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WO2021158041A1 - Module de câble et son procédé de fabrication - Google Patents

Module de câble et son procédé de fabrication Download PDF

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Publication number
WO2021158041A1
WO2021158041A1 PCT/KR2021/001493 KR2021001493W WO2021158041A1 WO 2021158041 A1 WO2021158041 A1 WO 2021158041A1 KR 2021001493 W KR2021001493 W KR 2021001493W WO 2021158041 A1 WO2021158041 A1 WO 2021158041A1
Authority
WO
WIPO (PCT)
Prior art keywords
ground
cover layer
magnetic layer
layer part
disposed
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Ceased
Application number
PCT/KR2021/001493
Other languages
English (en)
Korean (ko)
Inventor
양철용
박상용
김영태
김남일
이경호
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Kespion Co Ltd
Original Assignee
EMW Co Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by EMW Co Ltd filed Critical EMW Co Ltd
Publication of WO2021158041A1 publication Critical patent/WO2021158041A1/fr
Anticipated expiration legal-status Critical
Ceased legal-status Critical Current

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Classifications

    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01B—CABLES; CONDUCTORS; INSULATORS; SELECTION OF MATERIALS FOR THEIR CONDUCTIVE, INSULATING OR DIELECTRIC PROPERTIES
    • H01B7/00—Insulated conductors or cables characterised by their form
    • H01B7/08—Flat or ribbon cables
    • H01B7/0861—Flat or ribbon cables comprising one or more screens
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01B—CABLES; CONDUCTORS; INSULATORS; SELECTION OF MATERIALS FOR THEIR CONDUCTIVE, INSULATING OR DIELECTRIC PROPERTIES
    • H01B13/00—Apparatus or processes specially adapted for manufacturing conductors or cables
    • H01B13/22—Sheathing; Armouring; Screening; Applying other protective layers
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01B—CABLES; CONDUCTORS; INSULATORS; SELECTION OF MATERIALS FOR THEIR CONDUCTIVE, INSULATING OR DIELECTRIC PROPERTIES
    • H01B7/00—Insulated conductors or cables characterised by their form
    • H01B7/08—Flat or ribbon cables
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01B—CABLES; CONDUCTORS; INSULATORS; SELECTION OF MATERIALS FOR THEIR CONDUCTIVE, INSULATING OR DIELECTRIC PROPERTIES
    • H01B9/00—Power cables
    • H01B9/02—Power cables with screens or conductive layers, e.g. for avoiding large potential gradients
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01B—CABLES; CONDUCTORS; INSULATORS; SELECTION OF MATERIALS FOR THEIR CONDUCTIVE, INSULATING OR DIELECTRIC PROPERTIES
    • H01B9/00—Power cables
    • H01B9/02—Power cables with screens or conductive layers, e.g. for avoiding large potential gradients
    • H01B9/028—Power cables with screens or conductive layers, e.g. for avoiding large potential gradients with screen grounding means, e.g. drain wires

Definitions

  • the present invention relates to a cable module and a method for manufacturing the same, and more particularly, a flexible circuit board (FPCB) capable of improving electromagnetic wave shielding and noise shielding performance by providing a magnetic layer on the opposite side where a transmission line is formed; It relates to a cable module of Flexible Printed CircuitBoard) type and a method for manufacturing the same.
  • FPCB flexible circuit board
  • a coaxial cable having a transmission line therein is used for transmission of an internal electrical signal.
  • the coaxial cable had a limited use area due to its high cost.
  • the present invention is a cable module capable of improving electromagnetic wave shielding and noise shielding performance by providing a magnetic layer on the opposite side where a transmission line is formed, and a method for manufacturing the same provides
  • a flexible cable module capable of slimming a mobile terminal by implementing multiple lines in a limited space and a method for manufacturing the same are provided.
  • a base substrate made of an insulating material; a transmission unit disposed on one side of the base substrate; a first grounding unit disposed along the transmission unit at both ends of one side of the base substrate; the other side of the base substrate A second ground portion disposed at both ends to correspond to the first ground portion; A first magnetic layer portion disposed on the other side of the second ground portion; A first cover layer disposed on one side of the transmission unit and the first ground portion part; a second cover layer part disposed on the other side of the first magnetic layer part; a third ground part disposed on one side of the first cover layer part; and a fourth ground part disposed on the other side of the second cover layer part; It provides a cable module, including.
  • the first cover layer part, the third ground part, the second cover layer part, and the fourth ground part may be connected through a via hole.
  • a second magnetic layer part is disposed on one side of the third ground part, a third cover layer part is disposed on one side of the second magnetic layer part, and a third magnetic layer part is disposed on the other side of the fourth ground part,
  • the third magnetic A fourth cover layer part may be disposed on the other side of the layerer.
  • a method for manufacturing a cable module comprising: disposing a base substrate having a first metal layer formed on one side and a second metal layer formed on the other side; Disposing a first magnetic layer portion on the other side; Forming a transfer portion and a first ground portion by etching the first metal layer; Forming an air gap by etching the second metal layer and the second magnetic layer portion; The transfer portion and disposing a first cover layer part on one side of the first ground part; arranging a second cover layer part on the other side of the first magnetic layer part; arranging a third ground part on one side of the first cover layer part; and arranging a fourth grounding part on the other side of the second cover layer part; including, providing a cable module manufacturing method.
  • the method may further include forming a via hole to connect the first cover layer part, the third ground part, the second cover layer part, and the fourth ground part.
  • the method may further include disposing a fourth cover layer part on the other side of the third magnetic layer part.
  • the present invention it is possible to improve the electromagnetic wave shielding and noise shielding performance of the cable module by providing a magnetic layer on the opposite side where the transmission line is formed.
  • FIG. 1 is a schematic diagram of a cable module according to an embodiment of the present invention.
  • FIG. 2 is a cross-sectional view of a cable module according to an embodiment of the present invention.
  • 3 and 4 are reference views for explaining a method of manufacturing a cable module according to another embodiment of the present invention.
  • FIG. 1 is a schematic diagram of a cable module 100 according to an embodiment of the present invention
  • FIG. 2 is a cross-sectional view taken along II-II of FIG. 1 .
  • the cable module 100 includes a base substrate 110 , a transmission unit 115 , a first grounding unit 113 , and a second grounding unit 117 . , a first magnetic layer part 121 , a first cover layer part 133 , a second cover layer part 131 , a third ground part 143 , and a fourth ground part 141 .
  • the cable module 100 is a process capable of manufacturing a circuit or cable having flexibility, such as a flexible printed circuit board (FPCB) process or a flat flexible cable (FFC) process is available.
  • FPCB flexible printed circuit board
  • FFC flat flexible cable
  • the base substrate 110 is formed of an insulating material, and may be formed of an insulating material that can be easily bent, such as polyimide, which is a raw material for a flexible printed circuit board.
  • the base substrate 110 may be formed of, in addition to polyimide, polyethylene phthalate (PET) and thermoplastic polyurethane (TPU).
  • the transmission unit 115 is a component for transmitting a signal, is disposed on one side of the base substrate 110 and may be made of a material having excellent electrical conductivity, such as copper (Cu).
  • the transmission unit 115 may be formed by etching a portion of the copper thin film layer, and may be formed in a strip line shape through an etching process.
  • 'one side' may mean 'lower side' in the drawing.
  • the first ground unit 113 may be disposed along the transmission unit 115 at both ends of one side of the base substrate 110 .
  • the first ground unit 113 is formed of the same copper (Cu) as the transmission unit 115 . It may be formed of the same conductive material, and may be formed together with the transmission unit 115 by etching the copper thin film. Specifically, a pair of air gaps 116 are formed through the etching process of the copper thin film, and the center portion
  • the transfer unit 115 is formed in the , and a pair of first ground units 113 may be formed on both sides of the base substrate 110 with the transfer unit 115 interposed therebetween.
  • the second ground unit 117 may be disposed at both ends of the other side of the base substrate 110 to correspond to the first ground unit 113 .
  • the second ground portion 117 may be formed of a conductive material such as copper (Cu) in the same manner as the first ground portion 113 , and may be formed to correspond to the first ground portion 113 by etching a copper thin film.
  • the cross section of the second grounding part 117 may be formed to be the same as that of the first grounding part 113 .
  • 'the other side' may mean 'upper side' in the drawing.
  • the first magnetic layer part 121 may be disposed on the other side of the second ground part 117 .
  • the first magnetic layer part 121 is for shielding electromagnetic waves, and may be any one of a magnetic Ni (nickel) or Mn (manganese)-based structure, and a Fe-Si-based metal having a magnetic permeability and capable of manufacturing a thin film. It may include a blowout core.
  • the first magnetic layer part 121 may be coated on the second ground part 117 in the form of a thin film.
  • the first magnetic layer part 121 After the first magnetic layer part 121 is deposited on the second ground part 117 , it may be etched together with the second ground part 117 , and an air gap 125 may be formed by the etching process.
  • the first magnetic layer part 121 is not necessarily etched together with the second ground part 117 , and after etching the second ground part 117 , the first magnetic layer having the same shape as the second ground part 117 . It is also possible for the portion 121 to be deposited.
  • the first cover layer part 133 may be disposed on one side of the transmission part 115 and the first ground part 113 .
  • the first cover layer part 133 may be formed of an insulating material, and may be disposed by being adhered to one side of the transmission part 115 and the first contact part.
  • the transmission unit 115 is surrounded by the first ground unit 113 , the base substrate 110 , and the first cover layer unit 133 , and is embedded in the insulating member and the ground member, and the air gap 116 .
  • the transmission unit 115 transmits an electrical signal and effectively shields noise introduced from the outside, thereby improving transmission efficiency.
  • the magnetic layer portion is not directly deposited on the transmission unit 115 , but when the magnetic layer portion is directly deposited on the transmission unit 115 to improve the shielding performance, the resistance increases to increase the signal of the transmission unit 115 . This is because the transmission efficiency may be reduced by increasing the loss.
  • the transmission unit 115 is spaced apart from the base substrate 110 , the first cover layer unit 133 , the first ground unit 113 , and the first ground unit 113 and the transmission unit 115 are spaced apart from each other.
  • the shielding performance of electromagnetic waves and noise can be improved by sealing the air gap 116 that is arranged and formed, and disposing the first magnetic layer part 121 and another air gap 125 on the other side of the transmission part 115 . it can be
  • the second cover layer part 131 may be formed on the other side of the first magnetic layer part 121
  • the third ground part 143 may be formed on one side of the first cover layer part 133
  • a fourth ground portion 141 may be formed on the other side of the second cover layer portion 131 .
  • the second cover layer part 131 may be formed of the same insulating material as the first cover layer part 133 , and may be deposited by being adhered to the first magnetic layer part 121 .
  • the third ground part 143 and the fourth ground part 141 may be formed of a conductive material such as copper (Cu) or silver (Ag), and the first cover layer part 133 and the second cover layer part, respectively. It may be deposited by adhering to (131).
  • the cable module 100 may further include a via hole 147 .
  • the via hole 147 electrically connects the third ground portion 143 disposed in one direction of the base substrate 110 and the fourth ground portion 141 disposed in the other direction of the base substrate 110 .
  • the via hole 147 includes the base substrate 110 , the first ground part 113 , the first cover layer part 133 , the second ground part 117 , the first magnetic layer part 121 , and the second cover layer. It may be formed by drilling the portion 131 to form a cylindrical through hole.
  • the cable module 100 further includes a second magnetic layer part 153 , a third cover layer part 163 , a third magnetic layer part 151 , and a fourth cover layer part 161 .
  • the second magnetic layer part 153 may be disposed on one side of the third ground part 143
  • the third cover layer part 163 may be disposed on one side of the second magnetic layer part 153
  • the three magnetic layer part 151 may be disposed on the other side of the fourth ground part 141
  • the fourth cover layer part 161 may be disposed on the other side of the third magnetic layer part 151 .
  • the material and method of forming the second magnetic layer part 153 and the third magnetic layer part 151 are the same as those of the first magnetic layer part 121, and a description thereof will be replaced with the previous description.
  • the electromagnetic wave and noise shielding effect may be further improved by additionally stacking the magnetic layer part and the cover layer part.
  • FIGS. 3 and 4 are reference views for explaining a method of manufacturing the cable module 100 according to another embodiment of the present invention.
  • the present invention includes the cable module 100 .
  • a method of manufacturing is provided.
  • the method of manufacturing the cable module 100 includes: disposing FCCL (S100), depositing a magnetic layer (S200), etching step (S300), disposing a cover layer (S400), disposing a metal layer It may include a step S500, a drilling step S600, a magnetic layer arrangement step S700, a cover layer arrangement step S800, and a punching step S900.
  • a flexible copper clad laminated film provided with metal layers (a first metal layer and a second metal layer) stacked on both sides of the base substrate 110 made of an insulating material that can be easily bent, such as polyimide, is positioned. (a of FIG. 4).
  • the metal layer may be made of a copper (Cu) material having high conductivity.
  • a first magnetic layer part 121 is laminated on the other side of the second metal layer laminated on the other side (upper surface in the drawing) of the disposed FCCL ( FIG. 4 b ).
  • the transfer part 115 and the first ground part 113 are formed by etching the first metal layer stacked on one side of the FCCL.
  • the second metal layer and the second magnetic layer part 153 are etched to form the air gap 125 .
  • a first cover layer unit 133 is laminated on one side of the transmission unit 115 and the first ground unit 113 , and a second cover layer unit 131 is laminated on the other side of the first magnetic layer unit 121 . (Fig. 4d).
  • a third ground part 143 is laminated on one side of the first cover layer part 133
  • a fourth ground part 141 is laminated on the other side of the second cover layer part 131 ( FIG. 4E ).
  • the stacked magnetic layer part and the cover layer part are the same as the magnetic layer part and the cover layer part described in the embodiment of the cable module 100, so the description of materials and properties will be replaced with the description of the previous embodiment.
  • the transmission unit 115 is surrounded by the first ground unit 113 , the base substrate 110 , and the first cover layer unit 133 , and is embedded in the insulating member and the ground member, and the air gap 116 .
  • the transmission unit 115 transmits an electrical signal and effectively shields noise introduced from the outside, thereby improving transmission efficiency.
  • the magnetic layer portion is not directly deposited on the transmission unit 115 , but when the magnetic layer portion is directly deposited on the transmission unit 115 to improve the shielding performance, the resistance increases to increase the signal of the transmission unit 115 . This is because the transmission efficiency may be reduced by increasing the loss.
  • a via hole 147 is formed so that the first cover layer part 133 , the third ground part 143 , the second cover layer part 131 , and the fourth ground part 141 are connected ( FIG. 4F ).
  • the via hole 147 includes the base substrate 110 , the first ground portion 113 , the first cover layer portion 133 , the second ground portion 117 , the first magnetic layer portion 121 , and the second cover layer. It may be formed by drilling the portion 131 to form a cylindrical through hole.
  • the via hole 147 includes a first cover layer part 133 disposed in one direction of the base substrate 110 , a third ground part 143 , and a second cover layer part disposed in the other direction of the base substrate 110 . 131 and the fourth ground unit 141 are electrically connected.
  • the second magnetic layer part 153 is stacked on one side of the third ground part 143
  • the third magnetic layer part 151 is stacked on the other side of the fourth ground part 141 ( FIG. 4 g ).
  • a third cover layer part 163 is laminated on one side of the second magnetic layer part 153
  • a fourth cover layer part 161 is laminated on the other side of the third magnetic layer part 151 ( FIG. 4 h).
  • the electromagnetic wave and noise shielding effect may be further improved by additionally stacking the magnetic layer part and the cover layer part.

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  • Engineering & Computer Science (AREA)
  • Manufacturing & Machinery (AREA)
  • Shielding Devices Or Components To Electric Or Magnetic Fields (AREA)
  • Insulated Conductors (AREA)

Abstract

La présente invention concerne un module de câble et son procédé de fabrication et, plus spécifiquement : un module de câble de type pour carte de circuit imprimé souple (FPCB) qui comprend une couche magnétique sur un côté situé face au côté où est formée une ligne de transmission, et peut ainsi améliorer les performances de blindage contre les ondes et le bruit électromagnétiques ; et son procédé de fabrication.
PCT/KR2021/001493 2020-02-05 2021-02-04 Module de câble et son procédé de fabrication Ceased WO2021158041A1 (fr)

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
KR1020200013523A KR102363957B1 (ko) 2020-02-05 2020-02-05 케이블 모듈 및 이를 제조하기 위한 방법
KR10-2020-0013523 2020-02-05

Publications (1)

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WO2021158041A1 true WO2021158041A1 (fr) 2021-08-12

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PCT/KR2021/001493 Ceased WO2021158041A1 (fr) 2020-02-05 2021-02-04 Module de câble et son procédé de fabrication

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WO (1) WO2021158041A1 (fr)

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US12101873B2 (en) 2022-04-25 2024-09-24 Microsoft Technology Licensing, Llc Flexible printed circuit cable assembly with electromagnetic shielding

Families Citing this family (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
EP4550946A1 (fr) * 2023-09-19 2025-05-07 Samsung Electronics Co., Ltd Carte de circuit imprimé souple multicouche et dispositif électronique la comprenant

Citations (5)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP3138324U (ja) * 2007-02-16 2007-12-27 天瑞企業股▲ふん▼有限公司 高速デジタル伝送信号線
KR20130120101A (ko) * 2012-04-25 2013-11-04 엘지이노텍 주식회사 전송 케이블, 이를 포함하는 휴대 단말기 및 이의 제조 방법
KR20150137905A (ko) * 2014-05-30 2015-12-09 (주)창성 자성시트 일체형 커버레이와 이를 포함하는 연성인쇄회로기판 및 이들의 제조방법
KR20180010525A (ko) * 2016-07-21 2018-01-31 신창핫멜트 주식회사 양면 플렉시블 플랫 케이블
JP2019516231A (ja) * 2016-02-26 2019-06-13 ギガレーン カンパニー リミテッドＧｉｇａｌａｎｅ Ｃｏ．， Ｌｔｄ． フレキシブルプリント回路基板

Family Cites Families (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
KR200177475Y1 (ko) 1999-11-09 2000-04-15 송길봉 접착식 박막 케이블
JP2003036733A (ja) * 2001-04-26 2003-02-07 Molex Inc 平型柔軟ケーブル
KR101498570B1 (ko) * 2013-04-19 2015-03-04 주식회사 에프씨엔 다층 구조의 고기능 자성 필름 및 그 제조 방법

Patent Citations (5)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP3138324U (ja) * 2007-02-16 2007-12-27 天瑞企業股▲ふん▼有限公司 高速デジタル伝送信号線
KR20130120101A (ko) * 2012-04-25 2013-11-04 엘지이노텍 주식회사 전송 케이블, 이를 포함하는 휴대 단말기 및 이의 제조 방법
KR20150137905A (ko) * 2014-05-30 2015-12-09 (주)창성 자성시트 일체형 커버레이와 이를 포함하는 연성인쇄회로기판 및 이들의 제조방법
JP2019516231A (ja) * 2016-02-26 2019-06-13 ギガレーン カンパニー リミテッドＧｉｇａｌａｎｅ Ｃｏ．， Ｌｔｄ． フレキシブルプリント回路基板
KR20180010525A (ko) * 2016-07-21 2018-01-31 신창핫멜트 주식회사 양면 플렉시블 플랫 케이블

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US12101873B2 (en) 2022-04-25 2024-09-24 Microsoft Technology Licensing, Llc Flexible printed circuit cable assembly with electromagnetic shielding

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Publication number Publication date
KR102363957B1 (ko) 2022-02-16
KR20210099766A (ko) 2021-08-13

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