WO2020209026A1 - Cu-(ni,co)-si alloy wire, insulated wire, method for producing cu-(ni,co)-si alloy wire, and method for producing insulated wire - Google Patents
Cu-(ni,co)-si alloy wire, insulated wire, method for producing cu-(ni,co)-si alloy wire, and method for producing insulated wire Download PDFInfo
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- WO2020209026A1 WO2020209026A1 PCT/JP2020/012115 JP2020012115W WO2020209026A1 WO 2020209026 A1 WO2020209026 A1 WO 2020209026A1 JP 2020012115 W JP2020012115 W JP 2020012115W WO 2020209026 A1 WO2020209026 A1 WO 2020209026A1
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- C—CHEMISTRY; METALLURGY
- C22—METALLURGY; FERROUS OR NON-FERROUS ALLOYS; TREATMENT OF ALLOYS OR NON-FERROUS METALS
- C22C—ALLOYS
- C22C9/00—Alloys based on copper
- C22C9/06—Alloys based on copper with nickel or cobalt as the next major constituent
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- C—CHEMISTRY; METALLURGY
- C22—METALLURGY; FERROUS OR NON-FERROUS ALLOYS; TREATMENT OF ALLOYS OR NON-FERROUS METALS
- C22F—CHANGING THE PHYSICAL STRUCTURE OF NON-FERROUS METALS AND NON-FERROUS ALLOYS
- C22F1/00—Changing the physical structure of non-ferrous metals or alloys by heat treatment or by hot or cold working
- C22F1/08—Changing the physical structure of non-ferrous metals or alloys by heat treatment or by hot or cold working of copper or alloys based thereon
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01B—CABLES; CONDUCTORS; INSULATORS; SELECTION OF MATERIALS FOR THEIR CONDUCTIVE, INSULATING OR DIELECTRIC PROPERTIES
- H01B13/00—Apparatus or processes specially adapted for manufacturing conductors or cables
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01B—CABLES; CONDUCTORS; INSULATORS; SELECTION OF MATERIALS FOR THEIR CONDUCTIVE, INSULATING OR DIELECTRIC PROPERTIES
- H01B5/00—Non-insulated conductors or conductive bodies characterised by their form
- H01B5/02—Single bars, rods, wires, or strips
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01B—CABLES; CONDUCTORS; INSULATORS; SELECTION OF MATERIALS FOR THEIR CONDUCTIVE, INSULATING OR DIELECTRIC PROPERTIES
- H01B7/00—Insulated conductors or cables characterised by their form
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- C—CHEMISTRY; METALLURGY
- C22—METALLURGY; FERROUS OR NON-FERROUS ALLOYS; TREATMENT OF ALLOYS OR NON-FERROUS METALS
- C22F—CHANGING THE PHYSICAL STRUCTURE OF NON-FERROUS METALS AND NON-FERROUS ALLOYS
- C22F1/00—Changing the physical structure of non-ferrous metals or alloys by heat treatment or by hot or cold working
Definitions
- the present invention relates to a method for manufacturing a Cu- (Ni, Co) -Si alloy wire, an insulated wire, a Cu- (Ni, Co) -Si alloy wire, and a method for manufacturing an insulated wire.
- next-generation vehicles such as quick charging of mobile devices and plug-in hybrid vehicles and electric vehicles
- high-voltage and large-current circuits are required, and a large current tends to flow through the connector. Therefore, the connector material is required to have "high conductivity" in order to suppress energy loss when energized with a large current and deterioration of connection reliability due to stress relaxation progress due to heat generation.
- connectors for electronic devices and automobile parts are becoming smaller, lighter, and more precise, and Cu alloys, which are materials for connectors, are required to have "high strength" and "excellent elongation".
- Cu- (Ni, Co) -Si based alloys have been attracting attention as Cu alloys satisfying these required characteristics.
- Patent Document 1 discloses a Cu—Co—Si based alloy and a method for producing the same. According to the technique of Patent Document 1, fine second-phase particles having a particle size of 50 nm or less are divided into second-phase particles having a particle size of 5-10 nm and second-phase particles having a particle size of 10-50 nm. The number density and ratio of these particles are controlled to improve the settling resistance while maintaining high conductivity and strength.
- Patent Document 2 discloses a technique in which a Cu- (Ni, Co) -Si alloy is applied to a conductor wire rod for an electronic device. According to the technique of Patent Document 2, the addition amount ratio of (Ni, Co) and Si is controlled, and the cold working ratio before and after the aging heat treatment is adjusted to improve the conductivity and strength.
- the conductivity is 40% IACS or more
- the tensile strength is 400 MPa or more
- the elongation is 5% or more
- Patent Documents 1 and 2 can be applied to wiring applications such as electronic parts, automobiles, and robots by using Cu- (Ni, Co) -Si alloy as a wire rod. It is not mentioned whether or not the connector terminals can be attached with a certain degree of flexibility when they are actually crimped, and it is unclear whether or not they are truly suitable for the wiring application. That is, when the connector terminals are crimped, the metal structure of the Cu- (Ni, Co) -Si alloy wire is partially stretched (strained) and the strength is increased, but the elongation is considered to decrease accordingly.
- a main object of the present invention is Cu- having the same conductivity, strength and elongation as the techniques of Patent Documents 1 and 2 and flexibility (Vickers hardness of 150 HV or more and 200 HV or less) suitable for crimping of connector terminals.
- the purpose of the present invention is to provide (Ni, Co) -Si alloy wire rods.
- Si-based alloy wire Provided is a Cu- (Ni, Co) -Si based alloy wire rod characterized in that the crystal grain size (average value) of Cu matrix particles is 0.8 to 2.6 ⁇ m.
- a Cu- (Ni, Co) -Si alloy wire having flexibility (Vickers hardness of 150 HV or more and 200 HV or less) suitable for crimping of a connector terminal in addition to conductivity, strength and elongation. (See Examples 1 and 2 below).
- a Cu- (Ni, Co) -Si alloy wire rod and an insulated wire containing the Cu- (Ni, Co) -Si alloy wire according to a preferred embodiment of the present invention will be described, and then a method for manufacturing the insulated wire (Cu- (Ni, Co) -Si.
- a method for manufacturing a system alloy wire rod is included.
- the lower limit value and the upper limit value are included in the numerical range with respect to the description of “ ⁇ ” indicating the numerical range.
- Cu- (Ni, Co) -Si-based alloy wire is an alloy wire having Cu as a matrix, and at least one of Ni or Co is 1.6. It contains ⁇ 2.1 atomic% (preferably 1.7-2.0 atomic%) and contains 0.8-1.0 atomic% of Si, and has a composition in which the balance is Cu and unavoidable impurities. There is. "At least one of Ni or Co” means either one of Ni or Co, or both Ni and Co.
- a fine second metal mainly composed of (Ni, Co) and Si intermetallic compounds is subjected to appropriate heat treatment (including aging annealing).
- Phase particles are precipitated, and the second phase particles are present as precipitates.
- Phase 2 particles mainly means (Ni, Co) 2 Si, which are the crystallization generated in the solidification process of the melting and casting process described later, the precipitates generated in the subsequent cooling process, and the aging annealing process. It refers to a precipitate generated in the process, and the second phase particles also include second phase particles containing unavoidable impurities.
- the crystal grain size (mean value) of the Cu matrix particles is 0.8 to 2.6 ⁇ m, preferably 1.5 to 1.9 ⁇ m.
- the "crystal particle size” is a value based on JIS-H0501 (copper product crystal particle size test method).
- the method for displaying the crystal grain size and the method for cutting are as follows. How to display the crystal grain size; The crystal grain size is indicated in mm. For example, it is expressed as 0.025 mm. The following method is used to round the calculated or observed crystal grain size. In the case of 0.010 mm or less, the value closest to an integral multiple of 0.001 mm is adopted. If it exceeds 0.010 mm and is 0.060 mm or less, the value closest to an integral multiple of 0.005 mm is adopted. If it exceeds 0.060 mm, the value closest to an integral multiple of 0.010 mm is adopted.
- the crystal grain size is indicated by counting the number of crystal grains that are completely cut by a line segment of a known length on a microscope image or a photograph, and displaying the average value (mm) of the cutting length. If necessary, measure along three axes parallel and perpendicular to the machining direction. The value measured by the cutting method may be smaller than the value measured by the quadrature method.
- the above Cu- (Ni, Co) -Si alloy wire has flexibility with a Vickers hardness of 150 HV or more and 200 HV or less in accordance with JIS C 2244, and wiring for automobiles (wire harnesses for automobiles) and robots. Suitable for applications.
- the applications of Cu- (Ni, Co) -Si alloy wire rods are not limited to these applications, but can also be applied to wiring applications for electronic components, and can be applied to all applications including electrical connection.
- FIG. 1 is a cross-sectional view showing a schematic configuration of an insulated wire.
- the insulated wire 1 has a conductor portion 10 and a covering portion 20.
- the conductor portion 10 is formed by twisting a plurality of wire rods 12.
- the conductor portion 10 may be composed of one wire rod 12 (single wire).
- the wire rod 12 is composed of the above Cu— (Ni, Co) —Si alloy wire rod.
- the coating portion 20 is a so-called sheath (coating) that insulates and coats the conductor portion 10, and is configured by extruding and coating a polyvinyl chloride resin (PVC: Poly Vinyl Chloride).
- the covering portion 20 is not limited to PVC and may be made of a known insulator such as cross-linked polyethylene.
- FIG. 2 is a flowchart showing a manufacturing method of the insulated wire over time.
- each of the melting / casting process S1, the wire drawing process S2, the aging annealing process S3, the stranded wire processing process S4, and the insulation coating process S5 is performed in this order. Is done.
- the raw material is melted at 1100-1300 ° C., containing at least one of Ni or Co in an amount of 1.6 to 2.1 atomic% and Si in an amount of 0.8 to 1.0 atomic%.
- a composition (molten metal) in which the balance is composed of Cu and unavoidable impurities is prepared.
- the "raw material” contains at least one of Ni or Co in an amount of 1.6 to 2.1 atomic% (preferably 1.7 to 2.0 atomic%) and Si in an amount of 0.8 to 1.
- the composition may contain 0 atomic% and the balance may be composed of Cu and unavoidable impurities, and may be a simple substance in which (Ni, Co), Si and Cu are separately present at the stage before dissolution.
- the melt (raw material after melting, molten metal) is poured into a mold and cooled to room temperature within 5 minutes to 1 hour, preferably within 5 to 30 minutes, and a bar having a constant diameter is cast.
- the bar is drawn at a constant surface reduction rate to produce a wire having a constant diameter.
- the wire rod is heated at 300 to 600 ° C. for 0.5 to 4 hours for aging annealing.
- fine second-phase particles mainly composed of (Ni, Co) and Si intermetallic compounds are precipitated, and the distortion of the metal structure generated in the wire drawing step S2 is removed.
- a Cu- (Ni, Co) -Si alloy wire can be produced by the processes from the melting / casting step S1 to the aging annealing step S3.
- a plurality of wire rods after aging annealing are twisted and compressed to manufacture a stranded wire conductor.
- the process of the stranded wire processing step S4 may be performed after the wire drawing process step S2 and before the aging annealing step S3 (between the wire drawing process S2 and the aging annealing step S3).
- the insulation coating step S5 PVC is extruded and coated on the stranded conductor, and the stranded conductor is insulated and coated with PVC.
- An insulated wire can be manufactured by the processes from the melting / casting step S1 to the insulating coating step S5.
- the crystal grain size of the Cu matrix particles is remarkably larger than that of the sample 4-6, and the second phase particles are largely distributed in the crystal grains.
- the correlation between the composition ratio of Cu, Co, and Si, the metallographic state, and the Vickers hardness is whether the composition ratio of Co and Si is within an appropriate range, or the second phase particles are the crystal grains of the Cu parent phase. It is considered that this is due to whether it is distributed abundantly in the boundary or in the crystal grains, and contains 1.6 to 2.1 atomic% of Co, 0.8 to 1.0 atomic% of Si, and Cu. It was found that the crystal grain size (average value) of the matrix phase of 0.8 to 2.6 ⁇ m is useful for flexibility.
- a stranded conductor was produced from Samples 1-8 and 20 of Example 1 and its conductivity, tensile strength and elongation were measured.
- the present invention relates to Cu- (Ni, Co) -Si alloy wire rods, and is suitably used for wiring applications such as automobiles (wire harnesses for automobiles) and robots.
- Insulation coating process 1 Insulated wire 10 Conductor part 12 Wire rod 20 Coating part S1 Melting / casting process S2 Wire drawing process S3 Aging annealing process S4 Twisted wire processing process S5 Insulation coating process
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Abstract
Description
本発明はCu-(Ni,Co)-Si系合金線材、絶縁電線、Cu-(Ni,Co)-Si系合金線材の製造方法および絶縁電線の製造方法に関する。 The present invention relates to a method for manufacturing a Cu- (Ni, Co) -Si alloy wire, an insulated wire, a Cu- (Ni, Co) -Si alloy wire, and a method for manufacturing an insulated wire.
モバイル機器の急速充電や、プラグインハイブリッド自動車および電気自動車などの次世代自動車では、高電圧大電流回路が求められ、コネクタにより大きな電流が流れる傾向にある。そのためコネクタ用材料には、大電流通電時のエネルギーロスや発熱による応力緩和進行に伴う接続信頼性の低下などを抑制するため「高導電性」が要求される。一方で、電子機器や自動車部品のコネクタの小型化・軽量化・高精密化も進んでおり、コネクタ用材料のCu合金には「高強度化」や「優れた伸び」が求められる。これら要求特性を満たすCu合金として近年、Cu-(Ni,Co)-Si系合金が注目されている。 In next-generation vehicles such as quick charging of mobile devices and plug-in hybrid vehicles and electric vehicles, high-voltage and large-current circuits are required, and a large current tends to flow through the connector. Therefore, the connector material is required to have "high conductivity" in order to suppress energy loss when energized with a large current and deterioration of connection reliability due to stress relaxation progress due to heat generation. On the other hand, connectors for electronic devices and automobile parts are becoming smaller, lighter, and more precise, and Cu alloys, which are materials for connectors, are required to have "high strength" and "excellent elongation". In recent years, Cu- (Ni, Co) -Si based alloys have been attracting attention as Cu alloys satisfying these required characteristics.
特許文献1にはCu-Co-Si系合金およびその製造方法が開示されている。
特許文献1の技術によれば、粒径が50nm以下の微細な第2相粒子を、5-10nmの粒径をもつ第2相粒子と10-50nmの粒径をもつ第2相粒子とに分けこれら個数密度および割合を制御し、導電率および強度を高く維持しながら、耐へたり性を向上させている。
According to the technique of
特許文献2にはCu-(Ni,Co)-Si系合金を電子機器用導体線材に適用した技術が開示されている。
特許文献2の技術によれば、(Ni,Co)とSiとの添加量比を制御するとともに時効熱処理前後の冷間加工率を調整し、導電率と強度の向上を図っている。特に特許文献2の段落0016-0018や実施例2では、導電率が40%IACS以上、引張強度が400MPa以上、伸びが5%以上であれば、自動車(自動車用ワイヤーハーネス)やロボットなどの配線用途に好適に使用しうる旨言及しており、当該用途にはこれら基準を満たすことが要求される。
Patent Document 2 discloses a technique in which a Cu- (Ni, Co) -Si alloy is applied to a conductor wire rod for an electronic device.
According to the technique of Patent Document 2, the addition amount ratio of (Ni, Co) and Si is controlled, and the cold working ratio before and after the aging heat treatment is adjusted to improve the conductivity and strength. In particular, in paragraphs 0016-0018 of Patent Document 2 and Example 2, if the conductivity is 40% IACS or more, the tensile strength is 400 MPa or more, and the elongation is 5% or more, wiring of an automobile (wire harness for automobiles), a robot, etc. It mentions that it can be used suitably for the application, and the application is required to meet these standards.
しかしながら、特許文献1、2のいずれの技術においても、Cu-(Ni,Co)-Si系合金を線材として電子部品や自動車、ロボットなどの配線用途に適用可能である旨の言及はあるものの、実際にコネクタ端子が圧着された場合に一定の柔軟性をもって取り付けることができるかどうかにまで言及されておらず、当該配線用途に真に適合するかどうかは不明である。すなわち、コネクタ端子が圧着された場合、Cu-(Ni,Co)-Si系合金線材の金属組織が部分的に引き延ばされ(歪み)強度が上昇するものの、それに伴い伸びが低下すると考えられるため、その圧着に耐えうる一定の柔軟性が要求され、たとえばビッカース硬度が150HV以上200HV以下であることが要求される。
したがって本発明の主な目的は、特許文献1、2の技術と同様の導電率、強度および伸びに加え、コネクタ端子の圧着に適合した柔軟性(ビッカース硬度が150HV以上200HV以下)を有するCu-(Ni,Co)-Si系合金線材を提供することにある。
However, although it is mentioned that both the techniques of
Therefore, a main object of the present invention is Cu- having the same conductivity, strength and elongation as the techniques of
上記課題を解決するため本発明によれば、
NiまたはCoの少なくとも一方を1.6~2.1原子%含有し、Siを0.8~1.0原子%含有し、残部がCuおよび不可避的不純物からなるCu-(Ni,Co)-Si系合金線材であって、
Cu母相粒子の結晶粒度(平均値)が0.8~2.6μmであることを特徴とするCu-(Ni,Co)-Si系合金線材が提供される。
According to the present invention, in order to solve the above problems
Cu- (Ni, Co)-containing at least one of Ni or Co in an amount of 1.6 to 2.1 atomic%, Si in an amount of 0.8 to 1.0 atomic%, and the balance consisting of Cu and unavoidable impurities. Si-based alloy wire
Provided is a Cu- (Ni, Co) -Si based alloy wire rod characterized in that the crystal grain size (average value) of Cu matrix particles is 0.8 to 2.6 μm.
本発明によれば、導電率、強度および伸びに加え、コネクタ端子の圧着に適した柔軟性(ビッカース硬度が150HV以上200HV以下)を有するCu-(Ni,Co)-Si系合金線材を提供することができる(下記実施例1、2参照)。 According to the present invention, there is provided a Cu- (Ni, Co) -Si alloy wire having flexibility (Vickers hardness of 150 HV or more and 200 HV or less) suitable for crimping of a connector terminal in addition to conductivity, strength and elongation. (See Examples 1 and 2 below).
以下、本発明の好ましい実施形態にかかるCu-(Ni,Co)-Si系合金線材およびこれを含む絶縁電線について説明し、その後に当該絶縁電線の製造方法(Cu-(Ni,Co)-Si系合金線材の製造方法を含む。)について説明する。本明細書では、数値範囲を示す「~」の記載に関し、下限値および上限値はその数値範囲に含まれる。 Hereinafter, a Cu- (Ni, Co) -Si alloy wire rod and an insulated wire containing the Cu- (Ni, Co) -Si alloy wire according to a preferred embodiment of the present invention will be described, and then a method for manufacturing the insulated wire (Cu- (Ni, Co) -Si. A method for manufacturing a system alloy wire rod is included.) Will be described. In the present specification, the lower limit value and the upper limit value are included in the numerical range with respect to the description of “~” indicating the numerical range.
(1)Cu-(Ni,Co)-Si系合金線材
Cu-(Ni,Co)-Si系合金線材はCuを母相とする合金線材であって、NiまたはCoの少なくとも一方を1.6~2.1原子%(好ましくは1.7~2.0原子%)含有しかつSiを0.8~1.0原子%含有し、残部がCuおよび不可避的不純物からなる組成を有している。
「NiまたはCoの少なくとも一方」とは、NiまたはCoのいずれか一方か、NiとCoとの両方という意味である。
Cu-(Ni,Co)-Si系合金線材では、適切な熱処理(時効焼鈍を含む。)が施されることにより、(Ni,Co)およびSiの金属間化合物を主体とする微細な第2相粒子が析出し、当該第2相粒子が析出物として存在している。
「第2相粒子」とは主に(Ni,Co)2Siを意味し、後述の溶解・鋳造工程の凝固過程で生ずる晶出物、その後の冷却過程で生ずる析出物、および時効焼鈍工程の過程で生ずる析出物のことをいい、当該第2相粒子には不可避的不純物が含まれる第2相粒子も含まれる。
(1) Cu- (Ni, Co) -Si-based alloy wire The Cu- (Ni, Co) -Si-based alloy wire is an alloy wire having Cu as a matrix, and at least one of Ni or Co is 1.6. It contains ~ 2.1 atomic% (preferably 1.7-2.0 atomic%) and contains 0.8-1.0 atomic% of Si, and has a composition in which the balance is Cu and unavoidable impurities. There is.
"At least one of Ni or Co" means either one of Ni or Co, or both Ni and Co.
In the Cu- (Ni, Co) -Si alloy wire, a fine second metal mainly composed of (Ni, Co) and Si intermetallic compounds is subjected to appropriate heat treatment (including aging annealing). Phase particles are precipitated, and the second phase particles are present as precipitates.
"Phase 2 particles" mainly means (Ni, Co) 2 Si, which are the crystallization generated in the solidification process of the melting and casting process described later, the precipitates generated in the subsequent cooling process, and the aging annealing process. It refers to a precipitate generated in the process, and the second phase particles also include second phase particles containing unavoidable impurities.
Cu-(Ni,Co)-Si系合金線材では、Cu母相粒子の結晶粒度(平均値)が0.8~2.6μmであり、好ましくは1.5~1.9μmである。 In the Cu- (Ni, Co) -Si alloy wire, the crystal grain size (mean value) of the Cu matrix particles is 0.8 to 2.6 μm, preferably 1.5 to 1.9 μm.
「結晶粒度」とはJIS-H0501(伸銅品結晶粒度試験方法)に準拠する値である。
結晶粒度の表示方法および切断法は下記のとおりである。
結晶粒度の表示方法;
結晶粒度はmmで表示する。たとえば0.025mmと表す。
結晶粒度の計算値または観測値を丸めるには次の方法による。
0.010mm以下の場合、0.001mmの整数倍に最も近い値を採用する。
0.010mmを超え0.060mm以下の場合、0.005mmの整数倍に最も近い値を採用する。
0.060mmを超える場合、0.010mmの整数倍に最も近い値を採用する。
切断法;
結晶粒度は、顕微鏡の映像または写真上で既知の長さの線分によって完全に切られる結晶粒数を数え、その切断長さの平均値(mm)をもって表示する。必要に応じ加工方向に平行および垂直な3軸に沿って測定する。切断法で測定した値は、求積法で測定した値より小さいことがある。
The "crystal particle size" is a value based on JIS-H0501 (copper product crystal particle size test method).
The method for displaying the crystal grain size and the method for cutting are as follows.
How to display the crystal grain size;
The crystal grain size is indicated in mm. For example, it is expressed as 0.025 mm.
The following method is used to round the calculated or observed crystal grain size.
In the case of 0.010 mm or less, the value closest to an integral multiple of 0.001 mm is adopted.
If it exceeds 0.010 mm and is 0.060 mm or less, the value closest to an integral multiple of 0.005 mm is adopted.
If it exceeds 0.060 mm, the value closest to an integral multiple of 0.010 mm is adopted.
Cutting method;
The crystal grain size is indicated by counting the number of crystal grains that are completely cut by a line segment of a known length on a microscope image or a photograph, and displaying the average value (mm) of the cutting length. If necessary, measure along three axes parallel and perpendicular to the machining direction. The value measured by the cutting method may be smaller than the value measured by the quadrature method.
以上のCu-(Ni,Co)-Si系合金線材は、JIS C 2244に準拠したビッカース硬度が150HV以上200HV以下で柔軟性を有しており、自動車(自動車用ワイヤーハーネス)やロボットなどの配線用途に好適である。Cu-(Ni,Co)-Si系合金線材の用途は当該用途に限らず、電子部品の配線用途にも適用可能であって電気的接続を含むあらゆる用途に適用可能である。 The above Cu- (Ni, Co) -Si alloy wire has flexibility with a Vickers hardness of 150 HV or more and 200 HV or less in accordance with JIS C 2244, and wiring for automobiles (wire harnesses for automobiles) and robots. Suitable for applications. The applications of Cu- (Ni, Co) -Si alloy wire rods are not limited to these applications, but can also be applied to wiring applications for electronic components, and can be applied to all applications including electrical connection.
(2)絶縁電線
図1は絶縁電線の概略構成を示す断面図である。
図1に示すとおり、絶縁電線1は導体部10と被覆部20とを有している。
導体部10は複数本の線材12が撚り合わされ構成されている。導体部10は1本の線材12で(単線で)構成されてもよい。線材12は上記Cu-(Ni,Co)-Si系合金線材で構成されている。
被覆部20は導体部10を絶縁被覆するいわゆるシース(外被)であり、ポリ塩化ビニル樹脂(PVC:Poly Vinyl Chloride)が押出し被覆され構成されている。被覆部20はPVCに限らず架橋ポリエチレンなどの公知の絶縁体で構成されてもよい。
(2) Insulated Wire FIG. 1 is a cross-sectional view showing a schematic configuration of an insulated wire.
As shown in FIG. 1, the insulated
The
The
(3)絶縁電線の製造方法
図2は絶縁電線の製造方法を経時的に示すフローチャートである。
図2に示すとおり、絶縁電線の製造方法では基本的に、溶解・鋳造工程S1、伸線加工工程S2、時効焼鈍工程S3、撚線加工工程S4および絶縁被覆工程S5の各処理がこの順におこなわれる。
(3) Manufacturing Method of Insulated Wire FIG. 2 is a flowchart showing a manufacturing method of the insulated wire over time.
As shown in FIG. 2, in the method for manufacturing an insulated wire, basically, each of the melting / casting process S1, the wire drawing process S2, the aging annealing process S3, the stranded wire processing process S4, and the insulation coating process S5 is performed in this order. Is done.
溶解・鋳造工程S1では、原料を1100~1300℃で溶解させ、NiまたはCoの少なくとも一方を1.6~2.1原子%含有し、Siを0.8~1.0原子%含有し、残部がCuおよび不可避的不純物からなる組成物(溶湯)を調製する。
「原料」は、溶解後の段階でNiまたはCoの少なくとも一方を1.6~2.1原子%(好ましくは1.7~2.0原子%)含有し、Siを0.8~1.0原子%含有し、残部がCuおよび不可避的不純物からなる組成物になればよく、溶解前の段階では(Ni,Co)、SiおよびCuが別個に存在する単体であってもよいし、(Ni,Co)、SiおよびCuのうち2つ以上の金属原子からなる化合物であってもよいし、(Ni,Co)、SiおよびCuの一体物であってもよい。
その後、溶解物(溶解後の原料、溶湯)を、鋳型に流し込み、5分~1時間、好ましくは5~30分以内に室温まで冷却し、一定の直径を有する棒材を鋳造する。
In the melting / casting step S1, the raw material is melted at 1100-1300 ° C., containing at least one of Ni or Co in an amount of 1.6 to 2.1 atomic% and Si in an amount of 0.8 to 1.0 atomic%. A composition (molten metal) in which the balance is composed of Cu and unavoidable impurities is prepared.
The "raw material" contains at least one of Ni or Co in an amount of 1.6 to 2.1 atomic% (preferably 1.7 to 2.0 atomic%) and Si in an amount of 0.8 to 1. The composition may contain 0 atomic% and the balance may be composed of Cu and unavoidable impurities, and may be a simple substance in which (Ni, Co), Si and Cu are separately present at the stage before dissolution. It may be a compound composed of two or more metal atoms of Ni, Co), Si and Cu, or it may be an integral substance of (Ni, Co), Si and Cu.
Then, the melt (raw material after melting, molten metal) is poured into a mold and cooled to room temperature within 5 minutes to 1 hour, preferably within 5 to 30 minutes, and a bar having a constant diameter is cast.
伸線加工工程S2では、棒材を一定の減面率で伸線し、一定の直径を有する線材を製造する。
時効焼鈍工程S3では、線材を、300~600℃で0.5~4時間加熱し時効焼鈍する。時効焼鈍工程S3では、(Ni,Co)およびSiの金属間化合物を主体とする微細な第2相粒子を析出させるとともに、伸線加工工程S2で生じた金属組織の歪みを除去する。
かかる溶解・鋳造工程S1から時効焼鈍工程S3までの処理により、Cu-(Ni,Co)-Si系合金線材を製造することができる。
In the wire drawing process S2, the bar is drawn at a constant surface reduction rate to produce a wire having a constant diameter.
In the aging annealing step S3, the wire rod is heated at 300 to 600 ° C. for 0.5 to 4 hours for aging annealing. In the aging annealing step S3, fine second-phase particles mainly composed of (Ni, Co) and Si intermetallic compounds are precipitated, and the distortion of the metal structure generated in the wire drawing step S2 is removed.
A Cu- (Ni, Co) -Si alloy wire can be produced by the processes from the melting / casting step S1 to the aging annealing step S3.
撚線加工工程S4では、時効焼鈍後の複数本の線材を撚り合わせ圧縮し、撚線導体を製造する。撚線加工工程S4の処理は、伸線加工工程S2の後でかつ時効焼鈍工程S3の前に(伸線加工工程S2と時効焼鈍工程S3との間で)おこなわれてもよい。
絶縁被覆工程S5では、撚線導体に対し、PVCを押出し被覆し、当該撚線導体をPVCで絶縁被覆する。かかる溶解・鋳造工程S1から絶縁被覆工程S5までの処理により、絶縁電線を製造することができる。
In the stranded wire processing step S4, a plurality of wire rods after aging annealing are twisted and compressed to manufacture a stranded wire conductor. The process of the stranded wire processing step S4 may be performed after the wire drawing process step S2 and before the aging annealing step S3 (between the wire drawing process S2 and the aging annealing step S3).
In the insulation coating step S5, PVC is extruded and coated on the stranded conductor, and the stranded conductor is insulated and coated with PVC. An insulated wire can be manufactured by the processes from the melting / casting step S1 to the insulating coating step S5.
(1)線材サンプルの作製
(1.1)サンプル1-8
原料を1300℃で加熱し溶解させ、表1の組成比を有する組成物(溶湯)を調製した。その後、溶解物(溶解後の原料、溶湯)を、鋳型に流し込み10分以内に室温まで冷却し、直径12.0mmの棒材を鋳造した。
その後、直径12.0mmの棒材を、減面率10~20%で伸線し、直径1.1mmの線材を製造した。
その後、直径1.1mmの線材を、525℃で5時間加熱し時効焼鈍した。
(1) Preparation of wire rod sample (1.1) Sample 1-8
The raw materials were heated at 1300 ° C. and melted to prepare a composition (molten metal) having the composition ratios shown in Table 1. Then, the melt (raw material after melting, molten metal) was poured into a mold and cooled to room temperature within 10 minutes, and a bar having a diameter of 12.0 mm was cast.
Then, a rod having a diameter of 12.0 mm was drawn with a surface reduction rate of 10 to 20% to produce a wire having a diameter of 1.1 mm.
Then, a wire rod having a diameter of 1.1 mm was heated at 525 ° C. for 5 hours and annealed by aging.
(1.2)サンプル20
サンプル4と同様にして直径12.0mmの棒材を製造した。
その後、直径12.0mmの棒材を、950℃で1時間加熱して(溶体化して)水冷し、525℃で1時間加熱し時効焼鈍した。
(1.2)
A bar having a diameter of 12.0 mm was produced in the same manner as in Sample 4.
Then, a rod having a diameter of 12.0 mm was heated (dissolved) at 950 ° C. for 1 hour, cooled with water, and heated at 525 ° C. for 1 hour for aging annealing.
(2)線材サンプルの特性評価
(2.1)結晶粒度の測定
JIS-H0501に準拠する方法で組織観察し結晶粒度を算出した。
組織観察にはFE-SEM(日立ハイテクノロジーズ社製、電界放出形走査電子顕微鏡S-4500)を使用した。サンプル1-8、20については倍率1万倍で、サンプル20については倍率100倍でそれぞれ観察し、結晶粒度(平均値)を算出した。
算出結果を表1に示す。併せて代表例としてサンプル4、20のFE-SEM画像(1万倍)を図3に、サンプル20の光学顕微鏡画像(100倍)を図4に、それぞれ示す。
(2) Characteristic evaluation of wire rod sample (2.1) Measurement of crystal grain size The crystal grain size was calculated by observing the structure by a method according to JIS-H0501.
FE-SEM (field emission scanning electron microscope S-4500 manufactured by Hitachi High-Technologies Corporation) was used for microstructure observation. Samples 1-8 and 20 were observed at a magnification of 10,000 times, and
The calculation results are shown in Table 1. As a representative example, FE-SEM images (10,000 times) of
(2.2)ビッカース硬度の測定
JIS C 2244に準拠する方法でビッカース硬度を測定した。
測定装置としてマツザワ社製ビッカース硬さ測定装置(AMT-X7AFS)を使用した。測定条件は下記のとおりとした。
荷重:100gf
保持時間:15秒
測定結果を表1に示す。
(2.2) Measurement of Vickers hardness The Vickers hardness was measured by a method according to JIS C 2244.
A Vickers hardness measuring device (AMT-X7AFS) manufactured by Matsuzawa Co., Ltd. was used as the measuring device. The measurement conditions were as follows.
Load: 100gf
Retention time: 15 seconds Table 1 shows the measurement results.
(3)まとめ
表1に示すとおり、サンプル1-3では、Co、Siの添加元素量が多く適切な熱処理をしても(時効焼鈍しても)、ビッカース硬度が大きかった。逆にサンプル7-8では、Co、Siの添加元素量が少ないため、ビッカース硬度が小さかった。
表1および図3左側に示すとおり、サンプル4-6ではCu母相粒子の結晶粒度がサンプル20より顕著に小さく、第2相粒子が結晶粒界に多く分布している(図3左側はサンプル4-6の代表例としてサンプル4の金属組織を示している。)。他方、表1、図3右側および図4に示すとおり、サンプル20ではCu母相粒子の結晶粒度がサンプル4-6より顕著に大きく、第2相粒子が結晶粒中に多く分布している。
以上から、Cu、Co、Siの組成比、金属組織状態、およびビッカース硬度の相関性は、Co、Siの組成比が適切な範囲に収まっているか、第2相粒子がCu母相の結晶粒界に多く分布するか結晶粒内に多く分布するか、に起因すると考えられ、Coが1.6~2.1原子%含有され、Siが0.8~1.0原子%含有され、Cu母相の結晶粒度(平均値)が0.8~2.6μmであることは柔軟性に有用であることがわかった。
(3) Summary As shown in Table 1, in Samples 1-3, the amount of added elements of Co and Si was large, and even if appropriate heat treatment was performed (even by aging annealing), the Vickers hardness was large. On the contrary, in Samples 7-8, the Vickers hardness was small because the amount of added elements of Co and Si was small.
As shown on the left side of Table 1 and FIG. 3, in Sample 4-6, the crystal grain size of the Cu parent phase particles is remarkably smaller than that of
From the above, the correlation between the composition ratio of Cu, Co, and Si, the metallographic state, and the Vickers hardness is whether the composition ratio of Co and Si is within an appropriate range, or the second phase particles are the crystal grains of the Cu parent phase. It is considered that this is due to whether it is distributed abundantly in the boundary or in the crystal grains, and contains 1.6 to 2.1 atomic% of Co, 0.8 to 1.0 atomic% of Si, and Cu. It was found that the crystal grain size (average value) of the matrix phase of 0.8 to 2.6 μm is useful for flexibility.
実施例1のサンプル1-8、20から撚線導体を製造し導電率、引張強度および伸びを測定した。 A stranded conductor was produced from Samples 1-8 and 20 of Example 1 and its conductivity, tensile strength and elongation were measured.
(1)撚線導体サンプルの作製
撚線導体サンプルとして、サンプル1-8、20を7本ずつそれぞれ撚り合わせ圧縮し、断面積0.13mm2の円形圧縮撚線導体を製造した。
(1) Preparation of Twisted Conductor Sample As a stranded conductor sample, seven samples 1-8 and 20 were twisted and compressed to produce a circular compressed stranded conductor having a cross-sectional area of 0.13 mm 2 .
(2)撚線導体サンプルの特性評価
(2.1)導電率の測定
直流四端子法を用いて、20℃(±1℃)に管理された室内で各5本のサンプルについて導電率を測定しその平均値(%IACS)を算出した。電圧端子間距離は300mmとした。算出結果を表2に示す。
(2) Characteristic evaluation of stranded conductor samples (2.1) Measurement of conductivity Using the DC four-terminal method, conductivity is measured for each of the five samples in a room controlled at 20 ° C (± 1 ° C). The average value (% IACS) was calculated. The distance between the voltage terminals was set to 300 mm. The calculation results are shown in Table 2.
(2.2)引張強度
JIS Z 2241に準じて、各5本のサンプルについて引張強度を測定し、その平均値(MPa)を算出した。算出結果を表2に示す。
(2.2) Tensile strength Tensile strength was measured for each of the five samples according to JIS Z 2241, and the average value (MPa) was calculated. The calculation results are shown in Table 2.
(2.3)伸び
上記(2.2)引張強度の測定時においてこれと同時に伸びを測定し、その平均値(%)を算出した。算出結果を表2に示す。
(2.3) Elongation At the time of measuring the above (2.2) tensile strength, the elongation was measured at the same time, and the average value (%) was calculated. The calculation results are shown in Table 2.
(3)まとめ
表2に示すとおり、サンプル1-3では、Co、Siの添加元素量が多く、元材鋳造時にそれらで構成される第2相粒子が結晶粒界に存在しており、時効焼鈍時に第2相粒子が結晶成長し、Cu母相粒子の結晶粒界に多く析出していることで粒界強度が脆弱となり、伸びが測定できないかまたは低かった。サンプル7、8では、強度向上に寄与するだけのCo、Siの添加元素量が少なく、第2相粒子がCu母相中に所要量析出していないと考えられ、引張強度が小さかった。
これに対し、サンプル4-6では導電率、引張強度および伸びが、特許文献2に記載の自動車(自動車用ワイヤーハーネス)やロボットなどの配線用途に要求される一定の基準値を満たしおり、この絶縁電線を当該用途に好適に使用しうることが確認できた。
(3) Summary As shown in Table 2, in Samples 1-3, the amounts of added elements of Co and Si are large, and the second phase particles composed of them are present at the grain boundaries at the time of casting the base material, and are aged. During annealing, the second phase particles grew into crystals, and a large amount of them were precipitated at the grain boundaries of the Cu parent phase particles, so that the grain boundary strength became weak and the elongation could not be measured or was low. In Samples 7 and 8, the amount of added elements of Co and Si was small enough to contribute to the improvement of strength, and it was considered that the required amount of the second phase particles was not precipitated in the Cu matrix, and the tensile strength was small.
On the other hand, in Sample 4-6, the conductivity, tensile strength and elongation satisfy certain standard values required for wiring applications such as automobiles (wire harnesses for automobiles) and robots described in Patent Document 2. It was confirmed that the insulated wire can be suitably used for this purpose.
本発明はCu-(Ni,Co)-Si系合金線材にかかり、自動車(自動車用ワイヤーハーネス)やロボットなどの配線用途に好適に利用される。 The present invention relates to Cu- (Ni, Co) -Si alloy wire rods, and is suitably used for wiring applications such as automobiles (wire harnesses for automobiles) and robots.
1 絶縁電線
10 導体部
12 線材
20 被覆部
S1 溶解・鋳造工程
S2 伸線加工工程
S3 時効焼鈍工程
S4 撚線加工工程
S5 絶縁被覆工程
1
Claims (6)
Cu母相粒子の結晶粒度(平均値)が0.8~2.6μmであることを特徴とするCu-(Ni,Co)-Si系合金線材。 Cu- (Ni, Co)-containing at least one of Ni or Co in an amount of 1.6 to 2.1 atomic%, Si in an amount of 0.8 to 1.0 atomic%, and the balance consisting of Cu and unavoidable impurities. Si-based alloy wire
A Cu- (Ni, Co) -Si alloy wire rod having a crystal grain size (mean value) of 0.8 to 2.6 μm of Cu matrix particles.
Cu母相粒子の結晶粒度(平均値)が1.5~1.9μmであることを特徴とするCu-(Ni,Co)-Si系合金線材。 In the Cu- (Ni, Co) -Si alloy wire rod according to claim 1,
A Cu- (Ni, Co) -Si alloy wire rod having a crystal grain size (mean value) of 1.5 to 1.9 μm of Cu matrix particles.
前記導体部を絶縁被覆する被覆部とを、備えることを特徴とする絶縁電線。 Cu- (Ni, Co)-containing at least one of Ni or Co in an amount of 1.6 to 2.1 atomic%, Si in an amount of 0.8 to 1.0 atomic%, and the balance consisting of Cu and unavoidable impurities. A conductor portion composed of the Cu- (Ni, Co) -Si alloy wire having a crystal grain size (average value) of 0.8 to 2.6 μm of the Cu matrix particles, which is a Si alloy wire,
An insulated wire including a covering portion that insulates and coats the conductor portion.
Cu母相粒子の結晶粒度(平均値)が1.5~1.9μmであることを特徴とする絶縁電線。 In the insulated wire according to claim 3,
An insulated wire having a crystal grain size (mean value) of Cu matrix particles of 1.5 to 1.9 μm.
前記棒材を伸線し線材を製造する工程と、
前記線材を300~600℃で0.5~4時間加熱する工程と、
を備えることを特徴とするCu-(Ni,Co)-Si系合金線材の製造方法。 The raw material is melted at 1100-1300 ° C., containing at least one of Ni or Co in an amount of 1.6 to 2.1 atomic%, Si in an amount of 0.8 to 1.0 atomic%, and the balance being Cu and unavoidable impurities. The process of preparing a composition consisting of, cooling the melt to room temperature, and casting a bar,
The process of drawing the rod to manufacture the wire and
A step of heating the wire at 300 to 600 ° C. for 0.5 to 4 hours, and
A method for producing a Cu- (Ni, Co) -Si alloy wire rod, which comprises the above.
前記棒材を伸線し線材を製造する工程と、
前記線材を300~600℃で0.5~4時間加熱する工程と、
加熱後の複数本の前記線材を撚り合わせ撚線導体を製造する工程と、
前記撚線導体を絶縁体で被覆する工程と、
を備えることを特徴とする絶縁電線の製造方法。 The raw material is melted at 1100-1300 ° C., containing at least one of Ni or Co in an amount of 1.6 to 2.1 atomic%, Si in an amount of 0.8 to 1.0 atomic%, and the balance being Cu and unavoidable impurities. The process of preparing a composition consisting of, cooling the melt to room temperature, and casting a bar,
The process of drawing the rod to manufacture the wire and
A step of heating the wire at 300 to 600 ° C. for 0.5 to 4 hours, and
A process of manufacturing a stranded conductor by twisting a plurality of the above-mentioned wires after heating,
The process of coating the stranded conductor with an insulator and
A method of manufacturing an insulated wire, which comprises.
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Citations (4)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JP2006225753A (en) * | 2005-01-18 | 2006-08-31 | Kiyomine Kinzoku Kogyo Kk | Method for manufacturing fine wire of corson alloy for electrical and electronic equipment parts |
| JP2007305566A (en) * | 2005-12-07 | 2007-11-22 | Furukawa Electric Co Ltd:The | Wire conductor for wiring, wire for wiring, and manufacturing method thereof |
| WO2009057697A1 (en) * | 2007-11-01 | 2009-05-07 | The Furukawa Electric Co., Ltd. | Conductor material for electronic device and electric wire for wiring using the same |
| JP2011208232A (en) * | 2010-03-30 | 2011-10-20 | Jx Nippon Mining & Metals Corp | Cu-Co-Si alloy material |
-
2020
- 2020-03-18 JP JP2021513542A patent/JPWO2020209026A1/ja active Pending
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Patent Citations (4)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JP2006225753A (en) * | 2005-01-18 | 2006-08-31 | Kiyomine Kinzoku Kogyo Kk | Method for manufacturing fine wire of corson alloy for electrical and electronic equipment parts |
| JP2007305566A (en) * | 2005-12-07 | 2007-11-22 | Furukawa Electric Co Ltd:The | Wire conductor for wiring, wire for wiring, and manufacturing method thereof |
| WO2009057697A1 (en) * | 2007-11-01 | 2009-05-07 | The Furukawa Electric Co., Ltd. | Conductor material for electronic device and electric wire for wiring using the same |
| JP2011208232A (en) * | 2010-03-30 | 2011-10-20 | Jx Nippon Mining & Metals Corp | Cu-Co-Si alloy material |
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