment of the present invention also provides an electronic device, including a housing 2, which is characterized in that it further includes: a signal transceiving device as described in any of the above embodiments;

Wherein, the signal transceiving device is arranged on the housing 2.

Specifically, when the signal transceiving device is connected to the electronic device, the power access port 18 can be connected to an external power source to provide power, which can reduce the power consumption of the electronic device.

In the above-mentioned embodiment of the present invention, the signal transceiving device is arranged on the housing 2 and can be used as a 5G millimeter wave communication module of the electronic device to provide the machine with a 5G millimeter wave high-speed communication function; When the housing 2 is split, the signal transceiving device can be used as a signal forwarding device to provide a 5G millimeter wave high-speed communication function for multiple electronic devices.

Further, as shown in FIGS. 6 to 9, the housing 2 includes a display screen and a battery back cover 21 arranged opposite to the display screen, and the signal transceiving device is arranged on the battery back cover 21.

Furthermore, as shown in FIGS. 6 to 9, the battery back cover 21 is provided with a groove 22, and the signal transceiving device is adsorbed in the groove 22 through the magnetic component 13.

Specifically, the battery back cover 21 may be provided with a groove 22, and the length and width of the groove 22 may be greater than or equal to the length and width of the signal transceiving device, so that the signal transceiving device can be placed in all areas. The groove 22. The height of the groove 22 may be less than or equal to the height of the signal transceiving device, and the height of the groove 22 may also be greater than the height of the signal transceiving device, which is not specifically limited here.

Further, as shown in FIGS. 6 to 9, the housing 2 is provided with a power output interface contact and a second signal interface contact;

Wherein, the power output interface contact is electrically connected to the power input interface contact 11, and the first signal interface contact 12 is electrically connected to the second signal interface contact.

Specifically, the inner wall of the groove 22 may be provided with a magnetic strip of opposite magnetic poles that attracts the magnetic component 13 for when the signal transceiver device is placed in the groove 22, the opposite magnetic poles attract each other. The signal transceiving device is fixed in the groove 22. In addition, the number of the first signal interface contacts 12 and the second signal interface contacts may be the same, and the number of the power output interface contacts and the power input interface contacts 11 may be the same. A signal interface contact 12 is in contact with the second signal interface contact, and the power output interface contact is in contact with the power input interface contact 11, so that the signal transceiving device is electrically connected to the housing 2 , So that the signal transceiver device is used as the 5G millimeter wave communication module of the electronic device to provide the machine with a 5G millimeter wave high-speed communication function.

The above embodiment of the present invention uses a mobile phone as a specific example of the electronic device of the present invention. Those skilled in the art can understand that in addition to a mobile phone as an electronic device, it can also be applied to other electronic devices with a display screen, such as tablet computers and electronic devices. Book readers, moving picture experts compress standard audio layer 3 (Moving Picture Experts Group Audio Layer III, MP3) players, moving picture experts compress standard audio layer 4 (Moving Picture Experts Group Audio Layer IV, MP4) players, laptops Type portable computers, vehicle-mounted computers, desktop computers, set-top boxes, smart TVs, wearable devices, etc., are all within the protection scope of the embodiments of the present invention.

In the above-mentioned embodiment of the present invention, the signal transceiving device is arranged on the housing 2 and can be used as a 5G millimeter wave communication module of the electronic device to provide the machine with a 5G millimeter wave high-speed communication function; When the housing 2 is split, the signal transceiving device can be used as a signal forwarding device to provide a 5G millimeter wave high-speed communication function for multiple electronic devices; and the heat dissipation holes 17 are distributed on different side surfaces of the housing 1 , Can improve the heat dissipation capacity of the signal transceiving equipment; and, the millimeter wave array antenna 14 can provide beam scanning and communication functions in multiple directions, enhance the communication coverage effect of millimeter wave communication, and improve the quality of millimeter wave communication; The magnetic component 13 is provided on the upper part to connect and fix the signal transceiving device and the housing 2 conveniently and quickly. After the signal transceiving device and the housing 2 are separated, the signal transceiving device can also pass through the magnetic component 13 It is more convenient to be adsorbed on the surface of iron products and other objects.

The various embodiments in this specification are described in a progressive manner. Each embodiment focuses on the differences from other embodiments, and the same or similar parts between the various embodiments can be referred to each other.

Although the preferred embodiments of the embodiments of the present invention have been described, those skilled in the art can make additional changes and modifications to these embodiments once they learn the basic creative concept. Therefore, the appended claims are intended to be interpreted as including the preferred embodiments and all changes and modifications falling within the scope of the embodiments of the present invention.

Finally, it should be noted that in this article, relational terms such as first and second are only used to distinguish one entity or operation from another entity or operation, and do not necessarily require or imply these entities. Or there is any such actual relationship or sequence between operations. Moreover, the terms "including", "including" or any other variants thereof are intended to cover non-exclusive inclusion, so that a process, method, article or terminal device including a series of elements not only includes those elements, but also includes those elements that are not explicitly listed. Other elements listed, or also include elements inherent to this process, method, article, or terminal device. If there are no more restrictions, the element defined by the sentence "including a..." does not exclude the existence of other same elements in the process, method, article, or terminal device that includes the element.

The above are the preferred embodiments of the present invention. It should be pointed out that for those of ordinary skill in the art, a number of improvements and modifications can be made without departing from the principles of the present invention, and these improvements and modifications are also included in the present invention. Within the scope of protection of the invention.

Claims (9)

A signal transceiving device, including: A housing, the housing is provided with a power input interface contact, a first signal interface contact and a magnetic component; A millimeter wave array antenna and a wireless network antenna arranged in the housing; The radio frequency circuit module arranged in the housing, wherein the millimeter wave array antenna, the wireless network antenna, and the first signal interface contact are respectively connected to the radio frequency circuit module; The power management chip arranged in the housing, wherein the power input interface contacts are connected to the power management chip. The signal transceiving device according to claim 1, wherein the number of the millimeter wave array antennas is at least two, and at least two of the millimeter wave array antennas have different orientations. The signal transceiving device according to claim 1, wherein a heat dissipation hole is provided on the housing. The signal transceiving device according to claim 1, wherein the signal transceiving device further comprises: A power access port provided on the housing, and the power access port is connected to the power management chip. The signal transceiving device according to claim 1, wherein the signal transceiving device further comprises: A battery arranged inside the casing, and the battery is connected to the power management chip. An electronic device, comprising a housing, and further comprising: the signal transceiving device according to any one of claims 1 to 5; Wherein, the signal transceiving device is arranged on the housing. 7. The electronic device according to claim 6, wherein the housing comprises a display screen and a battery back cover arranged opposite to the display screen, and the signal transceiving device is arranged on the battery back cover. 8. The electronic device according to claim 7, wherein a groove is provided on the back cover of the battery, and the signal transceiving device is adsorbed in the groove by the magnetic component. The electronic device according to claim 6, wherein the housing is provided with a power output interface contact and a second signal interface contact; Wherein, the power output interface contact is electrically connected to the power input interface contact, and the first signal interface contact is electrically connected to the second signal interface contact.

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