WO2020133508A1 - Packaged antenna module and electronic device - Google Patents

Abstract

The present invention provides a packaged antenna module and an electronic device. The packaged antenna module comprises a substrate, an antenna group and an integrated circuit chip group provided on two opposite sides of the substrate, and a feed network embedded in the substrate. The integrated circuit chip group comprises a first integrated circuit chip and a second integrated circuit chip. The antenna group comprises a first antenna module electrically connected to the first integrated circuit chip and a second antenna module electrically connected to the second integrated circuit chip. The first antenna module comprises a plurality of cavity-backed patch antenna elements, and the second antenna module comprises a plurality of dipole antenna elements. According to the packaged antenna module and the electronic device of the present invention, the packaged antenna module is small in occupied space and high in radiation efficiency.

Description

Packaging antenna module and electronic equipment 【Technical field】

The invention relates to the field of communication, in particular to a packaged antenna module and electronic equipment.

【Background technique】

As 5G is the focus of research and development in the global industry, developing 5G technology to formulate 5G standards has become an industry consensus. At the 22nd meeting of ITU-RWP5D held in June 2015, the International Telecommunication Union ITU identified three main application scenarios of 5G: enhanced mobile broadband, large-scale machine communications, and high-reliability and low-latency communications. These three application scenarios correspond to different key indicators, in which the peak user speed in the enhanced mobile bandwidth scenario is 20Gbps, and the minimum user experience rate is 100Mbps. Millimeter wave's unique high carrier frequency and large bandwidth characteristics are the main means to achieve 5G ultra-high data transmission rate. And the space reserved for 5G antennas in future mobile phones is small, and there are not many optional positions.

Therefore, it is necessary to provide a packaged antenna module with high coverage efficiency and small occupation space.

[Invention content]

The object of the present invention is to provide a packaged antenna module to achieve a wide coverage and a small occupied space.

The technical solution of the present invention is as follows: A packaged antenna module includes a substrate, antenna groups and integrated circuit chip groups disposed on opposite sides of the substrate, and a feed network embedded in the substrate, the integrated The circuit chip set includes a first integrated circuit chip and a second integrated circuit chip, and the antenna set includes a first antenna module electrically connected to the first integrated circuit chip and a second electrically connected to the second integrated circuit chip An antenna module, the first antenna module includes a plurality of back cavity patch antenna units, and the second antenna module includes a plurality of dipole antenna units.

Preferably, the maximum radiation direction of the first antenna module is perpendicular to the substrate, and the maximum radiation direction of the second antenna module is parallel to the substrate and away from the first antenna module.

Preferably, the first antenna module and the second antenna module are arranged side by side along a first direction, a number of the back cavity patch antenna units of the first antenna module and a number of the second antenna modules The dipole antenna elements are all arranged in a straight line along the second direction, and the first direction is perpendicular to the second direction.

Preferably, the antenna group includes a system ground stacked on the substrate, and the back cavity patch antenna unit includes a back cavity opened in the system ground, and an upper patch and a lower layer accommodated in the back cavity Patch, the upper layer patch is stacked on the side of the lower layer patch away from the substrate, the feeding network is electrically connected to the lower layer patch for feeding, the upper layer patch and the lower layer The patch is coupled to feed.

Preferably, the antenna group further includes a clearance area arranged side by side at the end of the system, and the dipole antenna unit includes a reversely extending first radiating arm and a second radiating arm provided at the clearance area , A first feed arm extending from an end of the first radiation arm near the second radiation arm perpendicular to the first radiation arm, and a vertical end from the end of the second radiation arm close to the first radiation arm A second feed arm extending from the second radiation arm, the first feed arm is stacked on a side of the second feed arm away from the substrate, the first radiation arm and the first A feeding arm is arranged on the same plane, and the second radiation arm and the second feeding arm are arranged on the same plane.

Preferably, both the first feed arm and the second feed arm extend along the first direction.

Preferably, the first feed arm is electrically connected to the system ground, and the second feed arm is electrically connected to the feed network to feed power.

Preferably, the system is provided with a clearing window adjacent to the clearing area, and the second feeding arm extends into the clearing window to be electrically connected to the feeding network.

Preferably, the first antenna module includes 4 back cavity patch antenna units, and the second antenna module includes 4 dipole antenna units.

The present invention also provides an electronic device, which includes a housing and the above-mentioned packaged antenna module. The packaged antenna module is disposed in the housing.

The beneficial effect of the present invention is that: the first antenna module encapsulating the antenna module includes a plurality of back cavity patch antenna units, the second antenna module includes a plurality of dipole antenna units, and the first antenna module and the second antenna module respectively correspond to an integrated The circuit chip has a high degree of integration, saving the space occupied by the packaged antenna module, and through the cooperation of the back cavity patch antenna unit and the dipole antenna unit, the coverage efficiency is high.

[Description of the drawings]

1 is a logical block diagram of a packaged antenna module provided by the present invention;

2 is a perspective structural view of a packaged antenna module provided by the present invention;

3 is a top view of the packaged antenna module provided by the present invention;

4 is an enlarged view of the area A in FIG. 2;

FIG. 5 is an enlarged view of area B in FIG. 2;

6 is a beam direction diagram of the dipole antenna unit of the packaged antenna module provided by the present invention;

7 is a beam direction diagram of the back cavity patch antenna unit of the packaged antenna module provided by the present invention;

8 is a graph of coverage efficiency of a packaged antenna module provided by the present invention.

In the picture: 10, substrate; 20, antenna group; 21, first antenna module; 211, back cavity patch antenna unit; 212, back cavity; 213, upper patch; 214, lower patch; 22, second antenna Module; 221, dipole antenna unit; 222, first radiation arm; 223, second radiation arm; 224, first feed arm; 225, second feed arm; 23, system ground; 24, clearance area; 25. Clearance window; 30, integrated circuit chipset; 31, first integrated circuit chip; 32, second integrated circuit chip; 40, feed network.

【detailed description】

The present invention will be further described below with reference to the drawings and embodiments.

It should be noted that all the directional indicators (such as up, down, left, right, front, back, top, bottom, etc.) in the embodiments of the present invention are only used to explain a specific posture (as shown in the drawings) The relative positional relationship between the lower parts, etc., if the specific posture changes, the directional indication will change accordingly.

It should also be noted that when an element is referred to as being “fixed” or “disposed” on another element, the element can be directly on the other element or there can be a centering element at the same time. When an element is said to "connect" another element, it may be directly connected to the other element or there may be a center element at the same time.

The packaged antenna module provided by the present invention is applied to an electronic device. The electronic device includes a packaged antenna module and a housing. The packaged antenna module is provided in the housing and used for transmitting and receiving signals. As shown in FIGS. 1-2, the packaged antenna module includes a substrate 10, antenna groups 20 and integrated circuit chipsets 30 disposed on opposite sides of the substrate 10, and a feed network 40 embedded in the substrate 10, the integrated circuit chip The group 30 includes a first integrated circuit chip 31 and a second integrated circuit chip 32, and the antenna group 20 includes a first antenna module 21 electrically connected to the first integrated circuit chip 31 and a second antenna electrically connected to the second integrated circuit chip 32 Module 22, the first antenna module 21 includes several back cavity patch antenna units 211, and the second antenna module 22 includes several dipole antenna units 221. The back cavity patch antenna unit 211 is electrically connected to the first integrated circuit chip 31, and the dipole antenna unit 221 is electrically connected to the second integrated circuit chip 32 through the cooperation of the back cavity patch antenna unit 211 and the dipole antenna unit 221 , To form a packaged antenna module, make full use of the substrate 10 space, high integration, and high coverage efficiency.

As shown in FIG. 2, in a packaged antenna module provided by an embodiment of the present invention, the maximum radiation direction of the first antenna module 21 is perpendicular to the substrate 10 to form an orthobeam, and the maximum radiation direction of the second antenna module 22 is parallel to The substrate 10 and away from the first antenna module 21 form an end-fire beam, thereby increasing the coverage efficiency of the packaged antenna module.

In one embodiment, as shown in FIG. 3, the first antenna module 21 and the second antenna module 22 are arranged side by side along the first direction, and a plurality of back cavity patch antenna units 211 and the second antenna module 22 of the first antenna module 21 The plurality of dipole antenna units 221 are all arranged in a straight line along the second direction, and the first direction is perpendicular to the second direction.

As shown in FIGS. 2-5, the antenna group 20 includes a system ground 23 stacked on the substrate 10, and the back cavity patch antenna unit 211 includes a back cavity 212 opened in the system ground 23 and an upper patch contained in the back cavity 212 213 and the lower patch 214, the upper patch 213 is stacked on the side of the lower patch 214 away from the substrate 10, the feeding network 40 is electrically connected to the lower patch 214 for feeding, and the upper patch 213 is coupled to the lower patch 214 To feed.

The antenna group 20 further includes a clearance area 24 disposed side by side at the end of the system ground 23, and the dipole antenna unit 221 includes a reversely extending first radiation arm 222 and second radiation arm 223 disposed in the clearance area 24. The end of the radiation arm 222 near the second radiation arm 223 is perpendicular to the first feed arm 224 extending from the first radiation arm 222 and the end of the second radiation arm 223 near the first radiation arm 222 is perpendicular to the second radiation arm 223 The second feed arm 225, the first feed arm 224 is stacked on the side of the second feed arm 225 away from the substrate 10, the first radiating arm 222 and the first feed arm 224 are disposed on the same plane, the second radiating The arm 223 and the second feeding arm 225 are disposed on the same plane.

Preferably, both the first power feeding arm 224 and the second power feeding arm 225 extend along the first direction.

Preferably, the first feed arm 224 is electrically connected to the system ground 23, and the second feed arm 225 is electrically connected to the feed network 40 to feed power. The system ground 23 is provided with a clearance window 25 adjacent to the clearance area 24. The second feed arm 225 extends into the clearance window 25 to be electrically connected to the feed network 40.

In one embodiment, the first antenna module 21 includes 4 back cavity patch antenna units 211, and the second antenna module includes 4 dipole antenna units 221.

As shown in FIG. 6, the maximum radiation direction of the second antenna module is Theta=90° direction, that is, the direction parallel to the substrate. At the same time, it can be understood that because the second antenna module is provided with a system ground close to the first antenna module, the maximum radiation direction of the second antenna module is away from the first antenna module.

As shown in FIG. 7, the maximum radiation direction of the first antenna module is Theta=0°, that is, perpendicular to the substrate.

As shown in FIG. 8, the coverage efficiency curve diagram of the packaged antenna module provided by the present invention, it can be seen that the packaged antenna provided by the present invention has better coverage efficiency.

In the packaged antenna module and electronic equipment provided by the present invention, the first antenna module 21 includes a plurality of back cavity patch antenna units 211, the second antenna module 22 includes a plurality of dipole antenna units 221, the first antenna module 21 and the second antenna The modules 22 each correspond to an integrated circuit chip, which has a high degree of integration, saves the space occupied by the packaged antenna module, and through the cooperation of the back cavity patch antenna unit 211 and the dipole antenna unit 221, the coverage efficiency is high.

The above are only the embodiments of the present invention. It should be pointed out that those of ordinary skill in the art can make improvements without departing from the inventive concept of the present invention, but these belong to the present invention. Scope of protection.

Claims (10)

An encapsulated antenna module, characterized by comprising a substrate, antenna groups and integrated circuit chip groups provided on opposite sides of the substrate, and a feed network embedded in the substrate, the integrated circuit chip group Including a first integrated circuit chip and a second integrated circuit chip, the antenna group includes a first antenna module electrically connected to the first integrated circuit chip and a second antenna module electrically connected to the second integrated circuit chip, The first antenna module includes several back cavity patch antenna units, and the second antenna module includes several dipole antenna units. The packaged antenna module according to claim 1, wherein the maximum radiation direction of the first antenna module is perpendicular to the substrate and the maximum radiation direction of the second antenna module is parallel to the substrate and Away from the first antenna module. The packaged antenna module according to claim 1, wherein the first antenna module and the second antenna module are arranged side by side along a first direction, and a plurality of the back cavity patches of the first antenna module The antenna unit and the plurality of dipole antenna units of the second antenna module are all arranged in a line along a second direction, and the first direction is perpendicular to the second direction. The packaged antenna module according to claim 3, wherein the antenna group includes a system ground stacked on the substrate, and the back cavity patch antenna unit includes a back cavity opened in the system ground and An upper patch and a lower patch contained in the back cavity, the upper patch is stacked on a side of the lower patch away from the substrate, and the feeding network is electrically connected to the lower patch To feed, the upper-layer patch and the lower-layer patch are coupled to feed. The packaged antenna module according to claim 4, wherein the antenna group further includes a clearance area arranged side by side at the end of the system, and the dipole antenna unit includes a clearance area arranged at the clearance area A first radiation arm and a second radiation arm extending in reverse, a first feed arm extending perpendicularly to the first radiation arm from an end of the first radiation arm close to the second radiation arm, and from the first One end of the two radiating arms near the first radiating arm is perpendicular to the second feeding arm extending perpendicular to the second radiating arm, and the first feeding arm is stacked on the second feeding arm away from the substrate On one side, the first radiating arm and the first feeding arm are arranged on the same plane, and the second radiating arm and the second feeding arm are arranged on the same plane. The packaged antenna module according to claim 5, wherein the first power feeding arm and the second power feeding arm both extend along the first direction. The packaged antenna module according to claim 6, wherein the first feed arm is electrically connected to the system ground, and the second feed arm is electrically connected to the feed network to feed power. The packaged antenna module according to claim 7, wherein the system is provided with a clearance window adjacent to the clearance area, and the second feed arm extends into the clearance window to communicate with the feed Electrical network electrical connection. The packaged antenna module according to claim 1, wherein the first antenna module includes 4 back cavity patch antenna units, and the second antenna module includes 4 dipole antenna units. An electronic device, characterized by comprising a housing and the packaged antenna module according to any one of claims 1-9, wherein the packaged antenna module is provided in the housing.

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