WO2020113698A1 - Combined sensor and electronic device - Google Patents

Abstract

Disclosed are a combined sensor (100) and an electronic device. The combined sensor (100) comprises a cover (10), a substrate (30), an environment sensor (50) and an acoustics sensor (70), wherein the substrate (30) and the cover (10) enclose an accommodation cavity (10a); the environment sensor (50) comprises an MEMS environment chip (51) arranged in the accommodation cavity (10a) and a first ASIC chip (53) embedded in the substrate (30), with the first ASIC chip (53) being electrically connected to the MEMS environment chip (51) by means of a first pin (55); and the acoustics sensor (70) comprises an MEMS microphone chip (71) arranged in the accommodation cavity (10a) and a second ASIC chip (73) embedded in the substrate (30), with the MEMS microphone chip (71) being electrically connected to the second ASIC chip (73) by means of a second pin (75). The MEMS environment chip (51) and the MEMS microphone chip (71) are arranged at an interval, and the first pin (55) and the second pin (75) are respectively distributed at two different side edges of the substrate (30). According to the combined sensor (100) and the electronic device, the interference of the environment sensor (50) to the acoustics sensor (70) can be reduced.

Description

Combined sensor and electronics Technical field

The invention relates to the field of chip packaging technology, in particular to a combined sensor and electronic equipment.

Background technique

As a measuring device, sensors have been widely used in mobile phones, notebook computers and various wearable electronic products. In recent years, with the development of science and technology, the volume of electronic products has been shrinking. In order to save costs and reduce volume, sensors with different functions are usually integrated into the same package, such as environmental sensors and acoustic sensors. For more complex sensors, different types of chips are usually introduced, such as MEMS (Micro-Electro-Mechanical System) chips or ASIC (Application Specific Integrated Circuit) signal processing chips. In order to further reduce the size, ASIC signals can be used The processing chip is embedded in the substrate.

At present, in order to reduce energy consumption, environmental sensors usually switch frequently, and cause electromagnetic interference to the acoustic sensor at the moment of switching. Due to the limited space of the packaging structure, the distance between the signal output end of the environmental sensor and the acoustic sensor is very close. The interference is further increased.

Summary of the invention

The main object of the present invention is to provide a combined sensor, which aims to reduce the interference between the combined sensors.

In order to achieve the above object, the combined sensor proposed by the present invention includes a cover; a substrate, and the substrate and the cover are enclosed to form a containing cavity; and

The environmental sensor includes a MEMS environmental chip provided in the accommodating cavity and a first ASIC chip embedded in the substrate, the first ASIC chip and the MEMS environmental chip are electrically connected through a first pin;

An acoustic sensor includes a MEMS microphone chip provided in the accommodating cavity and a second ASIC chip embedded in the substrate, the MEMS microphone chip and the second ASIC chip are electrically connected through a second pin;

The MEMS environmental chip and the MEMS microphone chip are spaced apart, and the first pin and the second pin are arranged on different sides of the substrate, respectively.

Optionally, the MEMS environmental chip includes a positive electrical area and a negative electrical area arranged side by side, a plurality of the first pins are provided, a plurality of the first pins are arranged linearly, and a plurality of the first The connection of a pin is arranged in parallel with the connection of the positive electric area and the negative electric area.

Optionally, there are a plurality of second pins, and the plurality of second pins are all arranged on the same side of the MEMS microphone chip.

Optionally, the positive electrical area and the negative electrical area are arranged along the direction from the MEMS microphone chip to the second pin, and the first pin is provided on the positive electrical area and the negative electrical area The area faces away from the side of the MEMS microphone chip.

Optionally, the first pin and the second pin are provided on opposite sides of the substrate.

Optionally, the MEMS microphone chip includes a substrate provided on the substrate, the substrate is provided with a through hole, and an end of the substrate facing away from the substrate is sequentially connected to the diaphragm and the backplate. The cover is provided with an acoustic hole communicating with the through hole, and the back plate is provided with a through hole communicating with the through hole and the accommodating cavity.

Optionally, the sound hole is opened in the substrate, and the center of the through hole is consistent with the center of the sound hole.

Optionally, the environmental sensor is one or more of air pressure, temperature, humidity and optical sensors.

Optionally, a first cavity and a second cavity are provided inside the substrate at intervals, and the first ASIC chip and the second ASIC chip are accommodated in the first cavity and the second cavity, respectively.

The invention also proposes an electronic device including the above-mentioned combination sensor.

The combined sensor of the technical solution of the present invention includes an environmental sensor and an acoustic sensor. The first ASIC chip of the environmental sensor and the second ASIC chip of the acoustic sensor are both provided in the substrate to reduce the occupied space; the MEMS environmental chip of the environmental sensor and the acoustic sensor The MEMS microphone chip is spaced apart to increase the distance between the two, and the first ASIC chip and the second ASIC chip lead out the first pin and the second pin as signal output ends, the first pin and the MEMS environmental chip Connect, the second pin is connected to the MEMS microphone chip. When the environmental sensor is frequently switched, the first pin as a signal output terminal will generate an instantaneous electromagnetic change that interferes with the performance of the acoustic sensor. In this application, the first pin and the second pin are located on different sides of the substrate, then The first pin can be set at a position that increases the distance between the signal output end and the MEMS microphone chip, thereby greatly reducing the influence of electromagnetic interference and ensuring the stable performance of the acoustic sensor.

BRIEF DESCRIPTION

In order to more clearly explain the embodiments of the present invention or the technical solutions in the prior art, the following will briefly introduce the drawings required in the embodiments or the description of the prior art. Obviously, the drawings in the following description are only These are some embodiments of the present invention. For those of ordinary skill in the art, without paying any creative work, other drawings can be obtained according to the structures shown in these drawings.

1 is a longitudinal cross-sectional view of an embodiment of the combined sensor of the present invention;

2 is a lateral cross-sectional view of an embodiment of the combined sensor of the present invention;

3 is a lateral cross-sectional view of another embodiment of the combined sensor of the present invention.

Description of drawings

Label name Label name 100 Combination sensor 60 metal wires 10 Cover 70 Acoustic sensor 10a Accommodating cavity 71 MEMS microphone chip 30 Substrate 711 Substrate 50 Environmental sensor 711a Through hole 51 MEMS environmental chip 713 Diaphragm 511 Positive area 715 Backplane 513 Negative region 715a Via 53 The first ASIC chip 73 Second ASIC chip 55 First pin 75 Second pin

The implementation, functional characteristics and advantages of the present invention will be further described in conjunction with the embodiments and with reference to the drawings.

detailed description

The technical solutions in the embodiments of the present invention will be described clearly and completely in conjunction with the drawings in the embodiments of the present invention. Obviously, the described embodiments are only a part of the embodiments of the present invention, but not all the embodiments. Based on the embodiments of the present invention, all other embodiments obtained by a person of ordinary skill in the art without making creative efforts fall within the protection scope of the present invention.

It should be noted that all directional indicators (such as up, down, left, right, front, back, etc.) in the embodiments of the present invention are only used to explain the relationship between the components in a certain posture (as shown in the drawings) With respect to the relative positional relationship, movement conditions, etc., if the specific posture changes, the directional indication changes accordingly.

In the present invention, unless otherwise clearly specified and defined, the terms "connected" and "fixed" should be understood in a broad sense. For example, "fixed" may be a fixed connection, a detachable connection, or integrated; It is a mechanical connection or an electrical connection; it can be directly connected or indirectly connected through an intermediary. It can be the connection between two elements or the interaction between two elements, unless otherwise clearly defined. Those of ordinary skill in the art can understand the specific meanings of the above terms in the present invention according to specific situations.

In addition, descriptions related to "first", "second", etc. in the present invention are for descriptive purposes only, and cannot be understood as indicating or implying their relative importance or implicitly indicating the number of technical features indicated. Thus, the features defined with "first" and "second" may include at least one of the features either explicitly or implicitly. In addition, the technical solutions between the various embodiments can be combined with each other, but they must be based on the ability of those skilled in the art to realize. When the combination of technical solutions contradicts or cannot be realized, it should be considered that the combination of such technical solutions does not exist , Nor within the protection scope claimed by the present invention.

The present invention provides a combined sensor 100.

1 to 3, in the embodiment of the present invention, the combined sensor 100 includes a cover 10, a substrate 30, an environmental sensor 50, and an acoustic sensor 70;

The substrate 30 and the cover 10 are enclosed to form a receiving cavity 10a;

The environmental sensor 50 includes a MEMS environmental chip 51 provided in the accommodating cavity 10a and a first ASIC chip 53 embedded in the substrate 30. The first ASIC chip 53 and the MEMS environmental chip 51 pass through a first pin 55 electrical connection;

The acoustic sensor 70 includes a MEMS microphone chip 71 provided in the accommodating cavity 10a and a second ASIC chip 73 embedded in the substrate 30. The MEMS microphone chip 71 and the second ASIC chip 73 are electrically connected through the second pin 75. connection;

The MEMS environmental chip 51 and the MEMS microphone chip 71 are spaced apart, and the first pin 55 and the second pin 75 are respectively arranged on different sides of the substrate 30.

In this embodiment, the combined sensor 100 includes an acoustic sensor 50 and an environmental sensor 70. The acoustic sensor 70 includes a MEMS microphone chip 71 and a second ASIC chip 73, wherein the material of the MEMS microphone chip 71 is generally monocrystalline silicon, polycrystalline silicon, or nitrogen Silicone and other materials for sensing and detecting sound sources, which can convert sound signals into electrical signals for transmission. The second ASIC chip 73 is used to process the signals output by the MEMS microphone chip 71 and provide voltage for the MEMS microphone chip 71. Therefore, the acoustic sensor 70 provides a sound collecting function for the electronic device. The environmental sensor 50 includes a MEMS environmental chip 51 and a first ASIC chip 53, the MEMS environmental chip 51 is used to sense changes in various parameters of the external environment, and the first ASIC chip 53 is used to process the signal output by the MEMS environmental chip 51, thereby The environmental sensor 50 has the function of detecting changes in the external environment.

The environmental sensor 50 may be one or more of air pressure, temperature, humidity, optical sensors, etc., and the corresponding MEMS environmental chip 51 may be a MEMS air pressure sensor chip, a MEMS temperature chip, a MEMS humidity sensor chip, or a MEMS optical sensor chip Wait. Taking the environment sensor 50 as an air pressure sensor as an example, the air pressure sensor can sense the height of the human body according to the change of the gas pressure. Since both the acoustic sensor 70 and the air pressure sensor will sense the gas pressure, the two are packaged, so that the resulting combined sensor can be more convenient to use.

Understandably, in order to reduce the occupation of space, the first ASIC chip 53 and the second ASIC chip 73 are embedded in the substrate 30. Specifically, a first cavity and a second cavity (not shown) are provided inside the substrate 30 at intervals, and the first ASIC chip 53 and the second ASIC chip 73 are respectively accommodated in the first cavity and In the second cavity, the electromagnetic interference between the first ASIC chip 53 and the second ASIC chip 73 can also be reduced to a certain extent. When the first ASIC chip 53 and the second ASIC chip 73 are accommodated in the first cavity and the second cavity, respectively, the ends of the first ASIC chip 53 for accessing/outputting signals extend out of the surface of the substrate 30, That is, the first pin 55 of the first ASIC chip 53; similarly, the end of the second ASIC chip 73 used to access/output signals also extends out of the cavity and is exposed on the surface of the substrate 30, that is, the second pin 75, This structure facilitates signal transmission and facilitates electrical connection with the MEMS environmental chip 51 and the MEMS microphone chip 71. The MEMS environmental chip 51 and the MEMS microphone chip 71 are respectively connected to the first pin 55 and the second pin 75 through metal wires, which may be wires of gold, copper or other conductive metals.

Specifically, the substrate 30 is a PCB board. The PCB board may include a top solder mask layer, a copper foil layer, a semi-cured layer, and a buried capacitance layer in order from top to bottom. Of course, different specifications of the PCB board may have different layers , Can be selected according to actual needs. The outer surface of the substrate 30 is provided with pads, which can fix the combined sensor and be electrically connected to an external circuit. The cover 10 can be an integrally formed metal shell or a non-metallic shell coated with a metal material. The cover 10 and the substrate 30 enclose a receiving cavity 10a, and the two can be connected by conductive adhesive or solder paste. The electrical connection between the cover 10 and the substrate 30 is realized to realize a conductive shielding cavity, which can prevent external electromagnetic wave interference and enhance the protection of the acoustic sensor 70 and the environmental sensor 50. Of course, the cover 10 and the substrate 30 may also be connected by other conductive materials. The shape of the space enclosed by the cover 10 and the base plate 30 may be a square or a sphere, which is not limited herein.

In the technical solution of the present application, the MEMS environmental chip 51 includes a positive electrical area 511 and a negative electrical area 513 arranged side by side, a plurality of first pins 55 are provided, and the plurality of first pins 55 are arranged linearly, and the plurality The connection of the first pin 55 and the connection of the positive electrical region 511 and the negative electrical region 513 are arranged in parallel intervals.

The working principle of the environmental sensor 50 in this embodiment is to detect the change in capacitance. The surface is divided into different areas to form different capacitances. The surface material is deformed by the pressure of the air pressure, which will cause the change in capacitance. In order to detect the above capacitance Variation requires the application of an alternating voltage on the capacitor, which will accumulate charge on the surface of the capacitor. Different capacitors have different charged potentials. Therefore, the MEMS environmental chip will form a positively charged region 511 and a negatively charged region 513. The first pin 55 is provided with A plurality of, to achieve the stability of the signal transmission and electrical connection, a plurality of first pins 55 are linearly arranged, and a plurality of first pins 55 are connected to the positive electrical area 511 and the The lines of the negative electricity area 513 are arranged at parallel intervals, so as to achieve equal electrical connection stability to the positive electricity area 511 and the negative electricity area 513. There are also a plurality of second pins 75, and the plurality of second pins 75 are all arranged on the same side of the MEMS microphone chip 71, so as to achieve stable connection between the MEMS microphone chip 71 and the second ASIC chip 73.

Among the plurality of first pins 55, two of the first pins 55 have a large change in voltage amplitude during the signal transmission process, so that the interference generated will be larger than that of other remaining first pins 55, causing interference The two larger first pins 55 are located at the ends of the linear arrangement. When the MEMS environmental chip 51 and the MEMS microphone chip 71 are spaced apart, the two first pins 55 with greater interference are kept away from the acoustic The sensor 70 may be sufficient. In the technical solution of the present application, the distance between the first pin 55 with greater interference and the acoustic sensor 70 may be greater than 0.8 mm. For a simple and beautiful structure, the first pin 55 and the second pin 75 are arranged on different sides of the substrate 30 respectively, then the first pin 55 can be provided at the increased signal output terminal and the MEMS microphone chip 71 The position of the distance, thereby greatly reducing the influence of electromagnetic interference and ensuring the stable working performance of the acoustic sensor 70.

Please refer to FIG. 2, in one embodiment, the positive electric area 511 and the negative electric area 513 are arranged along the direction from the MEMS microphone chip 71 to the second pin 75, and the first pin 55 is provided on the side of the positive electrical area 511 and the negative electrical area 513 facing away from the MEMS microphone chip 71.

In this embodiment, the positive electrical area 511 and the negative electrical area 513 are arranged along the direction from the MEMS microphone chip 71 to the second pin 75, then the first pin 55 is disposed on the substrate 30 away from the MEMS microphone chip On the side of 71, at this time, the interference of the first pin 55 in the dotted box is the largest. The distance between the two first pins 55 and the MEMS microphone chip 71 is 1.4 mm, which greatly increases the signal interference The strong distance between the two first pins 55 and the MEMS microphone chip 71 can greatly reduce the electromagnetic interference to the MEMS microphone chip 71 and ensure the stable performance of the acoustic sensor 70. At the same time, the positive electrical area 511 and the negative electrical area 513 are at the same distance from the MEMS microphone chip 71, so that when the MEMS environmental chip 51 generates electromagnetic interference, the polarity of the electromagnetic interference is reversed and the distances are equal, which can cancel each other and further weaken The interference to the MEMS microphone chip 71 further ensures the stable performance of the acoustic sensor 70.

Please refer to FIG. 3. In another embodiment, the first pin 55 and the second pin 75 are disposed on opposite sides of the substrate 30.

In this embodiment, the position of the acoustic sensor 70 is unchanged. On the basis of the above embodiment, the environmental sensor 50 is rotated 90 degrees around its center to ensure that the first pin 55 and the second pin 75 are located opposite the substrate 30, respectively. The two first pins 55 in the virtual frame in this embodiment are strong in interference, and the distance from the MEMS microphone chip 71 is 1.1 mm, which also increases the interference distance, thereby reducing the interference effect .

Of course, on the basis of the second embodiment described above, the acoustic sensor 70 can also be rotated 180 degrees with its center so that the first pin 55 and the second pin 75 are located on the same side of the substrate 30, in this embodiment The distance between the first pin 55 with strong interference and the distance from the MEMS microphone chip 71 is the same as in the second embodiment, and the interference distance can also be increased to reduce the influence of the environmental sensor 50 on the acoustic sensor 70.

In order to realize the sound pickup of the acoustic sensor 70, the MEMS microphone chip 71 includes a substrate 711 provided on the substrate 30, the substrate 711 is provided with a through hole 711a, and one end of the substrate 711 facing away from the substrate 30 is connected in sequence The diaphragm 713 and the back plate 715, the substrate 30 or the cover 10 are provided with sound holes communicating with the through holes 711a, and the back plate 715 are provided with via holes communicating with the through holes 711a and the accommodating cavity 10a 715a.

In this embodiment, the second pin 75 and the substrate 711 are electrically connected by a metal wire 60, a sound hole is formed on the substrate 30, and a through hole 711a is provided on the substrate 711, the sound hole communicates with the outside world, the through hole 711a and the accommodating cavity 10a, to facilitate the inflow of sound signals. Of course, the sound hole may also be opened on the cover 10, and the substrate 711 is also provided correspondingly. The MEMS microphone chip 71 has a substantially rectangular parallelepiped shape. The substrate 711 is provided with a circular through hole 711a. The corresponding sound hole is also set to a circle. The through hole 711a communicates with the sound hole and is consistent with the center of the sound hole. The acoustic cavity formed of the acoustic sensor 70 can ensure the smoothness of sound introduction, and can continuously introduce sound along the peripheral wall of the sound hole and the through hole 711a, thereby improving the sound quality of the sound. An end of the substrate 711 facing away from the substrate 30 is connected to the diaphragm 713 and the back plate 715 in sequence, and the back plate 715 is provided with a via 715a connecting the through hole 711a and the accommodating cavity 10a. The diaphragm 713 is also provided due to its material characteristics. There are small holes, and there is a spacer between the back plate 715 and the diaphragm 713, so that there is a gap between the diaphragm 713 and the back plate 715, and there is a gap between the diaphragm 713 and the back plate 715 to form a Parallel plate capacitor, diaphragm 713 generates vibration after receiving the sound signal from the sound hole, thereby changing the gap between the two, changing the capacitance, and then generating an electrical signal, and transmitting it to the ASIC chip for processing, while cooperating with environmental sensors 50 improved settings to achieve stable sound reception.

The present invention also provides an electronic device including a combined sensor 100. The specific structure of the combined sensor 100 refers to the above-mentioned embodiments. Since the electronic device adopts all the technical solutions of all the above-mentioned embodiments, it has at least the above-mentioned embodiments All the beneficial effects brought by the technical solution of the above will not be repeated here. Among them, the electronic device may be a wearable electronic device, such as a smart watch or a wristband, or a mobile terminal, such as a mobile phone or a notebook computer, etc., which is not limited herein.

The above are only the preferred embodiments of the present invention, and therefore do not limit the patent scope of the present invention. Any equivalent structural transformation or direct/indirect use of the description and drawings of the present invention under the inventive concept of the present invention All other related technical fields are included in the patent protection scope of the present invention.

Claims (10)

A combined sensor, characterized in that it includes: Cover A substrate, the substrate and the cover are enclosed to form a containing cavity; and The environmental sensor includes a MEMS environmental chip provided in the accommodating cavity and a first ASIC chip embedded in the substrate, the first ASIC chip and the MEMS environmental chip are electrically connected through a first pin; An acoustic sensor includes a MEMS microphone chip provided in the accommodating cavity and a second ASIC chip embedded in the substrate, the MEMS microphone chip and the second ASIC chip are electrically connected through a second pin; The MEMS environmental chip and the MEMS microphone chip are spaced apart, and the first pin and the second pin are arranged on different sides of the substrate, respectively. The combination sensor according to claim 1, wherein the MEMS environmental chip includes a positive electrical area and a negative electrical area arranged side by side, the first pin is provided with a plurality, and the plurality of first pins are The wires are arranged linearly, and the connection lines of the plurality of first pins are arranged in parallel intervals with the connection lines of the positive and negative electrical regions. The combination sensor according to claim 2, wherein a plurality of the second pins are provided, and the plurality of second pins are all arranged on the same side of the MEMS microphone chip. The combination sensor according to claim 3, wherein the positive electrical area and the negative electrical area are arranged along the direction from the MEMS microphone chip to the second pin, and the first pin is provided A side of the positive electrical area and the negative electrical area facing away from the MEMS microphone chip. The combination sensor according to claim 3, wherein the first pin and the second pin are provided on opposite sides of the substrate. The combination sensor according to claim 4, wherein the MEMS microphone chip includes a substrate provided on the substrate, the substrate is provided with a through hole, and an end of the substrate facing away from the substrate is connected in sequence For the diaphragm and the back plate, the substrate or the cover is provided with an acoustic hole communicating with the through hole, and the back plate is provided with a through hole communicating with the through hole and the accommodating cavity. The combination sensor according to claim 6, wherein the sound hole is formed in the substrate, and the center of the through hole is consistent with the center of the sound hole. The combination sensor according to claim 1, wherein the environmental sensor is one or more of air pressure, temperature, humidity, and optical sensors. The combination sensor according to claim 1, wherein a first cavity and a second cavity are provided in the inner space of the substrate 30, and the first ASIC chip and the second ASIC chip are respectively accommodated in the first One cavity and the second cavity. An electronic device, characterized by comprising the combination sensor according to any one of claims 1 to 9.

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