WO2021160114A1 - Heat dissipation assembly and electronic device carrying same - Google Patents

Abstract

The present application provides a heat dissipation assembly and an electronic device carrying same. The heat dissipation assembly comprises: a first cover plate, which has a first cavity, with the bottom of the first cavity being provided with a protrusion; and a second cover plate, which has a second cavity, with the bottom of the second cavity being provided with a protruding fin array which comprises a plurality of fins, wherein the surface of at least some of the fins has a microstructure configured thereon, and the adjacent two protruding fins define a flow channel for storing a working medium. In the heat dissipation assembly, after the first cover plate and the second cover plate are assembled, a steam cavity is formed using the support effect of the protrusion such that heat generated by a heat source such as an electronic element and received by a second cover plate side is transferred to the steam cavity by means of the phase change of the working medium in the flow channel so as to achieve heat transfer in the steam cavity, thereby achieving high-efficiency heat transfer and also having a good temperature equalization performance.

Description

Heat dissipation component and electronic equipment carrying it Technical field

The present invention relates to the field of heat dissipation technology, in particular to a heat dissipation assembly for cooling electronic components and an electronic device equipped with the heat dissipation assembly.

Background technique

With the rapid development and popularization of electronic information technology, the development of electronic components presents a trend of high speed, high frequency and high integration. Such high calculation rate makes the power density of the chip continue to rise to a new height, making it possible in a short time The temperature rises sharply. Excessive temperature reduces the stability and accuracy of electronic components, and at the same time accelerates the aging of the product and reduces the cycle life. Therefore, the heat dissipation technology of electronic products is gradually becoming a bottleneck in the upgrading of electronic products, and the research and development of safe and efficient heat dissipation technology has become the top priority in the current electronic product field. Steam cavity heat pipes use liquid phase change, which has good temperature uniformity and heat dissipation capacity, and has become the mainstream technology of passive heat dissipation. However, the efficiency of such steam cavity heat pipes is not high. How to improve the phase change efficiency of the phase change medium? In thinner electronic products, improving heat dissipation efficiency is becoming more and more urgent.

technical problem

Therefore, there is an urgent need in the industry for a miniaturized, light and thin steam chamber heat dissipation component.

Technical solutions

The purpose of the present invention is to provide a new heat dissipation component, which is used to provide high-efficiency cooling for electronic components with a small area and high heat flux density. The internal structure of the heat dissipation component is simple.

In order to achieve the above objective, the present application adopts the following technical solutions.

A heat dissipation component, characterized in that it has:

The first cover plate has a first cavity, and the bottom of the first cavity is provided with protrusions,

The second cover plate has a second cavity, the bottom of the second cavity is configured with a protruding fin array, the fin array includes a plurality of fins, and two adjacent fins constitute a flow channel for storing the working fluid .

Preferably, part or all of the surface of the at least part of the fin is configured with a microstructure. That is, a microstructure is arranged on a part of the plural fins included in the fin line, and the microstructure is arranged on part or all of the surface of the fin. Or all the fins of the plurality of fins included in the fin array are configured with microstructures, and the microstructures are disposed on part or all of the surfaces of the fins.

Preferably, the fin array includes alternately arranged first fin arrays and second fin arrays, the first fin array includes a plurality of first fins, the tops of which are connected to the ends of the protrusions, and The second fin array includes a plurality of second fins, and the height h1 of the first fin is greater than the height h2 of the second fin.

Preferably, the ratio of the height h2 of the second fin to the height h1 of the first fin is greater than or equal to 0.1, and the preferred ratio is between 0.1 and 0.95.

Preferably, at least part of the surface of the first fin is configured with a microstructure.

Preferably, the top protrusion of the first fin is in a continuous strip shape, and its end is connected with the first fin array to form a steam passage.

Preferably, the protrusions are in the shape of discrete cylinders, spheres, hemispheres, or rhombuses, which are arranged in an array or randomly.

Preferably, the cross section of the flow channel is U-shaped, quadrangular or triangular.

Preferably, the microstructure includes protrusions and/or depressions or the microstructure includes a porous material layer.

Preferably, the working fluid contains at least one or more of water, deionized water, alcohol, methanol, acetone, and ethylene glycol.

An embodiment of the present application also provides an electronic device equipped with the above-mentioned heat dissipation component. Since the heat dissipation component can be designed to be very thin, it can be used in thin and light electronic devices, such as smart phones.

Beneficial effect

Compared with the solution in the prior art, the heat dissipation assembly proposed in the embodiment of the present application has a simple structure, and the entire surface of the heat absorption structure is used for cooling, so it has extremely high thermal conductivity, good temperature uniformity, and a small area and high heat flux density. Electronic components provide efficient cooling.

Description of the drawings

In order to more clearly describe the technical solutions in the embodiments of this specification or the prior art, the following will briefly introduce the drawings that need to be used in the description of the embodiments or the prior art. Obviously, the drawings in the following description are only These are some embodiments described in this specification. For those of ordinary skill in the art, other drawings can be obtained based on these drawings without creative labor.

FIG. 1 is a schematic structural diagram of a heat dissipation component according to an embodiment of the application.

FIG. 1a is a schematic view of the structure of FIG. 1 from a perspective.

Fig. 1b is a schematic cross-sectional view of B-B in Fig. 1a.

FIG. 2 is a schematic diagram of the structure of the first cover plate of the first embodiment of the application.

FIG. 3 is a schematic diagram of the structure of the first cover plate of the second embodiment of the application.

4 is a schematic diagram of the structure of the first cover plate of the third embodiment of the application.

FIG. 5 is a schematic structural diagram of a second cover plate according to an embodiment of the application.

Fig. 6 is a schematic cross-sectional view of A-A in Fig. 5.

Fig. 7 is a partial enlarged schematic diagram of B in Fig. 6.

Fig. 8 is a schematic cross-sectional view of a modified embodiment of A-A in Fig. 5.

Fig. 9 is a partial enlarged schematic diagram of C in Fig. 8.

The best mode of the present invention

In order to enable those skilled in the art to better understand the technical solutions proposed by the present invention, the following will clearly and completely describe the technical solutions in the embodiments of this specification with reference to the accompanying drawings in the embodiments of this specification. Obviously, the described The embodiments are only a part of the embodiments in this specification, rather than all the embodiments. Based on one or a plurality of embodiments in this specification, all other embodiments obtained by a person of ordinary skill in the art without creative work shall fall within the protection scope of the present invention.

The present application provides a heat dissipation component, which is used to provide efficient cooling for electronic components with a small area and high heat flow density, so as to solve the problem of high heat flow density heat dissipation in a small space, and greatly improve the heat dissipation efficiency and temperature uniformity of the heat dissipation component. Its overall thickness is small and can be used for heat dissipation of portable and intelligent processors. At least part of the surface of the fin is provided with a capillary structure to increase the capillary force. The heat dissipation component has: a first cover plate with a first cavity, the bottom of the first cavity is provided with protrusions, a second cover plate with a second cavity, and the bottom of the second cavity is provided with A protruding fin array, the fin array includes a plurality of fins, and two adjacent fins form a flow channel for storing the working fluid. That is, the recess between two adjacent fins is used to store the working fluid. The adjacent flow channels are connected. Part or all of the surface of the fin is configured with microstructures to increase the capillary force of the flow channel. The heat dissipation component has a simple structure. After the first cover plate and the second cover plate are combined, the protrusions play a supporting role to form a steam cavity. The phase change of the working fluid in the flow channel is used to convert the heat generated by the electronic components and other heat sources received on the second cover plate side. It is transferred to the steam chamber to realize the transfer of heat in the steam chamber, thereby realizing high-efficiency heat transfer and having good temperature uniformity performance. The flow channel (the cross section) is U-shaped, inverted triangle or square. In this way, the heat dissipation component utilizes the phase change and flow process of the working fluid in the flow to uniformly transfer and disperse the heat of the heat source received on the side of the second cover plate, thereby realizing efficient heat transfer. The heat dissipation component has good temperature uniformity performance.

The heat dissipation assembly proposed in the present application will be described in detail below with reference to the accompanying drawings.

Figure 1 is a schematic structural diagram of a heat dissipation assembly according to an embodiment of the application; the heat dissipation assembly 100 has: a first cover 101, and a second cover 102 matingly connected with the first cover 101. During production, the first After the cover plate 101 and the second cover plate 102 are combined, the working fluid is injected through the injection port and then the injection port is vacuum-sealed. Fig. 1a is a schematic structural view from a perspective of Fig. 1; Fig. 1b is a schematic cross-sectional view of BB in Fig. 1a; there are protrusions 101c in the first cavity a in the first cover plate 101, which are connected with the first fin array 102b, To form a steam chamber. The two fins in the second fin array 102c constitute a flow channel for storing the working fluid. The material of the first cover plate/the second cover plate can be copper or aluminum, stainless steel, copper alloys, metals such as titanium, titanium alloys, or polymers such as PI and PET.

Next, the heat dissipation assembly of the application embodiment will be described in detail with reference to FIGS. 2-9.

Figure 2 is a schematic structural diagram of the first cover plate of the first embodiment; one side of the first cover plate 101 is provided with a side wall 101b, and one side of the side wall 101b is provided with an injection port 101a through which The injection port 101a injects a cooling liquid working fluid into the heat dissipation component, and after injecting a preset amount of working fluid, the injection port 101a is evacuated and sealed. The first cover plate 101 is hermetically connected to the second cover plate 102 (not shown) through the end of the side wall 101b. The phase change working fluid includes at least one or a combination of water, deionized water, alcohol, methanol, acetone, ethylene glycol, and the like. In this embodiment, the protrusion 101c is arranged in a continuous elongated shape. The end of the protrusion 101c and the end of the side wall 101b are in the same plane, or the end of the protrusion 101c does not exceed the plane of the end of the side wall 101b (see FIG. 1b).

In one embodiment, the protrusions are discontinuously arranged in sections, as shown in FIG. 3, the first cover 201 has a first cavity therein, one side of which is provided with a side wall 201b, and one side of the first cover 201 has a side wall 201b The side wall 201b is provided with an injection port 201a. The bottom of the first cavity is provided with a plurality of sectioned protrusions 201c. There are grooves 201d between adjacent protrusions. The length of each section or each protrusion is the same or different. . The width of the protrusion (L1-L2 direction) is between 10 μm and 3 mm, and the width of the interval between adjacent protrusions is between 100 μm and 10 mm.

In one embodiment, the cross-section of the protrusion is rectangular, and at least one side includes a sharp angle; or the cross-section is round or round (semi-circular), and the protrusions are randomly arranged or arrayed. Configuration, the diameters can be the same or different, and the width of the protrusion is the diameter or the largest diameter.

In one embodiment, the protrusions are arranged in an array, as shown in FIG. An injection port 301a is arranged, and a plurality of protrusions 301c are arranged at the bottom of the first cavity. The protrusion 301c has a rhombus shape. In other embodiments, the protrusion 301c can be cylindrical, spherical, hemispherical, etc., and can be arranged in an array or randomly.

Next, the structure of the second cover plate of an embodiment of the present application will be described with reference to FIGS. 5-9. The second cover plate 102 includes a side wall 102a, which is used to connect with the side wall (not shown) of the first cover plate. , There is a second cavity inside, and the bottom of the second cavity is provided with protruding fins.

Please refer to FIG. 6 and FIG. 7 for a schematic cross-sectional view of A-A in FIG. 5 according to an embodiment; the bottom of the second cavity is provided with a protruding first fin array 102b and a second fin array 102c.

The first fin array 102b includes a plurality of first fins 102b1, and the top portion 102b2 of the first fin array 102b is used to connect with the end of the protrusion (not shown). Preferably, the surface of the first fin is at least partially configured with a microstructure 102d (micro-nano structure), and two adjacent first fins constitute a flow channel for storing the working fluid (or the first fin and its adjacent side wall It constitutes the flow channel of the storage working fluid), and the two adjacent flow channels are connected. The microstructure is arranged on the surface of the fin to increase the capillary force, so that the liquid working fluid is stored in the flow channel. Preferably, the top 102b2 of the first fin 102b1 is on the same plane. In one embodiment, the top 102b2 of the first fin 102b1 is in the same plane as the end of the side wall 102b.

The second fin array 102c includes a plurality of second fins 102c1. The surface of the second fin is at least partially configured with a microstructure 102d (micro-nano structure), and two adjacent second fins (between) constitute a storage working medium. The flow channel (or the second fin and its adjacent side wall constitute a flow channel for storing working fluid), and two adjacent flow channels are connected. The microstructure is arranged on the surface of the fin to increase the capillary force, so that the liquid working fluid is easily stored in the flow channel.

In this embodiment, the height h1 of the first fin 102b1 is higher than the height h2 of the second fin 102c1, so that after the second cover plate is combined with the first cover plate, the top 102b2 of the first fin 102b1 and the first cover plate The ends of the protrusions are in contact with each other, so that the two adjacent protrusions and the matching first fin array, and the inner side of the first/second cover plate and the adjacent protrusions and the matching first fin array, It constitutes the air passage through which steam flows. The ratio of the height h2 of the second fin to the height h1 of the first fin is greater than or equal to 0.1. Preferably, the ratio of the height h2 of the second fin to the height h1 of the first fin is between 0.1 and 0.95 (in this way, the steam pressure is used to improve the efficiency of the air passage). The width w1 of the first fin array is equivalent to the width w2 of the second fin array between two adjacent first fin arrays or w1<w2. The width w3 of the first fin array and the second fin array between the adjacent sidewalls.

The first fin array and the second fin array are alternately arranged. After the first and second cover plates are combined, the protrusions are used to contact the top of the first fin to form a supporting part, between two adjacent supporting parts or supporting parts The inner side of the side wall of the adjacent first/second cover forms an air passage through which steam flows. Two adjacent second fins included in the second fin array constitute a flow channel for storing the working fluid. Preferably, two adjacent first fins included in the first fin array also constitute a flow channel for storing the working fluid. The adjacent flow channels are connected, which is equivalent to the entire surface for cooling. By disposing microstructures on at least part of the surface of the second fin or disposing microstructures on at least part of the surfaces of the first fin and the second fin, the capillary force of the flow channel is increased, and the heat dissipation efficiency of the heat dissipation component is further improved.

As a modification of the embodiment in FIG. 6, FIGS. 8 and 9 are schematic cross-sectional views of the second cover plate of another embodiment. The second cover plate includes a side wall 202a, which is used to connect with the side wall (not shown) of the first cover plate, and has a second cavity therein. The fin array includes a plurality of protruding fins 202b, and at least part of the surface of the fin 202b is configured with a microstructure, and the microstructure includes a plurality of protrusions 202c. In other embodiments, the microstructure includes a plurality of depressions. In one embodiment, the microstructure is a porous material layer of porous material or a secondary microstructure. The height of the fin 202b is basically the same, and the depth of the recess between the two fins 202b is the same. Or the height of the fin 202b is basically the same, and the depth of the recess between the two fins 202b is different. The end 202b1 of part of the fin 202b is in contact with the protrusion of the first cover plate (not shown), so that after the first and second cover plates are combined, the protrusion of the first cover plate constitutes a supporting member, and two adjacent fins 202b will To form the flow channel of the storage working fluid, at least a part of the surface of the fin 202b is configured with microstructures, which improves the capillary force, improves the capacity of accommodating the liquid working fluid, and further improves the heat dissipation efficiency of the heat dissipation component. In this way, the protrusions contacting the end 202b1 of the fin 202b may be continuous, or may be discrete protrusions arranged in an array or randomly arranged. After the first and second cover plates are combined, the vapor cavity is separated by the protrusion, and the liquid working fluid is stored in the flow channel.

In one embodiment, the convex configuration of the first cover plate includes at least one sharp angle, and the convex cross-section is round and semicircular, so that the bottom of the first cavity and the fin are in contact with the top of the fin. Spaces between them are used as steam chambers to transfer heat.

In the design of the heat dissipation component, the structure is simple, with a first cover plate and a matching second cover plate. The bottom of the second cavity of the second cover plate is provided with a protruding fin array, and the fin array includes a plurality of For the fin, at least part of the surface of the fin is configured with a microstructure, and two adjacent fins constitute a flow channel for storing the working fluid (sometimes, the recess between the fin and its adjacent side wall constitutes the flow channel for storing the working fluid). The adjacent flow channels are connected. After the first cover plate and the second cover plate are combined, the protrusions play a supporting role to form a steam chamber. The phase change of the working fluid in the flow channel is used to transfer the heat generated by the heat sources such as electronic components received on the second cover plate side to the steam chamber, and The heat transfer is realized in the steam cavity, thereby realizing high-efficiency heat transfer. At least part of the surface of the fin is configured with microstructures to increase capillary force and further improve the heat dissipation efficiency of the heat dissipation component.

In the design of the fin, at least part of the surface of the fin is configured with a microstructure, the microstructure includes a convex and/or concave design, or the microstructure includes a porous material. Such a design increases the capillary force of the working medium and improves the heat dissipation effect.

In the design of the fin, it includes a plurality of first fins, the ends of which are in contact (connected) with the protrusions. Preferably, the protrusions are in a continuous strip shape, so that the ends of the first fins are in contact with the protrusions. After the contact, a steam channel is formed between two adjacent protrusions and includes a plurality of second fins, and the height of the second fins is lower than the height of the first fins. The second fin is used to form a flow channel for storing the working fluid. In order to improve its ability to store the working fluid, preferably, a microstructure is arranged on part or all of the surface of the second fin to improve the storage capacity of the working fluid. At the same time, the heat dissipation efficiency is improved. Preferably, a microstructure is disposed on part or all of the surface of the first fin. The microstructure may be a porous layer composed of porous materials.

In the design of the first cover plate, a first cavity is arranged in it, and a plurality of protrusions are arranged on the bottom of the cavity. Preferably, the top (also called the end) of the protrusion and the end of the side wall are in the same plane. Or the protrusion does not protrude from the plane where the end of the side wall is located. The protrusion is in the shape of a continuous rectangular parallelepiped or an intermittent rectangular parallelepiped shape, and the length of each section or each may be the same or different. The interval between the protrusions of adjacent protrusions is between 100 μm and 10 mm. Preferably, the cross-section of the protrusion is quadrangular or at least one side includes a sharp-angled shape or a round bag shape, or the cross-section is circular (semi-circular). Preferably, when the protrusions are discontinuously discrete, they are randomly arranged or arranged in an array.

In the design of the second cover plate, there is a second cavity inside. The bottom of the second cavity is provided with a protruding fin array. The fin array includes a plurality of fins protruding from the bottom of the second cavity. The heights of the fins are the same or different, and at least part of the surface of the fins are configured with microstructures; or the heights of the fins are the same, and the depths of the recesses between the two fins are the same or different.

The heat dissipation component in the above embodiment can be used to dissipate heat from the electronic components of the electronic device (such as a processor, a battery, etc.). Preferably, the thickness of the heat dissipation component is less than 3 mm, which can well solve the heat dissipation problem in a narrow space.

The above-mentioned embodiments are only to illustrate the technical concept and characteristics of the present invention, and their purpose is to enable people familiar with the technology to understand the content of the present invention and implement them accordingly, and should not limit the protection scope of the present invention. All equivalent changes or modifications made in accordance with the spirit of the present invention should be covered by the protection scope of the present invention.

Claims (1)

A heat dissipation component, characterized in that it has: The first cover plate has a first cavity, and the bottom of the first cavity is provided with protrusions, The second cover plate has a second cavity, the bottom of the second cavity is configured with a protruding fin array, the fin array includes a plurality of fins, and two adjacent fins constitute a flow channel for storing the working fluid . 2. The heat dissipation assembly of claim 1, wherein: At least part of the surface or the entire surface of the fin is configured with a microstructure. 3. The heat dissipation assembly of claim 1, wherein: The fin array includes a first fin array and a second fin array that are alternately arranged, The first fin array includes a plurality of first fins, the tops of which are connected to the ends of the protrusions, The second fin array includes a plurality of second fins, and the height h1 of the first fin is greater than the height h2 of the second fin. 4. The heat dissipation assembly of claim 3, wherein the ratio of the height h2 of the second fin to the height h1 of the first fin is greater than or equal to 0.1. 5. The heat dissipation assembly of claim 3, wherein the protrusions are in a continuous strip shape, and the ends of the protrusions are connected with the first fin array to form a steam passage. 6. The heat dissipation assembly of claim 1, wherein the protrusions are discrete cylinders, spheres, hemispheres, or rhombuses, which are arranged in an array or randomly. 7. The heat dissipation assembly of claim 1, wherein: The cross section of the flow channel is U-shaped, quadrangular or triangular. 8. The heat dissipation assembly of claim 1, wherein: The microstructure includes protrusions and/or depressions or the microstructure includes a porous material layer. 9. The heat dissipation assembly of claim 1, wherein: The working fluid includes at least one or more of water, deionized water, alcohol, methanol, acetone, and ethylene glycol. 10. An electronic device, characterized in that it is equipped with the heat dissipation assembly according to any one of claims 1-9.