WO2021042390A1 - Electronic assembly and manufacturing method therefor, and mold and manufacturing method therefor - Google Patents

Abstract

An electronic assembly (10) and a manufacturing method therefor, and a mold (20) and a manufacturing method therefor. The electronic assembly (10) comprises a first elastic substrate (300), stretchable wires (100), a first functional element (210), and a second functional element (220); the stretchable wires (100), the first functional element (210), and the second functional element (220) are located on the same side of the first elastic substrate (300); two opposite ends of the stretchable wire (100) are electrically connected to the first functional element (210) and the second functional element (220), respectively. The manufacturing method for the electronic assembly (100) facilitates improving the manufacturing yield of the electronic assembly (10), and facilitates largescale production of the electronic assembly (10).

Description

Electronic component and preparation method thereof, mold and preparation method thereof Technical field

The invention relates to the field of electronic technology, in particular to an electronic component and a preparation method thereof, a mold and a preparation method thereof.

Background technique

Existing methods for preparing elastic electronic components rely too much on elastic substrates, and the preparation process of elastic substrates is difficult to be compatible with existing electronic device preparation processes, which reduces the production efficiency of elastic electronic components and limits the elastic electronic components The scale of production.

Summary of the invention

The embodiment of the present invention provides an electronic component. The electronic component includes a first elastic substrate, a stretchable wire, a first functional element and a second functional element, and the stretchable wire, the first functional element and the second functional element are located on the first functional element. On the same side of an elastic substrate, opposite ends of the stretchable wire are electrically connected to the first functional element and the second functional element, respectively.

In the electronic component provided by the embodiments of the present application, the stretchable wire, the first functional element, and the second functional element are all carried on a first elastic substrate. The first elastic substrate can be used for the stretchable wire and the first functional element. It forms support and protection with the second functional element, which helps to prolong the service life of the electronic component.

The embodiment of the present invention provides a method for manufacturing an electronic component. The manufacturing method of the electronic component includes:

Provide molds;

Forming a stretchable wire on one side of the mold;

Forming a first elastic substrate covering the stretchable wire;

Remove the mold.

The method for preparing an electronic component provided by an embodiment of the present invention first provides a mold, then forms a stretchable wire on one side of the mold, then forms a first elastic substrate covering the stretchable wire, and finally removes the mold. To get electronic components. The use of molds to prepare electronic components can reduce the dependence on the first elastic substrate and facilitate the mass production of electronic components.

An embodiment of the present invention also provides a mold, the mold is used to prepare an electronic component, the mold includes a substrate and a shaped structure, and the shaped structure is used to shape the stretchable wire.

The embodiment of the present invention also provides a method for preparing a mold, the mold is used to prepare an electronic component, and the method for preparing the mold includes:

Provide substrate;

Forming a photoresist layer covering the substrate;

Disposing a photomask on the side of the photoresist layer away from the substrate, the photomask having gaps arranged at intervals;

Irradiate light on the side of the photomask away from the photoresist;

The photoresist layer formed after illumination is etched, so that the mold has a shaped structure.

Description of the drawings

In order to explain the embodiments of the present invention or the technical solutions in the prior art more clearly, the following will briefly introduce the drawings that need to be used in the embodiments. Obviously, the drawings in the following description are only some of the present invention. Embodiments, for those of ordinary skill in the art, without creative work, other drawings can be obtained based on these drawings.

FIG. 1 is a flowchart of a first method for manufacturing an electronic component provided by an embodiment of the present application.

Fig. 2 is a schematic structural diagram of an electronic component provided by an embodiment of the present application.

FIG. 3 is a schematic diagram of the structure corresponding to S100 of the manufacturing method of the electronic component in FIG. 1.

FIG. 4 is a schematic diagram of the structure corresponding to S200 of the manufacturing method of the electronic component in FIG. 1.

FIG. 5 is a schematic diagram of a structure corresponding to the manufacturing method of the electronic component in FIG. 1.

FIG. 6 is a schematic diagram of the structure corresponding to S300 of the manufacturing method of the electronic component in FIG. 1.

FIG. 7 is a schematic diagram of a structure corresponding to the manufacturing method of the electronic component in FIG. 1.

FIG. 8 is a schematic diagram of the structure corresponding to S400 of the manufacturing method of the electronic component in FIG. 1.

FIG. 9 is a schematic partial flowchart of a method S200 for manufacturing an electronic component in an embodiment of the present application.

FIG. 10 is a schematic diagram of the structure corresponding to S210 in FIG. 9.

FIG. 11 is a schematic partial flowchart of the method S200 of manufacturing an electronic component in an embodiment of the present application.

FIG. 12 is a schematic diagram of the structure corresponding to S220 in FIG. 11.

FIG. 13 is a schematic diagram of the structure corresponding to S230 in FIG. 11.

FIG. 14 is a schematic partial flowchart of a method S200 for manufacturing an electronic component in an embodiment of the present application.

FIG. 15 is a schematic diagram of the structure corresponding to S240 in FIG. 14.

FIG. 16 is a schematic diagram of the structure corresponding to S250 in FIG. 14.

FIG. 17 is a schematic partial flowchart of a method S200 for manufacturing an electronic component in an embodiment of the present application.

FIG. 18 is a schematic diagram of the structure corresponding to S260 in FIG. 17.

FIG. 19 is a schematic diagram of the structure corresponding to S270 in FIG. 17.

FIG. 20 is a schematic diagram of the structure corresponding to S280 in FIG. 17.

FIG. 21 is a schematic partial flowchart of a method S200 for manufacturing an electronic component in an embodiment of the present application.

FIG. 22 is a schematic diagram of the structure corresponding to S201 in FIG. 21.

FIG. 23 is a schematic diagram of the structure corresponding to S202 in FIG. 21.

FIG. 24 is a schematic partial flowchart of a method S200 for manufacturing an electronic component in an embodiment of the present application.

FIG. 25 is a schematic diagram of the structure corresponding to S203 in FIG. 23.

FIG. 26 is a schematic diagram of the structure corresponding to S204 in FIG. 24.

FIG. 27 is a schematic partial flowchart of a method S200 for manufacturing an electronic component in an embodiment of the present application.

FIG. 28 is a schematic diagram of the structure corresponding to S205 in FIG. 27.

FIG. 29 is a schematic diagram of the structure corresponding to S206 in FIG. 27.

FIG. 30 is a schematic diagram of the structure corresponding to S207 in FIG. 27.

FIG. 31 is a schematic partial flowchart of a method S200 for manufacturing an electronic component in an embodiment of the present application.

FIG. 32 is a schematic diagram of the structure corresponding to S2001 in FIG. 31.

FIG. 33 is a schematic diagram of the structure corresponding to S2002 in FIG. 31.

FIG. 34 is a schematic diagram of the structure corresponding to S2003 in FIG. 31.

FIG. 35 is a schematic partial flowchart of a method S200 for manufacturing an electronic component in an embodiment of the present application.

FIG. 36 is a schematic diagram of the structure corresponding to S2004 in FIG. 35.

FIG. 37 is a schematic diagram of the structure corresponding to S2005 in FIG. 35.

FIG. 38 is a schematic diagram of the structure corresponding to S2006 in FIG. 35.

FIG. 39 is a schematic diagram of the structure corresponding to S2007 in FIG. 35.

FIG. 40 is a schematic partial flowchart of a method S200 for manufacturing an electronic component in an embodiment of the present application.

FIG. 41 is a schematic diagram of the structure corresponding to S211 in FIG. 40.

FIG. 42 is a schematic diagram of the structure corresponding to S212 in FIG. 40.

FIG. 43 is a schematic diagram of the structure corresponding to S213 in FIG. 40.

FIG. 44 is a schematic diagram of the structure corresponding to S214 in FIG. 40.

FIG. 45 is a schematic partial flowchart of a method for manufacturing an electronic component in an embodiment of the present application.

FIG. 46 is a schematic diagram of the structure corresponding to S110 in FIG. 45.

FIG. 47 is a schematic partial flowchart of a method for manufacturing an electronic component in an embodiment of the present application.

FIG. 48 is a schematic diagram of the structure corresponding to S215 in FIG. 47.

FIG. 49 is a schematic diagram of the structure corresponding to S216 in FIG. 47.

FIG. 50 is a schematic diagram of the structure corresponding to S217 in FIG. 47.

FIG. 51 is a schematic diagram of the structure corresponding to S218 in FIG. 47.

FIG. 52 is a schematic partial flowchart of a method for manufacturing an electronic component in an embodiment of the present application.

FIG. 53 is a schematic diagram of the structure corresponding to S120 in FIG. 52.

FIG. 54 is a schematic diagram of the structure corresponding to S130 in FIG. 52.

FIG. 55 is a schematic partial flowchart of a method for manufacturing an electronic component in an embodiment of the present application.

FIG. 56 is a schematic diagram of the structure corresponding to S410 in FIG. 55.

FIG. 57 is a schematic diagram of the structure corresponding to S410 in FIG. 55.

FIG. 58 is a schematic partial flowchart of a method for manufacturing an electronic component in an embodiment of the present application.

FIG. 59 is a schematic diagram of the structure corresponding to S420 in FIG. 58.

FIG. 60 is a schematic diagram of the structure corresponding to S420 in FIG. 58.

FIG. 61 is a schematic partial flowchart of a method for manufacturing an electronic component in an embodiment of the present application.

FIG. 62 is a schematic diagram of the structure corresponding to S430 in FIG. 61.

Fig. 63 is a schematic diagram of the structure corresponding to S430 in Fig. 61.

Fig. 64 is a schematic structural diagram of a first mold provided by an embodiment of the present application.

Fig. 65 is a schematic structural diagram of a second mold provided in an embodiment of the present application.

Fig. 66 is a schematic structural diagram of a third mold provided in an embodiment of the present application.

FIG. 67 is a flowchart of the first method for preparing a mold provided in an embodiment of the present application.

FIG. 68 is a schematic diagram of the structure corresponding to W100 in FIG. 67.

FIG. 69 is a schematic diagram of the structure corresponding to W200 in FIG. 67.

FIG. 70 is a schematic diagram of the structure corresponding to W300 in FIG. 67.

Figure 71 is a schematic diagram of the structure corresponding to W500 in Figure 67.

Fig. 72 is a partial flowchart of a method for preparing a mold provided in an embodiment of the present application.

FIG. 73 is a schematic diagram of the structure corresponding to W110 in FIG. 72.

FIG. 74 is a schematic diagram of the structure corresponding to W120 in FIG. 72.

FIG. 75 is a partial flowchart of a method for preparing a mold provided in an embodiment of the present application.

FIG. 76 is a schematic diagram of the structure corresponding to W210 in FIG. 75.

Fig. 77 is a partial flowchart of a method for preparing a mold provided in an embodiment of the present application.

FIG. 78 is a schematic diagram of the structure corresponding to W310 in FIG. 77.

Fig. 79 is a schematic structural diagram of an electronic component provided by an embodiment of the present application.

FIG. 80 is a schematic structural diagram of another electronic component provided by an embodiment of the present application.

FIG. 81 is a schematic structural diagram of another electronic component provided by an embodiment of the present application.

FIG. 82 is a schematic structural diagram of yet another electronic component provided by an embodiment of the present application.

FIG. 83 is a schematic structural diagram of another electronic component provided by an embodiment of the present application.

FIG. 84 is a schematic structural diagram of another electronic component provided by an embodiment of the present application.

FIG. 85 is a schematic structural diagram of yet another electronic component provided by an embodiment of the present application.

FIG. 86 is a schematic structural diagram of yet another electronic component provided by an embodiment of the present application.

FIG. 87 is a schematic structural diagram of yet another electronic component provided by an embodiment of the present application.

FIG. 88 is a schematic structural diagram of another electronic component provided by an embodiment of the present application.

detailed description

The technical solutions in the embodiments of the present invention will be described clearly and completely in conjunction with the accompanying drawings in the embodiments of the present invention. Obviously, the described embodiments are only a part of the embodiments of the present invention, rather than all the embodiments. Based on the embodiments of the present invention, all other embodiments obtained by those of ordinary skill in the art without creative work shall fall within the protection scope of the present invention.

Please refer to FIG. 1 and FIG. 2. FIG. 1 is a flowchart of a first method for manufacturing an electronic component provided by an embodiment of the present application. Fig. 2 is a schematic structural diagram of an electronic component provided by an embodiment of the present application. In one embodiment, the electronic component 10 includes a first elastic substrate 300 and a stretchable wire 100 on one side of the first elastic substrate 300. When the first elastic substrate 300 is stretched, the stretchable wire 100 is in an extended state; when the first elastic substrate 300 is in a free state, the stretchable wire 100 is in a contracted state . In another embodiment, the electronic component 10 further includes a first functional element 210 and a second functional element 220, and the first functional element 210 and the second functional element 220 are respectively electrically connected to the stretchable wire The ends of 100. It should be noted that the number of functional elements is not limited to two, that is, the number of functional elements can be more than two. If the electronic component is a flexible display screen, the number of functional elements can be millions, with millions of functions. The components are electrically connected by stretchable wires to form a mesh structure.

The preparation method of the electronic component includes but is not limited to S100, S200, S300, and S400. The details of S100, S200, S300, and S400 are described below.

S100: Provide mold 20. Please refer to Figure 3.

Among them, the mold 20 is a preparation tool for the electronic component 10. The mold 20 is used to prepare the electronic component 10, and the structure and shape of the electronic component 10 can be relatively accurately controlled, which helps to improve the production yield of the electronic component 10 and facilitates the electronic component. Mass production of 10.

In one embodiment, S200: forming a stretchable wire 100 on one side of the mold 20. Please continue to refer to Figure 4.

In another embodiment, a stretchable wire 100 and a first functional element 210 and a second functional element 220 electrically connected to both ends of the stretchable wire 100 are formed on one side of the mold 20. Please continue to refer to Figure 5.

Among them, the first functional element 210 may be a control chip, and the second functional element 220 may also be a control chip. The first functional element 210 and the second functional element 220 are respectively electrically connected to two ends of the stretchable wire 100, and the first functional element 210, the second functional element 220 and the stretchable wire 100 have different stretching rates. In other words, the first functional element 210 and the second functional element 220 may be rigid functional elements. The first functional element 210 and the second functional element 220 may have different functions, such as calculation, storage, sensing, and communication. The method of forming the first functional element 210 and the second functional element 220 can be direct fabrication by bonding, wire bonding, flip chip packaging, or deposition and photolithography. Among them, bonding means that two pieces of homogeneous or heterogeneous semiconductor materials with clean and atomic-level flat surfaces are subjected to surface cleaning and activation treatments, and directly combined under certain conditions, and the wafers are bonded together through van der Waals force, molecular force or even atomic force. One-piece technology. Flip chip packaging refers to depositing solder points on both ends of the stretchable wire 100 to form solder balls, flipping and positioning the first functional unit 210 and the second functional element 220 so that the solder balls are facing the connector of the functional unit and remelting Solder balls to solder the functional unit on the stretchable wire 100. The first functional element 210 and the second functional element 220 may also be various elements with corresponding functions such as capacitors, resistors, inductors, wires, diodes, and triodes. The first functional element 210 and the second functional element 220 may also be made of elastic or flexible materials.

Wherein, the stretchable wire 100 may be metal, conductive ink, or the like. The preparation process of the stretchable wire 100 may be formed by a patterning method, specifically, it may be photolithography, printing, or the like. Further, the horizontal pattern of the stretchable wire 100 can be realized by a patterning process, and the vertical undulation of the stretchable wire 100 can be realized by the shape of the mold 20.

In a possible implementation, the stretchable wire 100 is formed on one side of the mold 20 first, and then the first functional element 210 and the second functional element 220 electrically connected to the two ends of the stretchable wire 100 are formed.

In another possible embodiment, the first functional element 210 and the second functional element 220 are formed on one side of the mold 20 first, and then a stretchable element is formed between the first functional element 210 and the second functional element 220. The wire 100 is such that one end of the stretchable wire 100 is electrically connected to the first functional element 210 and the other end of the stretchable wire 100 is electrically connected to the second functional element 220.

In one embodiment, S300: forming a first elastic substrate 300 covering the stretchable wire 100. Please continue to refer to Figure 6.

In another embodiment, a first elastic substrate 300 covering the first functional element 210, the second functional element 220 and the stretchable wire 100 is formed. Please continue to refer to Figure 7.

Wherein, the first elastic substrate 300 is a carrier of the first functional element 210, the second functional element 220 and the stretchable wire 100. The material of the first elastic substrate 300 may be thermoplastic polyurethane elastomer rubber (Thermoplastic polyurethanes, TPU), polydimethylsiloxane (polydimethylsiloxane, PDMS), (hydrogenated styrene-butadiene block copolymer, SEBS) , Styrene-butadiene-styrene block copolymer (Styreneic Block Copolymers, SBS), etc.

S400: Remove the mold 20. Please continue to refer to Figure 8.

The electronic component 10 is obtained by removing the mold 20. The method of removing the mold 20 may be a physical peeling method or a chemical dissolution method, which will be described in detail later and will not be repeated here.

In the method for preparing an electronic component provided by the embodiment of the present invention, a mold 20 is first provided, and then a stretchable wire 100 and a first functional element electrically connected to both ends of the stretchable wire 100 are formed on one side of the mold 20 210 and the second functional element 220, and then a first elastic substrate 300 covering the first functional element 210, the second functional element 220 and the stretchable wire 100 is formed, and finally the mold 20 is removed to obtain the electronic component 10. The use of the mold 20 to prepare the electronic component 10 can reduce the dependence on the first elastic substrate 300 during the preparation process, and can perform three-dimensional control of the shape of the stretchable wire 100, and the structure of the electronic component 10 can be more precise The adjustment helps to improve the yield rate of the electronic component 10 and facilitates the mass production of the electronic component 10.

Please continue to refer to FIGS. 9 and 10, the surface of the mold 20 is provided with a shaped structure A, S200: forming a stretchable wire 100 on one side of the mold 20 includes: forming a stretchable wire through the shaped structure A 100.

In one embodiment, the shaped structure A includes a plurality of protrusions 201 formed on the surface of the mold 20, and the two adjacent protrusions 201 are smoothly connected, and the stretchable wire 100 is arranged On the protruding portion 201, a number of curved portions 100a connected smoothly in sequence are formed.

S200 includes but is not limited to S210. S210 is described in detail as follows.

S210: Laying the stretchable wire 100 on the protruding portion 201 to form a plurality of curved portions 100a that are smoothly connected in sequence.

Specifically, the two adjacent protrusions 201 are smoothly connected, that is, the protrusions 201 have a gentle slope. In the subsequent manufacturing process, the stretchable wire 100 is not easy to break when climbing, which helps to ensure The manufacturing yield of the electronic component 10. Among them, smooth connection means that the connection between adjacent protrusions 201 is relatively smooth, and there is no turning point of sudden curvature. Since the adjacent protrusions 201 are smoothly connected, when the stretchable wire 100 is laid on the protrusion 201, the stretchable wire 100 will form a smoothly connected curved portion 100a, and the wire 100 will be stretched. It presents a gentle bending state. At this time, the prepared stretchable wire 100 is not easy to break, which helps to ensure the service life of the electronic component 10.

In another embodiment, the shaped structure A includes a corrugated groove opened on the surface of the mold 20, and the stretchable wire 100 is formed in the corrugated groove.

Please continue to refer to FIG. 11. In an implementation manner, S200 includes but is not limited to S220 and S230, and S220 and S230 are described in detail as follows.

S220: Form the stretchable wire 100 on one side of the mold 20. Please continue to refer to Figure 12.

S230: Form the first functional element 210 and the second functional element 220 on the side of the stretchable wire 100 away from the mold 20. Please continue to refer to Figure 13.

Specifically, in this embodiment, the stretchable wire 100 is first formed on one side of the mold 20, and then the first functional element 210 and the second functional element 220 are formed on the side of the stretchable wire 100 away from the mold 20. One end of the stretchable wire 100 is electrically connected to the first functional element 210, and the other end of the stretchable wire 100 is electrically connected to the second functional element 220.

Please continue to refer to FIG. 14. In an implementation manner, S200 includes but is not limited to S240 and S250, and S240 and S250 are described in detail as follows.

S240: Form the first functional element 210 and the second functional element 220 on one side of the mold 20. Please continue to refer to Figure 15.

S250: Form the stretchable wire 100 on the side of the first functional element 210 and the second functional element 220 away from the mold 20. Please continue to refer to Figure 16.

Specifically, in this embodiment, the first functional element 210 and the second functional element 220 are first formed on one side of the mold 20, and then the first functional element 210 and the second functional element 220 are formed on the side facing away from the mold 20. The stretchable wire 100, wherein one end of the stretchable wire 100 is electrically connected to the first functional element 210, and the other end of the stretchable wire 100 is electrically connected to the second functional element 220. Among them, the hardness of the first functional element 210 and the second functional element 220 is greater than that of the stretchable wire 100. First, the first functional element 210 and the second functional element 220 are formed on one side of the mold 20, and then the first functional element 210 and the second functional element 220 The stretchable wire 100 is formed on the side of the second functional element 220 away from the mold 20. Since the materials of the first functional element 210 and the second functional element 220 are relatively hard, it is convenient to combine the first functional element 210, the second functional element 220 and the mold. The separation of 20 helps to improve the production yield of the electronic component 10 and facilitates the mass production of the electronic component 10.

Please continue to refer to FIG. 17. In an embodiment, S200 includes but is not limited to S260, S270, and S280. The details of S260, S270, and S280 are described below.

S260: Form the first functional element 210 on one side of the mold 20. Please continue to refer to Figure 18.

S270: forming the stretchable wire 100 on the side of the first functional element 210 away from the mold 20. Please continue to refer to Figure 19.

S280: Form the second functional element 220 on the side of the stretchable wire 100 away from the first functional element 210. Please continue to refer to Figure 20.

Specifically, in this embodiment, the first functional element 210 is first formed on one side of the mold 20, and then the stretchable wire 100 is formed on the side of the first functional element 210 away from the mold 20, and finally the stretchable wire The side of 100 away from the first functional element 210 forms a second functional element 220, wherein one end of the stretchable wire 100 is electrically connected to the first functional element 210, and the other end of the stretchable wire 100 is electrically connected to the second functional element 220. At this time, the first functional element 210 and the second functional element 220 are respectively located on opposite sides of the stretchable wire 100. When it is necessary to arrange the first functional element 210 and the second functional element 220 on the stretchable wire 100, respectively. For opposite sides, the preparation method of this embodiment can be used.

Please continue to refer to FIG. 21, FIG. 22 and FIG. 23. In one embodiment, the stretchable wire 100 includes a first wire 101 and a second wire 102 arranged at intervals. S200 includes but is not limited to S201 and S202, S201 and S202 are described in detail as follows.

S201: Form the first wire 101 and the second wire 102 on one side of the mold 20. Please continue to refer to Figure 22.

S202: forming the first functional element 210 and the second functional element 220 on the side of the first wire 101 and the second wire 102 away from the mold 20. Please continue to refer to Figure 23.

Specifically, in this embodiment, the stretchable wire 100 includes a first wire 101 and a second wire 102 arranged at intervals. The first wire 101 and the second wire 102 are first formed on one side of the mold 20, and then Then, a first functional element 210 and a second functional element 220 are formed on the side of the first wire 101 and the second wire 102 away from the mold 20, wherein one end of the first wire 101 is electrically connected to the first functional element 210, and the first wire The other end of the second wire 101 is electrically connected to the second functional element 220, one end of the second wire 102 is electrically connected to the first functional element 210, and the other end of the second wire 102 is electrically connected to the second functional element 220. At this time, the first functional element 210 and the second functional element 220 are both located on the same side of the first wire 101, and both the first functional element 210 and the second functional element 220 are located on the same side of the second wire 102. When the one functional element 210 and the second functional element 220 are both arranged on the same side of the first wire 101 and the second wire 102, the manufacturing method of this embodiment can be used.

It should be noted that there is no distinction between the first wire 101 and the second wire 102 in this embodiment. The first wire 101 and the second wire 102 are in the same position, and each functional element may have one , 2 or more ports, input and output the same or different signals, the corresponding stretchable wire can be 1, 2, or more. Each wire can be connected to the same or different signals. When the first wire 101 and the second wire 102 are connected to the same signal, and the first wire 101 is broken, the second wire 102 can be used to electrically connect the first functional element 210 and the second functional element 220. Similarly, when the first wire 101 and the second wire 102 are connected to the same signal, and the second wire 102 is broken, the first wire 101 can be used to electrically connect the first functional element 210 and the second functional element 220.

Please continue to refer to FIG. 24, FIG. 25, and FIG. 26. In one embodiment, the stretchable wire 100 includes a first wire 101 and a second wire 102 arranged at intervals, S200 includes but is not limited to S203 and S204, S203 and S204 are described in detail as follows.

S203: forming the first functional element 210 and the second functional element 220 on one side of the mold 20. Please continue to refer to Figure 25.

S204: forming the first wire 101 and the second wire 102 on the side of the first functional element 210 and the second functional element 220 away from the mold 20. Please continue to refer to Figure 26.

Specifically, in this embodiment, the stretchable wire 100 includes a first wire 101 and a second wire 102 arranged at intervals, and the first functional element 210 and the second functional element 220 are formed on one side of the mold 20 first. , And then form a first wire 101 and a second wire 102 on the side of the first functional element 210 and the second functional element 220 away from the mold 20, wherein one end of the first wire 101 is electrically connected to the first functional element 210, The other end of a wire 101 is electrically connected to the second functional element 220, one end of the second wire 102 is electrically connected to the first functional element 210, and the other end of the second wire 102 is electrically connected to the second functional element 220. At this time, the first functional element 210 and the second functional element 220 are both located on the same side of the first wire 101, and both the first functional element 210 and the second functional element 220 are located on the same side of the second wire 102. When the one functional element 210 and the second functional element 220 are both arranged on the same side of the first wire 101 and the second wire 102, the manufacturing method of this embodiment can be used.

Further, the hardness of the first functional element 210 and the second functional element 220 is greater than that of the stretchable wire 100. Using the preparation method of this embodiment, the first functional element 210 and the second functional element 220 are first formed on one side of the mold 20 , And then form the first wire 101 and the second wire 102 on the side of the first functional element 210 and the second functional element 220 away from the mold 20. Since the material of the first functional element 210 and the second functional element 220 is relatively hard, it is convenient for follow-up Separating the first functional element 210 and the second functional element 220 from the mold 20 helps to improve the manufacturing yield of the electronic component 10 and facilitate the mass production of the electronic component 10. Furthermore, there is no distinction between the first wire 101 and the second wire 102 in this embodiment. The first wire 101 and the second wire 102 are in the same position, and each functional element may have 1, 2 One or more ports, input and output the same or different signals, the corresponding stretchable wire can be 1, 2, or more. Each wire can be connected to the same or different signals. When the first wire 101 and the second wire 102 are connected to the same signal, and the first wire 101 is broken, the second wire 102 can be used to electrically connect the first functional element 210 and the second functional element 220. Similarly, when the first wire 101 and the second wire 102 are connected to the same signal, and the second wire 102 is broken, the first wire 101 can be used to electrically connect the first functional element 210 and the second functional element 220.

Please continue to refer to FIG. 27, FIG. 28, FIG. 29, and FIG. 30. In one embodiment, the stretchable wire 100 includes a first wire 101 and a second wire 102 arranged at intervals, and S200 includes but is not limited to S205 , S206 and S207, S205, S206 and S207 are described in detail as follows.

S205: Form the first functional element 210 on one side of the mold 20. Please continue to refer to Figure 28.

S206: forming the first wire 101 and the second wire 102 on the side of the first functional element 210 away from the mold 20. Please continue to refer to Figure 29.

S207: Form the second functional element 220 on the side of the first wire 101 and the second wire 102 away from the first functional element 210. Please continue to refer to Figure 30.

Specifically, in this embodiment, the stretchable wire 100 includes a first wire 101 and a second wire 102 arranged at intervals. The first functional element 210 is formed on one side of the mold 20, and then the first functional element 210 is formed on one side of the mold 20. The first wire 101 and the second wire 102 are formed on the side of the functional element 210 away from the mold 20, and finally the second functional element 220 is formed on the side of the first wire 101 and the second wire 102 away from the first functional element 210, wherein, One end of the first wire 101 is electrically connected to the first functional element 210, the other end of the first wire 101 is electrically connected to the second functional element 220, one end of the second wire 102 is electrically connected to the first functional element 210, and the second wire 102 The other end of is electrically connected to the second functional element 220. At this time, the first functional element 210 and the second functional element 220 are respectively located on two opposite sides of the first wire 101, and the first functional element 210 and the second functional element 220 are respectively located on two opposite sides of the second wire 102. When both the first functional element 210 and the second functional element 220 are arranged on both sides of the first wire 101 and the second wire 102, the preparation method of this embodiment can be used.

Further, there is no distinction between the first wire 101 and the second wire 102 in this embodiment. The first wire 101 and the second wire 102 are in the same position, and each functional element may have one or two. , Or multiple ports, input and output the same or different signals, the corresponding stretchable wire can be 1, 2, or more. Each wire can be connected to the same or different signals. When the first wire 101 and the second wire 102 are connected to the same signal, and the first wire 101 is broken, the second wire 102 can be used to electrically connect the first functional element 210 and the second functional element 220. Similarly, when the first wire 101 and the second wire 102 are connected to the same signal, and the second wire 102 is broken, the first wire 101 can be used to electrically connect the first functional element 210 and the second functional element 220.

Please continue to refer to FIG. 31, FIG. 32, FIG. 33, and FIG. 34. In an embodiment, the stretchable wire 100 includes a first wire 101 and a second wire 102 arranged at intervals, and S200 includes but is not limited to S2001 , S2002 and S2003. The details of S2001, S2002 and S2003 are as follows.

S2001: forming the first wire 101 on one side of the mold 20. Please continue to refer to Figure 32.

S2002: forming the first functional element 210 and the second functional element 220 on the side of the first wire 101 away from the mold 20. Please continue to refer to Figure 33.

S2003: forming a second wire 102 on the side of the first functional element 210 and the second functional element 220 away from the first wire 101. Please continue to refer to Figure 34.

Specifically, in this embodiment, the stretchable wire 100 includes a first wire 101 and a second wire 102 arranged at intervals. The first wire 101 is formed on one side of the mold 20, and then the first wire 101 is formed on the side of the mold 20. The first functional element 210 and the second functional element 220 are formed on the side of 101 away from the mold 20, and finally the second wire 102 is formed on the side of the first functional element 210 and the second functional element 220 away from the first wire 101, wherein, One end of the first wire 101 is electrically connected to the first functional element 210, the other end of the first wire 101 is electrically connected to the second functional element 220, one end of the second wire 102 is electrically connected to the first functional element 210, and the second wire 102 The other end of is electrically connected to the second functional element 220. At this time, the first functional element 210 and the second functional element 220 are located between the first wire 101 and the second wire 102. When it is necessary to arrange both the first functional element 210 and the second functional element 220 on the first wire 101 and the second wire 101 When between the two wires 102, the preparation method of this embodiment can be used.

Further, there is no distinction between the first wire 101 and the second wire 102 in this embodiment. The first wire 101 and the second wire 102 are in the same position, and each functional element may have one or two. , Or multiple ports, input and output the same or different signals, the corresponding stretchable wire can be 1, 2, or more. Each wire can be connected to the same or different signals. When the first wire 101 and the second wire 102 are connected to the same signal, and the first wire 101 is broken, the second wire 102 can be used to electrically connect the first functional element 210 and the second functional element 220. Similarly, when the first wire 101 and the second wire 102 are connected to the same signal, and the second wire 102 is broken, the first wire 101 can be used to electrically connect the first functional element 210 and the second functional element 220.

Please continue to refer to FIG. 35, FIG. 36, FIG. 37, FIG. 38, and FIG. 39. In one embodiment, the stretchable wire 100 includes a first wire 101 and a second wire 102 arranged at intervals, and S200 includes but It is not limited to S2004, S2005, S2006, and S2007, and details about S2004, S2005, S2006, and S2007 are described below.

S2004: forming the first wire 101 on one side of the mold 20. Please continue to refer to Figure 36.

S2005: forming the first functional element 210 on the side of the first wire 101 away from the mold 20. Please continue to refer to Figure 37.

S2006: forming a second wire 102 on the side of the first functional element 210 away from the first wire 101. Please continue to refer to Figure 38.

S2007: A second functional element 220 is formed on the side of the second wire 102 away from the first functional element 210. Please continue to refer to Figure 39.

Specifically, in this embodiment, the stretchable wire 100 includes a first wire 101 and a second wire 102 arranged at intervals. The first wire 101 is formed on one side of the mold 20, and then the first wire 101 is formed on the side of the mold 20. The side of 101 away from the mold 20 forms a first functional element 210, and then the side of the first functional element 210 away from the first wire 101 forms a second wire 102, and finally the second wire 102 is away from the first functional element 210 The second functional element 220 is formed on one side of the first wire 101, wherein one end of the first wire 101 is electrically connected to the first functional element 210, the other end of the first wire 101 is electrically connected to the second functional element 220, and one end of the second wire 102 is electrically connected to the second functional element 220. It is connected to the first functional element 210, and the other end of the second wire 102 is electrically connected to the second functional element 220. At this time, the first wire 101, the first functional element 210, the second wire 102, and the second functional element 220 are arranged alternately and stacked in sequence. When it is necessary to connect the first wire 101, the first functional element 210, the second wire 102, and the second wire When the two functional elements 220 are staggered and stacked in sequence, the manufacturing method of this embodiment can be used.

Further, there is no distinction between the first wire 101 and the second wire 102 in this embodiment. The first wire 101 and the second wire 102 are in the same position, and each functional element may have one or two. , Or multiple ports, input and output the same or different signals, the corresponding stretchable wire can be 1, 2, or more. Each wire can be connected to the same or different signals. When the first wire 101 and the second wire 102 are connected to the same signal, and the first wire 101 is broken, the second wire 102 can be used to electrically connect the first functional element 210 and the second functional element 220. Similarly, when the first wire 101 and the second wire 102 are connected to the same signal, and the second wire 102 is broken, the first wire 101 can be used to electrically connect the first functional element 210 and the second functional element 220.

Please continue to refer to FIG. 40, FIG. 41, FIG. 42, FIG. 43, and FIG. 44. In one embodiment, the stretchable wire 100 includes a first wire 101 and a second wire 102 arranged at intervals, and S200 includes but Not limited to S211, S212, S213, and S214, S211, S212, S213, and S214 are described in detail as follows.

S211: Form the first functional element 210 on one side of the mold 20. Please continue to refer to Figure 41.

S212: Form the first wire 101 on the side of the first functional element 210 away from the mold 20. Please continue to refer to Figure 42.

S213: A second functional element 220 is formed on the side of the first wire 101 away from the first functional element 210. Please continue to refer to Figure 43.

S214: Form a second wire 102 on a side of the second functional element 220 away from the first wire 101. Please continue to refer to Figure 44.

Specifically, in this embodiment, the stretchable wire 100 includes a first wire 101 and a second wire 102 arranged at intervals. The first functional element 210 is formed on one side of the mold 20, and then the first functional element 210 is formed on one side of the mold 20. The side of the functional element 210 away from the mold 20 forms a first wire 101, and then the side of the first wire 101 away from the first functional element 210 forms a second functional element 220, and finally the second functional element 220 is away from the first functional element 220. One side of the wire 101 forms a second wire 102, wherein one end of the first wire 101 is electrically connected to the first functional element 210, the other end of the first wire 101 is electrically connected to the second functional element 220, and one end of the second wire 102 It is electrically connected to the first functional element 210, and the other end of the second wire 102 is electrically connected to the second functional element 220. At this time, the first functional element 210, the first wire 101, the second functional element 220, and the second wire 102 are arranged alternately and stacked in sequence. When the first functional element 210, the first wire 101, the second functional element 220, and the When the second wires 102 are staggered and stacked in sequence, the preparation method of this embodiment can be used.

Further, there is no distinction between the first wire 101 and the second wire 102 in this embodiment. The first wire 101 and the second wire 102 are in the same position, and each functional element may have one or two. , Or multiple ports, input and output the same or different signals, the corresponding stretchable wire can be 1, 2, or more. Each wire can be connected to the same or different signals. When the first wire 101 and the second wire 102 are connected to the same signal, and the first wire 101 is broken, the second wire 102 can be used to electrically connect the first functional element 210 and the second functional element 220. Similarly, when the first wire 101 and the second wire 102 are connected to the same signal, and the second wire 102 is broken, the first wire 101 can be used to electrically connect the first functional element 210 and the second functional element 220.

Please continue to refer to FIG. 45. In one embodiment, before the S200, the method for preparing the electronic component further includes but is not limited to S110. The details of S110 are described below.

S110: forming a sacrificial layer 400 covering the mold 20. Please continue to refer to Figure 46.

Wherein, the sacrificial layer 400 may be dissolved by a specific liquid or etched by a gas.

Specifically, the material of the sacrificial layer 400 may be inorganic salts, inorganic oxides, organic polymers, metals, and the like. The sacrificial layer 400 can be dissolved by a specific liquid or etched by a gas. For example, inorganic salts can be dissolved by water, inorganic oxides can be dissolved by acids, alkalis, etc., organic polymers can be dissolved by organic solutions, developing solutions, etc., and metals can be dissolved by acids. , Alkali and so on.

Please continue to refer to FIG. 47. The S200 includes but is not limited to S215 and S216. The details of S215 and S216 are described below.

S215: forming a stretchable wire 100 on the surface of the sacrificial layer 400. Please continue to refer to Figure 48.

S216: Form the first functional element 210 and the second functional element 220 electrically connected to the two ends of the stretchable wire 100. Please continue to refer to Figure 49.

The S300 includes but is not limited to S317, and the detailed description of S317 is as follows.

S317: Form a first elastic substrate 300 covering the first functional element 210, the second functional element 220 and the stretchable wire 100. Please continue to refer to Figure 50.

The S400 includes but is not limited to S418, and S418 is described in detail as follows.

S418: Dissolve the sacrificial layer 400 (not shown) to separate the mold 20 and the electronic component 10. Please continue to refer to Figure 51.

Specifically, in this embodiment, the sacrificial layer 400 covering the mold 20 is formed first. The sacrificial layer 400 can be dissolved by liquid or etched by gas, and then the stretchable wire 100 covering the sacrificial layer 400 is formed, and the electrical The first functional element 210 and the second functional element 220 are connected to opposite ends of the stretchable wire 100, and then a first elastic substrate covering the first functional element 210, the second functional element 220 and the stretchable wire 100 is formed 300. Finally, the sacrificial layer 400 between the mold 20 and the stretchable wire 100 is removed, so that the mold 20 can be separated from the electronic component 10, and the electronic component 10 can be obtained.

Among them, the first elastic substrate 300 can encapsulate and protect the first functional element 210, the second functional element 220, and the stretchable wire 100. The material of the first elastic substrate 300 may be rubber, silica gel, thermoplastic elastomer, or the like. The method of forming the first elastic substrate 300 may be coating, vapor deposition, casting, embossing, and the like.

Please continue to refer to FIG. 52. In one embodiment, before the S200, the preparation method of the electronic component further includes but is not limited to S120 and S130. S120 and S130 are described in detail as follows.

S120: forming a flexible substrate 410 covering the mold 20. Please continue to refer to Figure 53.

Wherein, the material of the flexible substrate 410 may be a polyimide film. The flexible substrate 410 can be formed by coating, vapor deposition, or the like.

S130: Perform a patterning process on the flexible substrate 410. Please continue to refer to Figure 54.

Wherein, the method of patterning the flexible substrate 410 may be photolithography, screen printing, inkjet printing, and the like. Since the stacking sequence of electronic components is flexible substrate, stretchable wire and functional element, and first elastic substrate, the stretchable wire and functional element can be wrapped between the flexible substrate and the first elastic substrate, which has protection effect

It can be understood that, in other embodiments, after step S120, the stretchable wire 100 is directly formed on the flexible substrate 410, and then the flexible substrate 410 and the stretchable wire 100 are patterned at the same time, which can be omitted One manufacturing process simplifies the preparation process. It should be noted that the flexible substrate 410 and the stretchable wire 100 can be patterned at the same time, and both have the same shape; it is also possible to pattern the flexible substrate 410 first, and then pattern the stretchable wire 100, at this time The shapes of the two may be the same or different; the stretchable wire 100 may be patterned first, and then the flexible substrate 410 may be patterned. In this case, the shapes of the two may be the same or different.

Please continue to refer to FIG. 55. In one embodiment, the mold 20 is made of a soluble material. S400 includes but is not limited to S410. S410 is described in detail as follows.

S410: Dissolve the mold 20. Please continue to refer to Figure 56 and Figure 57.

Specifically, in this embodiment, the mold 20 is made of a soluble material, and the mold 20 itself can be dissolved by a specific liquid or etched by a gas. The prepared mold 20 and the mold 20 in the electronic component 10 are dissolved, whereby a single electronic component 10 can be obtained.

Further, the material of the mold 20 may be thermoplastic polyurethane elastomer rubber. The mold 20 can be dissolved by a strong polar organic solvent, such as dimethylformamide (DMF), methyl ethyl ketone, cyclohexanone, acetone, ethyl acetate, toluene, etc.

Please continue to refer to FIG. 58. In one embodiment, the surface adhesion of the mold 20 is less than a preset threshold. S400 also includes but is not limited to S420. S420 is described in detail as follows.

S420: Use a mechanical peeling method to separate the mold 20 and the electronic component 10. Please continue to refer to Figure 59 and Figure 60.

Specifically, in this embodiment, the surface adhesion of the mold 20 is less than the preset threshold, that is, the mold 20 has a low adhesion surface, that is, the surface adhesion of the mold 20 is relatively weak. At this time, It may be considered to separate the mold 20 and the electronic component 10 by means of mechanical peeling. That is, the electronic component 10 is peeled from the surface of the mold 20 by pulling force, so as to obtain an independent electronic component 10.

Please continue to refer to FIG. 61. In an implementation manner, S400 further includes but is not limited to S430, and S430 is described in detail as follows.

S430: Use a laser ablation method to separate the mold 20 and the electronic component 10. Please continue to refer to Figure 62 and Figure 63.

Specifically, in this embodiment, a laser ablation method is used to perform laser ablation on the connection part of the electronic component 10 and the mold 20 to separate the mold 20 and the electronic component 10 to obtain an independent electronic component 10.

Please continue to refer to FIG. 64, an embodiment of the present application also provides a mold 20, the mold 20 is used to prepare the electronic component 10, the mold 20 includes a substrate 202 and a shaped structure A, the shaped structure A is used to The wire 100 is stretched for shaping.

In one embodiment, the shaped structure A includes a corrugated groove formed on the surface of the substrate 202.

In another embodiment, the shaped structure A includes a plurality of protrusions 201 formed on the surface of the substrate 202, and the plurality of protrusions 201 are arranged at intervals on the surface of the substrate 202, The two adjacent protrusions 201 are smoothly connected.

Specifically, the two adjacent protrusions 201 are smoothly connected, that is, the protrusions 201 have a gentle slope. In the subsequent manufacturing process, the stretchable wire 100 is not easy to break when climbing, which helps to ensure The manufacturing yield of the electronic component 10. Among them, smooth connection means that the connection between adjacent protrusions 201 is relatively smooth, and there is no turning point of sudden curvature.

Further, since the adjacent protrusions 201 are smoothly connected, when the stretchable wire 100 is laid on the protrusion 201, the stretchable wire 100 will form a smoothly connected curved portion 100a, which can be stretched. The wire 100 will show a gentle bending state. At this time, the prepared stretchable wire 100 is not easy to break, which helps to ensure the service life of the electronic component 10.

Please continue to refer to FIG. 65, the substrate 202 includes a first substrate 202a and a second substrate 202b that are stacked, and the surface of the second substrate 202b away from the first substrate 202a has the protrusion 201, the The first substrate 202a and the second substrate 202b are independent structures.

Specifically, in this embodiment, the substrate 202 includes a first substrate 202a and a second substrate 202b that are stacked, and the protrusion 201 is provided on the second substrate 202b away from the first substrate 202a. At this time, the first substrate 202a can be a rigid substrate, and the second substrate 202b can be a soluble substrate. The protrusion 201 is provided on the surface of the second substrate 202b away from the first substrate 202a, and the electronic component 10 is subsequently protruded from the surface. In the process of separating the raised portion 201, the second substrate 202b and the raised portion 201 can be dissolved to obtain an independent electronic component 10.

Please refer to FIG. 64 again, the substrate 202 and the protrusion 201 are integrally arranged.

Specifically, the mold 20 is an integrated structure, that is, the substrate 202 and the protrusion 201 are formed together in the same processing step. At this time, the entire mold 20 can be made of soluble material, and the electronic component 10 is subsequently removed from the mold 20. In the upper separation process, the entire mold 20 can be dissolved to obtain an independent electronic component 10.

Please continue to refer to FIG. 66. In one embodiment, a plurality of the protrusions 201 are arranged on the surface of the substrate 202, and two adjacent protrusions 201 are smoothly connected.

Specifically, since the adjacent protrusions 201 are smoothly connected, when the stretchable wire 100 is laid on the protrusion 201, the stretchable wire 100 will form a smoothly connected curved portion 100a, which can be stretched. The wire 100 will show a gentle bending state. At this time, the prepared stretchable wire 100 is not easy to break, which helps to ensure the service life of the electronic component 10.

Further, the protruding portion 201 has a gentle slope, and in the subsequent manufacturing process, the stretchable wire 100 is not easily broken when climbing a slope, which helps to ensure the manufacturing yield of the electronic component 10. Among them, smooth connection means that the connection between adjacent protrusions 201 is relatively smooth, and there is no turning point of sudden curvature.

Please continue to refer to FIG. 67, the embodiment of the present application also provides a method for preparing a mold 20, the mold 20 is used to prepare the electronic component 10, the preparation method of the mold 20 includes but not limited to W100, W200, W300, W400 and W500, about W100, W200, W300, W400 and W500 are introduced in detail as follows.

W100: Provide base material 500. Please continue to refer to Figure 68.

Wherein, the substrate 500 may be a rigid substrate 500.

W200: forming a photoresist layer 510 covering the substrate 500. Please continue to refer to Figure 69.

Specifically, in this embodiment, the photoresist layer 510 may be a "positive photoresist". The developed photoresist has a narrow cross-section and a wide sidewall with a certain slope. After etching, the protrusion 201 on the mold 20 is also Has a gentle slope. In the subsequent manufacturing process, the wire is not easy to break when climbing. It can be understood that, in other embodiments, the photoresist layer 510 may be a “negative photoresist”.

Among them, photoresist can be mainly divided into two types: positive photoresist and negative photoresist. Positive photoresist means that the part irradiated by light can be removed by the developer, while the unexposed photoresist will not be removed by the developer. The opposite is true for negative photoresist. The part irradiated by the light will not be removed by the developer, and the rest of the area not irradiated by the light will be removed by the developer.

W300: A photomask 520 is provided on the side of the photoresist layer 510 away from the substrate 500, and the photomask 520 has gaps 521 arranged at intervals. Please continue to refer to Figure 70.

W400: illuminate the side of the photomask 520 away from the photoresist.

W500: Perform an etching process on the photoresist layer 510 formed after illumination, so that the mold 20 has a shaped structure A. Please continue to refer to Figure 71.

Specifically, vertical light is used to irradiate the photomask 520, the light irradiated on the photomask 520 cannot pass through, and the light irradiated in the gaps of the photomask 520 can pass through, so the light that is located under the photomask 520 can be irradiated. The photoresist layer 510 is etched to obtain a mold 20 having a specific shape.

Please continue to refer to FIG. 72, FIG. 73, and FIG. 74. In one embodiment, the substrate 500 includes a first sub-substrate 501 and a second sub-substrate 502. W100 includes but is not limited to W110 and W120. And W120 are described in detail as follows.

W110: Provide the first sub-base 501.

W120: forming a second sub-substrate 502 covering the first sub-substrate 501.

Specifically, in this embodiment, the substrate 500 includes a first sub-substrate 501 and a second sub-substrate 502 that are stacked, and the first sub-substrate 501 and the second sub-substrate 502 are independent of each other. . The first sub-substrate 501 may be a rigid substrate, and the second sub-substrate 502 may be a soluble material. In the subsequent process of separating the electronic component 10 from the mold 20, the second sub-substrate 502 may be dissolved to Obtain an independent electronic component 10.

Please continue to refer to Figure 75. W200 includes but is not limited to W210. Details about W210 are as follows.

W210: forming a photoresist layer 510 covering the second sub-substrate 502. Please continue to refer to Figure 76.

Specifically, in this embodiment, the photoresist layer 510 may be a "positive photoresist". The developed photoresist has a narrow cross section and a wide sidewall with a certain slope. The rising portion 201 also has a gentle slope. In the subsequent manufacturing process, the wire is not easy to break when climbing. It can be understood that, in other embodiments, the photoresist layer 510 may be a “negative photoresist”.

Please continue to refer to Figure 77. W300 includes but is not limited to W310. The detailed description of W310 is as follows.

W310: A photomask 520 is provided on the side of the photoresist layer 510 away from the second sub-substrate 502. Please continue to refer to Figure 78.

Specifically, vertical light is used to irradiate the photomask 520, the light irradiated on the photomask 520 cannot pass through, and the light irradiated in the gaps of the photomask 520 can pass through, so the light that is located under the photomask 520 can be irradiated. The photoresist layer 510 is etched to obtain a mold 20 having a specific shape.

Please continue to refer to FIG. 79. The electronic component 10 provided by the embodiment of the present application includes a first elastic substrate 300, a stretchable wire 100, a first functional element 210, and a second functional element 220. The stretchable wire 100, the The first functional element 210 and the second functional element 220 are located on the same side of the first elastic substrate 300, and opposite ends of the stretchable wire 100 are electrically connected to the first functional element 210 and the Mentioned second functional element 220.

In one embodiment, the first functional element 210 and the second functional element 220 are located on one side of the first elastic substrate 300, and the stretchable wire 100 is located on the first functional element 210 And a side of the second functional element 220 away from the first elastic substrate 300. It should be noted that the number of functional elements is not limited to two, that is, the number of functional elements can be more than two. If the electronic component is a flexible display screen, the number of functional elements can be millions, with millions of functions. The components are electrically connected by stretchable wires to form a mesh structure.

In the electronic component 10 provided by the embodiment of the present application, the stretchable wire 100, the first functional element 210, and the second functional element 220 are all carried on the first elastic substrate 300, and the first elastic substrate 300 can be used for the stretchable wire 100. The first functional element 210 and the second functional element 220 form support and protection, which helps to prolong the service life of the electronic component 10.

Please continue to refer to FIG. 80, the stretchable wire 100 is located on one side of the first elastic substrate 300, and the first functional element 210 and the second functional element 220 are located away from the stretchable wire 100 One side of the first elastic substrate 300.

Please continue to refer to FIG. 81, the first functional element 210 is located on one side of the first elastic substrate 300, and the stretchable wire 100 is located on the first functional element 210 away from the first elastic substrate 300 The second functional element 220 is located on the side of the stretchable wire 100 away from the first functional element 210.

Please continue to refer to FIG. 82, the stretchable wire 100 includes a first wire 101 and a second wire 102 arranged at intervals, and the first wire 101 and the second wire 102 are located on a side of the first elastic substrate 300. On the other hand, the first functional element 210 and the second functional element 220 are located on the side of the first wire 101 and the second wire 102 away from the first elastic substrate 300.

In this embodiment, there is no distinction between the first wire 101 and the second wire 102. The first wire 101 and the second wire 102 are in the same position, and each functional element may have 1, 2, or more Two ports, input and output the same or different signals, the corresponding stretchable wires can be one, two, or more. Each wire can be connected to the same or different signals. When the first wire 101 and the second wire 102 are connected to the same signal, and the first wire 101 is broken, the second wire 102 can be used to electrically connect the first functional element 210 and the second functional element 220. Similarly, when the first wire 101 and the second wire 102 are connected to the same signal, and the second wire 102 is broken, the first wire 101 can be used to electrically connect the first functional element 210 and the second functional element 220.

Please continue to refer to FIG. 83, the stretchable wire 100 includes a first wire 101 and a second wire 102 arranged at intervals, and the first functional element 210 and the second functional element 220 are located on the first elastic substrate 300 The first wire 101 and the second wire 102 are located on the side of the first functional element 210 and the second functional element 220 away from the first elastic substrate 300.

Please continue to refer to FIG. 84, the stretchable wire 100 includes a first wire 101 and a second wire 102 arranged at intervals, the first functional element 210 is located on one side of the first elastic substrate 300, the The first wire 101 and the second wire 102 are located on the side of the first functional element 210 away from the first elastic substrate 300, and the second functional element 220 is located on the first wire 101 and the second The side of the second wire 102 facing away from the first functional element 210.

Please continue to refer to FIG. 85. The stretchable wire 100 includes a first wire 101 and a second wire 102 arranged at intervals. The first wire 101 is located on one side of the first elastic substrate 300. A functional element 210 and the second functional element 220 are located on the side of the first wire 101 away from the first elastic substrate 300, and the second wire 102 is located on the first functional element 210 and the first elastic substrate 300. The side of the second functional element 220 away from the first wire 101.

Please continue to refer to FIG. 86. The stretchable wire 100 includes a first wire 101 and a second wire 102 arranged at intervals. The first wire 101 is located on one side of the first elastic substrate 300. A functional element 210 is located on the side of the first wire 101 away from the first elastic substrate 300, and the second wire 102 is located on the side of the first functional element 210 away from the first wire 101, so The second functional element 220 is located on a side of the second wire 102 away from the first functional element 210.

Please continue to refer to FIG. 87, the stretchable wire 100 includes a first wire 101 and a second wire 102 arranged at intervals, the first functional element 210 is located on one side of the first elastic substrate 300, the The first wire 101 is located on the side of the first functional element 210 away from the first elastic substrate 300, and the second functional element 220 is located on the first wire 101 away from the first function On one side of the element 210, the second wire 102 is located on the side of the second functional element 220 away from the first wire 101.

Please continue to refer to FIG. 88, the electronic component 10 further includes a second elastic substrate 310, and the stretchable wire 100, the first functional element 210, and the second functional element 220 are located on the second elastic base. Between the material 310 and the first elastic substrate 300, the second elastic substrate 310 and the first elastic substrate 300 cooperate with each other to resist the stretchable wire 100 and the first functional element 210. It forms an encapsulation protection with the second functional element 220.

In the electronic component 10 in the embodiment of the present application, the stretchable wire 100, the first functional element 210, and the second functional element 220 are arranged between the first elastic substrate 300 and the second elastic substrate 310, and the first elastic The substrate 300 and the second elastic substrate 310 encapsulate and protect the stretchable wire 100, the first functional element 210, and the second functional element 220, which can prolong the service life of the electronic component 10.

In addition, it should be noted that the electronic component 10 may also include a flexible substrate 410, the flexible substrate 410 is encapsulated between the first elastic substrate 300 and the second elastic substrate 310, and the flexible substrate 410 is located The stretchable wire 100 is away from the side of the first elastic substrate 300.

Finally, it should be noted that the above embodiments are only used to illustrate the technical solutions of the present invention, not to limit them; although the present invention has been described in detail with reference to the foregoing embodiments, those of ordinary skill in the art should understand: The protection scope is not limited to this, and any changes or substitutions that can be easily conceived by those skilled in the art within the technical scope disclosed in the present invention should be covered by the protection scope of the present invention. Therefore, the protection scope of the present invention should be subject to the protection scope of the claims.

Claims (41)

An electronic component, characterized in that the electronic component comprises a first elastic substrate, a stretchable wire, a first functional element and a second functional element, the stretchable wire, the first functional element and the The second functional element is located on the same side of the first elastic substrate, and opposite ends of the stretchable wire are electrically connected to the first functional element and the second functional element, respectively. The electronic component of claim 1, wherein the stretchable wire is located on one side of the first elastic substrate, and the first functional element and the second functional element are located on the stretchable The side of the extending wire away from the first elastic substrate. The electronic component of claim 1, wherein the first functional element and the second functional element are located on one side of the first elastic substrate, and the stretchable wire is located on the first The functional element and the second functional element are away from the side of the first elastic substrate. The electronic component of claim 1, wherein the first functional element is located on a side of the first elastic substrate, and the stretchable wire is located away from the first functional element. On one side of the elastic substrate, the second functional element is located on the side of the stretchable wire away from the first functional element. The electronic component of claim 1, wherein the stretchable wire comprises a first wire and a second wire arranged at intervals, and the first wire and the second wire are located in the first elastic wire. On one side of the substrate, the first functional element and the second functional element are located on the side of the first wire and the second wire away from the first elastic substrate. The electronic component of claim 1, wherein the stretchable wire comprises a first wire and a second wire arranged at intervals, and the first functional element and the second functional element are located in the first On one side of an elastic substrate, the first wire and the second wire are located on the side of the first functional element and the second functional element away from the first elastic substrate. The electronic component of claim 1, wherein the stretchable wire comprises a first wire and a second wire arranged at intervals, and the first functional element is located on one side of the first elastic substrate , The first wire and the second wire are located on the side of the first functional element away from the first elastic substrate, and the second functional element is located on the side away from the first wire and the second wire One side of the first functional element. 5. The electronic component of claim 1, wherein the stretchable wire comprises a first wire and a second wire arranged at intervals, and the first wire is located on one side of the first elastic substrate, The first functional element and the second functional element are located on the side of the first wire away from the first elastic substrate, and the second wire is located on the first functional element and the second functional element The side away from the first wire. 5. The electronic component of claim 1, wherein the stretchable wire comprises a first wire and a second wire arranged at intervals, and the first wire is located on one side of the first elastic substrate, The first functional element is located on the side of the first wire away from the first elastic substrate, the second wire is located on the side of the first functional element away from the first wire, and the second wire is located on the side of the first functional element away from the first wire. The functional element is located on the side of the second wire away from the first functional element. The electronic component of claim 1, wherein the stretchable wire comprises a first wire and a second wire arranged at intervals, and the first functional element is located on one side of the first elastic substrate , The first wire is located on the side of the first functional element away from the first elastic substrate, the second functional element is located on the side of the first wire away from the first functional element, the The second wire is located on a side of the second functional element away from the first wire. 5. The electronic component of claim 1, further comprising a flexible substrate, the flexible substrate being located on a side of the stretchable wire away from the first elastic substrate. The electronic component according to any one of claims 1-11, wherein the electronic component further comprises a second elastic substrate, the stretchable wire, the first functional element and the second functional element The element is located between the second elastic base material and the first elastic base material, and the second elastic base material and the first elastic base material cooperate with each other to resist the stretchable wire and the first elastic base material. The functional element and the second functional element form package protection. A method for manufacturing an electronic component, characterized in that, the method for manufacturing the electronic component includes: Provide molds; Forming a stretchable wire on one side of the mold; Forming a first elastic substrate covering the stretchable wire; Remove the mold. The method of manufacturing an electronic component according to claim 13, wherein the surface of the mold is provided with a shaped structure, and the forming of a stretchable wire on one side of the mold comprises: forming a stretchable wire through the shaped structure Stretch the wire. 15. The method of manufacturing an electronic component according to claim 13, wherein before forming the stretchable wire on one side of the mold, the method further comprises forming a flexible substrate covering the mold. The method for manufacturing an electronic component according to claim 14, wherein the shaped structure comprises a plurality of protrusions formed on the surface of the mold, and the two adjacent protrusions are smoothly connected, and the The stretchable wire is arranged on the convex part to form a plurality of curved parts connected smoothly in sequence. 15. The method of manufacturing an electronic component according to claim 14, wherein the shaped structure comprises a wave groove opened on the surface of the mold, and the stretchable wire is formed in the wave groove. 17. The method for manufacturing an electronic component according to any one of claims 13-17, wherein the opposite ends of the stretchable wire are respectively connected to the first functional element and the second functional element. 18. The method of manufacturing an electronic component according to claim 18, wherein the opposite ends of the stretchable wire connected to the first functional element and the second functional element respectively comprise: Forming the stretchable wire on one side of the mold; The first functional element and the second functional element are formed on the side of the stretchable wire away from the mold. 18. The method of manufacturing an electronic component according to claim 18, wherein the opposite ends of the stretchable wire connected to the first functional element and the second functional element respectively comprise: Forming the first functional element and the second functional element on one side of the mold; The stretchable wire is formed on the side of the first functional element and the second functional element away from the mold. 18. The method of manufacturing an electronic component according to claim 18, wherein the opposite ends of the stretchable wire connected to the first functional element and the second functional element respectively comprise: Forming the first functional element on one side of the mold; Forming the stretchable wire on the side of the first functional element away from the mold; The second functional element is formed on the side of the stretchable wire away from the first functional element. The method for manufacturing an electronic component according to claim 18, wherein the stretchable wire comprises a first wire and a second wire arranged at intervals, wherein the opposite ends of the stretchable wire are respectively connected to the first wire. The functional element and the second functional element include: Forming the first wire and the second wire on one side of the mold; The first functional element and the second functional element are formed on the side of the first wire and the second wire away from the mold. The method for manufacturing an electronic component according to claim 18, wherein the stretchable wire comprises a first wire and a second wire arranged at intervals, wherein the opposite ends of the stretchable wire are respectively connected to the first wire. The functional element and the second functional element include: Forming the first functional element and the second functional element on one side of the mold; The first wire and the second wire are formed on the side of the first functional element and the second functional element away from the mold. The method for manufacturing an electronic component according to claim 18, wherein the stretchable wire comprises a first wire and a second wire arranged at intervals, wherein the opposite ends of the stretchable wire are respectively connected to the first wire. The functional element and the second functional element include: Forming the first functional element on one side of the mold; Forming the first wire and the second wire on the side of the first functional element away from the mold; The second functional element is formed on the side of the first wire and the second wire away from the first functional element. The method for manufacturing an electronic component according to claim 18, wherein the stretchable wire comprises a first wire and a second wire arranged at intervals, wherein the opposite ends of the stretchable wire are respectively connected to the first wire. The functional element and the second functional element include: Forming the first wire on one side of the mold; Forming the first functional element and the second functional element on the side of the first wire facing away from the mold; A second wire is formed on the side of the first functional element and the second functional element away from the first wire. The method for manufacturing an electronic component according to claim 18, wherein the stretchable wire comprises a first wire and a second wire arranged at intervals, wherein the opposite ends of the stretchable wire are respectively connected to the first wire. The functional element and the second functional element include: Forming the first wire on one side of the mold; Forming the first functional element on the side of the first wire facing away from the mold; Forming a second wire on the side of the first functional element away from the first wire; A second functional element is formed on the side of the second wire away from the first functional element. The method for manufacturing an electronic component according to claim 18, wherein the stretchable wire comprises a first wire and a second wire arranged at intervals, wherein the opposite ends of the stretchable wire are respectively connected to the first wire. The functional element and the second functional element include: Forming the first functional element on one side of the mold; Forming the first wire on the side of the first functional element away from the mold; Forming a second functional element on the side of the first wire away from the first functional element; A second wire is formed on the side of the second functional element away from the first wire. The method of manufacturing an electronic component according to claim 18, wherein the electronic component is connected to the first functional element and the second functional element before the opposite ends of the providing mold and the stretchable wire are respectively connected to the first functional element and the second functional element. The preparation method also includes: Forming a sacrificial layer covering the mold; Connecting opposite ends of the stretchable wire to the first functional element and the second functional element respectively includes: Forming a stretchable wire on the surface of the sacrificial layer; Forming a first functional element and a second functional element electrically connected to both ends of the stretchable wire; Forming a first elastic substrate covering the first functional element, the second functional element and the stretchable wire; The sacrificial layer is dissolved to separate the mold and the electronic component. The method for manufacturing an electronic component according to claim 13, wherein the mold is made of a dissolvable material, wherein the "removing the mold" includes: dissolving the mold. The method for manufacturing an electronic component according to claim 13, wherein the surface adhesion of the mold is less than a preset threshold, wherein the "removing the mold" further comprises: using a mechanical peeling method to make the The mold is separated from the electronic component. The method for manufacturing an electronic component according to claim 13, wherein the "removing the mold" further comprises: using a laser ablation method to separate the mold and the electronic component. A mold for preparing electronic components, characterized in that the mold includes a substrate and a shaped structure, and the shaped structure is used for shaping a stretchable wire. The mold of claim 32, wherein the shaped structure comprises a wave groove formed on the surface of the substrate. The mold according to claim 32, wherein the shaped structure comprises a plurality of protrusions formed on the surface of the substrate, and the plurality of protrusions are arranged at intervals on the surface of the substrate, There is a smooth connection between two adjacent protrusions. The mold according to claim 34, wherein the substrate comprises a first substrate and a second substrate that are stacked, and the surface of the second substrate facing away from the first substrate has the protrusion, so The first substrate and the second substrate are independent structures. The mold according to claim 34, wherein the substrate and the protrusion are integrally provided. The mold according to claim 34, wherein a plurality of the protrusions are arranged on the surface of the substrate, and two adjacent protrusions are smoothly connected. A method for preparing a mold, which is used for preparing electronic components, characterized in that, the method for preparing the mold includes: Provide substrate; Forming a photoresist layer covering the substrate; Disposing a photomask on the side of the photoresist layer away from the substrate, the photomask having gaps arranged at intervals; Irradiate light on the side of the photomask away from the photoresist; The photoresist layer formed after illumination is etched, so that the mold has a shaped structure. The method of manufacturing a mold according to claim 38, wherein the shaped structure comprises a wave groove formed on the surface of the substrate. The method for preparing a mold according to claim 38, wherein the shaped structure comprises a plurality of protrusions formed on the surface of the substrate, and two adjacent protrusions are smoothly connected. The method for preparing the mold according to claim 38, wherein the substrate comprises a first sub-substrate and a second sub-substrate, characterized in that: The provided substrate includes: Provide the first sub-substrate; Forming a second sub-substrate covering the first sub-substrate; The forming of the photoresist layer covering the substrate includes: Forming a photoresist layer covering the second sub-substrate; The step of disposing a photomask on the side of the photoresist layer away from the substrate includes: A photomask is provided on the side of the photoresist layer away from the second sub-substrate.

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