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WO2020122055A1 - Composition de résine, feuille de résine, carte de sécurité et procédé de production de la composition de résine - Google Patents

Composition de résine, feuille de résine, carte de sécurité et procédé de production de la composition de résine Download PDF

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Publication number
WO2020122055A1
WO2020122055A1 PCT/JP2019/048226 JP2019048226W WO2020122055A1 WO 2020122055 A1 WO2020122055 A1 WO 2020122055A1 JP 2019048226 W JP2019048226 W JP 2019048226W WO 2020122055 A1 WO2020122055 A1 WO 2020122055A1
Authority
WO
WIPO (PCT)
Prior art keywords
resin composition
resin
formula
antistatic agent
mass
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Ceased
Application number
PCT/JP2019/048226
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English (en)
Japanese (ja)
Inventor
鈴木 健太郎
聖英 武田
彰太 若山
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Mitsubishi Gas Chemical Co Inc
MGC Filsheet Co Ltd
Original Assignee
Mitsubishi Gas Chemical Co Inc
MGC Filsheet Co Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Mitsubishi Gas Chemical Co Inc, MGC Filsheet Co Ltd filed Critical Mitsubishi Gas Chemical Co Inc
Priority to CN201980081617.1A priority Critical patent/CN113166484B/zh
Priority to JP2020559245A priority patent/JP7420737B2/ja
Priority to KR1020217014450A priority patent/KR102900528B1/ko
Publication of WO2020122055A1 publication Critical patent/WO2020122055A1/fr
Anticipated expiration legal-status Critical
Priority to JP2024002592A priority patent/JP7675226B2/ja
Ceased legal-status Critical Current

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Classifications

    • CCHEMISTRY; METALLURGY
    • C08ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08KUse of inorganic or non-macromolecular organic substances as compounding ingredients
    • C08K5/00Use of organic ingredients
    • C08K5/49Phosphorus-containing compounds
    • C08K5/50Phosphorus bound to carbon only
    • BPERFORMING OPERATIONS; TRANSPORTING
    • B42BOOKBINDING; ALBUMS; FILES; SPECIAL PRINTED MATTER
    • B42DBOOKS; BOOK COVERS; LOOSE LEAVES; PRINTED MATTER CHARACTERISED BY IDENTIFICATION OR SECURITY FEATURES; PRINTED MATTER OF SPECIAL FORMAT OR STYLE NOT OTHERWISE PROVIDED FOR; DEVICES FOR USE THEREWITH AND NOT OTHERWISE PROVIDED FOR; MOVABLE-STRIP WRITING OR READING APPARATUS
    • B42D15/00Printed matter of special format or style not otherwise provided for
    • CCHEMISTRY; METALLURGY
    • C08ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08JWORKING-UP; GENERAL PROCESSES OF COMPOUNDING; AFTER-TREATMENT NOT COVERED BY SUBCLASSES C08B, C08C, C08F, C08G or C08H
    • C08J5/00Manufacture of articles or shaped materials containing macromolecular substances
    • C08J5/18Manufacture of films or sheets
    • CCHEMISTRY; METALLURGY
    • C08ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08KUse of inorganic or non-macromolecular organic substances as compounding ingredients
    • C08K3/00Use of inorganic substances as compounding ingredients
    • C08K3/01Use of inorganic substances as compounding ingredients characterized by their specific function
    • C08K3/013Fillers, pigments or reinforcing additives
    • CCHEMISTRY; METALLURGY
    • C08ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08KUse of inorganic or non-macromolecular organic substances as compounding ingredients
    • C08K5/00Use of organic ingredients
    • C08K5/36Sulfur-, selenium-, or tellurium-containing compounds
    • C08K5/37Thiols
    • C08K5/372Sulfides, e.g. R-(S)x-R'
    • C08K5/3725Sulfides, e.g. R-(S)x-R' containing nitrogen
    • CCHEMISTRY; METALLURGY
    • C08ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08KUse of inorganic or non-macromolecular organic substances as compounding ingredients
    • C08K5/00Use of organic ingredients
    • C08K5/49Phosphorus-containing compounds
    • C08K5/51Phosphorus bound to oxygen
    • C08K5/52Phosphorus bound to oxygen only
    • C08K5/524Esters of phosphorous acids, e.g. of H3PO3
    • CCHEMISTRY; METALLURGY
    • C08ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08LCOMPOSITIONS OF MACROMOLECULAR COMPOUNDS
    • C08L67/00Compositions of polyesters obtained by reactions forming a carboxylic ester link in the main chain; Compositions of derivatives of such polymers
    • CCHEMISTRY; METALLURGY
    • C08ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08LCOMPOSITIONS OF MACROMOLECULAR COMPOUNDS
    • C08L69/00Compositions of polycarbonates; Compositions of derivatives of polycarbonates
    • CCHEMISTRY; METALLURGY
    • C08ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08KUse of inorganic or non-macromolecular organic substances as compounding ingredients
    • C08K2201/00Specific properties of additives
    • C08K2201/017Additives being an antistatic agent

Definitions

  • the present invention relates to a resin composition, a resin sheet, a security card, and a method for producing a resin composition.
  • Resin sheets are used as security cards and electronic passports. Such a resin sheet inevitably comes into contact with a member of a manufacturing apparatus and a processing apparatus, for example, a member made of a material such as metal, rubber, or resin at the manufacturing stage and the processing stage after the manufacturing. Friction may occur between members. The resin sheet is charged by this frictional contact (dynamic contact). If the degree of this charge is large, handling of the resin sheet may be inconvenient during various steps during and after the production. Specifically, prevention of problems such as ink repelling during printing and prevention of stacking during film handling can be mentioned.
  • Patent Document 1 discloses that a thermoplastic resin, a phosphonium salt compound represented by the following general formula (1), and a polymer phosphorus-based compound represented by the following general formula (2).
  • An antistatic sheet having a sheet body containing a compound and having a thickness of 20 to 500 ⁇ m is disclosed.
  • R 1 represents an alkyl group having 1 to 4 carbon atoms
  • R 2 represents an alkyl group having 8 to 20 carbon atoms
  • R f 1 and R f 2 are the same.
  • Patent Documents 2 and 3 also describe blending a polycarbonate resin with the antistatic agent described in Patent Document 1 above.
  • the polycarbonate resin is blended with the antistatic agent described in Patent Document 1 to prevent electrification and reduce the surface resistivity.
  • the antistatic agent described in Patent Document 1 has insufficient dispersibility. When the dispersibility decreases, the content of the antistatic agent increases in order to achieve a sufficiently low surface resistivity. If the content of the antistatic agent is high, the physical properties inherent in the polycarbonate resin may be adversely affected.
  • the present invention is intended to solve the above problems, in which an antistatic agent is sufficiently dispersed in a thermoplastic resin, and a resin composition having a low surface resistivity, and the resin
  • An object is to provide a resin sheet formed from the composition, a security card, and a method for producing the resin composition.
  • the above problems can be solved by using a predetermined ionic compound as an antistatic agent. Specifically, the above problem is solved by the following means ⁇ 1>, preferably ⁇ 2> to ⁇ 15>.
  • thermoplastic resin (A) and an antistatic agent (B) are contained, the thermoplastic resin (A) contains at least one of a polycarbonate resin and an amorphous polyester resin, and the antistatic agent (B) is A resin composition which is a compound represented by the following formula (1); [(R 1 ) 3 R 2 P] + ⁇ (R 3 SO 2 )(R 4 SO 2 )N ⁇ (1)
  • R 1 and R 2 each independently represent an alkyl group having 5 or more carbon atoms
  • R 3 and R 4 each independently represent a perfluoroalkyl group having 1 to 4 carbon atoms. ..
  • R 1 is an alkyl group having 6 to 9 carbon atoms
  • R 2 is a linear alkyl group having 10 to 16 carbon atoms
  • Resin composition ⁇ 4>
  • R 1 is an alkyl group having 6 to 9 carbon atoms
  • R 2 is a linear alkyl group having 10 to 16 carbon atoms
  • R 3 and R 4 are each independently ⁇ 1>
  • the resin composition according to ⁇ 1> which represents a perfluoroalkyl group having 1 or 2 carbon atoms.
  • ⁇ 6> The resin composition according to any one of ⁇ 1> to ⁇ 5>, in which the content of the antistatic agent (B) is 0.1 to 1.0% by mass of the resin composition.
  • ⁇ 7> The resin composition according to any one of ⁇ 1> to ⁇ 5>, in which the content of the antistatic agent (B) is 0.3 to 0.8% by mass of the resin composition.
  • ⁇ 8> The resin composition according to any one of ⁇ 1> to ⁇ 7>, which has a melting point of the antistatic agent (B) measured by differential thermal scanning calorimetry of 0° C. or less.
  • ⁇ 9> The resin composition according to any one of ⁇ 1> to ⁇ 8>, in which the 5% mass reduction temperature of the antistatic agent (B) is 370° C. or higher.
  • ⁇ 10> The resin composition according to any one of ⁇ 1> to ⁇ 9>, which further contains a phosphorus antioxidant (C).
  • C phosphorus antioxidant
  • ⁇ 11> The resin composition according to any one of ⁇ 1> to ⁇ 10>, further containing an inorganic pigment.
  • ⁇ 12> The resin composition according to any one of ⁇ 1> to ⁇ 11>, which is for a security card.
  • ⁇ 13> A resin sheet formed from the resin composition according to any one of ⁇ 1> to ⁇ 12>.
  • ⁇ 14> A security card including the resin sheet according to ⁇ 13>.
  • ⁇ 15> The method for producing a resin composition according to any one of ⁇ 1> to ⁇ 12>, which comprises blending the powdery thermoplastic resin (A) with the antistatic agent (B).
  • an antistatic agent is sufficiently dispersed in a thermoplastic resin, and a resin composition having a low surface resistivity, and a resin sheet, a security card and a resin composition formed from the resin composition. It has become possible to provide a manufacturing method of.
  • the resin composition of the present invention contains a thermoplastic resin (A) and an antistatic agent (B), the thermoplastic resin (A) contains at least one of a polycarbonate resin and an amorphous polyester resin, and the antistatic agent
  • the agent (B) is a compound represented by the following formula (1). [(R 1 ) 3 R 2 P] + ⁇ (R 3 SO 2 )(R 4 SO 2 )N ⁇ (1)
  • R 1 and R 2 each independently represent an alkyl group having 5 or more carbon atoms
  • R 3 and R 4 each independently represent a perfluoroalkyl group having 1 to 4 carbon atoms. ..
  • the compound represented by the formula (1) is an ionic compound, has a low melting point, and becomes a liquid under normal use. Therefore, the dispersibility in the thermoplastic resin (A) is excellent. As a result, even if the addition amount is reduced, a sufficient antistatic function can be expected, and the antistatic function can be imparted without impairing the physical properties originally possessed by the resin composition.
  • the thermoplastic resin (A) contains at least one of a polycarbonate resin and an amorphous polyester resin, and preferably contains at least a polycarbonate resin.
  • ⁇ polycarbonate resin >> The polycarbonate resin is a -[O-R-OCO]- unit (where R contains an aliphatic group, an aromatic group, or both an aliphatic group and an aromatic group) containing a carbonic acid ester bond in the molecular main chain, It is not particularly limited as long as it has a linear structure or a branched structure). However, it is preferable to use an aromatic polycarbonate resin.
  • the weight average molecular weight of the polycarbonate resin is preferably 20,000 to 80,000, more preferably 30,000 to 70,000, and further preferably 40,000 to 60,000.
  • the glass transition temperature of the polycarbonate resin is preferably 120 to 160°C, more preferably 130 to 155°C. The glass transition temperature is measured according to the description in Examples below.
  • PETG resin is a polyester copolymer composed of dicarboxylic acid units having terephthalic acid units as main units, ethylene glycol units, and glycol units having 1,4-cyclohexanedimethanol units as main units.
  • the terephthalic acid units occupy, for example, all dicarboxylic acid units on a molar basis
  • the 1,4-cyclohexanedimethanol units occupy, for example, less than 50% of all glycol units on a molar basis.
  • the PCTG resin is a polyester copolymer composed of a dicarboxylic acid unit mainly containing terephthalic acid units, an ethylene glycol unit, and a glycol unit mainly containing 1,4-cyclohexanedimethanol units.
  • the terephthalic acid units occupy, for example, all dicarboxylic acid units on a molar basis
  • the 1,4-cyclohexanedimethanol units occupy, for example, 50% or more of all glycol units on a molar basis.
  • thermoplastic resin (A) contains at least one of a polycarbonate resin and an amorphous polyester resin, but may contain another thermoplastic resin.
  • examples of other thermoplastic resins include polyether resins and acrylic resins. Specifically, those described in paragraphs 0032 and 0033 of JP-A-2014-129488 can be used. Incorporated in the description.
  • the thermoplastic resin (A) is preferably 50% by mass or more, more preferably 60% by mass or more, even more preferably 80% by mass or more, still more preferably 90% by mass, still more preferably 95% by mass or more. However, even more preferably 100% by mass is at least one kind of polycarbonate resin and amorphous polyester resin (preferably polycarbonate resin).
  • the content of the thermoplastic resin (A) in the resin composition of the present invention is preferably 70% by mass or more, more preferably 80% by mass or more, and further 90% by mass or more, 95 It may be mass% or more.
  • the upper limit of the content of the thermoplastic resin (A) is, for example, 99.99 mass% or less.
  • the resin composition of the present invention may contain only one type of the thermoplastic resin (A), or may contain two or more types. When two or more kinds are contained, the total amount is preferably within the above range.
  • the resin composition of the present invention contains a compound represented by the following formula (1) as an antistatic agent (B).
  • R 1 and R 2 each independently represent an alkyl group having 5 or more carbon atoms
  • R 3 and R 4 each independently represent a perfluoroalkyl group having 1 to 4 carbon atoms. .. Since the compound represented by the formula (1) is a liquid under normal use (for example, 25° C.), it can be well dispersed in the thermoplastic resin (A).
  • R 1 and R 2 each independently represent an alkyl group having 5 or more carbon atoms, and preferably an alkyl group having 6 or more carbon atoms.
  • the upper limit of the carbon number of the alkyl group is not particularly limited, but is, for example, 20 or less, preferably 16 or less.
  • R 1 and R 2 also at least one R 2 R 1 ', preferably it has a carbon number of different alkyl group, and at least one R 2 of R 1, 3 or more of the difference for the number of carbon atoms more preferably there is at least one R 2 of R 1 is further preferable that a difference of 5 or more for the number of carbon atoms.
  • the upper limit of the difference in carbon number is not particularly limited, but it may be 12 or less.
  • the compound represented by the formula (1) becomes more difficult to crystallize, and the dispersibility tends to be further improved. More specifically, it is possible to prevent the occurrence of a non-uniform portion (dispersion defective portion) called a lump. As a result, the standard deviation (variation) of the antistatic performance of the resin composition can be suppressed.
  • the three R 1 may be the same group or different groups. One embodiment is in the form where three R 1 are the same group.
  • R 1 is an alkyl group having 6-9 carbon atoms, preferably R 2 is a linear alkyl group having 10 to 16 carbon atoms, R 1 is a C 6-8 carbon atoms alkyl It is preferable that R 2 is a linear alkyl group having 12 to 15 carbon atoms.
  • the alkyl group as R 1 is preferably a pentyl group, a hexyl group, a heptyl group, an octyl group or a nonyl group.
  • the alkyl group as R 2 is preferably a decyl group, an undecyl group, a dodecyl group, a tridecyl group, a tetradecyl group, a pentadecyl group, or a hexadecyl group.
  • the pentyl group include an n-pentyl group, an i-pentyl group, a sec-pentyl group and the like, and an n-pentyl group is preferable. The same applies to hexyl groups and the like.
  • R 3 and R 4 each independently represent a perfluoroalkyl group having 1 or 2 carbon atoms, and a trifluoromethyl group is preferable.
  • R 3 and R 4 may be the same group or different groups.
  • One embodiment is in the form where R 3 and R 4 are the same group.
  • R 1 is an alkyl group having 6 to 9 carbon atoms
  • R 2 is a linear alkyl group having 10 to 16 carbon atoms
  • R 3 and R 4 are It is preferable that each independently represent a perfluoroalkyl group having 1 or 2 carbon atoms.
  • the melting point of the compound represented by formula (1) is preferably 0° C. or lower, more preferably ⁇ 5° C. or lower, and further preferably ⁇ 10° C. or lower.
  • the antistatic agent (B) can be more easily dispersed in the thermoplastic resin (A).
  • the compound represented by the formula (1) does not solidify even at low temperatures and can be made into a liquid, it can be made suitable for use in cold regions.
  • the lower limit of the melting point of the compound represented by formula (1) is not particularly limited, but may be ⁇ 100° C. or higher, for example.
  • the melting point here is a value measured according to differential scanning calorimetry (DSC).
  • the compound represented by the formula (1) has a 5% mass reduction temperature of preferably 370° C. or higher, and more preferably 372° C. or higher.
  • the upper limit of the 5% mass reduction temperature is not particularly limited, but may be 400° C. or lower, for example. Due to such a high mass reduction temperature, a resin composition having more excellent heat resistance can be obtained.
  • the mass reduction temperature is a value measured by the method described in Examples below.
  • the lower limit of the molecular weight of the compound represented by the formula (1) is preferably 660 or more, more preferably 680 or more, further preferably 700 or more, and further preferably 730 or more. , 750 or more is even more preferable.
  • the upper limit of the molecular weight of the compound represented by the formula (1) is, for example, 1000 or less, and may be 900 or less and 800 or less.
  • the content of the compound represented by the formula (1) in the resin composition of the present invention is preferably 0.1% by mass or more, more preferably 0.3% by mass or more, and further, It may be 0.5% by mass or more, particularly 0.6% by mass or more. Further, the upper limit of the content of the compound represented by the formula (1) is, for example, 3.0% by mass or less. However, since the compound represented by the formula (1) is excellent in dispersibility, the content of the compound represented by the formula (1) is 1.0% by mass or less, further 0.9% by mass or less, Even if it is 0.8% by mass or less and 0.7% by mass or less, an excellent antistatic effect can be achieved.
  • the resin composition of the present invention may include only one type of compound represented by formula (1), or may include two or more types. When two or more kinds are contained, the total amount is preferably within the above range.
  • the resin composition of the present invention may or may not contain an antistatic agent other than the compound represented by formula (1).
  • an antistatic agent other than the compound represented by formula (1) As one embodiment of the present invention, a constitution which does not substantially contain an antistatic agent other than the compound represented by the formula (1) is exemplified.
  • the term "substantially free” means that the content of the antistatic agent other than the compound represented by the formula (1) is 5% by mass or less of the content of the compound represented by the formula (1), It is preferably 3% by mass or less, and may be 1% by mass or less.
  • the resin composition of the present invention may contain a phosphorus antioxidant (C).
  • a phosphorus antioxidant C
  • the phosphorus-based antioxidant (C) is not particularly limited as long as it is a phosphorus atom-containing antioxidant.
  • Specific examples of phosphorus-based antioxidants include phosphorus oxo acids such as phosphoric acid, phosphonic acid, phosphorous acid, phosphinic acid, and polyphosphoric acid; acidic pyrophosphorus such as sodium acid pyrophosphate, potassium acid pyrophosphate, and calcium acid pyrophosphate.
  • a phosphite compound By selecting a phosphite compound, a resin sheet having higher discoloration resistance and continuous productivity can be obtained.
  • the description in paragraphs 0058 to 0064 of JP-A-2018-090677 can be referred to, and the contents thereof are incorporated in the present specification.
  • One example of a preferred embodiment of the phosphorus-based antioxidant (C) used in the present invention is a phosphorus-based antioxidant having a pentaerythritol diphosphite structure.
  • Examples of the phosphorus-based antioxidant having a pentaerythritol diphosphite structure include compounds described in WO2013/088796 and pentaerythritol diphosphite compounds represented by the following formula (II).
  • Y 1 to Y 4 each independently represent a hydrocarbon group having 6 or more carbon atoms, preferably each independently a hydrocarbon group having 6 to 20 carbon atoms, more preferably substituted or It is an unsubstituted cumyl group, phenyl group, naphthyl group or biphenyl group.
  • the pentaerythritol diphosphite compound represented by the above formula (II) is preferably a pentaerythritol diphosphite compound represented by the following formula (II-1).
  • R B1 to R B8 are each independently an alkyl group (preferably an alkyl group having 1 to 4 carbon atoms, more preferably a methyl group or an ethyl group, further preferably a methyl group) or an alkenyl group (preferably having a carbon number). 2 to 4 alkyl groups), each independently preferably an alkyl group.
  • R B1 and R B2 , R B3 and R B4 , R B5 and R B6 , and R B7 and R B8 may bond to each other to form a ring, but it is preferable that they do not form a ring.
  • R B9 to R B12 each independently represent an alkyl group.
  • m1 to m4 are each independently an integer of 0 to 5, preferably 0 or 1, and more preferably 0.
  • Z 1 to Z 4 each independently represent a single bond or a carbon atom, preferably a carbon atom. When Z 1 to Z 4 represent a single bond, R B1 to R B8 are excluded from the formula (II-1).
  • the pentaerythritol diphosphite compound represented by the above formula (II) or (II-1) is obtained by adding a chlorine-based solvent to phosphorus trichloride and pentaerythritol to obtain pentaerythritol dichlorophosphite, and then using an aromatic solvent. Alternatively, it can be obtained by heating and mixing in the presence of an organic nitrogen-containing basic compound (see, for example, JP-A-2004-018406).
  • pentaerythritol diphosphite compounds represented by the above formula (II) or (II-1) heat resistance and hydrolysis resistance can be satisfactorily imparted to the resin composition, and they are easily available. Therefore, bis(2,4-dicumylphenyl)pentaerythritol diphosphite represented by the following formula (II-2) is particularly preferable.
  • This compound is commercially available, and for example, "Doverphos (registered trademark) S9228PC" manufactured by Dover Chemical can be used.
  • the lower limit of the content of the phosphorus-based antioxidant (C) in the resin composition of the present invention is preferably 0.005 parts by mass or more, and more preferably 100 parts by mass of the thermoplastic resin (A). Is 0.01 part by mass or more, more preferably 0.03 part by mass or more.
  • the upper limit of the content of the phosphorus-based antioxidant (C) is preferably 1 part by mass or less, more preferably 0.8 part by mass or less, based on 100 parts by mass of the thermoplastic resin (A). It is preferably 0.5 parts by mass or less, more preferably 0.1 parts by mass or less, and may be 0.07 parts by mass or less.
  • the mass ratio of the phosphorus antioxidant (C) and the antistatic agent (B) is 3 or more. It is preferable that it is 5 or more, more preferably 10 or more.
  • the upper limit value is preferably 22 or less, more preferably 18 or less. With such a ratio, the heat resistance tends to be more excellent.
  • the resin composition of the present invention may include only one type of phosphorus-based antioxidant (C), or may include two or more types. When two or more kinds are contained, the total amount is preferably within the above range.
  • the resin composition of the present invention may or may not contain a colorant.
  • the colorant include inorganic pigments, organic pigments, and organic dyes, and inorganic pigments are preferable.
  • the inorganic pigments include sulfide-based pigments such as carbon black, cadmium red and cadmium yellow; silicate-based pigments such as ultramarine; titanium oxide, zinc oxide, red iron oxide, chromium oxide, iron black, titanium yellow, zinc- Iron-based brown, titanium-cobalt-based green, cobalt-green, cobalt-blue, copper-chromium-based black, copper-iron-based black and other oxide-based pigments; yellow lead, molybdate orange and other chromic-acid-based pigments; Examples include Russian pigments, and carbon black and titanium oxide are preferable.
  • organic pigments and dyes examples include phthalocyanine dyes or pigments such as copper phthalocyanine blue and copper phthalocyanine green; azo dyes or pigments such as nickel azo yellow; thioindigo-based, perinone-based, perylene-based, quinacridone-based and dioxazine-based dyes. , Condensed polycyclic dyes or pigments such as isoindolinone and quinophthalone; anthraquinone, heterocyclic and methyl dyes and pigments.
  • the content of the colorant in the resin composition of the present invention can be appropriately determined according to the type of the colorant and the like, but is, for example, 0.0001 parts by mass or more relative to 100 parts by mass of the thermoplastic resin (A). And is, for example, 50 parts by mass or less. More specifically, when a black colorant (for example, carbon black) is used as the colorant, 0.0001 to 0.005 parts by mass is preferable with respect to 100 parts by mass of the thermoplastic resin (A). When a white colorant (for example, titanium oxide) is used as the colorant, it is preferably 1 to 50 parts by mass, more preferably 5 to 35 parts by mass, relative to 100 parts by mass of the thermoplastic resin (A).
  • the resin composition of the present invention may include only one type of colorant, or may include two or more types of colorants. When two or more kinds are contained, the total amount is preferably within the above range.
  • the resin composition of the present invention may contain the following additives in addition to the above components. That is, at least one additive selected from the group consisting of antioxidants other than phosphorus, heat stabilizers, flame retardants, flame retardant aids, ultraviolet absorbers, and mold release agents. Further, a fluorescent whitening agent, an antifogging agent, a fluidity improving agent, a plasticizer, a dispersant, an antibacterial agent, etc. may be added as long as desired physical properties are not significantly impaired.
  • the content of the additive in the resin composition, when contained, is, for example, 0.001% by mass or more, and for example, 5.0% by mass or less, preferably 3% by mass based on the mass of the resin composition. It is 0.0 mass% or less, and more preferably 1.0 mass% or less.
  • the resin composition of the present invention has a surface resistivity of 1.0E+14 ⁇ /sq. when formed into a resin sheet having a thickness of 100 ⁇ m. It is preferably not more than 9.0E+13 ⁇ /sq. It is more preferable that it is not more than 1.0E+13 ⁇ /sq. It is more preferable that it is not more than 9.0E+12 ⁇ /sq. The following is more preferable.
  • the lower limit of the surface resistivity is not particularly limited, but 1.0E+10 ⁇ /sq. The above is practical. The method for measuring the surface resistivity follows the method described in Examples below.
  • the 5% mass reduction temperature of the resin composition of the present invention is preferably 460°C or higher, more preferably 465°C or higher, and even more preferably 470°C or higher.
  • the lower limit of the 5% mass reduction temperature is not particularly limited, but is, for example, 500° C. or lower, and further 480° C. or lower.
  • the method for measuring the 5% mass reduction temperature is according to the method described in Examples below.
  • the method for producing the resin composition of the present invention is not limited, and any known method for producing a resin composition can be widely adopted. Specific examples thereof include the thermoplastic resin (A), the antistatic agent (B), and other components optionally blended, using various mixers such as a tumbler, a Henschel mixer, and a super mixer. After mixing in advance, a method of melt kneading with a mixer such as a Banbury mixer, a roll, a Brabender, a single-screw kneading extruder, a twin-screw kneading extruder or a kneader can be mentioned.
  • a mixer such as a Banbury mixer, a roll, a Brabender, a single-screw kneading extruder, a twin-screw kneading extruder or a kneader.
  • the method for producing a resin composition includes blending the powdery thermoplastic resin (A) with the antistatic agent (B). Since the antistatic agent (B) used in the present invention is usually a liquid at room temperature, it can be sufficiently dispersed even if it is directly added to a powdery resin. As a result, the compound becomes easier.
  • the resin sheet in the present invention may have a non-reinforced thermoplastic resin layer laminated on one surface or both surfaces of the surface layer. That is, according to one aspect of the present invention, there is provided a laminated sheet having a thermoplastic resin layer on at least one surface of the resin sheet. Further, the laminated thermoplastic resin may contain various additives. Examples of such additives include stabilizers, antioxidants, release agents, ultraviolet absorbers, dyes and pigments, antistatic agents, flame retardants, impact strength improvers, plasticizers, dispersants, antibacterial agents, and the like. .. One of these resin additives may be contained, or two or more of them may be contained in any combination and ratio.
  • the "sheet” generally means a thin product whose thickness is small in terms of length and width, and which is flat, and includes a film.
  • the thickness of the resin sheet of the present invention is preferably in the range of 10 to 1000 ⁇ m, more preferably 30 to 500 ⁇ m.
  • the resin composition and resin sheet of the present invention can be preferably used as a security card.
  • the security card in the present invention include an identification card (ID card), a passport, a driver's license, a bank card, a credit card, an insurance card, and other identification cards.
  • Examples 1-8, Comparative Examples 1-3 The respective components were blended in a tumbler so as to have the composition shown in Table 1 or Table 2 below.
  • the antistatic agent (B) was mixed with the powdery thermoplastic resin (A).
  • a liquid trihexyl(tetradecyl)phosphonium bis(trifluoromethanesulfonyl)amide
  • thermoplastic resin (A) a polycarbonate resin (“Upilon (registered trademark) E-2000F” manufactured by Mitsubishi Engineering Plastics) is used, and for the phosphorus-based antioxidant (C), “Doverphos S9228PC” manufactured by Dover Chemical is used. I was there.
  • antistatic agent (B) the following compounds (all manufactured by Fuji Film Wako Pure Chemical Industries, Ltd.) were used.
  • MONARCH (registered trademark) 800 manufactured by Cabot Corporation was used as the carbon black, and PC-3 manufactured by Ishihara Sangyo Co., Ltd. was used as the titanium oxide.
  • Trihexyl(tetradecyl)phosphonium bis(trifluoromethanesulfonyl)amide The melting point of trihexyl(tetradecyl)phosphonium bis(trifluoromethanesulfonyl)amide is less than ⁇ 50° C., the 5% mass reduction temperature is 375° C., and the molecular weight is 764.
  • Hex represents a hexyl group.
  • Tributyldodecylphosphonium bis(trifluoromethanesulfonyl)imide Bu represents a butyl group.
  • the 5% mass reduction temperature is 369° C.
  • the molecular weight is 652.
  • ⁇ Mass reduction temperature> The obtained resin sheet was heated under air (flow rate 200 mL/min) about 10 mg of the sample from room temperature to 600° C. at a rate of 10° C./min using a differential thermogravimetric simultaneous measurement apparatus, and the mass was measured. Was measured by 1% by mass, 5% by mass and 10% by mass, and the temperature (unit: °C) was measured.
  • a differential thermogravimetric simultaneous measurement device EXSTAR TGDTA 7220 manufactured by Hitachi High-Tech Science Co., Ltd. was used. A comprehensive evaluation was made based on the following criteria.
  • the resin composition of the present invention had a low surface resistivity and excellent dispersibility of the antistatic agent (B). Furthermore, the mass reduction temperature was high. In particular, when a phosphorus-based antioxidant was used, the mass reduction temperature was remarkably high.

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  • Chemical & Material Sciences (AREA)
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  • Chemical Kinetics & Catalysis (AREA)
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  • Polymers & Plastics (AREA)
  • Organic Chemistry (AREA)
  • Engineering & Computer Science (AREA)
  • Manufacturing & Machinery (AREA)
  • Materials Engineering (AREA)
  • Compositions Of Macromolecular Compounds (AREA)
  • Credit Cards Or The Like (AREA)

Abstract

L'invention concerne une composition de résine dans laquelle un agent antistatique est parfaitement dispersé dans une résine thermoplastique et qui présente une faible résistivité de surface, une feuille de résine formée à partir de la composition de résine, une carte de sécurité et un procédé de production d'une composition de résine. La composition de résine comprend une résine thermoplastique (A) et un agent antistatique (B), la composition de résine étant telle que la résine thermoplastique (A) comprend au moins une résine polycarbonate et une résine polyester amorphe, et l'agent antistatique (B) est un composé représenté par la formule (1). Formule (1) : [(R1)3R2P]+・(R3SO2) (R4SO2)N- Dans la formule (1), R1 et R2 représentent chacun indépendamment un groupe alkyle en C5 ou plus, et R3 et R4 représentent chacun indépendamment un groupe perfluoroalkyle en C1-4.
PCT/JP2019/048226 2018-12-14 2019-12-10 Composition de résine, feuille de résine, carte de sécurité et procédé de production de la composition de résine Ceased WO2020122055A1 (fr)

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CN201980081617.1A CN113166484B (zh) 2018-12-14 2019-12-10 树脂组合物、树脂片、安全卡和树脂组合物的制造方法
JP2020559245A JP7420737B2 (ja) 2018-12-14 2019-12-10 樹脂組成物、樹脂シート、セキュリティカードおよび樹脂組成物の製造方法
KR1020217014450A KR102900528B1 (ko) 2018-12-14 2019-12-10 수지 조성물, 수지 시트, 시큐리티 카드 및 수지 조성물의 제조 방법
JP2024002592A JP7675226B2 (ja) 2018-12-14 2024-01-11 樹脂組成物、樹脂シート、セキュリティカードおよび樹脂組成物の製造方法

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Cited By (7)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPWO2021085384A1 (fr) * 2019-10-31 2021-05-06
JP2021143219A (ja) * 2020-03-10 2021-09-24 帝人株式会社 ポリカーボネート樹脂組成物及びその成形体
WO2022038974A1 (fr) 2020-08-18 2022-02-24 三菱瓦斯化学株式会社 Composition de résine, feuille de résine, corps multicouche et carde
JP2022137822A (ja) * 2021-03-09 2022-09-22 帝人株式会社 樹脂組成物およびその成形品
JP2022170604A (ja) * 2021-04-28 2022-11-10 三菱ケミカル株式会社 カード又はパスポート用樹脂組成物、カード又はパスポート用フィルム、カード、及びパスポート
JP2023102111A (ja) * 2022-01-11 2023-07-24 三菱ケミカル株式会社 樹脂組成物、フィルム、カード及びパスポート
JP2024045214A (ja) * 2018-12-14 2024-04-02 三菱瓦斯化学株式会社 樹脂組成物、樹脂シート、セキュリティカードおよび樹脂組成物の製造方法

Citations (8)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2006063212A (ja) * 2004-08-27 2006-03-09 Teijin Chem Ltd ポリカーボネート樹脂組成物
US20090092914A1 (en) * 2007-10-09 2009-04-09 Xerox Corporation Phosphonium containing photogenerating layer photoconductors
US20090092915A1 (en) * 2007-10-09 2009-04-09 Xerox Corporation Phosphonium containing charge transport layer photoconductors
JP2010084113A (ja) * 2008-10-03 2010-04-15 Toyo Ink Mfg Co Ltd 耐熱性帯電防止ポリマー組成物及びその成形品
JP2013076081A (ja) * 1999-10-06 2013-04-25 Three M Innovative Properties Co 帯電防止組成物とその製法及び使用
JP2016108424A (ja) * 2014-12-04 2016-06-20 日本カラリング株式会社 帯電防止シート
WO2018108881A1 (fr) * 2016-12-13 2018-06-21 Institut National Des Sciences Appliquees De Lyon Matériau polymérique biodégradable et biosourcé
JP2018168207A (ja) * 2017-03-29 2018-11-01 東レ株式会社 液晶性ポリエステル樹脂組成物およびそれからなる成形品

Family Cites Families (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP4685431B2 (ja) * 2004-09-06 2011-05-18 帝人化成株式会社 帯電防止性樹脂組成物
JP5460190B2 (ja) * 2009-09-07 2014-04-02 住化スタイロンポリカーボネート株式会社 帯電防止性ポリカーボネート樹脂組成物
JP7015293B2 (ja) * 2017-03-06 2022-02-02 三菱瓦斯化学株式会社 樹脂積層体、及び樹脂積層体を含むカード
JP7420737B2 (ja) * 2018-12-14 2024-01-23 三菱瓦斯化学株式会社 樹脂組成物、樹脂シート、セキュリティカードおよび樹脂組成物の製造方法

Patent Citations (8)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2013076081A (ja) * 1999-10-06 2013-04-25 Three M Innovative Properties Co 帯電防止組成物とその製法及び使用
JP2006063212A (ja) * 2004-08-27 2006-03-09 Teijin Chem Ltd ポリカーボネート樹脂組成物
US20090092914A1 (en) * 2007-10-09 2009-04-09 Xerox Corporation Phosphonium containing photogenerating layer photoconductors
US20090092915A1 (en) * 2007-10-09 2009-04-09 Xerox Corporation Phosphonium containing charge transport layer photoconductors
JP2010084113A (ja) * 2008-10-03 2010-04-15 Toyo Ink Mfg Co Ltd 耐熱性帯電防止ポリマー組成物及びその成形品
JP2016108424A (ja) * 2014-12-04 2016-06-20 日本カラリング株式会社 帯電防止シート
WO2018108881A1 (fr) * 2016-12-13 2018-06-21 Institut National Des Sciences Appliquees De Lyon Matériau polymérique biodégradable et biosourcé
JP2018168207A (ja) * 2017-03-29 2018-11-01 東レ株式会社 液晶性ポリエステル樹脂組成物およびそれからなる成形品

Cited By (12)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2024045214A (ja) * 2018-12-14 2024-04-02 三菱瓦斯化学株式会社 樹脂組成物、樹脂シート、セキュリティカードおよび樹脂組成物の製造方法
JP7675226B2 (ja) 2018-12-14 2025-05-12 三菱瓦斯化学株式会社 樹脂組成物、樹脂シート、セキュリティカードおよび樹脂組成物の製造方法
JPWO2021085384A1 (fr) * 2019-10-31 2021-05-06
WO2021085384A1 (fr) * 2019-10-31 2021-05-06 帝人株式会社 Composition de résine de polycarbonate et son objet moulé
JP2021143219A (ja) * 2020-03-10 2021-09-24 帝人株式会社 ポリカーボネート樹脂組成物及びその成形体
JP7440306B2 (ja) 2020-03-10 2024-02-28 帝人株式会社 ポリカーボネート樹脂組成物及びその成形体
WO2022038974A1 (fr) 2020-08-18 2022-02-24 三菱瓦斯化学株式会社 Composition de résine, feuille de résine, corps multicouche et carde
JP2022137822A (ja) * 2021-03-09 2022-09-22 帝人株式会社 樹脂組成物およびその成形品
JP7658760B2 (ja) 2021-03-09 2025-04-08 帝人株式会社 樹脂組成物およびその成形品
JP2022170604A (ja) * 2021-04-28 2022-11-10 三菱ケミカル株式会社 カード又はパスポート用樹脂組成物、カード又はパスポート用フィルム、カード、及びパスポート
JP7639533B2 (ja) 2021-04-28 2025-03-05 三菱ケミカル株式会社 カード又はパスポート用樹脂組成物、カード又はパスポート用フィルム、カード、及びパスポート
JP2023102111A (ja) * 2022-01-11 2023-07-24 三菱ケミカル株式会社 樹脂組成物、フィルム、カード及びパスポート

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JPWO2020122055A1 (ja) 2021-11-04
JP2024045214A (ja) 2024-04-02
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