WO2021164342A1 - Die-taking and die-bonding mechanism and die bonder - Google Patents

Abstract

Provided in the present invention are a die-taking and die-bonding mechanism and a die bonder, relating to the technical field of die bonders. The die-taking and die-bonding mechanism comprises a portal frame bridge, a driving electric motor and a welding head assembly. The welding head assembly comprises a cantilever and a welding head selection box, the cantilever and the welding head selection box are arranged so as to be independent from each other, and a plurality of welding heads of different sizes arranged for the operation of wafers of different sizes are accommodated in the welding head selection box; the portal frame bridge is used for fixing the driving electric motor; the driving electric motor is respectively connected to the portal frame bridge and the cantilever, and is used for driving the cantilever to rotate; and the cantilever can select one welding head from the welding heads of different sizes in the welding head selection box to serve as a welding head to be connected, and the cantilever can be detachably connected to the welding head to be connected. By arranging the welding head selection box for accommodating the welding heads of different sizes, the required welding heads can be selected and connected by means of the rotation of the cantilevers, and the number of the cantilevers does not need to be greatly increased, thereby simplifying the structure of the cantilever and reducing the internal space of the die bonder.

Description

Crystal taking and crystal fixing mechanism and crystal fixing machine Technical field

The present invention relates to the technical field of die-bonding machines, in particular to a die-taking and die-bonding mechanism and a die-bonding machine.

Background technique

In the packaging process of semiconductor devices such as integrated circuits (ICs) and light-emitting diodes (LEDs), die bonding is an extremely important link. The process of die bonding is as follows: firstly, the glue dispensing mechanism (also called glue module) dispenses glue on the die bonding station of the substrate, and then the semiconductor chip is taken out from the wafer by the die bonding mechanism (also called die bond head) , And then transferred to the die bonding station where the glue has been dispensed.

Under the condition of the same yield (quality) of the die bonder, the die bond efficiency of the die bonder is an important indicator for evaluating the performance of the die bonder.

Generally, the chip to be packaged has a variety of different sizes, and therefore, a soldering head corresponding to the size of the die is required to perform the crystal taking and die attaching operations. In order to improve the efficiency of crystal taking and solidification, for example, a cross-shaped welding head cantilever assembly can be provided, which includes four cantilevers, and welding heads of different sizes can be arranged at the end of each cantilever.

However, the structure of the cantilever assembly of the welding head is complicated, which occupies a relatively large volume in the die bonder, and at the same time, there is a limitation in the scalability of the number of welding heads.

Summary of the invention

The purpose of the present invention is to provide a crystal taking and die attaching mechanism and a die attaching machine in view of the above-mentioned shortcomings of the prior art, so as to solve the crystal taking and die attaching problems of wafers of different sizes.

In order to achieve the above objectives, the technical solutions adopted by the present invention are as follows:

In the first aspect, the present invention provides a crystal taking and bonding mechanism, including: a gantry bridge, a drive motor and a welding head assembly,

The welding head assembly includes a cantilever and a welding head selection box. The cantilever and the welding head selection box are set independently of each other. The welding head selection box contains a plurality of welding heads of different sizes set for crystal fetching and die bonding operations of different sizes of wafers;

The gantry bridge is used to fix the drive motor; the drive motor is respectively connected with the gantry bridge and the cantilever, and the drive motor is used to drive the rotation movement of the cantilever;

The cantilever can select one welding head from the plurality of welding heads of different sizes in the welding head selection box as the welding head to be coupled, and the cantilever can be detachably coupled with the welding head to be coupled.

Optionally, the welding head selection box is arranged at a predetermined position relative to the cantilever, so that the plurality of welding heads of different sizes contained in the welding head selection box are within the rotation coverage of the cantilever.

Optionally, the plurality of welding heads of different sizes in the welding head selection box are arranged in an arc shape with respect to the center of rotation of the cantilever. During the connection, the cantilever performs a rotational movement so that one end of the cantilever is located above the one welding head.

Optionally, the crystal fetching and crystal bonding mechanism further includes a sliding track, and the welding head selection box is slidably arranged on the sliding track. When the cantilever needs to be connected with one of the welding heads of different sizes, The cantilever rotates so that one end of the cantilever is located at the preset position to be coupled, and the welding head selection box slides along the sliding track, so that the one welding head is located below the one end.

Optionally, the welding head selection box includes a plurality of accommodating cavities, the number of the accommodating cavities is greater than or equal to the number of the plurality of welding heads of different sizes, each accommodating cavity is provided with a corresponding mark and each accommodating cavity At most one corresponding welding head is accommodated in the accommodating cavity, and the identifier is used to indicate the size information of the welding head accommodated in the accommodating cavity.

Optionally, the crystal fetching and die bonding mechanism further includes an optical recognition device, which is used to recognize the mark on the accommodating cavity where the welding head to be connected is located, so as to determine the size information of the welding head to be connected.

Optionally, the crystal fetching and crystal bonding mechanism further includes an alarm device. When the size information of the welding head to be connected determined by the optical recognition device is inconsistent with the expected size information, the alarm device sends out an alarm signal.

Optionally, the cantilever includes a first cantilever and a second cantilever that are relatively fixed and linked to each other. The cantilever is used for detachably coupling with a second welding head of the plurality of welding heads of different sizes.

Optionally, the cantilever can be detachably coupled with the welding head to be coupled through a preset coupling mechanism.

In the second aspect, the present invention also provides a die bonder, including a substrate loading device, a glue dispensing device, and a wafer decoupling device, and the die bonder also includes the die taking and die bond mechanism according to the first aspect .

The beneficial effects of the present invention include:

The crystal taking and crystal fixing mechanism provided by the present invention includes: a gantry bridge, a drive motor and a welding head assembly. The welding head assembly includes a cantilever and a welding head selection box. The cantilever and the welding head selection box are set independently of each other, and the welding head selection box contains It is equipped with multiple welding heads of different sizes for the crystal fetching and die bonding operations of different sizes of wafers; the gantry bridge is used to fix the drive motor; the drive motor is respectively connected with the gantry bridge and the cantilever, and the drive motor is used to drive the cantilever The cantilever can select a welding head from the plurality of welding heads of different sizes in the welding head selection box as the welding head to be coupled, and the cantilever can be detachably coupled with the welding head to be coupled. By setting the welding head selection box accommodating multiple welding heads of different sizes, it is possible to select and connect the required welding heads from the welding head selection box by rotating the cantilever according to the size of the wafer to be fetched and die-attached. The number of cantilevers is greatly increased, thereby simplifying the structure of the cantilever and saving the internal space of the die bonder.

Description of the drawings

In order to more clearly describe the technical solutions in the embodiments of the present invention, the following will briefly introduce the drawings that need to be used in the description of the embodiments or the prior art. Obviously, the drawings in the following description are merely of the present invention. For some embodiments, those of ordinary skill in the art can obtain other drawings based on these drawings without creative work.

FIG. 1 shows a schematic structural view of an unconnected welding head state of a crystal fetching and crystal bonding mechanism provided by an embodiment of the present invention;

2 shows a schematic structural view of the state of the joint welding head of the crystal fetching and crystal bonding mechanism provided by an embodiment of the present invention;

Figure 3 shows a schematic structural diagram of a welding head assembly provided by an embodiment of the present invention;

Figure 4 shows a schematic structural view of a welding head assembly provided by another embodiment of the present invention;

Fig. 5 shows a schematic structural view of the state of the joint welding head of the crystal fetching and crystal bonding mechanism provided by another embodiment of the present invention.

Icon: 101-gantry bridge; 102-drive motor; 103-cantilever; 1031-first cantilever; 1032-second cantilever; 104-welding head selection box; 1041, 1042, 1043-welding head; 105-sliding rail.

Detailed ways

In order to make the objectives, technical solutions, and advantages of the embodiments of the present invention clearer, the following will clearly and completely describe the technical solutions in the embodiments of the present invention with reference to the accompanying drawings in the embodiments of the present invention. Obviously, the described embodiments These are a part of the embodiments of the present invention, but not all of the embodiments. The components of the embodiments of the present invention generally described and illustrated in the drawings herein may be arranged and designed in a variety of different configurations.

Therefore, the following detailed description of the embodiments of the present invention provided in the accompanying drawings is not intended to limit the scope of the claimed invention, but merely represents selected embodiments of the present invention. Based on the embodiments of the present invention, all other embodiments obtained by those of ordinary skill in the art without creative work shall fall within the protection scope of the present invention.

It should be noted that similar reference numerals and letters indicate similar items in the following figures. Therefore, once a certain item is defined in one figure, it does not need to be further defined and explained in subsequent figures.

In the description of the present invention, it should be noted that the terms "center", "upper", "lower", "left", "right", "vertical", "horizontal", "inner", "outer", etc. The indicated position or position relationship is based on the position or position relationship shown in the drawings, or the position or position relationship usually placed when the product of the invention is used, only for the convenience of describing the present invention and simplifying the description, rather than indicating or implying The referred device or element must have a specific orientation, be constructed and operated in a specific orientation, and therefore cannot be understood as a limitation of the present invention. In addition, the terms "first", "second", "third", etc. are only used for distinguishing description, and cannot be understood as indicating or implying relative importance.

In the description of the present invention, it should also be noted that the terms "set", "installation", "connected", and "connected" should be interpreted broadly unless otherwise clearly specified and limited. For example, they may be fixed connections. It can also be detachably connected or integrally connected; it can be mechanically connected or electrically connected; it can be directly connected or indirectly connected through an intermediate medium, and it can be the internal communication between two components. For those of ordinary skill in the art, the specific meanings of the above-mentioned terms in the present invention can be understood in specific situations.

Under the condition of the same yield (quality) of the die bonder, the die bond efficiency of the die bonder is an important indicator for evaluating the performance of the die bonder. Generally, the chip to be packaged has a variety of different sizes, and therefore, a soldering head corresponding to the size of the die is required to perform the crystal taking and die attaching operations. In order to improve the efficiency of crystal taking and solidification, for example, a cross-shaped welding head cantilever assembly can be provided, which includes four cantilevers, and welding heads of different sizes can be arranged at the end of each cantilever. However, the structure of the cantilever assembly of the welding head is complicated, which occupies a relatively large volume in the die bonder, and at the same time, there is a limitation in the scalability of the number of welding heads. Based on this, the embodiments of the present invention provide a crystal taking and die attaching mechanism to solve the problems of taking and die attaching a variety of wafers of different sizes.

Figure 1 shows a schematic structural view of the unconnected welding head of the crystal taking and die attaching mechanism provided by an embodiment of the present invention; Figure 2 shows the connecting welding head of the crystal taking and die attaching mechanism provided by an embodiment of the present invention Schematic diagram of the structure of the state.

As shown in Figure 1, the crystal taking and bonding mechanism provided by the embodiment of the present invention includes: a gantry bridge 101, a drive motor 102 and a welding head assembly. The welding head assembly includes a cantilever 103 and a welding head selection box 104. The cantilever 103 and the welding head The head selection boxes 104 are arranged independently of each other, and the welding head selection box 104 contains a plurality of welding heads of different sizes, such as welding heads 1041, 1042, 1043, which are set for crystal fetching and die bonding operations of different sizes of wafers. It should be understood that although three welding heads are shown in FIGS. 1 and 2, the present invention is not limited thereto. In practical applications, any number of welding heads can be provided as required.

The gantry bridge 101 is used to fix the drive motor 102; the drive motor 102 is respectively connected with the gantry bridge 101 and the cantilever 103, and the drive motor 102 is used to drive the rotation of the cantilever 103; the cantilever 103 can select all the boxes 104 from the welding head One of the plurality of welding heads 1041 to 1043 of different sizes is selected as the welding head to be connected. For example, the welding head 1043 shown in FIG. 2 is selected as the welding head to be connected, and the cantilever 103 can be connected to the welding head 1043 to be connected. Removably connected.

In practical applications, according to the size of all the wafers that need to be crystallized and bonded, a plurality of welding heads of corresponding sizes are preset in the welding head selection box 104. When performing crystal fetching and bonding operations, according to the size of the current wafer, the drive motor 102 drives the cantilever 103 to rotate and move to a suitable position, so as to select the corresponding welding head from the welding head selection box 104 and make it detachable Ground connection. After the cantilever 103 is connected to the selected welding head, the crystal fetching and bonding operations are performed. After the die fetching and die bonding operations for the current wafer are completed, if the current welding head does not need to be replaced for the size of the next wafer, the die fetching and die bonding operations will continue directly. If the size of the next wafer is required, the current Drive motor 102 to drive the cantilever 103 to rotate to an appropriate position, disassemble the current welding head, and re-accommodate the current welding head in the corresponding position in the welding head selection box 104, and then drive the motor 102 to drive the cantilever 103 Rotate movement to select and connect new welding heads.

Therefore, by setting the welding head selection box containing multiple welding heads of different sizes, the required welding heads can be selected and connected from the welding head selection box through the cantilever rotation movement according to the size of the wafer to be taken and die-attached. , There is no need to increase the number of cantilevers significantly, thereby simplifying the structure of the cantilever and saving the internal space of the die bonder.

Optionally, the welding head selection box 104 is arranged at a predetermined position relative to the cantilever 103, so that the plurality of welding heads 1041-1043 of different sizes accommodated in the welding head selection box 104 are within the rotation coverage range of the cantilever 103 . Optionally, as shown in FIG. 3, the plurality of welding heads 1041-1043 of different sizes in the welding head selection box 104 are arranged in an arc shape with respect to the center of rotation of the cantilever 103. When one welding head of a plurality of welding heads 1041-1043 of different sizes is connected, the cantilever 103 rotates so that one end of the cantilever 103 is located above the one welding head, and then the cantilever 103 is detachably connected.

Optionally, as shown in FIG. 4, the cantilever 103 includes a first cantilever 1031 and a second cantilever 1032 that are relatively fixed and linked to each other. The first welding head is detachably coupled, and the second cantilever 1032 is used for detachably coupling with the second welding head of the plurality of welding heads 1041-1043 of different sizes. Specifically, when the size of the chip to be packaged has a high usage rate for the first welding head with the first size and the second welding head with the second size, in order to reduce the number of times the welding head is disassembled and replaced, the crystal picking and solidification are improved. For crystal efficiency, two cantilevers can be set, and the angle Q between the two cantilevers is preferably less than or equal to 90°, for example, Q can be 30° to 60°, for example, Q can be 30°, 45°, or 60°. °.

It should be understood that with the increase in the size and type of wafers and the increase in the utilization rate of welding heads of various sizes, the number of cantilevers can be further increased as required. Based on the design structure of the present invention, in the case of increasing the number of cantilevers, although the structure may be complicated, compared with the prior art, the detachable selection structure of multiple cantilevers and multiple welding heads in the present invention can be more flexible. The structure design.

Optionally, as shown in FIG. 5, the crystal fetching and bonding mechanism further includes a sliding rail 105, and the welding head selection box 104 is slidably arranged on the sliding rail 105. When one of the welding heads of the heads 1041-1043 is connected, the cantilever 103 performs a rotational movement so that one end of the cantilever 103 is located at the preset position to be connected, and the welding head selection box 104 slides along the sliding rail 105, so that the one welding head is located Below the one end. At this time, the welding heads in the welding head selection box 104 may be arranged linearly.

Optionally, the welding head selection box 104 includes a plurality of accommodating cavities, the number of the accommodating cavities is greater than or equal to the number of the plurality of welding heads of different sizes, each accommodating cavity is provided with a corresponding mark and each At most one corresponding welding head is accommodated in the accommodating cavity, and the identifier is used to indicate size information of the welding head accommodated in the accommodating cavity. Through the mark, you can easily identify the size information of the welding head.

Optionally, the crystal fetching and die bonding mechanism further includes an optical recognition device, which is used to recognize the mark on the containing cavity where the welding head to be connected is located, so as to determine the size information of the welding head to be connected. Optionally, the crystal fetching and crystal bonding mechanism further includes an alarm device. When the size information of the welding head to be connected determined by the optical recognition device is inconsistent with the expected size information, the alarm device sends out an alarm signal.

Optionally, the cantilever can be detachably coupled with the welding head to be coupled through a preset coupling mechanism.

In addition, an embodiment of the present invention also provides a die bonder, including a substrate loading device, a glue dispensing device, and a wafer decoupling device. The die bonder also includes the die picking and die bonder provided in the above embodiments of the present invention. mechanism.

The above are only preferred embodiments of the present invention and are not used to limit the present invention. For those skilled in the art, the present invention can have various modifications and changes. Any modification, equivalent replacement, improvement, etc. made within the spirit and principle of the present invention should be included in the protection scope of the present invention.

Claims (10)

A crystal fetching and crystal fixing mechanism, which is characterized by comprising: a gantry bridge, a drive motor and a welding head assembly, The welding head assembly includes a cantilever and a welding head selection box. The cantilever and the welding head selection box are arranged independently of each other. Multiple welding heads of different sizes; The gantry bridge is used to fix the drive motor; the drive motor is respectively connected with the gantry bridge and the cantilever, and the drive motor is used to drive the rotation movement of the cantilever; The cantilever can select one welding head from the plurality of welding heads of different sizes in the welding head selection box as the welding head to be coupled, and the cantilever can be detachably coupled with the welding head to be coupled . The crystal taking and bonding mechanism according to claim 1, wherein the welding head selection box is arranged at a predetermined position relative to the cantilever, so that the welding head selection box accommodates the multiple Welding heads of different sizes are located within the rotation coverage of the cantilever. The crystal taking and crystal fixing mechanism according to claim 2, wherein the plurality of welding heads of different sizes in the welding head selection box are arranged in an arc shape with respect to the rotation center of the cantilever. When the cantilever needs to be coupled with one of the plurality of welding heads of different sizes, the cantilever performs a rotational movement so that one end of the cantilever is located above the one welding head. The crystal taking and crystal fixing mechanism according to claim 1, further comprising a sliding track, the welding head selection box is slidably arranged on the sliding track, and when the cantilever needs to interact with the plurality of When one of the welding heads of different sizes is connected, the cantilever rotates so that one end of the cantilever is located at the preset position to be connected, and the welding head selection box slides along the sliding track, so that The one welding head is located below the one end. The crystal fetching and crystal bonding mechanism according to any one of claims 1 to 4, wherein the welding head selection box comprises a plurality of accommodating cavities, and the number of the accommodating cavities is greater than or equal to the number of accommodating cavities. The number of welding heads of different sizes, each containing cavity is provided with a corresponding identification and each containing cavity contains at most one corresponding welding head, and the identification is used to indicate the welding head contained in the containing cavity. Head size information. The crystal taking and crystal bonding mechanism according to claim 5, further comprising an optical recognition device, the optical recognition device is used to recognize the mark on the accommodating cavity where the welding head to be connected is located, so as to determine The size information of the welding head to be connected. The crystal taking and bonding mechanism according to claim 6, further comprising an alarm device, when the size information of the welding head to be connected determined by the optical identification device is inconsistent with the expected size information, The alarm device emits an alarm signal. The crystal fetching and crystal bonding mechanism according to any one of claims 1 to 4, wherein the cantilever includes a first cantilever and a second cantilever that are relatively fixed and linked to each other, and the first cantilever is used to communicate with each other. A first welding head of the plurality of welding heads of different sizes is detachably coupled, and the second cantilever is used for detachably coupling with a second welding head of the plurality of welding heads of different sizes . The crystal taking and crystal fixing mechanism according to claim 1, wherein the cantilever can be detachably connected with the welding head to be connected through a predetermined connecting mechanism. A die bonder, comprising a substrate loading device, a glue dispensing device, and a wafer decoupling device, and is characterized in that it further comprises the die taking and die bonding mechanism according to any one of claims 1 to 9.

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