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WO2021083857A1 - Raccordement de matériau par complémentarité de forme et/ou ajustement de force - Google Patents

Raccordement de matériau par complémentarité de forme et/ou ajustement de force Download PDF

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Publication number
WO2021083857A1
WO2021083857A1 PCT/EP2020/080115 EP2020080115W WO2021083857A1 WO 2021083857 A1 WO2021083857 A1 WO 2021083857A1 EP 2020080115 W EP2020080115 W EP 2020080115W WO 2021083857 A1 WO2021083857 A1 WO 2021083857A1
Authority
WO
WIPO (PCT)
Prior art keywords
structural elements
composite
material composite
shear
produced
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Ceased
Application number
PCT/EP2020/080115
Other languages
German (de)
English (en)
Inventor
Stefan Denneler
Carsten Schuh
Thomas Soller
Eric SCHWARZER
Steven Weingarten
Johannes Abel
Tassilo Moritz
Peter NEUMEISTER
Sven Roszeitis
Uwe Scheithauer
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Siemens AG
Fraunhofer Gesellschaft zur Foerderung der Angewandten Forschung eV
Siemens Corp
Original Assignee
Siemens AG
Fraunhofer Gesellschaft zur Foerderung der Angewandten Forschung eV
Siemens Corp
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Siemens AG, Fraunhofer Gesellschaft zur Foerderung der Angewandten Forschung eV, Siemens Corp filed Critical Siemens AG
Publication of WO2021083857A1 publication Critical patent/WO2021083857A1/fr
Anticipated expiration legal-status Critical
Ceased legal-status Critical Current

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Classifications

    • C—CHEMISTRY; METALLURGY
    • C04—CEMENTS; CONCRETE; ARTIFICIAL STONE; CERAMICS; REFRACTORIES
    • C04B—LIME, MAGNESIA; SLAG; CEMENTS; COMPOSITIONS THEREOF, e.g. MORTARS, CONCRETE OR LIKE BUILDING MATERIALS; ARTIFICIAL STONE; CERAMICS; REFRACTORIES; TREATMENT OF NATURAL STONE
    • C04B37/00—Joining burned ceramic articles with other burned ceramic articles or other articles by heating
    • C04B37/02—Joining burned ceramic articles with other burned ceramic articles or other articles by heating with metallic articles
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B32—LAYERED PRODUCTS
    • B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
    • B32B15/00—Layered products comprising a layer of metal
    • B32B15/04—Layered products comprising a layer of metal comprising metal as the main or only constituent of a layer, which is next to another layer of the same or of a different material
    • B32B15/043—Layered products comprising a layer of metal comprising metal as the main or only constituent of a layer, which is next to another layer of the same or of a different material of metal
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B32—LAYERED PRODUCTS
    • B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
    • B32B15/00—Layered products comprising a layer of metal
    • B32B15/18—Layered products comprising a layer of metal comprising iron or steel
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B32—LAYERED PRODUCTS
    • B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
    • B32B15/00—Layered products comprising a layer of metal
    • B32B15/20—Layered products comprising a layer of metal comprising aluminium or copper
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B32—LAYERED PRODUCTS
    • B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
    • B32B3/00—Layered products comprising a layer with external or internal discontinuities or unevennesses, or a layer of non-planar shape; Layered products comprising a layer having particular features of form
    • B32B3/02—Layered products comprising a layer with external or internal discontinuities or unevennesses, or a layer of non-planar shape; Layered products comprising a layer having particular features of form characterised by features of form at particular places, e.g. in edge regions
    • B32B3/06—Layered products comprising a layer with external or internal discontinuities or unevennesses, or a layer of non-planar shape; Layered products comprising a layer having particular features of form characterised by features of form at particular places, e.g. in edge regions for securing layers together; for attaching the product to another member, e.g. to a support, or to another product, e.g. groove/tongue, interlocking
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B32—LAYERED PRODUCTS
    • B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
    • B32B3/00—Layered products comprising a layer with external or internal discontinuities or unevennesses, or a layer of non-planar shape; Layered products comprising a layer having particular features of form
    • B32B3/26—Layered products comprising a layer with external or internal discontinuities or unevennesses, or a layer of non-planar shape; Layered products comprising a layer having particular features of form characterised by a particular shape of the outline of the cross-section of a continuous layer; characterised by a layer with cavities or internal voids ; characterised by an apertured layer
    • B32B3/30—Layered products comprising a layer with external or internal discontinuities or unevennesses, or a layer of non-planar shape; Layered products comprising a layer having particular features of form characterised by a particular shape of the outline of the cross-section of a continuous layer; characterised by a layer with cavities or internal voids ; characterised by an apertured layer characterised by a layer formed with recesses or projections, e.g. hollows, grooves, protuberances, ribs
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B32—LAYERED PRODUCTS
    • B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
    • B32B7/00—Layered products characterised by the relation between layers; Layered products characterised by the relative orientation of features between layers, or by the relative values of a measurable parameter between layers, i.e. products comprising layers having different physical, chemical or physicochemical properties; Layered products characterised by the interconnection of layers
    • B32B7/02—Physical, chemical or physicochemical properties
    • B32B7/022—Mechanical properties
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B32—LAYERED PRODUCTS
    • B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
    • B32B7/00—Layered products characterised by the relation between layers; Layered products characterised by the relative orientation of features between layers, or by the relative values of a measurable parameter between layers, i.e. products comprising layers having different physical, chemical or physicochemical properties; Layered products characterised by the interconnection of layers
    • B32B7/04—Interconnection of layers
    • B32B7/08—Interconnection of layers by mechanical means
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B33—ADDITIVE MANUFACTURING TECHNOLOGY
    • B33Y—ADDITIVE MANUFACTURING, i.e. MANUFACTURING OF THREE-DIMENSIONAL [3-D] OBJECTS BY ADDITIVE DEPOSITION, ADDITIVE AGGLOMERATION OR ADDITIVE LAYERING, e.g. BY 3-D PRINTING, STEREOLITHOGRAPHY OR SELECTIVE LASER SINTERING
    • B33Y10/00—Processes of additive manufacturing
    • C—CHEMISTRY; METALLURGY
    • C04—CEMENTS; CONCRETE; ARTIFICIAL STONE; CERAMICS; REFRACTORIES
    • C04B—LIME, MAGNESIA; SLAG; CEMENTS; COMPOSITIONS THEREOF, e.g. MORTARS, CONCRETE OR LIKE BUILDING MATERIALS; ARTIFICIAL STONE; CERAMICS; REFRACTORIES; TREATMENT OF NATURAL STONE
    • C04B37/00—Joining burned ceramic articles with other burned ceramic articles or other articles by heating
    • C04B37/02—Joining burned ceramic articles with other burned ceramic articles or other articles by heating with metallic articles
    • C04B37/021—Joining burned ceramic articles with other burned ceramic articles or other articles by heating with metallic articles in a direct manner, e.g. direct copper bonding [DCB]
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B32—LAYERED PRODUCTS
    • B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
    • B32B2457/00—Electrical equipment
    • C—CHEMISTRY; METALLURGY
    • C04—CEMENTS; CONCRETE; ARTIFICIAL STONE; CERAMICS; REFRACTORIES
    • C04B—LIME, MAGNESIA; SLAG; CEMENTS; COMPOSITIONS THEREOF, e.g. MORTARS, CONCRETE OR LIKE BUILDING MATERIALS; ARTIFICIAL STONE; CERAMICS; REFRACTORIES; TREATMENT OF NATURAL STONE
    • C04B2235/00—Aspects relating to ceramic starting mixtures or sintered ceramic products
    • C04B2235/60—Aspects relating to the preparation, properties or mechanical treatment of green bodies or pre-forms
    • C04B2235/602—Making the green bodies or pre-forms by moulding
    • C04B2235/6026—Computer aided shaping, e.g. rapid prototyping
    • C—CHEMISTRY; METALLURGY
    • C04—CEMENTS; CONCRETE; ARTIFICIAL STONE; CERAMICS; REFRACTORIES
    • C04B—LIME, MAGNESIA; SLAG; CEMENTS; COMPOSITIONS THEREOF, e.g. MORTARS, CONCRETE OR LIKE BUILDING MATERIALS; ARTIFICIAL STONE; CERAMICS; REFRACTORIES; TREATMENT OF NATURAL STONE
    • C04B2237/00—Aspects relating to ceramic laminates or to joining of ceramic articles with other articles by heating
    • C04B2237/30—Composition of layers of ceramic laminates or of ceramic or metallic articles to be joined by heating, e.g. Si substrates
    • C04B2237/32—Ceramic
    • C04B2237/36—Non-oxidic
    • C04B2237/366—Aluminium nitride
    • C—CHEMISTRY; METALLURGY
    • C04—CEMENTS; CONCRETE; ARTIFICIAL STONE; CERAMICS; REFRACTORIES
    • C04B—LIME, MAGNESIA; SLAG; CEMENTS; COMPOSITIONS THEREOF, e.g. MORTARS, CONCRETE OR LIKE BUILDING MATERIALS; ARTIFICIAL STONE; CERAMICS; REFRACTORIES; TREATMENT OF NATURAL STONE
    • C04B2237/00—Aspects relating to ceramic laminates or to joining of ceramic articles with other articles by heating
    • C04B2237/30—Composition of layers of ceramic laminates or of ceramic or metallic articles to be joined by heating, e.g. Si substrates
    • C04B2237/40—Metallic
    • C04B2237/402—Aluminium
    • C—CHEMISTRY; METALLURGY
    • C04—CEMENTS; CONCRETE; ARTIFICIAL STONE; CERAMICS; REFRACTORIES
    • C04B—LIME, MAGNESIA; SLAG; CEMENTS; COMPOSITIONS THEREOF, e.g. MORTARS, CONCRETE OR LIKE BUILDING MATERIALS; ARTIFICIAL STONE; CERAMICS; REFRACTORIES; TREATMENT OF NATURAL STONE
    • C04B2237/00—Aspects relating to ceramic laminates or to joining of ceramic articles with other articles by heating
    • C04B2237/30—Composition of layers of ceramic laminates or of ceramic or metallic articles to be joined by heating, e.g. Si substrates
    • C04B2237/40—Metallic
    • C04B2237/407—Copper
    • C—CHEMISTRY; METALLURGY
    • C04—CEMENTS; CONCRETE; ARTIFICIAL STONE; CERAMICS; REFRACTORIES
    • C04B—LIME, MAGNESIA; SLAG; CEMENTS; COMPOSITIONS THEREOF, e.g. MORTARS, CONCRETE OR LIKE BUILDING MATERIALS; ARTIFICIAL STONE; CERAMICS; REFRACTORIES; TREATMENT OF NATURAL STONE
    • C04B2237/00—Aspects relating to ceramic laminates or to joining of ceramic articles with other articles by heating
    • C04B2237/50—Processing aspects relating to ceramic laminates or to the joining of ceramic articles with other articles by heating
    • C04B2237/62—Forming laminates or joined articles comprising holes, channels or other types of openings
    • C—CHEMISTRY; METALLURGY
    • C04—CEMENTS; CONCRETE; ARTIFICIAL STONE; CERAMICS; REFRACTORIES
    • C04B—LIME, MAGNESIA; SLAG; CEMENTS; COMPOSITIONS THEREOF, e.g. MORTARS, CONCRETE OR LIKE BUILDING MATERIALS; ARTIFICIAL STONE; CERAMICS; REFRACTORIES; TREATMENT OF NATURAL STONE
    • C04B2237/00—Aspects relating to ceramic laminates or to joining of ceramic articles with other articles by heating
    • C04B2237/50—Processing aspects relating to ceramic laminates or to the joining of ceramic articles with other articles by heating
    • C04B2237/64—Forming laminates or joined articles comprising grooves or cuts
    • C—CHEMISTRY; METALLURGY
    • C04—CEMENTS; CONCRETE; ARTIFICIAL STONE; CERAMICS; REFRACTORIES
    • C04B—LIME, MAGNESIA; SLAG; CEMENTS; COMPOSITIONS THEREOF, e.g. MORTARS, CONCRETE OR LIKE BUILDING MATERIALS; ARTIFICIAL STONE; CERAMICS; REFRACTORIES; TREATMENT OF NATURAL STONE
    • C04B2237/00—Aspects relating to ceramic laminates or to joining of ceramic articles with other articles by heating
    • C04B2237/50—Processing aspects relating to ceramic laminates or to the joining of ceramic articles with other articles by heating
    • C04B2237/84—Joining of a first substrate with a second substrate at least partially inside the first substrate, where the bonding area is at the inside of the first substrate, e.g. one tube inside another tube

Definitions

  • the present invention relates to a material composite for a power electronics component or for connecting construction elements and a method for producing a material composite.
  • the substrates used in power electronics consist of the ceramics A1N, A1203, Si3N4, HPS (A1203 + Zr02). These are connected to an electrically conductive metallic carrier either by means of a spinel connection (DCB) or an active solder (AMB).
  • the metallic carrier usually has a maximum thickness of 0.3 mm, so that excessive protrusion or premature initiation of breakage is prevented.
  • metallization thicknesses of 0.8 mm can also be achieved.
  • brazing alloys used have, on the one hand, significantly lower heat conduction and thus considerably slow down the heat flow in both the lateral and thickness directions and, on the other hand, are associated with high costs in order to etch structures that are required later.
  • a reduction in the ceramic thickness to minimize the thermal resistance is limited by the requirements for the insulation and partial discharge resistance of the insulation substrate.
  • the aluminum nitride (A1N) ceramic (> 200 W / mK), which is used in high-performance modules and has a significantly better thermal conductivity, has too low a fracture toughness or breaking strength, to withstand the thermomechanical stress of thick metallization layers.
  • the service life of ceramic insulation substrates decreases significantly with increasing metallization thickness.
  • the classic failure pattern is the shell breakage of the ceramic or the delamination of the metallization layers, accompanied by the loss of the thermal connection. Therefore, according to the state of the art, no "thick copper insulating substrates" with highly thermally conductive A1N ceramics that have adequate thermal shock resistance can be produced.
  • the only option on the market to apply thicker conductor tracks (> 300 ⁇ m) to AIN ceramics is based on burning In addition to the high process costs, the reduced thermal and electrical conductivity of the porous metal or copper pastes is a significant disadvantage.
  • the object of the invention is to provide a solution for a connection of a rigid material, in particular a ceramic and a plastically deformable material, in particular a metal.
  • One aspect of the invention is that a form-fitting and / or force-fitting connection is established between structural elements of a first material and a second material.
  • the invention claims a composite material comprising a first material and a second material, the first material having a smaller coefficient of thermal expansion (CTE) than the second material, the first material having at least one surface with structural elements, with the first material between and a positive and / or non-positive connection produced by the structural elements can be formed from the second material.
  • CTE coefficient of thermal expansion
  • the invention offers the advantage that tensile stresses in a rigid material, for example a ceramic, can be reduced by thermal expansion of a thermally deformable material, for example a metal.
  • the structural elements can be created by making recesses or depressions in the first material at certain points.
  • the shape, size and arrangement of the structural elements can be designed by simulating the thermomechanical stresses with a view to reducing the thermomechanical stresses.
  • the form-fit and / or force-fit connection can be produced in that the second material protrudes / penetrates / engages in the structural elements of the first material.
  • the composite material is part of a power electronics component and / or can be used to connect construction elements
  • the structural elements are punctiform and / or linear and / or concentric and / or meandering and / or distributed in serpentine lines on the first material.
  • the structural elements are in the form of material recesses protruding into the surface with undercuts and / or noses and / or mushrooms and / or pins and / or teeth and / or webs and / or shear anchors and / or a Adhesive structure formed.
  • undercuts are bulges in the material that make a positive connection possible, please include.
  • An adhesive structure is used to generate a contact pressure between the first material and the second material.
  • a shear anchor or shear anchor serves to prevent the surfaces of the first material and the second material from shearing off by absorbing the interphase forces parallel to the interphase surface.
  • the shear anchor or shear anchor is characterized by a pronounced neck (large neck diameter (d H) in relation to the neck length (1 H) with high stiffness to prevent shear deformations and a head shape that allows the structure of the second material to be pulled out and turned out
  • the head shape is characterized by a larger head diameter (d K) in relation to the height of the head.
  • the structural elements are designed as a recess with a recess bottom, the recess bottom having a geometric shape that spreads the material flow for the second material.
  • the first material with the lower CTE forms the structural element; the second material (plastic deformable) flows into the structural element of the first material and fills it out.
  • the first material has aluminum nitrite.
  • Oxide ceramics especially: A1203, A1203 (high purity), Zr02,
  • Non-oxide ceramics especially: Carbides (SiC, SiSiC, SiC- SiSiC, SSiC, HP SiC, B4C, TaC, TiC, ZrC), nitrides (Si3N4, SSN (Si3N4), HP SN (Si3N4), A1N, BN, TiN, TaN) and borides (MgB2, TiB2, ZrB2)
  • the second material has copper or a copper alloy.
  • the second material is aluminum or an aluminum alloy.
  • Further advantageous materials for the second material are titanium and titanium alloys, steels and / or tin and tin alloys.
  • the second material can have a layer thickness of greater than 1 mm and the first material can have a layer thickness of, for example, 1 mm.
  • the first material can have a layer thickness of, for example, 1 mm.
  • high layer thicknesses of the second material are advantageous.
  • the structural elements are produced by means of additive manufacturing (punctiform and / or linear and / or concentric and / or meandering and / or in serpentine lines). In this way, defined structural elements (shape, size and arrangement) can be produced. Structural elements in the form of depressions can be produced by additive manufacturing in which material elevations are additively attached at other points.
  • the structural elements are designed in such a way that thermomechanical stresses between the first material and the second material are reduced. This can be done with the aid of a simulation. The thermomechanical stresses can occur as a result of the cooling in the manufacturing process and / or renewed heating of the composite material after manufacture and can be kept / reduced at a necessary level by the structural elements.
  • the structural elements are by means of extrusion (only linear) and / or by means of multi-layer technology (punctiform and / or linear and / or concentric and / or meandering and / or in serpentine lines) and / or by means of green treatment and / or by means of laser bear processing and / or injection molding with lost cores herge provides.
  • defined structural elements shape, size and arrangement
  • the form-fit and / or force-fit connection is produced by embossing and / or infiltration of the second material into the structural elements of the first material. Different temperatures can be used for the embossing.
  • the embossing is carried out by means of riveting techniques or clinching techniques or caulking techniques or hot pressing or roll cladding (mechanical embossing) at a temperature above the use temperature of the material composite and below the melting temperature of the second material.
  • the infiltration is carried out as pressure filtration and / or vacuum infiltration at a temperature above the melting temperature of the second material.
  • the invention also claims a method for the produc- tion of a composite material according to the invention, with the step:
  • the invention also claims the production of a connection by means of a method according to the invention.
  • the second material can be steel, for example, the first material Si3N4.
  • the invention also claims a power electronics component with a material composite according to the invention or produced using a method according to the invention.
  • the invention represents a joining technology to create a reliable, long-lasting, direct connection of a sufficiently rigid component (preferably ceramic or a rigid metal, polymer, mixtures thereof) with a readily plastically deformable component (preferably metal or also a well plastic one deformable polymer, mixtures de rer).
  • a sufficiently rigid component preferably ceramic or a rigid metal, polymer, mixtures thereof
  • a readily plastically deformable component preferably metal or also a well plastic one deformable polymer, mixtures de rer.
  • a component ceramic, metal, polymer, mixtures thereof
  • a melt / solution / feedstock can also be used.
  • the invention offers the advantage of realizing a material composite via a form fit and / or a force fit. As a result, no hard or active solders are required and pure copper can be used, which has a high electrical conductivity (58 * 10 6 S / cm) and excellent thermal conductivity (400 W / mK). This results in a significant gain in performance.
  • thermomechanical stresses occur.
  • the thermomechanical stresses can be reduced in a targeted manner through the simulation-based optimization of the shape, size and arrangement of the structural elements used. This results in a significant increase in service life.
  • the optimized structural elements lead to a gap-free connection between the materials, which ensures good heat transfer over the long term. This improves the aging-resistant properties and maintains constant properties over the service life.
  • This joining technology makes it possible to connect metals (e.g. copper) with non-wetting ceramics (AIN) firmly and without a gap via the form fit / force fit.
  • FIG. 1 shows a first material with structural elements and a second material
  • FIG. 2 shows a material composite produced by hot pressing a second material into structural elements (depressions) of a first material
  • FIG. 3 shows structural elements of a first material
  • FIG. 4 shows a composite material
  • FIG. 5 shows an adhesive structure
  • FIG. 6 shows a shear / shear anchor
  • FIG. 7 shows a material flow guide
  • the DETAILED DESCRIPTION OF THE INVENTION 1 shows a first material 1 and a second material 2.
  • the first material 1 has structural elements 3. Between tween the first material 1 and the second material 2, a form-fitting and / or force-fitting connection can be established via the structural elements 3.
  • the structure elements 3 are designed in the form of mutually spaced apart mushroom-shaped depressions.
  • the structural elements 3 can be produced by means of additive manufacturing (punctiform and / or linear and / or concentric and / or meandering and / or in serpentine lines). In this way, defined structural elements 3 (shape, size and arrangement) can be produced.
  • the structural elements 3 can be designed in such a way that thermomechanical stresses between the first material 1 and the second material 2 are reduced when the material composite is heated. This can be done with the aid of a simulation.
  • the structural elements 3 can also by means of extrusion (only linear) and / or by means of multi-layer technology (punctiform and / or linear and / or concentric and / or meandering and / or in serpentine lines) and / or by means of Grünbe treatment and / or by means of Laser machining and / or injection molding can be produced with lost cores. In this way, defined structural elements 3 (shape, size and arrangement) can be produced.
  • the form-fitting and / or force-fitting connection can be produced by embossing and / or infiltration of the second material 2 into the structural elements 3 of the first material 1. Different temperatures can be used for the embossing.
  • the embossing can be done by means of riveting techniques and / or clinching techniques and / or caulking techniques and / or hot pressing, roll cladding (mechanical embossing) at one temperature Above the use temperature of the composite material and below the melting temperature of the second material run through.
  • the infiltration can be carried out as pressure filtration and / or vacuum filtration at a temperature above the melting temperature of the second material.
  • Fig. 2 shows a material composite 4 produced by hot pressing from a first material 1 with structural elements 3 (depressions) and a second material 2.
  • the structural elements 3 absorb shear forces well due to the short head.
  • a form-fitting and / or force-fitting connection with a further material can be established between the structural elements 3 of the first material 1.
  • FIG. 3 also shows the material composite 4 produced by hot pressing from a first material 1 with structure elements 3 and a second material 2 from FIG. 2.
  • the illustration is enlarged.
  • the structural elements 3 are designed in the form of material depressions with teeth.
  • the material composite 4 shows a material composite 4 composed of a first materi al 1 and a second material 2.
  • the material composite 4 is produced via a form-fitting and / or force-fitting connection through structural elements 3 of the first material.
  • Fig. 5 shows an adhesive structure 9 as an example of a Struktu relements 3 (see Fig. 1 to Fig. 4), which protrudes into the surface of the first material.
  • the adhesive structure 9 is used to generate a contact pressure between layers of the first material and the second material.
  • FIG. 6 shows a shear / shear anchor 20 as an example of a structural element 3 (see FIGS. 1 to 4)) which protrudes into the surface of the first material.
  • the shear anchor 20 or shear anchor 20 serves to prevent the surfaces of the first material and the second material (see FIGS. 1 to 4) from shearing off by absorbing the interphase forces parallel to the interphase surface.
  • the shear anchor 20 or shear anchor 20 is characterized by a pronounced neck (large neck diameter (d H) 14 in relation to the neck length (1 H) 12) with high rigidity to prevent
  • the head shape is characterized by a larger head diameter (d K) 13 in relation to the height of the head.
  • d K head diameter
  • a shear / shear anchor 20 does not offer any adhesive effect.
  • FIG. 7 shows a material flow guide 19 as an example of a structural element 3 (see FIGS. 1 to 4)) which protrudes into the surface of the first material.
  • the structural elements are designed in the form of depressions in the first material, which have a geometric shape at the bottom of the depression, which spreads the material flow for the second material.
  • Fig. 8 shows an adapted arrangement for solid copper tape layouts 17.
  • the second material 2 can be, for example, a copper conductor track.
  • the first material 1 can, for example, be a ceramic.
  • the copper conductor track has adhesive structures 20 and shear / shear anchors 9.
  • Fig. 9 shows an overlapping arrangement for free Kupferbandlay outs 18.
  • the second material 2 can be, for example, a Kup ferleiterbahn.
  • the first material 1 can be a ceramic, for example.
  • the copper conductor track has adhesive structures 20 and shear / shear anchors 9. In the case of small quantities of a conductor track layout, an overlapping arrangement of shear anchors / shear anchors and adhesive structures is recommended, as shown.

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  • Chemical & Material Sciences (AREA)
  • Engineering & Computer Science (AREA)
  • Ceramic Engineering (AREA)
  • Materials Engineering (AREA)
  • Structural Engineering (AREA)
  • Organic Chemistry (AREA)
  • Mechanical Engineering (AREA)
  • Manufacturing & Machinery (AREA)
  • Laminated Bodies (AREA)
  • Ceramic Products (AREA)

Abstract

L'invention concerne un raccordement de matériau (4), comprenant un premier matériau (1) et un second matériau (2), le premier matériau (1) ayant un coefficient de dilatation thermique (CTE) inférieur à celui du second matériau (2), le premier matériau (1) présentant au moins une surface pourvue d'éléments structuraux (3), un raccordement par complémentarité de forme et/ou ajustement de force établi au moyen des éléments structuraux (3) pouvant être formé entre le premier matériau (1) et le second matériau (2). L'invention concerne également un procédé de fabrication d'un raccordement de matériau.
PCT/EP2020/080115 2019-10-29 2020-10-27 Raccordement de matériau par complémentarité de forme et/ou ajustement de force Ceased WO2021083857A1 (fr)

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DE102019216605.9A DE102019216605A1 (de) 2019-10-29 2019-10-29 Formschlüssiger und/oder kraftschlüssiger Materialverbund

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DE102021117969B4 (de) 2021-07-12 2024-12-12 Fraunhofer-Gesellschaft zur Förderung der angewandten Forschung eingetragener Verein Verfahren zur Herstellung eines Bauteils aus mindestens zwei Materialien

Citations (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2010030280A (ja) * 2008-06-27 2010-02-12 Kyocera Corp セラミック基体、放熱基体および電子装置
WO2013008651A1 (fr) * 2011-07-14 2013-01-17 京セラ株式会社 Carte à circuits et dispositif électronique
EP3162469A1 (fr) * 2015-10-20 2017-05-03 General Electric Company Zone de transition de matériau d'interverrouillage avec refroidissement de film intégré
EP3501727A1 (fr) * 2017-12-22 2019-06-26 Ansaldo Energia IP UK Limited Système de protection thermique et procédé pour composants de turbine à gaz

Family Cites Families (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
EP0219122B1 (fr) * 1985-10-15 1990-07-04 Nec Corporation Substrat céramique métallisé et procédé pour sa fabrication
AT408345B (de) * 1999-11-17 2001-10-25 Electrovac Verfahren zur festlegung eines aus metall-matrix- composite-(mmc-) materiales gebildeten körpers auf einem keramischen körper
JP4918856B2 (ja) * 2004-04-05 2012-04-18 三菱マテリアル株式会社 パワーモジュール用基板及びパワーモジュール
DE102012112550A1 (de) * 2012-12-18 2014-06-18 Lpkf Laser & Electronics Ag Verfahren zur Metallisierung eines Werkstücks sowie ein Schichtaufbau aus einem Werkstück und einer Metallschicht

Patent Citations (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2010030280A (ja) * 2008-06-27 2010-02-12 Kyocera Corp セラミック基体、放熱基体および電子装置
WO2013008651A1 (fr) * 2011-07-14 2013-01-17 京セラ株式会社 Carte à circuits et dispositif électronique
EP3162469A1 (fr) * 2015-10-20 2017-05-03 General Electric Company Zone de transition de matériau d'interverrouillage avec refroidissement de film intégré
EP3501727A1 (fr) * 2017-12-22 2019-06-26 Ansaldo Energia IP UK Limited Système de protection thermique et procédé pour composants de turbine à gaz

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