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WO2020111582A1 - Unité d'affichage transparent et ensemble verre le comprenant - Google Patents

Unité d'affichage transparent et ensemble verre le comprenant Download PDF

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Publication number
WO2020111582A1
WO2020111582A1 PCT/KR2019/015356 KR2019015356W WO2020111582A1 WO 2020111582 A1 WO2020111582 A1 WO 2020111582A1 KR 2019015356 W KR2019015356 W KR 2019015356W WO 2020111582 A1 WO2020111582 A1 WO 2020111582A1
Authority
WO
WIPO (PCT)
Prior art keywords
display unit
electrode layer
conductive adhesive
transparent display
anisotropically conductive
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Ceased
Application number
PCT/KR2019/015356
Other languages
English (en)
Inventor
Kangmin KIM
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Hankuk Glass Industries Inc
Original Assignee
Hankuk Glass Industries Inc
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Hankuk Glass Industries Inc filed Critical Hankuk Glass Industries Inc
Publication of WO2020111582A1 publication Critical patent/WO2020111582A1/fr
Anticipated expiration legal-status Critical
Ceased legal-status Critical Current

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Classifications

    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L25/00—Assemblies consisting of a plurality of semiconductor or other solid state devices
    • H01L25/03—Assemblies consisting of a plurality of semiconductor or other solid state devices all the devices being of a type provided for in a single subclass of subclasses H10B, H10D, H10F, H10H, H10K or H10N, e.g. assemblies of rectifier diodes
    • H01L25/04—Assemblies consisting of a plurality of semiconductor or other solid state devices all the devices being of a type provided for in a single subclass of subclasses H10B, H10D, H10F, H10H, H10K or H10N, e.g. assemblies of rectifier diodes the devices not having separate containers
    • H01L25/075—Assemblies consisting of a plurality of semiconductor or other solid state devices all the devices being of a type provided for in a single subclass of subclasses H10B, H10D, H10F, H10H, H10K or H10N, e.g. assemblies of rectifier diodes the devices not having separate containers the devices being of a type provided for in group H10H20/00
    • H01L25/0753—Assemblies consisting of a plurality of semiconductor or other solid state devices all the devices being of a type provided for in a single subclass of subclasses H10B, H10D, H10F, H10H, H10K or H10N, e.g. assemblies of rectifier diodes the devices not having separate containers the devices being of a type provided for in group H10H20/00 the devices being arranged next to each other
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10H—INORGANIC LIGHT-EMITTING SEMICONDUCTOR DEVICES HAVING POTENTIAL BARRIERS
    • H10H29/00—Integrated devices, or assemblies of multiple devices, comprising at least one light-emitting semiconductor element covered by group H10H20/00
    • H10H29/10—Integrated devices comprising at least one light-emitting semiconductor component covered by group H10H20/00
    • H10H29/14—Integrated devices comprising at least one light-emitting semiconductor component covered by group H10H20/00 comprising multiple light-emitting semiconductor components
    • H10H29/142—Two-dimensional arrangements, e.g. asymmetric LED layout
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/30—Assembling printed circuits with electric components, e.g. with resistor
    • H05K3/32—Assembling printed circuits with electric components, e.g. with resistor electrically connecting electric components or wires to printed circuits
    • H05K3/321—Assembling printed circuits with electric components, e.g. with resistor electrically connecting electric components or wires to printed circuits by conductive adhesives
    • H05K3/323—Assembling printed circuits with electric components, e.g. with resistor electrically connecting electric components or wires to printed circuits by conductive adhesives by applying an anisotropic conductive adhesive layer over an array of pads
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10D—INORGANIC ELECTRIC SEMICONDUCTOR DEVICES
    • H10D86/00—Integrated devices formed in or on insulating or conducting substrates, e.g. formed in silicon-on-insulator [SOI] substrates or on stainless steel or glass substrates
    • H10D86/40—Integrated devices formed in or on insulating or conducting substrates, e.g. formed in silicon-on-insulator [SOI] substrates or on stainless steel or glass substrates characterised by multiple TFTs
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10H—INORGANIC LIGHT-EMITTING SEMICONDUCTOR DEVICES HAVING POTENTIAL BARRIERS
    • H10H20/00—Individual inorganic light-emitting semiconductor devices having potential barriers, e.g. light-emitting diodes [LED]
    • H10H20/80—Constructional details
    • H10H20/83—Electrodes
    • H10H20/832—Electrodes characterised by their material
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10H—INORGANIC LIGHT-EMITTING SEMICONDUCTOR DEVICES HAVING POTENTIAL BARRIERS
    • H10H20/00—Individual inorganic light-emitting semiconductor devices having potential barriers, e.g. light-emitting diodes [LED]
    • H10H20/80—Constructional details
    • H10H20/85—Packages
    • H10H20/852—Encapsulations
    • H10H20/854—Encapsulations characterised by their material, e.g. epoxy or silicone resins
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K1/00—Printed circuits
    • H05K1/18—Printed circuits structurally associated with non-printed electric components
    • H05K1/189—Printed circuits structurally associated with non-printed electric components characterised by the use of a flexible or folded printed circuit
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
    • H05K2201/10—Details of components or other objects attached to or integrated in a printed circuit board
    • H05K2201/10007—Types of components
    • H05K2201/10128—Display
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10H—INORGANIC LIGHT-EMITTING SEMICONDUCTOR DEVICES HAVING POTENTIAL BARRIERS
    • H10H20/00—Individual inorganic light-emitting semiconductor devices having potential barriers, e.g. light-emitting diodes [LED]
    • H10H20/80—Constructional details
    • H10H20/85—Packages
    • H10H20/857—Interconnections, e.g. lead-frames, bond wires or solder balls

Definitions

  • a flexible printed circuit board for electrically connecting the electrode layer and the driver controller is formed at the edge portion of the electrode layer of the glass assembly.
  • the driving controller controls the driving of the LED to display a character or an image.
  • a transparent display unit and a glass assembly are provided.
  • a transparent display unit includes: a transparent substrate film; an edge electrode layer disposed on the upper surface of the transparent substrate film; an anisotropically conductive adhesive layer disposed on the edge electrode layer; and a flexible printed circuit board (FPCB) disposed on the anisotropically conductive adhesive layer and electrically connected to the edge electrode layer through the anisotropically conductive adhesive layer.
  • FPCB flexible printed circuit board
  • a driving controller controlling driving of the transparent display unit may be further included, and the flexible printed circuit board (FPCB) may electrically connect the edge electrode layer and the driving controller.
  • FPCB flexible printed circuit board
  • a ratio W/L of an entire width W of one or a plurality of flexible printed circuit board (FPCB) for the edge portion length L of the transparent substrate film may be 0.1 to 0.5.
  • the edge electrode layer may include a circuit pattern formed of one or more of a metal, a metallic nanowire, a transparent conductive oxide, a metal mesh, a carbon nanotube, and graphene.
  • the anisotropically conductive adhesive layer may include a resin and conductive particles dispersed in the resin.
  • the anisotropically conductive adhesive layer may have the thickness of 25 ⁇ m to 225 ⁇ m.
  • a glass assembly includes: a transparent substrate film; an edge electrode layer disposed on the upper surface of the transparent substrate film; an anisotropically conductive adhesive layer disposed on the edge electrode layer; a flexible printed circuit board (FPCB) disposed on the anisotropically conductive adhesive layer and electrically connected to the edge electrode layer through the anisotropically conductive adhesive layer; a first sealing member disposed on the flexible printed circuit board (FPCB); and a first glass sheet disposed on the first sealing member,
  • FPCB flexible printed circuit board
  • the first sealing member may include one or more among polyvinyl butyral (PVB), ethylene vinyl acetate (EVA), an ionoplast polymer, a cyclo olefin polymer (COP), and polyurethane.
  • PVB polyvinyl butyral
  • EVA ethylene vinyl acetate
  • COP cyclo olefin polymer
  • polyurethane polyurethane
  • the second sealing member may include one or more among polyvinyl butyral (PVB), ethylene vinyl acetate (EVA), an ionoplast polymer, a cyclo olefin polymer (COP), and polyurethane.
  • PVB polyvinyl butyral
  • EVA ethylene vinyl acetate
  • COP cyclo olefin polymer
  • polyurethane polyurethane
  • the transparent display unit and the glass assembly according to an exemplary embodiment of the present invention may display the characters or the images while maintaining the visual transparency. For this reason, the transparent display unit and the glass assembly according to the exemplary embodiment of the present invention are applied to an exterior window of a building or a windshield of a vehicle to provide desired information to a user while maintaining the cooling and heating effect of the room to be used for lighting, an advertising means, and the like.
  • FIG. 3 is a schematic cross-sectional view illustrating a cross-section (an a-b cross-section) of a transparent display unit according to an exemplary embodiment of the present invention.
  • FIG. 7 is a schematic cross-sectional view illustrating a plan surface of a transparent display unit according to an exemplary embodiment of the present invention.
  • FIG. 8 is a view schematically showing a cross-section of a glass assembly according to an exemplary embodiment of the present invention.
  • FIG. 9 is a photo of an edge electrode layer after estimating corrosion of Embodiment Example 1.
  • FIG. 10 is a photo of an edge electrode layer after estimating corrosion of Comparative Example 1.
  • first, second, and third are used herein to explain various parts, components, regions, layers, and/or sections, but it should be understood that they are not limited thereto. These terms are used only to discriminate one portion, component, region, layer, or section from another portion, component, region, layer, or section. Thus, a first portion, component, region, layer, or section may be referred to as a second portion, component, region, layer, or section without departing from the scope of the present invention.
  • the present inventors provide a glass assembly capable of displaying characters or images while maintaining a visual transparency by inserting a transparent display unit in which an LED is mounted on a transparent substrate film between glass sheets.
  • FIG. 1 represents a cross-section of a transparent display unit 100 according to an exemplary embodiment of the present invention.
  • the transparent display unit 100 includes a transparent substrate film 10, an electrode layer disposed on an upper surface of the transparent substrate film, and a plurality of light emitting diodes (LEDs) 21 mounted on the electrode layer.
  • LEDs light emitting diodes
  • the electrode layer is electrically connected to the driving controller 50 through a flexible printed circuit board (FPCB) 40 in the edge portion of the transparent substrate film 10.
  • FPCB flexible printed circuit board
  • An exemplary embodiment of the present invention relates to the edge portion (a dotted line circle).
  • the electrode layer includes an edge electrode layer 22 connected to the flexible printed circuit board (FPCB) 40 in the edge portion, and an inner electrode layer 23 to which the light emitting diode 21 is mounted.
  • FPCB flexible printed circuit board
  • FIG. 2 is a schematic cross-sectional view illustrating a transparent display unit 100 according to an exemplary embodiment of the present invention.
  • the transparent display unit 100 of FIG. 2 is merely for illustrating the present invention, and the present invention is not limited thereto. Thus, the transparent display unit 100 of FIG. 2 may be transformed into various forms.
  • FIG. 3 is a schematic cross-sectional view illustrating a cross-section (an a-b cross-section) of a transparent display unit 100 according to an exemplary embodiment of the present invention.
  • FIG. 4 is a schematic top plan view illustrating an anisotropically conductive adhesive layer 30 and a flexible printed circuit board (FPCB) 40 in a transparent display unit 100 according to an exemplary embodiment of the present invention.
  • FPCB flexible printed circuit board
  • the transparent display unit 100 includes the transparent substrate film 10, the edge electrode layer 22 disposed on the upper surface of the transparent substrate film 10, the anisotropically conductive adhesive layer 30 disposed on the edge electrode layer 22, and the flexible printed circuit board (FPCB) 40 disposed on the anisotropically conductive adhesive layer 30 and electrically connected to the edge electrode layer 22 through the anisotropically conductive adhesive layer 30.
  • FPCB flexible printed circuit board
  • the flexible printed circuit board (FPCB) 40 includes an electrode portion 41 and a resin layer 42, and the resin layer 42 extends from the edge portion of the anisotropically conductive adhesive layer 30 to be in contact with the edge electrode layer 22.
  • the resin layer 42 climbs the edge portion of the anisotropically conductive adhesive layer 30, and for example, extends by 1 mm or more, thereby preventing the anisotropically conductive adhesive layer 30 from climbing the resin layer 42 and being exposed outside.
  • the thickness of this transparent substrate film 10 is not particularly limited. However, if the thickness of the transparent substrate film 10 is very thin, during the bonding of a glass assembly 200, the transparent substrate film 10 may be deformed by a pressure applied to the LED side or a crack may be caused on the electrode layer part. On the other hand, if the thickness of the transparent substrate film is very thick, the crack may be generated in glass sheets 71 and 72 due to the stress. According to an exemplary embodiment, the thickness of the transparent substrate film 10 may be about 200 to 300 ⁇ m. In this case, since the above-described problem does not only occur but also the heat resistance is excellent, even if the transparent display unit 100 is exposed to the external light for a long time, thermal deformation of the transparent substrate film 10 may be prevented.
  • the electrode layer is a portion disposed on one surface of the transparent substrate film 10, and serves to drive the light emitting diodes (LED) 21.
  • the inner electrode layer 23 may include a circuit pattern formed of the electrode material selected from a group consisting of the silver nanowire (Ag nanowire), the copper mesh, and the silver mesh.
  • the line width and the thickness of the circuit pattern are not particularly limited. However, when the circuit pattern has a width of about 5 to 15 ⁇ m and a thickness of about 0.2 to 1 ⁇ m, the inner electrode layer 23 has sheet resistance of about 0.5 to 3 ⁇ /sq.
  • the inner electrode layer 23 may be formed through methods known in the art.
  • at least one circuit pattern may be formed by irradiating a laser or through a mask and etching process after the above-described electrode material is disposed on the transparent substrate film 10.
  • the circuit pattern made of the electrode material may be formed on the transparent substrate film 10 through an inkjet printing process.
  • the present invention is not limited thereto.
  • the light emitting diode 21 may be fixed onto the inner electrode layer 23 through mounting methods known in the art.
  • a pad (not shown) including a material having high electrical conductivity such as silver (Ag) may be formed in at least part among the inner electrode layer 23.
  • the light emitting diode 21 may be fixed on the pad by using a low temperature SMT (surface mount technology) process.
  • the light emitting diode 21 may be adhered to the pad through solder.
  • the anisotropically conductive adhesive layer 30 disposed on the electrode layer, and electrically connects the flexible printed circuit board (FPCB) 40 and the edge electrode layer 22.
  • the electrode portion 41 of the flexible printed circuit board (FPCB) 40 may be made of a conductive metal such as copper, tin plated copper, or nickel plated copper.
  • a conductive metal of a thin shape is preferable.
  • the first sealing member 61 disposed on the resin layer 42 also extends from the edge portion of the edge portion and resin layer 42 of the anisotropically conductive adhesive layer 30 to be in contact with the edge electrode layer 22.
  • the transparent substrate film 10, the edge electrode layer 22, the anisotropically conductive adhesive layer 30, and the flexible printed circuit board (FPCB) 40 described in the transparent display unit 100 are the same such that the repeated description is omitted.
  • the first sealing member 61 is a part disposed between the first glass sheet 71 and the transparent display unit 100 so that the first glass sheet 71 and the transparent display unit 100 are not separated from each other.
  • the first sealing member 61 also prevents moisture and outside air such as oxygen from penetrating the transparent display unit 100.
  • the first sealing member 61 may be disposed on the entire surface of the first glass sheet 71. Alternatively, although not shown, the first sealing member 61 may be disposed on the edge portion of the first glass sheet 71.
  • the first sealing member 61 is formed of an optically transparent polymer so that the external light may be incident without blocking the user's view.
  • the first sealing member 61 may include one or more among polyvinyl butyral (PVB), ethylene vinyl acetate (EVA), an ionoplast polymer, and polyurethane.
  • the first sealing member 61 is formed of a PVB resin.
  • the first sealing member 61 may not only seal the transparent display unit 100 on the first glass sheet 71, but also block ultraviolet rays (UV) by about 99 % or more while blocking the external air.
  • UV ultraviolet rays
  • the first glass sheet 71 is a plate member including a transparent polymer such as glass and/or polymethylmethacrylate (PMMA), polycarbonate (PC), and the like, and is colorless-transparent or colored-transparent.
  • the first glass sheet 71 may have light transmittance of about 85 % or more for visible rays.
  • the first glass sheet 71 may have a planar shape or a curved shape such as a bow, that is, a curved-surface shape.
  • a curved radius R may be about 0.2 to 0.3 m.
  • the second sealing member 62 and the second glass sheet 72 may be further included in the lower surface of the transparent substrate film 10, that is, the lower surface of the transparent display unit 100.
  • the second sealing member 62 is a portion disposed between the second glass sheet 72 and the transparent display unit 100, and prevents moisture and the outside air such as oxygen from penetrating into the transparent display unit 100.
  • the second sealing member 62 is formed of an optically transparent polymer so that the external light may be incident without blocking the user's view.
  • the second sealing member 62 may include one or more among polyvinyl butyral (PVB), ethylene vinyl acetate (EVA), an ionoplast polymer, and polyurethane.
  • the second sealing member 62 may be formed of the PVB resin.
  • the second sealing member 62 may not only seal the transparent display unit 100 on the second glass sheet 72, but may also block about 99 % or more of ultraviolet (UV) while locking out the external air.
  • UV ultraviolet
  • the second glass sheet 72 is a plate member including a transparent polymer such as glass and/or polymethylmethacrylate (PMMA), polycarbonate (PC), and the like, and is colorless-transparent or colored-transparent.
  • the second glass sheet 72 may have light transmittance of about 85 % or more for visible rays.
  • the second glass sheet 72 may have the same or different material, color, and/or light transmittance as the first glass sheet 71.
  • the second glass sheet 72 may have the planar shape or the curved shape such as a bow, that is, the curved-surface shape.
  • the curved radius R may be about 0.2 to 0.3 m.
  • the transparent display unit 100 is a part interposed between the first glass sheet 71 and the second glass sheet 72, and displays the images and the character information.
  • the transparent display unit 100 has a yellowness index (YI) value of 3.0 or less, the external light may not only be incident, but also the visual transparency of the glass assembly 200 is not deteriorated and thus the user's view is not blocked.
  • YI yellowness index
  • a plurality of transparent display units 100 may display one large image. That is, when a video signal is divided according to a predetermined screen division method in the LED driver, one large image is generated in a plurality of divided images, and then each divided image may be displayed through each corresponding transparent display unit 100.
  • the glass assembly 200 has light transmittance of about 70 to 80 % and light reflectance of about 8 to 15 % at a wavelength in the visible ray region (a wavelength of 400 to 700 nm). Particularly, when the glass assembly 200 according to the exemplary embodiment of the present invention has light transmittance of 70 % or more at the wavelength in the visible ray region and satisfies Equation 1 below, the visual field is not blocked by the electrode layer, perspective may be ensured inside or outside, and an appearance characteristic, electrical conductivity, and a visual transparency may also be improved.
  • the glass assembly 200 satisfies Equation 2 while having the light transmittance of 70 % or more at the wavelength of the visible ray region.
  • the glass assembly 200 since the glass assembly 200 has excellent electrical conductivity, the power consumption is low and the heat is low, and also the visual transparency is secured so that a character or an image can be displayed more clearly.
  • T represents the light transmittance (%) of the glass assembly in the wavelength of the visible ray region
  • R S represents the sheet resistance ( ⁇ /sq) of the electrode layer.
  • the flexible printed circuit board (FPCB) 40 includes the electrode portion 41 and the resin layer 42, and the resin layer 42 extends from the edge portion of the anisotropically conductive adhesive layer 30 to be in contact with the edge electrode layer 22, thereby preventing the corrosion of the edge electrode layer 22.
  • a corrosion rate may be 1 % or less.
  • the corrosion rate refers to a weight of the corroded edge electrode layer 22 with respect to the entire edge electrode layer 22 weight.
  • a circuit pattern (line width: 15 ⁇ m) is formed with a copper mesh through a mask and etching process to form an inner electrode layer (sheet resistance: about 1 ⁇ /sq).
  • the edge electrode layer forms the circuit pattern with the copper line.
  • a silver (Ag) solder on the electrode layer through screen printing, a plurality of LEDs (height: about 1mm) are mounted to each silver (Ag) solder by using a low temperature SMT (surface mount technology).
  • the anisotropically conductive adhesive layer (RA3351, manufactured by H&S company) is formed at the edge portion of the electrode layer on which the LED is not mounted, and the flexible printed circuit board (FPCB) is stacked on the anisotropically conductive adhesive layer.
  • the transparent display unit is manufactured by stacking the resin layer of the flexible printed circuit board (FPCB) to extend 1 mm (i.e., A is 1 mm) compared with the edge portion of the anisotropically conductive adhesive layer.
  • the PVB resin film (thickness of 1.52 mm, Kuraray Butacite), and the second glass sheet, they are combined by applying pressure of 11.5 bar at 130 °C to manufacture the glass assembly.
  • Example 1 and Comparative Example 1 are immersed in the state that the current is applied to the electrode layer and the flexible printed circuit board (FPCB) in water at 100 °C for 24 hours, and a corrosion rate is measured.
  • FPCB flexible printed circuit board
  • the corrosion rate is calculated as follows and measured for the electrodes up to 1 mm from the edge of the edge electrode layer.
  • Example 1 to Example 3 in which a protection adhesive layer is formed it may be confirmed that the corrosion almost does not exist in the edge electrode layer, but the edge electrode layer is corroded in Comparative Example 1.
  • FIG. 9 and FIG. 10 show photos of the edge electrode layer after estimating the corrosion rate of Example 1 and Comparative Example 1. The corrosion almost does not exist in the edge electrode layer in FIG. 9, but the end of the edge electrode layer is corroded extensively in Comparative Example 1 of FIG. 10.
  • FPCB flexible printed circuit board

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  • Engineering & Computer Science (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Manufacturing & Machinery (AREA)
  • Power Engineering (AREA)
  • Devices For Indicating Variable Information By Combining Individual Elements (AREA)
  • Physics & Mathematics (AREA)
  • Condensed Matter Physics & Semiconductors (AREA)
  • General Physics & Mathematics (AREA)
  • Computer Hardware Design (AREA)

Abstract

Une unité d'affichage transparente selon un mode de réalisation donné à titre d'exemple de la présente invention comprend : un film de substrat transparent; une couche d'électrode de bord disposée sur la surface supérieure du film de substrat transparent; une couche adhésive conductrice anisotrope disposée sur la couche d'électrode de bord; et une carte de circuit imprimé souple (FPCB) disposée sur la couche adhésive conductrice anisotrope et connectée électriquement à la couche d'électrode de bord par l'intermédiaire de la couche adhésive conductrice anisotrope, la carte de circuit imprimé souple (FPCB) comprend une partie d'électrode et une couche de résine, et la couche de résine s'étend à partir de la partie de bord de la couche adhésive conductrice anisotrope pour être en contact avec la couche d'électrode de bord.
PCT/KR2019/015356 2018-11-27 2019-11-12 Unité d'affichage transparent et ensemble verre le comprenant Ceased WO2020111582A1 (fr)

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
KR10-2018-0148399 2018-11-27
KR1020180148399A KR20200062702A (ko) 2018-11-27 2018-11-27 투명 디스플레이부 및 이를 포함하는 유리 조립체

Publications (1)

Publication Number Publication Date
WO2020111582A1 true WO2020111582A1 (fr) 2020-06-04

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PCT/KR2019/015356 Ceased WO2020111582A1 (fr) 2018-11-27 2019-11-12 Unité d'affichage transparent et ensemble verre le comprenant

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WO (1) WO2020111582A1 (fr)

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN116133492A (zh) * 2022-11-29 2023-05-16 京东方科技集团股份有限公司 显示模组及显示装置

Citations (5)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2005050773A (ja) * 2003-07-31 2005-02-24 Asahi Glass Co Ltd 有機ｌｅｄ素子
US20070013856A1 (en) * 2005-07-15 2007-01-18 Mitsubishi Denki Kabushiki Kaisha Flexible printed circuit and display device using the same
US20170373125A1 (en) * 2016-06-23 2017-12-28 Samsung Display Co., Ltd. Flexible display device and method of manufacturing the same
US20180006004A1 (en) * 2016-06-30 2018-01-04 Samsung Display Co., Ltd. Display device
US20180146549A1 (en) * 2016-11-23 2018-05-24 G-Smatt Co., Ltd. Durable flexible circuit board for transparent display board and assembling method thereof

Patent Citations (5)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2005050773A (ja) * 2003-07-31 2005-02-24 Asahi Glass Co Ltd 有機ｌｅｄ素子
US20070013856A1 (en) * 2005-07-15 2007-01-18 Mitsubishi Denki Kabushiki Kaisha Flexible printed circuit and display device using the same
US20170373125A1 (en) * 2016-06-23 2017-12-28 Samsung Display Co., Ltd. Flexible display device and method of manufacturing the same
US20180006004A1 (en) * 2016-06-30 2018-01-04 Samsung Display Co., Ltd. Display device
US20180146549A1 (en) * 2016-11-23 2018-05-24 G-Smatt Co., Ltd. Durable flexible circuit board for transparent display board and assembling method thereof

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN116133492A (zh) * 2022-11-29 2023-05-16 京东方科技集团股份有限公司 显示模组及显示装置

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Publication number Publication date
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