WO2020255800A1 - Hollow container manufacturing apparatus - Google Patents

Abstract

Provided is a hollow container manufacturing apparatus which can maintain the temperature of a pinch corresponding part of a parison at a temperature suitable for joining, and can increase the joining strength of the pinch corresponding part of the parison. The hollow container manufacturing apparatus comprises a pair of main molding dies (21, 22) and a pair of sub molding dies (31, 32) arranged over the outer circumferences of the main molding dies (21, 22), wherein a set of half-split parisons (P) are pinched and fused over a butting part to form a hollow container. The sub-molding dies (31, 32) have first heating devices (33, 33) that heat the pinch corresponding parts (T1a, T2a) of the parisons (P) from the outer surface side thereof. The sub-molding dies (31, 32) are configured to be in a non-contact state with respect to the parisons (P) during in-mold cooling during which the main molding dies (21, 22) after the fusion are in contact with the parisons (P).

Description

Hollow container manufacturing equipment

The present invention relates to a hollow container manufacturing apparatus for manufacturing a hollow container.

Patent Document 1 discloses a hollow container manufacturing apparatus in which a pair of slide dies are arranged outside the pair of molding dies and a resin hollow container is manufactured by blow molding. In this manufacturing device, a primary molding process for molding a half-split molded product, a built-in component placement process for attaching internal parts, a secondary molding (main molding) process for abutting half-split molded products, and cooling of the molding die. A hollow container is formed by performing a cooling step.

Japanese Patent No. 4431086

In the hollow container manufacturing apparatus of Patent Document 1, it takes time from the extraction of the parison to the fusion of the pinch-corresponding parts of the parison, so that the temperature of the pinch-corresponding part may drop below the melting point. If the temperature of the pinch-corresponding part of the parison drops below the melting point, the parisons may not be sufficiently fused to each other and the bonding strength may decrease.

On the other hand, in the cooling step, it is necessary to cool the molded product to a predetermined temperature in order to take out the molded product from the molding mold. That is, when manufacturing a hollow container, there is a problem that it becomes difficult to control the temperature of the pinch corresponding portion of the parison in each process.

The present invention was created in view of the above circumstances, and the temperature of the pinch-corresponding portion of the parison can be maintained at a temperature suitable for bonding, and the bonding strength of the pinch-corresponding portion of the parison can be increased. An object of the present invention is to provide a container manufacturing apparatus.

In order to solve the above-mentioned problems, the present invention comprises a pair of main molding dies and a pair of sub-molding dies arranged over the outer periphery of the main molding dies, and a set of half-split parisons are provided. A hollow container manufacturing device that forms a hollow container by fusing while pinching over the butt portion, and the sub-molding mold is a first heating device that heats a pinch corresponding portion of the parison from the outer surface side thereof. The sub-molding mold is configured so that the main molding mold after fusion is in a non-contact state with respect to the parison during in-mold cooling. It is characterized by.

According to such a configuration, the pinch corresponding portion of the parison can be heated from the outer surface side by the first heating device. As a result, the temperature of the pinch-corresponding portion of the parison can be maintained at a temperature equal to or higher than the melting point, so that the fusion of the pinch-corresponding portion is promoted and the bonding strength can be increased.
On the other hand, when cooling the inside of the mold after fusion, the temperature of the part corresponding to the pinch can be lowered in a short time by keeping the parison and the sub-molding mold in a non-contact state. It can be preferably performed.

Further, it is preferable that the center mold is provided between the pair of main molding molds, and the center mold has a second heating device that heats the pinch corresponding portion of the parison from the inner surface side thereof. ..

According to this configuration, the pinch-corresponding part of the parison can be heated from the inner surface side by the second heating device, so that the temperature of the pinch-corresponding part can be more preferably maintained at a temperature equal to or higher than the melting point.

Further, it is preferable that the first heating device is arranged at a position away from the pinch corresponding portion.

According to this configuration, the time required for in-mold cooling after fusion can be shortened.

According to the present invention, it is possible to obtain a hollow container manufacturing apparatus capable of maintaining the temperature of the pinch-corresponding part of the parison at a temperature suitable for joining and increasing the joining strength of the pinch-corresponding part of the parison.

It is a figure which shows the hollow container manufacturing apparatus which concerns on 1st Embodiment of this invention, and is the schematic sectional view which shows the parison arrangement process. It is a figure which shows the hollow container manufacturing apparatus which concerns on 1st Embodiment of this invention, and is the schematic sectional view which shows the primary molding process. It is a figure which shows the hollow container manufacturing apparatus which concerns on 1st Embodiment of this invention, and is the schematic cross-sectional view which shows the built-in component arrangement process. It is a figure which shows the hollow container manufacturing apparatus which concerns on 1st Embodiment of this invention, and is the schematic sectional view which shows the secondary molding process. It is a figure which shows the hollow container manufacturing apparatus which concerns on 1st Embodiment of this invention, and is the schematic sectional view which shows the cooling process in a mold. It is a schematic cross-sectional view which shows the container main body of the fuel tank manufactured by the hollow container manufacturing apparatus which concerns on 1st Embodiment of this invention. It is a figure which shows the hollow container manufacturing apparatus which concerns on 2nd Embodiment of this invention, and is the schematic sectional view which shows the primary molding process. It is a figure which shows the hollow container manufacturing apparatus which concerns on 2nd Embodiment of this invention, and is the schematic sectional view which shows the built-in component arrangement process. It is a figure which shows the hollow container manufacturing apparatus which concerns on 2nd Embodiment of this invention, and is the schematic cross-sectional view which shows the secondary molding process. It is a figure which shows the hollow container manufacturing apparatus which concerns on 2nd Embodiment of this invention, and is the schematic sectional view which shows the cooling process in a mold. It is a figure which shows the hollow container manufacturing apparatus which concerns on 3rd Embodiment of this invention, and is the schematic sectional view which shows the primary molding process. It is a figure which shows the hollow container manufacturing apparatus which concerns on 3rd Embodiment of this invention, and is the schematic sectional view which shows the built-in component arrangement process. It is a figure which shows the hollow container manufacturing apparatus which concerns on 3rd Embodiment of this invention, and is the schematic sectional view which shows the secondary molding process. It is a figure which shows the hollow container manufacturing apparatus which concerns on 3rd Embodiment of this invention, and is the schematic sectional view which shows the cooling process in a mold.

Hereinafter, embodiments of the present invention will be described in detail with reference to the drawings as appropriate. In each embodiment, the container body of the hollow container molded by the hollow container manufacturing apparatus is, for example, a molded product such as a fuel tank mounted on a vehicle or the like. In each embodiment, the same reference numerals are given to the same configurations, and duplicate description will be omitted.

(First Embodiment)
As shown in FIG. 1A, the hollow container manufacturing apparatus 10A according to the first embodiment includes a main type 2, a sub type 3, and a center type 4. The main mold 2 includes a pair of main molding dies 21 and 22. The main molding dies 21 and 22 include concave cavities 21a and 22a corresponding to the shape of the container body 50 (see FIG. 3) of the hollow container, and pinch portions 21b and 22b formed at both ends of the cavities 21a and 22a. have. The main molding dies 21 and 22 are molded during the primary molding step described later to form a set of half-split molded bodies T1 and T2 along the concave shape of the cavities 21a and 22a from the parisons P and P (see FIG. 1B). ). Further, the main molding dies 21 and 22 are molded during the secondary molding step described later, and the molded bodies T1 and T2 (parisons P and P) extend over the butt portion (a part of the pinch corresponding portions T1a and T2a). Then, they are fused while being pinched by the pinch portions 21b and 22b (see FIG. 2B).

The main molding dies 21 and 22 are provided with heating means (not shown) for heating the entire molding die in advance before performing the primary molding step. Further, the main molding dies 21 and 22 are provided with cooling means (not shown) for cooling the entire molding dies during the cooling step described later.

Each parison P, P has a rectangular sheet shape. The parison P has a multi-layered cross-sectional structure in which, for example, a barrier layer made of a material having excellent fuel impermeable property is sandwiched between at least an inner thermoplastic resin layer forming the inner surface of the tank and an outer thermoplastic resin layer forming the outer surface of the tank. Present. These inner thermoplastic resin layer and outer thermoplastic resin layer are composed of, for example, PE (polyethylene) and HDPE (high density polyethylene) having excellent heat meltability and moldability.

The sub mold 3 is an annular mold arranged over the outer periphery of the main molding molds 21 and 22. The sub mold 3 includes a pair of sub molds 31 and 32. The sub-molding molds 31 and 32 form outer edge portions T1b and T2b that are continuous with the outside of the pinch corresponding portions T1a and T2a of the parisons P and P (see FIG. 1B). The sub-molding molds 31 and 32 include concave cavities 31a and 32a, sub-side pinch portions 31b and 32b continuous with the cavities 31a and 32a, and protrusions 31c and 32c provided at the end portions. The sub-side pinch portions 31b and 32b are formed so as to be continuous with the pinch portions 21b and 22b of the pair of main molding dies 21 and 22.

The sub-molding dies 31 and 32 are provided so as to be openable and closable in the same direction as the opening and closing directions of the main molding dies 21 and 22. The sub molding dies 31 and 32 can be opened and closed separately from the operations of the main molding dies 21 and 22. The sub-molding dies 31 and 32 are molded together with the main molding dies 21 and 22 during the primary molding step described later to form the outer edge portions T1b and T2b of the container body 50 (see FIG. 3) (see FIG. 1B). Further, the sub-molding dies 31 and 32 are molded together with the main molding dies 21 and 22 during the secondary molding step described later, and a part of the pinch-corresponding portions T1a and T2a of the molded bodies T1 and T2 is partially pinched on the sub-side pinch portions 31b. They are butted and fused at 32b (see FIG. 2B). At the time of mold clamping, the sub-side pinch portions 31b and 32b form a butt surface continuous with the pinch portions 21b and 22b of the main molding dies 21 and 22.

The protruding amounts of the protrusions 31c and 32c of the sub-molding dies 31 and 32 are the outer edge portions T1b of the molded bodies T1 and T2, as shown in FIG. 2B, in a state of being molded during the secondary molding step described later. The ends of T2b are set to be separated from each other. The sub-molding dies 31 and 32 are provided with heating means (not shown) for heating the entire molding die in advance before performing the primary molding step. Further, the sub-molding dies 31 and 32 are provided with cooling means (not shown) for cooling the entire molding dies during the cooling step described later.

The inner surfaces of the cavities 31a and 32a are provided with first heaters 33 and 33 as first heating devices. The first heaters 33 and 33 are provided in an annular shape along the circumferential direction of the submolds 31 and 32, come into contact with the outer surfaces of the outer edges T1b and T2b of the molded bodies T1 and T2, and heat them from the outer surface side. It is possible. The first heaters 33 and 33 can heat the outer edge portions T1b and T2b from the outer surface side, and can also heat the pinch corresponding portions T1a and T2a from the outer surface side (the radial outer side of the main mold 2).

The sub-molding dies 31 and 32 are opened separately from the main molding dies 21 and 22 during the in-mold cooling step in which the main molding dies 21 and 22 are in contact with the parisons P and P after the secondary molding step. The structure is such that the outer edge portions T1b and T2b are retracted (released) so as to be in a non-contact state. Since the first heaters 33 and 33 are separated from the outer edge portions T1b and T2b together with the sub-molding molds 31 and 32 by the retracting, the heat energy transmitted to the outer edge portions T1b and T2b becomes small. As a result, the temperatures of the outer edge portions T1b and T2b can be lowered.

The center mold 4 is a mold that is arranged between the main molding dies 21 and 22 and between the sub molding dies 31 and 32 during the primary molding process described later. The center type 4 includes an annular frame body 41 and a second heater 42 as a second heating device supported by the frame body 41. As shown in FIG. 1A, the frame body 41 has a quadrangular cross section. As shown in FIG. 1B, the frame body 41 is formed by molding the main mold 2 and the sub mold 3 during the primary molding step, so that the frame body 41 extends in the circumferential direction between the protrusions 31c and 32c of the sub molding molds 31 and 32. Be pinched. In the second heater 42, the main mold 2 and the sub mold 3 are molded during the primary molding process, so that the pinch portions 21b and 22b of the main molding molds 21 and 22 and the sub-side pinch of the sub molding molds 31 and 32 are pinched. It is sandwiched between the portions 31b and 32b in the circumferential direction. The second heater 42 can be heated by the electric power supplied from the frame body 41 via the electric wire 41a, and can be heated from the inner surface side in contact with or close to the pinch corresponding portions T1a and T2a of the molded bodies T1 and T2. it can.

Next, a method of manufacturing the container body 50 using the hollow container manufacturing apparatus 10A of the present embodiment will be described.
(Parison placement process)
The parison arrangement step is a step of arranging the parisons P and P on both sides of the center mold 4. In the parison arrangement step, for example, the amount of parisons P and P required for molding the container body 50 is extruded from a parison extruder (not shown). As shown in FIG. 1A, the extruded parisons P and P are placed on both sides of the center mold 4 on the inner surface side of the main molding die 21 and the sub molding die 31, and on the inner surface side of the main molding die 22 and the sub molding die 32. It is arranged using a chuck (not shown) or the like.

(Primary molding process)
The primary molding step is a step of transferring the parisons P and P to the main molding dies 21 and 22 and the sub molding dies 31 and 32. The main molding dies 21 and 22 and the sub molding dies 31 and 32 are heated to a predetermined temperature by a heating means (not shown). As shown in FIG. 1B, when the main molding dies 21 and 22 and the sub molding dies 31 and 32 are molded with the parisons P and P sandwiched between the main molding dies 21 and 22 and the center dies 4, they face the cavity 21a of the main molding dies 21. The space surrounded by the outer surface of the parison P is sealed. Similarly, the space surrounded by the cavity 22a of the main molding 22 and the outer surface of the parison P facing the cavity 22a is sealed.

On the other hand, the space surrounded by the cavity 31a of the submold 31 and the outer surface of the parison P facing the cavity 31a is sealed. Similarly, the space surrounded by the cavity 32a of the submold 32 and the outer surface of the parison P facing the cavity 32a is sealed.

After that, evacuation is started from the vacuum holes (not shown) provided in the cavities 21a, 22a, 31a, 32a, and air is injected from the inner surface side of the parisons P, P by a blow pin (not shown). As a result, the parisons P and P are transferred to the molding surfaces of the main molding dies 21 and 22 and the sub molding dies 31 and 32. As a result, half of the molded bodies T1 and T2 are molded.

At this time, the outer edge portions T1b and T2b of the molded bodies T1 and T2 are brought into contact with the first heaters 33 and 33 of the sub-molding molds 31 and 32 and heated. As a result, the pinch corresponding portions T1a and T2a are heated from the outer surface side (the radial outer side of the main mold 2). That is, the heat of the first heaters 33 and 33 is transferred to the pinch corresponding portions T1a and T2a via the parison P or the sub-molding molds 31 and 32. Further, the pinch corresponding portions T1a and T2a are directly heated in contact with or close to the second heater 42 of the center type 4. As a result, the temperatures of the pinch corresponding portions T1a and T2a are kept above the melting point.

(Built-in component placement process)
The built-in component placement step is a step of arranging the built-in parts 55 and 56 on the inner surfaces of the molded bodies T1 and T2. In the built-in component placement step, as shown in FIG. 2A, the main molding dies 21 and 22 and the sub molding dies 31 and 32 are opened, and the center mold 4 is retracted to the outside of these. In this state, for example, the built-in parts 55 and 56 are inserted into the inner surfaces of the molded bodies T1 and T2 and attached by using an attachment means such as a robot arm (not shown). Even during the built-in component arranging process, heating by the first heaters 33 and 33 is continued, and the temperatures of the pinch corresponding portions T1a and T2a are maintained above the melting point (the temperature decrease of the pinch corresponding portions T1a and T2a can be suppressed).

(Secondary molding process)
The secondary molding step (main molding step) is a step of abutting and fusing the molded bodies T1 and T2 in which the built-in parts 55 and 56 are arranged by the built-in part arranging step. In the secondary molding step, as shown in FIG. 2B, the main molding dies 21 and 22 and the sub molding dies 31 and 32 are remolded, and the pinch corresponding portions T1a and T2a of the molded bodies T1 and T2 are butted against each other and melted. To wear. Even during the secondary molding step, heating by the first heaters 33 and 33 is continued, and the temperatures of the pinch corresponding portions T1a and T2a are maintained above the melting point, so that the pinch corresponding portions T1a and T2a are satisfactorily fused to each other.

(In-mold cooling process)
The in-mold cooling step is a step of cooling the molded bodies T1 and T2 fused by the secondary molding step. In the in-mold cooling step, cooling is performed by cooling means (not shown) installed inside the main molding dies 21 and 22 and the sub molding dies 31 and 32. In the in-mold cooling step, the supply of electric power to the first heaters 33 and 33 is stopped, and as shown in FIG. 2C, the sub-molding molds 31 and 32 are in a non-contact state with respect to the outer edge portions T1b and T2b. Evacuate to (release). When the sub-molding molds 31 and 32 are released, the first heaters 33 and 33 are separated from the outer edge portions T1b and T2b, and the thermal energy of the outer edge portions T1b and T2b is reduced. As a result, the temperatures of the outer edge portions T1b and T2b are lowered, and the temperatures of the pinch corresponding portions T1a and T2a are also lowered, so that the cooling inside the mold is promoted.

After the in-mold cooling step, the main molding dies 21 and 22 and the sub molding dies 31 and 32 are opened, and the molded product is taken out. As a result, the container body 50 having the cross-sectional shape shown in FIG. 3 is completed.

In the hollow container manufacturing apparatus 10A of the present embodiment described above, the pinch corresponding portions T1a and T2a can be heated from the outer surface side over the entire circumferential direction by the first heaters 33 and 33. As a result, the temperature of the pinch corresponding portions T1a and T2a can be maintained at a temperature equal to or higher than the melting point, so that the fusion of the pinch corresponding portions T1a and T2a is promoted and the bonding strength can be improved.

In the process of arranging the built-in parts shown in FIG. 2A, since the main molding molds 21 and 22 are separated from each other and the center mold 4 is retracted, the pinch corresponding portions T1a and T2a of the parisons P and P come into contact with the atmosphere and it is difficult to maintain the temperature. Become. In particular, the temperature tends to decrease from the outer pinch corresponding portions T1a and T2a as compared with the centers of the parisons P and P.
However, according to the present embodiment, the temperature drop of the pinch corresponding portions T1a and T2a is suppressed by heating the sub-molding molds 31 and 32 and the outer edge portions T1b and T2b by the first heaters 33 and 33 even during the built-in component placement process. can do. Further, according to the present embodiment, since the pinch corresponding portions T1a and T2a can be continuously heated from the primary molding step to the secondary molding step, the temperatures of the pinch corresponding portions T1a and T2a can be easily maintained. be able to.

Further, during the in-mold cooling step after the secondary molding step, the sub-molding molds 31 and 32 can be retracted so as not to contact the outer edge portions T1b and T2b, and the first heaters 33 and 33 are kept away from the outer edge portions T1b and T2b. be able to. As a result, the temperatures of the outer edge portions T1b and T2b and the pinch corresponding portions T1a and T2a can be lowered in a short time, so that the in-mold cooling after the secondary molding step can be promoted. Although only the first heaters 33 and 33 may be separated from the parison P, the temperature of the pinch corresponding portions T1a and T2a can be lowered more quickly by retracting the sub-molding molds 31 and 32 from the parison P.

Here, in the hollow container manufacturing apparatus, when the molded products T1 and T2 are fused, it is necessary to maintain the temperature of the parison P above the melting point of the parison P. On the other hand, in the cooling step after fusion, it is necessary to cool the pinch corresponding portions T1a and T2a to cure the parison P. In addition to the first heater 33, the main molding dies 21 and 22 are provided with a heating means (not shown) for heating the entire molding die and a cooling means (not shown) for cooling the entire molding die. However, it is difficult to heat or cool the pinch-corresponding portions T1a and T2a in a short time according to each process only by these heating means and cooling means.

In this regard, according to the present embodiment, after the temperatures of the pinch corresponding portions T1a and T2a of the parisons P and P are maintained above the melting point, the first heaters 33 and 33 (sub-molding molds 31 and 32) are used during the cooling step. ) Is physically separated from the parisons P and P, and the outer edge portions T1b and T2b are brought into contact with the atmosphere to be cooled in a short time. That is, according to the present embodiment, the temperatures of the pinch corresponding portions T1a and T2a of the parison P can be appropriately changed according to the process.

Further, since the center type 4 has the second heater 42, the pinch corresponding portions T1a and T2a of the parisons P and P can be directly heated by the second heater 42 during the primary molding process. Therefore, the temperature of the pinch corresponding portions T1a and T2a of the parisons P and P can be preferably maintained at a temperature equal to or higher than the melting point.

Further, since the first heaters 33 and 33 are arranged at positions separated from the pinch corresponding portions T1a and T2a with respect to the extraction direction of the parisons P and P, the in-mold cooling after the secondary molding step can be performed in a short time. It can be carried out.

(Second Embodiment)
Next, the hollow container manufacturing apparatus of the second embodiment will be described with reference to FIGS. 4A to 5B. The difference between the hollow container manufacturing apparatus 10B of the second embodiment and the first embodiment is that the installation positions of the first heaters 33 and 33 have been changed.

As shown in FIG. 4A, the first heaters 33 and 33 are provided at the boundary portion with the main molding dies 21 and 22. That is, since the first heaters 33 and 33 are located at the boundary portion with the main molding dies 21 and 22, both the sub molding dies 31 and 32 and the main molding dies 21 and 22 can be heated.

Even with such a configuration, the pinch-corresponding portions T1a and T2a can be heated from the outer surface side by the first heaters 33 and 33 during the primary molding process. Further, the pinch corresponding portions T1a and T2a can be heated from the inner surface side by the second heater 42. In other words, the heating efficiency can be improved by arranging the first heaters 33, 33 and the second heater 42 so as to sandwich the positions close to the pinch corresponding portions T1a and T2a on the front and back sides.

Further, as shown in FIG. 4B, heating by the first heaters 33 and 33 is continued even during the built-in component arranging process, and the pinch corresponding portions T1a and T2a pass through the sub molding dies 31 and 32 and the main molding dies 21 and 22. Is heated.
Further, as shown in FIG. 5A, in the secondary molding step, heating by the first heaters 33 and 33 is continued, and the pinch corresponding portions T1a and T2a are formed via the sub molding dies 31 and 32 and the main molding dies 21 and 22. It is heated. That is, the pinch corresponding portions T1a and T2a can be continuously heated to maintain the temperature throughout the primary molding step, the built-in component placement step, and the secondary molding.

Further, as shown in FIG. 5B, in the in-mold cooling step, the supply of electric power to the first heaters 33 and 33 is stopped, and the sub-molding molds 31 and 32 are in a non-contact state with respect to the outer edge portions T1b and T2b. Evacuate (release mold) so that As a result, the temperatures of the pinch corresponding portions T1a and T2a are also lowered, and the cooling in the mold is promoted.

According to the hollow container manufacturing apparatus 10B of the present embodiment described above, the same operation and effect as those of the first embodiment can be obtained. Further, in the present embodiment, the first heaters 33 and 33 are located closer to the pinch corresponding portions T1a and T2a as compared with the first embodiment, and the first heaters 33 and 33 come into contact with the main molding dies 21 and 22. Therefore, the heating efficiency of the pinch corresponding portions T1a and T2a can be improved.

(Third Embodiment)
Next, the hollow container manufacturing apparatus of the third embodiment will be described with reference to FIGS. 6A to 7B. The hollow container manufacturing apparatus 10C of the third embodiment is different from the first and second embodiments in that the third heaters 34 and 34 as the third heating apparatus are installed in the sub-molding molds 31 and 32.

As shown in FIG. 6A, the hollow container manufacturing apparatus 10C of the present embodiment has a structure in which the outer peripheral portions of the main molding dies 21 and 22 and the inner peripheral portions of the sub molding dies 31 and 32 are unevenly fitted. .. On the outer peripheral portions of the main molding dies 21 and 22, ridges 23 and 24 projecting toward the sub molding dies 31 and 32 are formed over the outer circumference. The ridges 23 and 24 function as pinch portions for pinching a part of the pinch corresponding portions T1a and T2a of the molded bodies T1 and T2.

On the other hand, recessed portions 31e and 32e into which the convex portions 23 and 24 of the main molding molds 21 and 22 enter are formed on the inner peripheral portions of the sub-molding molds 31 and 32 over the inner peripheral circumference. The recessed portions 31e and 32e are provided with inner side surfaces 31f and 32f facing the pinch corresponding portions T1a and T2a. Although the inner side surfaces 31f and 32f are provided substantially parallel to the pinch corresponding portions T1a and T2a, they may be provided so as to be inclined with respect to the pinch corresponding portions T1a and T2a.

The third heaters 34 and 34 are provided on the inner side surfaces 31f and 32f of the recessed portions 31e and 32e of the sub-molding molds 31 and 32. The third heaters 34 and 34 are provided in an annular shape along the circumferential direction of the sub-molding molds 31 and 32, and come into contact with the outer surfaces of the ridges 23 and 24 facing each other to heat the ridges 23 and 24. It is possible. That is, the pinch-corresponding portions T1a and T2a of the molded bodies T1 and T2 are heated by the heat of the third heaters 34 and 34 transmitted through the ridges 23 and 24.

By providing such a configuration, as shown in FIG. 6A, during the primary molding process, the heat of the first heaters 33 and 33 transmitted via the outer edge portions T1b and T2b and the heat transmitted through the convex portions 23 and 24 are transmitted. The pinch corresponding portions T1a and T2a are heated by the heat of the third heaters 34 and 34. Further, similarly to the first and second embodiments, the pinch corresponding portions T1a and T2a are heated by the heat of the second heater 42 of the center type 4. That is, in the present embodiment, in addition to the first heaters 33 and 33 and the second heater 42, the third heaters 34 and 34 provided in the vicinity of the pinch corresponding portions T1a and T2a can also be used for heating. The temperatures of T1a and T2a can be reliably maintained above the melting point.

Further, as shown in FIG. 6B, in the built-in component arranging step, heating by the first heaters 33, 33 and the third heaters 34, 34 is continued, and the pinch corresponding portions T1a and T2a are heated.
Further, also in the secondary molding step shown in FIG. 7A, the heating by the first heaters 33 and 33 and the heating by the third heaters 34 and 34 are continued, and the pinch corresponding portions T1a and T2a are heated. As a result, the temperature of the pinch corresponding portions T1a and T2a is maintained at a temperature equal to or higher than the melting point. That is, the pinch corresponding portions T1a and T2a can be continuously heated to maintain the temperature throughout the primary molding step, the built-in component placement step, and the secondary molding.

Further, in the in-mold cooling step shown in FIG. 7B, the supply of electric power to the first heaters 33, 33 and the third heaters 34, 34 is stopped, and the outer edge portions T1b, T2b and the convex portions 23, 24 are supplied. The sub-molding dies 31 and 32 are retracted (released) so as to be in a non-contact state. As a result, the temperatures of the pinch corresponding portions T1a and T2a are also lowered, and the cooling in the mold is promoted.

According to the hollow container manufacturing apparatus 10C of the present embodiment described above, the same effects as those of the first and second embodiments can be obtained. In addition, in the present embodiment, since the third heaters 34 and 34 are provided, the temperature of the pinch corresponding portions T1a and T2a can be more reliably maintained above the melting point.

Although the embodiments of the present invention have been described above, the present invention is not limited to the above-described embodiments and can be appropriately modified without departing from the spirit of the present invention.
For example, each of the above-described embodiments has been described in detail in order to explain the present invention in an easy-to-understand manner, and is not necessarily limited to those having all the described configurations. For example, the second heater 42 does not necessarily have to be provided.

Further, in each embodiment, the first heaters 33, 33 are shown to be arranged in pairs on the sub-molding molds 31 and 32, but the present invention is not limited to this, and a plurality of pairs may be dispersed and provided.
Further, the first heaters 33 and 33 were provided so as to be exposed on the inner surfaces of the concave cavities 31a and 32a of the submolds 31 and 32, but were embedded without being exposed on the inner surfaces of the concave cavities 31a and 32a. May be good.
Further, the first heaters 33, 33 may be provided on the inner surface of the sub-side pinch portions 31b, 32b of the sub mold 3. In this case, the pinch corresponding portions T1a and T2a can be directly heated from the outer surface side.

Further, a plurality of pairs of the third heaters 34, 34 in the third embodiment may be provided in the same manner.

Further, in each embodiment, the sub-side pinch portions 31b of the sub-molding dies 31 and 32 do not necessarily have to be provided, and the pinch may be performed only on the main molding dies 21 and 22.

Further, in each of the above-described embodiments, a configuration in which the container body 50 is molded using two sheet-shaped parisons P and P is adopted, but even in a configuration in which the container body 50 is molded using a cylindrical parison. Good. Further, although the apparatus using the center mold 4 is illustrated in the present embodiment, the present invention can also be applied to the case of molding without using the center mold 4 (ship-in bottle molding).

2 Main type 3 Sub type 4 Center type 10A Hollow container manufacturing equipment 10B Hollow container manufacturing equipment 10C Hollow container manufacturing equipment 21 and 22 Main molding molds (pair of molding molds)
21b Pinch part 31b Sub side pinch part 31, 32 Sub-molding mold (pair of molding dies)
33 1st heater (1st heating device)
41 Frame 42 Second heater (second heating device)
50 Container body P Parison T1, T2 Molded body T1b, T2b Outer edge part T1a, T2a Pinch equivalent part

Claims (3)

A pair of main molding dies and a pair of sub-molding dies arranged over the outer circumference of the main molding dies are provided, and a set of half-split parisons are fused while being pinched over the abutting portion. It is a hollow container manufacturing device that forms a hollow container.
The sub-molding mold has a first heating device that heats a pinch-corresponding portion of the parison from the outer surface side thereof.
The sub-molding mold is hollow so that the main molding mold after fusion is in a non-contact state with respect to the parison during in-mold cooling. Container manufacturing equipment. It has a center mold that is placed between the pair of main molding molds.
The hollow container manufacturing apparatus according to claim 1, wherein the center type has a second heating apparatus that heats the pinch corresponding portion of the parison from the inner surface side thereof. The hollow container manufacturing apparatus according to claim 1 or 2, wherein the first heating apparatus is arranged at a position separated from the pinch corresponding portion.

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