WO2021153820A1 - Electronic device provided with 5g antenna - Google Patents

Abstract

An electronic device provided with a 5G antenna according to an embodiment is provided. The electronic device comprises: an antenna carrier made of a dielectric having a predetermined length and width, and configured to arrange an antenna therein; a frame arranged on a lower part of the antenna carrier; and the antenna comprising a printed circuit board (PCB) arranged on a lower part of the frame. The antenna may comprise a vertical feeding portion formed to vertically connect a feeding pad and a feeding pattern formed on the PCB.

Description

Electronic devices equipped with 5G antennas

The present invention relates to an electronic device having a 5G antenna. A specific implementation relates to an electronic device having a low profile antenna operating in the 5G Sub 6 band.

Electronic devices may be divided into mobile/portable terminals and stationary terminals depending on whether they can be moved. Again, the electronic device can be divided into a handheld terminal and a vehicle mounted terminal according to whether the user can directly carry the electronic device.

The functions of electronic devices are diversifying. For example, there are functions for data and voice communication, photo and video shooting through a camera, voice recording, music file playback through a speaker system, and an image or video output to the display unit. Some terminals add an electronic game play function or perform a multimedia player function. In particular, recent mobile terminals can receive multicast signals that provide broadcast and visual content such as video or television programs.

As such electronic devices have diversified functions, they are implemented in the form of multimedia devices equipped with complex functions, such as, for example, taking pictures or videos, playing music or video files, and receiving games and broadcasts. there is.

In order to support and increase the function of the electronic device, it may be considered to improve the structural part and/or the software part of the terminal.

In addition to the above attempts, a wireless communication system using LTE communication technology has recently been commercialized for electronic devices to provide various services. In addition, it is expected that a wireless communication system using 5G communication technology will be commercialized in the future to provide various services. Meanwhile, some of the LTE frequency bands may be allocated to provide 5G communication services.

In this regard, the mobile terminal may be configured to provide 5G communication services in various frequency bands. Recently, attempts have been made to provide a 5G communication service using the Sub6 band below the 6GHz band. In addition, it is expected to provide 5G communication services using millimeter wave (mmWave) bands in addition to Sub6 bands for faster data rates in the future.

Meanwhile, the antenna operating in the 5G Sub6 band may be disposed on the side of the electronic device or inside the electronic device. In this regard, in recent years, electronic devices such as mobile terminals tend to adopt a full display. In addition, new form-factors in the form of foldable, flexible, and rollable are emerging due to the development of flexible displays in addition to electronic devices having full displays.

Even in electronic devices according to such various form-factors, the number of antennas is increasing for fast data transmission. However, since the size and shape of an antenna that can be disposed in an electronic device is limited, there is a problem in that a design space is reduced and it is difficult to secure radiation efficiency.

SUMMARY OF THE INVENTION The present invention aims to solve the above and other problems. Another object is to provide an electronic device in which a low profile antenna having a small size and a low height is disposed inside the electronic device.

Another object of the present invention is to provide a low-profile antenna with high antenna space utilization and placement freedom while optimizing radio performance.

Another object of the present invention is to optimize antenna performance in a non-flat type ground mechanism structure, that is, a non-flat system ground structure.

Another object of the present invention is to minimize signal loss due to an interface between a plurality of low-profile antennas and other circuit boards.

Another object of the present invention is to maintain performance between different antennas when interfacing different antennas with other circuit boards.

Another object of the present invention is to provide an antenna structure capable of securing a degree of isolation from each other while arranging low-profile antennas adjacent to each other.

In order to achieve the above or other objects, an electronic device having a 5G antenna according to an embodiment is provided. The electronic device includes: an antenna carrier made of a dielectric material having a predetermined length and width and configured to place an antenna; a frame disposed under the antenna carrier; and an antenna including a printed circuit board (PCB) disposed under the frame. The antenna may include a vertical feeding portion formed to vertically connect the feeding pad and the feeding pattern formed on the PCB.

In an embodiment, the antenna includes a metal pattern having a predetermined length and width printed and disposed on the antenna carrier, and configured to operate as a radiator; and a feeding pattern in which at least a portion of the region is disposed in an inset region inside the metal pattern to couple and feed a signal to the metal pattern.

In an embodiment, the antenna may include a first antenna and a second antenna configured to be mutually symmetrical. The feeding pattern may include a first feeding pattern configured to feed the first antenna and a second feeding pattern configured to feed the second antenna. The vertical feeding unit may include a first vertical feeding unit vertically connected to the first feeding pattern and a second vertical feeding unit vertically connected to the second feeding pattern.

In an embodiment, the first vertical feeding part connected to the first feeding pattern and the second vertical feeding part connected to the second feeding pattern may be formed to pass through a hole formed in the frame.

In an embodiment, the antenna may further include a plurality of vertical short portions configured to connect the metal pattern and a ground formed on the PCB. A first vertical short-circuiting part formed between the first vertical feeding part and the second vertical feeding part among the plurality of vertical short-circuiting parts may be formed to pass through a hole formed in the frame.

In an embodiment, the first vertical shorting part may be disposed at a center of a region where the first antenna and the second antenna are interconnected. A second vertical shorting part of the plurality of vertical shorting parts may be connected to a lower portion of the frame and connected to the metal pattern through an upper portion of the frame.

In an embodiment, the second vertical shorting part is formed of a plurality of vertical vias disposed along a left boundary and a right boundary of a region where the first antenna and the second antenna are interconnected, and the first antenna and the second antenna are connected to each other. 2 It is possible to improve the isolation characteristics of the antenna.

In an embodiment, the first antenna includes a first metal pattern and a second metal pattern spaced apart from each other in a symmetrical shape, and the second antenna includes a third metal pattern and a second metal pattern disposed in a mutually symmetrical shape. 4 may include a metal pattern.

In an embodiment, the first metal pattern and the third metal pattern may be formed to be interconnected. The first feeding pattern may be disposed to be offset to an area in which any one of the first metal pattern and the second metal pattern is disposed. The second feeding pattern may be disposed to be offset to an area in which any one of the third metal pattern and the fourth metal pattern is disposed.

In an embodiment, an end of the first feeding pattern in the region where the second metal pattern is formed of the first antenna may be connected to the first vertical feeding part. In the region where the fourth metal pattern of the second antenna is formed, an end of the second feeding pattern may be connected to the second vertical feeding part.

In an embodiment, an end of the first feeding pattern may be connected to the first vertical feeding part in a region where the first metal pattern of the first antenna is formed. In the region where the third metal pattern of the second antenna is formed, an end of the second feeding pattern may be connected to the second vertical feeding part.

In an embodiment, the first feeding pattern may be configured to be spaced apart from one end of the first metal pattern so that a first signal is coupled thereto. The second feeding pattern may be configured to be spaced apart from one end of the third metal pattern so that a second signal is coupled thereto.

In one embodiment, the first metal pattern and the third metal pattern is a first radiation portion (radiation portion) formed in a rectangular shape having a predetermined length and width; and a second radiating part connected to the first radiating part and tapering at a predetermined angle to increase the width.

In an embodiment, the second radiation portion of the first metal pattern and the second radiation portion of the third metal pattern are interconnected, and a plurality of the second radiation portions are connected along a left boundary and a right boundary of an interconnected region. The vias may be disposed to be spaced apart from each other by a predetermined distance.

In an embodiment, the second metal pattern and the fourth metal pattern are formed in a rectangular shape having a predetermined length and width, the third radiation portion in which the inset region is formed; and a fourth radiation part connected to the third radiation part and tapered at a predetermined angle to increase the width.

In an embodiment, a plurality of vias may be disposed at an end of the fourth radiation part of the second metal pattern and an end of the fourth radiation part of the fourth metal pattern to be spaced apart from each other by a predetermined distance.

In one embodiment, the first antenna or the second antenna and the spaced apart arrangement, and may further include a WiFi antenna configured to operate in a WiFi band.

In one embodiment, the WiFi antenna may include a first metal pattern and a second metal pattern formed to be spaced apart from each other in a symmetrical form; a feeding pattern formed inside an inset region from which a metal pattern is partially removed from the first metal pattern and the second metal pattern; and a vertical short portion formed at an end of the first metal pattern and an end of the second metal pattern.

In an embodiment, the WiFi antenna may further include a vertical feeding unit configured to have one end of the feeding pattern vertically connected to the feeding pad of the PCB. The WiFi antenna may further include a second vertical short circuit configured to be vertically connected to the ground of the PCB and disposed at a position spaced apart from the vertical feeding part in a direction perpendicular to the direction in which the feeding pattern is disposed from the vertical feeding part. .

According to the present invention, it is possible to provide an electronic device in which a low profile antenna having a small size and a low height is disposed inside the electronic device even in a full display structure.

In addition, according to the present invention, it is possible to provide a low-profile antenna with high antenna space utilization and placement freedom while optimizing wireless performance through a low-profile antenna that can be horizontally disposed inside the electronic device on the cover of the electronic device. .

In addition, according to the present invention, it is possible to provide a 1xn MIMO antenna module capable of securing a degree of isolation between each other while arranging the low-profile antennas adjacent to each other.

In addition, according to the present invention, it is possible to optimize antenna performance such as bandwidth and antenna efficiency in a non-flat ground mechanism structure, that is, a non-flat system ground structure.

In addition, according to the present invention, it is possible to minimize the signal loss by minimizing the length of the transmission line according to the interface between the plurality of low-profile antennas and other circuit boards.

In addition, according to the present invention, when different antennas are interfaced with other circuit boards, the feed loss between the different antennas is set to be below a certain level, so that the signal level through the different antennas can be maintained at a certain level during MIMO operation.

In addition, according to the present invention, the antenna pattern disposed between the respective feeding patterns may give a de-coupling effect between the respective antenna radiators to improve the antenna isolation (S21 and ECC).

In particular, the low-profile antenna according to the present invention has the advantage that the antenna can be effectively designed at a very low height of 0.02λ or less, and impedance matching is easy.

In particular, the low-profile antenna according to the present invention has an advantage in that both ends of the radiator are shorted, so that it is advantageous for arranging several antennas according to the reduction in antenna size and improvement in the degree of mutual isolation.

Further scope of applicability of the present invention will become apparent from the following detailed description. However, it should be understood that the detailed description and specific embodiments such as preferred embodiments of the present invention are given by way of illustration only, since various changes and modifications within the spirit and scope of the present invention may be clearly understood by those skilled in the art.

1A illustrates a configuration for explaining an electronic device and an interface between the electronic device and an external device or server according to an embodiment. Meanwhile, FIG. 1B shows a detailed configuration in which an electronic device interfaces with an external device or a server according to an exemplary embodiment. Also, FIG. 1C illustrates a configuration in which an electronic device interfaces with a plurality of base stations or network entities according to an embodiment.

FIG. 2A shows a detailed configuration of the electronic device of FIG. 1A . Meanwhile, FIGS. 2B and 2C are conceptual views of an example of an electronic device related to the present invention viewed from different directions.

3A illustrates an example of a configuration in which a plurality of antennas of an electronic device may be disposed according to an embodiment. 3B illustrates a configuration of a wireless communication unit of an electronic device operable in a plurality of wireless communication systems according to an embodiment.

4 illustrates a framework structure related to an application program operating in an electronic device according to an exemplary embodiment.

5A shows an example of a frame structure in NR. Meanwhile, FIG. 5B shows a change in the slot length according to a change in the subcarrier spacing in NR.

6A is a configuration diagram in which a plurality of antennas and transceiver circuits are combined to be operable with a processor according to an embodiment. FIG. 6B is a configuration diagram in which antennas and transceiver circuits are additionally operable with a processor in the configuration diagram of FIG. 6A .

7A and 7B show a configuration of a low-profile antenna according to various embodiments of the present disclosure.

8A illustrates a low-profile antenna configuration described herein. FIG. 8B illustrates a configuration in which the low-profile antenna according to the exemplary embodiment of FIG. 8A is disposed on a carrier inside the electronic device.

FIG. 9A shows a change in a resonant frequency and a bandwidth according to an antenna height change in the antenna configuration having various antenna sizes of FIG. 8A . On the other hand, FIG. 9B shows a radiation efficiency peak according to an antenna height change in the antenna configuration having various antenna sizes of FIG. 8A .

10A illustrates a configuration of a plurality of low-profile antennas according to an embodiment. Meanwhile, FIG. 10B shows a multi-layered configuration of a feeding pattern and a metal pattern in the antenna configuration of FIG. 10A .

11A illustrates a configuration in which a low-profile antenna is disposed on a carrier inside an electronic device according to an embodiment. Meanwhile, FIG. 11B is an enlarged view of a configuration in which a feeding pattern formed in the antenna and a plurality of vias are connected to a PCB under the antenna carrier.

12A and 12B show the level of interference between the first and second antennas according to the presence or absence of a PCB shorting pin.

13A illustrates a configuration of a low-profile antenna in which a plurality of feeding patterns are adjacently disposed according to an exemplary embodiment. Meanwhile, FIG. 13B shows a multi-layered configuration, a plurality of vertical feeding units, and a plurality of vertical short circuits in the antenna configuration of FIG. 13A . 13C shows the shape of the antenna of FIG. 13A and the shape of controlling the antenna.

14A illustrates a configuration in which a plurality of low-profile antennas are formed in a structure of a PCB on which electronic components are mounted, according to an exemplary embodiment. Meanwhile, FIG. 14B shows a power supply unit and a short circuit unit when the SIM socket is disposed as an electronic component in the configuration of FIG. 13A .

15A shows the return loss characteristics of the antenna according to whether or not an electronic component such as a SIM socket is disposed thereunder. Meanwhile, FIG. 15B shows the efficiency characteristics of an antenna according to whether or not an electronic component such as a SIM socket is disposed underneath.

16A shows a frame structure formed inside an electronic device and having a feeding hole through which a vertical feeding part passes. Meanwhile, FIG. 16B shows a conceptual diagram in which a WiFi antenna and a plurality of 5G antennas are disposed. In addition, FIG. 16C shows a conceptual diagram in which a PCB disposed under the frame is disposed with a WiFi antenna and a plurality of 5G antennas.

17A is a front view of a WiFi antenna according to an embodiment. Meanwhile, FIG. 17B shows a WiFi antenna connected to a vertical feeding unit and a vertical shorting unit, and a vertical feeding unit and a vertical shorting unit.

18A shows the return loss characteristic of the WiFi antenna of FIG. 17A. On the other hand, Figure 18b shows the radiation efficiency and total efficiency characteristics of the WiFi antenna of Figure 17a.

19A shows the return loss and ECC characteristics of a plurality of antennas in the configuration of FIG. 18A. On the other hand, FIG. 19B shows the return loss and ECC characteristics of the plurality of antennas in the configuration of FIG. 18B.

20 illustrates a block diagram of a wireless communication system to which the methods proposed in the present specification can be applied.

Hereinafter, the embodiments disclosed in the present specification will be described in detail with reference to the accompanying drawings, but the same or similar components are assigned the same reference numerals regardless of reference numerals, and overlapping descriptions thereof will be omitted. The suffixes "module" and "part" for the components used in the following description are given or mixed in consideration of only the ease of writing the specification, and do not have a meaning or role distinct from each other by themselves. In addition, in describing the embodiments disclosed in the present specification, if it is determined that detailed descriptions of related known technologies may obscure the gist of the embodiments disclosed in the present specification, the detailed description thereof will be omitted. In addition, the accompanying drawings are only for easy understanding of the embodiments disclosed in the present specification, and the technical spirit disclosed herein is not limited by the accompanying drawings, and all changes included in the spirit and scope of the present invention , should be understood to include equivalents or substitutes.

Terms including an ordinal number, such as first, second, etc., may be used to describe various elements, but the elements are not limited by the terms. The above terms are used only for the purpose of distinguishing one component from another.

When a component is referred to as being “connected” or “connected” to another component, it is understood that the other component may be directly connected or connected to the other component, but other components may exist in between. it should be On the other hand, when it is said that a certain element is "directly connected" or "directly connected" to another element, it should be understood that no other element is present in the middle.

The singular expression includes the plural expression unless the context clearly dictates otherwise.

In the present application, terms such as "comprises" or "have" are intended to designate that a feature, number, step, operation, component, part, or combination thereof described in the specification exists, but one or more other features It should be understood that this does not preclude the existence or addition of numbers, steps, operations, components, parts, or combinations thereof.

Electronic devices described herein include mobile phones, smart phones, laptop computers, digital broadcasting terminals, personal digital assistants (PDAs), portable multimedia players (PMPs), navigation systems, and slate PCs. , tablet PCs, ultrabooks, wearable devices, for example, watch-type terminals (smartwatch), glass-type terminals (smart glass), HMD (head mounted display), etc. may be included. there is.

However, it will be readily apparent to those skilled in the art that the configuration according to the embodiment described in this specification may be applied to a fixed terminal such as a digital TV, a desktop computer, and a digital signage, except when applicable only to a mobile terminal. will be.

1A to 1C , FIG. 1A shows a configuration for explaining an electronic device and an interface between the electronic device and an external device or a server according to an exemplary embodiment. Meanwhile, FIG. 1B shows a detailed configuration in which an electronic device interfaces with an external device or a server according to an exemplary embodiment. Also, FIG. 1C illustrates a configuration in which an electronic device interfaces with a plurality of base stations or network entities according to an embodiment.

Meanwhile, referring to FIGS. 2A to 2C , FIG. 2A shows a detailed configuration of the electronic device of FIG. 1A . Meanwhile, FIGS. 2B and 2C are conceptual views of an example of an electronic device related to the present invention viewed from different directions.

Referring to FIG. 1A , the electronic device 100 is configured to include a communication interface 110 , an input interface (or an input device) 120 , an output interface (or an output device) 150 , and a processor 180 . can be Here, the communication interface 110 may refer to the wireless communication module 110 . Also, the electronic device 100 may be configured to further include a display 151 and a memory 170 . Since the components shown in FIG. 1A are not essential for implementing the electronic device, the electronic device described herein may have more or fewer components than those listed above.

More specifically, among the components, the wireless communication module 110 is between the electronic device 100 and the wireless communication system, between the electronic device 100 and another electronic device 100 , or between the electronic device 100 and the external device. It may include one or more modules that enable wireless communication between servers. In addition, the wireless communication module 110 may include one or more modules for connecting the electronic device 100 to one or more networks. Here, the one or more networks may be, for example, a 4G communication network and a 5G communication network.

1A and 2A , the wireless communication module 110 includes at least one of a 4G wireless communication module 111 , a 5G wireless communication module 112 , a short-range communication module 113 , and a location information module 114 . may include. In this regard, the 4G wireless communication module 111 , the 5G wireless communication module 112 , the short-range communication module 113 , and the location information module 114 may be implemented with a baseband processor such as a modem. As an example, the 4G wireless communication module 111 , the 5G wireless communication module 112 , the short-range communication module 113 and the location information module 114 may include a transceiver circuit and a baseband processor operating in an IF band. can be implemented as Meanwhile, the RF module 1200 may be implemented as an RF transceiver circuit operating in an RF frequency band of each communication system. However, the present invention is not limited thereto, and the 4G wireless communication module 111 , the 5G wireless communication module 112 , the short-range communication module 113 and the location information module 114 may be interpreted to include each RF module.

The 4G wireless communication module 111 may transmit and receive a 4G signal with a 4G base station through a 4G mobile communication network. In this case, the 4G wireless communication module 111 may transmit one or more 4G transmission signals to the 4G base station. In addition, the 4G wireless communication module 111 may receive one or more 4G reception signals from the 4G base station. In this regard, Up-Link (UL) Multi-Input Multi-Output (MIMO) may be performed by a plurality of 4G transmission signals transmitted to the 4G base station. In addition, Down-Link (DL) Multi-Input Multi-Output (MIMO) may be performed by a plurality of 4G reception signals received from a 4G base station.

The 5G wireless communication module 112 may transmit and receive a 5G signal with a 5G base station through a 5G mobile communication network. Here, the 4G base station and the 5G base station may have a Non-Stand-Alone (NSA) structure. For example, the 4G base station and the 5G base station may be a co-located structure disposed at the same location in a cell. Alternatively, the 5G base station may be disposed in a stand-alone (SA) structure at a location separate from the 4G base station.

The 5G wireless communication module 112 may transmit and receive a 5G signal with a 5G base station through a 5G mobile communication network. In this case, the 5G wireless communication module 112 may transmit one or more 5G transmission signals to the 5G base station. In addition, the 5G wireless communication module 112 may receive one or more 5G reception signals from the 5G base station.

In this case, the 5G frequency band may use the same band as the 4G frequency band, and this may be referred to as LTE re-farming. Meanwhile, as the 5G frequency band, the Sub6 band, which is a band of 6 GHz or less, may be used.

On the other hand, a millimeter wave (mmWave) band may be used as a 5G frequency band to perform broadband high-speed communication. When a millimeter wave (mmWave) band is used, the electronic device 100 may perform beam forming for communication coverage expansion with a base station.

Meanwhile, regardless of the 5G frequency band, the 5G communication system may support a larger number of Multi-Input Multi-Output (MIMO) in order to improve transmission speed. In this regard, Up-Link (UL) MIMO may be performed by a plurality of 5G transmission signals transmitted to the 5G base station. In addition, Down-Link (DL) MIMO may be performed by a plurality of 5G reception signals received from a 5G base station.

Meanwhile, the wireless communication module 110 may be in a dual connectivity (DC) state with the 4G base station and the 5G base station through the 4G wireless communication module 111 and the 5G wireless communication module 112 . In this way, the dual connection with the 4G base station and the 5G base station may be referred to as EN-DC (EUTRAN NR DC). Here, EUTRAN is an Evolved Universal Telecommunication Radio Access Network, which means a 4G wireless communication system, and NR is New Radio, which means a 5G wireless communication system.

On the other hand, if the 4G base station and the 5G base station have a co-located structure, throughput improvement is possible through inter-CA (Carrier Aggregation). Therefore, the 4G base station and the 5G base station In the EN-DC state, the 4G reception signal and the 5G reception signal may be simultaneously received through the 4G wireless communication module 111 and the 5G wireless communication module 112 .

Short-range communication module 113 is for short-range communication, Bluetooth (Bluetooth), RFID (Radio Frequency Identification), infrared communication (Infrared Data Association; IrDA), UWB (Ultra Wideband), ZigBee, NFC At least one of (Near Field Communication), Wireless-Fidelity (Wi-Fi), Wi-Fi Direct, and Wireless Universal Serial Bus (USB) technologies may be used to support short-range communication. The short-distance communication module 114, between the electronic device 100 and a wireless communication system, between the electronic device 100 and another electronic device 100, or the electronic device 100 through wireless area networks (Wireless Area Networks) ) and a network in which another electronic device 100 or an external server is located may support wireless communication. The local area network may be a local area network (Wireless Personal Area Networks).

Meanwhile, short-range communication between electronic devices may be performed using the 4G wireless communication module 111 and the 5G wireless communication module 112 . In an embodiment, short-distance communication may be performed between electronic devices using a device-to-device (D2D) method without going through a base station.

On the other hand, for transmission speed improvement and communication system convergence (convergence), carrier aggregation (CA) using at least one of the 4G wireless communication module 111 and the 5G wireless communication module 112 and the Wi-Fi communication module 113 This can be done. In this regard, 4G + WiFi carrier aggregation (CA) may be performed using the 4G wireless communication module 111 and the Wi-Fi communication module 113 . Alternatively, 5G + WiFi carrier aggregation (CA) may be performed using the 5G wireless communication module 112 and the Wi-Fi communication module 113 .

The location information module 114 is a module for acquiring a location (or current location) of an electronic device, and a representative example thereof includes a Global Positioning System (GPS) module or a Wireless Fidelity (WiFi) module. For example, if the electronic device utilizes a GPS module, it may acquire the location of the electronic device by using a signal transmitted from a GPS satellite. As another example, if the electronic device utilizes the Wi-Fi module, the location of the electronic device may be acquired based on information of the Wi-Fi module and a wireless access point (AP) that transmits or receives a wireless signal. If necessary, the location information module 114 may perform any function of the other modules of the wireless communication module 110 to obtain data on the location of the electronic device as a substitute or additionally. The location information module 114 is a module used to obtain the location (or current location) of the electronic device, and is not limited to a module that directly calculates or obtains the location of the electronic device.

Specifically, when the electronic device utilizes the 5G wireless communication module 112 , the electronic device may acquire the location of the electronic device based on information of the 5G wireless communication module and the 5G base station that transmits or receives the wireless signal. In particular, since the 5G base station of the millimeter wave (mmWave) band is deployed in a small cell having a narrow coverage, it is advantageous to obtain the location of the electronic device.

The input device 120 may include a pen sensor 1200 , a key button 123 , a voice input module 124 , a touch panel 151a, and the like. Meanwhile, the input device 120 includes a camera module 121 or an image input unit for inputting an image signal, a microphone 152c for inputting an audio signal, or an audio input unit, and a user input unit (eg, a user input unit for receiving information from a user). For example, it may include a touch key, a push key (mechanical key, etc.). The voice data or image data collected by the input device 120 may be analyzed and processed as a user's control command.

The camera module 121 is a device capable of capturing still images and moving images, and according to an embodiment, one or more image sensors (eg, a front sensor or a rear sensor), a lens, an image signal processor (ISP), or a flash (eg, : LED or lamp, etc.).

The sensor module 140 may include one or more sensors for sensing at least one of information in the electronic device, surrounding environment information surrounding the electronic device, and user information. For example, the sensor module 140 may include a gesture sensor 340a, a gyro sensor 340b, a barometric pressure sensor 340c, a magnetic sensor 340d, an acceleration sensor 340e, a grip sensor 340f, and a proximity sensor 340g. ), color sensor (340h) (e.g. RGB (red, green, blue) sensor), biometric sensor (340i), temperature/humidity sensor (340j), illuminance sensor (340k), or UV (ultra violet) At least one of a sensor 340l, an optical sensor 340m, and a hall sensor 340n may be included. In addition, the sensor module 140 includes a fingerprint recognition sensor (finger scan sensor), an ultrasonic sensor (ultrasonic sensor), an optical sensor (for example, a camera (see 121)), a microphone (see 152c), a battery battery gauges, environmental sensors (eg barometers, hygrometers, thermometers, radiation sensors, thermal sensors, gas detection sensors, etc.), chemical sensors (eg electronic noses, healthcare sensors, biometric sensors, etc.) etc.) may be included. Meanwhile, the electronic device disclosed in the present specification may combine and utilize information sensed by at least two or more of these sensors.

The output interface 150 is for generating an output related to visual, auditory or tactile sense, and may include at least one of a display 151 , an audio module 152 , a haptip module 153 , and an indicator 154 .

In this regard, the display 151 may implement a touch screen by forming a layer structure with each other or integrally formed with the touch sensor. Such a touch screen may function as the user input unit 123 providing an input interface between the electronic device 100 and the user, and may provide an output interface between the electronic device 100 and the user. For example, the display 151 may be a liquid crystal display (LCD), a light emitting diode (LED) display, an organic light emitting diode (OLED) display, or a micro electromechanical system (micro-electromechanical system). electro mechanical systems, MEMS) displays, or electronic paper displays. For example, the display 151 may display various contents (eg, text, image, video, icon, and/or symbol, etc.) to the user. The display 151 may include a touch screen, and may receive, for example, a touch input using an electronic pen or a part of the user's body, a gesture, a proximity, or a hovering input.

Meanwhile, the display 151 may include a touch panel 151a, a hologram device 151b, a projector 151c, and/or a control circuit for controlling them. In this regard, the panel may be implemented to be flexible, transparent, or wearable. The panel may include the touch panel 151a and one or more modules. The hologram device 151b may display a stereoscopic image in the air by using light interference. The projector 151c may display an image by projecting light onto the screen. The screen may be located inside or outside the electronic device 100 , for example.

The audio module 152 may be configured to interwork with the receiver 152a, the speaker 152b, and the microphone 152c. Meanwhile, the haptic module 153 may convert an electrical signal into mechanical vibration, and may generate vibration or a haptic effect (eg, pressure, texture) or the like. The electronic device includes, for example, a mobile TV support device (eg, GPU) capable of processing media data according to standards such as digital multimedia broadcasting (DMB), digital video broadcasting (DVB), or mediaFlow. may include Also, the indicator 154 may display a specific state of the electronic device 100 or a part thereof (eg, the processor 310 ), for example, a booting state, a message state, or a charging state.

The wired communication module 160 , which may be implemented as an interface unit, functions as a passage with various types of external devices connected to the electronic device 100 . The wired communication module 160 includes an HDMI 162 , a USB 162 , a connector/port 163 , an optical interface 164 , or a D-sub (D-subminiature) 165 . can do. In addition, the wired communication module 160 connects a device equipped with a wired/wireless headset port, an external charger port, a wired/wireless data port, a memory card port, and an identification module. It may include at least one of a port, an audio I/O (Input/Output) port, a video I/O (Input/Output) port, and an earphone port. In response to the connection of the external device to the wired communication module 160 , the electronic device 100 may perform appropriate control related to the connected external device.

In addition, the memory 170 stores data supporting various functions of the electronic device 100 . The memory 170 may store a plurality of application programs (or applications) driven in the electronic device 100 , data for operation of the electronic device 100 , and commands. At least some of these application programs may be downloaded from an external server (eg, the first server 310 or the second server 320) through wireless communication. In addition, at least some of these application programs may exist on the electronic device 100 from the time of shipment for basic functions (eg, incoming calls, outgoing functions, message reception, and outgoing functions) of the electronic device 100 . Meanwhile, the application program may be stored in the memory 170 , installed on the electronic device 100 , and driven by the processor 180 to perform an operation (or function) of the electronic device.

In this regard, the first server 310 may be referred to as an authentication server, and the second server 320 may be referred to as a content server. The first server 310 and/or the second server 320 may interface with an electronic device through a base station. Meanwhile, a part of the second server 320 corresponding to the content server may be implemented as a mobile edge cloud (MEC, 330) in units of base stations. Accordingly, it is possible to implement a distributed network through the second server 320 implemented as a mobile edge cloud (MEC, 330) and to reduce content transmission delay.

Memory 170 may include volatile and/or non-volatile memory. Also, the memory 170 may include an internal memory 170a and an external memory 170b. The memory 170 may store, for example, commands or data related to at least one other component of the electronic device 100 . According to one embodiment, the memory 170 may store software and/or a program 240 . For example, the program 240 may include a kernel 171 , middleware 172 , an application programming interface (API) 173 , or an application program (or “application”) 174 , and the like. At least a portion of the kernel 171 , the middleware 172 , or the API 174 may be referred to as an operating system (OS).

The kernel 171 is a system used to execute operations or functions implemented in other programs (eg, middleware 172 , an application programming interface (API) 173 , or an application program 174 ). Resources (eg, bus, memory 170, processor 180, etc.) may be controlled or managed. In addition, the kernel 171 may provide an interface capable of controlling or managing system resources by accessing individual components of the electronic device 100 from the middleware 172 , the API 173 , or the application program 174 . can

The middleware 172 may play an intermediary role so that the API 173 or the application program 174 communicates with the kernel 171 to exchange data. Also, the middleware 172 may process one or more work requests received from the application program 247 according to priority. In an embodiment, the middleware 172 sets a priority for using the system resource (eg, bus, memory 170, processor 180, etc.) of the electronic device 100 to at least one of the application programs 174 . Grants and can process one or more work requests. The API 173 is an interface for the application program 174 to control a function provided by the kernel 171 or the middleware 1723, for example, at least one for file control, window control, image processing, or text control. It can contain interfaces or functions (such as commands).

In addition to the operation related to the application program, the processor 180 generally controls the overall operation of the electronic device 100 . The processor 180 may provide or process appropriate information or functions to the user by processing signals, data, information, etc. input or output through the above-described components or by driving an application program stored in the memory 170 . In addition, the processor 180 may control at least some of the components described with reference to FIGS. 1A and 2A in order to drive an application program stored in the memory 170 . Furthermore, in order to drive the application program, the processor 180 may operate at least two or more of the components included in the electronic device 100 in combination with each other.

The processor 180 is one of a central processing unit (CPU), an application processor (AP), an image signal processor (ISP), a communication processor (CP), a low-power processor (eg, a sensor hub), or It may include more than that. For example, the processor 180 may execute an operation or data processing related to control and/or communication of at least one other component of the electronic device 100 .

The power supply unit 190 receives external power and internal power under the control of the processor 180 to supply power to each component included in the electronic device 100 . The power supply unit 190 includes a power management module 191 and a battery 192, and the battery 192 may be a built-in battery or a replaceable battery. The power management module 191 may include a power management integrated circuit (PMIC), a charger IC, or a battery or fuel gauge. The PMIC may have a wired and/or wireless charging method. The wireless charging method includes, for example, For example, it includes a magnetic resonance method, a magnetic induction method, an electromagnetic wave method, etc., and may further include an additional circuit for wireless charging, for example, a coil loop, a resonance circuit, or a rectifier. For example, the remaining amount of the battery 396, voltage, current, or temperature during charging may be measured, for example, the battery 192 may include a rechargeable battery and/or a solar cell.

Each of the external device 100a , the first server 310 , and the second server 320 may be the same or a different type of device (eg, an external device or a server) as the electronic device 100 . According to an embodiment, all or part of the operations executed in the electronic device 100 may be performed by one or a plurality of other electronic devices (eg, the external device 100a, the first server 310, and the second server 320). can be executed in According to an embodiment, when the electronic device 100 needs to perform a function or service automatically or upon request, the electronic device 100 performs the function or service by itself instead of or in addition to it. At least some related functions may be requested from other devices (eg, the external device 100a, the first server 310, and the second server 320). Another electronic device (eg, the external device 100a , the first server 310 , and the second server 320 ) may execute a requested function or an additional function, and transmit the result to the electronic device 201 . The electronic device 100 may provide the requested function or service by processing the received result as it is or additionally. For this purpose, for example, cloud computing, distributed computing, client-server computing, or mobile edge cloud (MEC) technology may be used.

At least some of the respective components may operate in cooperation with each other to implement an operation, control, or control method of an electronic device according to various embodiments described below. Also, the operation, control, or control method of the electronic device may be implemented on the electronic device by driving at least one application program stored in the memory 170 .

1A and 1B , the wireless communication system may include an electronic device 100 , at least one external device 100a , a first server 310 , and a second server 320 . The electronic device 100 is functionally connected to at least one external device 100a, and may control contents or functions of the electronic device 100 based on information received from the at least one external device 100a. . According to an embodiment, the electronic device 100 may use the servers 310 and 320 to perform authentication to determine whether the at least one external device 100 includes or generates information conforming to a predetermined rule. there is. Also, the electronic device 100 may display contents or control functions differently by controlling the electronic device 100 based on the authentication result. According to an embodiment, the electronic device 100 may be connected to at least one external device 100a through a wired or wireless communication interface to receive or transmit information. For example, the electronic device 100 and the at least one external device 100a may include near field communication (NFC), a charger (eg, universal serial bus (USB)-C), an ear jack, Information may be received or transmitted in a manner such as BT (bluetooth) or WiFi (wireless fidelity).

The electronic device 100 includes at least one of an external device authentication module 100-1, a content/function/policy information DB 100-2, an external device information DB 100-3, and a content DB 104 can do. The at least one external device 100a may be a device designed for various purposes, such as convenience of use of the electronic device 100, increase of aesthetics, enhancement of usability, etc. . At least one external device 100a may or may not be in physical contact with the electronic device 100 . According to an embodiment, the at least one external device 100a is functionally connected to the electronic device 100 using a wired/wireless communication module, and receives control information for controlling content or functions in the electronic device 100 . can be transmitted

According to an embodiment, the at least one external device 100a encrypts/decrypts one or more pieces of information included in the external device information, or stores it in a physical/virtual memory area that is not directly accessible from the outside. and may include an authentication module for management. According to an embodiment, the at least one external device 100a may communicate with the electronic device 100 or provide information through communication between external devices. According to an embodiment, at least one external device 100a may be functionally connected to the server 310 or 320 . In various embodiments, the at least one external device 100a includes a cover case, an NFC dongle, a vehicle charger, an earphone, an ear cap (eg, an accessory device mounted on a mobile phone audio connector), a thermometer, It may be a product of various types, such as an electronic pen, BT earphone, BT speaker, BT dongle, TV, refrigerator, WiFi dongle, etc.

In this regard, for example, the external device 100a such as a wireless charger may supply power to the electronic device 100 through a charging interface such as a coil. In this case, control information may be exchanged between the external device 100a and the electronic device 100 through in-band communication through a charging interface such as a coil. Meanwhile, control information may be exchanged between the external device 100a and the electronic device 100 through out-of-band communication such as Bluetooth or NFC.

Meanwhile, the first server 310 may include a server for a service related to the at least one external device 100a, a cloud device, or a hub device for controlling a service in a smart home environment. The first server 310 may include one or more of an external device authentication module 311 , a content/function/policy information DB 312 , an external device information DB 313 , and an electronic device/user DB 314 . . The first server 310 may be referred to as an authentication management server, an authentication server, or an authentication-related server. The second server 320 may include a server or a cloud device for providing a service or content, or a hub device for providing a service in a smart home environment. The second server 320 may include one or more of a content DB 321 , an external device specification information DB 322 , a content/function/policy information management module 323 , or a device/user authentication/management module 324 . can The second server 130 may be referred to as a content management server, a content server, or a content-related server.

Meanwhile, the electronic device 100 described herein may maintain a connection state with a 4G base station (eNB) and a 5G base station (eNB) through the 4G wireless communication module 111 and/or the 5G wireless communication module 112 . . In this regard, as described above, FIG. 1C shows a configuration in which an electronic device is interfaced with a plurality of base stations or network entities according to an embodiment.

Referring to FIG. 1C , 4G/5G deployment options are shown. In relation to 4G/5G deployment, when multi-RAT of 4G LTE and 5G NR is supported and in non-standalone (NSA) mode, it can be implemented as EN-DC of option 3 or NGEN-DC of option 5. On the other hand, if multi-RAT is supported and in standalone (SA) mode, it may be implemented as NE-DC of option 4. In addition, when single RAT is supported and in standalone (SA) mode, it may be implemented as NR-DC of option 2.

Regarding the base station type, the eNB is a 4G base station, also called an LTE eNB, and is based on the Rel-8 - Rel-14 standard. On the other hand, ng-eNB is an eNB capable of interworking with 5GC and gNB, also called eLTE eNB, and is based on the Rel-15 standard. In addition, gNB is a 5G base station interworking with 5G NR and 5GC, also called NR gNB, and is based on the Rel-15 standard. In addition, en-gNB is a gNB capable of interworking with EPC and eNB, also called NR gNB, and is based on the Rel-15 standard. Regarding the Dual Connectivity (DC) type, option 3 indicates E-UTRA-NR Dual Connectivity (EN-DC). On the other hand, option 7 represents NG-RAN E-UTRA-NR Dual Connectivity (NGEN-DC). Also, option 4 indicates NR-E-UTRA Dual Connectivity (NE-DC). Also, option 2 indicates NR-NR Dual Connectivity (NR-DC). In this regard, the technical characteristics of the dual connection according to option 2 to option 7 are as follows.

- Option 2: Independent 5G service can be provided only with 5G system (5GC, gNB). In addition to eMBB (enhanced Mobile Broadband), URLLC (Ultra-Reliable Low-Latency Communication) and mMTC (Massive Machine Type Communication) communication are possible, and 5GC characteristics such as network slicing, MEC support, Mobility on demand, and Access-agnostic can be used. 5G full service can be provided. Initially, due to coverage limitations, it can be used as a hot spot, enterprise, or overlay network. In case of out of 5G NR coverage, EPC-5GC interworking is required. 5G NR full coverage may be provided, and dual connectivity (NR-DC) between gNBs may be supported using multiple 5G frequencies.

- Option 3: When only gNB is introduced into the existing LTE infrastructure. The core is the EPC and the gNB is the en-gNB capable of interworking with the EPC and the eNB. Dual connectivity (EN-DC) is supported between the eNB and the en-gNB, and the master node is the eNB. The eNB, which is the control anchor of the en-gNB, processes control signaling for network access, connection establishment, handover, etc. of the UE, and user traffic may be delivered through the eNB and/or en-gNB. This option is mainly applied in the first stage of 5G migration as operators operating nationwide LTE networks can quickly establish 5G networks without 5GC without introducing en-gNB and minimal LTE upgrades.

There are 3 types of Option 3, Option 3/3a/3x depending on the user traffic split method. Bearer split is applied to Option 3/3x and Option 3a is not applied. The main method is Option 3x.

- Option 3: Only the eNB is connected to the EPC and the en-gNB is only connected to the eNB. User traffic is split in the master node (eNB) and can be transmitted simultaneously to LTE and NR.

- Option 3a: Both the eNB and the gNB are connected to the EPC, and user traffic is delivered directly from the EPC to the gNB. User traffic is transmitted in LTE or NR.

- Option 3x: Option 3 and Option 3a are combined. The difference from Option 3 is that user traffic is split at the secondary node (gNB).

The advantages of Option 3 are i) that LTE can be used as a capacity booster for eMBB service, and ii) that the terminal is always connected to LTE, so even if it goes out of 5G coverage or the NR quality is deteriorated, service continuity is provided through LTE and stable Communication may be provided.

- Option 4: 5GC is introduced and it is still linked with LTE, but independent 5G communication is possible. The core is 5GC and the eNB is an ng-eNB capable of interworking with 5GC and gNB. Dual connectivity (NE-DC) is supported between the ng-eNB and the gNB, and the master node is the gNB. When 5G NR coverage is sufficiently expanded, LTE can be used as a capacity booster. There are 2 types of Option 4/4a. The main method is Option 4a.

- Option 7: 5GC is introduced and still works with LTE, so 5G communication depends on LTE. The core is 5GC and the eNB is an ng-eNB capable of interworking with 5GC and gNB. Dual connectivity (NGEN-DC) is supported between ng-eNB and gNB, and the master node is the eNB. 5GC characteristics can be used, and service continuity can still be provided with the eNB as the master node, as in Option 3, when 5G coverage is not yet sufficient. There are 3 types of Option 7, Option 7/7a/7x, depending on the user traffic split method. Bearer split is applied to Option 7/7x and Option 7a is not applied. The main method is Option 7x.

Referring to FIGS. 2B and 2C , the disclosed electronic device 100 has a bar-shaped terminal body. However, the present invention is not limited thereto, and may be applied to various structures such as a watch type, a clip type, a glass type, or a folder type in which two or more bodies are coupled to be relatively movable, a flip type, a slide type, a swing type, a swivel type, etc. . Although they will relate to specific types of electronic devices, descriptions regarding specific types of electronic devices are generally applicable to other types of electronic devices.

Here, the terminal body may be understood as a concept referring to the electronic device 100 as at least one aggregate.

The electronic device 100 includes a case (eg, a frame, a housing, a cover, etc.) forming an exterior. As illustrated, the electronic device 100 may include a front case 101 and a rear case 102 . Various electronic components are disposed in the inner space formed by the combination of the front case 101 and the rear case 102 . At least one middle case may be additionally disposed between the front case 101 and the rear case 102 .

A display 151 is disposed on the front surface of the terminal body to output information. As shown, the window 151a of the display 151 may be mounted on the front case 101 to form a front surface of the terminal body together with the front case 101 .

In some cases, an electronic component may also be mounted on the rear case 102 . Electronic components that can be mounted on the rear case 102 include a removable battery, an identification module, a memory card, and the like. In this case, the rear cover 103 for covering the mounted electronic component may be detachably coupled to the rear case 102 . Accordingly, when the rear cover 103 is separated from the rear case 102 , the electronic components mounted on the rear case 102 are exposed to the outside. On the other hand, a portion of the side of the rear case 102 may be implemented to operate as a radiator (radiator).

As shown, when the rear cover 103 is coupled to the rear case 102, a portion of the side of the rear case 102 may be exposed. In some cases, the rear case 102 may be completely covered by the rear cover 103 during the combination. Meanwhile, the rear cover 103 may have an opening for exposing the camera 121b or the sound output unit 152b to the outside.

The electronic device 100 includes a display 151 , first and second sound output units 152a and 152b , a proximity sensor 141 , an illuminance sensor 142 , a light output unit 154 , and first and second cameras. (121a, 121b), first and second operation units (123a, 123b), a microphone 122, a wired communication module 160, etc. may be provided.

The display 151 displays (outputs) information processed by the electronic device 100 . For example, the display 151 may display execution screen information of an application program driven in the electronic device 100 or UI (User Interface) and GUI (Graphic User Interface) information according to the execution screen information.

In addition, two or more displays 151 may exist according to an implementation form of the electronic device 100 . In this case, in the electronic device 100 , a plurality of display units may be spaced apart from each other on one surface or may be integrally disposed, or may be respectively disposed on different surfaces.

The display 151 may include a touch sensor for sensing a touch on the display 151 so as to receive a control command input by a touch method. Using this, when a touch is made on the display 151, the touch sensor detects the touch, and the processor 180 may generate a control command corresponding to the touch based thereon. The content input by the touch method may be letters or numbers, or menu items that can be instructed or designated in various modes.

As such, the display 151 may form a touch screen together with the touch sensor, and in this case, the touch screen may function as the user input unit 123 (refer to FIG. 1A ). In some cases, the touch screen may replace at least some functions of the first operation unit 123a.

The first sound output unit 152a may be implemented as a receiver that transmits a call sound to the user's ear, and the second sound output unit 152b is a loud speaker that outputs various alarm sounds or multimedia reproduction sounds. ) can be implemented in the form of

The light output unit 154 is configured to output light to notify the occurrence of an event. Examples of the event may include a message reception, a call signal reception, a missed call, an alarm, a schedule notification, an email reception, and information reception through an application. When the user's event confirmation is detected, the processor 180 may control the light output unit 154 to end the light output.

The first camera 121a processes an image frame of a still image or a moving image obtained by an image sensor in a shooting mode or a video call mode. The processed image frame may be displayed on the display 151 and stored in the memory 170 .

The first and second manipulation units 123a and 123b are an example of the user input unit 123 operated to receive a command for controlling the operation of the electronic device 100, and may be collectively referred to as a manipulating portion. there is. The first and second operation units 123a and 123b may be adopted in any manner as long as they are operated in a tactile manner, such as by a touch, push, or scroll, while the user receives a tactile feeling. In addition, the first and second manipulation units 123a and 123b may be operated in a manner in which the user is operated without a tactile feeling through a proximity touch, a hovering touch, or the like.

Meanwhile, the electronic device 100 may be provided with a fingerprint recognition sensor for recognizing a user's fingerprint, and the processor 180 may use fingerprint information detected through the fingerprint recognition sensor as an authentication means. The fingerprint recognition sensor may be embedded in the display 151 or the user input unit 123 .

The wired communication module 160 serves as a path through which the electronic device 100 can be connected to an external device. For example, the wired communication module 160 includes a connection terminal for connection with another device (eg, earphone, external speaker), a port for short-range communication (eg, an infrared port (IrDA Port), a Bluetooth port ( Bluetooth Port), a wireless LAN port, etc.], or at least one of a power supply terminal for supplying power to the electronic device 100 . The wired communication module 160 may be implemented in the form of a socket accommodating an external card, such as a subscriber identification module (SIM), a user identity module (UIM), or a memory card for information storage.

A second camera 121b may be disposed on the rear side of the terminal body. In this case, the second camera 121b has a photographing direction substantially opposite to that of the first camera 121a. The second camera 121b may include a plurality of lenses arranged along at least one line. The plurality of lenses may be arranged in a matrix form. Such a camera may be referred to as an array camera. When the second camera 121b is configured as an array camera, images may be captured in various ways using a plurality of lenses, and images of better quality may be obtained. The flash 125 may be disposed adjacent to the second camera 121b. The flash 125 illuminates light toward the subject when the subject is photographed by the second camera 121b.

A second sound output unit 152b may be additionally disposed on the terminal body. The second sound output unit 152b may implement a stereo function together with the first sound output unit 152a, and may be used to implement a speakerphone mode during a call. In addition, the microphone 152c is configured to receive a user's voice, other sounds, and the like. The microphone 152c may be provided at a plurality of locations and configured to receive stereo sound.

At least one antenna for wireless communication may be provided in the terminal body. The antenna may be built into the terminal body or formed in the case. Meanwhile, a plurality of antennas connected to the 4G wireless communication module 111 and the 5G wireless communication module 112 may be disposed on the side of the terminal. Alternatively, the antenna may be formed in a film type and attached to the inner surface of the rear cover 103 , or a case including a conductive material may be configured to function as an antenna.

Meanwhile, a plurality of antennas disposed on the side of the terminal may be implemented in four or more to support MIMO. In addition, when the 5G wireless communication module 112 operates in a millimeter wave (mmWave) band, as each of the plurality of antennas is implemented as an array antenna, a plurality of array antennas may be disposed in the electronic device.

The terminal body is provided with a power supply unit 190 (refer to FIG. 1A ) for supplying power to the electronic device 100 . The power supply unit 190 may include a battery 191 that is built into the terminal body or is detachably configured from the outside of the terminal body.

Hereinafter, a multi-communication system structure according to an embodiment and an electronic device having the same, in particular, an antenna in a heterogeneous radio system and an electronic device having the same will be described with reference to the accompanying drawings. It is apparent to those skilled in the art that the present invention may be embodied in other specific forms without departing from the spirit and essential characteristics of the present invention.

Meanwhile, detailed operations and functions of an electronic device having a plurality of antennas according to an embodiment provided with a 4G/5G wireless communication module as shown in FIG. 2A will be reviewed below.

In the 5G communication system according to an embodiment, the 5G frequency band may be a higher frequency band than the Sub6 band. For example, the 5G frequency band may be a millimeter wave band, but is not limited thereto and may be changed according to an application.

3A illustrates an example of a configuration in which a plurality of antennas of an electronic device may be disposed according to an embodiment. Referring to FIG. 3A , a plurality of antennas 1110a to 1110d may be disposed inside or on the front side of the electronic device 100 . In this regard, the plurality of antennas 1110a to 1110d may be implemented in a form printed on a carrier inside an electronic device or may be implemented in a system-on-a-chip (Soc) form together with an RFIC. Meanwhile, the plurality of antennas 1110a to 1110d may be disposed on the front surface of the electronic device in addition to the inside of the electronic device. In this regard, the plurality of antennas 1110a to 1110d disposed on the front surface of the electronic device 100 may be implemented as transparent antennas embedded in a display.

Meanwhile, a plurality of antennas 1110S1 and 1110S2 may be disposed on a side surface of the electronic device 100 . In this regard, a 4G antenna is disposed on the side of the electronic device 100 in the form of a conductive member, a slot is formed in the conductive member region, and a plurality of antennas 1110a to 1110d radiate a 5G signal through the slot. can be In addition, antennas 1150B may be disposed on the rear surface of the electronic device 100 so that the 5G signal may be radiated from the rear surface.

Meanwhile, according to the present invention, at least one signal may be transmitted or received through the plurality of antennas 1110S1 and 1110S2 on the side of the electronic device 100 . Also, according to the present invention, at least one signal may be transmitted or received through the plurality of antennas 1110a to 1110d, 1150B, 1110S1 and 1110S2 on the front and/or side of the electronic device 100 . The electronic device may communicate with the base station through any one of the plurality of antennas 1110a to 1110d, 1150B, 1110S1, and 1110S2. Alternatively, the electronic device may perform multiple input/output (MIMO) communication with the base station through two or more antennas among the plurality of antennas 1110a to 1110d, 1150B, 1110S1, and 1110S2.

3B illustrates a configuration of a wireless communication unit of an electronic device operable in a plurality of wireless communication systems according to an embodiment. Referring to FIG. 3B , the electronic device includes a first power amplifier 1210 , a second power amplifier 1220 , and an RFIC 1250 . Also, the electronic device may further include a modem 400 and an application processor (AP) 500 . Here, the modem 400 and the application processor AP 500 are physically implemented on a single chip, and may be implemented in a logically and functionally separated form. However, the present invention is not limited thereto and may be implemented in the form of physically separated chips depending on the application.

On the other hand, the electronic device includes a plurality of low noise amplifiers (LNA: Low Noise Amplifiers, 13110 to 1340) in the receiver. Here, the first power amplifier 1210 , the second power amplifier 1220 , the controller 1250 , and the plurality of low-noise amplifiers 310 to 340 are all operable in the first communication system and the second communication system. In this case, the first communication system and the second communication system may be a 4G communication system and a 5G communication system, respectively.

As shown in FIG. 2B , the RFIC 1250 may be configured as a 4G/5G integrated type, but is not limited thereto and may be configured as a 4G/5G separate type according to an application. When the RFIC 1250 is configured as a 4G/5G integrated type, it is advantageous in terms of synchronization between 4G/5G circuits, as well as the advantage that control signaling by the modem 1400 can be simplified.

Meanwhile, when the RFIC 1250 is configured as a 4G/5G separate type, it may be referred to as a 4G RFIC and a 5G RFIC, respectively. In particular, when the difference between the 5G band and the 4G band is large, such as when the 5G band is configured as a millimeter wave band, the RFIC 1250 may be configured as a 4G/5G separate type. As such, when the RFIC 1250 is configured as a 4G/5G separate type, there is an advantage that RF characteristics can be optimized for each of the 4G band and the 5G band.

On the other hand, even when the RFIC 1250 is configured as a 4G/5G separate type, the 4G RFIC and the 5G RFIC are logically and functionally separated, and it is also possible to be physically implemented on a single chip.

Meanwhile, the application processor (AP) 1450 is configured to control the operation of each component of the electronic device. Specifically, the application processor (AP) 1450 may control the operation of each component of the electronic device through the modem 1400 .

For example, the modem 1400 may be controlled through a power management IC (PMIC) for low power operation of the electronic device. Accordingly, the modem 1400 may operate the power circuits of the transmitter and the receiver in the low power mode through the RFIC 1250 .

In this regard, when it is determined that the electronic device is in an idle mode, the application processor (AP) 500 may control the RFIC 1250 through the modem 300 as follows. For example, if the electronic device is in an idle mode, the RFIC through the modem 300 so that at least one of the first and second power amplifiers 110 and 120 operates in the low power mode or is turned off (1250) can be controlled.

According to another embodiment, when the electronic device is in a low battery mode, the application processor (AP) 500 may control the modem 300 to provide wireless communication capable of low power communication. For example, when the electronic device is connected to a plurality of entities among a 4G base station, a 5G base station, and an access point, the application processor (AP) 1450 may control the modem 1400 to enable wireless communication with the lowest power. Accordingly, the application processor (AP) 500 may control the modem 1400 and the RFIC 1250 to perform short-distance communication using only the short-range communication module 113 even though the throughput is somewhat sacrificed.

According to another embodiment, when the remaining battery level of the electronic device is equal to or greater than a threshold, the modem 300 may be controlled to select an optimal wireless interface. For example, the application processor (AP) 1450 may control the modem 1400 to receive through both the 4G base station and the 5G base station according to the remaining battery level and available radio resource information. In this case, the application processor (AP) 1450 may receive the remaining battery level information from the PMIC and the available radio resource information from the modem 1400 . Accordingly, if the remaining battery level and available radio resources are sufficient, the application processor (AP) 500 may control the modem 1400 and the RFIC 1250 to receive through both the 4G base station and the 5G base station.

Meanwhile, the multi-transceiving system of FIG. 3B may integrate the transmitter and receiver of each radio system into one transceiver. Accordingly, there is an advantage that a circuit part integrating two types of system signals in the RF front-end can be removed.

In addition, since the front-end components can be controlled by the integrated transceiver, the front-end components can be more efficiently integrated than when the transmission/reception system is separated for each communication system.

In addition, when each communication system is separated, it is impossible to control other communication systems as necessary, or efficient resource allocation is impossible because the system delay is increased. On the other hand, the multi-transmission/reception system as shown in FIG. 2 has the advantage that it is possible to control other communication systems as necessary, and thus system delay can be minimized, so that efficient resource allocation is possible.

Meanwhile, the first power amplifier 1210 and the second power amplifier 1220 may operate in at least one of the first and second communication systems. In this regard, when the 5G communication system operates in the 4G band or the Sub6 band, the first and second power amplifiers 1220 may operate in both the first and second communication systems.

On the other hand, when the 5G communication system operates in the millimeter wave (mmWave) band, one of the first and second power amplifiers 1210 and 1220 operates in the 4G band, and the other operates in the millimeter wave band. there is.

Meanwhile, by integrating the transceiver and the receiving unit, two different wireless communication systems can be implemented with one antenna by using an antenna for both transmitting and receiving. In this case, 4x4 MIMO can be implemented using four antennas as shown in FIG. 2 . In this case, 4x4 DL MIMO may be performed through the downlink (DL).

Meanwhile, if the 5G band is the Sub6 band, the first to fourth antennas ANT1 to ANT4 may be configured to operate in both the 4G band and the 5G band. On the other hand, if the 5G band is a millimeter wave (mmWave) band, the first to fourth antennas ANT1 to ANT4 may be configured to operate in any one of the 4G band and the 5G band. In this case, if the 5G band is a millimeter wave (mmWave) band, each of a plurality of separate antennas may be configured as an array antenna in the millimeter wave band.

Meanwhile, 2x2 MIMO implementation is possible using two antennas connected to the first power amplifier 1210 and the second power amplifier 1220 among the four antennas. In this case, 2x2 UL MIMO (2 Tx) may be performed through the uplink (UL). Alternatively, it is not limited to 2x2 UL MIMO, and may be implemented with 1 Tx or 4 Tx. In this case, when the 5G communication system is implemented with 1 Tx, only one of the first and second power amplifiers 1210 and 1220 needs to operate in the 5G band. On the other hand, when the 5G communication system is implemented as 4Tx, an additional power amplifier operating in the 5G band may be further provided. Alternatively, a transmission signal may be branched in each of one or two transmission paths, and the branched transmission signal may be connected to a plurality of antennas.

On the other hand, since a switch-type splitter or a power divider is built inside the RFIC corresponding to the RFIC 1250, there is no need for a separate component to be disposed outside, thereby improving component mountability. can Specifically, by using a single pole double throw (SPDT) type switch inside the RFIC corresponding to the controller 1250 , it is possible to select the transmitter (TX) of two different communication systems.

In addition, the electronic device operable in a plurality of wireless communication systems according to an embodiment may further include a duplexer 1231 , a filter 1232 , and a switch 1233 .

The duplexer 1231 is configured to mutually separate signals of a transmission band and a reception band. At this time, the signals of the transmission band transmitted through the first and second power amplifiers 1210 and 1220 are applied to the antennas ANT1 and ANT4 through the first output port of the duplexer 1231 . On the other hand, signals of the reception band received through the antennas ANT1 and ANT4 are received by the low noise amplifiers 310 and 340 through the second output port of the duplexer 1231 .

The filter 1232 may be configured to pass a signal of a transmission band or a reception band and block a signal of the remaining band. In this case, the filter 1232 may include a transmit filter connected to a first output port of the duplexer 1231 and a receive filter connected to a second output port of the duplexer 1231 . Alternatively, the filter 1232 may be configured to pass only a signal of a transmission band or only a signal of a reception band according to the control signal.

The switch 1233 is configured to transmit either only a transmit signal or a receive signal. In an embodiment of the present invention, the switch 1233 may be configured in a single pole double throw (SPDT) type to separate a transmission signal and a reception signal in a time division multiplexing (TDD) method. In this case, the transmission signal and the reception signal are signals of the same frequency band, and accordingly, the duplexer 1231 may be implemented in the form of a circulator.

On the other hand, in another embodiment of the present invention, the switch 1233 is also applicable to a frequency division multiplexing (FDD: Time Division Duplex) scheme. In this case, the switch 1233 may be configured in a double pole double throw (DPDT) type to connect or block a transmission signal and a reception signal, respectively. Meanwhile, since a transmission signal and a reception signal can be separated by the duplexer 1231 , the switch 1233 is not necessarily required.

Meanwhile, the electronic device according to an embodiment may further include a modem 1400 corresponding to a control unit. In this case, the RFIC 1250 and the modem 1400 may be referred to as a first controller (or first processor) and a second controller (second processor), respectively. Meanwhile, the RFIC 1250 and the modem 1400 may be implemented as physically separate circuits. Alternatively, the RFIC 1250 and the modem 1400 may be physically or logically divided into one circuit.

The modem 1400 may control and process signals for transmission and reception of signals through different communication systems through the RFIC 1250 . The modem 1400 may be obtained through control information received from the 4G base station and/or the 5G base station. Here, the control information may be received through a physical downlink control channel (PDCCH), but is not limited thereto.

The modem 1400 may control the RFIC 1250 to transmit and/or receive a signal through the first communication system and/or the second communication system in a specific time and frequency resource. Accordingly, the RFIC 1250 may control transmission circuits including the first and second power amplifiers 1210 and 1220 to transmit a 4G signal or a 5G signal in a specific time period. Also, the RFIC 1250 may control receiving circuits including the first to fourth low-noise amplifiers 310 to 340 to receive a 4G signal or a 5G signal in a specific time period.

Meanwhile, the application program operating in the electronic device described in this specification may be driven in association with a user space, a kernel space, and hardware. In this regard, FIG. 4 shows a framework structure related to an application program operating in an electronic device according to an exemplary embodiment. The program module 410 may include a kernel 420 , middleware 430 , an API 450 , a framework/library 460 , and/or an application 470 . At least a portion of the program module 410 may be pre-loaded on the electronic device or downloaded from an external device or server.

The kernel 420 may include a system resource manager 421 and/or a device driver 423 . The system resource manager 421 may control, allocate, or recover system resources. According to an embodiment, the system resource manager 421 may include a process manager, a memory manager, or a file system manager. The device driver 423 may include a display driver, a camera driver, a Bluetooth driver, a shared memory driver, a USB driver, a keypad driver, a WiFi driver, an audio driver, or an inter-process communication (IPC) driver. The middleware 430 provides, for example, functions commonly required by the applications 470 or provides various functions through the API 460 so that the applications 470 can use limited system resources inside the electronic device. It may be provided as an application 470 .

The middleware 430 includes a runtime library 425 , an application manager 431 , a window manager 432 , a multimedia manager 433 , a resource manager 434 , a power manager 435 , a database manager 436 , a package manager ( 437 ), connectivity manager 438 , notification manager 439 , location manager 440 , graphic manager 441 , security manager 442 , content manager 443 , service manager 444 or an external device manager It may include at least one of (445).

The framework/library 450 may include a general-purpose framework/library 451 and a special-purpose framework/library 452 . Here, the general-purpose framework/library 451 and the special-purpose framework/library 452 may be referred to as a first framework/library 451 and a second framework/library 452 , respectively. The first framework/library 451 and the second framework/library 452 may interface with the kernel space and hardware through the first API 461 and the second API 462, respectively. Here, the second framework/library 452 may be an example software architecture that may modularize artificial intelligence (AI) functions. Using the architecture, various processing blocks of hardware implemented as a System on Chip (SoC) (eg, CPU 422, DSP 424, GPU 426, and/or NPU 428) to support operations during runtime operation of the application 470 .

Application 470 may include, for example, home 471 , dialer 472 , SMS/MMS 473 , instant message (IM) 474 , browser 475 , camera 476 , alarm 477 . , Contact (478), Voice Dial (479), Email (480), Calendar (481), Media Player (482), Album (483), Watch (484), Payment (485), Accessory Management (486) ), health care, or environmental information providing applications.

The AI application may be configured to call functions defined in user space that may provide detection and recognition of a scene indicating the location in which the electronic device is currently operating. The AI application may configure the microphone and camera differently depending on whether the recognized scene is an indoor space or an outdoor space. The AI application may make a request for compiled program code associated with a library defined in the Scene Detect application programming interface (API) to provide an estimate of the current scene. Such a request may rely on the output of a deep neural network configured to provide scene estimates based on video and positioning data.

The framework/library 462 , which may be compiled code of the Runtime Framework, may be further accessible by the AI application. The AI application may cause the runtime framework engine to request a scene estimate at specific time intervals, or triggered by an event detected by the application's user interface. When estimating a scene, the runtime engine may then send a signal to an operating system such as a Linux Kernel running on the SoC. The operating system may cause the operation to be performed on the CPU 422 , DSP 424 , GPU 426 , NPU 428 , or some combination thereof. The CPU 422 may be accessed directly by the operating system, and other processing blocks may be accessed through a driver, such as the DSP 424 , the GPU 426 , or the driver 414 - 418 for the NPU 428 . may be In the illustrative example, deep neural networks and AI algorithms may be configured to run on a combination of processing blocks, such as CPU 422 and GPU 426 , or AI algorithms, such as deep neural networks, may be configured to run on NPU 428 . may be executed.

The AI algorithm performed through the special-purpose framework/library as described above may be performed only by an electronic device or may be performed by a server supported scheme. When the AI algorithm is performed by the server support method, the electronic device may receive and transmit information related to the AI server and AI processing through the 4G/5G communication system.

Meanwhile, referring to FIGS. 1A and 2A , a 5G wireless communication system, that is, 5G new radio access technology (NR) may be provided. In this regard, as more and more communication devices require a larger communication capacity, there is a need for improved mobile broadband communication compared to the existing radio access technology. In addition, massive MTC (Machine Type Communications), which provides various services anytime, anywhere by connecting multiple devices and objects, is also one of the major issues to be considered in next-generation communication. In addition, communication system design considering reliability and latency sensitive service/terminal is being discussed. As described above, the introduction of next-generation radio access technology considering eMBB (enhanced mobile broadband communication), Mmtc (massive MTC), URLLC (Ultra-Reliable and Low Latency Communication), etc. is being discussed, and in this specification, the technology is referred to as NR for convenience. . NR is an expression showing an example of 5G radio access technology (RAT).

A new RAT system including NR uses an OFDM transmission scheme or a similar transmission scheme. The new RAT system may follow OFDM parameters different from those of LTE. Alternatively, the new RAT system may follow the existing numerology of LTE/LTE-A, but may have a larger system bandwidth (eg, 100 MHz). Alternatively, one cell may support a plurality of numerologies. That is, terminals operating in different numerology may coexist in one cell.

In this regard, in the case of 4G LTE, since the maximum bandwidth of the system is limited to 20 MHz, a single sub-carrier spacing (SCS) of 15 KHz is used. However, in the case of 5G NR, since a channel bandwidth of 5 MHz to 400 MHz is supported, FFT processing complexity may increase to process the entire bandwidth through one subcarrier interval. Accordingly, the subcarrier interval used for each frequency band may be extended and applied.

Numerology corresponds to one subcarrier spacing in the frequency domain. By scaling the reference subcarrier spacing by an integer N, different numerology can be defined. In this regard, Fig. 5A shows an example of a frame structure in NR. Meanwhile, FIG. 5B shows a change in the slot length according to a change in the subcarrier spacing in NR.

An NR system can support multiple numerologies. Here, the numerology may be defined by a subcarrier spacing and a cyclic prefix (CP) overhead. In this case, the plurality of subcarrier intervals may be derived by scaling the basic subcarrier interval by an integer N (or μ). Also, although it is assumed that very low subcarrier spacing is not used at very high carrier frequencies, the numerology used can be selected independently of the frequency band. In addition, in the NR system, various frame structures according to a number of numerologies may be supported.

Hereinafter, an Orthogonal Frequency Division Multiplexing (OFDM) numerology and frame structure that can be considered in an NR system will be described. A number of OFDM numerologies supported in the NR system may be defined as shown in Table 1.

μ △f =2 ^m * 15 [kHz] Cyclic prefix (CP) 0 15 Normal One 30 Normal 2 60 Normal, Extended 3 120 Normal 4 240 Normal

NR supports multiple numerology (or subcarrier spacing (SCS)) to support various 5G services. For example, when SCS is 15kHz, it supports wide area in traditional cellular bands, and when SCS is 30kHz/60kHz, dense-urban, lower latency and a wider carrier bandwidth, and when the SCS is 60 kHz or higher, a bandwidth greater than 24.25 GHz to overcome phase noise. The NR frequency band is defined as a frequency range of two types (FR1, FR2). FR1 is the sub 6GHz range, and FR2 is the above 6GHz range, which may mean millimeter wave (mmW).

Table 2 below shows the definition of the NR frequency band.

Frequency Range designation Corresponding frequency range Subcarrier Spacing FR1 450MHz - 6000MHz 15, 30, 60 kHz FR2 24250MHz - 52600MHz 60, 120, 240 kHz

With respect to the frame structure in the NR system, the sizes of various fields in the time domain are expressed as multiples of a specific time unit. 3A is an example of SCS of 60 kHz, and one subframe may include four slots. One subframe = {1,2,4} slots shown in FIG. 3 is an example, and the number of slot(s) that can be included in one subframe may be one, two, or four. In addition, the mini-slot may include 2, 4, or 7 symbols, or more or fewer symbols. Referring to FIG. 5B, the subcarrier spacing of 5G NR phase I and the OFDM symbol length accordingly indicates. Each subcarrier interval is extended by a power of 2, and the symbol length is reduced in inverse proportion to this. In FR1, subcarrier spacings of 15 kHz, 30 kHz and 60 kHz are available depending on the frequency band/bandwidth. In FR2, 60 kHz and 120 kHz can be used for the data channel, and 240 kHz can be used for the synchronization signal.

In 5G NR, a basic unit of scheduling is defined as a slot, and the number of OFDM symbols included in one slot may be limited to 14 as shown in FIG. 5A or 5B regardless of subcarrier spacing. Referring to FIG. 3B , when a wide subcarrier interval is used, the length of one slot is shortened in inverse proportion to reduce transmission delay in a radio section. In addition, in order to efficiently support ultra reliable low latency communication (uRLLC), scheduling in units of minislots (eg, 2, 4, 7 symbols) may be supported as described above in addition to scheduling in units of slots.

Considering the above-described technical features, the slots in 5G NR described herein may be provided at the same interval as the slots of 4G LTE or may be provided as slots of various sizes. As an example, the slot interval in 5G NR may be configured as 0.5 ms, which is the same as the slot interval of 4G LTE. As another example, the slot interval in 5G NR may be configured as 0.25 ms, which is a narrower interval than the slot interval of 4G LTE.

In this regard, the 4G communication system and the 5G communication system may be referred to as a first communication system and a second communication system, respectively. Thus, the first signal (first information) of the first communication system may be a signal (information) in a 5G NR frame with a slot interval scalable to 0.25 ms, 0.5 ms, or the like. On the other hand, the second signal (second information) of the second communication system may be a signal (information) in a 4G LTE frame with a fixed slot interval of 0.5 ms.

Meanwhile, the first signal of the first communication system may be transmitted and/or received through a maximum bandwidth of 20 MHz. On the other hand, the second signal of the second communication system may be transmitted and/or received through a variable channel bandwidth from 5 MHz to 400 MHz. In this regard, the first signal of the first communication system may be FFT-processed with a single sub-carrier spacing (SCS) of 15 KHz.

On the other hand, the second signal of the second communication system may be FFT-processed at subcarrier intervals of 15 kHz, 30 kHz, and 60 kHz according to the frequency band/bandwidth. In this case, the second signal of the second communication system may be modulated and frequency-converted to the FR1 band and transmitted through the 5G Sub6 antenna. Meanwhile, the FR1 band signal received through the 5G Sub6 antenna may be frequency-converted and demodulated. Thereafter, the second signal of the second communication system may be IFFT-processed at subcarrier intervals of 15 kHz, 30 kHz, and 60 kHz according to the frequency band/bandwidth.

Meanwhile, the second signal of the second communication system may be FFT-processed at subcarrier intervals of 60 kHz, 120 kHz, and 240 kHz according to frequency band/bandwidth and data/synchronization channel. In this case, the second signal of the second communication system may be modulated to the FR2 band and transmitted through the 5G mmWave antenna. On the other hand, the FR2 band signal received through the 5G mmWave antenna can be frequency-converted and demodulated. Thereafter, the second signal of the second communication system may be IFFT-processed through subcarrier intervals of 60 kHz, 120 kHz, and 240 kHz according to frequency band/bandwidth and data/synchronization channel.

In 5G NR, symbol-level temporal alignment can be used for transmission schemes using various slot lengths, mini-slots, and different subcarrier spacings. Accordingly, it provides flexibility for efficiently multiplexing various communication services such as enhancement mobile broadband (eMBB) and ultra reliable low latency communication (uRLLC) in the time domain and frequency domain. Also, unlike 4G LTE, 5G NR may define uplink/downlink resource allocation at a symbol level in one slot as shown in FIG. 3 . In order to reduce hybrid automatic repeat request (HARQ) delay, a slot structure capable of transmitting HARQ ACK/NACK directly within a transmission slot may be defined. Such a slot structure may be referred to as a self-contained structure.

Unlike 4G LTE, 5G NR can support a common frame structure constituting an FDD or TDD frame through a combination of various slots. Accordingly, the transmission direction of an individual cell can be freely and dynamically adjusted according to traffic characteristics by introducing a dynamic TDD scheme.

Meanwhile, a detailed operation and function of an electronic device having a plurality of antennas according to an embodiment having a multiple transmission/reception system as shown in FIG. 3B will be reviewed below.

In the 5G communication system according to an embodiment, the 5G frequency band may be a Sub6 band. In this regard, FIG. 6A is a combined configuration diagram in which a plurality of antennas and transceiver circuits are operable with a processor according to an embodiment. FIG. 6B is a configuration diagram in which antennas and transceiver circuits are additionally operable with a processor in the configuration diagram of FIG. 6A .

Referring to FIGS. 6A and 6B , it may include a plurality of antennas ANT1 to ANT4 and front-end modules FEM1 to FEM7 operating in a 4G band and/or a 5G band. In this regard, a plurality of switches SW1 to SW6 may be disposed between the plurality of antennas ANT1 to ANT4 and the front end modules FEM1 to FEM7 .

Also, referring to FIGS. 6A and 6B , it may include a plurality of antennas ANT5 to ANT8 and front-end modules FEM8 to FEM11 operating in a 4G band and/or a 5G band. In this regard, a plurality of switches SW7 to SW10 may be disposed between the plurality of antennas ANT1 to ANT4 and the front end modules FEM8 to FEM11 .

On the other hand, a plurality of signals that may be branched through the plurality of antennas ANT1 to ANT8 may be transmitted to the input of the front end modules FEM1 to FEM11 or the plurality of switches SW1 to SW10 through one or more filters. there is.

As an example, the first antenna ANT1 may be configured to receive a signal in a 5G band. In this case, the first antenna ANT1 may be configured to receive the second signal of the second band B2 and the third signal of the third band B3 . Here, the second band B2 may be an n77 band, and the third band B3 may be an n79 band, but the limitation thereto may be changed according to an application. Meanwhile, the first antenna ANT1 may operate as a transmitting antenna in addition to a receiving antenna.

In this regard, the first switch SW1 may be configured as an SP2T switch or an SP3T switch. When implemented as an SP3T switch, one output port can be used as a test port. Meanwhile, the first and second output ports of the first switch SW1 may be connected to the input of the first front end module FEM1 .

As an example, the second antenna ANT2 may be configured to transmit and/or receive signals in a 4G band and/or a 5G band. In this case, the second antenna ANT2 may be configured to transmit/receive the first signal of the first band B1. Here, the first band B1 may be an n41 band, but the limitation thereto may be changed according to an application.

Meanwhile, the second antenna ANT2 may operate in the low band LB. In addition, the second antenna ANT2 may be configured to operate in a medium band (MB) and/or a high band (HB). Here, the middle band (MB) and the high band (HB) may be referred to as MHB.

A first output of the first filter bank FB1 connected to the second antenna ANT2 may be connected to the second switch SW2 . Meanwhile, the second output of the first filter bank FB1 connected to the second antenna ANT2 may be connected to the third switch SW3 . In addition, the third output of the first filter bank FB1 connected to the second antenna ANT2 may be connected to the fourth switch SW4 .

Accordingly, the output of the second switch SW2 may be connected to the input of the second front end module FEM2 operating in the LB band. Meanwhile, the second output of the third switch SW3 may be connected to the input of the third front end module FEM3 operating in the MHB band. Also, the first output of the third switch SW3 may be connected to the input of the fourth front end module FEM4 operating in the 5G first band B1 . In addition, the third output of the third switch SW3 may be connected to an input of the fifth front-end module FEM5 operating in the MHB band operating in the 5G first band B1.

In this regard, the first output of the fourth switch SW4 may be connected to the input of the third switch SW3 . Meanwhile, the second output of the fourth switch SW4 may be connected to the input of the third front end module FEM3 . Also, the third output of the fourth switch SW4 may be connected to the input of the fifth front end module FEM5 .

As an example, the third antenna ANT3 may be configured to transmit and/or receive signals in the LB band and/or the MHB band. In this regard, a first output of the second filter bank FB2 connected to the second antenna ANT2 may be connected to an input of the fifth front end module FEM5 operating in the MHB band. Meanwhile, the second output of the second filter bank FB2 connected to the second antenna ANT2 may be connected to the fifth switch SW5 .

In this regard, the output of the fifth switch SW5 may be connected to the input of the sixth front end module FEM6 operating in the LB band.

As an example, the fourth antenna ANT4 may be configured to transmit and/or receive a signal in a 5G band. In this regard, the fourth antenna ANT4 may be configured to perform frequency multiplexing (FDM) on the second band B2 as the transmission band and the third band B3 as the reception band. Here, the second band B2 may be an n77 band, and the third band B3 may be an n79 band, but the limitation thereto may be changed according to an application.

In this regard, the fourth antenna ANT4 may be connected to the sixth switch SW6 , and one output of the sixth switch SW6 may be connected to the receiving port of the seventh front end module FEM7 . Meanwhile, the other one of the outputs of the sixth switch SW6 may be connected to a transmission port of the seventh front end module FEM7 .

As an example, the fifth antenna ANT5 may be configured to transmit and/or receive signals in a WiFi band. In addition, the fifth antenna ANT5 may be configured to transmit and/or receive a signal in the MHB band.

In this regard, the fifth antenna ANT5 may be connected to the third filter bank FB3 , and the first output of the third filter bank FB3 may be connected to the first WiFi module WiFi FEM1 . Meanwhile, the second output of the third filter bank FB3 may be connected to the fourth filter bank FB5. In addition, the first output of the fourth filter bank (FB5) may be connected to the first WiFi module (WiFi FEM1). Meanwhile, the second output of the fourth filter bank FB5 may be connected to the eighth front-end module FEM8 operating in the MHB band through the seventh switch SW7 . Accordingly, the fifth antenna ANT5 may be configured to receive the WiFi band and 4G/5G band signals.

Similarly, the sixth antenna ANT6 may be configured to transmit and/or receive signals in a WiFi band. In addition, the sixth antenna ANT6 may be configured to transmit and/or receive a signal in the MHB band.

In this regard, the sixth antenna ANT6 may be connected to the fifth filter bank FB5 , and the first output of the fifth filter bank FB5 may be connected to the second WiFi module WiFi FEM2 . Meanwhile, a second output of the fifth filter bank FB5 may be connected to the sixth filter bank FB6 . In addition, the first output of the sixth filter bank (FB5) may be connected to the second WiFi module (WiFi FEM2). Meanwhile, the second output of the sixth filter bank FB5 may be connected to the ninth front-end module FEM9 operating in the MHB band through the eighth switch SW8. Accordingly, the sixth antenna ANT6 may be configured to receive the WiFi band and 4G/5G band signals.

3B, 6A, and 6B , the baseband processor 1400 may control the antenna and the transceiver circuit 1250 to perform multiple input/output (MIMO) or diversity in the MHB band. In this regard, the adjacent second antenna ANT2 and the third antenna ANT3 may be used in the diversity mode for transmitting and/or receiving the same information as the first signal and the second signal. On the other hand, in the MIMO mode in which the first information is included in the first signal and the second information is included in the second signal, antennas disposed on different sides may be used. As an example, the baseband processor 1400 may perform MIMO through the second antenna ANT2 and the fifth antenna ANT5. As another example, the baseband processor 1400 may perform MIMO through the second antenna ANT2 and the sixth antenna ANT6 .

As an example, the seventh antenna ANT7 may be configured to receive a signal in a 5G band. In this case, the seventh antenna ANT7 may be configured to receive the second signal of the second band B2 and the third signal of the third band B3 . Here, the second band B2 may be an n77 band, and the third band B3 may be an n79 band, but the limitation thereto may be changed according to an application. Meanwhile, the seventh antenna ANT7 may operate as a transmit antenna in addition to a receive antenna.

In this regard, the ninth switch SW9 may be configured as an SP2T switch or an SP3T switch. When implemented as an SP3T switch, one output port can be used as a test port. Meanwhile, the first and second output ports of the ninth switch SW9 may be connected to an input of the tenth front end module FEM10 .

As an example, the eighth antenna ANT8 may be configured to transmit and/or receive signals in a 4G band and/or a 5G band. In this case, the eighth antenna ANT8 may be configured to transmit/receive a signal of the second band B2. Also, the eighth antenna ANT8 may be configured to transmit/receive a signal of the third band B2. Here, the second band B2 may be an n77 band, and the third band B3 may be an n79 band, but the limitation thereto may be changed according to an application. In this regard, the eighth antenna ANT8 may be connected to the eleventh front end module FEM11 through the tenth switch SW10.

Meanwhile, the plurality of antennas ANT1 to ANT8 may be connected to an impedance matching circuit MC1 to MC8 to operate in a plurality of bands. In this regard, when operating in adjacent bands such as the first antenna ANT1 , the fourth antenna ANT4 , the seventh antenna ANT7 , and the eighth antenna ANT8 , only one variable element may be used. In this case, the variable element may be a variable capacitor configured to change the capacitance by varying the voltage.

On the other hand, when the second antenna ANT2, the third antenna ANT3, the fifth antenna ANT5, and the sixth antenna ANT6 can operate in spaced bands, only two or more variable elements may be used. In this case, the two or more variable elements may be two or more variable capacitors or a combination of a variable inductor and a variable capacitor.

3B, 6A, and 6B , the baseband processor 1400 may perform MIMO through at least one of a second band B2 and a third band B3 among 5G bands. In this regard, the baseband processor 1400 may be configured to operate via two or more of the first antenna ANT1 , the fourth antenna ANT4 , the seventh antenna ANT7 , and the eighth antenna ANT8 in the second band B2 . MIMO can be performed. Meanwhile, the baseband processor 1400 performs MIMO through at least two of the first antenna ANT1, the fourth antenna ANT4, the seventh antenna ANT7, and the eighth antenna ANT8 in the third band B3. can be done Accordingly, the baseband processor 1400 may control the plurality of antennas and the transceiver circuit 1250 to support MIMO up to 4RX as well as 2RX in the 5G band.

Hereinafter, specific operations and functions of an electronic device having a plurality of antennas according to an embodiment in which the multiple transmission/reception system is provided as shown in FIGS. 3B, 6A, and 6B will be described below.

In this regard, the electronic device may be configured to provide 5G communication services in various frequency bands. Recently, attempts have been made to provide a 5G communication service using the Sub6 band below the 6GHz band. Meanwhile, some of the LTE frequency bands may be allocated to provide 5G communication services.

Hereinafter, a low profile antenna that can be disposed inside an electronic device according to the present invention will be described. Here, the meaning of "low profile" means that it is formed to have a low height and can be disposed inside the electronic device.

In this regard, the antenna operating in the 5G Sub6 band may be disposed on the side of the electronic device or inside the electronic device. Also, in recent years, electronic devices such as mobile terminals tend to adopt a full display. In addition, new form-factors in the form of foldable, flexible, and rollable are emerging due to the development of flexible displays in addition to electronic devices having full displays.

Even in electronic devices according to such various form-factors, the number of antennas is increasing for fast data transmission. However, since the size and shape of an antenna that can be disposed in an electronic device is limited, there is a problem in that a design space is reduced and it is difficult to secure radiation efficiency.

In order to solve this problem, the present invention provides a low-profile antenna that can be disposed inside a full display or various form-factor electronic devices. Accordingly, an object of the present invention is to provide an electronic device in which a low profile antenna having a small size and a low height is disposed inside the electronic device. Another object of the present invention is to provide a low-profile antenna with high antenna space utilization and placement freedom while optimizing radio performance.

Accordingly, the present invention provides an antenna that can be disposed inside the electronic device, not the side edge of the electronic device, which is a region where the antenna is concentrated in the past. Specifically, an object of the present invention is to design an effective low-profile antenna with a low height that can be horizontally disposed on the inside of the cover of the electronic device.

On the other hand, although four antennas can be used in the current 5G communication system, 8 or more antennas are required in the future 5G communication system or 6G communication system. In this regard, future communication systems are for large-capacity high-speed data transmission, and the number of antennas will continue to increase. However, since the size and shape of an antenna that can be disposed in an electronic device is limited, a design space is reduced, and there are problems in that it is difficult to secure radiation efficiency.

Accordingly, an object of the present invention is to provide a 1xn MIMO antenna module capable of securing a degree of isolation between each other while disposing a low-profile antenna adjacent to each other. To this end, in the present invention, the antenna elements in the 1xn MIMO antenna module may be rotated and arranged and the feeding points may be spaced apart. Here, the meaning of “separating the feeding point” means that the distance between each other is increased as the antenna element is rotated while the feeding unit is offset.

On the other hand, the separation performance between the antennas is improved as the distance between the antennas is increased while the area connected to the ground of the substrate on which the antenna is disposed and the system ground is increased. In addition, when the metal structure is located under the antenna ground, parasitic resonance or ECC issues can be avoided only when the metal structure is in contact with the via (pattern short circuit) portion.

Meanwhile, referring to FIG. 3A , the low-profile antenna of the present invention may be disposed on the carrier 136 . For example, the carrier 136 on which the low-profile antenna of the present invention is disposed may be disposed in the longitudinal direction of the electronic device. In this regard, when the low-profile antenna of the present invention is disposed in the longitudinal direction of the electronic device, multiple input/output (MIMO) may be implemented by disposing a plurality of low-profile antennas.

In relation to such multiple input/output (MIMO), in general, antenna elements need to be spaced apart from each other by 5 wavelengths or more of an operating band. For such a spaced arrangement of 5 wavelengths or more, each of the antenna elements, for example, a 5G 2x2 MIMO antenna, may be disposed on the upper left, lower left, upper right, and lower right sides of the electronic device. As described above, the 5G 2x2 MIMO antennas disposed in the upper left, lower left, upper right, and lower right may cause interference between the 4G MIMO antennas.

Accordingly, the present invention intends to propose a 5G MIMO antenna that can be disposed very closely between antenna elements within a limited space on the carrier 136 inside the electronic device. In this regard, each of the antenna elements constituting the 5G MIMO antenna may be disposed adjacent to each other at a separation distance of about a half wavelength or a quarter wavelength. Accordingly, the 5G MIMO antenna according to the present invention can be implemented by changing the 2x1 MIMO antenna, the 2x2 MIMO antenna, and the m x n MIMO antenna according to the application.

As described above, the low-profile antenna that may be disposed inside the electronic device according to the present invention may be an antenna operating in the 5G Sub 6 band. However, the present invention is not limited thereto, and the low-profile antenna of the present invention may be an antenna operating in an LTE band according to an application.

In this regard, FIGS. 7A and 7B show the configuration of a low-profile antenna according to various embodiments of the present disclosure. 7A shows a structure in which a feeding pattern is formed inside a metal pattern. On the other hand, FIG. 7B shows a structure in which the feeding pattern is spaced apart from the end of the metal pattern.

In this regard, the electronic device having a low-profile antenna operating in the 5G Sub6 band described herein may include at least one antenna to achieve the following objects.

SUMMARY OF THE INVENTION The present invention aims to solve the above and other problems. Another object is to provide an electronic device in which a low profile antenna having a small size and a low height is disposed inside the electronic device.

Another object of the present invention is to provide a low-profile antenna with high antenna space utilization and placement freedom while optimizing radio performance.

Another object of the present invention is to optimize antenna performance in a non-flat type ground mechanism structure, that is, a non-flat system ground structure.

Another object of the present invention is to minimize signal loss due to an interface between a plurality of low-profile antennas and other circuit boards.

Another object of the present invention is to maintain performance between different antennas when interfacing different antennas with other circuit boards.

Another object of the present invention is to provide an antenna structure capable of securing a degree of isolation from each other while arranging low-profile antennas adjacent to each other.

Meanwhile, referring to FIG. 7A , a vertical structure for feeding is required to connect a coupled feed formed in an inset region inside a shorted arm with a transmission line. In this regard, when the metal layer is composed of two layers including the upper portion of the substrate on which the metal pattern and the feeding pattern are disposed, a vertical structure for feeding is required. In this regard, a vertical structure for feeding is required even in a three-layer structure in which the metal layer is a two-layer structure. Therefore, when the terminal mechanism structure is used as a ground, the ground may be referred to as a system ground. In this case, the system ground may be formed in a non-flat structure in which a height from an upper substrate on which the antenna is disposed is different for each area.

Accordingly, when the metal layer is composed of 2 or 3 layers in order to connect the transmission lines and feeding patterns of other circuit boards, a vertical structure for feeding is required at the center portion. In addition, a vertical structure for shorting for reducing the size of the low-profile antenna is also required. As such, it may not be easy to place the component in the lower layer due to the coupled feed disposed inside the shorting arm.

On the other hand, referring to FIG. 7B , a coupled feed is formed to be spaced apart from one end of the shorted arm. Accordingly, the vertical structure for feeding for connecting the coupled feed with the transmission line moves to the side of the shorting arm rather than the inside of the shorting arm. Accordingly, the vertical structure for feeding moves to the side of the antenna to provide a space at the bottom of the antenna.

Therefore, when the terminal mechanism structure is used as a ground, the ground may be referred to as a system ground. In this case, the system ground may be formed in a non-flat structure in which a height from an upper substrate on which the antenna is disposed is different for each area. Accordingly, in the non-flat system ground structure, it is necessary to consider in detail the antenna performance optimization according to the vertical structure for power feeding disposed under the antenna and the conditions for the same.

In this regard, FIG. 8A illustrates the low-profile antenna configuration described herein. Meanwhile, FIG. 8B illustrates a configuration in which the low-profile antenna according to the exemplary embodiment of FIG. 8A is disposed on a carrier inside the electronic device. Meanwhile, FIG. 9A shows a change in a resonant frequency and a bandwidth according to an antenna height change in the antenna configuration having various antenna sizes of FIG. 8A . On the other hand, FIG. 9B shows a radiation efficiency peak according to an antenna height change in the antenna configuration having various antenna sizes of FIG. 8A .

Referring to FIG. 8B , the electronic device may be formed of a dielectric, disposed inside the electronic device, and further include a carrier 136 . In this case, the antenna 1200 may be disposed on the front surface of the carrier 136 , and the first and second metal patterns 1211 and 1212 may be disposed in the longitudinal direction of the electronic device. Accordingly, by arranging the low-profile antennas on the carrier 136 in the electronic device, the antenna may be disposed with little influence on external environmental changes.

Specifically, FIG. 8B illustrates a configuration of an electronic device including a plurality of antennas, a transceiver circuit, and a baseband processor according to an exemplary embodiment. The electronic device 1000 may include a first antenna 1100 , a second antenna 1200 , a transceiver circuit 1250 , and a baseband processor 1400 .

The first antenna 1100 is formed on the side surface of the electronic device and is configured to operate in a first band that is an LTE band. On the other hand, the antenna 1200 according to the present invention may be the second antenna 1200 configured to operate in the second band, which is the 5G Sub 6 band. Here, the position of the first antenna 1100 is not limited to that of FIG. 8B , and may be formed in one region of the left, right, upper or lower portion of the electronic device.

Meanwhile, the transceiver circuit 1250 is connected to the feeding pattern 1220 and configured to transmit signals to the first metal pattern 1211-1 and the second metal pattern 1212-1 through the feeding pattern 1220 . do. In addition, the baseband processor 1400 is connected to the transceiver circuit 1250 and configures the transceiver circuit 1250 to transmit and receive signals through at least one of the first antenna 1100 and the second antenna 1200 . configured to control.

As an embodiment, the transceiver circuit 1250 may be configured to transmit and receive a first signal of a first band and transmit and receive a second signal of a second band. In this regard, the first signal of the first band may be a 4G LTE signal and the second signal of the second band may be a 5G NR signal. A detailed description of the frame structure in the time domain and the subcarrier spacing (SCS) in the frequency domain of the first signal of the first band and the second signal of the second band is as described in FIGS. 5A and 5B .

The baseband processor 1400 may control the transceiver circuit 1250 to receive the second signal through the second antenna 1200 when the quality of the first signal is equal to or less than a threshold. As an example, the baseband processor 1400 may perform carrier aggregation (CA) when a wideband transmission is requested and a wideband is allocated. To this end, the baseband processor 1400 performs carrier aggregation using the first signal of the first band received through the first antenna 1100 and the second signal of the second band received through the second antenna 1200 . (CA: Carrier Aggregation) may be performed.

The first antenna 1100 is configurable to transmit and receive signals of the LTE band. In this regard, the first antenna 1100 may be disposed on the side of the electronic device. For example, the first antenna 1100 may include one or more antennas 1100a and 1100b disposed on the top, bottom, left, or right side of the electronic device.

Accordingly, the baseband processor 1400 corresponding to the modem may perform a multiple input/output (MIMO) or diversity operation through the first antennas 1100a and 1100b. Here, the positions and numbers of the first antennas 1100a and 1100b are not limited thereto, and may be variously changed according to applications. The number of first antennas 1100a and 1100b is expandable up to 4 to support 4TX or 4RX.

On the other hand, the first antenna (1100a, 1100b) may operate in a dual band to operate in the 5G band in addition to the LTE band. In this case, the baseband processor 1400 may perform multiple input/output (MIMO) using at least one of the second antennas 1200 among the first antennas 1100a and 1100b.

8A and 8B , the antenna 1200 according to an embodiment may include a metal pattern 1210 and a feed pattern 1220 . The width W=10mm of the antenna 1200 and the length L=34, 24, 22mm may be configured to be. In this case, in order to consider the antenna characteristic change according to the antenna height change, the antenna height t=0.5mm to 4mm may vary. In this regard, referring to FIGS. 9A and 9B , even with an antenna having the same area, as the height of the antenna increases, the resonant frequency decreases, and the bandwidth and efficiency characteristics are improved. In addition, the change in antenna performance is large according to the change in the antenna height at a low height, and as the antenna height increases, the difference in antenna performance according to the area decreases. Therefore, the size of the antenna and the height of the antenna can be determined in consideration of the resonant frequency (eg, 3.7 GHz), the desired bandwidth condition, and radiation efficiency to operate such an antenna structure in the 5G Sub6 band.

Such a plurality of low-profile antennas operating in the 5G Sub6 band need to be arranged adjacent to each other while ensuring mutual isolation to perform multiple input/output (MIMO). In this regard, FIG. 10A shows a configuration of a plurality of low-profile antennas according to an embodiment. Meanwhile, FIG. 10B shows a multi-layered configuration of a feeding pattern and a metal pattern in the antenna configuration of FIG. 10A . 11A illustrates a configuration in which a low-profile antenna is disposed on a carrier inside an electronic device according to an exemplary embodiment. Meanwhile, FIG. 11B is an enlarged view of a configuration in which a feeding pattern formed in the antenna and a plurality of vias are connected to a PCB under the antenna carrier.

Referring to FIGS. 3A , 10A and 10B , an electronic device having a low-profile antenna may be configured to include an antenna carrier 136 , a frame, and a circuit board (PCB, 250 ). The antenna carrier 136 is made of a dielectric material having a predetermined length and width, and may be configured such that an antenna is disposed. Meanwhile, the frame may be configured to be disposed under the antenna carrier 136 . The frame may be formed of at least a metal material such that a vertical short portion (VS) is connected thereto. In addition, a printed circuit board (PCB) 250 may be disposed under a frame and configured to mount various electronic components.

10A to 11B , the antenna 1200 may include a metal pattern 1210 and a feed pattern 1220 . The antenna 1200 may further include a vertical feeding portion (VF) and a plurality of vertical short portions (VS).

In this regard, the metal pattern 1210 may be configured such that a metal having a predetermined length and width is printed and disposed on the antenna carrier, and operates as a radiator. Meanwhile, at least a portion of the feeding pattern 1220 may be disposed in an inset region inside the metal pattern 1210 , and may be configured to couple and feed a signal to the metal pattern 1210 .

Meanwhile, the plurality of vertical shorting units VS may be formed on a region in which the first antenna ANT1 and the second antenna ANT2 share a metal pattern. In this regard, a plurality of vertical shorting parts VS formed on a region where the first antenna ANT1 and the second antenna ANT2 share a metal pattern may be referred to as a PCB shorting pin. In this regard, FIGS. 12A and 12B show the level of interference between the first and second antennas according to the presence or absence of a PCB shorting pin.

In relation to this, referring to FIGS. 10A to 11B , a vertical short circuit unit VS disposed adjacent to the vertical power supply unit VS may be disposed. In this regard, the vertical shorting part VS may be referred to as a PCB shorting pin. Meanwhile, the vertical shorting part disposed through the antenna frame without passing through the through hole in the outer region of the first and second antennas ANT1 and ANT2 may also be referred to as a PCB shorting pin. In addition, a plurality of via holes disposed in the inner region of the antenna may also be referred to as PCB shorting pins. However, the vertical shorting part VS disposed adjacent to the vertical feeding part VS is to prevent interference with the adjacent antenna.

Accordingly, in FIGS. 12A and 12B , the presence or absence of the PCB shorting pin refers to the vertical shorting part VS disposed adjacent to the vertical feeding part VS. Referring to FIG. 12B , even when there is no PCB shorting pin, resonance formation for the first and second antennas is possible. However, when there is no PCB shorting pin, a parasitic resonance may occur greatly, and accordingly, the level of interference between the first and second antennas may increase.

According to another embodiment, in the plurality of low-profile antennas described herein, a plurality of feeding patterns may be disposed adjacent to each other in order to minimize feeding loss. In this regard, FIG. 13A shows a configuration of a low-profile antenna in which a plurality of feeding patterns are adjacently disposed according to an exemplary embodiment. Meanwhile, FIG. 13B shows a multi-layered configuration, a plurality of vertical feeding units, and a plurality of vertical short circuits in the antenna configuration of FIG. 13A . 13C shows the shape of the antenna of FIG. 13A and the shape of controlling the antenna.

13A to 13C , the vertical feeding part VF may be formed to vertically connect the feeding pad formed on the PCB 250 and the feeding pattern 1220 . In this regard, the configuration of the vertical feeding part VF limited thereto may also be applied to the feeding pattern structure disposed outside the antenna as shown in FIGS. 10A to 11B .

10A to 13B , the low-profile antenna 1200 described herein may be configured to include a first antenna ANT1 and a second antenna ANT2 configured in a mutually symmetrical shape. Accordingly, there is an advantage that multiple input/output (MIMO) can be performed through the first antenna ANT1 and the second antenna ANT2 that are disposed adjacent to each other or configured to have some metal patterns connected thereto.

The feeding pattern 1220 may include a first feeding pattern 1220 - 1 configured to feed the first antenna ANT1 . The feeding pattern 1220 may further include a second feeding pattern 1220 - 2 configured to feed the second antenna ANT2 . In this regard, the first vertical feeding part VF1 connected to the first feeding pattern and the second vertical feeding part VF2 connected to the second feeding pattern may be formed to pass through a hole formed in the frame.

The vertical feeding part VF may include a first vertical feeding part VF1 vertically connected to the first feeding pattern 1220-1. The vertical feeding part VF may include a second vertical feeding part VF2 vertically connected to the second feeding pattern 1220 - 2 .

The low-profile antenna 1200 described herein may further include a plurality of vertical short portions (VS) configured to connect the metal pattern 1210 and the ground formed on the PCB 250 . In relation to this, a first vertical shorting part VS1 may be formed between the first vertical feeding part and the second vertical feeding part among the plurality of vertical shorting parts VS. The first vertical shorting part VS1 may be formed to pass through a hole formed in a frame. As an example, the first vertical shorting part VS1 may be disposed at the center of an area where the first antenna ANT1 and the second antenna ANT2 are interconnected. Accordingly, the level of interference between the first vertical feeding part VF1 and the second vertical feeding part VF2 may be reduced by the first vertical shorting part VS1 .

Meanwhile, the second vertical shorting part VS2 among the plurality of vertical shorting parts may be connected to a lower portion of a frame and may be connected to the metal pattern 1110 through an upper portion of the frame. In this regard, the second vertical shorting part VS1 may be disposed along a left boundary and a right boundary of an area where the first antenna ANT1 and the second antenna ANT2 are interconnected. The second vertical shorting part VS2 may be formed of a plurality of vertical vias along a left boundary and a right boundary. As described above, the second vertical shorting part VS2 formed of a plurality of vertical vias along the left boundary and the right boundary may improve the isolation characteristics of the first antenna ANT1 and the second antenna ANT2 .

Meanwhile, the shape of the low-profile antenna 1200 described in this specification will be described as follows. 13A to 13C , the first antenna ANT1 may include a first metal pattern 1211-1 and a second metal pattern 1211-2 that are spaced apart from each other in a symmetrical form. Meanwhile, the second antenna ANT2 may include a third metal pattern 1211 - 2 and a fourth metal pattern 1212 - 2 that are formed in a mutually symmetrical shape. In this regard, since the first antenna ANT1 and the second antenna ANT2 are formed such that the metal pattern is interconnected, the size of the antenna may be reduced. To this end, the first metal pattern 1211-1 and the third metal pattern 1211-2 may be formed to be interconnected.

Coupling power may be supplied by feeding patterns 1220-1 and 1220-2 spaced apart from each other by a predetermined interval in the longitudinal direction of the first metal pattern 1211-1 and the third metal pattern 1211-2. In this regard, the first metal pattern 1211-1 and the third metal pattern 1211-2 each have a first radiation portion (R1, R1-2) formed in a rectangular shape having a predetermined length and width. may include. In addition, the first metal pattern 1211-1 and the third metal pattern 1211-2 are respectively connected to the first radiation parts R1 and R1-2, and are tapered at a predetermined angle to increase the width. It may further include the formed second radiation portion (R2, R2-2). In this case, the second radiation portion R2 of the first metal pattern 1211-1 and the second radiation portion R2-2 of the third metal pattern 1211-2 may be interconnected. Meanwhile, a plurality of vias may be disposed to be spaced apart from each other by a predetermined distance in a region where the second radiation portions R2 and R2 - 2 are interconnected.

In addition, the feeding patterns 1220 and 1220 - 2 may be formed to be disposed in the inner inset regions of the second metal pattern 1212-1 and the fourth metal pattern 1212 - 2 . In this regard, the second metal pattern 1212-1 and the fourth metal pattern 1212-2 are each formed in a rectangular shape having a predetermined length and width, and a third radiation portion R3, in which an inset region is formed. R3-2) may be included. In addition, the second metal pattern 1212-1 and the fourth metal pattern 1212-2 are connected to the third radiation parts R3 and R3-2, respectively, and are tapered at a predetermined angle to increase the width. It may further include a fourth radiation portion (R4, R2-2) is formed. In this case, a plurality of end portions of the third radiation portions R3 and R3 - 2 of the second metal pattern 1212-1 and the fourth radiation portions R4 and R2 - 2 of the fourth metal pattern 1212 - 2 are provided. The vias 1230 and 1230 - 2 may be disposed to be spaced apart from each other by a predetermined distance.

An end of the first feeding region F2 of the feeding pattern 1220 may be connected to a first transmission line TL1 disposed perpendicular to the feeding pattern 1220 . Meanwhile, an end of the first feeding region F1 of the second feeding pattern 1220 - 2 may be connected to a second transmission line TL2 disposed perpendicular to the second feeding pattern 1220 - 2 . In this regard, the transceiver circuit 1250 applies the first signal to the antenna ANT1 through the first transmission line TL1 and the feed pattern 1220 , and the second transmission line TL2 and the second feed pattern 1220 . The second signal may be applied to the second antenna ANT2 through -2). In this case, the baseband processor 1400 transmits or receives the second signal through the second antenna ANT2 while transmitting or receiving the first signal through the antenna, so as to perform multiple input/output (MIMO). 1250).

In an embodiment, a ground area is disposed on an upper end of an area where the first transmission line TL1 and the second transmission line TL2 are disposed, so that the first transmission line TL1 and the second transmission line TL2 are a strip line. structure can be formed. In this regard, the feeding pattern 1220 and the first transmission line TL1 may be directly connected, and the second feeding pattern 1220 and the second transmission line TL2 may be directly connected. Alternatively, the feeding pattern 1220 and the first transmission line TL1 are connected by a first signal via Via1 , and the second feeding pattern 1220 and the second transmission line TL2 are connected to a second signal via Via2 . may be connected by

Referring to FIGS. 10A to 10B , the first and second feeding patterns 1220-1 and 1220-2 may be configured such that the first and second signals are applied from the outside of the antenna 1200, respectively. In this regard, the first feeding pattern 1220-1 may be disposed offset to an area in which any one of the first metal pattern 1211-1 and the second metal pattern 1211-1 is disposed. . For example, the first feeding pattern 1220-1 may be disposed to be offset to an area in which the second metal pattern 1212-1 is disposed. Meanwhile, the second feeding pattern 1220 - 2 may be disposed to be offset to an area in which any one of the third metal pattern 1212-1 and the fourth metal pattern 1212 - 2 is disposed. For example, the second feeding pattern 1220 - 2 may be disposed to be offset to an area in which the fourth metal pattern 1212 - 2 is disposed.

On the other hand, a plurality of antennas having a plurality of feeding patterns 1220 formed in an outward direction as shown in FIGS. 10A to 11B may be formed in a non-flat system ground structure by at least one electronic component mounted on the PCB 250 . can In this regard, FIG. 14A illustrates a configuration in which a plurality of low-profile antennas are formed in a structure of a PCB on which an electronic component is mounted according to an exemplary embodiment. Meanwhile, FIG. 14B shows a power supply unit and a short circuit unit when the SIM socket is disposed as an electronic component in the configuration of FIG. 13A .

14A and 14B , in the region where the second metal pattern 1212-1 of the first antenna is formed, an end of the first feeding pattern 1220-1 may be connected to the first vertical feeding part VF1. . Also, in the region where the fourth metal pattern 1212 - 2 of the second antenna is formed, an end of the second feeding pattern 1220 - 2 may be connected to the second vertical feeding part VF2.

Meanwhile, referring to FIGS. 10A to 11B , 14A and 14B , a plurality of vertical shorting units 1230 formed on the SIM socket may be connected to inner regions of the first and second antennas ANT1 and ANT2, respectively. . As an example, an antenna height between the SIM socket and the first and second antennas ANT1 and ANT2 may be 0.5 mm, but is not limited thereto and may be changed according to an application. In this regard, referring to FIGS. 9A and 9B , when the antenna height is t=0.5 mm, the degree of change in characteristics such as the antenna resonance frequency, bandwidth, and efficiency may be somewhat large according to the change in the antenna height.

In this regard, FIG. 15A shows the return loss characteristics of the antenna according to whether or not an electronic component such as a SIM socket is disposed underneath. Meanwhile, FIG. 15B shows the efficiency characteristics of an antenna according to whether or not an electronic component such as a SIM socket is disposed underneath.

Referring to FIG. 15A , the return loss (S11) bandwidth of an antenna in which an electronic component such as a SIM socket is not disposed has a wide bandwidth characteristic. On the other hand, the return loss (S22, S33) bandwidth of the antenna in which the electronic component such as the SIM socket is disposed has a narrower bandwidth than the return loss (S11) bandwidth of the antenna. Referring to FIG. 15B , it can be seen that the efficiency of an antenna in which an electronic component such as a SIM socket is disposed is reduced.

Accordingly, the low-profile antenna described herein may be configured to be placed in an area where electronic components such as a possible SIM socket are not placed. In this regard, referring to FIGS. 14A and 14B , a ground region of the electronic component may be removed around the metal pattern 1210 corresponding to the radiator rather than the feeding patterns 1220-1 and 1220-2. In particular, the metal pattern of the electronic component is formed to remove the ground area under the area where the first and third metal patterns 1211-1 and 1211-2 formed in the inner area of the first and second antennas ANT1 and ANT2 are formed. can be removed. In this regard, the SIM socket is mounted with the PCB 250 through a connection formed on the side. Accordingly, the metal pattern at the center of the SIM socket may be removed so that the ground area is removed under the area where the first and third metal patterns 1211-1 and 1211-2 are formed.

According to another embodiment, as shown in FIGS. 13A to 13C , the length of the transmission line connection with the transceiver circuit may be minimized through the feeding pattern 1220 formed inside the antenna. In this regard, referring to FIGS. 13A and 13B , in the region where the first metal pattern 1211-1 of the first antenna is formed, the end of the first feeding pattern 1220-1 is the first vertical feeding part VS1. can be connected with Meanwhile, in the region where the third metal pattern 1211 - 2 of the second antenna is formed, an end of the second feeding pattern 1220 - 2 may be connected to the second vertical feeding unit VS2. In this regard, the first feeding pattern 1220-1 may be configured to be spaced apart from one end of the first metal pattern 1211-1 to couple the first signal. In addition, the second feeding pattern 1220 - 2 may be configured to be spaced apart from one end of the third metal pattern 1212 - 2 so that the second signal is coupled.

On the other hand, at least a portion of the feeding pattern formed on the outside of the antenna of FIGS. 10A to 11B and the feeding pattern formed inside the antenna of FIGS. 13A to 13C and the coupling-coupled antenna metal pattern is formed in a bow-tie shape, so that the antenna characteristics can be optimized. In this regard, the first metal pattern 1211-1 and the third metal pattern 1211-2 include a first radiation portion (R1, R1-2) and a second radiation portion (R2, R2-2). ) may be included.

In this regard, the first radiation portions R1 and R1 - 2 may be formed in a rectangular shape having a predetermined length and width. Meanwhile, the second radiating parts R2 and R2-2 may be connected to the first radiating parts R1 and R1-2, and may be tapered at a predetermined angle to increase the width. In this case, the second radiation portion R2 of the first metal pattern and the second radiation portion R2 - 2 of the third metal pattern may be interconnected. Accordingly, a plurality of vias may be disposed to be spaced apart from each other by a predetermined distance along a left boundary and a right boundary of the region where the second radiation portions R2 and R2 - 2 are interconnected.

The second metal pattern 1212-1 and the fourth metal pattern 1212-2 formed outside the antenna include third radiation portions R3 and R3-2 and fourth radiation portions R4 and R4-2. can do. In this regard, the third radiation portions R3 and R3 - 2 may be formed in a rectangular shape having a predetermined length and width, and an inset region may be formed therein. Meanwhile, the fourth radiating parts R4 and R4-2 may be connected to the third radiating parts R3 and R3-2, and may be tapered at a predetermined angle to increase the width. In this case, a plurality of vias may be disposed at an end of the fourth radiation portion R4 of the second metal pattern and at an end of the fourth radiation portion R4 - 2 of the fourth metal pattern to be spaced apart from each other by a predetermined distance.

Meanwhile, referring to FIGS. 10A to 13B , the electronic device may further include a transceiver circuit 1250 and a baseband processor 1400 . Meanwhile, in the plurality of low-profile antennas described herein, the metal pattern 1211-1 of the first antenna and the metal pattern 1211-2 of the second antenna may be configured to be interconnected. In this regard, the transceiver circuit 1250 may be configured to apply a first signal to the first antenna ANT1 and to apply a second signal to the second antenna ANT2 . Meanwhile, the baseband processor 1400 may control the transceiver circuit 1250 to perform multiple input/output (MIMO). To this end, the baseband processor 1400 controls the transceiver circuit 1250 to transmit or receive the second signal through the second antenna ANT2 while transmitting or receiving the first signal through the first antenna ANT1 . can do.

Meanwhile, the plurality of low-profile antennas operating in the 5G band described herein may be disposed together in the low-profile antenna operating as a WiFi antenna and the antenna carrier. In this regard, FIG. 16A shows a frame structure formed inside an electronic device and having a feeding hole through which a vertical feeding part passes. Meanwhile, FIG. 16B shows a conceptual diagram in which a WiFi antenna and a plurality of 5G antennas are disposed. In addition, FIG. 16C shows a conceptual diagram in which a PCB disposed under the frame is disposed with a WiFi antenna and a plurality of 5G antennas.

13A to 13C and 16A to 16C , the first and second vertical feeding units VF1 and VF2 vertically connected to the PCB 250 penetrate the frame and are on the antenna carrier 136 . It may be connected to the feeding pattern 1220 . Meanwhile, a portion of the vertical shorting part VS vertically connected to the PCB 250 may pass through a feeding hole in the frame to be connected to the metal pattern 1210 on the antenna carrier 136 . On the other hand, a portion of the vertical short circuit portion VS vertically connected to the PCB 250 may be connected to a frame and again connected to the metal pattern 1210 on the antenna carrier 136 .

Meanwhile, the WiFi antenna (W-ANT) may be formed of a single antenna. In this regard, FIG. 17A is a front view of a WiFi antenna according to an embodiment. Meanwhile, FIG. 17B shows a WiFi antenna connected to a vertical feeding unit and a vertical shorting unit, and a vertical feeding unit and a vertical shorting unit. In this regard, FIG. 18A shows the return loss characteristic of the WiFi antenna of FIG. 17A. On the other hand, Figure 18b shows the radiation efficiency and total efficiency characteristics of the WiFi antenna of Figure 17a. In this regard, the efficiency of the antenna may be expressed as radiation efficiency and total efficiency in consideration of signal loss such as a matching characteristic to the radiation efficiency.

16A to 17B , the electronic device may further include a WiFi antenna (W-ANT) disposed to be spaced apart from a first antenna or the second antenna and configured to operate in a WiFi band. In this regard, in the WiFi antenna W-ANT, the first metal pattern 1151 , the second metal pattern 1152 , and the feeding pattern 1155 may be formed in a shape corresponding to the antennas ANT and ANT2 . However, the feeding pattern 1155 of the WiFi antenna (W-ANT) may be formed inside the inset region in which the metal pattern is partially removed from the inside of the first metal pattern 1151 and the second metal pattern 1152 . That is, unlike the antennas (ANT1, ANT2) of the 5G Sub6 band of the offset-fed structure, the WiFi antenna (W-ANT) may be formed in a center-fed structure. Here, the meaning of the center-fed structure means that the feeding pattern is formed in a central region inside the metal pattern on one axis. In this case, on the other axis, the vertical feeding part VF may be connected to the PCB at the end of the feeding pattern 1155 .

In this regard, the first metal pattern 1151 and the second metal pattern 1152 corresponding to the radiator may be formed to be spaced apart from each other in a symmetrical form. Meanwhile, the feeding pattern 1155 may be formed inside the inset region in which the metal pattern is partially removed from the inside of the first metal pattern 1151 and the second metal pattern 1152 . In addition, the WiFi antenna W-ANT may further include a vertical short portion (VS). The vertical shorting part VS may be formed at an end of the first metal pattern 1151 and an end of the second metal pattern 1152 .

Meanwhile, the WiFi antenna W-ANT may be configured to further include a vertical feeding unit VF and a second vertical shorting unit VS2. In this regard, the vertical feeding part VF may be configured such that one end of the feeding pattern 1155 is vertically connected to the feeding pad of the PCB. Meanwhile, the second vertical shorting part VS2 may be disposed at a position spaced apart from a position in which the vertical feeding part VF is vertically connected in a direction perpendicular to a direction in which the feeding pattern 1155 is disposed. That is, the second vertical shorting part VS2 may be configured to be connected to an end of the shorting pattern 1153 disposed parallel to the feeding pattern 1155 . The WiFi antenna W-ANT may be configured to dual resonate in the 2.4 GHz band and the 5.8 GHz band by the second vertical shorting part VS2 connected to the end of the shorting pattern 1153 .

Meanwhile, the offset-fed antenna structure proposed in this specification may be used together with the center-fed antenna structure. In this regard, FIGS. 18A and 18B illustrate a plurality of antennas disposed on a carrier inside an electronic device according to an exemplary embodiment. 18A shows a configuration without a shorting pin connecting a metal pattern corresponding to a radiator printed on an antenna carrier and a frame. In this regard, FIG. 19A shows the return loss and ECC characteristics of the plurality of antennas in the configuration of FIG. 18A. On the other hand, FIG. 19B shows the return loss and ECC characteristics of the plurality of antennas in the configuration of FIG. 18B.

Referring to FIGS. 13A, 13B, and 18A , the vertical feeding units VF1 and VF2 may be configured to pass through the frame to connect the feeding patterns 1220-1 and 1220-2. In this regard, referring to FIGS. 13A, 13B, 18A and 19A, it can be seen that the first and second antennas ANT1 and ANT2 generate resonance even in unwanted bands as indicated by 1) and 2). can Due to the resonance in this unwanted band, the ECC in the corresponding region is also greatly increased. In addition, it can be seen that the interference between the first and second antennas ANT1 and ANT2 increases, so that the resonant frequency moves to a higher band. Meanwhile, when the first and second antennas ANT1 and ANT2 operate MIMO, the ECC level has a value of 0.6 or more in the 5G Sub 6 band.

Meanwhile, referring to FIGS. 13A, 13B, and 18B , the vertical feeding units VF1 and VF2 may pass through the frame to connect the feeding patterns 1220-1 and 1220-2. On the other hand, the vertical shorting part VS may be configured to be connected to the frame. In addition, some vertical shorting parts VS may be configured to pass through the frame. On the other hand, as the vertical shorting part VS is arranged along an area where the first and second antennas are connected, an interference field between the first and second antennas may be blocked. Accordingly, the case in which the vertical shorting units VS are arranged in a line has better performance than the case in which the vertical shorting units VS are arranged in a non-aligned manner.

In this regard, referring to FIGS. 13A, 13B, 18B, and 19B, it can be seen that resonance does not occur in the first and second antennas ANT1 and ANT2 even in an undesired band. In addition, it can be seen that a phenomenon in which the resonant frequency moves to a high band due to interference between the first and second antennas ANT1 and ANT2 does not occur. In addition, when the first and second antennas ANT1 and ANT2 operate MIMO, the ECC level has a low value of 0.2 or less in the 5G Sub 6 band.

18A and 18B , the electronic device may be formed of a dielectric material, disposed inside the electronic device, and further include a carrier 136 . In this case, the antenna 1200 may be disposed on the front surface of the carrier 136 , and the first and second metal patterns 1211 and 1212 may be disposed in the longitudinal direction of the electronic device. Accordingly, multiple low-profile antennas may be disposed on a carrier 136 to perform multiple input/output (MIMO).

According to an embodiment, the antenna carrier 136 has a predetermined distance or less between the ends of the first metal pattern 1211-1 of the antenna ANT1 and the third metal pattern 1211-2 of the second antenna ANT2. may be disposed adjacent to the phase. In this regard, the baseband processor 1400 may control the transceiver circuit 1250 to perform MIMO in the 5G Sub6 band through the adjacent antenna ANT and the second antenna ANT2 .

Meanwhile, the electronic device may further include a WiFi antenna W-ANT disposed to be spaced apart from the antenna ANT1 and the second antenna ANT2 and configured to operate in a WiFi band. Here, in the WiFi antenna W-ANT, the first metal pattern 1151 , the second metal pattern 1152 , and the feeding pattern 1155 may be formed in a shape corresponding to the antennas ANT and ANT2 . However, the feeding pattern 1155 of the WiFi antenna (W-ANT) may be formed inside the inset region in which the metal pattern is partially removed from the inside of the first metal pattern 1151 and the second metal pattern 1152 . That is, unlike the antennas (ANT1, ANT2) of the 5G Sub6 band of the offset-fed structure, the WiFi antenna (W-ANT) may be formed in a center-fed structure.

Therefore, mutual interference characteristics can be reduced through the 5G Sub6 antennas (ANT1, ANT2) and the WiFi antenna (W-ANT) configured with a center-fed structure of a different type. In this regard, Table 3 shows the resonant frequency, bandwidth, peak efficiency, and ECC characteristics of different antennas disposed on a carrier. As shown in Table 3, it can be seen that different antennas operate normally in each band and operate with a low interference level.

In the above, an electronic device having a plurality of antennas and a transceiver circuit according to an embodiment has been described. A wireless communication system including an electronic device and a base station for transmitting a reference signal through the plurality of antennas and the transceiver circuit will be described below. In this regard, FIG. 20 illustrates a block diagram of a wireless communication system to which the methods proposed in the present specification can be applied.

Referring to FIG. 20 , the wireless communication system includes a first communication device 910 and/or a second communication device 920 . 'A and/or B' may be interpreted as having the same meaning as 'including at least one of A or B'. The first communication device may represent the base station and the second communication device may represent the terminal (or the first communication device may represent the terminal and the second communication device may represent the base station).

Base station (BS) is a fixed station (fixed station), Node B, evolved-NodeB (eNB), gNB (Next Generation NodeB), BTS (base transceiver system), access point (AP: Access Point), gNB (general) NB), 5G system, network, AI system, RSU (road side unit), may be replaced by terms such as robot. In addition, the terminal (Terminal) may be fixed or have mobility, UE (User Equipment), MS (Mobile Station), UT (user terminal), MSS (Mobile Subscriber Station), SS (Subscriber Station), AMS (Advanced Mobile) Station), WT (Wireless terminal), MTC (Machine-Type Communication) device, M2M (Machine-to-Machine) device, D2D (Device-to-Device) device, vehicle, robot, AI module may be replaced by terms such as

The first communication device and the second communication device include a processor 911,921, a memory 914,924, one or more Tx/Rx radio frequency modules 915,925, Tx processors 912,922, Rx processors 913,923 , including antennas 916 and 926 . The processor implements the functions, processes and/or methods salpinned above. More specifically, in DL (communication from a first communication device to a second communication device), an upper layer packet from the core network is provided to the processor 911 . The processor implements the functions of the L2 layer. In DL, the processor provides multiplexing between logical channels and transport channels, allocation of radio resources to the second communication device 920, and is responsible for signaling to the second communication device. A transmit (TX) processor 912 implements various signal processing functions for the L1 layer (ie, the physical layer). The signal processing function facilitates forward error correction (FEC) in the second communication device, and includes coding and interleaving. The coded and modulated symbols are divided into parallel streams, each stream mapped to OFDM subcarriers, multiplexed with a reference signal (RS) in the time and/or frequency domain, and using Inverse Fast Fourier Transform (IFFT) are combined together to create a physical channel carrying a stream of time domain OFDMA symbols. The OFDM stream is spatially precoded to generate multiple spatial streams. Each spatial stream may be provided to a different antenna 916 via a separate Tx/Rx module (or transceiver) 915 . Each Tx/Rx module may modulate an RF carrier with a respective spatial stream for transmission. In the second communication device, each Tx/Rx module (or transceiver) 925 receives a signal via each antenna 926 of each Tx/Rx module. Each Tx/Rx module recovers information modulated with an RF carrier and provides it to a receive (RX) processor 923 . The RX processor implements the various signal processing functions of layer 1. The RX processor may perform spatial processing on the information to recover any spatial streams destined for the second communication device. If multiple spatial streams are destined for the second communication device, they may be combined into a single OFDMA symbol stream by multiple RX processors. The RX processor uses a Fast Fourier Transform (FFT) to transform the OFDMA symbol stream from the time domain to the frequency domain. The frequency domain signal includes a separate OFDMA symbol stream for each subcarrier of the OFDM signal. The symbols and reference signal on each subcarrier are recovered and demodulated by determining the most probable signal placement points transmitted by the first communication device. These soft decisions may be based on channel estimate values. The soft decisions are decoded and deinterleaved to recover the data and control signal originally transmitted by the first communication device on the physical channel. Corresponding data and control signals are provided to the processor 921 .

The UL (second communication device to first communication device) is handled in the first communication device 910 in a manner similar to that described with respect to the receiver function in the second communication device 920 . Each Tx/Rx module 925 receives a signal via a respective antenna 926 . Each Tx/Rx module provides an RF carrier and information to the RX processor 923 . The processor 921 may be associated with a memory 924 that stores program code and data. Memory may be referred to as a computer-readable medium.

An electronic device having a 5G low-profile antenna described in this specification is summarized as follows. In this regard, the present specification relates to the design and manufacture of a miniature antenna.

In the antenna according to an embodiment, two metal patterns having one end shorted are disposed to face each other with a gap, and there is a feeding pattern crossing the pattern. The starting point of the feeding pattern may vary depending on the location of the PCB power supply, and the appropriate length will be added accordingly.

Since the feeding pattern is located at the edge, the radiation pattern and the feeding pattern do not overlap, so it can be designed on the same floor, thereby eliminating the vertical structure for feeding. Therefore, the copper layer can be applied in various ways depending on the type of RF line, increasing the freedom of feeding.

When manufacturing the antenna in the form of FPCB, it can be manufactured integrally with the RF transmission line using a microstrip line or a strip line. In addition, when 2MIMO is deployed, the line length to the antenna can be similarly taken, so that the performance deviation due to line loss can be reduced.

On the other hand, the 5G low-profile antenna described in this specification has the following technical features.

1) If the feeding pattern is arranged between the metal patterns shorted on both sides, the coupling amount is large and impedance matching is advantageous. However, in this case, a vertical structure for feeding, such as a via for routing a signal line to a layer different from a metal pattern or a separate feeding structure, is required. A power supply structure that minimizes these restrictions and enables a single-layer design is required.

2) Also, when power is supplied using an RF line, there is a case where the line length between the two antennas needs to be matched because a loss occurs according to the line length. In this case, the line loss deviation can be minimized by changing the feeding position.

3) Accordingly, in the 5G low-profile antenna according to an embodiment, the feeding pattern is disposed at an edge so that the feeding pattern is disposed on the same layer as the antenna metal pattern. Accordingly, since the feeding pattern is disposed at the edge rather than the central region of the antenna, the design of the interface between the feeding pattern and the transmission line is free. On the other hand, bandwidth and efficiency reduction issues that occur as the feeding pattern is disposed off-center can be solved by increasing the length of the feeding pattern.

The technical effects of the electronic device having the 5G low-profile antenna as described above will be described as follows.

According to the present invention, it is possible to provide an electronic device in which a low profile antenna having a small size and a low height is disposed inside the electronic device even in a full display structure.

In addition, according to the present invention, it is possible to provide a low-profile antenna with high antenna space utilization and placement freedom while optimizing wireless performance through a low-profile antenna that can be horizontally disposed inside the electronic device on the cover of the electronic device. .

In addition, according to the present invention, since the antenna metal pattern and the feeding pattern do not overlap, the antenna metal pattern and the feeding pattern can be disposed on the same layer, thereby eliminating the need to form a vertical structure for feeding the antenna.

In addition, according to the present invention, the metal layer can be variously applied according to the RF line, so that the degree of freedom for the feeding position can be increased.

In addition, according to the present invention, it is possible to provide a 1xn MIMO antenna module capable of securing a degree of isolation between each other while arranging the low-profile antennas adjacent to each other.

In addition, according to the present invention, it is possible to optimize antenna performance such as bandwidth and antenna efficiency in a non-flat ground mechanism structure, that is, a non-flat system ground structure.

In addition, according to the present invention, it is possible to minimize the signal loss by minimizing the length of the transmission line according to the interface between the plurality of low-profile antennas and other circuit boards.

In addition, according to the present invention, when different antennas are interfaced with other circuit boards, the feed loss between the different antennas is set to be below a certain level, so that the signal level through the different antennas can be maintained at a certain level during MIMO operation.

Accordingly, when the MIMO antenna is arranged, the line length to the antenna can be similarly taken, so that the performance deviation caused by the line loss can be reduced.

In addition, according to the present invention, the antenna pattern disposed between the respective feeding patterns may give a de-coupling effect between the respective antenna radiators to improve the antenna isolation (S21 and ECC).

In particular, the low-profile antenna according to the present invention has the advantage that the antenna can be effectively designed at a very low height of 0.02λ or less, and impedance matching is easy.

In particular, the low-profile antenna according to the present invention has an advantage in that both ends of the radiator are shorted, so that it is advantageous for arranging several antennas according to the reduction in antenna size and improvement in the degree of mutual isolation.

Further scope of applicability of the present invention will become apparent from the following detailed description. However, it should be understood that the detailed description and specific embodiments such as preferred embodiments of the present invention are given by way of illustration only, since various changes and modifications within the spirit and scope of the present invention may be clearly understood by those skilled in the art.

In relation to the present invention described above, in an electronic device having a plurality of antennas, the antenna including the processors 180 , 1250 , and 1400 , the design of the control unit controlling the same, and the control method thereof are computer-readable in the medium in which the program is recorded. It is possible to implement it as an existing code. The computer-readable medium includes any type of recording device in which data readable by a computer system is stored. Examples of computer-readable media include Hard Disk Drive (HDD), Solid State Disk (SSD), Silicon Disk Drive (SDD), ROM, RAM, CD-ROM, magnetic tape, floppy disk, optical data storage device, etc. There is also a carrier wave (eg, transmission over the Internet) that is implemented in the form of. In addition, the computer may include the control unit 180 of the terminal. Accordingly, the above detailed description should not be construed as restrictive in all respects but as exemplary. The scope of the present invention should be determined by a reasonable interpretation of the appended claims, and all modifications within the equivalent scope of the present invention are included in the scope of the present invention.

Claims (15)

In an electronic device, an antenna carrier made of a dielectric material having a predetermined length and width and configured to place an antenna; a frame disposed under the antenna carrier; and a printed circuit board (PCB) disposed under the frame; The antenna is a metal pattern having a predetermined length and width printed and disposed on the antenna carrier and configured to operate as a radiator; a feeding pattern in which at least a portion of the region is disposed in an inset region inside the metal pattern and configured to couple and feed a signal to the metal pattern; and and a vertical feeding portion formed to vertically connect the feeding pad and the feeding pattern formed on the PCB. According to claim 1, The antenna includes a first antenna and a second antenna configured in a mutually symmetric form, the feeding pattern comprises a first feeding pattern configured to feed the first antenna and a second feeding pattern configured to feed the second antenna; The vertical feeding unit includes a first vertical feeding unit vertically connected to the first feeding pattern and a second vertical feeding unit vertically connected to the second feeding pattern. 3. The method of claim 2, The first vertical feeding unit connected to the first feeding pattern and the second vertical feeding unit connected to the second feeding pattern are formed to pass through a hole formed in the frame. 4. The method of claim 3, The antenna further includes a plurality of vertical short portions configured to connect the metal pattern and the ground formed on the PCB, A first vertical short circuit formed between the first vertical feeding part and the second vertical feeding part among the plurality of vertical shorting parts is formed to pass through a hole formed in the frame, and the first vertical shorting part is disposed at a center of a region where the first antenna and the second antenna are interconnected. 5. The method of claim 4, A second vertical shorting part of the plurality of vertical shorting parts is connected to a lower portion of the frame and connected to the metal pattern through an upper portion of the frame. 6. The method of claim 5, The second vertical shorting part is formed of a plurality of vertical vias disposed along a left boundary and a right boundary of a region where the first antenna and the second antenna are interconnected, so that the first antenna and the second antenna are isolated from each other. An electronic device that improves characteristics. 3. The method of claim 2, The first antenna includes a first metal pattern and a second metal pattern spaced apart from each other in a symmetrical form, The second antenna includes a third metal pattern and a fourth metal pattern disposed in a mutually symmetrical shape, The first metal pattern and the third metal pattern are formed to be interconnected, The first feeding pattern is disposed offset (offset) to an area in which any one of the first metal pattern and the second metal pattern is disposed, The second feeding pattern is disposed offset (offset) to an area in which any one of the third metal pattern and the fourth metal pattern is disposed. 8. The method of claim 7, An end of the first feeding pattern is connected to the first vertical feeding part in a region where the second metal pattern of the first antenna is formed, An end of the second feeding pattern is connected to the second vertical feeding part in a region where the fourth metal pattern of the second antenna is formed. 8. The method of claim 7, An end of the first feeding pattern is connected to the first vertical feeding part in a region where the first metal pattern of the first antenna is formed, An end of the second feeding pattern is connected to the second vertical feeding part in a region where the third metal pattern of the second antenna is formed. 10. The method of claim 9, The first feeding pattern is spaced apart from one end of the first metal pattern and configured to couple a first signal, The second feeding pattern is spaced apart from one end of the third metal pattern and configured to couple a second signal. 8. The method of claim 7, The first metal pattern and the third metal pattern, a first radiation portion formed in a rectangular shape having a predetermined length and width; and and a second radiating part connected to the first radiating part and tapering at a predetermined angle to increase the width, The second radiation portion of the first metal pattern and the second radiation portion of the third metal pattern are interconnected, and a plurality of vias are spaced apart from each other by a predetermined interval along a left boundary and a right boundary of a region where the second radiation portion is interconnected. An electronic device that has become and placed. 8. The method of claim 7, The second metal pattern and the fourth metal pattern, a third radiating part formed in a rectangular shape having a predetermined length and width, and having the inset region formed therein; and and a fourth radiating part connected to the third radiating part and tapering at a predetermined angle to increase the width, and a plurality of vias are disposed at an end of the fourth radiation portion of the second metal pattern and an end portion of the fourth radiation portion of the fourth metal pattern to be spaced apart from each other by a predetermined distance. 3. The method of claim 2, is configured such that the metal pattern of the first antenna and the metal pattern of the second antenna are interconnected, a transceiver circuit configured to apply a first signal to the first antenna and a second signal to the second antenna; and A baseband processor that transmits or receives the second signal through the second antenna while transmitting or receiving the first signal through the first antenna, and controls the transceiver circuit to perform multiple input/output (MIMO); Further comprising, an electronic device. 14. The method of claim 13, The first antenna or the second antenna and disposed spaced apart, further comprising a WiFi antenna configured to operate in a WiFi band, The WiFi antenna is a first metal pattern and a second metal pattern spaced apart from each other in a symmetrical form; a feeding pattern formed inside an inset region from which a metal pattern is partially removed from the first metal pattern and the second metal pattern; and and a vertical short portion formed at an end of the first metal pattern and an end of the second metal pattern. 15. The method of claim 14, The WiFi antenna is a vertical feeding part configured such that one end of the feeding pattern is vertically connected to the feeding pad of the PCB; and The electronic device further comprising: a second vertical short-circuit unit disposed at a position spaced apart from a position in which the vertical feeding unit is vertically connected in a direction perpendicular to a direction in which the feeding pattern is arranged, and configured to be vertically connected to the ground of the PCB.

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