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WO2020111793A1 - Dispositif électronique comprenant un écran souple et son procédé de fonctionnement - Google Patents

Dispositif électronique comprenant un écran souple et son procédé de fonctionnement Download PDF

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Publication number
WO2020111793A1
WO2020111793A1 PCT/KR2019/016515 KR2019016515W WO2020111793A1 WO 2020111793 A1 WO2020111793 A1 WO 2020111793A1 KR 2019016515 W KR2019016515 W KR 2019016515W WO 2020111793 A1 WO2020111793 A1 WO 2020111793A1
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WIPO (PCT)
Prior art keywords
display
electronic device
temperature
processor
component
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Ceased
Application number
PCT/KR2019/016515
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English (en)
Korean (ko)
Inventor
조정민
김광태
변형섭
염동현
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Samsung Electronics Co Ltd
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Samsung Electronics Co Ltd
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Filing date
Publication date
Application filed by Samsung Electronics Co Ltd filed Critical Samsung Electronics Co Ltd
Publication of WO2020111793A1 publication Critical patent/WO2020111793A1/fr
Anticipated expiration legal-status Critical
Ceased legal-status Critical Current

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    • G—PHYSICS
    • G06—COMPUTING OR CALCULATING; COUNTING
    • G06F—ELECTRIC DIGITAL DATA PROCESSING
    • G06F1/00—Details not covered by groups G06F3/00 - G06F13/00 and G06F21/00
    • G06F1/16—Constructional details or arrangements
    • G—PHYSICS
    • G06—COMPUTING OR CALCULATING; COUNTING
    • G06F—ELECTRIC DIGITAL DATA PROCESSING
    • G06F1/00—Details not covered by groups G06F3/00 - G06F13/00 and G06F21/00
    • G06F1/16—Constructional details or arrangements
    • G06F1/20—Cooling means

Definitions

  • the present disclosure relates to an electronic device, and more particularly, to an electronic device including a flexible display and a method of operating the same.
  • Various electronic devices such as smart phones, tablet personal computers (PCs), and personal digital assistants (PDAs) have been provided. Such electronic devices have been developed to improve portability and user accessibility.
  • Various electronic devices may include a display as a user interface, and recently, touch-sensitive displays are widely used.
  • Some portable or mobile electronic devices may have a foldable structure, and in this case, the structure may include a flexible display that can be folded according to folding.
  • the structure may include a flexible display that can be folded according to folding.
  • an external force is applied to the flexible display and a stress to resist the external force may occur in the flexible display.
  • the stress generated in the flexible display may vary depending on the temperature due to the properties (physical properties) of the materials constituting the flexible display. Due to this, for example, when the electronic device is moved to an environment where the external temperature is rapidly lowered and then unfolded or folded, the flexible display may break (eg, crack, deformation (eg, buckling)).
  • the modulus of the panel-laminated substrate is changed according to the temperature, and the panel repulsive force is changed during unfolding and folding, thereby providing a heterogeneous feeling to the user.
  • At least one component capable of dissipating heat transferred to the flexible display based on data from the flexible display and the temperature sensor An electronic device including the same and a method of operating the same may be provided.
  • the electronic device is a foldable housing, which is connected to the hinge structure, the hinge structure, and a first surface facing in a first direction and directed in a second direction opposite to the first direction
  • a first housing structure including a second side and a first side member that at least partially surrounds a space between the first side and the second side, and a third side connected to the hinge structure and facing in a third direction , A fourth side facing in a fourth direction opposite to the third direction, and a second side member surrounding at least a portion of the space between the third and fourth surfaces, centered on the hinge structure
  • a second housing structure that folds from the first housing structure, wherein the first surface faces the third surface in a folded state and the third direction is the same as the first direction in an unfolded state
  • a foldable housing a flexible display extending from the first surface to the third surface, at least one component capable of dissipating heat transferred to the flexible display, a sensor for detecting the temperature of the flexible display, and Including a processor, the processor may control
  • the temperature of the flexible display is increased, thereby causing damage to the flexible display when the electronic device is expanded or folded. Can be reduced.
  • FIG. 1 is a block diagram of an electronic device in a network environment, according to various embodiments.
  • FIG. 2 is a block diagram of a display device according to various embodiments of the present disclosure.
  • FIG. 3 is a diagram illustrating a flat or unfolded state of an electronic device according to an embodiment.
  • FIG. 4 is a diagram illustrating a folded state of an electronic device according to an embodiment.
  • FIG. 5 is an exploded perspective view of the electronic device of FIG. 3 or 4.
  • FIG. 6 is a cross-sectional view illustrating an unfolded state of an electronic device according to an embodiment.
  • FIG. 7 is a cross-sectional view illustrating a folded state of an electronic device according to an embodiment.
  • FIG. 8 is a cross-sectional view of a display module according to an embodiment.
  • FIG 9 illustrates a display module according to an embodiment.
  • FIG. 10 illustrates a part of an electronic device according to an embodiment.
  • FIG. 11 shows a display module according to an embodiment.
  • FIG. 12A is a view illustrating an unfolded state of a display module according to an embodiment.
  • 12B is a view illustrating a folded state of a display module according to an embodiment.
  • FIG. 12C illustrates an unfolded state of a display module according to various embodiments of the present disclosure.
  • FIG. 13A is a cross-sectional view of an unfolded state of a display module according to an embodiment.
  • 13B is a cross-sectional view of a folded state of a display module according to an embodiment.
  • 13C and 13D are cross-sectional views illustrating an unfolded state of a display module according to various embodiments of the present disclosure.
  • FIG. 14 is a block diagram of an electronic device according to an embodiment.
  • FIG. 15 is a flowchart illustrating an operation of the electronic device of FIG. 14 according to an embodiment.
  • 16 is a flowchart illustrating an operation of entering the constant temperature mode in the operation flow of FIG. 15.
  • 17 is a flowchart illustrating an operation of entering the constant temperature mode in the operation flow of FIG. 15.
  • FIG. 18 is a flow chart of the operation of controlling heating to the display in the operation flow of FIG. 15.
  • FIG. 19 is a flow chart of an operation for controlling heating to a display in the operation flow of FIG. 15.
  • FIG. 20 is a flow chart of an operation for controlling heating to a display in the operation flow of FIG. 15.
  • 21 is a flowchart of an operation of the electronic device of FIG. 14 according to an embodiment.
  • FIG. 22 is a flowchart illustrating an operation of the electronic device of FIG. 14 according to various embodiments of the present disclosure.
  • FIG. 23 is a flow chart of the operation of controlling heating to the display in the operation flow of FIG. 15.
  • the electronic device 101 communicates with the electronic device 102 through the first network 198 (eg, a short-range wireless communication network), or the second network 199. It may communicate with the electronic device 104 or the server 108 through (eg, a remote wireless communication network). According to an embodiment, the electronic device 101 may communicate with the electronic device 104 through the server 108.
  • the first network 198 eg, a short-range wireless communication network
  • the server 108 e.g, a remote wireless communication network
  • the electronic device 101 may communicate with the electronic device 104 through the server 108.
  • the electronic device 101 includes a processor 120, a memory 130, an input device 150, an audio output device 155, a display device 160, an audio module 170, a sensor module ( 176), interface 177, haptic module 179, camera module 180, power management module 188, battery 189, communication module 190, subscriber identification module 196, or antenna module 197 ).
  • the components for example, the display device 160 or the camera module 180
  • the sensor module 176 eg, fingerprint sensor, iris sensor, or illuminance sensor
  • the display device 160 eg, display.
  • the processor 120 executes software (eg, the program 140) to execute at least one other component (eg, hardware or software component) of the electronic device 101 connected to the processor 120. It can be controlled and can perform various data processing or operations. According to an embodiment, as at least a part of data processing or operation, the processor 120 may receive instructions or data received from other components (eg, the sensor module 176 or the communication module 190) in the volatile memory 132. Loaded into, process instructions or data stored in volatile memory 132, and store result data in non-volatile memory 134.
  • software eg, the program 140
  • the processor 120 may receive instructions or data received from other components (eg, the sensor module 176 or the communication module 190) in the volatile memory 132. Loaded into, process instructions or data stored in volatile memory 132, and store result data in non-volatile memory 134.
  • the processor 120 may include a main processor 121 (eg, a central processing unit or an application processor), and an auxiliary processor 123 (eg, a graphics processing unit, an image signal processor) that can be operated independently or together. , Sensor hub processor, or communication processor). Additionally or alternatively, the coprocessor 123 may be set to use lower power than the main processor 121, or to be specialized for a designated function. The coprocessor 123 may be implemented separately from the main processor 121 or as part of it.
  • a main processor 121 eg, a central processing unit or an application processor
  • an auxiliary processor 123 eg, a graphics processing unit, an image signal processor
  • the coprocessor 123 may be set to use lower power than the main processor 121, or to be specialized for a designated function.
  • the coprocessor 123 may be implemented separately from the main processor 121 or as part of it.
  • the coprocessor 123 may replace, for example, the main processor 121 while the main processor 121 is in an inactive (eg, sleep) state, or the main processor 121 may be active (eg, execute an application) ) With the main processor 121 while in the state, at least one of the components of the electronic device 101 (for example, the display device 160, the sensor module 176, or the communication module 190) It can control at least some of the functions or states associated with.
  • the coprocessor 123 eg, an image signal processor or communication processor
  • may be implemented as part of other functionally related components eg, the camera module 180 or the communication module 190). have.
  • the memory 130 may store various data used by at least one component of the electronic device 101 (eg, the processor 120 or the sensor module 176).
  • the data may include, for example, software (eg, the program 140) and input data or output data for commands related thereto.
  • the memory 130 may include a volatile memory 132 or a non-volatile memory 134.
  • the program 140 may be stored as software in the memory 130, and may include, for example, an operating system 142, middleware 144, or an application 146.
  • the input device 150 may receive commands or data to be used for components (eg, the processor 120) of the electronic device 101 from outside (eg, a user) of the electronic device 101.
  • the input device 150 may include, for example, a microphone, mouse, or keyboard.
  • the audio output device 155 may output an audio signal to the outside of the electronic device 101.
  • the audio output device 155 may include, for example, a speaker or a receiver.
  • the speaker can be used for general purposes such as multimedia playback or recording playback, and the receiver can be used to receive an incoming call.
  • the receiver may be implemented separately from the speaker, or as part thereof.
  • the display device 160 may visually provide information to the outside of the electronic device 101 (eg, a user).
  • the display device 160 may include, for example, a display, a hologram device, or a projector and a control circuit for controlling the device.
  • the display device 160 may include a touch circuitry configured to sense a touch, or a sensor circuit (eg, a pressure sensor) configured to measure the intensity of the force generated by the touch. have.
  • the audio module 170 may convert sound into an electrical signal, or vice versa. According to an embodiment of the present disclosure, the audio module 170 acquires sound through the input device 150 or directly or wirelessly connects to the sound output device 155 or the electronic device 101 (for example, an external electronic device) Sound may be output through the electronic device 102 (eg, speakers or headphones).
  • the audio module 170 acquires sound through the input device 150 or directly or wirelessly connects to the sound output device 155 or the electronic device 101 (for example, an external electronic device) Sound may be output through the electronic device 102 (eg, speakers or headphones).
  • the electronic device 101 may further include a speech recognition module (not shown).
  • the speech recognition module may convert, for example, an acoustic speech signal obtained through a microphone included in the input device 150 or a sound sensor included in the sensor module 176 into words or sentences.
  • the speech recognition module extracts an acoustic signal and removes noise, and then extracts the characteristics of the speech signal and compares it with a speech model database (DB) for speech recognition.
  • DB speech model database
  • the voice model database may be stored and managed in an external electronic device (eg, the server 108), and the voice recognition module may access the external electronic device through the communication module 190.
  • the sensor module 176 detects an operating state (eg, power or temperature) of the electronic device 101 or an external environmental state (eg, a user state), and generates an electrical signal or data value corresponding to the detected state can do.
  • the sensor module 176 includes, for example, a gesture sensor, a gyro sensor, a barometric pressure sensor, a magnetic sensor, an acceleration sensor, a grip sensor, a proximity sensor, a color sensor, an infrared (IR) sensor, a biological sensor, It may include a temperature sensor, a humidity sensor, or an illuminance sensor.
  • the interface 177 may support one or more designated protocols that can be used for the electronic device 101 to directly or wirelessly connect to an external electronic device (eg, the electronic device 102).
  • the interface 177 may include, for example, a high definition multimedia interface (HDMI), a universal serial bus (USB) interface, an SD card interface, or an audio interface.
  • HDMI high definition multimedia interface
  • USB universal serial bus
  • SD card interface Secure Digital Card interface
  • audio interface audio interface
  • the connection terminal 178 may include a connector through which the electronic device 101 can be physically connected to an external electronic device (eg, the electronic device 102 ).
  • the connection terminal 178 may include, for example, an HDMI connector, a USB connector, an SD card connector, or an audio connector (eg, a headphone connector).
  • the haptic module 179 may convert electrical signals into mechanical stimuli (eg, vibration or movement) or electrical stimuli that the user can perceive through tactile or motor sensations.
  • the haptic module 179 may include, for example, a motor, a piezoelectric element, or an electrical stimulation device.
  • the camera module 180 may capture still images and videos. According to an embodiment, the camera module 180 may include one or more lenses, image sensors, image signal processors, or flashes.
  • the power management module 188 may manage power supplied to the electronic device 101.
  • the power management module 188 may be implemented, for example, as at least a part of a power management integrated circuit (PMIC).
  • PMIC power management integrated circuit
  • the battery 189 may supply power to at least one component of the electronic device 101.
  • the battery 189 may include, for example, a non-rechargeable primary cell, a rechargeable secondary cell, or a fuel cell.
  • the communication module 190 is a direct (eg, wired) communication channel or a wireless communication channel between the electronic device 101 and an external electronic device (eg, the electronic device 102, the electronic device 104, or the server 108). It can support establishing and performing communication through the established communication channel.
  • the communication module 190 operates independently of the processor 120 (eg, an application processor) and may include one or more communication processors supporting direct (eg, wired) communication or wireless communication.
  • the communication module 190 may include a wireless communication module 192 (eg, a cellular communication module, a short-range wireless communication module, or a global navigation satellite system (GNSS) communication module) or a wired communication module 194 (eg : Local area network (LAN) communication module, or power line communication module.
  • a wireless communication module 192 eg, a cellular communication module, a short-range wireless communication module, or a global navigation satellite system (GNSS) communication module
  • GNSS global navigation satellite system
  • LAN Local area network
  • Corresponding communication module among these communication modules includes a first network 198 (eg, a short-range communication network such as Bluetooth, WiFi direct, or infrared data association (IrDA)) or a second network 199 (eg, a cellular network, the Internet, or It may communicate with external electronic devices through a computer network (eg, a telecommunication network such as a LAN or WAN).
  • a computer network eg, a telecommunication network such
  • the wireless communication module 192 uses a subscriber information (eg, International Mobile Subscriber Identifier (IMSI)) stored in the subscriber identification module 196 within a communication network such as the first network 198 or the second network 199.
  • IMSI International Mobile Subscriber Identifier
  • the antenna module 197 may transmit a signal or power to the outside (eg, an external electronic device) or receive it from the outside.
  • the antenna module may be formed of a conductor or a conductive pattern according to one embodiment, and according to some embodiments, may further include other components (eg, RFIC) in addition to the conductor or conductive pattern.
  • the antenna module 197 may include one or more antennas, from which at least one suitable for a communication scheme used in a communication network such as the first network 198 or the second network 199 The antenna of, for example, may be selected by the communication module 190.
  • the signal or power may be transmitted or received between the communication module 190 and an external electronic device through the at least one selected antenna.
  • peripheral devices for example, a bus, a general purpose input and output (GPIO), a serial peripheral interface (SPI), or a mobile industry processor interface (MIPI)
  • GPIO general purpose input and output
  • SPI serial peripheral interface
  • MIPI mobile industry processor interface
  • the command or data may be transmitted or received between the electronic device 101 and the external electronic device 104 through the server 108 connected to the second network 199.
  • Each of the electronic devices 102 and 104 may be the same or a different type of device from the electronic device 101.
  • all or some of the operations performed on the electronic device 101 may be performed on one or more external devices of the external electronic devices 102, 104, or 108.
  • the electronic device 101 can execute the function or service itself.
  • one or more external electronic devices may be requested to perform at least a portion of the function or the service.
  • the one or more external electronic devices receiving the request may execute at least a part of the requested function or service, or an additional function or service related to the request, and deliver the result of the execution to the electronic device 101.
  • the electronic device 101 may process the result, as it is or additionally, and provide it as at least part of a response to the request.
  • cloud computing, distributed computing, or client-server computing technology can be used, for example.
  • FIG. 2 is a block diagram 200 of a display device 160 according to various embodiments.
  • the display device 160 may include a display 210 and a display driver IC (DDI) 230 for controlling the display 210.
  • the DDI 230 may include at least one of an interface module 231, a memory 233 (eg, a buffer memory), an image processing module 235, or a mapping module 237.
  • the DDI 230 configures, for example, image data, or image information including an image control signal corresponding to a command for controlling the image data, through the interface module 231 to other components of the electronic device 101. It can be received from an element.
  • the image information may include a processor 120 (eg, a main processor 121 (eg, an application processor) or an auxiliary processor 123 operated independently of the functions of the main processor 121 ( For example, a graphic processing device)
  • the DDI 230 may communicate with the touch circuit 250 or the sensor module 176 through the interface module 231.
  • the DDI 230 may At least a portion of the received image information may be stored in the memory 233, for example, in units of frames.
  • the image processing module 235 may, for example, store at least a portion of the image data as a characteristic of the image data, or Pre-processing or post-processing (eg, resolution, brightness, or resizing) may be performed based on at least the characteristics of the display 210.
  • the mapping module 237 is pre-processed or post-processed through the image processing module 235.
  • a voltage value or a current value corresponding to the image data may be generated.
  • the generation of a voltage value or a current value may include, for example, properties of pixels of the display 210 (eg, an array of pixels ( RGB stripe or pentile structure), or the size of each of the sub-pixels. At least some pixels of the display 210 are, for example, based at least in part on the voltage value or the current value.
  • visual information for example, text, images, or icons
  • corresponding to the image data may be displayed through the display 210.
  • the display device 160 may further include a touch circuit 250.
  • the touch circuit 250 may include a touch sensor 251 and a touch sensor IC 253 for controlling it.
  • the touch sensor IC 253 may control the touch sensor 251 to detect, for example, a touch input or a hovering input for a specific location of the display 210.
  • the touch sensor IC 253 may sense a touch input or a hovering input by measuring a change in a signal (eg, voltage, light amount, resistance, or charge amount) for a specific location of the display 210.
  • the touch sensor IC 253 may provide information about the sensed touch input or hovering input (eg, location, area, pressure, or time) to the processor 120.
  • At least a part of the touch circuit 250 is disposed as part of the display driver IC 230, or the display 210, or outside the display device 160. It may be included as part of other components (eg, coprocessor 123).
  • the display device 160 may further include at least one sensor (eg, a fingerprint sensor, an iris sensor, a pressure sensor, or an illuminance sensor) of the sensor module 176, or a control circuit therefor.
  • the at least one sensor or a control circuit therefor may be embedded in a part of the display device 160 (eg, the display 210 or DDI 230) or a part of the touch circuit 250.
  • the sensor module 176 embedded in the display device 160 includes a biometric sensor (eg, a fingerprint sensor)
  • the biometric sensor is associated with the touch input through some areas of the display 210. (Eg fingerprint image) can be obtained.
  • the pressure sensor may acquire pressure information associated with a touch input through a partial or entire area of the display 210.
  • the touch sensor 251 or the sensor module 176 may be disposed between pixels of a pixel layer of the display 210 or above or below the pixel layer.
  • An electronic device may be various types of devices.
  • the electronic device may include, for example, a portable communication device (eg, a smart phone), a computer device, a portable multimedia device, a portable medical device, a camera, a wearable device, or a home appliance device.
  • a portable communication device e.g, a smart phone
  • a computer device e.g., a smart phone
  • a portable multimedia device e.g., a portable medical device
  • a camera e.g., a camera
  • a wearable device e.g., a smart bracelet
  • phrases such as “at least one of,, B, or C” may include any one of the items listed together in the corresponding phrase of the phrases, or all possible combinations thereof.
  • Terms such as “first”, “second”, or “first” or “second” can be used to simply distinguish a component from other components, and to separate components from other aspects (eg, importance or Order).
  • Any (eg, first) component is “coupled” or “connected” to another (eg, second) component, with or without the term “functionally” or “communicatively”
  • any of the above components can be directly (eg, wired) to other components, wirelessly, or through a third component.
  • module may include units implemented in hardware, software, or firmware, and may be used interchangeably with terms such as logic, logic blocks, components, or circuits.
  • the module may be an integrally configured component or a minimum unit of the component or a part thereof performing one or more functions.
  • the module may be implemented in the form of an application-specific integrated circuit (ASIC).
  • ASIC application-specific integrated circuit
  • Various embodiments of the present disclosure may include one or more instructions stored in a storage medium (eg, internal memory 136 or external memory 138) readable by a machine (eg, electronic device 101). It may be implemented as software (e.g., program 140) that includes.
  • a processor eg, processor 120
  • the one or more instructions may include code generated by a compiler or code executable by an interpreter.
  • the storage medium readable by the device may be provided in the form of a non-transitory storage medium.
  • non-transitory only means that the storage medium is a tangible device, and does not contain a signal (eg, electromagnetic wave), and this term is used when data is stored semi-permanently in a storage medium. It does not distinguish between temporary storage cases.
  • a signal eg, electromagnetic wave
  • a method may be provided as being included in a computer program product.
  • Computer program products can be traded between sellers and buyers as products.
  • the computer program product is distributed in the form of a device-readable storage medium (eg compact disc read only memory (CD-ROM)), or through an application store (eg Play StoreTM) or between two user devices. It can be distributed directly, online (eg, downloaded or uploaded).
  • a device such as a memory of a manufacturer's server, an application store's server, or a relay server, or may be temporarily generated.
  • each component (eg, module or program) of the above-described components may include a singular or a plurality of entities.
  • one or more components or operations among the above-described corresponding components may be omitted, or one or more other components or operations may be added.
  • a plurality of components eg, modules or programs
  • the integrated component may perform one or more functions of each component of the plurality of components the same or similar to that performed by the corresponding component among the plurality of components prior to the integration. .
  • operations performed by a module, program, or other component may be executed sequentially, in parallel, repeatedly, or heuristically, or one or more of the operations may be executed in a different order, omitted, or the like. , Or one or more other actions can be added.
  • the electronic device 30 (eg, the electronic device 101 of FIG. 1) includes a foldable housing 300 and a foldable portion of the foldable housing 300.
  • the foldable housing 300 surrounds the space between the front surface 300a where the display 400 is exposed, the rear surface 300b facing opposite to the front surface 300a, and the front surface 300a and the rear surface 300b. Side surfaces 300c and 300d may be included.
  • the foldable housing 300 may include a first housing structure 310 and a second housing structure 320 connected by a hinge structure (not shown).
  • the hinge structure, the first housing structure 310 may be foldably connected to the second housing structure 320 and the folding axis A by a hinge structure.
  • the first housing structure 310 includes a first surface 3001 facing the first direction 301 and a second surface facing the second direction 302 opposite to the first direction 301. (3002), and may include a first side surface (300c) at least partially surrounding the space between the first surface (3001) and the second surface (3002).
  • the second housing structure 320 includes a third surface 3003 facing in the third direction 303, a fourth surface 3004 facing in the fourth direction 304 opposite to the third direction 303, and the It may include a second side (300d) surrounding at least a portion of the space between the third surface (3003) and the fourth surface (3004).
  • the front surface 300a of the electronic device 30 includes a first surface 3001 and a third surface 3003, and the rear surface 300b of the electronic device 30 has a second surface 3002 and a fourth surface ( 3004).
  • the first housing structure 310 may refer to a structure that forms a part of the first surface 3001, the second surface 3002, and the first side surface 300c.
  • the second housing structure 320 may refer to a structure that forms a part of the third surface 3003, the fourth surface 3004, and the second side surface 300d.
  • the foldable housing 300 may include a transparent plate (not shown) (eg, a polymer layer including various coating layers) forming the first side 3001 and the third side 3003. Can be.
  • the display 400 may be disposed along a transparent plate, and may be exposed through the first surface 3001 and the third surface 3003.
  • the transparent plate may have flexibility to enable the folded state of the electronic device 30.
  • the display 400 may be implemented to include a transparent plate, and the transparent plate may be omitted from the foldable housing 300.
  • the first housing structure 310 may include a first rear cover 380 disposed on one side of the folding shaft A to form at least a portion of the second surface 3002.
  • the first back cover 380 may have a substantially rectangular periphery 381, and the edge 381 may be wrapped by the first side member 311.
  • the first side member 311 and the first rear cover 380 may be integrally formed, and may include the same material.
  • the second housing structure 320 may include a second rear cover 390 disposed on the other side of the folding shaft A to form at least a portion of the fourth surface 3004.
  • the second back cover 390 can have a substantially rectangular edge 391, which can be wrapped by a second side member 321.
  • the second side member 321 and the second rear cover 390 may be integrally formed, and may include the same material.
  • the first back cover 380 and/or the second back cover 390 is, for example, coated or colored glass, ceramic, polymer, metal (eg, aluminum, stainless steel (STS)) , Or magnesium), or a combination of at least two of the above materials.
  • the first rear cover 380 and the second rear cover 390 may have a substantially symmetrical shape around the folding axis A.
  • the first rear cover 380 and the second rear cover 390 do not necessarily have mutually symmetric shapes, and in other embodiments, the first rear cover 380 and/or the second rear cover of various other shapes ( 390) may be provided.
  • the first housing structure 310 may include a first side member (or a first side bezel structure) 311 forming the first side surface 300c
  • the second housing structure ( 320 may include a second side member (or a second side bezel structure) 321 forming the second side 300d.
  • the first side member 311 and/or the second side member 321 may include metal or polymer.
  • the first side member 311 and the second side member 321 may be extended to form an edge region of the front surface 300a.
  • the front surface 300a of the electronic device 30 is displayed on the display 400 and a portion of the first side member 311 adjacent to the display 400 and a portion of the second side member 321. Can be formed by.
  • the rear surface 300b of the electronic device 30 includes a first rear cover 380, a partial area of the first side member 311 adjacent to the first rear cover 380, and a second rear cover 390 And a second region of the second side member 321 adjacent to the second rear cover 390.
  • the first side member 311 and the second side member 321 are disposed on both sides about the folding axis A, and may have an overall symmetrical shape with respect to the folding axis A. .
  • the first housing structure 310 extends from the first side member 311 or is combined with the first side member 311 to form the first surface 3001 together with the display 400.
  • the component placement region 314 may be further included. Areas other than the component placement area 314 of the first side member 321 may have a shape symmetrical to the second side member 321. At least one component utilizing the first surface 3001 may be disposed in the component placement region 314.
  • the component placement region 314 may be formed to have a region set adjacent to a corner of the first side member 311. According to various embodiments, the arrangement, shape, and size of the component placement area 314 is not limited to the illustrated example.
  • the component placement area 314 may be provided at another corner of the first side member 311 or any area between the top and bottom corners.
  • Components for performing various functions embedded in the electronic device 30 may include one or more openings (not shown) provided through the component placement region 314 or in the component placement region 314. It may be exposed through the first surface (3001).
  • the component 346 disposed in the component placement region 314 may include at least one of various sensors, such as a proximity sensor, a front camera, a light emitting device, or a receiver.
  • the light emitting device may provide status information of the electronic device 30 in an optical form.
  • the light emitting device may provide, for example, a light source interlocked with the operation of the front camera.
  • the light emitting element may include, for example, an LED, an IR LED, and a xenon lamp.
  • the electronic device 30 may include at least one of the audio modules 341 and 342, the key input device 343, or the connector hole 344.
  • the audio modules 341 and 342 may include a microphone hole 341 or a speaker hole 342.
  • a microphone for acquiring external sound may be disposed therein, and in some embodiments, a plurality of microphones may be arranged to sense the direction of sound.
  • the speaker hole 342 may include an external speaker hole or a call receiver hole.
  • the speaker hole 342 and the microphone hole 341 may be implemented as one hole, or a speaker may be included without the speaker hole 342 (eg, a piezo speaker).
  • the key input device 343 may be disposed on the side surfaces 300c and 300d of the folder housing 300.
  • the electronic device 30 may not include some or all of the above-mentioned key input devices 343, and the key input devices 343 not included may be soft keys on the display 400, etc. It can be implemented in other forms.
  • the key input device includes a sensor module disposed on the second side 3002 of the first housing structure 310 (eg, one or more components 345 disposed on the first back region 382 ). can do.
  • the connector hole 344 may include a first connector hole that may receive a connector (eg, a USB connector) for transmitting and receiving power and/or data with an external electronic device, and/or external electronics. It may include a second connector hole (for example, an earphone jack) that can receive a connector for transmitting and receiving audio signals to and from the device.
  • a connector eg, a USB connector
  • a second connector hole for example, an earphone jack
  • the position or number of connector holes is not limited to the example shown in FIG. 3 and may be formed differently.
  • an audio module eg, a receiver for a call
  • a sensor module eg, a proximity sensor, or a fingerprint sensor
  • a camera module eg, a front surface on the back of the screen display area of the display 400 Camera
  • the display 400 is coupled to or adjacent to a touch sensing circuit, a pressure sensor capable of measuring the intensity (pressure) of the touch, and/or a digitizer detecting a magnetic field type stylus pen. Can be deployed.
  • the first housing structure 310 and the second housing structure 320 may form a recess, which is a space in which the display 400 is disposed.
  • the recesses may have two or more different widths in a direction perpendicular to the folding axis A.
  • the recess is formed at the edge of the first part 321a parallel to the folding axis A of the second side member 321 and the component placement area 314 of the first side member 311.
  • a first width w1 between the first portions 311a may be included.
  • the recess does not correspond to the second portion 321b of the second side member 321 and the component placement area 314 of the first side member 311, but the second portion parallel to the folding axis A ( 311b) may include a second width w2.
  • the second width w2 may be formed longer than the first width w1.
  • the first portion 311a of the first housing structure 310 having a mutually asymmetric shape and the first portion 321a of the second housing structure 320 have a first width w1 of the recess ), the second portion 311b of the first housing structure 310 having a mutually symmetrical shape, and the second portion 321b of the second housing structure 320 have a second width w2 of the recess.
  • the distances from the folding shaft A may be different from the first portion 321a and the second portion 321b of the second housing structure 320.
  • the width of the recess is not limited to the illustrated example.
  • the recesses may have a plurality of widths by portions having the shape of the component placement region 314 or the asymmetrical shapes of the first housing structure 310 and the second housing structure 320.
  • one or more components may be disposed or visually exposed on the rear surface 300b of the electronic device 30.
  • the sub display 393 may be visually exposed through the second rear area 392 of the second rear cover 390.
  • one or more components 345 may be visually exposed through the first rear region 382 of the first rear cover 380.
  • the one or more components 345 may include sensors (eg, proximity sensors, heart rate sensors) and/or rear cameras.
  • the hinge cover 330 is disposed between the first housing structure 310 and the second housing structure 320 to cover an internal component (eg, a hinge structure).
  • the hinge structure may be referred to as an element including the hinge cover 330.
  • the hinge cover 330 is formed by a portion of the first housing structure 310 and the second housing structure 320 according to a state of the electronic device 30 (eg, an extended state or a folded state). It may be obscured or exposed to the outside.
  • the hinge cover 330 when the electronic device 30 is in an unfolded state, the hinge cover 330 may be hidden and not exposed by the first housing structure 310 and the second housing structure 320. have.
  • the hinge cover 330 when the electronic device 30 is in a folded state (eg, a fully folded state), the hinge cover 330 includes a first housing structure 310 and a second The housing structure 320 may be exposed to the outside.
  • the electronic device 30 has an intermediate state in which the first housing structure 310 and the second housing structure 320 are folded with a certain angle (for example, an expanded state and When in the folded state), the hinge cover 330 may be partially exposed to the outside between the first housing structure 310 and the second housing structure 320.
  • the exposed area of the hinge cover 330 in the intermediate state may be less than the exposed area of the hinge cover 330 in the fully folded state.
  • the hinge cover 330 may include a curved surface, and the curved surface may form one side surface of the electronic device 30 in a folded state.
  • the display 400 may mean a display in which at least some areas may be transformed into a flat surface or a curved surface.
  • the display 400 includes a folding area 403, a first area 401 disposed on one side (right side of the folding area 403) based on the folding area 403, and The second region 402 may be disposed on the other side (left side of the folding region 403 ).
  • the region division of the display 400 illustrated in FIG. 3 is exemplary, and the display 400 is divided into a plurality of regions (eg, 4 or more or 2) according to a structure or function. It may be divided.
  • the area of the display 400 may be divided by the folding area 403 or the folding axis A extending parallel to the y-axis, but the display ( The region may be divided based on another folding area (eg, a folding area parallel to the x axis) or another folding axis (eg, a folding axis parallel to the x axis).
  • the first area 401 and the second area 402 of the display 400 may have an overall symmetrical shape around the folding area 403.
  • the second region 402 unlike the first region 401, may include a notch cut according to the presence of the component placement region 314, but other than In the region, the first region 401 and the folding region 403 may have a symmetrical shape.
  • the first region 401 and the second region 402 may include portions having symmetrical shapes with respect to the folding region 403 and portions having asymmetrical shapes with each other.
  • the angle or distance between the first housing structure 310 and the second housing structure 320 may vary depending on the unfolded state, the folded state, or the intermediate state of the foldable housing 300.
  • the operation of the first housing structure 310 and the second housing structure 320 according to the state of the electronic device 30 (for example, the unfolded state and the folded state) and each region of the display 400 will be described.
  • the third direction 303 facing the third surface 3003 may be the same.
  • the first surface 3001 of the first housing structure 310 and the third surface 3003 of the second housing structure 320 form an angle of about 180 degrees and have the same direction (eg, electron It may be arranged to face the front side (300a of the device 30).
  • the surface of the first area 401 and the surface of the second area 402 of the display 400 form an angle of about 180 degrees and are in the same direction (for example, the electronic device 30).
  • the front side (300a) may be facing).
  • the folding area 403 of the display 400 may form the same plane as the first area 401 and the second area 402.
  • the first housing structure 310 and the second housing structure 320 may be disposed to face each other.
  • the first surface 3001 of the first housing structure 310 and the third surface 3003 of the second housing 320 may face each other.
  • the surface of the first area 401 of the display 400 and the surface of the second area 402 form a narrow angle with each other (for example, between about 0 and 10 degrees), and can face each other.
  • the folding region 403 may be formed of a curved surface at least partially having a predetermined curvature.
  • the first housing structure 310 and the second housing structure 320 when the electronic device 30 is in an intermediate state (for example, a state between an expanded state and a folded state), the first housing structure 310 and the second housing structure 320 have a predetermined angle (a) with each other. It can be arranged at a certain angle.
  • the surface of the two regions 402 may form an angle larger than the folded state and smaller than the unfolded state.
  • the folding region 403 may be formed of a curved surface having at least a predetermined curvature, and the curvature at this time may be smaller than in the folded state.
  • FIG. 5 is an exploded perspective view of the electronic device 30 of FIG. 3 or 4.
  • the electronic device 30 includes a display unit 40, a bracket assembly 50, a substrate unit 550, a first housing structure 310, and a second housing
  • the structure 320 may include at least one of the first rear cover 380 or the second rear cover 390.
  • the display unit 40 may be referred to as a display module or display assembly.
  • the display unit 40 may include, for example, a display 400 and one or more plates or layers 440 on which the display 400 is mounted.
  • the plate 440 may be disposed between the display 400 and the bracket assembly 50.
  • the display 400 may be disposed on at least a portion of one surface of the plate 440 (eg, an upper surface based on FIG. 5 ).
  • the plate 440 may be formed in a shape corresponding to the display 400. For example, some areas of the plate 440 may be formed in a shape corresponding to the notch 404 of the display 400.
  • the bracket assembly 50 is a first bracket 510, a second bracket 520, the first bracket 510 and the hinge structure 501 disposed between the second bracket 520, the hinge A hinge cover 330 that covers the structure 501 when viewed from the outside, and a wiring member 530 that crosses the first bracket 510 and the second bracket 520 (eg, a flexible printed circuit board (FPC) circuit)).
  • FPC flexible printed circuit board
  • the bracket assembly 50 may be disposed between the plate 440 and the substrate portion 550.
  • the first bracket 510 may be disposed between the first area 401 of the display 400 and the first substrate (eg, the first printed circuit board (PCB)) 551.
  • the second bracket 520 may be disposed between the second area 402 of the display 400 and the second substrate (eg, the second printed circuit board) 552.
  • the wiring member 530 and the hinge structure 501 may be disposed inside the bracket assembly 50.
  • the wiring member 530 may be disposed in a direction (eg, an x-axis direction) crossing the first bracket 510 and the second bracket 520.
  • the wiring member 530 may be disposed in a direction perpendicular to a folding axis (eg, the y-axis or the folding axis (A) of FIG. 3) of the folding area 403 of the display 400 (eg, the x-axis direction). .
  • the substrate unit 550 may include a first substrate 551 disposed on the first bracket 510 side and a second substrate 552 disposed on the second bracket 520 side.
  • the first substrate 551 and the second substrate 552 include a bracket assembly 50, a first housing structure 310, a second housing structure 320, a first back cover 380, and a second back cover ( 390).
  • Components for implementing various functions of the electronic device 30 may be mounted on the first substrate 551 and the second substrate 552.
  • the first housing structure 310 and the second housing structure 320 are coupled to each other so that they are coupled to both sides of the bracket assembly 50 while the display unit 40 is coupled to the bracket assembly 50. Can be assembled. According to various embodiments, the first housing structure 310 and the second housing structure 320 may be coupled to the bracket assembly 50 by sliding on both sides of the bracket assembly 50.
  • the first housing structure 310 can include a first rotational support surface 312, and the second housing structure 320 is a second rotational support corresponding to the first rotational support surface 312. It may include a cotton 322.
  • the first rotational support surface 312 and the second rotational support surface 322 may include a curved surface corresponding to the curved surface included in the hinge cover 330.
  • the first rotation support surface 312 and the second rotation support surface 322 may cover the hinge cover 330
  • the hinge cover 330 may or may not be exposed to the rear of the electronic device 30 to a minimum.
  • the hinge cover 330 may be exposed as much as possible between the first rotating support surface 312 and the second rotating support surface 322.
  • the electronic device 600 (eg, the electronic device 30 of FIG. 3) includes a first housing structure 610, a second housing structure 620, and a hinge structure ( 630 ), a first printed circuit board 641, a second printed circuit board 642 or a display 650.
  • the first housing structure 610 (eg, the first housing structure 310 of FIG. 3) includes a first bracket 611 (eg, the first bracket 510 of FIG. 5) and a first It may include a back cover 612 (eg, the first back cover 380 of FIG. 3).
  • the first bracket 510 includes a first area 651 (eg, the first area 401 of FIG. 3) and a first print of the display 650 (eg, the display 400 of FIG. 3 ).
  • the circuit board 641 may be disposed at least partially.
  • the second housing structure 620 (eg, the second housing structure 320 of FIG. 3) includes a second bracket 621 (eg, the second bracket 520 of FIG. 5) and a second It may include a back cover 622 (eg, the second back cover 390 of FIG. 3).
  • the second bracket 621 includes a second area 652 (eg, the second area 402 of FIG. 3) and a second print of the display 650 (eg, the display 400 of FIG. 3). It may be disposed at least partially between the circuit boards 642.
  • the electronic device 600 includes a support member (eg, the plate of FIG.
  • the support member may be combined with a bracket (eg, the first bracket 611 and the second bracket 621) while supporting the flexible display 650.
  • the display 650 may include the support member.
  • the hinge structure 630 (eg, the hinge structure 501 of FIG. 5) includes a first hinge plate 631, a second hinge plate 632 or a hinge cover 633 (eg, FIG. 5) It may include at least one of the hinge cover (330).
  • the first hinge plate 631 and the second hinge plate 632 may be rotatably connected by a hinge (not shown).
  • the first hinge plate 631 can be combined with the first bracket 611 of the first housing structure 610, and the second hinge plate 632 is the second bracket 621 of the second housing structure 620. It can be combined with.
  • the hinge cover 633 is formed by a portion of the first housing structure 610 and the second housing structure 620, depending on the state of the electronic device 600 (eg, an extended state or a folded state). It may be obscured or exposed to the outside.
  • the first bracket 611 of the first housing structure 610 includes a first rotational support surface 611a (eg, the first rotational support surface 312 of FIG. 5) and a first coupling support surface. It may include (611b). Some areas of the first hinge plate 631 are disposed to face the first engagement support surface 611b and may be coupled to the first engagement support surface 611b. The first rotating support surface 611a may be disposed with a space therebetween while facing some other area of the first hinge plate 631.
  • the second bracket 621 of the second housing structure 620 includes a second rotation support surface 621a (eg, the second rotation support surface 322 of FIG. 5) and a second coupling support surface. (621b). Some areas of the second hinge plate 632 are disposed to face the second engagement support surface 621b and may be coupled to the second engagement support surface 621b. The second rotation support surface 621a may be disposed with a space therebetween while facing some other area of the second hinge plate 632.
  • the first rotational support surface 611a and the second rotational support surface 621a may cover the hinge cover 633, ,
  • the hinge cover 633 may be exposed to the outside or to a minimum.
  • the hinge cover 633 may be exposed as much as possible between the first rotational support surface 611a and the second rotational support surface 621a.
  • the hinge cover 633 faces at least a portion of the first rotational support surface 611a and the second rotational support surface 621a. It may include a curved surface 633a. According to an embodiment, the first rotation support surface 611a and/or the second rotation support surface 621a may include a curved surface (not shown) corresponding to the curved surface 633a of the hinge cover 633.
  • the hinge cover 633 may be a curved shape.
  • the first housing structure 610 is a first side member that at least partially surrounds a space between the first rear cover 612 and the first area 651 of the display 650. 613 (eg, the first side member 311 of FIG. 3 or 4).
  • the second housing 620 includes a second side member 623 (for example, the third or fourth member of FIG. 3 or 4) that at least partially surrounds a space between the second rear cover 622 and the second area 652 of the display 650. 2 side member 321).
  • the first side member 613 and the second side member 623 together form part of the side surface of the electronic device 600, and the curved surface 633a of the hinge cover 633 May form a part of the side surface of the electronic device 600.
  • the display device 650 when changing the electronic device 600 from the unfolded state (see FIG. 6) to the folded state (see FIG. 7) or when switching from the folded state to the unfolded state, the display device 650 attempts to resist external forces. Stress can occur. The stress generated within the display 610 when the display 650 is unfolded or folded may vary depending on the temperature of the display 650. The temperature of the display 650 may be changed according to an external temperature condition placed by the electronic device 600.
  • the display 650 may include a first area 651, a second area 652, and a third area 653.
  • the first region 651 and the second region 652 may be disposed on the same plane in the unfolded state by the hinge structure 630.
  • the first region 651 and the second region 652 may face each other in a folded state by the hinge structure 630.
  • the third region 653 may be disposed between the first region 651 and the second region 652 to be connected to each other.
  • the third region 653 may be disposed in a region corresponding to the hinge structure 630.
  • the third region 653 may be deformed by the hinge structure 630.
  • the probability of damage to the display 650 may be high when the display 650 is unfolded or folded.
  • the temperature reduction rate per unit time of the display 650 eg, °C/min
  • the probability of damage to the display 650 may be high when the display 650 is unfolded or folded.
  • the layers in the display according to the rapid temperature change and An increase in modulus of the interlayer adhesive can be added.
  • the upper limit threshold is a temperature that is a reference for causing material deformation of the display 650, and may vary depending on the materials included in the display 650.
  • the electronic device 600 includes at least sensors capable of dissipating heat for transmitting to the display 650 and sensors 671a, 671b, 672a, and 672b for detecting the temperature of the display 650.
  • One component 660 may be included.
  • the electronic device 600 may include the at least one component 660 (eg, first heat generation). By operating the plate 661 or the second heating plate 662, heat dissipated from the component can be provided to the display.
  • the electronic device 600 may cause at least one component to dissipate heat so that the temperature of the display 650 does not fall below the lower limit threshold.
  • the electronic device 600 may control the heat emitted by at least one component so that the rate of temperature reduction per unit time of the display 650 does not exceed the reference temperature reduction rate. Heat dissipated from at least one component may be transferred to the display 650 and diffused in the display 650.
  • At least one component capable of dissipating heat for transfer to the display 650 may include a resistance component, and when a current is provided, a portion of the current is converted into thermal energy by the resistance component And can diverge.
  • At least one component capable of dissipating heat for transferring to the display 650 is a heating layer (or a heating plate) disposed along at least a portion of the rear surface of the display 650 (heating plate)) 661, 662.
  • the at least one component 660 may include a first heating plate 661, a display disposed between the display 650 and the first bracket 611, and between the display 650 and the first hinge plate 631. It may include a second heating plate 662 disposed between the 650 and the second bracket 621, or between the display 650 and the second hinge plate (632).
  • the heating layer may be disposed adjacent to the rear surface of the display 650, and a high thermal conductivity member may be disposed between the display 650 and the heating layer.
  • a heating layer 660 capable of dissipating heat for transferring to the display 650 may be disposed between the hinge cover 633 and the display 650. According to various embodiments, the heating layer 660 capable of dissipating heat for transferring to the display 650 may be disposed at various other locations.
  • At least one component capable of dissipating heat for transferring to the display 650 includes a display driver integrated circuit (DDI) configured to control a plurality of pixels of the display 650,
  • DCI display driver integrated circuit
  • it may be the display driver IC 230 of FIG. 2.
  • At least one component capable of dissipating heat for transfer to the display 650 is an element disposed on the first printed circuit board 641 and/or the second printed circuit board 642 It may be at least one (for example, the processor 120 of FIG. 1).
  • the electronic device 600 may include a heat sink or heat pipe between at least one component (eg, the processor 120 of FIG. 1) and the display 650 capable of dissipating heat ( heat pipe)) (or a heat transfer structure). Heat dissipated from at least one component may be transferred to the display 650 through the heat exchanger.
  • the electronic device 600 maintains the display 650 within a certain temperature range (eg, room temperature) by using heat generated by the display 650 through driving of the display 650 Can be controlled.
  • a certain temperature range eg, room temperature
  • sensors 671a, 671b, 672a, and 672b for detecting the temperature of the display 650 may be disposed along the rear surface of the display 650.
  • a sensor for detecting the temperature of the display 650 may be disposed inside the display 650.
  • FIG. 8 is a cross-sectional view of a display module according to an embodiment.
  • the display module 800 may include a display 801 and a display driver IC (eg, the display driver IC 230 of FIG. 2 ).
  • a display driver IC eg, the display driver IC 230 of FIG. 2 .
  • the display 801 may include a first substrate 810 and a panel 830.
  • the first substrate 810 may be a base plate on which the panel 830 is formed, and the panel 830 may be formed on the first substrate 810 through a series of manufacturing processes.
  • the panel 830 may include a light emitting layer 832 forming a plurality of pixels, and a TFT (tin film transistor) 831 for controlling light of each pixel.
  • the first substrate 810 may include a first region 810a combined with the panel 830 and a second region 810b combined with the display driver IC 840.
  • the first substrate 810 is in the form of a plate including both sides (first side 811, second side 812), for example, polyimide (PI (polyimide)) and It may be formed of a material such as plastic having flexibility.
  • PI polyimide
  • the panel 830 may include a TFT 831 and a light emitting layer 832 forming a plurality of pixels controlled by the TFT 831.
  • the TFT 831 is disposed between the light emitting layer 832 and the first substrate 810, and the first substrate 810 is formed through a series of processes such as deposition, patterning, and etching. Layers of the TFT 831 may be formed on one surface 811.
  • an active layer or semiconductor layer formed of a semiconductor material such as poly-silicon is formed on the first surface 811 of the first substrate 810, and a gate electrode for driving the active layer ), a source electrode and a drain electrode may be formed.
  • the source electrode may be an electrode that supplies electrons
  • the drain electrode may be an electrode that receives electrons.
  • the gate electrode may be an electrode for controlling electron movement from the source electrode to the drain electrode.
  • the active layer is electrically connected to the source electrode and the drain electrode, and when a voltage greater than or equal to a gate electrode is applied, the active layer may be a path (or channel) that enables electrons to move.
  • the light emitting layer 832 may include an organic light emitting diode (OLED), and although not shown, an anode and a cathode formed through evaporation on the TFT 831 And an organic material layer.
  • OLED organic light emitting diode
  • the anode is an electrode that emits holes
  • the cathode is an electrode that emits electrons
  • the organic material layer can be disposed between the anode and the cathode. Due to the reaction of the active layer of the TFT 831, current flows to the source electrode, the active layer, and the drain electrode, and a voltage may be applied to the anode and cathode of the light emitting layer 832 electrically connected to the TFT 831.
  • the emission layer 832 including the OLED may be defined as an'organic emission layer'. According to various embodiments, the light emitting layer 832 may be replaced with a light emitting element having a different structure from the OLED.
  • the TFT 831 may be a TFT based on low-temperature polycrystalline silicon (LTPS). According to some embodiments, the TFT 831 may be an a-Si (amorphous silicon) based TFT.
  • LTPS low-temperature polycrystalline silicon
  • the TFT 831 may be an a-Si (amorphous silicon) based TFT.
  • the panel 830 may include an encapsulation 833 that prevents the light emitting layer 832 from being influenced by the outside. Since the organic material layer, the positive electrode, or the negative electrode included in the light emitting layer 832 may react with oxygen or moisture and lose its light emitting properties, the encapsulation 833 is a seal that prevents the light emitting layer 832 from being exposed, It is possible to prevent oxygen or moisture from penetrating into the light emitting layer 832. According to one embodiment, the encapsulation 833 may include thin film encapsulation (TFE).
  • TFE thin film encapsulation
  • the panel 830 may further include an optical layer 834 disposed on the bag 833.
  • the optical layer 834 may include a retardation layer (or retarder) and a polarizing layer (or polarizer) disposed on the phase retardation layer.
  • unpolarized light such as sunlight
  • the unpolarized light passes through the polarization layer and changes into linearly polarized light
  • the linearly polarized light passes through the phase retardation layer to become circularly polarized light.
  • the phase retardation layer may have a characteristic of a quarter wave retarder ( ⁇ /4 retarder).
  • the polarization layer and the phase retardation layer of the optical layer 834 may prevent light from outside to be reflected and improve outdoor visibility.
  • the 135° circularly polarized light changed by the phase retardation layer is reflected on the TFT 831, etc., and the reflected 135° circularly polarized light is converted into 180° linearly polarized light through the phase retardation layer.
  • ° Linear light cannot pass through the 90° polarization layer and be emitted outside.
  • one layer in which a polarization layer and a phase retardation layer are combined may be provided, and this layer may be defined as a'circular polarization layer'.
  • the panel 830 may further include various layers not shown.
  • the panel 830 may include a buffer layer formed of a material such as silicon oxide and silicon nitride disposed between the TFT 831 and the first substrate 810.
  • the panel 830 may include a protection layer formed of a polymer or the like disposed between the buffer layer and the first substrate 810.
  • the display 801 may be various displays based on the TFT 831, and for example, an active matrix organic light emitting diode (AMOLED) display, passive matrix organic light emitting diode (PMOLED) It may be a display, or a liquid crystal display (LCD). According to various embodiments of the present invention, the display may be formed on a flexible substrate (eg, a substrate formed of polyimide (PI)).
  • AMOLED active matrix organic light emitting diode
  • PMOLED passive matrix organic light emitting diode
  • LCD liquid crystal display
  • the display may be formed on a flexible substrate (eg, a substrate formed of polyimide (PI)).
  • PI polyimide
  • the display driver IC 840 may control the TFT 831 electrically connected to the light emitting layer 832 including a plurality of pixels under the control of a processor (eg, the processor 120 of FIG. 1 ). have.
  • a bonding pad 835 electrically connected to the TFT 831 and used to mount the display driver IC 840 is provided on the first surface 811 of the first substrate 810. It may be formed through evaporation.
  • the display driver IC 840 has a function of turning on or off a pixel and can be electrically connected to a gate electrode of the TFT 831.
  • the display driver IC 840 has a function of making a color difference by adjusting the amount of red, green, and blue (RGB) signals of pixels, and can be electrically connected to a source electrode of the TFT 831.
  • the TFT 831 is a gate line that electrically connects the display driver IC 840 and the gate electrodes of the TFT 831, and a source line that electrically connects the display driver IC 840 and the source electrodes of the TFT 831 ( Or a data line).
  • the gate line and the source line may be electrically connected to the connection pad 835.
  • connection pad 835 may be formed on the first substrate 810 based on LTPS or a-Si together with the TFT 831.
  • the structure including the TFT 831, the connection pad 835, and the first substrate 810 may be defined as the second substrate 820.
  • FIG. 8 illustrates a chip-on-panel (COP) structure in which the display driver IC 840 is coupled to the second substrate 820 in FIG. 8 according to one embodiment, the display driver IC 840 is mounted on a flexible FPCB (flexible)
  • a flexible FPCB flexible
  • COF chip-on-film
  • the second region 810b may be disposed in a rounded shape, and the display driver IC 840 may at least overlap the panel 830.
  • the display driver IC 840 is not limited to the illustrated example according to the shape in which the second region 810b is bent, but may be disposed at various positions with respect to the first region 810a.
  • an electronic device eg, the electronic device 101 of FIG. 1 or the electronic device 30 of FIG. 3 including the display module 800 has a low temperature at which the display 801 is likely to be damaged.
  • the temperature may be controlled so that the display driver IC 840 is evenly transmitted to the front of the panel using the heat emitted.
  • the temperature of the display 801 may not fall below the lower limit threshold, or the temperature reduction rate per unit time of the display 801 may not rise above the reference reduction rate.
  • the display 801 falls from a temperature higher than an upper threshold (eg, a temperature that is a reference for causing material deformation of the display 801) to a lower temperature, heat emitted from the display driver IC 840 is The rate of temperature reduction per unit time of the display 801 may be reduced.
  • an upper threshold eg, a temperature that is a reference for causing material deformation of the display 801
  • the display 801 may include a heat conducting layer (or heat conducting sheet) 850 disposed on the second surface 812 of the first substrate 810. Heat dissipated from the display driver IC 840 may be diffused in the display 801 through the heat conducting layer 850.
  • the thermally conductive layer 850 may include various thermally conductive materials such as graphite.
  • FIG 9 illustrates a display module according to an embodiment.
  • the display module 900 may include a display 901 and a display driver IC 940.
  • the display 901 is a flexible or foldable display, and may include, for example, the display 400 of FIG. 3.
  • the display 901 includes a folding area 913 (eg, the folding area 403 of FIG. 3) and a first area 911 disposed on both sides based on the folding area 913 (eg, the first area of FIG. 3) (401)) and the second region 912 (eg, the second region 402 of FIG. 3).
  • the display driver IC 940 may be disposed in a substantially same structure as the display driver IC 840 of FIG. 8.
  • the display 901 includes a rectangular light emitting unit (eg, a plurality of pixels) including a first edge 901a, a second edge 901b, a third edge 901c, and a fourth edge 901d. They may include an area 914 disposed therein, and an extension 915 extending from the third edge 901c and having a display driver IC 940 disposed thereon.
  • the extension portion 915 may be disposed to be curved toward the rear surface (not shown) of the light emitting portion 914, and the display driver IC 940 may be disposed to overlap at least with the light emitting portion 914.
  • an electronic device eg, the electronic device 101 of FIG. 1 or the electronic device 30 of FIG. 3 including the display module 900 is at a low temperature with a high probability of damage to the display 901.
  • heat generated by the display driver IC 940 may be provided to the display 901 to control the temperature of the display 901 to be maintained within a predetermined range. For example, due to heat emitted from the display driver IC 940, the temperature of the display 901 may not fall below the lower limit threshold, or the temperature reduction rate of the display 901 may not rise above the reference value.
  • heat dissipated from the display driver IC 940 displays the display ( 901) can decrease the rate of decrease in temperature per unit time.
  • the power consumption of the display driver IC 940 may be more affected by the pattern of image data than the luminance of the display 901. For example, when a black-and-white image is created by 1 by 1 pixel and inverted per second, power consumption of the display driver IC 940 (eg, current consumption of about 70 mA) can be maximized, and the display driver IC 940 Can dissipate heat of about 40 to 50°C.
  • the display driver IC 940 may display an image in which the panel maintains the lowest luminance (2 nits) in a folded state and inverts a black and white image in which a single 1by1 pixel flashing is repeated. By reproducing the black and white image in an inverted image, the user may not recognize it, and the display driver IC 940 may maximize the amount of current consumption and use it as a heat source.
  • FIG. 10 illustrates a part of an electronic device according to an embodiment.
  • the electronic device 1000 (eg, the electronic device 101 of FIG. 1 or the electronic device 30 of FIG. 3) is a display 1010 (eg, the display of FIG. 3 ( 400)) and at least one component 1020 capable of dissipating heat (eg, the processor 120 of FIG. 1 ). Heat dissipated from at least one component 1020 may be transferred to the display 1010.
  • the electronic device 1000 provides the display 1010 with heat emitted by at least one component 1020 at a low temperature at which the display 1010 is likely to be damaged, and the temperature of the display 1010 It can be controlled to maintain within a certain range.
  • the temperature of the display 1010 may not fall below the lower limit threshold, or the temperature reduction rate of the display 1010 may not rise above the reference value.
  • the display 1010 degrades from a temperature above an upper threshold (eg, a temperature that is a reference to cause material deformation of the display 1010), heat dissipated from at least one component 1020 is displayed. The rate of decrease in temperature per unit time of 1010 can be reduced.
  • one or more heat exchangers may be disposed between the display 1010 and the at least one component 1020.
  • the electronic device 1000 Includes a first heat pipe (or a thermal spreader 1021) connected to at least one component 1020 to diffuse or dissipate heat dissipated from at least one component 1020.
  • the electronic device 1000 may include a second heat pipe 1031 connected to the display 1010 and a heat switch between the first heat pipe 1021 and the second heat pipe 1031 ( heat switch) 1030.
  • the heat switch 1030 can be controlled.
  • the heat switch 1030 (for example, a Peltier device or a Thermoelectric module) utilizes a Peltier effect between the first heat pipe 1021 and the second heat pipe 1031 according to the current direction.
  • heat flux heat flux
  • heat flow heat flow
  • the second heat pipe 1031 may be connected using an element such as a bolt and a thermally conductive member (eg, a metal plate) 1015 coupled to the display 1010. Heat from the second heat pipe 1031 may be transferred to the heat conducting layer 1014 (eg, graphite sheet) disposed on the rear surface of the display 1010 through the thermally conductive member 1015. Heat may be diffused in display 1010 by heat conducting layer 1014.
  • a thermally conductive member eg, a metal plate
  • FIG 11 illustrates an electronic device according to an embodiment.
  • the electronic device 1100 includes a display 1101, a processor 1120, a coprocessor 1125, a power management module 1130, and a display driver IC 1140 (eg, the display driver IC of FIG. 2) (230)) or a temperature control IC (Thermal controllable IC) 1150.
  • the display 1101 is a flexible or foldable display, and may include, for example, the display 400 of FIG. 3.
  • the display 1101 includes a folding area 1113 (eg, the folding area 403 in FIG. 3) and a first area 1111 disposed on both sides based on the folding area 1113 (eg, the first area in FIG. 3) (401)) and the second region 1112 (eg, the second region 402 of FIG. 3).
  • the processor 1120 may be set to maintain within a predetermined temperature range of the display 1101.
  • the processor 1120 may generate heat by driving at least one component capable of dissipating heat for providing to the display 1410.
  • the at least one component capable of dissipating heat may be at least one of the heating plates 1114 and 1115, the display driver IC 1140, or the processor 1120.
  • the processor 1120 when the temperature of the display 1101 falls below a predetermined temperature, collapses or expands a set area (eg, a folding area 1113) of the display 1101 to a set area. Stress can be concentrated.
  • the electronic device 1100 may be kept in a locked state to prevent the display 1101 from being folded or unfolded below a certain temperature.
  • the processor 1120 may receive signals from the physical button 1171 and the motion sensor 1172.
  • the physical button 1171 may switch the electronic device 1100 from the locked state to the unlocked state, or from the unlocked state to the locked state.
  • the motion sensor 1172 may include at least one of a gyro sensor, a gesture sensor, a pressure sensor, a grip sensor, a proximity sensor, an IR sensor, a bio sensor, a temperature sensor, a humidity sensor, or an illuminance sensor.
  • the processor 1120 may control the temperature of the display 1101 based on information about the user's state, or may control the locked or unlocked state of the display 1101. For example, based on the information detected by the motion sensor 1172, the processor 1120 determines that the user wants to use the display, and if the detected temperature of the display 1101 is lower than the threshold, the display The heater 1101 may be heated, and a warning about folding or unfolding of the electronic device 1100 may be displayed.
  • the coprocessor 1125 may operate independently or together with the processor 1120.
  • the coprocessor 1125 may consume less power than the processor 1120.
  • the coprocessor 1125 may be implemented separately or as part of the processor 1120.
  • the coprocessor 1125 may be electrically connected to the processor 1120, the display driver IC 1140, and the temperature control IC 1150.
  • the coprocessor 1125 detects the temperature of the display 1101 through the temperature control IC 1150 instead of the processor 1120 while the processor 1120 is in the sleep state, or the heating plate
  • the temperature of the display 1101 may be controlled through (1114, 1115).
  • the coprocessor 1125 wakes up the processor 1120 if the display 1101 temperature is lower than a specified temperature when the processor 1120 is in a sleep state, so that the processor 1120 increases the temperature of the display 1101. Can be controlled.
  • the coprocessor 1125 when the processor 1120 is in a sleep state, the coprocessor 1125 maintains the processor 1120 in a sleep state when the display 1101 temperature is lower than a specified temperature, and the display driver IC 1140 ) Or the temperature of the display 1101 may be controlled through the temperature control IC 1150.
  • the coprocessor 1125 drives the display driver IC 1140 to use heat generated by the display driver IC 1140.
  • the temperature of the display 1101 can be controlled.
  • the coprocessor 1125 may transmit a signal to the temperature control IC 1150 to drive the heating plate to control the temperature of the display 1101.
  • the coprocessor 1125 displays the display driver IC 1140 and the temperature control IC ( 1150) can be controlled to simultaneously perform the above-described operation.
  • the power management IC 1130 may manage power supplied to elements of the electronic device 1100.
  • the power management IC 1130 may distribute or amplify power to elements of the electronic device 1100.
  • the power management IC 1130 may be implemented, for example, as at least a part of the PMIC.
  • the temperature control IC 1150 generates heat included in the heat generating modules 1114 and 1115 under the control of the processor 1120 (eg, the processor 120 of FIG. 1) or the auxiliary processor 1125. It is possible to provide current to the plate.
  • the temperature control IC 1150 may obtain data regarding the temperature of the display 1101 detected by the temperature sensors included in the heat generating modules 1114 and 1115 and provide the data to the processor 1120.
  • the temperature control IC 1150 may be electrically or signally connected to the bridge FPCB 1160, and controls the separated first heating module 1114 and the second heating module 1115 through the bridge FPCB 1160. And, it is possible to detect the temperature of the display 1101.
  • the temperature control IC 1150 may generate heat by supplying current to the heat generating modules 1114 and 1115 and control the temperature of the display 1101.
  • the processor 1120 of the (eg, the electronic device 101 of FIG. 1 or the electronic device 30 of FIG. 3) 1100 is based on the temperature of the display 1101, and the display 1101 ), the display driver IC 1140 may be controlled to output light through the entire area of the display 1101 so as not to reach a low temperature with a high probability of damage.
  • the current consumption may be about 100 mA.
  • the electronic device 1100 (eg, the electronic device 101 of FIG. 1 or the electronic device 30 of FIG. 3) has a display 1101 with the display 1101 folded (see FIG. 4 ). ), the heat emitted from the entire area of the display 1101 including the folding area 1113 may be controlled so that the temperature does not fall below the lower limit threshold.
  • an electronic device including the display module 1100 includes a display 1101 including a folding area 1113 so that the temperature decrease rate of the display 1101 does not rise above a reference value when the display 1101 is folded. ) It is possible to control the heat emitted from the whole area. For example, when the display 1101 degrades from a temperature greater than an upper threshold (eg, a temperature that is a reference to cause material deformation of the display 1101), the display 1101 includes the folding area 1113. The heat dissipated may lower the rate of temperature reduction per unit time of the display 1101.
  • an upper threshold eg, a temperature that is a reference to cause material deformation of the display 1101
  • an electronic device eg, the electronic device 30 of FIG. 3 including the display module 1100 is folded (see FIG. 4) through a set area (eg, a folding area 1113 ).
  • a set area eg, a folding area 1113
  • the light output through the area set in the folded state may be implemented in various patterns or colors, and thus a mode in which the electronic device is running through light leaking to the outside (eg, the display 1101) may be damaged.
  • the mode in which the temperature of the display 1101 is kept constant so as not to reach a high low temperature) may be implemented to be recognized by the user.
  • 12A is a view illustrating an unfolded state of a display module according to an embodiment.
  • 12B is a view illustrating a folded state of a display module according to an embodiment.
  • 12C illustrates an unfolded state of a display module according to various embodiments of the present disclosure.
  • the display module 1200 may include a display 1210 and one or more heating modules 1220 and 1230.
  • the display 1210 is a flexible or foldable display, and may include, for example, the display 400 of FIG. 3.
  • the display 1210 includes a folding area 1213 (eg, the folding area 403 of FIG. 3) and a first area 1211 disposed on both sides based on the folding area 613 (eg, the first area of FIG. 3) (401)) and the second region 1212 (eg, the second region 402 of FIG. 3).
  • the first region 1211 and the second region 1212 may be disposed to face each other, and the folding region 1213 may be disposed in a curved shape.
  • the first region 1211 and the second region 1212 may face each other, forming an angle between about 0 degrees and 10 degrees.
  • the display 1210 includes a front 1210a in which light output from a plurality of light emitting elements (eg, organic light emitting diodes (OLEDs)) is emitted to the outside, and the front 1210a is opposite. It may include a rear surface (1210b) disposed on the side. According to an embodiment, one or more heating modules 1220 and 1230 may be disposed on the rear surface 1210b of the display 1210.
  • a plurality of light emitting elements eg, organic light emitting diodes (OLEDs)
  • OLEDs organic light emitting diodes
  • the one or more heating modules 1220 and 1230 may include a first heating module 1220 disposed along at least a portion of the first area 1211 of the display 1210 and a display 1210.
  • a second heating module 1230 disposed along at least a portion of the second region 1212 may be included.
  • the first heating module 1220 may include a first heating plate (not shown) disposed along at least a portion of the first area 1211, and the second heating module 1220 may be configured to It may include a second heating plate (not shown) disposed along at least a portion of the two areas 1212.
  • the first heating plate and/or the second heating plate may include a resistance component, and when a current is provided, a portion of the current may be converted into heat energy and dissipated by the resistance component.
  • the first heating plate and/or the second heating plate may be referred to as heaters or radiators.
  • the first heating module 1220 may include a first temperature sensor (not shown) disposed along at least a portion of the first heating plate or the first region 1211.
  • the first temperature sensor may detect the temperature of the first area 1211 of the display 1210.
  • the second heating module 1230 may include a second temperature sensor (not shown) disposed along at least a portion of the first heating plate or the second region 1212. The second temperature sensor may detect the temperature of the second area 1212 of the display 1210.
  • the first temperature sensor and/or the second temperature sensor is a component for converting temperature into electrical property values, for example, a thermistor, resistance thermometer, thermoelectric pair ( thermoelectric couple), a silicon transducer or a critical temperature resistor (CTR).
  • the first temperature sensor or the second temperature sensor may be implemented as various other temperature detection elements.
  • the probability of damage to the display 1210 when the display 1210 is expanded or folded may be high.
  • the temperature reduction rate per unit time (eg, °C/min) of the display 1210 is greater than a reference value
  • the probability of damage to the display 1210 when the display 1210 is expanded or folded may be high.
  • the display 1210 degrades from a temperature greater than an upper threshold (eg, a temperature that is a reference for causing material deformation of the display 1210) to a rate of decrease in temperature per unit time greater than the reference value
  • the display 1210 When unfolding or folding, the probability of damage to the display 1210 may be high.
  • the display 1210 when the display 1210 is in a temperature condition with high probability of damage, when the display 1210 is unfolded or folded, the first position 1201 of the first area 1211 adjacent to the folding area 1213 ) And at least a portion of the area 1203 between the folding area 1213 and the second position 1202 of the adjacent second area 1212 may be more likely to break.
  • an electronic device eg, the electronic device 101 of FIG. 1 or the electronic device 30 of FIG. 3 including the display module 600 includes a first temperature sensor and/or a second temperature sensor Based on the temperature of the display 1210 obtained from, the first heating module 1220 and/or the second heating module 1230 radiate to prevent the display 1210 from reaching a low temperature with high probability of damage. Heat can be controlled. Heat dissipated from the first heating module 1220 and/or the second heating module 1230 may be transferred to the display 1210 and diffused in the display 1210.
  • the display module 1200 may include a heat conductive layer (or heat conductive sheet) 1214 disposed on the rear surface 1210b of the display 1210. Heat dissipated from the first heating module 1220 and/or the second heating module 1230 may be diffused in the display 1210 through the heat conducting layer 1214.
  • the heat conducting layer 1214 may include various heat conducting materials such as graphite.
  • the display module 1200 may include a thermal conductive material (eg, thermal interfacing material (TIM)) disposed between the first heating module 1220 (or the second heating module 1230) (not shown) Poems).
  • the thermally conductive material may increase a thermal conductivity by increasing a contact area related to thermal conduction between the display 1210 and the first heating module 1220 (or the second heating module 1230 ).
  • the thermally conductive material is an adhesive material (eg, pressure sensitive adhesive (PSA)) for bonding between the display 1210 and the first heating module 1220 (or the second heating module 1230) ).
  • PSA pressure sensitive adhesive
  • the position or number of the heating module may be formed differently without being limited to the example shown in FIGS. 12A or 12B.
  • one of the first heating module 1220 and the second heating module 1230 may be omitted.
  • the heating module 1240 includes the first position 1201 and the folding area 1213 of the first area 1211 adjacent to the folding area 1213. ) And a second position 1202 of the second area 1212 adjacent to the area 1203.
  • the heating module 1240 may be arranged along at least a portion of the folding area 1213.
  • the heating module 1240 may be formed of a flexible material.
  • 13A is a cross-sectional view of an unfolded state of a display module according to an embodiment.
  • 13B is a cross-sectional view of a folded state of a display module according to an embodiment.
  • 13C and 13D are cross-sectional views illustrating an unfolded state of a display module according to various embodiments of the present disclosure.
  • the display module 1300 includes a display 1310, a heat conducting layer 1311, a first heating module 1320, a second heating module 1330, and a first column At least one of the conductive member 1321 or the second thermal conductive member 1322 may be included.
  • the display 1310 includes a front 1310a in which light output from a plurality of light emitting elements (eg OLEDs) is emitted to the outside, and a rear surface 1310b disposed on the opposite side to the front 1310a. ).
  • the display 1310 is a flexible or foldable display, and includes a folding area 1313 (eg, the folding area 403 in FIG. 3) and a first area 1311 disposed on both sides based on the folding area 1313 (eg : The first region 401 of FIG. 3 and the second region 1312 (eg, the second region 402 of FIG. 3) may be included.
  • the heat conductive layer 1311 (eg, graphite sheet) may be disposed on the rear surface 1310b of the display 1310.
  • the first heat-conducting member 1321 is disposed between the heat-conducting layer 1311 and the first heat-generating module 1320 and may include an adhesive material (eg, PSA).
  • the second heat-conducting member 1331 is disposed between the heat-conducting layer 1311 and the second heat-generating module 1330 and may include an adhesive material (eg, PSA).
  • the first heating module 1320 in the unfolded state (see FIG. 13A ), may include a first portion 1320a overlapping a first region 1311 of the display 1310 and a display 1310. A second portion 1320b overlapping the folding area 1313 may be included.
  • the second heating module 1330 in the unfolded state (see FIG. 13A ), includes a first portion 1330a overlapping the first region 1311 of the display 1310 and a folding region 1313 of the display 1310. The overlapping second portion 1330b may be included.
  • the first heat-conducting member 1321 may be disposed between the first portion 1320a of the first heat-generating module 1320 and the heat-conducting layer 1311.
  • the second heat-lowering member 1331 may be disposed between the first portion 1330a of the second heating module 1330 and the heat-conducting layer 1311.
  • the second portion 1320b of the first heating module 1320 may be disposed with a space spaced apart from the heat conductive layer 1311.
  • the second portion 1330b of the second heating module 1330 may be disposed with a space spaced apart from the heat conductive layer 1311.
  • heat is prevented through the first heating module 1320 and/or the second heating module 1330 to prevent the display 1310 from reaching a low temperature with high probability of damage and to maintain a constant temperature.
  • the heat dissipated from the first heating module 1320 may be transferred to the heat conducting layer 1311 through the first heat conducting member 1321.
  • the heat dissipated from the second heating module 1330 may be transferred to the heat conducting layer 1311 through the second heat conducting member 1331.
  • the heat to be transferred from the first heating module 1320 and/or the second heating module 1330 to the heat conducting layer 1311 may be diffused in the display 1310 by the heat conducting layer 1311.
  • the display module 1300c compares with the display module 1300a of FIG. 13A along a thermally conductive layer 1311 along at least a portion of the folding area 1313 of the display 1310.
  • May further include a flexible heat conducting member 1340 eg, a graphite sheet.
  • the flexible heat-conducting member 1340 can help the heat dissipated from the first heating module 1320 and/or the second heating module 1330 diffuse into the folding area 1313 of the display 1310.
  • the display module 1300d is compared with the display module 1300a of FIG. 13A, and a first column disposed in the second portion 1320b of the first heating module 1320
  • a layout view of the conductive member 1351 and the second portion 1330b of the second heating module 1330 may further include a first thermal conductive member 1352.
  • the first heat-conducting member 1351 and/or the second heat-conducting member 1352 may have heat dissipated from the first heat-generating module 1320 and/or the second heat-generating module 1330 in the folding area of the display 1310. You can help spread to (1313).
  • the electronic device 1400 (eg, the electronic device 101 of FIG. 1 or the electronic device 30 of FIG. 3) includes a display 1410, a display driver IC 1411, Heat generation module 1420, temperature control IC (Thermal controllable IC) 1421, power management IC 1430, at least one sensor 1440, memory 1450, wireless communication module 1460 or processor 1470 It may include at least one.
  • the display 1410 is a flexible or foldable display, for example, the display 400 of FIG. 3, the display 650 of FIG. 6, the display 801 of FIG. 8, and the display of FIG. 9 901, the display 1010 of FIG. 10, the display 1101 of FIG. 11, the display 1210 of FIG. 12A, or the display 1310 of FIG. 13A.
  • the display driver IC 1411 since the display driver IC 1411 is substantially the same as the display driver IC 230 of FIG. 2, detailed description thereof will be omitted. According to various embodiments, the display driver IC 1411 may include the display driver IC 840 of FIG. 8, the display driver IC 940 of FIG. 9, or the display driver IC 1140 of FIG. 11.
  • the heating module 1420 may include a heating plate disposed along at least a portion of the rear surface of the display 1410. It can contain.
  • the heating plate may dissipate heat using current provided from the temperature control IC 1421.
  • the heating module 1420 may be replaced with a display driver IC 1411 or a processor 1470 that generates heat according to use among electronic components constituting the electronic device 1400.
  • the heating module 1420 may include a temperature sensor for converting the temperature of the display 1410 to an electrical characteristic value.
  • the temperature sensor can include at least one of a thermistor, resistance thermometer, thermocouple, silicon transducer, or CTR.
  • the temperature control IC 1421 may provide current to the heating plate included in the heating module 1420 under the control of the processor 1470 (eg, the processor 120 of FIG. 1 ). .
  • the temperature control IC 1421 may acquire data regarding the temperature of the display 1410 detected by the temperature sensor included in the heating module 1430 and provide it to the processor 1470.
  • the power management IC 1430 may manage power supplied to elements of the electronic device 1400.
  • the power management IC 1430 may distribute or amplify power to elements of the electronic device 1400.
  • the power management IC 1430 may be implemented, for example, as at least a part of the PMIC.
  • the at least one sensor 1440 may acquire data regarding the unfolded state or the folded state of the electronic device 1400.
  • the at least one sensor 1440 may include a proximity sensor (eg, a proximity sensor disposed in the component placement area 314 of the first housing structure 310 in FIG. 3 ).
  • a proximity sensor eg, a proximity sensor disposed in the component placement area 314 of the first housing structure 310 in FIG. 3 .
  • the proximity sensor disposed in the first housing structure eg, the first housing structure 310 of FIG. 4
  • has a second housing structure eg, FIG. 4
  • the electrical signal related to the proximity of the second housing structure 320 may be output.
  • At least one sensor 144 may include a hall integrated circuit (IC).
  • the first housing structure eg, the first housing structure 310 of FIG. 3 includes a hall IC
  • the second housing structure eg, the second housing structure 320 of FIG. 3 is a magnet ( magnet).
  • the hall IC disposed in the first housing structure and the magnet disposed in the second housing structure are aligned, and the hall IC recognizes the magnet and outputs an electrical signal. can do.
  • the processor 1470 prevents the display 1410 from reaching a low-risk high-breakage temperature and maintains the temperature of the display 1410 according to instructions stored in the memory 1450. You can enter constant temperature mode.
  • the processor 1470 may include at least one component capable of dissipating heat for providing heat to the display 1410 in a constant temperature mode (eg, a heating module 1420, a panel (eg, a panel 830 in FIG. 8)), and/or Alternatively, the display driver IC 1411 may be operated to dissipate heat.
  • the processor 1470 may determine whether to enter the constant temperature mode of the display 1410 based on data acquired from the at least one sensor 1440. For example, the processor 1470 is based on data regarding an operating state (eg, power or temperature) of the electronic device 1400 acquired from at least one sensor 1440 (eg, power or temperature), or an external environmental state (eg, user state). Can enter into constant temperature mode.
  • the at least one sensor 1440 may include a gesture sensor, a gyro sensor, a barometric pressure sensor, a magnetic sensor, an acceleration sensor, a grip sensor, a proximity sensor, a color sensor, an IR sensor, a bio sensor, a temperature sensor, a humidity sensor, or an illuminance sensor Can be.
  • the processor 1470 may be an external electronic device (eg, the electronic device 102 or 104 of FIG. 1) or a server through the wireless communication module 1460 (eg, the wireless communication module 192 of FIG. 1 ). It is also possible to determine whether to enter the constant temperature mode of the display 1410 based on information (eg, weather information, season information) obtained from the server 108 (eg, the server 108 of FIG. 1 ).
  • information eg, weather information, season information
  • the memory 1450 may store an instruction for the processor 1470 to detect the temperature of the display 1410.
  • the processor 1470 may detect the temperature of the display 1410 through at least one sensor (eg, a sensor 1440 or a temperature sensor included in the heating module 1420).
  • the processor 1470 may acquire data regarding the temperature of the display 1410 through the display driver IC 1411.
  • the memory 1450 may store an instruction to cause the processor 1470 to control heating of the display 1410 based on the temperature of the display 1410.
  • the processor 1470 in the constant temperature mode, at least one component (eg, the heating module 1420), a panel (eg, the panel of FIG. 8) so that the temperature of the display 1410 does not fall below the lower limit threshold. (830)), the display driver IC (1411)) can control the heat emitted.
  • the processor 1470 in the constant temperature mode, the processor 1470 may control heat generated by at least one component so that the rate of decrease in temperature per unit time of the display 1410 does not rise above a reference value. Heat dissipated from at least one component may be transferred to the display 1410 and diffused in the display 1410.
  • FIG. 15 is an operation flowchart 1500 of the electronic device of FIG. 14 according to an embodiment.
  • the processor 1470 may detect the temperature of the display 1410. For example, the processor 1470 may acquire data regarding the temperature of the display 1410 from at least one sensor 1440, a temperature sensor included in the heating module 1420, or a display driver IC 1411. have.
  • the processor 1470 may enter a constant temperature mode for the display 1410.
  • the constant temperature mode may be referred to as a mode that heats the display 1410 to prevent the display 1410 from reaching a low temperature with high probability of breakage and maintain the temperature of the display 1410 within a certain range, for example. have.
  • the processor 1470 when entering the constant temperature mode, may also implement an activation routine to wake up the element for operation 1505 of FIG. 15.
  • the processor 1470 may output information on entering the constant temperature mode through various output devices (eg, the display 1410, LEDs, and speakers) of the electronic device 1400.
  • the processor 1470 may control heating of the display 1410 based on the temperature of the display 1410. For example, the processor 1470 may control heat generated by at least one component that generates heat for providing the display 1410. The heat emitted by the at least one component may heat the display 1410.
  • the processor 1470 may include a main processor (eg, the main processor 121 of FIG. 1) and a coprocessor (eg, the coprocessor 123 of FIG. 1 ).
  • the coprocessor may wake up the main processor.
  • the main processor may control heat generated by at least one component that generates heat for providing the display 141. The heat dissipated by the at least one component can heat the display 1410.
  • At least one component that dissipates heat includes: a heating module 1420, a display driver IC 1411, a panel of the display 1410 (eg, the panel 830 of FIG. 8) or a processor 1470 ). Due to heat emitted from at least one component, the temperature of the display 110 may not fall below the lower limit threshold, or the rate of decrease in temperature per unit time of the display 1410 may not rise above the reference value. For example, when the display 1410 degrades from a temperature greater than an upper threshold (eg, a temperature that is a reference to cause material deformation of the display 1410), heat dissipated from at least one component is displayed 1410 Can decrease the rate of temperature reduction per unit time.
  • an upper threshold eg, a temperature that is a reference to cause material deformation of the display 1410
  • 16 is a flowchart 1600 for an operation of entering a constant temperature mode in the operation flow of FIG. 15.
  • the processor 1470 may determine whether an input with a possibility of switching between an expanded state and a folded state of the electronic device 1400 occurs. According to an embodiment, the processor 1470 may detect an input having a possibility of switching between the expanded state and the folded state of the electronic device 1400 based on the data obtained from the at least one sensor 1440. For example, the processor 1470 may check a folded state of the electronic device 1400 and a user state carrying the folded electronic device 1400 from data from at least one sensor 1440, from which An input having a possibility of switching between the expanded state and the folded state of the electronic device 1400 may be detected.
  • the locking device that maintains the folded state of the electronic device 1400 is released, or the input is input through a specific input device (for example, the sub display 393 of FIG. 3) while the electronic device 1400 is folded.
  • the processor 1470 may detect an input with a possibility of switching between the expanded state and the folded state.
  • the processor 1470 may enter the constant temperature mode in operation 1603.
  • 17 is a flowchart 1700 for an operation of entering a constant temperature mode in the operation flow of FIG. 15.
  • the processor 1470 may determine whether the temperature of the display 1410 is greater than an upper limit threshold.
  • the processor 1470 may enter the constant temperature mode in operation 1703.
  • the upper threshold may be a temperature that is a reference for causing material relaxation of the display 1410.
  • the display 1410 having a temperature greater than the upper limit threshold may be in a state of being easily damaged under external low temperature conditions, and may enter a constant temperature mode.
  • FIG. 18 is a flow chart 1800 for the operation of controlling heating for the display in the operation flow of FIG. 15.
  • the processor 1470 may determine whether the temperature of the display 1410 is less than a lower limit threshold.
  • the processor 1470 may enter the constant temperature mode in operation 1803.
  • the display 1410 having a temperature lower than the lower limit threshold may be in a state of being easily damaged when the electronic device 1400 is unfolded or folded, and may require a constant temperature mode.
  • 19 is a flow chart 1900 for the operation of controlling heating to the display in the operation flow of FIG. 15.
  • the processor 1470 may determine whether the temperature of the display 1410 is reduced.
  • the processor 1470 may determine whether the rate of decrease in temperature per unit time of the display 1410 is greater than a reference value in operation 1903.
  • the processor 1470 may heat the display 1410 in operation 1905.
  • the processor 1470 may control heat generated by at least one component that generates heat for providing the display 1410.
  • the heat emitted by the at least one component may heat the display 1410.
  • At least one component that dissipates heat may include a heating module 1420, a display driver IC 1411, a panel of the display 1410 (eg, the panel 830 of FIG. 8) or a processor 1470. .
  • FIG. 20 is a flow chart 2000 of operations for controlling heating to a display in the operation flow of FIG. 15.
  • the processor 1470 may determine whether the temperature of the display 1410 is greater than an upper limit threshold.
  • the processor 1470 may wait for heating of the display 1410 in operation 2003.
  • the processor 1470 may wake up at least one component that dissipates heat for providing to the display 1410.
  • the upper limit threshold value may be a temperature that is a reference for causing material relaxation of the display 1410.
  • the display 1410 having a temperature greater than the upper limit threshold may be in a state of being easily damaged under external low temperature conditions, and may require heating of the display 1410.
  • the processor 1470 may determine whether the temperature of the display 1410 is reduced.
  • the processor 1470 may determine whether the rate of decrease in temperature per unit time of the display 1410 is greater than a reference value in operation 2007.
  • the processor 1470 may heat the display 1410 in operation 2009. According to an embodiment of the present disclosure, if the temperature reduction rate per unit time of the display 1410 is greater than a reference value, the electronic device 1400 may be easily damaged when it is opened or folded, and heating of the display 1410 may be required. have.
  • the processor 1470 may control heat generated by at least one component that generates heat for providing the display 1410. The heat emitted by the at least one component may heat the display 1410. At least one component that dissipates heat may include a heating module 1420, a display driver IC 1411, a panel of the display 1410 (eg, the panel 830 of FIG. 8) or a processor 1470. .
  • the processor 1470 determines whether the temperature of the display 1410 is lower than the lower limit threshold in operation 2011. Can be. According to an embodiment, when the temperature of the display 1410 is smaller than the lower limit threshold, the processor 1470 may heat the display 1410 in operation 2013. According to an embodiment of the present disclosure, the display 1410 having a temperature lower than the lower limit threshold may be easily damaged when the electronic device 1400 is unfolded or folded, and may require heating. In operation 2013, it is emitted from at least one component (e.g., heating module 1420, display driver IC 1411), panel of display 1410 (e.g., panel 830 of FIG. 8) or processor 1470. Heat may be transferred to the display 1410.
  • 21 is an operation flowchart 2100 of the electronic device of FIG. 14 according to an embodiment.
  • the processor 1470 may enter a constant temperature mode.
  • the constant temperature mode may be referred to as a mode in which the display 1410 is heated, for example, to prevent the display 1410 from reaching a low temperature with a high probability of breakage and to maintain a constant temperature.
  • the processor 1470 may determine whether the remaining amount of the battery (eg, the battery 189 of FIG. 1) is lower than a threshold.
  • the processor 1470 may select and control the first heating component in operation 2105. Heat dissipated from the first heating component may be transferred to the display 1410.
  • the processor 1470 may select and control the second heating component having higher power consumption than the first heating component in operation 2107. Heat dissipated from the second heating component may be transferred to the display 1410.
  • the maximum current consumption of the display driver IC 1411 may be about 70 mA
  • the maximum current consumption of the display 1410 may be about 100 mA
  • the maximum current consumption of the processor 1470 may be about 300 mA.
  • the exothermic temperature can be proportional to the current consumption.
  • the second heating component may be the display 1410 or the processor 1470.
  • the first heating component is the display 1410
  • the second heating component may be the processor 1470.
  • operations 2103, 2105, and 2107 in the operation flow of FIG. 21 may be added to the operation flow of FIG. 15.
  • FIG. 22 is an operation flowchart 2200 of the electronic device of FIG. 14 according to various embodiments of the present disclosure.
  • the main processor (the main processor 121 of FIG. 1) among the processors 1470 may enter an idle state.
  • the coprocessor (coprocessor 123 of FIG. 1) manages the temperature control IC 1421 and can process information obtained from the sensor 1440 and the heating module 1420. .
  • the coprocessor may detect the temperature of the display 1410. For example, the coprocessor may acquire data regarding the temperature of the display 1410 from the at least one sensor 1440, the temperature sensor included in the heating module 1420, or the display driver IC 1411.
  • the coprocessor may switch the main processor to the active state when the temperature of the display 1410 is less than a specified value based on the acquired data about the temperature of the display 1410. have.
  • the main processor may control heating of the display 1410 based on the temperature of the display 1410.
  • the main processor may control heat generated by at least one component that generates heat for providing to the display 1410.
  • the heat emitted by the at least one component may heat the display 1410.
  • At least one component that dissipates heat includes: a heating module 1420, a display driver IC 1411, a panel of the display 1410 (eg, the panel 830 of FIG. 8) or a processor 1470 ). Due to heat emitted from at least one component, the temperature of the display 110 may not fall below the lower limit threshold, or the rate of decrease in temperature per unit time of the display 1410 may not rise above the reference value. For example, when the display 1410 degrades from a temperature greater than an upper threshold (eg, a temperature that is a reference to cause material deformation of the display 1410), heat dissipated from at least one component is displayed 1410 Can decrease the rate of temperature reduction per unit time.
  • an upper threshold eg, a temperature that is a reference to cause material deformation of the display 1410
  • FIG. 23 is a flow chart 2300 of the operation of controlling heating for the display in the operation flow of FIG. 15.
  • the processor 1470 may maintain a constant temperature mode to maintain the temperature of the display 1401 constant.
  • the processor 1470 controls to operate 2305 when the remaining battery level is lower than the specified second threshold value, and when the remaining battery level is higher than the designated second threshold value, operation 2301 It can be kept in constant temperature mode.
  • the processor 1470 may display a warning message on the external display 1415 that the electronic device 1400 cannot be deployed, and the physical button ( For example, by controlling the physical button 1171 of FIG. 11, the electronic device 1400 may be kept in a locked state that cannot be expanded.
  • the processor 1470 may display a warning phrase on the display 1410 that the electronic device 1400 cannot be folded, and control the physical button 1171 to control the electronic device 1400. Can be locked in a non-foldable state.
  • An electronic device includes a foldable housing, a hinge structure, a first surface connected to the hinge structure, and a first surface facing in a first direction, a second surface facing in a second direction opposite to the first direction, and A first housing structure including a first side member that at least partially surrounds a space between the first surface and the second surface, a third surface connected to the hinge structure, facing in a third direction, and the third direction A fourth side facing in the opposite fourth direction, and a second side member surrounding at least a part of the space between the third side and the fourth side, and folding with the first housing structure around the hinge structure
  • a foldable housing comprising a second housing structure, the first surface facing the third surface in a folded state, and the third direction being the same as the first direction in the unfolded state, the first A flexible display extending from one side to the third side, at least one component capable of dissipating heat transferred to the flexible display, a sensor detecting a temperature of the flexible display, and a processor, wherein the processor
  • the at least one component may include a heating plate disposed along at least a portion of the flexible display.
  • a thermal conductive layer disposed on the rear surface of the flexible display may be included.
  • the senor may be disposed on the rear surface of the flexible display together with the heating plate.
  • the flexible display includes a folding area, a first area disposed on one side based on the folding area, and a second area disposed on the other side, and the heating plate is disposed in the first area It may include a first heating plate and a second heating plate disposed in the second region.
  • the heating plate may be disposed in a folding area of the flexible display.
  • the processor may control heat generated by the at least one component when the temperature detected by the sensor is reduced from a temperature greater than a threshold value.
  • the threshold may be a temperature related to material relaxation of the flexible display.
  • the processor may control heat generated by the at least one component.
  • the processor may control heat generated by the at least one component.
  • the processor may control heat generated by the at least one component.
  • a heat transfer structure between the at least one component and the flexible display may be further included.
  • the at least one component may include at least one of a display driver integrated circuit (IC) or a processor.
  • IC display driver integrated circuit
  • the processor may selectively control the at least one component based on the remaining amount of the battery included in the electronic device.
  • the processor may consume current based on the temperature detected by the sensor without driving the at least one component. have.
  • An electronic device is a foldable housing, and includes a hinge structure, a first surface connected to the hinge structure, and a second surface facing in a second direction opposite to the first direction. It includes a first housing structure including, a third surface connected to the hinge structure, and facing in a third direction, and a fourth surface facing in a fourth direction opposite to the third direction, wherein the hinge structure is centered on the A first housing structure and a second housing structure, the first surface facing the third surface in a folded state, and the third direction being the same as the first direction in an unfolded state Foldable housing, first display extending from the first surface to the third surface to form the first surface and the third surface, at least one temperature sensor disposed in the first housing or the second housing, the first A housing or a processor disposed in the second housing, the at least one electronic component generating heat during operation, the temperature sensor, a processor operatively connected to the electronic component, and a memory operatively connected to the processor, the memory comprising: , At run time
  • the electronic device includes a display driving circuit disposed in the first housing or the second housing, the display includes a panel layer, and the at least one electronic component includes the display driving circuit. , At least one of the panel layer or the processor.
  • the processor checks whether the rate of temperature reduction per unit time of the flexible display is greater than a reference value, and the rate of temperature reduction per unit time is based on If it is greater than the value, it can be set to heat the flexible display.
  • the processor when the temperature reduction rate per unit time is less than or equal to the reference value, the processor is configured to heat the flexible display when the temperature of the flexible display is less than a second threshold value that is less than the first threshold value. Can be.
  • the first threshold may be a temperature related to material relaxation of the flexible display.

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  • Physics & Mathematics (AREA)
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  • General Engineering & Computer Science (AREA)
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  • Computer Hardware Design (AREA)
  • Mathematical Physics (AREA)
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Abstract

Selon un mode de réalisation, la présente invention concerne un dispositif électronique qui comprend : un boîtier pliable comprenant une structure de charnière, une première structure de boîtier et une seconde structure de boîtier, la première structure de boîtier étant reliée à la structure de charnière et comprenant une première surface faisant face à une première direction, une seconde surface faisant face à une seconde direction opposée à la première direction, et un premier élément de surface latérale pour entourer au moins une partie d'un espace entre la première surface et la seconde surface, la seconde structure de boîtier étant reliée à la structure de charnière et comprenant une troisième surface faisant face à une troisième direction, une quatrième surface faisant face à une quatrième direction opposée à la troisième direction, et un second élément de surface latérale pour entourer au moins une partie d'un espace entre la troisième surface et la quatrième surface, et étant pliée sur la première structure de boîtier en référence à la structure de charnière, la première surface faisant face à la troisième surface lorsque le boîtier pliable est dans un état plié, et la troisième direction étant identique à la première direction lorsque le boîtier pliable est dans un état déplié ; un écran souple s'étendant de la première surface à la troisième surface ; au moins un composant apte à rayonner de la chaleur transférée vers l'écran souple ; un capteur destiné à détecter la température de l'écran souple ; et un processeur apte à commander le ou les composants sur la base de la température détectée par le capteur. De plus, divers modes de réalisation sont également possibles.
PCT/KR2019/016515 2018-11-29 2019-11-27 Dispositif électronique comprenant un écran souple et son procédé de fonctionnement Ceased WO2020111793A1 (fr)

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WO2022119173A1 (fr) * 2020-12-04 2022-06-09 삼성전자 주식회사 Dispositif électronique comprenant un écran souple
KR20230011762A (ko) * 2021-07-14 2023-01-25 삼성전자주식회사 플렉서블 디스플레이를 포함하는 전자 장치 및 그의 동작 방법
EP4350477A4 (fr) 2021-09-08 2024-09-25 Samsung Electronics Co., Ltd. Appareil électronique de compensation de température et son procédé de fonctionnement
KR20230041348A (ko) * 2021-09-17 2023-03-24 삼성전자주식회사 온도를 관리하는 전자 장치 및 이의 동작 방법
KR20230054074A (ko) * 2021-10-15 2023-04-24 삼성전자주식회사 플렉서블 디스플레이를 구비한 전자 장치 및 플렉서블 디스플레이를 구비한 전자 장치에서 모터 구동 제어 방법
EP4376392A4 (fr) 2021-10-15 2024-11-13 Samsung Electronics Co., Ltd. Dispositif électronique ayant un afficheur flexible, et procédé par lequel un dispositif électronique ayant un afficheur flexible commande un entraînement de moteur
KR20230059923A (ko) * 2021-10-26 2023-05-04 삼성전자주식회사 플렉서블 디스플레이 모듈을 포함하는 전자 장치와 플렉서블 디스플레이 모듈의 손상을 감지하는 방법
CN118176534A (zh) 2021-10-26 2024-06-11 三星电子株式会社 包括柔性显示模块的电子装置和用于检测显示模块的损坏的方法
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