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WO2020252555A1 - Dispositif de transfert de chaleur et procédé de fabrication d'un tel dispositif de transfert de chaleur - Google Patents

Dispositif de transfert de chaleur et procédé de fabrication d'un tel dispositif de transfert de chaleur Download PDF

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Publication number
WO2020252555A1
WO2020252555A1 PCT/BY2019/000009 BY2019000009W WO2020252555A1 WO 2020252555 A1 WO2020252555 A1 WO 2020252555A1 BY 2019000009 W BY2019000009 W BY 2019000009W WO 2020252555 A1 WO2020252555 A1 WO 2020252555A1
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WO
WIPO (PCT)
Prior art keywords
segment
transfer device
heat transfer
region
heat
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Ceased
Application number
PCT/BY2019/000009
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English (en)
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WO2020252555A8 (fr
Inventor
Sviataslau Alehavich FILATAU
Leonid Leonardovich VASILIEV
Yun Tang
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Huawei Technologies Co Ltd
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Huawei Technologies Co Ltd
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Publication date
Application filed by Huawei Technologies Co Ltd filed Critical Huawei Technologies Co Ltd
Priority to EP19745036.4A priority Critical patent/EP3973240B1/fr
Priority to PCT/BY2019/000009 priority patent/WO2020252555A1/fr
Publication of WO2020252555A1 publication Critical patent/WO2020252555A1/fr
Publication of WO2020252555A8 publication Critical patent/WO2020252555A8/fr
Anticipated expiration legal-status Critical
Ceased legal-status Critical Current

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Classifications

    • F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
    • F28—HEAT EXCHANGE IN GENERAL
    • F28D—HEAT-EXCHANGE APPARATUS, NOT PROVIDED FOR IN ANOTHER SUBCLASS, IN WHICH THE HEAT-EXCHANGE MEDIA DO NOT COME INTO DIRECT CONTACT
    • F28D15/00—Heat-exchange apparatus with the intermediate heat-transfer medium in closed tubes passing into or through the conduit walls ; Heat-exchange apparatus employing intermediate heat-transfer medium or bodies
    • F28D15/02—Heat-exchange apparatus with the intermediate heat-transfer medium in closed tubes passing into or through the conduit walls ; Heat-exchange apparatus employing intermediate heat-transfer medium or bodies in which the medium condenses and evaporates, e.g. heat pipes
    • F28D15/04—Heat-exchange apparatus with the intermediate heat-transfer medium in closed tubes passing into or through the conduit walls ; Heat-exchange apparatus employing intermediate heat-transfer medium or bodies in which the medium condenses and evaporates, e.g. heat pipes with tubes having a capillary structure
    • F28D15/046—Heat-exchange apparatus with the intermediate heat-transfer medium in closed tubes passing into or through the conduit walls ; Heat-exchange apparatus employing intermediate heat-transfer medium or bodies in which the medium condenses and evaporates, e.g. heat pipes with tubes having a capillary structure characterised by the material or the construction of the capillary structure
    • F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
    • F28—HEAT EXCHANGE IN GENERAL
    • F28D—HEAT-EXCHANGE APPARATUS, NOT PROVIDED FOR IN ANOTHER SUBCLASS, IN WHICH THE HEAT-EXCHANGE MEDIA DO NOT COME INTO DIRECT CONTACT
    • F28D15/00—Heat-exchange apparatus with the intermediate heat-transfer medium in closed tubes passing into or through the conduit walls ; Heat-exchange apparatus employing intermediate heat-transfer medium or bodies
    • F28D15/02—Heat-exchange apparatus with the intermediate heat-transfer medium in closed tubes passing into or through the conduit walls ; Heat-exchange apparatus employing intermediate heat-transfer medium or bodies in which the medium condenses and evaporates, e.g. heat pipes
    • F28D15/0233—Heat-exchange apparatus with the intermediate heat-transfer medium in closed tubes passing into or through the conduit walls ; Heat-exchange apparatus employing intermediate heat-transfer medium or bodies in which the medium condenses and evaporates, e.g. heat pipes the conduits having a particular shape, e.g. non-circular cross-section, annular
    • F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
    • F28—HEAT EXCHANGE IN GENERAL
    • F28D—HEAT-EXCHANGE APPARATUS, NOT PROVIDED FOR IN ANOTHER SUBCLASS, IN WHICH THE HEAT-EXCHANGE MEDIA DO NOT COME INTO DIRECT CONTACT
    • F28D21/00—Heat-exchange apparatus not covered by any of the groups F28D1/00 - F28D20/00
    • F28D2021/0019—Other heat exchangers for particular applications; Heat exchange systems not otherwise provided for
    • F28D2021/0028—Other heat exchangers for particular applications; Heat exchange systems not otherwise provided for for cooling heat generating elements, e.g. for cooling electronic components or electric devices
    • F28D2021/0029—Heat sinks
    • F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
    • F28—HEAT EXCHANGE IN GENERAL
    • F28F—DETAILS OF HEAT-EXCHANGE AND HEAT-TRANSFER APPARATUS, OF GENERAL APPLICATION
    • F28F2255/00—Heat exchanger elements made of materials having special features or resulting from particular manufacturing processes
    • F28F2255/18—Heat exchanger elements made of materials having special features or resulting from particular manufacturing processes sintered

Definitions

  • the present invention relates to a heat transfer device for transferring heat generated by a heat source to a heat sink via a fluid working in evaporating-condensing cycles.
  • the fluid evaporates to a vapor phase near the heat source and then condenses to a liquid phase near the heat sink, the vapor phase flowing toward the heat sink and the liquid phase flowing toward the heat source.
  • the present invention relates to a method for manufacturing such a heat transfer device.
  • a heat source e.g. an electronic device such as a chip or a circuit
  • generates heat The heat may be transferred to a heat sink where the heat can be dissipated to the ambient.
  • a heat transfer device for example a heat pipe, comprises an evaporation region and a condensation region, a vapor channel extending between them, and a porous structure surrounding the vapor channel
  • Such a heat transfer device may transfer heat on long distances via a fluid flowing in the vapor phase through the vapor channel, and flowing back to the evaporator in the liquid phase through the porous structure that generates a capillary pressure.
  • the porous structure of a conventional heat pipe has uniform pore size from the evaporation region to the condensation region, and the porous structure is uniformly distributed around the vapor channel.
  • the liquid pressure drop in the porous structure mostly depends on the permeability of the porous structure:
  • a porous structure having big pores, hence big particles, causes only a low liquid pressure drop and can hence provide a large maximum transferrabie heat load.
  • big particles can generate only low capillary forces, thus limiting the liquid flow rate in the porous structure.
  • a conventional heat transfer device has a limited heat transfer rate, because the pore or particle size of its porous structure is selected as a tradeoff between the pressure drop and the capillary pressure.
  • a porous structure having a non-uniform distribution of pore or particle sizes could provide both a high capillary pressure around the evaporation region (liner particles) and a low liquid pressure drop around the condensation region (larger particles).
  • a heat transfer device comprising such a porous structure could theoretically provide a large maximum transferrable heat load.
  • US4170262 A describes a heat transfer device in which the porous structure has a continuously varying pore or particle size.
  • this type of heat transfer device can be difficult to manufacture.
  • An objective is to provide a heat transfer device which can efficiently transfer heat and which can be be manufactured reliably, especially in mass production.
  • An aspect of the invention provides a heat transfer device for transferring heat generated by a heat source to a heat sink via a fluid, the heat transfer device comprising:
  • vapor channel extending from the evaporation region to the condensation region such that evaporated fluid may flow from the evaporation region to the condensation region through the vapor channel
  • porous structure extending front the condensation region to the evaporation region such that condensed fluid may flow from the condensation region to the evaporation region through the porous structure by action of capillary forces.
  • the porous structure comprises a sequence of segments including at least i) a first segment extending in the evaporation region and ti) a second segment extending in the condensation region,
  • the first segment having a first effective pore size
  • the second segment having a second effective pore size, the second effective pore size being larger than the first effective pore size
  • the fluid may form an internal working media with two phases (liquid phase, vapor phase).
  • the fluid may be water or any other evaporative liquid.
  • the fluid When the heat transfer device is in service the fluid may evaporate as the heat-receiving outer surface receives heat from the heat source, i.e. from an electronic device. Evaporation of the fluid occurs in an evaporation region.
  • the evaporated fluid may flow through the vapor chamber and toward the heat-emitting outer surface.
  • the evaporated fluid may condense when the heat-emitting outer surface emits heat and hence dissipate it in the ambient. Condensation of the fluid occurs in a condensation region.
  • the condensed fluid may flow through the porous structure back toward the heat-receiving carter surface.
  • the first segment may generate a large capillary pressure, in other words large capillary forces, while the second segment may cause only a low liquid pressure drop thanks to its larger effective pore size, which helps increase the maximum transferable heat load.
  • a heat transfer device may be manufactured in mass production since the porous structure has a relatively simple structure. Such a heat transfer device may have a relatively low thermal resistance.
  • the maximum possible capillary pressure P ca ⁇ . can be estimated via the following equation:
  • s is the surface tension of the fluid, in N/m
  • Q is the contact angle between the fluid and the material of porous structure, in degree
  • d eff is the effective pore size, in m.
  • the effective pore size 3 ⁇ 4 ⁇ may be calculated as 0.&d m£lXi where d mtx is the maximum pore diameter according to the method A of the standard Standard Test Methods for Pore Size Characteristics of Membrane Filters by Bubble Point and Mean Flow Pore Test” ASTM F3 i 6 - 03(201 1 ) (available at: https://www.astm.org/Standards/F316.htm); the maximum pore diameter dmax may be measured using the Advanced Capillary Flow Pororaeter iPORE 1200 provided by company Porous Materials, Inc. (available at:
  • the heat transfer device may operate in a so-called anti-gravity configuration, in which the liquid phase flows vertically upwards, hence against the gravity, from the condensation region to the evaporation region.
  • the heat transfer device may operate in the opposite configuration, the evaporation region being located below the condensation region.
  • the heat transfer device may operate in a horizontal or inclined orientation.
  • the porous structure in the condensation region may include two or more segments having different effective pore sizes, which effective pore sizes decrease in a direction going from the condensation region to the e vapo rati on reg i o n .
  • the porous structure in the evaporation region may include two or more segments having different effective pore sizes, which effective pore sizes decrease in a direction going from the condensation region to the evaporation region.
  • the first segment may comprise a first sintered material formed of sintered particles ha ving a first average particle size and the second segment may comprise a second sintered material formed of sintered particles having a second average particle size.
  • the particles having the first average particle size may be selected within the group consisting of: copper powder, copper meshes, aluminum powder, aluminum meshes, nickel powder, nickel meshes, steel powder, steel meshes, titanium powder, titanium meshes, ceramics, and polymers.
  • the particles having the second average particle size may be selected within the group consisting of: copper powder, copper meshes, aluminum powder, aluminum meshes, nickel powder, nickel meshes, steel powder, steel meshes titanium powder, titanium meshes, ceramics, and polymers.
  • the copper powder may be of dendritic shape or of irregular shape.
  • the sequence of segments may further include at least one intermediate segment extending between the first segment and the second segment, the at least one intermediate segment having a third effective pore size, the third effective pore size being larger than the first effective pore size.
  • the at least one intermediate segment enables manufacturing a heat transfer device that can be iong and efficient since the third effective pore size enhances the maximum transferrable heat load, as it helps increase the capillary pressure while decreasing the liquid pressure drop.
  • the at least one intermediate segment may define a transport region for transporting the liquid under capillary pressure through the porous structure from the condensation region to the evaporation region.
  • the number of intermediate segments may range from I to 5, each intermediate segment having a respective effective pore size, the intermediate segments being sequentially arranged along a longitudinal direction extending from the condensation region toward the evaporation region such that the effective pore sizes decrease stepwise from one intermediate segment to the next intermediate segment in the sequence of segments from the condensation region toward the evaporation region.
  • the or each intermediate segment enables manufacturing a longer yet efficient heat transfer device.
  • the number of intermediate segments may range from 2 to 5.
  • a third cross-sectional area of the vapor channel in the at least one intermediate segment may be smaller than at least one of: i) a first cross-sectional area of the vapor channel in the first segment, and ii) a second cross-sectional area of the vapor channel in the second segment.
  • the total pressure drop generated in the porous structure may be comparable to the total pressure drop generated in a porous structure having a constant cross-sectional area, while the thermal resistance may be smaller as the temperature difference may be decreased.
  • the number of spaces having different cross- sectional areas in the vapor channel may differ from the number of segments having different effective pore sizes in the sequence of segments.
  • the second effective pore size of the second segment may be smaller than the third effective pore size of the at least one intermediate segment.
  • the sequence of segments makes it possible to decrease thermal resistance in the conden satio n regi on .
  • the evaporation region may be delimited i) by a heat-receiving side wall configured to be thermally coupled to the heat source and ii) by an opposite side wall located opposite the heat-receiving side wall with respect to a longitudinal direction extending from the condensation region toward the evaporation region the porous structure being thinner at the heat- receiving side wall than at the opposite side wall.
  • the thermal resistance of the porous structure may be reduced near the heat source, which may increase the maximum transferrable heat load.
  • the vapor channel may extend closer to the heat-receiving side wall than to the opposite side wall.
  • the porous structure may be thinner at the heat-receiving side wail than at the opposite side wall.
  • the condensation region may be delimited i) by a heat-dissipating side wail configured to be thermally coupled to the heat sink and ii) by a facing side wail facing the heat-dissipating side wall with respect to a longitudinal direction extending from the condensation region toward the evaporation region, the porous structure being thinner at the heat-dissipating side wall than at the facing side wall.
  • the thermal resistance of the porous structure may be reduced near the heat sink, which may increase the maximum transferable heat load.
  • the vapor channel may extend closer to the heat-dissipating side wall than to the lacing side wall.
  • the porous structure may be thinner at the heat-dissipating side wall than at the facing side wall.
  • the vapor channel may be inclined with respect to a longitudinal direction extending from the condensation region toward the evaporation region.
  • the porous structure may be thinner near the heat source and near the heat sink, which may increase the maximum transferrable heat load.
  • At least one segment of the sequence of segments may have a main portion and a boundary portion, the boundary portion being closer to an interface with the consecutive segmen in the sequence of segments than the main portion, the cross-sectional area of the porous structure in the boundary portion being larger than the cross-sectional area of the porous structure in the main portion.
  • a larger cross-sectional area of the porous structure in the boundary portion may decrease the local pressure drop in the liquid flow.
  • the porous structure may have at least one interface that is arranged between two consecutive segments in the sequence of segments and that extends obliquely to a longitudinal direction extending from the condensation region toward the evaporation region.
  • such an obliquely extending interface may locally increase the cross-sectional area of the porous structure, which may decrease the local pressure drop in the liquid flow.
  • the interface or each interface between two consecutive segments may be planar.
  • the cross-sectional area of the porous structure in the first segment may range from 60% to 450% of the cross-sectional area of the vapor channel, and wherein the cross-sectional area of the porous structure in the second segment may range from 60% to 450% of the cross-sectional area of the vapor channel.
  • a first length of the first segment may range from 50% to 200% of a length of the evaporation region, and wherein a second length of the second segment may range from 50% to 300% of a length of the condensation region.
  • an electronic assembly may comprise an heat source, for example an electronic device, a heat sink, and the heat transfer device of any one of the preceding claims, wherein the evaporation region may be in thermal contact with the heat source and the condensation region is in thermal contact with the heat sink.
  • the electronic assembly may comprise at least one heat source like an electronic component that generates heat when functioning.
  • the electronic assembly may comprise several heat sources.
  • the heat sink may comprise at least one heat dissipating element that dissipates heat in the ambient or surrounding environment. In a particular implementation form, the heat sink may comprise several heat dissipating elements.
  • the heat transfer device may further comprise walls arranged to enclose the evaporation region, the condensation region, the porous structure and the vapor channel, the porous structure being arranged around the vapor channel.
  • the heat transfer device may be elongated at least along a longitudinal direction extending between the evaporation region and the condensation region.
  • the heat transfer device may generally have the shape of a cylinder having a circular or an oblong cross-section.
  • the heat transfer device may form a heat pipe.
  • the heat transfer device may generally have the shape of a plate having, for example, a rectangular outline.
  • An aspect of the invention provides a method for manufacturing a heat transfer device for transferring heat generated by a heat source to a heat sink via a fluid, wherein the heat transfer device comprises:
  • a vapor channel extending from the evaporation region to the condensation region such that evaporated fluid may flow from the evaporation region to the condensation region through the vapor channel
  • a porous structure extending from the condensation region to the evaporation region such that condensed fluid may flow from the condensation region to the evaporation region through the porous structure by actio of capillary forces
  • porous structure comprises a sequence of segments including at least i) afirst segment extending in the evaporation region and ii) a second segment extending in the condensation region,
  • the method further comprises:
  • the first place corresponds to the first segment and the second place corresponds to the second segment.
  • the sintering process may comprise: providing an atmosphere containing at least one of nitrogen gas and argon gas and a sintering temperature ranging from 860 degrees Celsius to 890 degrees Celsius
  • the sintering process may have a duration in the range of 1 .2 h to 2.0 h, advantageously in the range of 1 .5 h to 2.0 h.
  • the method further comprises: before the sintering process: placing a filling material in a space corresponding to the vapor channel ;
  • the filling material is a core pin.
  • the first average particle size is comprised in the range of 40 um to 290 pm, advantageously of 40 pm to 75 pm, and wherein the second average particle size is comprised in the range of 50 pm to 300 pm, advantageously of 200 pm to 300 pm.
  • the average particle sizes (first, second) of filling material, for each one of the first and second segments, may be calculated as d ; , ,av in the following equation:
  • Minimum and maximum particle sizes of filling material, for each one of the first and second segments may be measured during sieve analysis according to standard ASTM C136 / C136M - 14“Standard Test Method for Sieve Analysis of Fine and Coarse Aggregates’ " (available at: https://www.astm. org/Standards/C 136.htm): design, e.g.
  • a sieve shaker for measuring particle sizes may follow the specification ASTM El l-17, which is referred to in relation to Method A of standard ASTM C l 36 / C136M - 14; for example the sieve shaker“Gilson SS-8R” (available at: https://www.globalgiison.com/giison- tanpi ng-sleve-shakers) may be used for measuring particle sizes.
  • the first average particle size and the second average particle size arc measured before the particles forming the first and second sintered materials are sintered hence before the sintering process.
  • FIG. 1 is a schematic cross-sectional view, along plane I in FIG. 2, illustrating a heat transfer device according to a first embodiment.
  • FIG. 2 is a schematic cross-sectional view along plane II in FIG. 1.
  • FIG. 3 is a schematic cross-sectional view along plane HI in FIG. 1.
  • FIG. 4 is a schematic cross-sectional view along plane IV in FIG. I .
  • FIG. 5 is a schematic cross-sectional view, along plane V in FIG. 6. illustrating a heat transfer device according to a second embodiment.
  • FIG. 6 is a schematic cross-sectional view along plane VI in FIG. 5.
  • FIG. 7 is a schematic cross-sectional view along plane VII in FIG 5.
  • FIG. 8 is a. schematic cross-sectional view along plane VIII in FIG. 5.
  • FIG. 9 is a schematic cross-sectional view along plane IX in FIG. 5.
  • FIG. 10 is a schematic diagram illustrating changes of effective pore sizes along the heat transfer device of FIG. 5.
  • FIG. 1 1 is a schematic diagram similar to FIG. 10 and illustrating the effective pore size along a heat transfer device according to a third embodiment.
  • FIG. 12 is a schematic cross-sectional view along plane XII in FIG. 13, illustrating a heat transfer device according to a fourth embodiment.
  • FIG. 13 is a schematic cross-sectional view along plane XI 1 i in FIG. 12.
  • FIG. 14 is a schematic cross-sectional view along plane XIV in FIG 12.
  • FIG. 15 is a schematic cross-sectional view along plane XV in FIG. 12.
  • FIG. 16 is a schematic cross-sectional view along plane XVI in FIG. 12.
  • FIG. 17 is a schematic diagram illustrating thicknesses of porous structure along the heat transfer device of FIG. 12.
  • FIG. 1 8 is a view similar to FIG. 12 illustrating a heat transfer device according to a fifth embodiment.
  • FIG. 19 is a view similar to FIG. 5 illustrating a heat transfer device according to a sixth embodiment.
  • FIG. 20 is a schematic cross-sectional view, along plane XX in FIG. 21 , illustrating a heat transfer device according to a seventh embodiment.
  • FIG. 21 is a schematic cross-sectional view along plane XXI in FIG. 20.
  • FIG. 22 is a schematic cross-sectional view along plane XXII in FIG. 20.
  • FIG 23 is a schematic cross-sectional view along plane XXII 1 in FIG. 20.
  • FIG. 24 is a schematic cross-sectional view along plane XXIV in FIG. 20.
  • FIG. 25 is a schematic cross-sectional view along plane XXV in FIG. 26, illustrating a heat transfer device according to an eighth embodiment.
  • FIG. 26 is a schematic cross-sectional view along plane XXVI in FIG. 25.
  • FIG. 2? is a schematic cross-sectional view along plane XXVII in FIG. 25.
  • FIG. 28 is a schematic cross-sectional view along plane XXVIII in FIG. 25.
  • FIG. 29 is a schematic cross-sectional view along plane XXIX in FIG. 25.
  • FIG. 30 is a schematic diagram Illustrating thicknesses of porous structure along the heat transfer device of FIG. 25.
  • FIG. 31 to 38 are cross-sectional views il lustrating several steps of a method according to an embodiment for manufacturing a heat transfer device.
  • FIG. 39 is a cross-sectional view illustrating a step of a method according to another embodiment for manufacturing a heat transfer device.
  • FIG. 40 are cross-sectional views illustrating several steps of a method according to yet another embodiment for manufacturing a heat transfer device.
  • FIG 41 is a schematic diagram illustrating a technical effect of a heat transfer device according to an embodiment as compared to a conventional heat transfer device.
  • FIG. 1 to 4 illustrate a heat transfer device f , according to a first embodiment, for transferring heat generated by a heat source 2 to a heat sink 4 via a fluid (not shown).
  • Heat transfer device 1 comprises an evaporation region 6 where a fluid in the liquid phase may evaporate.
  • Evaporation region 6 corresponds to heat source 2 when heat transfer device 1 is assembled with heat source 2.
  • Heat transfer device 1 comprises a condensation region 8 where the fluid in the vapor phase may condense.
  • Condensation region 8 corresponds to heat sink 4 when the heat transfer device 1 is assembled with heat sink 4.
  • heat transfer device 1 may comprise a transport region 9 between evaporation region 6 and condensation region 8.
  • Heat transfer device 1 comprises a porous structure 10 extending from condensation region 8 to evaporation region 6 such that condensed fluid may flow' from condensation region 8 to evaporation region 6 through porous structure 10.
  • Heat transfer device 1 comprises a vapor channel 12 extending from evaporation region 6 to the condensation region 8 such that evaporated fluid may flow from evaporation region 6 to condensation region 8 through vapor channel 12.
  • Porous structure 10 may be arranged around vapor channel 12.
  • Heat transfer device 1 may be elongated along a longitudinal direction Z extending between evaporation region 6 and condensation region 8. Heat transfer device 1 may generally have the shape of a cylinder having an oblong basis across longitudinal direction Z.
  • Porous structure 10 may have the shape of a tube extending in longitudinal direction Z.
  • Vapor channel 12 may extend along, i.e. parallel to or coincident with, longitudinal direction Z.
  • Vapor channel 12 may have the same shape and the same cross section area all along heat transfer device 1.
  • Vapor channel 12 may generally have the shape of a cylinder having an oblong basis across longitudinal direction Z.
  • Porous structure 10 comprises a sequence of segments including i) a first segment 20 extending in evaporation region 6 and ii) a second segment 22 extending in condensation region 8.
  • First segment 20 has a first effective pore size and second segment 22 has a second effective pore size.
  • the second effective pore size is larger than the first effective pore size.
  • the first effective pore size may be of about 30 pm and the second effective pore size may be of about 70 pm.
  • First segment 20 may comprise a first sintered material, e.g. copper, formed of sintered particles, which particles have a first average particle size of about 60 to 75 pm before being sintered.
  • Second segment 22 may comprise a second sintered material, e.g. copper, formed of sintered particles, which particles have a second average particle size of about 200 to 300 p before being sintered.
  • Heat transfer device 1 may comprise walls 14 arranged to enclose evaporation region 6, condensation region 8, porous structure 10 and vapor channel 1:2.
  • heat transfer device 1 may comprise a top wall (not shown) arranged atop first segment 20 and a bottom wall (not shown) arranged beneath second segment 22, so as to hermetically contain the fluid.
  • An inner, cylindrical surface of the w alls of heat transfer device 1 may be covered by porous structure 10.
  • evaporation region 6 may be about 25 m long condensation region 8 may be about 80 mm long, and transport region 9 may be about 80 mm long.
  • First segment 20 may be about 40 mm long
  • second segment 22 may be about 195 mm long.
  • Beat transfer device 1 may have a length of 300 mm from top of first segment 20 to bottom of second segment 22.
  • Heat transfer device 1 may have a width of i 1 m including the walls enclosing porous structure 10 as measured in a width direction X perpendicular to longitudinal direction Z.
  • Vapor channel 12 may have a width W12 of 6 mm.
  • Heat transfer device 1 may have a thickness of 3 mm including the walls enclosing porous structure 10 as measured in a thickness direction Y perpendicular to longitudinal direction Z and to width direction X.
  • Porous structure 10 may have a thickness of about 0.85 mm.
  • the sequence of segments may include a third segment 24, which is an intermediate segment located between the first segment 20 and the second segment 22.
  • Third segment 24 may have a third effective pore size that is larger than the first effective pore size (of first segment 20).
  • Third segment 24 may he formed from particles having a size of about 100 to 150 mth.
  • Third segment 24 may be about 65
  • Third segment 24 may define a border region 24.20 with first segment 20, and a border region 24.22 with second segment 22.
  • Border regio 24 20 may be located in transport region 9.
  • border region 24.22 may be located in transport region 9.
  • first segment 20 may extend partially in evaporation region 6 and partially in transport region 9
  • second segment 20 may extend partially in condensation region 8 and partially in transport region 9.
  • the smaller first effective pore size at first segment 20 may generate a relatively large capillary pressure in other words relatively large capillary forces, for moving the liquid phase back to evaporation section 6.
  • the largest second effective pore size at second segment 22 and the large third second effective pore size at third segment 24 may only cause a relatively small liquid pressure drop in the liquid phase moving back to evaporation section 6. So second segment 22 and third segment 24 may have a higher permeability than first segment 20 due to their big pores located between their large particles.
  • heat transfer device 1 may form an electronic assembly together with an electronic device forming heat source 2, for example a chip, and heat sink 4. in the electronic assembly evaporation region 6 is in thermal contact with heat source 2 and condensation region 8 is in thermal contact with heat sink 4. In service heat source 2 may generate heat and heat sink 4 may be an element that dissipates heat in the ambient or surrounding environment.
  • Meat transfer device 1 may operate in a so-called anti- gravity configuration, in which the liquid phase flows vertically upwards, hence against the gravity, from condensation region 8 to evaporation region 6.
  • FIG. 5 to 0 illustrate a heat transfer device 1 according to a second embodiment. he afore-detailed description of FIG. 1 to 4 may be applied to FIG. 5 to 10, except for the hereinafter-mentioned noticeable differences.
  • An element of heat transfer device 1 of FIG. 5 to 10 is given the same reference sign as an. element having a similar structure or function in FIG. 1 to 4.
  • Heat transfer device 1 of FIG. 5 to 10 differs from heat transfer device 1 of FIG. 1 to 4 in that the sequence of segments of porous structure 10 further comprises a fourth segment 26, which is an intermediate segment located between second segment 22 and third segment 24. Fourth segment 26 may have a fourth effective pore size that is larger than the first effective pore size (of first segment 20)
  • the intermediate segments, third segment 24 and fourth segment 26, may have respective effective pore sizes.
  • the third effective pore size is different from the fourth effective pore size.
  • FIG. 10 illustrates the effective pore size EPS on the horizontal axis with respect to the length in longitudinal direction Z on the vertical axis.
  • the intermediate segments, i.e. third segment 24 and fourth segment 26, may be sequentially arranged along longitudinal direction Z from condensation region 8 toward evaporation region 6 such that the effective pore sizes EPS decrease stepwise from one intermediate segment, herein fourth segment 26, to the next intermediate segment 24, herein third segment 24, in the sequence of segments from condensation region 8 toward evaporation region 6.
  • lake in FIG. 1 to 5 third segment 24 may define a border region 2.4.20 with first segment 20.
  • fourth segment 26 may define a border region 26.22 with secon segment 22.
  • fourth segment 26 may define a border region 26.24 with third segment 24.
  • border region 24.20 may be located in evaporation region 6 in lieu of transport region 9.
  • border region 26.22 may be located in condensation region 8, in lieu of transport region 9.
  • border region 26.24 may be located in transport region 9.
  • the dimensions of heat transfer device 1 of FIG. 5 to 10 may differ from the afore-mentioned dimensions of heat transfer device 1 of FIG. 1. to 4.
  • FIG. 1 1 illustrate a heat transfer device 1 according to a second embodiment.
  • the afore- detailed description of FIG. 5 to 10 may be applied to FIG. 1 1 , except for the hereinafter-mentioned noticeable differences.
  • An element of heat transfer device 1 of FIG. 1 1 is given the same reference sign as an element having a similar structure or function in FIG. 5 to 10.
  • FIG. 1 i illustrates the effective pore size EPS on the horizontal axis with respect to the length in longitudinal direction Z on the vertical axis.
  • Heat transfer device 1 of FIG. 11 differs from heat transfer device 1 of FIG. 5 to 10 in that the fourth effective pore size of fourth segment 26 is larger than the first effective pore size of second segment 22.
  • the third effective pore size of third segment 24 is larger than the first effective pore size of second segment 22.
  • each intermediate segment, 24 or 26, has a larger effective pore size than second segment 22.
  • FIG. 12 to 17 illustrate a heat transfer device 1 according to a second embodiment.
  • the afore-detailed description of FIG. 5 to 9 may be applied to FIG. 12 to 17. except for the hereinafter-mentioned noticeable differences.
  • An element of heat transfer device 1 of FIG. 12 to 17 is given the same reference sign as an element having a similar structure or function in FIG. 5 to 9.
  • Meat transfer device 1 of FIG. 12 to 17 differs from heat transfer device 1 of FIG. 5 to 9 in that vapor channel 12. of FIG. 12 to 17 may include three spaces of different cross- sectional areas along longitudinal direction Z:
  • first space 12.20 extending approximately along first segment 20, a second space .12.22 extending approximately along second segment 20, and a third space 12.24 extending approximately along third, intermediate segment 24, hence between first space 12 20 and second space 12 22 As visible on FIG 12 first space 12.20 extends across border region 24.20 and second space 12.22 extends across border region 26.22.
  • the cross-sectional area of third space 12.24 may be smaller than the cross-sectional area of first space 12.20 and smaller than the cross-sectional area of second space 12.22.
  • the cross-sectional area of first space 12.20 may be similar or identical to the cross- sectional area of second space 12.22.
  • a ratio between the cross-sectional areas of third space 12.24 and of first space 12.20 or of second space 12.22 may range between 20% and 50%
  • FIG. 17 illustrates the thickness T of porous structure 10 on the horizontal axis with respect to the length in longitudinal direction Z on the vertical axis.
  • FIG. 17 illustrates the different thicknesses of porous structure 10 in correspondence to first space 12.20, second space 12.22 and third space 12.24.
  • the different thicknesses of porous structure 10 correspond to different cross-sectional areas of vapor channel 12 in first space 12.20, second space 12.22 and third space 12.24.
  • porous structure 10 may have different cross-sectional areas along first space 12.20, second space 12.22 and third space 12.24, the cross-sectional area along third space 12.24 being larger than the cross-sectional area along first space 12.20 and larger than the cross-sectional area along second .space 12.22.
  • porous structure 10 may be thicker in transport region 9 than in condensation region 8 and in evaporation region 6.
  • the number of spaces, i.e. three, having different cross-sectional areas in vapor channel 12 differs from, and herein is smaller than, the number of segments, i.e. four, having different effective pore sizes in the sequence of segments of porous structure 10.
  • the total pressure drop generated in porous structure 10 may be similar to the design of FIG. 5 to 9, while the thermal resistance may be smaller as the temperature difference e.g. along evaporation region 6 may be decreased.
  • FIG. 18 illustrate a heat transfer device 1 according to a second embodiment.
  • the afore- detailed description of FIG. 12 to 1 7 may be applied to FIG. 18, except for the hereinafter-mentioned noticeable differences.
  • An element of heat transfer device 1 of FIG. 18 is given the same reference sign as an element having a similar structure or function in FIG. 12 to F7,
  • Heat transfer device 1 of FIG. 18 differs from heat transfer device 1 of FIG. 12 to 17 in that first space 12.20 does not extend across border region 24.20, and in that second space 12.22 does not extend across border region 26.22.
  • first space 12.20 extends only within first segment 20 and second space 12.22 extends only within second segment 22.
  • Heat transfer device 1 of FIG. 18 also differs from heat transfer device 1 of FIG. 12 to 17 in that first segment 20 of the sequence of segments has a main portion and a boundary portion, the boundary portion being closer to an interface with the consecutive segment, herein third segment 24, in the sequence of segments than the main portion.
  • the main portion extends along first space 12.2.0, while the boundary portion corresponds to a downstream end of third space 12,24.
  • the cross-sectional area of porous structure 10 in the boundary portion may be larger than the cross-sectional area of porous structure 10 in the main portion.
  • second segment 22 is configured with a main portion and a boundary portion of larger cross-sectional area than its main portion, the boundary portion of second segment 22 being closer to the border region 26.22 than the main portion of second segment 22.
  • first space 12.20 and second space 12.22 of vapor channel 12 in FIG. 18 are shorter, along longitudinal direction Z, than in the design of FIG. 12.
  • So porous structure 10 has a large cross-sectional area at border regions 24.20 and 26.22. Thus, a contact area between first segment 20 and third segment 24 is larger in FIG. 18 than in FIG. 12. Likewise, a contact area between second segment 22 and fourth segment 26 is larger in FIG. 18 than in FiG. 12.
  • the vapor channel may have only two spaces of different cross-sectional areas.
  • the vapor channel may have a larger cross-sectional area at the first segment and a smaller cross-sectional area at the second segment, or vice-versa.
  • the vapor channel may generally have a frustoconieal. shape tapering from condensation region toward evaporation region, or tapering from evaporation region toward condensation region.
  • FIG. 19 illustrates a heat transfer device 1 according to a second embodiment.
  • the afore-detailed description of FIG. 5 to 9 may he applied to FIG. 19, except for the hereinafter-mentioned noticeable differences.
  • An element of heat transfer device 1 of FIG. 19 is given the same reference sign as an dement having a similar structure or function in FIG. 5 to 9.
  • Heat transfer device 1 of FIG. 19 differs from heat transfer device 1 of FIG. 5 to 9 in that porous structure 10 has border regions 24.20, 26.22 and 26.24 between consecutive segments 20/24, 26/22, 24/26 in the sequence of segments define interfaces which extend obliquely to longitudinal direction Z.
  • the obliquely extending interlaces are planar, parallel and each of them forms art angle of approximately 45 degrees with longitudinal direction Z.
  • obliquely extending planar interfaces offer an enlarged contact area between consecutive segments 20/24, 24/26, 26/22 of the sequence of segments.
  • Such an enlarged contact area limits the risk of insufficient contact between particles of different sizes in the sequence of segments.
  • FIG. 20 to 24 illustrates a heat transfer device 1 according to a second embodiment.
  • the afore-detailed description of FIG. 5 to 9 may be applied to FIG. 20 to 24, except for the hereinafter-mentioned noticeable differences.
  • An element of heat transfer device 1 of FIG. 20 to 24 is given the same reference sign as an element having a similar structure or function in FIG. 5 to 9.
  • vapor channel 12 generally has the shape of a cylinder having an oblong basis across longitudinal direction Z. Unlike in the embodiment of FIG. 5 to 9 vapor channel 12 extends closer to the side of heat transfer device 1 where heat source 2 and beat sink 4 are arranged than to the opposite side of heat transfer device 1.
  • Evaporation region 6 is delimited i) by a heat-receiving side wall 6.2 configured to be thermally coupled to heat source 2 and ii) by an opposite side wall 6.3 located opposite heat-receiving side wall 6.2 with respect to longitudinal direction Z.
  • condensation region 8 is delimited i) by a heat-dissipating side wall 8.4 configured to be thermally coupled to heat sink 4, and ii) by a facing side wall 8.5 facing heat- dissipating side wall 8.4 with respect to longitudinal direction Z.
  • Heat transfer device 1 of FIG. 20 to 24 differs from heat transfer device 1 of FIG. 5 to 9 in that: i) vapor channel 12 extends closer to heat-receiving side wall 6.2 than to opposite side wail 6.3, and in that ii) vapor channel 12 extends closer to heat- dissipating side wall 8.4 than to facing side wall 8.5.
  • heat transfer device 1 of FIG. 20 to 24 differs from heat transfer device 1 of FIG. 5 to 9 in that: i) porous structure 10 is thinner at heat-receiving side wail 6.2 than at opposite side wall 6.3, and in that ii) porous structure .10 is thinner at heat-dissipating side wail 8.4 than at facing side wall 8.5.
  • the thickness of porous structure 10 cm heat-receiving side wall 6.2 is smaller than the thickness of porous structure 10 on opposite side wall 6.3 as particularly visible on FIG. 21.
  • the thickness of porous structure 10 on heat-dissipating side wall 8.4 is smaller than the thickness of porous structure 10 on facing side wall 8.5 as particularly visible on FIG. 24.
  • thermal resistance of porous stmctu.re 10 may be reduced near heat source 2 and near heat sink 4, which may increase the maximum transferrable heat load.
  • first segment 20, second segment 22 and of vapor channel 12 may be similar in the configuration of FIG. 20 to 24 as in the configuration of FIG. 5 to 9, thus generating a similar pressure drop in the liquid flow ⁇ .
  • FIG. 25 to 30 illustrates a heat transfer device 1 according to a second embodiment.
  • the afore-detailed description of FIG. 20 to 24 may be applied to FIG. 25 to 30, except for the hereinafter-mentioned noticeable differences.
  • An element of heat transfer device 1 of FIG. 25 to 30 is given the same reference sign as an element having a similar structure or function in FIG. 20 to 24.
  • Heat transfer device I of FIG, 25 to 30 differs from heat transfer device i of FIG. 20 to 24 in that heat source 2 and heat sink 4 are arranged on opposite sides of heat transfer device 1 with respect to longitudinal direction Z.
  • heat transfer device 1 of FIG. 25 to 30 differs from heat transfer device 1 of FIG. 20 to 24 in that vapor channel 12 is inclined with respect to longitudinal direction Z extending front condensation region 8 toward the evaporation region 6.
  • vapor channel 12 extends closer to heat-receiving side wall 6.2 than to opposite side wall 6.3, and in that ii) vapor channel 12 extends closer to heat-dissipating side wall 8.4 than to facing side wall 8.5.
  • FIG. 30 illustrates the thickness T of porous structure 10 on the horizontal axis with respect to the length in longitudinal direction 2 on the vertical axis. As illustrated in FIG. 30 a thickness of porous structure 10 in first segment 20 decreases linearly along longitudinal direction Z and toward second segment 22. Similarly, a thickness of porous structure 10 in secon segment 22 increases linearly along longitudinal direction Z and toward first segment 20.
  • FIG. 25 to 30 the thermal resistance of porous structure 10 can be reduced near heat source 2 and near heat sink 4. thus enhancing the heat transfer.
  • the respective cross-sectional areas of first segment 20, second segment 22 and of vapor channel 12 may be substantially equal in the configuration of FIG. 20 to 24 as in the configuration of FIG. 5 to 9, thus generating a similar pressure drop in the liquid fl w.
  • FIG. 31 to 38 illustrate several steps of a method according to an embodiment for manufacturing a heat transfer device which is akin to heat transfer device 1 of FIG. 5 to 9.
  • a heat transfer device 1 manufactured through this method comprises:
  • vapor channel 12 extending from evaporation region 6 to the condensation region 8 such that evaporated fluid may flow from evaporation region 6 to condensation region 8 through vapor channel 12, and
  • Porous structure 10 comprises a sequence of segments including i) a first segment 20 extending in evaporation region 6, ii) a second segment 22 extending in condensation region 8. iii) a third segment 24 and a fourth segment 24, which are intermediate segments extending between first segment 20 and second segment 22.
  • a second effective pore size of second segment 22 may be larger than a first effective pore size of first segment 20.
  • the method of FIG. 31 to 37 may comprise:
  • the housing may be comprised of walls, which may form a metal envelope;
  • pin 32 may obstruct a bottom port 33 while carrying out the method steps so that vapor channel 12 has an open bottom end; pin 32 may be formed of a core pin;
  • the first, second, third and fourth places respectively correspond to first segment 20, second segment 22, third segment 24 and fourth segment 26 of heat transfer device 1.
  • the step of placing particles may be repeated a number of times equal to the number of desired segments in the sequence of segments eventually composing the porous structure.
  • the first average particle size (powder P20) may be comprised in the range of 40 pm to 290 mh , advantageously of 40 pm to 75 pm
  • the second average particle size (powder P22) is comprised in the range of 50 pm to 300 pm, advantageously of 200 p to 300 pm.
  • the third and fourth particle sizes may be selected according to the details given in relation to FIG 10 and 1 i .
  • the sintering process may comprise; providing an atmosphere containing at least one of nitrogen gas and argon gas and a sintering temperature ranging from 860 degrees Celsius to 890 degrees Celsius
  • the sintering process may have a duration in the range of 1.2 h to 2.0 h.
  • the method of FIG. 31 to 38 may comprise;
  • the method of F G. 31 to 37 may comprise:
  • FIG. 39 illustrates a step of a method according to another embodiment for manufacturing a heat transfer device which is akin to heat transfer device 1 of FIG. 25 to 29, The afore-detailed description of FIG. 31 to 38 may be applied to FIG. 39, except for the hereinafter-mentioned noticeable differences.
  • the step illustrated on FIG. 39 may replace the step of FIG. 32 in the method of FIG. 31 to 38.
  • the method of FIG. 39 differs from the method of FIG. 25 to 29 in that filling material 32 is placed in an inclined orientation with respect to housing 30.
  • a longitudinal axis Z32 of filling material 32 is inclined with respect to a longitudinal direction Z of housing 30.
  • Such an inclined orientation of filling material 32 enables for example to manufacture heat transfer device 1 of FIG. 25 to 29 with an oblique vapor channel 12 after completion of the previous steps as described in relation to FIG. 31. to 38.
  • FIG. 40 illustrates a step of a method according to another embodiment for manufacturing a heat transfer device which is akin to heat transfer device 1 of FIG. 39.
  • the afore-detailed description of FIG. 39 may be applied to FIG. 40, except for the hereinafter-mentioned noticeable di fferences .
  • the method of FIG. 40 differs from the method of FIG. 39 in that filling material 32 includes a primary pin 32.1 and a secondary pin 32.2.
  • Secondary pin 32.2 may be integral with primary pin 32.1, thus forming a combined pin.
  • Secondary pin 32.2 may be arranged so as to obstruct port 33 of housing 30 when charging powder particles in housing 30.
  • FIG. 41 illustrates Temperature difference fin degrees Celsius) as a function of heating power Q (in Watt) that is transferred:
  • FIG. 41 shows that beyond a heating power Q of 16 W, the conventional heat transfer device stops operating properly, because the Temperature difference increases rapidly (left curve). By contrast, the Temperature difference for heat transfer device I of FIG. 1 (right curve) does not change rapidly even when the heating power Q exceeds 35 W. Hence, heat transfer device 1 of FIG. 1 may transfer much more heat as compared to a conventional heat transfer device. Similar results are obtained when the same heal transfer devices are tested operating in a horizontal orientation.
  • a heat transfer device as described above may efficiently transfer heat, and a method as described above make it possible to manufacture such a heat transfer device in mass production with a reduced cost and an enhanced reliability.

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  • Engineering & Computer Science (AREA)
  • Life Sciences & Earth Sciences (AREA)
  • Sustainable Development (AREA)
  • Physics & Mathematics (AREA)
  • Thermal Sciences (AREA)
  • Mechanical Engineering (AREA)
  • General Engineering & Computer Science (AREA)
  • Cooling Or The Like Of Semiconductors Or Solid State Devices (AREA)
  • Heat-Exchange Devices With Radiators And Conduit Assemblies (AREA)

Abstract

L'invention concerne un dispositif de transfert de chaleur efficace pouvant être utilisé pour la production en série. Le dispositif de transfert de chaleur comprend : - une région d'évaporation, - une région de condensation, - un canal de vapeur s'étendant de la région d'évaporation à la région de condensation, et - une structure poreuse s'étendant de la région de condensation à la région d'évaporation. La structure poreuse comprend une séquence de segments comprenant au moins i) un premier segment dans la région d'évaporation et ii) un second segment dans la région de condensation. Le premier segment a une première taille de pore effective, et le second segment a une seconde taille de pore effective qui est plus grande que la première taille de pore effective. L'invention concerne également un procédé de fabrication d'un dispositif de transfert de chaleur.
PCT/BY2019/000009 2019-06-17 2019-06-17 Dispositif de transfert de chaleur et procédé de fabrication d'un tel dispositif de transfert de chaleur Ceased WO2020252555A1 (fr)

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EP19745036.4A EP3973240B1 (fr) 2019-06-17 2019-06-17 Dispositif de transfert thermique et son procede de fabrication
PCT/BY2019/000009 WO2020252555A1 (fr) 2019-06-17 2019-06-17 Dispositif de transfert de chaleur et procédé de fabrication d'un tel dispositif de transfert de chaleur

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CN113784584A (zh) * 2021-08-19 2021-12-10 联想(北京)有限公司 一种散热件和电子设备
JP2023158332A (ja) * 2022-04-18 2023-10-30 古河電気工業株式会社 ヒートパイプ
WO2025179363A1 (fr) 2024-02-28 2025-09-04 Huawei Technologies Co., Ltd. Dispositif de transfert de chaleur et procédé de fabrication d'un tel dispositif de transfert de chaleur

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WO2025179363A1 (fr) 2024-02-28 2025-09-04 Huawei Technologies Co., Ltd. Dispositif de transfert de chaleur et procédé de fabrication d'un tel dispositif de transfert de chaleur

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EP3973240A1 (fr) 2022-03-30
EP3973240B1 (fr) 2023-10-04

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