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WO2021153106A1 - Dispositif électroluminescent et dispositif d'éclairage - Google Patents

Dispositif électroluminescent et dispositif d'éclairage Download PDF

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Publication number
WO2021153106A1
WO2021153106A1 PCT/JP2020/047996 JP2020047996W WO2021153106A1 WO 2021153106 A1 WO2021153106 A1 WO 2021153106A1 JP 2020047996 W JP2020047996 W JP 2020047996W WO 2021153106 A1 WO2021153106 A1 WO 2021153106A1
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WO
WIPO (PCT)
Prior art keywords
light emitting
emitting device
phosphor layer
translucent member
light
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Ceased
Application number
PCT/JP2020/047996
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English (en)
Japanese (ja)
Inventor
尚子 竹井
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Panasonic Intellectual Property Management Co Ltd
Original Assignee
Panasonic Intellectual Property Management Co Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Panasonic Intellectual Property Management Co Ltd filed Critical Panasonic Intellectual Property Management Co Ltd
Priority to CN202080086742.4A priority Critical patent/CN114830362A/zh
Publication of WO2021153106A1 publication Critical patent/WO2021153106A1/fr
Anticipated expiration legal-status Critical
Ceased legal-status Critical Current

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Classifications

    • F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
    • F21—LIGHTING
    • F21S—NON-PORTABLE LIGHTING DEVICES; SYSTEMS THEREOF; VEHICLE LIGHTING DEVICES SPECIALLY ADAPTED FOR VEHICLE EXTERIORS
    • F21S8/00—Lighting devices intended for fixed installation
    • F21S8/02—Lighting devices intended for fixed installation of recess-mounted type, e.g. downlighters
    • F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
    • F21—LIGHTING
    • F21V—FUNCTIONAL FEATURES OR DETAILS OF LIGHTING DEVICES OR SYSTEMS THEREOF; STRUCTURAL COMBINATIONS OF LIGHTING DEVICES WITH OTHER ARTICLES, NOT OTHERWISE PROVIDED FOR
    • F21V9/00—Elements for modifying spectral properties, polarisation or intensity of the light emitted, e.g. filters
    • F21V9/30—Elements containing photoluminescent material distinct from or spaced from the light source
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10H—INORGANIC LIGHT-EMITTING SEMICONDUCTOR DEVICES HAVING POTENTIAL BARRIERS
    • H10H20/00—Individual inorganic light-emitting semiconductor devices having potential barriers, e.g. light-emitting diodes [LED]
    • H10H20/80—Constructional details
    • H10H20/85—Packages
    • H10H20/851—Wavelength conversion means
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10H—INORGANIC LIGHT-EMITTING SEMICONDUCTOR DEVICES HAVING POTENTIAL BARRIERS
    • H10H20/00—Individual inorganic light-emitting semiconductor devices having potential barriers, e.g. light-emitting diodes [LED]
    • H10H20/80—Constructional details
    • H10H20/85—Packages
    • H10H20/852—Encapsulations
    • H10H20/854—Encapsulations characterised by their material, e.g. epoxy or silicone resins

Definitions

  • the present invention relates to a light emitting device and a lighting device.
  • Light emitting devices using a solid-state light emitting element such as an LED (Light Emitting Diode) as a light source are becoming more and more popular due to the increase in the output of the LED.
  • Lighting devices used in commercial spaces, office spaces, and the like are required to irradiate white light that makes the color of an object existing in the lighting space look natural, that is, white light having high color rendering properties.
  • a method of obtaining white light by combining an LED and a plurality of types of phosphors is the mainstream, and in this case, the luminous efficiency may decrease. It was an issue.
  • Patent Document 1 proposes to combine Mn 4 + activated fluoride complex phosphor such as KSF phosphor as a red phosphor. ing. Since the KSF phosphor exhibits emission line-like emission characteristics, it emits less light in a long wavelength region with low luminous efficiency, so that a light source that achieves both high luminous efficiency and high color rendering properties can be realized.
  • KSF phosphors are known to have low moisture resistance.
  • the phosphor is dispersed in a silicone resin (sealing member) that seals the LED from the viewpoint of translucency, heat resistance, and weather resistance.
  • the silicone resin has a low water vapor barrier property, it has a low function of suppressing the invasion of water molecules in the atmosphere. Therefore, a light emitting device using a KSF phosphor has a problem that it deteriorates over time after long-term use and its luminous efficiency tends to decrease.
  • Patent Document 2 a method of using glass having a high water vapor barrier property or organic-inorganic hybrid glass as a sealing member for dispersing the phosphor is used. Proposed.
  • the KSF phosphor hydrogen fluoride is generated by reacting with the water remaining on the surface, and the generated hydrogen fluoride erodes the siloxane bond portion of the glass or the organic-inorganic hybrid glass. As a result, there is a problem that the water vapor barrier property of the glass or the organic-inorganic hybrid glass is lowered.
  • Patent Document 3 proposes a structure in which a phosphor layer containing a phosphor is protected by a film having a low water vapor transmittance.
  • this structure is applied to a light emitting device in which a phosphor and a substrate on which a light emitting element is mounted are integrated, the surface on which the film is formed has irregularities, so that the film does not have sufficient followability, and There is a problem that the phosphor is not sufficiently protected due to the invasion of water molecules from the end of the phosphor layer.
  • an object of the present invention is to provide a light emitting device or the like capable of irradiating light having high color rendering properties with high luminous efficiency over a long period of time.
  • the light emitting device is a light emitting device that irradiates white light, and includes a base material, a solid light emitting element arranged on the base material, and the solid light emitting device.
  • a phosphor layer composed of a silicone resin in which a fluorescent member containing a KSF phosphor, which is excited by light from an element and emits light, is dispersed, and is arranged on the base material so as to cover the solid light emitting element.
  • a translucent member which is arranged on the base material so as to surround the phosphor layer without exposing it and is in contact with the base material at a position surrounding the outer periphery of the phosphor layer in a top view.
  • the water vapor transmission rate of the translucent member is 50.0 g / m 2 ⁇ day or less.
  • the lighting device includes the light emitting device and a lighting device that supplies electric power for lighting the light emitting device to the light emitting device.
  • the light emitting device or the like according to the present invention can irradiate light with high color rendering properties with high luminous efficiency for a long period of time.
  • FIG. 1 is a top view showing a schematic configuration of a light emitting device according to a first embodiment.
  • FIG. 2 is a cross-sectional view of the light emitting device according to the first embodiment at the position shown by the line II-II of FIG.
  • FIG. 3A is a diagram showing an example of the concentration distribution of the fluorescent member in the phosphor layer according to the first embodiment.
  • FIG. 3B is a diagram showing another example of the concentration distribution of the fluorescent member in the phosphor layer according to the first embodiment.
  • FIG. 3C is a diagram showing another example of the concentration distribution of the fluorescent member in the phosphor layer according to the first embodiment.
  • FIG. 4 is a cross-sectional view showing a schematic configuration of a light emitting device according to a modified example of the first embodiment.
  • FIG. 5 is a top view showing a schematic configuration of the light emitting device according to the second embodiment.
  • FIG. 6 is a cross-sectional view of the light emitting device according to the second embodiment at the position shown by the VI-VI line of FIG.
  • FIG. 7 is a cross-sectional view showing a schematic configuration of the lighting device according to the third embodiment.
  • FIG. 8 is an external perspective view showing a schematic configuration of the lighting device and its peripheral members according to the third embodiment.
  • each figure is a schematic view in which emphasis, omission, or ratio is adjusted as appropriate to show the present invention, and is not necessarily exactly illustrated. What is the actual shape, positional relationship, and ratio? May be different. Further, in each figure, substantially the same configuration may be designated by the same reference numerals, and duplicate description may be omitted or simplified.
  • the x-axis, y-axis, and z-axis indicate the three axes of the three-dimensional Cartesian coordinate system.
  • the z-axis direction is the vertical direction
  • the direction perpendicular to the z-axis (the direction parallel to the xy plane) is the horizontal direction.
  • the positive direction of the z-axis is the light emission direction.
  • the positive direction of the z-axis is the upper side in the z-axis direction
  • the negative direction of the z-axis is the lower side in the z-axis direction.
  • the numerical value of the color deviation Duv is the numerical value of Duv which is the notation of the color deviation from the blackbody (radiation) locus defined by JIS Z8725, that is, 1000 times the numerical value of duv.
  • the numerical value of the color deviation Duv is 1000 times the numerical value of the duv according to JIS Z8725 unless otherwise specified.
  • FIG. 1 is a top view showing a schematic configuration of a light emitting device 1 according to the present embodiment.
  • FIG. 2 is a cross-sectional view of the light emitting device 1 according to the present embodiment at the position shown by the line II-II of FIG.
  • the light emitting device 1 includes a substrate 10, a plurality of solid-state light emitting elements 20, a phosphor layer 30, and a translucent member 40.
  • the substrate 10 is an example of a base material.
  • the light emitting device 1 is a light emitting device that irradiates white light.
  • the correlated color temperature of the white light emitted by the light emitting device 1 is, for example, 2000 K or more and 7200 K or less.
  • the color deviation Duv of the white light emitted by the light emitting device 1 is, for example, ⁇ 10 or more and +10 or less. Further, the average color rendering index Ra of the white light emitted by the light emitting device 1 is, for example, 80 or more.
  • the light emitting device 1 can irradiate white light having high color rendering properties by using the KSF phosphor 35a described later.
  • the light emitting device 1 is a COB (Chip On Board) type light emitting device, and a plurality of solid-state light emitting elements 20 are mounted on a substrate 10 and sealed by a phosphor layer 30.
  • the substrate 10 is a flat plate-shaped mounting substrate for mounting a plurality of solid-state light emitting elements 20.
  • the substrate 10 is provided with metal wiring (not shown) for supplying electric power to the plurality of solid-state light emitting elements 20. Further, the substrate 10 is provided with electrodes (not shown) for supplying electric power from an external device to the plurality of solid-state light emitting elements 20.
  • the substrate 10 is, for example, a ceramic substrate made of ceramic.
  • the substrate 10 may be a resin substrate using a resin as a base material, or may be a glass substrate. Alternatively, the substrate 10 may be a metal base substrate in which a metal plate is coated with an insulating film.
  • a white substrate having a high light reflectance for example, a light reflectance of 90% or more
  • a white substrate having a high light reflectance for example, a light reflectance of 90% or more
  • the white substrate By using the white substrate, the light emitted by the solid-state light emitting element 20 can be reflected on the surface of the substrate 10, so that the light extraction efficiency can be improved.
  • a white ceramic substrate made of alumina white alumina substrate
  • the plan view shape of the substrate 10 is rectangular, but it may be another shape such as a circle or a polygon.
  • the plurality of solid-state light emitting elements 20 are, for example, LED chips, and are arranged on the substrate 10.
  • the upper surface (the upper surface in the z-axis direction) is the irradiation surface.
  • the plurality of solid-state light emitting elements 20 are electrically connected so that they can be turned on and off at once, for example.
  • the adjacent solid-state light emitting elements 20 are connected by a bonding wire (not shown) for feeding power in a chip-to-chip manner.
  • the number of solid-state light emitting elements 20 is 8 in the illustrated example, but may be 1 or more and 7 or less, or 9 or more.
  • the LED chip emits blue light, for example.
  • the emission peak wavelength of the LED chip is, for example, 430 nm or more and 460 nm or less, and may be 445 nm or more and 460 nm or less.
  • the emission peak wavelength of the LED chip is 430 nm or more, the color rendering property of the white light emitted by the light emitting device 1 is likely to be improved.
  • the emission peak wavelength of the LED chip is 460 nm or less, the luminous efficiency of the light emitting device 1 is likely to be improved.
  • the light emitted by the LED chip is not limited to blue light.
  • the plurality of solid-state light emitting elements 20 may be used in combination with an LED chip that emits ultraviolet rays or green light and an LED chip that emits blue light.
  • the phosphor layer 30 is a sealing resin that covers a plurality of solid-state light emitting elements 20.
  • the phosphor layer 30 is arranged on the substrate 10 so as to cover each of the plurality of solid-state light emitting elements 20.
  • the phosphor layer 30 is in contact with all surfaces of the plurality of solid-state light emitting elements 20 except for the surface on the substrate 10 side. That is, the phosphor layer 30 seals a plurality of solid-state light emitting elements 20 mounted on the substrate 10.
  • the shape of the phosphor layer 30 is columnar in the illustrated example.
  • the shape of the phosphor layer 30 is not particularly limited, and may be a rectangular parallelepiped shape or a dome shape.
  • the phosphor layer 30 is made of a silicone resin in which the fluorescent member 35 is dispersed.
  • the phosphor layer 30 may contain a silicone resin in which the fluorescent member 35 is dispersed as a main component.
  • the silicone resin is a polymer of a bifunctional organosilane compound.
  • Bifunctional organosilane compound is a compound represented by SiR 2 X1 2, in one molecule, bonded to the silicon atom has two functional groups X1, and two substituents R1.
  • the functional group X1 is a functional group such as a hydroxyl group or an alkoxyl group that can be siloxane-bonded to a compound such as a bifunctional organosilane compound.
  • the substituent R1 is, for example, an alkyl group such as a methyl group or an ethyl group or a hydrocarbon group such as a phenyl group.
  • the silicone resin is a polymer containing a compound other than the bifunctional organosilane compound (for example, a trifunctional organosilane compound or a modified organosilane compound having a crosslinkable functional group) for the purpose of curing the silicone resin. There may be.
  • the compound other than the bifunctional organosilane compound is, for example, 10% by weight or less in the polymer.
  • Basic skeleton of the silicone resin is represented by the molecular formula (SiR1 2 O) n.
  • the main chain of the silicone resin is formed of siloxane bonds and is linear.
  • the side chain of the silicone resin is composed of the substituent R1.
  • the main chain in the silicone resin has a spiral structure, and the substituent R1 which is a side chain comes out of the spiral structure. Therefore, the surface of the silicone resin is coated with the substituent R1.
  • the siloxane bond is easily eroded by hydrogen fluoride generated from the KSF phosphor, but the surface of the silicone resin is coated with the substituent R1.
  • the substituent R1 may be a phenyl group. Further, the two substituents R1 bonded to one silicon atom may be the same substituent or may be different substituents.
  • the length of the phosphor layer 30 is, for example, 100 ⁇ m or more and 1000 ⁇ m or less.
  • the thickness of the phosphor layer 30 is 100 ⁇ m or more, the concentration of the fluorescent member 35 is unlikely to increase, and embrittlement of the phosphor layer 30 is suppressed.
  • the thickness of the phosphor layer 30 is 1000 ⁇ m or less, the heat generated in the fluorescent member 35 due to the component of the light absorbed by the fluorescent member 35 that is not wavelength-converted moves to the solid light emitting element 20 side. It will be easier to do. As a result, the temperature rise of the phosphor layer 30 is suppressed, and the conversion efficiency of the fluorescent member 35 is less likely to decrease.
  • the fluorescent member 35 includes at least a KSF phosphor 35a.
  • the KSF phosphor 35a is a red phosphor represented by the general formula (M1) 2 ((M2) 1-x Mn x ) F 6.
  • M1 is at least one alkali metal element of Li, Na, K, Rb and Cs
  • M2 is at least one tetravalent metal element of Ge, Si, Sn, Ti and Zr.
  • x satisfies 0.00 ⁇ x ⁇ 0.5.
  • a typical composition formula of the KSF phosphor 35a is K 2 (Si, Mn) F 6 .
  • the KSF phosphor 35a has a bright red emission peak having an emission wavelength of 625 nm or more and 635 nm or less in the emission spectrum.
  • the light emitting device 1 By using the fluorescent member 35 including the KSF phosphor 35a, which emits less light in the long wavelength region with low luminous efficiency, in the light emitting device 1, the light emitting device 1 emits white light having high luminous efficiency and high color rendering properties. Can be irradiated.
  • the KSF phosphor 35a comes into contact with water, a part of the surface of the phosphor is dissolved in water and a hydrolysis reaction occurs.
  • manganese dioxide is generated from Mn 4+ which is an activated ion, and manganese dioxide absorbs visible light, so that the luminous efficiency of the phosphor is lowered.
  • the hydrolysis reaction produces highly corrosive hydrogen fluoride, which erodes peripheral members. Therefore, the translucent member 40 described later suppresses the invasion of water molecules in the atmosphere into the phosphor layer 30, thereby suppressing the deterioration of the KSF phosphor 35a due to hydrolysis.
  • the fluorescent member 35 may contain a red phosphor other than the KSF phosphor 35a.
  • examples of the red phosphor other than the KSF phosphor 35a include a nitride phosphor and an oxynitride phosphor. When these red phosphors are used in combination with the KSF phosphor 35a, the color rendering property of the white light emitted by the light emitting device 1 can be further enhanced.
  • the fluorescent member 35 further includes a fluorescent substance 35b.
  • the phosphor 35b is, for example, a green phosphor or a yellow-green phosphor.
  • Examples of the green phosphor or yellow-green phosphor include lutetium aluminum garnet (LuAG) phosphor, yttrium aluminum garnet (YAG) phosphor, silicate-based phosphor and acid that emit green or yellow-green light.
  • Nitride phosphors can be mentioned.
  • the particle size of the KSF phosphor 35a and the phosphor 35b (for example, median diameter d50) is, for example, 5 ⁇ m or more and 40 ⁇ m or less.
  • the particle size is 5 ⁇ m or more, the conversion efficiency of the phosphor tends to be high.
  • the particle size is 40 ⁇ m or less, the light emitted from each of the KSF phosphor 35a and the phosphor 35b is likely to be mixed, and the color of the irradiated light is likely to be uniform.
  • the type of phosphor used in the fluorescent member 35, the blending ratio in the silicone resin, and the blending amount in the silicone resin are adjusted so as to have the target correlated color temperature, color deviation Duv, and average color rendering index Ra.
  • 3A, 3B and 3C are diagrams showing an example of the concentration distribution of the fluorescent member 35 in the phosphor layer 30.
  • the vertical axis represents the concentration of the fluorescent member 35 in the phosphor layer 30
  • the horizontal axis represents the z-axis direction from the upper surface (upper surface in the z-axis direction) of the solid-state light emitting device 20.
  • the distance As shown in FIG. 3A, the concentration of the fluorescent member 35 in the phosphor layer 30 is constant regardless of the distance from the upper surface of the solid-state light emitting element 20, for example.
  • the concentration of the fluorescent member 35 in the phosphor layer 30 decreases as the distance from the solid-state light emitting element 20 (specifically, the upper surface of the solid-state light emitting element 20 which is the irradiation surface) increases. You may. As a result, the heat from the fluorescent member 35 can be easily transferred to the solid light emitting element 20 having high thermal conductivity, the temperature rise of the phosphor layer 30 can be suppressed, and the conversion efficiency of the fluorescent member 35 can be improved. Further, in the phosphor layer 30, the concentration of the fluorescent member 35 at a position close to the translucent member 40 tends to be low, and the heat from the fluorescent member 35 is difficult to be transferred to the translucent member 40.
  • the higher the temperature of the translucent member 40 the higher the water vapor permeability of the translucent member 40. Therefore, by suppressing the temperature rise of the translucent member 40, it is possible to suppress the decrease in the water vapor barrier property of the translucent member 40.
  • the concentration of the fluorescent member 35 in the phosphor layer 30 decreases as the distance from the solid-state light emitting device 20 increases, the concentration may decrease continuously as shown in FIG. 3B, as shown in FIG. 3C.
  • the concentration may decrease in stages. In the example shown in FIG. 3B, the concentration decreases linearly, but the decrease in concentration may be curved.
  • the phosphor layer 30 may have a region that does not include the fluorescent member 35 and is in contact with the translucent member 40. This makes it more difficult for the heat from the fluorescent member 35 to be transferred to the translucent member 40.
  • the phosphor layer 30 does not have to have a region that does not include the fluorescent member 35.
  • a liquid thermosetting silicone resin in which the fluorescent member 35 is uniformly dispersed is applied onto the substrate 10 so as to cover the solid light emitting element 20, and the liquid silicone resin is heated by heat. It is formed by curing.
  • a dam material made of another silicone resin may be formed on the substrate 10 outside the outer periphery of the phosphor layer 30 in the top view. The dam material functions as a frame for preventing the liquid silicone resin from flowing out when the phosphor layer 30 is formed.
  • the translucent member 40 is formed so as to surround the dam material and the phosphor layer 30 from the outside of the dam material.
  • the phosphor layer 30, which has the concentration of the fluorescent member 35 as shown in FIG. 3A, is formed, for example, by applying the liquid silicone resin and then immediately curing the liquid silicone resin. Further, the phosphor layer 30, which has the concentration of the fluorescent member 35 as shown in FIG. 3B, is, for example, coated with a liquid silicone resin and then allowed to stand for a while to allow the fluorescent member 35 to settle in a predetermined amount, and then is in a liquid state. It is formed by curing a silicone resin. Since the phosphor of the fluorescent member 35 usually does not have a uniform particle size, the sedimentation rate changes depending on the particle size, and by precipitating the fluorescent member 35 for a certain period of time, a concentration gradient as shown in FIG. 3B is formed. NS. Further, the phosphor layer 30 having the concentration of the fluorescent member 35 as shown in FIG. 3C is formed, for example, by repeating application and curing of liquid silicone resins having different concentrations of the fluorescent member 35.
  • the translucent member 40 is arranged on the substrate 10 so as to surround the phosphor layer 30 without exposing it. Specifically, the translucent member 40 is in contact with the upper surface and the side surface of the phosphor layer 30, and covers all the upper surface and the side surface of the phosphor layer 30. Further, the translucent member 40 is in contact with the substrate 10 at a position surrounding the outer periphery of the phosphor layer 30 in the top view. As a result, the phosphor layer 30 is not exposed in the light emitting device 1.
  • the water vapor transmittance of the translucent member 40 is 50.0 g / m 2 ⁇ day or less.
  • the water vapor transmittance of the translucent member 40 may be 20.0 g / m 2 ⁇ day or less.
  • the value of the water vapor transmittance is a value measured under the conditions of 25 ° C. and a relative humidity difference of 90% in accordance with JIS K 7129.
  • the translucent member 40 has a bonding surface 41 in contact with the substrate 10 extending from the outer periphery of the phosphor layer 30 in the top view in a direction of 2.5 mm or more away from the phosphor layer 30 along the surface of the substrate 10.
  • the bonding surface 41 is located so as to surround the entire outer circumference of the phosphor layer 30 in the top view. Since the translucent member 40 has the joint surface 41, the adhesiveness between the translucent member 40 and the substrate 10 is improved. Therefore, it is difficult for a gap to be formed between the translucent member 40 and the substrate 10 during use of the light emitting device 1, and the translucent member 40 can suppress the invasion of water molecules in the atmosphere into the phosphor layer 30.
  • the phosphor layer 30 has a structure in which the phosphor layer 30 is easily exposed. , It is effective to suppress the invasion of water molecules in the atmosphere by the joint surface 41.
  • the length extending from the outer circumference of the phosphor layer 30 in the top view of the bonding surface 41 may be 2.5 mm or more on a part of the bonding surface 41, and from the viewpoint of enhancing the effect of suppressing the invasion of water molecules, it is considered from the viewpoint of enhancing the effect of suppressing the invasion of water molecules. It may be 2.5 mm or more at any position of the joint surface 41.
  • the total light transmittance of the translucent member 40 in the visible light region is, for example, 80% or more, and may be 90% or more.
  • the translucent member 40 is, for example, a sheet-shaped or layered member.
  • the thickness of the translucent member 40 is, for example, 30 ⁇ m or more and 100 ⁇ m or less from the viewpoint of achieving both the water vapor barrier property and the followability to the phosphor layer 30 and the substrate 10.
  • the thickness of the translucent member 40 is a length in a direction perpendicular to the surface in which the translucent member 40 and the phosphor layer 30 or the substrate 10 are in contact with each other.
  • the translucent member 40 may be composed of one sheet-shaped or layered member, or may be composed of a plurality of sheet-shaped or layered members.
  • the material constituting the translucent member 40 As the material constituting the translucent member 40, a material having a water vapor permeability coefficient lower than that of the silicone resin is used. Further, the material constituting the translucent member 40 is a material in which the change in optical characteristics (discoloration, etc.) and the change in water vapor barrier property due to deformation such as cracking are small even when exposed to a high temperature for a long time. May be used.
  • the light emitting device 1 is operated at a high output, the phosphor layer 30 becomes hot due to heat generated from the fluorescent member 35, so that the translucent member is also exposed to a high temperature. High water vapor barrier properties and high optical properties are easily maintained.
  • the translucent member 40 is made of, for example, organic-inorganic hybrid glass.
  • the organic-inorganic hybrid glass is a polymer of a bifunctional organosilane compound and a trifunctional organosilane compound.
  • Trifunctional organosilane compound is a compound represented by SiR2X2 3, in one molecule, bonded to the silicon atom has three functional groups X2, and one of the substituents R2.
  • the functional group X2 is a functional group such as a hydroxyl group or an alkoxyl group that can be siloxane-bonded to a compound such as a bifunctional organosilane compound or a trifunctional organosilane compound.
  • the substituent R2 is, for example, an alkyl group such as a methyl group or an ethyl group or a hydrocarbon group such as a phenyl group.
  • the bifunctional organosilane compound and the trifunctional organosilane compound are polymerized to form a polymer in which a network-like siloxane bond is formed.
  • Basic skeleton of the organic-inorganic hybrid glass is represented by the molecular formula (SiR1 2 O) m1 (SiR2O 3) m2.
  • the organic-inorganic hybrid glass is a compound other than the bifunctional organosilane compound and the trifunctional organosilane compound (for example, a modified organosilane compound having a crosslinkable functional group) for the purpose of curing the organic-inorganic hybrid glass. It may be a polymer containing.
  • the compound other than the bifunctional organosilane compound and the trifunctional organosilane compound is, for example, 10% by weight or less in the polymer.
  • a polymer of a liquid bifunctional organosilane compound and a trifunctional organosilane compound is applied onto the substrate 10 so as to surround the phosphor layer 30, and is subjected to heat, ultraviolet rays, or the like. It is formed by curing.
  • the organic-inorganic hybrid glass may have a multilayer structure of a polymer of a bifunctional organosilane compound and a trifunctional organosilane compound and an inorganic oxide thin film.
  • the organic-inorganic hybrid glass may be a material in which an inorganic oxide such as nanoparticles, which is difficult to absorb visible light, is dispersed in a polymer of a bifunctional organosilane compound and a trifunctional organosilane compound.
  • the inorganic oxide include silicon oxide, aluminum oxide, indium oxide and zinc oxide.
  • organic-inorganic hybrid glass has a higher inorganic content than silicone resin because it has a higher proportion of siloxane bonds. Since the inorganic material has low gas permeability, the water vapor barrier property of the material is increased by increasing the inorganic content. That is, the water vapor permeability coefficient of the material is low.
  • the inorganic component is a weight ratio derived from an inorganic component such as a siloxane bond portion in the material. The inorganic content is calculated, for example, from the weight of the residue obtained by heating the material to a temperature at which the organic component is decomposed by thermogravimetric analysis and reducing the weight.
  • the organic-inorganic hybrid glass has a high water vapor barrier property because the siloxane bond is formed in a network shape and the inorganic content is higher than that of the silicone resin. Further, since the main chain of the organic-inorganic hybrid glass is formed of a siloxane bond having a higher binding energy than a carbon-carbon bond, the organic-inorganic hybrid glass is excellent in heat resistance and weather resistance. Therefore, deterioration such as discoloration of the translucent member 40 is suppressed even after long-term use.
  • the inorganic content of the organic-inorganic hybrid glass is, for example, 60% by weight or more and 95% by weight or less.
  • the water vapor barrier property of the organic-inorganic hybrid glass is likely to be high, and the invasion of water molecules into the phosphor layer 30 is likely to be suppressed.
  • the hardness of the organic-inorganic hybrid glass does not become too high because the inorganic content is 95% by weight or less, the translucent member even when the phosphor layer 30 expands due to heat generation during light irradiation. Cracks and the like are unlikely to occur in 40. As a result, the high water vapor barrier property of the translucent member 40 is easily maintained.
  • the inorganic content of the organic-inorganic hybrid glass can be adjusted, for example, by changing the composition ratio of the functional organosilane compound and the trifunctional organosilane compound in the polymer.
  • the inorganic content of the organic-inorganic hybrid glass can also be increased by containing the inorganic oxide particles or having a multilayer structure of the inorganic oxide thin film and the organic-inorganic hybrid glass thin film. ..
  • the difference between the refractive index of the silicone resin constituting the phosphor layer 30 and the refractive index of the organic-inorganic hybrid glass is, for example, 0.2 or less, and may be 0.1 or less.
  • the difference between the refractive index of the silicone resin and the refractive index of the organic-inorganic hybrid glass is 0.2 or less, the reflection at the interface between the phosphor layer 30 and the translucent member 40 can be suppressed, so that light can be extracted. Efficiency is improved.
  • the refractive index of the organic-inorganic hybrid glass is higher than the refractive index of the silicone resin constituting the phosphor layer 30. It may be small.
  • the refractive index of the silicone resin and the organic-inorganic hybrid glass can be adjusted by, for example, the types of substituents R1 and R2.
  • the refractive index of the silicone resin and the organic-inorganic hybrid glass tends to be high.
  • the refractive index of the silicone resin and the organic-inorganic hybrid glass can also be adjusted by adding nanoparticles or the like to the silicone resin and the organic-inorganic hybrid glass.
  • the thickness of the translucent member 40 may be adjusted according to the inorganic content of the organic-inorganic hybrid glass. For example, the higher the inorganic content of the organic-inorganic hybrid glass, the higher the water vapor barrier property, but the more easily it breaks, so that the thickness of the translucent member 40 is reduced.
  • the light emitting device 1 is a light emitting device that irradiates white light.
  • the light emitting device 1 exposes the substrate 10, the solid light emitting element 20 arranged on the substrate 10, the phosphor layer 30 arranged on the substrate 10 so as to cover the solid light emitting element 20, and the phosphor layer 30. It is provided with a translucent member 40 arranged on the substrate 10 so as to surround the substrate 10 without causing it.
  • the phosphor layer 30 is made of a silicone resin in which a fluorescent member 35 including a KSF phosphor 35a, which is excited by light from the solid-state light emitting element 20 and emits light, is dispersed.
  • the translucent member 40 comes into contact with the substrate 10 at a position surrounding the outer periphery of the phosphor layer 30 in the top view.
  • the water vapor transmittance of the translucent member 40 is 50.0 g / m 2 ⁇ day or less.
  • the light emitting device 1 contains the KSF phosphor 35a which exhibits bright line-shaped light emitting characteristics and can enhance the light emitting efficiency and the color rendering property, both the high light emitting efficiency and the high color rendering property can be achieved at the same time.
  • the translucent member 40 is arranged on the substrate 10 so as to surround the phosphor layer 30 without exposing it, and is in contact with the substrate 10 at a position surrounding the outer periphery of the phosphor layer 30 in the top view. Therefore, the phosphor layer 30 is separated from the atmosphere by the translucent member 40 and does not come into direct contact with the atmosphere.
  • the translucent member 40 since the water vapor transmittance of the translucent member 40 is low, the water vapor barrier property of the translucent member 40 is high, and the invasion of water molecules in the atmosphere into the phosphor layer 30 through the translucent member 40 is suppressed. Will be done.
  • the fluorescent member 35 containing the KSF phosphor 35a is dispersed in a silicone resin having a low water vapor barrier property, but the translucent member 40 allows the KSF phosphor 35a having a low moisture resistance to be dispersed. Contact with water molecules is suppressed.
  • the decrease in luminous efficiency due to the deterioration of the KSF phosphor 35a having low moisture resistance due to hydrolysis due to contact with water molecules is suppressed. Therefore, the light emitting device 1 can irradiate light having high color rendering properties with high luminous efficiency for a long period of time.
  • the KSF phosphor 35a is dispersed in a silicone resin that is not easily eroded by hydrogen fluoride, rather than an organic-inorganic hybrid glass or the like that has a high water vapor barrier property but is easily eroded by hydrogen fluoride. Therefore, even when a part of the KSF phosphor 35a is hydrolyzed to generate hydrogen fluoride, cracks or the like do not occur in the phosphor layer 30, and hydrogen fluoride is contained in the phosphor layer 30. Cheap. Therefore, hydrogen fluoride does not easily erode the translucent member 40 and the like, and the high water vapor barrier property of the translucent member 40 is maintained for a long period of time.
  • FIG. 4 is a cross-sectional view showing a schematic configuration of the light emitting device 2 according to the modified example of the first embodiment.
  • the light emitting device 2 according to the modified example of the first embodiment includes a translucent member 42 instead of the translucent member 40 of the light emitting device 1 according to the first embodiment.
  • the translucent member 42 has a resin film 42a and an adhesive layer 42b. Similar to the translucent member 40 according to the first embodiment, the translucent member 42 is arranged on the substrate 10 so as to surround the phosphor layer 30 without exposing it. Further, the translucent member 42 has a bonding surface 43 in contact with the substrate 10 extending from the outer periphery of the phosphor layer 30 in the top view in a direction away from the phosphor layer 30 along the surface of the substrate 10.
  • the thickness of the translucent member 42 is, for example, 30 ⁇ m or more and 100 ⁇ m or less from the viewpoint of achieving both the water vapor barrier property and the followability to the phosphor layer 30 and the substrate 10.
  • the resin film 42a is bonded to the substrate 10 and the phosphor layer 30 via the adhesive layer 42b. That is, the resin film 42a and the adhesive layer 42b are in contact with each other, and the adhesive layer 42b exists between the resin film 42a and the substrate 10 and between the resin film 42a and the phosphor layer 30.
  • the thickness of the resin film 42a is, for example, 20 ⁇ m or more and 80 ⁇ m or less.
  • the thickness of the resin film 42a is 20 ⁇ m or more, the water vapor barrier property is increased and the mechanical strength is increased, so that even if the phosphor layer 30 expands due to the heat generated by the fluorescent member 35, it is less likely to be damaged.
  • the thickness of the resin film 42a is 80 ⁇ m or less, the conformability of the resin film 42a to the phosphor layer 30 and the substrate 10 is improved. Therefore, it is difficult to form a gap between the translucent member 42 and the phosphor layer 30, and it is possible to suppress a decrease in the luminous efficiency of the light emitting device 2 due to a decrease in optical characteristics. Further, it is difficult for voids to be formed between the translucent member 42 and the substrate 10, and it is possible to suppress the invasion of water molecules in the atmosphere into the phosphor layer 30.
  • the total light transmittance of the resin film 42a in the visible light region is, for example, 80% or more, and may be 90% or more.
  • the resin film 42a is made of a material having a water vapor permeability coefficient lower than that of silicone resin. Specifically, the resin film 42a is composed of an alicyclic olefin-based resin or a fluorine-based transparent resin.
  • the alicyclic olefin resin and the fluorine-based transparent resin have properties such as flexibility, high transparency, high heat resistance, high water vapor barrier property and low water absorption. Since the resin film 42a is made of an alicyclic olefin resin or a fluorine-based transparent resin having such characteristics, water molecules in the atmosphere can form a phosphor layer without impairing the optical characteristics of the light emitting device 2. It is possible to suppress the invasion of 30. As a result, it is possible to suppress aged deterioration such as a decrease in luminous efficiency during long-term use of the light emitting device 2. Further, the resin film 42a composed of an alicyclic olefin resin or a fluorine-based transparent resin has flexibility. Therefore, the resin film 42a has good followability to the phosphor layer 30 and the substrate 10, and is not easily damaged even when the phosphor layer 30 expands due to heat generated by the fluorescent member 35.
  • the alicyclic olefin resin is a resin having a monomer unit composed of a cyclic olefin (cycloolefin).
  • the alicyclic olefin resin include a cycloolefin polymer (COP) and a cycloolefin copolymer (COC).
  • the cycloolefin copolymer is a non-crystalline cyclic olefin resin which is a copolymer of a cyclic olefin and an olefin such as ethylene.
  • the cyclic olefin include a polycyclic cyclic olefin and a monocyclic cyclic olefin.
  • polycyclic cyclic olefin examples include norbornene, methylnorbornene, dimethylnorbornene, ethylnorbornene, etilidennorbornene, butylnorbornene, dicyclopentadiene, dihydrodicyclopentadiene, methyldicyclopentadiene, dimethyldicyclopentadiene, and tetracyclododecene.
  • examples thereof include methyltetracyclododecene, dimethylcyclotetradodecene, tricyclopentadiene and tetracyclopentadiene.
  • Examples of the monocyclic cyclic olefin include cyclobutene, cyclopentene, cyclooctene, cyclooctadiene, cyclooctadiene, cyclododecatriene and the like.
  • the monomer unit of the alicyclic olefin resin one kind of these cyclic olefins may be used, or two or more kinds may be used.
  • the alicyclic olefin resin may contain general resins, resin additives, and the like.
  • the fluorine-based transparent resin is a transparent resin having a monomer unit composed of an olefin having a fluoro group as a substituent.
  • the olefin having a fluoro group include vinylidene fluoride, tetrafluoroethylene, chlorotrifluoroethylene, hexafluoropropylene and the like.
  • the fluororesin may be a polymer consisting only of an olefin having a fluoro group, or may be a copolymer of an olefin having a fluoro group and an olefin having no fluoro group.
  • the fluororesin is a fluororesin such as polyvinylidene fluoride resin, polychlorotrifluoroethylene resin, and ethylene tetrafluoroethylene copolymer resin from the viewpoint that it can be melt-molded and easily formed into the desired shape. May be contained as a main component.
  • the fluorine-based transparent resin may contain 50% by mass or more of the fluorine-based resin, or may contain 60% by mass or more. As long as the characteristics of the resin film 42a are the desired characteristics, the fluorine-based transparent resin may contain general resins, resin additives, and the like.
  • the adhesive layer 42b is located between the resin film 42a and the substrate 10.
  • the adhesive layer 42b is also located between the resin film 42a and the phosphor layer 30.
  • the adhesive layer 42b is in contact with the resin film 42a, the substrate 10 and the phosphor layer 30, and the resin film 42a, the phosphor layer 30 and the substrate 10 are bonded to each other.
  • the adhesive layer 42b joins the resin film 42a and the substrate 10
  • the translucent member 42 and the substrate 10 are brought into close contact with each other, and the translucent member 42 is less likely to be peeled off from the substrate 10. Therefore, it is difficult for a gap to be formed between the translucent member 42 and the substrate 10 during use of the light emitting device 2, and it is possible to suppress the invasion of water molecules in the atmosphere into the phosphor layer 30.
  • the adhesive layer 42b joins the resin film 42a and the phosphor layer 30 to improve the adhesiveness between the translucent member 42 and the phosphor layer 30. Therefore, it is difficult to form a gap between the translucent member 42 and the phosphor layer 30, and it is possible to suppress a decrease in the luminous efficiency of the light emitting device 2 due to a decrease in optical characteristics.
  • the surface of the adhesive layer 42b in contact with the substrate 10 is the joint surface 43.
  • the adhesiveness between the translucent member 42 and the substrate 10 is improved.
  • the thickness of the adhesive layer 42b is, for example, 10 ⁇ m or more and 50 ⁇ m or less.
  • the thickness of the adhesive layer 42b is 10 ⁇ m or more, the adhesiveness between the translucent member 42 and the substrate 10 and the adhesiveness between the translucent member 42 and the phosphor layer 30 are likely to be improved.
  • the thickness of the adhesive layer 42b is 50 ⁇ m or less, water molecules in the atmosphere are less likely to enter the phosphor layer 30 from the end of the adhesive layer 42b via the adhesive layer 42b. From the viewpoint of suppressing the invasion of water molecules into the phosphor layer 30 in the atmosphere, the thickness of the adhesive layer 42b may be 30 ⁇ m or less.
  • the total light transmittance of the adhesive layer 42b in the visible light region is, for example, 80% or more, and may be 90% or more.
  • an adhesive such as an acrylic resin adhesive or a silicone resin adhesive is used.
  • the translucent member 42 is formed by laminating the resin film 42a to the surfaces of the substrate 10 and the phosphor layer 30 via the adhesive used for the adhesive layer 42b. For example, an adhesive is applied to the surfaces of the substrate 10 and the phosphor layer 30, a resin film 42a is applied from above, and pressure is applied to improve the adhesiveness and to remove air between the resin film 42a and the adhesive. In forming the translucent member 42, the adhesive may be cured if necessary.
  • the entire surface of the resin film 42a is bonded to the substrate 10 and the phosphor layer 30 by the adhesive layer 42b, but a part of the resin film 42a is bonded to the substrate 10 and the phosphor by the adhesive layer 42b. It may be bonded to the layer 30.
  • the translucent member 42 is composed of a resin film 42a made of an alicyclic olefin resin or a fluorine-based transparent resin and an adhesive layer 42b.
  • the translucent member 42 can suppress the invasion of water molecules into the phosphor layer 30, and the deterioration of the KSF phosphor 35a is suppressed.
  • the resin film 42a has flexibility, it has good followability to the phosphor layer 30 and the substrate 10, and is not easily damaged even when the phosphor layer 30 expands due to heat generation of the fluorescent member 35. Therefore, the light emitting device 2 can irradiate light having high color rendering properties with high luminous efficiency for a long period of time.
  • FIG. 5 is a top view showing a schematic configuration of the light emitting device 3 according to the present embodiment.
  • FIG. 6 is a cross-sectional view of the light emitting device 3 according to the present embodiment at the position shown by the VI-VI line of FIG.
  • the light emitting device 1 according to the first embodiment was a COB type light emitting device, but the light emitting device 3 according to the second embodiment is an SMD (Surface Mount Device) type light emitting device.
  • SMD Surface Mount Device
  • the light emitting device 3 includes a container 11, a solid light emitting element 20, a phosphor layer 30, and a translucent member 44.
  • the light emitting device 3 has a rectangular parallelepiped shape, but is not limited to this, and may have other shapes such as a columnar shape or a hemispherical shape.
  • the container 11 is an example of a base material, and has a recess for accommodating the solid-state light emitting element 20 and the phosphor layer 30. Further, although not shown, the container 11 has a metal wiring, a bonding wire, and the like for supplying electric power to the solid-state light emitting element 20.
  • the material of the container 11 is, for example, metal, ceramic, resin, or the like.
  • a solid light emitting element 20 is arranged on the recess of the container 11. Further, a phosphor layer 30 is arranged on the recess of the container 11 so as to cover the solid-state light emitting element 20. That is, the solid-state light emitting element 20 is mounted in the center of the recess of the container 11 and is sealed by the phosphor layer 30. In the illustrated example, the upper surface of the phosphor layer 30 and the uppermost surface of the container 11 are flush with each other, but even if a step is formed between the upper surface of the phosphor layer 30 and the uppermost surface of the container 11. good.
  • the translucent member 44 is arranged on the container 11 so as to surround the phosphor layer 30 without exposing it. Specifically, the translucent member 44 is in contact with the upper surface of the phosphor layer 30, and covers the entire upper surface of the phosphor layer 30. Further, the translucent member 44 is in contact with the container 11 at a position surrounding the outer periphery of the phosphor layer 30 in the top view.
  • the translucent member 44 has a joint surface 45 in contact with the container 11 extending from the outer periphery of the phosphor layer 30 in the top view in a direction away from the phosphor layer 30 along the surface of the container 11.
  • the bonding surface 45 is located so as to surround the entire outer circumference of the phosphor layer 30 in the top view.
  • the detailed configuration of the translucent member 44 may be the same as that of the translucent member 40 or the translucent member 42 described above, detailed description thereof will be omitted.
  • the light emitting device 3 according to the present embodiment since the phosphor layer 30 is surrounded by the translucent member 44 so as not to be exposed as in the first embodiment, water to the phosphor layer 30 is formed. Invasion of molecules is suppressed. As described above, the light emitting device 3 according to the present embodiment also has the same effect as the light emitting device 1 according to the first embodiment.
  • FIG. 7 is a cross-sectional view showing a schematic configuration of the lighting device 100 according to the present embodiment.
  • FIG. 8 is an external perspective view showing a schematic configuration of the lighting device 100 and its peripheral members according to the present embodiment.
  • the lighting device 100 is a downlight or the like that emits light downward (floor surface, wall, etc.) by being embedded in the ceiling of a house or the like. It is an embedded lighting device.
  • the lighting device 100 includes a light emitting device 1 according to the first embodiment.
  • the lighting device 100 further includes a substantially bottomed tubular fixture body formed by combining a base 110 and a frame body 120, and a reflector 130 and a translucent panel 140 arranged on the fixture body. To be equipped.
  • the base 110 is a mounting base on which the light emitting device 1 is mounted.
  • the base 110 also functions as a heat sink (heat sink) that dissipates the heat generated by the light emitting device 1.
  • the base 110 is formed in a substantially bottomed cylindrical shape using a metal material, and is made of, for example, aluminum die-cast.
  • a plurality of heat radiating fins 111 projecting upward are provided on the upper portion (ceiling side portion) of the base 110 at regular intervals along one direction. As a result, the heat generated by the light emitting device 1 can be efficiently dissipated.
  • the frame body portion 120 includes a substantially cylindrical (funnel-shaped) auxiliary reflecting member 121 having a reflecting surface on the inner surface, and a frame body main body portion 122 to which the auxiliary reflecting member 121 is attached.
  • the auxiliary reflection member 121 is formed by using a metal material, and is formed, for example, by drawing or press-molding an aluminum alloy or the like.
  • the frame body portion 120 is fixed by attaching the frame body portion 122 to the base portion 110 with mounting screws (not shown) or the like.
  • the reflector 130 is a substantially cylindrical (funnel-shaped) reflective member having an internal reflection function.
  • the reflector 130 is formed by using a metal material such as aluminum.
  • the reflector 130 may be formed using a hard white resin material.
  • the translucent panel 140 is a member having light diffusivity and translucency.
  • the translucent panel 140 is a flat plate arranged between the reflector 130 and the frame body 120, and is attached to the reflector 130.
  • the translucent panel 140 is formed in a disk shape using, for example, a transparent resin material such as an acrylic resin (PMMA resin) and a polycarbonate resin (PC resin).
  • the lighting device 100 does not have to include the translucent panel 140.
  • the translucent panel 140 is not provided, the luminous flux of the light emitted from the lighting device 100 can be improved.
  • the lighting device 100 includes a lighting device 150 that supplies power for lighting the light emitting device 1 to the light emitting device 1, and a lighting device 150 that supplies AC power from an external power source such as a commercial power source. It is provided with a terminal block 160 that relays to. Specifically, the lighting device 150 converts the AC power relayed from the terminal block 160 into DC power, and supplies the converted DC power to the light emitting device 1.
  • the lighting device 150 and the terminal block 160 are fixed to a mounting plate 170 provided separately from the fixture body.
  • the mounting plate 170 is formed by bending a rectangular plate-shaped member made of a metal material.
  • the lighting device 150 is fixed to the lower surface of one end of the mounting plate 170 in the longitudinal direction, and the terminal block 160 is fixed to the lower surface of the other end.
  • the mounting plate 170 is connected to each other with the top plate 180 fixed to the upper part of the base 110 of the instrument body.
  • the lighting device 100 includes, for example, a light emitting device 1 and a lighting device 150 that supplies electric power for lighting the light emitting device 1 to the light emitting device 1.
  • the lighting device 100 includes the light emitting device 1 according to the first embodiment, it is possible to irradiate light having high color rendering properties with high luminous efficiency for a long period of time.
  • the lighting device 100 may include a light emitting device 2 according to a modification of the first embodiment instead of the light emitting device 1. Further, the lighting device 100 may include a light emitting module in which the light emitting device 3 according to the second embodiment is mounted on a substrate instead of the light emitting device 1.
  • an example of the downlight is shown as the lighting device 100, but the configuration of the downlight is not limited to the illustrated example. Further, the present invention is not limited to downlights, and may be realized as other lighting devices such as spotlights or ceiling lights.
  • the LED chip is shown as an example of the solid-state light emitting element 20, but the present invention is not limited to this.
  • the solid-state light-emitting element 20 may be a semiconductor light-emitting device such as a semiconductor laser, or another solid-state light-emitting element such as an organic EL (Electroluminescence) or an inorganic EL.
  • the fluorescent member 35 includes, but is not limited to, the KSF phosphor 35a and the phosphor 35b.
  • the fluorescent member 35 may contain a phosphor other than the KSF phosphor 35a and the phosphor 35b. Further, the fluorescent member 35 may contain only the KSF phosphor 35a.
  • the light emitting device may irradiate white light by using a combination of an LED chip that emits blue light and an LED chip that emits green light to a plurality of solid-state light emitting elements 20.
  • the translucent member 40 is joined by extending 2.5 mm or more from the outer periphery of the phosphor layer 30 in the top view in a direction away from the phosphor layer 30 along the surface of the substrate 10. It had a surface 41, but is not limited to this.
  • the translucent member 40 does not have a joint surface 41 and has a C-shaped cross section, and the end surface of the sheet-shaped translucent member 40 may be in contact with the substrate 10.
  • the translucent member 42 is composed of the resin film 42a and the adhesive layer 42b, but the present invention is not limited to this.
  • the translucent member 42 may be made of a resin film 42a.
  • the translucent member 42 is formed by bonding the resin film 42a to the surfaces of the phosphor layer 30 and the substrate 10. Examples of the bonding method include laminating a resin film 42a on the substrate 10 on which the phosphor layer 30 is formed.

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  • Physics & Mathematics (AREA)
  • Spectroscopy & Molecular Physics (AREA)
  • Engineering & Computer Science (AREA)
  • General Engineering & Computer Science (AREA)
  • Led Device Packages (AREA)
  • Non-Portable Lighting Devices Or Systems Thereof (AREA)

Abstract

L'invention concerne un dispositif électroluminescent (1) qui émet une lumière blanche et comprend : un substrat (10) ; un élément électroluminescent solide (20) qui est disposé sur le substrat (10) ; une couche de phosphore (30) qui est composée d'une résine de silicone dans laquelle des éléments fluorescents (35) contenant des phosphores KSF (35a) qui émettent de la lumière en étant excités par la lumière provenant de l'élément électroluminescent solide (20) sont dispersés, et qui est disposée sur le substrat (10) de manière à recouvrir l'élément électroluminescent solide (20) ; et un élément de transmission de lumière (40) qui est disposé sur le substrat (10) de manière à entourer la couche de phosphore (30) sans exposer celle-ci, et entre en contact avec le substrat (10) dans des positions entourant la périphérie externe de la couche de phosphore (30) dans une vue de dessus. L'élément de transmission de lumière (40) présente un taux de transmission de la vapeur d'eau de 50,0 g/m2 x jour ou moins.
PCT/JP2020/047996 2020-01-29 2020-12-22 Dispositif électroluminescent et dispositif d'éclairage Ceased WO2021153106A1 (fr)

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JP2010040986A (ja) * 2008-08-08 2010-02-18 Nec Lighting Ltd Ｌｅｄ装置
WO2013001687A1 (fr) * 2011-06-30 2013-01-03 パナソニック株式会社 Dispositif émetteur de lumière
JP2016184751A (ja) * 2016-05-26 2016-10-20 石塚硝子株式会社 Ｌｅｄ素子用封止材料
WO2018143437A1 (fr) * 2017-02-02 2018-08-09 シチズン電子株式会社 Boîtier de del et son procédé de fabrication

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JP2008159705A (ja) * 2006-12-21 2008-07-10 Matsushita Electric Works Ltd 発光装置
US10103353B2 (en) * 2014-03-27 2018-10-16 Lg Chem, Ltd. Encapsulation film and organic electronic device comprising the same
US9660151B2 (en) * 2014-05-21 2017-05-23 Nichia Corporation Method for manufacturing light emitting device
CN107134521A (zh) * 2016-02-26 2017-09-05 光宝光电(常州)有限公司 光电半导体装置
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JP2009071005A (ja) * 2007-09-13 2009-04-02 Sony Corp 波長変換部材及びその製造方法、並びに、波長変換部材を用いた発光デバイス
JP2010040986A (ja) * 2008-08-08 2010-02-18 Nec Lighting Ltd Ｌｅｄ装置
WO2013001687A1 (fr) * 2011-06-30 2013-01-03 パナソニック株式会社 Dispositif émetteur de lumière
JP2016184751A (ja) * 2016-05-26 2016-10-20 石塚硝子株式会社 Ｌｅｄ素子用封止材料
WO2018143437A1 (fr) * 2017-02-02 2018-08-09 シチズン電子株式会社 Boîtier de del et son procédé de fabrication

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