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WO2021085303A1 - Corps moulé en résine pour dispositif semi-conducteur optique, et dispositif semi-conducteur optique - Google Patents

Corps moulé en résine pour dispositif semi-conducteur optique, et dispositif semi-conducteur optique Download PDF

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Publication number
WO2021085303A1
WO2021085303A1 PCT/JP2020/039748 JP2020039748W WO2021085303A1 WO 2021085303 A1 WO2021085303 A1 WO 2021085303A1 JP 2020039748 W JP2020039748 W JP 2020039748W WO 2021085303 A1 WO2021085303 A1 WO 2021085303A1
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WIPO (PCT)
Prior art keywords
optical semiconductor
semiconductor device
resin molded
recess
molded body
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Ceased
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PCT/JP2020/039748
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English (en)
Japanese (ja)
Inventor
裕之 平川
山本　康雄
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Daicel Corp
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Daicel Corp
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Filing date
Publication date
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Publication of WO2021085303A1 publication Critical patent/WO2021085303A1/fr
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    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L23/00—Details of semiconductor or other solid state devices
    • H01L23/28—Encapsulations, e.g. encapsulating layers, coatings, e.g. for protection
    • H01L23/29—Encapsulations, e.g. encapsulating layers, coatings, e.g. for protection characterised by the material, e.g. carbon
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L23/00—Details of semiconductor or other solid state devices
    • H01L23/28—Encapsulations, e.g. encapsulating layers, coatings, e.g. for protection
    • H01L23/31—Encapsulations, e.g. encapsulating layers, coatings, e.g. for protection characterised by the arrangement or shape
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10H—INORGANIC LIGHT-EMITTING SEMICONDUCTOR DEVICES HAVING POTENTIAL BARRIERS
    • H10H20/00—Individual inorganic light-emitting semiconductor devices having potential barriers, e.g. light-emitting diodes [LED]
    • H10H20/80—Constructional details
    • H10H20/85—Packages
    • H10H20/855—Optical field-shaping means, e.g. lenses
    • H10H20/856—Reflecting means

Definitions

  • the present disclosure relates to a resin molded body used in an optical semiconductor device including an optical semiconductor element such as a light emitting diode, and an optical semiconductor device including the resin molded body.
  • the present application claims the priority of Japanese Patent Application No. 2019-195431 filed in Japan on October 28, 2019, the contents of which are incorporated herein by reference.
  • Optical semiconductor devices equipped with optical semiconductor elements have a longer life, stable operation, and faster response speed than other light sources such as light bulbs, fluorescent lamps, neon tubes, and halogen lamps. It has features such as that.
  • Such optical semiconductor devices are being put into practical use in various applications. For example, it is used for lighting (general indoor lighting in homes and offices, street lights, etc.), display applications (traffic lights, etc.), light source applications (backlights of LCD TVs, etc.), and communication applications (infrared remote controls, etc.).
  • Such an optical semiconductor device is described in, for example, Patent Document 1 below.
  • optical semiconductor devices There are various designs of optical semiconductor devices, and even optical semiconductor devices of the same external size are required to have a design that obtains brighter luminosity.
  • optical semiconductor device there is a large loss in extracting light, and the current situation is that the luminous intensity inherent in the optical semiconductor element cannot be fully utilized.
  • the conventional optical semiconductor device has a problem that a part of the light emitting surface becomes dark, that is, there is a so-called dead space, and the brightness is not uniform. This tendency becomes remarkable as the optical semiconductor device becomes larger. It's coming. In recent years, even on the surface of a larger optical semiconductor device, there is a demand for more uniform brightness by reducing dead space.
  • the present disclosure has been conceived under the above circumstances, and its purpose is to be used in an optical semiconductor device for reducing light loss to emit brighter and more uniform light. It is an object of the present invention to provide a resin molded body for an optical semiconductor device, and an optical semiconductor device including the resin molded body for the optical semiconductor device.
  • the inventors of the present disclosure have limited the path of reflected light in the optical semiconductor device as the main cause of light loss and dead space in the optical semiconductor device.
  • the collision between the reflected lights increased and the light was attenuated (disappeared).
  • the design of the resin molded body used in the optical semiconductor device the light is uniformly reflected throughout the optical semiconductor device, the collision between the reflected lights is reduced, the light is brighter, and the dead space is minimized. I found a design that can obtain more uniform light.
  • the invention of the present disclosure has been completed based on these findings.
  • one embodiment of the present disclosure is a resin molded body for an optical semiconductor device. It has front and back surfaces that face opposite to each other in the thickness direction.
  • the front surface has a recess recessed from the opening toward the back surface.
  • the recess has n reflective surfaces (n represents an integer of 5 or more) and a bottom surface on the inner wall.
  • the shape of the opening of the recess is a substantially n-sided polygon (n is the same integer as n) that satisfies the following conditions (1) and (2).
  • All internal angles of the substantially n-sided polygon are obtuse angles.
  • All sides of the substantially n-sided polygon are not parallel to each other.
  • a resin molded product for an optical semiconductor device wherein the shape formed by an arbitrary surface parallel to the opening and the inner wall of the recess is a substantially n-sided shape substantially similar to the opening of the recess.
  • the bottom surface of the recess may be a substantially n-sided polygon that is substantially similar to the opening of the recess.
  • the area of the opening of the recess is preferably larger than the area of the bottom surface of the recess.
  • the area of the shape formed by an arbitrary surface parallel to the opening and the side surface of the recess gradually decreases from the opening of the recess to the bottom surface.
  • the first lead has a first exposed surface that forms a part of the bottom surface of the recess, and is exposed on a side opposite to the first exposed surface.
  • the first lead and the second lead may each have an electrode portion extending to the outside from the resin molded body for the optical semiconductor device.
  • an optical semiconductor device and the like.
  • the resin molded body is the resin molded body for an optical semiconductor device.
  • the optical semiconductor device provides an optical semiconductor device mounted on the first exposed surface of the first lead and connected to the third exposed surface of the second lead via a bonding wire.
  • the optical semiconductor element may be connected to a substantially central portion of the bottom surface of the recess.
  • the optical semiconductor device including the resin molded body reflects light uniformly throughout the optical semiconductor device and collides with each other. Is less and brighter, and dead space is minimized to obtain more uniform light.
  • FIG. 1 It is a perspective view (schematic diagram) of the resin molded body for an optical semiconductor device which concerns on one Embodiment of this disclosure. It is a top view (schematic view) of the resin molded body for an optical semiconductor device shown in FIG. It is sectional drawing (schematic diagram) along the line XX'in the resin molded article for an optical semiconductor device shown in FIG. It is a top view (schematic view) of the resin molded article for an optical semiconductor device which concerns on other embodiments of this disclosure. It is sectional drawing (schematic diagram) along the line YY'in the resin molded body for an optical semiconductor device shown in FIG. It is a back view (schematic view) of the resin molded body for an optical semiconductor device shown in FIG.
  • FIG. 7 is a cross-sectional view (schematic diagram) along the line ZZ'in the optical semiconductor device shown in FIG. 7. It is a top view (schematic diagram) of one conventional optical semiconductor device. It is sectional drawing (schematic diagram) along the line VV'in the optical semiconductor device shown in FIG. It is explanatory drawing about the reflected light in the conventional optical semiconductor device.
  • 9 and 10 show a schematic view of an optical semiconductor device 100 which is an example of a conventional optical semiconductor device
  • FIG. 9 is a plan view from above
  • FIG. 10 is a line V in the optical semiconductor device shown in FIG. It is sectional drawing along-V'.
  • the optical semiconductor device 100 is formed in the form of a so-called mold array package (MAP), and includes a resin molded body 110, a set of leads 120 and 130, an LED element 140 which is a light emitting diode, and a transparent resin.
  • MAP mold array package
  • the resin molded body 110 is a resin body molded in a form of holding the leads 120 and 130 by so-called insert molding accompanied by the leads 120 and 130, and has a recess 112 whose concave shape is defined by an inclined surface 111. At least the inclined surface 111 of the resin molded body 110 is imparted with light reflectivity according to a predetermined embodiment.
  • the LED element 140 is electrically and mechanically connected to the reed 120 in the recess 112. At the same time, the LED element 140 is electrically connected to the lead 130 via the bonding wire 160.
  • the transparent resin portion 150 is a transparent resin body that is filled and cured in the recess 112 of the resin molded body 110, and seals the LED element 140 and the like in the recess 112. When the leads 120 and 130 are energized from the external electrodes 120a and 130a, the LED element 140 emits light. The light passes through the transparent resin portion 150 and is emitted to the outside from the recess 112 of the optical semiconductor device 100
  • the optical semiconductor device 100 having such a configuration, light is sterically emitted from the LED element 140 in all directions. Some light goes out of the recess 112 directly from the upper opening of the recess 112, but most of the light goes out of the recess 112 while repeating reflection on a reflecting surface such as an inclined surface 111 inside the recess 112. At that time, when the reflected light collides with each other inside the recess 112, the light is attenuated (disappeared), the amount of light emitted from the opening is reduced, and the illuminance is reduced.
  • FIG. 1 to 3 are schematic views showing a resin molded body 1 for an optical semiconductor device according to an embodiment of the present disclosure.
  • FIG. 1 is a perspective view of the resin molded body 1 for an optical semiconductor device according to the embodiment
  • FIG. 2 is a plan view of the resin molded body 1 for an optical semiconductor device.
  • FIG. 3 is a cross-sectional view of the resin molded body 1 for an optical semiconductor device along the dotted line XX'of FIG.
  • the resin molded body 1 for an optical semiconductor device is not particularly limited as long as it is used in the manufacture of an optical semiconductor device, but is preferably a resin molded body constituting a substrate of the optical semiconductor device, and faces opposite sides in the thickness direction. It has a front surface 10 and a back surface 11.
  • the substrate of an optical semiconductor device means a plate-like object for mounting a constituent member such as an optical semiconductor element described later.
  • the front surface 10 and the back surface 11 are, in principle, flat surfaces except for the case specified in the present disclosure (for example, the recess 13 described later), but other uneven shapes and the like can be provided as long as the effects of the present disclosure are not impaired. You may have.
  • the resin molded body 1 for an optical semiconductor device is molded by, for example, an insert molding method.
  • a resin molded product 1 for a semiconductor device is made of, for example, a thermosetting resin composition containing a white pigment.
  • the thermosetting resin include epoxy resins.
  • the white pigment blended in the thermosetting resin include titanium oxide, alumina, zinc oxide, magnesium oxide, antimony oxide, and zirconium oxide.
  • Examples of commercially available products of the resin material for forming the resin molded body 1 for semiconductor devices include "AEW-700" manufactured by Daicel Corporation.
  • the resin molded body 1 for an optical semiconductor device has a recess 13 recessed from an opening 12 toward a back surface 11 on the front surface 10.
  • the recess 13 constitutes a reflector opening of the optical semiconductor device, and has n reflective surfaces (n represents an integer of 5 or more) and a bottom surface 15 on the inner wall.
  • the reflective surface 14 and the bottom surface 15 of the recess 13 define the concave shape of the recess 13.
  • n reflective surfaces are formed so that the concave shape spreads from the bottom 15 to the opening 12 of the recess 13. 14 is tilted.
  • the reflective surface 14 is, for example, imparted with light reflectivity by the resin body containing the above-mentioned white pigment.
  • a flat surface is preferable, but it may have a fine uneven shape as long as the light reflectivity is not impaired.
  • the surface of the bottom surface 15 of the recess 13 where the resin body is exposed may also have light reflectivity.
  • the number of reflecting surfaces 14 existing on the inner wall of the recess 13 is not particularly limited as long as it is 5 or more, but it is preferable from the viewpoint of reducing collisions between reflected lights and improving brightness and light uniformity. 6 or more, more preferably 7 or more, more preferably 8 or more, more preferably 9 or more, more preferably 10 or more, more preferably 11 or more, more preferably 12 or more, still more preferable. Is 13 or more, and even more preferably 14 or more.
  • the number of reflecting surfaces 14 is not particularly limited, but is preferably 30 or less, more preferably 25 or less, and even more preferably 20 or less, from the viewpoint of design and ease of manufacture of the optical semiconductor device.
  • the n reflecting surfaces 14 may include the same (joint) shape, or may all have different shapes. From the viewpoint of reducing collisions between reflected lights and improving brightness and light uniformity, it is preferable that they all have different shapes.
  • the shape of the opening 12 of the recess 13 (that is, the shape of the opening end of the recess 13) is a substantially n-sided polygon that satisfies the following conditions (1) and (2).
  • All internal angles of the substantially n-sided polygon are obtuse angles (hereinafter referred to as condition (1)).
  • condition (2) All sides of the substantially n-sided polygon are not parallel to each other (hereinafter, referred to as condition (2)).
  • the shape 16 formed by an arbitrary surface parallel to the opening 12 and the inner wall of the recess 13 is a substantially n-sided shape substantially similar to the opening 12 of the recess 13.
  • the arbitrary surface parallel to the opening 12 is a virtual surface for cutting the resin molded body 1 for a semiconductor device in the horizontal direction with the opening 12, and the shape 16 is a line at which the surface and the inner wall of the recess 13 intersect. It is a configured shape.
  • the substantially n-sided polygon whose shape 16 is substantially similar to the opening 12 is intended to include the case where the shape 16 is similar to the opening 12 and the case where the shape 16 is close to the similar shape to the opening 12.
  • the shape 16 is similar to the opening 12, for example, the opening 12 is an n-sided polygon, the shape 16 is a similar figure to the n-sided polygon, and all or part of the corners are rounded.
  • the purpose includes the case where the shape 16 is an n-sided polygon and the opening 12 is a similar figure of the n-sided polygon, and refers to a shape in which all or a part of the corners are rounded.
  • the opening 12 and the shape 16 have a substantially n-sided relationship with each other, it is defined that the conditions (1) and (2) are satisfied on the entire surface of the n reflecting surfaces 14. It is a thing.
  • the internal angle is the angle formed by the extension lines of the adjacent sides of the substantially n-sided polygon.
  • All internal angles of the approximately n-sided polygon are not particularly limited as long as they exceed 90 ° and are less than 180 °, but are preferably 95 from the viewpoint of reducing collisions between reflected lights and improving brightness and light uniformity. ° or more, more preferably 100 ° or more, more preferably 110 ° or more, more preferably 120 ° or more, more preferably 130 ° or more, more preferably 140 ° or more, more preferably 150 ° or more, still more preferably 160 °. That is all.
  • the condition (2) defines that all the sides of the substantially n-sided polygon defining the opening 12 and the shape 16 are not parallel to each other. According to the condition (2), the collision of the light reflected by the two reflecting surfaces 14 facing each other in the recess 13 can be minimized. Therefore, as long as the condition (2) is satisfied, the collision between the reflected lights is reduced, and the brightness and the uniformity of the light can be improved.
  • the substantially n-sided shape defining the opening 12 and the shape 16 may have a symmetrical shape or an asymmetrical shape as long as the above conditions (1) and (2) are satisfied, but the reflected light may be of each other. Asymmetry is preferred from the standpoint of reducing collisions and improving brightness and light uniformity.
  • the bottom surface 15 of the recess 13 has a substantially n-sided shape that is substantially similar to the opening 12 of the recess 13.
  • the meaning of "a substantially n-sided polygon having a substantially similar figure" is the same as described above.
  • the area of the opening 12 of the recess 13 is preferably larger than the area of the bottom surface 15 of the recess 13.
  • the area of the shape 16 gradually decreases from the opening 12 of the recess 13 to the bottom surface 15.
  • the preferred embodiment defines an embodiment in which n reflecting surfaces 14 are inclined so that the concave shape spreads from the bottom surface 15 of the recess 13 to the opening 12. According to the preferred embodiment, the light is easily reflected upward, the collision between the reflected lights can be reduced, and the brightness and the uniformity of the light can be improved.
  • FIG. 4 to 6 are schematic views showing a resin molded body 2 for an optical semiconductor device according to another embodiment of the present disclosure.
  • FIG. 4 is a plan view of the resin molded body 2 for an optical semiconductor device according to the embodiment
  • FIG. 5 is a cross-sectional view of the resin molded body 2 for an optical semiconductor device along the dotted line YY'of FIG.
  • FIG. 6 is a back view of the resin molded body 2 for an optical semiconductor device.
  • the resin molded body 2 for an optical semiconductor device is integrated (integrally molded) with a first lead 21 and a second lead 22 which are separated from each other from the resin molded body 1 for a semiconductor device. That is, the resin molded body 2 for an optical semiconductor device is a resin body formed by, for example, insert molding while partially incorporating the first lead 21 and the second lead 22 inside. In the resin molded body 2 for an optical semiconductor device, the first lead 21 and the second lead 22 form a pair of terminals for external connection in the optical semiconductor device.
  • the lead 21 faces the recess 13 of the resin molded body 2 for an optical semiconductor device and forms a part of the bottom surface 15 of the recess 13 (the first exposed surface). ), And has an exposed surface 21b (second exposed surface) exposed on the side opposite to the recess 13. Further, the lead 21 has an electrode portion 21c extending to the outside from the resin molded body 2 for an optical semiconductor device.
  • the extending length of the electrode portion 21c from the resin molded body 2 for an optical semiconductor device is, for example, 0.1 to 2 mm. In such an embodiment, the lead 21 is partially covered and held by the resin molded body 2 for an optical semiconductor device.
  • the reed 22 (second reed) faces the exposed surface 22a (the exposed surface 22a) facing the recess 13 at a position separated from the exposed surface 21a on the bottom surface 15 of the recess 13 of the resin molded body 2 for an optical semiconductor device. It has an exposed surface 22b (fourth exposed surface) that has a third exposed surface) and is exposed on the side opposite to the recess 13. Further, the lead 22 has an electrode portion 22c extending to the outside from the resin molded body 2 for an optical semiconductor device. The extending length of the electrode portion 22c from the resin molded body 2 for an optical semiconductor device is, for example, 0.1 to 2 mm. In such an embodiment, the reed 22 is held while being partially covered by the resin molded body 2 for an optical semiconductor device.
  • the area of the electrodes (exposed surface 21a, exposed surface 21b, exposed surface 22a, exposed surface 22b, etc.) can be increased, so that heat can be easily released and thermal resistance can be increased. It is preferable because it can be made smaller.
  • the lead 21 and the lead 22 are each made of a conductive metal material.
  • the metal material for the reed include Cu, Cu alloy, and 42% Ni—Fe alloy.
  • the thickness of the lead 21 and the lead 22 is, for example, 0.1 to 0.3 mm, respectively.
  • Such leads 21 and 22 can be formed, for example, by etching or punching a metal plate.
  • the surfaces of the leads 21 and the leads 22 may be subjected to a predetermined plating treatment such as an Ag plating treatment.
  • the area of the exposed surface 21a and the exposed surface 22a in the recess 13 of the lead 21 and the lead 22 is preferably 50% or more, more preferably 50% or more of the area of the bottom surface 15 in the recess 13. Is 60% or more, more preferably 70% or more, still more preferably 80% or more, still more preferably 85% or more.
  • the area of the exposed surface 21a and the exposed surface 22a is preferably 95% or less, more preferably 90% or less of the area of the bottom surface 15 in the recess 13.
  • Such a configuration is suitable for sufficiently separating the exposed surface 21a and the exposed surface 22a and securing an area of a region having light reflectivity on a part of the bottom surface 15 of the recess 13, and by extension, an optical semiconductor. It is suitable for achieving high light utilization efficiency in the device.
  • Such a resin molded body 2 for an optical semiconductor device is manufactured by, for example, the following so-called line molding method.
  • a predetermined lead frame is prepared.
  • This lead frame has a rectangular frame in a plan view and a pattern portion having a predetermined pattern shape for each optical semiconductor device forming area arranged in a row in the frame.
  • the pattern portion includes a lead portion that forms the lead 21 and the lead 22 described above, a connecting portion that connects the lead portion and the frame body, and a connecting portion that connects the lead portions.
  • Such a lead frame can be manufactured, for example, by etching.
  • the above-mentioned resin molded body 2 for an optical semiconductor device is formed for each optical semiconductor device forming area of the lead frame.
  • the lead frame is interposed in a set of molds having a molding surface for collectively molding a plurality of resin molded bodies 2 for an optical semiconductor device over a plurality of optical semiconductor device forming areas in the lead frame.
  • the above-mentioned thermosetting resin composition containing a white pigment for forming a resin molded body 2 for an optical semiconductor device is supplied into a mold and molded under predetermined temperature and pressure conditions. (Insert molding).
  • the resin molded body 2 for an optical semiconductor device having the above-mentioned recess 13 is formed in each optical semiconductor device forming area.
  • the molding method for example, transfer molding or injection molding is adopted.
  • FIG. 7 and 8 are schematic views showing the optical semiconductor device 3 according to the embodiment of the present disclosure.
  • FIG. 7 is a plan view of the optical semiconductor device 3 according to the embodiment
  • FIG. 8 is a cross-sectional view of the optical semiconductor device 3 along the dotted line ZZ'of FIG.
  • the optical semiconductor device 3 includes an optical semiconductor element 31 and a resin molded body 2 for an optical semiconductor device, the optical semiconductor element 31 is mounted on the exposed surface 21a of the lead 21, and the exposed surface of the lead 22. It is connected to 22a via a bonding wire 32.
  • the recess 13 of the optical semiconductor element 31 may be sealed with the transparent resin portion 33.
  • the optical semiconductor device 3 is formed in the form of a so-called mold array package (MAP).
  • MAP mold array package
  • the optical semiconductor element 31 is an element having a light emitting function, and is specifically a light emitting diode (LED) element in the present embodiment.
  • Examples of the semiconductor material for forming the LED element include GaAlAs, AlInGaP, InGaN, GaP, GaAs, and GaAsP.
  • the optical semiconductor element 31 has electrode portions (not shown) on the upper surface side and the lower surface side in FIG. 8, respectively.
  • the transparent resin portion 33 is a transparent resin body that is filled and cured in the recess 13 of the optical semiconductor device 3, and is made of a transparent sealing material for semiconductors.
  • a sealing material include an epoxy-based sealing material and a silicone-based sealing material.
  • examples of commercially available epoxy-based encapsulants include “CELVENUS W0973” and “CELVENUS W0925” manufactured by Daicel Corporation.
  • examples of commercially available silicone-based encapsulants include "CELVENUS A2045" and "CELVENUS A0246" manufactured by Daicel Corporation.
  • Such an optical semiconductor device 3 is manufactured by the above-mentioned line mold method.
  • the resin molded body 2 for an optical semiconductor device is manufactured by the above method.
  • the optical semiconductor element 31 is mounted via the conductive bonding material on the above-mentioned exposed surface 21a of the lead 21, and the above-mentioned exposed surface of the optical semiconductor element 31 and the lead 22. It undergoes wire bonding with 22a and formation of the above-mentioned transparent resin portion 33 by, for example, potting.
  • the lead 21 and the lead 22 are separated by cutting the above-mentioned connecting portion of the pattern portion in the lead frame for each optical semiconductor device forming area, and the optical semiconductor device 3 is isolated.
  • the optical semiconductor device 3 can be manufactured as described above.
  • the optical semiconductor device 3 When the optical semiconductor device 3 is driven, a predetermined electric power is supplied to the optical semiconductor element 31 via the lead 21 and the lead 22, whereby the optical semiconductor element 31 emits light. A part of the light emitted from the optical semiconductor element 31 is reflected in the recess 13 of the resin molded body 2 for the optical semiconductor device, and the other part of the light emitted from the optical semiconductor element 31 is reflected in the recess 13. It passes through the transparent resin portion 33 and is emitted to the outside of the recess 13 without passing through.
  • the optical semiconductor device 3 of the present embodiment is suitable in that it can reduce collisions between reflected lights and improve brightness and light uniformity.
  • the optical semiconductor element 31 is preferably connected to a substantially central portion of the bottom surface 15 of the recess 13. This configuration is preferable from the viewpoint that the light emitted from the optical semiconductor element 31 is uniformly reflected by the n reflecting surfaces 14, the collision between the reflected lights is reduced, and the brightness and the uniformity of the light are improved.
  • optical semiconductor element 31 is connected to a substantially central portion of the bottom surface 15 is intended to be arranged so that the center (center of gravity) of the bottom surface 15 and at least a part of the entire surface of the optical semiconductor element 31 overlap. It is more preferable to arrange the optical semiconductor element 31 so that the center (center of gravity) and the center (center of gravity) of the bottom surface 15 coincide with each other.
  • the substantially n-sided shape defining the opening 12 and the shape 16 satisfies the above conditions (1) and (2), thereby satisfying the optical semiconductor.
  • the light emitted from the element 31 is repeatedly reflected very complicatedly by the n reflecting surfaces 14 and is emitted to the outside of the recess 13. Therefore, the attenuation (loss) due to the collision of the reflected light is minimized, and brighter light is emitted. Further, the reflected light spreads to every corner inside the recess 13 and is emitted as uniform light without dead space.
  • a resin molded product for an optical semiconductor device It has front and back surfaces that face opposite to each other in the thickness direction.
  • the front surface has a recess recessed from the opening toward the back surface.
  • the recess has n reflective surfaces (n represents an integer of 5 or more) and a bottom surface on the inner wall.
  • the shape of the opening of the recess is a substantially n-sided polygon (n is the same integer as n) that satisfies the following conditions (1) and (2).
  • All internal angles of the substantially n-sided polygon are obtuse angles.
  • All sides of the substantially n-sided polygon are not parallel to each other.
  • a resin molded product for an optical semiconductor device wherein the shape formed by an arbitrary surface parallel to the opening and the inner wall of the recess is a substantially n-sided shape substantially similar to the opening of the recess.
  • the thermosetting resin is an epoxy resin.
  • the white pigment is selected from the group consisting of titanium oxide, alumina, zinc oxide, magnesium oxide, antimony oxide, and zirconium oxide. ..
  • n is an integer of 6 or more (for example, 7 or more, 8 or more, 9 or more, 10 or more, 11 or more, 12 or more, 13 or more, or 14 or more).
  • [6] The resin molded product for an optical semiconductor device according to any one of [1] to [5] above, wherein n is an integer of 30 or less (for example, 25 or less or 20 or less).
  • n is an integer of 30 or less (for example, 25 or less or 20 or less).
  • All internal angles of the substantially n-sided polygon are 95 ° or more (for example, 100 ° or more, 110 ° or more, 120 ° or more, 130 ° or more, 140 ° or more, 150 ° or more, or 160 ° or more).
  • the resin molded product for an optical semiconductor device according to any one of the above [1] to [12], which is integrated with the first reed and the second reed that are separated from each other.
  • the first lead has a first exposed surface that forms a part of the bottom surface of the recess of the resin molded body for an optical semiconductor device, and is on a side opposite to the first exposed surface.
  • Has a second exposed surface that is exposed The second lead forms a part of the bottom surface of the recess of the resin molded body for an optical semiconductor device, has a third exposed surface separated from the first exposed surface, and has the third exposed surface.
  • the resin molded product for an optical semiconductor device according to the above [13] which has a fourth exposed surface exposed on the opposite side to the above.
  • the areas of the first exposed surface and the third exposed surface in the recesses of the first lead and the second lead are 95% or less (for example, 90% or less) of the area of the bottom surface in the recesses.
  • Optical semiconductor devices and With a resin molded body The resin molded product is the resin molded product for an optical semiconductor device according to any one of [14] to [20].
  • optical semiconductor device [23] The optical semiconductor device according to the above [22], wherein the transparent resin portion is formed of an epoxy-based encapsulant or a silicone-based encapsulant.
  • the optical semiconductor element is a light emitting diode (LED) element.
  • the semiconductor material for forming the light emitting diode (LED) element is at least one selected from the group consisting of GaAlAs, AlInGaP, InGaN, GaP, GaAs, and GaAsP. ].
  • the resin molded body for an optical semiconductor device according to any one of the above.
  • optical semiconductor device any one of [21] to [25], wherein the optical semiconductor element is connected to a substantially central portion of the bottom surface of the recess.
  • the resin molded body for an optical semiconductor device and the optical semiconductor device of the present disclosure are used for lighting (general indoor lighting in homes and offices, street lights, etc.), display applications (traffic signals, etc.), and light source applications (backlights of liquid crystal televisions, etc.). , And communication applications (infrared remote control, etc.).

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  • Condensed Matter Physics & Semiconductors (AREA)
  • General Physics & Mathematics (AREA)
  • Engineering & Computer Science (AREA)
  • Computer Hardware Design (AREA)
  • Microelectronics & Electronic Packaging (AREA)
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  • Structures Or Materials For Encapsulating Or Coating Semiconductor Devices Or Solid State Devices (AREA)

Abstract

La présente invention vise à fournir : un corps moulé en résine destiné à un dispositif semi-conducteur optique qui émet une lumière plus uniforme et plus brillante en raison d'une diminution de la perte lumineuse ; et un dispositif semi-conducteur optique qui comprend ledit corps moulé en résine destiné à un dispositif semi-conducteur optique. Le corps moulé en résine 1 destiné à un dispositif semi-conducteur optique selon la présente invention comprend une surface avant 10 et une surface arrière 11 qui font face à des côtés mutuellement opposés dans le sens de l'épaisseur de celui-ci, et présente, dans la surface avant 10, une section en creux 13 à partir d'une section d'ouverture 12 vers la surface arrière 11. La section en creux 13 comprend : n surfaces réfléchissantes 14 (n étant un nombre entier supérieur ou égal à 5) et des surfaces inférieures 15 sur sa paroi interne. La forme de la section d'ouverture 12 de la section en creux 13 est un polygone à environ n côtés qui satisfait les conditions (1) et (2) ci-dessous, la nature de n étant mentionnée ci-dessus. (1) Tous les angles internes du polygone à environ n côtés sont des angles obtus. (2) Tous côtés du polygone à environ n côtés ne sont pas parallèles les uns aux autres. Une forme 16 constituée d'une surface arbitraire parallèle à la section d'ouverture 12 et à la paroi interne de la section en creux 13 est un polygone à environ n côtés qui est approximativement similaire à la section d'ouverture 12 de la section en creux 13.
PCT/JP2020/039748 2019-10-28 2020-10-22 Corps moulé en résine pour dispositif semi-conducteur optique, et dispositif semi-conducteur optique Ceased WO2021085303A1 (fr)

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JP2019-195431 2019-10-28

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JP2023082632A (ja) * 2021-12-02 2023-06-14 スタンレー電気株式会社 半導体発光装置

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JP2012044206A (ja) * 2006-04-24 2012-03-01 Cree Inc 横向き平面実装白色ｌｅｄ
JP2012530342A (ja) * 2009-06-16 2012-11-29 コーニンクレッカ フィリップス エレクトロニクス エヌ ヴィ スポット照明のための照明システム
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