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WO2021142766A1 - Systèmes pour appliquer des matériaux sur des composants - Google Patents

Systèmes pour appliquer des matériaux sur des composants Download PDF

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Publication number
WO2021142766A1
WO2021142766A1 PCT/CN2020/072710 CN2020072710W WO2021142766A1 WO 2021142766 A1 WO2021142766 A1 WO 2021142766A1 CN 2020072710 W CN2020072710 W CN 2020072710W WO 2021142766 A1 WO2021142766 A1 WO 2021142766A1
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WO
WIPO (PCT)
Prior art keywords
liner
tool
supply
component
along
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Ceased
Application number
PCT/CN2020/072710
Other languages
English (en)
Inventor
Jie Zhou
Yuan Ren
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Tianjin Laird Technologies Co Ltd
Original Assignee
Tianjin Laird Technologies Co Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Tianjin Laird Technologies Co Ltd filed Critical Tianjin Laird Technologies Co Ltd
Priority to PCT/CN2020/072710 priority Critical patent/WO2021142766A1/fr
Priority to CN202020367356.XU priority patent/CN211937670U/zh
Priority to CN202010201132.6A priority patent/CN113134459B/zh
Priority to TW110101698A priority patent/TWI777370B/zh
Publication of WO2021142766A1 publication Critical patent/WO2021142766A1/fr
Anticipated expiration legal-status Critical
Ceased legal-status Critical Current

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    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B05—SPRAYING OR ATOMISING IN GENERAL; APPLYING FLUENT MATERIALS TO SURFACES, IN GENERAL
    • B05C—APPARATUS FOR APPLYING FLUENT MATERIALS TO SURFACES, IN GENERAL
    • B05C9/00—Apparatus or plant for applying liquid or other fluent material to surfaces by means not covered by any preceding group, or in which the means of applying the liquid or other fluent material is not important
    • B05C9/02—Apparatus or plant for applying liquid or other fluent material to surfaces by means not covered by any preceding group, or in which the means of applying the liquid or other fluent material is not important for applying liquid or other fluent material to surfaces by single means not covered by groups B05C1/00 - B05C7/00, whether or not also using other means
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L24/00—Arrangements for connecting or disconnecting semiconductor or solid-state bodies; Methods or apparatus related thereto
    • H01L24/74—Apparatus for manufacturing arrangements for connecting or disconnecting semiconductor or solid-state bodies
    • H01L24/741—Apparatus for manufacturing means for bonding, e.g. connectors
    • H01L24/743—Apparatus for manufacturing layer connectors
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B05—SPRAYING OR ATOMISING IN GENERAL; APPLYING FLUENT MATERIALS TO SURFACES, IN GENERAL
    • B05C—APPARATUS FOR APPLYING FLUENT MATERIALS TO SURFACES, IN GENERAL
    • B05C11/00—Component parts, details or accessories not specifically provided for in groups B05C1/00 - B05C9/00
    • B05C11/02—Apparatus for spreading or distributing liquids or other fluent materials already applied to a surface ; Controlling means therefor; Control of the thickness of a coating by spreading or distributing liquids or other fluent materials already applied to the coated surface
    • B05C11/023—Apparatus for spreading or distributing liquids or other fluent materials already applied to a surface
    • B05C11/025—Apparatus for spreading or distributing liquids or other fluent materials already applied to a surface with an essentially cylindrical body, e.g. roll or rod
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B05—SPRAYING OR ATOMISING IN GENERAL; APPLYING FLUENT MATERIALS TO SURFACES, IN GENERAL
    • B05C—APPARATUS FOR APPLYING FLUENT MATERIALS TO SURFACES, IN GENERAL
    • B05C9/00—Apparatus or plant for applying liquid or other fluent material to surfaces by means not covered by any preceding group, or in which the means of applying the liquid or other fluent material is not important
    • B05C9/08—Apparatus or plant for applying liquid or other fluent material to surfaces by means not covered by any preceding group, or in which the means of applying the liquid or other fluent material is not important for applying liquid or other fluent material and performing an auxiliary operation
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B05—SPRAYING OR ATOMISING IN GENERAL; APPLYING FLUENT MATERIALS TO SURFACES, IN GENERAL
    • B05C—APPARATUS FOR APPLYING FLUENT MATERIALS TO SURFACES, IN GENERAL
    • B05C11/00—Component parts, details or accessories not specifically provided for in groups B05C1/00 - B05C9/00
    • B05C11/02—Apparatus for spreading or distributing liquids or other fluent materials already applied to a surface ; Controlling means therefor; Control of the thickness of a coating by spreading or distributing liquids or other fluent materials already applied to the coated surface
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
    • H01L2224/10—Bump connectors; Manufacturing methods related thereto
    • H01L2224/15—Structure, shape, material or disposition of the bump connectors after the connecting process
    • H01L2224/16—Structure, shape, material or disposition of the bump connectors after the connecting process of an individual bump connector
    • H01L2224/161—Disposition
    • H01L2224/16151—Disposition the bump connector connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive
    • H01L2224/16221—Disposition the bump connector connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked
    • H01L2224/16225—Disposition the bump connector connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked the item being non-metallic, e.g. insulating substrate with or without metallisation
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/73—Means for bonding being of different types provided for in two or more of groups H01L2224/10, H01L2224/18, H01L2224/26, H01L2224/34, H01L2224/42, H01L2224/50, H01L2224/63, H01L2224/71
    • H01L2224/732—Location after the connecting process
    • H01L2224/73251—Location after the connecting process on different surfaces
    • H01L2224/73253—Bump and layer connectors
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L23/00—Details of semiconductor or other solid state devices
    • H01L23/34—Arrangements for cooling, heating, ventilating or temperature compensation ; Temperature sensing arrangements
    • H01L23/42—Fillings or auxiliary members in containers or encapsulations selected or arranged to facilitate heating or cooling
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L24/00—Arrangements for connecting or disconnecting semiconductor or solid-state bodies; Methods or apparatus related thereto
    • H01L24/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
    • H01L24/10—Bump connectors ; Manufacturing methods related thereto
    • H01L24/15—Structure, shape, material or disposition of the bump connectors after the connecting process
    • H01L24/16—Structure, shape, material or disposition of the bump connectors after the connecting process of an individual bump connector
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L24/00—Arrangements for connecting or disconnecting semiconductor or solid-state bodies; Methods or apparatus related thereto
    • H01L24/73—Means for bonding being of different types provided for in two or more of groups H01L24/10, H01L24/18, H01L24/26, H01L24/34, H01L24/42, H01L24/50, H01L24/63, H01L24/71
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/15—Details of package parts other than the semiconductor or other solid state devices to be connected
    • H01L2924/161—Cap
    • H01L2924/1615—Shape
    • H01L2924/16152—Cap comprising a cavity for hosting the device, e.g. U-shaped cap

Definitions

  • the present disclosure relates to systems for applying materials to components.
  • Electrical components such as semiconductors, integrated circuit packages, transistors, etc.
  • pre-designed temperatures approximate the temperature of the surrounding air. But the operation of electrical components generates heat. If the heat is not removed, the electrical components may then operate at temperatures significantly higher than their normal or desirable operating temperature. Such excessive temperatures may adversely affect the operating characteristics of the electrical components and the operation of the associated device.
  • the heat should be removed, for example, by conducting the heat from the operating electrical component to a heat sink.
  • the heat sink may then be cooled by conventional convection and/or radiation techniques.
  • the heat may pass from the operating electrical component to the heat sink either by direct surface contact between the electrical component and heat sink and/or by contact of the electrical component and heat sink surfaces through an intermediate medium or thermal interface material.
  • the thermal interface material may be used to fill the gap between thermal transfer surfaces, in order to increase thermal transfer efficiency as compared to having the gap filled with air, which is a relatively poor thermal conductor.
  • Heat spreaders are commonly used to spread the heat from one or more heat generating components such that the heat is not concentrated in a small area when transferred to a heat sink.
  • An integrated heat spreader (IHS) is a type of heat spreader that may be used to spread the heat generated by operation of a central processing unit (CPU) or processor die.
  • An integrated heat spreader or lid e.g., a lid of an integrated circuit (IC) package, etc.
  • An integrated heat spreader or lid is typically a thermally-conductive metal (e.g., copper, etc. ) plate that rests on top of the CPU or processor die.
  • Heat spreaders are also commonly used (e.g., as a lid, etc. ) to protect chips or board-mounted electronic components often in conjunction with a sealed package. Accordingly, a heat spreader may also be referred to herein as a lid and vice versa.
  • a first thermal interface material or layer (s) may be used between an integrated heat spreader or lid and a heat source to reduce hot spots and generally reduce the temperature of the heat generating components or device.
  • a second thermal interface material or layer (s) (referred to as TIM2) may be used between the lid or integrated heat spreader and the heat sink to increase thermal transfer efficiency from the heat spreader to the heat sink.
  • FIG. 1 illustrates an exemplary electronic device 11 having a TIM1 or first thermal interface material 15.
  • the TIM1 or thermal interface material 15 is positioned between a heat spreader or lid 19 and a heat source 21, which may comprise one or more heat generating components or devices (e.g., a CPU, die within underfill, semiconductor device, flip chip device, graphics processing unit (GPU) , digital signal processor (DSP) , multiprocessor system, integrated circuit, multi-core processor, etc. ) , batteries, solar panels, etc.
  • a TIM2 or second thermal interface material 25 is positioned between a heat sink 29 and the heat spreader or lid 19.
  • the heat source 21 may comprise a central processing unit (CPU) or processor die mounted on a printed circuit board (PCB) 33.
  • the PCB 33 may be made of FR4 (flame retardant fiberglass reinforced epoxy laminates) or other suitable material.
  • the heat spreader or lid 19 is an integrated heat spreader (IHS) , which may comprise metal or other thermally-conductive structure.
  • the heat spreader or lid 19 includes a perimeter ridge, flange, or sidewall portions 37. Adhesive 41 is applied to and along the perimeter ridge 37 for attaching the heat spreader or lid 19 to the PCB 33.
  • the perimeter ridge 37 may thus protrude sufficiently downward to extend around the silicon die on the PCB 33 and thereby allow contact between the adhesive 41 on the perimeter ridge 37 and the PCB 33.
  • adhesively attaching the heat spreader or lid 19 to the PCB 33 may also help stiffen the package, which is attached to the base PCB.
  • pin connectors 45 Also shown in FIG. 1 are pin connectors 45.
  • the heat sink 29 may generally include a base from which outwardly protrude a series of fins.
  • an exemplary electronic device may include a thermal interface material positioned between a heat source and a heat sink without any intervening heat spreader between.
  • the thermal interface material may thus be positioned directly between and/or against the heat sink and the heat source, which may comprise one or more heat generating components or devices (e.g., a CPU, die within underfill, semiconductor device, flip chip device, graphics processing unit (GPU) , digital signal processor (DSP) , multiprocessor system, integrated circuit, multi-core processor, etc. ) , batteries, solar panels, etc.
  • the system includes a tool (e.g., a roller, rolling device, etc. ) configured to be movable relative to a supply of a material for positioning a portion of the material from the supply along a component (or other target surface) , and thereby forcing, squeezing, or removing air pockets and/or bubbles out of the portion of the material when the tool is moved relatively along the portion of the material.
  • a tool e.g., a roller, rolling device, etc.
  • FIG. 1 is a cross-sectional view of an exemplary electronic device showing a thermal interface material (TIM1) positioned between a lid (e.g., integrated heat spreader (IHS) , etc. ) and a heat source (e.g., one or more heat generating components, central processing unit (CPU) , die, semiconductor device, etc. ) .
  • a lid e.g., integrated heat spreader (IHS) , etc.
  • a heat source e.g., one or more heat generating components, central processing unit (CPU) , die, semiconductor device, etc.
  • FIG. 2 illustrates an exemplary system for applying thermal interface materials to lids according to an exemplary embodiment.
  • FIG. 3 illustrates exemplary shapes (e.g., star, arrow, square, rectangular, oval, etc. ) that are possible for the thermal interface materials using the system according to the exemplary embodiment shown in FIG. 2.
  • exemplary shapes e.g., star, arrow, square, rectangular, oval, etc.
  • FIG. 4 is a perspective view of an exemplary embodiment of a tool configured to be operable for transferring a portion of a material (e.g., thermal interface material, other material, etc. ) from a supply (e.g., roll, reel, tape, etc. ) of the material to a substrate, part, component, or other target surface.
  • a material e.g., thermal interface material, other material, etc.
  • a supply e.g., roll, reel, tape, etc.
  • FIG. 5 is a perspective view of the tool shown in FIG. 4, and also illustrating a strip or tape that includes a liner and thermal interface material (TIM) positioned across the tool and between the spring-loaded compressible and/or retractable guide pins.
  • TIM thermal interface material
  • FIG. 6 illustrates an exemplary system that includes the tool shown in FIGS. 4 and 5, for applying materials to components, parts, substrates, or other targets.
  • FIG. 7 illustrates three different die cutting modes (A, B, C) that may be used when applying materials to substrates, parts, components, or other target surfaces according to exemplary embodiments.
  • FIGS. 8-20 illustrate an exemplary embodiment of a system for applying materials (e.g., thermal interface material, other material, etc. ) from a supply (e.g., roll, reel, tape, etc. ) of the material to target surfaces (e.g., a target surface of a component, substrate, part, plate, another material, other target surface, etc. ) .
  • the system includes a tool (e.g., a roller, rolling device, etc.
  • PCM phase change material
  • Thermal interface materials are commonly provided as a thermal pad with release liners on both sides of the thermal pad.
  • a common installation method is to peel one of the two release liners, attach the thermal pad to a target area with the remaining release liner exposed or on top, and then peel the remaining release liner off the thermal pad.
  • phase change thermal interface materials are relatively easy to break when release liners are peeled off.
  • systems and processes for applying materials e.g., phase change thermal interface materials, other thermal interface materials, etc.
  • systems and processes may help reduce failure rate, such as reduced breaking of materials when peeling release liners off and/or mitigation of air entrapment and/or removal of air pockets and/or bubbles within the material.
  • exemplary embodiments of systems and processes for applying e.g., pushing, pressing, tamping, removing, severing, tearing, cutting, blowing, imprinting, transferring from a supply, etc.
  • a wide range of materials e.g., thermal interface materials (TIMs) , electrically-conductive elastomers, electromagnetic interference (EMI) absorbers, EMI shielding materials, dielectric materials, thermally-conductive materials, other interface materials, combinations thereof, individual layers, stacked layers thereof, etc.
  • lids or integrated heat spreaders of integrated circuit (IC) packages such as lids or integrated heat spreaders of integrated circuit (IC) packages, board level shields (e.g., a removable lid or cover of a board level shield (BLS) , etc. ) , heat sources (e.g., a central processing unit (CPU) , etc. ) , heat removal/dissipation structures or components (e.g., a heat spreader, a heat sink, a heat pipe, a vapor chamber, a device exterior case or housing, etc. ) , films and other substrates, etc.
  • IC integrated circuit
  • board level shields e.g., a removable lid or cover of a board level shield (BLS) , etc.
  • heat sources e.g., a central processing unit (CPU) , etc.
  • heat removal/dissipation structures or components e.g., a heat spreader, a heat sink, a heat pipe, a vapor chamber
  • a tool is used to transfer the TIM or other material from a delivery liner (broadly, a supply) to the target part, component, or substrate.
  • the tool may comprise a die that is tailored or customized (e.g., shaped and sized, rectangular as shown in FIG. 4, etc. ) according to a customer required size and shape (e.g., one or more of the shapes shown in FIG. 3, etc. ) .
  • the die may be moved relative to (e.g., downwardly, upwardly, laterally, diagonally, rotationally, etc. ) and pressed through a liner (e.g., a polyethylene terephthalate (PET) carrier and/or release liner, etc.
  • PET polyethylene terephthalate
  • thermal interface material e.g., phase change material (PCM) , other TIM, etc.
  • PCM phase change material
  • other material e.g., electrically-conductive elastomer, electromagnetic interference (EMI) absorber, EMI shielding material, dielectric material, combinations thereof, individual or stacked layers thereof, etc.
  • the die may be moved relative to and pressed through the liner along with pressure, dwell, heating, and cooling, which may aid in cutting, adhesion, release of the TIM or other material from the liner, temperature control, etc.
  • the movement of the die relative to the liner also moves a portion of the TIM or other material for transfer or application from the supply onto a substrate or component.
  • the liner is also removed from the portion of the TIM or other material.
  • the portion of the TIM or other material in the specific customer required size and shape remains left behind, e.g., on the lid, BLS, heat source, heat removal/dissipation structure, etc.
  • the die may be configured to reduce the material thickness, create adhesion, and tear the TIM or other material from the supply.
  • the machine or press used to press the die (e.g., downwardly, upwardly, laterally, diagonally, rotationally, etc. ) through the liner may range from a manual hand operated press to a highly automated machine.
  • at least a portion of the liner may remain on the portion of the TIM or other material that was applied to the substrate or component, where the remaining liner portion may be useful for protection, labeling, provide tabs, and/or other reasons.
  • the supply of material comprises a supply (e.g., roll, reel, tape, etc. ) of thermal interface material, such as phase change material (PCM) or other non-metal TIM (e.g., plastic TIM, silicone elastomer TIM, etc. ) .
  • the supply of material may include a wide range of other materials, such as other TIMs, non-thermally enhanced materials, thermal insulators, dielectric insulation, electrical insulators, electrically-conductive elastomers, EMI absorbers, EMI shielding materials, polymeric materials, adhesive materials, other interface materials, combinations thereof, individual layers thereof, stacked layers thereof, etc.
  • a tamping tool is used to tamp the TIM or other material onto the substrate or component (e.g., lid, BLS, heat source, heat removal/dissipation structure, etc. ) .
  • the tamping tool may include a cavity and a resilient material (e.g., cotton, cork, gel, gel packs, rubber, elastomer, resilient plastic, springy or sponge-like material, fibrous material, insulation material, other resilient material, etc. ) within the cavity.
  • the tamping tool may include a center foam core or foam filled core.
  • the tamping tool may include another resilient material within the cavity or no cavity at all.
  • a die may be used to remove (e.g., cut, tear, sever, etc. ) the TIM or other material through the liner without having to puncture the liner.
  • the die may be integral with or separate from the tamping tool.
  • the TIM or other material is non-metal such that there is no diffusion bonding or welded joints between the non-metal and the substrate or component (e.g., lid, BLS, heat source, heat removal/dissipation structure, etc. ) .
  • the non-metal may be naturally tacky and self-adhere to the substrate or component without any additional adhesive needed (although adhesives could also be used) .
  • the die may comprise one or more blades and/or at least one edge configured (e.g., flat, pointed, sharp, etc. ) for cutting, tearing, or severing one or more edges or sides (e.g., a single side or edge, two opposing sides or edges, all sides or edges, etc. ) of the TIM or other material from the supply.
  • the die may comprise a blade die (e.g., steel blade die, etc. ) , a knife die (e.g., rounded knife die, etc. ) , a rotary die, a steel ruled die having a knife, rounded, or dulled edge, etc.
  • the die comprises an integrated circuit die (e.g., a block of semiconducting material, etc. ) having one or more edges for cutting, severing, or tearing one or more edges (e.g., a single side or edge, two opposing sides or edges, all sides or edges, etc. ) of the TIM or other material that is tamped onto the integrated circuit die by the tamping tool.
  • the tamping tool may be operable for cutting, tearing, or severing one or more sides or edges (e.g., a single side or edge, two opposing sides or edges, all sides or edges, etc.
  • the tamping tool may comprise a resilient material (e.g., foam filled cavity, center foam core, etc. ) that is usable for tamping and transferring (e.g., cutting, tearing, severing, etc. ) the TIM or other material from a supply (e.g., roll, reel, tape, etc. ) onto a substrate or component.
  • a resilient material e.g., foam filled cavity, center foam core, etc.
  • transferring e.g., cutting, tearing, severing, etc.
  • a rolling rotary die may be used to apply or transfer a TIM or other material from a supply onto components or substrates.
  • the rolling rotary die may be used to apply or transfer a portion of a TIM or other material from a reel or roll onto a surface of a component or substrate.
  • This example may be a reel-to-reel or roll-to-roll process in which the rotary die is between the supply reel or roll and the take-up or salvage reel or roll.
  • the system components may be run at a given speed such that there is a rotary transfer of the portions of the material from the supply roll or reel to the surface of the substrate or component.
  • the TIMS and other materials may be provided with textured and/or modeled surfaces during the application or transfer from a supply onto the components or substrates. Accordingly, exemplary embodiments disclosed herein include methods for texturing surfaces and/or creating textured or modeled surfaces on a TIM and other materials.
  • a TIM or other material may be transferred from a carrier or delivery liner or other supply to a heat sink, lid, other part, substrate or component, etc. It has been discovered that the slightest imperfections in the liner are also transferred into the TIM or other material during the application/transfer process. For example, the thickness of an ink used for a logo on the liner may be imprinted into the TIM or other material being applied or transferred from the liner to the component or substrate.
  • a textured portion of a tool may be used to provide texturing to a surface of the TIM or other material when the textured portion of the tool is used to tamp, press against, or otherwise apply the TIM or other material from a carrier liner to a component or substrate.
  • a standalone stencil may also be used between a carrier liner and a tool (e.g., a foam core of a die, etc. ) during the transfer process to create and leave a texture on a surface of the TIM or other material being transferred from the carrier liner to a component or substrate.
  • one or more markings from an item between a backside of a foam core (or other resilient material) and a tool may also be transferred therefrom to provide texturing to a surface of the TIM or other material being transferred to a component or substrate.
  • This discovery allows for microtexturing of the TIM and other materials during the application/transfer process.
  • the texturing of the surface may improve or aide in air removal and pressure reduction during assembly.
  • the texturing of the surface may reduce contact resistance and make the TIM or other material softer and more compliant.
  • the texturing may also be used to create identifying marks on the TIMs and other materials being transferred or applied from the liners or other supplies.
  • Microtextured surfaces on a TIM or other material may also provide benefits for EMI shielding and/or absorbing.
  • Electrically-conductive ink or other electrically-conductive substance on the liner may be transferred from the liner to the TIM or other material to thereby create a textured surface (e.g., frequency selective surface (FSS) , grid, etc. ) for EMI shielding purposes.
  • a textured surface e.g., frequency selective surface (FSS) , grid, etc.
  • the liner may be entirely removed and not left behind as only the portion of the TIM or other material may be transferred from the liner and remain on the component or substrate.
  • at least a portion of a carrier liner may remain on the portion of the TIM or other material that was transferred from the carrier liner to the substrate or component. By way of example, this may be accomplished by cutting through the carrier liner with high pressure and/or a sharp die. The remaining portion of the carrier liner that was transferred along with the TIM or other material from the carrier liner may be useful for protection as a protective cover, for labeling, for providing tabs, and/or other reasons.
  • a downstream secondary action may be employed to subsequently add a cover, tab, or liner to the portion of the TIM or other material that was previously applied to the substrate or component.
  • the subsequently added cover, tab, or liner may be useful for protection as a protective cover during transport, provide labeling, provide tabs, and/or other reasons.
  • the TIM or other material may be susceptible to contamination or other defects such that a protective cover may be beneficial, e.g., during transportation, during installation and assembly, etc.
  • a tool e.g., a die, etc.
  • the tool may include a cavity and a resilient material within the cavity.
  • the resilient material may comprise a specifically shaped piece of foam that allows for air entrapment to be mitigated and removal of air pockets.
  • the foam shape may be configured to apply material air/bubble free on larger part sizes (e.g., greater than 20 millimeters (mm) , etc. ) .
  • the shape of this foam may be cylinder shaped or cylindrical, hemispherical, chamfered, or a flat piece that is inserted into a die in such a way that the surface is curved (e.g., oversized or standoff, etc. ) .
  • the traditional peel and stick method parts are usually limited to squares or rectangles.
  • Exemplary embodiments disclosed herein may be used to apply or transfer parts or portions of a TIM or other material, which have intricate geometries and/or irregular shape, such as circles, letters, parts with negative space, other shapes, such as the shapes shown FIG. 3 (e.g., star, arrow, square, oval, etc. ) , etc.
  • a single part or portion of a thermal interface material (TIM) or other material may be applied or transferred to a single component or substrate in a single action (e.g., a single stroke, single press of a die, etc. ) .
  • multiple parts or portions of the same or different TIMs and/or other materials may be applied or transferred at the same time to different areas of the same single component or substrate, e.g., in a single action or stroke of a multiple up die, etc.
  • multiple parts or portions of the same or different TIMs and/or other materials may be applied or transferred at the same time (e.g., in a single press of a die, etc. ) to multiple components or substrates, e.g., by using a multiple up die and the parts are staggered and the TIM or other material is wide enough, etc.
  • a single action (e.g., a single stroke, single press of a die, etc. ) is performed that includes tacking a TIM or other material to a component or substrate using a foam core (or other resilient material) and imprinting the TIM or other material for release using a die edge (e.g., edge of a steel ruled die, knife die, integrated circuit die, etc. ) .
  • the tacking and imprinting may be accomplished in a single stroke.
  • multiple actions (e.g., multiple strokes, etc. ) may be performed for the tacking and imprinting of the TIM or other material.
  • This may include first tacking or pre-tacking the TIM or other material with a foam or other resilient material, then in a separate action using a die (e.g., a blade die, steel ruled die, knife die, integrated circuit die, etc. ) to imprint the TIM or other material for release.
  • a die e.g., a blade die, steel ruled die, knife die, integrated circuit die, etc.
  • the pre-tacking and imprinting may either be done on the same machine or on separate machines.
  • tacking and imprinting in separate actions may help mitigate air entrapment and/or allow for a faster overall process.
  • multiple actions may be performed to stack materials (e.g., TIMs on TIMs, etc. ) either of the same material or different materials.
  • stack materials e.g., TIMs on TIMs, etc.
  • this can allow for less SKUs (stock keeping units) by allowing a single thickness to be built up through multiple actions in a same location (e.g., 25 micron thick layers built to a final thickness, etc. ) .
  • This can also allow for different layers to be placed or stacked on top of each other, such as a bottom or first TIM layer, a middle or second dielectric layer, and a top or third TIM layer, etc. This can also allow for easier rework where not enough material was added.
  • a die is used to make an imprint in the TIM or other material to be transferred.
  • the edges of a raised pedestal or integrated circuit may be used to make the imprint needed for the release and transfer of the TIM or other material from the supply.
  • a piece of an oversized resilient material (e.g., foam, etc. ) or an oversized die including a core or cavity filled with a resilient material (e.g., foam, etc. ) may be used to complete the transfer of the imprinted TIM or other material to the raised pedestal or integrated circuit.
  • this process may allow for covering an entire surface of the raised pedestal or integrated circuit with the TIM or other material.
  • thermal interface materials or other materials may be required on both sides of a part, substrate, or component.
  • dual heads e.g., dual print heads, etc.
  • the material applied to one side may be the same as or different than the material applied to the other side of the part.
  • exemplary embodiments may allow for reduced handling and fixturing time and/or costs as compared to processes in which TIMs may be applied sequentially and not simultaneously to both sides of a part.
  • Some exemplary embodiments include multi-directional printing functionality such that the TIM or other materials may be printed, applied, or transferred to target components in various directions, including but not limited to, up/down, lateral, diagonal, rotary, inverted, etc. This may include printing, applying, or transferring the TIM or other material on multiple sides (e.g., double sided, etc. ) or multiple target surfaces.
  • FIG. 2 illustrates an exemplary system 100 for applying (e.g., transferring from one or more supplies, etc. ) materials to components according to an exemplary embodiment embodying one or more aspects of the present disclosure.
  • FIG. 2 shows thermal interface materials 120 (broadly, materials) being applied to lids or integrated heat spreaders 124 (broadly, components)
  • the system 100 may also be used for applying thermal interface materials 120 and other materials to a wide range of other components and substrates, such as board level shields (e.g., a removable lid or cover of a board level shield (BLS) , etc. ) , heat sources (e.g., a central processing unit (CPU) , etc.
  • board level shields e.g., a removable lid or cover of a board level shield (BLS) , etc.
  • heat sources e.g., a central processing unit (CPU) , etc.
  • CPU central processing unit
  • aspects of the present disclosure should not be limited to use with any single type of material, substrate, part, component or limited to application or transfer of materials to any specific location or portion of the substrates, parts, or components.
  • the system 100 includes a press 104 coupled with a die 108.
  • the press 104 and die 108 are operable for tamping and cutting, severing, tearing, etc. the portion of the strip or tape 112 that includes a liner 116 and thermal interface material (TIM) 120 that is underneath the die 108.
  • TIM thermal interface material
  • alternative embodiments may include tools configured differently than the press 104 and die 108.
  • the die 104 may comprise a rounded knife die.
  • the rounded knife die may include a foam filled core.
  • the die 108 may include a cavity or core filled with a different resilient material, such as cotton, cork, gel, gel packs, rubber, elastomer, resilient plastic, springy or sponge-like material, fibrous material, insulation material, etc.
  • the die 108 may not require a core filled with resilient material depending on the particular type of material being applied or transferred by the system 100.
  • the foam filled core of the die 108 may tamp the TIM 120 downward onto a corresponding one of the lids 124 located underneath the die 108. Then, the rounded knife die may be used to remove (e.g., cut, tear, sever, etc. ) the TIM 120 through the liner 116, e.g., without having to puncture the liner 116, etc. During this removal operation, the TIM 120 is squeezed down and the liner 116 is pushed through the TIM 120 with the die 108, which causes the severing, tearing, or cutting of the TIM 120 from itself without cutting the liner 116.
  • the rounded knife die may be used to remove (e.g., cut, tear, sever, etc. ) the TIM 120 through the liner 116, e.g., without having to puncture the liner 116, etc.
  • the TIM 120 is squeezed down and the liner 116 is pushed through the TIM 120 with the die 108, which causes the
  • the TIM 120 may start at an initial thickness of about 125 microns.
  • the die 108 may force the liner 116 down into the TIM 120 until the TIM thickness is reduced to about 25 microns or is pushed out of the way. Accordingly, the TIM 120 may thus have tapered edges on all four sides due to this method.
  • the TIM 120 may remain on the lid 124 when the die 108 is removed and the next portion of the strip 112 and the next lid 124 is moved into place under the die 108.
  • the lids 124 may progress or move relative to the die 108 via a conveyor belt or other feeding/conveyor mechanism.
  • the strip of material 112 that includes the liner 116 and TIM 120 is roll stock from a supply or roll 128.
  • Rollers 132, 136, 140 are used to cause the strip of material 112 to unroll from the supply 128 of roll stock and travel to the location underneath the die 108 for tamping and cutting.
  • what is left of the strip of material 144 may be collected or salvaged, e.g., wound onto a salvage roll 148, allowed to fall into a waste basket, etc.
  • more or less rollers may be used and/or strips of material that do not come on rolls may be used. In which case, the strips of material may be put in place by hand, with a jig, or by an automated means.
  • the system 100 preferably uses as much of the strip of material as possible to thereby minimize or at least reduce waste (e.g., minimize the amount of TIM material left on the liner, etc. ) during the application process.
  • the lids 124 are spaced apart by a greater distance than which the strip 112 is advanced after each tamping and cutting (broadly, removing) operation. After each tamping and cutting operation, the strip 112 is advanced only enough (e.g., a minimum distance, etc. ) to allow the next portion of the strip 112 to be tamped and cut, severed, torn, etc. in order to apply the TIM 120 to the next lid 124.
  • the width of the TIM 120 along the liner 116 may be equal to the width of the pieces of the TIM 120 that are tamped and applied/transferred to the lids 124. In another exemplary embodiment, the width (e.g., 1 inch, etc. ) of the TIM 120 along the liner 116 may be greater than the width (e.g., 3/4 inches, etc. ) of the pieces of the TIM 120 that is tamped and applied/transferred to the lids 124.
  • the strip of material 112 may also include a lower liner disposed along a lower surface or bottom of the TIM 120.
  • the lower liner may be manually removed by hand or automatically without manual intervention (e.g., with a rewind and stripper bar, etc. ) before the die 108 applies the TIM 120 to the lids 124.
  • the system 100 may include one or more heaters such that heat is applied or added to the top and/or such that heat is applied or added to the base or bottom.
  • the heat may aid in the cutting, tearing, severing, etc. of the material and/or adhesion of the material to the components. Or, for example, the heat may be used to cut or otherwise remove (e.g., without a knife or blade, etc. ) the material portions from the supply.
  • the system 100 may be configured with cooling, e.g., added to the top part and die used to cut the TIM, a thermoelectric module, etc. A die may be added to the top plate in some exemplary embodiments.
  • the roll 128 (broadly, supply) may be provided in various sizing, such as 0.5 inches (12.7 millimeters (mm) ) , 1 inch (25.4mm) , etc.
  • the roll width may be selected based on the part size. For example, a roll having a width of 0.5 inches (12.7mm) may be used if the lid 124 (broadly, part) is 10mm x 5mm.
  • the roll 128 is placed onto an unwind and threaded through the application machine or system 100. If the roll 128 includes a lower liner, the lower liner may be removed as the material advances with small rewind.
  • the lids 124 and die 108 may be oriented in the application machine or system 100 to maximize usage of the thermal interface material.
  • the lids 124 may be placed in a jig for application step to ensure good or perfect positioning and TIM placement.
  • the orientation may be performed manually by hand although for high volumes the orientation may be performed automatically, e.g., by an automated table (e.g., turntable or other, etc. ) .
  • the system 100 may include a sensor system to advance the rolled TIM material for the next TIM application. Alternatively, the system 100 may be configured with a set distance advance process. Heat and cooling may be provided to improve application robustness.
  • FIGS. 4 through 6 illustrate an exemplary embodiment of a tool 202 embodying one or more aspects of the present disclosure.
  • the tool 202 is configured to be operable for transferring a portion of a material (e.g., thermal interface material, other material, etc. ) from a supply (e.g., roll, reel, tape, etc. ) of the material to a substrate, part, component, or other target surface.
  • a material e.g., thermal interface material, other material, etc.
  • a supply e.g., roll, reel, tape, etc.
  • the tool 202 may be used with the system 100 shown in FIG. 2 or other suitable system.
  • the tool 202 includes a die 208 (e.g., blade die, etc. ) configured for cutting a portion of material along only one edge or side of the material portion.
  • the tool 202 also includes a resilient material 210 for tamping, pressing, pushing against, etc. the entire portion of the material to cause the other remaining attached edges or sides of the portion of the material to be torn, severed, detached, or separated from the supply of material as the portion of material is being applied to the component.
  • the die 208 may have a closed shaped (e.g., rectangular, non-rectangular, etc. ) .
  • the tool 202 may include a cavity filled with one or more different resilient materials 210, such as cotton, cork, gel, gel packs, rubber, elastomer, resilient plastic, springy or sponge-like material, fibrous material, insulation material, other resilient material, etc.
  • the die 208 may comprise a blade die having a foam filled core or center foam core.
  • the die 108 may not require a core filled with resilient material depending on the particular type of material being applied or transferred by the system 100.
  • the resilient material 210 of the tool 202 may comprise a specifically shaped piece of resilient material (e.g., foam, etc. ) that allows for air entrapment to be mitigated and for removal of air pockets and/or bubbles.
  • the resilient material 210 may comprise foam having a convex curvature, outwardly curved shape, or other suitable non-flat shape for squeezing or forcing bubbles or air pockets out of the portion of material when the foam is pressed or pushed against the portion of the material to cause uncut sides or edges of the portion of the material to be torn, severed, detached, or separated from the supply of material as the portion of material is being applied to the component.
  • One or more alignment members 214 e.g., pins, post, guides, spring-loaded retractable pins, etc. arranged or disposed around the die 208.
  • the alignment members 214 may be configured to help align the material supply (e.g., material roll, etc. ) and to press against the component to which the material portion is applied to help inhibit lifting while liner peeling.
  • the alignment members 214 comprise a set of four pins or posts each of which is adjacent one of the four corners of the rectangular blade die 208 in this example.
  • the four pins or posts 214 may be retractable, compressible, spring-loaded, or otherwise configured for pressing against and/or applying a force (e.g., a spring force, etc. ) against the component to help inhibit lifting when a liner is peeled or otherwise removed from the portion of material applied to the component.
  • the four pins or posts 214 may be retractable relative to the support surface or substrate 218 to which are mounted and/or coupled the pins or posts 214.
  • a chilling unit, cooling module, or apparatus may be disposed in front of or upstream of the tool 202.
  • the cooling module may be used for reducing the material’s temperature before the portion of the material is applied to the component. Reducing the material’s temperature may increase the material’s hardness and reduce the release force needed to peel the liner from the material. The increased material hardness and reduced release force will make it easier to peel or otherwise remove a liner from the portion of the material applied to the component, which, in turn, may allow for a reduced failure rate associated with materials breaking during liner peeling.
  • a press 204 is coupled with the die 208.
  • the press 204, die 208, and resilient material 210 are applying for a portion of the thermal interface material (TIM) 220 from the supply 212 (e.g., strip or tape that that includes a liner 216 and the TIM 220, etc. ) to the component or target 224.
  • the process of applying the portion of the TIM 220 to the target 224 may include moving (e.g., lowering, etc. ) the die 208 via the press 204 relative to the target 224 and pressing the die 208 against the target 224 for an amount of time (e.g., a dwell of 2 or 3 seconds, etc. ) , and then moving (e.g., raising, etc. ) the die 208 relatively away from the target 224.
  • the liner 216 needs to be peeled, separated, or removed from the TIM 220. Due to the release force, the bottom of the target 224 may be lifted up a little and then dropped (if the weight is higher than the release force) in conventional processes. And, if left unchecked, this may increase the failure rate of the material such as broken, bubbles, etc.
  • the pins 214 are disposed around the die 208 that may help to eliminate this issue. For example, the pins 214 may be compressed or retract when the die 208 is pressed against the target 224. When the die 208 is moved away (e.g., lifted, etc.
  • the pins 214 may then provide a force (e.g., a spring force from a compressed spring-loaded pin, etc. ) against the target 224 to help hold the target 224 down in place and inhibit the target 224 from being lifted.
  • a force e.g., a spring force from a compressed spring-loaded pin, etc.
  • the pins 214 also help to guide and align the material 212 into position relative to the die 208 and the component 224. This, in turn, may provide better positioning precision in the Y direction, which is the vertical direction in FIG. 6.
  • This exemplary embodiment may be used to apply or transfer a portion of a TIM or other material from a reel or roll onto a surface of a component or substrate, such as shown in FIG. 2, etc.
  • the tool 202 e.g., blade die 208 and foam 210, etc.
  • the take-up or salvage reel or roll e.g., salvage 148 in FIG. 2, etc.
  • the system components may be run at a given speed such that there is a transfer of the portions of the material from the supply roll or reel to the surface of the substrate or component.
  • This exemplary embodiment including the tool 202 may provide one or more (but not necessarily any or all) of the following features or advantages, such as an easier transfer from material roll to the target surface, more precise positioning of the material onto the target surface, wider and/or greater variety in available target surface, etc.
  • the system may be used for applying materials to components without requiring a fixture.
  • the alignment members 214 may be used to guide the material to a correct position relative to (e.g., underneath, etc. ) the die 208 and resilient material 214 and relative to (e.g., above, etc. ) the component for application of the material to the component.
  • the tool 202 may be used with system 100 shown in FIG. 2.
  • the die blade 208 may cut along only a single side or edge of the portion of the TIM 120 and the resilient material 210 may tamp or press the TIM 120 downward onto a corresponding one of the lids 124 located underneath the die 108.
  • the tool 202 may be used to remove (e.g., cut, tear, sever, etc. ) the TIM 120 through the liner 116, e.g., without having to puncture the liner 116, etc.
  • the TIM 120 may be squeezed down and the liner 116 is pushed through the TIM 120 with the tool 202, which causes the severing, tearing, or cutting of the TIM 120 from itself without cutting the liner 116.
  • the TIM 120 may be squeezed down and the liner 116 is pushed through the TIM 120 with the tool 202, which causes the severing, tearing, or cutting of the TIM 120 from itself without cutting the liner 116.
  • a very thin portion of the TIM 120 may be left between the lid 124 and the liner 116, the portion is so thin that it breaks free from the rest of the TIM 120 essentially cutting the TIM 120.
  • the TIM 120 may remain on the lid 124 when the die 208 and resilient material 210 are removed and the next portion of the strip 112 and the next lid 124 is moved into place under the die 208 and resilient material 210.
  • the lids 124 may progress or move relative to the die 208 and resilient material 210 via a conveyor belt or other feeding/conveyor mechanism.
  • FIG. 7 illustrates three different die cutting modes (A, B, C) that may be used when applying materials to substrates, parts, components, or other target surfaces according to exemplary embodiments.
  • a first die cutting mode (A) includes cutting all four sides or edges with a blade die. With this first die cutting mode (A) , a lot of material (residual) may be lost but there will be good dimension precision as determined by the blade die.
  • a second die cutting mode (B) including cutting two opposing sides or edges with a blade die.
  • the loss of material (scrap) may be reduced as compared to the first die cutting mode (A) .
  • various roll widths may be needed when using the second die cutting mode (B) to meet different width requirements as the width of the material (e.g., TIM, etc. ) being applied is determined by or equal to the material roll width.
  • a third die cutting mode (C) includes cutting a single side or edge with a blade die.
  • the length of the material e.g., TIM, etc.
  • the length of the material is determined by or equal to the distance the material roll moving.
  • a system for applying materials to components generally may include a tool operable for transferring a portion of a material from a supply of the material to a component.
  • a first portion of the tool is configured for cutting along a single side or edge of the portion of the material.
  • a second portion of the tool is configured for tamping, pressing, or pushing against the portion of the material to cause uncut sides or edges of the portion of the material attached to the supply of the material to be torn, severed, detached, or separated from the supply of the material.
  • the first portion of the tool may comprise a blade configured for cutting along the single side or edge of the portion of the material.
  • the second portion of the tool may comprise a resilient material configured for tamping, pressing, or pushing against the portion of the material to cause uncut sides or edges of the portion of the material attached to the supply of the material to be torn, severed, detached, or separated from the supply of the material.
  • the tool may comprise a blade die having the first portion configured for cutting along the single side or edge of the portion of the material.
  • the second portion may comprise a resilient material configured for mitigating air entrapment and for removing air pockets and/or bubbles from the portion of material when the resilient material is tamped, pressed, or pushed against the portion of the material and causes the uncut sides or edges of the portion of the material attached to the supply of the material to be torn, severed, detached, or separated from the supply of the material.
  • the second portion may comprise foam configured for squeezing or forcing bubbles or air pockets out of the portion of the material when the foam is tamped, pressed, or pushed against the portion of the material and causes the uncut sides or edges of the portion of the material attached to the supply of the material to be torn, severed, detached, or separated from the supply of the material.
  • the second portion may have a convexly curved outer surface.
  • the system may comprise one or more alignment members configured to help align the portion of the material with the tool and the component and/or to help inhibit lifting of the component when removing a liner from the portion of the material.
  • the system may comprise an apparatus for reducing temperature of the portion of the material before the portion of the material is applied to the component, whereby reducing temperature of the portion of the material increases hardness of the portion of the material and reduces a release force needed to peel a liner from the portion of the material.
  • the system may comprise one or more compressible and/or retractable pins configured to help guide the portion of the material into position relative to the tool and the component.
  • the tool may comprise a blade die having a rectangular shape including four corners.
  • the system further may comprise four compressible and/or retractable pins each of which is adjacent one of the four corners of the blade die, the compressible and retractable pins configured to help guide the portion of the material into position relative to the tool and the component.
  • a system for applying materials to components generally includes a tool operable for transferring a portion of a material from a supply of the material to a component.
  • the system also includes an apparatus for reducing temperature of the portion of the material before the portion of the material is applied to the component. Reducing temperature of the portion of the material may increase hardness of the portion of the material and may reduce a release force needed to peel a liner from the portion of the material.
  • the tool may comprise a blade configured for cutting along at least one side or edge of the portion of the material.
  • the blade may be configured for cutting along a single side or edge, two opposing sides or edges, or all sides or edges as shown in FIG. 7.
  • the tool may comprise a resilient material configured for tamping, pressing, or pushing against the portion of the material to cause uncut sides or edges of the portion of the material attached to the supply of the material to be torn, severed, detached, or separated from the supply of the material.
  • the resilient material may be configured for mitigating air entrapment and for removing air pockets and/or bubbles from the portion of material when the resilient material is tamped, pressed, or pushed against the portion of the material and causes the uncut sides or edges of the portion of the material attached to the supply of the material to be torn, severed, detached, or separated from the supply of the material.
  • the system may comprise one more alignment members configured to help align the portion of the material with the tool and the component and/or to help inhibit lifting of the component when removing a liner from the portion of the material.
  • the system may comprise one or more compressible and/or retractable pins configured to help guide the portion of the material into position relative to the tool and the component.
  • the tool may comprise a blade die having a rectangular shape including four corners.
  • the system may comprise four spring-loaded compressible and/or retractable pins each of which is adjacent one of the four corners of the blade die.
  • the spring-loaded compressible and/or retractable pins may be configured to help guide the portion of the material into position relative to the tool and the component.
  • a system for applying materials to components generally includes a tool operable for transferring a portion of a material from a supply of the material to a component.
  • the system also includes one or more compressible and/or retractable pins configured to help guide the portion of the material into position relative to the tool and the component.
  • the one or more compressible and/or retractable pins may be configured to help inhibit lifting of the component when removing a liner from the portion of the material.
  • the tool may comprise a blade configured for cutting along at least one side or edge of the portion of the material.
  • the blade may be configured for cutting along a single side or edge, two opposing sides or edges, or all sides or edges as shown in FIG. 7.
  • the tool may comprise a resilient material configured for tamping, pressing, or pushing against the portion of the material to cause uncut sides or edges of the portion of the material attached to the supply of the material to be torn, severed, detached, or separated from the supply of the material.
  • the resilient material may be configured for mitigating air entrapment and for removing air pockets and/or bubbles from the portion of material when the resilient material is tamped, pressed, or pushed against the portion of the material and causes the uncut sides or edges of the portion of the material attached to the supply of the material to be torn, severed, detached, or separated from the supply of the material.
  • the system may comprise an apparatus for reducing temperature of the portion of the material before the portion of the material is applied to the component. Reducing temperature of the portion of the material may increase hardness of the portion of the material and may reduce a release force needed to peel a liner from the portion of the material.
  • the tool may comprise a blade die having a rectangular shape including four corners.
  • the one or more compressible and/or retractable pins may comprise four compressible and/or retractable pins each of which is adjacent one of the four corners of the blade die.
  • a method for applying materials to components generally includes transferring a portion of a material from a supply of the material to a component.
  • the method may include one or more of: cutting along a single side or edge of the portion of the material and tamping, pressing, or pushing against the portion of the material to cause uncut sides or edges of the portion of the material attached to the supply of the material to be torn, severed, detached, or separated from the supply of the material; and/or reducing temperature of the portion of the material before the portion of the material is applied to the component, whereby reducing temperature of the portion of the material increases hardness of the portion of the material and reduces a release force needed to peel a liner from the portion of the material; and/or guiding the portion of the material into position relative to the component using one or more compressible and/or retractable pins.
  • Cutting along a single side or edge of the portion of the material may comprise using a blade die to cut along the single side or edge of the portion of the material.
  • Tamping, pressing, or pushing against the portion of the material may comprise using a resilient material to tamp, press, or push against the portion of the material to cause uncut sides or edges of the portion of the material attached to the supply of the material to be torn, severed, detached, or separated from the supply of the material.
  • Using a resilient material to tamp, press, or push against the portion of the material further may include using the resilient material squeeze or force bubbles or air pockets out of the portion of the material.
  • the method may include using a blade die to cut along a single side, two opposing sides, or all sides of the portion of the material.
  • FIGS. 8-20 illustrate an exemplary embodiment of a system 300 for applying materials 320 (e.g., thermal interface material, other material, etc. ) from a supply 312 (e.g., roll, reel, tape, etc. ) of the material 320 to target surfaces 324 (e.g., a target surface of a component, substrate, part, plate, another material, other target surface, etc. ) .
  • the system 320 includes a rolling device or roller 360 (broadly, a tool or device) configured to be movable relative to an upper liner 316 (e.g., a carrier liner, etc. ) of the supply 312 of the material 320.
  • an upper liner 316 e.g., a carrier liner, etc.
  • the rolling device/roller 360 is movable downwardly into contact with the liner 316 (FIGS. 10 and 11) and then rollable along the liner 316 (FIGS. 11-13) , for positioning a portion of the material 320 from the supply 312 along a component 324 (broadly, a target surface) .
  • the rolling device/roller 360 is also operable for forcing or squeezing (broadly, removing) air pockets and/or bubbles out of the portion of the material 320 as the rolling device/roller 360 is rolled along the liner 316. See, for example, FIG.
  • TIM thermal interface material
  • the component 324 e.g., a plate, other target surface, etc.
  • the system 300 includes a tool 302 configured to be operable for transferring the portion of material 320 from the liner 316 to the component 324.
  • the tool 302 may be similar or substantially identical to the tool (e.g., press 104 and die 108) of the system 100 (FIG. 2) and/or the tool 202 (FIGS. 4-6) as disclosed herein. Stated differently, the tool (e.g., press 104 and die 108) of the system 100 (FIG. 2) and/or the tool 202 (FIGS. 4-6) may be used with the system 300 shown in FIGS. 8-20.
  • the rolling device/roller 360 is operable for forcing, squeezing, or removing air pockets and/or bubbles out of the portion of the material 320 before the tool 302 transfers the portion of the material 320 from the liner 316 to the component 324. After the rolling device/roller operation, the tool 302 may then be used for severing, tearing, detaching, separating, and/or cutting the portion of the material 320 for release and transfer from the liner 316 of the supply of material 312.
  • the tool 302 may be configured to be operable for removing and/or peeling the liner 316 from the portion of the material 320 without removing the portion of the material 320 from the component 324 when the tool 302 is removed and retracted upwardly away from the component 324, as shown by FIGS. 16-18.
  • the system 300 may move the rolling device/roller 360 downwardly into contact with the liner 316 of the supply of material 312.
  • the system 300 may then roll the rolling device/roller 360 (from right to left in FIGS. 12 and 13) along the liner 316 while in contact with the liner 316.
  • the system 300 may move or retract the rolling device/roller 360 upwardly away from and out of contact with the liner 316 as shown by FIGS. 13 and 14.
  • the system 300 may move the rolling device/roller 360 (horizontally from left to right in FIGS. 14 and 15) back to its original starting position.
  • the tool 302 and the rolling device or device 360 may be coupled for common horizontal and vertical movement.
  • the system 300 may move the rolling device/roller 360 vertically or horizontally along with the die 308 of the tool 302.
  • the system 300 may also be configured such that the rolling device/roller 360 is also, or alternatively, movable independently from the die 308 of the tool 302.
  • the rolling device/roller 360 may be configured to contact the liner 316 at a non-perpendicular angle, such as an angle of about 60 degrees, about 45 degrees, other acute angle, other non-perpendicular angle, etc.
  • the rolling device/roller 360 is movable along (e.g., automatically rolled by the system 300 along and in contact with, etc. ) the liner 316 to thereby apply pressure (e.g., downwardly to, against, or along the liner, etc. ) for positioning the portion of the material 320 from the supply 312 against the component 324 without removing or transferring the portion of the material 320 from the liner 316.
  • the pressure applied to, against, or along the liner 316 by the rolling device/roller 360 while being rolled along the liner 316 may help mitigate air entrapment by removing air pockets and/or bubbles from the portion of the material 320.
  • the rolling device/roller 360 may be configured for squeezing or forcing air pockets and/or bubbles out of and/or from underneath the portion of material 320 when the rolling device/roller 360 applies pressure to (e.g., is pressed or pushed against, etc. ) the liner 316 as the rolling device/roller 360 is rolled along and the liner 316.
  • the rolling device/roller 360 may include a resilient material to lessen a force applied by the rolling device/roller 360 to the material 320 of the supply 312, e.g., which may help protect the material 320 from deformation of thickness, etc.
  • the supply of material 312 may include a relatively soft thermal interface material (TIM) or other material.
  • the rolling device/roller 360 may include or be covered with a relative soft foam or other resilient material (e.g., rubber, elastomer, resilient plastic, springy or sponge-like material, fibrous material, insulation material, other resilient material, etc. ) .
  • the tool 302 may include a cavity filled with one or more different resilient materials, such as cotton, cork, gel, gel packs, rubber, elastomer, resilient plastic, springy or sponge-like material, fibrous material, insulation material, other resilient material, etc.
  • the die 308 may comprise a blade die having a foam filled core or center foam core. In yet other embodiments, the die 308 may not require a core filled with resilient material depending on the particular type of material being applied or transferred by the system 300.
  • the system 300 may include a chilling unit, cooling module, or apparatus (e.g., recirculating chiller, a thermoelectric module, etc. ) for reducing the material’s temperature before the portion of the material 320 is applied to the component 324. Reducing the material’s temperature may increase the material’s hardness and reduce the release force needed to peel the liner 316 from the material 320. The increased material hardness and reduced release force will make it easier to peel or otherwise remove the liner 316 from the portion of the material 320 applied to the component 324, which, in turn, may allow for a reduced failure rate associated with materials breaking during liner peeling.
  • a chilling unit e.g., recirculating chiller, a thermoelectric module, etc.
  • a press is coupled with the die 308 such that the die 308 may be moved (e.g., lowered, etc. ) via the press relative to the component 324 or other target surface.
  • the press may be operable to press the die 308 against the component 324 for an amount of time (e.g., a dwell of 2 or 3 seconds, etc. ) , and then move (e.g., raise, retract, etc. ) the die 308 relatively away from the component 324.
  • the material 320 may be squeezed down and the liner 316 may be pushed through the material 320 with the tool 302, which causes the severing, tearing, or cutting of the material 320 from itself without cutting the liner 316.
  • the material 320 may remain on the component 324 when the die 308 is moved or retracted away from the component 324.
  • the strip of material 312 that includes the liner 316 and TIM 320 is roll stock from a supply or roll 328.
  • Rollers 332, 340 may be used to cause the strip of material 312 to unroll from the supply 328 of roll stock and travel to the location underneath the rolling device/roller 360 and the die 308.
  • the TIM 320 has been applied and transferred to the component 324, what is left of the strip of material 344 may be collected or salvaged, e.g., wound onto a salvage roll 348, allowed to fall into a waste basket, etc.
  • this exemplary embodiment may be used to apply or transfer a portion of a TIM or other material from a reel or roll onto a surface of a component or target surface.
  • the rolling device/roller 360 and the tool 302 are between the supply reel or roll 328 and the take-up or salvage reel or roll 348.
  • more or less rollers may be used and/or strips of material that do not come on rolls may be used. In which case, the strips of material may be put in place by hand, with a jig, or by an automated means.
  • FIGS. 8 and 20 show the component 324 being manually placed onto and removed from the support surface 318 of the system 300.
  • the component 324 being automatically positioned (e.g., placed underneath, aligned with, moved, etc. ) relative to the supply of material 312, the rolling device/roller 360, and tool 302, such as in the system 100 shown in FIG. 2, etc.
  • components may be aligned with and moved relative to the tool 302 and rolling device/roller 360 via a conveyor belt or other feeding/conveyor mechanism.
  • exemplary embodiments disclosed herein may include a rolling device or roller configured to be moved into contact with and pressed against a liner (e.g., a carrier liner, etc. ) of a supply of material.
  • the rolling device/roller is movable (e.g., automatically rolled, etc. ) along the liner while in contact with the liner to thereby apply pressure to the liner.
  • the pressure applied to the liner by the rolling device/roller positions, presses, or pushes the portion of the material from the supply against the component (broadly, a target surface) , while also forcing, squeezing, or removing air pockets and/or bubbles out of and/or from underneath the portion of the material.
  • the rolling device/roller Prior to removal of the liner from the portion of the material that is along the component, the rolling device/roller is moved relatively along (e.g., automatically moved downwardly into contact with, etc. ) the liner (e.g., a carrier liner along an upper surface of the material of the supply, etc. ) .
  • the rolling device/roller may be configured to contact the liner at a non-perpendicular angle, such as an angle of about 60 degrees, about 45 degrees, other acute angle, other non-perpendicular angle, etc.
  • the rolling device/roller is moved along (e.g., automatically rolled along and in contact with, etc. ) the liner to thereby apply pressure (e.g., downwardly to, against, or along the liner, etc.
  • the pressure applied to, against, or along the liner by the rolling device/roller while being rolled along the liner may mitigate air entrapment by removing air pockets and/or bubbles from the material.
  • the rolling device/roller may be configured for squeezing or forcing air pockets and/or bubbles out of and/or from underneath the portion of material when the rolling device/roller applies pressure to (e.g., is pressed or pushed against, etc. ) the liner as the rolling device/roller is rolled along the liner.
  • the rolling device/roller includes a resilient material (e.g., a roller covered with a relatively soft foam or other soft resilient material, etc. ) to lessen a force applied by the rolling device/roller to the material, e.g., which may help protect the material from deformation of thickness, etc.
  • a resilient material e.g., a roller covered with a relatively soft foam or other soft resilient material, etc.
  • the material to be applied by the system may comprise a relatively soft thermal interface material (TIM) or other material.
  • TIM thermal interface material
  • the rolling device/roller may include relative soft foam or other resilient material (e.g., rubber, elastomer, resilient plastic, springy or sponge-like material, fibrous material, insulation material, other resilient material, etc. ) .
  • the rolling device/roller is a first tool
  • the system further includes a second tool operable for transferring the portion of the material from the supply to the component.
  • the rolling device/roller is operable for forcing, squeezing, or removing air pockets and/or bubbles out of the portion of the material before the second tool transfers the portion of the material from the supply to the component.
  • the second tool may be configured to be operable for severing, tearing, detaching, separating, and/or cutting the portion of the material for release and transfer from the liner of the supply of the material.
  • the second tool may be configured to be operable for removing and/or peeling a liner (e.g., a carrier liner) from the portion of the material without removing the portion of the material from the component when the second tool is removed.
  • a liner e.g., a carrier liner
  • the rolling device/roller may be configured to be movable into contact with and along the liner for pushing or pressing the portion of the material that is along (e.g., underneath, etc. ) the liner against the component and thereby forcing or squeezing air pockets and/or bubbles out of the portion of the material when the rolling device/roller is rolled along the liner while in contact with the liner.
  • the rolling device/roller may be configured to be movable into contact with and rolled along the liner at a non-perpendicular angle relative to the liner.
  • the rolling device/roller may include a resilient material (e.g., foam, etc. ) that rollingly contacts the liner for applying pressure to the liner for forcing, squeezing, or removing air pockets and/or bubbles out of the portion of the material when the resilient material of the rolling device/roller is rolled along the liner.
  • a resilient material e.g., foam, etc.
  • the rolling device/roller may be configured to be moved automatically by the system relative to the supply of the material for automatically positioning the portion of the material from the supply along the component and thereby automatically forcing, squeezing, or removing air pockets and/or bubbles out of the portion of the material when the rolling device/roller is moved automatically relatively along the portion of the material.
  • the system may include a first tool having a convexly curved outer surface configured for forcing, squeezing, or removing air pockets and/or bubbles out of the portion of the material when the convexly curved outer surface is slidably moved or translated (e.g., not rolled, etc. ) along the portion of the material.
  • Exemplary embodiments are disclosed of systems for applying (e.g., transferring from a supply, etc. ) thermal interface material and other materials to components.
  • a thermal interface material or other material may be applied to a wide range of substrates, components, and parts, such as lids or integrated heat spreaders of integrated circuit (IC) packages, board level shields, heat sources (e.g., a central processing unit (CPU) , etc. ) , heat removal/dissipation structures or components (e.g., a heat spreader, a heat sink, a heat pipe, a vapor chamber, a device exterior case or housing, etc. ) , etc.
  • heat sources e.g., a central processing unit (CPU) , etc.
  • heat removal/dissipation structures or components e.g., a heat spreader, a heat sink, a heat pipe, a vapor chamber, a device exterior case or housing, etc.
  • the system may include a supply of material (e.g., a roll, reel, or tape of thermal interface material or other material, etc. ) and a tool (e.g., a die, etc. ) .
  • the tool may be operable for pushing against (e.g., tamping, etc. ) and removing (e.g., cutting, tearing, shearing, severing, separating, etc. ) a portion of the material from the supply that is between the tool and a component.
  • the material may comprise a non-metal.
  • the portion of the material may be coupled to the component without any diffusion bonding or welded joints therebetween.
  • a liner may be along a surface of the supply of material.
  • the tool may be operable for removing the portion of material from the supply through the liner.
  • the tool may be operable for pushing the liner through the portion of the material for severing the portion of the from the supply without having to puncture the liner.
  • the tool may comprise a die operable for tamping and cutting the portion of the material from the supply that is between the tool and a corresponding one of the components.
  • the tool may comprise a rounded knife die with a foam filled core.
  • the foam filled core may be usable for tamping the portion of material downward onto the component.
  • the rounded knife die may be usable to cut the portion of material from the supply through the liner.
  • the system may be configured such that the portion of material remains on the component and such that the liner is removed from the portion of material when the tool is removed and moved (e.g., raised upwardly, etc. ) away from the portion of material.
  • the system may be configured such that the portion of material remains on the component when the tool is removed and a next portion of the supply of material and a next component is moved into place for application of the material thereto.
  • the system may comprise a sensor system to advance the supply of material for the next application to a subsequent component.
  • the system may be configured with a set distance advance process for the supply of material.
  • the system may include jigs in which the components are placed and oriented relative to the die for placement of the material onto the components.
  • the components may comprise lids or integrated heat spreaders of integrated circuit (IC) packages, board level shields, heat sources (e.g., a central processing unit (CPU) , etc. ) , heat removal/dissipation structures or components (e.g., a heat spreader, a heat sink, a heat pipe, a vapor chamber, a device exterior case or housing, etc. ) , etc.
  • the system may be configured with heating and/or cooling features (e.g., recirculating heater/chiller, a thermoelectric module, etc. ) for applying heat and/or cooling during application of the material to the components, which may aid in cutting, adhesion, release of the TIM or other material from the liner, temperature control of the components and substrates, etc.
  • heating and/or cooling features e.g., recirculating heater/chiller, a thermoelectric module, etc.
  • heat may aid in the cutting of the material and/or adhesion of the material to the components.
  • heat may be used to cut or otherwise remove (e.g., without a knife or blade, etc. ) the portions of the material from the supply.
  • the system may include a roll of the supply of material. Rollers may be provided for causing the supply of material to unroll from the roll and travel to a location aligned with the tool.
  • a salvage e.g., a salvage roll, waste basket, etc.
  • the material may be thermal phase change material with or without any tabs.
  • a system or method may be configured to apply (e.g., transfer from a roll, etc. ) a thermal interface material or other material to a substrate, such as a film in order to make a tabbed product, etc.
  • a thermal interface material or other material may be applied to a wide range of substrates and components, such as lids or integrated heat spreaders of integrated circuit (IC) packages, board level shields, heat sources (e.g., a central processing unit (CPU) , etc. ) , heat removal/dissipation structures or components (e.g., a heat spreader, a heat sink, a heat pipe, a vapor chamber, a device exterior case or housing, etc. ) , etc.
  • heat sources e.g., a central processing unit (CPU) , etc.
  • heat removal/dissipation structures or components e.g., a heat spreader, a heat sink, a heat pipe, a vapor chamber, a device exterior case or housing, etc.
  • a method generally includes tamping and removing (e.g., cutting, tearing, shearing, severing, separating, etc. ) a portion of a material from a supply of the material that is aligned with a component, such that the portion of the material is applied to the component without diffusion bonding of the portion of thermal interface material to the corresponding one of the components.
  • tamping and removing e.g., cutting, tearing, shearing, severing, separating, etc.
  • the tamping and removing may comprise pressing a tool (e.g., die, etc. ) through a liner disposed along a surface of the supply of material such that the portion of the material remains on the component and such that the liner is removed from the portion of the material when the tool is removed and moved relatively away from the portion of the material.
  • the method may include using the tool to push the liner through the portion of the material to thereby severe the portion of the material from the supply without puncturing the liner.
  • the tamping and removing may comprise using a tool to tamp and remove the portion of the material from the supply that is between the tool and the component.
  • the tool may comprise a die, such as a rounded knife die with a foam filled core, etc.
  • the method may include using the foam filled core for tamping the portion of the material onto the component and using the rounded knife die to cut the portion of the material from the supply of material.
  • the method may include advancing a corresponding one of the components having the portion of material thereon away from the tool; and advancing the supply of material and a next component into place aligned with the tool for application of the material to the next component.
  • Advancing the supply of the material may comprise using rollers to cause the supply of the material to unroll from a supply roll and travel to a location aligned with the tool.
  • the method may include collecting an unused portion of the supply of the material that remains after the material has been applied to the components.
  • the material may comprise a non-metal.
  • the method may include coupling the portion of the material to the component without any diffusion bonding or welded joints therebetween.
  • the method may include advancing the supply of the material for a next application to a component while using a sensor system or a set distance advance process.
  • the method may further comprise placing the components in jigs such that the components are oriented for placement of the material onto the components.
  • the components may comprise lids or integrated heat spreaders of integrated circuit (IC) packages, board level shields, heat sources (e.g., a central processing unit (CPU) , etc. ) , heat removal/dissipation structures or components (e.g., a heat spreader, a heat sink, a heat pipe, a vapor chamber, a device exterior case or housing, etc. ) , etc.
  • the method may further comprise heating and/or cooling during the tamping and/or removing.
  • Another exemplary embodiment includes an integrated heat spreader and a thermal interface material or other material applied (e.g., tamped and cut, transferred form a supply, etc. ) thereon by a system or method disclosed herein.
  • An electronic device may include the integrated heat spreader of claim and central processing unit or processor die.
  • the integrated heat spreader may be operable for spreading heat generated by operation of the central processing unit or processor die.
  • Another exemplary embodiment includes a board level shield (BLS) and a thermal interface material or other material applied (e.g., tamped and cut, transferred from a supply, etc. ) thereon by a system or method disclosed herein.
  • the BLS may be suitable for use in providing electromagnetic interference (EMI) shielding for at least one component on a substrate.
  • the BLS may comprise one or more sidewalls defining an opening and configured for installation to the substrate generally about the at least one component on the substrate, and a lid configured to cover the opening defined by the one or more sidewalls.
  • the thermal interface material may be applied to the lid.
  • the thermal interface material and the lid may cooperate to define a thermally-conductive heat path from the at least one component, and the BLS may be operable for providing EMI shielding for the at least one component.
  • the lid may be integral with or removably attachable to the one or more sidewalls.
  • Another exemplary embodiment includes an assembly comprising a heat removal/dissipation structure, a printed circuit board having a heat source, and a board level shield having a thermal interface material or other material applied (e.g., tamped and cut, transferred from a supply, etc. ) thereon by a system or method disclosed herein.
  • the one or more sidewalls are installed to the printed circuit board with the opening over the at least one component.
  • the lid is positioned on the one or more sidewalls such that the opening defined by the one or more sidewalls is covered by the lid.
  • the thermal interface material and the lid cooperate to define a thermally-conductive heat path from the heat source to the heat removal/dissipation structure.
  • the board level shield is operable for providing EMI shielding for the heat source.
  • the heat removal/dissipation structure may be a heat spreader.
  • the heat source may be an integrated circuit on the printed circuit board.
  • thermal interface materials and other materials may be used in exemplary embodiments, such as for the material 120 shown in FIG. 2, material 220 shown in FIG. 6, material 320 shown in FIG. 20, etc.
  • exemplary embodiments disclosed herein may allow a TIM to be made that will have relaxed properties over current TIMs. Ease of handling and application are important for TIMs, although softness, shear thinning, and modulus that help performance result in more difficult to apply materials.
  • the exemplary application processes disclosed herein may allow materials that are typically hard to apply but have better performance to be applied easier.
  • Example thermal interface materials that may be used in exemplary embodiments include thermal gap fillers, thermal phase change materials, thermally-conductive EMI absorbers or hybrid thermal/EMI absorbers, thermal putties, thermal pads, etc.
  • exemplary embodiments may include a thermally-conductive EMI absorbers or hybrid thermal/EMI absorbers tamped, cut, and applied to a portion of an EMI shield, such as a cover or lid of a board level shield.
  • Example embodiments may include one or more thermal interface materials of Laird, such as any one or more of the Tputty TM 502 series thermal gap fillers, Tflex TM series gap fillers (e.g., Tflex TM 300 series thermal gap filler materials, Tflex TM 600 series thermal gap filler materials, Tflex TM 700 series thermal gap filler materials, etc. ) , Tpcm TM series thermal phase change materials (e.g., Tpcm TM 580 series phase change materials, Tpcm TM 780 series phase change materials, Tpcm TM 900 series phase change materials etc. ) , Tpli TM series gap fillers (e.g., Tpli TM 200 series gap fillers, etc.
  • Tflex TM series gap fillers e.g., Tflex TM 300 series thermal gap filler materials, Tflex TM 600 series thermal gap filler materials, Tflex TM 700 series thermal gap filler materials, etc.
  • Tpcm TM series thermal phase change materials e.g., T
  • the thermal interface material may comprise a compliant gap filler having high thermal conductivity.
  • the thermal interface material may comprise a thermal interface material of Laird, such as one or more of Tflex TM 200, Tflex TM HR200, Tflex TM 300, Tflex TM 300TG, Tflex TM HR400, Tflex TM 500, Tflex TM 600, Tflex TM HR600, Tflex TM SF600, Tflex TM 700, Tflex TM SF800 thermal gap fillers.
  • a thermal interface material of Laird such as one or more of Tflex TM 200, Tflex TM HR200, Tflex TM 300, Tflex TM 300TG, Tflex TM HR400, Tflex TM 500, Tflex TM 600, Tflex TM HR600, Tflex TM SF600, Tflex TM 700, Tflex TM SF800 thermal gap fillers.
  • the thermal interface materials disclosed herein may comprise an elastomer and/or ceramic particles, metal particles, ferrite EMI/RFI absorbing particles, metal or fiberglass meshes in a base of rubber, gel, or wax, etc.
  • the thermal interface materials may include compliant or conformable silicone pads, non-silicone based materials (e.g., non-silicone based gap filler materials, thermoplastic and/or thermoset polymeric, elastomeric materials, etc. ) , silk screened materials, polyurethane foams or gels, thermally-conductive additives, etc.
  • the thermal interface materials may be configured to have sufficient conformability, compliability, and/or softness (e.g., without having to undergo a phase change or reflow, etc.
  • thermal interface materials to closely conform (e.g., in a relatively close fitting and encapsulating manner, etc. ) to a mating surface when placed in contact with (e.g., compressed against, etc. ) the mating surface, including a non-flat, curved, or uneven mating surface.
  • the thermal interface materials disclosed herein may include a soft thermal interface material formed from elastomer and at least one thermally-conductive metal, boron nitride, and/or ceramic filler, such that the soft thermal interface material is conformable even without undergoing a phase change or reflow.
  • the first and/or second thermal interface materials may include ceramic filled silicone elastomer, boron nitride filled silicone elastomer, or a thermal phase change material that includes a generally non-reinforced film.
  • Exemplary embodiments may include one or more thermal interface materials having a high thermal conductivity (e.g., 1 W/mK (Watts per meter per Kelvin) , 1.1 W/mK, 1.2 W/mK, 2.8 W/mK, 3 W/mK, 3.1 W/mK, 3.8 W/mK, 4 W/mK, 4.7 W/mK, 5 W/mK, 5.4 W/mK, 6W/mK, etc. ) depending on the particular materials used to make the thermal interface material and loading percentage of the thermally conductive filler, if any.
  • a high thermal conductivity e.g., 1 W/mK (Watts per meter per Kelvin) , 1.1 W/mK, 1.2 W/mK, 2.8 W/mK, 3 W/mK, 3.1 W/mK, 3.8 W/mK, 4 W/mK, 4.7 W/mK, 5 W/mK, 5.4 W/mK, 6W/mK
  • thermal conductivities are only examples as other embodiments may include a thermal interface material with a thermal conductivity higher than 6 W/mK, less than 1 W/mK, or other values and ranges between 1 and 6 W/mk. Accordingly, aspects of the present disclosure should not be limited to use with any particular thermal interface material as exemplary embodiments may include a wide range of thermal interface materials and other materials (e.g., non-thermally enhanced materials, thermal insulators, dielectric insulation, electrical insulators, electrically-conductive elastomers, EMI absorbers, EMI shielding materials, polymeric materials, adhesive materials, other interface materials, combinations thereof, individual layers thereof, stacked layers thereof, etc. ) .
  • thermal interface materials and other materials e.g., non-thermally enhanced materials, thermal insulators, dielectric insulation, electrical insulators, electrically-conductive elastomers, EMI absorbers, EMI shielding materials, polymeric materials, adhesive materials, other interface materials, combinations thereof, individual layers thereof, stacked layers thereof, etc.
  • the thermal interface materials and/or other materials applied by the systems and methods disclosed herein may include one or more suitable fillers and/or additives added to achieve various desired outcomes.
  • Example fillers include pigments, plasticizers, process aids, flame retardants, extenders, etc.
  • tackifying agents, etc. may be added to increase the tackiness of a thermal interface material or other material, etc.
  • the thermal interface materials and/or other materials applied by the systems and methods disclosed herein may include electromagnetic interference (EMI) or microwave absorbers, electrically-conductive fillers, and/or magnetic particles so as to be operable or usable as an EMI and/or RFI shielding material.
  • EMI electromagnetic interference
  • microwave absorbers electrically-conductive fillers
  • magnetic particles so as to be operable or usable as an EMI and/or RFI shielding material.
  • Examples of which include carbonyl iron, iron silicide, iron particles, iron-chrome compounds, metallic silver, carbonyl iron powder, SENDUST (an alloy containing 85%iron, 9.5%silicon and 5.5%aluminum) , permalloy (an alloy containing about 20%iron and 80%nickel) , ferrites, magnetic alloys, magnetic powders, magnetic flakes, magnetic particles, nickel-based alloys and powders, chrome alloys, and any combinations thereof.
  • the thermal interface materials and/or other materials applied by the systems and methods disclosed herein may include one or more EMI absorbers formed from one or more of the above materials where the EMI absorbers comprise one or more of granules, spheroids, microspheres, ellipsoids, irregular spheroids, strands, flakes, powder, and/or a combination of any or all of these shapes.
  • lids (broadly, parts) including electrically-conductive materials, such as metals (e.g., aluminum, copper, etc. ) , alloys, natural graphite, synthetic graphite, or other suitable materials, etc.
  • electrically-conductive materials such as metals (e.g., aluminum, copper, etc. ) , alloys, natural graphite, synthetic graphite, or other suitable materials, etc.
  • exemplary materials from which the EMI shield or portion thereof may be made include cold rolled steel, nickel-silver alloys, copper-nickel alloys, stainless steel, tin-plated cold rolled steel, tin-plated copper alloys, carbon steel, brass, copper, aluminum, copper-beryllium alloys, phosphor bronze, steel, alloys thereof, a plastic material coated with electrically-conductive material, or any other suitable electrically-conductive and/or magnetic materials.
  • the materials disclosed in this application are provided herein for purposes of illustration only as different materials may be used depending, for example, on the particular application.
  • thermal interface materials and other materials disclosed herein may applied to a wide range of parts or components, including lids or integrated heat spreaders of integrated circuit (IC) packages, board level shields (e.g., a removable lid or cover of a board level shield (BLS) , etc. ) , heat sources (e.g., a central processing unit (CPU) , etc. ) , heat removal/dissipation structures or components (e.g., a heat spreader, a heat sink, a heat pipe, a vapor chamber, a device exterior case or housing, etc. ) , etc. Accordingly, aspects of the present disclosure should not be limited to use with any single type of part or component or limited to application to any specific location or portion of a part or component.
  • IC integrated circuit
  • board level shields e.g., a removable lid or cover of a board level shield (BLS) , etc.
  • heat sources e.g., a central processing unit (CPU) , etc.
  • a portion of a thermal interface material or other material may be removed from a supply and applied to a lid or cover of a board level shield (BLS) .
  • the BLS lid or cover may be integral with or removably attachable to sidewalls of the BLS.
  • the BLS may include sidewalls that are integrally formed with the upper surface, cover, lid, or top of the BLS.
  • the sidewalls and upper surface may be formed by stamping the same electrically-conductive piece of material and then folding the stamped material such that the sidewalls are generally perpendicular to the upper surface.
  • the sidewalls may be made separately and not integrally formed with the upper surface of the BLS.
  • the BLS may comprise a two-piece shield in which the upper surface, cover, lid, or top is removable from and reattachable to the sidewalls.
  • the BLS may include one or more interior walls, dividers, or partitions that are attached to and/or integrally formed with the BLS.
  • the BLS cover, sidewalls, and interior walls may cooperatively define a plurality of individual EMI shielding compartments.
  • multiple material portions may be removed (e.g., pushed, pressed, tamped, removed, severed, torn, cut, blown, etc. ) from one or more supplies (e.g., one or more rolls, reels, or tapes of one or more of the same, different, and/or multilayered materials, etc. ) and applied to either or both sides of the components or substrates.
  • one or more supplies e.g., one or more rolls, reels, or tapes of one or more of the same, different, and/or multilayered materials, etc.
  • multiple different portions of the same thermal interface material may be removed from a single supply of the thermal interface material and applied along the lower or inner side of a BLS lid or cover (or other component) .
  • the multiple different portions may be removed and applied from the single supply separately (e.g., sequentially, successively, consecutively, etc.
  • multiple different portions of the same thermal interface material (or other material) may be removed and applied from different supplies separately or simultaneously.
  • multiple different portions of different materials may be removed and applied from different supplies of the different materials separately or simultaneously.
  • the multiple different portions may be adjacent (e.g., abutting, in contact, etc. ) or spaced apart from each other along the BLS lid or cover. Additionally, or alternatively, the multiple different portions may be stacked on top of each other along the lower or inner side of a BLS lid or cover.
  • the TIM or other material portions applied along an inner side of a BLS lid or cover may have the same thickness or different thicknesses to accommodate for varying heights of the devices, components, etc., that will be under the BLS.
  • the TIM or other material portions applied along an outer side of the BLS lid or cover may also have the same thickness or different thicknesses to accommodate for varying thicknesses of the heat spreader, heat sink, other heat removal/dissipation structures, etc.
  • the supply of material may comprise a single roll, reel, tape, or other supply of a single layer of material or a multilayered material.
  • the supply of material may comprise multiple rolls, reels, tapes, or other supplies of a single layer of material, which material may be the same or different for the multiple supplies.
  • the supply of material may comprise multiple rolls, reels, tapes, or other supplies of a multilayered material, which multilayered material may be the same or different for the multiple supplies.
  • the supply of material may comprise at least one roll, reel, tape, or other supply of a single layer of material and at least one roll, reel, tape, or other supply of a multilayered material.
  • the supply of material may comprise a supply (e.g., carrier tape, etc. ) having pockets or cavities in which are positioned the material portions (e.g., portions of the TIM or other material, etc. ) to be applied (e.g., blown out from within the pockets, mechanically removed with pick-n-place equipment, etc. ) .
  • portions from the one or more supplies of materials may be removed and applied separately (e.g., sequentially, successively, consecutively, etc. ) or simultaneously.
  • a system may be used for removing portions of a material (e.g., TIM, etc. ) from a supply (e.g., reel, roll, tape, etc. ) and applying or transferring the material portions to components.
  • a material e.g., TIM, etc.
  • the system may cut the material portions from the supply, which cutting process may also transfer the cut material portions to the components.
  • the system may shape and/or size the material portions, which shaping and/or sizing process may also transfer the shaped and/or sized material portions to the components.
  • the system may deform the material portions, which deforming process may also transfer the deformed material portions to the components.
  • the system may imprint and tear the material portions, which process may also transfer the material portions to the components.
  • Example embodiments disclosed herein may be used with a wide range of heat sources, electronic devices, and/or heat removal/dissipation structures or components (e.g., a heat spreader, a heat sink, a heat pipe, a device exterior case or housing, etc. ) .
  • a heat source may comprise one or more heat generating components or devices (e.g., a CPU, die within underfill, semiconductor device, flip chip device, graphics processing unit (GPU) , digital signal processor (DSP) , multiprocessor system, integrated circuit, multi-core processor, etc. ) .
  • a heat source may comprise any component or device that has a higher temperature than the thermal interface material or otherwise provides or transfers heat to the thermal interface material regardless of whether the heat is generated by the heat source or merely transferred through or via the heat source. Accordingly, aspects of the present disclosure should not be limited to any particular use with any single type of heat source, electronic device, heat removal/dissipation structure, etc.
  • Exemplary embodiments may provide one or more (but not necessarily any or all) of the following features or advantages, such as the elimination of tabs and reduced costs as compared to some conventional phase change material (PCM) application processes having tabbed parts that add high cost. Exemplary embodiments may help solve problems such as issues that customers have in applying tabbed parts correctly, issues with liner release, limitations on part configuration, shape and size, difficulty in a keeping material clean during additional steps after forming in a clean room, and/or shipping tabbed parts without distortion. Exemplary embodiments disclosed herein may allow a standard material (e.g., standard width, thickness, and/or length, etc. ) to be provided, which may then be used with different dies that can be changed as needed for various shapes and sizes.
  • a standard material e.g., standard width, thickness, and/or length, etc.
  • Exemplary embodiments disclosed herein may provide a relatively simple forming design from pot to finished rolls, may provide a compact process and smaller clean room requirements (Type 2) , may only require limited work-in-progress (WIP) dollars, may allow for a relatively simple/smaller part numbers list, thickness of PCM and width, may allow for a wide variety of die shapes and parts (e.g., FIG. 3, etc. ) that are not feasible in tabbed format cost effectively, may allow the smallest size providable to become a non-issue (e.g., FIG. 3, etc. ) , may allow liner release variance issues to be less of an issue, and/or may allow extrusion screened “clean” material to stay between liners until applied to lid.
  • the TIM may be applied quickly and without distortion or trapped air, and the parts may be clean without pump out.
  • Example embodiments are provided so that this disclosure will be thorough, and will fully convey the scope to those who are skilled in the art. Numerous specific details are set forth such as examples of specific components, devices, and methods, to provide a thorough understanding of embodiments of the present disclosure. It will be apparent to those skilled in the art that specific details need not be employed, that example embodiments may be embodied in many different forms, and that neither should be construed to limit the scope of the disclosure. In some example embodiments, well-known processes, well-known device structures, and well-known technologies are not described in detail.
  • parameter X may have a range of values from about A to about Z.
  • disclosure of two or more ranges of values for a parameter subsume all possible combination of ranges for the value that might be claimed using endpoints of the disclosed ranges.
  • parameter X is exemplified herein to have values in the range of 1 –10, or 2 –9, or 3 –8, it is also envisioned that Parameter X may have other ranges of values including 1 –9, 1 –8, 1 –3, 1 -2, 2 –10, 2 –8, 2 –3, 3 –10, and 3 –9.
  • the term “about” as used herein when modifying a quantity of an ingredient or reactant of the invention or employed refers to variation in the numerical quantity that can happen through typical measuring and handling procedures used, for example, when making concentrates or solutions in the real world through inadvertent error in these procedures; through differences in the manufacture, source, or purity of the ingredients employed to make the compositions or carry out the methods; and the like.
  • the term “about” also encompasses amounts that differ due to different equilibrium conditions for a composition resulting from a particular initial mixture. Whether or not modified by the term “about” , the claims include equivalents to the quantities.
  • first, second, third, etc. may be used herein to describe various elements, components, regions, layers and/or sections, these elements, components, regions, layers and/or sections should not be limited by these terms. These terms may be only used to distinguish one element, component, region, layer or section from another region, layer or section. Terms such as “first, ” “second, ” and other numerical terms when used herein do not imply a sequence or order unless clearly indicated by the context. Thus, a first element, component, region, layer or section discussed below could be termed a second element, component, region, layer or section without departing from the teachings of the example embodiments.
  • spatially relative terms such as “inner, ” “outer, ” “beneath” , “below” , “lower” , “above” , “upper” and the like, may be used herein for ease of description to describe one element or feature’s relationship to another element (s) or feature (s) as illustrated in the figures.
  • Spatially relative terms may be intended to encompass different orientations of the device in use or operation in addition to the orientation depicted in the figures. For example, if the device in the figures is turned over, elements described as “below” or “beneath” other elements or features would then be oriented “above” the other elements or features.
  • the example term “below” can encompass both an orientation of above and below.
  • the device may be otherwise oriented (rotated 90 degrees or at other orientations) and the spatially relative descriptors used herein interpreted accordingly.

Landscapes

  • Engineering & Computer Science (AREA)
  • Manufacturing & Machinery (AREA)
  • Computer Hardware Design (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Power Engineering (AREA)
  • Moulds For Moulding Plastics Or The Like (AREA)
  • Cooling Or The Like Of Semiconductors Or Solid State Devices (AREA)
  • Non-Metallic Protective Coatings For Printed Circuits (AREA)
  • Application Of Or Painting With Fluid Materials (AREA)
  • Detergent Compositions (AREA)

Abstract

La présente invention concerne des systèmes pour appliquer des matériaux (par exemple, un matériau d'interface thermique, un autre matériau, etc.) à partir d'une alimentation (par exemple, un rouleau, une bobine, une bande, etc.) du matériau sur un composant, un substrat, une partie, une plaque, un autre matériau, ou une autre surface cible. Dans des modes de réalisation donnés à titre d'exemple, le système comprend un outil (par exemple, un rouleau, un dispositif de laminage, etc.) configuré pour être mobile par rapport à une alimentation en un matériau destiné à positionner une partie du matériau provenant de l'alimentation le long d'un composant (ou d'une autre surface cible), et ainsi forcer, comprimer, ou retirer des poches d'air et/ou des bulles de la partie du matériau lorsque l'outil est déplacé relativement le long de la partie du matériau.
PCT/CN2020/072710 2020-01-17 2020-01-17 Systèmes pour appliquer des matériaux sur des composants Ceased WO2021142766A1 (fr)

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CN202020367356.XU CN211937670U (zh) 2020-01-17 2020-03-20 用于将材料涂敷到部件的系统
CN202010201132.6A CN113134459B (zh) 2020-01-17 2020-03-20 用于将材料涂敷到部件的系统
TW110101698A TWI777370B (zh) 2020-01-17 2021-01-15 用於將材料塗敷到部件的系統

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WO2021142766A1 (fr) * 2020-01-17 2021-07-22 Tianjin Laird Technologies Limited Systèmes pour appliquer des matériaux sur des composants
CN112813482B (zh) * 2020-12-30 2021-11-02 泉芯集成电路制造(济南)有限公司 芯片电镀系统及芯片电镀控制方法
CN113716091B (zh) * 2021-11-01 2022-01-07 深圳中科四合科技有限公司 一种正方形封装器件的排布转置装置和方法

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TWI777370B (zh) 2022-09-11
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CN211937670U (zh) 2020-11-17
CN113134459A (zh) 2021-07-20

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